JPH1140646A - Pickup tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the damage and absorption trace of an edge, generated due to a pickup tool. SOLUTION: An absorbing member 22 having a hole 23 communicated with an inlet hole 14 is connected with the top end face of a shank 12, through which the inlet hole 14 is put, and plural air grooves 24 which is made concentric with the hole 23 and which are not deformed and closed when a desired part is vacuum absorbed, are formed on an absorbing face 22' of the absorbing member 22 in which the hole 23 is opened. Each of plural projecting parts 25 formed by the air grooves 24 is provided with a notch 28 communicated with the air groove 24 at the inside and outside of the projecting part 25, and the air groove 24 which is closest to the hole 23 is communicated with the hole 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-up tool for vacuum-sucking a semiconductor chip or the like, and more particularly to a suction tool which can be cut into a size adapted to the shape of the semiconductor chip or the like without damaging the semiconductor chip or the like. The present invention relates to a pickup tool having a member.

Conventionally, semiconductor bare chip mounting (packaging) work, which has been mainly performed by semiconductor device manufacturers, has been carried out by board mounting companies, that is, those who mount purchased semiconductor bare chips on substrates, with the expansion of the distribution market of semiconductor bare chips. It is expanding.

The know-how for mounting a semiconductor bare chip, especially the know-how for guaranteeing the surface damage of the semiconductor bare chip, is as follows.
It is difficult to determine due to technical and quality evaluations,
The surface damage strength of the semiconductor bare chip does not have a certain guaranteed value, and the miniaturization of the wiring pattern to be mounted and the increase in the mounting density also make it difficult to handle the semiconductor bare chip.

[0004] Therefore, a pickup tool that is used in the substrate mounting industry where the semiconductor bare chip is not manufactured by itself and that does not damage the semiconductor bare chip has been strongly demanded.

[0005]

2. Description of the Related Art In the process of manufacturing and mounting semiconductor devices, various pickup tools used for picking up semiconductor chips, particularly semiconductor bare chips, have been devised and provided.

[0006] As typical examples, those having an ultra-hard suction member and those having a soft suction pad are known. A pick-up tool provided with a super-hard suction member is generally configured such that an edge of a desired component, for example, a semiconductor bare chip, that is, an edge of a suction side surface abuts on the suction member, and is suitable for protecting a semiconductor bare chip surface but is expensive. . A pickup tool provided with a suction pad, that is, a suction pad generally having rubber elasticity, is less expensive and more convenient than a tool provided with a super-hard suction member.

FIG. 4 is an explanatory view of a pick-up tool having a super-hard suction member, FIG. 5 is an explanatory view of a pick-up tool having a suction pad, and FIG. 6 is an explanatory view of a pick-up tool having irregularities on a suction surface. is there.

In FIG. 4, a pickup tool 1 is
A suction member 3 made of a super-hard metal is joined to the tip of the shank 2. Generally, a pyramid-shaped concave portion 6 is formed on the lower surface of the suction member 3, and the through hole 5 of the suction member 3 opening at the center of the concave portion 6 communicates with the suction hole 4 penetrating the shank 2.

In the pick-up tool 1, when the shank 2 is connected to a vacuum device (not shown), and the vacuum device is driven, the air in the concave portion 6 is sucked through the through hole 5 and the suction hole 4, and Desired parts such as a semiconductor bare chip 8
To adsorb.

The edge of the upper surface of the semiconductor bare chip 8 sucked by the pickup tool 1, that is, the edge of the surface on the suction side comes into contact with the tapered surface 7 constituting the concave portion 6 of the suction member 3.

Referring to FIG.
The suction pad 13 having rubber elasticity is joined to the front end face (lower end face in the figure) of the shank 12.
A through hole 15 provided at the center of the pad 13 communicates with an intake hole 14 penetrating the pad 2.

In the pick-up tool 11, the shank 12 is connected to a vacuum device (not shown). When the vacuum device is driven, air outside the pad 13 is sucked through the through hole 15 and the suction hole 14, and the pad 13 Adsorption surface 13 '
Then, a desired component, for example, a semiconductor bare chip 8 is sucked.

Referring to FIG. 6, a pickup tool 16 is shown.
The suction member 17 is joined to the tip end surface of the shank 12, and a through hole 18 provided at the center of the elastic suction member 17 communicates with the intake hole 14. However, the suction member 1
The suction surface 17 'of 7 is a fine uneven surface such as satin.

In the pick-up tool 16, the shank 12 is connected to a vacuum device (not shown), and when the vacuum device is driven, air outside the suction member 17 is sucked through the through hole 18 and the suction hole 14 to be sucked. Suction surface 1 of member 17
A desired component, for example, a semiconductor bare chip 8 is attracted to 7 ', and the minute irregularities of the attracting surface 17' at the portion where the semiconductor bare chip 8 contacts are deformed and flattened as shown in FIG.

[0015]

As described above,
The conventional pickup tool 1 has an advantage of not damaging the surface of the semiconductor bare chip 8, but is expensive because the suction member 3 to which the edge of the semiconductor bare chip 8 contacts is made of a super-hard metal, and the semiconductor bare chip 8 is tilted. The semiconductor bare chip 8 may have different dimensions because of the
There is a problem that cannot be shared.

Next, the conventional pickup tools 11 and 16 are less expensive than the pickup tool 1,
The entire surface of the suction surface of the semiconductor bare chip 8 is the suction pad 1.
3 or the suction member 17 is brought into contact.

For this reason, there is a concern that damage to the surface to be attracted, particularly when foreign matter such as dust is caught between the surface to be attracted and the suction pad 13 or 17,
Adsorption marks are easily formed even without damage,
There is a problem that the attraction force of the outer peripheral portion is lower than that of the central portion, and the insufficiency of the attraction force particularly to the large semiconductor bare chip 8 tends to occur.

[0018]

SUMMARY OF THE INVENTION A pickup tool of the present invention aims to solve the above-mentioned problems in the conventional pickup tools 1, 11, and 16, and a first pickup tool of the present invention has an intake hole. A suction tool provided with a through-hole communicating with the suction hole at a tip end surface of the penetrating shank, and a pickup tool for vacuum-sucking a desired component to the suction surface of the suction member; A plurality of ventilation grooves concentric with the through hole and not deformed and closed at the time of vacuum suction of the desired component are formed on the suction surface, and a plurality of convex portions formed concentrically with the through hole by the plurality of ventilation grooves. A cutout communicating with the ventilation groove inside and outside the projection is formed in each of the projections, and the ventilation groove closest to the through hole communicates with the through hole.

According to a second pick-up tool of the present invention, in the first pick-up tool of the present invention, a notch length of the notch formed in the plurality of protrusions is such that the notch is formed from the through hole. It is characterized in that it becomes shorter as it goes away.

In a third pick-up tool according to the present invention, in the first pick-up tool according to the present invention, the notch is formed at each of four locations of the convex portion, and the four locations are provided with the through holes. The radiation is emitted intermittently in eight directions at an equal angle from the radiation, and the notches of the protrusions adjacent in the inward and outward directions are not located on the same radiation.

A fourth pick-up tool according to the present invention is characterized in that, in the first pick-up tool according to the present invention, the ventilation groove and the convex portion have a rectangular loop shape, and the convex portion has a trapezoidal cross section. I do.

A fifth pick-up tool of the present invention is characterized in that, in the first pick-up tool of the present invention, the ventilation groove and the convex portion have a circular loop shape, and the convex portion has a trapezoidal cross section. In the first pick-up tool of the present invention, the tip of the convex portion comes into contact with the suction surface of the desired component to be sucked, and after sucking the desired component, sucks the outside air from the notch formed in the outermost convex portion. , To hold a desired part.

Therefore, the suction force on the surface to be sucked is dispersed at the same time as the foreign matter removing operation at the time of suction, and the suction force constantly acts over the entire surface of the surface to be sucked, so that the suction and quality of the desired component are guaranteed, ie Edge damage and suction marks and non-uniform suction force caused by the conventional pickup tool are eliminated.

According to the second pick-up tool of the present invention, even if the size of the desired component to be picked up changes, the suction force can be made uniform. Contributes to making the attraction force uniform on the attraction surface.

The fourth pick-up tool of the present invention proposes a suction member adapted to a square desired part, and the fifth pick-up tool of the present invention proposes a suction member adapted to a circular desired part. It is a proposal.

[0026]

1 is an explanatory view of a pickup tool according to an embodiment of the present invention, FIG. 2 is an explanatory view (No. 1) of a suction member according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is explanatory drawing (the 2) of an adsorption | suction member.

In FIG. 1, (a) is a sectional view showing a main structure of the pickup tool, (b) is an enlarged sectional view showing a surface structure on a suction side of a suction member, and a pickup tool 21 is a tip end of a shank 12. The suction member 22 is joined to the surface.

At the center of the adsorbing member 22 joined to the shank 12 generally made of metal, the suction hole 1 of the shank 12 is provided.
A plurality of ventilation grooves 2 which are not closed even when the desired component is sucked are provided on the lower surface (suction surface) 22 'of the suction member 22 for sucking the desired component.
4 are formed.

The plurality of ventilation grooves 24 are concentric with the through holes 23, and the plurality of projections 25 formed by the formation of the ventilation grooves 24 are provided with notches 2 for communicating the inner and outer ventilation grooves 24.
8 are formed.

Accordingly, the tip surface 26 of the projection 25 formed by the formation of the ventilation groove 24 comes into contact with the suction surface of a desired component, for example, a semiconductor bare chip. Will be sucked.

The ventilation groove 24 which is not closed by elastic deformation when a desired component is sucked has, for example, a pitch p of 0.5 mm, an angle θ of 30 ° and a depth of 0.6 mm.
_Assuming that the width w _-1 of the tip end surface 26 of the projection 25 formed by the formation of the groove 4 is 0.1 mm, the width w _-2 of the bottom surface 27 of the ventilation groove 24 is set.
Is about 0.9 mm.

In such a pickup tool 21,
The tip end surface of the shank 12 and the suction member 22 are preferably air-tightly joined. Therefore, it is possible to apply a bonding method using an adhesive, a bonding method using a filler, and a bonding method using an O-ring as a bonding means, and the bonding method is the simplest. Since metals and various resins can be used, it is preferable to select the joining means in consideration of the material of the suction member 22.

In FIG. 2, the suction member _22-1 is a detailed explanatory view of the embodiment of the suction member 22 of FIG. 1, (a) is a side view, and (b) is a bottom view (suction surface view). However, FIG.
(B) shows the projection 25 to avoid congestion in the figure and to make it easier to see.
Notch end 28 'of notch 28 of notch 28 of convex portion 25
Is indicated by a solid line, and more precisely, the cross section V to be indicated by a solid line.
The illustration of the bottom surface 27 of the V-shaped ventilation groove 24 is omitted.

[0034] a thickness of, for example 3.3 mm, in the adsorption member 22 _-1 that hole 23 is opened in the center on the lower surface (suction surface) for vacuum suction of the desired component such as a semiconductor bare chip, holes A plurality of ventilation grooves 24 concentric with 23
And a plurality of projections (25) formed by forming the ventilation groove 24, and a portion of the projection (25) is cut out to communicate the ventilation groove 24 inside and outside the projection (25). Notch 2
8 are formed.

A plurality of portions (four portions in the figure) of each convex portion (25)
The notches 28 formed on the four sides of the radiation radiating in eight directions at equal angles from the through holes 23 are on non-adjacent radiations, and the notches 28 on the adjacent projections (25) are on the same radiation. It is arranged so that it is not located, that is, adjacent ventilation grooves 24 follow the zigzag course.

Each of the plurality of ventilation grooves 24 has a rectangular loop shape, and is directly connected to the bottom of the innermost ventilation groove 24 and the opening of the through hole 23.
The notch 28 of the odd-numbered convex portion (25) is the convex portion (2
When it is located at the corner of 5), the notch 28 of the even-numbered projection (25) from the through hole 23 is located at the center of the four sides of the projection (25).

[0037] The width w _-X notches 28 formed from holes 23 to the radial line is narrower as the distance from the through hole 23, for example the contour dimension in the adsorption member 22 _-1 of 22 mm × 22 mm, most Inner notch width w _-X = 1.5
mm, the outermost notch width w- _X = 0.25 mm.

In FIG. 3, the suction member _22-2 is a detailed explanatory view of another embodiment of the suction member 22 of FIG. 1, (a) is a side view, and (b) is a bottom view (suction surface view). is there. However,
FIG. 3B shows the notch end 2 of the notch 28 of the protrusion 25 and the notch 28 of the protrusion 25 in order to avoid congestion in the figure and to make it easier to see.
8 'is indicated by a solid line, and more precisely, the display of the bottom surface 27 of the ventilation groove 24 having a V-shaped cross section, which should be indicated by the solid line, is omitted.

[0039] a thickness of, for example 3.3 mm, in the adsorption member 22 _-1 that hole 23 is opened in the center on the lower surface (suction surface) for vacuum suction of the desired component such as a semiconductor bare chip, holes A plurality of ventilation grooves 24 concentric with 23
And a plurality of projections (25) formed by forming the ventilation groove 24, and a portion of the projection (25) is cut out to communicate the ventilation groove 24 inside and outside the projection (25). Notch 2
8 are formed.

A plurality of portions (four portions in the figure) of each convex portion (25)
The notches 28 formed on the four sides of the radiation radiating in eight directions at equal angles from the through holes 23 are on non-adjacent radiations, and the notches 28 on the adjacent projections (25) are on the same radiation. It is arranged so that it is not located, that is, adjacent ventilation grooves 24 follow the zigzag course.

Each of the plurality of ventilation grooves 24 has a circular loop shape, and is directly connected to the bottom of the innermost ventilation groove 24 and the opening of the through hole 23.
When the notch 28 of the odd-numbered projection (25) is positioned on the 45-degree oblique line in the figure, the notch 28 of the even-numbered projection (25) from the through-hole 23 Located in.

[0042] The width w _-X notches 28 formed from holes 23 to the radial line is narrower as the distance from the through hole 23, for example the contour dimension in the adsorption member 22 _-1 of 22 mm × 22 mm, most Inner notch width w _-X = 1.5
mm, the outermost notch width w- _X = 0.25 mm.

Suction member 2 for vacuum-sucking conductive bare chips
2,22 _-1 and 22 _-2 can be made of metal, hard resin or material having rubber elasticity. However, in consideration of the surface damage of the parts to be sucked, Shore hardness is low for sucking semiconductor bare chips. A resin of about 60 °, for example, urethane or Teflon or neoprene is preferable. For forming the ventilation groove, usual means, ie, laser processing using a laser, hot press processing using a mold, melting using a mask and a solvent are used. The past method is applicable.

Then, the adsorbing member 22, which is made of the resin,
22 _-1 and 22 _-2 can be cut and used according to the size of the component to be sucked, and the pickup tool 21 shown in FIG. 1 connects the shank 12 to a vacuum device (not shown). Is driven, the suction member 22 or 22
The air outside of _-1 or 22 _-2 is sucked through the ventilation groove 24 and sucks a desired component, for example, a semiconductor bare chip, on the suction surface (the lower surface in the drawing) of the suction members 22, 22 _-1 and 22 _-2 .

[0045]

As described above, in the pick-up tool according to the present invention, the notch formed in the outermost convex portion even after the suction of the desired component, the tip of the protrusion contacting the suction surface of the desired component to be suctioned. While holding the outside air from above, the desired parts are held.

Therefore, the suction force to the suction surface is dispersed, and the suction force is constantly applied to the entire surface of the suction surface, so that the suction and quality of the desired component are guaranteed, that is, the edge generated by the conventional pickup tool. The damage to the surface and the adsorption marks and the non-uniformity of the adsorption force are eliminated.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a pickup tool according to an embodiment of the present invention.

FIG. 2 is an explanatory view (No. 1) of the suction member according to the embodiment of the present invention.

FIG. 3 is an explanatory view (part 2) of the suction member according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram of a pickup tool including a super-hard suction member.

FIG. 5 is an explanatory diagram of a pickup tool including a suction pad.

FIG. 6 is an explanatory diagram of a pickup tool provided with irregularities on a suction surface.

[Explanation of symbols]

12 the shank 21 pickup tool 22 _-1,-out bottom surface 28 cut-out _22-2 suction member 23 through hole 24 ventilation channel 25 the distal end surface 27 ventilation grooves of the convex portion 26 protrusion

Claims (5)

[Claims] 1. A shank through which an intake hole penetrates,
A suction tool provided with a through-hole provided in communication with the suction hole, for picking up a desired component on the suction surface of the suction member by vacuum, and the suction surface having the through-hole opened; A plurality of ventilation grooves which are concentric with the holes and are not deformed and closed at the time of vacuum suction of the desired component are formed. Each of the plurality of projections formed concentrically with the through holes by the plurality of ventilation grooves has an inner side of the projection. And a notch communicating with the outside ventilation groove, and the ventilation groove closest to the through hole communicates with the through hole. 2. The pickup tool according to claim 1, wherein a notch length of the notch formed in the plurality of protrusions becomes shorter as the protrusions move away from the through hole. 3. The notch is formed at each of four positions of the convex portion, and the four positions are formed on four intermittent radiations of radiation radiating in eight directions at an equal angle from the through hole. 2. The pickup tool according to claim 1, wherein the notches of the protrusions adjacent in the inward and outward directions are not located on the same radiation. 4. The pickup tool according to claim 1, wherein the ventilation groove and the projection have a rectangular loop shape, and the projection has a trapezoidal cross section. 5. The pickup tool according to claim 1, wherein the ventilation groove and the projection have a circular loop shape, and the projection has a trapezoidal cross section.