JP2008244125A - Tool, device and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting tool capable of absoptively holding a semiconductor chip without giving a bending stress, and mounting it on a substrate without generating any voids. <P>SOLUTION: The mounting tool 15 serves for sucking a semiconductor chip 1 and mounting it onto the substrate; and is provided with a holder 18 with a sucking hole 19 formed therein, and an elastic holder 21 mounted in the extremity of the holder with a communicating hole 23 communicating to a sucking hole for absorptively holding the semiconductor chip by the sucking force generated in the communicating hole. The elastic holder 21 has a stepping structure 25 for sequentially pressing the semiconductor chip from the center of the substrate to its periphery. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting tool for mounting a thin and deformable electronic component such as a semiconductor chip on a substrate, a mounting apparatus using the mounting tool, and a mounting method.

  A semiconductor chip formed by cutting a semiconductor wafer into a dice is attached to an adhesive sheet, and when mounting this semiconductor chip on a substrate, after picking up and picking up the semiconductor chips one by one from the adhesive sheet, It is pressed against the board for mounting.

  When a semiconductor chip picked up from an adhesive sheet is mounted on a substrate, the semiconductor chip is picked up by a pick-up tool and transferred to a reversing tool. When a chip system or a semiconductor chip is picked up from an adhesive sheet, die bonding is known in which the semiconductor chip is mounted on a substrate as it is.

  In the case of die bonding in which the picked-up semiconductor chip is directly mounted on the substrate, the pick-up and mounting of the semiconductor chip is performed with the same tool. In other words, the mounting tool also serves as the pickup tool.

  By the way, recently, the thickness of a semiconductor chip may be as thin as 50 μm or less. Such a thin semiconductor chip may be chipped or broken by a slight impact.

  In particular, when a semiconductor chip is pushed up and picked up from an adhesive sheet or die-bonded, the semiconductor chip is easily subjected to an impact. Therefore, a mounting tool that also serves as a pick-up tool used for die bonding has at least a portion in contact with the semiconductor chip. It is formed by an elastic member so as not to give a shock to the semiconductor chip as much as possible.

  When the portion of the mounting tool that contacts the semiconductor chip is formed by an elastic member, a suction hole is formed in the center of the elastic member, and the semiconductor chip is attracted and picked up by the suction force generated in the suction hole. In the case of a semiconductor chip, the center part may be curved and deformed upward in a convex manner while elastically deforming the elastic member by the suction force.

  In the semiconductor chip, not only the central part but also the peripheral part is held by an elastic member. Therefore, since the semiconductor chip is curved and deformed only at the central portion and the peripheral portion is not deformed, the entire semiconductor chip is curved and deformed in a convex shape as a whole. When the semiconductor chip is mounted on the substrate in this state, the substrate and the semiconductor chip Voids in which bubbles remain may occur between the two and lead to poor mounting.

Patent Document 1 discloses a mounting tool (a die bonder collet) for preventing generation of voids when a thin and easily bent semiconductor chip is mounted on a substrate. That is, the mounting tool disclosed in Patent Document 1 sucks a semiconductor chip by forming a vacuum suction hole only in the peripheral portion except the central portion of the suction surface on the lower surface of the elastic suction member that holds the semiconductor chip by suction. Thus, the semiconductor chip is sucked and held and mounted on the substrate with the central portion of the suction surface and the central portion of the semiconductor chip projecting and deformed downward in a convex spherical shape.
JP 2006-165188 A

  If the mounting tool shown in Patent Document 1 is used, the semiconductor chip is mounted in a state where it protrudes and deforms downward into a convex spherical shape. That is, when the mounting tool is lowered, the central portion of the semiconductor chip comes into contact with the substrate and is pressed by the elastic adsorption member, so that the protruding central portion of the elastic adsorption member is compressed by the reaction force. As a result, the contact portion between the semiconductor chip and the substrate expands in order from the central portion to the peripheral portion, so that the semiconductor chip can be mounted on the substrate without causing voids.

  However, in the invention disclosed in Patent Document 1, the substrate is curved and deformed in advance so as to have a convex spherical shape and is held by suction on the elastic suction member of the mounting tool. For this reason, since a very thin semiconductor chip is preliminarily attracted and held in a field state by bending stress, the semiconductor chip may be damaged by the bending stress.

  The present invention is an electronic component mounting tool that can be mounted without causing generation of voids or damage to the electronic component by adsorbing and holding the electronic component without applying bending stress and mounting the substrate on the substrate. To provide a mounting apparatus and a mounting method.

This invention is an electronic component mounting tool for adsorbing and mounting electronic components on a substrate,
The mounting tool is attached to the tip of the holder with a suction hole, and a communication hole is formed to communicate with the suction hole, and the electronic component is sucked and held by the suction force generated in the communication hole. An elastic holding member
The mounting tool for an electronic component, wherein the elastic holding member has a shape for sequentially pressing the electronic component from the central portion toward the peripheral portion when the electronic component is mounted on the substrate. It is in.

  It is preferable that the elastic holding member has a stepped step portion that protrudes most from a portion corresponding to the center portion of the electronic component and that gradually separates from the surface to which the electronic component is attracted toward the peripheral portion. .

  It is preferable that the stepped portion is formed by a plurality of elliptical portions or circular portions that gradually increase from the central portion to the peripheral portion of the electronic component.

This invention is an electronic component mounting tool for adsorbing and mounting electronic components on a substrate,
The mounting tool is attached to the tip of the holder with a suction hole, and a communication hole is formed to communicate with the suction hole, and the electronic component is sucked and held by the suction force generated in the communication hole. An elastic holding member
In the electronic component mounting tool, the elastic holding member has a structure that presses the central portion of the electronic component more strongly than the peripheral portion when the electronic component is mounted on the substrate.

  The tip of the portion of the holder to which the elastic holding member is mounted is formed in a convex curved surface, and the elastic holding member is formed with a concave curved surface into which the convex curved surface is fitted and the tip surface is flat. It is preferably formed on the surface.

  It is preferable that the elastic holding member is formed of a plurality of elastic materials that are gradually softened from the center to the periphery of the holder.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
The electronic component supply unit;
A mounting tool for adsorbing and removing electronic components from the supply unit and mounting them on the substrate is provided.
The mounting tool is an electronic component mounting apparatus having the structure described in any one of claims 1 and 4.

This invention is a mounting method for mounting an electronic component on a substrate,
A step of adsorbing and taking out the electronic component provided in the supply unit with a mounting tool;
Positioning the electronic component taken out from the supply unit by the mounting tool above the mounting position of the substrate;
Lowering the mounting tool and mounting the electronic component sucked and held by the mounting tool on the substrate;
A step of sequentially pressing the electronic component from the central portion toward the peripheral portion with respect to the substrate when the electronic component is mounted on the substrate by the mounting tool. It is in.

This invention is a mounting method for mounting an electronic component on a substrate,
A step of adsorbing and taking out the electronic component provided in the supply unit with a mounting tool;
Positioning the electronic component taken out from the supply unit by the mounting tool above the mounting position of the substrate;
Lowering the mounting tool and mounting the electronic component sucked and held by the mounting tool on the substrate;
And a step of pressing the center of the electronic component more strongly than the peripheral portion when the electronic component is mounted on the substrate by the mounting tool.

  According to the present invention, since the elastic holding member of the mounting tool that holds the electronic component by suction presses the electronic component sequentially from the central portion toward the peripheral portion with respect to the substrate, the electronic component is curved upward in a convex spherical shape. The generation of voids can be prevented by mounting with suction and holding in a substantially flat state without being deformed.

  According to this invention, since the elastic holding member of the mounting tool that holds the electronic component by suction presses the central part of the electronic component more strongly than the peripheral part, the electronic component is not curved and deformed upward in a convex spherical shape. Generation of voids can be prevented by mounting with suction holding in a flat state.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 3 show a first embodiment of the present invention. FIG. 1 shows a mounting device for a semiconductor chip 1 as an electronic component, and this mounting device includes a pickup unit 2 and a mounting unit 3. The pickup unit 2 has a backup body 5, and a push-up shaft 6 is held by the backup body 5 so as to be movable in the vertical direction.

  A cam follower 7 is provided at the lower end of the push-up shaft 6 protruding from the backup body 5. The cam follower 7 is in contact with the outer peripheral surface of a cam 8 that is rotationally driven in the direction of the arrow by a rotational drive source (not shown). When the cam 8 is driven to rotate, the push-up shaft 6 is driven in the vertical direction. Thereby, the upper end portion of the push-up shaft 6 projects from the upper end surface of the backup body 5.

  A suction pump 11 is connected to the backup body 5 via a suction pipe 12. The suction pipe 12 communicates with a suction hole (not shown) formed in the upper end surface 5 a through the internal space of the backup body 5. Accordingly, when the suction pump 11 is operated, a suction force is generated on the upper end surface 5a of the backup body 5.

  The upper end surface 5a of the backup body 5 sucks and holds the adhesive sheet 13 stretched on a wafer ring (not shown). The adhesive sheet 13 has a plurality of rectangular semiconductor chips 1 obtained by dividing a semiconductor wafer into dice.

  The wafer ring is driven in the horizontal direction by an XY drive source (not shown), and the semiconductor chip 1 to be picked up is positioned at the center of the upper end surface 5a of the backup body 5. When the semiconductor chip 1 is positioned, the suction pump 11 is operated and the lower surface of the portion of the adhesive sheet 13 corresponding to the semiconductor chip 1 to be picked up is adsorbed to the upper end surface 5a, and then the cam 8 is driven to rotate. The

  When the cam 8 is rotationally driven, the push-up shaft 6 is driven in the upward direction, and the upper end of the push-up shaft 6 protrudes from the upper end surface 5a of the backup body 5. Therefore, the semiconductor chip 1 in which the adhesive sheet 13 is stretched and positioned is positioned. It is pushed up.

  The semiconductor chip 1 pushed up from the upper end surface 5a of the backup body 5 is picked up by a mounting tool 15 that also serves as a pickup tool. The mounting tool 15 is driven in the horizontal and vertical directions by an XYZ drive source 16.

  As shown in FIG. 2, the mounting tool 15 has a shaft-shaped holder 18 provided with a flange 17 in the middle in the axial direction. The holder 18 is provided with a suction hole 19 penetrating in the axial direction. A suction pump is connected to the suction hole 19 via a flexible tube (both not shown).

  An elastic holding member 21 made of an elastic material such as natural rubber or synthetic rubber is detachably mounted on the mounting portion 18a which is the tip of the holder 18. That is, the elastic holding member 21 is formed with a mounting hole 22 for fitting the mounting portion 18 a of the holder 18 and a communication hole 23 communicating with the suction hole 19.

  As shown in FIG. 3, the front end surface 21a of the elastic holding member 21 has a rectangular shape corresponding to the shape of the semiconductor chip 1, and a step portion 25 is formed on the front end surface 21a. The step portion 25 is formed by a plurality of steps, the center portion of which protrudes downward most and is sequentially positioned upward as it goes to the peripheral portion, in this embodiment, the first to third steps 25a to 25c. . In the first to third steps 25a to 25c, the planar shape is formed in an elliptical shape, and the step in each step 25a to 25c is set to 0.01 to 0.03 mm.

  The elastic holding member 21 is formed of an elastic material having a rubber hardness of about JIS-30 to 90. If the steps 25a to 25c having a step of 0.01 to 0.03 mm are formed by the elastic holding member 21 having such hardness, a lead frame which will be described later with the semiconductor chip 1 adsorbed and held on the front end surface 21a of the elastic holding member 21. When the pressure is applied for mounting on the substrate 27, the plurality of steps 25a to 25c are elastically compressed and deformed sequentially from the lowest step 25a protruding downward, and finally the elastic holding member 21 is pressed. It becomes substantially the same plane as the front end surface 21a of, ie, a flat surface.

  As shown in FIG. 1, the substrate 27 is pitch-fed by a conveying means 28. The conveying means 28 includes a pair of conveying rails 29 arranged in parallel at a predetermined interval. A thermocompression film (not shown) is attached to the upper surface of the substrate 27 on which the semiconductor chip 1 is mounted, and the lower surface is held by a heater block 31 having a built-in heater 31a.

  Accordingly, when the semiconductor chip 1 is pressed against the substrate 27 by the mounting tool 15, the thermocompression bonding film is melt-cured and the semiconductor chip 1 is mounted on the substrate 27. Note that the thermocompression bonding film may be attached to the back surface of the semiconductor chip 1 instead of the top surface of the substrate 27.

  When the semiconductor chip 1 is mounted on the substrate 27 by the mounting apparatus having such a configuration, first, the mounting tool 15 is driven in the X and Y directions to be positioned above the backup body 5. Next, the mounting tool 15 is driven in the downward direction, and a first step 25 a that protrudes the upper surface of the picked-up semiconductor chip 1 positioned on the upper end surface of the backup body 5 to the lowermost position of the tip surface of the elastic holding member 21. Adsorb.

  Next, the push-up shaft 6 provided on the backup body 5 is driven in the upward direction to push up the semiconductor chip 1. At this time, the mounting tool 15 moves in the upward direction together with the push-up shaft 6. When the push-up shaft 6 rises while stretching the adhesive sheet 13, the adhesive sheet 13 is peeled from the lower surface of the pushed-up semiconductor chip 1. Accordingly, after the push-up shaft 6 is raised to the ascent limit, when the mounting tool 15 is further raised, the semiconductor chip 1 is attracted and held by the mounting tool 15 and picked up.

  The mounting tool 15 picked up the semiconductor chip 1 is positioned above the substrate 27 by the XYZ driving source 16. Next, the mounting tool 15 is driven in the downward direction, and the semiconductor chip 1 held on the front end surface is mounted on the substrate 27.

  The operation when the semiconductor chip 1 is mounted on the substrate 27 will be described with reference to FIGS. The semiconductor chip 1 is sucked and held by the first step 25a of the step portion 25 formed on the distal end surface 21a of the elastic holding member 21 of the mounting tool 15. When the mounting tool 15 is lowered, the central portion of the upper surface of the semiconductor chip 1 is pressed against the substrate 27 by the first step 25a as shown in FIG.

  When the mounting tool 15 is lowered, the first step 25a is compressed and deformed by the reaction force of the pressing force as shown in FIG. 4B, and becomes almost the same height as the second step 25b. That is, after the center portion of the semiconductor chip 1 is pressed against the substrate 27 by the first step 25a, the peripheral portion of the center portion pressed by the first step 25a is pressed by the second step 25b.

  When the mounting tool 15 is further lowered, as shown in FIG. 4C, the second step 25b is compressed and deformed after the first step 25a, so that the semiconductor chip 1 has the first step 25a and the second step. The further outer portion of 25b is pressed by the third step 25c.

  When the mounting tool 15 is further lowered, as shown in FIG. 4D, the third step 25c is compressed and deformed, and the first to third steps 25a to 25c are the same height as the distal end surface 21a of the elastic holding member 21. It will be. As a result, the entire surface of the semiconductor chip 1 is pressed by the first to third steps 25a to 25c and the tip surface 21a and mounted on the substrate 27.

  The semiconductor chip 1 picked up from the pickup unit 2 by the mounting tool 15 is held only in contact with the first step 25a of the elastic holding member 21 at the center of the upper surface thereof. In the first step 25a, the semiconductor chip 1 is compressed and deformed by the suction force holding the semiconductor chip 1 by suction. However, even if the first step 25a is compressed and deformed to some extent, the second and third steps 25b and 25c corresponding to the peripheral portion of the semiconductor chip 1 are formed higher than the first step 25a.

  Therefore, even if the first step 25a is compressed and deformed, the peripheral portion of the upper surface of the semiconductor chip 1 does not hit the second and third steps 25b and 25c and is pressed downward, so that the semiconductor chip 1 is elastic. The holding member 21 is sucked and held in a substantially flat state on the tip surface 21a.

  In other words, since the semiconductor chip 1 attracted and held by the mounting tool 15 is not curved and deformed upwardly, without giving bending stress that causes damage to the semiconductor chip 1 before mounting, It can be conveyed from the pickup unit 2 to the mounting unit 3.

  When the semiconductor chip 1 sucked and held by the mounting tool 15 in this way is transported to the mounting portion 3 and mounted on the substrate 27, the semiconductor chip 1 becomes the second step portion 25 of the step portion 25 formed on the front end surface 21 a of the elastic holding member 21. When the central portion is pressed against the substrate 27 by the first step 25a and the first step 25a is compressed and deformed, the peripheral portion is sequentially pressed by the second and third steps 25b and 25c.

  That is, the semiconductor chip 1 is mounted on the substrate 27 by being sequentially pressed from the central portion toward the peripheral portion. Therefore, it is possible to prevent bubbles from remaining between the semiconductor chip 1 and the substrate 27 and generating voids.

  In the first embodiment, the stepped portion 25 on the distal end surface of the elastic holding member 21 is formed by a plurality of elliptical steps 25a to 25c. However, the steps 25a to 25c are not limited to the elliptical shape. The shape may be rectangular, and the number of steps is not limited to three, and may be two or four or more.

  FIG. 5 shows a second embodiment of the present invention. This embodiment is a modification of the mounting tool 15A. In the mounting tool 15A, the tip of the mounting portion 18b of the holder 18 to which the elastic holding member 21A is mounted is formed as a spherical convex curved surface 33. . The elastic holding member 21A is formed with a concave curved surface 34 corresponding to the convex curved surface 33 on which the mounting portion 18b of the holder 18 is mounted.

The elastic holding member 21A is made of an elastic material similar to that of the first embodiment, and the tip end surface thereof is a flat surface 35. The outer diameter of the flat surface 35 is set larger than the outer diameter of the convex curved surface 33 of the mounting portion 18b. As a result, the peripheral portion of the elastic holding member 21A that is out of the convex curved surface 33 is thicker than the central portion, and is easily elastically deformed.
Note that a communication hole 23 a that communicates with the suction hole 19 formed in the holder 18 is formed in the center of the flat surface 35 of the elastic holding member 21 </ b> A.

  According to the mounting tool 15A having such a configuration, the mounting portion 18b of the holder 18 is formed on the convex curved surface 33, and the concave holding curved surface 34 on which the mounting portion 18b is mounted is formed on the elastic holding member 21A. Therefore, the peripheral portion of the elastic holding member 21A is thicker than the central portion, and is easily elastically deformed.

  If the peripheral portion of the elastic holding member 21A is easily elastically deformed, the central portion of the elastic holding member 21A is thick even if a suction force acts on the central portion of the upper surface of the semiconductor chip 1 picked up from the pickup portion 2. Since it is thin and hardly elastically deformed, the central portion of the elastic holding member 21A1 is hardly compressed and deformed.

  Moreover, even if the central portion of the elastic holding member 21A is compressed and deformed and the semiconductor chip 1 is displaced upward, the semiconductor chip 1 elastically deforms the peripheral portion of the elastic holding member 21A that is easily elastically deformed at its peripheral portion. Displace upward.

  As a result, the semiconductor chip 1 is hardly deformed in a convex shape only at the center, and is displaced upward as a whole to maintain a flat shape. That is, the mounting tool 15A can hold the semiconductor chip 1 by suction without applying excessive bending stress that causes damage.

  When the semiconductor chip 1 attracted and held by the elastic holding member 21A of the mounting tool 15A is pressed and mounted on the substrate 27, the elastic holding member 21A becomes thicker and elastically deforms from the center to the periphery. Since the shape is easy, the pressing force acting on the semiconductor chip 1 is the largest in the central portion and becomes lower as going to the peripheral portion.

  For this reason, the semiconductor chip 1 is mounted with the central portion being pressed more strongly than the peripheral portion, so that bubbles between the substrate 27 and the semiconductor chip 1 are easily pushed out from the central portion toward the peripheral portion. Therefore, it is possible to prevent bubbles from remaining between the semiconductor chip 1 and the substrate 27 and generating voids.

  FIG. 6 shows a third embodiment of the present invention. The mounting tool 15B of this embodiment is a modification of the elastic holding member 21B in the second embodiment, and the elastic holding member 21B has a plurality of different hardnesses. In this embodiment, the first to third 3 The two elastic members 37a to 37c are formed.

  That is, the elastic holding member 21B is formed by the hardest first elastic material 37a corresponding to the central portion of the semiconductor chip 1, and is gradually softened toward the peripheral portion by the second and third elastic materials 37b and 37c. Is formed.

  Therefore, even if the mounting tool 15B holds the semiconductor chip 1 by suction and the reaction force acts on the elastic holding member 21B, the first elastic material 37a that holds the center of the upper surface of the semiconductor chip 1 is hard, so it is almost compressed. There is no deformation.

  Even if the first elastic member 37a is slightly compressed and deformed and the central portion of the semiconductor chip 1 is displaced upward, the peripheral portion of the semiconductor chip 1 is softer than the first elastic member 37a. Since the third and third elastic members 37b and 37c are opposed to each other, the second and third elastic members 37b and 37c are elastically deformed and displaced upward.

  Therefore, since the semiconductor chip 1 is hardly pressed and deformed downward by the second and third elastic members 37b and 37c of the elastic holding member 21B, the semiconductor chip 1 is held flat without being curved in a convex shape. Will be.

  Moreover, when the semiconductor chip 1 is mounted on the substrate 27, the semiconductor chip 1 is pressed by the hardest first elastic material 37a at the center, and the second and third elastic materials 37b and 37c that become softer toward the periphery. Is pressed by. That is, since the center part of the semiconductor chip 1 is pressed more strongly than the peripheral part, air between the semiconductor chip 1 and the substrate 27 escapes to the outside, so that generation of voids can be prevented.

  In the third embodiment, the mounting portion 18b of the holder 18 may not be the convex curved surface 33, but the tip end surface may be a flat surface. In this case, the elastic holding member 21B has an inner surface instead of the concave curved surface 34. A recess having a flat bottom surface may be formed.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows 1st Embodiment of this invention. The front view which decomposes | disassembles and shows the holder and elastic holding member of a mounting tool. The top view which shows the front end surface of an elastic holding member. (A)-(d) is explanatory drawing which showed the deformation | transformation state of the elastic holding member when mounting a semiconductor chip on a board | substrate sequentially. The front view which decomposes | disassembles and shows the holder and elastic holding member of the mounting tool of 2nd Embodiment of this invention. The front view which decomposes | disassembles and shows the holder and elastic holding member of the mounting tool of 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip (electronic component), 2 ... Pick-up part, 3 ... Mounting part, 5 ... Backup body, 13 ... Adhesive sheet, 15 ... Mounting tool, 18 ... Holder, 19 ... Suction hole, 21, 21A, 21B ... Elasticity Holding member, 25 ... stepped portion, 27 ... substrate, 33 ... convex curved surface, 34 ... concave curved surface.

Claims (9)

An electronic component mounting tool that picks up electronic components and mounts them on a board,
The mounting tool is attached to the tip of the holder with a suction hole, and a communication hole is formed to communicate with the suction hole, and the electronic component is sucked and held by the suction force generated in the communication hole. An elastic holding member
The mounting tool for an electronic component, wherein the elastic holding member has a shape for sequentially pressing the electronic component from the central portion toward the peripheral portion when the electronic component is mounted on the substrate. .   The elastic holding member is formed with a stepped step portion that protrudes most from a portion corresponding to the central portion of the electronic component, and that gradually separates from the surface to which the electronic component is attracted toward the peripheral portion. The electronic component mounting tool according to claim 1.   3. The electronic component mounting tool according to claim 2, wherein the stepped portion is formed by a plurality of elliptical or circular portions that gradually increase from the center to the periphery of the electronic component. An electronic component mounting tool that picks up electronic components and mounts them on a board,
The mounting tool is attached to the tip of the holder with a suction hole, and a communication hole is formed to communicate with the suction hole, and the electronic component is sucked and held by the suction force generated in the communication hole. An elastic holding member
The mounting tool for an electronic component, wherein the elastic holding member has a structure that presses the central portion of the electronic component more strongly than the peripheral portion when the electronic component is mounted on the substrate.   The tip of the portion of the holder to which the elastic holding member is mounted is formed in a convex curved surface, and the elastic holding member is formed with a concave curved surface into which the convex curved surface is fitted and the tip surface is flat. 5. The electronic component mounting tool according to claim 4, wherein the electronic component mounting tool is formed on a surface.   5. The electronic component mounting tool according to claim 4, wherein the elastic holding member is formed of a plurality of elastic materials that are gradually softened from the center to the periphery of the holder. A mounting device for mounting electronic components on a substrate,
The electronic component supply unit;
A mounting tool for adsorbing and removing electronic components from the supply unit and mounting them on the substrate is provided.
5. The electronic component mounting apparatus according to claim 1, wherein the mounting tool has the structure described in any one of claims 1 and 4. A mounting method for mounting electronic components on a substrate,
A step of adsorbing and taking out the electronic component provided in the supply unit with a mounting tool;
Positioning the electronic component taken out from the supply unit by the mounting tool above the mounting position of the substrate;
Lowering the mounting tool and mounting the electronic component sucked and held by the mounting tool on the substrate;
A step of sequentially pressing the electronic component from the central portion toward the peripheral portion with respect to the substrate when the electronic component is mounted on the substrate by the mounting tool. . A mounting method for mounting electronic components on a substrate,
A step of adsorbing and taking out the electronic component provided in the supply unit with a mounting tool;
Positioning the electronic component taken out from the supply unit by the mounting tool above the mounting position of the substrate;
Lowering the mounting tool and mounting the electronic component sucked and held by the mounting tool on the substrate;
And a step of pressing the central part of the electronic component more strongly than the peripheral part when the electronic component is mounted on the substrate by the mounting tool.

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