CN101373284A - ACF paste device, manufacturing device of flat panel display and flat panel display - Google Patents
ACF paste device, manufacturing device of flat panel display and flat panel display Download PDFInfo
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- CN101373284A CN101373284A CNA2008102142317A CN200810214231A CN101373284A CN 101373284 A CN101373284 A CN 101373284A CN A2008102142317 A CNA2008102142317 A CN A2008102142317A CN 200810214231 A CN200810214231 A CN 200810214231A CN 101373284 A CN101373284 A CN 101373284A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- Nonlinear Science (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Crystallography & Structural Chemistry (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The purpose of the invention includes avoiding complication of process, mechanism, and high cost, and adhering ACF to a substrate when peeling off a paper tape. The ACF adhering device of the invention has a pressure blade (51), a support blade (52), and a support side heater (52H). The pressure blade (51) performs lifting action and exerts pressure onto the substrate so as to press and connect a ACF tape (13) holding an ACF (8) via the peel-off layer of a paper tape (12) onto the surface of a lower surface (2). The support blade (52) is connected with the back of the lower substrate (2), so that the lower substrate (2) is supported horizontally. The support side heater (52H) heats the support blade (52) with a temperature higher than that of the pressure blade (51) not to make thermo-hardening of the ACF (8); therefore, temperature gradient is present between the connection face of the ACF support side and the pressured side connection face, and the ACF can be adhered to the lower substrate (2) so as to peel off the paper tape (12).
Description
Technical field
The present invention relates to for the semiconductor circuit components of driving circuit etc. is carried on the substrate and with ACF (Anisotropic Conductive Film) paste ACF sticker on this substrate, comprise this ACF sticker flat-panel monitor manufacturing installation and with the flat-panel monitor of the manufacturing installation manufacturing of this flat-panel monitor.
Background technology
LCD is a kind of of flat-panel monitor.LCD is liquid crystal is enclosed between the liquid crystal panel that is made of 2 transparency carriers up and down and to be formed.On liquid crystal panel, connecting tellite by driving circuit, the electrode of the inboard of driving circuit is connected with liquid crystal panel, and the electrode in the outside is connected with tellite.The mounting means of driving circuit, representational have TAB (Tape Automated Bonding) mode and COG (Chip on Glass) mode, which kind of mode no matter, all be to form Wiring pattern at least 2 limits on liquid crystal panel surface, the electrode in this Wiring pattern and the electrode of driving circuit are electrically connected.
ACF be used between driving circuit and the base plate of liquid crystal panel be electrically connected and driving circuit and tellite between be electrically connected.ACF is small conducting particles is evenly dispersed in the binder resin with cementability and forms.By this ACF is carried out thermo-compressed, be electrically connected by conducting particles between electrode.Then, make the binder resin sclerosis, driving circuit is fixed on liquid crystal panel, the tellite by heating.
When carrying driving circuit on liquid crystal panel with the TAB mode, ACF is sticked on the position that is provided with Wiring pattern in the substrate of liquid crystal panel, the TCP (Tape Carrier Package) as driving circuit is contained on the substrate with the TAB mode.Because ACF is an adhesive substance, so, be stacked on the cardboard band by peel ply, like this, constituted the ACF band.Therefore, under being with by the state that is pressed on the substrate, only peel off the cardboard band, just can paste ACF on the substrate to ACF.
But, under ACF does not paste state on the substrate effectively, being with from ACF when peeling off the cardboard band, ACF is pulled and strips down from substrate by the cardboard band sometimes.ACF is stacked on the peel ply of cardboard band, is acting on certain power of connecting airtight between cardboard band and ACF, when the peeling off of cardboard band, is acting on the power that ACF is stripped down from substrate with the cardboard band, and like this, ACF is stripped from.In addition, even under the situation that ACF is not peeled off fully, produced partially float, upset etc., also will cause the stickup of ACF bad generally.Therefore, when being crimped onto on the substrate, the whole face of ACF must be transferred to substrate-side effectively, only the cardboard band be separated effectively and be not stripped to ACF band heating.
In order to improve the bonding strength of ACF and substrate, patent documentation 1 has disclosed the technology with the interface cooling of ACF and substrate.In patent documentation 1, ACF is heated, makes it transfer to substrate-side, then, make the ACF cooling, ACF is pasted on the substrate.Because after with the ACF heating, when peeling off the cardboard band in the short time of fully not cooling off, ACF can peel off from substrate, so, after ACF is added thermo-compressed, make the interface cooling of ACF and substrate forcibly, can improve bonding strength.
Patent documentation 1: Japanese kokai publication hei 11-242446 communique
But, in patent documentation 1,, carry out such two operations of heating process and refrigerating work procedure for ACF is pasted on the substrate effectively.Therefore, owing to need two operations, so the stickup complex proceduresization of ACF can not realize rapidization of handling.In addition, in order to carry out each operation, need respectively independently structure, also cause the problem of complicated, expensiveization of mechanism.
ACF adopts the binder resin of hot melt usually.The binder resin of hot melt is keeping high viscosity state (solid-state or approaching semi-solid state) at normal temperatures, and this binder resin just becomes molten condition when being heated, will be bedewed by convered structure.The binder resin of fusion has cementability, has by bonding force to make the effect that engages between object.Therefore, the hot melt adhesive resin, when heating and melting, the performance bonding force.
Therefore, when the binder resin with ACF is heated to uniform temperature, certain bonding force plays a role, between ACF and substrate, produce and connect airtight power, so if the bonding force of bringing into play when making the binder resin fusion, the power when peeling off the cardboard band is stronger, then when peeling off the cardboard band, can make ACF transfer to substrate-side.That is, do not need special refrigerating work procedure, just ACF can be pasted on the substrate effectively.
Summary of the invention
, the objective of the invention is for this reason, avoid complicated, expensiveization of operation, mechanism, and, when peeling off the cardboard band, ACF can be pasted on the substrate effectively.
The ACF sticker of technical solution of the present invention 1 is characterized in that, has pressing mechanism, base supporting mechanism and support side heating arrangements; Above-mentioned pressing mechanism with respect to substrate surface, is keeping the peel ply via the cardboard band ACF band of ACF to add and is being pressed on the aforesaid substrate surface; The aforesaid substrate supporting device joins with the back side of aforesaid substrate, and the aforesaid substrate supporting is horizontality; Above-mentioned support side heating arrangements is used the temperature higher than above-mentioned pressing mechanism, and the mode of the temperature of thermmohardening heats the aforesaid substrate supporting device so that ACF becomes not.
When pasting ACF on the substrate, for the ACF heating and melting or make it softening and improve connecting airtight property with substrate, heating and crimping ACF at least.Because ACF is stacked on the peel ply of cardboard band, so the connecting airtight property of ACF and cardboard band weakens, when heating and crimping ACF, usually ACF is sticked on the substrate, so just can peel off the cardboard band.But, strip down in order more effectively ACF to be pasted on the substrate and from the cardboard band, in the ACF of technical scheme 1 sticker, be provided with the support side heating arrangements of using the temperature higher that base supporting mechanism is heated than pressing mechanism.Like this, the temperature of the face (support side abutted surface) that joins with substrate, (the pressure side abutted surface: the height face of a side of pressurized mechanism pressurization) can have thermograde than the face on the cardboard band of being stacked in of ACF.By this thermograde, can make the bonding force of the support side abutted surface of ACF, than the bonding force height of pressure side abutted surface.And, because the pressure side abutted surface of ACF is stacked on the peel ply of cardboard band,, ACF is transferred on the substrate effectively so peel off easily.And, do not need the special processing of cooling processing etc., can avoid complicated, expensiveization of operation, mechanism.
The temperature of support side heating arrangements must be to make the not temperature of thermmohardening of ACF.The stickup stage of ACF, owing to be before the access phase of driving circuit, to carry out, so in this stage, if the binder resin thermmohardening of ACF, then be dispersed in wherein conducting particles by thermmohardening binder resin cover, may cause between substrate and the driving circuit not electrically conducting.But,, for example, when usefulness short time heated substrates etc., also can be heated to thermmohardening temperature or near its temperature of ACF to the temperature of support side heating arrangements as long as ACF be the temperature of thermmohardening not.
The ACF sticker of technical scheme 2 of the present invention in the ACF sticker of technical scheme 1 record, is characterized in that, has so that above-mentioned pressing mechanism becomes the mode of the above temperature of normal temperature, the pressure side heating arrangements of the above-mentioned pressing mechanism of heating.
According to the ACF sticker of technical scheme 2, the pressure side heating arrangements heats pressing mechanism, and thus, the temperature of pressing mechanism also increases.If pressing mechanism is a low-temperature condition, then the hot pressurized mechanism side of ACF absorbs, and the temperature of ACF reduces.In addition,, must promptly make ACF become molten condition for rapidization that realizes handling, so, make pressing mechanism also have heat, can promptly make ACF become molten condition like this.But in order to have thermograde between the pressure side abutted surface that makes ACF and the support side abutted surface, the pressure side heating arrangements heats with not too high temperature (caing be compared to the higher temperature of normal temperature most).
The ACF sticker of technical solution of the present invention 3 in the ACF sticker of technical scheme 1 record, is characterized in that, is formed with several electrode groups on aforesaid substrate; Be provided with feed roller and the half-cutting mechanism of supplying with the ACF band, this half-cutting mechanism, remain on the ACF that sends from this feed roller with on ACF, cut into the length on each electrode group that pastes aforesaid substrate; Above-mentioned pressing mechanism has the length of pasting ACF on each electrode group at least; ACF is pasted respectively on each electrode group of aforesaid substrate.
In the method that ACF is pasted on the substrate, the method for main flow is, reach substrate on one side the ACF of total length paste once, be called paste List.But also can as the ACF sticker of technical scheme 3, paste ACF respectively, be called and cut apart stickup each electrode group.Be formed on the electrode of the fine pitch on the substrate, in each driving circuit, the mode that constitutes a group with the electrode of specified quantity forms the group.Between each electrode group and adjacent electrode group, formed white space.Do not need to paste ACF at white space, so, the stickup of cutting apart of ACF is not pasted in employing at unnecessary white space, can prevent the waste of material, and, also can avoid exposing the problem that produces in the processing of carrying out behind the driving circuit, the processing etc. of having installed at white space because of the resin of binding property and the conducting particles that constitute ACF.
When cutting apart stickup, with the pull-up of cardboard band, ACF is torn from the cardboard band, peel off with this.Therefore, when peeling off the cardboard band, act on very big on the ACF from the power that substrate is peeled off., substrate is heated for this reason, strengthen the bonding force of ACF support side abutted surface, like this, can under the state that ACF is pasted effectively on the substrate, peel off the cardboard band with bearing the side heating arrangements.
The ACF sticker of technical solution of the present invention 4 at technical scheme 3 described ACF stickers, is characterized in that, the aforesaid substrate supporting device has the length of pasting ACF on each electrode group at least; Be provided with the support side lift drive mechanism opposite to each other with above-mentioned pressing mechanism, this support side lift drive mechanism drives the aforesaid substrate supporting device, makes the aforesaid substrate supporting device towards carrying out lifting action independently near the direction of leaving above-mentioned pressing mechanism.
According to the ACF sticker of technical scheme 4, the length of base supporting mechanism is about the stickup length of a slice ACF, makes the base supporting mechanism lifting action.Therefore, with the lifting action crimping ACF of base supporting mechanism and pressing mechanism, like this, the plus-pressure of even action all sidedly.Therefore, can avoid pasting bad.
The ACF sticker of technical solution of the present invention 5 is characterized in that the aforesaid substrate supporting device has the length that reaches the aforesaid substrate total length, and is in fixing state.
According to the ACF sticker of technical scheme 5, the length of base supporting mechanism reaches the total length of substrate, and base supporting mechanism is the state of fixing.Therefore, only pressing mechanism carries out lifting action, and base supporting mechanism joins with substrate always.Therefore, when carrying out crimping with pressing mechanism, because substrate has been the state that has been heated, so, can be promptly the temperature of the support side abutted surface of ACF be formed the condition of high temperature.Like this, can improve treatment effeciency.In addition, because substrate and base supporting mechanism are the states that often joins, so, can make the uniformity of temperature profile of substrate.Therefore, can carry out stable temperature treatment.
The manufacturing installation of the flat-panel monitor of technical scheme 6 of the present invention, the ACF sticker of each record in the scheme that possesses skills 1 to 5.In addition, the flat-panel monitor of technical solution of the present invention 7 is to make with the flat panel display manufacturing apparatus of technical scheme 6 records.The ACF sticker is applicable to the manufacturing installation of flat-panel monitor.Flat-panel monitor is applicable to LCD, plasma display, OLED display etc.
The invention effect
In the present invention, substrate is heated, the support side abutted surface of the ACF that joins with substrate is heated, like this, can improve the bonding force between substrate and ACF by the support side heating arrangements is set.Therefore, do not need refrigerating work procedure, cooling body, when the peeling off of cardboard band, ACF can be pasted on the substrate effectively.
Description of drawings
Fig. 1 be expression as the liquid crystal cell of the substrate of pasting ACF and be contained in driving circuit on this substrate want portion's vertical view.
Fig. 2 is the front elevation of the general structure of expression ACF labelling machine.
Fig. 3 is the left side view of Fig. 2.
Fig. 4 is the vertical view of Fig. 2.
Fig. 5 is the structure key diagram that level is transported roller.
Fig. 6 is the side view that the expression level is transported the structure of roller.
Fig. 7 is the structure key diagram of shut-off mechanism.
Fig. 8 be expression ACF band the half cut-off state the ACF labelling machine want portion's amplification front elevation.
Fig. 9 is the left side view of Fig. 8.
Figure 10 be the expression labelling machine the decline state the ACF labelling machine want portion's amplification front elevation.
Figure 11 is the left side view of Figure 10.
Figure 12 be the expression pivot edge propradation the ACF labelling machine want portion's amplification front elevation.
Figure 13 is the left side view of Figure 12.
Figure 14 be expression ACF band crimped status, the ACF labelling machine want portion's amplification front elevation.
Figure 15 is the left side view of Figure 14.
Figure 16 is the key diagram of the state of the expression cardboard band of peeling off ACF band.
Figure 17 is the key diagram of another routine pivot edge of expression.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.At first, Fig. 1 represents liquid crystal board and driving circuit, and this liquid crystal board is as an example of the substrate of pasting ACF; This driving circuit is to be made of the TCP that carries on substrate with the TAB mode as an example of the semiconductor circuit arrangement of installing by ACF.In addition, substrate not necessarily constitutes the structure of liquid crystal panel, also can be substrate or other various printed circuit board (PCB)s that other display is used.In addition, carrying not limiting on this substrate is driving circuit, so long as the circuit that is electrically connected by ACF all can.
Among Fig. 1, the 1st, liquid crystal board, this liquid crystal board 1 is by all being that infrabasal plate 2 and the upper substrate 3 that sheets of glass constitutes constitutes.Between two substrates 2,3, enclosed liquid crystal.Infrabasal plate 2, at least on its 2 limit, the amount from upper substrate 3 stretches out Rack is installed with a plurality of driving circuits 4 on this extension 2a, and this driving circuit 4 is integrated circuit component 4b is installed in that film substrate 4a goes up and constitutes.
On the extension 2a of infrabasal plate 2, be provided with the electrode of specified quantity, these electrodes are connected with following distribution, and described distribution is connected with the TFT (Thin Film Transistor) that is formed on the position that two substrates 2,3 overlaps respectively.These electrodes, shown in mark among the figure 5, at the installation portion of each driving circuit 4, the electrode of specified quantity forms a group.In the left and right sides of each electrode group 5, be formed with alignment mark 6a, 6a.Therefore, between adjacent electrode group 5,5, formed white space with Rack.On the other hand, on driving circuit 4, be provided with a plurality of electrodes that are electrically connected with each electrode that constitutes these electrode groups 5, the electrode group that is connected with electrode group 5 is represented with mark 7.In addition, on driving circuit 4, in the left and right sides of electrode group 7, also be formed with alignment mark 6b, 6b, when driving circuit 4 carries on the liquid crystal board 1, be benchmark with these alignment marks, constitute each electrode of electrode group 7 and constitute each electrode adjustment position of electrode group 5 and consistent.
Fig. 2 to Fig. 4 represents ACF8 is pasted the general structure of the labelling machine on the extension 2a of infrabasal plate 2.In these figure, the 9th, liquid crystal board 1 is remained the supporting base of horizontality.Liquid crystal board 1 for example by the vacuum suction mechanism stable remain on this supporting base 9.Here, though liquid crystal board 1 joins with supporting base 9 in large area, the lower position of extension 2a of having pasted the infrabasal plate 2 of ACF8 is open.In order to aim at driving circuit 4 etc., the position adjusting mechanism of X, Y, θ direction can be set on supporting base 9.
In addition, the 10th, ACF8 is pasted labelling machine on the liquid crystal board 1, this labelling machine 10 is made of the plate body that is located at vertical direction, and feed roller 11 releasably is installed.ACF8 is stacked on the peel ply of cardboard band 12, has constituted ACF and has been with 13, and this ACF is with 13 to be wound on the feed roller 11.ACF is with 13, along the walking path that is made of the roller 14～17 that is installed on the labelling machine 10, is directed walking.The 18th, drive and use roller, seizing the cardboard band 12 after pasting ACF8 on the liquid crystal board 1 on both sides by the arms, send into discharge portion 19.
Roller the 14, the 15th is supplied with the deflector roll of ACF with 13 usefulness, and deflector roll 15 is installed on the swing arm 20.Swing arm 20 is the center swing with rotation axis 21.The driving mechanism (not shown) that is connecting motor etc. on rotation axis 21 makes swing arm 20 when arrow F direction is swung, and sends at least from feed roller 11 and once pastes length, and the ACF that promptly sends length L shown in Figure 1 is with 13, and supplies between the roller 14,15.As a result, carrying ACF to keep certain with the counter-force of effect in 13 o'clock is total, can be because of the resistance change that causes transport force that differs from of the coiling amount of feed roller 11.
As shown in Figure 5 and Figure 6, roller the 16, the 17th, horizontal guide roller is with 13 to guide towards horizontal direction in its walking path ACF, and regulation ACF8 is toward liquid crystal panel 1 last length of pasting.The stickup initiating terminal position of horizontal guide roller 17 regulation ACF8, the stickup terminal location of horizontal guide roller 16 regulation ACF8, like this, the sticking area of ACF8 is set.As shown in Figure 6, horizontal guide roller 16,17 in the both sides of cylindrical portion 16a, 17a, is formed with the 16b of blade of a sword portion, 17b, the 16b of blade of a sword portion, 17b, from the height at the outstanding position of cylindrical portion 16a, 17a, with the thickness roughly the same or slightly bigger point of ACF with the cardboard band 12 in 13.
Therefore, between horizontal guide roller 16,17, ACF8 is adhered on the liquid crystal panel 1, then, separates with cardboard band 12, and the position in horizontal guide roller 17 downstreams has been peeled off the cardboard band 12 behind the ACF8 and has been recovered.In position, sticking area downstream, be provided with to drive and use roller 18 by horizontal guide roller 16,17 ACF8 that divided.Driving has driven roller 18a and pinch roll 18b with roller 18, and cardboard band 12 is seized on both sides by the arms between driven roller 18a and pinch roll 18b.By with driven roller 18a driven in rotation, can one section one section ground ACF of sending (the ピ Star チ send り) length L be with 12.
As shown in Figure 3, labelling machine 10 is installed on the lifting drive division 22, and on the drive division 23, front and back drive division 23 was installed in the driven in parallel portion 24 before and after this lifting drive division 22 was installed in, and described driven in parallel portion 24 constitutes and transports structure.By these mechanisms, can make ACF with sticking area in 13 walking paths, that be defined in the ACF8 of (see figure 2) between the horizontal guide roller 16-17, at above-below direction, be Z-direction and move in X-direction of surface level (with the direction of the orientation orthogonal of electrode group 5) and Y direction (orientation of electrode group 5).On the other hand, liquid crystal board 1 usefulness vacuum suction remains on the supporting base 9 regularly.
Here, must adjust between horizontal guide roller 16-17 ACF with 13 with infrabasal plate 2 in the relative position of electrode group 5, the moving drive division 23 in front and back makes sticking area towards moving near the direction of leaving liquid crystal board 1, parallel moving drive division 24 make sticking area towards with liquid crystal board 1 in the parallel direction of orientation of electrode group 5, be that Y direction moves, so, can carry out position adjustments in labelling machine 10 sides, but as previously mentioned, if on supporting base 9, be provided with X, Y, the position adjusting mechanism of θ direction then also can be with 13 to position to ACF in these supporting base 9 sides.
Lifting drive division 22 have tilted block 30 and make this tilted block 30 towards front and back to the cylinder 31 that moves.On labelling machine 10, connecting the slide unit 32 that engages with the dip plane of tilted block 30.Slide unit 32 has the dip plane consistent with tilted block 30, by limit rod 33, and all can not displacement except above-below direction.Therefore, when driving cylinder 31, labelling machine 10 is in the above-below direction displacement.Also can replace cylinder 31 with motor.
Then, front and back drive division 23 moves forward and backward the pedestal 34 that tilted block 30 is installed.Moving back and forth of this pedestal 34 is that driving mechanism 35 by cylinder, motor etc. constitutes carries out.Parallel moving drive division 24, have pedestal 34 and driving mechanism 35 thereof be installed transport platform 36.When driving ball-screw 37 rotations that constitute the ball-screw conveyers with motor 38, transport platform 36 can make labelling machine 10 be parallel to the electricity level group 5 in the liquid crystal board 1 orientation move.
ACF on being installed in labelling machine 10 is with in 13 the walking path, as shown in Figure 8, position, downstream slightly in the position of horizontal guide roller 16 is provided with half-cutting mechanism 40, and this half-cutting mechanism 40 can be yearned for multiple being installed in movably on the surface of labelling machine 10 towards front and back.As shown in Figure 7, this half-cutting mechanism 40 has cutting knife 41 and cutter support 42, and cutting knife 41 can be that the center is towards rotating near the direction of leaving cutter support 42 with axle 43 shown in arrow among the figure.By the elastic force of the spring 44 that acts on cutting knife 41 always, keeping leaving the state of cutter support 42.Be located at promotion roller 46 on the cylinder 45 with cutting knife 41 when the direction of antagonistic spring 44 promotes, cutting knife 41 is towards the direction swing displacement near cutter support 42.At cutting knife 41 near the position of cutter support 42, between them, formed with ACF with identical or a little bit smaller slightly closely-spaced of the thickness of 13 cardboard band 12.Like this, can only carry out half cut-off to ACF8.
On the extension 2a that ACF8 is pasted infrabasal plate 2, the position between horizontal guide roller 16,17, ACF is crimped on the surface of infrabasal plate 2 with 13 plus-pressures that are prescribed.For this reason, as Fig. 8 and shown in Figure 9, on labelling machine 10, be provided with crimp head 50.Here, liquid crystal board 1 is positioned on the supporting base 9, but the extension 2a of its infrabasal plate 2 stretches out from supporting base 9, and crimp head 50 is from holding the position that this stretches out up and down under the arm.
Crimp head 50 is by constituting as the pressurization sword 51 of pressing mechanism with as the pivot edge 52 of base supporting mechanism.These pressurization swords 51 and pivot edge 52 are installed in respectively on the elevator 53,54.These elevators 53,54 can along be located at pair of guide rails 55 on the labelling machine 10 towards upper and lower to displacement.These pressurization sword 51 and pivot edges 52 are being held liquid crystal board 1 ground under the arm and are being disposed up and down, form identical length.Pressurization sword 51 be disposed between horizontal guide roller 16,17, be guided and the ACF of along continuous straight runs walking with 13 top position.In addition, elevator 53,54 is along common guide rail 55 lifting actions, but the independently guide rail corresponding with each elevator 53,54 also can be set.
The elevator 54 of pivot edge 52 is installed,, carries out lifting action with prescribed stroke by cylinder 56.That is, when making cylinder 56 become deflated state, pivot edge 52 descends, and is configured to the lower position that leaves liquid crystal board 1.When making cylinder 56 elongations, pivot edge 52 joins below liquid crystal board 1.On the other hand, on the elevator 53 that pressurization sword 51 is installed, connecting pressing mechanism 57.Illustrated pressing mechanism 57, have by motor driven transport screw rod 57a, constitute so-called lifting jack.Make the elevator 53 that is connecting sword 51 settings of pressurizeing along guide rail 55 knee-actions, 57 pairs of this pressing mechanisms are bearing in the liquid crystal board 1 on the pivot edge 52, from the plus-pressure of top effect regulation.Pressurization sword 51 and pivot edge 52 are correctly keeping the depth of parallelism.In addition, the cylinder 56 of supporting pivot edge 52 at least at the upward stroke end position, can not touched because of the plus-pressure of pressing mechanism 57 effects, can import the pressure that can keep elongation state
In constituting the pressurization sword 51 and pivot edge 52 of crimp head 50, built-in respectively as the pressure side heating arrangements pressure side well heater 51H and as the support side well heater 52H of support side pressing mechanism.Sword 51 heating of will pressurizeing of the heat of pressure side well heater 51H.The heat of support side well heater 52H is with pivot edge 52 heating.The heating-up temperature of support side well heater 52H is than the heating-up temperature height of pressure side well heater 51H.Therefore, the temperature of pivot edge 52 is than the temperature height of pressurization sword 51.Pressure side well heater 51H and support side well heater 52H are thermals source, and for example, the power converter that the electric power supply source of scheming not show is supplied with is a heat energy, generates heat.
Therefore, the pressurization sword 51 and the pivot edge 52 that have been heated are with 13 thermo-compressed on liquid crystal board 1 ACF from above-below direction.The temperature of support side well heater 52H heating is set at the not temperature of thermmohardening degree of ACF8.Therefore, be not set at too high temperature, and be set at the binder resin fusion of ACF8, the temperature (for example about 140 ℃) of performance bonding force degree.On the other hand, the temperature of heated side well heater 51H heating, than the temperature of support side pressurized heat device 52H heating lower, be set at the temperature (for example about 50 ℃) that the temperature that makes the ACF8 that has been heated does not reduce degree.Constitute the pressurization sword 51 of crimp head 50 and the width dimensions of pivot edge 52, can fully cover ACF with 13 width, and the size of its length direction has the stickup length L of ACF8 at least.
As mentioned above, the ACF that on labelling machine 10, feed roller 11 is installed, supplies with from this feed roller 11 is with 13 walking path, half-cutting mechanism 40 and crimp head 50.With this ACF sticker, carry the required ACF8 of driving circuit 4 in the TAB mode, paste on the electrode group 5 of specified quantity, the electrode group 5 of this specified quantity is formed on the extension 2a of infrabasal plate 2 of liquid crystal board 1.
Paste the liquid crystal board 1 of ACF8, be adsorbed the assigned position that remains on the supporting base 9 with horizontality.Under this state, in the infrabasal plate 2 of liquid crystal board 1, extension 2a shown in Figure 4 stretches out from supporting base 9, on this extension 2a, is carrying the driving circuit 4 of regulation sheet number.Therefore, the labelling machine 10 of sticker is installed, is transported by one section one section ground of interval P shown in Figure 1 towards the direction of arrow by ball-screw 37.
The ACF8 of length L sticks on the liquid crystal board 1 successively, and for this reason, the platform 36 that transports that constitutes parallel moving drive division 24 is driven, and labelling machine 10 is indexed to the sticking area of regulation.At this moment, shown in the arrow among Fig. 8 and Fig. 9, lifting drive division 22 remains on lifting position with labelling machine 10.The pressurization sword 51 that constitutes crimp head 50 remains on lifting position, and pivot edge 52 remains on down position.Like this, these pressurization swords 51 and pivot edge 52 are keeping contactless state with liquid crystal board 1, and labelling machine 10 can move neatly, can not produce the situation of damage liquid crystal board 1 grade.In addition because ACF is with 13 to separate with liquid crystal board 1, so, even half-cutting mechanism 40 is forwards stretched out from the surface of labelling machine 10, also can with liquid crystal board 1 interference.Therefore, can carry out ACF with 13 half cut-off.After having carried out this half cut-off, ACF is to paste terminal location with 13 the position by half cut-off, and the end of having pasted previous ACF8 is to paste the initiating terminal position.That is, horizontal guide roller 17 is configured in pastes the initiating terminal position, and horizontal guide roller 16 is configured in the stickup terminal location.
Then, after half-cutting mechanism 40 was kept out of the way, shown in arrow among Figure 10, Figure 11, lifting drive division 22 descended labelling machine 10, and ACF with position in 13, between the horizontal guide roller 16,17, is configured in the position near infrabasal plate 2 surfaces of liquid crystal board 1.Then, make cylinder 56 actions, elevator 54 is risen, shown in Figure 12,13, the pivot edge 52 and the back side of liquid crystal board 1 are joined.When the back side of pivot edge 52 and liquid crystal board 1 joins, because pivot edge 52 is supported side well heater 52H heating, so in the moment that pivot edge 52 and infrabasal plate 2 are joined, the infrabasal plate 2 that thin glass plate constitutes is heated, and becomes the condition of high temperature.
At this, the length of pivot edge 52 does not reach the total length of liquid crystal board 1, in action once, is limited to and the regional corresponding position of pasting ACF8.Then, shown in arrow among Figure 14, Figure 15, make pressing mechanism 57 action, pressurization sword 51 is descended, promote ACF, like this, ACF8 is crimped on the infrabasal plate 2 with 13 cardboard band 12.
51 promotion ACF were with 13 o'clock at the pressurization sword, and pressurization sword 51 is with 13 to become contact condition with ACF, still, because pressurization sword 51 pressurized side well heater 51H heat, are in heated condition to a certain degree, so heat also is delivered to the peel ply of cardboard band 12.According to the kind of cardboard band 12, heat is paid peel ply, like this, ACF8 can be easily strips down from the peel ply of cardboard band 12.Therefore, heat is paid the peel ply of cardboard band 12, the power of connecting airtight of ACF8 and cardboard band 12 is weakened, become the state that to peel off easily.
Under this state, pressurization sword 51 is with 13 to be crimped on the infrabasal plate 2 ACF.Owing to being supported side well heater 52H heating, infrabasal plate 2 becomes the condition of high temperature, so heat is delivered to ACF8, beginning fusion.At this moment, because ACF8 is film, the thickness with regulation, so, from the support side abutted surface of ACF8 (ACF8 with abutted surface infrabasal plate 2) fusion gradually, the temperature height of support side abutted surface side, the temperature of pressure side abutted surface side (the face on the cardboard band 12 of being stacked in of ACF8) is low, has produced thermograde.When the further fusion of this face, the viscosity of binder resin reduces, and infrabasal plate 2 is soaked, brings into play bonding force.So bonding force acts between ACF8 and the infrabasal plate 2, both become tightlock status.
On the other hand, because the also pressurized side well heater of pressurization sword 51 51H heating, so heat also is delivered to the pressure side abutted surface of ACF8.But, because being the low temperature of using the temperature that makes ACF8 not reduce degree, heats pressure side well heater 51H, so, even heat is delivered to the pressure side abutted surface of ACF8, this also not fusion of face.Therefore, the bonding force that acts between ACF8 and the cardboard band 12 is little.Otherwise,, can easily peel off by the heating peel ply.
For make the plus-pressure of pressurization sword 51 pairs of liquid crystal boards 1 effect regulation, drive constitute pressing mechanism 57 transport screw rod 57a.Here, the infrabasal plate of liquid crystal board 12 is made of thin glass plate, allow distortion to a certain degree, and length is identical, is seized on both sides by the arms between the pressurization sword 51 and pivot edge 52 that keep the correct depth of parallelism.Therefore, when this was seized on both sides by the arms, the position that the quilt in the liquid crystal board 1 is seized on both sides by the arms similarly was out of shape with the shape of the crimp head 50 that is made of pressurization sword 51 and pivot edge 52.Because pressurization sword 51 and pivot edge 52 all are limited at from ACF with the position to terminal location, 13 stickup initiating terminal position, so, to ACF with whole linking part on 13, that join with pressurization sword 51, acting on impartial plus-pressure, and, have ACF8, by the stickup terminal location of half cut-off by base end side, do not act on plus-pressure.
When ACF8 is crimped on the infrabasal plate 2, remove 50 couples of ACF of crimp head with 13 plus-pressure.Then, drive cylinder 56, make pivot edge 52 be indexed to down position.Then, lifting drive division 22 is risen, at this moment, shown in arrow among Figure 16, the moving drive division 23 in front and back is driven with lifting drive division 22, it is just moved with 12 Width obliquely with respect to ACF with drawing, like this, cardboard band 12 is peeled off in the mode of tearing from ACF8.
When carrying out pasting cutting apart of ACF8, because ACF8 is peeled off with tearing, so the power of peeling off from infrabasal plate 2 that is pulled, acting on ACF8 by cardboard band 12 (power of being drawn by side obliquely with cardboard band 12) is very big.But the state of ACF8 at this moment is, the support side abutted surface is connecting airtight by bonding force and infrabasal plate 2, and the pressure side abutted surface is peeled off from cardboard band 12 easily, so ACF8 becomes the state that pastes conscientiously on the infrabasal plate 2.
Through above-mentioned action, the stickup of the ACF8 of an electrode group 5 on the extension 2a of infrabasal plate 2 is finished.Labelling machine 10 is remained on the position of rising, make to drive, extract ACF out from feed roller 11 and be with 13, one sections one section ground to send with roller 18 actions.Then, make parallel moving drive division 24 actions, labelling machine 10 is moved a segment length, is the length shown in the P of interval among Fig. 1.Keep the substrate supporting platform 9 of liquid crystal board 1 motionless.Under this state, carry out repeatedly and aforementioned same action, in turn electrode group 5 is carried out the stickup of ACF8.
Here, pressurization sword 51 and pivot edge 52 drive lifting by elevator 53,54 respectively.Therefore, these elevators 53,54 are always keeping under the state of the correct depth of parallelism, from seizing infrabasal plate 2 up and down on both sides by the arms at pressurization sword 51 and pivot edge 52 along guide rail 55 knee-actions that are located on the labelling machine 10.When electrode group 5 is formed on n position on the liquid crystal board 1, though also separate, all use roughly the same condition crimping ACF8 from the distance (np) of initial ACF8 paste position ACF8 paste position to the end.Therefore, undersized liquid crystal board needless to say, even large-scale liquid crystal board 1 also can paste ACF8 on whole electrode group 5 with the pressure of equalization, it is bad can not produce crimping.In addition, though two elevators the 53, the 54th, by identical guide rail 55 guiding, a shared guide rail 55 not necessarily wanted.
In addition, also can as shown in Figure 17 pivot edge 152 be installed on the supporting base 9, pivot edge 152 is configured in position with supporting base 9 equal heights, make it have the length of infrabasal plate 2 total lengths.Setting reaches the support side well heater 152H of pivot edge 152 total lengths.At this moment, liquid crystal board 1 be positioned on the supporting base 9 during, become heated state always, have only the pressurization sword 51 carry out lifting action.By constituting pivot edge 152 in this wise, can realize the more stable temperature treatment and rapidization of processing.
That is, owing to pivot edge 152 is fixed, so, infrabasal plate 2 is joined with pivot edge 152 always.Pivot edge 152 is in and is supported side well heater 152H heated state, so the infrabasal plate 2 that joins always with pivot edge 152 also is in heated state always.And, because pivot edge 152 has the length that has reached infrabasal plate 2 total lengths, so, be formed with the position of the infrabasal plate 2 of electrode group 5, distributing with even temperature along total length is heated.Therefore, can realize stable temperature treatment.In addition, because infrabasal plate 2 often is in heated state, so, the time that does not need to be used to heat infrabasal plate 2.Like this, can promptly carry out the stickup of ACF8, realize rapidization of handling.Therefore, pivot edge 152 is set at the liftable action still is set at stationary state, can at random select according to demand.
In the top explanation, illustrated and cut apart the mechanism of pasting ACF, but the present invention also is applicable to the mechanism that carries out paste List.When cutting apart stickup, the size of ACF is the stickup length to each electrode group.When paste List, be the length that reaches the total length of infrabasal plate.Even when paste List, also must strip down ACF from the cardboard band, so when the peeling off of cardboard band, the power that strips down from infrabasal plate in effect to ACF.Therefore, as long as infrabasal plate is heated, bonding force is acted between infrabasal plate and the ACF, both are connected airtight,, also can under the state that effectively ACF is pasted on the infrabasal plate, peel off the cardboard band even during paste List with the support side well heater.
Claims (7)
1. an ACF sticker is characterized in that, has pressing mechanism, base supporting mechanism and support side heating arrangements;
Above-mentioned pressing mechanism with respect to substrate surface, is keeping the peel ply via the cardboard band ACF band of ACF to add and is being pressed on the aforesaid substrate surface;
The aforesaid substrate supporting device joins with the back side of aforesaid substrate, and the aforesaid substrate supporting is horizontality;
Above-mentioned support side heating arrangements is used the temperature higher than above-mentioned pressing mechanism, and the mode of the temperature of thermmohardening heats the aforesaid substrate supporting device so that ACF becomes not.
2. ACF sticker as claimed in claim 1 is characterized in that, has so that above-mentioned pressing mechanism becomes the mode of the above temperature of normal temperature, the pressure side heating arrangements of the above-mentioned pressing mechanism of heating.
3. ACF sticker as claimed in claim 1 is characterized in that,
On aforesaid substrate, be formed with several electrode groups;
Be provided with feed roller and the half-cutting mechanism of supplying with the ACF band, this half-cutting mechanism, remain on the ACF that sends from this feed roller with on ACF, cut into the length on each electrode group that pastes aforesaid substrate;
Above-mentioned pressing mechanism has the length of pasting ACF on each electrode group at least;
ACF is pasted respectively on each electrode group of aforesaid substrate.
4. ACF sticker as claimed in claim 3 is characterized in that,
The aforesaid substrate supporting device has the length of pasting ACF on each electrode group at least;
Be provided with the support side lift drive mechanism opposite to each other with above-mentioned pressing mechanism, this support side lift drive mechanism drives the aforesaid substrate supporting device, makes the aforesaid substrate supporting device towards carrying out lifting action independently near the direction of leaving above-mentioned pressing mechanism.
5. ACF sticker as claimed in claim 3 is characterized in that, the aforesaid substrate supporting device has the length that reaches the aforesaid substrate total length, and is in fixing state.
6. the manufacturing installation of a flat-panel monitor is characterized in that, has the ACF sticker of each record in the claim 1 to 5.
7. a flat-panel monitor is characterized in that, is to use the manufacturing installation of the flat-panel monitor of claim 6 record to make.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-214892 | 2007-08-21 | ||
| JP2007214892 | 2007-08-21 | ||
| JP2007214892A JP5096835B2 (en) | 2007-08-21 | 2007-08-21 | ACF pasting device and flat panel display manufacturing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101373284A true CN101373284A (en) | 2009-02-25 |
| CN101373284B CN101373284B (en) | 2010-09-15 |
Family
ID=40447523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102142317A Expired - Fee Related CN101373284B (en) | 2007-08-21 | 2008-08-21 | ACF paste device, manufacturing device of flat panel display and flat panel display |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5096835B2 (en) |
| KR (1) | KR100967688B1 (en) |
| CN (1) | CN101373284B (en) |
| TW (1) | TWI392037B (en) |
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| CN102184680A (en) * | 2010-09-30 | 2011-09-14 | 四川虹欧显示器件有限公司 | Method and device for bonding flat-panel display |
| CN102495487A (en) * | 2011-12-29 | 2012-06-13 | 苏州光宝康电子有限公司 | Main bonding unit for full-automatic chip on glass (COG) bonder |
| CN102666332A (en) * | 2010-11-15 | 2012-09-12 | 松下电器产业株式会社 | Tape adhesion device and tape adhesion method |
| CN105938263A (en) * | 2015-03-06 | 2016-09-14 | 松下知识产权经营株式会社 | ACF sticking method and ACF sticking apparatus |
| CN107390407A (en) * | 2017-08-24 | 2017-11-24 | 重庆市福显电子科技有限公司 | A kind of bonding method of liquid crystal display and FPC |
| CN110654030A (en) * | 2018-06-28 | 2020-01-07 | 松下知识产权经营株式会社 | Component pressure-bonding device, sheet setting unit, and method for mounting sheet setting unit |
| CN111801720A (en) * | 2018-03-12 | 2020-10-20 | 堺显示器制品株式会社 | Hot press bonding device |
| CN113054075A (en) * | 2021-03-09 | 2021-06-29 | 深圳市华星光电半导体显示技术有限公司 | ACF (anisotropic conductive film) attaching method |
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| JP4392766B2 (en) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
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| JP6393904B2 (en) * | 2015-03-06 | 2018-09-26 | パナソニックＩｐマネジメント株式会社 | ACF sticking method and ACF sticking apparatus |
| JP6393903B2 (en) * | 2015-03-06 | 2018-09-26 | パナソニックＩｐマネジメント株式会社 | ACF sticking method and ACF sticking apparatus |
| JP6528116B2 (en) * | 2015-03-06 | 2019-06-12 | パナソニックＩｐマネジメント株式会社 | ACF sticking method and ACF sticking device |
| KR102072813B1 (en) * | 2018-10-18 | 2020-02-03 | 박호석 | Glass tape attachment apparatus for display unit |
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| US6501525B2 (en) * | 2000-12-08 | 2002-12-31 | Industrial Technology Research Institute | Method for interconnecting a flat panel display having a non-transparent substrate and devices formed |
| JP3767474B2 (en) * | 2001-01-15 | 2006-04-19 | セイコーエプソン株式会社 | Display device and manufacturing method thereof |
| JP2003078238A (en) | 2001-09-03 | 2003-03-14 | Asuriito Fa Kk | Device and method for sticking anisotropic conductor |
| US7076867B2 (en) * | 2001-12-28 | 2006-07-18 | Matsushita Electric Industrial Co., Ltd. | Pressurizing method |
| JP4417028B2 (en) | 2003-05-22 | 2010-02-17 | 株式会社タカトリ | Device for attaching dicing tape to dicing frame |
| JP4312648B2 (en) | 2004-04-14 | 2009-08-12 | 富士機械製造株式会社 | Tape metering device |
| JP4908051B2 (en) * | 2006-05-12 | 2012-04-04 | 東レエンジニアリング株式会社 | Anisotropic conductive tape pasting device |
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2007
- 2007-08-21 JP JP2007214892A patent/JP5096835B2/en not_active Expired - Fee Related
-
2008
- 2008-08-20 KR KR1020080081526A patent/KR100967688B1/en not_active IP Right Cessation
- 2008-08-20 TW TW097131733A patent/TWI392037B/en not_active IP Right Cessation
- 2008-08-21 CN CN2008102142317A patent/CN101373284B/en not_active Expired - Fee Related
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| CN102184680A (en) * | 2010-09-30 | 2011-09-14 | 四川虹欧显示器件有限公司 | Method and device for bonding flat-panel display |
| CN102666332A (en) * | 2010-11-15 | 2012-09-12 | 松下电器产业株式会社 | Tape adhesion device and tape adhesion method |
| CN102495487A (en) * | 2011-12-29 | 2012-06-13 | 苏州光宝康电子有限公司 | Main bonding unit for full-automatic chip on glass (COG) bonder |
| CN102495487B (en) * | 2011-12-29 | 2014-05-14 | 苏州光宝康电子有限公司 | Main bonding unit for full-automatic chip on glass (COG) bonder |
| CN105938263A (en) * | 2015-03-06 | 2016-09-14 | 松下知识产权经营株式会社 | ACF sticking method and ACF sticking apparatus |
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| CN107390407A (en) * | 2017-08-24 | 2017-11-24 | 重庆市福显电子科技有限公司 | A kind of bonding method of liquid crystal display and FPC |
| CN111801720A (en) * | 2018-03-12 | 2020-10-20 | 堺显示器制品株式会社 | Hot press bonding device |
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| CN113054075A (en) * | 2021-03-09 | 2021-06-29 | 深圳市华星光电半导体显示技术有限公司 | ACF (anisotropic conductive film) attaching method |
| CN113054075B (en) * | 2021-03-09 | 2022-06-10 | 深圳市华星光电半导体显示技术有限公司 | ACF (anisotropic conductive film) attaching method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101373284B (en) | 2010-09-15 |
| JP5096835B2 (en) | 2012-12-12 |
| TW200931550A (en) | 2009-07-16 |
| JP2009049238A (en) | 2009-03-05 |
| KR100967688B1 (en) | 2010-07-07 |
| TWI392037B (en) | 2013-04-01 |
| KR20090019736A (en) | 2009-02-25 |
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