JP2009167007A - Adhesive tape supply unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape supply unit for allowing easy and quick replacement of an adhesive tape. <P>SOLUTION: The adhesive tape supply unit 30 is provided for an adhesive tape pasting device 1 where the adhesive tape 5 having an adhesive material layer on a supporting tape 5A is arranged on a pasting site provided at the side edge of a base 2 along its longitudinal direction so that the adhesive tape 5 is thrust by a press bonding head 11 to paste the adhesive material layer to the pasting site. On a supporting plate 31 which can be detachably mounted on the body of the adhesive tape pasting device, there are provided a tape supply part 32 for supplying the adhesive tape 5, tape travel guide parts 33a, 33b located on both sides of the press bonding head 11 for guiding the supplied adhesive tape 5 to be arranged above the pasting site, and a tape travel part 34 for driving the travel of the supporting tape 5A from which the adhesive material layer is separated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an adhesive tape supply unit used in an adhesive tape attaching apparatus for attaching an adhesive tape having an adhesive layer provided on a support tape, such as an ACF (anisotropic conductive material film) tape, to a substrate.

  As a method of mounting components on a substrate in a display panel such as a liquid crystal panel or a PDP (Plasma Display Panel), an adhesive tape such as an ACF tape is attached to the substrate, and then the supporting tape is peeled off to remove the ACF from the substrate. By adhering parts such as TCP (Tape Carrier Package), IC, thin LSI package parts, etc. on the adhesive material layer, and then applying pressure and heat to the adhesive material layer A method of mounting a component on a substrate is known. In such a component mounting method, an adhesive tape attaching device is used to attach an adhesive tape to a substrate as described above.

  The configuration of the adhesive tape application device is to pull out the adhesive tape from the reel on which the adhesive tape having the adhesive material layer provided on the support tape is wound, cut only the adhesive material layer to a predetermined length, and then receive the adhesive tape. Supply to the upper position of the substrate placed on the table, press the adhesive tape with the crimping means, attach the adhesive material layer cut to a predetermined length to the substrate, and then support from the adhesive material layer attached There is known one that peels and collects the tape and repeats the operation of supplying the next adhesive tape (see, for example, Patent Document 1).

  A tape applying apparatus having a configuration similar to that described in Patent Document 1 will be described with reference to FIGS. 9 and 10. The adhesive tape applying apparatus 1 supports a substrate 2 and moves and positions the positioning means 3. A lower support 4 that supports the side edge of the substrate 2 positioned by the positioning means 3 from below, a pressure-bonding mechanism 6 that presses the adhesive tape 5 to be applied from above and attaches it to the substrate 2; The tape supply unit 7 that supplies the adhesive tape 5, the peeling mechanism unit 8 that peels the supporting tape from the adhesive material layer of the adhesive tape 5 attached to the substrate 2, and the peeled supporting tape of the adhesive tape 5 are collected. The tape collecting unit 9 is used. Reference numeral 10 denotes transfer means for transferring and transferring the substrate 2 carried into the carry-in position of the adhesive tape attaching apparatus 1 to and from the positioning means 3. In FIG. 9, 1 </ b> A is a control unit that performs overall operation control of the adhesive tape applying device 1.

  The pressure-bonding mechanism 6 has a pressure-bonding surface 11a facing the lower receiving portion 4 disposed below, and a pressure-bonding head 11 that performs a sticking operation of the adhesive tape 5 and a cylinder device that drives the pressure-bonding head 11 up and down. The head lifting / pressurizing device 12 is provided. The pressure-bonding head 11 includes a heating means (not shown), and heats the pressure-bonding surface 11 a of the pressure-bonding head 11 to a predetermined temperature for sticking the pressure-sensitive adhesive tape 5 having the pressure-sensitive adhesive layer to the side end of the substrate 2. It is possible.

  The tape supply unit 7 includes a reel 13 around which the adhesive tape 5 is wound, a plurality of guide rollers 14 a, 14 b, and 14 c that guide the adhesive tape 5 supplied from the reel 13, and a pair arranged in parallel at intervals. Between the guide rollers 14a and 14b, a tension roller 15 which is urged to move in a direction away from and away from these rollers, and an adhesive material layer provided in series on one side of the support tape of the adhesive tape 5 On the other hand, a cutter 16 for making a cut for each length according to the size of the adhesive material application area on the substrate 2, an end portion of the adhesive tape 5, and a start end portion of the adhesive tape 5 pulled out from the newly mounted reel 13. And a tape connecting means 17 for connecting the two.

  The peeling mechanism unit 8 includes a movable body 18 that can reciprocate in the longitudinal direction between the base 4 and the crimping surface 11a of the crimping head 11, and an adhesive that is crimped to the substrate 2 as the movable body 18 moves. A tape pressing roller 19a that moves while rolling along the upper surface of the tape 5, and an oblique upper portion of the pressing roller 19a, and the moving tape 18 is wound around a part of the outer periphery to move the moving body 18. Accordingly, a tape peeling roller 19b for peeling the support tape from the adhesive material layer affixed to the substrate 2 and a chuck 20 provided on the moving body 18 for gripping and fixing the support tape peeled off when necessary. Yes. The tape recovery unit 9 includes a guide roller 21 that guides the peeled support tape upward, a chuck 22 that grips and fixes the support tape, and a recovery unit 23 that sucks and recovers the support tape. Reference numeral 24 denotes an end detection sensor that detects an end mark or the like provided near the end of the adhesive tape 5 to detect the end of the adhesive tape 5.

In addition, in an adhesive tape attaching apparatus in which an adhesive tape cut to a predetermined length is held by a crimping head and attached to a substrate, an adhesive tape storage cassette capable of supplying the adhesive tape for a predetermined length is mounted. It is known (see, for example, Patent Document 2).
Japanese Patent Laid-Open No. 7-270742 Japanese Patent No. 3149679

  By the way, in the conventional adhesive tape applying apparatus such as the above-mentioned Patent Document 1, when the adhesive tape 5 wound around the reel 13 is lost, the reel 13 in use is removed and a new reel 13 is mounted. It is necessary to pull out the adhesive tape 5 from the roller, wrap the adhesive tape 5 around each roller arranged along the traveling path and stretch it to the collecting means 23. The thin and sticky tape is wound around and stretched. Therefore, labor, time, and skill are required for the complicated and delicate work, and there is a problem that productivity is lowered.

  In order to solve such a problem, in the adhesive tape applying apparatus having the configuration shown in FIGS. 9 and 10, the end detection sensor 24 indicates that the end of the adhesive tape 5 wound around the reel 13 is near. Is detected, the new reel 13 is replaced and the start end of the adhesive tape 5 is pulled out, and the end of the adhesive tape 5 in use and the start of the new adhesive tape 5 are connected by the tape connecting means 17. This eliminates the need for complicated tensioning work for the adhesive tape 5, but even in that case, it takes time and effort to connect the terminal portion and the starting end portion of the adhesive tape 5. Although it is conceivable to automatically perform the above work, since the configuration becomes complicated and the work still takes time, it is difficult to improve the productivity by shortening the work time associated with reel replacement. Toi There was a problem.

  Moreover, the substrate of the display panel is generally produced by bonding two glass substrates, and the side edges of one to three sides of the one substrate are projected from the corresponding side edges of the other glass substrate, Electrodes for electrical connection to the outside are disposed on the surface of the protruding side edge portion to drive the display panel, and components are mounted on the electrode portion via the ACF as described above. It is configured. Therefore, the sticking part of the adhesive tape to the substrate is the protruding side edge of the one substrate, and one side edge of the sticking part is constituted by a rising step portion by the side edge of the other substrate. Moreover, in recent years, the effective display screen is required to be enlarged, but the display panel is required to be reduced in outer dimensions, so the width dimension of the pasted portion provided on the side edge of the one substrate is becoming increasingly narrow. It has become. Moreover, the variation in the dimensional accuracy in the width direction of an adhesive tape such as an ACF tape is different for each production lot.

  Therefore, when affixing the adhesive tape, very high application position accuracy is required. However, in the configurations described in Patent Document 1, FIG. 9, and FIG. Since there is no configuration that regulates the position of one side edge, it is difficult to meet such requirements, and it is difficult to apply adhesive tape properly, which causes defective mounting of components and increases productivity. There was a problem of significantly lowering.

  In view of the above-described conventional problems, the present invention provides an adhesive tape supply unit capable of easily and quickly replacing an adhesive tape and supplying the adhesive tape in the width direction with high positional accuracy. For the purpose.

  The pressure-sensitive adhesive tape supply unit according to the present invention has a pressure-sensitive adhesive head in which a pressure-sensitive adhesive tape provided with a pressure-sensitive adhesive material layer is disposed on a bonding portion provided along a longitudinal direction of a side edge of a substrate. Is an adhesive tape supply unit in an adhesive tape application device for applying an adhesive material layer to an application site by pressing the adhesive material, and supplies the adhesive tape to a support plate that can be detachably attached to the main body of the adhesive tape application device A tape supply section, a tape traveling guide section for guiding the adhesive tape disposed and supplied so as to be positioned on both sides of the pressure-bonding head to be disposed above the application site, and a support tape from which the adhesive material layer has been peeled off And a tape running part that is driven to travel, and the tape running guide part has at least one side edge in the width direction of the adhesive tape and / or the support tape aligned in the width direction of the application site. It is provided with a position regulating means for moving adjustably position regulating the position of the predetermined distance from the predetermined position.

  According to this configuration, when the adhesive tape in use reaches the end, the adhesive tape supply unit in use is removed, and the adhesive tape supply unit having an unused adhesive tape is attached, so that the tape is supplied from the tape supply unit. The adhesive tape is placed above the application site in the tape travel guide section and can be driven and driven by the tape travel section, so that the operator directly attaches the adhesive tape on the adhesive tape application device. It is not necessary to perform the troublesome work of wrapping the adhesive tape around each roller arranged along the travel path and to connect the end and the start of the adhesive tape. Can be exchanged easily and in a short time.

  In addition, the tape travel guide part can be adjusted so that one side edge of at least one of the adhesive tape and / or the support tape can be moved and adjusted from a specified position on one side in the width direction of the application site to a position of a required interval. By providing position regulating means, the adhesive tape can be attached with one side edge in the width direction regulated from the specified position on one side in the width direction of the application site to the position of the required interval. Even if the width dimension of the application site in the width direction of the tape is small, the adhesive tape can be accurately attached to an appropriate position.

  Further, the position adjusting means is rotated as the pressure-sensitive adhesive tape and / or the support tape is brought into contact with the travel, and the side surface in the width direction of the pressure-sensitive adhesive tape and / or the support tape is engaged with the flange on the outer peripheral surface side. A configuration using a leveling roller at the edge is preferable because the leveling can be performed smoothly and accurately while the adhesive tape travels.

  Further, the regulation roller includes a first regulation roller disposed at a lateral position of the pressure-bonding means so as to regulate the position of the adhesive tape and / or the support tape on the application site, and an upper portion of the first regulation roller. And the first regulating roller and the second regulating roller have different side edges of the adhesive tape and / or the support tape on different side edges. When the configuration is provided with a position adjustment means for adjusting the position of either one of the setting rollers in the axial direction, the board model can be adjusted by adjusting the position of one of the setting rollers. Depending on the width of the adhesive tape, which varies depending on the production lot, and the dimensional accuracy in the width direction of the adhesive tape varies from lot to lot. Rukoto can. In particular, if one of the scissors provided on both sides is configured to be movable by using a single leveling roller, a step is generated on the peripheral surface in the direction in which the adhesive tape is wound due to the moving mechanism, and the adhesive tape is removed. Although there is a risk of deforming or creating a gap and biting the adhesive tape, this problem can be solved by using the first and second regulating rollers that are configured with different axes. can do.

  In addition, the second leveling roller is used in advance with respect to variations such as minute irregularities in manufacturing the step portion with respect to a specified position of the step portion of the substrate on the attachment portion of the substrate that is one side of the attachment portion. The reference roller is configured with a reference roller provided with a flange at the reference position with a position separated by a set allowable gap dimension as a reference position, and the first setting roller is set to have an interval between the reference roller flange and its own flange. It is preferable to use an adjusting roller that can be adjusted by the position adjusting means. This is because even if the width of the pressure-sensitive adhesive tape is the same standard, there are variations in production lots, so it is preferable that the position of one side edge can be finely adjusted according to the width of the pressure-sensitive adhesive tape to be used. . In that case, if the first setting roller is constituted by a reference roller, it is difficult to perform such fine adjustment by adjusting the position of the second setting roller located above the first setting roller. The position of the one side edge of the adhesive tape can be easily adjusted by using the second setting roller located at the top as the reference roller and making it possible to adjust the position of the first setting roller located closer to the part where the substrate is applied. Fine adjustment is possible.

  In addition, if the position adjustment means consists of a micrometer and the adjustment roller is rotatably mounted on its retracting shaft, the adjustment roller can be positioned with high accuracy using an inexpensive micrometer because it is a mass-produced product. This is preferable.

  According to the pressure-sensitive adhesive tape supply unit of the present invention, a new pressure-sensitive adhesive tape supply unit having an unused pressure-sensitive adhesive tape part is removed from the pressure-sensitive adhesive tape applying device and replaced with a pressure-sensitive adhesive tape supply unit having a used or used pressure-sensitive adhesive tape. By making it possible to attach, the adhesive tape supplied from the tape supply unit is placed above the application site in the tape traveling guide unit and can be driven and driven by the tape traveling unit. There is no need for the operator to perform the troublesome work of directly placing the adhesive tape on each roller arranged along the travel path of the tape on the apparatus, and the end and start of the adhesive tape are Since connection work is not required, the adhesive tape can be replaced easily and in a short time.

  Hereinafter, an adhesive tape supply unit according to an embodiment of the present invention will be described with reference to FIGS. In addition, the adhesive tape supply unit of this embodiment is applied to the conventional adhesive tape applying apparatus described with reference to FIGS. 9 and 10, and the same components in the adhesive tape applying apparatus are the same. The description will be omitted with reference numerals, and only the differences will be mainly described.

  1 and 2, the adhesive tape supply unit 30 according to the present embodiment is detachably attached to the main body of the adhesive tape applying apparatus 1, and is attached to a support plate 31 that is detachably attached to the main body. A tape supply section 32 that supplies the tape 5 and a tape running guide that is disposed so as to be positioned on both sides of the pressure-bonding head 11 and guides the supplied adhesive tape 5 to be disposed above the application site of the substrate 2. The parts 33a and 33b and a tape running part 34 for running and driving the support tape 5A peeled off from the adhesive layer attached to the substrate 2 are arranged. As shown in FIG. 2, the support plate 31 is brought into contact with the end surfaces of positioning bosses 40 a provided at a plurality of locations on the mounting plate 40 on the main body side of the adhesive tape applying device 1, so that the adhesive tape supply unit 30 With the positioning pins 41 of the support plate 31 inserted into the positioning holes 40b provided on the mounting plate 40 side on the main body side, the positioning pins 41 are accurately positioned, and are adhered by appropriate fixing means (not shown) such as mounting screws. The tape supply unit 30 is configured to be attached to the attachment plate 40 on the main body side of the adhesive tape applying device 1.

  The tape supply unit 32 includes a reel mounting unit 35 that mounts the reel 13 around which the adhesive tape 5 to be supplied is wound, and a tension mechanism unit 36 that applies a predetermined tension to the adhesive tape 5 pulled out from the reel 13. . As shown in FIG. 2, the reel mounting portion 35 has a mounting shaft 37 on which a reel 13 is detachably fitted and is rotatably disposed by a bearing 38, and an end portion of the mounting shaft 37 on the back side of the support plate 31. Is provided with a connection hole 39 into which the output shaft 42a of the supply motor 42 disposed on the attachment plate 40 on the main body side of the adhesive tape applying device 1 is engaged in the rotational direction.

  The tension mechanism portion 36 is supported by the tension roller 43 so as to be movable in the vertical direction along the guide groove 44 and is moved upward by an urging means (not shown) using gravity or spring force. It is energized. A detection sensor for detecting the position of the tension roller 43 is disposed on the main body side of the adhesive tape applying device 1, and the supply motor 42 is driven and controlled based on a detection signal from the detection sensor. Yes. Further, the cutter 16 and the end detection sensor 24 are disposed on the main body side of the adhesive tape applying device 1 at a position between the tension mechanism portion 36 and the tape travel guide portion 33a so as not to interfere with them. A cutout 31 a is formed in the plate 31.

  The tape running guide 33a on the supply side directs the adhesive tape 5 supplied from the tape supply unit 32 on the side portion of the substrate 2 on the pasting portion 25 (see FIG. 4) provided along the longitudinal direction thereof. The recovery-side tape travel guide portion 33b guides the support tape 5A peeled off from the adhesive material layer attached to the attachment portion 25 of the substrate 2 toward the tape travel portion 34 and the tape recovery portion 9. It is.

  These supply side and recovery side tape travel guides 33a and 33b are arranged on both sides of the pressure-bonding head 11 and are positioned closer to the application site 25 side of the substrate 2 and the first regulation roller 46 and the first A second regulating roller 47 disposed on the upper portion of the regulating roller 46 is disposed, and the first and second regulating rollers 46 and 47 are in the width direction of the adhesive tape 5 and its supporting tape 5A. Position correcting means 45 is configured to adjust the position in the width direction of the pasting part 25 of the substrate 2 so that the position can be adjusted. The support shaft 48 of the second setting roller 47 is attached to the support plate 31, and the position of the first setting roller 46 is attached to an inverted L-shaped mounting bracket 49 fixed to the support plate 31. The first regulating roller 46, which is attached to the retracting shaft 50a of the micrometer 50 as the adjusting means and is located closer to the sticking portion 25 of the substrate 2 than the second regulating roller 47, is adjusted in the axial direction. It is configured to be possible. Thus, the second regulation roller 47 constitutes a reference roller and the first regulation roller 46 constitutes an adjustment roller in the width direction of the adhesive tape 5 and / or the support tape 5A with respect to the application site 25 of the substrate 2. Yes.

  The second leveling roller 47 includes a side edge 5a in the width direction of at least one of the adhesive tape 5 and / or the supporting tape 5A on one side edge of the pasting portion 25 of the substrate 2 where the stepped portion 25a exists. And a width of at least one of the adhesive tape 5 and / or the supporting tape 5A on the other side edge opposite to the second regulating roller 47. A flange 46a for positioning the other side edge 5b in the direction is provided. As shown in FIG. 5, the flange 47 a of the second setting roller 47 is positioned so as to be located at a distance A from the position mark 26 provided on the pasting site 25 of the substrate 2. This distance A is set as follows. That is, the specified position of one side edge of the pasting site 25 of the substrate 2 is set at a position of a distance S from the position mark 26, but the step portion 25a forming the one side edge is formed by breaking the glass plate. Therefore, it is inevitable that irregularities of ± d (specifically, about 0.3 mm) are generated. Therefore, a distance obtained by subtracting the distance D = (d + α) obtained by adding the margin allowance α to the distance S is obtained. The distance A is set. Although the flange 47a of the second setting roller 47 is set to the distance A from the position mark 26, it may be set directly to the position of the distance D with the allowance added from the step portion 25a of the substrate 2. .

  Thus, by engaging the one side edge 5a of the adhesive tape 5 with the flange 47a of the second setting roller 47, the one side edge 5a of the adhesive tape 5 is separated from the specified position of the one side edge of the application site 25 by a distance D. The position can be adjusted. Furthermore, when the width dimension of the adhesive tape 5 is accurately controlled to the prescribed dimension, the first regulating roller 46 is spaced from the flange 46a of the second regulating roller 47 and the distance between the flange 47a of the second regulating roller 47. By adjusting and setting the position of the first regulating roller 46 with the micrometer 50 so as to be the size, the other side edge 5b of the adhesive tape 5 is engaged with the flange 46a of the first regulating roller 46 and is adhered. As the tape 5 travels, the one side edge 5a is regulated to the position of the distance D from the specified position of the one side edge of the application site 25 as described above.

  On the other hand, the actual width dimension of the adhesive tape 5 has an error in the minus direction with respect to the prescribed dimension as a manufacturing tolerance, and the position of the flange 46a of the first regulating roller 46 is adjusted and set according to the prescribed dimension. If this is the case, the one side edge 5a of the adhesive tape 5 may move away from the specified position of the one side edge of the application site 25 in a direction larger than the distance D, but in this embodiment, the second regulation which is a reference roller Even when the axial position, which is the width direction of the adhesive tape 5, of the flange 47 a of the roller 47 is fixedly positioned, the position of the first setting roller 46 can be changed according to the width dimension of the adhesive tape 5 to be used. By fine adjustment with the meter 50, the position of the one side edge 5a of the adhesive tape 5 can be accurately set to the position of the distance D from the specified position of the one side edge of the application site 25.

  Meanwhile, a reference roller in which the position of the first setting roller 46 and the position of the second setting roller 47 are exchanged so that the second setting roller 47 is positioned closer to the attaching portion 25 of the substrate 2. In this case, it can be considered that when the ridge 47a is positioned at a distance D from the specified position of one side edge of the application site 25, the one side edge 5a of the adhesive tape 5 can be positioned at that position. The position of the flange 46a of the first setting roller 46 located far from the second setting roller 47 with respect to the pasting portion 25 of the substrate 2 above the setting roller 47 is defined as described above. Even when the position is adjusted in accordance with the width dimension, the adjustment roller for adjusting the position in the width direction of the adhesive tape 5 is located farther from the pasting portion 25 of the substrate 2. In particular, when the adhesive tape 5 has a small specified width dimension, the one side edge 5a of the adhesive tape 5 is larger than the distance D from the specified position of the one side edge of the application site 25. Since the first regulating roller 46 that is the adjusting roller is disposed above the sticking portion 25 of the substrate 2 from the second regulating roller 47 that is the reference roller. It is found that there is a problem that it is difficult to accurately adjust the position of the one side edge 5a of the adhesive tape 5 from the specified position of the one side edge of the application site 25 to the position of the distance D by the adjustment. is doing.

  The tape running unit 34 is configured to drive and drive the adhesive tape 5 by sandwiching the support tape 5A of the adhesive tape 5 between the pinching roller 51 and the driving roller 52 and rotationally driving the driving roller 52. Yes. The nipping roller 51 and the driving roller 52 are rotatably supported by the support plate 31 of the adhesive tape supply unit 30, and the support plate 31 of the adhesive tape supply unit 30 is attached to the mounting plate 40 of the main body of the adhesive tape applying apparatus 1. When mounted, the adhesive tape applying device 1 is configured to be driven to rotate by being coupled to a travel drive motor 53 disposed on the main body side. The coupling configuration (not shown) of the driving roller 52 and the travel driving motor 53 is the same as the coupling configuration of the supply motor 42 and the mounting shaft 37. The support tape 5 </ b> A sent out from the tape running unit 34 is sucked by the collecting means 23 disposed in the main body of the adhesive tape applying device 1.

  The adhesive tape pasting device 1 has an adhesive that is reciprocally moved between the supply-side tape travel guide means 33a and the recovery-side tape travel guide means 33b of the adhesive tape supply unit 30 and is pressure-bonded to the substrate 2. A peeling mechanism 54 (details are omitted) is provided for peeling the support tape 5A of the tape 5 from the adhesive material layer stuck to the sticking part 25 of the substrate 2. The peeling mechanism 54 is arranged on the tape pressing roller 54a that moves while rolling along the upper surface of the pressure-sensitive adhesive tape 5 that is pressure-bonded to the substrate 2, and is disposed obliquely above the pressing roller 54a, and the support tape 5A is part of the outer periphery. The tape peeling roller 54b is configured to peel the support tape 5A from the adhesive material layer stuck to the sticking portion 25 of the substrate 2 by winding. Further, the mounting plate 40 to which the support plate 31 is attached so as to change the height position of the adhesive tape 5 between the tape running guide means 33a and 33b when the adhesive tape 5 is crimped, when the support tape 5a is peeled off and when the tape runs. Can be configured to move up and down as indicated by an arrow 55.

  Next, the process of affixing the adhesive tape 5 to the affixing site 25 on the side edge of the substrate 2 using the adhesive tape affixing device 1 having the above configuration will be described. With the positioning means 3 (having X, Y, Z, and θ moving axes), the side edge of the substrate 2 is positioned on the lower support 4 and the pressure raising / lowering pressure device 12 lowers the crimping head 11. The pressure-sensitive adhesive tape 5 is pressed on the pressure-bonding surface 11 a on the lower surface of the pressure-bonding head 11 to pressure-bond the pressure-sensitive adhesive tape 5 to the substrate 2. Next, after operating the peeling mechanism 54 to peel the support tape 5A of the pressure-sensitive adhesive tape 5 that has been pressure-bonded to the substrate 2 from the pressure-sensitive adhesive material layer that has been stuck to the sticking part 25 of the substrate 2, the tape running section 34 supports the support tape. 5A is moved by a predetermined tape supply amount, the supporting tape 5A is sucked and collected by the collecting means 22, and the adhesive tape 5 provided with the adhesive material layer is positioned on the crimping surface 11a of the crimping head 11 and the lower receiving base 4. It supplies between the pasting site | parts 25 of the board | substrate 2 made. By this operation, the tension roller 43 descends from the predetermined origin position in the tape supply unit 32, and then the supply motor 42 is driven to supply the adhesive tape 5 until the tension roller 43 is located at the origin position.

  When the adhesive tape 5 is supplied in the above-described adhesive tape 5 attaching step, the adhesive tape 5 and its supporting tape 5A are placed on the both sides of the pressure-bonding head 11 by the position adjusting means 45 of the tape running guide portions 33a and 33b. By being regulated in this way, the one side edge 5a of the adhesive tape 5 is accurately positioned at a distance D from the prescribed position on one side of the pasting part 25 of the substrate 2. Thus, even if the width dimension of the application part 25 which is the width direction of the adhesive tape 5 is small, the adhesive tape 5 can be accurately attached to an appropriate position.

  Further, the position regulating means 45 is constituted by regulating rollers 46 and 47 that rotate as the adhesive tape 5 and / or the support tape 5A comes into contact with the travel, and a flange 46a provided on the side edge of the outer peripheral surface. Since at least one of the widthwise side edges 5a and 5b of the adhesive tape 5 and / or the support tape 5A is engaged with 47a, the position in the width direction of the adhesive tape 5 or the support tape 5A is regulated. The position can be adjusted smoothly and accurately while the adhesive tape 5 is traveling.

  Also, a first regulating roller 46 disposed on both sides of the crimping means 11 on the side closer to the pasting site 25 of the substrate 2 so as to regulate the position above the pasting site 25 of the adhesive tape 5 and the support tape 5A. And a second setting roller 47 disposed on the upper portion of the first setting roller 46, and the adhesive tape 5 and / or the second setting roller 47 and the second setting roller 47 on different side edges of the first setting roller 46. Provided are flanges 46a and 47a that can be engaged with mutually different side edges 5a and 5b of the support tape 5A, and in any case, in the present embodiment, the first setting roller 46 has its axis in the width direction of the adhesive tape 5. Since the position can be adjusted in the core direction, the position of the first setting roller 46 is adjusted in accordance with the width dimension of the adhesive tape 5 which differs depending on the model of the substrate 2, and the first is configured as a separate body having a different shaft core. 1 regulation roller 4 Spacing between the flange 46a and the flange 47a of the second regulating rollers 47 may corresponding be by adjusting the.

  Further, even when the step portion 25a having minute irregularities with respect to the reference line passing through the prescribed position is provided on one side of the pasting portion 25 of the substrate 2, the first regulating roller 46 is attached to the adhesive tape 5 as described above. An adjustment roller whose position can be adjusted in the axial direction which is the width direction of the second position, and a position where the second setting roller 47 is separated from the specified position by a preset allowable gap size so as to absorb minute irregularities is a reference position. As the reference roller, the adhesive tape 5 and / or the supporting tape 5A is provided with a flange 47a of the second setting roller 47 with which one side edge 5a of the support tape 5A is engaged. Even when there is a variation in the manufacturing lot in the width dimension 5, the second regulation roller 47 located above the first regulation roller 46 is used as a reference roller, and the width of the width dimension 5 is set to the pasting portion 25 of the substrate 2. Since the position of the first setting roller 46 located closer to the second setting roller 47 is adjustable, the position of the first setting roller 46 is adjusted according to the width dimension of the adhesive tape 5 to be used. Thereby, the position of the one side edge 5a of the adhesive tape 5 can be finely adjusted with high accuracy.

  As described above, the end of the adhesive tape 5 of the reel 13 mounted on the adhesive tape supply unit 30 is detected by the end detection sensor 24 by repeating the operation of applying the adhesive tape 5 to the application site 25 of the substrate 2. Then, the adhesive tape supply unit 30 having the used or used adhesive tape is removed from the adhesive tape applicator 1, and the reel 13 around which the adhesive tape 5 having an unused portion to be replaced is wound is mounted. The sticking operation can be resumed by a simple operation of simply mounting the adhesive tape supply unit 30.

  In the adhesive tape supply unit 30 described above, as shown in FIGS. 1, 3, and 4, both the supply side tape travel guide unit 33 a and the recovery side tape travel guide unit 33 b are both adhesive tapes. 5 is shown in a tangential contact with the second regulation roller 47 and wound around the first regulation roller 46 in an L-shape. However, as shown in FIGS. In the guide portion 33 a, the adhesive tape 5 is brought into contact with the second regulation roller 47 in a tangential state, and is wound around the first regulation roller 46 in an L shape, so that the adhesive material layer of the adhesive tape 5 is in the regulation roller 46. 47, the recovery-side tape travel guide portion 33b winds the support tape 5A without the adhesive material layer, so that the winding angle can be increased. Regulation roller 4 , It may be wrapped around the support tape 5A substantially S-shape 47.

  In the above description of the embodiment, only an example of an ACF tape in which an ACF (anisotropic conductive material film), which is an adhesive layer, is provided on one side of the support tape as the adhesive tape is shown. The present invention is not limited to the component mounting using the above, but can also be applied to the case where a non-conductive film is attached to the substrate to mount the component. Also, an adhesive tape application device that prevents adhesive material from adhering to the crimping head by crimping with a protective tape between the crimping head and the adhesive tape or between the crimping head and the component. In the pressure bonding apparatus, the present invention can also be applied to position adjustment in the width direction when the protective tape is supplied.

  According to the pressure-sensitive adhesive tape supply unit of the present invention, the pressure-sensitive adhesive tape supply device can be obtained by simply removing the pressure-sensitive adhesive tape supply unit in use from the main body side of the pressure-sensitive adhesive tape applying device and mounting the pressure-sensitive adhesive tape supply unit having an unused pressure-sensitive adhesive tape. There is no need for the operator to perform the troublesome work of directly placing the adhesive tape around each roller arranged along the travel path of the tape, and connecting the end and start of the adhesive tape. Since the adhesive tape can be exchanged easily and in a short time, it can be suitably used for a component mounting apparatus that mounts various components by attaching the adhesive tape to the substrate.

The whole perspective view of one embodiment of the adhesive tape supply unit concerning the present invention. The expanded vertical side view which shows the periphery structure of the reel mounting part of the embodiment. The fragmentary sectional front view which shows the structure of the tape running guide part of the embodiment. The AA arrow side view of FIG. Explanatory drawing of the arrangement position of the reference | standard roller in the embodiment. The whole perspective view which shows the modification of the adhesive tape travel path | route in the embodiment. The fragmentary sectional front view which shows the structure of the tape travel guide part in the modification. The BB arrow side view of FIG. The whole perspective view of the adhesive tape sticking apparatus of a prior art example. The front view which shows the principal part structure of the adhesive tape supply sticking apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive tape sticking apparatus 2 Board | substrate 5 Adhesive tape 5A Support tape 5a One side edge 5b The other side edge 11 Crimping tool (crimping means)
25 Adhering Site 30 Adhesive Tape Supply Unit 31 Support Plate 32 Tape Supply Part 33a, 33b Tape Travel Guide Part 34 Tape Travel Part 45 Position Adjustment Means 46 First Adjustment Roller (Adjustment Roller)
46a 鍔 47 Second regulation roller (reference roller)
47a ５０ 50 micrometers (position adjustment means)

Claims (5)

  An adhesive tape with an adhesive layer provided on the support tape is placed on the side of the substrate along the longitudinal direction of the substrate, and the adhesive tape is pressed with a pressure head to adhere to the site. An adhesive tape supply unit in an adhesive tape application device for attaching a material layer, the tape supply unit supplying adhesive tape to a support plate that can be detachably attached to the main body of the adhesive tape application device, and both sides of the crimping head A tape running guide unit that guides the adhesive tape that is disposed and supplied to be placed above the application site, and a tape running unit that drives the support tape from which the adhesive material layer has been peeled off. At least one of the adhesive tape and / or support tape in the width direction is moved from the specified position on one side in the width direction of the application site to the position of the required interval. Adhesive tape supply unit, characterized in that a position regulating means for adjustably position regulating.   The position regulating means rotates the outer periphery of the adhesive tape and / or the support tape, and rotates along with the running of the adhesive tape and / or at least one side edge in the width direction of the support tape. 2. The pressure-sensitive adhesive tape supply unit according to claim 1, wherein the pressure-sensitive adhesive tape supply unit is constituted by a setting roller provided on a side edge of the surface.   The regulation roller is arranged on the upper side of the first regulation roller and the first regulation roller arranged at the side position of the pressure-bonding means so as to regulate the position of the adhesive tape and / or the support tape on the application site. The first and second setting rollers are engaged with different side edges of at least one of the adhesive tape and / or the support tape. 4. The pressure-sensitive adhesive tape supply unit according to claim 3, wherein a flange is provided, and a position adjusting means for adjusting the position of any one of the regulating rollers in the axial direction thereof is provided.   The second leveling roller is constituted by a reference roller provided with a wrinkle at the reference position with a position separated by a preset allowable gap dimension from a specified position on one side of the application site as a reference position. 4. The pressure-sensitive adhesive tape supply unit according to claim 3, wherein the regulating roller is constituted by an adjustment roller capable of adjusting a distance between a flange of the reference roller and its own flange by a position adjusting means.   5. The pressure-sensitive adhesive tape supply unit according to claim 3, wherein the position adjusting means comprises a micrometer, and an adjustment roller is rotatably attached to the retracting shaft.

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