TWI392037B - An anisotropic conductive film attaching means, and a flat panel display manufacturing apparatus - Google Patents

Description

Device for attaching an anisotropic conductive film and a flat panel display

The present invention relates to an ACF attaching device for attaching an anisotropic conductive film (ACF) to a substrate for mounting a semiconductor circuit element such as a driver circuit on a substrate, and a flat panel display manufacturing device including the ACF attaching device and A flat panel display manufactured using the manufacturing apparatus of the flat panel display.

One of the flat panel displays is a liquid crystal display. The liquid crystal display is configured by enclosing liquid crystal between liquid crystal panels formed by two upper and lower transparent substrates. In the liquid crystal panel, a printed circuit board is connected through a drive circuit, and an electrode on the inner side of the drive circuit is connected to the liquid crystal panel, and an electrode on the outer side is connected to the printed circuit board. As a mounting method of the driving circuit, a TAB (Tape Automated Bonding) method and a COG (Chip On Glass) method are representative, and a wiring pattern is formed on at least two sides of the surface of the liquid crystal panel, and the electrode of the wiring pattern is The electrodes of the drive circuit are electrically connected.

The conductive connection between the driving circuit and the liquid crystal panel substrate, and between the driving circuit and the printed circuit board, is used to uniformly disperse the ACF of the minute conductive particles in the adhesive resin. By thermally bonding the ACF, the electrodes are electrically connected through the conductive particles, and the adhesive is hardened by heating to fix the driving circuit to the liquid crystal panel or the printed circuit board.

When the driving circuit is mounted on the liquid crystal panel by the TAB method, the ACF is attached to the portion of the substrate of the liquid crystal panel where the wiring pattern is provided, and the TCP (Tape Carrier Package) TAB as the driving circuit is mounted on the substrate. Since ACF is an adhesive substance, it is laminated on a paper tape through a peeling layer, thereby constituting an ACF tape. That is, in a state where the ACF tape is pressed against the substrate, only the tape is peeled off, that is, the ACF is attached to the substrate.

However, when the paper tape is peeled off by the ACF tape in a state where the ACF is not attached to the substrate, the ACF may be peeled off by the paper tape and peeled off from the substrate. ACF is laminated on the release layer of the paper tape, and has a certain adhesive force between the paper tape and the ACF. When the paper tape is peeled off, the ACF is peeled off by the force of the substrate together with the paper tape. . In addition, even in the case where the ACF is not completely peeled off, a part of the ACF may be floated or rolled up, causing a poor attachment of the entire ACF. That is, when the ACF tape is heated/crimped on the substrate, it is necessary that the ACF is completely transferred to the substrate side, and it is only separated and the paper tape is peeled off.

A technique for cooling the interface between the ACF and the substrate in order to increase the adhesion strength between the ACF and the substrate is disclosed in Patent Document 1. In Patent Document 1, after the heating ACF is transferred to the substrate side, the ACF is cooled and the ACF is attached to the substrate. After the ACF is heated and not sufficiently cooled, the ACF is peeled off from the substrate when the ACF is peeled off for a short period of time. Therefore, the interface between the ACF and the substrate is forcibly cooled by the thermocompression bonding of the ACF to improve the bonding strength.

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-242446

However, in Patent Document 1, in order to attach the ACF to the substrate, two processes of heating engineering and cooling engineering are performed. That is, since two projects are required, the attachment work of the ACF is complicated, and the processing cannot be speeded up. In addition, in order to carry out separate projects, individual independent configurations are required, and thus the problem of complexity or high cost of the mechanism is also attracted.

Here, as the ACF, it is generally suitable to use a hot-melt adhesive resin. The hot-melt adhesive resin maintains a high-viscosity state (solid or near-semi-solid state) at a normal temperature, and is melted by heating the adhesive resin, and is wetted to the attached body. The adhesive resin which is melted and wetted and spread has adhesiveness, and the bonding force is exerted by the adhesive force between the objects. That is, the hot-melt adhesive resin exerts a bonding force at the time of heating and melting.

In other words, when the adhesive resin of ACF is heated to a certain temperature, a certain adhesive force is exerted to cause an adhesive force between the ACF and the substrate, so that the adhesion of the adhesive resin during melting can be achieved. The force is stronger than when the tape is peeled off, so that the ACF can be transferred to the substrate side when the tape is peeled off. In summary, the ACF can be attached to the substrate without the need for special cooling engineering.

Here, an object of the present invention is to avoid complication and cost of an engineering or a mechanism, and to reliably attach the ACF to the substrate when the paper tape is peeled off.

An ACF attaching device according to the first aspect of the present invention has a pressurizing means for pressurizing an ACF tape holding a layer of ACF through a peeling layer of a paper sheet against a surface of the substrate to abut the substrate The substrate receiving means for supporting the substrate in a horizontal state and the receiving side heating means for heating the substrate receiving means so as to have a higher temperature than the pressing means and a temperature at which the ACF is not thermally cured.

When the ACF is attached to the substrate, the ACF is heated and pressure-bonded in order to heat the ACF to melt or at least soften it to improve the adhesion to the substrate. Since the ACF is laminated on the release layer of the paper tape, the adhesion between the ACF and the paper tape is weakened. When the ACF is heated and crimped, the ACF can be attached to the substrate and the paper tape can be peeled off. However, in order to more reliably achieve the adhesion of the ACF to the substrate and the peeling of the paper strip, the ACF attaching device of the first application of the patent scope is provided with a receiving side that heats the substrate receiving means at a higher temperature than the pressing means. Heating means. Thereby, the temperature of the surface of the substrate (the receiving side abutting surface) which is in contact with the substrate is higher than the surface of the ACF which is laminated on the paper tape (the pressure side abutting surface: the surface on the side pressurized by the pressurizing means) The temperature is even higher, allowing it to have a temperature gradient. By this temperature gradient, the bonding force of the abutting surface of the ACF can be made higher than the bonding force of the pressing side abutting surface. Further, since the pressing side contact surface of the ACF is laminated on the peeling layer of the paper tape, it is easy to peel off, and the ACF can be more reliably transferred to the substrate. Then, special processing such as cooling treatment is not required, and complication and cost increase of the engineering or the mechanism can be avoided.

It is necessary to set the temperature of the side heating means to a temperature at which the ACF is not thermally hardened. The attachment phase of ACF is performed before the connection phase of the driving circuit. At this stage, if the bonding resin of ACF is thermally hardened, the conductive particles dispersed therein are covered by the heat-hardened bonding tree fingers, possibly for the substrate and the driving. The conductive connections between the circuits no longer contribute. However, if the temperature at which the ACF is not thermally cured, for example, when the substrate is heated for a short period of time, the temperature of the receiving side heating means may be heated to a temperature at which the ACF is not thermally cured or a temperature in the vicinity thereof.

The ACF attaching device according to the second aspect of the invention is the ACF attaching device according to the first aspect of the patent application, wherein the pressurizing means is heated to a temperature higher than a normal temperature, and the pressurizing means is heated. Pressure side heating means.

According to the ACF attaching device of the second application of the patent application, the pressurizing means is heated by the pressurizing side heating means, and the temperature of the pressurizing means is also increased. When the pressurizing means is in a low temperature state, the heat of the ACF is absorbed by the pressurizing means side to lower the temperature of the ACF. Further, in order to speed up the process, it is necessary to rapidly bring the ACF into a molten state. Therefore, by heating the pressurizing means, the ACF can be quickly brought into a molten state. However, since there is a temperature gradient between the pressing side abutting surface of the ACF and the receiving side abutting surface, the pressurizing side heating means is heated at a temperature which is not so high (a temperature which is higher than a normal temperature) .

An ACF attaching device according to claim 3 of the present invention is the ACF attaching device of claim 1, characterized in that a plurality of electrode groups are formed on the substrate, and a supply reel for supplying the ACF tape is provided, and a half-cutting means for cutting the ACF held by the ACF tape fed from the supply reel into a length of attachment to each electrode group of the substrate; at least having a length of attachment to the ACF of each electrode group In the above configuration, the pressurizing means is configured to individually attach the ACF to each electrode group of the substrate.

As a method of attaching the ACF to the substrate, the ACF attached to the entire length of one side of the substrate is attached to the main body as a main stream, and is divided into each electrode as in the ACF attaching device of the third application of the patent application. It is also possible to perform a split attachment of the ACF individually. The electrodes of the fine pitch formed on the substrate are formed as a group of electrodes in a specific number of electrodes per drive circuit, and each electrode group is formed with a blank region between the adjacent electrode groups. It is not necessary to attach the ACF to the blank area, so by using the split attachment without attaching the ACF in an unnecessary blank area, by preventing the waste of materials, or by forming the adhesive resin and conductive particles constituting the ACF in the blank area. Exposed, it is possible to avoid a problem in the processing or processing after the driving circuit is mounted.

In the case of dividing and attaching, the paper tape is moved so as to be moved, and the paper tape is peeled off by cutting the ACF. Therefore, when the paper tape is peeled off, the effect of the force in which the ACF is peeled off from the substrate becomes large. Therefore, by heating the substrate by the receiving side heating means, the bonding force of the abutting side abutting surface of the ACF is increased, and the paper tape can be peeled off while the ACF is surely attached to the substrate.

The ACF attaching device according to the fourth aspect of the present invention is the ACF attaching device according to claim 3, characterized in that the aforementioned ACF attaching portion having at least the ACF of each electrode group is configured. The substrate receiving means is provided so as to face the pressing means, and the receiving side lifting and lowering driving means for driving the substrate receiving means is provided so as to independently move up and down in a direction in which the pressing means approaches and separate from the pressing means.

According to the ACF attaching device of the fourth aspect of the patent application, the length of the substrate receiving means is one ACF attached to the length of the length, and the substrate receiving means is moved up and down. That is, the ACF is pressure-bonded by the lifting action of both the substrate receiving means and the pressing means, so that a uniform pressure can be applied across almost the whole. Thereby, the effect of avoiding the attachment failure can be exerted.

The ACF attaching device according to the fifth aspect of the present invention is characterized in that the substrate receiving means is configured to have a state of being fixed to the entire length of the substrate.

According to the ACF attaching device of the fifth aspect of the patent application, the length of the substrate receiving means is the length of the entire length of the substrate, and the substrate receiving means is in a fixed state. Therefore, the lifter only has a pressurizing means, and the substrate receiving means can always be in a state of abutting against the substrate. That is, when the substrate is heated by pressure bonding, the temperature of the abutting surface of the ACF can be quickly brought to a high temperature. Thereby, the efficiency of the processing can be improved. Further, since the substrate and the substrate receiving means are always in contact with each other, the temperature distribution of the substrate can be made uniform. That is, stable temperature management can be performed.

The apparatus for manufacturing a flat panel display according to claim 6 of the present invention has the ACF attaching apparatus according to any one of claims 1 to 5. Further, the flat panel display of claim 7 of the present invention is manufactured by the manufacturing apparatus of the flat panel display of claim 6 of the patent application. The ACF attaching device can be applied to a manufacturing device of a flat panel display, and the flat panel display can be applied to a liquid crystal display or a plasma display, an organic EL display, or the like.

In the present invention, the substrate is heated by providing the receiving side heating means, and the bonding force between the substrate and the ACF is improved by heating the receiving side abutting surface of the ACF that abuts against the substrate. Thereby, the cooling process or the cooling mechanism can be eliminated, and the ACF is surely attached to the substrate when the tape is peeled off.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a liquid crystal panel is displayed as an example of a substrate to which an ACF is attached, and a driving circuit including a TCP mounted on a substrate by a TAB is shown as an example of a semiconductor circuit device mounted on the ACF. Further, the substrate may be not only a liquid crystal panel but also a substrate for other displays or other various printed circuit boards, and the substrate to be mounted on the substrate is not limited to a driving circuit, and may be electrically connected to the ACF.

In Fig. 1, a liquid crystal panel 1 is composed of a lower substrate 2 made of a thin glass plate and an upper substrate 3, and a liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 has only a specific wide portion projected from the upper substrate 3 on at least two sides thereof, and the extension portion 2a is mounted with a plurality of driving circuits 4 on which the integrated circuit elements 4b are mounted on the film substrate 4a.

The protruding portion 2a of the lower substrate 2 is provided with a specific number of electrodes connected to the wirings respectively connected to the TFTs (thin film transistors) formed at the portions where the two substrates 2 and 3 are overlapped, and these electrodes are as shown in the figure. As indicated by reference numeral 5, a specific number of electrodes are formed in a group on each of the mounting portions of the drive circuit 4. Next, alignment marks 6a and 6a are formed on the left and right sides of each electrode group 5. That is, a gap area having a specific width is formed between the adjacent electrode groups 5, 5. On the other hand, the drive circuit 4 is provided with a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5, and the electrode group connected to the electrode group 5 is indicated by reference numeral 7. Further, the drive circuit 4 is also formed with alignment marks 6b and 6b on the left and right sides of the electrode group 7, and when the drive circuit 4 is mounted on the liquid crystal panel 1, the electrodes of the electrode group 7 are formed based on these alignment marks. The positions of the electrodes constituting the electrode group 5 are adjusted to match each other.

The drive circuit 4 is mounted on the liquid crystal panel 1 through the ACF 8. As is well known, the ACF 8 is formed by dispersing a plurality of minute conductive particles in an adhesive resin having a bonding function, and heating and pressurizing the ACF 8 between the driving circuit 4 and the liquid crystal panel 1 to form an electrode group through the conductive particles. Each of the electrodes of 5 and each of the electrodes constituting the electrode group 7 is electrically connected to each other, and is thermally cured by an adhesive resin to fix the drive circuit 4 to the liquid crystal panel 1. Here, the ACF 8 is divided at each position of the electrode group 5 provided in the overhang portion 2a of the lower substrate 2, and is attached at L portions per length. Thereby, the ACF 8 can be used without waste, and the attached ACF is almost completely covered by the drive circuit 4.

2 to 4 show a schematic configuration of an attaching mechanism for attaching the ACF 8 to the overhanging portion 2a of the lower substrate 2. In these figures, the 9 series holds the liquid crystal panel 1 in a horizontal support base. The liquid crystal panel 1 is stably held on the support base 9 by, for example, a vacuum suction means. Here, the liquid crystal panel 1 on the support base 9 abuts on a wide area, and the lower position of the extension portion 2a of the lower substrate 2 to which the ACF 8 is attached is open. Here, the support base 9 can be provided with position adjustment means in the X, Y, and θ directions for use in alignment with the position of the drive circuit 4.

Further, the 10-series ACF 8 is attached to the liquid crystal panel 1, and the attaching unit 10 is composed of a plate body provided in the vertical direction, and the supply reel 11 is detachably attached. The ACF 8 is laminated on the peeling layer of the paper tape 12 to constitute an ACF tape 13, which is wound around the supply reel 11. The ACF tape 13 is guided and advanced along the traveling path formed by the rollers 14 to 17 attached to the attaching unit 10. Further, the 18-series driving roller holds the paper tape 12 after the ACF 8 is attached to the liquid crystal panel 1, and is driven to be fed to the discharge portion 19.

The rollers 14, 15 are guide rollers for feeding the ACF tape 13, and the guide roller 15 is attached to the swing arm 20, and the rocking wall 20 is swung around the rotary shaft 21. When the rotating shaft 21 is connected to a driving means (not shown) such as a motor and the swing arm 20 is swung in the direction of the arrow F, at least the sub-attachment portion is fed from the supply reel 11, that is, the length L shown in FIG. The ACF tape 13 is fed out and supplied between the rolls 14, 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not change as the winding amount of the supply reel 11 is different.

As shown in FIGS. 5 and 6, the rollers 16 and 17 are horizontal guide rollers for guiding the length of the ACF tape 13 to the horizontal direction of the liquid crystal panel 1 by the ACF tape 13 in the horizontal direction. . The horizontal guide roller 17 defines the attachment start position of the ACF 8, and the horizontal guide roller 16 defines the attachment end position of the ACF 8, by which the attachment area of the ACF 8 is set. As shown in Fig. 6, the horizontal guide rollers 16, 17 are formed on the both side portions of the cylindrical portions 16a, 17a to form the crotch portions 16b, 17b, and the crotch portions 16b, 17b are protruded from the cylindrical portions 16a, 17a. The height of the paper strip 12 of the ACF tape 13 is almost the same, or is only slightly larger than it.

That is, the ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16, 17, and thereafter separated by the paper tape 12. Next, at a position further downstream than the horizontal guide rail 17, the paper tape 12 from which the ACF 8 is peeled off is recovered. The driving roller 18 is provided at a position further downstream than the attachment region of the ACF 8 partitioned by the horizontal driving rollers 16, 17. The driving roller 18 is composed of a driving roller 18a and a spacer roller 18b, and the paper tape 12 is held between the driving roller 18a and the spacing roller 18b. By rotationally driving the driving roller 18a, the ACF tape 12 is intermittently fed in portions by the length L.

As can be seen from FIG. 3, the attaching unit 10 is attached to the elevation drive unit 22, and the elevation drive unit 22 is attached to the front and rear drive unit 23, and the front and rear drive unit 23 is attached to the parallel movement drive unit 24 constituting the conveyance means. With these mechanisms, the attachment region of the ACF 8 defined by the horizontal guide rollers 16 to 17 (see FIG. 2) of the winding path of the ACF tape 13 can be in the up and down direction, that is, the Z axis direction. The horizontal plane can be moved in the X-axis direction (the direction orthogonal to the arrangement of the electrode group 5) and the Y-axis direction (the arrangement direction of the electrode group 5). On the other hand, the liquid crystal panel 1 is fixedly held on the support base 9 by vacuum suction.

Here, it is necessary to adjust the relative positions of the ACF tape 13 between the horizontal guide rollers 36 to 17 and the electrode group 5 of the lower substrate 2, but the driving portion 23 is moved back and forth to move the liquid crystal panel 1 close to / In the direction away from the direction, the parallel movement drive unit 24 moves in the direction parallel to the arrangement direction of the electrode group 5 of the liquid crystal panel 1, that is, the attachment area is moved in the Y-axis direction, so that the attachment unit 10 can be attached. The position adjustment can be performed on the side. However, as described above, when the support base 9 is provided with the position adjustment means in the X, Y, and θ directions, the ACF tape 13 can be aligned on the support base 9 side.

The elevation drive unit 22 has an inclined block 30 and a cylinder 31 for moving the inclined block 30 in the front-rear direction. Further, the attaching unit 10 is coupled to the sliding member 32 that is engaged with the inclined surface of the inclined block 30. The sliding member 32 has an inclined surface that coincides with the inclined block 30, and the restricting lever 33 is not able to be separated from the vertical direction. The composition of the displacement. That is, by driving the cylinder 31, the attaching unit 10 can be displaced in the up and down direction. Here, a motor may be used instead of the cylinder 31.

Next, the front and rear moving drive unit 23 is used to move the pedestal 34 to which the tilt block 30 is attached to the front and rear. The reciprocating movement of the pedestal is performed by a driving means 35 composed of a cylinder, a motor, or the like. Next, the horizontal movement drive unit 24 includes a pedestal 34 and a transfer table 36 to which the drive means 35 is attached, and the transfer table 36 can drive the ball screw 37 constituting the ball screw feeding means by the motor 38, so that the attaching unit 10 can It moves in the direction parallel to the arrangement direction of the electrode group 5 of the liquid crystal panel 1.

As shown in FIG. 8, the traveling path of the ACF tape 12 attached to the attaching unit 10 is provided with a half-cutting means 40 at a position slightly downstream of the position of the horizontal guide roller 16, and the half-cutting means 40 is attached. The surface of the attachment unit 10 can be mounted reciprocally in the front-rear direction. As shown in Fig. 7, the half-cutting means 40 is provided with a cutting edge 41 and a cutting edge receiving member 42, and the cutting edge 41 is rotatable about the shaft 43 in a direction approaching/away from the cutting edge receiving 42 as indicated by the arrow in the figure. Then, the state of leaving the cutting edge receiving 42 is always maintained by the elastic force of the spring 44 acting on the cutting edge 41, and the cutting blade 41 is pressed against the direction of the spring 44 by the pressing roller 46 provided in the cylinder 45. The swing is displaced in a direction close to the cutting edge receiving 42. Next, the cutting edge 41 is at the position closest to the cutting edge receiving portion 42, and is formed to be the same as or slightly shorter than the thickness of the paper tape 12 of the ACF tape 13. Thereby, only the ACF 8 is half cut.

Further, in order to attach the ACF 8 to the overhang portion 2a of the lower substrate 2, the ACF tape 13 is pressed against the surface of the lower substrate 2 by a specific pressure at a position between the horizontal guide rolls 16, 17. Therefore, in the attaching unit 10, as shown in FIGS. 8 and 9, a press fitting 50 is provided. Here, the liquid crystal panel 1 is placed on the support base 9, but the projecting portion 2a of the lower substrate 2 is extended by the support base 9, and the crimping joint 50 is configured to hold the projecting portion up and down.

The press fitting 50 is composed of a pressurizing blade 51 as a pressurizing means and a receiving blade 52 as a substrate receiving means, and the pressurizing blade 51 and the receiving blade 52 are attached to the elevating blocks 53, 54 respectively. And 54 are attached to the pair of guide rails 55 provided in the attaching unit 10 so as to be displaceable in the vertical direction. The pressure blade 51 and the receiving blade 52 are disposed on the vertical direction with the liquid crystal panel 1 interposed therebetween, and are formed to have the same length. The pressing blade 51 is further guided between the horizontal guide rails 16 and 17 and disposed at a position above the ACF belt 13 that moves in the horizontal direction. Further, the elevating blocks 53 and 54 are configured to elevate and move the common guide rails 55, but independent guide rails corresponding to the respective elevating blocks 53 and 54 may be provided.

The lifting block 54 of the receiving blade 52 is mounted, and the cylinder 56 performs a lifting operation of a specific stroke length. In other words, when the cylinder 56 is in the reduced state, the receiving blade 52 is lowered and placed below the liquid crystal panel 1 to extend the cylinder 45, and the receiving blade 52 abuts against the lower surface of the liquid crystal panel 1. On the other hand, in the lift block 53 to which the pressurizing blade 51 is attached, the pressurizing means 57 is connected. The pressing means 57 shown has a feed screw 57a driven by a motor to constitute a so-called jack. In the pressurizing means 57, the elevating block 53 connected to the pressurizing blade 51 is moved up and down along the guide rail 55, and the liquid crystal panel 1 received by the receiving blade 52 is biased by a specific pressing force from above. Next, the pressing blade 51 and the receiving blade 52 are configured to accurately maintain the parallelism. Further, the cylinder 56 that supports the receiving blade 52 is unnecessarily moved at least at the position of the rising stroke end without being applied by the pressing force applied by the pressing means 57, and is introduced into a pressure capable of maintaining the extended state.

Both the pressurizing blade 51 and the receiving blade 52 constituting the press fitting 50 include a pressurizing side heater 51H as a pressurizing side heating means and a receiving side heater 52H which is a receiving side heating means. The heating blade 51 is heated by the heat of the pressurizing side heater 51H, and the receiving blade 52 is heated by the heat of the side heater 52H. The heating temperature of the receiving side heater 52H is set to be higher than the heating temperature of the pressing side heater 51. Therefore, the receiving blade 52 is in a state of being higher than the pressure blade 51. The pressure side heater 51H and the receiving side heater 52H are heat sources, and for example, electric power from a power supply source (not shown) is converted into heat energy to generate heat.

That is, the ACF tape 13 is thermocompression-bonded to the liquid crystal panel 1 by the heated pressing blade 51 and the receiving blade 52 from the vertical direction. The temperature at which the side heater 52H is heated is set to a temperature at which the ACF 8 is not thermally hardened. That is, the temperature at which the adhesive resin of the ACF 8 is melted to exert the adhesive force (for example, before and after 140 ° C) is set so as not to be set to a relatively high temperature. On the other hand, the temperature at which the pressure side heater 51H is heated is lower than the temperature at which the receiving side heater 52H is heated, and is set to a temperature (for example, around 50 ° C) that does not lower the temperature of the heated ACF 8 . Next, the pressing blade 51 and the receiving blade 52 constituting the press fitting 50 have a wide width which can sufficiently correspond to the width of the ACF tape 13, and have a bonding length L of at least ACF 8 in the longitudinal direction.

As described above, in the attaching unit 10, the supply reel 11, the traveling path of the ACF tape 13 supplied from the supply reel 11, the half-cutting means 40, and the crimping joint 50 are attached. By the ACF attaching device, the ACF 8 necessary for the TAB mounting of the driving circuit 4 is attached to the protruding portion 2a of the substrate 2 below the liquid crystal panel 1 to which a specific number of electrode groups 5 are formed.

Therefore, the liquid crystal panel 1 to which the ACF 8 is attached on the support substrate 9 is placed in a horizontal position and is adsorbed and held. In this state, on the lower substrate 2 of the liquid crystal panel 1, the projecting portion 2a shown in Fig. 4 is protruded from the support base 9, and the extension portion 2a is mounted with a specific number of drive circuits 4. Therefore, the attaching unit 10 to which the attaching mechanism is attached by the ball screw 7 is intermittently fed in the direction of the arrow every other distance P as shown in FIG.

The liquid crystal panel 1 is sequentially attached with a length L of the ACF 8, so that the transfer table 36 constituting the parallel movement drive unit 24 is driven, and the attaching unit 10 is displaced to a specific attachment area. At this time, as shown by the arrows in FIGS. 8 and 9, the attaching and lowering unit 10 holds the attaching unit 10 at the raised position. The pressing blade 51 constituting the press fitting 50 is held at the raised position, and the receiving blade 52 is held at the lowered position. Thereby, the pressing blade 51 and the receiving blade 52 are kept in a non-contact state with the liquid crystal panel 1, and the movement of the attaching unit 10 is smoothly performed, and the liquid crystal panel 1 is not damaged. Further, the ACF tape 13 is separated from the liquid crystal panel 1, and even if the half-cutting means 40 is protruded forward from the surface of the attaching unit 10, it does not interfere with the liquid crystal panel 1. That is, the half cut of the ACF tape 13 is performed. By performing this half-cutting, the half-cut position of the ACF tape 13 becomes the attachment end position, and the end portion of the previous ACF 8 is attached to the start position. That is, the horizontal guide roller 17 is disposed at the attachment start position, and the horizontal guide roller 16 is disposed at the attachment end position.

Thereafter, after the half-cutting means 40 is avoided, as shown by the arrows in FIGS. 10 and 11, the attaching and lowering unit 10 is lowered by the elevation driving unit 22 to cause the horizontal guide rails 16 and 17 among the ACF tapes 13. The portion is disposed at a position close to the surface of the substrate 2 below the liquid crystal panel 1. Thereafter, the cylinder 56 is made to have a hole, and the lifting block 54 is raised. As shown in Figs. 12 and 13, the receiving blade 52 is brought into contact with the inner surface of the liquid crystal panel 1. When the receiving blade 52 is brought into contact with the inner surface of the liquid crystal panel 1, the receiving blade 52 is heated by the receiving side heater 52H. Therefore, when the receiving blade 52 abuts against the lower substrate 2, it is composed of a thin glass plate. The lower substrate 2 is heated to a high temperature state.

Here, the receiving blade 52 does not correspond to the entire length of the liquid crystal panel 1, and the operation of the ACF 8 is limited to the position corresponding to the attached region. Next, as shown by the arrows in Figs. 14 and 15, the pressing means 57 is operated to lower the pressing blade 51, and the ACF 8 is pressure-bonded to the lower substrate 2 by pressing the paper tape 12 of the ACF tape 13.

When the pressure blade 51 presses the ACF tape 13, the pressure blade 51 and the ACF tape 13 are in contact with each other. However, the pressure blade 51 is heated by the pressure side heater 51H to be heated to some extent, so the heat is also It is conveyed to the peeling layer of the paper tape 12. As the type of the paper tape 12 is different, the ACF 8 is easily peeled off by the peeling layer of the paper tape 12 by supplying heat to the peeling layer. Therefore, heat is supplied to the peeling layer of the paper tape 12, and the adhesion between the ACF 8 and the paper tape 12 is weakened to a state where it can be easily peeled off.

Next, in this state, the ACF tape 13 is pressed against the lower substrate 2 by the pressing blade 51. The lower substrate 2 is heated to a high temperature by the heating of the receiving side heater 52H, so that heat is transmitted to the ACF 8 and starts to be melted. At this time, since the ACF 8 has a specific thickness of a very thin film, the abutting surface of the ACF 8 (the abutting surface of the ACF 8 and the lower substrate 2) is slowly melted, and the abutting side of the receiving side is compared. The high temperature and the side of the pressure side abutting surface (the surface of the ACF 8 laminated on the paper tape 12) are relatively low temperature gradients. When the surface is gradually melted, the viscosity of the adhesive resin is lowered, and the wetness spreads on the lower substrate while exerting the adhesive force. As a result, an adhesive force acts between the ACF 8 and the lower substrate 2, and the two are in an intimate state.

On the other hand, since the pressurizing blade 51 is also heated by the pressurizing side heater 51H, heat is also transmitted to the pressurizing side abutting surface of the ACF 8. However, since the pressure side heater 51H is heated at a temperature that does not lower the temperature of the ACF 8, the heat is transmitted to the pressure side abutting surface of the ACF 8, and the surface is not melted. . That is, the adhesion between the ACF 8 and the paper tape 12 is small. Conversely, peeling is facilitated by heating the release layer.

In order to apply a specific pressing force to the liquid crystal panel 1 by the pressing blade 51, the feeding screw 57a constituting the pressing means 57 is driven. Here, the lower substrate 2 of the liquid crystal panel 1 is composed of a thin glass plate, which is allowed to be deformed to some extent, and is held between the pressing blade 51 and the receiving blade 52 which are the same length and which are correctly maintained in parallel. . That is, at the time of holding, the portion to be held in the liquid crystal panel 1 serves as a press fitting 50 which is formed by the pressing blade 51 and the receiving blade 52. Then, the pressing blade 51 or the receiving blade 52 is also substantially limited to the portion from the attachment start position to the end position of the ACF tape 13, so that the abutting portion of the ACF tape 13 to the pressing blade 51 becomes Equally applied pressure is applied, and the position of the half-cut attachment end existing from the ACF 8 does not apply pressure to the base end side.

When the ACF 8 is crimped to the lower substrate 2, the pressing force of the ACF tape 13 according to the press fitting 50 is released. Next, the cylinder 56 is driven to displace the receiving blade 52 to the lowered position. After that, the elevation drive unit 22 is raised. However, as shown by the arrow in FIG. 16, the drive unit 23 is driven to move forward and backward together with the elevation drive unit 22, so that the width direction of the ACF tape 12 is pulled up obliquely upward. When the mode is actuated, the tape 12 is peeled off by the ACF 8 slip.

When the ACF 8 is attached and detached, the ACF 8 is peeled off, so that the paper strip 12 is pulled and the ACF 8 greatly acts on the lower substrate 2 (the force which is pulled obliquely upward together with the paper tape 12) ). However, in the state of the ACF 8 at this time, the receiving side abutting surface is in close contact with the lower substrate 2 by the adhesive force, and the pressing side abutting surface is in a state of being easily peeled off by the paper tape 12, so that the ACF 8 is reliably attached thereto. The state of the lower substrate 2.

Thereby, the attachment of the ACF 8 to one electrode group 5 of the projecting portion 2a of the lower substrate 2 is completed. The attaching unit 10 is held at the position where it is raised, the driving roller 18 is operated, and the ACF tape 13 is pulled out by the supply reel 11 to feed only one pitch amount. Next, the parallel movement drive unit 24 is operated to move the attachment unit 10 by the amount of one pitch, and as shown in Fig. 1, the movement amount is only shown by the interval P. Next, the substrate supporting table 9 of the liquid crystal panel 1 is kept not moved. In this state, the same operation as described above is repeated, and the electrode group 5 is attached to the ACF 8 in order.

Here, the pressing blade 51 and the receiving blade 52 are driven up and down by the lifting blocks 53, 54 respectively. That is, the lifting blocks 53, 54 are moved up and down along the guide rails 55 provided on the attaching unit 10, and the pressing blade 51 and the receiving blade 52 always hold the lower substrate 2 up and down in a state where the parallelism is correctly maintained. When the liquid crystal panel 1 forms the electrode group 5 at n locations, the distance (n‧ P) from the attachment position of the first ACF 8 to the final attachment position of the ACF 8 is also isolated, all of which are almost Crimp ACF 8 under the same conditions. That is, regardless of the small size or the large liquid crystal panel 1, the ACF 8 can be attached to all the electrode groups 5 by the equal pressing force without causing a pressure failure. Further, it is necessary to guide the two lift blocks 53, 54 to the same guide rail 55 without sharing the guide rail 55.

On the other hand, as shown in Fig. 17, the receiving blade 152 is attached to the support table 9, and the receiving blade 152 is placed at the same height as the support table 9 so as to have the length of the entire length of the lower substrate 2. The way of doing this is also possible. Next, the receiving side heater 152H is provided so as to be the entire length of the receiving blade 152. In this case, when the liquid crystal panel 1 is placed on the support table 9, it is always heated, and only the pressure blade 51 is lifted and lowered. By configuring the receiving blade 152 in such a manner, it is possible to achieve stable temperature management and rapid processing.

In short, since the receiving blade 152 is fixed, it can be brought into a state in which the lower substrate is always brought into contact with the receiving blade 152. Since the receiving blade 152 is heated by the receiving side heater 152H, the lower substrate 2 that always abuts against the receiving blade 152 is always heated. Further, since the receiving blade 152 has the length of the entire length of the lower substrate 2, the portion of the lower substrate 2 on which the electrode group 5 is formed can be heated with a uniform temperature distribution over the entire length. Therefore, stable temperature management is possible. Further, since the lower substrate 2 is always heated, the time for heating the lower substrate 2 is not required. Therefore, the attachment of the ACF 8 can be performed quickly, which contributes to the rapid processing. In other words, the receiving blade 152 is set to perform the lifting operation, or the setting is set to be fixed, and can be arbitrarily selected depending on the purpose.

Further, in the above description, the mechanism for dividing and attaching the ACF will be described, but the present invention can also be applied to a mechanism for collectively attaching. In the case of split attachment, the size of the ACF is the length of the attachment of each electrode group, and in the case of the attachment, the length of the entire length of the lower substrate. Even if the attachment is integrally attached, the ACF must be peeled off from the paper tape, so that the force of peeling off the lower substrate acts on the ACF when the paper tape is peeled off. In other words, when the lower substrate is heated by the contact-side heater and the adhesive force is applied between the lower substrate and the ACF to make the two adhere to each other, even if they are attached together, they can be made The ACF is peeled off in a state where it is attached to the lower substrate.

1. . . Crystal panel

2. . . Lower substrate

2a. . . Extension

3. . . Upper substrate

4. . . Drive circuit

5. . . Electrode group

8. . . ACF

9. . . Support abutment

11. . . Supply reel

12. . . Paper tape

13. . . ACF belt

16,17. . . Horizontal guide roller

twenty two. . . Lifting drive

twenty three. . . Front and rear mobile drive

twenty four. . . Parallel moving drive

36. . . Transfer station

40. . . Cutting unit

41. . . Cutting edge

50. . . Pressure connector

151. . . Pressurized blade

152. . . Receiving blade

53,54. . . Lifting block

55. . . Guide rail

56. . . cylinder

57. . . Pressurization

Fig. 1 is a plan view showing an important part of a liquid crystal cell as a substrate to which an ACF is attached, and a drive circuit mounted on the substrate.

Fig. 2 is a front view showing the schematic configuration of an ACF attaching machine.

Figure 3 is a left side view of Figure 2.

Figure 4 is a plan view of Figure 2.

Fig. 5 is an explanatory view showing the configuration of a horizontal feed roller.

Fig. 6 is a side view showing the configuration of a horizontal feed roller.

Fig. 7 is an explanatory view showing the configuration of the cutting unit.

Fig. 8 is an enlarged front elevational view showing an important part of the ACF attaching machine in the half-cut state of the ACF tape.

Figure 9 is a left side view of Figure 8.

Fig. 10 is an enlarged front elevational view showing an important part of the ACF attaching machine in a lowered state of the attaching unit.

Figure 11 is a left side view of Figure 10.

Fig. 12 is an enlarged front elevational view showing an important part of the ACF tape attaching machine in which the receiving blade is raised.

Figure 13 is a left side view of Figure 12.

Fig. 14 is an enlarged front elevational view showing an important part of the ACF attaching machine showing the crimped state of the ACF tape.

Figure 15 is a left side view of Figure 14.

Fig. 16 is an explanatory view showing a state in which a paper tape of the ACF tape is peeled off.

Fig. 17 is an explanatory view showing another example of the receiving blade.

1. . . LCD panel

12. . . Paper tape

53. . . Lifting block

55. . . Guide rail

57a. . . Feed screw

57. . . Pressurization

51. . . Pressurized blade

55. . . Guide rail

51H. . . Pressurized side heater

40. . . Half cutting

13. . . ACF belt

16. . . Roll

50. . . Pressure connector

52H. . . Receiving side heater

10. . . Attachment unit

8. . . ACF

56. . . cylinder

54. . . Lifting block

52. . . Receiving blade

17. . . Horizontal guide roller

3. . . Upper substrate

2. . . Lower substrate

Claims (6)

An anisotropic conductive film (ACF) attaching device, comprising: a pressurizing means for pressurizing an ACF tape for holding a layer of ACF through a peeling layer of a paper sheet on a surface of the substrate, and pressing the surface of the substrate; The substrate receiving means for supporting the substrate in a horizontal contact state and the receiving side heating means for heating the substrate receiving means so as to have a higher temperature than the pressing means and a temperature at which the ACF is not thermally cured. The ACF attaching apparatus according to claim 1, wherein the pressurizing side heating means for heating the pressurizing means is performed such that the pressurizing means is at a temperature higher than a normal temperature. An ACF attaching device according to claim 1, wherein a plurality of electrode groups are formed on the substrate, a supply reel for supplying the ACF tape, and an ACF held by the ACF tape fed from the supply reel are cut into a half-cutting means for attaching a length of each of the electrode groups of the substrate; the pressing means is configured to have at least a length of attachment of the ACF to each of the electrode groups, and the respective electrode groups of the substrate are individually Attach ACF. For example, the ACF attachment device of claim 3, wherein The substrate receiving means is configured to have at least a part of the attachment length of the ACF of each of the electrode groups, and is opposed to the pressing means, and is close to the pressing means. The receiving side lifting and lowering driving means for driving the substrate receiving means is provided in a manner of independently moving up and down in the direction of separation. The ACF attaching device according to claim 3, wherein the substrate receiving means is configured to have a state of being fixed to the entire length of the substrate. A manufacturing apparatus for a flat panel display, comprising: an ACF attaching device according to any one of claims 1 to 5.