JP2005252259A - Bga package vacuum pad - Google Patents

Bga package vacuum pad Download PDF

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Publication number
JP2005252259A
JP2005252259A JP2005056907A JP2005056907A JP2005252259A JP 2005252259 A JP2005252259 A JP 2005252259A JP 2005056907 A JP2005056907 A JP 2005056907A JP 2005056907 A JP2005056907 A JP 2005056907A JP 2005252259 A JP2005252259 A JP 2005252259A
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Prior art keywords
package
ball
vacuum
vacuum pad
contact portion
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Yae Fuun Seo
フーン セオ，ヤエ
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Secron Co Ltd
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Secron Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a BGA vacuum pad capable of performing absorption without the loss of a vacuum absorption even if a poll land is narrow. <P>SOLUTION: The BGA (Ball Grid Array Package) vacuum pad provided with a vacuum hole to which a vacuum line is connected and a closely contacted section that is protruded and formed at the outer edge of an upper section, is characterized in that ball receiving grooves 13 capable of receiving the balls 21 of the BGA package 20 are formed at the section 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はビージーエーパッケージ（BGA, Ball Grid Array Package）を吸着して固定するか移送する真空パッドに関するもので、より詳しくはビージーエーパッケージで最外側に配列されたボール、即ち中心部から一番遠く配列されたボールとパッケージ端部までの空間（以下、ボールランドという）が狭いビージーエーパッケージの場合にも真空吸引力の損失なしに吸着できるビージーエーパッケージ真空パッド（BGA package vacuum pad）に関するものである。   The present invention relates to a vacuum pad for attracting and fixing or transferring a BG package (BGA, Ball Grid Array Package). More specifically, the present invention relates to balls arranged on the outermost side in the BG package, that is, from the center. BGA package vacuum pad that can be absorbed without loss of vacuum suction force even in the case of a BG package where the space between balls and the package end (hereinafter referred to as ball land) is narrow. It is.

ビージーエーパッケージは実装面にチップパッドと連結される電気的連結端子であるソルダーボール（Solder Ball, 以下ボールという）を配列、付着したもので、外部端子の長さが短いため外部の衝撃によって曲ることの発生が抑えられるし、電気的信号伝達が容易で、ピーシービー(Printed Circuit Board)に実装時、炉（Furnace）でリフロー(Reflow)させて実装するので実装時間が減少されるなどの長点があって最近広く使用されている。   The BG package has solder balls (hereinafter referred to as “balls”) that are electrically connected to the chip pads on the mounting surface. It is easy to transmit electrical signals, and when mounting on PCB (Printed Circuit Board), mounting is done by reflowing with a furnace (Furnace), so mounting time is reduced, etc. Recently, it has been widely used.

前記ビージーエーパッケージはいくつかの工程を経て最終的に完成するので、各工程のステージに移送するかまたは固定した後作業をしなければならない。特に、ボールを配列、付着した後の固定または移送は一般的に真空ラインを通じて引加された真空吸引力でパッケージを吸着して行う。   Since the BG package is finally completed through several steps, it must be transferred to the stage of each step or fixed before it can be operated. In particular, fixing or transferring after arranging and adhering the balls is generally performed by adsorbing the package with a vacuum suction force applied through a vacuum line.

例えば、図７〜図９に示されたチャックテーブル(chuck table)とこれに安着された真空パッドを参照して説明すると、図７は、多数個の半導体パッケージがグループ単位で成型されたストリップ状態の資材を、単位パッケージに分離するソーイング(sawing)工程で、パッケージなどを吸着して固定するチャックテーブル (chuck table)を図示したものである。   For example, referring to the chuck table shown in FIGS. 7 to 9 and the vacuum pad attached thereto, FIG. 7 shows a strip in which a plurality of semiconductor packages are molded in groups. A chuck table for chucking and fixing a package or the like in a sawing process of separating the material in a state into a unit package is shown.

前記チャックテーブルにはそれぞれの単位パッケージを吸着して固定する多数個の真空パッド１０がボディーＡ上に安着されるが、前記多数個の真空パッドが一体に成型される一体型とそれぞれ個別に成型される個別型がある。   A large number of vacuum pads 10 for adsorbing and fixing each unit package to the chuck table are seated on the body A. Each of the vacuum pads 10 is individually integrated with the integral type in which the large number of vacuum pads are integrally molded. There are individual molds to be molded.

ここでは個別型を適用したもので、その構成は、内部に真空ラインと連結される真空ホール１１が備えられ、上面の外縁にはボールランド２２と接触する密着部１２が突出形成されている。   Here, an individual type is applied, and the structure is provided with a vacuum hole 11 connected to a vacuum line inside, and a close contact portion 12 in contact with the ball land 22 is protruded and formed on the outer edge of the upper surface.

図８は前記個別型真空パッドと単位パッケージが結合することを表す分離斜視図、図９は吸着状態の断面図であり、これを参照に前記真空パッド１０の作動状態を説明すると、ビージーエーパッケージ２０のボールランド２２に前記密着部１２が接触し真空ライン（図示しない）を通じて真空吸引力が引加されると単位パッケージが吸着、固定されるのである。勿論、ボール２１は密着部１２の内側に受容される。   FIG. 8 is an exploded perspective view showing that the individual vacuum pad and the unit package are combined, and FIG. 9 is a sectional view of the suction state, and the operation state of the vacuum pad 10 will be described with reference to this. When the contact portion 12 comes into contact with 20 ball lands 22 and a vacuum suction force is applied through a vacuum line (not shown), the unit package is sucked and fixed. Of course, the ball 21 is received inside the contact portion 12.

前記のような従来の真空パッド１０は前記ボールランド２２がある程度確保されたビージーエーパッケージの場合には問題がない。しかし、ボールランドが狭い場合、即ちパッケージ端部から非常に近い所までボール２１が配列、付着されたビージーエーパッケージの場合には、密着部１２をボールランド２２にのみ接触する場合密着部１２が非常に薄く支持力及び気密性が落ちる。   The conventional vacuum pad 10 as described above has no problem in the case of a BG package in which the ball land 22 is secured to some extent. However, when the ball land is narrow, that is, in the case of the BG package in which the balls 21 are arranged and attached to a position very close to the end of the package, when the close contact portion 12 contacts only the ball land 22, the close contact portion 12 It is very thin and its bearing capacity and airtightness are reduced.

また、これを防ぐために前記密着部１２を最小限の厚さにする場合には、ボールと接触するようになるのでやはりパッケージとの気密性が落ち、結果的には真空吸引力が損失されてパッケージを吸着、固定できなくなる問題点があった。   Further, in order to prevent this, when the contact portion 12 is made to have a minimum thickness, it comes into contact with the ball, so that the airtightness with the package is lowered, and as a result, the vacuum suction force is lost. There was a problem that the package could not be absorbed and fixed.

本発明は前記のような問題点を解決するために案出されたもので、本発明の目的は、ボールランドが狭い場合でも真空吸引力の損失無しに吸着できるビージーエー真空パッドを提供することにある。   The present invention has been devised to solve the above problems, and an object of the present invention is to provide a BG vacuum pad that can be adsorbed without loss of vacuum suction force even when the ball land is narrow. is there.

このような技術的課題を解決するために本発明は、真空ラインが連結される真空ホールと、上部の外縁に突出形成された密着部を備えるビージーエーパッケージ（BGA, Ball Grid Array Package）真空パッドにおいて、前記密着部にビージーエーパッケージのボールを受容できるボール受容溝が形成されることを特徴とするビージーエーパッケージ真空パッドを提供する。   In order to solve such technical problems, the present invention provides a vacuum pad to which a vacuum line is connected, and a BG package (BGA, Ball Grid Array Package) vacuum pad including a close-contact portion formed on the outer edge of the upper portion. In the above, a BG package vacuum pad is provided, wherein a ball receiving groove capable of receiving a ball of the BG package is formed in the contact portion.

また、本発明のビージーエーパッケージ真空パッドにおいて、前記密着部に接触される前記ボールによって前記ボール受容溝が１列または多数列で形成できるし、さらに前記ボール受容溝は作業対象になる前記ビージーエーパッケージのボール配列によってこれに対応する位置に選択的に形成されるか、前記ビージーエーパッケージのボールの間のピッチと同一なピッチで前記密着部全面に形成される事も可能である。   Further, in the BG package vacuum pad according to the present invention, the ball receiving grooves can be formed in one or a plurality of rows by the balls that are in contact with the contact portion, and the ball receiving grooves are the BGAs to be operated. It may be selectively formed at a position corresponding to this according to the ball arrangement of the package, or may be formed on the entire surface of the contact portion at the same pitch as the pitch between the balls of the BG package.

また本発明は真空ラインが連結される真空ホールと、上部の外縁に突出形成された密着部を備えるビージーエーパッケージ（BGA, Ball Grid Array Package）真空パッドにおいて、前記密着部にビージーエーパッケージのボールを受容できる凹溝が形成されることを特徴とする。   The present invention also relates to a BG package (BGA, Ball Grid Array Package) vacuum pad having a vacuum hole to which a vacuum line is connected and a close contact portion projecting from the outer edge of the upper portion. It is characterized in that a concave groove capable of receiving the above is formed.

また、本発明によるビージーエーパッケージ真空パッドは前記密着部の内側に突起がさらに付加されることが望ましい。   In addition, the BG package vacuum pad according to the present invention preferably further includes a protrusion on the inner side of the contact portion.

本発明によれば、ビージーエーパッケージを吸着して移送または固定が必要な場合には何処でも適用可能な真空パッドで、特にボールランドが狭いビージーエーパッケージの場合に真空吸引力の損失なしに吸着できるという効果がある。   According to the present invention, the vacuum pad can be applied wherever the BG package needs to be sucked and transported or fixed, and in particular in the BG package where the ball land is narrow, the vacuum suction force is not lost. There is an effect that can be done.

また、ボールが受容されるボール受容溝または凹溝がガイドの役割をするのでパッケージを正確な位置に供給することができる効果もある。   In addition, since the ball receiving groove or the concave groove in which the ball is received serves as a guide, the package can be supplied to an accurate position.

また、ボールランドが狭いビージーエーパッケージの場合、従来はこれを吸着することが困難でボール付着部位の裏面を吸着して移送するか固定するなどのことがあったが、本発明によるとボール付着部位の裏面だけではなくボール付着部位の吸着も可能なので作業工程を非常に順調に進行することができる。   Also, in the case of a BG package with a narrow ball land, it has been difficult to adsorb the ball land in the past, and the back surface of the ball adhering portion has been adsorbed and transferred or fixed. Since not only the back surface of the part but also the adhering part of the ball can be adsorbed, the work process can proceed very smoothly.

以下、添付された図面に基づいて本発明による実施の形態を具体的に説明する。図１〜図６において図７〜図９と同一部分は同一符号をもって示している。図１と図２はそれぞれ第１実施例による真空パッド３０と、これに吸着されるビーシーエーパッケージ２０の分離斜視図を示したもので、前記密着部１２にボール受容溝１３が多数個形成されている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 to 6, the same parts as those in FIGS. 7 to 9 are denoted by the same reference numerals. FIG. 1 and FIG. 2 show a perspective view of the vacuum pad 30 according to the first embodiment and the BCA package 20 adsorbed thereto, and a plurality of ball receiving grooves 13 are formed in the contact portion 12. ing.

図示されたように、ボールランド２２が狭いビージーエーパッケージ２０の吸着時密着部１２の厚さを薄くしてボールランド２２にのみ接触させるのであれば支持力及び気密性が落ちるので、これを改善するために密着部１２の厚さを必要な程度確保すると同時にこれによって接触されるボール２１を避けるために前記ボール受容溝１３を形成したものである。   As shown in the drawing, if the thickness of the adhesion portion 12 at the time of adsorption of the BG package 20 where the ball land 22 is narrow is reduced and brought into contact only with the ball land 22, the supporting force and the airtightness are lowered, so this is improved. For this purpose, the ball receiving groove 13 is formed in order to secure the necessary thickness of the contact portion 12 and at the same time to avoid the ball 21 being in contact therewith.

前記ボール受容溝１３は、密着部１２上でパッケージ２０のボール２１配列、特に最外側に配列されたボールに対応する位置に選択的に形成されるものなので、作業の対象になるパッケージ２０のボール配列によって前記ボール受容溝１３形成位置は変更される。   The ball receiving groove 13 is selectively formed on the contact portion 12 at a position corresponding to the arrangement of the balls 21 of the package 20, particularly the balls arranged on the outermost side. The position where the ball receiving groove 13 is formed is changed depending on the arrangement.

またここでは最外側に配列されたボールを受容するように前記ボール受容溝１３を１列にしたが、必要によって前記ボールの内側に形成されたボールを受容するために前記ボール受容溝１３を２列またはそれ以上にも形成できる。   Further, here, the ball receiving grooves 13 are arranged in a row so as to receive the balls arranged on the outermost side. However, if necessary, the ball receiving grooves 13 are formed in two rows to receive the balls formed inside the balls. Can be formed in rows or more.

図３は前記実施例にパッケージ２０が吸着された状態の断面図で、これを参照して前記実施例の作動状態を説明すると、真空ホール１１を通じて真空吸引力が引加されると前記密着部１２の外側端部（密着部においてボール受容溝１３を境として外側端部）は狭いボールランド２２に接触し、最外側に配列されたボールを前記ボール受容溝１３に受容、避けて入れることで前記密着部の内側端部（密着部においてボール受容溝１３を境として内側端部）が最外側に配列されたボールとそのすぐ内側に配列されたボールの間の空間に接続できるものである。   FIG. 3 is a cross-sectional view of a state in which the package 20 is attracted to the embodiment, and the operation state of the embodiment will be described with reference to this. When a vacuum suction force is applied through the vacuum hole 11, the contact portion The outer end portion 12 (the outer end portion of the contact portion with the ball receiving groove 13 as a boundary) is in contact with the narrow ball land 22, and the balls arranged on the outermost side are received and avoided by the ball receiving groove 13. The inner end of the contact portion (the inner end of the contact portion with the ball receiving groove 13 as a boundary) can be connected to a space between the ball arranged on the outermost side and the ball arranged on the inner side.

従って前記密着部１２の外側端部と内側端部がそれぞれビーシーエーパッケージ２０と気密性があるように接続するので真空吸引力の損失なしに吸着できるのである。   Therefore, the outer end portion and the inner end portion of the contact portion 12 are connected to the BCA package 20 so as to be airtight, so that they can be adsorbed without loss of vacuum suction force.

図４は本発明においての第２実施例の真空パッド４０を示し、前記第１実施例では作業対象になるパッケージのボール配列に対応して選択的にボール受容溝を形成したのに対し、本実施例は密着部１２の全面にボール受容溝１３を形成したものである。   FIG. 4 shows a vacuum pad 40 according to a second embodiment of the present invention. In the first embodiment, a ball receiving groove is selectively formed corresponding to the ball arrangement of the package to be worked. In the embodiment, the ball receiving groove 13 is formed on the entire surface of the contact portion 12.

現実的には、ビージーエーパッケージのボール配列状態は非常に多様であるので、第１実施例のように特定の位置にボール受容溝１３を形成する場合、これと異なるボール配列を持つパッケージの吸着のためにはそれに対応するボール受容溝１３が形成された真空パッドに交替しなければならないという問題が発生する。   Actually, since the ball arrangement state of the BG package is very diverse, when the ball receiving groove 13 is formed at a specific position as in the first embodiment, the adsorption of the package having a different ball arrangement is different. Therefore, there arises a problem that the vacuum pad must be replaced with the corresponding ball receiving groove 13 formed therein.

従ってこのような互換性の問題を克服するために通常的なビージーエーパッケージのボールピッチと同一なピッチで前記密着部１２の全面にボール受容溝１３を形成するものである。   Therefore, in order to overcome such a compatibility problem, the ball receiving grooves 13 are formed on the entire surface of the contact portion 12 at the same pitch as the ball pitch of a normal BG package.

図５は本発明による第３実施例の真空パッド５０を示し、前記密着部１２の中間部に凹溝１４を形成することでボール２１を受容、避けることができる構成である。   FIG. 5 shows a vacuum pad 50 according to a third embodiment of the present invention, which has a configuration in which the ball 21 can be received and avoided by forming the concave groove 14 in the intermediate portion of the contact portion 12.

即ち、前記密着部１２の中間部に沿って切開して凹溝１４を形成し、その結果前記密着部には内壁１２ａと外壁１２ｂに形成されるのである。従ってビージーエーパッケージ２０を吸着する場合、最外側に配列されるボールまたはその内側に配列されるボールが前記凹溝１４に受容、避けて入れられるし、前記外壁１２ｂはボールランド２２に、内壁１２ａはその内側のボールとボールの間の空間に密着される。   That is, an incision is made along the middle portion of the contact portion 12 to form the concave groove 14, and as a result, the contact portion is formed on the inner wall 12a and the outer wall 12b. Therefore, when the BG package 20 is adsorbed, the balls arranged on the outermost side or the balls arranged on the inner side are received and avoided in the concave groove 14, and the outer wall 12b is inserted into the ball land 22 and the inner wall 12a. Is in close contact with the space between the balls inside.

図６は図１に示した実施例に突起１５を付加して真空パッド６０を構成したものを示している。この突起１５は真空パッド６０と一体に形成されるのでその材質はやわらかいシリコンであることが望ましい。   FIG. 6 shows a vacuum pad 60 formed by adding protrusions 15 to the embodiment shown in FIG. Since the protrusion 15 is formed integrally with the vacuum pad 60, the material is preferably soft silicon.

前記突起１５は密着部１２と同一な高さでその内側で突出形成されたもので、吸着時ビーシーエーパッケージ２０によって圧縮されてから真空吸引力が破れると前記突起１５自体の復元力によって前記パッケージ２０が前記真空パッド６０から離型されるのを手伝う。   The protrusion 15 is formed so as to protrude at the same height as the close contact portion 12, and when the vacuum suction force is broken after being compressed by the BCA package 20 at the time of suction, the restoring force of the protrusion 15 itself causes the package to 20 is released from the vacuum pad 60.

前記では個別型真空パッドに対してのみ説明したが、多数個の真空パッドが一体に形成される一体型の場合にも本発明によるボール受容溝または凹溝の適用が可能であることは当然である。   In the above description, only the individual vacuum pad has been described. However, it is obvious that the ball receiving groove or the concave groove according to the present invention can be applied to an integrated type in which a large number of vacuum pads are integrally formed. is there.

以上で本発明の具体例に対してのみ詳細に説明したが、本発明の技術思想の範囲内で多様な変形及び修正が可能であることは当業者にとって明白なことで、このような変形及び修正が添付された特許請求の範囲に属することは当然なことである。   Although the present invention has been described in detail only for the specific examples of the present invention, it is obvious to those skilled in the art that various modifications and corrections are possible within the scope of the technical idea of the present invention. It will be appreciated that modifications are within the scope of the appended claims.

本発明による真空パッドの第１実施例の斜視図である。1 is a perspective view of a first embodiment of a vacuum pad according to the present invention. 本発明の第１実施例によってビージーエーパッケージを吸着することを示す分離斜視図。FIG. 3 is an exploded perspective view showing the adsorption of the BG package according to the first embodiment of the present invention. 本発明の第１実施例によってビージーエーパッケージを吸着した状態の断面図。Sectional drawing of the state which adsorb | sucked the BG package by 1st Example of this invention. 本発明による第２実施例の斜視図。The perspective view of 2nd Example by this invention. 本発明による第３実施例の斜視図。The perspective view of 3rd Example by this invention. 本発明による第４実施例の斜視図。The perspective view of 4th Example by this invention. 従来のビージーエーパッケージを吸着するチャックテーブルとそれに安着される個別型真空パッドの一例を示す斜視図。The perspective view which shows an example of the conventional chuck table which adsorb | sucks the conventional BG package, and the separate type | mold vacuum pad seated on it. 図７の真空パッドとビージーエーパッケージの分離斜視図。FIG. 8 is an exploded perspective view of the vacuum pad and the BG package of FIG. 7. 図８のビージーエーパッケージが真空パッドによって吸着される状態の断面図。FIG. 9 is a cross-sectional view of a state in which the BG package of FIG. 8 is adsorbed by a vacuum pad.

符号の説明Explanation of symbols

１０、３０、４０、５０、６０…真空パッド
１１…真空ホール
１２…密着部
１２a…内壁
１２b…外壁
１３…ボール受容溝
１４…凹溝
１５…突起
２０…ビーシーエーパッケージ
２１…ボール
２２…ボールランド
DESCRIPTION OF SYMBOLS 10, 30, 40, 50, 60 ... Vacuum pad 11 ... Vacuum hole 12 ... Close contact part 12a ... Inner wall 12b ... Outer wall 13 ... Ball receiving groove 14 ... Concave groove 15 ... Protrusion 20 ... BCE package 21 ... Ball 22 ... Ball land

Claims (6)

真空ラインが連結される真空ホールと、上部の外縁に突出形成された密着部を備えるビージーエーパッケージ真空パッドにおいて、
前記密着部にビージーエーパッケージのボールを受容できるボール受容溝が形成されることを特徴とするビージーエーパッケージ真空パッド。 In a BG package vacuum pad comprising a vacuum hole to which a vacuum line is connected and a close contact portion protruding from the outer edge of the upper part,
The BG package vacuum pad is characterized in that a ball receiving groove capable of receiving a ball of the BG package is formed in the contact portion. 前記密着部に接触される前記ボールによって前記ボール受容溝が１列または多数列で形成されることを特徴とする請求項１に記載のビージーエーパッケージ真空パッド。   2. The BG package vacuum pad according to claim 1, wherein the ball receiving grooves are formed in one row or multiple rows by the balls that are in contact with the close contact portion. 前記ボール受容溝は作業の対象になる前記ビージーエーパッケージのボール配列によってこれに対応できる位置に選択的に形成されることを特徴とする請求項１に記載のビージーエーパッケージ真空パッド。   The BG package vacuum pad according to claim 1, wherein the ball receiving groove is selectively formed at a position corresponding to the ball array of the BG package to be operated. 前記ボール受容溝が前記ビージーエーパッケージのボールの間のピッチと同一なピッチで前記密着部全面に形成されることを特徴とする請求項１に記載のビージーエーパッケージ真空パッド。   2. The BG package vacuum pad according to claim 1, wherein the ball receiving grooves are formed on the entire surface of the contact portion at the same pitch as the pitch between the balls of the BG package. 真空ラインが連結される真空ホールと、上部の外縁に突出形成される密着部を備えるビージーエーパッケージ真空パッドにおいて、
前記密着部にビージーエーパッケージのボールを受容できる凹溝が形成されることを特徴とするビージーエーパッケージ真空パッド。 In a BG package vacuum pad comprising a vacuum hole to which a vacuum line is connected and a close contact portion formed to protrude from the outer edge of the upper part,
The BG package vacuum pad is characterized in that a concave groove capable of receiving a ball of the BG package is formed in the close contact portion. 前記密着部の内側に突起がさらに付加されることを特徴とする請求項１または請求項５に記載の前記ビージーエーパッケージ真空パッド。
The BG package vacuum pad according to claim 1, wherein a protrusion is further added to the inside of the contact portion.
JP2005056907A 2004-03-04 2005-03-02 Bga package vacuum pad Pending JP2005252259A (en)

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Publication number Priority date Publication date Assignee Title
CN105628068A (en) * 2014-10-30 2016-06-01 宁波舜宇光电信息有限公司 Fixture preventing measurement deviation and manufacturing method thereof

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CN107685240A (en) * 2017-09-29 2018-02-13 深圳市宇顺电子股份有限公司 A kind of FPC placement platforms
CN110013931B (en) * 2019-04-26 2020-09-22 长江存储科技有限责任公司 Device and method for spraying ball grid array packaging part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105628068A (en) * 2014-10-30 2016-06-01 宁波舜宇光电信息有限公司 Fixture preventing measurement deviation and manufacturing method thereof

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