JP2011071159A - Vacuum suction nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum suction nozzle for surely and precisely placing an electronic component at a mounting position on a circuit board, by detecting an accurate position of a suctioned electronic component for the vacuum suction nozzle of a mounting device for moving the electronic component to the circuit board, as is, by detecting the position of the sucked electronic component by applying light from a camera side, and mounting it. <P>SOLUTION: The vacuum suction nozzle 1 includes, in a circumferential direction, a plurality of concave surface, where a conical section or a pyramid section spreads toward an opposite side from a suction surface side for sucking and holding an object to be suctioned by vacuum suction is recessed along an axial side and is spread gradually in width. When a light from the camera side is irradiated and the position of the object to be suctioned is detected, the image input level of the reflected light from the suction nozzle becomes low (low luminance); and since accurate position of the object to be suctioned can be detected, damages due to contact of the vacuum suction nozzle 1 with the already mounted electronic components, as much as possible, are reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a vacuum suction nozzle suitably used for an electronic component mounting machine for mounting a chip-shaped electronic component such as a chip capacitor or a chip resistor on a circuit board.

  Conventionally, chip-shaped electronic components such as a chip capacitor and a chip resistor are adsorbed by vacuum suction to the suction surface at the tip of a vacuum suction nozzle provided in the electronic component mounting machine, and then transported as they are to obtain a predetermined circuit board. Implemented at the position of. At this time, the position of the chip-shaped electronic component is measured by irradiating light, receiving the reflected light reflected by the chip-shaped electronic component with a CCD camera, and using the image analysis device to detect the chip-shaped electronic component. This is done by analyzing the shape and electrode position.

  FIG. 7 is a schematic diagram showing a configuration of an electronic component mounting apparatus for mounting a chip-shaped electronic component on a circuit board using an electronic component mounting machine equipped with a vacuum suction nozzle.

  The electronic component mounting apparatus 50 shown in FIG. 7 is directed toward the vacuum suction nozzle 31 provided in the electronic component mounting machine 44, the tray 46 in which the electronic components 45 are arranged, and the electronic component 45 sucked by the vacuum suction nozzle 31. The light 47 is configured to include a light 47, a CCD camera 48 for receiving reflected light from the electronic component 45, and an image analysis device 49 for processing the reflected light received by the CCD camera 48.

  Then, in this electronic component mounting apparatus 50, when the vacuum suction nozzle 31 moves to the tray 46 and sucks the electronic component 45 arranged on the tray 46, the light 47 is transferred to the electronic component 45 sucked by the vacuum suction nozzle 31. The CCD camera 48 receives reflected light that is reflected when the light hits the body or electrodes of the electronic component 45, and the position of the electronic component 45 is detected by the image analyzer 49 based on the image received by the CCD camera 48. The vacuum suction nozzle 31 that sucks the electronic component 45 is moved to a predetermined position on the circuit board (not shown) based on the data, and the electronic component 45 is mounted on the circuit board.

  Although not shown in the drawings, the electronic component mounting device 50 is imaged with a CCD camera to determine whether the position of the electronic component 45 mounted on the circuit board is accurate, and is analyzed with an image analysis device, and an arbitrary mounting schedule is planned. When the positional deviation is larger than the position, the mounted circuit board is removed from the manufacturing process.

  6A and 6B show an example of the configuration of the vacuum suction nozzle in a state assembled to the holding member of the electronic component mounting machine, where FIG. 6A is a perspective view and FIG. 6B is a longitudinal sectional view.

  The vacuum suction nozzle 31 includes a cylindrical portion 35 having a suction surface 32 on the end face side of the tip for suctioning and holding electronic components by vacuum suction, and a side opposite to the suction surface 32 of the cylindrical portion 35. The conical part 34 is provided in a tapered shape toward the cylindrical part 35, and the head part 36 is provided on the end face side of the base where the conical part 34 faces the suction surface 32. An inner hole penetrating through the central portion of the cylindrical portion 35 is extended to the conical portion 34 and the head portion 36 to form a suction hole 33.

  Further, the holding member 40 has a receiving portion 41 that fits with the head portion 36 of the vacuum suction nozzle 31 in the center, and has a suction hole 42 at the center portion thereof so as to communicate with the suction hole 33. The head 36 of the vacuum suction nozzle 31 is fitted to 41 so that it can be attached to the electronic component mounting machine.

  As the material of the vacuum suction nozzle 31, ceramics or cemented carbide having excellent wear resistance are used.

  Furthermore, in Patent Document 1, ceramics having excellent wear resistance are used at the tip of the suction nozzle that sucks the chip component, and when the tip of such a suction nozzle is photographed with a camera, the tip part is more than the chip component. It is disclosed that the position of a chip component can be detected by being composed of a color with a low image input level (dark color, for example, a black ceramic color). It is disclosed that image processing can be reliably performed when a component is picked up by a nozzle.

  In addition, Patent Document 2 includes a suction nozzle having a flat suction surface for sucking and holding an object to be measured at the tip and a suction hole communicating with the suction surface. In the object holder for optical measurement, wherein the object to be measured is sucked and held on the suction surface by vacuum suction from the hole, at least the tip of the suction nozzle has a reflectance of 40% or less with respect to light having a wavelength of 400 to 1000 nm. An optical measurement object holding device formed of ceramics is disclosed, and at the same time, a substantially conical suction nozzle having a flat suction surface at the tip and tapered toward the suction surface, and the suction nozzle And a holding member (flange) having a recess into which is fitted, the suction nozzle is made of black ceramic, and the holding member (flange) is made of stainless steel, aluminum, or an alloy tool. Those formed of a metal wood or the like is disclosed. And according to this, reflection of light at the suction nozzle can be suppressed, the outer shape of the object to be measured and a part thereof can be reliably recognized and conveyed to a predetermined position, and the object to be measured is repeatedly attached and detached. However, since the wear of the adsorption surface is small, it can be used for a long time.

Japanese Patent Laid-Open No. 2-90700 Japanese Patent Laid-Open No. 10-117099

  However, in recent years, there are more and more circuit boards and electronic components to be mounted on them in the process of moving the vacuum suction nozzle at high speed to pick up electronic components on the tray and moving the electronic components to the circuit board as they are for mounting. As the number of electronic components to be mounted tends to increase in size, the vacuum suction nozzle has further been required to accurately and accurately place the electronic components on the circuit board mounting position. . In particular, when an electronic component is picked up by a vacuum suction nozzle using an electronic component mounting device or the like and placed on a circuit board, the electronic component is irradiated with light, and the reflected light is received by a CCD camera. The position of the electronic component is checked, but since the electronic component to be picked up has been miniaturized, the reflected light from the vacuum suction nozzle is included in addition to the reflected light from this electronic component, and the accurate position It is difficult to detect and it is difficult to implement with higher accuracy. Further, there is a problem that the vacuum suction nozzle hits an electronic component already mounted on the circuit board and is damaged.

  In addition, the suction nozzle of Patent Document 2 is a substantially conical suction nozzle that is formed of ceramics having a reflectance of 40% or less with respect to light having a wavelength of 400 to 1000 nm and tapered toward the suction surface. Although it is made of black ceramics and the reflected light is reduced, when the electronic component is downsized, the reflected light from the entire suction nozzle increases, making accurate position detection difficult and vacuuming. There is a problem that the suction nozzle hits an electronic component already mounted on the circuit board and is damaged.

  The present invention provides a vacuum suction nozzle that can mount an adsorbate with high positional accuracy when the adsorbate (electronic component) is vacuum-adsorbed and transferred to the tip, and is less likely to be damaged by hitting an electronic component already mounted on a circuit board. The purpose is to provide.

  The vacuum suction nozzle of the present invention has a suction surface for sucking and holding an electronic component by vacuum suction at the tip, and has a conical portion or a pyramidal portion that extends from the suction surface side to the opposite side. In the vacuum suction nozzle, the side surface of the conical portion or the pyramid portion is recessed along the axial direction from the suction surface side to the opposite side of the conical portion or the pyramid portion, and the width gradually increases. A plurality of concave curved surfaces are provided in the circumferential direction.

  Moreover, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the conical portion or the pyramid-shaped portion has a cylindrical portion on the suction surface side.

  Moreover, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the concave curved surface is also provided in the cylindrical portion.

  In addition, the vacuum suction nozzle of the present invention is characterized in that, in each of the above-described configurations, a pedestal portion that continues to an end surface opposite to the suction surface of the conical portion or the pyramidal portion is provided.

  Furthermore, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the concave curved surface continues from the cylindrical portion to the pedestal portion.

  Furthermore, the vacuum suction nozzle of the present invention has an inner surface in a direction intersecting the axial direction on the opposite side of the suction surface of the concave curved surface in the above configuration, and the inner side surface is the opposite side of the suction surface. It is characterized by being inclined.

  According to the vacuum suction nozzle of the present invention, the tip has a suction surface for sucking and holding an electronic component by vacuum suction, and a conical portion or a pyramid shape spreading from the suction surface side toward the opposite side Since the side surface of the part has a plurality of concave curved surfaces that are recessed along the axial direction from the suction surface side to the opposite side and gradually increase in width, the light reflected from the electronic component is irradiated with light. When the position of the electronic component is confirmed by a CCD camera and the image analysis apparatus confirms the position of the electronic component, the irradiated light is scattered by the concave curved surface on the side surface of the cone-shaped portion or the pyramid-shaped portion. Since the light is clearly received by the CCD camera, the position of the electronic component can be accurately detected and can be mounted with high accuracy. For this reason, the vacuum suction nozzle is less likely to be damaged by hitting an electronic component already mounted on the circuit board.

  In addition, when the conical part or the pyramid part has the cylindrical part on the suction surface side, when the electronic component is mounted on the circuit board, the number of electronic parts to be mounted is increased and the electronic parts are densely arranged on the circuit board. Even if it becomes a state, it will reduce that it contacts and damages the electronic component in which the cone-shaped part and the pyramid-shaped part were mounted.

  In addition, since the cylindrical portion also has a concave curved surface on the side surface of the conical portion or the pyramid portion, the irradiated light is applied to the side surface of the conical portion or the pyramid portion when confirming the position of the electronic component. As the concave curved surface is scattered by the concave curved surface of the cylindrical portion, the reflected light from the electronic component is received by the CCD camera more clearly and the electronic component can be accurately detected. Less damage is caused by hitting electronic components already mounted on the substrate.

  Further, according to the vacuum suction nozzle of the present invention, since the pedestal portion continues to the end surface on the side opposite to the suction surface of the conical portion or the pyramidal portion, when the vacuum suction nozzle is attached to the electronic component mounting machine, the pedestal It can be easily attached after joining the part and the holding member. Therefore, handling becomes easy, and it is less likely that the vacuum suction nozzle comes into contact with an electronic component mounting machine or the like and the corner portion is cut and damaged. Moreover, since it joins to a holding member and it attaches to an electronic component mounting machine, the positional accuracy of a vacuum suction nozzle improves, and it becomes less likely to hit and damage an electronic component.

  Furthermore, according to the vacuum suction nozzle of the present invention, since the concave curved surface continues from the cylindrical portion to the pedestal portion, the irradiated light is scattered by the concave curved surface, so that the reflected light from the electronic component is more clearly displayed in the CCD. Since the position of the electronic component can be detected by being received by the camera, the vacuum suction nozzle is less likely to be damaged by hitting the electronic component already mounted on the circuit board.

  Furthermore, according to the vacuum suction nozzle of the present invention, the inner surface of the direction intersecting the axial direction is provided on the opposite side of the suction surface of the concave curved surface, and the inner surface is inclined to the opposite side of the suction surface. Therefore, even if the irradiated light hits this inner side surface, the reflected light is less likely to be reflected to the suction surface side, so that the reflected light from the electronic component is received more clearly by the CCD camera, and accurate position detection of the electronic component is possible. As a result, the vacuum suction nozzle is less likely to be damaged by hitting electronic components already mounted on the circuit board.

An example of a structure when the vacuum suction nozzle of this invention is assembled | attached to the holding member of an electronic component mounting machine is shown, (a) is a perspective view, (b) is a longitudinal cross-sectional view of (a), (c ) Is a cross-sectional view taken along line AA 'in FIG. 5A, and FIG. 5D is a cross-sectional view taken along line BB' in FIG. It is the schematic which shows the structure of the electronic component mounting apparatus which mounts a chip-shaped electronic component on a circuit board using the electronic component mounting machine provided with the vacuum suction nozzle of this invention. The example of the cross-sectional shape of the direction perpendicular | vertical to the axial direction of the cone-shaped part of the vacuum suction nozzle of this invention is shown, (a) is sectional drawing which has three concave curved surfaces in the circumferential direction of a cone-shaped part, (b ) Is a sectional view having four concave curved surfaces in the circumferential direction of the conical portion, (c) is a sectional view having five concave curved surfaces in the circumferential direction of the conical portion, and (d) is a quadrangular pyramid. It is sectional drawing which has four concave curved surfaces in the outer peripheral surface of a shape part, (e) is sectional drawing which has a pair of concave curved surface facing the outer peripheral surface of a quadrangular pyramid-shaped part. The vacuum suction nozzle of this invention shows the example of the cylinder part which the adsorption | suction surface side of a cone-shaped part has, (a) is a perspective view of a cylindrical cylinder part, (b) is a perspective view of a triangular column-shaped cylinder part. (C) is a perspective view of a quadrangular columnar cylindrical portion, (d) is a perspective view of a cylindrical portion having four concave curved surfaces in the circumferential direction in the cylindrical cylindrical portion, and (e) is a triangular shape. It is a perspective view of the cylinder part which has a concave curved surface in the outer peripheral surface of a columnar cylinder part, (f) is a perspective view of the cylindrical part which has a concave curved surface in a pair of outer peripheral surface which a square columnar cylinder part opposes. An example of a structure when the vacuum suction nozzle of this invention is assembled | attached to the holding member of an electronic component mounting machine is shown, (a) is a perspective view, (b) is a longitudinal cross-sectional view of (a), (c ) Is a cross-sectional view taken along line CC ′ in FIG. 5A, and FIG. 6D is a cross-sectional view taken along line DD ′ in FIG. An example of a structure of the vacuum suction nozzle of the state assembled | attached to the holding member of the conventional electronic component mounting machine is shown, (a) is a perspective view, (b) is a longitudinal cross-sectional view. It is the schematic which shows the structure of the electronic component mounting apparatus which mounts a chip-shaped electronic component on a circuit board using the electronic component mounting machine provided with the conventional vacuum suction nozzle.

  Hereinafter, examples of embodiments of the present invention will be described.

  FIG. 1 shows an example of a configuration when the vacuum suction nozzle of the present invention is assembled to a holding member of an electronic component mounting machine, (a) is a perspective view, and (b) is a longitudinal sectional view of (a). (C) is sectional drawing in the AA 'line of (a), (d) is sectional drawing in the BB' line of (a).

  A vacuum suction nozzle 1 shown in FIG. 1 has a suction surface 2 for sucking and holding an electronic component (not shown) by vacuum suction, and spreads from the suction surface 2 side to the opposite side. The side surface of the conical portion 4 has a plurality of concave curved surfaces 8 that are recessed along the axial direction from the suction surface 2 side toward the opposite side and gradually increase in width in the circumferential direction. The inner hole opened in the suction surface 2 is formed as a suction hole 3 through the conical portion 4. In the example shown in FIG. 1, four concave curved surfaces 8 are provided in the circumferential direction of the conical portion 4 of the vacuum suction nozzle 1.

  A holding member 10 having a receiving portion 11 joined to an end surface opposite to the suction surface 2 of the vacuum suction nozzle 1 and having a suction hole 12 so as to communicate with the suction hole 3 is a vacuum suction nozzle. 1 is attached by joining the end surface opposite to the suction surface 2 and the receiving portion 11, and the vacuum suction nozzle 1 is attached to an electronic component mounting machine (not shown) through the holding member 10. It is.

  Next, FIG. 2 schematically shows a configuration of an electronic component mounting apparatus for mounting a chip-shaped electronic component on a circuit board using an electronic component mounting machine equipped with the vacuum suction nozzle 1 of the present invention.

  The electronic component mounting apparatus 20 shown in FIG. 2 is directed toward the vacuum suction nozzle 1 provided in the electronic component mounting machine 14, the tray 16 in which the electronic components 15 are arranged, and the electronic component 15 sucked by the vacuum suction nozzle 1. , A CCD camera 18 for receiving the reflected light of the light 17, and an image analysis device 19 for processing the reflected light (image) received by the CCD camera 18.

  In the electronic component mounting apparatus 20, when the vacuum suction nozzle 1 moves to the tray 16 and sucks the electronic components 15 arranged on the tray 16, the light 17 moves to the electronic component 15 sucked by the vacuum suction nozzle 1. The CCD camera 18 receives the reflected light that is reflected when the light hits the body or electrode of the electronic component 15, and the position of the electronic component 15 is detected by the image analyzer 19 based on the image received by the CCD camera 18. The vacuum suction nozzle 1 that sucks the electronic component 15 is moved to a predetermined position on the circuit board (not shown) based on the data, and the electronic component 15 is mounted on the surface of the circuit board. is there. Although not shown in the figure, the electronic component mounting device 20 is imaged with a CCD camera to determine whether the position of the electronic component 15 mounted on the circuit board is accurate, and is analyzed with an image analysis device. When the positional deviation is larger than the position, the mounted circuit board is removed from the manufacturing process.

  In the vacuum suction nozzle 1 of the present invention, the side surface of the conical portion (or pyramid-shaped portion) 4 is recessed along the axial direction from the suction surface 2 side toward the opposite side, and the width gradually increases. It is important to have a plurality of curved surfaces 8 in the circumferential direction.

  By providing a plurality of such concave curved surfaces 8 in the circumferential direction, the electronic component 15 is irradiated with light, the reflected light is received by the CCD camera 18, and the position of the electronic component 15 is confirmed by the image analysis device 19 Furthermore, the irradiated light is scattered by the concave curved surface 8 on the side surface of the conical portion (or pyramid-shaped portion) 4. Since the reflected light from the concave curved surface 8 is separated from the reflected light from the electronic component 15, the reflected light from the electronic component 15 is received by the CCD camera 18 more clearly, and accurate position detection of the electronic component 15 can be performed. Thus, the vacuum suction nozzle 1 is less likely to be damaged by the electronic component 15 already mounted on the circuit board.

  Such a concave curved surface 8 is provided in the conical portion 4 of the vacuum suction nozzle 1, but when the vacuum suction nozzle 1 adopts a pyramid portion instead of a conical portion, the concave curved surface 8 is a pyramidal portion. The number of side surfaces of the pyramid portion may be any number, but a pyramid portion of about 3 to 8 pyramids is preferable in manufacturing.

  Further, when there are a plurality of concave curved surfaces 8 in the circumferential direction, the concave curved surfaces 8 adjacent in the circumferential direction may be in contact with each other or separated from each other, but the electronic component 15 is reduced in size and becomes narrower on the circuit board. When it is required to be mounted in a place, the vacuum suction nozzle 1 is also required to be downsized. At this time, since the tip side of the suction surface 2 of the vacuum suction nozzle 1 becomes thinner and easily damaged, it is preferable that the concave curved surfaces 8 are separated from each other because the strength of the vacuum suction nozzle 1 is improved.

  The depth of the concave curved surface 8 is such that when the vacuum suction nozzle 1 mounts the electronic components 15 on the circuit board, the number of electronic components 15 to be mounted increases and the electronic components 15 are densely packed on the circuit board. However, the strength of the vacuum suction nozzle 1 itself and the size of the electronic component 15 as an adsorbent are reduced so that the electronic component 15 on which the conical portion or the pyramidal portion is placed is less likely to be damaged. Further, it may be appropriately selected according to the position range on the circuit board to be mounted.

  Next, FIG. 3 shows an example of a cross-sectional shape in a direction perpendicular to the axial direction of the conical portion of the vacuum suction nozzle of the present invention. FIG. 3A has three concave curved surfaces in the circumferential direction of the conical portion. It is sectional drawing, (b) is sectional drawing which has four concave curved surfaces in the circumferential direction of a cone-shaped part, (c) is sectional drawing which has five concave curved surfaces in the circumferential direction of a cone-shaped part. (D) is sectional drawing which has four concave curved surfaces in the outer peripheral surface of a quadrangular pyramid part, (e) is sectional drawing which has a pair of concave curved surface facing the outer peripheral surface of a quadrangular pyramid part. is there. Since the vacuum suction nozzle 1 has the cross-sectional shapes of (a) to (e), when the electronic component 15 is irradiated with light, the irradiated light has a concave in the circumferential direction of the conical portion (or pyramidal portion) 4. Scattered by the curved surface 8. Since the reflected light from the concave curved surface 8 is separated from the reflected light from the electronic component 15, the reflected light from the electronic component 15 is clearly received by the CCD camera 18 and the electronic component 15 can be accurately detected. Therefore, the vacuum suction nozzle 1 is less likely to be damaged by the electronic component 15 already mounted on the circuit board.

  3 (a), (b), and (c) are described as having a concave curved surface 8 in the circumferential direction of the conical portion 4, the triangular pyramid portion, the quadrangular pyramid portion, and the pentagonal pyramid, respectively. It is good also as a case where it has the concave curved surface 8 in the outer peripheral surface of a shape part. FIG. 3D illustrates the case where the outer peripheral surface of the quadrangular pyramid has a concave curved surface, but it is considered that the conical portion 4 of the vacuum suction nozzle 1 has four concave curved surfaces in the circumferential direction. Also good.

  Furthermore, in the vacuum suction nozzle 1 of the present invention, it is preferable that the conical portion 4 has the cylindrical portion 5 on the suction surface 2 side.

  FIG. 4 shows an example of a cylindrical part that the vacuum suction nozzle of the present invention has on the suction surface side of the conical part, (a) is a perspective view of the cylindrical cylindrical part, and (b) is a triangular columnar cylindrical part. (C) is a perspective view of a quadrangular columnar cylindrical portion, (d) is a perspective view of a cylindrical portion having four concave curved surfaces in the circumferential direction, and (e) ) Is a perspective view of a cylindrical portion having a concave curved surface on the outer peripheral surface of a triangular columnar cylindrical portion, and (f) is a perspective view of a cylindrical portion having a concave curved surface on a pair of opposed outer peripheral surfaces of the rectangular columnar cylindrical portion. It is.

  A cylindrical portion 5 as shown in FIGS. 4A, 4B and 4C extends to the tip of the suction surface 2 side of the conical portion (or pyramid portion) 4 of the vacuum suction nozzle 1 shown in FIG. Since the suction surface 2 is set to the tip side of the vacuum suction nozzle 1 in which these cylindrical portions 5 are extended, the electronic component 15 can be mounted with high accuracy when mounted on the circuit board. Even when the number of electronic components 15 increases and the electronic components 15 are densely packed on the circuit board, the electronic components 15 can be placed in a narrower range, and the conical portion 4 is in contact with the mounted electronic component 15. Damage.

  Moreover, it is preferable that the vacuum suction nozzle 1 of this invention also has the concave curved surface 8 which has the circumferential direction of the cone-shaped part (or pyramid-shaped part) 4 also in the cylinder part 5. FIG.

  The cylindrical portion 5 having the concave curved surface 8 as shown in FIGS. 4D, 4E and 4F is the suction surface 2 of the conical portion (or pyramidal portion) 4 of the vacuum suction nozzle 1 shown in FIG. By extending the suction surface 2 on the distal end side of these cylindrical portions 5 and extending the concave side 8 according to the size of the side surface of the cylindrical portion 5, When the electronic component 15 is attracted and the position is confirmed, the irradiated light is scattered by the concave curved surface 8 in the cylindrical portion 5 as well as the concave curved surface 8 in the circumferential direction of the conical portion (or pyramidal portion) 4. Therefore, the reflected light from the electronic component 15 is received by the CCD camera 18 more clearly, so that the position of the electronic component 15 can be accurately detected and mounted with high accuracy, and the electronic component 15 is touched and damaged. Less. In addition, although the cylindrical part 5 was demonstrated by extending in the cone-shaped part (or pyramid-shaped part) 4, the suction surface 2 of the cone-shaped part (or pyramid-shaped part) 4 of the vacuum suction nozzle 1 shown in FIG. On the side, the cylindrical part 5 may be bonded using an adhesive or an inorganic bonding agent.

  Moreover, it is preferable that the vacuum suction nozzle 1 of this invention has the base part 6 following the end surface on the opposite side to the suction surface 2 of the cone-shaped part (or pyramid-shaped part) 4. FIG.

  FIG. 5 shows an example of the configuration when the vacuum suction nozzle of the present invention is assembled to the holding member of the electronic component mounting machine, (a) is a perspective view, and (b) is a longitudinal sectional view of (a). (C) is sectional drawing in the CC 'line of (a), (d) is sectional drawing in the DD' line of (a).

  The vacuum suction nozzle 1 shown in FIG. 5 has a suction surface 2 for sucking and holding an electronic component (not shown) by vacuum suction at the tip of the cylindrical portion 5, and is directed from the suction surface 2 side to the opposite side. The side surface of the conical portion (or the pyramid-shaped portion) 4 spreading in the circumferential direction is a plurality of concave curved surfaces 8 that are recessed along the axial direction from the suction surface 2 side toward the opposite side and gradually widen in the circumferential direction. As an arrangement, the inner hole opened in the suction surface 2 extends through the conical portion (or pyramid-shaped portion) 4 to the pedestal portion 6 and opens on the surface 7 of the pedestal portion 6 to form the suction hole 3. is there. And the side surface of the cylinder part 5 also has the concave curved surface 8.

  A holding member 10 having a receiving part 11 joined to the base part 6 of the vacuum suction nozzle 1 and having a suction hole 12 so as to communicate with the suction hole 3 is provided on the base part 6 of the vacuum suction nozzle 1. The front surface 7 and the receiving part 11 are joined and attached, and the vacuum suction nozzle 1 is attached to an electronic component mounting machine (not shown) via the holding member 10.

  By providing such a base portion 6, it is possible to prevent the edge of the side surface of the conical portion (or pyramid-shaped portion) 4 of the vacuum suction nozzle 1 from being lost. In particular, the vacuum suction nozzle 1 is attached to an electronic component mounting machine (not shown) via the holding member 10, and the conical portion (or pyramid-like portion) 4 is joined to the holding member 10. It can prevent that the edge of an end surface is missing. Further, since the vacuum suction nozzle 1 is attached to the electronic component mounting machine by being joined to the holding member 10, the position is accurately fixed when the holding member 10 is attached to the electronic component mounting machine. Since the position does not shift due to the start of mounting or attachment / detachment for cleaning in the middle of mounting, contact with the electronic component 15 is less likely to be damaged.

  In the vacuum suction nozzle 1 of the present invention, it is preferable that the concave curved surface 8 continues from the cylindrical portion 5 to the pedestal portion 6.

  Since the vacuum suction nozzle 1 of FIG. 5 has the pedestal portion 6, the inner side surface 9 of the pedestal portion 6 on the conical portion (or pyramid shape) 4 side faces the direction of the electronic component 15. At this time, when the electronic component 15 is irradiated with light, the reflected light is received by the CCD camera 18, and the position of the electronic component 15 is confirmed by the image analysis device 19, the irradiated light is conical. (Or pyramid-shaped part) Since it hits the inner side surface 9 on the 4 side and is reflected and received by the CCD camera 18, accurate position detection of the electronic component 15 cannot be performed, and accurate position accuracy cannot be obtained and vacuum suction is performed. The nozzle 1 contacts the electronic component 15 on the circuit board and is damaged. If the inner side surface 9 on the conical portion (or pyramid-shaped portion) 4 side of the pedestal portion 6 has the concave curved surface 8, the reflected light that is reflected by the concave curved surface 8 will be scattered, so that the reflected light from the electronic component 15 is scattered. Is clearly received by the CCD camera 18 so that the position of the electronic component 15 can be accurately detected, and when the vacuum suction nozzle 1 moves on the circuit board, the electronic component 15 already mounted is touched and damaged. Less.

  Further, it is preferable that the concave curved surface 8 has an inner side surface 9 in the direction intersecting the axial direction on the opposite side of the suction surface 2, and the inner side surface 9 is inclined to the opposite side of the suction surface 2.

  If the inner side surface 9 is inclined toward the opposite side of the suction surface 2, the irradiated light hits the inclined inner side surface 9 and is reflected by the CCD camera 18 because the inner side surface 9 is inclined even if it is reflected. Therefore, the position of the electronic component 15 can be detected accurately. Further, when the inner side surface 9 has the concave curved surface 8, the irradiated light strikes the concave curved surface 8 and the reflected light is scattered in a different direction from the adsorbed electronic component 15. The reflected light is clearly received by the CCD camera 18 so that the position of the electronic component 15 can be accurately detected. When the vacuum suction nozzle 1 moves on the circuit board, the electronic component 15 contacts the already mounted electronic component 15. Less damage.

  The diameter of the suction surface 2 is preferably 0.7 mm or less. When a rectangular electronic component 15 with a long side of 1 mm or less is picked up and mounted on a circuit board that is mounted with high density, it is mounted on the electronic component on which the suction surface 2 and the cylindrical part 5 are mounted first, and the surrounding area. This is to make it difficult to cause the problem of chipping in contact with a certain part. If the diameter of the suction surface 2 exceeds 0.7 mm, the suction surface 2 and the cylindrical portion 5 are not attached to the circuit board that is mounted with high density by sucking the rectangular electronic component 15 having a long side of 1 mm or less. Contact with the parts around the mounting location will easily cause damage. For example, when the electronic component 15 is a 0603 type chip component (dimensions: 0.6 mm × 0.3 mm), the interval between the components mounted on the circuit board may be about 0.1 mm. Even if the position is slightly shifted when the suction surface 2 is attracted to the suction surface 2, there is a risk that the suction surface 2 or the cylindrical portion 5 may come into contact with components around the mounting location and be damaged during mounting.

  The vacuum suction nozzle 1 preferably uses ceramics for the suction surface 2. When ceramics are used for the suction surface 2, for example, even if the electronic component 15 is used as an adsorbent and the attachment and detachment is repeated, the suction surface 2 is less likely to be worn or damaged at an early stage. As such ceramics, for example, alumina ceramics, zirconia ceramics, silicon nitride ceramics, silicon carbide ceramics, or the like can be suitably used. Not only the suction surface 2 but also the cylindrical part 5, the conical part (or pyramidal part) 4 and the pedestal part 6 are made of ceramics respectively, or the entire vacuum suction nozzle 1 is made of ceramics. This is more effective for reducing wear and damage. If zirconia ceramics are used at this time, the average crystal particle diameter of zirconia is preferably 3 μm or less. By making the average crystal particle diameter 3 μm or less, the suction surface is less likely to fall off when the suction surface 2 is ground or mirror-finished when the vacuum suction nozzle 1 is manufactured or repaired. 2 is less likely to be chipped. Furthermore, the average crystal grain size of zirconia is more preferably in the range of 0.3 to 0.8 μm. Ceramic small vacuum suction nozzles are generally manufactured by the injection molding method. However, if a molded body is to be manufactured using the injection molding method, an extra portion (gate traces) is introduced at the entrance of the raw material into the mold. ) Remain and must be removed by grinding after sintering. For this reason, when the average crystal grain size of zirconia is less than 0.3 μm, the crystal grains are small, so that the strength of the sintered body is increased, and the processing time for removing the gate trace tends to increase. Further, the vacuum suction nozzle 1 is required to have a mechanical strength as the size of the vacuum suction nozzle 1 is increasingly required. In view of these points, the average grain size is preferably 0.8 μm or less in order to have better mechanical strength.

  Furthermore, the ceramic used for the vacuum suction nozzle 1 of the present invention preferably contains a conductivity imparting agent.

  If the ceramic used for the vacuum suction nozzle 1 contains a conductivity-imparting agent, even if it is a single insulating ceramic, the vacuum suction nozzle has a desired appropriate resistance value by including the conductivity-imparting agent. 1 can be produced.

When the vacuum suction nozzle 1 of the present invention has semiconductivity, for example, if the resistance value between the front end and the rear end of the vacuum suction nozzle 1 is 10 ³ to 10 ¹¹ Ω, the vacuum suction nozzle 1 Even if it moves at high speed and is charged by static electricity generated by friction with air, this static electricity can be grounded (static elimination) through the holding member 10 and the electronic component mounting machine 20, so that the surrounding electronic components from the vacuum suction nozzle 1 It is possible to prevent the surrounding electronic component 15 from being damaged due to discharge of static electricity to 15 or the like. Even if the vacuum suction nozzle 1 approaches the electronic component 15, the static electricity of the vacuum suction nozzle 1 is removed, so that the phenomenon that the electronic component 15 blows off due to the repulsive force of static electricity can be prevented. If this resistance value is less than 10 ³ Ω, if the static electricity is charged in the parts around the vacuum suction nozzle 1, it is easy to be discharged from them, and the adsorbed electronic parts 15 are electrostatically destroyed. There is a risk of problems. Further, if it exceeds 10 ¹¹ Ω, it becomes easy to charge static electricity generated in the vacuum suction nozzle 1, and when the vacuum suction nozzle 1 approaches the electronic component 15, the phenomenon that the electronic component 15 blows off due to the repulsive force of static electricity may occur. There is a risk of becoming.

  As such semiconductive ceramics, for example, alumina ceramics is an insulating ceramic, but it has a feature that it is inexpensive and has excellent wear resistance, and a conductivity imparting material such as titanium carbide or titanium nitride is used. If it is added, it will have moderate conductivity, and by using this, it is possible to produce a vacuum suction nozzle 1 that is excellent in wear resistance and also has moderate conductivity. Similarly, zirconia ceramics is a high-strength material. By adding a conductivity-imparting material such as iron oxide, titanium oxide, or zinc oxide, it has moderate conductivity. However, it is difficult to break, and the vacuum suction nozzle 1 having appropriate conductivity can be produced. Moreover, the silicon carbide ceramics can produce the vacuum suction nozzle 1 which adjusted the resistance value by adding carbon.

  Furthermore, the ceramic used for the vacuum suction nozzle 1 of the present invention is preferably a black ceramic.

  When black ceramics are used for the vacuum suction nozzle 1, when the electronic component 15 sucked by the vacuum suction nozzle 1 is irradiated with the light 17 and photographed with the CCD camera 18, the electronic component 15 is clearly reflected by the reflected light of the light 17. As shown, the background of the electronic component 15 becomes dark because the vacuum suction nozzle 1 is made of black ceramics, and the outline of the electronic component 15 becomes clear. For this reason, the image analysis device 19 can easily recognize the shape of the electronic component 15 sucked by the vacuum suction nozzle 1, so that there is an advantage that the mounting accuracy when mounting on the circuit board is increased.

  Examples of black ceramics include zirconia, alumina, and silicon carbide to which a black conductivity imparting material is added. Further, even with ceramics having other color tones such as brown and blue, the same effects as black ceramics can be obtained by making the color tone darker.

  For example, as a conductivity imparting material that can be used as a dark color tone that is black or brown or blue added to alumina ceramics, iron oxide, nickel oxide, titanium carbide, titanium nitride and the like can be mentioned. Iron oxide and titanium carbide are preferable as the conductivity imparting material from which black ceramics can be obtained. Examples of the conductivity imparting material that can be used as a dark color tone added to zirconia ceramics, such as black, brown or blue, include iron oxide, titanium oxide, cobalt oxide, chromium oxide, nickel oxide, Among these, iron oxide is preferable as a conductivity imparting material from which black ceramics can be obtained. As the silicon carbide ceramics, those containing carbon and imparting conductivity are preferable as the black ceramics.

  For the measurement of the reflected light from the vacuum suction nozzle 1, a white LED having a wavelength of 400 to 750 nm is used as the light source, and the distance from the suction surface 2 is set to 20 to 40 mm and the irradiation angle is set to 45 °. Furthermore, a general-purpose CCD camera (double speed monochrome camera model CV-020 manufactured by KEYENCE) may be set facing the vacuum suction nozzle 1 to perform image processing with 256 gradations.

  Next, the manufacturing method of the vacuum suction nozzle 1 of the present invention will be described in the case of producing ceramics as a material.

  As ceramics which comprise the vacuum suction nozzle 1 of this invention, well-known materials, such as silicon carbide, an alumina, and the zirconia containing a stabilizer, can be used.

  For example, a raw material in which 95% by mass of silicon carbide and 5% by mass of alumina as a sintering aid are mixed into a ball mill and pulverized to a predetermined particle size to produce a slurry, which is then spray dried using a spray dryer To form granules.

  Next, if the kneaded material obtained by putting the granules and the thermoplastic resin into a kneader and kneading while heating is put into a pelletizer, pellets as a raw material for injection molding (injection molding) can be obtained. it can. In addition, as a thermoplastic resin thrown into the kneader, an ethylene vinyl acetate copolymer, polystyrene, an acrylic resin, or the like may be added in an amount of about 10 to 25% by mass with respect to the mass of the ceramic. The heating temperature may be set to 140 to 180 ° C. The kneading conditions may be appropriately set according to the type and particle size of ceramics and the type of thermoplastic resin.

  Then, if the obtained pellets are put into an injection molding machine (injection molding machine) equipped with an injection mold having a shape capable of obtaining the vacuum suction nozzle 1 to be manufactured, the vacuum suction nozzle 1 is obtained. A molded body is obtained. At this time, the obtained molded body is usually accompanied by a runner in which excess raw materials obtained by injection molding are cooled and solidified, and therefore, they are cut before degreasing.

  The silicon carbide may be fired in a vacuum atmosphere or in an inert gas atmosphere such as argon or helium. The maximum temperature is 1900-2200 ° C., and the holding time at the maximum temperature is 1-5 hours. That's fine.

  Furthermore, when using zirconia ceramics or alumina ceramics containing a stabilizer as the ceramics constituting the vacuum suction nozzle 1 of the present invention, as the conductivity imparting material, iron oxide, cobalt oxide, chromium oxide and oxidation are used. At least one of nickel, or one containing titanium carbide or titanium nitride can be used.

  For example, zirconia containing yttria as a stabilizer is mixed in an amount of 35% by mass with 65% by mass of iron oxide, and this raw material is put into a ball mill and pulverized to a predetermined particle size to produce a slurry. If a granule is formed by spray-drying using a dryer, and then injected into an injection molding machine and injection-molded by the same method as described above, a molded body to be the vacuum suction nozzle 1 is obtained.

  As the firing conditions for zirconia ceramics and alumina ceramics, when the conductivity imparting material is at least one of iron oxide, cobalt oxide, chromium oxide and nickel oxide, the maximum temperature is 1300-1500 ° C when fired in an air atmosphere. In this range, the holding time at the maximum temperature may be 1 to 5 hours. When the conductivity imparting material is titanium carbide, the maximum temperature is in the range of 1400 to 1800 ° C., the holding time at the maximum temperature is 1 to 5 hours, in a vacuum atmosphere or an inert gas atmosphere such as argon. Can be fired. Further, when the conductivity imparting material is titanium nitride, in addition to the vacuum atmosphere or the inert atmosphere, firing may be performed in a nitrogen gas atmosphere. Thereby, moderate electroconductivity can be provided to the vacuum suction nozzle 1 made of ceramics.

  The vacuum suction nozzle 1 after firing may be polished by barrel processing or the like to make the surface state of the ceramic uniform, and if a smooth suction surface 2 is required, it is processed using a surface grinder. Also good.

  The description of the vacuum suction nozzle 1 according to the present invention has been made on the case of using ceramics. However, the present invention is not limited to this, and the case where the vacuum suction nozzle 1 is manufactured using metal, for example, is within the scope of the present invention. It is. In order to produce the vacuum suction nozzle 1 using metal, electric discharge machining or grinding generally used as a metal machining method from a metal block may be used, or a method such as casting may be used.

  Although the vacuum suction nozzle 1 of the present invention has been mainly described by having the conical portion 4, it goes without saying that the same is true even if the vacuum suction nozzle 1 has a pyramidal portion.

  Furthermore, the vacuum suction nozzle 1 of the present invention has been described with respect to the case where the adsorbed material is the electronic component 15 and is mounted on the circuit board. However, the present invention is not limited to the suction of the electronic component 15 but simply separates the chip-shaped components. It may be a case where it is used as a means for transferring an adsorbate.

  Examples of the present invention will be described below.

  The main component of ceramics is zirconia containing 3 mol% yttria as a stabilizer, and 59 parts by mass of zirconia containing 3 mol% yttria of iron oxide, chromium oxide, cobalt oxide and nickel oxide, respectively. Weighing was performed so that the conductivity imparting material was 41 parts by mass, iron oxide was 36 parts by mass, cobalt oxide was 2 parts by mass, chromium oxide was 2 parts by mass, and nickel oxide was 1 part by mass. Then, water was added to these raw materials and pulverized and mixed with a ball mill to prepare a slurry, and this slurry was spray-dried using a spray dryer to prepare granules. Then, a total of 20 parts by mass of ethylene vinyl acetate copolymer, polystyrene and acrylic resin was added to 100 parts by mass of these granules, and the mixture was put into a kneader and kneaded while maintaining a temperature of about 150 ° C. to prepare a clay. . Next, the obtained kneaded material was put into a pelletizer to produce pellets as raw materials for injection molding. Then, the pellets are put into a known injection molding machine, and the molded bodies to be the vacuum suction nozzle 1 and the holding member 10 shown in FIG. 1 are produced, and these molded bodies are put into a dryer and dried. The sintered body was fired in an air atmosphere, which is an oxidizing atmosphere, with a maximum temperature in the range of 1400 ± 50 ° C. and a holding time at the maximum temperature of 1 to 5 hours. Then, the sintered body of the vacuum suction nozzle 1 and the holding member 10 was barrel-polished, the suction surface 2 was ground, and the vacuum suction nozzle 1 and the holding member 10 were joined with an adhesive to obtain a sample 1.

  Next, in the same manner, the vacuum suction of the present invention in which the cross-sectional shape in the direction perpendicular to the axial direction of the conical portion 4 becomes the shape shown in (a), (c), (d) and (e) of FIG. Molded bodies to be the nozzle 1 and the holding member 10 were respectively prepared, and samples in which the vacuum suction nozzle 1 and the holding member 10 were bonded in the same manner as the sample 1 were prepared. 2, sample no. 3, Sample No. 4 and sample no. It was set to 5. Further, the vacuum suction nozzle 1 of the sample 1 having the cylindrical portion 5 of FIGS. 6, Sample No. 7 and sample no. 2 having the cylindrical portion 5 of (b) and (e) of FIG. 8, sample no. 9 and the suction surface 2 side cross-sectional shape of the conical portion 4 and the shape of the suction surface 2 of the cylindrical portion 5 are the same. Sample No. 10. Sample No. with inner surface 9 having concave curved surface 8 Sample No. 11 and the inner surface 9 are inclined toward the opposite side of the adsorption surface 2 and have a concave curved surface 8. 12 was produced. In addition, the conventional vacuum suction nozzle 1 shown in FIG. 13 was prepared as a comparative example.

  These sample Nos. Sample Nos. 1 to 12 and Comparative Example. Mounted on the electronic component mounting machine 14 of the electronic component mounting apparatus 20 using the 13 vacuum suction nozzles and operated, and mounted on the circuit board using the 0603 type (0.6 mm x 0.3 mm) electronic component 15 A test was performed, and the number of each sample and the vacuum suction nozzle of the comparative example until the damage was compared. In addition, the device for checking the positional accuracy of the electronic component 15 attached to the electronic component mounting device 20 is operated, and a mounting test for mounting 7 million electronic components 15 using each sample and the vacuum suction nozzle of the comparative example. The image is picked up by a CCD camera and further analyzed by an image analysis device. When the positional deviation is larger than an arbitrary mounting position, the mounted circuit board is removed from the manufacturing process, and the number of the circuit boards is determined. Were compared.

  As a result, the sample No. of the vacuum suction nozzle 1 of the present invention was measured. No. 1 was damaged when 18 million electronic components 15 were mounted, but sample No. 1 was a comparative example. 13 was 12 million. Furthermore, sample no. Sample Nos. 2 and 3 are As with 1, the result was 18 million. Sample No. 4 is 17 million pieces, sample No. No. 5 was slightly inferior with 16 million pieces. Compared to 13 million 12 in 13. Furthermore, sample no. When the mounting tests of 6 to 12 were performed, the number of mountings in which the vacuum suction nozzle was damaged was the sample number. In order from 6, there were 21 million, 22 million, 21 million, 22 million, 24 million, 26 million, and 28 million. Sample No. which is a comparative example. It was good because it was possible to mount more than 13. Moreover, the vacuum suction nozzle 1 having the cylindrical portion 5 was better than the one having no cylindrical portion 5, and the vacuum suction nozzle 1 having the concave curved surface 8 in the cylindrical portion 5 was better. In addition, the sample No. having the pedestal portion 6 was used. Samples Nos. 10 to 12 were more favorable, and had sample surfaces No. 8 having a concave curved surface 8 on the inner surface 9 of the pedestal 6. 11 and No. 12 were in order better.

  Further, in a test in which 7 million electronic components 15 were used for each vacuum suction nozzle sample and mounted on the circuit board to compare the number of circuit boards with large positional deviation, the sample No. 1 to 12 are 8 sheets, 8 sheets, 8 sheets, 9 sheets, 10 sheets, 7 sheets, 6 sheets, 7 sheets, 6 sheets, 5 sheets, 4 sheets, and 3 sheets in this order. As good as the result of the damage. In comparison with these, sample No. In 13, the number was 12 and the vacuum suction nozzle 1 of the present invention was satisfactory.

  As described above, according to the vacuum suction nozzle 1 of the present invention, when the adsorbate (electronic component) is vacuum adsorbed to the tip and transferred, the adsorbate can be mounted with high positional accuracy and has already been mounted on the circuit board. It is possible to provide a vacuum suction nozzle that is less likely to be damaged by hitting an electronic component.

1: Vacuum suction nozzle 2: Suction surface 3: Suction hole 4: Conical part (or pyramidal part)
5: Tube portion 6: Pedestal portion 7: Surface (of the pedestal portion)
8: Concave surface 9: Inner surface (of pedestal)
10: Holding member
11: Receiver
14: Electronic component mounting machine
15: Electronic components (adsorbent)
16: Tray
19: Image analyzer
20: Electronic component mounting device

Claims (6)

A vacuum suction nozzle having a conical portion or a pyramid-shaped portion having a suction surface at the tip for sucking and holding an electronic component by vacuum suction and extending from the suction surface side toward the opposite side; A plurality of concave curved surfaces in the circumferential direction in which the side surface of the conical portion or the pyramid portion is recessed along the axial direction from the suction surface side to the opposite side of the conical portion or the pyramid portion and gradually widens. A vacuum suction nozzle comprising: The vacuum suction nozzle according to claim 1, wherein the conical part or the pyramid part has a cylindrical part on the suction surface side. The vacuum suction nozzle according to claim 2, wherein the cylindrical surface also has the concave curved surface. The vacuum suction nozzle according to any one of claims 1 to 3, further comprising a pedestal portion continuing from an end surface of the conical portion or the pyramid portion on the opposite side to the suction surface. The vacuum suction nozzle according to claim 4, wherein the concave curved surface continues from the cylindrical portion to the pedestal portion. 6. The concave surface has an inner surface in a direction intersecting the axial direction on the opposite side of the adsorption surface, and the inner surface is inclined to the opposite side of the adsorption surface. The vacuum suction nozzle described.

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