JP2018129401A - Semiconductor manufacturing equipment and method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that, when a die is pushed up by a push-up unit, the die is deformed to be deflected to the bottom of a suction surface of a collet and a leakage may be caused.SOLUTION: Semiconductor manufacturing equipment includes a wafer holding table holding a wafer and a collet part sucking a die from the wafer holding table. The collet part includes a collet and a collet holder holding the collet. The collet includes: a first portion in contact with the die; a second portion held by the collet holder; a third portion connecting between the central portion of the first portion and the central portion of the second portion; a first suction hole penetrating through the first portion, the third portion and the second portion. The first portion is deformable to follow the deflection of the die.SELECTED DRAWING: Figure 8

Description

  The present disclosure relates to a semiconductor manufacturing apparatus and can be applied to, for example, a die bonder including a collet.

  Generally, in a die bonder in which a semiconductor chip called a die is mounted on the surface of, for example, a wiring board or a lead frame (hereinafter collectively referred to as a board), the die is generally used by using a suction nozzle such as a collet. The operation (work) of transporting the substrate onto the substrate, applying a pressing force, and performing bonding by heating the bonding material is repeatedly performed.

  In the die bonding process by a semiconductor manufacturing apparatus such as a die bonder, there is a peeling process for peeling a divided die from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling step, the die is pushed up from the back surface of the dicing tape by the pushing-up unit, peeled off one by one from the dicing tape held in the die supply unit, and conveyed onto the substrate using a suction nozzle such as a collet.

Japanese Patent Laying-Open No. 2015-76410

When the die is pushed up by the push-up unit, the die may be deformed to be bent below the suction surface of the collet, thereby causing a leak.
An object of the present disclosure is to provide a semiconductor manufacturing apparatus that does not lose a vacuum adsorption force due to leakage even when a die is deformed.
Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

An outline of typical ones of the present disclosure will be briefly described as follows.
That is, the semiconductor manufacturing apparatus includes a wafer holding table for holding a wafer and a collet portion for sucking a die from the wafer holding table. The collet portion includes a collet and a collet holder that holds the collet. The collet includes a first part in contact with the die, a second part held by the collet holder, a third part connecting the central part of the first part and the central part of the second part, and the first part And a first suction hole penetrating the third portion and the second portion. The first portion can be deformed following the deflection of the die.

  According to the semiconductor manufacturing apparatus, it is possible to reduce leakage.

Conceptual diagram of the die bonder according to the embodiment as seen from above FIG. 1 is a view for explaining operations of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. The figure which shows the external appearance perspective view of the die | dye supply part of FIG. Schematic cross-sectional view showing the main part of the die supply unit of FIG. Top view of the push-up unit of FIG. Sectional drawing of collet part and push-up unit according to comparative example Bottom view of collet section according to comparative example Sectional drawing explaining the collet part which concerns on an Example Sectional drawing explaining the collet part which concerns on an Example Sectional drawing and top view explaining the collet holder which concerns on an Example Sectional drawing and top view explaining the suction cup collet which concerns on an Example Sectional drawing and top view explaining the suction cup collet which concerns on an Example Sectional drawing of collet part and push-up unit according to embodiment Flowchart for explaining the pick-up operation of the die bonder according to the embodiment Sectional drawing of collet part and substrate according to example 6 is a flowchart showing a method for manufacturing a semiconductor device according to an embodiment. Sectional drawing for demonstrating the concept of the die bonder which concerns on the modification 1. Sectional drawing for demonstrating the assist means of the die bonder which concerns on the modification 1. Sectional drawing and top view explaining suction cup collet according to modification 2 Sectional drawing and top view explaining sucker collet according to modification 3 Sectional drawing and top view explaining suction cup collet according to modification 4 Sectional drawing and top view explaining suction cup collet according to modification 5 Sectional drawing and top view explaining suction cup collet according to modification 6

  Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be denoted by the same reference numerals and repeated description may be omitted. In order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to the actual embodiment, but are merely examples, and the interpretation of the present invention is not limited to them. It is not limited.

  FIG. 1 is a top view schematically illustrating a die bonder according to an embodiment. FIG. 2 is a diagram for explaining the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

  The die bonder 10 roughly divides the die supply unit 1, the pickup unit 2, the intermediate stage unit 3, the bonding unit 4, the transfer unit 5, the substrate supply unit 6, the substrate carry-out unit 7, and monitors the operation of each unit. And a control unit 8 for controlling.

  First, the die supply unit 1 supplies a die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a dotted line that pushes up the die D from the wafer 11. The die supply unit 1 is moved in the XY directions by a driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

  The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and each drive unit (not shown) that moves the collet unit 22 up and down, rotates, and moves in the X direction. And having. The pickup head 21 has a collet portion 22 (see also FIG. 2) that sucks and holds the pushed up die D at the tip, picks up the die D from the die supply portion 1, and places it on the intermediate stage 31. The pickup head 21 has driving units (not shown) that move the collet unit 22 up and down, rotate, and move in the X direction.

  The intermediate stage unit 3 includes an intermediate stage 31 on which the die D is temporarily placed and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds the die D on the transported substrate P or laminates the die D on the die already bonded on the substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) for attracting and holding the die D at the tip, similarly to the pickup head 21, a Y driving unit 43 for moving the bonding head 41 in the Y direction, It has a substrate recognition camera 44 that images a position recognition mark (not shown) of the substrate P and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. Bond die D to P.

The transport unit 5 includes a substrate transport pallet 51 on which one or a plurality of substrates P (four in FIG. 1) are placed, and a pallet rail 52 on which the substrate transport pallet 51 moves, and is provided in parallel. And the first and second transfer units having the same structure. The substrate transfer pallet 51 is moved by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.
With such a configuration, the substrate transport pallet 51 places the substrate P on the substrate supply unit 6, moves to the bonding position along the pallet rail 52, moves to the substrate unloading unit 7 after bonding, and unloads the substrate. Pass the substrate P to the unit 7. The first and second transfer units are driven independently of each other, and while the die D is being bonded to the substrate P placed on one substrate transfer pallet 51, the other substrate transfer pallet 51 carries out the substrate P. Returning to the substrate supply unit 6, preparations such as mounting a new substrate P are made.

  The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each unit of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

  Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing the main part of the die supply unit.

  The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holder 12 includes an expand ring 15 that holds the wafer ring 14 and a support ring 17 that horizontally positions the dicing tape 16 that is held by the wafer ring 14 and to which a plurality of dies D are bonded. The push-up unit 13 is disposed inside the support ring 17.

  The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the die D is pushed up from below the die D by the push-up unit 13 to improve the pick-up property of the die D. Note that the adhesive that bonds the die to the substrate in accordance with the reduction in thickness is changed from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. Yes. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. Hereinafter, the peeling process will be described ignoring the presence of the die attach film 18.

  Next, the push-up unit will be described with reference to FIG. FIG. 5 is a top view of the push-up unit of FIG.

  The push-up unit 13 roughly includes a push-up block portion 131 and a peripheral portion 132 that surrounds the push-up block portion 131. The push-up block 131 has a first block 131a and a second block 131b located inside the first block 131a. The peripheral portion 132 has a plurality of suction holes 132a.

  Next, a technique (hereinafter referred to as a comparative example) studied by the inventors of the present application will be described with reference to FIGS. FIG. 6 is a longitudinal sectional view showing a collet portion and a push-up unit according to a comparative example. FIG. 7 is a bottom view of the collet portion of FIG.

  As shown in FIG. 6, the collet portion 22R includes a rubber chip 25R and a rubber chip holder 24R that holds the rubber chip 25R. The rubber chip 25R is provided with a vacuum suction hole 251R. A vacuum suction hole 26R is provided at the center of the rubber chip holder 24R, and a vacuum suction groove 27R is provided on the upper surface side of the rubber chip 25R of the rubber chip holder 24R. As shown in FIG. 7, the rubber chip 25 </ b> R has a rectangular shape similar to that of the die D in plan view, and has the same size as the die D. The rubber chip 25R has a thickness of about 5 mm. The push-up unit 13 is the same as the push-up unit 13 of the embodiment.

  The pickup operation according to the comparative example starts when the target die D (separation target die) on the dicing tape 16 is positioned on the push-up unit 13 and the collet portion 22R. When the positioning is completed, the dicing tape 16 is attracted to the upper surface of the push-up unit 13 by evacuating through the suction holes 132a of the push-up unit 13 and the gaps 131c and 131d. In this state, the collet portion 22R descends while evacuating toward the device surface of the die D, and lands. Here, when the push-up block 131, which is the main part of the push-up unit 13, rises, the die D rises while being sandwiched between the collet portion 22R and the push-up block 131, but the peripheral portion of the dicing tape 16 is pushed. Since vacuum suction is still performed on the peripheral portion 132 of the raised block portion 131, tension is generated around the die D, and as a result, the dicing tape 16 is peeled around the die D. However, at this time, the periphery of the die D is stressed downward and curved. As a result, a gap is formed between the lower surface of the collet, and air flows into the vacuum suction system of the collet portion 22R (leakage occurs). Once the die D is leaked and separated, the die D bent below the suction surface cannot be held again.

  In a stacked package in which a plurality of dies are three-dimensionally mounted on a wiring board, the die thickness is required to be thinner than about 20 μm (for example, 10 to 15 μm) in order to prevent an increase in package thickness. As a result, the die is easily bent.

  Next, the collet part which concerns on an Example is demonstrated using FIGS. FIG. 8 is a cross-sectional view illustrating the collet portion according to the embodiment, and is a view showing a state before the suction cup collet is mounted. FIG. 9 is a cross-sectional view illustrating the collet portion according to the embodiment, and is a view showing a state after the suction cup collet is mounted. 10A and 10B are diagrams illustrating the collet holder according to the embodiment. FIG. 10A is a cross-sectional view taken along line A1-A2 of FIG. 10B, FIG. 10B is a plan view, and FIG. It is a top view showing only a support part. 11A and 11B are diagrams for explaining the suction cup collet (when the die size is large) according to the embodiment. FIG. 11A is a cross-sectional view taken along line A1-A2 of FIG. 11B, and FIG. 12A and 12B are diagrams for explaining the suction cup collet (when the die size is small) according to the embodiment. FIG. 12A is a cross-sectional view taken along line A1-A2 of FIG. 12B, and FIG.

  The collet portion 22 includes a suction cup collet 221 and a collet holder 222 that holds the suction cup collet 221.

  The suction cup collet 221 is made of, for example, silicon rubber, and has a suction cup part (first part) 221a for sucking the die D, a holding part (second part) 221b inserted into the collet holder 222, and a vacuum suction hole (first suction). Hole) 221c provided with a connecting portion (third portion) 221d. The suction cup 221a has a rectangular shape similar to that of the die D and is smaller than the die D. The thickness of the suction cup part 221a is 0.5-1 mm.

  The collet holder 222 fixes and releases the space portion 222a into which the holding portion 221b is inserted, the tubular portion 222b extending upward from the space portion 222a, the outer peripheral portion 222c that holds the periphery of the suction cup portion 221a, and the holding portion 221b. And a lever 222d to perform. A vacuum suction hole (second suction hole) 222e is provided at the center of the tubular portion 222b, and is configured to be connected to the vacuum suction hole 221c. A spring 222f is attached to the lever 222d and its rotating shaft, and the lever 222d is biased in the direction of the arrow by the biasing force of the spring 222f.

  When the suction cup collet 221 is put in the collet holder 222 and the lever 222d is released, the suction cup collet 221 is held by the force of the spring 222f. The suction cup collet 221 can be easily removed by grasping the lever 222d. As shown in FIG. 10C, the lateral direction and θ-direction alignment are automatically performed with the side surface of the holding portion 221b of the suction cup collet 221 serving as a guide. FIG. 10C shows a state before the holding portion 221b is fixed by the lever 222d.

  The outer periphery of the bottom surface of the suction cup collet 221 (suction cup portion 221a) has a rectangular shape similar to that of the die D, and is approximately the same size as the die D. The outer periphery of the bottom surface of the suction cup 221a may be slightly larger than the die D or slightly smaller. As shown in FIG. 11, when the size of the die D is large, the suction cup part 221a is enlarged, and as shown in FIG. 12, when the size of the die D is small, the suction cup part 221a is reduced. The collet holder 222 is common regardless of the size of the die D, and the size change of the die D can be handled by preparing a suction cup collet in which only the size of the suction cup portion 221a of the suction cup collet 221 is changed. In FIG. 11, the area of the bottom surface of the collet holder 222 is approximately the same as the area of the bottom surface of the suction cup 221 a, but in FIG. 12, the area of the bottom surface of the suction cup 221 a is larger than the area of the bottom surface of the collet holder 222. small. The holding part 221b has a rectangular shape in plan view. In FIGS. 11 and 12, the area of the upper surface of the holding part 221b is smaller than the area of the bottom surface of the suction cup part 221a. The connecting section 221d has an annular cross section, and the annular outer diameter is smaller than that of the holding section 221b.

  Next, the pickup operation by the collet portion according to the embodiment will be described with reference to FIGS. FIG. 13 is a cross-sectional view of the collet portion and the push-up unit according to the embodiment. FIG. 14 is a flowchart showing the processing flow of the pickup operation.

  Step S1: The controller 8 moves the wafer holder 12 so that the die D to be picked up is positioned directly above the push-up unit 13, and positions the separation target die on the push-up unit 13 and the collet unit 22. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. At this time, as shown in FIG. 13A, the control unit 8 causes the blocks 131a and 131b of the push-up block part 131 to form the same plane as the surface of the peripheral part 132, and the suction hole of the peripheral part 132 The dicing tape 16 is attracted to the upper surface of the push-up unit 13 by evacuating through the gaps 131c and 131d between the block 132a and the block.

  Step S2: As shown in FIG. 13 (A), the control unit 8 lowers the collet unit 22 while evacuating it, lands on the die D to be peeled, presses against the die D, and sets the vacuum suction hole 221c. The die D is adsorbed by the suction cup 221a and the vacuum suction hole 221c.

  Step S3: The controller 8 raises the first block 131a and the second block 131b of the push-up block 131, which is the main part of the push-up unit 13. As a result, the die D rises while being sandwiched between the collet portion 22 and the push-up block portion 131, but the peripheral portion of the dicing tape 16 remains vacuum adsorbed on the peripheral portion 132 of the push-up block portion 131. As a result, the dicing tape 16 is peeled around the die D. However, at this time, as shown in FIG. 13B, the periphery of the die D is subjected to stress on the lower side and is curved, but the sucker portion 221a is thin and soft so that the suction cup is adapted to the bending of the die D. The suction cup 221a of the collet 221 follows to suppress the occurrence of leak. At this time, the peripheral portion of the suction cup portion 221 a is separated from the bottom surface of the collet holder 222. The push-up height of the push-up block 131 is smaller than the push-up height of the comparative example.

  Step S4: The control unit 8 raises the collet unit 22. As a result, the die D is peeled off from the dicing tape 16 as shown in FIG.

  Step S5: The control unit 8 causes the blocks 131a and 131b of the push-up block part 131 to form the same plane as the surface of the peripheral part 132, and the suction holes 132a of the peripheral part 132 and the gaps 131c and 131d between the blocks. The adsorption of the dicing tape 16 is stopped. The controller 8 moves the push-up unit 13 so that the upper surface of the push-up block 131 is separated from the back surface of the dicing tape 16.

  The controller 8 repeats steps S1 to S5 to pick up a good die on the wafer 11.

  The collet unit according to the embodiment is mounted on the pickup head 21 and picks up the die D from the die supply unit 1 and places it on the intermediate stage 31, but it is also used as a collet for a bonding head for bonding to the substrate P or the like. be able to. FIG. 15 is a cross-sectional view of the collet portion and the substrate. As shown in FIG. 15, the upper surface of the suction cup portion 221a of the suction cup collet 221 is in contact with the bottom surface of the collet holder 222 (the outer peripheral portion 222c and the bottom surface of the lever 222d), so that bonding to the substrate P or the like is possible.

  Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIGS. FIG. 16 is a flowchart showing a method for manufacturing a semiconductor device.

  Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control unit 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Also, the substrate P is prepared and carried into the die bonder 10. The control unit 8 places the substrate P on the substrate transport pallet 51 by the substrate supply unit 6.

  Step S12: The control unit 8 picks up the die divided in steps S1 to S5 from the wafer.

  Step S13: The controller 8 stacks the picked up die on the substrate P mounted or already bonded. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds the die D to the conveyed substrate P.

  Step S <b> 14: The control unit 8 takes out the substrate P to which the die D is bonded from the substrate transfer pallet 51 in the substrate carry-out unit 7. The substrate P is unloaded from the die bonder 10.

  The collet according to the embodiment is provided with a vacuum suction hole only at the center of the collet, and the remaining outer peripheral portion has a suction cup structure that is easily deformed. Moreover, the structure which can remove a collet from a collet holder by one-touch is provided.

  Since it is possible to prevent a decrease in collet holding force due to a leak, it is possible to pick up at a low push-up height. Since the vacuum suction hole is provided only at the center, no structural design depending on the die size is required. The holder structure that prevents the upward deformation can be used for bonding. Since the push-up amount can be reduced, the stress of the die can be reduced.

<Modification>
Hereinafter, some typical modifications will be exemplified. In the following description of the modified examples, the same reference numerals as those in the above-described embodiments can be used for portions having the same configurations and functions as those described in the above-described embodiments. And about description of this part, the description in the above-mentioned Example shall be used suitably in the range which is not technically consistent. In addition, a part of the above-described embodiments and all or a part of the plurality of modified examples can be appropriately combined in a range not technically inconsistent.

(Modification 1)
In the embodiment, the push-up unit 13 is used when the die D is peeled from the dicing tape 16, but other means for assisting the suction of the collet may be used instead of the push-up unit 13. A die bonder according to Modification 5 using this means will be described with reference to FIGS.

  FIG. 17 is a cross-sectional view for explaining the concept of a die bonder in Modification 1. FIG. 17 (A) is FIG. 13 (A), FIG. 17 (B) is FIG. 13 (B), and FIG. ) Corresponds to FIG. FIG. 18 is a cross-sectional view for explaining assist means of a die bonder according to a modification.

  As shown in FIG. 17A, the control unit 8 lowers the collet unit 22 while evacuating it, lands on the die D to be peeled off, and presses against the die D to have a suction unit 221c having a vacuum suction hole 221c. The die D is adsorbed by the 221a and the vacuum suction hole 221c.

  As shown in FIG. 17B, the controller 8 deforms the dicing tape 16 by the same assist means as that for raising the push-up block 131 when raising the collet 22 adsorbing the die D.

  As shown in FIG. 17C, the control unit 8 raises the collet unit 22 and separates the die D from the dicing tape 16.

  As shown in FIG. 18 (A), the control unit 8 assists the die D by inflating the balloon structure 13A simultaneously with the raising of the collet unit 22.

  As shown in FIG. 18B, the control unit 8 raises the assist block 13B in synchronization with the collet raising of the collet unit 22. For example, the assist block 13B has the same structure as the second block 131b of the push-up unit 13 and performs the same operation.

  As shown in FIG. 18C, the control unit 8 sucks and holds only the outer peripheral portion of the die D with the suction portion 13C so that the dicing tape 16 under the target die D can be deformed to some extent. For example, the suction portion 13C has the same structure as the peripheral portion 132 of the push-up unit 13 and performs the same operation.

(Modification 2)
FIG. 19 is a view for explaining the suction cup collet according to the modified example 2. FIG. 19 (A) is a cross-sectional view taken along line A1-A2 in FIGS. 19 (B), 19 (B), 19 (C). ), (D) are plan views. The suction cup collet 221B according to the modified example 2 includes a groove VT2 having a width and a height that is not crushed by the suction force at the bottom of the suction cup part 221a2 in order to stably secure the suction force between the suction cup collet 221B and the die D. The groove VT2 is formed to extend radially from the vacuum suction hole 221c. As a result, even if the suction vacuum from the central vacuum suction hole 221c attracts the die D contacting the suction cup 221a2, and the suction vacuum flow path may be blocked around the vacuum suction hole 221c, the groove VT2 extends to the outer periphery. The suction vacuum is guided and the die can be sucked stably. Note that the shape of the groove is not limited to that shown in FIG. 19B, and may be that shown in FIGS. 19C and 19D. In FIG. 19C, a concentric groove centered on the vacuum suction hole 221c is connected to a horizontal and vertical straight groove passing through the vacuum suction hole 221c to form a groove VT2. In FIG. 19D, the grooves VT2 are formed by arranging the grooves connected to the vacuum suction holes 221c in a lattice shape.

(Modification 3)
20A and 20B are views for explaining a suction cup collet according to Modification 3. FIG. 20A is a cross-sectional view taken along line A1-A2 of FIG. 20B, and FIG. 20B is a plan view. The suction cup collet 221C according to the modified example 3 includes a space SP for securing the suction force provided at the outer periphery of the bottom part of the suction cup part 221a3, and a block part BLK for maintaining the position of the die D at the time of suction provided near the center. . The block portion BLK includes four rectangular blocks BL and four grooves VT3 that guide suction vacuum to the outer peripheral space SP between the blocks BL. As a result, the die D can be stably adsorbed in a state where deformation of the die D during adsorption is prevented as much as possible. The material of the block part BL is made of a material having higher hardness than the suction plate 221a3 in order to ensure the flexibility of the suction plate 221a3 as a whole and ensure the followability of the suctioned outer peripheral portion, and to prevent deformation of the central portion. May be used.

(Modification 4)
21A and 21B are diagrams for explaining a suction cup collet according to Modification 4. FIG. 21A is a cross-sectional view taken along line A1-A2 of FIG. 21B, and FIG. 21B is a plan view. The suction cup collet 221D according to the modification 4 includes a plurality of elongated elliptical partition walls PW at the bottom of the suction cup part 221a4 in order to ensure a wide area of the suction surface (groove). The partition wall PW is formed so as to extend radially (spoke) from the central vacuum suction hole 221c, and the groove VT4 is formed. Considering the strength of the partition wall PW and the degree of vacuum, the configuration interval is set such that the partition wall PW does not deform. Thereby, the suction | attraction force with respect to die | dye can further be improved, and outer periphery followable | trackability can also be ensured.

(Modification 5)
22 is a cross-sectional view for explaining a suction cup collet according to Modification 5. FIG. 22A is a cross-sectional view taken along line A1-A2 of FIG. 22B, and FIG. 22B is a plan view. In the suction cup collet 221E according to the fifth modification, instead of the elongated elliptical partition wall PW of the fourth modification, a pin QP having a pyramid shape (for example, a quadrangular pyramid) is configured. In the suction cup collet 221E, a pyramid-shaped pin QP is provided in an array shape at the bottom of the suction cup part 221a5 to form the groove VT5. Thereby, the effect similar to the modification 4 can be acquired.

(Modification 6)
FIG. 23 is a cross-sectional view illustrating a suction cup collet according to Modification 6. FIG. 23A is a cross-sectional view taken along line A1-A2 of FIG. 23B, and FIG. The suction cup collet 221F according to the modified example 6 includes a suction cup portion 221a6 configured by two layers of an elastic plate and a rubber sheet. That is, the suction cup part 221a6 has the upper layer part PL and the lower layer part SH. The upper layer portion PL is a plate made of an elastic material (metal plate or resin plate), for example, a metal plate having spring elasticity and having a thickness of about 0.03 to 0.3 mm. The holding part 221b and the connecting part 221d are also composed of the same members as the upper layer part PL. The lower layer portion SH is a rubber-like elastic body, for example, a rubber sheet, and is made of silicon rubber similar to the embodiment.

  In addition, the upper layer part PL can be made smaller than the lower layer part SH and the outer peripheral part can be made of only rubber, so that followability can be more easily obtained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments and the modified examples. However, the present invention is not limited to the above-described embodiments and modified examples, and various modifications can be made. Not too long.

  For example, as in the case of the sixth modification, the suction surface of the suction part of the suction cups of the third, fourth, and fifth modifications is guided by adhering a rubber sheet to the elastic plate in a block shape, an elliptical shape, or a pyramid shape. The grooves VT3, VT4, and VT5 may be configured.

  Further, in Modification 6, the sucker portion 221a6 may be configured by attaching a rubber material as a lower layer portion only to the outer peripheral portion of the upper layer portion PL. Thereby, the suction cup collet 221 can be configured with high accuracy at low cost.

  Further, in the modified example 6, the upper layer portion PL is not a plate of elastic material but is composed of elastic wire such as piano wire in a radial manner like an umbrella, and a lower layer portion SL of rubber material is pasted on the suction portion 221a4. It may be configured.

  In the embodiment, an example using a die attach film has been described. However, it is not necessary to use a die attach film by providing a preform portion for applying an adhesive to a substrate.

In the embodiment, the die bonder for picking up the die from the die supply unit with the pickup head and placing it on the intermediate stage and bonding the die placed on the intermediate stage to the substrate with the bonding head has been described. However, the present invention can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.
For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pickup head and bonds a die of a die supply unit to a substrate with a bonding head.
Further, the present invention can be applied to a flip chip bonder that has no intermediate stage, picks up a die from a die supply unit, rotates the die pickup head upward, transfers the die to the bonding head, and bonds the die to the substrate with the bonding head.
Further, the present invention can be applied to a die sorter in which a die picked up by a pickup head from a die supply unit is placed on a tray or the like without an intermediate stage and a bonding head.

1: Die supply unit 11: Wafer 13: Push-up unit 16: Dicing tape 2: Pickup unit 21: Pickup head 22: Collet unit 221: Suction cup collet 221a: Suction cup unit 221b: Holding unit 221c: Vacuum suction hole 221d: Connection unit 222: Collet holder 222a: Spacer 222b: Tubular part 222c: Peripheral part 222d: Lever 222e: Vacuum suction hole 222f: Spring 3: Intermediate stage part 31: Intermediate stage 4: Bonding part 41: Bonding head 8: Control part 10: Die bonder D: Die P: Substrate

Claims (19)

Semiconductor manufacturing equipment
A wafer holder for holding the wafer;
A collet portion for adsorbing a die from the wafer holder;
With
The collet part is
Collet,
A collet holder for holding the collet;
With
The collet is
A first portion in contact with the die;
A second portion held by the collet holder;
A third part connecting the central part of the first part and the central part of the second part;
A first suction hole penetrating the first part, the third part and the second part;
With
The first portion can be deformed following the deflection of the die. The semiconductor manufacturing apparatus according to claim 1.
The upper surface of the first portion is in contact with the bottom surface of the collet holder, and when the die is deformed following the bending of the die, the peripheral portion of the first portion is separated from the bottom surface of the collet holder. The semiconductor manufacturing apparatus according to claim 1.
The first part and the second part are rectangular in plan view,
The area of the upper surface of the second part is smaller than the area of the bottom surface of the first part. The semiconductor manufacturing apparatus according to claim 1.
The collet is made of silicon rubber. The semiconductor manufacturing apparatus according to claim 4.
The thickness of the first part is 0.5-1 mm. The semiconductor manufacturing apparatus according to claim 1.
The collet is constituted by attaching a rubber-like elastic body to a metal plate or resin plate having spring elasticity. The semiconductor manufacturing apparatus according to claim 6.
The metal plate has a thickness of 0.03 to 0.3 mm. The semiconductor manufacturing apparatus according to claim 6 or 7,
The metal plate is smaller than the rubber-like elastic body. The semiconductor manufacturing apparatus according to claim 1.
The first portion includes a groove having a width and a height that are not crushed by an adsorption force at the bottom. The semiconductor manufacturing apparatus according to claim 1.
The first part is
To secure the suction force located on the outer periphery, the space of the suction part,
Multiple blocks that are located near the center and maintain the position of the die during suction,
A groove that is located between the plurality of blocks and guides an adsorption vacuum to the space of the outer periphery;
Is provided. The semiconductor manufacturing apparatus according to claim 1.
The first part is
A plurality of thin, long oval bulkheads;
A groove between the partition walls;
With
The plurality of partition walls are arranged in a spoke shape from the first suction hole. The semiconductor manufacturing apparatus according to claim 1.
The collet holder is
An outer periphery that holds the periphery of the first part; and
A space into which the second part is inserted;
A tubular portion extending upward from the space portion;
A lever for fixing and releasing the second part;
With
A second suction hole is provided at the center of the tubular portion, and is configured to be connected to the first suction hole. The semiconductor manufacturing apparatus according to claim 12,
The collet holder further includes a spring,
The lever fixes the second part by the biasing force of the spring,
The second portion is released by applying a force against the biasing force of the spring to the lever. The semiconductor manufacturing apparatus according to claim 1, further comprising a push-up unit that sucks and pushes up the die from below a dicing tape;
A pickup head to which the collet is attached;
Is provided. 15. The semiconductor manufacturing apparatus according to claim 14, further comprising:
An intermediate stage for mounting a die picked up by the pickup head;
A bonding head for bonding a die placed on the intermediate stage onto a substrate or an already bonded die;
Is provided. The semiconductor manufacturing apparatus according to claim 1.
The die further includes a die attach film between the die and the dicing tape. The manufacturing method of the semiconductor device is as follows:
(A) preparing a semiconductor manufacturing apparatus according to any one of claims 1 to 16,
(B) preparing a wafer ring for holding a dicing tape having a die;
(C) picking up the die at the collet part;
Is provided. The method of manufacturing a semiconductor device according to claim 17, further comprising:
(D) preparing a substrate;
(E) bonding the die onto the substrate or an already bonded die. In the manufacturing method of the semiconductor device of Claim 18,
The step (c) further includes a step of placing the picked-up die on an intermediate stage,
The step (e) further includes a step of picking up the die from the intermediate stage.

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