WO2023008086A1 - Method for producing adhesive holding jig - Google Patents

Method for producing adhesive holding jig Download PDF

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Publication number
WO2023008086A1
WO2023008086A1 PCT/JP2022/026253 JP2022026253W WO2023008086A1 WO 2023008086 A1 WO2023008086 A1 WO 2023008086A1 JP 2022026253 W JP2022026253 W JP 2022026253W WO 2023008086 A1 WO2023008086 A1 WO 2023008086A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
mold
holding jig
adhesive holding
manufacturing
Prior art date
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PCT/JP2022/026253
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French (fr)
Japanese (ja)
Inventor
聡 保泉
俊明 初見
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信越ポリマー株式会社
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Publication of WO2023008086A1 publication Critical patent/WO2023008086A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

Definitions

  • the present invention relates to a method for manufacturing an adhesive holding jig.
  • Japanese Unexamined Patent Application Publication No. 2002-200002 discloses an element mounting apparatus in which a transfer section has an adhesive sheet whose adhesive strength is lost or reduced at a specified temperature. This device mounting apparatus picks up the device by first pressing the adhesive sheet against the device and sticking it to the adhesive sheet, then bringing the device into contact with the substrate to be transferred, and heating the adhesive sheet to a specified temperature or higher. Thus, by peeling the picked-up elements from the adhesive sheet, the elements can be transferred all at once.
  • micro LED displays in which micro LEDs are mounted on a circuit board, have attracted attention from the viewpoint of high image quality and high energy efficiency.
  • an adhesive base material is used to adhere the LEDs of each color of RGB and transfer them to the substrate.
  • the present invention is a method for manufacturing an adhesive holding jig comprising a supporting substrate and an adhesive layer provided on the supporting substrate and having an uneven pattern on its surface, the method comprising an upper mold and a lower mold.
  • the nanoimprint mold is preferably a nickel electroforming mold.
  • the liquid thermosetting adhesive material preferably contains unvulcanized silicone rubber.
  • the support substrate is preferably a glass substrate.
  • At least the surface of the glass substrate on which the adhesive layer is to be formed is subjected to a primer treatment.
  • the adhesive holding jig is preferably for the micro LED manufacturing process.
  • an adhesive holding jig can be manufactured with good work efficiency.
  • FIG. 1 is a schematic cross-sectional view showing one embodiment of an adhesive holding jig manufactured by the method for producing an adhesive holding jig of the present invention
  • FIG. It is a schematic sectional drawing explaining one Embodiment of the manufacturing method of the adhesive holding jig of this invention.
  • FIG. 4 is a schematic cross-sectional view showing an additional step in the method for manufacturing the adhesive holding jig of the present invention;
  • the adhesive holding jig 10 includes a supporting substrate 11 and an adhesive layer 12 provided on the supporting substrate 11 and having an uneven pattern 13 on a surface 12a.
  • the concave-convex pattern 13 of the adhesive holding jig 10 has the same adhesive force on all the concave-convex surfaces, but can selectively adhere the adherend to the top of the convex portions 13a of the concave-convex pattern 13.
  • the rubber hardness of the pressure-sensitive adhesive layer 12 is preferably 10 degrees or more and 80 degrees or less, more preferably 20 degrees or more and 60 degrees or less, in terms of durometer A hardness, from the viewpoint of adhesion to an adherend and easy removal. When the hardness is within the above range, sufficient adhesive strength can be easily obtained, and the adherend can be easily removed.
  • the rubber hardness is a value measured according to JIS K6253.
  • the adhesive strength (unit: N/25 mm width) of the adhesive layer 12 is measured according to the 90-degree peel adhesive strength measurement method of the adhesive tape/adhesive sheet test method of JIS Z0237. Specifically, the adhesive force is measured by the following method with reference to JIS Z0237. First, the adhesive surface to be measured is horizontally fixed, and the measurement environment is set to 23 ⁇ 1° C. and 50 ⁇ 5% humidity. Next, after cutting a polyimide film having a thickness of 25 ⁇ m into a width of 25 mm, it is attached to the adhesive surface using a rubber roller of 2 kg. Thereafter, a 90 degree peel test is performed within 1 minute at a peel rate of 5 mm/sec.
  • the adhesive strength measured in this way is preferably 0.1 (N/25 mm) or more and 1.5 (N/25 mm) or less, and 0.3 (N/25 mm) or more and 0.7 (N/ 25 mm) or less.
  • the adhesive strength is within the above range, it is possible, for example, to prevent component pick-up errors and chip drop-off during transportation, and furthermore, when fixed at a predetermined position on the board by soldering, the chip can be easily removed.
  • the height h (see FIG. 1) of the convex portion 13a is preferably 10 ⁇ m or more and 50 ⁇ m or less. Since the height h of the protrusions 13a is 10 ⁇ m or more, when the adherend is transferred to another adhesive substrate after being adhered to the protrusions 13a, even if the adherend falls into the recesses 13b, However, it is possible to prevent the adherend from coming into contact with other adhesive substrates. This makes it possible to prevent transfer of the adherend to unintended locations.
  • the protrusions 13a since the height h of the protrusions 13a is 50 ⁇ m or less, the protrusions 13a do not bend when pressed against the object to be held, and can reliably adhere and hold the object to be held.
  • the method for measuring the height h of the convex portion 13a is the method described later in Examples.
  • the adhesive holding jig 10 has high adhesiveness and low hardness. In addition, even if the surface 12a of the pressure-sensitive adhesive layer 12 is adhered with dirt, dust, etc. and the adhesiveness is lowered, the original adhesiveness can be easily restored by washing with alcohol, so that the surface 12a can be used repeatedly. Furthermore, when the pressure-sensitive adhesive layer 12 is made of silicone rubber, it has heat resistance, so it is possible to perform a heat resistance test with the adherend being adhered.
  • a method for manufacturing the adhesive holding jig of the present invention will be described.
  • a nanoimprint mold 30 is attached to the upper mold 21 of a mold 20 having an upper mold 21 and a lower mold 22, and a cavity of the lower mold 22 is This is a step of disposing the support base material 11 on the bottom portion 22a.
  • the upper mold 21 and the lower mold 22 that constitute the mold 20 are preferably made of SUS (stainless steel) or steel materials such as S45C and SKD11.
  • the nanoimprint mold 30 has a pattern 31 for forming the uneven pattern 13 of the adhesive layer 12 .
  • the pattern 31 of the nanoimprint mold 30 is preferably formed by photolithography. If a nanoimprinting mold 30 having different patterns 31 is formed according to the arrangement pattern of components to be adhered to the adhesive layer 12, different irregularities can be obtained by changing the nanoimprinting mold 30 attached to the upper mold 21. A large number of adhesive layers 12 having patterns 13 can be efficiently formed.
  • the nanoimprint mold 30 is preferably a nickel electroforming mold or a copper electroforming mold, more preferably a nickel electroforming mold, from the viewpoint of ease of electrodeposition and mechanical strength.
  • the size of the cavity bottom portion 22a of the lower mold 22 is formed to be the same as that of the support base material 11.
  • the supporting substrate 11 is preferably a glass substrate, a silicon wafer, or a low thermal expansion metal, more preferably a glass substrate.
  • the supporting substrate 11 is a glass substrate, it is preferable that at least the surface of the glass substrate on which the pressure-sensitive adhesive layer 12 is to be formed is subjected to a primer treatment. Due to the primer treatment, the later-described liquid thermosetting adhesive material 24, which is the material of the adhesive layer 12, easily adheres to the glass base material, and the glass base material is firmly integrally molded.
  • a spacer 23 is arranged between the upper mold 21 and the lower mold 22 and around the glass substrate.
  • the thickness of the adhesive layer 12 can be adjusted by the thickness T of the spacers 23 .
  • the thickness of the adhesive layer 12 can be adjusted by adjusting the cavity depth of the lower mold 22 and the thickness or shape of the nanoimprint mold 30 .
  • the second step is a step of disposing a liquid thermosetting adhesive material 24 on the support substrate 11 .
  • the method of disposing the liquid thermosetting adhesive material 24 is preferably performed with a precision dispenser.
  • the viscosity of the liquid thermosetting adhesive material 24 is preferably 50 Pa ⁇ s or more and 1600 Pa ⁇ s or less, more preferably 200 Pa ⁇ s or more and 600 Pa ⁇ s, from the viewpoints of easiness of blending, stirring and kneading, and precise metering and dispensing. s or less.
  • the viscosity in the present invention is a value measured according to JIS K 7117-1:1999.
  • Silicone rubber is preferable as the liquid thermosetting adhesive material 24 .
  • the following silicone rubber composition can be used as the liquid thermosetting adhesive material 24 whose main component is silicone rubber.
  • the silicone rubber composition contains unvulcanized silicone rubber and an adhesive.
  • the (A) unvulcanized silicone rubber used in the present invention is a general addition reaction type liquid silicone rubber.
  • the addition reaction type liquid silicone rubber consists of the following components.
  • the addition reaction type liquid silicone rubber contains an organopolysiloxane containing a vinyl group as a main component, a filler such as silica for reinforcement, and a platinum catalyst as a catalyst.
  • Addition reaction type liquid silicone rubber is prepared by blending organohydrogenpolysiloxane, a reaction control agent, silicone oil, additives and the like for the purpose of imparting properties, if necessary.
  • a heat-resistant silicone resin is preferable because it is added to the silicone rubber and molding is performed at the same time.
  • Silicone resins are organopolysiloxanes containing M units (R 3 SiO 1/2 ) and Q units (SiO 4/2 ).
  • R represents a hydrogen atom, a hydroxyl group, or an organic group, and is preferably a methyl group from the viewpoint of being easily dissolved in an organic solvent.
  • the organopolysiloxane may also contain OH groups, vinyl groups, or phenyl groups. Examples of commercially available products include KR3701 and KR3700 manufactured by Shin-Etsu Chemical Co., Ltd., SD4580 and SD4584 manufactured by Dow Corning Toray Co., Ltd., and the like.
  • the silicone rubber composition may contain additives such as catalysts, diluents, colorants such as pigments and dyes, leveling agents, and antistatic agents.
  • the mold 20 is clamped, and the mold 20 is heated by a heating means (not shown) so that the supporting substrate 11 and the liquid thermosetting adhesive material are bonded together.
  • 24 is integrally bonded and molded.
  • the heating temperature may be appropriately adjusted depending on the material of the composition, preferably 100° C. or higher and 150° C. or lower, more preferably 100° C. or higher and 130° C. or lower.
  • the heating time is preferably 30 seconds or more and 20 minutes or less, more preferably 5 minutes or more and 10 minutes or less, from the viewpoint of integrally bonding and molding the supporting substrate 11 and the liquid thermosetting adhesive material 24 .
  • the supporting base material 11 is preliminarily treated with a primer, the supporting base material 11 and the liquid curable adhesive material are easily adhesive-molded integrally by heating.
  • the fourth step is a step of opening the clamped mold 20, removing the spacer 23, and taking out the molded adhesive holding jig 10. As shown in FIG. If the nanoimprint mold 30 is subjected to mold release treatment in advance, the protrusions can be prevented from being broken or chipped.
  • the adhesive holding jig of the present invention has high adhesiveness and can be removed from the object to be adhered, so that it can be used repeatedly. can be used for the manufacturing process of minute parts.
  • a fifth step of forming a non-adhesive region in a region other than the top portions of the convex portions 13a of the concave-convex pattern 13 of the adhesive layer 12. may be provided.
  • the non-adhesive region can be formed by performing surface treatment such as laser light irradiation (symbol L in FIG. 3), UV irradiation, and blasting.
  • the adhesive strength of the non-adhesive area is preferably 0.02 (N/25mm) or less, more preferably 0.01 (N/25mm) or less. When the adhesive force is within the above range, it is possible to prevent the adherend from adhering.
  • a pattern corresponding to the shape of the convex portion is formed so as to have the size and height of the upper surface of the convex portion of the pressure-sensitive adhesive layer shown in Table 1 ("convex shape" in the table).
  • a silicone rubber composition was prepared from the following materials.
  • -Silicone rubber composition- (A) Unvulcanized silicone rubber KE-1950-30A (manufactured by Shin-Etsu Chemical Co., Ltd.) 50 parts by mass KE-1950-30B (manufactured by Shin-Etsu Chemical Co., Ltd.) 50 parts by mass (B) Adhesive KR- 3700 (manufactured by Shin-Etsu Chemical Co., Ltd.) 30 parts by mass
  • a nanoimprint mold is attached to the upper mold so that the size of the upper surface of the protrusions of the adhesive layer is 30 ⁇ m ⁇ 30 ⁇ m and the height of the protrusions is 40 ⁇ m.
  • a glass substrate (0.7 mm thick, 40 mm x 40 mm, borosilicate glass) is placed on the bottom of the cavity of the lower mold, the silicone rubber composition is placed on the glass substrate, and the mold is clamped. Then, the silicone rubber composition was vulcanized at 110° C. for 10 minutes. After that, the mold was opened and the molded adhesive holding jig was taken out.
  • Example 2 An adhesive holder was formed in the same manner as in Example 1, except that the nanoimprint mold was used so that the size of the upper surface of the convex portion of the adhesive layer was 50 ⁇ m ⁇ 30 ⁇ m and the height of the convex portion was 50 ⁇ m.
  • Example 1 A flat metal plate was used in place of the nanoimprint mold in Example 1, and molding was performed in the same manner as in Example 1 to form an adhesive holding jig without irregularities. After that, the silicone rubber part was processed with a laser processing machine to form an adhesive holding jig with irregularities.
  • Comparative Example 2 The uneven shape similar to that of Example 2 was formed using a laser processing machine as in Comparative Example 1.
  • the rubber hardness was measured according to JIS K 6253 with a durometer A hardness tester (trade name "GS-719N", manufactured by Teclock).
  • Table 1 shows the molding method (rubber portion molding time, rubber portion processing time), the shape of the convex portion, the height of the convex portion, and the rubber hardness.
  • the adhesive holding jig of the present invention made it possible to shorten the molding time compared to forming an adhesive pattern by laser light irradiation.

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  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The present invention is a method for producing an adhesive holding jig 10 provided with a support substrate 11 and an adhesive agent layer 12 which is provided on the support substrate 11 and which has a relief pattern 13 on a surface 12a thereof, said method comprising: a first step for inserting a nano-implant mold 30 that has a pattern 31 for forming a relief pattern 13 into an upper mold 21 of a mold 20 that has the upper mold 21 and a lower mold 22, and disposing the support substrate 11 in a cavity bottom part 22a of the lower mold 22; a second step for disposing a heat-curing liquid adhesive material 24 on the support substrate 11; a third step for closing and then heating the mold 20 so as to integrally bond and mold the support substrate 11 and the heat-curing liquid adhesive material 24; and a fourth step for opening the mold 20 and removing an adhesive holding jig 10 that has been molded.

Description

粘着性保持治具の製造方法Method for manufacturing adhesive holding jig
　本発明は、粘着性保持治具の製造方法に関する。 The present invention relates to a method for manufacturing an adhesive holding jig.
　セラミックコンデンサ、チップ抵抗、コイル、半導体素子等の電子部品を回路が設けられた基板に実装するために、電子部品を粘着保持して、基板まで搬送し、離脱させる実装装置が知られている。例えば、特許文献１には、移送部が、規定温度によって粘着力が喪失又は低下する粘着シートを有する素子実装装置が開示されている。この素子実装装置は、まず、素子に粘着シートを押し付けて粘着シートに貼り付けることで、素子をピックアップし、次に、移送する基板上に素子を接触させ、粘着シートを規定温度以上に加熱することによって、ピックアップした素子を粘着シートから剥離することで、一括して素子を移送するものである。 In order to mount electronic parts such as ceramic capacitors, chip resistors, coils, and semiconductor elements on a circuit board, there is known a mounting apparatus that adhesively holds the electronic parts, transports them to the board, and removes them. For example, Japanese Unexamined Patent Application Publication No. 2002-200002 discloses an element mounting apparatus in which a transfer section has an adhesive sheet whose adhesive strength is lost or reduced at a specified temperature. This device mounting apparatus picks up the device by first pressing the adhesive sheet against the device and sticking it to the adhesive sheet, then bringing the device into contact with the substrate to be transferred, and heating the adhesive sheet to a specified temperature or higher. Thus, by peeling the picked-up elements from the adhesive sheet, the elements can be transferred all at once.
　近年、高画質、高エネルギー効率の観点から、マイクロＬＥＤが回路基板に実装されたマイクロＬＥＤディスプレイが注目されている。マイクロＬＥＤディスプレイの製造工程においても、ＲＧＢの各色のＬＥＤを粘着させて基板まで移送するために粘着性基材が用いられている。その際、ＲＧＢ各色のＬＥＤの配置に対応した粘着領域と被粘着領域のパターンを有する粘着性基板を形成する必要がある。そして、そのようなパターンは、例えば、粘着剤層の表面にレーザー光を照射することにより、粘着力を変化させることで形成されている。 In recent years, micro LED displays, in which micro LEDs are mounted on a circuit board, have attracted attention from the viewpoint of high image quality and high energy efficiency. Also in the manufacturing process of the micro LED display, an adhesive base material is used to adhere the LEDs of each color of RGB and transfer them to the substrate. At that time, it is necessary to form an adhesive substrate having a pattern of adhesive areas and adhesive areas corresponding to the arrangement of LEDs of RGB colors. And such a pattern is formed, for example, by irradiating the surface of the pressure-sensitive adhesive layer with laser light to change the pressure-sensitive adhesive strength.
特開２０１９－６８０５５号公報JP 2019-68055 A
　しかしながら、レーザー光照射によるパターンの形成では、同一製品を多数製造する場合には、時間がかかり、作業効率が低いという問題がある。
　本発明は、上記事情に鑑みてなされたものであり、作業効率が良い粘着性保持治具の製造方法を提供することを目的とする。 However, pattern formation by laser light irradiation has the problem that it takes a long time to manufacture a large number of the same product, and the work efficiency is low.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an adhesive holding jig with good working efficiency.
　本発明は、支持基材と、支持基材上に設けられ、表面に凹凸パターンを有する粘着剤層とを備える粘着性保持治具の製造方法であって、上金型及び下金型を有する金型の上金型に、凹凸パターンを形成するためのパターンを有するナノインプリント金型を装着し、下金型のキャビティ底部に、支持基材を配置する第１工程と、支持基材上に、液状熱硬化性粘着材料を配置する第２工程と、金型を型締めし、金型を加熱することにより、支持基材と液状熱硬化性粘着材料とを一体的に接着成型する第３工程と、金型を開放して、成型された粘着性保持治具を取り出す第４工程と、を含む粘着性保持治具の製造方法である。 The present invention is a method for manufacturing an adhesive holding jig comprising a supporting substrate and an adhesive layer provided on the supporting substrate and having an uneven pattern on its surface, the method comprising an upper mold and a lower mold. A first step of mounting a nanoimprint mold having a pattern for forming an uneven pattern on the upper mold of the mold, placing a supporting substrate on the bottom of the cavity of the lower mold; A second step of disposing the liquid thermosetting adhesive material, and a third step of integrally bonding and molding the supporting substrate and the liquid thermosetting adhesive material by clamping the mold and heating the mold. and a fourth step of opening the mold and taking out the molded adhesive holding jig.
　ナノインプリント金型は、ニッケル電鋳金型であることが好ましい。 The nanoimprint mold is preferably a nickel electroforming mold.
　液状熱硬化性粘着材料は、未加硫のシリコーンゴムを含有することが好ましい。 The liquid thermosetting adhesive material preferably contains unvulcanized silicone rubber.
　支持基材は、ガラス基材であることが好ましい。 The support substrate is preferably a glass substrate.
　ガラス基材の少なくとも粘着剤層が形成される表面にプライマー処理が施されていることが好ましい。 It is preferable that at least the surface of the glass substrate on which the adhesive layer is to be formed is subjected to a primer treatment.
　凹凸パターンの凸部の頂上部以外の領域に、非粘着領域を形成する第５工程を含むことが好ましい。 It is preferable to include a fifth step of forming a non-adhesive area in an area other than the top of the projections of the uneven pattern.
　粘着性保持治具は、マイクロＬＥＤの製造工程用であることが好ましい。 The adhesive holding jig is preferably for the micro LED manufacturing process.
　本発明によれば、作業効率良く粘着性保持治具を製造することができる。 According to the present invention, an adhesive holding jig can be manufactured with good work efficiency.
本発明の粘着性保持治具の製造方法によって製造される粘着性保持治具の一実施形態を示す概略断面図である。1 is a schematic cross-sectional view showing one embodiment of an adhesive holding jig manufactured by the method for producing an adhesive holding jig of the present invention; FIG. 本発明の粘着性保持治具の製造方法の一実施形態を説明する概略断面図である。It is a schematic sectional drawing explaining one Embodiment of the manufacturing method of the adhesive holding jig of this invention. 本発明の粘着性保持治具の製造方法の追加の工程を示す概略断面図である。FIG. 4 is a schematic cross-sectional view showing an additional step in the method for manufacturing the adhesive holding jig of the present invention;
　本発明の粘着性保持治具の製造方法の一実施形態を、図を参照しながら説明する。 An embodiment of the method for manufacturing an adhesive holding jig of the present invention will be described with reference to the drawings.
［粘着性保持治具］
　まず、本発明の粘着性保持治具の製造方法の一実施形態によって製造される粘着性保持治具について図１を参照しながら説明する。
　図１に示すように、粘着性保持治具１０は、支持基材１１と、支持基材１１上に設けられ、表面１２ａに凹凸パターン１３を有する粘着剤層１２とを備える。
　粘着性保持治具１０の凹凸パターン１３は、凹凸表面は全て同じ粘着力であるが、凹凸パターン１３の凸部１３ａの頂上部で選択的に被粘着物を粘着させることができる。 [Adhesive holding jig]
First, an adhesive holding jig manufactured by an embodiment of the method for producing an adhesive holding jig of the present invention will be described with reference to FIG.
As shown in FIG. 1, the adhesive holding jig 10 includes a supporting substrate 11 and an adhesive layer 12 provided on the supporting substrate 11 and having an uneven pattern 13 on a surface 12a.
The concave-convex pattern 13 of the adhesive holding jig 10 has the same adhesive force on all the concave-convex surfaces, but can selectively adhere the adherend to the top of the convex portions 13a of the concave-convex pattern 13. FIG.
（ゴム硬度）
　粘着剤層１２のゴム硬度は、被粘着物への粘着性及び取り外しを容易にする観点から、デューロメータＡ硬度で、１０度以上８０度以下が好ましく、２０度以上６０度以下がより好ましい。硬度が、上記範囲であることにより、十分な粘着力が得られやすく、被粘着物の取り外しを容易に行うことができる。
　なお、ゴム硬度は、ＪＩＳ　Ｋ　６２５３に従って測定した値である。 (rubber hardness)
The rubber hardness of the pressure-sensitive adhesive layer 12 is preferably 10 degrees or more and 80 degrees or less, more preferably 20 degrees or more and 60 degrees or less, in terms of durometer A hardness, from the viewpoint of adhesion to an adherend and easy removal. When the hardness is within the above range, sufficient adhesive strength can be easily obtained, and the adherend can be easily removed.
The rubber hardness is a value measured according to JIS K6253.
（粘着力）
　粘着剤層１２の粘着力（単位：Ｎ／２５ｍｍ幅）は、ＪＩＳ　Ｚ０２３７の粘着テープ・粘着シート試験方法の９０度引きはがし粘着力の測定方法に準拠して測定される。
　具体的には、粘着力の測定方法は、ＪＩＳ　Ｚ０２３７を参考に以下の方法で行われる。まず、測定する粘着面を水平に固定し、測定環境を２３±１℃、湿度５０±５％に設定する。次に、厚さ２５μｍのポリイミドフィルムを幅２５ｍｍにカットした後、粘着面に２ｋｇのゴムローラを用いて貼り付ける。その後、１分以内に剥離５ｍｍ／秒で９０度剥離試験を実施する。
　剥離試験は、引張試験機にポリイミドフィルムをチャック後、速度５±０．２ｍｍ／秒で運転する。結果はニュートン毎２５ｍｍ（Ｎ／２５ｍｍ）に換算する。
　上記粘着力の測定においては、株式会社ＩＭＡＤＡ製のデジタルフォースゲージ、電動スタンド、９０度剥離試験冶具の組み合わせを用いて行い、ポリイミドフィルムは東レ・デュポン株式会社製のカプトン（登録商標）フィルムを使用する。 (Adhesive force)
The adhesive strength (unit: N/25 mm width) of the adhesive layer 12 is measured according to the 90-degree peel adhesive strength measurement method of the adhesive tape/adhesive sheet test method of JIS Z0237.
Specifically, the adhesive force is measured by the following method with reference to JIS Z0237. First, the adhesive surface to be measured is horizontally fixed, and the measurement environment is set to 23±1° C. and 50±5% humidity. Next, after cutting a polyimide film having a thickness of 25 μm into a width of 25 mm, it is attached to the adhesive surface using a rubber roller of 2 kg. Thereafter, a 90 degree peel test is performed within 1 minute at a peel rate of 5 mm/sec.
In the peel test, after chucking the polyimide film on a tensile tester, it is operated at a speed of 5±0.2 mm/sec. The results are converted to Newtons per 25 mm (N/25 mm).
In the measurement of the adhesive strength, a combination of a digital force gauge, an electric stand, and a 90-degree peel test jig manufactured by IMADA Co., Ltd. was used, and Kapton (registered trademark) film manufactured by DuPont Toray Co., Ltd. was used as the polyimide film. do.
　このようにして測定される粘着力は、０．１（Ｎ／２５ｍｍ）以上１．５（Ｎ／２５ｍｍ）以下であることが好ましく、０．３（Ｎ／２５ｍｍ）以上０．７（Ｎ／２５ｍｍ）以下であることがより好ましい。
　粘着力が、上記範囲であることにより、例えば、部品のピックアップミス及び搬送時のチップ脱落を防止でき、さらに、基板上の所定位置でのハンダによる固定時に、チップの取り外しが容易となる。 The adhesive strength measured in this way is preferably 0.1 (N/25 mm) or more and 1.5 (N/25 mm) or less, and 0.3 (N/25 mm) or more and 0.7 (N/ 25 mm) or less.
When the adhesive strength is within the above range, it is possible, for example, to prevent component pick-up errors and chip drop-off during transportation, and furthermore, when fixed at a predetermined position on the board by soldering, the chip can be easily removed.
（凸部の高さ）
　凸部１３ａの高さｈ（図１参照）は、１０μｍ以上５０μｍ以下であることが好ましい。凸部１３ａの高さｈが、１０μｍ以上であることにより、被粘着物を凸部１３ａに粘着させた後、他の粘着性基板へ転写する場合、仮に、凹部１３ｂに被粘着物が落下したとしても、被粘着物が他の粘着性基板へ接触するのを防止することができる。これにより、被粘着物の意図しない箇所への転写を防止することができる。また、凸部１３ａの高さｈが、５０μｍ以下であることにより、凸部１３ａが、保持対象物に押し付けられたときに屈曲することなく、確実に保持対象物を粘着保持することができる。
　なお、凸部１３ａの高さｈの測定方法は、後述の実施例で示す方法である。 (Height of convex part)
The height h (see FIG. 1) of the convex portion 13a is preferably 10 μm or more and 50 μm or less. Since the height h of the protrusions 13a is 10 μm or more, when the adherend is transferred to another adhesive substrate after being adhered to the protrusions 13a, even if the adherend falls into the recesses 13b, However, it is possible to prevent the adherend from coming into contact with other adhesive substrates. This makes it possible to prevent transfer of the adherend to unintended locations. In addition, since the height h of the protrusions 13a is 50 μm or less, the protrusions 13a do not bend when pressed against the object to be held, and can reliably adhere and hold the object to be held.
The method for measuring the height h of the convex portion 13a is the method described later in Examples.
　粘着性保持治具１０は、高い粘着性を有し、かつ低硬度である。また、粘着剤層１２の表面１２ａにごみ、埃等が付着して粘着性が低下しても、アルコールで洗浄することにより、容易に元の粘着性を有するため、繰り返し使用可能である。
　さらに、粘着剤層１２がシリコーンゴムからなる場合は、耐熱性を有するため、被粘着物を粘着させた状態で耐熱試験を行うことも可能である。 The adhesive holding jig 10 has high adhesiveness and low hardness. In addition, even if the surface 12a of the pressure-sensitive adhesive layer 12 is adhered with dirt, dust, etc. and the adhesiveness is lowered, the original adhesiveness can be easily restored by washing with alcohol, so that the surface 12a can be used repeatedly.
Furthermore, when the pressure-sensitive adhesive layer 12 is made of silicone rubber, it has heat resistance, so it is possible to perform a heat resistance test with the adherend being adhered.
［粘着性保持治具の製造方法］
　次に、本発明の粘着性保持治具の製造方法について説明する。
（第１工程）
　第１工程は、図２（ａ）に示すように、上金型２１及び下金型２２を有する金型２０の上金型２１に、ナノインプリント金型３０を装着し、下金型２２のキャビティ底部２２ａに、支持基材１１を配置する工程である。 [Manufacturing method of adhesive holding jig]
Next, a method for manufacturing the adhesive holding jig of the present invention will be described.
(First step)
In the first step, as shown in FIG. 2A, a nanoimprint mold 30 is attached to the upper mold 21 of a mold 20 having an upper mold 21 and a lower mold 22, and a cavity of the lower mold 22 is This is a step of disposing the support base material 11 on the bottom portion 22a.
　金型２０を構成する上金型２１及び下金型２２は、ＳＵＳ（ステンレス鋼）、又は、Ｓ４５Ｃ、ＳＫＤ１１等の鋼材で形成されることが好ましい。 The upper mold 21 and the lower mold 22 that constitute the mold 20 are preferably made of SUS (stainless steel) or steel materials such as S45C and SKD11.
　ナノインプリント金型３０は、粘着剤層１２の凹凸パターン１３を形成するためのパターン３１を有する。ナノインプリント金型３０のパターン３１は、フォトリソグラフィーで形成されることが好ましい。粘着剤層１２に粘着させる部品等の配列パターンに応じて異なるパターン３１を有するナノインプリント金型３０を形成しておけば、上金型２１に装着するナノインプリント金型３０を変更することによって、異なる凹凸パターン１３を有する粘着剤層１２を効率良く多数形成することができる。
　ナノインプリント金型３０は、電着の容易さ、機械的強度の観点からニッケル電鋳金型、銅電鋳金型であることが好ましく、ニッケル電鋳金型であることがより好ましい。 The nanoimprint mold 30 has a pattern 31 for forming the uneven pattern 13 of the adhesive layer 12 . The pattern 31 of the nanoimprint mold 30 is preferably formed by photolithography. If a nanoimprinting mold 30 having different patterns 31 is formed according to the arrangement pattern of components to be adhered to the adhesive layer 12, different irregularities can be obtained by changing the nanoimprinting mold 30 attached to the upper mold 21. A large number of adhesive layers 12 having patterns 13 can be efficiently formed.
The nanoimprint mold 30 is preferably a nickel electroforming mold or a copper electroforming mold, more preferably a nickel electroforming mold, from the viewpoint of ease of electrodeposition and mechanical strength.
　下金型２２のキャビティ底部２２ａの大きさは、支持基材１１と同等となるように形成されている。 The size of the cavity bottom portion 22a of the lower mold 22 is formed to be the same as that of the support base material 11.
　支持基材１１は、耐熱性及び熱膨張の観点から、ガラス基材、シリコンウエハー、又は低熱膨張金属であることが好ましく、ガラス基材がより好ましい。
　支持基材１１がガラス基材である場合、ガラス基材の少なくとも粘着剤層１２が形成される表面にプライマー処理が施されていることが好ましい。プライマー処理が施されていることにより、ガラス基材に粘着剤層１２の材料である後述する液状熱硬化性粘着材料２４が密着しやすく、強固に一体成形される。 From the viewpoint of heat resistance and thermal expansion, the supporting substrate 11 is preferably a glass substrate, a silicon wafer, or a low thermal expansion metal, more preferably a glass substrate.
When the supporting substrate 11 is a glass substrate, it is preferable that at least the surface of the glass substrate on which the pressure-sensitive adhesive layer 12 is to be formed is subjected to a primer treatment. Due to the primer treatment, the later-described liquid thermosetting adhesive material 24, which is the material of the adhesive layer 12, easily adheres to the glass base material, and the glass base material is firmly integrally molded.
　本実施形態では、上金型２１と下金型２２との間であって、ガラス基材の周囲に、スペーサ２３を配置している。スペーサ２３の厚さＴによって、粘着剤層１２の厚さを調整することができる。スペーサ２３を使用しない場合は、下金型２２のキャビティ深さとナノインプリント金型３０の厚さ又は形状を調整することによって、粘着剤層１２の厚さを調整することができる。 In this embodiment, a spacer 23 is arranged between the upper mold 21 and the lower mold 22 and around the glass substrate. The thickness of the adhesive layer 12 can be adjusted by the thickness T of the spacers 23 . When the spacer 23 is not used, the thickness of the adhesive layer 12 can be adjusted by adjusting the cavity depth of the lower mold 22 and the thickness or shape of the nanoimprint mold 30 .
（第２工程）
　第２工程は、図２（ｂ）に示すように、支持基材１１上に、液状熱硬化性粘着材料２４を配置する工程である。
　液状熱硬化性粘着材料２４を配置する方法は、精密ディスペンサーで行うことが好ましい。
　液状熱硬化性粘着材料２４の粘度は、配合と攪拌混錬の容易さ、及び精密な計量と吐出の観点から、５０Ｐａ・ｓ以上１６００Ｐａ・ｓ以下であることが好ましく、２００Ｐａ・ｓ以上６００Ｐａ・ｓ以下であることが好ましい。本発明における粘度は、ＪＩＳ　Ｋ　７１１７－１：１９９９に準じて測定した値とする。 (Second step)
The second step, as shown in FIG. 2B, is a step of disposing a liquid thermosetting adhesive material 24 on the support substrate 11 .
The method of disposing the liquid thermosetting adhesive material 24 is preferably performed with a precision dispenser.
The viscosity of the liquid thermosetting adhesive material 24 is preferably 50 Pa·s or more and 1600 Pa·s or less, more preferably 200 Pa·s or more and 600 Pa·s, from the viewpoints of easiness of blending, stirring and kneading, and precise metering and dispensing. s or less. The viscosity in the present invention is a value measured according to JIS K 7117-1:1999.
　液状熱硬化性粘着材料２４としては、シリコーンゴムが好ましい。
　シリコーンゴムを主成分とする液状熱硬化性粘着材料２４は、例えば、以下のシリコーンゴム組成物を用いることができる。 Silicone rubber is preferable as the liquid thermosetting adhesive material 24 .
For example, the following silicone rubber composition can be used as the liquid thermosetting adhesive material 24 whose main component is silicone rubber.
（シリコーンゴム組成物）
　以下にシリコーンゴム組成物の詳細を説明する。
　シリコーンゴム組成物は、未加硫のシリコーンゴム、及び粘着剤を含有する。 (Silicone rubber composition)
Details of the silicone rubber composition are described below.
The silicone rubber composition contains unvulcanized silicone rubber and an adhesive.
－（Ａ）未加硫のシリコーンゴム－
　本発明で使用する（Ａ）未加硫のシリコーンゴムは、一般的な付加反応型の液状シリコーンゴムである。付加反応型の液状シリコーンゴムは以下の成分からなる。
　付加反応型の液状シリコーンゴムは、主成分としてビニル基を含んだオルガノポリシロキサン、補強目的としてのシリカ等の充填材、触媒として白金系触媒を含む。付加反応型の液状シリコーンゴムは、必要に応じて、特性を付与する目的でオルガノハイドロジェンポリシロキサン、反応制御材、シリコーンオイル、添加剤等が配合されて調製される。 -(A) Unvulcanized silicone rubber-
The (A) unvulcanized silicone rubber used in the present invention is a general addition reaction type liquid silicone rubber. The addition reaction type liquid silicone rubber consists of the following components.
The addition reaction type liquid silicone rubber contains an organopolysiloxane containing a vinyl group as a main component, a filler such as silica for reinforcement, and a platinum catalyst as a catalyst. Addition reaction type liquid silicone rubber is prepared by blending organohydrogenpolysiloxane, a reaction control agent, silicone oil, additives and the like for the purpose of imparting properties, if necessary.
－（Ｂ）粘着剤－
　（Ｂ）粘着材としては、シリコーンゴムに添加され、同時に成形を行うことから耐熱性を有するシリコーンレジンが好ましい。シリコーンレジンは、Ｍ単位（Ｒ３ＳｉＯ１／２）とＱ単位（ＳｉＯ４／２）を含むオルガノポリシロキサンである。Ｒは、水素原子、水酸基又は有機基を表し、有機溶剤に溶解しやすい観点から、メチル基であることが好ましい。また、オルガノポリシロキサンは、ＯＨ基、ビニル基、又はフェニル基を含有するものであってもよい。市販品として、例えば、信越化学工業株式会社製のＫＲ３７０１、ＫＲ３７００、東レ・ダウコーニング社製のＳＤ４５８０、ＳＤ４５８４等が挙げられる。 -(B) Adhesive-
(B) As the adhesive material, a heat-resistant silicone resin is preferable because it is added to the silicone rubber and molding is performed at the same time. Silicone resins are organopolysiloxanes containing M units (R 3 SiO 1/2 ) and Q units (SiO 4/2 ). R represents a hydrogen atom, a hydroxyl group, or an organic group, and is preferably a methyl group from the viewpoint of being easily dissolved in an organic solvent. The organopolysiloxane may also contain OH groups, vinyl groups, or phenyl groups. Examples of commercially available products include KR3701 and KR3700 manufactured by Shin-Etsu Chemical Co., Ltd., SD4580 and SD4584 manufactured by Dow Corning Toray Co., Ltd., and the like.
－その他の成分－
　シリコーンゴム組成物は、触媒、希釈剤、顔料や染料等の着色剤、レベリング剤、帯電防止剤等の添加物が含有されていてもよい。 -Other ingredients-
The silicone rubber composition may contain additives such as catalysts, diluents, colorants such as pigments and dyes, leveling agents, and antistatic agents.
（第３工程）
　第３工程は、図２（ｃ）に示すように、金型２０を型締めし、金型２０を加熱手段（不図示）によって加熱することにより、支持基材１１と液状熱硬化性粘着材料２４を一体的に接着成型する工程である。
　加熱温度は、組成物の材料によって適宜調整すればよく、１００℃以上１５０℃以下が好ましく、１００℃以上１３０℃以下がより好ましい。加熱時間は、支持基材１１と液状熱硬化性粘着材料２４とを一体的に接着成型する観点から、３０秒以上２０分以下であることが好ましく、５分以上１０分以下がより好ましい。
　支持基材１１に、あらかじめプライマー処理が施されていると、加熱により、支持基材１１と液状硬化性粘着材料とが一体的に接着成型されやすい。 (Third step)
In the third step, as shown in FIG. 2(c), the mold 20 is clamped, and the mold 20 is heated by a heating means (not shown) so that the supporting substrate 11 and the liquid thermosetting adhesive material are bonded together. 24 is integrally bonded and molded.
The heating temperature may be appropriately adjusted depending on the material of the composition, preferably 100° C. or higher and 150° C. or lower, more preferably 100° C. or higher and 130° C. or lower. The heating time is preferably 30 seconds or more and 20 minutes or less, more preferably 5 minutes or more and 10 minutes or less, from the viewpoint of integrally bonding and molding the supporting substrate 11 and the liquid thermosetting adhesive material 24 .
When the supporting base material 11 is preliminarily treated with a primer, the supporting base material 11 and the liquid curable adhesive material are easily adhesive-molded integrally by heating.
（第４工程）
　第４工程は、図２（ｄ）に示すように、型締めをしていた金型２０を開放し、スペーサ２３を除去して、成型された粘着性保持治具１０を取り出す工程である。あらかじめ、ナノインプリント金型３０に、離型処理をしておくと凸部の破壊又は欠損を防止することができる。 (Fourth step)
The fourth step, as shown in FIG. 2(d), is a step of opening the clamped mold 20, removing the spacer 23, and taking out the molded adhesive holding jig 10. As shown in FIG. If the nanoimprint mold 30 is subjected to mold release treatment in advance, the protrusions can be prevented from being broken or chipped.
　本発明の粘着性保持治具は、高い粘着性を有し、かつ被粘着物から取り外しが可能であるので繰り返し使用可能であることから、マイクロＬＥＤ、セラミックコンデンサ、チップ抵抗、コイル、半導体素子等の微小な部品の製造工程用として用いることができる。 The adhesive holding jig of the present invention has high adhesiveness and can be removed from the object to be adhered, so that it can be used repeatedly. can be used for the manufacturing process of minute parts.
（第５工程）
　本発明粘着性保持治具の製造方法においては、図３に示すように、粘着剤層１２の凹凸パターン１３の凸部１３ａの頂上部以外の領域に、非粘着領域を形成する第５工程を設けてもよい。例えば、非粘着領域は、レーザー光照射（図３中、符号Ｌ）、ＵＶ照射、ブラスト加工等の表面処理を施すことにより形成することができる。 (Fifth step)
In the manufacturing method of the adhesive holding jig of the present invention, as shown in FIG. 3, a fifth step of forming a non-adhesive region in a region other than the top portions of the convex portions 13a of the concave-convex pattern 13 of the adhesive layer 12. may be provided. For example, the non-adhesive region can be formed by performing surface treatment such as laser light irradiation (symbol L in FIG. 3), UV irradiation, and blasting.
　非粘着領域の粘着力は、０．０２（Ｎ／２５ｍｍ）以下であることが好ましく、０．０１（Ｎ／２５ｍｍ）以下であることがより好ましい。粘着力が、上記範囲であることにより、被粘着物が粘着するのを防止することができる。 The adhesive strength of the non-adhesive area is preferably 0.02 (N/25mm) or less, more preferably 0.01 (N/25mm) or less. When the adhesive force is within the above range, it is possible to prevent the adherend from adhering.
　以下、実施例によって本発明の一例を詳細に説明する。
　実施例では、表１に示す、粘着剤層の凸部の上面の大きさ（表中の「凸部形状）を示す。）と高さとなるように、この凸部の形状に対応したパターンを有するナノインプリント金型を使用した。 An example of the present invention will be described in detail below with reference to examples.
In the examples, a pattern corresponding to the shape of the convex portion is formed so as to have the size and height of the upper surface of the convex portion of the pressure-sensitive adhesive layer shown in Table 1 ("convex shape" in the table). A nanoimprint mold with
［実施例１］
　まず、以下の材料からなるシリコーンゴム組成物を調製した。
－シリコーンゴム組成物－
（Ａ）未加硫のシリコーンゴム
　ＫＥ－１９５０－３０Ａ（信越化学工業株式会社社製）　　　　　５０質量部
　ＫＥ－１９５０－３０Ｂ（信越化学工業株式会社社製）　　　　　５０質量部
（Ｂ）粘着剤
　ＫＲ－３７００（信越化学工業株式会社製）　　　　　　　　　　３０質量部 [Example 1]
First, a silicone rubber composition was prepared from the following materials.
-Silicone rubber composition-
(A) Unvulcanized silicone rubber KE-1950-30A (manufactured by Shin-Etsu Chemical Co., Ltd.) 50 parts by mass KE-1950-30B (manufactured by Shin-Etsu Chemical Co., Ltd.) 50 parts by mass (B) Adhesive KR- 3700 (manufactured by Shin-Etsu Chemical Co., Ltd.) 30 parts by mass
　次に、粘着剤層の凸部の上面の大きさが３０μｍ×３０μｍ、凸部の高さが４０μｍとなるような、ナノインプリント金型を上金型に装着する。 Next, a nanoimprint mold is attached to the upper mold so that the size of the upper surface of the protrusions of the adhesive layer is 30 μm×30 μm and the height of the protrusions is 40 μm.
　次に、ガラス基材（厚さ０．７ｍｍ、４０ｍｍ×４０ｍｍ、ホウケイ酸ガラス）を下金型のキャビティ底部に配置し、ガラス基材上に、上記シリコーンゴム組成物を配置し、型締めをして、シリコーンゴム組成物を１１０℃で１０分間加硫した。その後、金型を開放して、成型された粘着性保持治具を取り出した。 Next, a glass substrate (0.7 mm thick, 40 mm x 40 mm, borosilicate glass) is placed on the bottom of the cavity of the lower mold, the silicone rubber composition is placed on the glass substrate, and the mold is clamped. Then, the silicone rubber composition was vulcanized at 110° C. for 10 minutes. After that, the mold was opened and the molded adhesive holding jig was taken out.
［実施例２］
　粘着剤層の凸部の上面の大きさが５０μｍ×３０μｍ、凸部の高さが５０μｍとなるような、ナノインプリント金型にしたこと以外は実施例１と同様に粘着性保持具を形成した。 [Example 2]
An adhesive holder was formed in the same manner as in Example 1, except that the nanoimprint mold was used so that the size of the upper surface of the convex portion of the adhesive layer was 50 μm×30 μm and the height of the convex portion was 50 μm.
［比較例１］
　実施例１においてナノインプリント金型の代わりに平坦な金属板を使用して、同様に成形して、凹凸のない粘着保持治具を成形した。
　その後、レーザー加工機でシリコーンゴム部を加工して、凹凸のある粘着性保持治具を形成した。 [Comparative Example 1]
A flat metal plate was used in place of the nanoimprint mold in Example 1, and molding was performed in the same manner as in Example 1 to form an adhesive holding jig without irregularities.
After that, the silicone rubber part was processed with a laser processing machine to form an adhesive holding jig with irregularities.
［比較例２］
　比較例１と同様にレーザー加工機で、実施例２と同様の凹凸形状を形成した。 [Comparative Example 2]
The uneven shape similar to that of Example 2 was formed using a laser processing machine as in Comparative Example 1.
（凸部形状及び凸部高さ）
　実施例及び比較例の粘着保持治具の凸部の形状及び凸部の高さを、レーザー顕微鏡（商品名「ＶＫ－Ｘ１０００」、キーエンス社製）で測定した。 (Convex shape and convex height)
The shape and height of the protrusions of the adhesive holding jigs of Examples and Comparative Examples were measured with a laser microscope (trade name “VK-X1000”, manufactured by Keyence Corporation).
（ゴム硬度）
　ゴム硬度は、ＪＩＳ　Ｋ　６２５３に従って、デューロメータＡ硬度計（商品名「ＧＳ－７１９Ｎ」、テクロック社製）で測定した。 (rubber hardness)
The rubber hardness was measured according to JIS K 6253 with a durometer A hardness tester (trade name "GS-719N", manufactured by Teclock).
　表１に、成型方法（ゴム部成形時間、ゴム部加工時間）、凸部の形状、凸部の高さ、ゴム硬度を示す。 Table 1 shows the molding method (rubber portion molding time, rubber portion processing time), the shape of the convex portion, the height of the convex portion, and the rubber hardness.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すように、本発明の粘着性保持治具は、レーザー光照射による粘着パターンの形成に比べて、成形時間の短縮が可能となった。 As shown in Table 1, the adhesive holding jig of the present invention made it possible to shorten the molding time compared to forming an adhesive pattern by laser light irradiation.
　１０　　粘着性保持治具
　１１　　支持基材
　１２　　粘着剤層
　１２ａ　　（粘着剤層の）表面
　１３　　凹凸パターン
　１３ａ　　凸部
　１３ｂ　　凹部
　２０　　金型
　２１　　上金型
　２２　　下金型
　２２ａ　　キャビティ底部
　２３　　スペーサ
　２４　　液状熱硬化性粘着材料
　３０　　ナノインプリント金型
　３１　　パターン
　Ｔ　　（スペーサの）厚さ
　ｈ　　凸部の高さ REFERENCE SIGNS LIST 10 adhesive holding jig 11 support substrate 12 adhesive layer 12a surface (of adhesive layer) 13 uneven pattern 13a convex portion 13b concave portion 20 mold 21 upper mold 22 lower mold 22a cavity bottom 23 spacer 24 liquid thermosetting adhesive material 30 nanoimprint mold 31 pattern T (spacer) thickness h height of protrusion

Claims (7)

  1. 　支持基材と、前記支持基材上に設けられ、表面に凹凸パターンを有する粘着剤層とを備える粘着性保持治具の製造方法であって、
    　上金型及び下金型を有する金型の前記上金型に、前記凹凸パターンを形成するためのパターンを有するナノインプリント金型を装着し、前記下金型のキャビティ底部に、前記支持基材を配置する第１工程と、
    　前記支持基材上に、液状熱硬化性粘着材料を配置する第２工程と、
    　前記金型を型締めし、前記金型を加熱することにより、前記支持基材と前記液状熱硬化性粘着材料とを一体的に接着成型する第３工程と、
    　前記金型を開放して、成型された前記粘着性保持治具を取り出す第４工程と、
    を含む粘着性保持治具の製造方法。     A method for producing an adhesive holding jig comprising a supporting substrate and an adhesive layer provided on the supporting substrate and having an uneven pattern on its surface,
    A nanoimprint mold having a pattern for forming the concave-convex pattern is attached to the upper mold of a mold having an upper mold and a lower mold, and the supporting substrate is attached to the bottom of the cavity of the lower mold. A first step of arranging;
    a second step of disposing a liquid thermosetting adhesive material on the supporting substrate;
    a third step of integrally bonding and molding the supporting substrate and the liquid thermosetting adhesive material by clamping the mold and heating the mold;
    a fourth step of opening the mold and taking out the molded adhesive holding jig;
    A method of manufacturing an adhesive holding jig comprising:
  2. 　前記ナノインプリント金型が、ニッケル電鋳金型である請求項１記載の粘着性保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to claim 1, wherein the nanoimprint mold is a nickel electroforming mold.
  3. 　前記液状熱硬化性粘着材料が、未加硫のシリコーンゴムを含有する請求項１又は２記載の粘着性保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to claim 1 or 2, wherein the liquid thermosetting adhesive material contains unvulcanized silicone rubber.
  4. 　前記支持基材が、ガラス基材である請求項１から３いずれか１項記載の粘着性保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to any one of claims 1 to 3, wherein the supporting base material is a glass base material.
  5. 　前記ガラス基材の少なくとも前記粘着剤層が形成される表面にプライマー処理が施されている請求項４記載の粘着性保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to claim 4, wherein at least the surface of the glass base material on which the adhesive layer is formed is subjected to a primer treatment.
  6. 　前記凹凸パターンの凸部の頂上部以外の領域に、非粘着領域を形成する第５工程を含む請求項１から５いずれか１項記載の粘着保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to any one of claims 1 to 5, further comprising a fifth step of forming a non-adhesive area in an area other than the peaks of the projections of the uneven pattern.
  7. 　前記粘着性保持治具が、マイクロＬＥＤの製造工程用である請求項１から６いずれか１項記載の粘着性保持治具の製造方法。 The method for manufacturing an adhesive holding jig according to any one of claims 1 to 6, wherein the adhesive holding jig is used for a micro LED manufacturing process.
PCT/JP2022/026253 2021-07-29 2022-06-30 Method for producing adhesive holding jig WO2023008086A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110847A (en) * 1999-10-13 2001-04-20 Murata Mfg Co Ltd Electronic component holding jig, holding method of electronic component holding jig and manufacturing method of electronic component
JP2002016103A (en) * 2000-06-28 2002-01-18 Nec Corp Intermediate sheet and chip-mounting system using it
JP2016192519A (en) * 2015-03-31 2016-11-10 株式会社協同インターナショナル Replica mold and manufacturing method thereof
JP2017007187A (en) * 2015-06-19 2017-01-12 株式会社リコー Method and apparatus for manufacturing mold formed article and optical element
JP2017154273A (en) * 2016-02-29 2017-09-07 株式会社ｎｉｔｔｏｈ Method for manufacturing mold by electroforming

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110847A (en) * 1999-10-13 2001-04-20 Murata Mfg Co Ltd Electronic component holding jig, holding method of electronic component holding jig and manufacturing method of electronic component
JP2002016103A (en) * 2000-06-28 2002-01-18 Nec Corp Intermediate sheet and chip-mounting system using it
JP2016192519A (en) * 2015-03-31 2016-11-10 株式会社協同インターナショナル Replica mold and manufacturing method thereof
JP2017007187A (en) * 2015-06-19 2017-01-12 株式会社リコー Method and apparatus for manufacturing mold formed article and optical element
JP2017154273A (en) * 2016-02-29 2017-09-07 株式会社ｎｉｔｔｏｈ Method for manufacturing mold by electroforming

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