JP2004095796A - Circuit board suction pad and method of cutting the board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board suction pad which can hold the circuit board at the predetermined position by making the circumferential wall hard to deform. <P>SOLUTION: In the circuit board suction pad, a circumferential wall 10 is partitioned so that it is in contact with the edge of a single surface of the circuit board 99 on which a plurality of electronic components C, C are mounted on the single surface, and surrounds the single surface side. Moreover, a closed space 16 continued from the circumferential wall 10 is also partitioned against the single surface side covering the single surface side in combination with the circumferential wall 10. A suction nozzle is provided with a covering portion 8 to be loaded on which a communicating hole 6 is formed. Moreover, the circuit board suction pad which can suck the circuit board 99 by exhausting the air within the closed space 16 via the suction nozzle, and a rib 12 is also provided so that it is extended from the internal bottom surface of the covering portion 8 and is in contact with the surface of circuit board 99 other than the area in which the electronic components C, C are loaded. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate suction pad for suction-holding a wiring board on which a plurality of electronic components are mounted on one side, and a substrate cutting method using the same.
[0002]
[Prior art]
There is a so-called MCM (multi-chip module) as a wiring board having a plurality of electronic components such as IC chips mounted on one side. FIG. 11 is a diagram showing the MCM 98 on which a plurality of electronic components C, C,... Are mounted on one side. In the manufacturing process, a plurality of MCMs 98 are continuously formed on one continuous substrate W2 as shown in FIG. Then, a plurality of MCMs 98, 98,... Are obtained by cutting the continuous substrate W2 along cutting lines a, b.
[0003]
FIG. 12 is a diagram (bottom view) illustrating a suction surface of a conventional suction head H2 that suctions the continuous substrate W2. FIG. 13 is a front sectional view of the suction head H2.
The suction head H2 includes a suction jig 30 made of metal, and substrate suction pads P2, P2,... Attached to the suction jig 30 and made of an elastic material such as silicon rubber. The board suction pad P2 abuts along the edge on one side of each MCM 98 (each wiring board) on which the electronic components C, C,... Are mounted, and a peripheral wall portion 52 surrounding the one surface side; Continuing with 52, a covering portion 53 that covers the one surface side is formed together with the peripheral wall portion 52. A communication hole 54 in which a suction nozzle 58 is mounted is formed at the center of the cover 53. The suction nozzle 58 is connected to the suction device V via a communication hole 30a formed in the suction jig 30 and a pipe Va connected to the communication hole 30a.
[0004]
When the continuous substrate W2 is suctioned by the suction head H2, as shown in FIG. 13, the peripheral walls 52 and the covering portions 53 of the substrate suction pads P2, P2,. To form a closed space 62 between the substrate suction pad P2 and one side of the MCM 98. Then, the suction device V sucks the air in the sealed spaces 62, 62,... Through the pipe Va, the communication hole 30a, and the suction nozzle 58, thereby separating the MCMs 98, 98,.・ ・ Adsorb to and hold.
[0005]
In the manufacturing process of the MCM 98, in a state where the continuous substrate W2 is sucked and held by the suction head H2, the presence or absence of the solder balls 98a, 98a,. Is cut along the cutting lines a and b (see FIG. 11) to cut into individual MCMs 98.
As shown in FIG. 14, the continuous substrate W2 is cut into individual pieces of MCMs 98, 98,... By, for example, rotating a blade B as a cutting means from the solder ball joining surface side of the continuous substrate W2 to the cutting line a, This is performed by abutting along b.
[0006]
[Problems to be solved by the invention]
With the recent increase in the integration of wiring boards such as MCMs, as shown in FIG. 11, the number of electronic components C, C,. More. Accordingly, in the recent MCM 99, the gap L2 between the electronic component C on the MCM 99 and the cutting lines a and b of the continuous substrate W is larger than the gap L1 in the previous MCM 98 (see FIG. 11). , Is very narrow. Accordingly, as shown in FIG. 9, the thickness of the peripheral wall portion 52 of the substrate suction pad P3 for sucking the MCM 99 needs to be formed very thin as compared with that of the previous substrate suction pad P2. .
[0007]
Further, in the recent MCM 99, as shown in FIG. 9, the height of each electronic component C tends to be higher than that of the previous MCM 98 in order to reduce the occupied area. Accordingly, the height h2 of the peripheral wall portion 52 of the substrate suction pad P3 needs to be formed higher than the height h1 of the peripheral wall portion of the substrate suction pad P2.
As described above, in recent years, the peripheral wall portion 52 of the substrate suction pad P3 has been required to be formed thinner and higher than before.
[0008]
Here, when the continuous substrate W is sucked by the suction head H3 and cut by the cutting means such as the rotary blade B, the continuous substrate W is closed upward by the negative pressure in the closed space 62. A force such as a force that is pushed up, a force that the rotating blade B comes into contact with and is pushed upward, and a force that acts in the horizontal direction due to the rotating force of the rotating blade B are applied. These forces are transmitted to the peripheral wall 52 supporting the continuous substrate W.
[0009]
As described above, since the peripheral wall portion 52 of the recent substrate suction pad P3 is formed thin and high, it is easily deformed by this force as shown in FIG. When the peripheral wall portion 52 is deformed, the MCM 99 moves during cutting by the rotating blade B, so that the MCM 99 can be formed in an accurate shape or dimension such that a cutting line is bent or shifted, or a cut surface is formed obliquely. However, there is a problem that the defect rate of the MCM99 product increases.
[0010]
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate suction pad that can stably hold a wiring substrate at a fixed position because a peripheral wall portion is not easily deformed. is there. Further, the present invention provides a substrate cutting method capable of preventing a wiring substrate from moving, cutting or bending a cutting line, or preventing a cut surface from being formed obliquely when a continuous substrate sucked by a substrate suction pad is cut. It is in.
[0011]
[Means for Solving the Problems]
A substrate suction pad according to the present invention has the following configuration in order to solve the above problems. In other words, the peripheral wall portion that abuts along the edge on the one side of the wiring board on which a plurality of electronic components are mounted on one side, and surrounds the one side, and is continuous with the peripheral wall, together with the peripheral wall. A cover portion that covers the one side and defines a closed space between the one side and a cover portion in which a communication hole to which a suction nozzle is attached is formed, and air in the closed space via the suction nozzle is provided. A substrate suction pad capable of sucking the wiring board by sucking the wiring board, and a rib extending from an inner bottom surface of the covering portion and abutting on the wiring board surface other than a portion on which the electronic component is mounted. It is characterized by having been done.
According to this, the force applied to the adsorbed wiring board can be supported by the peripheral wall and the rib, so that deformation of the peripheral wall can be suppressed.
[0012]
Further, the rib is provided continuously with the peripheral wall portion.
According to this, the peripheral wall portion is supported by the rib, and the deformation of the peripheral wall portion can be suppressed to be smaller.
[0013]
Further, a substrate cutting method according to the present invention has the following configuration in order to solve the above problems. That is, a substrate cutting method for cutting a continuous substrate formed by forming a plurality of adjoining wiring substrates on which a plurality of electronic components are mounted on one surface side into individual wiring substrates, wherein the one side of the wiring substrate The side, for each of the wiring boards that become individual pieces after cutting, is covered with the cover portion of the substrate suction pad according to claim 1 or 2, to define a sealed space, and via a suction nozzle attached to the communication hole. The suction step of sucking and holding the continuous substrate by sucking the air in the closed space, and cutting between the plurality of wiring substrates held by the substrate suction pads from the other surface side of the wiring substrate A cutting step of cutting the continuous substrate into individual wiring substrates.
According to this, the deformation of the peripheral wall portion of the substrate suction pad is suppressed, and the continuous substrate can be stably sucked and held. Therefore, in the cutting process, the cutting line of the wiring board is bent or shifted, and the cut surface is formed obliquely. Can be prevented.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a substrate suction pad and a substrate cutting method according to the present invention will be described in detail with reference to the drawings.
1A and 1B show a substrate suction pad P according to the present invention, wherein FIG. 1A is a bottom view, FIG. 1B is a front view, FIG. 1C is a plan view, and FIG.
The substrate suction pad P is made of an elastic material such as silicon rubber, and is in contact with the one side of the MCM 99 shown in FIG. And a covering portion 8 that covers the one side together with the peripheral wall portion 10 is formed continuously with the peripheral wall portion 10. At the center of the cover 8, a step 4 is formed that is recessed in a direction away from the sucked MCM 99, and a communication hole 6 is formed at the center of the step 4.
[0015]
On the inner wall side of the peripheral wall portion 10, ribs (projections) 12, 12... Extending from the inner bottom surface of the cover portion 8 and provided continuously to the peripheral wall portion 10 are formed. As shown in FIG. 2, a plurality of ribs 12, 12,... Are arranged so as to enter between electronic components C, C,. Are mounted so as not to contact the electronic components C, C,... Mounted on the MCM 99, but to a surface of the MCM 99 other than the portion where the electronic components C, C,. The ribs 12, 12,... Protrude from the inner wall surface of the peripheral wall portion 10 between the electronic components C, C, and have substantially the same height as the peripheral wall portion 10.
[0016]
FIG. 3 is an assembly diagram showing a suction head H including a suction jig 30 made of metal and a plurality of substrate suction pads P, P,... FIG. 4 is a bottom view of the suction head H.
As shown in FIG. 3, in the substrate suction pad P, a protrusion 14 formed on the outer surface of the cover 8 is fitted into a recess 30 b provided on the lower surface of the suction jig 30. The holding member 32 is fitted into the step portion 4, and the holding member 32 is attached to the suction jig 30 via the communication hole 6 by a hollow screw 34 formed in a hollow shape along the axis. The hollow screw 34 passes through the opening of the holding member 32 and the communication hole 6 of the substrate suction pad P, and is screwed with a screw provided on the inner wall of the communication hole 30 a formed in the suction jig 30. As a result, the substrate suction pad P is attached to the suction jig 30 with the peripheral portion of the communication hole 6 of the cover 8 held by the holding member 32.
[0017]
FIG. 5 is a front sectional view of the suction head H. When the hollow screw 34 is screwed with a screw portion provided on the inner wall of the communication hole 30a, the hollow portion communicates with the communication hole 30a to form a suction nozzle. The suction nozzle communicates with a concave portion (sealed space) 16 formed by being surrounded by the peripheral wall portion 10 and the cover portion 8, and is also communicated with the suction device V via the communication hole 30a and the pipe Va.
[0018]
Next, a substrate cutting method for cutting the continuous substrate W using the suction head H according to the present invention will be described.
First, the continuous substrate W is sucked by the suction head H.
When the continuous substrate W2 is sucked by the suction head H, the suction head H is moved above the continuous substrate W by a moving driving means (not shown) so that each of the substrate suction pads P, P,. The alignment is performed so as to match the positions of the MCMs 99, 99,. Subsequently, the suction head H is moved downward to make contact with the continuous substrate W, and as shown in FIG. 6, each of the continuous substrates W on the peripheral wall portions 10 and the cover portions 8 of the substrate suction pads P, P,. Covering the MCMs 99, 99, a closed space 16 is defined between the substrate suction pad P and one side of the MCM 99. Subsequently, the suction device V sucks the air in the closed space 16 through the pipe Va, the communication hole 30a, and the hollow portion 34a of the hollow screw 34, so that each of the MCMs 99, 99,.・ ・ Adsorb to and hold.
[0019]
Subsequently, as shown in FIG. 7, the rotating blade B as a cutting means is brought into contact with the continuous substrate W along the cutting lines a and b from the back side of the surface of the continuous substrate W held by the suction head H. W is cut into individual MCMs 99, 99...
The cutting means is not limited to the rotating blade B.
[0020]
Subsequently, the cut MCMs 99, 99... Are imaged from below by an imaging means such as a CCD camera (not shown), and the presence or absence of the solder balls 99a, 99a.
[0021]
When the continuous substrate W is cut by the cutting means, the continuous substrate W has a negative pressure in the closed space 16 and is pushed upward, a rotating blade B is brought into contact with the continuous substrate W and pushed upward. A force such as a force acting in the horizontal direction is applied by the rotation force of B. These forces are transmitted to the peripheral wall 52 supporting the continuous substrate W. Here, in the conventional substrate suction pad P3, there is a problem that the peripheral wall portion 52 is deformed. However, in the substrate suction pad P according to the present embodiment, the force applied to the peripheral wall portion 10 , 12,..., The deformation of the peripheral wall portion 10 can be kept very small. Since the ribs 12, 12,... Are provided continuously with the peripheral wall portion 10, the peripheral wall portion 10 is supported on the side surfaces by the ribs 12, 12,. .
[0022]
Since the peripheral wall portion 10 is hardly deformed and the MCM 99 is stably supported by the peripheral wall portion 10 and the ribs 12, 12,..., The cutting line is bent or misaligned because the MCM 99 does not move during cutting by the rotating blade B. The MCM 99 can be formed in an accurate shape and size without causing any cuts or oblique cuts.
[0023]
The ribs 12, 12,... Do not necessarily need to be provided continuously with the inner wall surface of the peripheral wall portion 10, but may be provided in a form projecting into the closed space 16 in a pin shape from the inner bottom surface of the cover portion 8.
For example, when there is no space for the rib 12 to enter between the electronic components C, C,... Near the periphery of the MCM 99, an appropriate portion between the electronic components C, C,. Preferably, the pin-shaped ribs 12 are provided.
[0024]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the board | substrate suction pad which concerns on this invention, since the peripheral wall part of a recessed part does not deform easily, there exists an effect that a wiring board can be stably hold | maintained at a fixed position. Further, according to the substrate cutting method of the present invention, when the continuous substrate sucked by the substrate suction pad is cut, the wiring board moves, the cutting line is bent or shifted, or the cut surface is formed obliquely. The effect that it can prevent is produced.
[Brief description of the drawings]
1A and 1B are diagrams showing a substrate suction pad according to the present invention, wherein FIG. 1A is a bottom view, FIG. 1B is a front view, FIG. 1C is a plan view, and FIG.
FIG. 2 is an explanatory diagram showing positions of a peripheral wall portion and a rib in a state where a substrate suction pad according to the present invention is in contact with a wiring substrate (MCM).
FIG. 3 is an assembly view showing a suction head using the substrate suction pad according to the present invention.
FIG. 4 is a bottom view of a suction head using the substrate suction pad according to the present invention.
FIG. 5 is a front sectional view of a suction head using the substrate suction pad according to the present invention.
FIG. 6 is a front sectional view showing a state in which a wiring board is sucked by a suction head using a board suction pad according to the present invention.
FIG. 7 is a view showing a state in which the wiring board sucked by the suction head using the board suction pad according to the present invention is cut by cutting means.
FIG. 8 is a diagram showing a recent wiring board (MCM).
FIG. 9 is a front sectional view of a suction head using a conventional board suction pad capable of sucking the wiring board (MCM) of FIG. 8;
10 is a diagram showing a state in which the wiring board sucked by the suction head in FIG. 9 is cut by cutting means.
FIG. 11 is a view showing a conventional wiring board (MCM).
FIG. 12 is a bottom view of a suction head using a conventional substrate suction pad.
FIG. 13 is a front sectional view of a suction head using a conventional substrate suction pad.
FIG. 14 is a diagram showing a state in which a wiring board sucked by a suction head using a conventional board suction pad is cut by cutting means.
[Explanation of symbols]
P Substrate suction pad H Suction head V Suction device W Continuous substrate C Electronic component B Rotating blade (cutting means)
4 Step portion 6 Communication hole 8 Covering portion 10 Peripheral wall portion 12 Rib 14 Convex portion 16 Sealed space 30 Suction jig 32 Holding member 34 Hollow screw 99 Wiring board (MCM)

Claims (3)

A peripheral wall portion that abuts along an edge on the one surface side of the wiring board on which a plurality of electronic components are mounted on one surface side and surrounds the one surface side;
Continuing with the peripheral wall, covering the one surface together with the peripheral wall to define a closed space between the peripheral wall and the one surface, and comprising a cover formed with a communication hole to which a suction nozzle is attached,
A board suction pad capable of sucking the wiring board by sucking air in the sealed space through the suction nozzle,
A board suction pad provided with a rib extending from an inner bottom surface of the cover portion and abutting on a surface of the wiring board other than a portion where the electronic component is mounted. The substrate suction pad according to claim 1, wherein the rib is provided continuously with the peripheral wall portion. A wiring board mounted with a plurality of electronic components on one side, a substrate cutting method of cutting a continuous board formed adjacently to a plurality of individual wiring boards,
3. A closed space is defined by covering the one surface side of the wiring board with the covering portion of the substrate suction pad according to claim 1 or 2 for each wiring board that becomes an individual piece after cutting, and is attached to the communication hole. Suctioning the air in the closed space through the suction nozzle, thereby suctioning and holding the continuous substrate,
A cutting step of cutting the continuous substrate into individual wiring substrates by cutting a space between the plurality of wiring substrates held by the substrate suction pads from the other surface side of the wiring substrate. Substrate cutting method.

Images