JP2009218286A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus for immediately pressure-bonding a TCP(tape carrier package) on a substrate without temporarily pressure-bonding it. <P>SOLUTION: The electronic component mounting apparatus is used for pressure-bonding an electronic component on a substrate using a thermosetting adhesive tape to be molten and cured by being heated. The mounting apparatus includes: a mounting head 14 in which a mounting tool 18 for sucking and holding the top surface of one end of a TCP3 allowing an adhesive tape 119 to be stuck on the bottom surface of the one end is provided so as to be driven in a vertical direction; a protective tape 101 having ventilation, provided on the mounting head, intervened between the mounting tool and the TCP when the mounting tool sucks and holds the top surface of one end of the TCP, and preventing a molten substance generated when the adhesive tape is heated and molten from adhering to the mounting tool; and a heater 18b which is provided on the mounting tool and heats and melts the adhesive tape via the protective tape when the TCP sucked and held by the mounting tool is mounted on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting, for example, a TCP (Tape Carrier Package) as an electronic component on a glass panel used for a liquid crystal display device as a substrate.

  For example, when manufacturing a liquid crystal display device, a mounting device for mounting the TCP as an electronic component on the panel as a substrate is used. The TCP is punched from the carrier tape by a mold and then supplied to an index table that is rotationally driven by a predetermined angle. The index table is provided with a plurality of mounting tools in the circumferential direction at intervals corresponding to the rotation angle per time. The TCP punched out by the mold is sequentially supplied to a plurality of mounting tools.

  The panel is positioned and placed on an XY table, and is driven in the XY direction by the XY table. At the mounting position of the index table, the alignment mark provided on the TCP and the alignment mark provided on the panel are imaged by the imaging camera, and the imaging signal is processed by the image processing unit. Based on the processing in the image processing unit, the panel is positioned by controlling the driving of the XY table so that the alignment mark of the panel matches the alignment mark of the TCP. .

  When the panel is positioned with respect to the TCP, the suction head holding the electronic component is driven in the downward direction, and the adhesive composed of a thermosetting anisotropic conductive member in which the TCP is attached to the panel in advance. Apply pressure to the tape. In other words, it is designed to be implemented. A conventional mounting apparatus that mounts TCP on a substrate using an index table is disclosed in, for example, Patent Document 1.

  By the way, the mounting apparatus disclosed in Patent Document 1 is a so-called temporary pressure-bonding mounting apparatus that attaches TCP to an adhesive tape that is attached to a substrate. It is not a so-called mounting apparatus for actual crimping.

  That is, conventionally, TCP temporary press-bonding and main press-bonding to a substrate are performed by separate mounting apparatuses. The reason for this is that when TCP is mounted on a substrate using an adhesive tape made of a thermosetting anisotropic conductive member, provisional pressure bonding is short because only TCP is attached to the adhesive tape provided on the substrate. Although this can be done in a time and at a low temperature, the main pressure bonding requires melting and heating the pressure-sensitive adhesive tape, so it takes more time than the temporary pressure bonding and must be performed at a high temperature. For this reason, the mounting conditions may be greatly different between the temporary pressure bonding and the main pressure bonding.

Furthermore, the adhesive tape is heated to a high temperature and melted by the mounting tool during the main press bonding. Therefore, the melted material adheres to the mounting tool and the mounting tool is contaminated, and the adhesion of the dirt causes a mounting failure. In order to prevent adhesion of the molten material to the mounting tool, it is necessary to press and heat the TCP with a protective tape between the mounting tool and the TCP. It may be different.
JP 2002-305398 A

  As described above, since the conventional mounting apparatus is different in various mounting conditions in the main pressure bonding and the temporary pressure bonding, the main pressure bonding and the temporary pressure bonding are performed by separate mounting apparatuses. In some cases, the installation space is increased in order to install the mounting apparatus, and further, the provisional pressure bonding and the main pressure bonding are separately performed, thereby causing a decrease in productivity.

  The present invention enables the electronic component to be immediately bonded without temporarily bonding the electronic component to the substrate, so that the electronic component can be attached to the substrate without causing an increase in equipment cost, an increase in installation space, or a decrease in productivity. It is an object to provide a mounting apparatus and a mounting method that can be mounted.

This invention is a mounting device for an electronic component in which an electronic component is pressure-bonded to a substrate with a thermosetting adhesive tape that is melt-cured by heating,
A mounting head provided with a mounting tool capable of adsorbing and holding the upper surface of one end of the electronic component to which the adhesive tape is attached to the lower surface of the one end;
A melt generated when the pressure-sensitive adhesive tape is heated and melted between the mounting tool and the electronic component when the mounting tool is attached to the mounting head and sucks and holds the upper surface of one end of the electronic component. A protective tape with air permeability to prevent from adhering to the mounting tool,
And a heater for heating and melting the adhesive tape via the protective tape when the electronic component that is provided on the mounting tool and is held by suction on the mounting tool is mounted on the substrate. It is in the mounting device.

The mounting head is
A mounting plate provided with the mounting tool;
A supply reel wound around the protective tape and provided on one end of the mounting tool on the mounting plate;
A take-up reel provided on the other end side of the mounting tool of the mounting plate and winding up the protective tape that has been fed from the supply reel and passed through a position facing the lower end surface of the mounting tool. preferable.

  The mounting tool is preferably provided with a pulse heat type heater.

Component supply means for punching out the electronic components from the carrier tape and supplying them to the mounting tool;
It is preferable that the electronic device further includes an attaching unit that attaches the adhesive tape to the lower surface of the one end of the electronic component that is supplied to the mounting tool by the component supplying unit and the upper surface of the one end is sucked and held.

It has an index table that is intermittently rotated by a predetermined angle in the circumferential direction, and a plurality of the mounting heads are provided at predetermined intervals in the circumferential direction of the index table,
It is preferable that the component supply means and the sticking means are provided at positions facing the mounting tool positioned by the index table.

This invention is an electronic component mounting method in which an electronic component sucked and held by a mounting tool is crimped to a substrate with a thermosetting adhesive tape that is melt-cured by heating,
A step of adsorbing and holding the upper surface of one end portion of the electronic component by which the adhesive tape is attached to the lower surface of the one end portion by the mounting tool;
When the mounting tool sucks and holds the upper surface of one end of the electronic component, the melt generated when the adhesive tape is heated and melted between the mounting tool and the electronic component adheres to the mounting tool. A step of interposing a protective tape with air permeability to prevent
And mounting the electronic component sucked and held on the mounting tool via the protective tape on the substrate while heating and melting the adhesive tape attached to the electronic component. There is an electronic component mounting method.

  According to the present invention, when the mounting tool holds the electronic component by suction, the protective tape having air permeability is interposed between the mounting tool and the electronic component, and the adhesive tape is heated by the mounting tool by the protective tape. When melted, the melt was prevented from adhering to the mounting tool.

  Therefore, if the electronic component is sucked and held on the mounting tool via the protective tape, the adhesive tape can be heated and melted by the mounting tool to mount the electronic component on the substrate. That is, if the mounting tool sucks and holds the electronic component, the electronic component can be immediately pressed and bonded without temporarily bonding the electronic component to the substrate.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic diagram showing the overall configuration of an electronic component mounting apparatus according to an embodiment of the present invention. This mounting apparatus has a panel table 2 which is a first transport means for transporting, for example, a panel 1 for a liquid crystal display device as a substrate, and an index table 4 as a second transport means for transporting a TCP 3 as an electronic component. .

  The panel table 2 has an X table 6 provided on a base 5 so as to be movable along the X direction (direction orthogonal to the paper surface of FIG. 1). The X table 6 is driven on the base 5 along the X direction by an X drive source 7 provided on the base 5.

  The X table 6 is provided with a Y table 8 movable along a Y direction (indicated by an arrow) orthogonal to the X direction. The Y table 8 is driven along the Y direction by a Y drive source 9 provided on the X table 6. The Y table 8 is provided with a θ table 10 so as to be rotatable on a horizontal plane, and is driven in a rotating direction by a θ drive source 10 a provided on the Y table 8.

  And the said panel 1 is supplied to the upper surface of this (theta) table 10, for example, is hold | maintained immovably by means, such as a vacuum suction. Thereby, the panel 1 can be positioned with respect to the XY and θ directions by the panel table 2. The θ table 10 is smaller than the panel 1. Thus, the panel 1 has a peripheral portion protruding from the peripheral portion of the θ table 10.

  The index table 4 is provided with a rotating shaft 11 at the center, and the rotating shaft 11 is intermittently rotated by a predetermined angle in the clockwise direction indicated by an arrow R in FIG. . In this embodiment, the index table 4 is intermittently driven at a rotation angle of 90 degrees.

  Four mounting heads 14 are provided on the upper surface of the index table 4 at intervals of 90 degrees. The mounting head 14 has a support 15. In FIG. 1, only two supports 15 are shown, and the other supports 15 are omitted. The side surface of the support 15 is L-shaped, and a lower end portion of the mounting plate 16 with the plate surface vertical is attached and fixed to the vertical surface.

  A linear guide 17 is provided along the vertical direction at the center of the front surface of the mounting plate 16 in the width direction. A mounting tool 18 is provided on the linear guide 17 so that a guide member 19 provided on the back surface is slidably engaged.

  6 and 7, the lower end of the mounting tool 18 is provided with an elongated suction nozzle 18a along the width direction of the mounting plate 16, and the upper end is a cylinder as a Z drive source mounted on the mounting plate 16. It is connected to 20 rods 20a. A cartridge-type heater 18b is embedded in the suction nozzle 18a along the width direction. As the heater 18b, a pulse heat method that can rapidly raise the temperature of the suction nozzle 18a is used. By using a pulse heat type heater, even if the TCP 3 is sucked and held by the suction nozzle 18a through a heat-resistant protective tape 101 described later, rapid heating is possible, so that the TCP 3 is prevented from being damaged or warped. it can.

  As shown in FIG. 7, a supply reel 102 around which a protective tape 101 having air permeability and heat resistance is wound is rotatably provided at one end in the width direction of the mounting plate 16 and supplied at the other end. A take-up reel 103 is provided to take up the protective tape 101 fed from the reel 102 by a predetermined length. The take-up reel 103 is driven to rotate by a take-up motor 104 provided on the back surface of the mounting plate 16 as shown in FIG.

A portion of the protective tape 101 between the supply reel 102 and the take-up reel 103 is guided by a pair of guide rollers 105 so as to face and separate from the tip surface of the suction nozzle 18a of the mounting tool 18 at a slight interval. Has been.
As described above, the protective tape 101 and the mounting tool 18 are attached to the same mounting plate 16 and can move integrally.

  As the protective tape 101, a heat-resistant fiber knitted in a mesh shape, a heat-resistant tape-like resin such as a fluororesin, or a plurality of fine holes formed is used.

  The suction nozzle 18a of the mounting tool 18 sucks and holds the TCP 3 supplied from a component supply unit 21 (shown in FIG. 1) described later at the receiving position indicated by A in FIG. ing. In addition to the receiving position A described above, the index table 4 has three positions indicated by B to D, that is, a total of four positions.

The position of B is a terminal portion (not shown) provided on the lower surface of one end portion of the TCP 3 which is supplied to the mounting tool 18 at the receiving position A and whose upper surface of one end portion is sucked and held by the suction nozzle 18a. The cleaning position for cleaning with a brush or the like, C position is from an anisotropic conductive member cut to a predetermined length in a state of being attached to the release tape 120 as shown in FIG. After attaching the adhesive tape 119 to be described later, the adhesive peeling position at which the release tape 120 is peeled off from the adhesive tape 119, and the position D is the TCP3 with the adhesive tape 119 attached to the terminal portion. This is a mounting position for mounting by heating and melting the adhesive tape 119 on the upper surface of the side portion of 1, that is, for actual press bonding.
In addition, if the adhesive tape 119 is a low-temperature curing type, for example, made of a material that is melt-cured at 150 ° C., the tact time required for the melt-curing of the adhesive tape 119 at the time of the main pressure bonding is shortened. It becomes possible to do.

  In addition, since the TCP 3 is heated at a low temperature, the TCP 3 is less likely to be warped or deformed, so that it is possible to mount the precision wing when aligning and mounting the TCP 3 as described later. .

  The component supply unit 21 includes a mold 23 for punching out the TCP 3 from the carrier tape 22 as shown in FIG. The mold 23 includes an upper mold 23a that is driven in the vertical direction, and a lower mold 23b that is fixedly disposed facing the upper mold 23a. The upper die 23a is provided with a punch 24, and the lower die 23b is provided with a through hole 25 into which the punch 24 is inserted when the upper die 23a is lowered.

  The carrier tape 22 is passed between the upper mold 23a and the lower mold 23b. When the upper mold 23a is lowered, the TCP 3 is punched, and when it is raised, the carrier tape 22 is sent at a predetermined pitch in the arrow direction indicated by + Y. In this state, TCP3 can be punched out.

  A receiving tool 26 is disposed below the lower mold 23b. The receiver 26 is driven by a Zθ driving source 28 provided on the X table 27 in the Z direction which is the vertical direction and the θ direction which is the rotational direction. The X table 27 is provided on the Y table 29 so as to be movable along the X direction orthogonal to the Y direction. The Y table 29 is provided with an X drive source 31 for driving the X table 27 along the X direction.

  The Y table 29 is provided on a base 32 disposed along the Y direction indicated by an arrow in FIG. 1 so as to be movable along the Y direction. One end of the base 32 is provided with a Y drive source 33 for driving the Y table 29 along the Y direction. The other end of the base 32 is located below the receiving position A of the index table 4.

  When the TCP 26 punched from the carrier tape 22 by the mold 23 is received and lowered, the Y table 29 is driven from one end of the base 32 to the other end by the Y drive source 33. As a result, the holder 26 holding the TCP 3 is positioned below the receiving position A of the index table 4 as indicated by a chain line in FIG.

  When the receiver 26 is positioned below the receiving position A, the receiver 26 is driven in the upward direction. Accordingly, as indicated by a chain line in FIG. 6, the suction nozzle 18 a provided at the lower end of the mounting tool 18 has the upper surface of one end portion provided with the terminal portion of the TCP 3 held by the receiver 26 as the suction nozzle. It is sucked and held via a protective tape 101 provided facing the lower end surface of 18a.

  In FIG. 6, the adhesive tape 119 is attached to the lower end surface of one end portion of the TCP 3, but when the TCP 3 is positioned at the receiving position A, the adhesive tape 119 is not attached.

  When the suction nozzle 18a sucks the TCP 3 at the receiving position A, the index table 4 is rotated 90 degrees, and the suction nozzle 18a is positioned at the cleaning position B. At the cleaning position B, the terminal portion of the TCP 3 sucked and held by the suction nozzle 18a is brushed by a brush (not shown). Thereby, the dirt adhering to the terminal portion is removed.

  When the dirt on the terminal portion of the TCP 3 is removed at the cleaning position B, the index table 4 is rotated 90 degrees. Accordingly, the TCP 3 is positioned at the sticking / peeling position C. At the sticking / peeling position C, as shown by a chain line in FIG. 6, the adhesive tape 119 cut to a predetermined length is stuck to the terminal portion of the TCP 3.

  As shown in FIGS. 3 to 5, the sticking / peeling position C is located at a position facing the lower side of the mounting tool 18 positioned at the sticking / peeling position C, and a pressing block 34 having the same width as the suction nozzle 18a. Is provided. The pressing block 34 includes a heater 34a.

  The pressing block 34 is attached to a rod 35a of a driving cylinder 35 arranged with its axis perpendicular, and can be driven in the vertical direction indicated by an arrow in FIG. Accordingly, when the drive cylinder 35 is operated and the rod 35a is driven in the protruding direction, the pressing block 34 rises toward the suction nozzle 18a.

  On the upper surface of the pressing block 34, a release tape 120 having the adhesive tape 119 attached to one surface thereof is guided by a pair of guide rollers 37 with the adhesive tape 119 facing upward, and an arrow in FIG. It runs in the direction shown.

  The release tape 120 to which the adhesive tape 119 is attached is drawn out from the supply reel 38 and taken up on the take-up reel 39. The adhesive tape 119 is cut to a predetermined length by a cutting mechanism (not shown) before being conveyed to a position facing the upper surface of the pressing block 34, and is adjacent to the adhesive tape 119 cut to a predetermined length. A portion between the end portions is removed (cleared) so that a gap 119a is formed between the end portions.

  When the portion of the adhesive tape 119 cut to a predetermined length is positioned below the suction nozzle 18a that sucks and holds one end of the TCP 3 via the protective tape 101, the drive cylinder 35 is activated and the rod 35a is moved. Driven in the protruding direction, the pressing block 34 provided on the rod 35a rises while pushing up the lower surface of the portion where the adhesive tape 119 cut to a predetermined length of the release tape 120 is attached to the upper surface.

Accordingly, as shown in FIG. 4, the pressure-sensitive adhesive tape 119 cut to a predetermined length is pressed against the lower surface of one end of the TCP 3 held by the pressure block 34 via the protective tape 101 by the suction nozzle 18a. Attached while being heated by a heater 34a incorporated in 34. The heater 34a heats the pressing block 34 at a temperature that increases the viscosity of the adhesive tape 119.
The pressing block 34 constitutes an adhering means for adhering the adhesive tape 119 cut to a predetermined length to the lower surface of one end of the TCP 3.

  Then, as shown in FIG. 5, when the pressing block 34 with the adhesive tape 119 adhered to the TCP 3 is lowered to the original position, the release roller 41 presses the release tape 120 downward by a drive mechanism (not shown). In other words, after being driven in the downward direction indicated by arrow -Z, it is driven from one end in the width direction of TCP 3 indicated by arrow + X toward the other end. Thereby, the release tape 120 is peeled from the adhesive tape 119 adhered to the TCP 3.

The release roller 41 can be driven to retract in the Y direction orthogonal to the X direction so as not to hit the mounting tool 18 when the index table 4 rotates.
When the release tape 120 is peeled from the adhesive tape 119 attached to the TCP 3, the index table 4 is rotated 90 degrees, and the TCP 3 to which the adhesive tape 119 is attached is positioned at the mounting position D. At the mounting position D, a first imaging camera 43 and a second imaging camera 44 are arranged as imaging means shown in FIG.

  A pair of first alignment marks (not shown) are provided at predetermined intervals on the portion of the panel 1 where the TCP 3 is mounted, and at both ends in the width direction of one end where the terminals of the TCP 3 are provided. A pair of second alignment marks (not shown) are provided at the same interval as the pair of first alignment marks.

  When the TCP 3 with the adhesive tape 119 attached is positioned at the mounting position D, the panel 1 is arranged so that the part where the TCP 3 is mounted approaches the TCP 3 positioned at the mounting position D based on the coordinates taught in advance. Temporary positioning is performed by the table 2.

  When the panel 1 is temporarily positioned with respect to the TCP 3, the first imaging camera 43 images one of the first alignment marks and one of the second alignment marks. Similarly, the second imaging camera 44 images the other first alignment mark and the other second alignment mark.

  The imaging signals of the imaging cameras 43 and 44 are output to the image processing device 45 shown in FIG. 9, where the imaging signals are converted from analog signals to digital signals and processed by an arithmetic processing unit 47 provided in the control device 46. Is done.

  The arithmetic processing unit 47 calculates the X and Y coordinates of each pair of first and second alignment marks, and calculates the amount of positional deviation between the panel 1 and the TCP 3 in the X, Y, and θ directions from the calculated coordinates. calculate.

  When the calculation result of the arithmetic processing unit 47 is output to the drive output unit 48, the drive output unit 48 drives the panel table 2 in the X, Y, and θ directions, and the panel 1 on the θ table 10 is moved. Then, positioning is performed with respect to the TCP 3 positioned at the mounting position D. In other words, the positioning is performed so that the pair of second alignment marks provided on the TCP 3 coincide with the pair of first alignment marks provided on the panel 1.

  When the panel table 2 is driven in the X, Y, and θ directions and the panel 1 is positioned with respect to the TCP 3, the cylinder 20 is activated to drive the mounting tool 18 in the downward direction. As a result, the TCP 3 sucked and held on the suction nozzle 18 a of the mounting tool 18 via the protective tape 101 is mounted on the panel 1. At this time, the lower surface of the portion of the panel 1 where the TCP 3 is mounted is supported by the backup tool 49.

  When the mounting tool 18 is driven in the downward direction and the TCP 3 is pressure-mounted on the panel 1, the pulse heater 18b provided in the suction nozzle 18a is energized. Thereby, the suction nozzle 18a is heated to a temperature at which the adhesive tape 119 is rapidly melted and cured, that is, 150 ° C. in this embodiment.

  Therefore, the adhesive tape 119 adhered to the lower surface of the TCP 3 is heated and melted by the heater 18b and is cured when the temperature reaches 150 ° C. Therefore, the TCP 3 is mounted on the panel 1, that is, is subjected to main pressure bonding. be able to.

  Moreover, at the time of mounting, the suction nozzle 18 a of the mounting tool 18 pressurizes and heats the TCP 3 through the protective tape 101. Therefore, even if the adhesive tape 119 is heated and melted, the adhesive tape 119 melted by the protective tape 101 interposed between the mounting tool 18 and the TCP 3 is applied to the tip surface of the suction nozzle 18 a provided in the mounting tool 18. Since the adhesion is prevented, the suction nozzle 18a is prevented from being soiled by the melt.

  That is, even when the main pressure bonding for melting the adhesive tape 119 and mounting the TCP 3 is performed, the protective tape 101 prevents the melt from adhering to the suction nozzle 18a and the contamination is prevented. It is possible to repeatedly perform the main pressure bonding one by one.

  In other words, since the TCP 3 can be sucked and held on the suction nozzle 18a via the protective tape 101, the mounting of the TCP 3 is not temporarily performed after the temporary pressure bonding as in the prior art, and the temporary pressure bonding is not performed. It is possible to immediately perform the main pressure bonding without performing the pressure bonding. Therefore, it is possible to simplify the device required for mounting, increase the efficiency of the installation space associated therewith, and reduce the tact time required for mounting.

  In addition, the TCP 3 is heated by the pulse heater 34a during the main press bonding. Therefore, since heating is performed after the panel 1 and the TCP 3 are aligned, the TCP 3 can be mounted with high accuracy. In addition, since the heating temperature is low, the warping of the TCP 3 can be reduced, which can improve the mounting accuracy.

  In the above embodiment, the TCP supplied from the component supply unit is mounted on the panel using the index table, but the mounting head provided with the mounting tool and the protective tape can be driven in the X and Y directions. If the mounting tool sucks and holds the TCP through the protective tape, the mounting head is driven in the X and Y directions to stick the adhesive tape to the lower surface of one end of the TCP, and then the TCP is attached to the panel. You may make it carry out positioning so that it may mount.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The top view which shows an index table and a panel table. The block diagram which shows the sticking peeling position which sticks the adhesive tape cut | disconnected by TCP to predetermined length. Explanatory drawing when sticking an adhesive tape on TCP in a sticking peeling position. Explanatory drawing when peeling a release tape from the adhesive tape affixed on TCP. The side view of a mounting head. The front view of a mounting head. The side view of the part of the take-up reel provided in the mounting head. The block diagram of a control system.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Panel (board | substrate), 3 ... TCP (electronic component), 4 ... Index table, 14 ... Mounting head, 18 ... Mounting tool, 18a ... Adsorption nozzle, 34 ... Pressing block (sticking means), 21 ... Component supply part 101 ... protective tape, 102 ... supply reel, 119 ... adhesive tape, 120 ... release tape, 103 ... take-up reel.

Claims (6)

An electronic component mounting apparatus that crimps an electronic component to a substrate with a thermosetting adhesive tape that melts and cures by heating,
A mounting head provided with a mounting tool capable of adsorbing and holding the upper surface of one end of the electronic component to which the adhesive tape is attached to the lower surface of the one end;
A melt generated when the pressure-sensitive adhesive tape is heated and melted between the mounting tool and the electronic component when the mounting tool is attached to the mounting head and sucks and holds the upper surface of one end of the electronic component. A protective tape with air permeability to prevent from adhering to the mounting tool,
And a heater for heating and melting the adhesive tape via the protective tape when the electronic component that is provided on the mounting tool and is held by suction on the mounting tool is mounted on the substrate. Mounting equipment. The mounting head is
A mounting plate provided with the mounting tool;
A supply reel wound around the protective tape and provided on one end of the mounting tool on the mounting plate;
A take-up reel provided on the other end side of the mounting tool of the mounting plate and winding up the protective tape that has been fed from the supply reel and passed through a position facing the lower end surface of the mounting tool. The electronic component mounting apparatus according to claim 1, wherein:   2. The electronic component mounting apparatus according to claim 1, wherein the mounting tool is provided with a pulse heat type heater. Component supply means for punching out the electronic components from the carrier tape and supplying them to the mounting tool;
An adhesive means for adhering the adhesive tape to the lower surface of the one end of the electronic component, which is supplied to the mounting tool by the component supplying means and the upper surface of the one end is sucked and held. Item 2. An electronic component mounting apparatus according to Item 1. It has an index table that is intermittently rotated by a predetermined angle in the circumferential direction, and a plurality of the mounting heads are provided at predetermined intervals in the circumferential direction of the index table,
5. The electronic component mounting apparatus according to claim 4, wherein the component supply means and the attaching means are provided at positions facing the mounting tool positioned by the index table. An electronic component mounting method in which an electronic component sucked and held by a mounting tool is pressure-bonded to a substrate with a thermosetting adhesive tape that is melt-cured by heating,
A step of adsorbing and holding the upper surface of one end portion of the electronic component by which the adhesive tape is attached to the lower surface of the one end portion by the mounting tool;
When the mounting tool sucks and holds the upper surface of one end of the electronic component, the melt generated when the adhesive tape is heated and melted between the mounting tool and the electronic component adheres to the mounting tool. A step of interposing a protective tape with air permeability to prevent
And mounting the electronic component sucked and held on the mounting tool via the protective tape on the substrate while heating and melting the adhesive tape attached to the electronic component. Electronic component mounting method.

Images