JP2010087055A - Semiconductor package and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device for suppressing the defect of a package resin forming the body of the semiconductor package and preventing the generation of a cause being a malfunction in the semiconductor device. <P>SOLUTION: The package resin forming the body is molded on a lead frame and a chamfer is formed at an external corner in the appearance shape of the package resin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor package and a semiconductor device, and relates to the shape of a package resin forming a casing.

  As a semiconductor package of a conventional semiconductor device, in particular, an optical semiconductor device, there is one described in Patent Document 1, for example. This is a surface-mount type LED semiconductor package, FIG. 3 shows a plan view, and FIG. 4 shows a front sectional view.

  As shown in FIGS. 3 and 4, the resin 2 constituting the casing is integrally attached to the lower surface of the chip pad portion 101 of the lead frame, the lower surface of the inner lead portion 102, and a part of the upper surface of the inner lead portion 102. is doing.

  A space 207 is formed in the resin 2 by a recess reaching the chip pad portion 101 from the upper surface. The space 207 forms a region to be sealed by being filled with a sealing resin, and the inner surface of the recess surrounding the space 207 is on the upper surface side. It forms a tapered inclined surface that decreases in diameter toward the bottom. In the outer shape of the resin 2, the protruding corner has an angular shape.

  A part of the chip pad portion 101 and the inner lead portion 102 of the lead frame is exposed on the lower surface of the space 207. Outer side lead 103 is exposed from side surfaces 203 and 204 of the front and rear of the transport direction of resin 2, and outer lead portion 103 is pressed so as to adhere along side surfaces 203 and 204 and bottom surface 205 of resin 2. Bending is performed, and the lower surface of the front end portion 105 of the outer lead portion 103 and the bottom center 206 of the resin 2 are substantially on the same plane.

In this optical semiconductor device using a semiconductor package, a light emitting element is mounted on the chip pad portion 101 of the semiconductor package, the light emitting element and the inner lead portion 102 are electrically connected by wire bonding, and a light-transmitting resin is formed in the space 207. To form a structure in which the light emitting element is sealed.
JP2003-7946

  In the substrate mounting of the above-described conventional optical semiconductor device and other semiconductor devices, the semiconductor device is arranged and arranged on an embossed tape or the like by a parts feeder such as a taping machine and supplied to the mounting machine.

  However, as described above, in the conventional semiconductor package, the projecting corner of the package resin forming the casing is angular, and when the semiconductor device is handled in the parts feeder, the package resin is slightly chipped to generate small pieces and fine powder. To do.

  On the other hand, silicone is often used for the translucent sealing resin, and silicone remains sticky on the surface even after curing, so small pieces and fine powder chipped from the package resin may adhere to the translucent resin. is there. The adhering substance to the light-transmitting resin is an obstructive element that blocks the light emitted from the light emitting element, or is a defective element that drops on the circuit board to be mounted on the board and becomes dust.

  The present invention solves the above-described problems, and provides a semiconductor package and a semiconductor device that suppress the loss of package resin that forms a housing of the semiconductor package and prevent the occurrence of a factor causing a problem in the semiconductor device. With the goal.

  In order to solve the above-described problems, a semiconductor package of the present invention is formed by molding a package resin that forms a casing on a lead frame, and a chamfered portion or a curved surface portion is formed at an outer corner of the outer shape of the package resin. It is characterized by.

  In the semiconductor package of the present invention, the package resin is characterized in that the chamfered portion or the curved surface portion is formed at a corner portion between two surfaces forming an outer corner portion and an apex portion between multiple surfaces in an outer shape.

  Further, in the semiconductor package of the present invention, the package resin has a recess for mounting a semiconductor element opened in a main surface, and has the chamfered portion or a curved surface portion at a protruding corner portion including an edge of the main surface. Features.

  A semiconductor device according to the present invention includes a semiconductor element mounted on a die pad of a lead frame, and a package resin forming a casing on the lead frame. The outer shape of the package resin includes at least an edge of the main surface. A chamfered portion or a curved surface portion is formed at a corner portion between two surfaces forming a portion and an apex portion between multiple surfaces.

  According to another aspect of the present invention, there is provided a semiconductor device including: a package resin forming a housing on a lead frame; and a semiconductor package having a recess opened on a main surface of the package resin, and an optical semiconductor element mounted on the recess of the package resin. A semiconductor device sealed with a light-transmitting resin, wherein the outer shape of the package resin includes a chamfered portion at a corner portion between two surfaces including at least an edge of the main surface and forming a protruding corner portion and a vertex portion between multiple surfaces Alternatively, a curved surface portion is formed.

  The semiconductor device of the present invention is engaged with a holding jig for holding the semiconductor device when mounted on the substrate by the package resin, and the package resin is formed by a chamfered portion formed at the protruding corner portion in the outer shape or The curved surface portion is shaped to engage with the holding jig.

  As described above, according to the present invention, by forming a chamfered portion or a curved surface portion at the protruding corner portion of the outer shape of the package resin that forms the housing of the semiconductor package, a semiconductor device using this semiconductor package is Package resin defects can be suppressed.

  For example, even when the semiconductor device is aligned in the parts feeder, vibrations applied to the semiconductor device cause interference between the component feeder components and the semiconductor device, or even when the semiconductor device package resins rub against each other. Since the protruding corner portion, which is an easy part, has a chamfered shape or a curved surface shape, it can be prevented from being lost, and it can be prevented from dropping onto the circuit board to be mounted on the board and becoming a defective element dust. In particular, in an optical semiconductor device, even when silicone or the like that remains sticky on the surface after curing is used as a light-transmitting sealing resin, small pieces or fine powder of the package resin may cause the light emitted from the light-emitting element to be emitted. It can suppress that the situation which becomes an obstructive element to shield and adheres to translucent resin occurs.

  In addition, when mounting a semiconductor device on a substrate, by using a holding jig (collet) having a shape corresponding to the outer shape of the package resin formed in a chamfered shape or a curved shape at the protruding corner, The positional accuracy relative to the semiconductor device can be increased, and as a result, the positional accuracy of the mounting position of the semiconductor device on the substrate can be increased.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a top perspective view showing an optical semiconductor package according to the present invention, and FIG. 2 is a bottom perspective view of the optical semiconductor package.
As shown in FIGS. 1 and 2, the optical semiconductor package 51 is formed by insert molding a package resin 53 that forms a casing on the lead frame 52, and the package resin 53 includes the lower surface of the die pad portion 521 of the lead frame 52 and the inner leads. It is provided integrally on the lower surface of the portion 522 and further on part of the upper surface of the inner lead portion 522.

  The package resin 53 has an opening in the upper surface 531 that forms the main surface thereof, and a recess 54 is formed. The recess 54 forms a space that reaches the die pad portion 521 of the lead frame 52, and seals the optical semiconductor element mounted on the die pad portion 521. An area to be filled with a translucent resin (not shown) for stopping is formed. The package resin 53 forms a tapered inclined surface whose inner side surface 532 surrounding the space of the concave portion 54 is reduced in diameter from the upper surface side downward.

  A part of the die pad portion 521 and the inner lead portion 522 of the lead frame 52 is exposed at the bottom surface of the recess 54, and the outer lead portion 523 of the lead frame 52 is exposed from the outer side surfaces 533 and 534 of the package resin 53. ing. The outer lead portion 523 is press-bended so as to be in close contact with the side surfaces 533 and 534 and the bottom surface 535 of the package resin 53, and the bottom surface of the front end portion 524 of the outer lead portion 523 and the bottom surface 535 of the package resin 53 are substantially the same. On the same plane.

  In the optical semiconductor device using the optical semiconductor package 53, an optical semiconductor element (not shown) is mounted on the die pad portion 521 of the optical semiconductor package 51, and the optical semiconductor element and the inner lead portion 522 are electrically connected by wire bonding. The space of the recess 54 is filled with a translucent resin to seal the optical semiconductor element.

  The package resin 53 of the optical semiconductor package 51 has a substantially rectangular parallelepiped shape, and has an upper surface 531, side surfaces 533 and 534, a bottom surface 535, and side surfaces 536 and 537 on both sides via the lead frame 52, A chamfered portion 538 is formed between two surfaces forming the projecting corner portion of the outer shape of the package resin 53, that is, at each corner portion of the upper surface 531 and the side surfaces 536 and 537. Further, chamfered portions 538 are formed between multiple surfaces, that is, apex portions of the upper surface 531, the side surfaces 536 and 537, and the side surfaces 533 and 534. Although the chamfered portion 538 is used in this embodiment mode, it may be formed on a curved surface portion. Further, in the present embodiment, the chamfered portion 538 is provided at the protruding corner portion including the edge of the upper surface 531 that is the main surface where the concave portion 54 opens, but the chamfered portion 538 or the portion that forms the curved surface portion is formed at all corners. And vertices.

  When an optical semiconductor device using the optical semiconductor package 51 is mounted on a substrate, a chamfered portion 538 or a curved surface formed at a protruding corner portion of the outer shape of the package resin 53 as a holding jig (collet) for holding the semiconductor device. Use a shape that engages the part. In other words, the optical semiconductor device using the optical semiconductor package 53 has a shape corresponding to the shape of the holding jig (collet), and the protruding corner portion is a chamfered portion 538 or a curved surface portion that engages with the holding jig (collet). Make.

  With the configuration described above, by forming a chamfered portion 538 or a curved surface portion in the outer corner of the outer shape of the package resin 53 that forms the housing of the optical semiconductor package 51, an optical semiconductor device using the optical semiconductor package 51 is Defects in the package resin 53 can be suppressed during handling.

  For example, even when the optical semiconductor device is aligned in the parts feeder, vibrations applied to the optical semiconductor device cause interference between the component feeder components and the optical semiconductor device, or the package resin of the optical semiconductor device rubs against each other. Since the protruding corner, which is a part where the resin 53 is easily damaged, has a chamfered shape 538 or a curved surface, the loss can be prevented, and the resin 53 can be prevented from dropping on the circuit board to be mounted on the circuit board and becoming a defective element dust. it can.

  Even in the case of using, for example, silicone that remains sticky on the surface even after curing as a light-transmitting sealing resin in an optical semiconductor device, small pieces and fine powder of the package resin 53 cause the light emitted from the optical semiconductor element to be emitted. It can suppress that the situation which becomes an obstructive element to shield and adheres to translucent resin occurs.

  Further, when mounting the optical semiconductor device on the substrate, a holding jig (collet) having a shape corresponding to the outer shape of the package resin 53 in which the chamfered portion 538 or the curved surface portion is formed at the protruding corner portion is used to hold the optical semiconductor device. The relative positional accuracy between the jig and the semiconductor device can be increased, and as a result, the position system of the mounting position of the semiconductor device on the substrate can be increased. In addition, the recognizability of the directivity on the anode side and the cathode side can be improved as compared with the conventional configuration.

  In the present embodiment, the outer lead portion 523 is bent toward the bottom surface 535 of the package resin 53. However, as another embodiment, the outer lead portion 523 is bent toward the upper surface 531 side of the package resin 53, that is, the light emitting side. It is also possible. In this case, a hole for mounting the optical semiconductor device is opened in the mounting substrate, and the light emitting side of the optical semiconductor device is mounted in this opening. At this time, the chamfered portion 538 or the curved surface portion formed at the projecting corner portion of the outer shape of the package resin 53 serves as a guide for guiding the optical semiconductor device to the opening of the mounting substrate, and the optical semiconductor device is easily positioned on the mounting substrate. be able to. Further, the surface of the mounting substrate and the light emitting surface which is the upper surface 531 of the package resin 53 can be arranged in the same plane, and it is possible to avoid that the cross-sectional wall at the opening of the mounting substrate hinders light emission.

  The present invention is effective for a semiconductor package and a semiconductor device because it can suppress the loss of the package resin that forms the housing of the semiconductor package and prevent the occurrence of a factor causing a problem in the semiconductor device.

The top perspective view which shows the semiconductor package in embodiment of this invention Bottom perspective view showing the semiconductor package Plan view showing a conventional semiconductor package Front sectional view showing the semiconductor package

Explanation of symbols

51 Optical Semiconductor Package 52 Lead Frame 53 Package Resin 54 Recess 521 Die Pad 522 Inner Lead 523 Outer Lead 524 Tip 531 Upper Surface 532 Inner Side 533 534 Side 535 Bottom 536, 537 Side 538 Chamfer

Claims (6)

  A semiconductor package, wherein a lead resin is molded with a package resin forming a casing, and a chamfered portion or a curved portion is formed at a protruding corner portion of the outer shape of the package resin.   2. The semiconductor package according to claim 1, wherein the package resin is formed with the chamfered portion or the curved surface portion at a corner portion between two surfaces forming a protruding corner portion in an outer shape and an apex portion between multiple surfaces.   3. The package resin according to claim 1, wherein the package resin has a recess for mounting a semiconductor element opened in a main surface, and has the chamfered portion or a curved surface portion at a protruding corner portion including an edge of the main surface. The semiconductor package described.   A semiconductor element is mounted on a die pad of a lead frame, and a package resin forming a housing is formed on the lead frame, and the outer shape of the package resin includes at least an edge of the main surface and between two surfaces forming a protruding corner. A semiconductor device, wherein a chamfered portion or a curved surface portion is formed at a corner portion and a vertex portion between multiple faces.   A package resin forming a housing on the lead frame is formed, and a semiconductor package having a recess opened on a main surface of the package resin, and an optical semiconductor element is mounted on the recess of the package resin, and a translucent sealing resin is used. In a sealed semiconductor device, a chamfered portion or a curved surface portion is formed at a corner portion between two faces that form at least an outer corner of the package resin and an apex portion between multiple faces, including at least an edge of the main surface. A semiconductor device characterized by that.   The package resin is engaged with a holding jig for holding a semiconductor device when mounted on a substrate, and the chamfered portion or curved surface portion formed at the protruding corner portion of the outer shape of the package resin is the holding jig. The semiconductor device according to claim 4, wherein the semiconductor device has a shape that engages with the semiconductor device.

Images