JP2002110835A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component in which miniaturization, high accuracy in size, and prevention of molding failure can be realized. SOLUTION: This electronic component comprises an airtight sealed package, which consists of a package body 1 having a bottom plate 3 and a side wall 5, and a lid 31, an electronic element A enclosed inside the package, and lead terminals 7. The lead terminals 7 are electrically connected to the electronic element A and are arranged on outer faces of the package while a part of each lead terminal is embedded in the bottom plate 3. The package body 1 is composed of a resin in which ceramic whiskers are dispersed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which an electronic element such as a piezoelectric oscillator is housed in a housing.

[0002]

2. Description of the Related Art Conventionally, a resonator, a filter, a sensor, or the like is known as an application device using a piezoelectric resonator or the like.

[0003] In these piezoelectric devices, the piezoelectric resonator and the like are provided with an outer case made of resin or ceramics in order to prevent the characteristics of the piezoelectric resonator or the like from largely changing due to adhesion of water, humidity, or dust. The structure is covered while securing the vibration space.

[0004] It is also important to establish electrical continuity between a piezoelectric resonator disposed inside and an external terminal while being covered with an outer case or the like. In addition, the miniaturization of piezoelectric devices has been progressing in response to the miniaturization of electronic devices. Therefore, it is indispensable to have high reliability while miniaturizing electronic components.

[0005] As a conventional surface mount type electronic component, one disclosed in Japanese Patent Application Laid-Open No. 2000-165179 is known. A resin housing having a plurality of recesses for conductive members, and a portion of the housing that abuts on the bottom plate protrudes toward the inside of the housing, and a protrusion exposed to the recess for conductive members formed on the inner surface of the bottom plate includes: A plurality of lead terminals integrally provided in the housing; an electronic element housed in the housing and having a plurality of connection electrodes formed on the bottom surface; and a connection electrode and a lead provided in the recess for the conductive member. It has a conductive member for connecting to the projecting portion of the terminal, and a metal lid adhered to the opening of the housing.

In such a surface mount type electronic component, a conductive paste is filled in a recess for a conductive member, and before the paste is solidified, an electronic element is housed in a housing and a connection electrode for the conductive member is used. The electronic element was electrically connected to the lead terminals provided on the housing by being connected to the conductive paste in the recess and solidifying.

A high heat-resistant resin is used for the housing because reflow soldering is performed, and a liquid crystal polymer or the like containing glass fibers in the high heat-resistant resin is used to further increase the strength. .

[0008] Such a housing is made by filling a molding die with resin from the vicinity of the embedded portion of the lead terminal so as to sufficiently fill the embedded portion of the lead terminal with the resin. Since the resin containing glass fiber flows into the narrow gap, the glass fiber is oriented along the gap.

[0009]

However, in the above-mentioned conventional surface-mounted electronic components, the average diameter of glass fibers used for the liquid crystal polymer is about 5 to 50 μm, and the length is 50 to 300 μm. In recent years, where the size of the storage body has been required to be smaller and the thickness has been reduced to 400 μm or less,
Because the dimensions of the glass fibers are large and the orientation of the glass fibers after injection molding is high and the molding shrinkage is large,
There is a problem that it is difficult to obtain a high dimensional accuracy of the housing, and that the resin cannot be sufficiently filled around the buried lead terminal, and a gap is easily generated together with molding failure.

That is, when the raw material mixture of the molten resin and the glass fiber is filled in the mold, the glass fiber 71 is oriented in the inflow direction (perpendicular to the paper surface) of the raw material mixture as shown in FIG. , The ratio of the thermal expansion coefficient α1 in the inflow direction of the raw material mixture to the thermal expansion coefficient α2 in the direction perpendicular to the inflow direction (α
2 / α1) is as large as about 4 to 6, and the amount of shrinkage in the direction perpendicular to the length direction of the glass fiber 71 during cooling and hardening of the raw material mixture increases. There was a problem that it became low.

The lead terminals 75 are partially buried in the housing 73. Such a structure has a structure in which a part of the lead terminals 75 is positioned at the center of the mold, and the raw material is placed in the mold. Achieved by filling the mixture. At this time, the raw material mixture passes between the molding die and the lead terminal 75, and the glass fiber 71 exists between the molding die and the lead terminal 75. The glass fiber 71 is present between the molding die and the embedded portion of the lead terminal 75, and the resin 76 cannot be sufficiently filled between the molding die and the dimensional accuracy in this portion is significantly reduced. There has been a problem that the resin 76 is not sufficiently filled around the terminal 75 and a gap is easily generated together with molding failure, and airtightness with the outside cannot be sufficiently ensured.

For example, the glass fibers 71 contained in the liquid crystal polymer have an average diameter of about 5 to 50 μm and a length of 50 to 30 μm.
0 μm is used, and as the size of the housing 73 is reduced, the thickness of the raw material mixture covering the periphery of the lead terminal 75 in the portion embedded in the housing 73 is reduced to about 200 μm or less, and the resin 76 Since the periphery of the terminal 75 cannot be covered, a molding defect such as the existence of the gap 77 occurs, and there is a problem that a sufficient sealing cannot be obtained.

As a result, water or moisture enters the inside from the gap 77 or a part where sealing is insufficient, and the electrical characteristics, for example, P / V
There has been a problem that characteristics and oscillation frequency are greatly deteriorated or changed. On the other hand, in order to sufficiently prevent water and moisture from entering the inside, the thickness of the storage body 73 in the portion where the lead terminals 75 are embedded must be increased.
There is a problem in that the overall size is increased, and it is not possible to reduce the size while maintaining airtightness.

The present invention has been made in view of the above-mentioned problems, and has as its object to provide an electronic component which can be miniaturized, can obtain high dimensional accuracy, and can prevent molding defects. The purpose is to do.

[0015]

According to the present invention, there is provided an electronic component comprising: a hermetically sealed storage container comprising a storage body having a bottom plate and a side wall and a lid; an electronic element stored in the storage container; A lead terminal electrically connected to the electronic element and partially provided on an outer surface of the storage body, wherein the storage body has ceramic whiskers dispersed in resin. It is.

Since the ceramic whisker is generally much smaller than the glass fiber used for the liquid crystal polymer forming the conventional container, the length is short, and since it is crystallized, the length of the ceramic whisker in the longitudinal direction and the diameter in the radial direction are changed depending on the composition. Since the thermal expansion coefficient can be controlled, the ratio (α2 / α1) of the thermal expansion coefficient α1 in the inflow direction of the raw material mixture of the resin and the ceramic whisker to the thermal expansion coefficient α2 in the direction perpendicular to the inflow direction (α2 / α1) is about 2 to 3.5. When the raw material mixture is heated and filled into the mold by injection molding, the ceramic whiskers are oriented in the inflow direction of the raw material mixture, but the shrinkage amount of the ceramic whisker when the raw material mixture is hardened is reduced. Even if the bottom plate and side walls of the container are made small and thin, the dimensional accuracy after molding of the container becomes good,
The adhesion accuracy between the housing and the lid can be increased, and high sealing properties can be obtained.

Further, such a structure is manufactured by positioning a part of a lead terminal at a central portion in a molding die and filling a raw material mixture in the molding die. Because it is very small, ceramic whiskers that are small relative to the thickness of the container are sufficiently present between the mold and the embedded portion of the lead terminal, and the surface of the lead terminal can be sufficiently filled with resin to form a gap. Can be prevented, the dimensional accuracy in this portion can be improved, and the airtightness with the outside can be sufficiently maintained.

Further, since no gap is formed between the lead terminal and the housing, and the space is in close contact with the lead terminal, it is possible to prevent water from penetrating from this portion and to improve the airtightness in the housing. For example, moisture resistance can be ensured even when the surface-mounted piezoelectric oscillator is washed with hot water before and after mounting on a substrate.

The average length of the ceramic whiskers is 10 to 2
0 μm, and the average diameter is desirably 1 μm or less. By using such a whisker, the amount of shrinkage of the ceramic whisker during curing of the raw material mixture can be further reduced, and the dimensional accuracy can be adequately adapted to the miniaturization and thinning of the housing. As a result, the raw material mixture can be sufficiently filled even between the molding die and the embedded portion of the lead terminal, thereby improving the moldability and further improving the dimensional accuracy.

Further, by using the whisker as described above, the surface roughness after molding can be reduced to about 1 μm or less, and the adhesion between the raw material mixture and the lead terminal can be reduced in the portion embedded in the lead terminal housing. The airtightness can be improved.

The ceramic whisker contains at least one of potassium titanate, barium titanate, calcium titanate, and strontium titanate as a main component, and in particular, uses potassium titanate to provide anisotropic case strength. And a sufficient strength can be secured, and the ratio (α2 / α1) of the thermal expansion coefficient α1 in the inflow direction and the thermal expansion coefficient α2 in the direction perpendicular to the inflow direction of the raw material mixture of the resin and the ceramic whisker is set to 3. It can be reduced to less than 5.

Further, it is desirable that the resin used for the container contains at least one of liquid crystalline aromatic polyester resin, linear aromatic polymer, polyimide and polyamideimide as a main component. By using such a resin, deformation at a high temperature of 150 ° C. to 260 ° C. can be reduced, and it is possible to cope with reflow surface mounting, and it is small, has high sealing reliability, and has excellent moisture resistance. Electronic components can be obtained.

Further, it is desirable that the thickness of the housing at the portion where the lead terminals are buried is 400 μm or less. With such a thickness, the size of the housing can be reduced, and even if the size is reduced, poor molding can be further prevented, and high dimensional accuracy can be obtained.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component comprising a surface-mount type piezoelectric oscillator according to the present invention will be described with reference to the drawings. FIG.
FIG. 2 is an external perspective view of the electronic component of the present invention, FIG. 2 is a vertical cross-sectional view thereof, and FIG. 3 is a horizontal cross-sectional view thereof. A piezoelectric oscillator including a piezoelectric resonance element and a capacitor element is provided in a storage container. ing.

In FIGS. 1 to 3, reference numeral 1 denotes a housing, and the housing 1 includes a ceramic whisker such as a potassium titanate whisker and a barium titanate whisker, a liquid crystalline aromatic polyester resin, It is formed from a raw material mixture composed of a heat-resistant resin selected from linear aromatic polymers, polyimides, and polyamideimides.

As the ceramic whisker, the ratio (α) between the coefficient of thermal expansion α1 in the inflow direction of the raw material mixture of the resin and the ceramic whisker and the coefficient of thermal expansion α2 in the direction perpendicular to the inflow direction is represented by α
In order to make 2 / α1) less than 3.5, it is preferable that the average length is 5 to 30 μm and the average diameter is 1 μm or less. This is because when the average length of the whiskers is shorter than 5 μm, the strength is reduced and cracks may be formed in the molded body. When the average length is longer than 30 μm, the ratio of the thermal expansion coefficient (α2 / α1) is obtained. Is likely to be large. Average length of ceramic whisker is 10-20μ
m, an average diameter of 0.2 to 0.7 μm is desirable from the viewpoint that the adhesion between the raw material mixture and the lead terminal can be improved in the portion embedded in the lead terminal housing, and the airtightness is improved. .

As the ceramic whisker, a potassium titanate whisker is preferable because the surface of the whisker has few irregularities and is easily mixed with the resin.

Further, as the heat-resistant resin, it is necessary to bond the case and the lid, which is another member, and from the viewpoint of enhancing the bonding effect, a liquid crystalline aromatic polyester resin is preferable.

As shown in FIGS. 2 and 3, the housing 1 has a bottom plate 3 and a side wall 5 integrated with each other, has an upper opening, and has a housing area for a piezoelectric oscillator therein. (Internal space) is formed. The inner periphery of the opening is a tapered surface 6 that expands outward, and the tapered opening allows the piezoelectric oscillator to be accommodated and arranged smoothly. On the outer peripheral surface of the housing 1, three lead terminals 7 made of a metal member such as nickel-white or phosphor bronze are arranged.

As shown in FIG. 4, three recesses 8 for conductive members are formed on the inner surface of the bottom plate 3 of the housing 1, and these recesses 8 for conductive members are formed as shown in FIGS. The cross-sectional area on the lower surface side of the bottom plate 3 is small, and the cross-sectional area on the upper surface side is large.

As shown in FIGS. 2 and 3, the lead terminal 7 has a projection 9 formed by projecting a portion of the housing 1 in contact with the bottom plate 3 toward the inside of the housing 1 to form an inner surface of the bottom plate 3. The protruding portions 9 are integrally provided on the housing 1. That is, after arranging the lead terminal 7 in a predetermined molding die, a resin material (raw material mixture) is poured (injection molding), and the projection 9 of the lead terminal 7 and the bottom plate 3 of the housing 1 are integrated. The thickness of the bottom plate 3 is 400 μm for miniaturization.
m or less.

An electronic element A comprising a piezoelectric oscillator is accommodated in the housing 1, and this electronic element A is provided with vibration electrodes on both main surfaces of a rectangular piezoelectric substrate 13 as shown in FIG. 1
A piezoelectric resonance element 17 formed with the elements 5 and 16 and a capacitor element 23 formed with two capacitance components and having three connection electrodes 21 formed on one main surface of a rectangular dielectric substrate 19 are formed by each element 17. , 23 are electrically connected via conductive connecting members 25 disposed at both ends of the opposing surfaces.

The piezoelectric substrate 13 is made of PT (lead titanate), P
ZT (lead zirconate titanate), SrBi ₄ Ti ₄ O ₁₅ ,
_{(K 1- α - β Na α} K β) piezoceramic material mainly composed of the composition of NbO _3, etc., quartz, lithium tantalate, and a single crystal material such as lithium niobate and lithium tetraborate.

A vibrating electrode 15 formed from the center to the right end of the upper surface of the upper surface of the piezoelectric substrate 13 is
3, extending to the lower surface side main surface end via the right side surface,
An extraction electrode 15a is formed at the right end of the lower main surface.
A vibrating electrode 16 formed from the center to the left end of the lower surface of the piezoelectric substrate 13 is extended from the left side of the piezoelectric substrate 13 to the end of the upper main surface. An extraction electrode 16a is formed at the left end of the surface. That is, the vibrating electrode 15 is formed on the conductor film 1 formed on the right side of the piezoelectric substrate 13.
5b is connected to the extraction electrode 15a via the vibration electrode 16a.
Is connected to the extraction electrode 16a via a conductor film 16b formed on the left side surface of the piezoelectric substrate 13.

The vibrating electrodes 15, 16 and the extraction electrode 15
a and 16a are formed of, for example, a thin film conductor film mainly composed of an Ag-based material, and the conductor films 15b and 16b are formed of, for example, A
It is formed of an Ag-based thin film formed by printing, thermosetting, sputtering, or the like of a conductive paste mainly containing a g-based material.

The capacitor element 23 is made of PT (lead titanate), PZT (lead zirconate titanate), BaTiO ₃
It is composed of a rectangular dielectric substrate 19 made of a dielectric ceramic material such as (barium titanate) and a plurality of connection electrodes 21 for forming two capacitance components.
In the figure, two electrodes 2 are provided on the upper surface side of a dielectric substrate 19.
0a and 20b form a capacitance component on the lower side, which is one main surface of the dielectric substrate 19, and at the same time, three connection electrodes 21a to achieve connection with the outside (lead terminal 7).
21b and 21c are formed.

The upper electrode 20 a and the lower connection electrode 21 a are connected to the conductor film 22 on one end face of the dielectric substrate 19.
The electrode 20b on the upper surface and the connection electrode 21b on the lower surface are connected via the conductor film 22b on the other end surface of the dielectric substrate 19. Further, the electrodes 20 a and 20 b on the upper surface side of the dielectric substrate 19 partially face the connection electrodes 21 c on the lower surface of the dielectric substrate 19.

That is, when the connection electrode 21c on the lower surface of the dielectric substrate 19 is viewed as a center, a predetermined capacitance component is formed between the dielectric substrate 19 and the electrode 20a on the upper surface through the thickness of the dielectric substrate 19. predetermined capacity is formed between the electrode and 20a connecting electrode 21a, both capacitive component is a first capacitance component C ₁ is constructed. The connection electrode 21c and the electrode 20b, the second capacitive component C ₂ is obtained in between the electrode 20b connecting electrode 21b.

The above-described piezoelectric resonance element 17 and capacitor element 23 are mechanically joined and electrically connected to each other by a conductive connection member 25 at a predetermined interval. Thereby, the electronic element A is configured. Note that, in the above example, an example in which the electronic element A including the piezoelectric resonance element 17 and the capacitor element 23 is housed in the housing 1 has been described, but only the piezoelectric resonance element may be housed.

The conductive member recess 8 of the housing 1 is provided with a conductive member 27 for connecting the connection electrode 21 of the capacitor element 23 and the protruding portion 9 of the lead terminal 7. The conductive member 27 is formed of a conductive member. It is formed by filling the conductive concave portion 8 with a conductive paste. That is, the conductive member 27
The cross-sectional area S ₁ of the lead terminal 7 on the protruding portion 9 side is formed smaller than the cross-sectional area S _{2 of} the capacitor element 23 on the connection electrode 21 side, and the side surface of the conductive member 27 and the protruding portion 9 of the lead terminal 7 are formed. The angle θ with the upper surface is less than 90 degrees.

The opening of the housing 1 is sealed by fitting the peripheral wall 33 of the cap-shaped metal lid 31 to the side wall 5 of the housing 1. The metal lid 31 has a thickness of 40
It is composed of a stainless steel plate of about 100 μm.
That is, on the outer peripheral surface of the side wall 5 of the housing 1, an inclined portion 37 inclined toward the inside of the housing 1 is formed, and an epoxy-based material is provided between the inclined portion 37 and the peripheral wall 33 of the metal lid 31. By filling the adhesive 39 made of resin or the like, the metal lid 3
1 is fixed to the housing 1.

As shown in FIGS. 2 and 4, an insulating recess 41 for insulating the connection electrodes 21 of the capacitor element 23 is provided between the conductive member recesses 8 formed on the inner surface of the bottom plate 3. Are formed.

In such a surface-mount type piezoelectric oscillator, first, the conductive member 27 is formed by filling a conductive paste in the conductive member recess 8 of the housing 1 as shown in FIG.
The electronic element A is housed from above, and the connection electrode 21 is connected to the conductive member 27. At this time, simultaneously with the solidification of the conductive paste in the conductive member concave portion 8, the connection electrode 2 of the electronic element A is formed.
1 is fixed, and the electronic element A is fixed in the housing 1.

The conductive member 27 is manufactured by supplying and curing a conductive resin paste obtained by mixing silver powder or an alloy powder of copper and silver with an epoxy adhesive.

Thereafter, an adhesive made of an epoxy resin is applied to the inclined portion 37 formed on the outer peripheral surface of the side wall 5 of the housing 1, and the peripheral wall 33 of the cap-shaped metal lid 31 is removed.
The electronic component made of the surface-mount type piezoelectric oscillator of the present invention can be manufactured by externally fitting to the side wall 5 of the housing 1 for sealing.

In the electronic component configured as described above, since the ceramic whisker is generally very small, its length is also short. When the raw material mixture is filled into a molding die by injection molding, the ceramic whisker is mainly filled with the inflow of the raw material mixture. Although it is oriented in the direction, the ratio (α2 / α1) of the thermal expansion coefficient α1 in the inflow direction and the thermal expansion coefficient α2 in the direction perpendicular to the inflow direction of the raw material mixture of the resin and the ceramic whisker is less than 3.5. In addition, since the difference in shrinkage during curing of the raw material mixture is small, even if the bottom plate and side walls of the storage body are reduced in size and thickness, the dimensional accuracy of the storage body after molding is improved, and the adhesion accuracy between the storage body and the lid is improved. And a high sealing property can be obtained.

Also, with such a structure, the ceramic whisker is much smaller than the glass fiber even when a part of the lead terminal is located in the center of the mold and the raw material mixture is filled in the mold. Therefore, ceramic whiskers smaller than the thickness of the container are sufficiently present between the molding die and the buried portion of the lead terminal, so that the resin can be sufficiently filled in the lead terminal surface, and molding defects such as formation of a gap are formed. Can be prevented, the dimensional accuracy in this portion can be improved, and the airtightness with the outside can be sufficiently maintained.

FIG. 6 shows the housing 1 in which a part of the lead terminal 7 is buried. Here, reference numeral 51 denotes a ceramic whisker, and 53 denotes a resin.

Also, since the electronic element A is accommodated from above the housing 1 and the metal sealing member 31 is arranged in the opening thereof, the electronic element A is accommodated from the side and the side surface is made of resin as in the conventional case. Therefore, even if electronic elements A of various sizes are accommodated in the housing 1, the resin does not enter the housing 1 and the vibration of the piezoelectric resonance element 17 is limited. No oscillation characteristics are degraded.

In the surface-mount type piezoelectric oscillator of the present invention, the cross-sectional area S ₁ of the lead terminal 7 on the side of the protrusion 9 is made smaller than the cross-sectional area S ₂ of the connection electrode 21 side. Angle between the lead member 7 and the side surface of the conductive member 27 becomes less than 90 degrees, and even if moisture invades from the gap between the lead terminal 7 and the housing 1, the water penetrates at the connection portion between the protrusion 9 and the conductive member 27. Is prevented, the sealing reliability of the housing 1 is further improved, and the moisture resistance in the case is further improved.

Further, in the surface mount type piezoelectric oscillator of the present invention, the peripheral wall 33 of the cap-shaped metal lid 31 is provided.
Is externally fitted to the side wall 5 of the housing 1, and an inclined portion 37 is formed on the outer peripheral surface of the side wall 5 of the housing 1 to be inclined toward the inside of the housing 1, and the inclined portion 37 and the metal lid are formed. By filling the gap 39 with the surrounding wall 33 with the adhesive 39, the opening of the housing 1 can be reliably sealed, and the sealing member 31 can be sealed.
Is made of metal, the thickness of the sealing member 31 can be reduced,
The thickness of the surface mount type piezoelectric oscillator can be reduced.

The opening of the housing may be sealed by bonding a flat resin lid to the upper end surface of the side wall of the housing via an adhesive. In this case, it is desirable that the resin lid is made of the same material as the container.

[0053]

EXAMPLE A small container having a capacity of about 0.005 cc as shown in FIGS. 4 and 6 was prepared.
When the container was 100 parts by weight of the polyester resin, 30 parts by weight of potassium titanate whisker (average fiber diameter: 0.4 μm, average fiber length: 17 μm) was added to 100 parts by weight of the liquid crystalline aromatic polyester resin to form a composite. A raw material mixture (composite resin) was used. The part where the lead terminal of the container is embedded, that is, the thickness of the bottom plate is 300 μm and 400 μm.
Were prepared.

As an electronic element housed in the housing container, a piezoelectric oscillator in which a capacitor element and a piezoelectric element were laminated was manufactured. For the piezoelectric resonance element, the Ag paste is made of a PT piezoelectric ceramic (L
= 1.5 mm, W = 1.0 mm, t = 0.22 mm) to produce a piezoelectric resonance element used for tertiary overtone vibration as shown in FIG. 5 (oscillation frequency 33.86).
MHz). The P / V value at this time was 71 dB.

Further, the capacitance components C ₁ and C ₂ were set to 15 pF, and a capacitor element having the same L and W dimensions as the piezoelectric resonator was manufactured using a PT-based piezoelectric ceramic.

Next, the piezoelectric resonance element, the capacitor element, and the silver paste were fixed at both ends to produce an electronic element composed of a two-layer laminate.

Next, a conductive silver paste was filled in the recess, and an electronic element was inserted and fixed from above the conductive silver paste as shown in FIGS. Next, an epoxy resin is applied to the inclined portion of the side wall of the housing, the peripheral wall of the cap-shaped metal lid is externally fitted to the side wall of the housing, and fixedly sealed while heating at 150 ° C. 1000 pieces of 33.86 MHz surface mount type oscillators of the invention were produced.

After passing through the reflow (at 260 ° C. for 5 seconds) to mount these surface mount type piezoelectric oscillators on the substrate,
A boiling quenching test in which the sample was put into boiling water at 100 ° C. and then rapidly cooled in water at 10 ° C. was repeated five times to evaluate whether or not the sealing was released and water permeated into the container. As a result, none of the bottom plates having a thickness of 300 μm or 400 μm resulted in poor sealing. Further, a heat shock test in which the step of holding at a temperature of 150 ° C. for 30 minutes and then holding at a temperature of −50 ° C. for 10 minutes was repeated 500 times was performed, and the thickness of the bottom plate was 300 μm or 400 μm. There was no.

On the other hand, when 100 parts by weight of the polyester resin is used, 100 parts by weight of the polyester resin is mixed with conventional glass fibers (average fiber diameter: 10 μm, average fiber length: 70 μm).
Using a raw material mixture containing 30 parts by weight of m), 1000 surface-mount type piezoelectric vibrators having a bottom plate thickness of 400 μm were manufactured and subjected to the same test as above. 21 occurred, and eight sealing failures occurred after the heat shock test. The cause of the poor sealing in the boiling and quenching test was the intrusion of water from the through hole in the bottom plate of the housing and from the joint with the lid.

[0060]

According to the electronic component of the present invention, since the housing is manufactured using the raw material mixture containing the resin and the ceramic whisker, the dimensional accuracy after injection molding can be reduced even if the size is reduced. Can be increased,
The adhesion accuracy with the lid can be increased, and further, the molding failure of the storage body can be prevented, and high sealing properties can be obtained.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an electronic component including a surface-mount type piezoelectric oscillator of the present invention.

FIG. 2 is a longitudinal sectional view taken along line aa of FIG.

FIG. 3 is a cross-sectional view taken along the line bb of FIG. 2;

FIG. 4 is a plan view showing a housing in which lead terminals are integrally formed.

FIG. 5 is an exploded perspective view of the piezoelectric oscillator of FIG. 2;

FIG. 6 is a cross-sectional view showing a storage body of the present invention.

FIG. 7 is a cross-sectional view showing a conventional storage body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Storage body 3 ... Bottom plate 5 ... Side wall 7 ... Lead terminal 31 ... Lid body 51 ... Ceramic whisker 53 ... Resin A ... Electronic element

Claims (5)

[Claims] 1. An airtightly sealed storage container comprising a storage body having a bottom plate and a side wall and a lid, an electronic element stored in the storage container, and electrically connected to the electronic element, An electronic component, comprising: a lead terminal partly buried in an outer surface of a housing, and the housing having ceramic whiskers dispersed in a resin. 2. The electronic component according to claim 1, wherein the ceramic whisker contains at least one of potassium titanate, barium titanate, calcium titanate and strontium titanate as a main component. 3. The resin used for the container is a liquid crystalline aromatic polyester resin, a linear aromatic polymer, a polyimide,
The electronic component according to claim 1, wherein at least one kind of polyamideimide is a main component. 4. The electronic component according to claim 1, wherein the thickness of the housing at a portion where the lead terminals are embedded is 400 μm or less. 5. The electronic component according to claim 1, wherein the electronic element is a piezoelectric oscillator.