JP2009238775A - Apparatus and method for sticking adhesive tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for sticking an adhesive tape, capable of unfailingly sticking an adhesive tape to a TCP (tape carrier package). <P>SOLUTION: The apparatus for sticking an adhesive tape is used to stick an adhesive tape stuck on a mold release tape and cut in a predetermined length to one end of a lead of the TCP in which a portion except the one end is covered with an electric insulator. The apparatus is provided with: a feeding reel and a windup reel for carrying and positioning the adhesive tape 1 together with the mold release tape 2, a suction head 12 for holding the TCP 13 so that the one end of the lead exposed from the electric insulator may face the positioned adhesive tape of a predetermined length, and a pressurizing tool 21 having a pressurizing surface 21a for pressurizing the positioned adhesive tape of a predetermined length to the lead of the TCP and sticking it, and an inclined surface 21b as an escaping portion for preventing the electric insulator 17 covering the portion except the one end of the lead from abutting on the pressurizing surface when the adhesive tape is pressurized. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adhesive tape sticking apparatus and sticking method used when mounting, for example, a TCP (Tape Carrier Package) as an electronic component on a glass panel used as a substrate, for example, in a liquid crystal display device.

  For example, when manufacturing a liquid crystal display device, the TCP as an electronic component is mounted on the panel as a substrate. The TCP is punched from the carrier tape by a mold and then supplied to an index table that is rotationally driven by a predetermined angle. The index table is provided with a plurality of suction heads in the circumferential direction at intervals corresponding to the rotation angle per time. The TCP punched out by the mold is sequentially supplied to a plurality of suction heads.

  The panel is supplied and mounted on an XY table, and is driven in the XY direction by the XY table. At the mounting position of the index table, the alignment mark provided on the TCP and the alignment mark provided on the panel are imaged by the imaging camera, and the imaging signal is processed by the image processing unit. Based on the processing in the image processing unit, the panel is positioned by controlling the driving of the XY table so that the alignment mark of the panel matches the alignment mark of the TCP. .

  When the panel is positioned with respect to the TCP, the suction head holding the electronic component is driven in the downward direction, and the TCP is pressed and applied to an adhesive tape made of an anisotropic conductive member provided on the panel. To wear, that is, to implement. Conventional mounting apparatuses for mounting TCP on a panel are disclosed in Patent Document 1 and Patent Document 2, for example.

  By the way, in the conventional mounting apparatus, the adhesive tape for mounting TCP on a panel is stuck over the full length of the one side of the said panel, and the said TCP is mounted there by a predetermined space | interval.

  For this reason, the portion of the adhesive tape located between the TCPs attached at a predetermined interval becomes a portion that is not necessary for mounting the TCP, so that the portion is wasted, leading to an increase in cost.

  Therefore, recently, it is considered that the adhesive tape is not attached to the panel, and the adhesive tape is attached to the TCP with a length corresponding to the width dimension of the TCP, thereby eliminating the waste of the adhesive tape.

  In that case, cut the adhesive tape affixed to the release tape with a length corresponding to the width of the TCP, push the adhesive tape up, and press it up with the release tape with a pressure tool. After pressurizing and adhering to the held lead of the electronic component, the release tape is peeled off from the lower surface of the adhesive tape. And the said TCP is mounted in a panel by sticking the surface by which the release tape of the adhesive tape was peeled off to a panel.

  The lead provided on the TCP mounted on the panel is covered with an electrical insulator except for one end. A semiconductor chip is mounted on the other end of the lead. In the TCP, one end exposed from the electrical insulator is electrically connected to the electrode formed on the panel via the adhesive tape.

  A circuit board is connected to the semiconductor chip connected to the other end of the lead to the TCP having one end of the lead connected to the panel. The TCP to which the circuit board is connected is bent in order to position the circuit board at a predetermined position with respect to the panel.

By covering the portion of the TCP lead excluding one end connected to the substrate with an electrical insulator in advance, when the TCP is connected to the panel and bent, the TCP lead is exposed to the outside. There is no. Therefore, it is possible to prevent the lead from causing an insulation failure or being damaged by receiving a frictional force.
JP 2002-305398 A JP 2002-261491 A

  By the way, when a predetermined length of adhesive tape attached to the release tape is applied to the one end of the TCP lead whose portion excluding one end is covered with an electrical insulator by applying a pressure tool. The width of the adhesive tape is set larger than the length of the exposed end of the lead so as to reliably cover the exposed end of the lead from the electrical insulator. Moreover, the pressurizing tool that pressurizes the adhesive tape against the TCP leads is formed to have the same width as the width of the adhesive tape.

  Accordingly, when the pressure tool presses the adhesive tape to one end of the TCP lead, the pressure tool is not only the portion corresponding to the one end exposed from the electrical insulator of the lead, but also near the other end. The electric insulator coated with is also pressurized at the same time.

  The electrical insulator covering the lead has a height of about 0.1 mm, for example. Therefore, when pressurizing the adhesive tape with a pressurizing tool, the entire width direction of the adhesive tape cannot be uniformly pressed on the pressurizing surface of the pressurizing tool due to the difference in height between one end of the lead and the insulator. Sometimes.

  For this reason, there is a case where the pressure-sensitive adhesive tape cannot be reliably pressure-applied to one end portion of the lead, that is, the TCP. Therefore, when peeling the release tape from the pressure-sensitive adhesive tape adhered to the TCP, The end of the tape may squeeze out of the TCP.

  In addition, if the pressure-sensitive adhesive tape cannot be reliably pressure-bonded to the TCP, bubbles remain between the pressure-sensitive adhesive tape and the TCP. The remaining bubbles are taken by imaging a mark provided on the TCP, and when the TCP is positioned with respect to the panel based on the imaging, the remaining bubbles are mistakenly recognized as alignment marks, and the TCP is detected with respect to the panel. There is a possibility that the positioning cannot be performed reliably.

  In the present invention, when a portion other than one end portion of the lead of the electronic component is covered with an electrical insulator, the adhesive tape cut to a predetermined length without being affected by the electrical insulator is attached to the lead of the electronic component. It is in providing the adhesive tape sticking apparatus and the sticking method which enabled it to stick reliably.

The present invention provides an adhesive tape for adhering an adhesive tape that is attached to a release tape and cut to a predetermined length to the one end of an electronic component lead that is covered with an electrical insulator except for one end. A sticking device,
Tape transport means for transporting and positioning the adhesive tape together with the release tape;
Holding means for holding the electronic component such that one end exposed from the electrical insulator of the lead is opposed to the adhesive tape of a predetermined length positioned by the tape conveying means;
A pressure surface for pressing and sticking the adhesive tape having a predetermined length positioned on the lead of the electronic component; and when the pressure-sensitive adhesive tape is applied to the pressure surface, the pressure surface is connected to one end of the lead. There is provided a pressure-sensitive adhesive tape bonding apparatus, comprising: a pressurizing unit formed with a relief portion that avoids hitting the electric insulator covering a portion to be removed.

  It is preferable to include a peeling means for peeling the release tape from the adhesive tape attached to the lead portion of the electronic component.

  The relief portion formed on the pressure surface of the pressure means is preferably an inclined surface corresponding to the shape of the end portion of the electrical insulator.

  The relief portion formed on the pressure surface of the pressure means is preferably a concave portion formed in a stepped shape.

The present invention provides an adhesive tape for adhering an adhesive tape that is attached to a release tape and cut to a predetermined length to the one end of an electronic component lead that is covered with an electrical insulator except for one end. A sticking method,
A step of conveying and positioning the adhesive tape together with the release tape;
Holding the electronic component such that one end exposed from the electrical insulator of the lead is opposed to the adhesive tape of a predetermined length positioned;
A step of pressurizing and sticking the positioned adhesive tape of a predetermined length to one end of the lead without being interfered by the electrical insulator covering a portion excluding the one end of the lead. In the method of sticking an adhesive tape characterized by the above.

  It is preferable to include a step of peeling the release tape from the adhesive tape attached to the electronic component.

  According to this invention, when the adhesive tape cut to a predetermined length is pressed and attached to the electronic component, it is avoided that the electrical insulator covering the lead of the electronic component hits the pressing surface of the pressing means. A relief was provided. Therefore, when adhering the adhesive tape to the electronic component, the adhering can be reliably performed without being affected by the electric insulator.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 7 show an adhesive tape sticking device according to a first embodiment of the present invention. As shown in FIG. 1, this sticking apparatus has a supply reel 3 around which a release tape 2 having a pressure-sensitive adhesive tape 1 stuck on one side is wound. The release tape 2 is fed out from the supply reel 3 with the surface to which the adhesive tape 1 is attached facing upward, and is guided horizontally by the first guide roller 4 and the second guide roller 5 to run horizontally. The take-up reel 6 is wound up. The supply reel 3 and the take-up reel 6 constitute tape transport means.

  The adhesive tape 1 attached to the release tape 2 fed out from the supply reel 3 is divided into a predetermined length by a cutting mechanism (not shown) and between adjacent ends of the part 1a divided into the predetermined length. In order to form a gap 1b, a portion between the end portions is removed (hollow out).

  Above the middle of the part where the release tape 2 travels horizontally by a pair of guide rollers 4 and 5, it can be driven in the direction indicated by the arrow Z in FIGS. The movable body 11 provided in is opposed.

  A suction head 12 having an L-shaped cross section is provided at the lower end of the movable body 11. The suction head 12 is configured to suck and hold one end portion of the TCP 13 as an electronic component punched from the carrier tape in the previous process.

  The TCP 13 has a base material 14 in which a tape member is punched into a predetermined shape, for example, a rectangular shape, as shown in FIGS. A plurality of leads 15 are printed on one side surface of the base material 14. One end of the lead 15 extends to one side edge of the base material 14, and the other end is connected to the semiconductor chip 16 mounted on the other side portion of the base material 14.

  Then, one side surface of the base material 14 on which the semiconductor chip 16 is provided is covered with an electrical insulator 17 such as a resin, except for the peripheral portion of the one side surface. Thereby, one end of the lead 15 is exposed, and the portion other than the one end is covered with the electrical insulator 17.

  When an electrical insulator 17 such as a resin is applied to one side surface of the base material 14, the peripheral portion of the first inclined surface 17a is inclined downward toward the outside as shown in FIGS. It becomes. The semiconductor chip 16 is exposed from the electrical insulator 17.

  As shown in FIGS. 4 and 5, the TCP 13 having the above configuration is suction-held by the suction surface 12 a of the suction head 12 at one side of the other side surface of the base material 14 corresponding to one end of the lead 15. . That is, the suction surface 12a of the suction head 12 has a width dimension extending over one end portion of the lead 15 exposed from the electrical insulator 17 and a part of the electrical insulator 17 located near the lead 15, and the other side surface of the base material. One side is held by suction.

  Below the suction head 12 that holds the TCP 13, a pressurizing tool 21 that constitutes a pressurizing unit with the release tape 2 interposed therebetween is disposed. This pressurizing tool 21 is attached to a drive shaft 23 of a drive cylinder 22 arranged with its axis line vertical. The planar shape of the pressurizing tool 21 is the same size as the suction surface 12a of the suction head 12, and the length and width dimensions of the portion 1a divided into the predetermined length of the adhesive tape 1 are substantially the same. It is set to be.

  As shown in FIGS. 4 and 5, the first inclined surface of the peripheral portion of the electrical insulator 17 applied to the TCP 13 is disposed at one end in the width direction of the pressing surface 21 a that is the upper end surface of the pressing tool 21. A second inclined surface 21b as an escape portion having an inclination angle corresponding to 17a and a horizontal surface 21c continuous with the second inclined surface 21b are formed.

  The second inclined surface 21b prevents the pressure surface 21a from interfering with the peripheral portion of the electrical insulator 17 as will be described later when the adhesive tape 1 is pressure-bonded to the TCP 13 as described later. It has become.

  A cushion tape 25 is provided between the pressing surface 21 a of the pressing tool 21 and the release tape 2. The cushion tape 25 is unwound from a supply reel (not shown) and is wound around a take-up reel (not shown).

  When the pressing tool 21 is driven in the upward direction by the drive cylinder 22, the pressing surface 21a is divided into the predetermined length of the adhesive tape 1 together with the cushion tape 25 and the release tape 2 as shown in FIG. The portion 1 a is pushed up and pressed to one end portion of the lead 15 exposed from the electrical insulator 17 of the TCP 13 held by suction on the suction surface 12 a of the suction head 12.

  A heater 26 is embedded in the pressurizing tool 21, and the portion 1 a divided to a predetermined length of the adhesive tape 1 is pushed up while being heated. Thereby, the divided part 1a of the adhesive tape 1 is satisfactorily stuck to the lead 15 part of the TCP 13.

  When the portion 1a divided into the predetermined length of the adhesive tape 1 is attached to the lead 15 portion of the TCP 13, the portion corresponding to the lead 15 of the TCP 13 of the adhesive tape 1 is pressurized by the flat portion of the pressure surface 21a. The portion corresponding to the peripheral portion of the electrical insulator 17 is pressed by the second inclined surface 21b and the horizontal surface 21c formed on the pressing surface 21a of the pressing tool 21.

  That is, the pressurizing tool 21 presses the portion 1a of the pressure-sensitive adhesive tape 1 divided to a predetermined length almost uniformly over the entire width direction without receiving the interference of the electrical insulator 17 provided on the TCP13. Can be securely attached.

  Moreover, even when the cushion tape 25 is interposed between the pressing surface 21a of the pressing tool 21 and the TCP 13, the portion 1a of the adhesive tape 1 divided into a predetermined length is elastically pressed by the TCP 13. It is securely attached.

  Thus, when the part 1a parted by the predetermined length of the adhesive tape 1 is affixed to TCP13, the release tape 2 will be peeled from the adhesive tape 1 affixed to TCP13 by the release roller 27. FIG.

  The release roller 27 is disposed on one side of the suction head 12 on the downstream side in the transport direction of the release tape 2 indicated by an arrow -X in FIG. It is driven in the −X direction (shown in FIG. 7) which is the direction opposite to the transport direction of the tape 2.

  Then, when the pressurizing tool 21 is driven in the downward direction by the drive cylinder 22 as shown in FIG. 7 from the position where the pressurizing tool 21 is raised as shown in FIG. 6, the release roller 27 is in the downward direction indicated by -Z in FIG. And the release tape 2 is pressed downward to drive in the + X direction. Thereby, the release tape 2 is peeled off from the adhesive tape 1 attached to the TCP 13.

  The portion 1a of the pressure-sensitive adhesive tape 1 divided into a predetermined length is not affected by the electrical insulation 17 provided on the TCP 13 by the pressure tool 21 on which the second inclined surface 21b is formed. It is securely attached. In addition, one end portion in the width direction is surely pressed and adhered to the upper surface of the electrical insulator 17 also by the horizontal surface 21c continuous to the second inclined surface 21b.

  Therefore, when the release tape 2 is peeled from the adhesive tape 1, it is possible to prevent the end of the adhesive tape 1 from rolling up from the TCP 13 due to the tensile force applied to the adhesive tape 1.

  In this way, the TCP 13 to which the adhesive tape 1 is attached is imaged with a mark for alignment by an imaging camera (not shown), and is positioned relative to a panel (not shown) based on the imaging. At this time, if bubbles remain between the TCP 13 and the adhesive tape 1 attached to the TCP 13, the imaging camera may misidentify the bubbles as alignment marks.

  However, the part 1a divided into the predetermined length of the adhesive tape 1 is firmly pressed by the pressing tool 21 and adhered to the TCP 13. Therefore, bubbles hardly remain between the TCP 13 and the adhesive tape 1, so that the position of the TCP 13 can be accurately recognized by the imaging camera, and the mounting accuracy of the TCP 13 on the panel can be improved.

  In the first embodiment, the second inclined surface 21b having an inclination angle corresponding to the first inclined surface 17a of the electrical insulator 17 as the relief portion and the second inclined surface as the relief portion on the pressing surface 21a of the pressing tool 21. By forming the horizontal surface 21c continuous with 21b, the pressure-sensitive adhesive tape 1 can be surely pressed over the entire width direction, but the pressure surface 21a of the pressure tool 21 is replaced with the second inclined surface 21b. Then, a stepped recess 21d may be formed as a relief portion for preventing the peripheral portion of the electrical insulator 17 from interfering with the pressing surface 21a as in the second embodiment shown in FIG.

  Even with such a configuration, it is possible to reliably pressure-bond the portion 1a of the adhesive tape 1 divided into a predetermined length to one end exposed from the electrical insulator 17 of the lead 15 of the TCP 13. is there.

  Further, as in the third embodiment shown in FIG. 9, only the second inclined surface 21 b having an inclination angle corresponding to the first inclined surface 17 a of the electrical insulator 17 is provided on the pressing surface 21 a of the pressing tool 21. You may make it form.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the adhesive tape sticking apparatus which shows 1st Embodiment of this invention. The top view of TCP by which the part except the one end part of a lead was coat | covered with the electrical insulator. The expanded sectional view of TCP shown in FIG. The side view which shows the suction head and pressure tool before sticking an adhesive tape on TCP. The side view which shows an adsorption head and a pressurization tool when sticking an adhesive tape on TCP. The front view which shows the adsorption | suction head and pressure tool when sticking an adhesive tape on TCP. The front view when peeling a release tape from the adhesive tape stuck on TCP. The side view of the pressurization tool which shows 2nd Embodiment of this invention. The side view of the pressurization tool which shows the 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Adhesive tape, 2 ... Release tape, 3 ... Supply reel (tape conveyance means), 6 ... Take-up reel (tape conveyance means), 12 ... Adsorption head, 13 ... TCP (electronic component), 15 ... Lead, 17 ... Electric insulator, 21 ... Pressure tool, 21a ... Pressure surface, 21b ... Second inclined surface (relief portion).

Claims (6)

An adhesive tape attaching device that attaches an adhesive tape that is attached to a release tape and cut to a predetermined length to the one end of an electronic component lead that is covered with an electrical insulator except for one end. There,
Tape transport means for transporting and positioning the adhesive tape together with the release tape;
Holding means for holding the electronic component such that one end exposed from the electrical insulator of the lead is opposed to the adhesive tape of a predetermined length positioned by the tape conveying means;
A pressure surface for pressing and sticking the adhesive tape having a predetermined length positioned on the lead of the electronic component; and when the pressure-sensitive adhesive tape is applied to the pressure surface, the pressure surface is connected to one end of the lead. An adhesive tape sticking device comprising: a pressurizing means having a relief portion that avoids hitting the electric insulator covering a portion to be removed.   2. The adhesive tape attaching apparatus according to claim 1, further comprising a peeling means for peeling the release tape from the adhesive tape attached to a lead portion of the electronic component.   2. The adhesive tape sticking apparatus according to claim 1, wherein the relief portion formed on the pressure surface of the pressure means is an inclined surface corresponding to the shape of the end portion of the electrical insulator.   The pressure-sensitive adhesive tape sticking apparatus according to claim 1, wherein the relief portion formed on the pressure surface of the pressure means is a concave portion formed in a step shape. A method of attaching an adhesive tape in which an adhesive tape that is attached to a release tape and cut to a predetermined length is attached to the one end of an electronic component lead that is covered with an electrical insulator at a portion other than one end. There,
A step of conveying and positioning the adhesive tape together with the release tape;
Holding the electronic component such that one end exposed from the electrical insulator of the lead is opposed to the adhesive tape of a predetermined length positioned;
A step of pressurizing and sticking the positioned adhesive tape of a predetermined length to one end of the lead without being interfered by the electrical insulator covering a portion excluding the one end of the lead. Adhesive tape sticking method characterized by the above.   The method for adhering an adhesive tape according to claim 5, further comprising a step of peeling the release tape from the adhesive tape adhered to the electronic component.

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