KR100819333B1 - Acf pre-bonding machine - Google Patents

Abstract

An ACF(Anisotropic Conductive Film) pre-bonding machine is provided to reduce a manufacturing cost by maintaining an optimum bonding condition in response to a structure of various pattern units. A coupled frame(100) has a vertical supporting bar and a horizontal supporting bar. An ACF supply unit(200) is coupled to the coupled frame. An ACF is held and supplied to the ACF supply unit. A plurality of bonding head units(300) are coupled to a front plane of the horizontal supporting bar of the coupled frame, and compress a substrate and the ACF through a thermal compression. The horizontal transfer device(400) transfers the bonding head units along a horizontal direction. A substrate compressed by the bonding head units is put on a working table(500). A control unit controls the ACF supply unit, the bonding head units and the horizontal transfer device. The bonding head unit includes a head coupled bar, a head frame, a head cylinder, a head heating block unit, a cutting unit, and an ACF ejection unit. The head coupled bar is coupled to an upper part of the coupled frame, and is fixed on a transfer table which is transferred along a horizontal direction. The head frame is fixed to the head coupled bar and located on a front plane of the horizontal supporting bar. The head cylinder is fixed on an upper part of the head frame. The head heating block unit is driven by an operation of the head cylinder and compresses a heat for an ACF on the substrate. The cutting unit cuts the ACF compressed by the heat on the substrate. The ACF ejection unit separates an ACF supporting layer from the ACF and ejects the ACF supporting layer to an external part.

Description

ACF Pre-Bonding Machine

Figure 1a is a structural diagram showing the structure of a conventional anisotropic conductive film bonding device;

1B is a state diagram showing a working state of a conventional anisotropic conductive film bonding apparatus;

Figure 2 is a front structural view showing the overall structure of the AFC pressure bonding bonding apparatus according to an embodiment of the present invention;

3 is a partial coupling perspective view showing the structure of the coupling frame, the bonding head portion and the ACF supply unit according to an embodiment of the present invention;

4 is an overall perspective view of a bonding head part according to an embodiment of the present invention;

5 is a front view, a plan view, and a side view showing a structure of a bonding head part according to an embodiment of the present invention; And

6 is a working state diagram showing an operating state of the AFC press bonding device according to an embodiment of the present invention.

※ Explanation of symbols for main parts of drawing

100: coupling frame 110: vertical support

120: horizontal support 130: head feeder

200: ACF supply unit 210: supply unit coupling table

220: holder 230: feed roller

300: bonding head portion 310: head coupling

320: head frame 330: head cylinder

340: head heating blur 350: cutting portion

360: head flatness adjustment unit 370: ACF outlet

371: peeling part 372: tension adjusting part

373: transfer unit 374: recovery unit

375: ACF roller 400: horizontal feed unit

500: Workbench 600: PCB Board

700: ACF film

The present invention relates to a pressure bonding bonding apparatus, and more particularly, a plurality of small pressing bonding head portions in the head portion of the bonding apparatus, so that the bonding of the ACF can be made only in the pattern portion that is required to be bonded. By controlling the bonding head unit, the present invention relates to an A.C pressure bonding bonding device which prevents unnecessary waste of ACF, improves productivity, and improves efficiency of a work process and equipment.

In general, an ACF-anisotropic conductive film (ACF) is composed of particulate conductive particles (metal particles, carbon, coated plastic particles coated with metal), adhesives (thermoplastic or thermosetting), and additives (dispersants). It forms a conductive adhesive layer in the form of a thin film by mixing, etc. It is very excellent in connection reliability, micro-connectivity, low-temperature connection, etc., so it is LCD panel, TCP (Tape Carrier Package) or PCB (Printed Circuit Board) and TCP ( Tape Carrier Package) is widely used for electrical connection.

In particular, in the case of film on glass (FOG) or chip on glass (COG), an ACF film is set in a pattern part on which at least one pattern is formed before bonding a chip to a glass pattern, and then a predetermined temperature is set by a separate bonding device. The process of adhering the electrically conductive adhesive layer of a film to the whole pattern part is performed, heating and pressurizing with a furnace.

The film adhered to the pattern portion of the LCD by such an adhesion process is conductive by the conductive particles on the upper side of each pattern, and the conductive particles are independently present between the pattern and the pattern spaced apart at predetermined intervals. The pattern is insulated so that the chips bonded on the upper side of the pattern are bonded so as to have conductivity independently only on the corresponding pattern.

In particular, the bonding process is performed through a pre-bonding process for adhering the ACF to the pattern portion of the PCB, and a main bonding process for bonding the LCD panel on which the FOG is formed and the PCB to which the ACF is pressed.

The device used for the pre-bonding bonding process is an anisotropic conductive film bonding device. For example, in the accompanying drawings, FIG. 1A is a structural diagram showing a structure of a conventional anisotropic conductive film bonding apparatus and FIG. 1B is a state diagram showing a working state of a conventional anisotropic conductive film bonding apparatus.

Referring to the drawings, a conventional bonding apparatus includes a frame 10, a film supply unit 20 provided with both sides of the frame 10 and a film supply reel 21 for supplying ACF, the frame 10 Bonding on the PCB 40 and bonding the ACF 30 supplied from the film supply unit 20 to the left and right, and the ACF layer is separated through the bonding unit 50. The film recovery part 60 is provided with the film recovery reel 61 which collect | recovers the ACF support layer 31, and the carrier which draws out the ACF 30 from the said film supply part 20, and transfers it to the said bonding part 50. It consists of 70.

In the bonding part 50, when the PCB 40 is supplied from the outside and supported on a work table (not shown), the heating block 51 provided on the upper part moves downward by driving the cylinder 80, and thus the carrier ( The ACF 30 supplied by 70 is pressed to press the ACF layer onto the PCB 40.

However, the conventional anisotropic conductive film bonding apparatus as described above has the following problems.

First, since the conventional anisotropic conductive film bonding apparatus bonds the conductive adhesive layer to the entire pattern portion composed of one or more patterns on the LCD panel, not only an expensive film is excessively used, but also the film is adhered to the entire pattern portion. Bubbles are generated between the pattern and the pattern, there is a problem that can not obtain a good bonding quality.

Second, the conventional anisotropic conductive film bonding apparatus does not correspond to the pattern portion and the pattern formed in a variety of structures of the workbench and the bonding portion is appropriately changed if the structure of the pattern portion and the pattern formed on the pattern portion is changed to In addition, due to the lack of efficiency and compatibility of the equipment to be produced additionally, the work efficiency is not only degraded, but the cost of additional costs is increasing.

Third, the conventional anisotropic conductive film bonding apparatus has a problem that the thermal deformation may occur in the heating block in which the bonding portion is formed of one large heating block, the heat compression process is performed.

Fourth, the conventional anisotropic conductive film bonding device is a manual operation to adjust the flatness of the bottom surface of the heating block in contact with the LCD panel when assembling equipment and parts replacement, there was a problem that it is difficult to precisely adjust the flatness .

Fifth, the conventional anisotropic conductive film bonding device has a large size of the heating block of the bonding portion, so that the length of the ACF is bonded on the PCB. There was a problem.

In order to solve the above problems, the present invention provides a plurality of bonding parts so that the ACF bonding work can be performed only on the pattern parts provided on the various LCD panels. The purpose of the present invention is to provide an A. C pressure bonding bonding device capable of obtaining high quality bonding quality by preventing optimum and maintaining optimum bonding conditions corresponding to structures of various patterns.

In addition, another object of the present invention is to provide an AC F compression bonding device capable of reducing thermal deformation of a heating block in which a thermal bonding process is performed by miniaturizing a bonding part including a heating block.

In addition, the present invention is provided with a flatness adjusting device to adjust the flatness of the bottom surface of the heating block that is in contact with the LCD panel during the assembly of equipment and parts replacement, thereby improving the flatness of the LCD panel surface and the bottom surface of the heating block Another object is to provide a precisely adjustable bonding pressure bonding apparatus.

In addition, the present invention is provided with a heating block of a plurality of bonding portion is reduced in size, shorten the peeling operation time for separating the ACF tape and the ACF support layer after bonding of the ACF to provide a pressure bonding bonding device that can improve productivity. There is another purpose.

AC F pressure bonding device of the present invention for achieving the above object is a coupling frame made of a vertical support and a horizontal support; An ACF supply unit coupled to the coupling frame and supplied with an anisotropic conductive film; A plurality of bonding heads coupled to the front side of the horizontal support of the coupling frame and press-bonding the substrate and the ACF film through thermal compression; A horizontal transfer device for horizontal transfer of the bonding head portion; A work table on which the substrate pressed by the bonding head is placed; And a control unit for controlling and controlling the ACF supply unit control unit, the bonding head unit, and the horizontal transfer device.

Preferably, the ACF supply unit is coupled to the supply unit coupled to the upper front surface of the vertical support; A swivel drive unit coupled to a rear side of the supply unit coupler and having a rotation shaft penetrating through the front of the supply unit coupler; A cradle extending and coupled to the rotation shaft and on which the ACF film is mounted; And a plurality of transfer rollers configured to transfer the ACF film mounted on the holder to be supplied to the bonding head.

In addition, preferably, the bonding head unit is coupled to the upper portion of the coupling frame head fixed to the transfer table for transporting in the horizontal direction; A head frame fixed to the head coupler and positioned in front of the horizontal supporter; A head cylinder fixedly coupled to an upper portion of the head frame; A head heating block unit for thermally compressing the ACF film on the substrate while driving the head cylinder by the operation of the head cylinder; A cutting unit to cut an ACF film that is thermally pressed onto the substrate to an appropriate size; And an ACF discharge part which separates the ACF support layer from the ACF film thermally compressed through the head heating block part and discharges the ACF support layer to the outside.

More preferably, the head heating block portion further includes a head flatness control unit that can adjust the parallelism of the bottom surface to be parallel to the plane of the substrate.

In addition, more preferably, the ACF discharge portion is a heat-compression through the head heating block portion, the separation portion for separating the ACF support layer from the ACF film; A tension control unit for adjusting the tension of the ACF film supplied through the ACF supply unit; A transfer unit for transferring the ACF film supplied from the ACF supply unit; And a recovery unit for recovering / discharging the ACF support layer of the ACF film transferred through the transfer unit.

More preferably, the ACF discharge unit further includes an ACF roller between the transfer unit and the recovery unit to facilitate the transfer of the ACF film.

Further, more preferably, the recovery unit includes a discharge pipe in which the ACF support layer is sucked and discharged to the outside, and vacuum means for vacuuming the inside of the discharge pipe so that the ACF support layer is sucked and discharged through the discharge pipe. It is composed.

The inventors of ACF pressure bonding bonding device is an anisotropic conductive film on glass (ACF) used for connecting, bonding, and energizing a printed circuit board (PCB) substrate and film on glass (FOG) to an LCD panel. A press-fitting apparatus, which is an AFC press bonding apparatus having four small sized bonding head portions that can be separately driven to be attached to only a portion where ACF adhesion is required.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, Figure 2 is a front structural view showing the overall structure of the AFC press bonding device according to an embodiment of the present invention, Figure 3 is a structure of the coupling frame, the bonding head portion and the ACF supply unit according to an embodiment of the present invention 4 is a partial perspective view illustrating the bonding head portion according to the embodiment of the present invention, and FIG. 5 is a front view, a plan view, and a side view showing the structure of the bonding head portion according to the embodiment of the present invention.

Referring to FIG. 2, an AFC press bonding device according to an exemplary embodiment of the present invention may include a coupling frame 100, an ACF supply unit 200, a bonding head unit 300, a horizontal transfer device 400, It is configured to include a work table 500, and a control unit (not shown).

-Coupling frame (100)

The coupling frame 100 forms an overall appearance frame of the present invention of the AF F compression bonding device, which is a pair of longitudinal support 110 located on both sides of the bonding device, and the pair of vertical support 110 It consists of a horizontal support 120 to be fixed between.

On the upper portion of the horizontal support 120, the head coupling stage 310 of the bonding head portion 300 of the bonding head portion 300 to be described below is coupled to the left and right transfer unit 130 that can be transferred. Therefore, the bonding head part 300 coupled to the head conveyer 130 may be moved left and right according to the position of the work piece placed on the workbench 500 by the operation of a linear motor (not shown) provided on the side. It becomes possible.

ACF Supply Unit (200)

2 and 3, the ACF supply unit 200 is an apparatus for supplying an ACF film 700 adhered to a PCB substrate 600 (see FIG. 6) through thermal compression of the bonding head unit 300. , It is configured to include a supply coupling table 210, a swivel drive means (not shown), the holder 220, and a plurality of feed roller 230.

The supply unit coupler 210 is coupled to the upper front surface of the vertical support 110, and preferably, two ACF films 700 are mounted on the supply unit coupler 210 and mounted.

That is, two cradles 220 on which the ACF film 700 can be mounted are provided at the upper and lower portions of the supply unit coupler 210, respectively, and have a rotation shaft 240 coupled to the holder 220. A motor (not shown) is coupled to the rear of the supply unit coupling 210.

Therefore, when the driving motor is driven by the control of a controller (not shown) of the inventors of the AC F pressure bonding device, the holder 220 is rotated by the rotation of the rotating shaft 240 ACF film 700 Will be supplied. On the other hand, the ACF film 700 is supplied to the lower surface of the head heating block portion 340 of the bonding head portion 300 while passing through a plurality of feed rollers 230 installed on the supply portion coupling table (210).

The ACF film 700 supplied through the respective ACF supply parts 200 is supplied to the bonding head part 300 in a 1: 1 ratio, which is different from the conventional structure having the ACF supply part and the discharge part, respectively. . In other words, the ACF film 700 is supplied to four bonding head parts 300 through four ACF supply parts 200, and after the ACF film 700 is bonded, the ACF film 700 is bonded. ACF support layer constituting the discharge through the ACF discharge unit 370 constituting the bonding head portion 300 to the outside in a vacuum discharge method, respectively.

Bonding head 300

4 and 5, the bonding head portion 300 is an important part of the inventors of the AC F compression bonding device, which is the ACF film 700 on the PCB substrate 600 (see FIG. 6) through thermal compression This is the part to compress.

The bonding head part 300 includes a head coupler 310, a head frame 320, a head cylinder 330, a head heating block part 340, a cutting part 350, and a head flatness adjusting part. 360, and an ACF outlet 370.

The head coupler 310 is a part for fixing and coupling the head frame 320 to the head portion carrier 130 of the coupling frame 100, preferably four bonding head portion 300 is the head It is coupled to the sub-carrier 130 to the left and right transfer as a whole by the driving of a linear motor (not shown) provided on the side of the bonding head (300).

The head frame 320 forms a whole frame of the bonding head part 300, and includes the head cylinder 330, the head heating block part 340, the cutting part 350, and the ACF discharge part ( 370) and the like.

The head cylinder 330 drives the head heating block unit 340 positioned below the head frame 320 up and down, and controls the PCB substrate by a control drive of a control unit (not shown) of an AFC press bonding device. 600, see FIG. 6) and the ACF film 700.

In addition, the width of the pressing portion of the head heating block 340 is preferably about 50 mm, which is about 600 mm, which is the width of the pressing portion of the conventional head heating block 340, due to the characteristics of the thermal pressing operation This has the advantage of reducing deformation from heat.

In addition, one side of the head heating block 340 is provided with a cutting unit 350 for cutting the ACF film 700 is bonded by bonding. Therefore, when the ACF film 700 is positioned and thermally compressed on the PCB substrate 600 (see FIG. 6), the ACF film 700 is automatically cut according to the pressing width of the head heating block 340.

In addition, a head flatness adjustment unit 360 is provided on an upper front surface of the head heating block unit 340, and the head flatness adjustment unit 360 is for adjusting the parallelism of the head heating block unit 340. . That is, the precision of parallelism is made at the time of assembly | assembly of a device, or a part replacement, and it is preferable that this head flatness adjustment part 360 is comprised by a micrometer.

The ACF discharge part 370 includes a peeling part 371, a tension adjusting part 372, a transfer part 373, and a recovery part 374.

The peeling part 371 is provided on the other side of the head heating block part 340 opposite to the cutting part 350, which is a PCB substrate 600 from an ACF film 700 composed of an ACF layer and an ACF support layer. 6, after the ACF layer is pressed, to separate the ACF support layer. The separated ACF support layer is discharged to the outside through the recovery unit 374 to be described later.

The tension control unit 372 is to adjust the tension of the ACF film 700 supplied through the ACF supply unit 200, and prevents being hit down during the transfer of the ACF film 700, preferably This tension adjusting unit 372 is configured to include a small rotating roller 373a.

The transfer unit 373 is to transfer the ACF film 700 supplied through the ACF supply unit 200, the transfer unit 373 rotates the rotary roller 373a and the rotary roller 373a to the ACF film ( It consists of a rotary motor (374b) for feeding 700. The rotation motor 374b is provided with a coupling frame 100 at the bottom rear, preferably composed of a stepping motor (Stepping Motor).

The recovery unit 374 is for discharging the ACF support layer separated from the ACF film 700 to the outside, which is through the discharge pipe 374a and the discharge pipe 374a for sucking and discharging the ACF support layer to the outside. It consists of a vacuum means (not shown) to make the inside of the discharge pipe 374a into a vacuum state so that the ACF support layer is sucked out and discharged.

The discharge pipe 374a is fixedly coupled to one side of the coupling frame 100, and the inlet of the discharge pipe 374a is provided with an ACF roller 375 for guiding the ACF support layer to be sucked smoothly into the discharge pipe 374a. have.

Looking at the path through which the ACF support layer passes, first through the peeling part 371 through the rotating roller 372a of the tension control unit 372, and through the rotating roller 373a of the conveying unit 373 the ACF roller ( 375 is guided into the discharge pipe 374a and finally discharged to a recovery container (not shown) which is separately provided on the rear side of the AFC press bonding device of the present invention.

Each of the bonding heads 300 configured as described above may be separately controlled and driven, thereby allowing the ACF film 700 to be pressed onto various kinds of PCB substrates 600 (see FIG. 6).

That is, the bonding head unit 300 according to the size of the PCB substrate 600 (refer to FIG. 6) may be controlled by 1 to 4 individually, so that the ACF film 700 according to the unnecessary ACF film 700 bonding operation. ), Which can reduce the production cost of the entire LCD panel and enable efficient operation of the AFC press bonding device.

In addition, the precision of the parallelism between the head heating block 340 and the PCB substrate 600 (see FIG. 6) by the head flatness adjusting unit 360, and thermal deformation reduction due to the miniaturization of the head heating block 340. The quality of the product can be improved, thereby improving the productivity of the product.

Horizontal feeder (400)

The horizontal transfer device 400 is a device for horizontally transferring the bonding head unit 300, which consists of the four, as described above, and is bonded according to the size of the PCB substrate 600 (refer to FIG. 6) placed on the work table 500. It is a device that can transfer the head portion 300 to the desired working position.

This is controllable by driving of a linear motor (not shown) for transferring the head feeder 130 which is integrally coupled with the head coupler 310 of the bonding head part 300.

Workbench (500)

The workbench 500 is a place where the PCB substrate 600 (see FIG. 6) is placed and the compression bonding of the ACF film 700 is made, which is a well-known technique and a detailed description thereof will be omitted.

Control unit (not shown)

The controller (not shown) of the AFC press bonding device according to the present invention may control the driving of the bonding head unit 300 described above.

That is, the individual cutting of the ACF film 700 according to the driving of each bonding head 300, the supply and recovery of the individual ACF film 700, the length of the individual ACF film 700 can be adjusted.

Hereinafter, the operating state of the AFC press bonding device according to the embodiment of the present invention configured as described above will be described. Of the accompanying drawings, Figure 6 is a working state diagram showing an operating state of the AFC press bonding device according to an embodiment of the present invention.

Referring to the drawings, four ACF film 700 is mounted on each of the cradle 220 of the supply unit coupler 210 provided on both sides of the vertical frame 110, respectively.

Four ACF films 700 mounted on the holder 220 are guided and supplied to the plurality of transfer rollers 230 to the bonding head 300, respectively, and the bonding head 300 is a controller (not shown). Controlled through each through, the PCB substrate 600 (see FIG. 6) and the ACF film 700 is pressed.

On the other hand, the bonding head portion 300 is moved left and right by the horizontal transfer device 400 provided on one side, it is vertical vertical drive by the head cylinder 330. Therefore, the thermocompression bonding is performed only on the portion where the pressure bonding operation is required, so that unnecessary waste of the ACF film 700 can be eliminated.

According to the AFC pressurized bonding apparatus according to the present invention as described above, it is possible to prevent excessive ACF due to unnecessary ACF bonding treatment, and to maintain the optimum bonding conditions corresponding to the structure of the various pattern portion of high quality bonding quality It can be obtained, and the manufacturing cost can be significantly reduced.

In addition, it is possible to precisely control the flatness of the LCD panel surface and the bottom surface of the heating block while reducing the thermal deformation of the heating block in which the thermal compression process is performed, thereby improving the product quality.

In addition, it is possible to shorten the peeling operation time for separating the ACF tape and the ACF support layer after bonding the ACF, thereby improving productivity.

While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

Claims (7)

A coupling frame consisting of a longitudinal support and a transverse support; An ACF supply unit coupled to the coupling frame and supplied with an anisotropic conductive film; A plurality of bonding heads coupled to the front side of the horizontal support of the coupling frame and press-bonding the substrate and the ACF film through thermal compression; A horizontal transfer device for horizontal transfer of the bonding head portion; A work table on which the substrate pressed by the bonding head is placed; And And a control unit for controlling and driving the ACF supply unit control unit, the bonding head unit, and the horizontal transfer device. The bonding head unit is coupled to the upper portion of the coupling frame head fixed to the transfer table for transport in the horizontal direction; A head frame fixed to the head coupler and positioned in front of the horizontal supporter; A head cylinder fixedly coupled to an upper portion of the head frame; A head heating block unit for thermally compressing the ACF film on the substrate while driving the head cylinder up and down by operation of the head cylinder; A cutting unit to cut the ACF film thermally pressed onto the substrate to an appropriate size; And an ACF discharge part for separating an ACF support layer from the ACF film thermally compressed through the head heating block part, and discharging the ACF support layer to the outside. The method of claim 1, The ACF supply unit is coupled to the supply unit coupled to the upper front surface of the vertical support; A swivel drive unit coupled to a rear side of the supply unit coupler and having a rotation shaft penetrating through the front of the supply unit coupler; A cradle extending and coupled to the rotation shaft and on which the ACF film is mounted; And a plurality of transfer rollers configured to transfer the ACF film mounted on the holder to be supplied to the bonding head portion. delete The method of claim 1, The ACF discharge part may be separated from the ACF film by separating the ACF support layer from the ACF film after being thermally compressed through the head heating block part. A tension control unit for adjusting the tension of the ACF film supplied through the ACF supply unit; A transfer unit which transfers the ACF film supplied from the ACF supply unit; And a recovery unit for recovering / discharging the ACF support layer of the ACF film transferred through the transfer unit. The method of claim 4, wherein The ACF discharge unit further comprises an ACF roller between the conveying portion and the recovery portion to facilitate the transfer of the ACF film AC F pressure bonding device. The method of claim 4, wherein The recovery unit is configured to include a discharge pipe that sucks the ACF support layer is discharged to the outside and the vacuum means for making the interior of the discharge pipe vacuum so that the ACF support layer is sucked out through the discharge pipe Press bonding device. The method of claim 1, And the head heating block portion further comprises a head flatness adjusting portion capable of adjusting the parallelism of the bottom surface to be parallel to the plane of the substrate.

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