JPH08111578A - Manufacture of board for mounting ball grid array package - Google Patents

Manufacture of board for mounting ball grid array package

Info

Publication number
JPH08111578A
JPH08111578A JP6267999A JP26799994A JPH08111578A JP H08111578 A JPH08111578 A JP H08111578A JP 6267999 A JP6267999 A JP 6267999A JP 26799994 A JP26799994 A JP 26799994A JP H08111578 A JPH08111578 A JP H08111578A
Authority
JP
Japan
Prior art keywords
pads
solder resist
mother board
board
motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6267999A
Other languages
Japanese (ja)
Inventor
Takeshi Nakagawa
剛 中川
Tomoiku Nakagawa
智郁 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP6267999A priority Critical patent/JPH08111578A/en
Publication of JPH08111578A publication Critical patent/JPH08111578A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

PURPOSE: To enable an alignment operation to be easily and visually carried out by a method wherein the pads of a mother board are formed like holes so as to be easily mounted with the corresponding ball bumps of a BGA package. CONSTITUTION: A copper foil 2 on a printed wiring board 1 is plated with copper 3. In succession, the copper plating 3 and the copper foil 2 are etched for the formation of pads 4. With dry film resist, a second solder resist 6 is applied overlapping a first solder resist 5 so as to be flush with the pad 4. On the surface of a mother board formed as mentioned above, the pads 4 are recessed, and the solder resists 6 are protrudent. Therefore, after flux 7 is applied onto the pads 4, the ball bumps 10 of a BGA package 8 are made to overlap easily with the pads 4 of the mother board 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、ＩＣなどのパッケージ
として用いられるボールグリッドアレイパッケージ（以
下、ＢＧＡパッケージという）を実装する基板であるマ
ザーボードの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a mother board which is a substrate for mounting a ball grid array package (hereinafter referred to as a BGA package) used as a package for ICs and the like.

【０００２】[0002]

【従来の技術】ＢＧＡパッケージは、電子部品の小型・
軽量・多機能化を担うもので、リードを用いずボールバ
ンプによる接続方式をもつパッケージである。従来、Ｂ
ＧＡパッケージを実装するマザーボードの構造は、図２
に示すようにマザーボード１上のパッド４を除く部分に
ソルダーレジスト５が印刷されている。このマザーボー
ドへのＢＧＡパッケージの実装・半田付けは図３に示す
ように次の工程でなされている。 （１）図３（Ａ）のように、マザーボード１のパッド４
の上にフラックス７を塗布する。 （２）アレイ状に並んでいるＢＧＡパッケージのボール
バンプ１０とそれに対応したマザーボード上のパッド４
とを、画像処理により、図３（Ｂ）に示す位置関係とな
るように位置合わせする。 （３）位置合わせ後、マウンタの吸着ノズルを用いて、
図３（Ｃ）に示すように、ＢＧＡパッケージ８をマザー
ボード１上に載せる。 （４）ＢＧＡパッケージ８をマザーボード１に載せた状
態で、リフロー炉で加熱し、ＢＧＡパッケージ８とマザ
ーボード１とを半田付けし、図３（Ｄ）のごとく実装が
完了する。BGA packages are small electronic components.
This package is lightweight and multi-functional, and has a connection method using ball bumps without using leads. Conventionally, B
Figure 2 shows the structure of the motherboard on which the GA package is mounted.
As shown in FIG. 3, a solder resist 5 is printed on a portion of the motherboard 1 excluding the pads 4. Mounting and soldering of the BGA package on this mother board are performed in the following steps as shown in FIG. (1) As shown in FIG. 3 (A), the pads 4 on the motherboard 1
Apply flux 7 on top. (2) BGA package ball bumps 10 arranged in an array and corresponding pads 4 on the motherboard
And are aligned by image processing so that the positional relationship shown in FIG. (3) After positioning, use the suction nozzle of the mounter to
As shown in FIG. 3C, the BGA package 8 is placed on the motherboard 1. (4) The BGA package 8 placed on the motherboard 1 is heated in a reflow furnace to solder the BGA package 8 and the motherboard 1 to complete the mounting as shown in FIG.

【０００３】[0003]

【発明が解決しようとする課題】従来の製造方法におい
て、ＢＧＡパッケージのボールバンプとそれに対応する
マザーボードのパッドとの位置合わせには、高い精度が
必要であり、通常、画像処理機能を有するマウンタが使
用されている。この画像処理機能を有するマウンタは高
価であり、そのため、生産コストが増大することにな
る。In the conventional manufacturing method, high accuracy is required for the alignment between the ball bumps of the BGA package and the corresponding pads of the motherboard, and a mounter having an image processing function is usually required. in use. The mounter having this image processing function is expensive, which increases the production cost.

【０００４】[0004]

【課題を解決するための手段】本発明では、ＢＧＡパッ
ケージのボールバンプとマザーボードのパッドとの位置
合わせにおいて、高価な画像処理機能を有するマウンタ
を使用せず、マニュアル等で簡易に行うため、次の工程
によりマザーボードを製造する。 （１）プリント配線板の銅箔に銅メッキを施す工程。 （２）不要な銅メッキおよび銅箔をエッチングしてパッ
ドを形成する工程。 （３）１回目のソルダーレジストを塗布する工程。 （４）１回目と同じ位置に重ねて、２回目のソルダーレ
ジストを塗布する工程。According to the present invention, the positioning of the ball bumps of the BGA package and the pads of the motherboard can be easily performed manually without using an expensive mounter having an image processing function. The motherboard is manufactured by the process. (1) A step of plating copper on a copper foil of a printed wiring board. (2) A step of etching unnecessary copper plating and copper foil to form pads. (3) A step of applying the first solder resist. (4) A step of applying the solder resist on the same position as the first time and applying the solder resist on the second time.

【０００５】[0005]

【実施例】図１は本発明によるマザーボードの製造工程
を示す図である。図１（Ａ）に示すように、プリント配
線基板１の銅箔２の上に銅メッキ３を施す。続いて、図
１（Ｂ）のように、銅メッキおよび銅箔をエッチングし
て、パッド４を形成する。次に、図１（Ｃ）に示すよう
に、ドライフィルムレジストにより、パッド４と同じ高
さ（約１５μｍ）になるように、１回目のソルダーレジ
スト５を塗布する。続いて、１回目のソルダーレジスト
５の上に重ねて、２回目のソルダーレジスト６を塗布す
る。２回目のソルダーレジスト６の厚さは、５０μｍ程
度が適当である。以上で、マザーボードの製造は完了す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a manufacturing process of a motherboard according to the present invention. As shown in FIG. 1A, copper plating 3 is applied on the copper foil 2 of the printed wiring board 1. Subsequently, as shown in FIG. 1B, the copper plating and the copper foil are etched to form the pads 4. Next, as shown in FIG. 1C, the first solder resist 5 is applied by a dry film resist so as to have the same height (about 15 μm) as the pad 4. Subsequently, the solder resist 6 for the second time is applied so as to be overlaid on the solder resist 5 for the first time. A suitable thickness of the second solder resist 6 is about 50 μm. This completes the manufacture of the motherboard.

【０００６】以上のように製造されたマザーボードで
は、パッド４の部分が凹になり、ソルダーレジスト６の
部分が凸になっている。従って、図１（Ｅ）に示すよう
にパッド４の上にフラックス７を塗布した後、図１
（Ｆ）に示すようにＢＧＡパッケージ８のボールバンプ
１０を、マザーボード１のパッド４の上に容易に重ねる
ことができる。この後、従来通りの方法で、リフロー炉
により半田付けする。In the mother board manufactured as described above, the pad 4 is concave and the solder resist 6 is convex. Therefore, after applying the flux 7 on the pad 4 as shown in FIG.
As shown in (F), the ball bump 10 of the BGA package 8 can be easily overlaid on the pad 4 of the motherboard 1. After that, soldering is performed by a reflow furnace in a conventional method.

【０００７】[0007]

【発明の効果】本発明によれば、図１（Ｆ）に示すよう
に、マザーボード１のパッド４の部分が、対応するＢＧ
Ａパッケージ８のボールバンプ１０を容易に載せられる
ような穴状に形成されている。従って、目視により容易
に位置合わせができ、高価な画像処理機能付きのマウン
タを使用する必要がなく、製造コストを低減できる。ま
た、パッド４の部分が穴状になっていることは、リフロ
ー時の位置ズレを防止する効果もある。According to the present invention, as shown in FIG. 1 (F), the portion of the pad 4 of the mother board 1 corresponds to the BG.
It is formed in a hole shape so that the ball bumps 10 of the A package 8 can be easily placed. Therefore, it is possible to easily perform visual alignment, and it is not necessary to use an expensive mounter having an image processing function, and the manufacturing cost can be reduced. In addition, the hole-like portion of the pad 4 also has the effect of preventing positional displacement during reflow.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明になるマザーボードの製造工程を示す
図。FIG. 1 is a diagram showing a manufacturing process of a motherboard according to the present invention.

【図２】従来のマザーボードを示す図。FIG. 2 is a diagram showing a conventional motherboard.

【図３】従来のマザーボードによるＢＧＡパッケージの
実装を示す工程図。FIG. 3 is a process diagram showing mounting of a BGA package on a conventional motherboard.

【符号の説明】[Explanation of symbols]

１ プリント配線基板（マザーボード） ２ 銅箔 ３ 銅メッキ ４ マザーボード上のパッド ５ １回目のソルダーレジスト ６ ２回目のソルダーレジスト ７ フラックス ８ ＢＧＡパッケージ ９ ＢＧＡパッケージ上のパッド １０ ボールバンプ １１ ソルダーレジスト 1 printed wiring board (mother board) 2 copper foil 3 copper plating 4 pad on motherboard 5 first solder resist 6 second solder resist 7 flux 8 BGA package 9 BGA package pad 10 ball bump 11 solder resist

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】ボールグリッドアレイパッケージを実装す
る基板であるマザーボードの製造方法において、マザー
ボード用のプリント配線基板の銅箔に銅メッキを施す工
程と、マザーボード上の不要な銅メッキ及び銅箔をエッ
チングして、パッドを形成する工程と、マザーボードの
パッドを除く部分に１回目のソルダーレジストを塗布す
る工程と、１回目のソルダーレジストの上に、２回目の
ソルダーレジストを重ねて塗布する工程とを有すること
を特徴とするボールグリッドアレイパッケージ実装用基
板の製造方法。1. A method of manufacturing a mother board, which is a substrate for mounting a ball grid array package, in which a copper foil of a printed wiring board for the mother board is plated with copper, and unnecessary copper plating and copper foil on the mother board are etched. Then, the step of forming the pad, the step of applying the first solder resist to the portion of the motherboard other than the pad, and the step of applying the second solder resist over the first solder resist are applied. A method for manufacturing a substrate for mounting a ball grid array package, which comprises:
JP6267999A 1994-10-07 1994-10-07 Manufacture of board for mounting ball grid array package Pending JPH08111578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6267999A JPH08111578A (en) 1994-10-07 1994-10-07 Manufacture of board for mounting ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6267999A JPH08111578A (en) 1994-10-07 1994-10-07 Manufacture of board for mounting ball grid array package

Publications (1)

Publication Number Publication Date
JPH08111578A true JPH08111578A (en) 1996-04-30

Family

ID=17452511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6267999A Pending JPH08111578A (en) 1994-10-07 1994-10-07 Manufacture of board for mounting ball grid array package

Country Status (1)

Country Link
JP (1) JPH08111578A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998036455A1 (en) * 1997-02-12 1998-08-20 Peter Anthony Fry Herbert A diode array
KR100328834B1 (en) * 1999-09-11 2002-03-14 박종섭 Manufacturing method of wafer level chip size package
KR100773288B1 (en) * 1999-10-01 2007-11-05 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 Multilayer flexible wiring boards
KR100905568B1 (en) * 2007-04-13 2009-07-02 삼성전기주식회사 Printed circuit board and method of manufacturing the same
JP2013138181A (en) * 2011-12-27 2013-07-11 Samsung Electro-Mechanics Co Ltd Printed circuit board and manufacturing method of the same
CN110913601A (en) * 2019-11-18 2020-03-24 大连崇达电路有限公司 Method for manufacturing solder mask translation film
CN115802601A (en) * 2023-02-07 2023-03-14 四川英创力电子科技股份有限公司 Flush printed circuit board and production method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998036455A1 (en) * 1997-02-12 1998-08-20 Peter Anthony Fry Herbert A diode array
KR100328834B1 (en) * 1999-09-11 2002-03-14 박종섭 Manufacturing method of wafer level chip size package
KR100773288B1 (en) * 1999-10-01 2007-11-05 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 Multilayer flexible wiring boards
KR100905568B1 (en) * 2007-04-13 2009-07-02 삼성전기주식회사 Printed circuit board and method of manufacturing the same
JP2013138181A (en) * 2011-12-27 2013-07-11 Samsung Electro-Mechanics Co Ltd Printed circuit board and manufacturing method of the same
CN110913601A (en) * 2019-11-18 2020-03-24 大连崇达电路有限公司 Method for manufacturing solder mask translation film
CN115802601A (en) * 2023-02-07 2023-03-14 四川英创力电子科技股份有限公司 Flush printed circuit board and production method thereof
CN115802601B (en) * 2023-02-07 2023-06-27 四川英创力电子科技股份有限公司 Flush printed circuit board and production method thereof

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