JP2001156497A - Component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable adjustment control of compressive pressure for mounting a component. SOLUTION: This component mounting machine has a mounting mechanism 21 having a plurality of bonding nozzles 26, each of which sucks a bare chip, and an adjustment mechanism 30 that adjusts the pressure to a bonding nozzle 26 in mounting a bare chip sucked on the bonding nozzle 26 of the mounting mechanism 21 on a mounting substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, and more particularly, to a technique for adjusting a pressing force for mounting various components on a mounting board.

[0002]

2. Description of the Related Art A conventional component mounting apparatus will be described below.

In a component mounting apparatus for mounting various components on a mounting board, high-precision control of mounting conditions has been required in order to be able to handle a wide variety of components and to increase speed and versatility.

[0004] In addition, pressure control during component mounting is also one of the important factors. Conventionally, in order to cope with various types of components, the outer peripheral portion of a rotating body rotatable about a fixed shaft is radially formed. Various methods have been developed for individually adjusting the pressing force for a multi-axis mounting nozzle having a plurality of holding means. However, in terms of high speed, compactness, and high accuracy, it is still present. There was no effective means.

[0005]

SUMMARY OF THE INVENTION Therefore, there is provided a component mounting in which a pressure adjusting unit for controlling the rotation of the above-mentioned multi-axis mounting nozzle capable of supporting various models and adjusting the pressure of the multi-axis mounting nozzle is installed at the center thereof. It is intended to provide a device.

[0006]

SUMMARY OF THE INVENTION In view of the above problems, a component mounting apparatus according to the present invention has a mounting mechanism 21 having a plurality of bonding nozzles 26 for sucking bare chips as shown in FIG. An adjustment mechanism 30 for adjusting the pressing force of the bonding nozzle 26 when mounting the bare chip adsorbed on the bonding nozzle 26 of the mechanism 21 on the mounting substrate 2 is provided.

As shown in FIG. 4, a plurality of bonding nozzles 26 of the mounting mechanism 21 are erected from an outer peripheral portion of a rotating body 24 rotatable about a fixed shaft 23. And

Further, the pressure of the bonding nozzle 26 is adjusted by the adjusting mechanism 30 only to a desired bonding nozzle 26 positioned on the mounting substrate 2 by the rotation of the rotating body 24. .

A rotating body 24 rotatable about a fixed shaft 23, and a bonding nozzle 26 erected from an outer peripheral portion of the rotating body 24 radially and adsorbing a bare chip mounted on the mounting board 2. And an adjusting mechanism 30 for adjusting the pressing force of the bonding nozzle 26 by contacting one end of the bonding nozzle 26 slidable through a notch 25 formed in a part of the fixed shaft 23.
And characterized in that:

Further, the adjusting mechanism 30 includes a contact lever 31 that contacts one end of the bonding nozzle 26,
It is characterized by comprising a voice coil motor 33 which is connected to the contact lever 31 and which can adjust the pressing force.

The adjusting mechanism 30 includes a contact lever 31 that contacts one end of the bonding nozzle 26,
It is characterized by comprising an adjusting mechanism 30 capable of adjusting the pressing force connected to the contact lever 31 and a contact portion 37 (load cell) for detecting the pressing force by the adjusting mechanism 30.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a component mounting apparatus to which the present invention is applied, FIG. 2 is an enlarged side view of a component mounting unit which is a part thereof, and FIGS. It is an expanded sectional view shown.

In FIG. 1, reference numeral 1 denotes a component mounting apparatus main body.
The main body 1 is supplied from a supply stocker (not shown), and a work pallet 3 on which a mounting board 2 on which various components are mounted is placed and transported to a mounting station. Transport mechanism 4 is configured. The mounting board 2 mounted on the work pallet 3
May be one sheet or a plurality of sheets.

Various configurations are conceivable as the configuration of the transport mechanism 4. In the present embodiment, a slide that can move horizontally while being guided by the transport guide 5 with the work pallet 3 mounted thereon. Although a configuration having the mechanism 6 is adopted, for example, a transport system using a conveyor or a rod feed system may be used.

Further, in this embodiment, in order to improve the efficiency of component mounting, a plurality (for example, two) of component supply units to be described later are prepared, and a corresponding work pallet 3 is provided.
The (mounting board 2) is transported to the mounting station by a plurality (two) at a time.

Reference numeral 10 denotes a component group containing a large number of components (in this embodiment, a diced semiconductor wafer, hereinafter referred to as a wafer, and a component taken out from the wafer 11 is referred to as a bare chip). , 4)
The mounting table is capable of moving in the X direction, the Y direction, and rotating by θ, and is arranged in two adjacent shapes. The range indicated by the two-dot chain line so as to surround the outer peripheral portion of the mounting table 10 in FIG. 1 is the moving range of the mounting table 10 with respect to the center T.

Reference numeral 15 denotes a take-out mechanism for taking out a desired bare chip from the inside of the wafer 11 on the mounting table 10 and transferring it onto the inspection table 16, and having a pickup arm 17 that can be rotated 90 ° horizontally and vertically. Pickup arm 1
After the bare chips on the wafer 11 are sucked out at 7, the pickup arm 17 is rotated by 90 ° via the fulcrum to transfer the bare chips onto the inspection table 16.

Reference numeral 20 denotes an inspection mechanism for inspecting the state (posture, chipping, etc.) of the bare chip transferred onto the inspection table 16, and the posture of the bare chip by a recognition camera (not shown) positioned above the inspection table 16. And recognizes a chipped state or the like.

21 is supported by the main body of the component mounting apparatus,
A mounting mechanism for taking out the bare chip after the inspection and mounting it on the mounting substrate 2 and having a bonding head 22 capable of moving horizontally and vertically and from the inspection station to the mounting station by the inspection mechanism 20 and capable of rotating θ.
After the bare chip on the inspection table 16 is suctioned and taken out by the bonding head 22, the bare chip is horizontally moved to a mounting point on the mounting board 2, and moved down at that point to bond the bare chip.

The configuration of the mounting mechanism 21 (component mounting unit) will be described below with reference to FIGS.

Reference numeral 23 denotes a fixed shaft constituting the component mounting unit, 24 denotes a rotating body rotatable about the fixed shaft 23, and the bonding head 22 includes a plurality of bonding heads 22 radially from an outer peripheral portion of the rotating body 24. In the present embodiment, six are erected. More specifically, the bonding head 22
As shown in FIG. 4, a direction of contact and separation with the mounting board 2 through a notch 25 (corresponding to a bare chip removal and mounting operation direction) formed in a part of the fixed shaft 23 (see FIG. 4). Bonding nozzle 26 slidable in the direction indicated by the arrow).
(Equivalent to a multi-axis mounting nozzle).

Reference numeral 27 denotes a spring for urging the bonding nozzle 26 toward the mounting substrate. Reference numeral 28 denotes a pair of bearings attached to the tip of the bonding nozzle 26 via a metal fitting 29. It is configured to enter the center of the fixed shaft 23 via the notch 25.

Reference numeral 30 denotes an adjusting mechanism for adjusting the pressing force during the bare chip mounting operation by the bonding nozzle 26. The structure of the adjusting mechanism 30 will be described below.

Reference numeral 31 denotes a contact lever which contacts the bearing 28. The contact lever 31 is connected via a connecting lever 32 to a voice coil motor 33 capable of adjusting the pressing force. As is well known, the voice coil motor 33 adjusts the magnetic force and moves the movable portion 34 by a predetermined amount (for example,
The connection lever 3 can be inserted deeply into the groove 35).
2 rotates around a shaft 36 as a fulcrum, and the contacting lever 31 contacts the bearing 28 via a contacting portion 37 with which the connecting lever 32 contacts.
Is pressed against the mounting substrate 2 side. Further, by adjusting the magnetic force and moving the movable portion 34 in the opposite direction by a predetermined amount (to enter the groove portion 35 shallowly), the connection lever 32 and the contact portion 3 are moved.
The pressing force of the bonding nozzle 26 against the mounting board 2 via the bearing 28 by the contact lever 7 and the contact lever 31 is reduced as compared with the case described above.

In the present embodiment, a load cell is used as the contact portion 37. This makes it possible to perform a mounting operation while monitoring the pressurizing force control by the voice coil motor 33. Mounting work becomes possible. When the monitoring operation is not required, it is only necessary to provide the contact lever 31 that is directly connected to the movable portion 34 of the voice coil motor 33 and contacts the bearing 28 on the bonding nozzle 26. Points can be reduced.

40 drives the rotating body 24 to rotate,
A rotating mechanism for selecting a plurality of (multi-axial) bonding nozzles 26, and a pulley 4 fitted to a rotating shaft 42 of a motor 41.
3 and an endless belt 44 engaged with a pulley constituting the rotating body 24. The rotating body 24 is driven to rotate about the fixed shaft 23 by the rotation of the motor 41.

Reference numeral 46 denotes a rotation mechanism for driving the nozzle 26 to rotate by θ, and a pulley 49 fitted to a rotation shaft 48 of a motor 47 and a support member for supporting the entire component mounting portion (a support member for supporting the fixed shaft 23). The motor 47 includes an endless belt 53 that engages with a pulley that forms the support body 51 and a rotating body 52 to which the support body 51 is fixed.
By rotating the rotating body 52 by the rotation of, the mounting direction of the bare chip sucked by the nozzle 26 can be adjusted.

In FIG. 2, reference numeral 54 denotes a vertical movement mechanism which enables the component mounting unit to move up and down (moves in the direction of contact and separation with respect to the mounting board 2 and the inspection table 16). The slide mechanism 59 supporting the component mounting portion is guided by the guide body 60 to move up and down by the rotational driving of the ball screw shaft 58 fitted via 57, whereby the component mounting portion can move up and down.

Reference numeral 62 denotes a moving mechanism which enables the component mounting unit to move horizontally (reciprocal movement between the inspection table 16 and the mounting board 2 shown in FIG. 1), and a ball screw shaft 63 driven by rotation of a motor (not shown). The guide body 60 connected to the component mounting unit is guided by the guide body 64 and horizontally moved by the rotational driving of the component mounting unit.
And the mounting board 2 can be reciprocated.

Hereinafter, the component mounting operation will be described with reference to the drawings.

First, before starting the component mounting operation, the operator mounts various bonding nozzles 26 corresponding to various bare chips to be handled during the mounting operation to the tip of the bonding head 22 shown in FIG. If only one type of bare chip is handled, one type of bonding nozzle 26 may be mounted.

When the preparation is completed, the operator starts the component mounting work.

First, the mounting table 10 is moved in the X and Y directions and rotated by θ (the range indicated by the two-dot chain line surrounding the outer periphery of the mounting table 10 is the movement of the mounting table 10 with respect to the center T). Then, the pickup arm 17 of the take-out mechanism 15 is positioned above the desired bare chip (see FIG. 1).

Next, the pick-up arm 17 moves down by a predetermined amount to suck and take out a desired bare chip. At the time of suction and removal, a push-up mechanism (not shown) is provided to push up the bare chip from the back surface of the wafer to facilitate suction and removal.

Subsequently, after picking up the bare chip on the wafer 11 by the pick-up arm 17, the pick-up arm 17 is rotated 90 ° via a fulcrum,
A bare chip is transferred onto the inspection table 16. At this time,
The direction of the bare chip on the wafer 11 and the direction of the bare chip on the inspection table 16 are the same. Here, the inspection table 16
The bare chip state (posture, chipping, etc.) transferred above is
It is recognized by the inspection mechanism 20.

Finally, the bare chip after the completion of the inspection is taken out by the bonding head 22 (bonding nozzle 26) of the mounting mechanism 21, and the bare chip is bonded to a mounting point on the mounting substrate 2 via the bonding nozzle 26.

Hereinafter, this bonding operation will be described with reference to FIG.
This will be described with reference to FIGS.

First, in order to take out the bare chip on the inspection table 16, the component mounting section on which the bonding head 22 is mounted is moved by the ball screw shaft 6 by the rotation of the motor of the moving mechanism 62.
By the rotation drive of No. 3, the guide body 64 guides the guide body 64 to move horizontally to be positioned on the inspection table 16.

After the inspection is completed, the ball screw shaft 5 by the rotation of the motor 55 of the vertical movement mechanism 54 is placed on the upper surface of the bare chip.
When the slide mechanism 59 is guided by the guide body 60 and moved downward by the rotation drive of 8, the bonding nozzle 26 is brought into contact with the upper surface of the bare chip on the inspection table 16 with a predetermined pressing force, and the The bare chip is sucked by the bonding nozzle 26 via the suction mechanism.

At this time, the method of adjusting the pressure of the bonding nozzle 26 is such that the bonding nozzle 26 reaching the position of the notch 25 formed in the fixed shaft 23 as described above
It slides through the notch 25 to the center of the fixed shaft 23, and the bearing 28 located above the bonding nozzle 26 is connected to the voice coil motor 33 by the connecting lever 32.
When the contact lever 31 connected via is contacted,
The pressure control of the bonding nozzle 26 is performed.

That is, the movable portion 34 is moved by a predetermined amount by controlling the magnetic force of the voice coil motor 33 by program control. For example, when the movable part 34 is inserted deeply into the groove 35, the connection lever 32 rotates about the shaft 36 as a fulcrum, and the contact lever 31 contacts the contact part 37 with which the connection lever 32 contacts. Is the bearing 2
8, the bonding nozzle 26 is pressed against the mounting substrate 2 according to the amount of movement of the movable portion 34 against the urging force of the spring 27.

Thus, the mounting operation of the bare chip by the bonding nozzle 26 is performed in a state where the pressure is adjusted to a desired pressure. Thus, the voice coil motor 3
By performing the program control of No. 3, highly accurate pressure control can be performed. Further, in the present configuration, only the desired bonding nozzle 26 positioned on the mounting substrate 2 by the rotation of the rotating body 23 is subjected to the pressure adjustment by the adjustment mechanism 30. The apparatus configuration can be made more compact as compared with a configuration having an adjustment mechanism.

Since a load cell is used as the contact portion 37 in this embodiment, the mounting operation can be performed while monitoring the pressing force control by the voice coil motor 33, and the mounting operation is set during the mounting operation. If it is determined that the pressure is not the desired pressure, for example, the mounting operation is temporarily interrupted, and the operator is notified of the abnormality. As described above, the mounting operation can be performed while monitoring the pressing force adjustment control using the load cell, so that the mounting accuracy is improved.

Next, the bonding nozzle 26 sucking the bare chip is moved upward by the vertical movement mechanism 54, horizontally moved from the inspection table 16 to the mounting point on the mounting board 2 by the movement mechanism 62, and further vertically moved. The mechanism 54 moves down to mount the bare chip on the mounting board 2.

Hereinafter, the same operation is repeated, but if the type of bare chip to be sucked next is the same, the nozzle 26 sucks out the bare chip on the inspection table 16 and mounts it on the mounting board 2. Is performed. In this case, the mounting operation is performed with the pressing force as described above.

In the case of handling another type of bare chip (for example, taller than the bare chip), for example, even if the same type of bonding nozzle 26 is used, it is necessary to change the pressing force.

That is, when the mounting operation is performed with the same pressing force as described above, the bare chip is damaged by the same pressing force as the height of the bare chip is increased. Therefore, the magnetic force of the voice coil motor 33 is adjusted, and the movable portion 34 is inserted into the groove 35 shallowly, so that the connecting nozzle 32 through the bearing 28 by the connecting lever 32, the contact portion 37 and the contact lever 31. The pressing force against the mounting substrate 2 is reduced as compared with the above-described mounting operation.

In the above description, an example using the same type of bonding nozzle 26 has been introduced.
For example, a description will be given of a suction operation of a bare chip using a bonding nozzle 26 of a different type and a mounting operation on the mounting substrate 2.

In this case, first, the bonding nozzle 26 corresponding to the bare chip on the inspection table 16 is selected.

That is, the rotating body 24 is rotationally driven by the rotation of the motor 41 of the rotating mechanism 40, and a desired bonding nozzle 26 is selected. If the selection operation is controlled so as to be performed during the horizontal movement operation on the inspection table 16, the workability is good.

Thereafter, as described above, the bonding nozzle 26 is moved down to the upper surface of the bare chip after the inspection by the vertical movement mechanism 54, and the nozzle 26 comes into contact with the upper surface of the bare chip on the inspection table 16 at a desired pressure. The bare chip is sucked and taken out.

The pressing force of the bonding nozzle 26 at this time is also a desired pressing force controlled by the program as described above.

Thereafter, similarly, the bonding nozzle 26 having sucked the bare chip moves to a mounting point on the mounting board 2 and mounts the bare chip on the mounting board 2.

[0055]

According to the present invention, it is possible to adjust the pressure applied to each nozzle in a component mounting apparatus of a multi-axis mounting nozzle type capable of supporting various types of components.

Further, a plurality of holding means of the mounting mechanism are erected from the outer periphery of the rotating body rotatable about a fixed axis and are provided on a mounting board by rotation of the rotating body. Since the pressure adjustment by the adjusting mechanism is performed only on the holding means, it is not necessary to provide an adjusting mechanism for each holding means, and the apparatus configuration can be made compact.

Further, since the adjusting mechanism is constituted by a contact portion abutting on one end of the holding means and a voice coil motor connected to the abutting portion and capable of adjusting the pressing force, By performing program control of the coil motor, highly accurate pressure control can be performed.

Further, since the mounting operation can be performed while monitoring the pressure adjustment control by the load cell, the mounting accuracy can be further improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a component mounting apparatus to which the present invention is applied.

FIG. 2 is a side view showing a component mounting unit to which the present invention is applied.

FIG. 3 is a partial cross-sectional view showing a component mounting unit to which the present invention is applied.

FIG. 4 is a sectional view showing a bonding head of a component mounting section to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting apparatus main body 2 Mounting board 4 Transport mechanism 21 Mounting mechanism 22 Bonding head 23 Fixed shaft 24 Rotating body 26 Bonding nozzle 31 Contact lever 33 Voice coil motor 37 Load cell

Continued on the front page F term (reference) 5E313 AA02 AA11 AA21 AA23 CC01 CC04 CD06 DD02 DD03 DD12 DD21 DD23 DD31 DD33 EE01 EE02 EE03 EE05 EE24 EE25 EE33 EE35 EE37 EE38 FF06 FF28 5F044 PP16 PP17

Claims (7)

[Claims] 1. A component mounting apparatus for mounting various components on a mounting board, comprising: a mounting mechanism having a plurality of holding means for holding the components; and a component held by the holding means of the mounting mechanism on the mounting board. An adjusting mechanism for adjusting a pressing force of the holding means when mounting. 2. The component mounting according to claim 1, wherein a plurality of holding means of the mounting mechanism are erected radially from an outer peripheral portion of a rotating body rotatable about a fixed axis. apparatus. 3. The pressure adjusting device according to claim 2, wherein the holding means adjusts the pressing force by an adjusting mechanism only to a desired holding means positioned on a mounting board by rotation of the rotating body. Component mounting equipment. 4. A rotating body rotatable about a fixed shaft, a plurality of erected radially from an outer peripheral portion of the rotating body, and holding means for holding a component mounted on a mounting board; A mounting mechanism for adjusting the pressing force of the holding means by contacting one end of the holding means slidable through a notch formed in a part of the component mounting part. apparatus. 5. The adjusting mechanism according to claim 1, wherein the adjusting mechanism includes a contact portion that abuts one end of the holding unit, and a voice coil motor that is connected to the abutting portion and that can adjust the pressing force. The component mounting apparatus according to claim 4, wherein 6. The adjusting mechanism detects an abutting portion abutting on one end of the holding unit, an adjusting mechanism connected to the abutting portion, the adjusting mechanism being capable of adjusting a pressing force, and a pressing force by the adjusting mechanism. The component mounting apparatus according to claim 4, further comprising a detection mechanism. 7. The component mounting apparatus according to claim 6, wherein the adjustment mechanism is a voice coil motor, and the detection mechanism is a load cell.