KR101566988B1 - Chuck table for processing semiconductor packages - Google Patents
Chuck table for processing semiconductor packages Download PDFInfo
- Publication number
- KR101566988B1 KR101566988B1 KR1020090083431A KR20090083431A KR101566988B1 KR 101566988 B1 KR101566988 B1 KR 101566988B1 KR 1020090083431 A KR1020090083431 A KR 1020090083431A KR 20090083431 A KR20090083431 A KR 20090083431A KR 101566988 B1 KR101566988 B1 KR 101566988B1
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- South Korea
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- semiconductor package
- group
- vacuum
- pad
- chuck table
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a chuck table for processing a semiconductor package, in which a semiconductor package strip can be stably fixed with high precision flatness when a semiconductor package mold part on a semiconductor package strip is processed into a blade. A chuck table for vacuum chucking a semiconductor package strip on which a plurality of semiconductor packages are arranged in a lattice form is provided, the chuck table including: a base on which a semiconductor package strip to be processed is placed; A group pad of a flexible material which is provided on the base and contacts and supports the bottom surface of the package group of the semiconductor package strip which is seated on the base; A plurality of supports formed inside the group pad on the base to support a lower surface between the semiconductor packages in the package group; And a plurality of vacuum holes for sucking air between the support portions to form a vacuum.
Semiconductor package, strip, mold, POP, group pad, chuck table
Description
BACKGROUND OF THE
2. Description of the Related Art [0002] In recent years, development of compact multi-applications having various functions such as mobile communication terminals, portable internet devices, portable multimedia terminals, and the like have been developed, and a multi chip package (MCP) ) And package on package (PoP) technology are being developed.
Among these, a package-on-package (PoP) technology is a technique of stacking and integrating packages containing one or more semiconductor chips, and typically, a plurality of solder balls for electrical connection are formed on the upper surface of the lower semiconductor package, And a solder ball formed on a lower surface of the upper semiconductor package is bonded to a solder ball of the lower semiconductor package when the upper semiconductor package is stacked on the upper side.
If warpage deformation occurs in the upper and lower semiconductor packages when the two semiconductor packages are bonded together by the package-on-package technology, the bonding between the solder balls and the solder balls of the upper and lower semiconductor packages is not accurately performed There is a high possibility of failure.
Therefore, at the time of manufacturing a lower semiconductor package, molding is carried out to a portion where the solder ball is formed in the molding process to minimize the warpage, and then a portion covered with the solder ball in the mold part of the semiconductor package is cut Thereby exposing the upper end of the solder ball to the outside and interconnecting the solder balls of the upper semiconductor package to the solder balls of the lower semiconductor package when stacking the upper semiconductor package.
When the mold part of the lower semiconductor packages is cut using the blades and the mold part is not machined to the correct depth, when the upper semiconductor packages are stacked on the lower semiconductor package, the lower solder ball and the upper solder ball are accurately It is not connected and a defect occurs. Therefore, when the mold part of the lower semiconductor packages is bladed, the lower semiconductor packages must be fixed with an accurate flatness.
In particular, a warpage phenomenon occurs in which a strip of semiconductor packages is bent after being subjected to a molding process. In this case, if the semiconductor package strip is fixed in a deformed state, So that it is required to flatten the semiconductor package strip and fix it with an accurate flatness.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor package which can stably fix a semiconductor package strip to a high precision flatness, The semiconductor package strip can be stably fixed with high accuracy and flatness even when the semiconductor package is produced.
According to an aspect of the present invention, there is provided a chuck table for vacuum-chucking a semiconductor package strip having a plurality of semiconductor packages arranged in a lattice form, A base; A group pad of a flexible material which is provided on the base and contacts and supports the bottom surface of the package group of the semiconductor package strip which is seated on the base; A support portion formed on the base on the inner side of the group pad to support a lower surface between the semiconductor packages in the package group; And a vacuum hole for sucking air between the support portions to form a vacuum.
The upper surface of the group pad is protruded to the outside of the upper end of the pad receiving groove and contacts the lower surface of the package group of the semiconductor package strip, .
According to another aspect of the present invention, there is provided a chuck table for vacuum-chucking a semiconductor package strip in which a plurality of semiconductor packages are arranged in a lattice form, the semiconductor package having a base on which the semiconductor package strip to be processed is seated; A group pad of a flexible material inserted into the base at a position corresponding to a rim of the package group of the semiconductor package strip and inside the pad receiving groove and supporting the semiconductor package strip along the rim of the package group of the semiconductor package strip; A supporting portion formed inside the group pad on the base to support a lower portion between the semiconductor packages in the package group and an outer lower portion of the semiconductor package disposed on the outer periphery; A vacuum hole for sucking air between the support portions to form a vacuum; And a side vacuum groove formed between the support portion of the outside of the support portion and the group pad.
Here, the group pad is inserted while completely filling the pad receiving groove, and the upper end of the group pad is flush with the upper surface of the base.
Further, a vacuum hole for sucking outside air into the side vacuum groove to form a vacuum may be additionally formed.
According to still another aspect of the present invention, an escape groove, in which a solder ball protruding from a lower surface of each of the semiconductor packages is received, is recessed between the support portions.
In the base, a side vacuum hole is formed along the outer side of the group pad for vacuum suction of the edge portion of the semiconductor package strip.
Preferably, the support portions are spaced apart from each other by a predetermined distance so as to allow air to flow, and the vacuum hole is formed only in a portion corresponding to a semiconductor package outside the package group of the semiconductor package strip.
According to the present invention, the semiconductor package strip is fixed by a vacuum adsorption method, in which the group pads entirely support the rim portion of each package group of the semiconductor package strip and the support portion fixes while supporting between the respective individual semiconductor packages , The semiconductor package strip is fixed on the chuck table while maintaining a high degree of flatness, and when the blade is brought into contact with the upper surface of the mold part of the semiconductor package strip, the part in contact with the blade is stably supported, .
In particular, even when a semiconductor package strip is deformed such as a warpage, both side portions of the semiconductor package strip can be vacuum-adsorbed on the base while spreading downward, so that the semiconductor package strip can be always fixed with a substantially constant flatness.
Hereinafter, preferred embodiments of a chuck table for processing a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.
First, for the sake of understanding, the structure of the semiconductor package strip processed in the semiconductor package processing chuck table of the present invention will be briefly described with reference to FIGS. 1 and 2. FIG.
1 and 2 show a finished
Each of the
Next, a first embodiment of a chuck table for processing semiconductor packages according to the present invention will be described with reference to Figs. 3 to 5. Fig.
3 and 4, the chuck table of the present invention includes a
A plurality of
The
The upper end of the
However, as shown in FIG. 5, in order to prevent the
The
The upper surface of the
The
A
The lower end of the
A plurality of
The chuck table according to the first embodiment configured as above operates as follows.
The
Subsequently, when an air suction force is generated through the
When vacuum pressure is generated through the
In this state, the blade B (see Figs. 6 and 7) rotates at a high speed on the upper side of the
Next, a second embodiment of the chuck table according to the present invention will be described with reference to Figs. 6 to 9. Fig.
The chuck table of this second embodiment includes an
A
A
Between the inner side of the
The chuck table of this second embodiment also includes a side vacuum hole 80 (also shown in the drawing) along the outer side of the
The chuck table of the second embodiment configured as above operates as follows.
When the
In this manner, in a state where the lower surface between the package group 3 of the
9 is a modification of the second embodiment described above. The basic configuration of the chuck table of this embodiment is the same as that of the second embodiment. However, in this embodiment, in order to further increase the vacuum pressure in the
As described above, the chuck table for processing a semiconductor package according to the present invention fixes the
1 is a plan view schematically showing an example of a processed semiconductor package strip on a chuck table according to the present invention.
2 is a sectional view taken along the line I-I in Fig. 1;
3 is a partial cross-sectional view of a chuck table for processing semiconductor packages according to the first embodiment of the present invention
Fig. 4 is a plan view showing a part of the chuck table of Fig.
5 is a cross-sectional view showing a modification of the chuck table of Fig. 3
6 is a cross-sectional view of a main portion of a chuck table for processing semiconductor packages according to a second embodiment of the present invention
Fig. 7 is a cross-sectional view showing a state in which the semiconductor package strip is seated and processed in the chuck table of Fig. 6
8 is a plan view showing a part of the chuck table of Fig.
9 is a cross-sectional view showing a modification of the chuck table of Fig. 6
Description of the Related Art [0002]
1: semiconductor package strip 2: circuit board
3: Package group 4: Semiconductor package
5: Solder ball 6: Solder ball
10, 110:
30, 130:
42:
60, 160: escape
80: Side vacuum hole B: Blade
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090083431A KR101566988B1 (en) | 2009-09-04 | 2009-09-04 | Chuck table for processing semiconductor packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090083431A KR101566988B1 (en) | 2009-09-04 | 2009-09-04 | Chuck table for processing semiconductor packages |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110025390A KR20110025390A (en) | 2011-03-10 |
KR101566988B1 true KR101566988B1 (en) | 2015-11-09 |
Family
ID=43932952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020090083431A KR101566988B1 (en) | 2009-09-04 | 2009-09-04 | Chuck table for processing semiconductor packages |
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KR (1) | KR101566988B1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101228461B1 (en) * | 2011-03-24 | 2013-01-31 | 한미반도체 주식회사 | A table for loading semiconductor package |
KR20130012631A (en) * | 2011-07-26 | 2013-02-05 | 한미반도체 주식회사 | Cutting device for led material and method for cutting led material |
KR101363992B1 (en) * | 2012-05-10 | 2014-02-18 | (주)윈팩 | Stacked semiconductor package and fabrication method of the same |
KR101334085B1 (en) * | 2012-05-11 | 2013-12-02 | 쿠어스텍아시아 유한회사 | Wafer supporting unit |
KR102457193B1 (en) * | 2018-05-29 | 2022-10-20 | (주)포인트엔지니어링 | Micro led adsorption body |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100614797B1 (en) * | 2005-03-24 | 2006-08-28 | 한미반도체 주식회사 | Chuck table for manufacturing semiconductor |
JP2007320124A (en) | 2006-05-31 | 2007-12-13 | Sharp Corp | Device and method for cutting brittle plate to be machined |
-
2009
- 2009-09-04 KR KR1020090083431A patent/KR101566988B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100614797B1 (en) * | 2005-03-24 | 2006-08-28 | 한미반도체 주식회사 | Chuck table for manufacturing semiconductor |
JP2007320124A (en) | 2006-05-31 | 2007-12-13 | Sharp Corp | Device and method for cutting brittle plate to be machined |
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KR20110025390A (en) | 2011-03-10 |
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