KR101148766B1 - Detach device of film - Google Patents

Detach device of film Download PDF

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Publication number
KR101148766B1
KR101148766B1 KR1020100104068A KR20100104068A KR101148766B1 KR 101148766 B1 KR101148766 B1 KR 101148766B1 KR 1020100104068 A KR1020100104068 A KR 1020100104068A KR 20100104068 A KR20100104068 A KR 20100104068A KR 101148766 B1 KR101148766 B1 KR 101148766B1
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KR
South Korea
Prior art keywords
substrate
heating
film
method
moving shaft
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Application number
KR1020100104068A
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Korean (ko)
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KR20120042387A (en
Inventor
김포철
백정기
이종천
Original Assignee
삼성전기주식회사
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Priority to KR1020100104068A priority Critical patent/KR101148766B1/en
Publication of KR20120042387A publication Critical patent/KR20120042387A/en
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Publication of KR101148766B1 publication Critical patent/KR101148766B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00Machines for separating superposed webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004Component parts, details or accessories; Auxiliary operations
    • B29C63/0013Removing old coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Abstract

The present invention relates to a film removing apparatus, and more particularly, to a film removing apparatus for removing a mylar film remaining on a substrate by a heating unit composed of a heating block and a heating blade, comprising: a substrate supporting unit supporting a substrate; A fixed shaft disposed above the substrate support; A moving shaft provided to be movable in the fixed shaft; A heating unit coupled to the moving shaft, wherein the heating unit comprises: a heating block coupled to a lower portion of the moving shaft; And a heating blade pressurizing the laminated member of the substrate supported by the substrate support using heat generated from the heating block.

Description

Detach device of film

The present invention relates to a film removing apparatus, and more particularly, to a film removing apparatus for removing a mylar film remaining on a substrate by a heating unit consisting of a heating block and a heating blade.

Mylar film used to improve exposure and prevent contamination of foreign substances in PCB (Print Curcuit Board) production process should be removed after peeling off mylar film after exposure is completed. The applied automation equipment has low productivity and low peeling success rate, so its utilization is low, and the worker mainly peels the film by hand and supplies it to the developing process.

Manpower requirements, increased worker fatigue, and musculoskeletal disorders have been raised as a problem.

The current peeling equipment adds the primary external force to the Mylar Film and Photo Resist layers prior to peeling, which acts as a cause of foreign matter and affects product quality. There is a need for peeling technology.

As one of the conventional film removal methods, what is disclosed in Japanese Patent Laid-Open No. 2002-211836 is known. In this invention, it raises a film edge part by the knurling roller in which the unevenness | corrugation was formed in the surface, and forms a peeling part partially, and peels with an adhesive roller, conveying a board | substrate with a conveyance roller from this. . However, in recent years, the thickness of the printed wiring board tends to be reduced, and there is a problem that the adhesive force of the adhesive roller is not uniform and the end of the substrate is bent during film peeling or an accident occurs in the device.

Accordingly, the present invention has been made to solve the above disadvantages and problems that are pointed out in the conventional film removal apparatus, the film removal apparatus that can easily remove the film remaining on the substrate using a heating blade (Heating Blade) There is provided an object of the invention.

The object of the present invention includes a substrate support for supporting a substrate, a fixed shaft disposed on the upper portion of the substrate support, a moving shaft which is provided to be movable in the fixed shaft, a heating unit coupled to the moving shaft, The heating unit: a heating block coupled to the lower portion of the moving shaft; And a heating blade pressurizing the laminated member of the substrate supported by the substrate support using heat generated from the heating block.

In addition, the pressure adjusting device is provided on one side of the moving shaft, the moving shaft can be moved up and down inside the fixed shaft.

In addition, the pressure adjusting device may move the moving shaft using pneumatic pressure.

In addition, it may further include an elastic member consisting of a coil spring outside the moving shaft.

In addition, the heating block may be provided with a heat controller that can control a predetermined temperature.

In addition, the heating blade generated heat from the heating block may be formed in the shape of an inverted triangle cross section for pressing the laminated member on the substrate.

In addition, the heating blade for pressing the laminated member on the substrate may melt only the mylar film of the laminated member on the substrate.

In addition, the heating blade for pressing the laminated member on the substrate may cut the laminated member on the substrate.

In addition, the heating blade may horizontally press the laminated member of the substrate while being moved horizontally by the guide portion of the transfer guide portion.

In addition, the heating blade may press the dry film and the mylar film of the portion where the circuit is not formed on the substrate.

In addition, the mylar film of the laminated member may be removed using an adhesive tape after being pressed by the heating blade.

In addition, the stacking member may be sequentially stacked dry film and mylar film on the substrate.

In addition, the substrate support portion facing the heating blade is located on the lower side of the substrate, a roller may be installed on the substrate support portion.

The present invention provides a film removing device having a heating unit composed of a heating block and a heating blade, it is possible to prevent the generation of foreign substances appearing during the peeling process through the existing knurling operation, and to prevent damage to the substrate by applying the pressure control device of the heating unit There are advantages to it.

1 to 2 is a cross-sectional view of the film removing device according to an embodiment of the present invention.
3 to 6 are steps of film removal according to an embodiment of the present invention.

The situation regarding the operational effects including the technical configuration of the film removing apparatus according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The embodiments may be provided to make the disclosure of the present invention complete, and to fully inform the scope of the invention to those skilled in the art.

1 and 2 will be described in detail with respect to the film removing device according to an embodiment of the present invention.

Film removing apparatus according to an embodiment of the present invention is fixed to the fixed shaft 10 disposed on the upper portion of the substrate support, the movable shaft 20 provided to be movable in the fixed shaft, the substrate 100 is not damaged The heating unit 40, consisting of a heating block 42 having a resilient member 30, a controller capable of controlling the temperature and a heating blade 44 in which a predetermined temperature is conducted from the heating block 42, the The substrate supporting part 50 supports the substrate 100 by facing the heating blade 44 of the heating part 40.

The fixed shaft 10 is connected to the fixed shaft support 15, the fixed shaft support 15 is connected to the support 60.

The moving shaft 20 is formed on the lower end side of the fixed shaft 10 and the moving shaft 20 is less than or equal to the inner diameter of the fixed shaft 10, the moving shaft 20 into the inside of the fixed shaft The upper end of the) can be inserted and moved up and down. In addition, due to the pressure regulator (not shown) separately provided on one side of the movable shaft 20, the movable shaft 20 is freely moved to the inside of the fixed shaft 10 according to the thickness of the substrate 100, Can be moved down.

The pressure regulator is a device for adjusting the pressure of the air, is connected to the moving shaft (20). In the present invention, the moving shaft 20 is moved up and down inside the fixed shaft 10 using pneumatic pressure, but the up and down moving method of the moving shaft 20 is not limited to pneumatic pressure.

In addition, an elastic member 30 is provided between the movable shaft 20 and the fixed shaft so as not to damage the substrate 100. The elastic member 30 may be present in the form of a coil spring on the outside of the moving shaft 20, but may not be located on the outside of the moving shaft 20 if the elastic member 30 is applied to the moving shaft 20. . In addition, the elastic member 30 is the heating blade (44) which is described below by the pressure adjusting device connected to the moving shaft 20 is in contact with the substrate 100, the substrate 100 is the heating blade ( 44) to prevent damage.

The heating unit 40 may be composed of a heating block 42 and the heating blade.

The heating block 42 is formed on one side of the lower end of the moving shaft 20, the heating block 42 is provided with a heat controller (not shown) that can control a predetermined temperature separately heating block 42 Can transfer heat to The temperature of the heat transferred to the heating block 42 may be 200 ° C. to 400 ° C., which is a temperature at which the dry film 102 and the mylar film 103 existing on the substrate 100 are melted.

A heating blade 44 may be mounted at the end of the heating block 42, and the heating blade 44 receives heat to the heating block 42. The heating blade 44 may be formed in the shape of an inverted triangle cross section at the bottom of the heating block to cut or scrape the dry film 102 and the mylar film 103 sequentially stacked on the substrate 100. . However, the shape of the heating blade 44 will be fine as long as the shape can be in line contact with the dry film 102 and the mylar film 103 existing on the substrate 100, and also with the dry film 102 The number of the heating blades 44 in contact with the mylar film 103 is not limited.

The substrate support 50 is positioned at the lower end of the substrate 100 and is fixed to the support 60 by the substrate support 50.

The substrate support 50 is positioned on the lower surface of the substrate 100 to support the substrate 100, and the substrate 100 is easily moved by providing a roller on the upper surface of the substrate support 50. You can do that.

The support 60 may fix the fixed shaft support 15 and the substrate support 50 which fix the fixed shaft 10.

In addition, the support 60 may be moved left and right through the guide portion 75 formed in the transfer guide 70, the fixed shaft support 15 and the substrate support fixed to the support 60 50 can move from side to side.

The support 60 may move along the transfer guide part 70 through air pressure, but is not limited thereto and may move left and right using electric or hydraulic pressure.

The transfer guide part 70 is attached to the fixing part 80.

The substrate 100 may be moved between the heating part 40 and the substrate support part 50 by a conveyor belt (not shown), and may be moved by the heating blade 44 of the heating part 40. The dry film 102 and the mylar film 103 of 100 are cut and scratched.

With reference to Figures 3 to 6 will be described in detail with respect to the film removal method and the fixing sequence of the film removal apparatus in an embodiment of the present invention.

Film removal fixing sequence according to an embodiment of the present invention is the substrate 100 in Figure 3 is a heating blade and the substrate of the heating unit 40 is attached to one side of the lower end of the moving shaft 20 by a conveyor belt (not shown) It moves up to between the supports 50. The substrate 100, which is moved between the heating blade 44 and the substrate support 50, may be an end of the substrate 100 in which a circuit is not formed. However, even if not the end of the substrate 100 may be a portion where the circuit is not formed, but is not limited thereto.

In this case, the heating part 40 and the substrate support part 50 may be wider than the thickness of the substrate 100 so that the substrate 100 is carried in. In this case, the substrate support 50 is fixed, and the moving shaft 20 moves inside the fixed shaft 10.

In addition, the substrate 100 may be entered between the heating part 40 and the substrate support part 50 by the conveyor belt (not shown), but the present invention is not limited thereto. May be moved in the entry direction or the opposite direction of the substrate 100 to enter the substrate 100 where the circuit is not formed. The support 60 may move along the guide portion 75 formed on the transfer guide portion 70.

In FIG. 4, the heating blade 44 may contact the substrate 100 by the moving shaft 20. In this case, the movable shaft 20 may move to the substrate 100 until the heating blade 44 is in line with the dry film 102 and the mylar film 103, and the heating blade 44 may move the substrate ( You may approach to the top of 100). The circuit may not be formed on the upper surface of the substrate 100 to which the heating blade 44 approaches.

In addition, in this case, the heating blade 44 may receive heat from the heating block 42.

In FIG. 5, the dry film 102 and the mylar film 103 which are sequentially stacked on the substrate 100 may be cut by the heating blade 44.

In another embodiment, the heating blade 44 receives 210 ° C to 250 ° C from the heating block to pressurize the dry film 102 and the mylar film 103 which are sequentially stacked on the substrate 100. In this case, since the melting point of the dry film 102 is about 200 ° C., and the melting point of the mylar film 103 is 260 ° C. or more, the dry film 102 and the mylar film (pressurized by the heating blade 44) Only the dry film 102 of the 103 is melted by the heating blade (44).

At this time, as the support 60 moves left and right along the guide portion 75 of the transfer guide part 70, the heating blade 44 moves left and right to form the dry film 102 formed on the substrate 100. ) And the mylar film 103 may be cut or only the mylar film 103 is melted.

In another embodiment, the substrate 100 is moved left and right by the converter belt while cutting the dry film 102 and the mylar film 103 by the heating blade 44 or the mylar film 103. ) Can only melt.

In some cases, the heating blade 44 may approach the substrate 100 to scratch the substrate 100, but the heating blade 44 may be a dummy part in which a circuit is not formed.

In FIG. 6, between the lower surface of the mylar film 103 and the substrate 100 are separated by the dry film 102 and the mylar film 103 which are cut to the left and right, and air is introduced therebetween.

By attaching an adhesive tape (not shown) on the upper surface of the mylar film 103 into which air is introduced, the mylar film 103 can be easily peeled off at a constant angle and speed.

In another embodiment, since the heating blade 44 melts only the dry film 102 among the laminated members existing on the substrate 100, a space is spaced between the mylar film 103 and the substrate 101. The mylar film 103 can be easily peeled off.

In this case, an adhesive roller or the like may be used as the method of peeling the mylar film 103, but is not limited thereto.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. The foregoing embodiments are intended to illustrate the best state in carrying out the present invention, and to utilize other inventions such as the present invention in other conditions known in the art, as well as in specific applications and uses of the invention. Various changes are possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

10: fixed shaft
20: moving shaft
30: elastic member
40: heating unit
42: heating block
44: heating blade
50: substrate support
60 support
70: transfer guide part
75: guide part
80: fixed part
100: substrate
101: description
102: dry film
103: mylar film

Claims (13)

  1. A substrate support for supporting a substrate;
    A fixed shaft disposed above the substrate support;
    A moving shaft provided to be movable in the fixed shaft;
    Including a heating unit coupled to the moving shaft,
    The heating unit:
    A heating block coupled to the lower portion of the moving shaft; And
    A heating blade configured to press the stacking member of the substrate supported by the substrate support using heat generated from the heating block,
    A substrate supporting part facing the heating blade is located on the lower side of the substrate, and a film is provided on the substrate supporting part to prevent breakage of the substrate, to maintain tension of the substrate, and to make the heating blade slip on the substrate. Removal device.
  2. The method of claim 1,
    A film removing device having a pressure adjusting device on one side of the moving shaft to move the moving shaft up and down inside the fixed shaft.
  3. The method of claim 2,
    The pressure adjusting device is a film removing device for moving the moving shaft using the pneumatic.
  4. The method of claim 1,
    Film removing device further comprises an elastic member consisting of a coil spring outside the moving shaft.
  5. The method of claim 1,
    The heating block is a film removing device having a heat controller that can control a constant temperature.
  6. The method of claim 1,
    Heating blades generated heat from the heating block is formed in the cross-sectional shape of the inverted triangle to press the laminated member on the substrate, the heating blade is a film removal device that includes a spring to prevent breakage of the substrate.
  7. The method of claim 1,
    Heating blades for pressing the laminated member on the substrate that can melt only the dry film of the laminated member on the substrate film removal apparatus.
  8. The method of claim 1,
    Heating blades for pressing the laminated member on the substrate is a film removing device capable of melting the laminated member on the substrate to be discharged out of the mylar film.
  9. The method of claim 1,
    The heating blade is a film removal device for horizontally pressing the laminated member of the substrate while being moved horizontally by the guide portion of the transfer guide.
  10. The method of claim 9,
    The heating blade is a film removing device for pressing the dry film and the mylar film of the portion where the circuit is not formed on the substrate.
  11. The method of claim 10,
    Mylar film of the laminated member is removed by using an adhesive tape after being pressed by a heating blade.
  12. The method of claim 1,
    The stacking member is a film removing device in which a dry film and a mylar film are sequentially stacked on the substrate.
  13. delete
KR1020100104068A 2010-10-25 2010-10-25 Detach device of film KR101148766B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100104068A KR101148766B1 (en) 2010-10-25 2010-10-25 Detach device of film

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020100104068A KR101148766B1 (en) 2010-10-25 2010-10-25 Detach device of film
JP2011139250A JP5290358B2 (en) 2010-10-25 2011-06-23 Film removal device
CN201110238430.3A CN102452574B (en) 2010-10-25 2011-08-18 Membrane separation device

Publications (2)

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KR20120042387A KR20120042387A (en) 2012-05-03
KR101148766B1 true KR101148766B1 (en) 2012-05-25

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KR1020100104068A KR101148766B1 (en) 2010-10-25 2010-10-25 Detach device of film

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JP (1) JP5290358B2 (en)
KR (1) KR101148766B1 (en)
CN (1) CN102452574B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103407634B (en) * 2013-07-16 2015-04-01 吴江市博众精工科技有限公司 Dustproof material feeding mechanism capable of automatically uncovering dustproof membranes
CN104669765B (en) * 2015-03-23 2016-09-14 南通鑫祥锌业有限公司 A kind of zinc material film removing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05147819A (en) * 1991-11-29 1993-06-15 Ibiden Co Ltd Method and apparatus for separating mylar for dry film
JPH09162532A (en) * 1995-12-11 1997-06-20 Senju Metal Ind Co Ltd Formation of bump on bga substrate and reflow furnace used therefor
JP2002334905A (en) * 2001-05-09 2002-11-22 Sony Corp Method for adhering adhesive film, device for adhering, and assembling method for electronic circuit device
JP2005317711A (en) * 2004-04-28 2005-11-10 Lintec Corp Peeling device and peeling method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158197U (en) * 1978-04-26 1979-11-05
JP4204653B2 (en) * 1997-06-20 2009-01-07 リンテック株式会社 Sheet peeling apparatus and method
KR20040110391A (en) * 2003-06-19 2004-12-31 삼성전자주식회사 substrate treatment apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05147819A (en) * 1991-11-29 1993-06-15 Ibiden Co Ltd Method and apparatus for separating mylar for dry film
JPH09162532A (en) * 1995-12-11 1997-06-20 Senju Metal Ind Co Ltd Formation of bump on bga substrate and reflow furnace used therefor
JP2002334905A (en) * 2001-05-09 2002-11-22 Sony Corp Method for adhering adhesive film, device for adhering, and assembling method for electronic circuit device
JP2005317711A (en) * 2004-04-28 2005-11-10 Lintec Corp Peeling device and peeling method

Also Published As

Publication number Publication date
JP2012091864A (en) 2012-05-17
JP5290358B2 (en) 2013-09-18
KR20120042387A (en) 2012-05-03
CN102452574B (en) 2016-08-24
CN102452574A (en) 2012-05-16

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