JP2007049100A - Sticking device, method for sticking membrane, semiconductor device, and display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sticking device capable of suppressing the occurrence of pin holes and void in mounting a semiconductor device on a circuit substrate and preventing an adhesive layer from being exfoliated from the circuit substrate in exfoliating a separator from the adhesive layer. <P>SOLUTION: The sticking device is one having a pressurizing section that crimps the adhesive layer onto the circuit substrate a part of the principal plane of which is exposed by providing a coating layer with an opened region prepared on the principal plane, and is such that the pressurizing section applies a pressure larger than that applied to the edge of the coating layer that forms the opened region to regions other than the edge while it pressurizes and crimps the opened region and the coating layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a sticking device, a film sticking method, a semiconductor device, and a display device. More specifically, the present invention relates to a sticking device for pressure-bonding an adhesive layer, a method for sticking a film using the same, and a semiconductor device and a display device including the adhesive layer attached using the sticking method.

The sticking device is for joining by pressurizing and heating members, and is widely used in the manufacture of semiconductor devices and the like used in electronic and electrical equipment such as liquid crystal display devices. As a technique using such a sticking apparatus, a COF (Chip On Film) flip chip mounting method is widely known. In this method, bumps are formed on an IC (semiconductor integrated circuit), an ACF (Anisotropic Conductive Film) is interposed between the bump formation side of the IC and the substrate, and the IC and the substrate are heated and pressed. This is a technique to join the upper wiring.

In order to improve the reliability of such a flip chip mounting technique, a method for improving the state of attachment of the ACF is conceivable. As shown in FIG. 10A, the sticking surface of the pressure unit 6 (made of rubber) of the conventional sticking device was larger than the non-formation region of the resist (coating layer) 3. Therefore, when the ACF 4 is attached to the circuit board 7 provided with the wiring 2 and the resist 3 in this order on the substrate 1 by heating and pressurizing, as shown in FIG. Since a high pressure is applied in the upper region of the part, the film thickness of the ACF 4 becomes thin. In addition, since the ACF 4 is insufficiently filled in the vicinity of the resist 3 on the wiring 2, a large amount of air is caught between the ACF 4 and the circuit board 7. As a result, pinholes and voids were generated when the IC was bonded to the circuit board 7 to which the ACF 4 was adhered. Here, the pinhole is a hole having a diameter of several μm to several tens of μm that penetrates in the thickness direction of the ACF. Air pinched when the ACF is stuck or air caught when the IC is connected (mounting) Is generated by the expansion of heat (170 to 250 ° C.) when the IC is connected, and the ACF expands like a balloon and bursts through. On the other hand, a void is a bubble inside the ACF, which is generated when air entrained when the ACF is stuck or air entrained during IC connection (mounting) remains in the ACF after IC connection.

When a pinhole is generated, the wiring is exposed to the outside air, so that it easily corrodes. Further, when a conductive material comes into contact with the pinhole, an electric leak occurs. On the other hand, when a void occurs, the bonding strength between the IC and the circuit board decreases, and an insulation failure due to the occurrence of dendrites or the like tends to occur inside the void across the terminals.

As a method of suppressing this pinhole, (1) a method of increasing the film thickness of ACF, (2) a method of optimizing the temperature profile at the time of pressure bonding in order to reduce air entrainment during pressure bonding, etc. Has been proposed. However, the method (1) has a manufacturing limit to increase the thickness of the ACF, and if the thickness is increased, the ACF adheres to the pressure part of the sticking device, and the method (2). However, the optimum profile differs depending on the resin as the adhesive, and the pinholes could not be removed sufficiently.

On the other hand, as a method for suppressing voids, (1) a method of optimizing the temperature profile at the time of IC connection in order to reduce air entrainment when connecting the IC, and (2) before connecting the IC , A method of removing air caught by baking the board, and (3) using a sticking device in which the pressurizing part has a recess corresponding to the wiring pattern of the circuit board, There have been proposed a method of moving to an unnecessary region above, and (4) a method of expanding an adhesive layer such as ACF during pressure bonding (for example, see Patent Documents 1 and 2). However, in the method (1), the optimum profile differs depending on the resin, and voids cannot be sufficiently removed. In the methods (2) to (4), the voids are sufficiently removed. There was room for improvement. Although it is considered that (2) to (4) can be used as a method for suppressing pinholes, there is still room for improvement in order to sufficiently remove pinholes. It was.
JP 2001-60758 A JP 2001-64619 A

The present invention has been made in view of the above-described situation, and pinholes and voids are not formed when a semiconductor element is mounted on a circuit board without increasing the ACF film thickness or optimizing the temperature profile. It aims at providing the sticking apparatus which can suppress generation | occurrence | production.

The present inventors have provided a pressurizing part for pressure-bonding an adhesive layer (ACF) to a circuit board in which a part of the main surface is exposed by providing a coating layer (resist) having an opening region on the main surface. A bonding apparatus provided, which provides a semiconductor device in which the generation of pinholes and voids is suppressed, and can prevent the ACF from peeling from the circuit board when the separator is peeled from the ACF. As a result of various investigations, attention was paid to the shape of the pressure-applying part on the sticking surface side.

And as shown to Fig.10 (a), when the pressurization part (made of rubber) 6 of the conventional sticking apparatus is a rectangular parallelepiped, and the sticking surface is larger than the non-formation area | region (opening area | region) of the resist 3, As shown in FIG. 10B, it was found that the pressure applied to the upper region of the edge portion of the resist 3 was larger than that of the other upper region. Therefore, the inventors of the present invention used a bonding apparatus having a rectangular parallelepiped pressure portion 6 having a bonding surface smaller than the non-formation region of the resist 3 as shown in FIG. An attempt was made to pressure-bond onto the substrate 7. Then, as shown in FIG. 11B, (1) the pressure applied to the upper region of the edge of the resist 3 is reduced, and the film thickness of the ACF 4 in the upper region of the edge of the resist 3 is increased. (2) ACF 4 is satisfactorily filled in the vicinity of the resist 3 on the wiring 2 exposed in the opening region, and the amount of air caught between the ACF 4 and the circuit board 7 is reduced, thereby generating pinholes and voids. It was found that it can be suppressed.

However, when this sticking apparatus is used, the upper region of the resist 3 is not pressurized at all, so that the ACF 4 is not sufficiently pressed onto the circuit board 7 so that the pressure part of the ACF 4 and the sticking apparatus does not adhere. It was found that when the separator 5 provided on the ACF 4 was peeled off from the ACF 4, the ACF 4 was peeled off from the circuit board 7. Therefore, by applying a larger pressure on the other area than the edge area of the covering layer that forms the opening area when the pressing portion pressurizes and press-bonds the opening area and the covering layer, While being able to obtain the effects of (1) and (2) above, it has been found that the adhesive layer can be adhered to the upper region of the coating layer with sufficient strength, and the above problems can be solved brilliantly. The present invention has been reached.

That is, according to the first aspect of the present invention, there is provided a paste provided with a pressure unit that presses an adhesive layer onto a circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface. In the application device, the pressurizing unit applies pressure larger than the pressure exerted on the edge of the coating layer that forms the opening region to pressurize and pressurize the opening region and the coating layer. It is the sticking device which affects to the area.

In the present invention, the circuit board is a board in which a part of the main surface is exposed by providing a covering layer having an opening region on the main surface, and is a so-called printed wiring board (PWB). It is. That is, a conductive pattern (wiring pattern) is formed and fixed on the surface of the substrate by wiring that is a conductive material, and chip electronic components such as transistors, resistors, and capacitors, and semiconductor elements such as ICs (semiconductor integrated circuits) are mounted. Is done. The substrate may be a soft substrate (flexible substrate) or a hard substrate. The main surface of the circuit board is a board surface on the side where a semiconductor element such as a coating layer or an IC is mounted.

The opening region is a region on the main surface where the coating layer is not formed, but at least a part of the outer peripheral portion of the region only needs to be a boundary between the region and the coating layer, and is surrounded by the coating layer. It is not limited to the area.
The edge part of the said coating layer is a part of the main surface which exists between the side surface of the coating layer which forms an opening area | region, and this side surface from predetermined width. That is, the side surface of the coating layer that is in contact with the boundary between the opening region and the coating layer, and a part of the coating layer on the main surface that is between the side surface and a predetermined width. The predetermined width is preferably about 0.2 mm.

Although the said adhesive layer is not specifically limited, It is preferable that it is ACF (Anisotropic conductive film; Anisotropic Conductive Film) etc. ACF is a resin in which conductive particles such as nickel, gold, and copper are dispersed in a resin as an adhesive, and the conductive particles share the electrical connection and the adhesive maintains the pressure contact state. . When mounting a semiconductor element such as an IC (semiconductor integrated circuit) on which a bump is formed on a circuit board, the ACF is attached to the circuit board by heating and pressurizing using an attaching device, and the ACF is passed through the ACF. Then, the semiconductor element and the circuit board are joined by heating and pressing. According to the flip chip method using the ACF, it is possible to adjust the variation in bump height.

When sticking an adhesive layer on a circuit board using the sticking apparatus of the present invention, a film other than the adhesive layer may be disposed between the pressure unit and the circuit board. Although it does not specifically limit as films | membranes other than this contact bonding layer, It is preferable that it consists of protective layers, such as a separator. Thereby, in the case of crimping | bonding, it can prevent that the contact bonding layer and the pressurization part of a sticking apparatus adhere | attach. The protective layer such as a separator may be one layer or two or more layers.

The pressure unit provided in the sticking device of the present invention applies pressure larger than the pressure exerted on the edge of the coating layer forming the opening region when the opening region and the coating layer are pressurized and pressed. It affects the area other than the part. Thereby, the pressure applied to the upper region of the edge portion of the coating layer is smaller than that of the upper region other than the edge portion of the coating layer, and the film thickness of the adhesive layer in the upper region of the edge portion of the coating layer is increased. In addition, the filling of the adhesive layer is good in the vicinity of the covering layer in the opening region, and the amount of air caught between the adhesive layer and the circuit board is reduced. As a result, it is possible to suppress the generation of pinholes and voids when mounting a semiconductor element on a circuit board. In addition, since the pressurizing unit exerts pressure on the upper region of the coating layer, the adhesive layer is sufficiently adhered to the circuit board, and the adhesive layer is removed from the circuit board when the protective layer such as the separator is peeled off from the adhesive layer. Peeling can be prevented. In addition, it is preferable that the coating layer which a pressurization part pressurizes is a coating layer around an opening area | region.

In the present invention, the pressurizing portion refers to a portion in contact with the material to be pressed, and is configured to be movable up and down by a drive mechanism. Therefore, the pressurizing unit may have a structure that can be detached from the sticking device.
Moreover, as a structure of the sticking apparatus of this invention, as long as it has a pressurization part and can show the above-mentioned effect, it will not specifically limit about another structure, A normal ACF sticking A configuration similar to that of the apparatus can be used.

The second aspect of the present invention is a sticking device provided with a pressure unit that presses an adhesive layer onto a circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface. And the said pressurization part is equipped with the convex part which pressurizes an opening area | region and a coating layer, and protrudes to the sticking surface side, The said convex part is the sticking | fitting loosely fitted to an opening area | region when crimping | bonding It is also a device.

The loose fitting in the opening area means that when the pressure bonding is performed, the sticking surface of the pressurizing part is in contact with the substrate surface of the opening area, and the side surface of the pressing part is not in contact with the side surface of the covering layer in the opening area. It means that the sticking surface of the pressurizing part is fitted to such an extent that it does not directly press the edge of the coating layer. In consideration of the fact that misalignment occurs in the alignment between the opening area and the pressure unit in the actual manufacturing process, even if the circuit board is not strictly positioned at a predetermined position below the pressure unit, It is preferable that the convex portion is gently fitted into the opening region in the circuit board to such an extent that the entire sticking surface of the convex portion provided in the portion can press the opening region in the circuit board.

According to such a configuration, when a semiconductor element is mounted on a circuit board, a pinhole can be applied to a region other than the edge of the coating layer when pressure bonding. And the generation of voids can be suppressed, and the adhesive layer can be prevented from peeling from the circuit board when the protective layer such as the separator is peeled from the adhesive layer. In addition, if the said convex part is the part protruded to the sticking surface side, the shape may not be a convex shape exactly | strictly.

In the first and second inventions, it is preferable that a wiring is formed between the coating layer and the circuit board, and a part of the wiring is exposed in the opening region. As a result, even in the circuit board on which the wiring is formed, the adhesive layer is satisfactorily filled in the vicinity of the coating layer on the wiring in the opening region, and the air caught between the adhesive layer and the circuit board is reduced. As a result, it is possible to suppress the generation of pinholes and voids when mounting a semiconductor element on a circuit board.

In the first and second inventions, the pressurizing part is preferably formed of an elastic material. Thereby, in the crimping | compression-bonding, since the sticking surface of a pressurization part changes according to a wiring pattern rather than the pressurization part formed with the nonelastic material, the filling on a circuit board can be made favorable. . The elastic material preferably has a heat resistance of 80 ° C. or higher so as not to be deformed by heat at the time of pressure bonding. For example, silicon rubber or the like is preferably used.
Thus, when the pressurizing part is formed of an elastic material, the height of the convex part is preferably higher than the height from the circuit board main surface of the opening region to the upper surface of the coating layer. According to this, when crimping, the sticking surface of the pressurizing unit is in contact with the substrate surface of the opening region, and the side surface of the pressurizing unit is not in contact with the side surface of the coating layer of the opening region. Since the sticking surface is fitted to the extent that it does not directly press the edge of the coating layer, the effect of the present invention can be exhibited.

It is preferable that a wiring is formed between the covering layer and the circuit board, and a part of the wiring is exposed in the opening region. As a result, even when a wiring is formed between the circuit board and the circuit board, an adhesive layer is satisfactorily formed on the wiring exposed in the opening region. And generation | occurrence | production of a void can be suppressed.

The sticking surface of the convex part is preferably smaller than the opening region and larger than the wiring non-forming region in the opening region. Thereby, the pressurizing part can exert pressure on the upper region of the overlapping part of the opening region and the wiring forming region.

It is preferable that the convex portion has a concave portion so that the convex portion is loosely fitted to the wiring non-formation region in the opening region. Thereby, since a pressurization part becomes a shape along the wiring pattern formed with the wiring and coating layer on the circuit board, it can make favorable filling of the adhesive layer between wiring.

It is preferable that the convex part is loosely fitted into the opening region when being crimped, and that the vertical cross section of the convex part with respect to the sticking surface is formed by a curve that swells toward the sticking surface. Thereby, while it can prevent that a pressure becomes high in the upper area | region of the edge part of a coating layer, sufficient pressure can be exerted so that a contact bonding layer may adhere to a circuit board in another area | region. In addition, the filling of the adhesive layer in the vicinity of the wiring on the substrate is good, and further, the air that has been caught when the adhesive layer is pressure-bonded can be easily released out of the mounting region of the semiconductor element or the like. As a result, generation of pinholes and voids can be suppressed when semiconductor elements are mounted on the circuit board, and the adhesive layer is peeled off from the circuit board when the protective layer such as a separator is peeled off from the adhesive layer. Can be prevented.

It is preferable that the pressurizing portion includes a concave portion in a region corresponding to the edge portion of the coating layer when the pressure bonding is performed. Thereby, it can fully prevent that a pressure becomes high in the upper area | region of the edge part of a coating layer. In addition, as long as the said recessed part is the part depressed in the other side of the sticking surface, the shape may not be a concave shape exactly | strictly.

According to a third aspect of the present invention, there is provided a sticking apparatus including a pressure unit that presses an adhesive layer onto a circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface. And the said pressurization part is also the sticking apparatus by which the notch was provided in the area | region corresponding to the edge of the coating layer which forms an opening area | region when pressurizing and crimping | bonding an opening area | region and a coating layer.

In the third aspect of the present invention, the direction of cutting in the region corresponding to the edge of the coating layer when crimping in the pressurizing part is not particularly limited, and is formed in a direction perpendicular to the sticking surface. And cuts formed in the same (parallel) direction. The number of cuts is not particularly limited, and may be one or two or more. As a result, it is possible to sufficiently prevent the pressure from increasing in the upper region of the edge of the coating layer, while in other regions, the adhesive layer may exert sufficient pressure to press the circuit board. It is possible to satisfactorily fill the opening region with the adhesive layer. As a result, generation of pinholes and voids can be suppressed when semiconductor elements are mounted on the circuit board, and the adhesive layer is peeled off from the circuit board when the protective layer such as a separator is peeled off from the adhesive layer. Can be prevented.

It is preferable that the pressure part is provided with a cut in a region corresponding to the coating layer when pressure-bonding. It is preferable that the notch is provided so that a portion where the notch of the pressurizing portion is not provided does not come into contact with an edge portion of the coating layer forming the opening region when the pressure bonding is performed.
Thereby, it is possible to sufficiently prevent the pressure from increasing in the upper region of the edge portion of the coating layer, and it is also possible to exert pressure on the upper region of the coating layer.

Wiring is formed between the covering layer and the circuit board, and the pressurizing portion is substantially in contact with the covering surface in the area corresponding to the wiring forming area in the covering layer and the opening area when crimping. A cut is provided in the vertical direction, and the cut is preferably shorter in a region corresponding to the wiring formation region in the opening region than in a region corresponding to the coating layer when the pressure bonding is performed. In this way, by providing the cuts, the pressure applied to the adhesive layer on the circuit board can be adjusted for each region at the time of crimping, so that the pressure increases in the upper region of the edge of the coating layer. Can be sufficiently prevented. On the other hand, in other regions, it is possible to exert sufficient pressure for the adhesive layer to adhere to the circuit board, and the adhesive layer can be satisfactorily filled into the opening region and the wiring non-forming region. As a result, it is possible to prevent the adhesive layer from peeling from the circuit board when peeling the protective layer such as the separator from the adhesive layer while suppressing the generation of pinholes and voids when mounting the semiconductor element on the circuit board. be able to. In the present specification, the substantially vertical cut includes not only a cut formed in a vertical (90 °) direction but also a cut formed in a direction capable of achieving substantially the same function and effect. It is out.

According to a fourth aspect of the present invention, there is provided a sticking apparatus including a pressure unit that presses an adhesive layer onto a circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface. The pressurizing portion is formed of an elastic material, and the elastic material is adhered in a region corresponding to the covering layer that is softer than a region corresponding to the opening region when the pressure bonding is performed. It is also a device. It is preferable that the elastic material has the softest area corresponding to the edge of the coating layer when it is pressure-bonded. According to such a sticking apparatus, even if the shape of the pressurizing portion is not a shape along the wiring pattern of the circuit board but a rectangular parallelepiped, the pressurizing portion is an upper region of the coating layer edge portion when crimping. Since it is possible to apply a greater pressure to the other upper region than that, the protective layer such as the separator is peeled off from the adhesive layer while suppressing the generation of pinholes and voids when mounting the semiconductor element on the circuit board. In this case, it is possible to prevent the adhesive layer from peeling off from the circuit board. When wiring is formed between the covering layer and the circuit board, the elastic material corresponds to a region corresponding to the covering layer, a region corresponding to the wiring forming region in the opening region, and a wiring non-forming region. It is preferable that the areas are soft in the order of the areas to be processed. Thereby, since the pressure which hold | suppresses the coating layer, wiring, and the upper area | region of a board | substrate can each be optimized, an adhesive layer can be favorably filled to a wiring non-formation area | region.

The configuration of the present invention is not particularly limited as long as such components are formed as essential, and other components may or may not be included.

The present invention is also a film sticking method performed using the sticking apparatus. According to such a sticking method, the adhesive layer is peeled from the circuit board when the protective layer such as the separator is peeled from the adhesive layer while suppressing the generation of pinholes and voids when mounting the semiconductor element on the circuit board. Can be prevented from peeling off.

This invention is also a semiconductor device provided with the contact bonding layer stuck using the said sticking apparatus. In the present invention, a semiconductor device means a chip electronic component such as a transistor, a resistor, and a capacitor, and a semiconductor element such as an IC (semiconductor integrated circuit) mounted on a circuit board. According to such a semiconductor device, the adhesive layer is removed from the circuit board when the protective layer such as the separator is peeled off from the adhesive layer while suppressing the generation of pinholes and voids when mounting the semiconductor element on the circuit board. A semiconductor device in which peeling is prevented can be provided. Examples of the use of such a semiconductor device include IC cards and constituent materials for display devices.

This invention is also a display apparatus provided with the contact bonding layer stuck using the said sticking apparatus. In the present invention, the display device is not particularly limited, and examples thereof include a liquid crystal display device, an organic electroluminescence display device, and a plasma display device. According to the display device of the present invention, since the adhesive layer using the above-described sticking device is provided, it is possible to provide a more reliable electrical connection with a semiconductor element having a good sticking state. As a result, it is possible to prevent a decrease in yield in manufacturing the display device.

According to the sticking device of the present invention, when a semiconductor element is mounted on a circuit board, the generation of pinholes and voids is suppressed, and when a protective layer such as a separator is peeled from the adhesive layer, the adhesive layer is peeled off from the circuit board. Can be prevented from peeling off.

Hereinafter, the present invention will be described in more detail with reference to the drawings with reference to examples. However, the present invention is not limited only to these examples.

Example 1
FIG. 1 is a schematic cross-sectional view showing a state of pressure bonding using the sticking apparatus of the present invention. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board.

In this embodiment, as shown in FIG. 1A, a circuit in which a part of the main surface is exposed by providing a resist (covering layer; thickness 50 μm) 3 having an opening region on the main surface. A substrate 7 was prepared. A wiring 2 (thickness: 17 μm) is formed between the resist 3 and the circuit board 7, and a part of the wiring 7 is exposed in the opening region. The circuit board 7 has a wiring pattern formed and fixed on the surface of the insulating substrate by the wiring 2 which is a conductive material, and a semiconductor element such as an IC (semiconductor integrated circuit) is mounted thereon. When a circuit board 7 on which a semiconductor element is mounted (semiconductor device) is mounted inside an electronic device, it has a function as a product such as a display device.

This circuit board 7 is arranged under the pressure part (crimp head) 6 of the sticking apparatus. The pressurizing unit 6 includes a convex portion 9 formed so as to be loosely fitted in the opening region of the resist 3 of the circuit board 7, and the circuit board 7 corresponds to the shape of the pressurizing unit 6. Arranged. The pressurizing unit 6 is formed of an elastic material (Vickers hardness (HV) = 60 to 70). The convex portion 9 has a height of 0.2 mm, and the outer periphery of the sticking surface (tip surface) is located 0.1 mm inside the outer periphery of the resist non-formation region. In this example, an ACF thermocompression bonding machine was used as the sticking apparatus.

An adhesive film 8 (thickness) in which ACF (an anisotropic conductive film (thickness 20 to 50 μm)) 4 functioning as an adhesive layer and a separator (thickness 80 μm) 5 functioning as a protective layer are formed into two layers. 100 to 130 μm) was sent between a circuit board 7 and a pressure unit 6 from a supply reel (not shown). A cutter (not shown) for cutting the ACF 4 to a set dimension is disposed below the adhesive film 8 that travels between the supply reel and the pressure unit 6. This cutter is adjusted so as to cut only the ACF 4 and not the separator 5. When the ACF 4 is arranged on the circuit board 7, the cutter is cut to a set dimension.

The adhesive film 8 is formed by applying a solution of epoxy resin (thermosetting resin) in which conductive particles are dispersed to the separator 5 and drying the applied solution to form a first layer (not shown) of ACF. After that, an epoxy resin solution in which insulating particles were dispersed was applied on the first layer, and the applied solution was dried to form a second layer (not shown) of ACF. As the separator 5, PET (polyethylene terephthalate) having a film thickness of 80 μm was used. The conductive particles are nickel (lower layer) / gold plated (upper layer) plastic particles, and the average diameter thereof is 5 μm. It is also possible to use metal particles such as nickel fine particles. The insulating particles are not particularly limited, and examples thereof include silica, calcium silicate, alumina, calcium carbonate, aluminum nitride, and silicon carbide. In this embodiment, the adhesive layer (ACF) 4 is composed of two layers, but the present invention is not limited to this and may be formed of three or more layers. Further, the adhesive layer is not limited to an anisotropic conductive film such as ACF, and may be a non-conductive film such as NCF (Non-Conductive Film).

Next, as shown in FIG.1 (b), the pressurization part 6 heated at 60-90 degreeC was dropped, and the adhesive film 8 was pressed on the circuit board 7 for 1-4 seconds with the pressure of 1-5 MPa. At this time, ACF4 is about 80 ° C., but is not completely cured. When the pressure bonding is performed, the pressure unit 6 included in the sticking apparatus of the present invention exerts a larger pressure on the other upper region than on the upper region of the resist 3 edge. As a result, the ACF 4 is sufficiently adhered to the circuit board 7 in the resist non-formation region and the surrounding resist formation region of 1 to 2 mm, and the ACF 4 is peeled off from the circuit substrate 7 when the separator 3 is peeled off from the ACF 4. I was able to prevent that.

Further, the pressure applied to the upper region of the edge of the resist 3 is reduced, the thickness of the ACF 4 in the upper region of the edge of the resist 3 is increased, and the ACF 4 is well filled in the vicinity of the resist 3 on the wiring 2. When the air entrained between the ACF 4 and the circuit board 7 is less than when pasted by a conventional pasting device, the pressure unit is heated and pressurized to a high temperature of about 200 ° C., Even when a semiconductor element (IC) or the like is mounted on the circuit board 7 to which the ACF 4 is adhered, in the case of the present embodiment, pinholes are generated in 13 samples out of 32 samples in the case of using the conventional adhesion apparatus. In one sample, no pinhole was generated, and generation of voids could be sufficiently suppressed. Furthermore, in this embodiment, the resist non-formation region and the surrounding resist formation region can be pressed simultaneously with different pressures by one pressurizing unit 6, which is excellent in productivity.

When mounting ICs such as driver ICs, controller ICs, and power supply ICs (DC-DC converters) on the circuit board 7, press the pressure unit heated to 180 to 250 ° C. for 5 to 20 seconds at a pressure of 60 to 200 MPa. To do. Thus, since the thermosetting resin of the first and second layers of ACF 4 is completely cured by pressing at a higher temperature and pressure than when ACF 4 is adhered to circuit board 7, the IC and the like The circuit board 7 can be bonded. When an IC or the like is mounted on the circuit board 7, the sticking device of the present invention may not be used. In this manner, a semiconductor device in which an IC or the like is mounted on the circuit board 7 can be manufactured via the ACF 4 attached using the attaching device of the present invention.

As the circuit board 7, a soft board (FPC (Flexible Printed Circuit); a flexible board) 7 a or a hard board (PWB) 7 b may be used. When the FPC 7a is used, as shown in FIGS. 12A and 12B, a semiconductor device is manufactured by mounting ICs such as a driver IC 41, a controller IC 42, and a power supply IC 43 (DC-DC converter) on the FPC 7a. be able to. In this case, a display device such as a liquid crystal display device can be manufactured by directly connecting the FPC 7a on which the IC is mounted to the liquid crystal panel 40.

On the other hand, when the PWB 7b is used, as shown in FIG. 12C, the semiconductor device including the ACF 4 attached using the attaching device of the present invention and having the controller IC 42 and the power supply IC 43 mounted on the PWB 7b is By connecting to the liquid crystal panel 40 or the like by the FPC 44 other than the invention, a display device such as a liquid crystal display device can be manufactured. Since such a display device uses a semiconductor element with a good adhesion state, it can provide more reliable electrical connection and can prevent a decrease in yield.

(Example 2)
FIG. 2 is a schematic cross-sectional view showing a state of pressure bonding using the sticking apparatus of this example. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board.
As shown in FIG. 2, the pressure unit 6 included in the sticking apparatus in the present embodiment has a notch (slit) 10 in a direction perpendicular to the sticking surface in a region corresponding to the resist 3 when pressure bonding. As shown in FIG. 2 (b), the pressure applied to the upper region of the edge of the resist 3 is reduced by pressing the ACF 4 on the circuit board 7 in the same manner as in the first embodiment, using such a bonding apparatus. The effect similar to Example 1 can be acquired, such as becoming small. Note that the slit provided in the pressurizing part may be provided only in the region corresponding to the edge of the resist when pressure bonding. Even in this case, since the pressure applied to the upper region of the edge of the resist 3 can be reduced, the same effect as in the first embodiment can be obtained.

(Example 3)
FIG. 3 is a schematic cross-sectional view of the pressure unit of the sticking device in the present embodiment.
As shown in FIG. 3, the pressure unit 6 of the sticking apparatus in the present embodiment has a recess 31 in a region corresponding to the edge of the resist 3 when pressure bonding. While the pressure applied to the upper region of the edge of the resist 3 is reduced, the non-formed region of the resist 3 can exert a pressure sufficient for the ACF to be pressure-bonded onto the circuit board 7. The effect of can be obtained.

Example 4
Fig.4 (a) shows the plane schematic diagram of the convex part with which the pressurization part of the sticking apparatus in a present Example was equipped, (b) shows the cross-sectional schematic diagram of the sticking apparatus before crimping | bonding. As shown in FIGS. 4 (a) and 4 (b), the convex part 9 provided in the pressure part 6 of the sticking apparatus of the present embodiment seems to be loosely fitted in the non-formation area of the wiring 2 when crimping. Has a recess 12a. According to the present embodiment, the pressurizing portion 6 has a shape along the wiring pattern formed by the wiring 2 and the resist 3 on the circuit board 7, so that the vicinity of the resist 3 on the wiring 2 (non-formation of the resist 3 is not formed). In addition to the good filling of ACF4 in the region), the filling of ACF4 in the vicinity of the wiring 2 on the substrate (the region where the wiring 2 is not formed) is even better than in the first embodiment. As a result, it is possible to sufficiently suppress the occurrence of pinholes and voids when a semiconductor element or the like is mounted on the circuit board 7 to which the ACF 4 is adhered.

(Example 5)
FIG. 5 is a schematic cross-sectional view of the pressure unit of the sticking apparatus in the present embodiment.
As shown in FIG. 5, the pressure unit 6 of the sticking apparatus in the present example has a recess 31 in a region corresponding to the edge of the resist 3 when crimping, and is the same as in Example 4. The convex part provided in the pressure part 6 has a concave part so as to be loosely fitted to the non-formation area of the wiring 2 in the opening area when crimping. According to the sticking apparatus in the present embodiment, the same effect as in the fourth embodiment can be obtained.

(Example 6)
FIG. 6 is a schematic cross-sectional view of the pressure unit of the sticking device in the present embodiment.
As shown in FIG. 6, the pressure unit 6 included in the adhering apparatus in this example has slits 14 and 15 in a direction perpendicular to the adhering surface in a region corresponding to the resist 3 when the pressure bonding is performed. In this case, the slit 14 provided in the region corresponding to the formation region of the wiring 2 in the opening region is shorter than the slit 15 provided in the region corresponding to the resist 3. According to the present embodiment, the pressure exerted on the adhesive film 8 on the circuit board 7 by the pressurizing unit 6 at the time of pressure bonding can be adjusted by the length of the slit. Obtainable.

(Example 7)
FIG. 7 is a schematic cross-sectional view of the pressure unit of the sticking apparatus in the present embodiment.
As shown in FIG. 7, the pressurizing part 6 provided in the sticking device in the present embodiment is formed of rubber which is an elastic material, and the rubber corresponds to the opening region when being pressed. The portion 17 corresponding to the resist 3 is softer than 16. That is, the portion 16 is made of high elastic rubber, and the portion 17 is made of low elastic rubber. According to this embodiment, even if the shape of the pressurizing portion 6 is not a shape along the wiring pattern of the circuit board 7 but a rectangular parallelepiped, the pressurizing portion 6 is an upper part of the edge of the resist 3 when it is pressure-bonded. Since sufficient pressure can be exerted on the upper region other than the region, the same effect as in the first embodiment can be obtained.

(Example 8)
FIG. 8 is a schematic cross-sectional view of the pressurizing unit of the sticking apparatus in the present example.
As shown in FIG. 8, the pressure unit 6 included in the sticking apparatus in the present embodiment is formed from rubber that is an elastic material, and the rubber is in the region corresponding to the resist 3 and the opening region. The area corresponding to the wiring forming area and the area corresponding to the wiring non-forming area are soft in this order. According to the present embodiment, the pressure for pressing the resist 3, the wiring 2 and the upper region of the substrate 1 can be optimized, so that the vicinity of the resist 3 on the wiring 2 in the opening region (the region where the resist 3 is not formed). In addition to the good filling of ACF4, the filling of ACF4 in the vicinity of the wiring 2 on the substrate 1 (the area where the wiring 2 is not formed) is even better than in the seventh embodiment. As a result, the same effect as in the fourth embodiment can be obtained.

Example 9
FIG. 9 is a schematic cross-sectional view of the pressure unit of the sticking apparatus in the present example.
As shown in FIG. 9, the convex part provided in the pressurizing part of the sticking apparatus in the present embodiment is loosely fitted in the opening area when crimping, and is perpendicular to the sticking surface of the convex part. The cross section is formed by a curve that swells toward the sticking surface. According to the present embodiment, it is possible to prevent the pressure from being increased in the upper region of the edge of the resist 3, while in the other regions, sufficient pressure is applied to allow the ACF 4 to adhere to the circuit board 7. Can do. In addition, the ACF 4 can be satisfactorily filled in the vicinity of the wiring 2 on the substrate 1, and further, air that has been caught when the ACF 4 is crimped can be easily released outside the mounting region of the semiconductor element or the like. As a result, generation of pinholes and voids can be suppressed when a semiconductor element is mounted on the circuit board 7, and when the protective layer such as the separator 5 is peeled from the adhesive layer 4, the adhesive layer 4 is removed from the circuit board 7. Can be prevented from peeling off.

It is a cross-sectional schematic diagram which shows the mode of the crimping | compression-bonding using the sticking apparatus of this invention. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board. It is a cross-sectional schematic diagram which shows the mode of the crimping | compression-bonding using the sticking apparatus of Example 2. FIG. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 3. (A) shows the plane schematic diagram of the pressurization part of the sticking apparatus in Example 4, (b) shows the cross-sectional schematic diagram of the sticking apparatus before crimping. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 5. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 6. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 7. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 8. It is a cross-sectional schematic diagram of the pressurization part of the sticking apparatus in Example 9. It is a cross-sectional schematic diagram which shows the mode of the crimping | compression-bonding using the conventional sticking apparatus. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board. It is a cross-sectional schematic diagram which shows the mode of the crimping | compression-bonding using another conventional sticking apparatus. (A) shows a state before pressure bonding, and (b) shows a state where the pressurizing part presses the adhesive layer on the circuit board. 1 is a schematic plan view of a liquid crystal display device using a semiconductor device according to the present invention. ((A) and (b) are when a soft substrate is used as a circuit board, and (c) is when a hard substrate is used as a circuit board.)

Explanation of symbols

1: Substrate 2: Wiring 3: Resist (coating layer)
4: ACF (adhesive layer)
5: Separator 6: Pressure part 7: Circuit board 7a: FPC
7b: PWB
8: Adhesive film 9: Convex part 10 of pressurization part: Cut (slit)
11: Convex part 12a which presses on the board | substrate formed in the sticking surface side of a pressurization part: Recessed part 12b which does not press on the wiring formed in the sticking surface side of a pressurization part: Adhesion surface of a pressurization part Convex part 13 pressing on the wiring formed on the side: Convex part pressing on the resist formed on the sticking surface side of the pressurizing part 14: Short slit 15: Long slit 16, 18: High pressurizing part Elastic rubber parts 17 and 19: Low elastic rubber part of the pressure part 20: Low elastic rubber part of the pressure part (lower elastic than 19)
31: Recess 40 of the pressurizing part: Liquid crystal panel 41: Driver IC
42: Controller IC
43: Power supply IC
44: FPC other than the present invention

Claims (17)

A circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface, and a bonding device including a pressure unit that presses the adhesive layer,
The pressurizing unit applies pressure larger than the pressure exerted on the edge of the coating layer forming the opening region to the region other than the edge when pressurizing and crimping the opening region and the coating layer. A sticking device characterized by being. A circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface, and a bonding device including a pressure unit that presses the adhesive layer,
The pressurizing part is provided with a convex part that pressurizes the opening region and the coating layer and protrudes to the sticking surface side.
The sticking device is characterized in that the convex portion is loosely fitted into the opening region when being crimped. The sticking apparatus according to claim 2, wherein the pressurizing unit is made of an elastic material. The sticking apparatus according to claim 3, wherein the height of the convex portion is higher than the height from the circuit board main surface of the opening region to the upper surface of the coating layer. Between the coating layer and the circuit board, wiring is formed,
3. The sticking apparatus according to claim 1, wherein a part of the wiring is exposed in the opening region. The sticking device according to claim 5, wherein the sticking surface of the convex portion is smaller than the opening region and larger than the wiring non-forming region in the opening region. The sticking device according to claim 5 or 6, wherein the convex part has a concave part so as to be loosely fitted to a wiring non-formation region in the opening region when crimping. The sticking device according to any one of claims 4 to 7, wherein the convex portion is formed by a curve having a vertical cross section with respect to the sticking surface of the convex portion swelled on the sticking surface side. The sticking device according to any one of claims 4 to 8, wherein the pressurizing unit includes a concave portion in a region corresponding to an edge portion of the coating layer when the pressure bonding is performed. A circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface, and a bonding device including a pressure unit that presses the adhesive layer,
The pressing device is characterized in that a notch is provided in a region corresponding to an edge of the coating layer that forms the opening region when the opening region and the coating layer are pressed and pressed. The sticking apparatus according to claim 10, wherein the pressurizing part is provided with a cut in a region corresponding to the coating layer when the pressure bonding is performed. Between the coating layer and the circuit board, wiring is formed,
The pressure part is provided with a cut in a direction substantially perpendicular to the sticking surface in a region corresponding to the wiring formation region in the covering layer and the opening region when pressure bonding.
The sticking apparatus according to claim 10, wherein the notch is shorter in a region corresponding to the wiring formation region in the opening region than in a region corresponding to the coating layer when the pressure bonding is performed. A circuit board in which a part of the main surface is exposed by providing a coating layer having an opening region on the main surface, and a bonding device including a pressure unit that presses the adhesive layer,
The pressurizing part is formed from an elastic material,
The sticking apparatus, wherein the elastic material is softer in a region corresponding to the covering layer than in a region corresponding to the opening region when pressure-bonding. Between the coating layer and the circuit board, wiring is formed,
14. The sticking apparatus according to claim 13, wherein the elastic material is soft in the order of a region corresponding to the covering layer, a region corresponding to the wiring forming region in the opening region, and a region corresponding to the wiring non-forming region. A film sticking method, which is performed using the sticking apparatus according to claim 1. A semiconductor device comprising an adhesive layer adhered using the adhesive device according to claim 1. A display device comprising an adhesive layer adhered using the adhesive device according to claim 1.

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