KR20090019736A - Acf attaching apparatus, flat panel display manufacturing apparatus and flat panel display - Google Patents

Abstract

An ACF(Anisotropic Conductive Film) attaching apparatus, an apparatus for manufacturing a flat panel display, and a flat panel display are provided to improve adhesion between a substrate and the AFC by heating the substrate. A pressurization unit(57) pressurizes an ACF tape maintaining ACF through an exfoliation layer for a surface of substrate. A substrate reception unit supports the substrate horizontally by contacting a rear side of the substrate. A heating unit(52H) heats the substrate reception unit to a temperature not to harden the ACF thermally. The temperature is higher than the heater of the pressurization unit.

Description

ACF attachment device, flat panel display manufacturing equipment and flat panel display {ACF ATTACHING APPARATUS, FLAT PANEL DISPLAY MANUFACTURING APPARATUS AND FLAT PANEL DISPLAY}

The present invention relates to an ACF attachment device for attaching an anisotropic conductive film (ACF) to a substrate, for mounting a semiconductor circuit element such as a driver circuit on a substrate, and a flat panel display manufacturing apparatus including the ACF attachment device. A flat panel display manufactured using a manufacturing apparatus of a flat panel display.

One flat panel display is a liquid crystal display. A liquid crystal display is comprised by enclosing a liquid crystal between the liquid crystal panels which consist of two upper and lower transparent substrates. The printed circuit board is connected to the liquid crystal panel via a driver circuit, the electrode on the inner side of the driver circuit is connected to the liquid crystal panel, and the electrode on the outer side is connected to the printed circuit board. As the mounting method of the driver circuit, a tape automated bonding (TAB) method and a chip on glass (COG) method are typical. In either case, a wiring pattern is formed on at least two sides of the surface of the liquid crystal panel. And the electrode of the driver circuit are electrically connected.

ACF obtained by uniformly dispersing fine conductive particles in a tacky binder resin is used for electrical connection between the driver circuit and the liquid crystal panel substrate and between the driver circuit and the printed circuit board. By thermocompression bonding of this ACF, between electrodes is electrically connected via electroconductive particle, hardening binder resin by heating, and fixing a driver circuit to a liquid crystal panel or a printed circuit board.

In the case where the driver circuit is mounted on the liquid crystal panel by the TAB method, ACF is attached to a portion where the wiring pattern on the substrate of the liquid crystal panel is provided, and TAB is mounted on the substrate as a tape carrier package (TCP) as a driver circuit. Since ACF is an adhesive substance, it is laminated | stacked on the earth tape through a peeling layer, and this constitutes an ACF tape. Therefore, only the earth tape is peeled off and the ACF is attached to the substrate while the ACF tape is pressed against the substrate.

By the way, when ACF is peeled from an ACF tape in the state which ACF is not adhered to a board | substrate reliably, it may be attracted to a mount tape and ACF may peel from a board | substrate. The ACF is laminated on the release layer of the earth tape, and a constant adhesive force is applied between the earth tape and the ACF. When the earth tape is peeled off, the ACF is exfoliated from the substrate together with the earth tape and the ACF peels. It may become. In addition, even when the ACF is not completely peeled off, the surface may be floated, peeled off, etc., resulting in poor adhesion of the ACF as a whole. Therefore, when the ACF tape is heated and pressed onto the substrate, the entire surface of the ACF must be reliably transferred to the substrate side, and only the earth tape must be separated and peeled off reliably.

In order to raise the adhesive strength of an ACF and a board | substrate, the technique which cools the interface of an ACF and a board | substrate is disclosed by patent document 1. As shown in FIG. In patent document 1, after ACF is heated and electrodeposited to the board | substrate side, ACF is cooled and ACF is stuck to a board | substrate. Since the ACF peels from the substrate when the ACF is peeled off in a short time without being sufficiently cooled after heating, the interface between the ACF and the substrate is forcibly cooled after the thermal bonding of the ACF to increase the adhesive strength.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 11-242446

By the way, in patent document 1, in order to attach | attach ACF to a board | substrate reliably, two processes, a heating process and a cooling process, are performed. Therefore, since two steps are required, the ACF attachment step becomes complicated and the processing can not be speeded up. Moreover, since a separate independent structure is required to perform each process, the problem of complicated mechanism and high cost also arises.

Here, as ACF, generally hot melt type binder resin is used suitably. The hot-melt type binder resin maintains a high viscosity state (solid state or near solid state) at normal temperature, is heated to binder resin, and melted and spreads on the adherend. The melted and wet binder resin has adhesiveness, and a force to bond objects to each other by adhesive force acts. Therefore, the hot-melt type binder resin exhibits adhesive force at the time of heat melting.

Therefore, by heating to a certain temperature with respect to the binder resin of ACF, since a certain adhesive force acts and the adhesive force acts between ACF and a board | substrate, the adhesive tape exerts when the binder resin melts, and peels off the earth tape If it can be made stronger than the force at the time of carrying out, ACF can be transferred to the board | substrate side at the time of peeling of a mount tape. In other words, the ACF can be reliably attached to the substrate without requiring a special cooling step.

Then, an object of this invention is to attach | attach ACF to a board | substrate reliably when peeling a board | substrate tape, avoiding complicated process and expensive cost of a process and a mechanism.

The apparatus for attaching an ACF of claim 1 of the present invention comprises contacting the back surface of the substrate with pressurizing means for pressing the ACF tape holding the ACF to the surface of the substrate via the release layer of the earth tape against the surface of the substrate. And substrate receiving means for supporting the substrate in a horizontal state, and receiving side heating means for heating the substrate receiving means so as to have a temperature higher than that of the pressurizing means and at a temperature at which the ACF is not thermally cured.

In adhering the ACF to the substrate, the ACF is heated and compressed in order to heat and melt or at least soften the ACF to enhance adhesion to the substrate. Since ACF is laminated | stacked on the peeling layer of a mount tape, adhesiveness of an ACF and a mount tape becomes weak, and when ACF is heated and crimped | bonded, ACF can be attached to a board | substrate and peeling a mount tape normally. However, in order to make the adhesion of the ACF to the substrate and the peeling from the earth tape more reliable, the ACF attachment device of claim 1 is provided with receiving side heating means for heating the substrate receiving means at a higher temperature than the pressing means. Thereby, the temperature of the surface (receiving side contact surface) which contacts the board | substrate becomes higher than the surface (pressure side contact surface: surface of the side pressurized by a press means) laminated | stacked on the earth tape of ACF, and the temperature gradient You can have (勾 配). By this temperature gradient, the adhesive force of the receiving side contact surface of ACF can be made higher than the adhesive force of the pressure side contact surface. Moreover, since the pressing side contact surface of ACF is laminated | stacked on the peeling layer of the earth tape, it is easy to peel and can transfer ACF to a board | substrate reliably. In addition, since no special treatment such as cooling treatment is required, the complexity and cost of the process and the mechanism can be avoided.

The temperature of the receiving side heating means needs to be a temperature at which the ACF is not thermally cured. Since the ACF attaching step is performed before the connecting step of the driver circuit, if the binder resin of the ACF is thermoset at this stage, the conductive particles dispersed therein are covered with the thermosetting binder resin and the substrate and the driver circuit are separated. There is a possibility that it will not contribute to the electrical connection at. However, what is necessary is just the temperature which ACF will not thermoset, for example, when heating a board | substrate in a short time etc., you may heat the temperature of a receiving side heating means to the thermosetting temperature of ACF or its vicinity.

The ACF attachment device of claim 2 of the present invention is characterized in that the attachment device according to claim 1 has a pressing side heating means for heating the pressing means such that the pressing means has a temperature equal to or higher than room temperature.

According to the ACF attachment device of claim 2, the pressure side heating means heats the pressure means, so that the temperature of the pressure means also increases. When the pressurizing means is in a low temperature state, heat of the ACF is absorbed by the pressurizing means and the temperature of the ACF is lowered. In addition, in order to speed up the process, the ACF must be quickly melted, so that the pressurizing means can also be heated to quickly melt the ACF. However, in order to have a temperature gradient between the pressing side contact surface and the receiving side contact surface of the ACF, the pressing side heating means performs heating at a temperature not so high (preferably slightly higher than normal temperature). Do it.

In the ACF attachment device of Claim 1, the ACF attachment device of Claim 3 forms a plurality of electrode groups on the said board | substrate, and supplies it from the supply reel which supplies an ACF tape, and is sent out from this supply reel. A half cut means for cutting the ACF held by the ACF tape for each of the electrode length groups of the substrate is provided, and the pressing means is configured to have an adhesion length amount of the ACF for at least each electrode group. The ACF is individually attached to each electrode group of the substrate.

As a method of attaching the ACF to the substrate, the bulk attachment for attaching the ACF to the entire length of one side of the substrate at a time is mainstream, but the division for dividing the ACF separately by dividing the electrode groups separately as in the ACF attachment apparatus of claim 3 It can also be attached. In the fine pitch electrode formed on the substrate, a predetermined number of electrodes constitute a group as a group for each driver circuit, and each electrode group has a blank region formed between adjacent electrode groups. Since there is no need to attach the ACF to the blank area, by adopting split adhesion where the ACF is not attached to the unnecessary blank area, waste material is prevented from occurring, and the adhesive resin and the conductive particles constituting the ACF are formed in the blank area. By exposing, it can avoid that a disadvantage arises by the process and the process after mounting a driver circuit.

In the case of the divided attachment, it is operated to pull up the earth tape, and the peeling is performed by rubbing the ACF from the earth tape. For this reason, the action of the force to peel from a board | substrate becomes large in ACF at the time of peeling a mount tape. For this reason, a board | substrate can be peeled in the state which affixed ACF to a board | substrate reliably by heating a board | substrate by receiving side heating means and making the adhesive force of the receiving side contact surface of ACF strong.

The ACF attachment device according to claim 4 of the present invention is the ACF attachment device according to claim 3, wherein the substrate receiving means is configured to have an attachment length of the ACF to at least each electrode group so as to face the pressing means. And a receiving side elevating driving means for driving the substrate receiving means so as to perform the elevating operation independently in the direction of approaching and separating from the pressing means.

According to the ACF attachment apparatus of Claim 4, the board | substrate receiving means is made to raise and lower the length of the board | substrate receiving means about one ACF attachment length. Therefore, by pressing the ACF by the lifting operation of both the substrate receiving means and the pressing means, it is possible to apply a uniform pressing force over the entire front surface. This has the effect of avoiding the occurrence of adhesion failure.

The ACF attachment apparatus of Claim 5 is comprised so that the said board | substrate receiving means may be in the fixed state so that it may have a length which affects the full length of the said board | substrate. It is characterized by the above-mentioned.

According to the ACF attachment apparatus of Claim 5, the length of a board | substrate receiving means is made into the length which extends to the full length of a board | substrate, and a board | substrate receiving means is fixed. For this reason, only the pressing means performs the lifting operation, and the substrate receiving means can be brought into contact with the substrate at all times. Therefore, when pressing by the pressing means, since the substrate is already in a heated state, the temperature of the receiving side contact surface of the ACF can be quickly brought to a high temperature state. Thereby, the efficiency of a process can be aimed at. Moreover, since the board | substrate and the board | substrate receiving means are always in contact with each other, the temperature distribution of a board | substrate can be made uniform. Therefore, stable temperature management can also be performed.

The manufacturing apparatus of the flat panel display of Claim 6 of this invention has the ACF attachment apparatus in any one of Claims 1-5. Moreover, the flat panel display of Claim 7 of this invention is manufactured by the manufacturing apparatus of the flat panel display of Claim 6. The ACF attachment device can be applied to an apparatus for manufacturing flat panel displays, and the flat panel display can be applied to liquid crystal displays, plasma displays, organic EL displays, and the like.

In this invention, the board | substrate is heated by providing a receiving side heating means, and the adhesive force between a board | substrate and ACF is made high by heating the receiving side contact surface of ACF which contact | connects a board | substrate. Thereby, ACF can be reliably attached to a board | substrate at the time of peeling of a mount tape, without requiring a cooling process or a cooling mechanism.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. First, a liquid crystal panel is shown as an example of the board | substrate with ACF shown in FIG. 1, and the driver circuit which consists of TCP mounted TAB on a board | substrate is shown as an example of the semiconductor circuit apparatus mounted via ACF. In addition, the substrate may not only constitute a liquid crystal panel, but also may be other display substrates or other various printed circuit boards, and the substrate mounted on the substrate is not limited to a driver circuit, but is electrically connected through an ACF. do.

In FIG. 1, 1 is a liquid crystal panel, and this liquid crystal panel 1 is comprised from the base board 2 and the said board | plate 3 which consist of glass thin plates, and both board | substrates 2 And 3) are filled with a liquid crystal. The driver board which protrudes from the said board 3 by the predetermined width in at least two sides, and has the integrated circuit element 4b attached to the film board 4a in the protrusion part 2a at least in the 2nd board | substrate. A plurality of (4) are mounted.

The projecting portion 2a of the lower substrate 2 is provided with a predetermined number of electrodes connected to wirings respectively connected to TFTs (Thin Film Transistors) formed at portions where the substrates 2 and 3 overlap each other. In these electrodes, as indicated by reference numeral 5 in the figure, a predetermined number of electrodes are formed as a group for each mounting portion of the driver circuit 4. And alignment marks 6a and 6a are formed in the left and right both sides of each electrode group 5. Therefore, a blank area having a predetermined width is formed between the electrode groups 5 and 5 adjacent to each other. On the other hand, the driver circuit 4 is provided with the some electrode electrically connected with each electrode which comprises these electrode groups 5, and the electrode group connected with the electrode group 5 is shown with the code | symbol 7. As shown in FIG. Moreover, in the driver circuit 4, alignment marks 6b and 6b are formed on both left and right sides of the electrode group 7, and when the driver circuit 4 is mounted on the liquid crystal panel 1, these alignment marks are referred to as a reference. Position adjustment is performed so that each electrode which comprises the electrode group 7 and each electrode which comprises the electrode group 5 correspond.

The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 8. As is well known, the ACF 8 is obtained by dispersing a large number of minute conductive particles in a binder resin having an adhesive function, and heating and heating the ACF 8 between the driver circuit 4 and the liquid crystal panel 1. By pressurizing, each electrode constituting the electrode group 5 and the electrodes constituting the electrode group 7 are electrically conductive through the conductive particles, and the binder resin is thermally cured. 4) is fixed to the liquid crystal panel 1. Here, the ACF 8 is divided for each position of the electrode group 5 provided in the protruding portion 2a of the base plate 2, and is attached for each length L amount. Thereby, the ACF 8 can be used without waste, and the attached ACF 8 is almost completely covered by the driver circuit 4.

2 to 4 show a schematic configuration of an attachment mechanism for attaching the ACF 8 to the protrusion 2a of the base plate 2. In these figures, 9 is a support base for keeping the liquid crystal panel 1 in a horizontal state. The liquid crystal panel 1 is stably held on the support base 9 by, for example, vacuum suction means. Here, although the liquid crystal panel 1 abuts on the support base 9 in a large area, the lower position of the protrusion part 2a of the base board 2 to which the ACF 8 is attached is open. Here, the support base 9 can be provided with a position adjusting means in the X, Y, and θ directions for alignment with the driver circuit 4 or the like.

In addition, 10 is an attachment unit with respect to the liquid crystal panel 1 of the ACF 8, This attachment unit 10 is comprised from the board body provided in the perpendicular direction, and the supply reel 11 is detachable. It is equipped. The ACF 8 is laminated on the release layer of the earth tape 12 to constitute the ACF tape 13, and the ACF tape 13 is wound on the supply reel 11. The ACF tape 13 is guided along the travel route consisting of the rollers 14 to 17 attached to the attachment unit 10. In addition, 18 is a drive roller, and it drives so that the earth tape 12 after attaching the ACF 8 to the liquid crystal panel 1 may be hold | maintained and sent to the discharge part 19. FIG.

The rollers 14 and 15 are guide rollers for a feeder of the ACF tape 13, and the guide rollers 15 are attached to the swing arm 20, which swings the pivot shaft 21. It is tossed around the center. Driving means (not shown), such as a motor, is connected to the rotational shaft 21, and when the swing arm 20 swings in the direction of an arrow F, at least one attachment amount from the supply reel 11, that is, FIG. The ACF tape 13 of length L shown by the figure is sent out, and is supplied between the rollers 14 and 15. FIG. As a result, the reaction force acting at the time of sending the ACF tape 13 is always constant, and the resistance to the conveying force does not change due to the difference in the winding amount of the supply reel 11.

5 and 6, the rollers 16 and 17 guide the ACF tape 13 in the horizontal direction in the traveling path thereof, and once in the liquid crystal panel 1 of the ACF 8. It is a horizontal guide roller that defines the length of attachment. The horizontal guide roller 17 defines the attachment start position of the ACF 8, and the horizontal guide roller 16 defines the attachment end position of the ACF 8, whereby the attachment region of the ACF 8 is set. do. These horizontal guide rollers 16 and 17 form flange parts 16b and 17b in the both side parts of the cylindrical parts 16a and 17a, as is evident from FIG. 6, and this flange part 16b The height of the portion protruding from the cylindrical portions 16a, 17a of 17b is approximately equal to, or slightly larger than, the thickness of the earth tape 12 on the ACF tape 13.

Thus, the ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16 and 17, and then separated from the mounting tape 12. FIG. And at the position downstream from the horizontal guide roller 17, the mounting tape 12 after ACF 8 peels is collect | recovered. The driving roller 18 is provided at a position downstream from the attachment region of the ACF 8 partitioned by the horizontal guide rollers 16 and 17. The drive roller 18 is comprised by the drive roller 18a and the pinch roller 18b, and the mount tape 12 is pinched | interposed and held between these drive roller 18a and the pinch roller 18b. By rotationally driving the drive roller 18a, the ACF tape 12 is pitch-feeded every length L amount.

As is apparent from FIG. 3, the attachment unit 10 is mounted to the lift drive unit 22, and the lift drive unit 22 is mounted to the front-rear drive unit 23, and the front-rear drive unit 23 carries the conveying means. It is attached to the parallel copper drive part 24 which comprises. By these mechanisms, the attachment region of the ACF 8 defined by the horizontal guide rollers 16-17 (see Fig. 2) in the wiring path of the ACF tape 13 is moved up and down, that is, in the Z-axis direction, It is movable in the X-axis direction (direction perpendicular to the string of the electrode group 5) and the Y-axis direction (row direction of the electrode group 5) in the horizontal plane. On the other hand, the liquid crystal panel 1 is fixedly held by the vacuum suction on the support base 9.

Here, although it is necessary to adjust the relative position of the ACF tape 13 between the horizontal guide rollers 16-17, and the electrode group 5 in the base board 2, the front-back drive part 23 is affixed zero. The reverse direction is moved in a direction in which the liquid crystal panel 1 is close to and separated from the liquid crystal panel 1, and the parallel copper driving unit 24 is a direction parallel to the row direction of the electrode group 5 in the liquid crystal panel 1, that is, the Y axis direction. Since the attachment area is moved in the above manner, the position can be adjusted on the attachment unit 10 side. However, as described above, when the position adjustment means in the X, Y, and θ directions is provided on the support base 9 It can also be aligned with respect to the ACF tape 13 at this support base 9 side.

The lift drive unit 22 includes the inclined block 30 and a cylinder 31 to move the inclined block 30 in the front-back direction. Moreover, the slide unit 32 which engages with the inclined surface of the inclined block 30 is connected to the attachment unit 10, This slide member 32 has the inclined surface matching with the inclined block 30, and is a regulation rod. By (33), it is the structure which cannot be displaced except an up-down direction. Accordingly, by driving the cylinder 31, the attachment unit 10 is displaced in the vertical direction. Here, a motor may be used instead of the cylinder 31.

Next, the front-rear drive unit 23 is for moving the pedestal 34 on which the inclined block 30 is mounted, and the reciprocating motion of the pedestal 34 is a drive made of a cylinder, a motor, or the like. By the means 35. And the parallel drive part 24 has the conveyance base 36 which mounted the base 34 and the drive means 35, The conveyance base 36 has the ball screw 37 which comprises a ball screw feed means. By rotationally driving with the motor 38, the attachment unit 10 can be moved in parallel with the arrangement direction of the electrode group 5 in the liquid crystal panel 1.

In the traveling path of the ACF tape 12 attached to the attachment unit 10, as shown in FIG. 8, the half cut means 40 is provided in the position slightly downstream from the position of the horizontal guide roller 16, This half-cut means 40 is attached to the surface of the attachment unit 10 so as to reciprocate in the front-rear direction. This half cut means 40 is provided with the cutter 41 and the cutter base 42 as shown in FIG. 7, and the cutter 41 centered on the axis 43 as shown by the arrow in FIG. It is possible to rotate in the direction close to and away from the cutter base 42. And, normally, it is maintained in the state separated from the cutter base 42 by the biasing force of the spring 44 which acts on the cutter 41, and the pressurization provided in the cylinder 45 was carried out. The roller 46 presses the cutter 41 in a direction that resists the spring 44, and causes a swing displacement in a direction close to the cutter receiver 42. At the position where the cutter 41 is closest to the cutter receiver 42, an interval equal to or slightly shorter than the thickness of the earth tape 12 of the ACF tape 13 is formed therebetween. As a result, only the ACF 8 is half-cut.

In addition, in order to attach the ACF 8 to the protruding portion 2a of the base plate 2, the ACF tape 13 is formed on the surface of the base plate 2 at a position between the horizontal guide rollers 16 and 17. It is crimped by the preset pressing force. For this reason, as shown to FIG. 8 and FIG. 9, the crimping head 50 is provided in the attachment unit 10. FIG. Here, although the liquid crystal panel 1 is mounted on the support base 9, the protrusion part 2a of the base board 2 is pushed out from the support base 9, and the crimping head 50 is This pushed-out part is clamped from above and below.

The press head 50 is comprised from the press blade 51 as a press means, and the receiving blade 52 as a board | substrate receiving means, These press blades 51 and the receiving blade 52 are the lifting blocks 53, respectively. 54, and these elevating blocks 53 and 54 are attached to the up-down direction along the pair of guide rails 55 provided in the attachment unit 10 so that displacement is possible. These press blades 51 and receiving blades 52 are arranged up and down with the liquid crystal panel 1 interposed therebetween, and are formed in the same length. The press blade 51 is further disposed at a position above the ACF tape 13 which is guided between the horizontal guide rollers 16 and 17 and travels in the horizontal direction. In addition, although the elevating blocks 53 and 54 are made to elevate the common guide rail 55, you may make it provide the independent guide rail corresponding to each elevating block 53 and 54. As shown in FIG.

The lifting block 54 on which the receiving blade 52 is mounted is subjected to a stroke lifting operation predetermined by the cylinder 56. That is, when the cylinder 56 is in a reduced state, the receiving blade 52 is lowered and disposed at a lower position separated from the liquid crystal panel 1. When the cylinder 56 is extended, the receiving blade 52 is extended. Is in contact with the lower surface of the liquid crystal panel 1. On the other hand, the pressurizing means 57 is attached to the lifting block 53 on which the press blade 51 is attached. The illustrated pressurizing means 57 has a feed screw 57a driven by a motor, and constitutes a so-called jack. The pressurizing means 57 moves the lifting block 53, which is connected to the pressing blade 51 and installed up and down along the guide rail 55, to be received on the receiving blade 52. Is to apply a predetermined pressing force from the top. And the press blade 51 and the receiving blade 52 are comprised so that exact parallelism may be maintained. In addition, the cylinder 56 supporting the receiving blade 52 has a pressure that can be maintained in the extended state without introducing the cylinder 56 at an upward stroke end position by the pressing force acting by the pressing means 57. .

The pressurizing side 51 and the receiving side heater 52H serving as the receiving side heating means are incorporated in both the pressing blade 51 and the receiving blade 52 constituting the crimping head 50, respectively. Doing. The presser blade 51 is heated by the heat of the pressurized heater 51H, and the receiver blade 52 is heated by the heat of the receiver-side heater 52H. The heating temperature of the receiving side heater 52H is set higher than the heating temperature of the pressurizing side heater 51H. For this reason, the receiving blade 52 is at a higher temperature than the press blade 51. The pressurized side heater 51H and the receiving side heater 52H are heat sources, and for example, electric power from a power supply source (not shown) is converted into thermal energy to generate heat.

Therefore, the ACF tape 13 is thermocompression-bonded to the liquid crystal panel 1 in the vertical direction by the heated press blade 51 and the receiving blade 52. The temperature which the receiving side heater 52H heats is set so that it may become the temperature which ACF8 does not thermoset. Therefore, the temperature is not set at such a high temperature but is set at a temperature (for example, around 140 ° C) at which the binder resin of the ACF 8 melts and exhibits adhesive force. On the other hand, the temperature at which the pressurized side heater 51H heats is lower than the temperature at which the receiving side heater 52H heats, and the temperature at which the temperature of the heated ACF 8 is not lowered (for example, around 50 ° C). Set to). And the press blade 51 and the receiving blade 52 which comprise the crimping head 50 have the width dimension which can fully cover the width of the ACF tape 13, and the dimension of a longitudinal direction is at least ACF It shall have an attachment length L of (8).

As described above, the attachment unit 10 is equipped with a supply reel 11, a traveling path of the ACF tape 13 supplied from the supply reel 11, a half cut means 40, and a crimping head 50. It is. By this ACF attachment device, the ACF required for mounting the driver circuit 4 on the electrode group 5 in which a predetermined number is formed in the protrusion 2a on the base plate 2 of the liquid crystal panel 1 ( 8) is attached.

Thus, on the support base 9, the liquid crystal panel 1 to which the ACF 8 is affixed is arrange | positioned in the horizontal position at the predetermined position, and it is hold | maintained and held. In this state, the projecting portion 2a shown in FIG. 4 protrudes from the support base 9 on the base plate 2 of the liquid crystal panel 1, and the number of driver circuits preset in the projecting portion 2a ( 4) is mounted. For this reason, the pitch feed is performed by the ball screw 37 in the direction of an arrow for every pitch interval P shown in FIG.

Although the ACF 8 of length L is attached to the liquid crystal panel 1 one by one, for this reason, the conveyance base 36 which comprises the parallel motion drive part 24 is driven, and the attachment area | region 10 with which the attachment unit 10 was preset. Displace in At this time, as shown by the arrow in FIG. 8 and FIG. 9, the attachment unit 10 is held in the raised position by the lift drive unit 22. The presser blade 51 which comprises the crimping head 50 is hold | maintained in a raise position, and the receiving blade 52 is kept in a lowered position. As a result, these pressing blades 51 and the receiving blades 52 are held in a non-contact state with the liquid crystal panel 1, so that the attachment unit 10 is smoothly moved, and the liquid crystal panel 1 is damaged. There is no such thing as giving. In addition, since the ACF tape 13 is separated from the liquid crystal panel 1, the half cut means 40 does not interfere with the liquid crystal panel 1 even when the half cut means 40 protrudes forward from the surface of the attachment unit 10. Therefore, the half cut of the ACF tape 13 is performed. By performing this half cut, the half-cut position of the ACF tape 13 becomes an attachment end position, and the edge part which attached the ACF 8 last time is an attachment start end position. That is, the horizontal guide roller 17 is arrange | positioned at the attachment start end position, and the horizontal guide roller 16 is arrange | positioned at the attachment end position.

Thereafter, after the half cut means 40 is evacuated, the lifting unit 22 lowers the attachment unit 10 as indicated by the arrows in FIGS. 10 and 11, and is horizontal in the ACF tape 13. The site | part between the guide rollers 16 and 17 is arrange | positioned in the position near the surface of the base board 2 of the liquid crystal panel 1. Thereafter, the cylinder 56 is operated to raise and lower the lifting block 54 to bring the receiving blade 52 into contact with the rear surface of the liquid crystal panel 1 as shown in FIGS. 12 and 13. When the receiving blade 52 is brought into contact with the rear surface of the liquid crystal panel 1, the receiving blade 52 is heated by the receiving heater 52H, so that the receiving blade 52 is fitted to the lower substrate 2. At the point of contact, the base plate 2 made of a thin glass plate is heated to a high temperature state.

Here, the receiving blade 52 does not affect the entire length of the liquid crystal panel 1, but is limited to a position corresponding to an area to which the ACF 8 is attached in one operation. Subsequently, as shown by the arrows in FIGS. 14 and 15, the pressing means 57 is operated to lower the pressing blade 51 and press the earth tape 12 of the ACF tape 13 to press the ACF 8. ) Is pressed onto the substrate (2).

When the pressure blade 51 presses the ACF tape 13, the pressure blade 51 and the ACF tape 13 come into contact, but the pressure blade 51 is heated by the pressure side heater 51H. Since it is in the state heated to some extent, heat is transmitted also to the peeling layer of the earth tape 12. FIG. Depending on the type of mounting tape 12, the ACF 8 may be easily peeled from the peeling layer of the mounting tape 12 by applying heat to the release layer. For this reason, heat is given to the peeling layer of the mount tape 12, and the adhesive force of the ACF 8 and the mount tape 12 is weakened, and it becomes a state which can be peeled easily.

And in this state, the ACF tape 13 is crimped | bonded to the base board 2 by the press blade 51. As shown in FIG. Since the lower plate 2 is in a high temperature state by heating the receiving heater 52H, heat is transferred to the ACF 8 and starts to melt. At this time, since the ACF 8 is a thin film and has a predetermined thickness, the ACF 8 is gradually melted at the receiving side contact surface of the ACF 8 (abutment surface of the ACF 8 with the substrate 2). The receiving side abutting surface side is higher in temperature, and the pressure side abutting surface side (the surface laminated on the earth tape 12 of the ACF 8) generates a temperature gradient at which the temperature is lower. As this surface melts, the viscosity of the binder resin decreases, soaks into the base plate 2 and at the same time exerts an adhesive force. In this case, the adhesive force acts between the ACF 8 and the lower substrate 2, so that both are in close contact.

On the other hand, since the press blade 51 is also heated by the pressurized side heater 51H, heat is transmitted also to the pressurized side abutting surface of the ACF8. However, since the pressure side heater 51H is heating at a temperature low enough not to lower the temperature of the ACF 8, even if heat is transmitted to the pressure side contact surface of the ACF 8, this surface is maintained. It does not melt so much. Therefore, the adhesive force which acts between the ACF 8 and the mounting tape 12 is small. On the contrary, it is easy to peel easily by heating a peeling layer.

In order to apply the predetermined pressing force to the liquid crystal panel 1 by the pressing blade 51, the feed screw 57a constituting the pressing means 57 is driven. Here, the base plate 2 of the liquid crystal panel 1 is composed of a thin glass plate, and the pressing blade 51 and the receiving blade 52, which are allowed to be deformed to a certain degree and have the same length and exactly parallelity, are maintained. It is kept sandwiched between. Therefore, when hold | maintaining in this way, the site | part held in the liquid crystal panel 1 will mimic the crimping head 50 which consists of these press blade 51 and the receiving blade 52. As shown in FIG. In addition, since both the press blade 51 and the receiving blade 52 are substantially limited to a portion from the attachment start end position to the end position of the ACF tape 13, the press blade 51 is attached to the ACF tape 13. Evenly, the pressing force is applied to the entire abutting portion against the), and the pressing force is not applied to the base end side than the half-cut attachment end position where the ACF 8 is present.

When the ACF 8 is pressed against the base plate 2, the pressing force against the ACF tape 13 by the crimping head 50 is released. Next, the cylinder 56 is driven to displace the receiving blade 52 to the lowered position. Thereafter, the lift drive unit 22 is raised, but at this time, as shown by the arrow in FIG. 16, the front and rear drive unit 23 is driven together with the lift drive unit 22 to the width direction of the ACF tape 12. When operated to be pulled upward at an angle, the earth tape 12 is peeled off by being rubbed off from the ACF 8.

When the ACF 8 is separated, the ACF 8 is rubbed off and peeled off. Therefore, the ACF 8 is attracted to the earth tape 12 and the force peeled off from the base plate 2 [ The force pulled upwards obliquely with the earth tape 12 greatly acts. However, as a state of ACF 8 at this time, the receiving side contact surface is in a state of being in close contact with the base plate 2 by adhesive force, and the pressing side contacting surface is in a state of being easy to peel off from the earth tape 12. As a result, the ACF 8 is securely attached to the base plate 2.

By the above, attachment of the ACF 8 is completed with respect to one electrode group 5 in the protrusion part 2a of the base board 2. The attachment unit 10 is held at the raised position, the driving roller 18 is operated, and the ACF tape 13 is taken out from the supply reel 11 and sent by one pitch amount. Then, the parallel copper drive unit 24 is operated to move the attachment unit 10 by one pitch amount, that is, by the amount indicated by the interval P in FIG. And the substrate support 9 which holds the liquid crystal panel 1 does not move. In this state, the ACF 8 is attached to the electrode group 5 sequentially by repeating the same operation as described above.

Here, the presser blade 51 and the receiving blade 52 employ | adopt a lift drive by the lifting block 53, 54, respectively. Therefore, these lifting blocks 53 and 54 move up and down along the guide rail 55 provided in the attachment unit 10, and the press blade 51 and the receiving blade 52 always maintain the parallel degree correctly. The lower plate 2 is sandwiched and held from above. In the case where n electrode groups 5 are formed in the liquid crystal panel 1, the distance from the position where the first ACF 8 is attached to the position where the final ACF 8 is attached is as much as the distance n · P. The ACF 8 is compressed under approximately the same conditions. Therefore, even in the case of a large size liquid crystal panel 1 as well as a small size, the ACF 8 can be attached to all the electrode groups 5 by an equal pressing force, and no crimping failure occurs. In addition, although it is made to guide both lifting blocks 53 and 54 to the same guide rail 55, it is not necessarily necessary to share the guide rail 55.

On the other hand, as shown in FIG. 17, the receiving blade 152 is attached to the support base 9, the receiving blade 152 is arrange | positioned at the same height position as the support base 9, and the base board 2 It can also be configured to have a length that affects the entire length of. Then, the receiving side heater 152H is provided so as to extend to the entire length of the receiving blade 152. In this case, while the liquid crystal panel 1 is mounted on the support base 9, it is always in a heated state, and only the press blade 51 performs the lifting operation. By configuring the receiving blade 152 in this manner, stable temperature management and speeding up of processing can be achieved.

That is, since the receiving blade 152 is fixed, the base plate 2 can be brought into contact with the receiving blade 152 at all times. Since the receiving blade 152 is heated by the receiving heater 152H, the base plate 2 which always comes into contact with the receiving blade 152 is also always in a heated state. In addition, since the receiving blade 152 has a length that affects the entire length of the lower substrate 2, the portion of the lower substrate 2, on which the electrode group 5 is formed, has a uniform temperature distribution over the entire length. It is heated. For this reason, stable temperature management is attained. In addition, since the lower plate 2 is always in a heated state, time for heating the lower plate 2 is not required. Therefore, the ACF 8 can be attached quickly, which contributes to speeding up the processing. Therefore, it is possible to arbitrarily select whether to set the receiving blade 152 to move up or down or to be fixed.

Moreover, in the above, the mechanism which divides and attaches ACF has been demonstrated, but this invention is applicable also to the mechanism which performs a batch attachment. In the case of split adhesion, the dimension of ACF is made into the length of adhesion for every electrode group, but in the case of package adhesion, it is made into the length of length which affects the full length of a base board. Also in the case of package attachment, since ACF needs to be peeled from a mount tape, the force which peels from a base board at the time of peeling of a mount tape acts on ACF. Therefore, when the base plate is heated by the receiving heater, when the adhesive force is applied between the base plate and the ACF to bring the two into close contact, the ACF is reliably attached to the base plate even in the case of batch attachment. The earth tape can be peeled off.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view of the principal part which shows the liquid crystal cell as a board | substrate with ACF, and the driver circuit mounted on this board | substrate.

2 is a front view showing a schematic configuration of an ACF attaching machine;

3 is a left side view of FIG. 2;

4 is a plan view of FIG.

5 is a configuration explanatory diagram of a horizontal feed roller;

6 is a side view showing the configuration of a horizontal feed roller;

7 is a configuration explanatory diagram of a cutter unit;

8 is an enlarged front view of an essential part of an ACF attaching machine showing a half cut state of an ACF tape;

9 is a left side view of FIG. 8;

10 is an enlarged front view of the main part of the ACF attaching machine showing the lowered state of the attaching unit;

11 is a left side view of FIG. 10;

12 is an enlarged front view of the main part of the ACF attaching machine showing the raised state of the receiving blade;

FIG. 13 is a left side view of FIG. 12;

14 is an enlarged front view of an essential part of an ACF attaching machine showing a compressed state of an ACF tape;

15 is a left side view of FIG. 14;

Explanatory drawing which shows the state which peeled the earth tape of ACF tape,

It is explanatory drawing which shows the other example of a receiving blade.

Claims (7)

Pressing means for pressing the ACF tape holding the ACF to the surface of the substrate, against the surface of the substrate via the release layer of the earth tape; Substrate receiving means for supporting the substrate in a horizontal state by abutting the back surface of the substrate; And a receiving side heating means for heating the substrate receiving means so that the temperature is higher than the pressurizing means and the temperature at which the ACF is not thermally cured is provided. The method of claim 1, And a pressurizing side heating means for heating the pressurizing means such that the pressurizing means has a temperature equal to or higher than room temperature. The method of claim 1, Forming a plurality of electrode groups on the substrate, A supply reel for supplying an ACF tape, and half cut means for cutting the ACF held in the ACF tape sent out from the supply reel for each attachment length of the electrode groups of the substrate, The pressing means is configured to have a length of attachment of the ACF to at least each electrode group, ACF attachment device characterized in that the ACF is individually attached to each electrode group of the substrate. The method of claim 3, wherein The substrate receiving means is configured to have an attachment length of ACF to at least each electrode group, And a receiving side elevating driving means for driving the substrate receiving means so as to face the pressing means so as to independently move in the direction close to and separated from the pressing means. The method of claim 3, wherein The board | substrate receiving means was comprised so that it might be in the fixed state so that it may have a length which affects the full length of the said board | substrate, The ACF attachment apparatus characterized by the above-mentioned. The manufacturing apparatus of the flat panel display which has an ACF attachment apparatus as described in any one of Claims 1-5. The method of claim 6, A flat panel display, which is manufactured by a manufacturing apparatus of a flat panel display.

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