JP2002334905A - Method for adhering adhesive film, device for adhering, and assembling method for electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for adhering an adhesive film by which an adhesive film, such as an anisotropic conductive film or the like can be adhered surely and efficiently to a body to be adhered to, such as a wiring board having a wiring pattern. SOLUTION: This device for adhering is provided with a cutting means for separatably cutting one end of a series of adhesive film held by a base film 100 at specified dimension and a pressing surface 13a for pressing the adhesive film positioned on a substrate 200 from the rear side of the base film 100; it is also provided with a pressing head 11 to heat the adhesive film at a specified temperature and a separation mechanism 40 for separating the adhesive film adhered to the surface of the substrate 200 from the base film, by peeling off the base film from the one end side of the adhesive film toward the other end side thereof; and the pressing surface 13a of the pressing head 11 selectively gives a large pressing force to the separation starting end part and separation ending end part of the adhesive film with respect to the base film 100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding apparatus for bonding an adhesive film such as an anisotropic conductive film to an object such as a wiring board on which a wiring pattern is formed. The present invention relates to a mounting method and an assembling method of an electronic circuit device using the bonding method.

[0002]

2. Description of the Related Art For example, in the product fields such as home appliances, computers, and mobile products, there is a strong demand for miniaturization, high performance, and low cost of products. In the field of mounting technology for mounting electronic circuit components, there is a demand for saving space and improving mounting efficiency. A so-called flip-chip mounting is known as a mounting method capable of achieving space saving, improvement of mounting efficiency, and the like. Flip chip mounting is a mounting method in which an electrode formed on a surface of a semiconductor chip and an electrode formed on a surface of a substrate are directly opposed to each other, aligned and adhered, and bonded by applying heat and pressure.

[0003] Basically, this flip chip mounting is performed by:
This is a method of simultaneously performing electrical connection between a substrate and electrodes of a semiconductor chip and fixing of the semiconductor chip to the substrate. Note that an adhesive may be interposed between the substrate and the semiconductor chip to reinforce the fixation of the substrate and the semiconductor chip. In flip-chip mounting, a conductive material such as silver paste is applied to the electrodes of a semiconductor chip, and the conductive material is electrically connected to the electrodes of the substrate. Anisotropic conductive as an adhesive containing metal particles A method of conducting and fixing by interposing a material between the substrate and the semiconductor chip before mounting and applying heat and pressure, interposing an electrically insulating adhesive containing no metal particles between the substrate and the semiconductor chip A method of conducting and fixing by applying pressure is known. In the latter two methods, an adhesive is interposed between the opposing surfaces of the semiconductor chip and the substrate, and the adhesive is formed in a film form in advance, such as an anisotropic conductive film, or in a paste form. And is known.
In mounting using a film-like adhesive (adhesive film), for example, an adhesive film of a predetermined size is attached to a substrate, and then a semiconductor chip is mounted on the substrate, and the adhesive film is applied by applying heat and pressure. Curing has been done. Thereby, the semiconductor chip is fixed to the substrate.

[0004]

By the way, an adhesive film used for flip chip mounting is usually provided in a state of being continuously attached to a surface of a series of base films. As a method of attaching the adhesive film to the substrate, for example, the adhesive film is cut into a predetermined size, the cut adhesive film is attached to a predetermined position on the substrate, and the adhesive film attached to the substrate is Peeling of the base film has been performed. However, in the related art, there has been a problem that an adhesion error of the adhesive film is likely to occur, and the stability of a process of attaching the adhesive film to the substrate is low. In addition, there are many steps, and there is a problem of equipment cost.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to attach an adhesive film such as an anisotropic conductive film to a wiring board or the like on which a wiring pattern is formed. An object of the present invention is to provide an adhesive film sticking apparatus and a sticking method that can be stuck to a body reliably and efficiently. Another object of the present invention is to secure an adhesive film on a wiring board when mounting an electronic circuit component such as a semiconductor chip on the wiring board using an adhesive film such as an anisotropic conductive film in so-called flip-chip mounting. Another object of the present invention is to provide a method of assembling an electronic circuit device that can be efficiently attached.

[0006]

According to the present invention, there is provided a method for adhering an adhesive film, comprising the steps of: cutting one end of a series of adhesive films held on a surface of a flexible support into a predetermined size so as to be separable; And positioning the adhesive film capable of being separated on the adhered surface by facing the flexible support to the adhered surface of the adherend, and positioning the adhesive film on the flexible support. A bonding step of pressing from the back side toward the surface to be bonded and heating and bonding to a predetermined temperature to bond the flexible support from one end side to the other end side of the adhesive film By separating, the separation step of separating the adhesive film and the flexible support adhered to the surface to be adhered,
In the attaching step, a high pressing force is selectively applied to the separation start end and the separation end of the adhesive film with respect to the flexible support.

Preferably, the method for attaching an adhesive film of the present invention further comprises a cooling step of blowing cooling air to the adhesive film from which the flexible support has been separated to forcibly cool the adhesive film.

[0008] More preferably, in the attaching step, the flexible support is curved so that an unadhered adhesive film adjacent to the detachable adhesive film does not contact the adherend. Let it.

In the method for attaching an adhesive film of the present invention, the cutting step, the attaching step, and the separating step are performed while a flexible support supporting the adhesive film is intermittently run.

The adherend is a wiring board on which at least a wiring pattern is formed, and the adhesive film fixes an electronic circuit component mounted on the wiring board and a mounting surface of the electronic circuit component. And an anisotropic conductive film for electrically connecting the external connection terminal exposed to the wiring pattern to the wiring pattern.

The adherend may be a wiring board on which at least a wiring pattern is formed, and the adhesive film may be an adhesive film for fixing an electronic circuit component mounted on the wiring board. is there.

The adhesive film contains a resin as a main component.

The adhesive film sticking apparatus of the present invention comprises a cutting means for cutting one end of a series of adhesive films held on the surface of a flexible support into a predetermined size so as to be separable; A pressing surface for pressing the adhesive film positioned on the surface to be adhered and capable of being separated from the back side of the flexible support toward the surface to be adhered, and heating the adhesive film to a predetermined temperature. Press head, and the flexible film is separated from the one end side of the adhesive film toward the other end side of the adhesive film so that the adhesive film adhered to the surface to be adhered and the flexible support Separation means for separating the body,
And the pressing surface of the pressing head selectively applies a high pressing force to the separation start end and the separation end of the adhesive film against the flexible support.

Preferably, the adhesive film sticking apparatus of the present invention further comprises a cooling means for blowing cooling air onto the adhesive film from which the flexible support is separated to forcibly cool the adhesive film.

More preferably, the adhesive film sticking apparatus of the present invention is arranged such that the unadhered adhesive film adjacent to the detachable adhesive film does not contact the adherend. Guide means for bending the flexible support.

Specifically, the pressing head includes an elastic member having the pressing surface, a pressing member having the elastic member fixed to a distal end, heated to a predetermined temperature, and pressing the pressing surface from the back side. And the pressing member includes a protrusion at a position corresponding to a separation start end and a separation end of the adhesive film.

Preferably, the elastic member is formed from a rubber material containing silicon.

In the adhesive film sticking apparatus of the present invention, the adhesive film is continuously supplied to the pressing head while applying a predetermined tension to a flexible support for supporting the adhesive film. Further comprising a film supply winding mechanism for winding the flexible support after the is separated.

The method for assembling an electronic circuit device according to the present invention is a method for assembling an electronic circuit device in which at least a wiring board on which a wiring pattern is formed and electronic circuit components are fixed on the wiring board with an adhesive film. A cutting step of cutting one end of the series of adhesive films held on the surface of the flexible support to a predetermined size so as to be separable; and causing the flexible support to face a component mounting surface of the wiring board. Position the adhesive film that has become separable on the component mounting surface, press the adhesive film from the back side of the flexible support toward the component mounting surface, and heat the adhesive film to a predetermined temperature to attach the adhesive film. An adhesive film attached to the component mounting surface and the flexible support by separating the flexible support from one end side of the adhesive film toward the other end side. With the body A separating step of separating, positioning the electronic circuit component on an adhesive film stuck to the component mounting surface, heat-pressing the electronic circuit component toward the component mounting surface, and mounting the electronic circuit component. A connection step of electrically connecting the external connection terminal exposed to the wiring pattern to the wiring pattern, and in the attaching step, a separation start end of the adhesive film with respect to the flexible support in the separation step. A high pressing force is selectively applied to the section and the separation end.

In the present invention, the adhesive film held by the flexible support is cut into a predetermined size, and then is held on the flexible support and adheres to the surface of the adherend. Positioned. The positioned adhesive film is heated and pressed from the back side of the flexible support at a temperature that does not cause thermosetting. As a result, the adhesive film is adhered to the surface to be adhered to the surface to be adhered. However, the adhesive film made of resin is softened by heating and is easily adhered to the surface to be adhered. At this time, the separation start end and the separation end of the adhesive film with respect to the flexible support are selectively pressed with a high pressing force. Thereby, the separation start end and the separation end of the adhesive film are securely adhered to the substrate. Further, the flexible support is curved so that the adhesive film adjacent to the detachable adhesive film does not contact the adherend. Next, the adhesive film is forcibly cooled by cooling air. The adhesive film solidifies again from the state of being softened by cooling, and the adhesive force between the adhesive film and the surface to be adhered becomes strong. Next, the flexible support is separated from one end of the adhesive film adhered to the surface to be adhered toward the other end. At this time, the separation start end and the separation end end of the adhesive film are securely adhered to the substrate by a high pressing force, and the adhesive force is strengthened by cooling, so that the flexible support is peeled from the adhesive film. The adhesive film is not peeled off from the substrate when starting and when peeling is completed.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration of an adhesive film sticking apparatus according to an embodiment of the present invention. 1 includes a movable table 80, a pressing head 11, a cooling mechanism 60, a separating mechanism 40, a supply roll 21, a winding roll 27, and the like.

The supply roll 21 is rotatably supported by a support mechanism (not shown), and is connected to a drive source such as a motor. This supply roll 21 is wound with a base film 100 holding an adhesive film on the surface,
The base film 100 is paid out by rotating in the rotation direction of the arrow R1. The base film 100 fed from the supply roll 21 is moved by a movable table 80 by guide rollers 22, 23 and 24 held rotatably.
Guide roller 2 guided above and rotatably held
It is guided to a take-up roll 27 by 5 and 26.
The base film 100 holds the adhesive film on the side facing the movable table 80. Winding roll 2
Reference numeral 7 is rotatably supported by a support mechanism (not shown), and is connected to a drive source such as a motor. The take-up roll 27 takes up the base film 100 by rotating in the rotation direction of the arrow R2. The drive of the supply roll 21 and the take-up roll 27 is controlled by a control device (not shown). This control device performs traveling control of the base film 100 and tension control so that a predetermined tension acts on the base film 100.

FIGS. 2A and 2B are views showing the structure of the base film 100. FIG. 2A is a side view and FIG. 2B is a plan view. As shown in FIG. 2, the base film 100 is a tape-shaped member is constant width W and a thickness TH _0. The base film 100 is formed of, for example, a resin material such as polyethylene terephthalate (PET) and has flexibility. Width W of the base film 100, for example, about 5 mm, a thickness TH ₀ is 0.
It is about 1 mm.

On the surface of the base film 100, an adhesive film 10 having the same width as the width W of the base film 100 is provided.
1 is pasted. This adhesive film 101
Anisotropic conductive film (ACF)
m). The anisotropic conductive film is a film in which fine metal particles such as silver are dispersed in a thermosetting resin or a thermoplastic resin to form a sheet. The anisotropic conductive film is used for fixing a semiconductor chip on a substrate and making electrical connection as described later. The thickness TH ₁ of the adhesive film 101 is, for example, about 15 μm. The adhesive film 101 is continuous on the base film 100,
As shown in FIG. 2 (a), is cut from the end portion to a predetermined per dimension L ₀ by a cutting mechanism to be described later, is used by peeling the cut adhesive film 101p from the base film 100. In addition, on the surface of the adhesive film 101,
Cover film 10 having a thickness of, for example, about 0.05 mm
The base film 100 is unwound from the supply roll 21 and is peeled off before the adhesive film 101 is cut by a cutting mechanism described later.

The movable table 80 shown in FIG.
It is provided movably on two rails 81 arranged in parallel on S. The movable table 80 holds the holding surface 8
A substrate 200 as an adherend to which the adhesive film 101 is to be adhered is held at 0a. Further, the movable table 80 is movable from a position where the adhesive film 101 is attached to a position where a mounting step of mounting a semiconductor chip is performed as described later.

FIG. 3 is a side view of the movable table 80 viewed from the direction of the arrow E shown in FIG. As shown in FIG.
The movable table 80 is provided with a cutting mechanism 70. The cutting mechanism 70 includes a cutter knife 71, and cuts the adhesive film 101 described above. The cutter knife 71 has a double-edged cutting blade 71a at the tip. The cutting blade 71a has substantially the same width as the adhesive film 101. The cutter knife 71 is held by a holding member 74, and the holding member 74 is movably guided by a guide mechanism 73 provided along the directions of arrows G1 and G2. Further, the holding member 74 is connected to an actuator 72 composed of, for example, an air cylinder, and is driven by the actuator 72 in directions of arrows G1 and G2.

A support portion 76 for supporting the base film 100 is provided above the cutter knife 71, and the base film 100 is supported by a support surface 76a which is a lower surface of the support portion 76. A stopper member 7 that defines a stop position of the cutter knife 71 by contacting the holding member 74 when the cutter knife 71 moves in the direction of the arrow G1 at a position facing the holding member 74.
5 are provided.

The cutting mechanism 70 having the above-described structure moves the movable table 80 along the rail 81 from the state shown in FIG.
By moving it to 1 and positioning it in a predetermined position,
The base film 100 holding the adhesive film 101 is inserted between the cutter knife 71 and the support surface 76a. FIG. 4 shows a base film 100 holding an adhesive film 101 between a cutter knife 71 and a support surface 76a.
It is a figure which shows the state which inserted. Cutter knife 71
After the base film 100 is inserted between the base film 100 and the support surface 76a, when the actuator 72 is driven to raise the cutter knife 71 in the direction of the arrow G1, the cutting blade 71a of the cutter knife 71 cuts into the adhesive film 101.
The cut amount is determined by the stop position of the cutter knife 71 defined by the stopper member 75. In addition, basically, the adhesive film 1 is
01 is cut, and the base film 100 is not cut.

The pressing head 11 shown in FIG. 1 is disposed right above the base film 100 passing over the movable table 80. The pressing head 11 is connected to a piston rod 17a of an air cylinder 17 supported by a support mechanism (not shown) provided on the base BS.
The pressing head 11 is movable in the vertical direction shown by arrows A1 and A2 by the expansion and contraction of the piston rod 17a of the air cylinder 17.

FIGS. 5A and 5B show the structure of the pressing head 11, in which FIG. 5A is a sectional view, and FIG. 5B is a view of the pressing head 11 shown in FIG. . As shown in FIG. 5, the pressing head 11 includes a pressing member 12 and an elastic member 13 attached to a head 12 t of the pressing member 12.
And an electric heater 14 built in the pressing member 12.

The pressing member 12 is made of, for example, a metal material such as stainless steel, and a head portion 12t protrudes from the center of a rectangular parallelepiped body 12d. The dimensions of the head 12t are substantially the same as the dimensions of the cut adhesive film 101, and are, for example, about 5 × 5 mm.
Projecting portions 12a arranged in parallel are formed on both ends of the tip end surface of the head portion 12t. The protrusion amount of the protrusion 12a is, for example, about 0.3 mm and the width is about 1 mm.

The electric heater 14 is connected to the body 1 of the pressing member 12.
The electric heater 14 is provided with a DC current from the power supply 16 shown in FIG. 1 and generates heat to heat the pressing member 12. The pressing member 12 is controlled to a predetermined temperature of, for example, about 80 ° C. to 110 ° C. by adjusting the amount of direct current supplied to adjust the heat generation amount of the electric heater 14.

The elastic member 13 attached to the head 12t
Is formed in a cap shape, and its periphery is fixed to the head portion 12t by a fixing jig 15. The elastic member 13 is formed of, for example, a rubber material containing silicon. The temperature of the elastic member 13 also rises due to the heating of the pressing member 12. The thickness of the elastic member 13 is, for example,
It is about 0.3 mm. The elastic member 13 has a pressing surface 13a.
Presses the back surface of the base film 100 (the surface to which the adhesive film 101 is not attached).

The cooling mechanism 60 shown in FIG.
And a cooling air supply source 62. Nozzle 61
Are arranged so that the cooling air supplied from the cooling air supply source 62 can be blown toward the rear surface of the base film 100 pressed by the pressing head 11. The nozzle 61 is supported by a support mechanism (not shown) provided on the base BS.

The cooling air supply source 62 is at room temperature (about 27 ° C.).
Air at a predetermined temperature, for example, about 22 ° C.
And supply it to the nozzle 61. Further, the cooling air supply source 62 is capable of controlling the blowing time of the cooling air.

The separation mechanism 40 shown in FIG.
1, a movable member 43, a guide member 44 fixed to the movable member 43, a guide roller 45 rotatably held by the movable member 43 adjacent to the guide member 44, and air. And a cylinder 41.

The air cylinder 41 is horizontally arranged by a flange member 42 fixed to the base BS.
A built-in piston rod 41 a is connected to the movable member 43. The air cylinder 41 includes a piston rod 41a.
The movable member 43 can be moved in the horizontal direction shown by the arrows C1 and C2 by the expansion and contraction of.

A base film 100 is in contact with the lower surface of the guide member 44. The base film 100 is curved at one end of the lower surface of the guide member 44 and is guided to the guide roller 45.

As will be described later, the separating mechanism 40 moves the movable member 43 in the direction of the arrow C1,
It acts to separate the base film 100 from the adhesive film 101 adhered to the substrate 200.

Next, an example of a method of attaching an adhesive film using the attaching device 1 having the above configuration and an example of a method of assembling an electronic circuit device will be described with reference to FIGS.
First, after setting the substrate 200 at a predetermined position on the movable table 80 described above, the movable table 80 is moved and positioned at a predetermined position.
The base film 100 in a state where a predetermined tension acts between the support surface 76a and the cutter knife 71 is inserted.
FIG. 6A shows a state where the base film 100 is inserted between the support surface 76 a and the cutter knife 71. In this state, the leading end 101s of the adhesive film 101 formed on the base film 100 is located at a position facing the cutting blade 71a of the cutter knife 71.

The winding roller 27 and the supply roller 21 are rotated from the state in which the tip portion 101s of the adhesive film 101 faces the cutting blade 71a of the cutter knife 71, and the adhesive film 101 is shown in FIG. Run in the direction of arrow J. At this time, as the distal end portion 101s of the adhesive film 101 is moved by ₀ min predetermined dimension L, controls the take-up roller 27 and the supply roller 21. Dimension L
₀ is, for example, 5 mm.

[0042] After the tip 101s of the adhesive film 101 is moved by ₀ min predetermined dimension L, against the adhesive film 101 has been stopped, as shown in FIG. 6 (b), the orientation of the cutter knife 71 in the arrow B1 Then, the adhesive film 101 is cut. At this time, the adhesive film 101 is cut while the back surface of the base film 100 is supported by the support surface 76a of the support portion 76.

After the adhesive film 101 has been cut,
As shown in FIG. 6 (c), the cutter knife 71 is moved to the arrow B2.
In the direction of. As shown in FIG.
The end portion of the adhesive film 101 having the predetermined size L₀ To
The adhesive film 101p that has been cut is
Separating (peeling) from the base film 100
Becomes possible. This adhesive film 10 that can be separated
1p is, for example, the dimension L in the longitudinal direction. ₀ As mentioned above
5 mm and a width of about 5 mm.

After the cutting of the adhesive film 101 is completed, the movable table 80 is moved so that a predetermined adhered surface of the substrate 200 set on the movable table 80 can be separated as shown in FIG. Adhesive film 101p
Position so that it is located below. The substrate 20
0 indicates that a predetermined wiring pattern 200 is formed on the surface. The substrate 200 is, for example, a film-shaped substrate made of PET, and has a thickness of, for example, about 0.1 mm. The wiring pattern 200 is formed of, for example, aluminum and has a thickness of, for example, 30.
It is about μm.

After positioning the substrate 200 with respect to the adhesive film 101p that has become separable, the pressing head 11
Is lowered in the direction of arrow A2 as shown in FIG. Note that the pressing head 11 is heated to a predetermined temperature in advance.

When the pressing head 11 is lowered, FIG.
As shown in (2), the pressing surface 13a of the elastic member 13 of the pressing head 11 contacts the back surface of the base film 100 to press. Thereby, the adhesive film 10 that can be separated
The surface of 1p is pressed against the surface of the substrate 200 and attached. At this time, the adhesive film 101 that has become separable
The unbonded adhesive film 101 adjacent to the substrate 200
So that the base film 100 does not contact the
00 at a predetermined angle θ. The base film 100 is curved, and the predetermined inclination angle θ is determined by the arrangement of the guide rollers 24. That is,
The arrangement of the guide rollers 24 is determined in advance so as to have a predetermined inclination angle θ. The predetermined inclination angle θ is, for example, about 10 degrees.

Further, the adhesive film 10 which has become separable
1p is caused by the pressing by the pressing surface 13a as shown in FIG.
As shown in the figure, a high pressure acts on the protruding portion 12a of the pressing member 12 at the corresponding both ends R1 and R2, and the pressure of the intermediate portion R3 between the both ends R1 and R2 is higher than that of both ends R1 and R2. Low.

On the other hand, since the pressing surface 13a of the pressing head 11 is heated to a predetermined temperature, the adhesive film 101p mainly composed of resin is softened. Therefore, the adhesive film 101p is in close contact with the surface of the substrate 200 and adapts to the surface of the substrate 200. Furthermore, both ends R of the adhesive film 101p
Since high pressure acts on 1 and R2, they adhere more firmly to the surface of the substrate 200.

The heating and pressing of the adhesive film 101p, which can be separated from the back surface of the base film 100 by the pressing surface 13a of the pressing head 11, are performed, for example, by 0.2 to 2 times.
After a predetermined time of about sec, as shown in FIG.
The pressing head 11 is raised in the direction of arrow A1.

In parallel with the lifting operation of the pressing head 11, cooling air is supplied from the nozzle 61 to the pressing surface 13a of the pressing head 11.
Is sprayed toward the back surface of the base film 100 pressed for a predetermined time. The spraying time is, for example, 0.5
About 2 seconds.

By blowing the cooling air, the adhesive film 101p is forcibly cooled. Adhesive film 101
When the p is forcibly cooled, it solidifies because it contains a resin as a main component. After the adhesive film 101p is brought into close contact with the surface of the substrate 200 by heating, this adhered state is fixed by forced cooling, so that the adhesive force between the adhesive film 101p and the surface of the substrate 200 is increased.

After the cooling air is blown, as shown in FIG. 10, the movable member 43 of the separation mechanism 40 is moved in the direction of arrow C1. The movement of the movable member 43 causes the guide member 4 to move.
The curved position of the base film 100 curved by 4 moves in the direction of arrow C1. Since a constant tension T is always applied to the base film 100, the base film 100
It is gradually pulled away from the zero surface.

As shown in FIG. 11, as the movable member 43 advances, the base film 100 is first peeled off from the leading end 101s of the adhesive film 101p. As the movable member 43 further advances, as shown in FIG. 12, separation of the base film 100 and the adhesive film 101p proceeds toward the rear end portion 101e of the adhesive film 101p.

Here, the adhesive film 101p is
00, but the adhesive film 101p
The force separating the base film 100 from the adhesive film 101p acts as a force separating the adhesive film 101p from the surface of the substrate 200. Due to this force, the adhesive film 101p becomes the substrate 2
The adhesive film 101 is easily peeled from the surface of the adhesive film 101.
p is a front end portion 101s and a rear end portion 101e. Front end portion 101s or rear end portion 101e of adhesive film 101p
Is peeled off from the surface of the substrate 200 and is turned up, it results in poor adhesion.

In the present embodiment, as described above, the leading end portion 101s where separation of the base film 100 and the adhesive film 101p starts, or the base film 100
End 10 at which separation of the adhesive film 101p from the end is completed
1e is selectively applied with a high pressing force by the respective protruding portions 11a formed on the pressing head 11, and is firmly adhered. Further, the adhesive force between the substrate 200 and the adhesive film 101p is increased by blowing cooling air to the heated adhesive film 101p to forcibly cool the adhesive film 101p. Therefore, it is possible to reliably prevent the leading end portion 101s or the rear end portion 101e of the adhesive film 101p from peeling off from the surface of the substrate 200 and being turned up.

Next, the movable table 80 is moved to a position where the semiconductor chip is mounted on the substrate 200. FIG.
(A) is a side view in the state where the adhesive film 101p was stuck on the board | substrate 200, (b) is the board | substrate 20 shown in (a).
0 is a top view. As shown in FIG. 13, the adhesive film 101p is formed on the wiring pattern 20 formed on the substrate 200.
It is located on one of the plurality of connection terminals 201a.

The semiconductor chip to be mounted on the adhesive film 101p in this state is positioned. In the semiconductor chip, for example, as shown in FIG. 14, a plurality of external connection terminals 301 made of, for example, gold bumps are formed on a surface 300a on which an integrated circuit is formed. The semiconductor chip 300 is in a so-called bare chip state, and has an outer dimension slightly smaller than that of the adhesive film 101p.
For example, it has a size of 4.4 × 4.2 mm and a thickness of 175 μm.
m. The external connection terminal 301 has an outer dimension of, for example, 100 × 100 μm and a height of 22 × 100 μm.
μm.

The semiconductor chip 300 as shown in FIG.
As shown in (2), the external connection terminals 301 are aligned so as to face the plurality of connection terminals 201a of the wiring pattern 201 formed on the substrate 200.

After the semiconductor chip 300 is positioned with respect to the substrate 200, as shown in FIG. 15, the semiconductor chip 300 is heated using a pressing head 400 heated to a predetermined temperature.
00 is pressed toward the substrate 200. Press head 400
Is heated, for example, to about 150 ° C.

By this heat-compression bonding, the resin which is the main component of the adhesive film 101p made of an anisotropic conductive film is cured after being melted. In addition, when the resin of the anisotropic conductive film is a thermosetting resin, the resin is melted by heating and then undergoes a chemical reaction to be cured, and in the case of a thermoplastic resin, the resin is melted by heating and then cured after cooling. . Thus, the semiconductor chip 300 is fixed on the substrate 200. Further, as shown in FIG. 16, among the conductive particles contained in the anisotropic conductive film, the semiconductor chip 300
The conductive particles existing between the external connection terminal 301 and the connection terminal 201a of the wiring pattern 201 are electrically connected by heat compression. That is, the external connection terminal 301 and the connection terminal 201a of the wiring pattern 201 are electrically connected via the conductive particles.

Through the above steps, the assembly of the electronic circuit device 350 shown in FIG. 16 is completed. According to the present embodiment, the pressing head 11 is provided with the protruding portion 12a to selectively apply a high pressing force to the separation start end and the separation end end of the adhesive film 101p with respect to the base film 100. The adhesive film 10 is adhered to the substrate 200 and then forcedly cooled so that the adhesive film 10
The adhesion force of the 1p separation start end and separation end to the substrate 200 is increased. Therefore, the base film 10 is removed from the adhesive film 101p attached to the substrate 200.
When the adhesive film 101p is peeled off from the substrate 20
It is possible to prevent the adhesive film 101p from being peeled from zero, to prevent the occurrence of defective bonding, to efficiently perform the bonding, and to significantly reduce the time required for bonding the adhesive film 101p. As a result, the semiconductor chip 300 is
This makes it possible to shorten the lead time of the mounting process for mounting at 00.

In the above embodiment, the case where an anisotropic conductive film is used as the adhesive film 101 has been described, but the present invention is not limited to this. For example, a film that does not include conductive particles can be used as the adhesive film 101. FIG. 17 is a diagram showing a state in which a semiconductor chip 300 is mounted on a substrate 200 using an adhesive film 101 containing a resin containing no conductive particles as a main component. As shown in FIG. 17, the adhesive film 500 interposed between the semiconductor chip 300 and the substrate 200 has only the function of fixing the semiconductor chip 300 to the substrate 200. Further, the semiconductor chip 3
The external connection terminal 301 and the connection terminal 201a of the wiring pattern 201 are electrically connected by direct contact.

[0063]

According to the present invention, an adhesive film such as an anisotropic conductive film can be securely and efficiently adhered to an adherend such as a wiring board on which a wiring pattern is formed. As a result, the lead time of the flip-chip mounting process using the adhesive film can be shortened, and the production efficiency of the electronic circuit device can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an adhesive film sticking apparatus according to an embodiment of the present invention.

FIGS. 2A and 2B are diagrams showing a structure of a base film 100, wherein FIG. 2A is a side view and FIG. 2B is a plan view.

FIG. 3 is a side view of the movable table 80 viewed from a direction of an arrow E shown in FIG.

FIG. 4 is a view showing a state in which a base film 100 holding an adhesive film 101 is inserted between a cutter knife 71 and a support surface 76a.

FIG. 5 is a view showing a structure of a pressing head 11,
(A) is a cross-sectional view, and (b) is a view of the pressing head 11 shown in (a) as viewed from the direction of arrow H.

FIG. 6 is a view for explaining a step of cutting the adhesive film using the sticking device 1.

FIG. 7 is a view for explaining a procedure of a sticking step by the pressing head 11;

FIG. 8 is a diagram illustrating a procedure following FIG. 7;

FIG. 9 is a view for explaining a procedure of a cooling step after the sticking step.

FIG. 10 is a diagram for explaining a procedure of a separation step after the cooling step.

FIG. 11 is a view for explaining the procedure of the separation step following FIG. 10;

FIG. 12 is a view for explaining the procedure of the separation step following FIG. 11;

FIG. 13 is a diagram for explaining a state of the substrate in a state where the adhesion of the adhesive film is completed.

FIG. 14 is a perspective view illustrating an example of a semiconductor chip.

FIG. 15 is a view for explaining a thermocompression bonding step of mounting a semiconductor chip on a substrate via an adhesive film.

FIG. 16 is a diagram for describing fixing and electrical connection between a semiconductor chip and a substrate by using an anisotropic conductive film.

FIG. 17 shows a semiconductor chip 30 using an adhesive film 101 containing a resin containing no conductive particles as a main component.
FIG. 5 is a diagram showing a state in which 0 is mounted on a substrate 200.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Sticking apparatus, 11 ... Pressing head, 60 ... Cooling mechanism, 6
DESCRIPTION OF SYMBOLS 1 ... Nozzle, 62 ... Cooling air supply source, 40 ... Separation mechanism,
21: supply roll, 27: take-up roll, 70: cutting mechanism, 80: movable table, 100: base film, 1
01 ... adhesive film.

Claims (24)

[Claims] 1. A cutting step of cutting one end of a series of adhesive films held on the surface of a flexible support into a predetermined size so as to be separable, and attaching the flexible support to an adherend. Positioning the adhesive film, which has become separable on the surface to be adhered, in opposition to the surface to be adhered, pressing the adhesive film from the back side of the flexible support toward the surface to be adhered, and A bonding step of heating and bonding to a temperature, and separating the flexible support from one end side of the adhesive film toward the other end side, thereby bonding the flexible support to the surface to be bonded. And a separating step of separating the adhesive film and the flexible support. In the attaching step, a separation start end and a separation end end of the adhesive film with respect to the flexible support are selected. A method of attaching an adhesive film that applies a high pressing force. 2. After adhering the adhesive film to the surface to be adhered and before separating the flexible support, cooling air is blown from the back of the flexible support to forcibly force the adhesive film. The method for adhering an adhesive film according to claim 1, further comprising a cooling step of cooling to increase an adhering force between the adhesive film and the surface to be adhered. 3. The flexible supporting body is curved in the attaching step so that an unadhered adhesive film adjacent to the detachable adhesive film does not contact the adherend. 2. The method for attaching an adhesive film according to item 1. 4. The method according to claim 1, wherein the cutting step, the adhering step and the separating step are performed while intermittently running a flexible support supporting the adhesive film. 5. The bonding object is a wiring board on which at least a wiring pattern is formed, and the adhesive film is an adhesive film for fixing an electronic circuit component mounted on the wiring board. 2. The method for attaching an adhesive film according to item 1. 6. The adherend is a wiring board on which at least a wiring pattern is formed, and the adhesive film fixes an electronic circuit component mounted on the wiring board, and 2. The method according to claim 1, wherein the adhesive film is an anisotropic conductive film for electrically connecting an external connection terminal exposed on a mounting surface to the wiring pattern. 3. 7. The method according to claim 1, wherein the adhesive film contains a resin as a main component. 8. The pressing member, comprising: an elastic member having a pressing surface; and a pressing member fixed to the distal end, heated to a predetermined temperature, and pressing the pressing surface from the back side. Using a pressing head having a protrusion at a position corresponding to a separation start end and a separation end end of the adhesive film, the adhesive film capable of being separated in the attaching step by the flexible support. The method for attaching an adhesive film according to claim 1, wherein the adhesive film is pressed from the back side. 9. A cutting step of cutting one end of a series of adhesive films held on the surface of the flexible support into a predetermined size so as to be separable, and attaching the flexible support to an adherend. Positioning the adhesive film, which has become separable on the surface to be adhered, in opposition to the surface to be adhered, pressing the adhesive film from the back side of the flexible support toward the surface to be adhered, and A bonding step of heating and bonding to a temperature, and separating the flexible support from one end side of the adhesive film toward the other end side, thereby bonding the flexible support to the surface to be bonded. A separating step of separating the adhesive film and the flexible support, and a back surface of the flexible support after the adhesive film is attached to the surface to be bonded and before the flexible support is separated. Forcibly cooling the adhesive film by blowing cooling air from,
A method for adhering an adhesive film, further comprising a cooling step of increasing a bonding force between the adhesive film and the surface to be adhered. 10. A cutting step of cutting one end of a series of adhesive films supported by a flexible support into predetermined dimensions so as to be separable, and applying the separable adhesive film to an adherend. An adhering step of positioning the adhesive film on the adhering surface, pressing the adhesive film from the back side of the flexible support toward the adhering surface, and heating the adhesive film to a predetermined temperature for adhering; By separating the support from one end side of the adhesive film toward the other end side, a separation step of separating the adhesive film and the flexible support adhered to the surface to be adhered, In the attaching step, an adhesive film that bends the flexible support so that an unattached adhesive film adjacent to the adhesive film that has become separable does not contact the adherend. Sticking method. 11. A cutting means for cutting one end of a series of adhesive films held on the surface of a flexible support to a predetermined size so as to be separable; A press head for heating the adhesive film to a predetermined temperature, comprising a pressing surface for pressing the adhesive film that has become possible from the back side of the flexible support toward the surface to be adhered; Separating means for separating the flexible film from the adhesive film adhered to the surface to be adhered by separating the support from one end of the adhesive film toward the other end thereof, An adhesive film sticking device, wherein the pressing surface of the pressing head selectively applies a high pressing force to a separation start end and a separation end end of the adhesive film on the flexible support. 12. After the adhesive film is attached to the surface to be adhered and before separating the flexible support, cooling air is blown from the back surface of the flexible support to force the adhesive film. The adhesive film sticking device according to claim 11, further comprising cooling means for cooling to increase the sticking force between the adhesive film and the surface to be stuck. 13. A guide means for bending the flexible support so that an unadhered adhesive film adjacent to the detachable adhesive film does not contact the adherend. 3. The adhesive film sticking device according to claim 1. 14. The adherend is a wiring board on which at least a wiring pattern is formed, and the adhesive film is an adhesive film for fixing an electronic circuit component mounted on the wiring board. 12. The adhesive film sticking device according to item 11. 15. The adherend is a wiring board on which at least a wiring pattern is formed, and the adhesive film fixes an electronic circuit component mounted on the wiring board, and The adhesive film sticking device according to claim 11, wherein the adhesive film is an anisotropic conductive film for electrically connecting an external connection terminal exposed on a mounting surface and the wiring pattern. 16. The pressing head comprises: an elastic member having the pressing surface; and a pressing member having the elastic member fixed to a distal end, heated to a predetermined temperature, and pressing the pressing surface from the back side. The adhesive film sticking device according to claim 11, wherein the pressing member includes a protrusion at a position corresponding to a separation start end and a separation end of the adhesive film. 17. The apparatus according to claim 16, wherein the elastic member is formed of a rubber material containing silicon. 18. A flexible support that supports the adhesive film and continuously supplies the flexible support to the pressing head in a state where a predetermined tension is applied to the flexible support. The adhesive film sticking device according to claim 11, further comprising a film supply winding mechanism for winding the support. 19. A method of assembling a wiring board on which at least a wiring pattern is formed, and an electronic circuit device having an electronic circuit component fixed on the wiring board by an adhesive film, wherein the electronic circuit component is held on a surface of a flexible support. A cutting step of cutting one end of the series of the adhesive films to a predetermined size so as to be separable, and separating the flexible support to the component mounting surface by facing the component mounting surface of the wiring board. Positioning the resulting adhesive film, pressing the adhesive film from the back side of the flexible support toward the component mounting surface, and heating and bonding the adhesive film to a predetermined temperature; A separation step of separating the flexible support from the adhesive film adhered to the component mounting surface by separating the flexible support from one end side of the adhesive film toward the other end side, The component board Positioning the electronic circuit component on the adhesive film attached to the mounting surface, heat-pressing the electronic circuit component toward the component mounting surface, and external connection terminals exposed on the mounting surface of the electronic circuit component And a connection step of electrically connecting the wiring pattern and the wiring pattern. In the attaching step, a separation start end and a separation end of the adhesive film with respect to the flexible support in the separation step. Method of assembling an electronic circuit device for selectively applying a high pressing force to the electronic circuit device. 20. After adhering the adhesive film to the surface to be adhered and before separating the flexible support, cooling air is blown from the back surface of the flexible support to force the adhesive film. 20. The method of assembling an electronic circuit device according to claim 19, further comprising a cooling step of cooling and increasing a bonding force between the adhesive film and the surface to be bonded. 21. In the attaching step, the flexible support is curved so that an unadhered adhesive film adjacent to the detachable adhesive film does not contact the adherend. 20. The method for assembling an electronic circuit device according to claim 19. 22. The method for assembling an electronic circuit device according to claim 19, wherein in said connecting step, an external connection terminal of said electronic circuit component is directly connected to said wiring pattern. 23. The adhesive film is an anisotropic conductive film. In the connecting step, an external connection terminal of the electronic circuit component and the wiring pattern are interposed via a conductive material included in the anisotropic conductive film. 20. The method for assembling an electronic circuit device according to claim 19, wherein the electronic circuit device is electrically connected. 24. The method for assembling an electronic circuit device according to claim 19, wherein said adhesive film contains resin as a main component.