JPH09148789A - Electronic device mounter and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save the installation space. SOLUTION: The electronic device mounter comprises a plurality of heads 33-36 being mounted on a board 6 while holding chips P1, P2. The mounting heads 33-36 set a station S1 for picking up the chips P1, P2 and a station S4 for mounting the chips P1, P2 on the board 6 at a position separated from the station S1. A table 31 reciprocates the mounting heads 33-36 between the pickup station S1 and mounting station S4 and stations S2, S3 for pasting and anisotropic conductor 47 to the chip are set between the pickup station S1 and mounting station S4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting a chip on a substrate such as a liquid crystal panel using an anisotropic conductor.

[0002]

2. Description of the Related Art In recent years, in mounting a chip on a substrate such as a liquid crystal panel, an electronic component mounting apparatus using an anisotropic conductor has been put into practical use.

By the way, in the conventional electronic component mounting apparatus,
It is divided into a first device for attaching an anisotropic conductor to a substrate and a second device for mounting a chip on the substrate on which the anisotropic conductor is attached by the first device. A unique installation space was assigned to each of the first device and the second device.

[0004]

However, the electronic component mounting apparatus is, for example, in a clean room or the like,
Since it is arranged in a facility where the unit price of the installation space is high, the conventional electronic component mounting apparatus has a problem that the installation space becomes large.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method which can save the installation space.

[0006]

An electronic component mounting apparatus according to the present invention comprises a plurality of mounting heads for holding chips and mounting them on a substrate, and these mounting heads set a pickup station for picking up the chips. The mounting head for mounting the chip on the substrate is set at a position away from the pickup station, and a table for reciprocating the mounting head between the pickup station and the mounting station is provided, and between the pickup station and the mounting station. A sticking station was set to stick an anisotropic conductor to the chip picked up by the mounting head.

In the electronic component mounting method of the present invention, the step of holding the chip on the mounting head at the pick-up station and the step of moving the mounting head holding the chip to the bonding station to heat the heater built in the mounting head. The method includes a step of attaching an anisotropic conductor to the chip while adding it to the chip, and a step of moving a mounting head to a mounting station and sticking the anisotropic conductor adhered to the chip to an electrode of a substrate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the invention of claim 1, a single electronic component mounting apparatus, a pickup station,
A sticking station and a mounting station are set, and a plurality of mounting heads reciprocate between these stations. Then, in a single electronic component mounting apparatus, a chip is picked up, an anisotropic conductor is attached to the chip, and a chip to which an anisotropic conductive band is attached is mounted. As described above, since the necessary steps can be performed in a single electronic component mounting apparatus, the installation space can be saved as compared with the conventional electronic component mounting apparatus.

According to the second aspect of the present invention, the mounting head for mounting the chip on the substrate can also serve to attach the anisotropic conductor to the chip. The two steps that were performed by the device of
It can be completed during a series of operations from chip pickup to mounting.

Next, an embodiment of the present invention will be described with reference to the drawings. (First Embodiment) FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 is a horizontal base, and 2 is a board positioning portion provided in the front part of the base 1.

Of the substrate positioning unit 2, 3 and 4 are arms that move in the X direction by an arm moving shaft 5 that is long in the X direction, and the arms 3 and 4 support the lower surface of the substrate 6 to support the substrate. 6 can be transferred.

In the present embodiment, a liquid crystal panel is used as the substrate 6, the second chip P2 is mounted on the first side A and the third side C of the substrate 6, and the first chip P1 is mounted on the second side B. It will be implemented. Then, these first chips P
The first and second chips P2 are flip chips having bumps on the lower surface.

Reference numeral 7 is a holding portion for holding the central portion of the lower surface of the substrate 6, 8 is a θ table for rotating the holding portion 7 in the θ direction, 9 is an X table for moving the θ table 8 in the X direction, and 10 is a base. The Y table is provided on the table 1 and moves the X table 9 in the Y direction. These θ table 8, X
By driving the table 9 and the Y table 10, one of the first side A, the second side B, and the third side C of the substrate 6 to be mounted next can be positioned at the mounting station described later. it can.

At the rear of the base 1, a first chip supply section 11 for supplying the first chip P1 and a second chip supply section 12 for supplying the second chip P2 are arranged symmetrically.

In the first chip supply section 11, 13 is a magazine for accommodating trays 16 in multiple stages, and 14 is a magazine 13.
And a tray 16 for inserting and removing the tray 16 between the tray holding table 15. On the tray holding table 15, there are placed trays 16 for accommodating the first chips P1 in a matrix shape with their bumps facing upward. Also nail 1
4, the tray holding table 15 pulled out from the magazine 13 can be moved in the Y direction by the tray Y table 17. Reference numeral 18 is a magazine elevating mechanism for elevating the magazine 13.

Similar to the first chip supply unit 11, the second chip supply unit 12 includes a magazine 19, a claw 20, a tray holding table 21, a tray 22 for storing the second chip P2, a tray Y table 23, and a magazine lifting mechanism. 24 are provided.

Further, as shown in FIG. 2, reference numeral 25 is a chip reversing portion which rotates in a vertical plane. On the peripheral surface of the chip reversing portion 25, holding heads 25a to 25d are radially provided so as to project.

In FIG. 1, reference numerals 26 and 27 denote the first chip P1 and the second chip P from the trays 16 and 22, respectively.
It is a take-out head for taking out 2. Extraction head 26, 27
Is driven by the moving shaft 28 to move in the X direction. The take-out heads 26 and 27 are connected to the tray Y.
The first chip P1 or the second chip P2 is taken out from the trays 16 and 22 which are positioned in the Y direction by the tables 17 and 23, and the holding head 2 of the chip reversing unit 25 is taken out.
The first chip P1 or the second chip P2 that has been taken out is transferred to one of 5a to 25d that is currently facing upward.

Reference numeral 29 is a holding head 25 of the chip reversing section 25.
a to 25d, the first chip P1 or the second chip P2 held by the one facing downward is received, and the chuck claw 29a receives the first chip P1 or the second chip P1.
It is a pre-center table for positioning the chip P2. The pre-center table 29 is placed on the reciprocating table 30, and the center of the pre-center table 29 reciprocates between directly below the chip reversing unit 25 and the pickup station S1 (solid line and broken line in FIG. 3).

Reference numeral 31 is a turntable provided in the center of the base 1. The turntable 31 rotates about a shaft 32 in a horizontal plane, and the turntable 31 has an outer periphery at intervals of 90 degrees. The mounting heads 33 to 36 are provided downward. 37 is the first sticking station S
2 is a first conductor supply portion provided in 2, and 38 is a shaft 32
Is a second conductor supply unit provided in the second attaching station S3 which is symmetrical to the first attaching station S2 with respect to the center. The configurations of the first conductor supply section 37 and the second conductor supply section 38 will be described in detail later.

Now, as shown in FIG. 3, the turntable 3
A cylinder 39 as an elevating mechanism corresponding to the mounting heads 33 to 36 in a one-to-one correspondence is provided on the upper part of the mounting head 33. The mounting heads 33 to 36 are moved up and down independently by driving the cylinder 39. It has become. Further, reference numeral 40 denotes a lower pedestal for lowering the lower surface of the substrate 6,
Reference numeral 1 denotes a camera for observing the substrate 6 and the first chip P1 or the second chip P2 from below in the mounting station S4. From the image data obtained by the camera 41, the substrate 6 and the first chip P1 or the second chip P2 are aligned with each other by a control means (not shown).

Next, the structure of the first conductor supply section 37 will be described. Note that the second conductor supply unit 38 has the same configuration as the first conductor supply unit 37, and a description thereof will be omitted.

Now, in FIG. 4, reference numeral 43 is a vertical support plate for supporting each element of the first conductor supply section 37. Below the support plate 43, a supply reel 44 around which a leader tape 46 to which an anisotropic conductor 47 is adhered is wound is pivotally supported. Reference numeral 45 is a winding reel for winding the leader tape 46 after the anisotropic conductor 47 is peeled off. Then, the leader tape 46 is wound on the winding reel 45 from the supply reel 44 through the vertical guide 48, the guide roller 49, the horizontal guide 50, and the guide roller 51 as shown by an arrow N1. .

The anisotropic conductor 47 guided to the leader tape 46 maintains a vertical posture while being in contact with the vertical guide 48, and the cutter 52 moves in the direction of arrow N2, whereby the first chip P1 of the first chip P1 is moved. It is cut into a predetermined length according to the size to form a tape. Then, the cut anisotropic conductor 47 is in contact with the horizontal guide 50, and the mounting head 34 descends to be pressed against the bumps 42 of the first chip P1 adsorbed to the mounting head 34 and anisotropically conductive. It is attached to the body 47. Here, the mounting heads 33 to 3
6 is a heater H and the first chip P1 or the second chip P
A suction path V for adsorbing 2 is provided. Due to the heat of the heater H, the first chip P1 and the bump 42 are heated, and when the first chip P1 is pressed against the anisotropic conductor 47, the heat is different as shown in FIG. The anisotropic conductor 47 is transmitted to the anisotropic conductor 47 and adheres to the first chip P1. Then, when the mounting head 33 is raised, the anisotropic conductor 47 is separated from the leader tape 46 and rises together with the first chip P1.

Next, an outline of the operation of the electronic component mounting apparatus according to this embodiment will be described with reference to FIG. Here, it is assumed that the second chip P2 is mounted on the first side A of the substrate 6.

First, the take-out head 27 is driven to drive the tray 2.
To the top of 2. The tray 22 is a tray Y table 23.
Is positioned directly below the moving path of the take-out head 27. Then, as shown by the arrow M, the ejection head 2
7 picks up the second chip P2 from the tray 22,
The second chip P2 is transferred to the holding head 25a of the chip reversing unit 25 which is currently facing upward.

Next, when the chip reversing unit 25 rotates and the holding head 25a faces downward, the pre-center table 2
9 reaches directly under the holding head 25a as shown by the solid line in FIG. At this time, the holding force of the holding head 25a is released, and the second chip P2 is dropped between the chuck claws 29a. Then, the chuck claw 29a is closed to position the second chip P2. Then, as shown by the chain line in FIG. 6, the pre-center table 29 chucking the second chip P2 is moved to the pickup station S1, and the chuck claw 29a is moved.
Release the chuck by.

At this time, the pickup station S1
It is assumed that the mounting head 33 has arrived. Then, the cylinder 39 is driven to lower the mounting head 33, and the second chip P2 is sucked by the suction path V of the mounting head 33.

Next, the mounting head 33 is moved to the second sticking station S3 via the path L3. And
By the sticking operation described above, the anisotropic conductor 47 is stuck to the lower surface (the surface where the bumps 42 are exposed) of the second chip P2 (FIG. 5A).

When the pasting is completed, go through the route L4,
The mounting head 33 is moved to the mounting station S4. At this time, the θ table 8, the X table 9, and the Y table 10 are positioned so that the area of the first side A of the substrate 6 to be mounted this time is on the mounting station S4.

Then, as shown in FIG. 5B, at the mounting station S4, the mounting head 33 is lowered to sandwich the anisotropic conductor 47 and the bump 42 and the electrode 53 on the first side A.
Crimp. At this time, the anisotropic conductive body 47 is heated by the heat of the heater H built in the mounting head 33 to cause the second chip P2 to move.
Then, the first side A is strongly adhered, and when the suction of the suction path V is released and the mounting head 33 is raised, the mounting of the second chip P2 can be completed as shown in FIG. 5C. it can.

As described above, according to the electronic component mounting apparatus of this embodiment, the step of attaching the anisotropic conductor and the step of mounting the chip in the conventional electronic component mounting apparatus are performed in a single electronic component mounting apparatus. This can be performed by a series of operations, and the installation space can be saved as compared with the case where the first device and the second device are installed separately. Although the second chip P2 has been described above, the first chip P1 can be similarly mounted by changing the route.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the first TCP (Tape C
arriage package) P3, second TCP P
4 is attached. Further, the difference from the first embodiment will be mainly described below.

In FIG. 7, reference numeral 60 denotes a first carrier tape which is sent in the direction of arrow N3 and holds the first TCP P3. 61 is sent in the direction of arrow N4, and the second TCP
It is a second carrier tape that holds P4. The die 62 punches the first TCP P3 from the first carrier tape 60, and the first TCP P3 is taken out. The mold 63 punches the second TCP P4 from the second carrier tape 61, and the second TCP P4 is taken out.

Then, the taken-out first TCP P3 or the second TCP P4 is transferred to the pre-center table 29 by the take-out head 64. In addition, 65 to 68 are
Similar to the mounting heads 33 to 36 in the first embodiment, the mounting head includes a motor H and a suction path V to transfer the first TCP P3 or the second TCP P4.

Hereinafter, as in the case of the first embodiment, the first TC
Regarding P P3, it is transferred to the mounting station S4 via paths L1 and L2, and regarding the second TCP P4,
It is transferred to the mounting station S4 via the paths L3 and L4. Further, 70 is the substrate 6 at the mounting station S4.
9 is a camera for observing the first TCP P1 or the second TCP P2 from below.

A first conductor supply section 37 is provided in the first attachment station S2, and a second conductor supply section 38 is provided in the second attachment station S3. Here, the first conductor supply part 37 and the second conductor supply part 38 are the same as those in the first embodiment.
3, the anisotropic conductor 47 is attached to the second TCP P4, but unlike the flip chip, the TCP has an extremely thin film carrier and is easily deformed.
In the embodiment, the following additional elements are added.

That is, in FIG. 8A, a box 71 is fixed to the upper side of the support plate 43 on the side surface opposite to the horizontal guide 50, and the rod 7 is provided inside the box 71.
2 is inserted so that it can be raised and lowered. The lower end portion of the rod 72 is a wide flange portion 72a, and the flange portion 72a is the spring 7 housed in the box 71.
It is biased upward by 3. And rod 7
A horizontal pedestal 74 is attached to the upper end of the pedestal 2, and the upper surface of the pedestal 74 is normally set to be higher than the anisotropic conductor 47 on the horizontal guide 50.

Now, the mounting head 68 is attached to the second TCP P4.
Will be described, and the operation when the mounting head 68 reaches the second attaching station S3 will be described. First, FIG. 8 (a)
As shown in, when the mounting head 68 reaches the second attaching station S3, the lower surface of the second TCP P4 held by the mounting head 68 is located slightly above the upper surface of the pedestal 74.

Next, when the mounting head 68 is lowered, first, a portion of the second TCP P4 to which the anisotropic conductor 47 is not attached is brought into contact with the pedestal 74 and received underneath. When the mounting head 68 is further lowered, as shown by an arrow N5 in FIG. 8B, a portion of the second TCP P4 that is not in contact with the pedestal 74 is pressure-bonded to the anisotropic conductor 47. At this time, the spring 73 contracts so that the pedestal 74 moves to the second TCP.
While touching P4, it descends slightly.

When the attachment of the anisotropic conductor 47 is completed, the mounting head 68 is raised as shown by the arrow N6 in FIG. 8C, and the anisotropic conductor 47 is removed from the leader tape 46. Even after peeling off, the pedestal 74 remains in the second TCP P
Ascends while touching 4. That is, the second TCP P4
Before and after attaching the anisotropic conductor 47, the pedestal 74
The posture is forced to be constant by. Therefore, when the mounting head 68 rises, it is possible to prevent the second TCP P4 from being pulled toward the leader tape 46 side and being displaced or dropped.

[0042]

The electronic component mounting apparatus of the present invention is provided with a plurality of mounting heads for holding the chips and mounting them on the substrate, and these mounting heads set a pickup station for picking up the chips. The mounting station for mounting the chip on the substrate is set at a position away from the pick-up station, and a table is provided to reciprocate the mounting head between the pick-up station and the mounting station, and the chip is anisotropic between the pick-up station and the mounting station. Since the sticking station for sticking the conductive material is set, it is not necessary to provide an independent installation place for each of the temporary pressure bonding step and the main pressure bonding step, and the installation space can be saved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a view taken along the arrow in FIG.

FIG. 3 is a view on arrow in FIG. 1b-b.

FIG. 4 is a front view of a second conductor supply unit according to the first embodiment of the present invention.

FIG. 5A is a diagram illustrating a pasting operation according to the first embodiment of the present invention. FIG. 5B is a diagram illustrating a pasting operation according to the first embodiment of the present invention. Of the pasting operation in the form

FIG. 6 is an overall operation explanatory diagram of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 7 is an overall operation explanatory diagram of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 8A is a diagram illustrating a pasting operation according to the second embodiment of the present invention. FIG. 8B is a diagram illustrating a pasting operation according to the second embodiment of the present invention. Of the pasting operation in the form

[Explanation of symbols]

 6 Substrate 31 Turntable 33-36 Mounting Head 47 Anisotropic Conductor H Heater P1 First Chip P2 Second Chip S1 Pickup Station S2 First Sticking Station S3 Second Sticking Station S4 Mounting Station

Claims (4)

[Claims] 1. A plurality of mounting heads for holding a chip and mounting it on a substrate, wherein these mounting heads set a pickup station for picking up the chip, and these mounting heads mount a chip on the substrate. A table that is set apart from the pick-up station and that reciprocates the mounting head between the pick-up station and the mounting station is provided, and is picked up by the mounting head between the pick-up station and the mounting station. An electronic component mounting apparatus having a sticking station for sticking an anisotropic conductor to a chip. 2. The electronic component mounting apparatus according to claim 1, wherein a plurality of the pasting stations are set. 3. The electronic component mounting apparatus according to claim 1, wherein the table is provided on a turntable. 4. A step of holding a chip on a mounting head at a pickup station, moving the mounting head holding the chip to a bonding station, and applying heat from a heater built in the mounting head to the chip An electronic component mounting method comprising: a step of attaching an anisotropic conductor, and a step of moving the mounting head to a mounting station and bonding the anisotropic conductor adhered to a chip to an electrode of a substrate. .