JP2010225924A - Device and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device with reduced thermal influence exerted to an electronic component, when the electronic component temporarily pressure-bonded to a substrate by an adhesive tape is finally pressure-bonded onto the substrate. <P>SOLUTION: The mounting device has a retaining table 11 to retain the substrate W, with its side projecting outward and movably formed in the vertical direction and with a tape-carrier package (TCP 13) temporarily pressure-bonded thereto; and a supporting surface 20 for supporting the TCP temporarily pressure-bonded to one side of the substrate retained by the retaining table. Further, the device is equipped with a fixing tool 19 with the supporting surface heated at a first temperature; and a pressing tool 16 drivably mounted in the vertical direction at the position facing the fixing tool, with a pressing surface 15 heated at a second temperature higher than the first temperature, for pressure-heating the other side corresponding to the side on which the TCP of the substrate supported by the supporting surface is temporarily pressure-bonded, and for melting to cure the adhesive tape 12 to finally pressure-bond the TCP to the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a substrate by melting and curing a thermosetting adhesive tape.

  For example, a TCP (Tape Carrier Package), which is an electronic component, is mounted on the side of a liquid crystal cell as a substrate. The liquid crystal cell is configured by adhering two glass plates at a predetermined interval via a sealing agent, enclosing liquid crystal between these glass plates, and attaching a polarizing plate to the outer surface of each glass plate. The

  An anisotropic conductive pressure-sensitive adhesive tape formed of a thermosetting resin is attached to the upper surface of the side portion of the liquid crystal cell having the above configuration over almost the entire length of the side portion. A plurality of TCPs are temporarily pressure-bonded to the adhesive tape at predetermined intervals.

  The temporarily pressure-bonded TCP is finally pressure-bonded by a mounting apparatus. As is well known, this mounting apparatus has an apparatus main body, and this apparatus main body is provided with a backup tool and a crimping tool driven in the vertical direction above the backup tool.

In the liquid crystal cell in which the TCP is temporarily pressure-bonded by the adhesive tape, the lower surface of the side portion is supported by the upper end surface of the backup tool. Then, the crimping tool is driven in the downward direction, and the TCP is pressurized and heated by the pressing surface of the crimping tool. Thereby, the adhesive tape is melt-cured, and the TCP is finally press-bonded, that is, mounted on the liquid crystal cell.
Such a mounting apparatus is shown in Patent Document 1.

  When the TCP is pressure-bonded to the liquid crystal cell, the pressure tool is heated to a temperature at which the adhesive tape can be melt-cured, for example, a high temperature of about 350 ° C. On the other hand, when the heating tool pressurizes and heats the adhesive tape, the backup tool that receives the substrate is a temperature at which the heat of the pressing tool is difficult to escape by being transmitted through the backup tool, and is sufficiently lower than the pressing tool. It is heated to a temperature, for example, about 80 ° C.

JP 2002-246422 A

  In the mounting apparatus having the above-described configuration, when the pressure-bonded TCP is temporarily bonded to the liquid crystal panel, first, the lower surface of the portion where the TCP of the liquid crystal cell is mounted is supported by the upper end surface of the backup tool. Next, the TCP temporarily press-bonded to the upper surface of the liquid crystal cell with an adhesive tape is pressurized and heated by the pressing surface of the pressing tool.

  The pressurizing tool heats the TCP at a high temperature of about 350 ° C. as described above. TCP is formed of a resin such as polyimide. Polyimide has a coefficient of thermal expansion as large as about 50 times that of a glass liquid crystal cell.

  Therefore, when TCP is pressure-bonded to the liquid crystal cell, if the TCP is heated to a high temperature by a pressurizing tool, it is provided in the terminal provided in the TCP and the liquid crystal cell due to the difference in thermal expansion coefficient between the TCP and the liquid crystal cell. There may be a shift in the connected terminals. In particular, since the terminal spacing provided in the TCP and the liquid crystal cell has been miniaturized recently, even if a slight shift occurs between the terminals of the liquid crystal cell and the TCP, there is a risk of causing a mounting failure.

  In addition, if the TCP continues to be heated to a high temperature by a pressure tool, the degree of softening of the polyimide, which is the material forming the TCP, increases, and the shape of the TCP may be impaired.

  This invention can suppress that an electronic component is heated to a high temperature by a pressurizing tool when the electronic component temporarily press-bonded to the substrate by an adhesive sheet is pressed with a pressurizing tool and finally pressed. Another object of the present invention is to provide an electronic component mounting apparatus and mounting method.

This invention is an electronic component mounting apparatus for temporarily bonding an electronic component temporarily bonded with a thermosetting adhesive tape to one surface of a side portion of a substrate by melting and curing the adhesive tape.
A holding table that is provided so as to be capable of being driven in the vertical direction and that holds the substrate by projecting a side portion on which the electronic component is temporarily crimped;
A fixing tool that has a support surface for supporting the electronic component temporarily bonded to one surface of the substrate held by the holding table and is heated to a first temperature;
The electronic component of the substrate, which is provided so as to be able to be driven in the vertical direction at a position facing the fixed tool and is heated to a second temperature higher than the first temperature and supported by the support surface, is temporarily pressure-bonded. A pressure tool having a pressure surface that pressurizes and heats the other surface corresponding to the portion to melt and cure the adhesive tape and finally press-bonds the electronic component to the substrate. In the mounting device.

First driving means for driving the holding table in the vertical direction;
Second driving means for driving the pressurizing tool in the vertical direction;
The electronic component temporarily bonded to one surface of the substrate is brought into contact with the support surface of the fixed tool, and at the same time, the other surface of the portion of the substrate where the electronic component is temporarily bonded is the pressure tool. It is preferable to further comprise control means for controlling the driving of the first driving means and the second driving means so as to be pressurized and heated on the pressing surface.

  It is preferable that a protective sheet for preventing the adhesive tape heated and melted by the pressure tool from adhering to the support surface is interposed between the support surface of the fixed tool and the electronic component.

  The substrate is held on the holding table with one surface on which the electronic component is temporarily crimped facing upward, the fixed tool is disposed above the substrate with the support surface facing downward, and the movable tool is the substrate It is preferable that the pressurizing surface is disposed upward below the surface.

The pressure tool is plural,
The plurality of pressing tools are preferably driven in synchronism so as to simultaneously pressurize and heat the plurality of electronic components temporarily bonded to the side portion of the substrate.

This invention is an electronic component mounting method in which an electronic component temporarily bonded with a thermosetting pressure-sensitive adhesive tape to one surface of a side portion of a substrate is melt-cured and the main pressure bonded to the surface.
A step of holding the substrate on which the electronic component is temporarily press-bonded on the side portion, by projecting the side portion outwardly on a holding table driven in a vertical direction; and
Supporting the electronic component temporarily bonded to one surface of the substrate with a support surface of a fixed tool heated at a first temperature;
The other surface of the substrate supported by the support surface, which corresponds to the portion where the electronic component is temporarily bonded, is added by the pressing surface of the pressing tool heated at a second temperature higher than the first temperature. And a step of melt-curing the pressure-sensitive adhesive tape to press-bond the electronic component to the substrate.

  It is preferable to simultaneously support the electronic component by the support surface of the fixed tool and pressurize and heat the portion corresponding to the portion where the electronic component of the substrate is provided by the pressure surface of the pressure tool.

  According to the present invention, the electronic component temporarily bonded to one surface of the substrate is supported by the support surface of the fixed tool, and the other surface of the substrate corresponding to the portion supported by the support surface is supported by the pressure tool. It was made to pressurize and heat by a pressurization surface.

  For this reason, the electronic component is not directly pressurized and heated by the pressing surface of the pressing tool, so that the temperature rise of the electronic component is suppressed.

The block diagram of the mounting apparatus which shows 1st Embodiment of this invention. The block diagram of a control system. The top view of the board | substrate by which TCP was temporarily crimped | bonded to the side part. FIG. 5 is a configuration diagram when the pressure tool and the substrate are driven in the upward direction and the TCP temporarily bonded to the substrate is finally bonded. The figure which shows the arrangement | positioning relationship of the fixing tool with respect to the board | substrate which shows the 2nd Embodiment of this invention, and a pressurization tool.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a schematic configuration of a mounting apparatus according to an embodiment of the present invention, and this mounting apparatus includes an apparatus main body 1. The apparatus main body 1 is provided with a table unit 21 driven by the first driving means 2.

  The table unit 21 is provided in an X table 4 driven in an X direction indicated by an arrow by an X drive source 3 provided in the apparatus main body 1 and provided in the X table 4 so as to be movable in a Y direction orthogonal to the X direction. The Y table 6 driven by the Y drive source 5, the Z movable body 9 provided on the Y table 6 and driven by the Z drive source 7 in the Z direction which is the vertical direction, and the Z movable body 9 in the rotational direction. The holding table 11 is provided so as to be drivable in a certain θ direction and is driven in the rotation direction by a θ driving source 10.

Accordingly, the holding table 11 is driven in the X, Y, Z, and θ directions. On the holding table 11, for example, a glass substrate W such as a liquid crystal cell is supplied and mounted with its peripheral portion protruding outward from the upper surface of the holding table 11, and held by holding means such as vacuum suction. It is like that.
The drive source 3, the Y drive source 5, the Z drive source 7 and the θ drive source 10 constitute the first drive means 2.

  As shown in FIG. 3, on one side of the substrate W, a plurality of TCPs 13 as electronic components are temporarily press-bonded at predetermined intervals by an anisotropic conductive adhesive tape 12 formed of a thermosetting resin. . The TCP 13 is formed by mounting a semiconductor chip (not shown) on a synthetic resin member such as polyimide. The pressure-sensitive adhesive tape 12 is adhered over almost the entire length of the side portion of the substrate W.

  The thermal expansion coefficient of the glass substrate W is about ± 0.019 PPm / ° C., and the thermal expansion coefficient of the polyimide forming the TCP 13 is about ± 1.0 PPm / ° C. Therefore, the thermal expansion coefficient of the TCP 13 is about 50 times that of the substrate W.

  In the apparatus main body 1, a pressurizing tool 16 that pressurizes the lower surface of one side of the substrate W held by the holding table 11 with an upper pressurizing surface 15 is moved up and down by a second driving means 17 such as a linear motor. It can be driven in the direction.

  The pressure tool 16 is set to a width dimension slightly longer than the width dimension of one of the plurality of TCPs 13 temporarily bonded to the substrate W. A first heater 16a for heating to a high temperature of ° C. is provided.

  Above the pressurizing tool 16, a fixed tool 19 attached and fixed to the fixing portion 18 is disposed with the lower support surface 20 facing the pressurizing surface 15. The support surface 20 is set to be approximately the same size as the pressure surface 15.

  A second heater 19 a for heating the fixed tool 19 to a temperature of about 80 ° C., which is lower than the heating temperature of the pressurizing tool 16, is provided at the upper end of the fixed tool 19. Here, the heating temperature of the fixed tool 19 by the second heater 19a is the first temperature, and the heating temperature of the pressing tool 16 by the first heater 16a is the second temperature.

  The driving of the driving sources 3, 5, 7, 10 and the second driving means 17 of the first driving means 2 is controlled by the control device 22 shown in FIG. The control device 22 operates the Z drive source 7 of the first drive means 2 to drive the holding table 11 in the upward direction at a predetermined speed, and simultaneously operates the second drive means 17 to The pressing tool 16 is driven in the upward direction at a predetermined speed.

  Thereby, the upper surface of one TCP 13 out of the plurality of TCPs 13 temporarily bonded to the upper surface of the side portion of the substrate W held on the holding table 11 hits the support surface 20 of the fixing tool 19, and at the same time, the substrate The pressing surface 15 of the pressing tool 16 hits the lower surface of the W corresponding to the portion where the TCP 13 is provided, so that the substrate W is pressurized and heated.

  That is, at the same time as the TCP 13 hits the support surface 20 of the fixed tool 19, the substrate W is pressed and heated by the pressing surface 15 of the pressing tool 16, and the increasing speed with respect to the rising distance of the substrate W and the pressing The ascent speed of the tool 16 with respect to the ascent distance is set by the control device 22.

  Thereby, the heating of the TCP 13 by the fixing tool 19 and the heating of the substrate W by the pressing tool 16 are performed almost simultaneously. That is, the TCP 13 is not heated before the substrate W is heated.

  If the substrate W is pressurized and heated by the pressing surface 15 of the pressing tool 16, the heat is transmitted through the substrate W to the adhesive tape 12 in which the TCP 13 is temporarily bonded to the upper surface of the substrate W. After being melted by the heat of 16, it will be cured.

  In the initial state before the Z driving source 7 and the second driving means 17 of the first driving means 2 are driven by the control device 22, the pressing surface of the pressing tool 16 as shown in FIG. 15 is set below a predetermined distance below the lower surface of the substrate W held on the holding table 11, and the support surface 20 of the fixing tool 19 is set above a predetermined distance.

  A protective sheet 24 formed of a resin having heat resistance such as a fluororesin is interposed between the TCP 13 temporarily bonded to the substrate W and the support surface 20 of the fixing tool 19. The protective sheet 24 is drawn out from the supply reel 25 and taken up on the take-up reel 27.

  The protective sheet 24 is interposed between the support surface 20 and the TCP 13 when the substrate W is pressurized and heated to the support surface 20 of the fixed tool 19 by the pressure tool 16. Thereby, when the adhesive tape 12 is melted by the heat of the pressurizing tool 16, even if the melt is protruded from the TCP 13, the melt is prevented from adhering to the support surface 20 of the fixed tool 19. ing.

  When the pressure heating by the pressurizing tool 16 is repeated a plurality of times and the protective sheet 24 becomes dirty, the protective sheet 24 is taken up by the take-up reel 27 by a predetermined size, and a new part is fed out to a position facing the pressurizing tool 16. It is supposed to be.

  When the TCP 13 temporarily press-bonded to the upper surface of the substrate W is mounted by the mounting apparatus configured as described above, the first driving unit 2 and the second driving unit 17 are operated by the control unit 22, and FIG. The holding table 11 holding the substrate W is driven in the ascending direction at a predetermined speed as indicated by an arrow 4 plus Z1, and the pressing tool 16 is driven in the ascending direction as indicated by an arrow + Z2.

  Here, the rising speed of the holding table 11 and the pressing tool 16 is such that the TCP 13 temporarily bonded to the upper surface of the substrate W hits the support surface 20 of the fixing tool 19 via the protective sheet 24 and at the same time the TCP 13 of the substrate W Control is performed by the control device 22 so that the lower surface of the pasted portion is pressurized and heated by the pressing surface 15 of the pressing tool 16.

  When the pressing surface 15 of the pressing tool 16 pressurizes and heats the lower surface of the substrate W, the heat is transmitted to the adhesive tape 12 through the substrate W, and the adhesive tape 12 is melted and cured. Thereby, the TCP 13 temporarily bonded to the substrate W is finally bonded.

  Since the pressing tool 16 presses the lower surface of the substrate W, the heat is transmitted to the adhesive tape 12 through the substrate W, and is transmitted from the adhesive tape 12 to the TCP 13. Therefore, the TCP 13 provided on the upper surface of the substrate W is not directly heated by the pressure tool 16, so that the thermal expansion or softening due to the temperature rise of the TCP 13 is directly heated by the pressure tool 16. It will be suppressed compared to the case.

  When the temperature rise of the TCP 13 at the time of mounting was measured, when the pressure-sensitive tool 16 was pressurized and heated through the protective sheet 24 by the pressure tool 16 to melt and cure the adhesive tape 12, the temperature of the TCP 13 was about 210. Rose to ℃.

  On the other hand, when the adhesive tape 12 is melt-cured by pressurizing and heating the lower surface of the substrate W with the TCP 13 temporarily bonded to the upper surface by the pressing tool 16 as in the embodiment of the present invention, the temperature of the TCP 13 Rose to about 160 ° C. That is, it was confirmed that the temperature rise of the TCP 13 is suppressed.

  In addition, the first driving means 2 causes the substrate W to be pressurized and heated by the pressing surface 15 of the pressing tool 16 at the same time that the substrate W is driven in the upward direction and the TCP 13 hits the support surface 20 of the fixed tool 19. The control device 22 controls the driving speed of the holding table 11 in the upward direction and the driving speed of the pressing tool 16 in the upward direction by the second driving means 17.

  For this reason, since the TCP 13 is not heated by the fixed tool 19 before being pressed by the pressing tool 16, the heating time of the TCP 13 by the fixed tool 19 is shortened as compared with the conventional case.

  Thus, if the heating time of the TCP 13 is shortened, the thermal expansion and softening due to the heating of the TCP 13 will be suppressed. Therefore, the mounting accuracy is lowered due to the thermal expansion of the TCP 13 and the undulation due to the softening occurs. That is, shape deformation and the like can be prevented.

  A protective sheet 24 is interposed between the TCP 13 and the support surface 20 of the fixed tool 19 to prevent the molten material from adhering to the support surface 20 when the adhesive tape 12 is melted. The heating temperature of the fixed tool 19 is about 80 ° C., and the heating temperature of the pressurizing tool 16 is about 350 degrees.

  For this reason, the protective sheet 24 may be less susceptible to heat loss as compared to the case where it directly receives the heat of the pressure tool 16 that is higher than the heating temperature of the fixed tool 19. As a result, the number of times that the same portion of the protective sheet 24 is used can be increased, so that the running cost can be reduced.

  FIG. 5 shows a second embodiment of the present invention. In this embodiment, the substrate W is held by the holding table 11 with the surface to which the TCP 13 is temporarily press bonded facing downward. A fixing tool 19 is disposed on the lower surface side of the substrate W, and a pressing tool 16 is disposed on the upper surface side. That is, in the second embodiment, the substrate W is held on the holding table 11 upside down as compared with the first embodiment, and the arrangement of the fixing tool 19 and the pressing tool 16 is also upside down. Yes.

  When the TCP 13 temporarily bonded to the lower surface of the substrate W is pressure bonded, the holding table 11 holding the substrate W is lowered by the Z driving source 7 of the first driving means 2 as shown by an arrow -Z1 in FIG. At the same time, the pressurizing tool 16 is driven in the downward direction by the second driving means 17 as indicated by the arrow -Z2.

  As a result, as in the first embodiment, the TCP 13 can be permanently crimped while suppressing the thermal effect on the TCP 13, so that the TCP 13 is permanently crimped to the substrate W without causing a reduction in mounting accuracy. Can do.

  In the above-described embodiment, an example has been described in which a plurality of TCPs are pressurized and heated for each location using one pressing tool and a fixed tool. However, when a plurality of TCPs are pressurized and heated, the number of TCPs A pressurizing tool and a fixing tool according to the above may be provided, and a plurality of TCPs may be pressurized and heated together.

  In this case, the fixed tool may be divided into a plurality of parts corresponding to the number of pressure tools, but one fixed tool having a length capable of receiving a plurality of pressure tools simultaneously is used. May be.

  In that case, the driving of the plurality of pressurizing tools is controlled in synchronism so as to simultaneously pressurize and heat the plurality of TCPs. By doing so, it is not necessary to drive and position the holding table on which the substrate is placed with respect to each TCP as in the case of pressurizing and heating the TCP one by one, thereby improving productivity. Can be achieved.

  In addition, if the plurality of TCPs are pressurized and heated in synchronism with the driving of the plurality of pressure tools, the impact applied to the substrate can be reduced by one time, so that the damage to the substrate can be reduced.

  In addition, because multiple TCPs are pressurized and heated at the same time, mounting accuracy such as misalignment of other TCPs that are not pressurized and heated, such as when one is pressurized and heated one by one, is implemented. It is possible to eliminate the factor that causes a decrease in

  DESCRIPTION OF SYMBOLS 2 ... 1st drive means, 11 ... Holding table, 12 ... Adhesive tape, 15 ... Pressure surface, 16 ... Pressure tool, 17 ... 2nd drive means, 19 ... Fixed tool, 20 ... Support surface, 22 ... Control Device, 24 ... protective sheet.

Claims (7)

An electronic component mounting apparatus that temporarily press-bonds an electronic component temporarily bonded with a thermosetting adhesive tape to one surface of a side edge portion of a substrate, wherein the adhesive tape is melt-cured and subjected to final bonding.
A holding table that is provided so as to be capable of being driven in the vertical direction and that holds the substrate by projecting a side portion on which the electronic component is temporarily crimped;
A fixing tool that has a support surface for supporting the electronic component temporarily bonded to one surface of the substrate held by the holding table and is heated to a first temperature;
The electronic component of the substrate, which is provided so as to be able to be driven in the vertical direction at a position facing the fixed tool and is heated to a second temperature higher than the first temperature and supported by the support surface, is temporarily pressure-bonded. A pressure tool having a pressure surface that pressurizes and heats the other surface corresponding to the portion to melt and cure the adhesive tape and finally press-bonds the electronic component to the substrate. Mounting device. First driving means for driving the holding table in the vertical direction;
Second driving means for driving the pressurizing tool in the vertical direction;
The electronic component temporarily bonded to one surface of the substrate is brought into contact with the support surface of the fixed tool, and at the same time, the other surface of the portion of the substrate where the electronic component is temporarily bonded is the pressure tool. 2. The electronic component mounting apparatus according to claim 1, further comprising control means for controlling the driving of the first driving means and the second driving means so as to be pressurized and heated on the pressing surface.   A protective sheet is interposed between the support surface of the fixed tool and the electronic component to prevent the adhesive tape heated and melted by the pressure tool from adhering to the support surface. The electronic component mounting apparatus according to claim 1 or 2.   The substrate is held on the holding table with one surface on which the electronic component is temporarily crimped facing upward, the fixed tool is disposed above the substrate with the support surface facing downward, and the movable tool is the substrate 4. The electronic component mounting apparatus according to claim 1, wherein the pressure surface is disposed upward below the electronic component. The pressure tool is plural,
2. The electronic component mounting apparatus according to claim 1, wherein the plurality of pressurizing tools are driven synchronously so as to simultaneously pressurize and heat the plurality of electronic components temporarily bonded to the side portion of the substrate. An electronic component temporarily bonded by thermosetting adhesive tape to one surface of a side portion of a substrate is a method for mounting an electronic component by melt-curing the adhesive tape and performing final bonding,
A step of holding the substrate on which the electronic component is temporarily press-bonded on the side portion, by projecting the side portion outwardly on a holding table driven in a vertical direction; and
Supporting the electronic component temporarily bonded to one surface of the substrate with a support surface of a fixed tool heated at a first temperature;
The other surface of the substrate supported by the support surface, which corresponds to the portion where the electronic component is temporarily bonded, is added by the pressing surface of the pressing tool heated at a second temperature higher than the first temperature. And a step of melt-curing the pressure-sensitive adhesive tape to press-bond the electronic component to the substrate.   The support of the electronic component by the support surface of the fixed tool and the pressurization and heating of the portion corresponding to the portion where the electronic component of the substrate is provided by the pressurization surface of the pressurizing tool are simultaneously performed. Item 7. A method for mounting an electronic component according to Item 6.

Images