KR101566988B1 - Chuck table for processing semiconductor packages - Google Patents

Chuck table for processing semiconductor packages Download PDF

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Publication number
KR101566988B1
KR101566988B1 KR1020090083431A KR20090083431A KR101566988B1 KR 101566988 B1 KR101566988 B1 KR 101566988B1 KR 1020090083431 A KR1020090083431 A KR 1020090083431A KR 20090083431 A KR20090083431 A KR 20090083431A KR 101566988 B1 KR101566988 B1 KR 101566988B1
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KR
South Korea
Prior art keywords
semiconductor package
group
vacuum
pad
chuck table
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KR1020090083431A
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Korean (ko)
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KR20110025390A (en
Inventor
정현권
강대희
임재영
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한미반도체 주식회사
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Priority to KR1020090083431A priority Critical patent/KR101566988B1/en
Publication of KR20110025390A publication Critical patent/KR20110025390A/en
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Abstract

The present invention relates to a chuck table for processing a semiconductor package, in which a semiconductor package strip can be stably fixed with high precision flatness when a semiconductor package mold part on a semiconductor package strip is processed into a blade. A chuck table for vacuum chucking a semiconductor package strip on which a plurality of semiconductor packages are arranged in a lattice form is provided, the chuck table including: a base on which a semiconductor package strip to be processed is placed; A group pad of a flexible material which is provided on the base and contacts and supports the bottom surface of the package group of the semiconductor package strip which is seated on the base; A plurality of supports formed inside the group pad on the base to support a lower surface between the semiconductor packages in the package group; And a plurality of vacuum holes for sucking air between the support portions to form a vacuum.

Semiconductor package, strip, mold, POP, group pad, chuck table

Description

[0001] The present invention relates to a chuck table for processing semiconductor packages,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a chuck table for fixing a semiconductor package strip in the process of manufacturing a semiconductor package, and more particularly, To a chuck table for processing a semiconductor package capable of stably fixing a semiconductor package strip in a precise flatness when cutting a mold of a semiconductor package.

2. Description of the Related Art [0002] In recent years, development of compact multi-applications having various functions such as mobile communication terminals, portable internet devices, portable multimedia terminals, and the like have been developed, and a multi chip package (MCP) ) And package on package (PoP) technology are being developed.

Among these, a package-on-package (PoP) technology is a technique of stacking and integrating packages containing one or more semiconductor chips, and typically, a plurality of solder balls for electrical connection are formed on the upper surface of the lower semiconductor package, And a solder ball formed on a lower surface of the upper semiconductor package is bonded to a solder ball of the lower semiconductor package when the upper semiconductor package is stacked on the upper side.

If warpage deformation occurs in the upper and lower semiconductor packages when the two semiconductor packages are bonded together by the package-on-package technology, the bonding between the solder balls and the solder balls of the upper and lower semiconductor packages is not accurately performed There is a high possibility of failure.

Therefore, at the time of manufacturing a lower semiconductor package, molding is carried out to a portion where the solder ball is formed in the molding process to minimize the warpage, and then a portion covered with the solder ball in the mold part of the semiconductor package is cut Thereby exposing the upper end of the solder ball to the outside and interconnecting the solder balls of the upper semiconductor package to the solder balls of the lower semiconductor package when stacking the upper semiconductor package.

When the mold part of the lower semiconductor packages is cut using the blades and the mold part is not machined to the correct depth, when the upper semiconductor packages are stacked on the lower semiconductor package, the lower solder ball and the upper solder ball are accurately It is not connected and a defect occurs. Therefore, when the mold part of the lower semiconductor packages is bladed, the lower semiconductor packages must be fixed with an accurate flatness.

In particular, a warpage phenomenon occurs in which a strip of semiconductor packages is bent after being subjected to a molding process. In this case, if the semiconductor package strip is fixed in a deformed state, So that it is required to flatten the semiconductor package strip and fix it with an accurate flatness.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor package which can stably fix a semiconductor package strip to a high precision flatness, The semiconductor package strip can be stably fixed with high accuracy and flatness even when the semiconductor package is produced.

According to an aspect of the present invention, there is provided a chuck table for vacuum-chucking a semiconductor package strip having a plurality of semiconductor packages arranged in a lattice form, A base; A group pad of a flexible material which is provided on the base and contacts and supports the bottom surface of the package group of the semiconductor package strip which is seated on the base; A support portion formed on the base on the inner side of the group pad to support a lower surface between the semiconductor packages in the package group; And a vacuum hole for sucking air between the support portions to form a vacuum.

The upper surface of the group pad is protruded to the outside of the upper end of the pad receiving groove and contacts the lower surface of the package group of the semiconductor package strip, .

According to another aspect of the present invention, there is provided a chuck table for vacuum-chucking a semiconductor package strip in which a plurality of semiconductor packages are arranged in a lattice form, the semiconductor package having a base on which the semiconductor package strip to be processed is seated; A group pad of a flexible material inserted into the base at a position corresponding to a rim of the package group of the semiconductor package strip and inside the pad receiving groove and supporting the semiconductor package strip along the rim of the package group of the semiconductor package strip; A supporting portion formed inside the group pad on the base to support a lower portion between the semiconductor packages in the package group and an outer lower portion of the semiconductor package disposed on the outer periphery; A vacuum hole for sucking air between the support portions to form a vacuum; And a side vacuum groove formed between the support portion of the outside of the support portion and the group pad.

Here, the group pad is inserted while completely filling the pad receiving groove, and the upper end of the group pad is flush with the upper surface of the base.

Further, a vacuum hole for sucking outside air into the side vacuum groove to form a vacuum may be additionally formed.

According to still another aspect of the present invention, an escape groove, in which a solder ball protruding from a lower surface of each of the semiconductor packages is received, is recessed between the support portions.

In the base, a side vacuum hole is formed along the outer side of the group pad for vacuum suction of the edge portion of the semiconductor package strip.

Preferably, the support portions are spaced apart from each other by a predetermined distance so as to allow air to flow, and the vacuum hole is formed only in a portion corresponding to a semiconductor package outside the package group of the semiconductor package strip.

According to the present invention, the semiconductor package strip is fixed by a vacuum adsorption method, in which the group pads entirely support the rim portion of each package group of the semiconductor package strip and the support portion fixes while supporting between the respective individual semiconductor packages , The semiconductor package strip is fixed on the chuck table while maintaining a high degree of flatness, and when the blade is brought into contact with the upper surface of the mold part of the semiconductor package strip, the part in contact with the blade is stably supported, .

In particular, even when a semiconductor package strip is deformed such as a warpage, both side portions of the semiconductor package strip can be vacuum-adsorbed on the base while spreading downward, so that the semiconductor package strip can be always fixed with a substantially constant flatness.

Hereinafter, preferred embodiments of a chuck table for processing a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

First, for the sake of understanding, the structure of the semiconductor package strip processed in the semiconductor package processing chuck table of the present invention will be briefly described with reference to FIGS. 1 and 2. FIG.

1 and 2 show a finished semiconductor package strip 1 in which a semiconductor package strip 1 comprises a circuit board 2 in the form of an elongated rectangular plate and a plurality of packages arranged in the circuit board 2 (3), and a plurality of semiconductor packages (4) are arranged in a grid shape (mxn) in each package group (3). In the semiconductor package strip 1 illustrated in Fig. 1, four package groups 3 are formed, and in each package group 3, semiconductor packages 4 are formed in a 4x4 array (16 pieces).

Each of the semiconductor packages 4 has a plurality of solder balls 6 formed on the lower surface thereof. The solder balls 5 are formed on four sides of the respective semiconductor packages 4. The solder balls 5 are molded by the molding compound in the molding process, The upper portion of the molding compound is exposed to the outside as shown in Fig. 2 while being cut.

Next, a first embodiment of a chuck table for processing semiconductor packages according to the present invention will be described with reference to Figs. 3 to 5. Fig.

3 and 4, the chuck table of the present invention includes a base block 20 made of a metal such as SUS and a lower base block 30 coupled to a lower portion of the upper base block 20. [ (10).

A plurality of pad receiving grooves 22 are formed on the upper surface of the upper base block 20 along a portion corresponding to a rim of each package group 3 of the semiconductor package strip 1, On the inside of the receiving groove 22, there is provided a group pad 40 of a flexible material for supporting the rim of the package group 3 of the semiconductor package strip 1. [

The group pad 40 has a generally rectangular shape and is made of a flexible material such as rubber or silicone so that the semiconductor package strip 1 is contracted when the semiconductor package strip 1 is vacuum-adsorbed on the upper base block 20, And supports the lower surface of the package group (3).

The upper end of the group pad 40 is slightly exposed above the upper surface of the upper base block 20 so as to be in direct contact with the lower surface of the semiconductor package strip 1. [ Further, it is preferable that the side walls 42 are formed in a corrugated shape so that the group pad 40 can smoothly shrink upward and downward when vacuum pressure is formed. When the sidewall 42 of the group pad 40 is formed in a corrugated shape, vacuum pressure is formed in the inner space of the group pad 40, so that when the semiconductor package strip 1 is adsorbed, the corrugated sidewalls do not spread sideways There is an advantage that it is possible to prevent the side wall 42 from being in contact with or caught by the upper end of the outer wall surface of the pad accommodating groove 22. [

However, as shown in FIG. 5, in order to prevent the side wall 42a of the group pad 40 from contacting the upper end of the outer wall surface of the pad receiving groove 22, The side wall 42a may be formed to be inclined outward at a predetermined angle.

The pad accommodating groove 22 in which the group pad 40 is provided is formed to have a width greater than the width of the side wall of the group pad 40 so that the upper end of the group pad 40 is not contacted when the group pad 40 is retracted. .

The upper surface of the upper base block 20 is provided with a plurality of support portions 50 for supporting the lower surface between the semiconductor packages 4 of the semiconductor package strip 1 in the inner space of the group pad 40, And an escape groove 60 corresponding to the size of each semiconductor package 4 is formed between the supporting portions 50. In addition, 2) protruding from the lower surface of each semiconductor package 4 when the semiconductor package strip 1 is seated on the upper base block 20 and the solder ball 6 (6), and forms a space for vacuum formation.

The support portions 50 may be integrally connected to each other. However, as shown in FIG. 4, the support portions 50 may be separated from each other by a predetermined distance to form a space through which the air can flow through the support portions 50 desirable.

A vacuum hole 70 for forming a vacuum is formed in the center of the escape groove 60 so as to penetrate up and down. Here, the vacuum hole 70 may be formed in all the escape grooves 60, but may be formed in the package group 3 of the semiconductor package strip 1 so that a larger vacuum pressure may be generated on the outer side of the package group 3 And is formed only on a portion corresponding to the outer semiconductor package. For example, when 16 semiconductor packages 4 are arranged in 4x4 in one package group 3 as shown in Fig. 1, 12 semiconductor packages 4 in the outer side and corresponding escape grooves A vacuum hole 70 is formed only in a part of the recess 60 and a vacuum hole 70 is not formed in the center of four escape grooves 60. Even if the vacuum hole 70 is not formed in the center of the escape groove 60 as described above, since the support portions 50 are separated from each other and the escape grooves 60 are communicated with each other, Are moved to the outer escape grooves 60 through the spaces between the supports 50, so that a vacuum pressure can be formed, so that there is no problem in forming the vacuum pressure.

The lower end of the vacuum hole 70 communicates with a vacuum passage 71 formed between the lower end of the upper base block 20 and the upper surface of the lower base block 30, Pressure line (72) connected to the lower portion of the main body (30).

A plurality of side vacuum holes 80 are formed in the upper base block 20 along the outer side of the group pad 40 to vacuum adsorb the edge portions of the semiconductor package strip 1. [ The lower end of the side vacuum hole (80) communicates with the vacuum passage (71) to form a vacuum pressure.

The chuck table according to the first embodiment configured as above operates as follows.

The semiconductor package strip 1 subjected to the molding process is conveyed by the picker to be seated on the upper surface of the upper base block 20. At this time, the rim of each package group 3 of the semiconductor package strip 1 is seated on the upper end of the group pad 40.

Subsequently, when an air suction force is generated through the pneumatic line 72, air is introduced through the vacuum hole 70 and the side vacuum hole 80, and vacuum pressure is formed in the space inside the group pad 40, The strip 1 is brought into close contact with the upper surface of the upper base block 20. Even if the semiconductor package strip 1 is warped and warped, the edges of the semiconductor package strip 1 are also separated from the upper base block 20 by the suction force generated through the side vacuum holes 80. Therefore, As shown in Fig. In addition, since the vacuum holes 70 are disposed only at the outer periphery of the package group 3, even when an air suction force is generated inside the group pad 40, a large vacuum pressure is generated at the outer side of the group pad 40, There is an effect that the both sides of the strip 1 can be vacuum-adsorbed while spreading downward.

When vacuum pressure is generated through the vacuum hole 70 and the side vacuum hole 80 and the semiconductor package strip 1 is brought into close contact with the upper surface of the upper base block 20, And the lower surface between the semiconductor packages 4 is held in contact with the support portion 50.

In this state, the blade B (see Figs. 6 and 7) rotates at a high speed on the upper side of the semiconductor package strip 1, and the mold part between the semiconductor packages 4 (see Fig. 1) is cut.

Next, a second embodiment of the chuck table according to the present invention will be described with reference to Figs. 6 to 9. Fig.

The chuck table of this second embodiment includes an upper base block 120 and a lower base block 130 coupled to the upper base block 120, as in the above embodiment. A vacuum flow path 171 is formed between the upper base block 120 and the lower base block 130. The vacuum flow path 171 includes a pneumatic line 172 connected to a lower portion of the lower base block 130, Lt; / RTI >

A pad accommodating groove 122 is formed in the upper base block 120 along the rim of the package group 3 (see FIG. 1) of the semiconductor package strip 1, 3, a flexible rubber member group pad 140 for supporting the rim portion is inserted and installed. The group pad 140 is completely filled in the pad receiving groove 122 and the upper end of the group pad 140 is substantially flush with the upper surface of the upper base block 120.

A support portion 150 for supporting the space between the semiconductor packages 4 is formed in the inner space of the group pad 140. In this second embodiment, the support portion 150 is provided only between the semiconductor packages 4 But also along the inner side of the group pad 140 so as to support the outer lower portion of the semiconductor package 4 disposed at the outer periphery.

Between the inner side of the group pad 140 and the outer supporting part 150, a side vacuum groove 162 for increasing the suction force to the rim of the package group 3 is recessed. The side vacuum groove 162 communicates with the escape grooves 160 between the supporting portions 150 through a space formed between the supporting portions 150. Therefore, when the air suction force is generated through the vacuum hole 170 formed at the center of the escape groove 160, the air in the side vacuum groove 162 flows into the escape groove 160 through the space between the supports 150, Vacuum pressure is also generated in the groove 162, and the rim of the package group 3 is strongly attracted to the vacuum.

The chuck table of this second embodiment also includes a side vacuum hole 80 (also shown in the drawing) along the outer side of the group pad 140 of the upper base block 120 to vacuum adsorb the edge portion of the semiconductor package strip 1 3 and FIG. 4) may be additionally formed.

The chuck table of the second embodiment configured as above operates as follows.

When the semiconductor package strip 1 is mounted on the upper base block 120 by the picker, an air suction force is generated through the vacuum hole 170 at the center of each escape groove 160, and the semiconductor package strip 1 And is in close contact with the upper surface of the upper base block 120. At this time, the bottom surface of the package group 3 of the semiconductor package strip 1 is in close contact with the upper end of the group pad 140, and the lower surface between the semiconductor packages 4 and the lower surface of the outer- And is supported by the support portion 150 in close contact with each other.

In this manner, in a state where the lower surface between the package group 3 of the semiconductor package strip 1 and each semiconductor package 4 is stably supported by the group pad 140 and the supporting portion 150, At the top of the strip 1, the blade B cuts the mold part of the semiconductor package strip 1 to a desired precise depth so that the solder balls 5 of the semiconductor packages 4 are exposed to the outside.

9 is a modification of the second embodiment described above. The basic configuration of the chuck table of this embodiment is the same as that of the second embodiment. However, in this embodiment, in order to further increase the vacuum pressure in the side vacuum groove 162, the side vacuum hole 162 is further provided with a side vacuum hole 180 communicating with the lower vacuum passage 171 .

As described above, the chuck table for processing a semiconductor package according to the present invention fixes the semiconductor package strip 1 in a vacuum adsorption manner so that group pads 40 and 140 are connected to each package group 3 of the semiconductor package strip 1, The semiconductor package strips 1 are supported on the chuck table while maintaining the flatness of the semiconductor package strips 1 with a high degree of flatness while supporting the edge portions of the semiconductor package strips 1, Even when cutting the blade B by cutting the blade B in contact with the upper surface of the mold part of the semiconductor package strip 1, the portion where the blade B contacts is stably supported, thereby improving the machining accuracy.

1 is a plan view schematically showing an example of a processed semiconductor package strip on a chuck table according to the present invention.

2 is a sectional view taken along the line I-I in Fig. 1;

3 is a partial cross-sectional view of a chuck table for processing semiconductor packages according to the first embodiment of the present invention

Fig. 4 is a plan view showing a part of the chuck table of Fig.

5 is a cross-sectional view showing a modification of the chuck table of Fig. 3

6 is a cross-sectional view of a main portion of a chuck table for processing semiconductor packages according to a second embodiment of the present invention

Fig. 7 is a cross-sectional view showing a state in which the semiconductor package strip is seated and processed in the chuck table of Fig. 6

8 is a plan view showing a part of the chuck table of Fig.

9 is a cross-sectional view showing a modification of the chuck table of Fig. 6

Description of the Related Art [0002]

1: semiconductor package strip 2: circuit board

3: Package group 4: Semiconductor package

5: Solder ball 6: Solder ball

10, 110: base 20, 120: upper base block

30, 130: lower base block 40, 140: group pad

42: side wall 50, 150: support

60, 160: escape grooves 70, 170: vacuum hole

80: Side vacuum hole B: Blade

Claims (10)

A chuck table for vacuum-adsorbing a semiconductor package strip on which a plurality of semiconductor packages are arranged in a lattice form, A base on which a semiconductor package strip to be processed is seated; A group pad of a flexible material which is provided on the base and contacts and supports the bottom surface of the package group of the semiconductor package strip which is seated on the base; A support portion formed on the base on the inner side of the group pad to support a lower surface between the semiconductor packages in the package group; And a vacuum hole for sucking air between the support portions to form a vacuum, Wherein each of the support portions is spaced apart from each other by a predetermined distance so as to allow air to flow therethrough. 2. The semiconductor package according to claim 1, wherein the group pad is provided inside the pad accommodating groove formed concavely in the base, and the upper end of the group pad protrudes outward from the upper end of the pad accommodating groove, Of the chuck table. The chuck table according to any one of claims 1 to 3, wherein each side wall of the group pad is formed into a wrinkle shape so as to be stretchable up and down according to vacuum formation. A chuck table for vacuum-adsorbing a semiconductor package strip on which a plurality of semiconductor packages are arranged in a lattice form, A base on which a semiconductor package strip to be processed is seated; A group pad of a flexible material inserted into the base at a position corresponding to a rim of the package group of the semiconductor package strip and inside the pad receiving groove and supporting the semiconductor package strip along the rim of the package group of the semiconductor package strip; A supporting portion formed inside the group pad on the base to support a lower portion between the semiconductor packages in the package group and an outer lower portion of the semiconductor package disposed on the outer periphery; A vacuum hole for sucking air between the support portions to form a vacuum; And a side vacuum groove formed between the support portion of the outer side of the support portion and the group pad. The chuck table according to claim 4, wherein the group pad is inserted while completely filling the pad receiving groove, and the upper end of the group pad is flush with the upper surface of the base. The chuck table according to claim 4, wherein a vacuum hole is formed in the side surface vacuum groove to absorb external air to form a vacuum. The chuck table according to any one of claims 1 to 4, wherein an escape groove, in which a solder ball protruding from a lower surface of each of the semiconductor packages is received, is recessed between the support portions. The chuck table according to any one of claims 1 to 4, wherein a side vacuum hole is formed in the base along the outer side of the group pad for vacuum suction of an edge portion of the semiconductor package strip. The chuck table according to claim 4, wherein each of the support portions is spaced apart from each other by a predetermined distance so that air can flow. 5. The chuck table according to any one of claims 1 to 4, wherein the vacuum holes are formed only in a portion of the package group of the semiconductor package strip corresponding to the outer semiconductor package.
KR1020090083431A 2009-09-04 2009-09-04 Chuck table for processing semiconductor packages KR101566988B1 (en)

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Application Number Priority Date Filing Date Title
KR1020090083431A KR101566988B1 (en) 2009-09-04 2009-09-04 Chuck table for processing semiconductor packages

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KR101566988B1 true KR101566988B1 (en) 2015-11-09

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101228461B1 (en) * 2011-03-24 2013-01-31 한미반도체 주식회사 A table for loading semiconductor package
KR20130012631A (en) * 2011-07-26 2013-02-05 한미반도체 주식회사 Cutting device for led material and method for cutting led material
KR101363992B1 (en) * 2012-05-10 2014-02-18 (주)윈팩 Stacked semiconductor package and fabrication method of the same
KR101334085B1 (en) * 2012-05-11 2013-12-02 쿠어스텍아시아 유한회사 Wafer supporting unit
KR102457193B1 (en) * 2018-05-29 2022-10-20 (주)포인트엔지니어링 Micro led adsorption body

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100614797B1 (en) * 2005-03-24 2006-08-28 한미반도체 주식회사 Chuck table for manufacturing semiconductor
JP2007320124A (en) 2006-05-31 2007-12-13 Sharp Corp Device and method for cutting brittle plate to be machined

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100614797B1 (en) * 2005-03-24 2006-08-28 한미반도체 주식회사 Chuck table for manufacturing semiconductor
JP2007320124A (en) 2006-05-31 2007-12-13 Sharp Corp Device and method for cutting brittle plate to be machined

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