JPH05259221A - Electronic part mounting device - Google Patents
Electronic part mounting deviceInfo
- Publication number
- JPH05259221A JPH05259221A JP5163692A JP5163692A JPH05259221A JP H05259221 A JPH05259221 A JP H05259221A JP 5163692 A JP5163692 A JP 5163692A JP 5163692 A JP5163692 A JP 5163692A JP H05259221 A JPH05259221 A JP H05259221A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- printed wiring
- wiring board
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の所定
の位置に、電気部品が搭載された電子部品搭載用フィル
ムキャリアを搭載して電気的に接続するようにした電子
部品搭載装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which a film carrier for mounting electronic components on which electric components are mounted is mounted at a predetermined position on a printed wiring board and electrically connected. Is.
【０００２】[0002]
【従来の技術】従来、このような電子部品を他のプリン
ト配線板等の導体回路側に電気的に接続するために、一
旦電子部品を電子部品搭載用フィルムキャリアに搭載
し、このフィルムキャリアをプリント配線板に半田接続
し、電子部品搭載装置とする方法が用いられている。こ
の電子部品搭載フィルムキャリアは、絶縁基材として可
撓性を有する長尺なフィルム状物を主材として形成され
るものであり、そのメッキ等の加工を連続的に行なえる
ことから、近年においては、数多く採用されかつ生産量
も増加しつつあるものである。そして、フィルム状の絶
縁基材を最終的に切断することにより、一つまたは複数
の電子部品を搭載するものとして個片状のフィルムキャ
リアとされるものであるが、このフィルムキャリアは半
導体装置を構成する場合の薄型化を実現できて、非常に
多く採用されているものである。2. Description of the Related Art Conventionally, in order to electrically connect such an electronic component to a conductor circuit side of another printed wiring board or the like, the electronic component is once mounted on a film carrier for mounting an electronic component, and the film carrier is mounted on the film carrier. A method is used in which an electronic component mounting device is formed by soldering to a printed wiring board. This electronic component mounting film carrier is formed mainly of a flexible and long film-like material as an insulating base material, and since plating and the like can be continuously performed in recent years, Has been adopted in large numbers and the production volume is increasing. Then, by finally cutting the film-shaped insulating base material, a piece-shaped film carrier for mounting one or a plurality of electronic components is formed. It is possible to realize a thin structure, and it is very often adopted.
【０００３】ところで、この種のフィルムキャリアにあ
っては、電子部品やプリント配線板との電気的接続を行
うためのメッキを施しているのであるが、近年の電子部
品の高密度化に対応すべくリードピッチを小さくしなけ
ればならないのであり、種々の問題が発生している。By the way, this type of film carrier is plated for electrical connection with electronic parts and printed wiring boards, but it is suitable for high density electronic parts in recent years. Since the lead pitch must be reduced as much as possible, various problems occur.
【０００４】すなわち、従来一般の電子部品搭載用フィ
ルムキャリアにおいては、例えば図１０に示すように形
成されていて、各リード１３のインナーリード部１３ａ
は勿論、アウターリード部１３ｂにおいても何等保護す
るものがなく、しかも図１１に示すように、各アウター
リード部１３ｂはプリント配線板４０側の接続部４１に
リフローさせたハンダによって電気的接続を行うように
なっているのである。このような場合に、各アウターリ
ード部１３ｂ間の間隔が狭く、しかもハンダメッキが多
目に存在していたとすると、接続のためにハンダメッキ
をリフローさせると、各アウターリード部１３ｂ間にシ
ョートが生じ得るのである。従って、リード間隔を小さ
くしたフィルムキャリアを使用して構成した電子部品搭
載装置は、他のプリント配線板への実装も困難になり、
また、半田リフローによるショート不良発生が多くなっ
てきているのである。That is, in a conventional general film carrier for mounting electronic parts, it is formed as shown in FIG. 10, for example, and the inner lead portion 13a of each lead 13 is formed.
Of course, there is nothing to protect the outer lead portions 13b, and as shown in FIG. 11, each outer lead portion 13b is electrically connected to the connecting portion 41 on the printed wiring board 40 side by reflow soldering. It is like this. In such a case, if the distance between the outer lead portions 13b is narrow and there is a large amount of solder plating, reflowing the solder plating for connection causes a short circuit between the outer lead portions 13b. It can happen. Therefore, the electronic component mounting device configured by using the film carrier with a small lead interval becomes difficult to mount on another printed wiring board,
In addition, the occurrence of short-circuit defects due to solder reflow is increasing.
【０００５】そこで、本発明者等は、リードが高密度化
されてきても、他のプリント配線板への実装を常に十分
に行えるようにするにはどうしたらよいか、また、メッ
キフローによるショート発生を防ぐにはどうしたらよい
かについて種々検討を重ねてきた結果、本発明を完成し
たのである。Therefore, the inventors of the present invention have found out how to make it possible to always mount the printed wiring board on another printed wiring board sufficiently even if the leads are densified, and to find out the short circuit due to the plating flow. As a result of various studies on how to prevent the occurrence, the present invention has been completed.
【０００６】[0006]
【発明が解決しようとする課題】本発明は以上のような
経緯に基づいてなされたもので、その解決しようとする
課題は、電子部品搭載用フィルムキャリアをプリント配
線板に搭載する際の半田溶融によるショートの発生であ
る。SUMMARY OF THE INVENTION The present invention has been made based on the above-mentioned background, and the problem to be solved is to melt solder when mounting a film carrier for mounting electronic parts on a printed wiring board. It is a short circuit caused by.
【０００７】そして、本発明の目的とするところは、半
田溶融によるショート不良発生がなく、しかも電子部品
搭載用フィルムキャリアとプリント配線板との電気的接
続が常に確実である電子部品搭載装置を簡単な構成によ
って提供することにある。The object of the present invention is to simplify an electronic component mounting apparatus which does not cause a short circuit defect due to melting of solder and which is always reliable in electrical connection between the electronic component mounting film carrier and the printed wiring board. It is to provide by a simple configuration.
【０００８】[0008]
【課題を解決するための手段】以上の課題を解決するた
めに、本発明の採った手段は、実施例において使用する
符号を付して説明すると、「接続部４１を有するプリン
ト配線板４０上の所定の位置に、フィルム状の絶縁基材
１１と、この上に所定のパターンで形成したリード１３
とを備え、電子部品３０が搭載された電子部品搭載用フ
ィルムキャリア１０を搭載し一体化して電気的に接続し
た電子部品搭載装置１００において、リード１３と、接
続部４１とが異方性導電膜２０を介して一体化されて、
電気的に接続されていることを特徴とする電子部品搭載
装置１００」である。Means for Solving the Problems In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the embodiments. A film-shaped insulating base material 11 at a predetermined position on the substrate, and leads 13 formed in a predetermined pattern on the insulating base material 11.
In the electronic component mounting apparatus 100 including the electronic component mounting film carrier 10 on which the electronic component 30 is mounted and integrally and electrically connected, the lead 13 and the connecting portion 41 are anisotropic conductive films. Integrated through 20,
The electronic component mounting apparatus 100 is characterized in that it is electrically connected.
【０００９】この電子部品搭載装置１００を構成するた
めに用いられる異方性導電膜２０は次のようなものであ
る必要がある。すなわち、この異方性導電膜２０は、図
５の（ａ）に示すように、熱可撓性または熱硬化性の接
着剤２１をマトリックスとし、この接着剤２１内に導電
粒子２２を互いに接触しない状態で分散させたものであ
り、各リード１３を構成している銅箔程度の厚さのもの
として形成したものである。この異方性導電膜２０は、
図５の（ｂ）に示すように、電子部品搭載用フィルムキ
ャリア１０側のアウターリード部１３ｂとプリント配線
板４０上の接続部４１の間に配され、に加熱圧着された
とき、これを構成している接着剤２１が導電粒子２２を
その場所に残して流動するものであり、結果として、図
５の（ｃ）に示すように、電子部品搭載用フィルムキャ
リア１０側のアウターリード部１３ｂとプリント配線板
４０側の接続部４１との間に導電粒子２２を互いに接触
させた状態で残すものである。これにより、電子部品搭
載装置１００側のアウターリード部１３ｂとプリント配
線板４０側の接続部４１とは、残留して接触しあってい
る導電粒子２２によってその間の導通が確保されるもの
であり、アウターリード部１３ｂや接続部４１が存在し
ていない他の部分すなわち、圧力が加わらない部分にお
いては、導電粒子２２が接着剤２１によって隔離された
ままであるため、絶縁状態となるものである。勿論、こ
の電子部品搭載装置１００において使用されている異方
性導電膜２０は、そのマトリックスそれ自体を接着剤２
１によって構成しているので、電子部品搭載装置１００
側のアウターリード部１３ｂとプリント配線板４０側の
接続部４１との接着をも行うことができるのである。The anisotropic conductive film 20 used to construct the electronic component mounting apparatus 100 needs to be as follows. That is, as shown in FIG. 5A, the anisotropic conductive film 20 uses a thermo-flexible or thermosetting adhesive 21 as a matrix, and conductive particles 22 are brought into contact with each other in the adhesive 21. It is dispersed in a state where it is not formed, and is formed as a thickness of about the copper foil forming each lead 13. This anisotropic conductive film 20 is
As shown in FIG. 5 (b), it is arranged between the outer lead portion 13b on the electronic component mounting film carrier 10 side and the connection portion 41 on the printed wiring board 40, and when heat-pressed to The adhesive 21 that flows flows with the conductive particles 22 left in its place, and as a result, as shown in FIG. 5C, the outer lead portion 13b on the electronic component mounting film carrier 10 side and The conductive particles 22 are left in contact with the connection portion 41 on the printed wiring board 40 side. As a result, the outer lead portion 13b on the electronic component mounting apparatus 100 side and the connecting portion 41 on the printed wiring board 40 side are electrically connected by the conductive particles 22 remaining and in contact with each other. In the other portion where the outer lead portion 13b and the connecting portion 41 are not present, that is, in the portion to which the pressure is not applied, the conductive particles 22 remain isolated by the adhesive 21 and thus are in an insulating state. Of course, the anisotropic conductive film 20 used in the electronic component mounting apparatus 100 has the matrix itself as the adhesive 2
Since it is configured by 1, the electronic component mounting apparatus 100
The outer lead portion 13b on the side and the connecting portion 41 on the printed wiring board 40 side can also be bonded.
【００１０】[0010]
【発明の作用】以上のように構成した本発明に係る電子
部品搭載装置１００においては、次のような作用があ
る。The electronic component mounting apparatus 100 according to the present invention constructed as above has the following operations.
【００１１】まず、この電子部品搭載装置１００におい
て使用されている異方性導電膜２０それ自体は、厚さが
４０μｍ程度のものであるため、例えば、まず異方性導
電膜２０を予め電子部品搭載用フィルムキャリア１０に
仮付けする場合においてもこの異方性導電膜２０を一体
化した電子部品搭載用フィルムキャリア１０は全体の厚
さがそれ程増大しておらず、また異方性導電膜２０それ
自体は前述した通りに接着剤２１を基材としているもの
であるから、絶縁基材１１に完全に追随するものとなっ
ている。従って、この電子部品搭載装置１００において
使用されている電子部品搭載用フィルムキャリア１０
は、電子部品搭載装置１００を構成するために本来有し
ている薄型化に対するメリット、及びリール・トゥ・リ
ール方式による作業が行えるというメリットをそのまま
備えたものとなっているのである。First, since the anisotropic conductive film 20 itself used in the electronic component mounting apparatus 100 has a thickness of about 40 μm, for example, the anisotropic conductive film 20 is first prepared in advance as an electronic component. Even when it is temporarily attached to the mounting film carrier 10, the thickness of the electronic component mounting film carrier 10 in which the anisotropic conductive film 20 is integrated has not increased so much, and the anisotropic conductive film 20 is not necessary. Since it itself uses the adhesive 21 as the base material as described above, it completely follows the insulating base material 11. Therefore, the electronic component mounting film carrier 10 used in the electronic component mounting apparatus 100 is mounted.
Has the merit that the electronic component mounting apparatus 100 originally has the advantage of reducing the thickness and the merit that work can be performed by the reel-to-reel method.
【００１２】また、この電子部品搭載装置１００におい
て使用されている異方性導電膜２０それ自体は、上述し
た厚さのシート状のものを図１あるいは図６に示すよう
な枠形状のものとして、電子部品搭載用フィルムキャリ
ア１０の各アウターリード部１３ｂとプリント配線板４
０の接続部４１との間に配すればよいのであるから、そ
の製造それ自体も非常に容易となっているものである。The anisotropic conductive film 20 itself used in the electronic component mounting apparatus 100 has a sheet-like shape having the above-mentioned thickness as a frame-like shape as shown in FIG. 1 or 6. , Each outer lead portion 13b of the electronic component mounting film carrier 10 and the printed wiring board 4
Since it may be arranged between the zero connection portion 41 and the connection portion 41, the manufacturing itself is very easy.
【００１３】さらに、この電子部品搭載装置１００にお
いて使用されている異方性導電膜２０は、前述したよう
に加熱圧着しない限り、接着剤２１中に導電粒子２２が
互いに接触しない状態で分散されているものであり、ま
た接着剤２１それ自体が絶縁性を有したものであるか
ら、各リード１３のアウターリード部１３ｂ間を言わば
絶縁体で覆った状態としているものであり、他電子部品
の実装等のために半田浴中にリフローさせても、これが
各アウターリード部１３ｂの絶縁状態をこの異方性導電
膜２０が維持するのである。Further, the anisotropic conductive film 20 used in the electronic component mounting apparatus 100 is dispersed in the adhesive 21 in a state where the conductive particles 22 do not come into contact with each other unless they are heated and pressed as described above. In addition, since the adhesive 21 itself has an insulating property, the outer lead portions 13b of the leads 13 are covered with an insulator so to speak, and other electronic components are mounted. The anisotropic conductive film 20 maintains the insulating state of each outer lead portion 13b even when reflowing is performed in the solder bath for the above reasons.
【００１４】そして、重要なことは、この電子部品搭載
装置１００は、その電子部品搭載用フィルムキャリア１
０のインナーリード部１３ａに電子部品３０を電気的に
接続した後に、この電子部品搭載用フィルムキャリア１
０を他のプリント配線板４０に実装する場合には、図８
または図９に示すように、電子部品搭載用フィルムキャ
リア１０側の各アウターリード部１３ｂとプリント配線
板４０側の各接続部４１とによって、一対一で電気的接
続と接着がなされるのである。つまり、図８及び図９に
おいて、連続的な異方性導電膜２０が各アウターリード
部１３ｂと接続部４１間に介在してはいるけれども、各
アウターリード部１３ｂと接続部４１とが対向している
部分においてのみ異方性導電膜２０を構成している接着
剤２１中の導電粒子２２が互いに接触し合って導通を確
保しているのであり、その他の部分では絶縁性を保って
いるのである。従って、特に図９に示したように、この
電子部品搭載装置１００は、これを構成している電子部
品搭載用フィルムキャリア１０がプリント配線板４０に
対して所定の位置（図８に示したような位置）に配置さ
れていなくても、各アウターリード部１３ｂと接続部４
１とが対向し合う部分があれば、その導通は十分確保さ
れるのである。It is important to note that the electronic component mounting apparatus 100 includes the electronic component mounting film carrier 1
After electrically connecting the electronic component 30 to the inner lead portion 13a of No. 0, the electronic component mounting film carrier 1
When 0 is mounted on another printed wiring board 40, as shown in FIG.
Alternatively, as shown in FIG. 9, the outer lead portions 13b on the electronic component mounting film carrier 10 side and the respective connection portions 41 on the printed wiring board 40 side provide one-to-one electrical connection and adhesion. That is, although the continuous anisotropic conductive film 20 is interposed between each outer lead portion 13b and the connection portion 41 in FIGS. 8 and 9, each outer lead portion 13b and the connection portion 41 face each other. The conductive particles 22 in the adhesive 21 forming the anisotropic conductive film 20 are in contact with each other only in the part where the conductive film 20 is present to ensure conduction, and in other parts, the insulating property is maintained. is there. Therefore, in particular, as shown in FIG. 9, in the electronic component mounting apparatus 100, the electronic component mounting film carrier 10 forming the electronic component mounting apparatus 100 is located at a predetermined position with respect to the printed wiring board 40 (as shown in FIG. 8). Even if the outer lead portion 13b and the connecting portion 4
If there is a portion where 1 and 1 face each other, the conduction is sufficiently ensured.
【００１５】[0015]
【実施例】次に、本発明に係る電子部品搭載装置１００
を、図面に示した各実施例に従って具体的に説明する。EXAMPLE Next, an electronic component mounting apparatus 100 according to the present invention.
Will be specifically described according to each embodiment shown in the drawings.
【００１６】図１〜図４には、本発明の第一実施例に係
る電子部品搭載装置１００が示してあり、この電子部品
搭載装置１００は電子部品搭載用フィルムキャリア１０
とプリント配線板４０によって構成されている。この電
子部品搭載用フィルムキャリア１０は、そのフィルム状
の絶縁基材１１に形成したデバイス穴１２に対して、銅
箔等を所定のパターン形状にエッチングして形成した多
数のリード１３のインナーリード部１３ａを突出させた
ものである。つまり、この図１に示した電子部品搭載装
置１００は、図３及び図４に示したように、その電子部
品搭載用フィルムキャリア１０のデバイス穴１２内に電
子部品３０を収納しながら各インナーリード部１３ａと
電気的に接続するものである。なお、電子部品３０の搭
載後は、図３及び図４に示したように、電子部品３０を
中心に封止樹脂５０による封止を行うものである。1 to 4 show an electronic component mounting apparatus 100 according to a first embodiment of the present invention. The electronic component mounting apparatus 100 is an electronic component mounting film carrier 10.
And a printed wiring board 40. This electronic component mounting film carrier 10 has inner lead portions of a large number of leads 13 formed by etching a copper foil or the like into a predetermined pattern shape in a device hole 12 formed in the film-shaped insulating base material 11. 13a is projected. That is, as shown in FIGS. 3 and 4, the electronic component mounting apparatus 100 shown in FIG. 1 accommodates each inner lead while accommodating the electronic component 30 in the device hole 12 of the electronic component mounting film carrier 10. It is electrically connected to the portion 13a. After the electronic component 30 is mounted, as shown in FIGS. 3 and 4, the electronic component 30 is mainly sealed by the sealing resin 50.
【００１７】この電子部品搭載装置１００の電子部品搭
載用フィルムキャリア１０においては、図１及び図２に
示すように、絶縁基材１１の各リード１３を形成した側
の面に、各リード１３のアウターリード部１３ｂを覆う
ような状態で枠状の異方性導電膜２０を一体化したもの
である。この異方性導電膜２０は、前述したように、そ
れ自体は絶縁性の接着剤２１中に、種々な材料（炭素
等）からなる導電粒子２２を互いに接触し合わない状態
で分散させたものであり、これに熱と圧力を加えた場合
に各導電粒子２２同志を接触させると同時に、接着剤２
１の硬化によって各導電粒子２２の接触状態を固定化す
るものである。In the electronic component mounting film carrier 10 of the electronic component mounting apparatus 100, as shown in FIGS. 1 and 2, each lead 13 is formed on the surface of the insulating base material 11 on which the leads 13 are formed. The frame-shaped anisotropic conductive film 20 is integrated so as to cover the outer lead portion 13b. As described above, the anisotropic conductive film 20 is obtained by dispersing the conductive particles 22 made of various materials (carbon or the like) in the insulating adhesive 21 so as not to be in contact with each other. When heat and pressure are applied to the conductive particles 22, the conductive particles 22 are brought into contact with each other, and at the same time, the adhesive 2
The curing of 1 fixes the contact state of each conductive particle 22.
【００１８】図６及び図７には、本発明の第二実施例に
係る電子部品搭載装置１００が示してあり、この電子部
品搭載装置１００においては、電子部品搭載用フィルム
キャリア１０が使用されている。この電子部品搭載用フ
ィルムキャリア１０は、所謂チップ・オン・ボードタイ
プのものである。つまりこの電子部品搭載用フィルムキ
ャリア１０の絶縁基材１１はデバイス穴１２を有してい
ないものであり、絶縁基材１１の略中央部に形成したダ
イパッド上に搭載した電子部品３０と各インナーリード
部１３ａとは、図７に示したように、ボンディングワイ
ヤ３１によって電気的接続がなされるものである。FIGS. 6 and 7 show an electronic component mounting apparatus 100 according to a second embodiment of the present invention. In this electronic component mounting apparatus 100, an electronic component mounting film carrier 10 is used. There is. The electronic component mounting film carrier 10 is of a so-called chip-on-board type. That is, the insulating base material 11 of the electronic component mounting film carrier 10 does not have the device hole 12, and the electronic component 30 mounted on the die pad formed in the substantially central portion of the insulating base material 11 and each inner lead. The portion 13a is, as shown in FIG. 7, electrically connected by the bonding wire 31.
【００１９】この電子部品搭載用フィルムキャリア１０
においても、絶縁基材１１のリード１３を形成した面に
枠状の異方性導電膜２０を、各リード１３のアウターリ
ード部１３ｂを覆う状態で一体化したものである。な
お、この電子部品搭載用フィルムキャリア１０に実装し
た電子部品３０に対しても、図７にて示すように、封止
樹脂５０による封止がなされるものである。This electronic component mounting film carrier 10
Also in this case, the frame-shaped anisotropic conductive film 20 is integrated with the surface of the insulating base material 11 on which the leads 13 are formed so as to cover the outer lead portions 13b of the leads 13. The electronic component 30 mounted on the electronic component mounting film carrier 10 is also sealed with the sealing resin 50 as shown in FIG. 7.
【００２０】以上、いずれの電子部品搭載装置１００に
おいても、これを構成している電子部品搭載用フィルム
キャリア１０として、異方性導電膜２０を絶縁基材１１
のリード１３側面に一体化するようにしたものを例示し
たが、各リード１３とスルーホールによって電気的に接
続されるパッド等を、絶縁基材１１のリード１３とは反
対面に形成しておき、これらのパッド等を異方性導電膜
２０によって覆うようにして実施してもよいものであ
る。As described above, in any of the electronic component mounting apparatuses 100, the anisotropic conductive film 20 is used as the insulating substrate 11 as the electronic component mounting film carrier 10 constituting the electronic component mounting apparatus 100.
However, the pad electrically connected to each lead 13 by a through hole is formed on the side of the insulating base material 11 opposite to the lead 13. Alternatively, these pads and the like may be covered with the anisotropic conductive film 20.
【００２１】[0021]
【発明の効果】以上詳述した通り、本発明においては、
上記各実施例にて例示した如く、「接続部４１を有する
プリント配線板４０上の所定の位置に、フィルム状の絶
縁基材１１と、この上に所定のパターンで形成したリー
ド１３とを備え、電子部品３０が搭載された電子部品搭
載用フィルムキャリア１０を搭載し一体化して電気的に
接続した電子部品搭載装置１００において、リード１３
と、接続部４１とが異方性導電膜２０を介して一体化さ
れて、電気的に接続されていること」にその構成上の特
徴があり、これにより、半田リフローによるショート不
良発生がなく、しかも電子部品搭載用フィルムキャリア
とプリント配線板との電気的接続が常に確実である電子
部品搭載装置を簡単な構成によって提供することができ
るのである。As described above in detail, in the present invention,
As illustrated in each of the above-described embodiments, "the film-shaped insulating base material 11 is provided at a predetermined position on the printed wiring board 40 having the connection portion 41, and the leads 13 formed in a predetermined pattern thereon. In the electronic component mounting apparatus 100 in which the electronic component mounting film carrier 10 on which the electronic component 30 is mounted is mounted and integrated and electrically connected, the lead 13
And the connection portion 41 are integrated and electrically connected through the anisotropic conductive film 20. ”, which prevents a short circuit from being caused by solder reflow. In addition, it is possible to provide an electronic component mounting apparatus having a simple structure in which electrical connection between the electronic component mounting film carrier and the printed wiring board is always reliable.
【図１】本発明の第一実施例に係る電子部品搭載装置を
構成している電子部品搭載用フィルムキャリアの部分拡
大平面図である。FIG. 1 is a partially enlarged plan view of an electronic component mounting film carrier that constitutes an electronic component mounting apparatus according to a first embodiment of the present invention.
【図２】図１の１−１線に沿ってみた断面図である。FIG. 2 is a sectional view taken along line 1-1 of FIG.
【図３】同電子部品搭載装置を構成するための電子部品
搭載用フィルムキャリアに電子部品を実装した状態の断
面図である。FIG. 3 is a cross-sectional view showing a state in which an electronic component is mounted on an electronic component mounting film carrier that constitutes the electronic component mounting apparatus.
【図４】図３に示した電子部品搭載用フィルムキャリア
を他のプリント配線板に実装し電子部品搭載装置とした
状態の断面図である。FIG. 4 is a cross-sectional view of a state in which the electronic component mounting film carrier shown in FIG. 3 is mounted on another printed wiring board to form an electronic component mounting device.
【図５】異方性導電膜の構成及び作用を示すための部分
拡大断面図である。FIG. 5 is a partial enlarged cross-sectional view showing the configuration and action of the anisotropic conductive film.
【図６】本発明の第二実施例に係る電子部品搭載装置を
構成している電子部品搭載用フィルムキャリアの部分拡
大平面図である。FIG. 6 is a partially enlarged plan view of an electronic component mounting film carrier that constitutes an electronic component mounting apparatus according to a second embodiment of the present invention.
【図７】図６の電子部品搭載用フィルムキャリアを用い
た電子部品搭載装置の部分断面図である。FIG. 7 is a partial cross-sectional view of an electronic component mounting apparatus using the electronic component mounting film carrier of FIG.
【図８】各アウターリード部とプリント配線板側の接続
部とを異方性導電膜を介して接続した状態の断面図であ
る。FIG. 8 is a cross-sectional view of a state in which each outer lead part and a connection part on the printed wiring board side are connected via an anisotropic conductive film.
【図９】各アウターリード部とプリント配線板側の接続
部とを異方性導電膜を介して他の状態の断面図である。FIG. 9 is a cross-sectional view of another state in which each outer lead portion and the connection portion on the printed wiring board side are interposed by an anisotropic conductive film.
【図１０】従来の電子部品搭載用フィルムキャリアの部
分拡大断面図である。FIG. 10 is a partially enlarged cross-sectional view of a conventional electronic component mounting film carrier.
【図１１】図１０に示した電子部品搭載用フィルムキャ
リアを用いた電子部品搭載装置の部分拡大断面図であ
る。11 is a partially enlarged cross-sectional view of an electronic component mounting apparatus using the electronic component mounting film carrier shown in FIG.
１００ 電子部品搭載装置 １０ 電子部品搭載用フィルムキャリア １１ 絶縁基材 １２ デバイス穴 １３ａ インナーリード部 １３ｂ アウターリード部 ２０ 異方性導電膜 ２１ 接着剤 ２２ 導電粒子 ４０ プリント配線板 ４１ 接続部 100 Electronic Component Mounting Device 10 Electronic Component Mounting Film Carrier 11 Insulating Base Material 12 Device Hole 13a Inner Lead Part 13b Outer Lead Part 20 Anisotropic Conductive Film 21 Adhesive 22 Conductive Particles 40 Printed Wiring Board 41 Connection Part
Claims (1)
の位置に、フィルム状の絶縁基材と、この上に所定のパ
ターンで形成したリードとを備え、電子部品が搭載され
た電子部品搭載用フィルムキャリアを搭載し一体化して
電気的に接続した電子部品搭載装置において、 前記リードと、前記接続部とが異方性導電膜を介して一
体化されて、電気的に接続されていることを特徴とする
電子部品搭載装置。1. An electronic component mounting, in which an electronic component is mounted, comprising a film-shaped insulating base material and a lead formed in a predetermined pattern on the insulating base material at a predetermined position on a printed wiring board having a connecting portion. In an electronic component mounting apparatus in which a film carrier for a vehicle is mounted and integrated and electrically connected, the lead and the connection portion are integrated and electrically connected through an anisotropic conductive film. An electronic component mounting device characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5163692A JPH05259221A (en) | 1992-03-10 | 1992-03-10 | Electronic part mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5163692A JPH05259221A (en) | 1992-03-10 | 1992-03-10 | Electronic part mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05259221A true JPH05259221A (en) | 1993-10-08 |
Family
ID=12892339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5163692A Pending JPH05259221A (en) | 1992-03-10 | 1992-03-10 | Electronic part mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05259221A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0683517A3 (en) * | 1994-05-09 | 1997-04-02 | Nec Corp | Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof. |
| JP2006332624A (en) * | 2005-04-26 | 2006-12-07 | Asahi Kasei Electronics Co Ltd | Connection material |
| JP2009238775A (en) * | 2008-03-25 | 2009-10-15 | Shibaura Mechatronics Corp | Apparatus and method for sticking adhesive tape |
-
1992
- 1992-03-10 JP JP5163692A patent/JPH05259221A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0683517A3 (en) * | 1994-05-09 | 1997-04-02 | Nec Corp | Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof. |
| JP2006332624A (en) * | 2005-04-26 | 2006-12-07 | Asahi Kasei Electronics Co Ltd | Connection material |
| JP2009238775A (en) * | 2008-03-25 | 2009-10-15 | Shibaura Mechatronics Corp | Apparatus and method for sticking adhesive tape |
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