JP4484823B2 - Electronic circuit component mounting machine - Google Patents

Description

  The present invention relates to an electronic circuit component mounting machine that receives an electronic circuit component from a component supply device by a suction nozzle and mounts the electronic circuit component on a circuit board, and particularly relates to detection of a load applied to the electronic circuit component by the suction nozzle.

  In the electronic circuit component mounting machine, for example, as described in Patent Document 1, the mounting head holding the suction nozzle is moved to an arbitrary position in the horizontal plane by the head moving device and is moved up and down by the head lifting device. In some cases, an electronic circuit component is received from a component supply device by a suction nozzle and mounted on a circuit board. The electronic circuit component is a component that is mounted on a circuit board such as a printed wiring board and constitutes an electronic circuit. The mounting head holds the suction nozzle so as to be relatively movable in the axial direction by the nozzle holder, and when the electronic circuit component is received from the component supply device, the mounting head is lowered after the suction nozzle contacts the electronic circuit component. The absorption nozzle is absorbed by relative movement with respect to the nozzle holder. Also, when the electronic circuit component is mounted on the circuit board, the lowering of the mounting head after the electronic circuit component contacts the circuit board is similarly absorbed. Usually, a spring member is provided between the nozzle holder and the suction nozzle, and the suction nozzle is normally biased in a direction protruding from the nozzle holder. The nozzle holder sucks the spring member while elastically deforming the spring member. By moving with respect to the nozzle, an excessive lowering of the mounting head is allowed, and the impact when the suction nozzle contacts the electronic circuit component and the impact when the electronic circuit component contacts the circuit board are alleviated, In addition, the pressing force of the suction nozzle against the electronic circuit component is set to an appropriate magnitude.

In this way, when the electronic circuit component is sucked and mounted by the suction nozzle, the electronic circuit component has a weight of the suction nozzle, an urging force of the spring member, and the nozzle holder and the suction by the relative movement of the suction nozzle and the nozzle holder. A force based on the sliding resistance with the nozzle is applied. If this force is not appropriate, the electronic circuit component and the suction nozzle may be damaged, or the pressing force of the electronic circuit component against the circuit board may be insufficient or excessive, and the mounting may not be performed properly. Therefore, in the electronic circuit component mounting machine described in Patent Document 1, a load detection device is provided in the mounting head, and the load applied to the electronic circuit component when the suction nozzle receives the electronic circuit component is detected. The lowering of the mounting head is controlled so as to be a large size. The same applies when the suction nozzle mounts the electronic circuit component on the circuit board.
Japanese Patent Laid-Open No. 5-191097

However, the electronic circuit component mounting machine described in Patent Document 1 has a problem that the pressing force of the suction nozzle to the electronic circuit component cannot be accurately detected. As described above, the pressing force of the suction nozzle to the electronic circuit component is equal to the sum of the weight of the suction nozzle, the biasing force of the spring member, and the sliding resistance between the suction nozzle and the nozzle holder. In the electronic circuit component mounting machine, the pressing force of the suction nozzle against the electronic circuit component is acquired by detecting the biasing force (elastic force) of the spring member disposed between the suction nozzle and the holder. It has become. For this reason, only the force obtained by subtracting at least the sliding resistance between the suction nozzle and the nozzle holder (and the weight of the suction nozzle as the case may be) can be detected from the pressing force of the suction nozzle against the electronic circuit components. If the above sliding resistance can be regarded as constant, this problem is not so important. May not increase the amount. In that case, the pressing force of the suction nozzle against the electronic circuit component becomes excessive, which may cause damage to the suction nozzle and electronic circuit component, or decrease in mounting position accuracy. Accordingly, an object of the present invention is to make it possible to accurately detect the pressing force of the suction nozzle against the electronic circuit component in the electronic circuit component mounting machine and to appropriately control the pressing force. It is a thing.

Above-mentioned problems, an electronic circuit component mounting machine, a component supply device for supplying (i) the electronic circuit component, a board holding device that holds a (ii) a circuit board, an electronic circuit component by (iii) the negative pressure A mounting head for receiving an electronic circuit component from the component supply device and mounting it on a circuit board held by the substrate holding device, comprising a nozzle holder that holds the suction nozzle to be sucked and held so as to be relatively movable in the axial direction; (iv) a mounting relative motion imparting device that imparts relative motion necessary for mounting electronic circuit components to the mounting head, the substrate holding device, and the component supply device; and (v) the mounting head provided with a detector. Provided separately from the load detection device that detects the load applied by the suction nozzle to the detection unit, and (vi) provides the mounting head and the load detection device with a relative motion necessary to detect the load, The suction nozzle is connected to the detection unit A load detection relative motion imparting device; and (vii) a load detected by the load detection device between the start of contact of the suction nozzle to the detection unit and the end of approach of the mounting head to the detection unit. The maximum load generated by once increasing and then decreasing and the steady load that is the load detected by the load detecting device after completion of the approach of the mounting head to the detection unit are acquired, and the maximum load is preset. If the normal load is within the set maximum load range but normal but the steady load is out of the preset set steady load range and is abnormal, the mounting head and the load detection by the relative motion applying device for load detection It is solved by including means for determining that the application of relative motion with the apparatus is abnormal.

If the suction nozzle detects the load applied to the detection unit, the suction nozzle receives the electronic circuit component and can accurately detect the load applied to the electronic circuit component when it is mounted. It is possible to appropriately receive and mount the circuit components.
In addition, since the load detection device is provided separately from the mounting head, the mounting head can be made lighter than when it is provided on the mounting head, and when the mounting head is given motion by the mounting relative motion applying device. The acceleration and deceleration of the exercise can be increased, and the wearing efficiency can be improved. Furthermore, it is not necessary to secure a space for installing the load detection device on the mounting head, and the load detection device can be shared by a plurality of mounting heads, and the load can be detected easily and inexpensively. .
Further, if the load detecting device is provided on the mounting head, when the mounting relative motion applying device imparts motion to the mounting head, the load detecting device and the signal extraction circuit from the load detecting device are shocked at the start and stop of the motion. In the case according to the present invention, the impact does not act or is small, and the occurrence of the failure is well avoided. When the load detection device is kept stationary, the impact does not act. For example, even when moved with the component supply feeder, the impact is smaller than when moved with the mounting head. Since the load detection device is provided separately from the mounting head, the load is not detected every time the electronic circuit component is received and mounted by the suction nozzle, but is detected at a time different from the mounting operation. It is desirable to make it. Since the sliding resistance between the suction nozzle and the nozzle holder rarely changes suddenly, it was detected at a different time from the mounting work even if the load was not detected and the movement of the mounting head was not controlled during the mounting work. The electronic circuit components can be mounted without any trouble using the load.
Moreover, since the "relative-motion applying a load heavy detecting relative motion applying device Ru instrumentation wearing head and load weight detecting device good in means it determines that abnormal" including, by abnormal relative motion imparted, the suction nozzle It is possible to prevent erroneous detection of the load applied to the detection unit. In particular, in the aspect where the mounting relative motion applying device also serves as the load detecting relative motion applying device, the mounting relative motion applying device is abnormal. Therefore, it is possible to prevent the suction nozzle from being pressed against the electronic circuit component and the electronic circuit component from being attached to the circuit board due to an erroneous pressing force.

The following invention which is considered claimable (hereinafter referred to as "claimable invention" there Ru.) Illustrate some aspects of them will be described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

Note that some of the inventions in the following paragraphs are no longer claimed in the claims due to amendments, but contain statements useful for understanding the inventions in the claims. Therefore, it will be left as it is.

(1) a component supply device for supplying electronic circuit components;
A circuit board holding device for holding the circuit board;
A circuit board that includes a nozzle holder that holds a suction nozzle that sucks and holds an electronic circuit component by negative pressure so as to be relatively movable in the axial direction, receives the electronic circuit component from the component supply device, and is held by the substrate holding device A mounting head to be mounted on,
A mounting relative motion imparting device for imparting relative motion necessary for mounting electronic circuit components to the mounting head, the substrate holding device, and the component supply device;
A load detection device that includes a detection unit and is provided separately from the mounting head, and detects a load applied by the suction nozzle to the detection unit;
A relative motion imparting device for load detection that imparts a relative motion necessary for detecting the load to the mounting head and the load detection device, and presses the suction nozzle against the detection unit;
An electronic circuit component mounting machine including a load detection result utilization device that utilizes a load detection result obtained by the load detection device.

(2) A load detection control unit that controls the load detection relative motion imparting device, causes the suction nozzle to contact the detection unit, and causes the load detection device to detect a load applied to the detection unit by the suction nozzle at the time of contact. The electronic circuit component mounting machine according to item (1).
The load detection control unit is configured to include, for example, a load detection relative motion imparting device control unit that controls the load detection relative motion imparting device and a load detection device control unit that controls the load detection device. These control units may be configured by different control devices, or may be configured by the same control device.
Based on the control by the load detection control unit, the mounting head and the load detection device are relatively moved to detect the load.

(3) The load detection control unit applies the load detection relative motion applying device and the load detection device when the electronic circuit component mounting machine is not performing the mounting operation of the electronic circuit component on the circuit board. The electronic circuit component mounting machine according to (1) or (2), including a load detection control unit for non-mounting work for detecting the load.
The load detection control unit during non-mounting work starts the mounting work of one lot of circuit boards, starts the operation after the machine stops for more than the set time, sets the operating time, sets the number of components, and sets the number of boards. For example, when a predetermined condition is satisfied, the load detection device can detect the load.
According to the electronic circuit component mounting machine of this section, the load is detected periodically. Therefore, for example, it is easy to maintain and manage the electronic circuit component mounting machine in a state where the electronic circuit component can be properly received and mounted, and when the load is detected every time the electronic circuit component is received and mounted Compared to this, the time required for the component mounting work can be shortened, and the load is accurately detected while avoiding the efficiency of the mounting work, and the electronic circuit component is received and mounted appropriately by using the detection result. It can be made to be. Furthermore, the effect that the maintenance man-hour is reduced can be obtained. If the load is not detected, frequent maintenance is necessary to avoid the occurrence of abnormalities, and the number of maintenance increases, whereas if the load applied by the suction nozzle is detected periodically, The occurrence of load abnormality can be predicted based on the detection result, and the number of maintenance can be reduced.

(4) The electronic circuit component mounting machine according to any one of (1) to (3), further including a load detection result recording unit that records a load detection result by the detection unit.
The load detection result recording unit includes a detection load recording unit that records the detected load itself, or a post-processing information recording unit that records a result of statistically processing the detected load, a result of pass / fail determination, and the like. Can be included.
If the load detection result is recorded, it is easy to use the result. For example, the load detection result can be used at a time different from the detection time. It is not necessary to use each time the load is detected. For example, the load is detected multiple times for one suction nozzle, the entire detection result is recorded, an average value is obtained, or a plurality of mounting heads are used. When provided or when the mounting head holds a plurality of suction nozzles, the detection results can be used after performing load detection for each of the plurality of suction nozzles, and detection and use are performed efficiently. be able to. Even when the load detection result is used at the time of detection, if the detection result is recorded in the recording unit, it can be further used later.
Further, it is easy to provide a load detection result utilization device separately from the component supply device, the circuit board holding device, the mounting head, the mounting relative motion applying device, the load detecting device, and the load detecting relative motion applying device. This is because, if the load detection result is recorded, the load detection result utilization device only has to acquire the load detection result from the load detection result recording unit, and is less related to other components of the electronic circuit component mounting machine.
(5) The electronic circuit component mounting machine according to (4), wherein the load detection result recording unit is provided in the load detection device.
According to the electronic circuit component mounting machine described in this section, for example, load detection and recording are performed in the load detection device, and recording is easily performed corresponding to the detection.

(6) The load detection result recording unit records a change in load with the passage of time in one contact of the suction nozzle with the load detection device, and the detected load recording unit The electronic circuit component mounting machine according to (4) or (5), further including a detected load recording time limiting unit that limits at least one of a recording start time and a recording end time of the detected load.
According to the electronic circuit component mounting machine described in this section, it is possible to reduce the recording amount as compared with the case where the entire detected load is recorded, and it is possible to make the detected load recording unit small in capacity and inexpensive. Alternatively, it is possible to increase the number of suction nozzles in which load detection results are recorded, or to increase the number of detections per suction nozzle.
(7) The detected load recording time limiting unit sets the recording start time to a time before the contact start time of the suction nozzle to the detection unit, and sets the recording end time after the contact start time. The electronic circuit component mounting machine according to (6), wherein the electronic circuit component mounting machine is set to a time before the end of relative motion for load detection between the mounting head and the detection unit.
According to the electronic circuit component mounting machine described in this section, the load when at least the suction nozzle starts to contact the detection unit is recorded. Since the load detected at the time when the load is most likely to be large is recorded, it is possible to reliably record an excessive load.

(8) The load detection result utilization device is a detection result analysis unit that analyzes a load detection result by the load detection device, and includes at least (a) a maximum value and a minimum value of the detected load, the mounting head, and the load Obtaining a preset load, such as a load at the end of relative motion with the detection device, (b) examining a change tendency of the load during relative motion between the mounting head and the load detection device, and (c) them. The electronic circuit component mounting machine according to any one of (1) to (7), wherein at least one of acquiring the state and characteristics of the suction nozzle represented by the above is performed.
According to the electronic circuit component mounting machine described in this section, for example, if the suction nozzle is usable or unusable, it is possible to investigate what is the cause.
(9) The electronic circuit component mounting according to any one of (1) to (8), wherein the load detection result utilization device includes a nozzle abnormality warning unit that warns of an abnormality of the suction nozzle based on the load detection result. Machine.
If the suction nozzle abnormality is warned, for example, if the abnormality warning nozzle is actually held by the mounting head, the operator can replace the normal suction nozzle or perform maintenance. Thus, it is possible to avoid the production of a defective circuit board by using an abnormal suction nozzle while it is abnormal. A suction nozzle replacement instruction or maintenance instruction may be issued together with the abnormality warning or as a kind of abnormality warning. In this case, the load detection result utilization device includes a nozzle replacement instruction unit and a maintenance instruction unit.
(10) The electronic circuit component according to any one of (1) to (9), wherein the load detection result utilization device includes a nozzle quality determination unit that determines quality of the suction nozzle based on the load detection result. Mounting machine.
For example, it is determined whether the suction nozzle is a non-defective nozzle or a defective nozzle by comparing the detected load with a set value. If the detected load is abnormally large, the load applied to the electronic circuit component by the suction nozzle becomes excessive, which may damage the electronic circuit component or the circuit board, and the suction nozzle is considered to be a defective nozzle. On the other hand, even if the detection load is abnormally small, for example, the pressing force applied to the electronic circuit component by the suction nozzle may be insufficient, and the electronic circuit component may not be received or mounted properly. It is considered a defective nozzle. In any case, if the quality of the suction nozzle is determined, it can be determined whether or not the suction nozzle is a defective nozzle, and production of a defective substrate due to the use of the defective nozzle can be avoided.
(11) The electronic circuit component according to any one of (1) to (10), wherein the load detection result utilization device includes a nozzle use prohibition unit that prohibits use of the suction nozzle based on the load detection result. Mounting machine.
The use of the suction nozzle is prohibited, for example, with respect to the suction nozzle currently held by the mounting head. Even if the suction nozzle remains held by the mounting head, it will not be used for mounting electronic circuit components thereafter. To be. Alternatively, use of the suction nozzle that is not held by the mounting head when the load detection result is used is prohibited, and thereafter, it is held by the mounting head and is not used for mounting work.
Nozzle use prohibition includes various modes such as, for example, storing the use prohibition data in association with data that can individually specify the suction nozzle, such as the nozzle ID, and displaying the use prohibition nozzle on the display device. Done in

(12) A display device, wherein the load detection result utilization device includes a load detection result display unit that causes the display device to display a load detection result by the load detection device. The electronic circuit component mounting machine described in 1.
The load detection result display section displays on the display device the raw load that is the detected load itself, the processing load after statistical processing of the raw load, the suction nozzle abnormality warning, the suction nozzle pass / fail judgment result, the suction nozzle use prohibition, etc. It can be displayed.
If the load detection result is displayed, it is easy for the operator to understand and the response to the detection result is easy.
(13) The load detection result utilization device is provided separately from a control device that controls the mounting relative motion applying device, and is provided in an external device that can receive the load detection result from the load detection device (1). The electronic circuit component mounting machine according to any one of items 1 to (12).
Receiving the load detection result from the load detection device can be performed in various modes, for example, by wired communication using a communication cable, or by wireless communication.
The load detection result utilization device may be provided in a control device that controls the mounting relative motion applying device, or may be provided in a control device that controls the load detection device. If the load detection result utilization device is provided in the external device as in the electronic circuit component mounting machine described in this section, for example, the load detection result is used in parallel with the mounting operation of the electronic circuit component in the electronic circuit component mounting machine. Or can be shared by a plurality of electronic circuit component mounting machines, and the cost required for using the load detection result can be reduced.
(14) The electronic circuit component mounting machine according to any one of (1) to (13), wherein the mounting relative motion applying device also serves as the load detecting relative motion applying device.
According to the electronic circuit component mounting machine described in this section, it is possible to easily and inexpensively configure the electronic circuit component mounting machine in which the load detection of the suction nozzle is performed.

(15) The electronic circuit component mounting machine according to any one of (1) to (14), wherein the detection unit of the load detection device includes a load cell.
(16) In the detection unit, one of two surfaces opposite to each other is a nozzle contact surface larger than the suction surface of the suction nozzle, and the opposite surface is in contact with the input portion of the load cell in a spot shape. The electronic circuit component mounting machine according to the item (15), including a transmission body that is swingable about the contact portion.
The shape of the suction surface is not limited to a circle, and various shapes such as an ellipse, a rectangle, and a square can be employed. The nozzle contact surface is larger than the suction surface regardless of the shape and dimensions of the suction surface. According to the electronic circuit component mounting machine described in this section, even if the load cell input portion is small and the suction surface is large, a load can be applied to the load cell and detected, and multiple types of suctions with different suction surface sizes can be detected. It can be set as the load detection apparatus common to a nozzle.
Further, the transmission body is brought into contact with the input portion of the load cell so as to be able to swing. For example, even if the suction surface is worn and the surface is slightly inclined with respect to the axis of the suction nozzle, the transmission body swings. Then, a force can be applied to the input portion of the load cell at substantially the same position as the center of the suction surface.

(17) The electronic circuit component mounting machine according to any one of (1) to (16), wherein the load detection device is detachably attached to the electronic circuit component mounting machine.
If the load detection device is detachably attached, for example, it is possible to share the load detection device among a plurality of electronic circuit component mounting machines of the same type or between different types of electronic circuit component mounting machines. The load detection device only needs to be attached to the electronic circuit component mounting machine at the time of load detection, can be removed at the time of non-detection, and can be used for load detection in another electronic circuit component mounting machine. It is not essential to provide a load detection device for each of the component mounting machines, and the cost required for load detection can be reduced.
Also, the load detection device only needs to be detachably attached to the electronic circuit component mounting machine, and the mounting configuration can be simplified compared to the case where it is fixedly provided on the electronic circuit component mounting machine. It is possible to reduce the cost.
Furthermore, after the load detection device is removed, its mounting space can be used for mounting other components of the electronic circuit component mounting machine, or the mounting space of another component can be used for mounting the load detection device. It is not essential to provide a dedicated space for providing the load detection device, and the load detection device can be provided while effectively using the space of the electronic circuit component mounting machine.
When the load detection device is detachably attached to the electronic circuit component mounting machine as described above, it is particularly effective that the load detection result storage unit is provided in the load detection device as described above. In this case, the load detection device has a detection unit and a load detection result storage unit, and a plurality of electronic circuit component mounting machines can share not only the detection unit but also the load detection result storage unit.
Moreover, it is effective to combine the aspect in which the load detection result utilization device is provided in the external device and this item. For example, if the load detection device is fixed to the electronic circuit component mounting machine in a non-detachable manner, the load detection device is a dedicated load detection device, and the load detection result utilization device is provided in the control device that controls the mounting relative motion imparting device. If it is easy to use, but provided to be detachable, the load detection device may be shared by a plurality of electronic circuit component mounting machines. This is because it is possible to enjoy both effects of reducing the load detection cost and the load detection result utilization cost by providing it to be shared by a plurality of electronic circuit component mounting machines.
Furthermore, when the load detection result utilization device is provided in an external device, the degree of freedom of installation of the external device is increased. This is because the load detection device can be detached from the electronic circuit component mounting machine and connected to an external device to supply the load detection result without being restricted by the configuration of the electronic circuit component mounting machine.

(18) The electronic circuit component mounting machine according to item (17), wherein the load detection device is detachably attached to the component supply device.
The mounting head is moved relative to the component supply device by the mounting relative motion imparting device in order to receive the electronic circuit component from the component supply device. Therefore, if the load detection device is attached to the component supply device, the load detection device will be located in the relative movement region between the mounting head and the component supply device, and using the mounting relative motion applying device, It is easy to apply a relative motion necessary for load detection to the mounting head and the load detection device.
Also, for example, when a load is detected at a time different from the mounting operation, if the load detection device is removed from the component supply device except when the load is detected, the load detection device is not attached. Similarly, electronic circuit components can be supplied, and the load can be detected without causing a reduction in supply efficiency due to the attachment of the load detection device.
Furthermore, it is easy to suppress the load detection cost by attaching the load detection device using an existing device of the electronic circuit component mounting machine.

(19) The component supply device includes a plurality of component supply feeders and feeder support members, and the load detection device is selectively attachable to and detachable from at least one of the plurality of component supply feeders. The electronic circuit component mounting machine described in 1.
Each of the plurality of component supply feeders is detachably attached to the feeder support member, and the load detection device is selectively attached to and detached from at least one of the component supply feeders. The load detection device can be mounted instead of a plurality of the plurality of component supply feeders, or can be mounted instead of one. Further, it can be selectively detachable only from a specific one of the plurality of component supply feeders, or can be selectively detachable from any of the plurality of component supply feeders.
In any case, the load detection device can be attached to the feeder support member using the attachment device of the component supply feeder. The load detection device can be attached using the existing attachment portion of the feeder support member and the attachment device for attaching the component supply feeder to the attachment portion, and the load detection device can be attached to the electronic circuit component mounting machine. The installation of a dedicated attachment device can also be performed at no cost, and the attachment can be easily and inexpensively. If the load is detected at a different time from the mounting operation, it is essential to secure a space for attaching the load detection device to the feeder support member if the load detection device is removed from the feeder support member during the mounting operation. Is not. The load detection device only needs to be attached to the electronic circuit component mounting machine at the time of load detection. Providing a dedicated mounting part on the mounting machine body is wasteful in terms of space and cost, but it eliminates such waste. However, a load detection device can be provided. Moreover, if the component supply device is an electronic circuit component mounting machine including a component supply feeder and a feeder support member, the load detection device can be shared, and the shared range is wide and easy to share.

It is a top view which shows the electronic circuit component mounting machine which is an Example of this claimable invention. It is a front view (part cross section) which shows the component mounting apparatus of the said electronic circuit component mounting machine. It is a side view (partial cross section) which shows the mounting head of the said component mounting apparatus, and its periphery. It is side surface sectional drawing which shows the nozzle holder and suction nozzle of the mounting head of the said component mounting apparatus. It is a side view (partial cross section) which shows the load detection apparatus which detects the load which the said suction nozzle applies. It is a side view (partial cross section) which shows the load cell and transmission plate of the said load detection apparatus. It is a block diagram which shows roughly the microcomputer provided with the said load detection apparatus. It is a block diagram which shows roughly the control apparatus which controls the said electronic circuit component mounting machine. It is a graph which shows the relationship between the load of a suction nozzle detected by the said load detection apparatus, and descent distance, load detection, and recording time. It is a graph explaining the setting of the setting value for determining the quality of the suction nozzle based on the load detected by the load detection device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10: Mounting machine main body 14: Printed wiring board holding | maintenance apparatus 16: Component mounting apparatus 18: Component supply apparatus 24: Control apparatus 30: Printed wiring board 38: Feeder support stand 40: Tape feeder 46: Electronic circuit component 50: Mounting head 52 : XY robot 54: Head lifting device 114: Suction nozzle 132: Nozzle holder 180: Load detection device 190: Strain gauge type load cell 192: Input element 200: Transmission plate 208: Nozzle contact surface 220: Microcomputer 240: Personal computer

Embodiments of the claimable invention will be described below in detail with reference to the drawings.
FIG. 1 shows an electronic circuit component mounting machine which is an embodiment of the claimable invention. In this electronic circuit component mounting machine, the mounting head is moved to an arbitrary position in a plane parallel to the surface of the printed wiring board, receives the electronic circuit component from the component supply device, and is mounted on the printed wiring board. For example, it is already known in Japanese Patent No. 2824378 and will be described briefly.

  As shown in FIGS. 1 and 2, the electronic circuit component mounting machine includes a bed 10 constituting the mounting machine body, a wiring board transport device 12 provided on the bed 10, a printed wiring board holding device 14, and a component mounting device 16. , A component supply device 18 and a wiring board imaging system 22, a control device 24 (see FIG. 8) for controlling these devices, and the like.

  In this embodiment, the printed wiring board 30 as a circuit board is transported in a horizontal posture by the wiring board transporting device 12 and stopped at a predetermined mounting work position by a stop device (not shown). The mounting surface holds the mounting surface in a horizontal posture. The conveyance direction of the printed wiring board 30 is defined as the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction. The printed wiring board holding device 14 includes a printed wiring board support device and a clamp device (not shown), and is provided with a fixed position.

  As shown in FIG. 1 and FIG. 2, the component supply device 18 is fixed and fixed on one side of the wiring board transport device 12. The component supply device 18 is known in Japanese Patent No. 2824378, Japanese Patent Laid-Open No. 10-112598, and the like, and will be described briefly.

  The component supply device 18 includes a feeder support base 38 as a feeder support member, and a plurality of tape feeders (hereinafter abbreviated as feeders) as a component supply feeder which is a kind of a component supply tool mounted on the feeder support base 38. 40. Each of the plurality of feeders 40 includes an attachment portion (not shown), and is positioned in the width direction and the front-rear direction and is prevented from being lifted, and the plurality of feeder attachment portions (for example, provided on the feeder support base 38) (Including the slot). The feeder attachment portion is provided with an attachment device for fixing the feeder 40 to the feeder support base 38 in cooperation with the attachment portion provided in the feeder 40. These feeder attachment portions and the like are configured in the same manner as, for example, the feeder attachment portions described in JP-A-9-29550.

  In this embodiment, the feeder 40 is supplied in a state in which an electronic circuit component 46 (see FIG. 2; hereinafter abbreviated as the component 46) is held on a carrier tape (not shown) to form a taping electronic circuit component. ing. The taping electronic circuit components are fed by the feeding device, and the components 46 are sequentially positioned in the component supply unit. In the present embodiment, the plurality of feeders 40 are attached to the feeder support base 38 in a state where each component supply unit is positioned on a straight line parallel to the X-axis direction.

  As shown in FIGS. 1 and 2, the component mounting device 16 mainly moves the mounting head 50 and the mounting head 50 to an arbitrary position in a horizontal plane that is one plane parallel to the mounting surface of the printed wiring board 30. An XY robot 52 as a mounting head moving device to be mounted, a head lifting device 54 that lifts and lowers the mounting head 50, a head rotating device 56 that rotates the mounting head 50 about an axis, and the like.

  As shown in FIG. 1, the XY robot 52 includes an X-axis slide 60, an X-axis slide moving device 62 as a moving member, a Y-axis slide 64, and a Y-axis slide moving device 66 as moving members. The X-axis slide moving device 62 includes an X-axis slide drive motor 68, a ball screw 70, and a nut 71 (see FIG. 2), moves the X-axis slide 60 in the X-axis direction, and moves along with the X-axis slide 60 in the X-axis. The apparatus 72 is comprised. The Y-axis slide 64 and the Y-axis slide moving device 66 are provided on the X-axis slide 60. The Y-axis slide moving device 66 includes a Y-axis slide driving motor 76, a ball screw 78, and a nut 80, and moves the Y-axis slide 64 in the Y-axis direction, and constitutes a Y-axis moving device 82 together with the Y-axis slide 64. ing.

  The mounting head 50, the head lifting device 54, and the head rotating device 56 are provided on a Y-axis slide 64 as shown in FIG. The head lifting / lowering device 54 includes a nut 90, a ball screw 92 screwed to the nut 90, and a head lifting / lowering motor 94 as a drive source. The nut 90 is rotated by the head lifting / lowering motor 94 via a gear train 96. As a result, the ball screw 92 is moved up and down. The head rotating device 56 includes a spline shaft 102 and a head rotating motor 104 (see FIG. 7) that are integrally provided below the spline member 100 and the ball screw 92 and are fitted to the spline member 100. 100 is rotated by the head rotating motor 104 via the gear train 106, whereby the spline shaft 102 is rotated.

  As shown in FIG. 4, the suction nozzle 114 is detachably held by the chuck adapter 110 and the chuck 112 at the lower end portion of the spline shaft 102. The suction nozzle 114 includes a nozzle main body 116 as a main body part and a suction pipe 118 constituting the suction part, and sucks and holds the component 46 with a negative pressure. In this embodiment, the suction pipe 118 has a circular cross-sectional shape, and the tip surface of the suction pipe 118 constitutes the suction surface 120.

  The chuck adapter 110 has a generally cylindrical shape and is detachably fixed to the lower end portion of the spline shaft 102. The chuck 112 also has a generally cylindrical shape and is detachably fixed to the outside of the chuck adapter 110. The nozzle body 116 of the suction nozzle 114 has a cylindrical shape, is fitted in the chuck adapter 110 so as to be relatively movable in the axial direction, and is held by the chuck 112 so as not to be relatively rotatable and relatively movable in the axial direction. . The suction nozzle 114 is urged in a direction to come out of the chuck adapter 110 by a compression coil spring 124 as an elastic member which is a kind of urging device disposed between the chuck adapter 110 and the nozzle main body 116. A pair of inclined surfaces 128 provided on the pair of ears 126 and located on the same plane with each other are engaged with a pair of pins 130 provided on the chuck 112, whereby the suction nozzle 114 is chucked. 112 is held so as to be relatively movable in the axial direction and not to be relatively rotatable.

  In the present embodiment, the chuck adapter 110 and the chuck 112 constitute a nozzle holder 132 and constitute the mounting head 50 together with the lower end portion of the spline shaft 102. The suction nozzle 114 can move relative to the nozzle holder 132 in the axial direction by compressing the spring 124, and this relative movement is guided by fitting the nozzle body 116 to the chuck adapter 110. The outer peripheral surface of the nozzle body 116 constitutes a guided surface 134, and the inner peripheral surface of the chuck adapter 110 constitutes a guide surface 136. The mounting head 50 is raised and lowered by raising and lowering the ball screw 92 of the head raising and lowering device 54, and is rotated by rotating the spline shaft 102 of the head rotating device 56. Thereby, the suction nozzle 114 is moved up and down and rotated.

  The Y-axis slide 64 is also provided with the wiring board imaging system 22 as shown in FIG. The wiring board imaging system 22 includes a wiring board imaging device 140 (see FIG. 8) and an illumination device (not shown). The wiring board imaging system 22 is moved by the XY robot 52, for example, a reference provided on the mounting surface of the printed wiring board 30. The mark 142 (see FIG. 1) is imaged. Based on this imaging result, position errors in each horizontal plane of a plurality of component mounting points set on the mounting surface of the printed wiring board 30 are acquired.

  The X-axis slide 60 is provided with a component imaging system 150 as shown in FIG. The component imaging system 150 includes a component imaging device 152, a light guide device 154, and an illumination device 156, images the component 46 held by the suction nozzle 114, and selectively acquires a front image and a projection image of the component 46. It is configured as follows. Based on this imaging result, a holding position error of the component 46 by the suction nozzle 114 (including a position error and a rotation position error of the suctioned portion of the component 46 in the X-axis and Y-axis directions) is acquired.

  As shown in FIG. 1, a load detection device 180 can be detachably attached to the feeder support base 38 of the component supply device 18. The load detection device 180 is provided separately from the mounting head 50. The apparatus main body 182 of the load detection apparatus 180 is configured in the same manner as the feeder main body of the feeder 40 in the present embodiment, and is generally formed in an elongated plate shape, and as shown in FIG. An attachment portion 184 for attaching to the feeder attachment portion is provided. The attachment portion 184 is configured in the same manner as the attachment portion provided in the feeder body. The load detection device 180 can be mounted on any of the feeder mounting portions provided on the feeder support base 38, can be selectively attached to and detached from the feeder support base 38 with the feeder 40, and is provided on the feeder support base 38. It attaches to the feeder support stand 38 using the attachment apparatus which was attached, and is attached to the bed 10 so that attachment or detachment is possible. In this embodiment, the attachment position of the load detection device 180 is one end in the X-axis direction of the feeder support base 38, and is attached to the feeder support base 38 when detecting a load applied by a suction nozzle 114 described later. The configuration of the mounting portion 184 is already well known as described in, for example, Japanese Patent No. 3397900, and will not be described.

  A strain gauge type load cell (hereinafter abbreviated as a load cell) 190 is provided at the front of the apparatus main body 182 to constitute a detection unit. As shown in FIG. 6, the input element 192 constituting the input portion of the load cell 190 has a partially spherical outer peripheral surface and a protruding shape upward, and the load cell 190 protrudes upward from the casing 194 of the load cell 190. It is made to protrude and a load is applied. The input element 192 is provided integrally with a sensing part column (not shown) as a sensing member housed in the casing 194. The sensing part column is made of an elastic body, and a plurality of strain gauges are attached. When a load is applied to the input element 192, the sensing part column is compressed, and the strain of the strain gauge is converted into an electrical signal by the bridge circuit. It is converted and output.

  A transmission plate 200 as a transmission body is brought into contact with the input element 192. In the present embodiment, the transmission plate 200 is generally disc-shaped, and a projection 202 having an outer peripheral surface forming a partial spherical shape is provided at the center thereof, and as shown in FIG. A recess 204 provided at the protruding end of the load cell 190 is fitted to the input element 192 of the load cell 190. The bottom surface of the recess 204 is in contact with the input element 192, but the protrusion 202 is separated from the casing 194, and the transmission plate 200 is in contact with the input element 192 so as to be swingable. The movement in the direction parallel to the plate surface of the transmission plate 200 is restricted by the recess 204 engaging the input element 192.

  The diameter of the transmission plate 200 is larger than the outer diameter of the suction surface 120 of all types of suction nozzles 114 whose load is detected by the load cell 190, and the upper surface of the transmission plate 200 constitutes the nozzle contact surface 208. . Reference numeral 210 denotes a restricting member, which includes a restricting portion 212 that extends above the transmission plate 200, and a plurality of restricting portions 212 are provided to define the swing limit of the transmission plate 200.

  As shown in FIG. 5, a microcomputer 220 is provided at the rear part of the apparatus main body 182 of the load detection apparatus 180. As shown in FIG. 7, the microcomputer 220 includes a CPU 222, a ROM 224, a RAM 226, and a bus connecting them. The load cell 190 is connected to the input / output interface 230 connected to the bus, and an electric signal corresponding to the magnitude of the load applied to the load cell 190 is input. The microcomputer 220 takes this electric signal and converts it into a load. In the present embodiment, the portion of the microcomputer 220 that performs this conversion constitutes the load detection device 180 together with the load cell 190. The microcomputer 220 also constitutes a control device that controls the load detection device 180.

  Also connected to the input / output interface 230 is a personal computer (hereinafter abbreviated as PC) 240 as an external device via a communication cable 242 (see FIG. 5). The communication cable 242 constitutes a communication line which is a kind of communication means. For example, the communication cable 242 is a kind of standard interface for data transmission, and is constituted by an RS-232C cable as a standard interface for serial data transmission. The PC 240 is connected via the USB-RS232C conversion device 243 (see FIG. 5). In the connected state, data transmission is performed by communication between the microcomputer 220 and the PC 240, and the PC 240 can receive the load detection result. The PC 240 is provided separately from the control device 24. As shown in FIG. 5, the PC 240 includes a monitor 244 as a display device and a keyboard 246 as an input device, and controls the monitor 244 via a control circuit (not shown). The PC 240 is an external computer provided outside the main part of the electronic circuit component mounting machine such as the component mounting device 16. The load detection device 180 is connected to an external computer, and the PC 240 performs nozzle quality determination based on the load detection result, displays the load detection result on the monitor 244 that is an external display device, and the like.

  As shown in FIG. 8, the control device 24 for controlling the electronic circuit component mounting machine is mainly composed of a CPU 250, a ROM 252, a RAM 254 and a computer 260 (hereinafter referred to as a mounting control computer 260) having a bus connecting them. To do. An input / output interface 262 is connected to the bus, and an image processing computer 268 that processes image data obtained by each imaging of the wiring board imaging device 140 of the wiring board imaging system 22 and the component imaging device 152 of the component imaging system 150. 270, wiring board imaging device 140, component imaging device 152, various sensors such as encoder 272, input device 274, and the like. When the load detection device 180 is attached to the feeder support base 38, the microcomputer 220 is connected to the attachment control computer 260. The input device 274 is configured by a keyboard, for example. The microcomputer 220 and the mounting control computer 260 are connected by a signal line.

  The input / output interface 262 is also connected to various actuators constituting a drive source such as the wiring board transport device 12 via the drive circuit 276. In these devices 12 and the like, the motor that constitutes the drive source is a kind of actuator. In this embodiment, the motor is an electric rotary motor that is a kind of electric motor, and a servo motor capable of controlling the rotation angle with high accuracy. In many cases, the driven member such as the mounting head 50 is moved to an arbitrary position based on the drive of the motor. A step motor may be used instead of the servo motor. The rotation angles of these motors are detected by an encoder which is a rotation angle detection device, and the motors are controlled based on the detection results. FIG. 8 representatively shows an encoder 272 that is one of these encoders and detects the rotation angle of the head lifting motor 94. The encoder is a kind of an operation amount detection device or an operation position detection device that detects an operation amount or an operation position of a member such as a motor driven by a power drive source. The ROM 254 and the RAM 256 store various programs and data such as a basic operation program of the electronic circuit component mounting machine and a component mounting work program corresponding to the printed wiring board 30 to be worked.

  Next, the operation will be described. Since the mounting operation for mounting the component 46 on the printed wiring board 30 is described in the above-mentioned Japanese Patent No. 2824378 and the like, the entire description will be simplified, and the portion deeply related to the claimable invention will be described in detail.

  During the mounting operation, the mounting head 50 is moved to the component supply device 18 by the XY robot 52 and receives the component 46 from one component supply unit among the plurality of feeders 40. At this time, the mounting head 50 is lowered by the head lifting / lowering device 54, but after the suction pipe 118 of the suction nozzle 114 comes into contact with the component 46 on the suction surface 120, the mounting head 50 is further lowered by a small distance. 46 is adsorbed. The excessive lowering of the mounting head 50 is permitted by the compression of the spring 124, the nozzle holder 132 is lowered with respect to the suction nozzle 114, the impact when the suction nozzle 114 collides with the component 46 is reduced, and The pressing force of the suction nozzle 114 against the component 46 is set to an appropriate magnitude.

  Therefore, a force based on the weight of the suction nozzle 114, the biasing force of the spring 124, and the sliding resistance between the nozzle holder 132 and the suction nozzle 114 is applied to the component 46. The weight of the component 46 is extremely small and will be ignored. The descending distance of the mounting head 50 after the suction nozzle 114 contacts the component 46 is set according to the magnitude of the pressing force that presses the component 46 when the suction nozzle 114 sucks the component 46. The descending speed and acceleration / deceleration are set to such a magnitude that the mounting head 50 starts descending smoothly and stops. Then, as the mounting head 50 is lowered, a negative pressure is supplied to the suction nozzle 114, the suction nozzle 114 comes into contact with the component 46, and is sucked and held by the negative pressure, and then the mounting head 50 is raised and the component 46 is fed to the feeder. 40.

  The mounting head 50 that has received the component 46 from the feeder 40 is moved to the printed wiring board 30 by the XY robot 52 and mounted at a predetermined component mounting point. At this time, the position error of the component mounting point obtained based on the imaging of the reference mark 142 and the holding position error of the component 46 by the suction nozzle 114 obtained based on the imaging of the component 46 by the component imaging device 152 are corrected. A component 46 is mounted on the printed wiring board 30.

  Even when the component 46 is mounted, the mounting head 50 is lowered by a distance set in advance by the head lifting device 54, and is lowered by a small distance after the component 46 is brought into contact with the mounting surface of the printed wiring board 30. 46 is pressed against the printed wiring board 30 by the suction nozzle 114. This excessive lowering of the mounting head 50 is permitted by the compression of the spring 124, and the component 46 is based on the weight of the suction nozzle 114, the biasing force of the spring 124, and the sliding resistance between the suction nozzle 114 and the nozzle holder 132. Power is applied. In this embodiment, for simplicity of explanation, the spring 124 is the same even if the kind of the suction nozzle 114 is different, and the biasing force of the spring 124 applied to the component 46 is the same at the time of suction and mounting. Yes, it is assumed that the types of parts 46 are the same even if they are different. The lowering distance of the mounting head 50 after the suction nozzle 114 contacts the component 46 or the component 46 contacts the printed wiring board 30, and the relative movement distance between the suction nozzle 114 and the nozzle holder 132 is made constant. It is. Further, it is assumed that the descending speed and acceleration / deceleration are the same at the time of attachment and at the time of adsorption.

  As described above, the suction nozzle 114 presses the component 46 both when the suction nozzle 114 receives the component 46 from the feeder 40 and when the component 46 is mounted on the printed wiring board 30, but this pressing force has an abnormality. Sometimes. For example, if foreign matter enters between the guided surface 134 of the nozzle body 116 and the guide surface 136 of the chuck adapter 110 or if galling occurs on at least one of the surfaces, the suction nozzle 114 and the nozzle holder 132 may be separated. , And the pressing force becomes excessive, which may cause damage to the suction nozzle 114, the component 46, and the printed wiring board 30. Sliding resistance also increases when a twist occurs. The pressing force may become abnormally small. For example, when the spring 124 that biases the suction nozzle 114 falls and the spring constant decreases, the biasing force decreases and the pressing force becomes insufficient.

  Therefore, in this electronic circuit component mounting machine, the load applied by the suction nozzle 114 is periodically detected during the non-mounting operation in which the component 46 is not mounted on the printed wiring board 30, and there is an abnormality. A warning will be given. In the present embodiment, the load detection execution condition is selected by the operator. For example, at the start of a mounting operation on one printed wiring board 30, at the start of operation after the mounting machine is stopped for a set time or longer, every set operating time, every set number of components mounted, to a set number of printed wiring boards 30 The operator selects one of the detection execution conditions for each mounting of the component 46, and the mounting operation is not performed during the detection. Regardless of which condition is selected, the load detection device 180 is attached to the feeder support base 38 at the time of load detection.

  Hereinafter, detection of a load applied by the suction nozzle 114 will be described.

  The load is detected by the load detection device 180. For this purpose, the load detection device 180 is attached to the feeder support base 38 and the microcomputer 220 is connected to the mounting control computer 260 and the PC 240. At the time of non-mounting work and at the selected load detection time, the mounting head 50 is moved by the XY robot 52 to the load detecting device 180 attached to the feeder support base 38. Then, the mounting head 50 is lowered by the head lifting device 54 with the suction nozzle 114 positioned directly above the load cell 190, and the suction nozzle 114 is brought into contact with the nozzle contact surface 208 of the transmission plate 200. After that, the mounting head 50 is lowered, and a load based on the weight of the suction nozzle 114, the urging force of the spring 124, and the sliding resistance is applied to the input element 192 of the load cell 190 similarly to the component 46.

  In this embodiment, for the sake of simplicity, it is assumed that the vertical position of the suction surface 120 with respect to the nozzle holder 132 is uniform even if the type of the suction nozzle 114 is different. Therefore, the vertical distance (A) between the suction surface 120 and the nozzle contact surface 208 in a state where the mounting head 50 is located at the rising end position is the same regardless of the type of the suction nozzle 114. Further, the descending distance (B) of the mounting head 50 after the suction surface 120 comes into contact with the nozzle contact surface 208 is the same regardless of the type of the suction nozzle 114. In this embodiment, the lowering distance B is the same as the relative movement distance between the suction nozzle 114 and the nozzle holder 132 when the component 46 is sucked and mounted, and the biasing force that the spring 124 applies to the load cell 190 due to the relative movement. Is the same as when the component 46 is sucked and mounted. Further, it is assumed that the lowering speed and acceleration / deceleration of the mounting head 50 are the same as those when the suction nozzle 114 sucks and mounts the component 46 and is the same regardless of the type of the suction nozzle 114. To do. Therefore, the impact applied to the load cell 190 when the suction nozzle 114 contacts the nozzle contact surface 208 is the same as when the component 46 is sucked and mounted, and the state of the suction nozzle 114 at the time of suction and mounting (the suction nozzle 114). The magnitude and change of the load applied to the component 46 can be understood. In this electronic circuit component mounting machine, when the component 46 is received and mounted, the lowering speed, acceleration and deceleration of the mounting head 50, the pressing force with which the suction nozzle 114 presses the component 46, etc. are received and mounted. It is set so as to be normally performed, and various components of the electronic circuit component mounting machine are manufactured and managed based on the setting.

  The mounting head 50 is lowered from the state where the mounting head 50 is located at the rising end position by a distance shorter than the descending distance A (referred to as C), and the suction surface 120 is located at a predetermined distance above the nozzle contact surface 208 of the transmission plate 200. When the position is reached, a signal representing the position is output from the mounting control computer 260 to the microcomputer 220. Each of the descending distances A, B, and C is converted into the number of pulses of the encoder 272 that detects the rotation angle of the head lifting motor 94, and whether the mounting head 50 is lowered by the distance A, B, or C by counting the number of pulses I know if it's not. The number of pulses is counted by the mounting control computer 260.

  When the mounting head 50 reaches a position lowered by the distance C from the ascending end position, a signal indicating that is output to the microcomputer 220, and the microcomputer 220 receives an input from the load cell 190 based on the input of the signal. The conversion of the electrical signal into the load, that is, the detection of the load and the storage of the detected load in the RAM 226 starts recording. Although the output signal of the load cell 190 is an analog signal, it is converted into a digital signal at the input interface 230 and taken into the microcomputer 220, converted into a load, and stored in the RAM 226. In the present embodiment, the load applied by the suction nozzle 114 to the load cell 190, and the detected load itself is recorded in the RAM 226. As shown in the graph of FIG. The time point is the load detection start point, which is the recording start time, and is set to a time before the touch start time of the suction nozzle 114 to the load cell 190. A plurality of detection results can be recorded in the RAM 226.

  The mounting head 50 is further lowered from the position where the distance C is lowered, and the suction surface 120 is brought into contact (collision) with the nozzle contact surface 208 of the transmission plate 200. The mounting head 50 is further lowered from this state, but this lowering is permitted when the nozzle holder 132 is lowered while compressing the spring 124 with respect to the suction nozzle 114. When the suction nozzle 114 collides with the transmission plate 200, the load detected by the load detection device 180 increases rapidly. The sudden increase in the detection value of the load detection device 180 indicates that the suction nozzle 114 is in contact with the transmission plate 200, and a signal representing this is output from the microcomputer 220 to the mounting control computer 260. The mounting control computer 260 controls the lowering distance of the mounting head 50 after the suction nozzle 114 contacts the nozzle contact surface 208 based on the input of this signal, and lowers it by the distance B. The transmission plate 200 is brought into contact with the input element 192 so as to be swingable. Even if the suction surface 120 is worn or the like, the suction nozzle 114 can push the load cell 190 through the transmission plate 200 satisfactorily. Initially, the force applied by the suction nozzle 114 to the transmission plate 200 fluctuates in a vibrational manner, but eventually the suction nozzle 114 is stably pressed against the transmission plate 200, and the transmission plate 200 includes the weight of the suction nozzle 114, A force based on the biasing force and sliding resistance of the spring 124 is applied and detected.

  The mounting control computer 260 monitors whether or not the mounting head 50 has further lowered the distance C from the distance C, that is, the state where the load recording is started. Output to. Based on the input of the signal, the microcomputer 220 ends the detection and recording of the load. Thereafter, the load cell 190 outputs a signal, but the conversion into the load and the recording of the detected load in the RAM 226 are not performed, and the detection ends when the mounting head 50 further lowers the distance D from the position where the distance C descends. This is the point, the recording end time, and is set after the contact start time. Detection and recording are performed during the distance D. In this embodiment, the position of the distance D is from the position where the mounting head 50 is lowered by the distance B after the suction nozzle 114 contacts the nozzle contact surface 208. It is set to the front, and the recording is completed before the time point when the lowering of the mounting head 50 is completed. Therefore, the maximum load (impact) is detected and recorded, but in a steady state (a state where the mounting head 50 is lowered by the distance B and the relative movement of the suction nozzle 114 from the nozzle holder 132 ends and the load is stable). Up to the load of is not recorded. When the sliding resistance increases, the contact load becomes abnormally large when the suction nozzle 114 contacts the transmission plate 200, and then the contact load in the steady state is equal to or less than that in the normal state. If the expected maximum load is recorded, an abnormally large contact load can be detected.

  When the mounting head 50 is further lowered after the suction nozzle 114 comes into contact with the nozzle contact surface 208, the load applied to the load cell 190 by the suction nozzle 114 rapidly increases and then decreases as shown in the graph of FIG. Although it fluctuates in a vibrational manner, it eventually becomes a substantially constant size. After the suction nozzle 114 comes into contact with the nozzle contact surface 208, the load increases rapidly to overcome the sliding resistance until the relative movement between the suction nozzle 114 and the nozzle holder 132 starts, but decreases after the relative movement starts, When the mounting head 50 is lowered by a distance B and the spring 124 is compressed by a predetermined amount due to the relative movement between the suction nozzle 114 and the nozzle holder 132, and the steady state is reached, the load is increased by the weight of the suction nozzle 114 and the spring 124. The size is determined by the biasing force. The distance D is set to a size at which the suction nozzle 114 and the nozzle holder 132 start relative movement, the load increases rapidly, and the maximum load is detected and recorded. The distances A and B are unique values set by design in this embodiment, but the distances C and D are arbitrarily set, and are set by an operator using the input device 274, for example.

  As described above, the load detection start point and the recording start time are set to a time before the contact start time of the suction nozzle 114 to the load cell 190, and the load is applied before the suction nozzle 114 contacts the nozzle contact surface 208. Since it is detected and recorded, the maximum value of the load can be reliably detected and recorded. Due to manufacturing errors, assembly errors, wear of the suction surface 120, and the like, the descending distance of the mounting head 50 when the suction nozzle 114 contacts the nozzle contact surface 208 is not necessarily the distance A set by design. The contact may occur when the distance is lower than A and the contact may occur when the distance is lower than a long distance. However, the distance C is set in consideration of this, and if the microcomputer 220 starts detecting and recording a load when the mounting head 50 is lowered by a distance C shorter than the distance A, the nozzle contact surface of the suction nozzle 114 is set. Even when the descending distance of the mounting head 50 at the time of contact with 208 is deviated, when the suction nozzle 114 contacts the nozzle contact surface 208, the load is detected and recorded, and the maximum load is detected. It will be recorded.

  The detected load recorded in the RAM 226 of the microcomputer 220 is output to the PC 240 by communication, and the PC 240 determines the quality of the suction nozzle 114 based on the load detection result. This determination is performed by comparing the maximum load among the loads detected by the load detection device 180 and recorded in the microcomputer 220 with a set value (threshold value). Even when the suction nozzle 114 is normal, when the suction nozzle 114 collides with the transmission plate 200, the load detected by the load detection device 180 increases rapidly. However, when the abnormality is detected, the maximum load is abnormally large or small. Attention is paid and the quality of the nozzle is determined by comparing with the set value.

  As shown in FIG. 10, the set value is set both when the load is abnormally large and when the load is abnormally small. In the former case, the set value FPT is, for example, the maximum load FPA detected by using a plurality of normal suction nozzles 114 from the maximum load FPA assumed when the load becomes abnormally large. The difference ΔFF ′ (positive value) obtained by subtracting the average value FPNm is multiplied by a preset ratio, and the value obtained thereby is added to the average maximum load FPNm when the nozzle is normal. This ratio is set to an arbitrary value between 0 and 1. In the latter case, the set value FPT ′ is set in advance, for example, to a difference ΔFF (negative value) obtained by subtracting the average value FPNm from the maximum load FPA ′ assumed when the load becomes abnormally small. Is set by multiplying the calculated ratio and adding the resulting value to the average maximum load FPNm. This ratio is set to an arbitrary value between 0 and 1, and may be the same as or different from the ratio when the set value FPT is set. The load applied by the suction nozzle 114 to the load cell 190 is the sum of the weight based on the weight of the suction nozzle 114, the urging force of the spring 124, and the sliding resistance, but here, for the sake of simplicity, the suction nozzle 114 is used. The weight of is assumed to be the same regardless of the type. The set values FPT and FPT ′ are set in advance and stored in the memory of the PC 240.

  If the maximum detected load FPA, which is the maximum load among the detected and stored loads, is not more than the set value FPT and not less than the set value FPT ′, the suction nozzle 114 is normal and a message to that effect is displayed on the monitor 244. . If the maximum detected load FPA is larger than the set value FPT or smaller than the set value FPT ′, it is determined that the pressing force is abnormal and the suction nozzle 114 is defective, and the monitor 244 displays an abnormality of the suction nozzle 114. And warned. Based on this abnormality warning, the operator can replace the suction nozzle 114 or perform maintenance, and the abnormal suction nozzle 114 is used for mounting the component 46 to damage the component 46 or the printed wiring board 30. This is avoided and the production of defective printed circuit boards is prevented. Moreover, it can be avoided that the mounting machine is stopped due to the nozzle abnormality. When the suction nozzle 114 is defective, suction nozzle information or detection / determination results such as the maximum load and whether the maximum load is abnormally large or small may be displayed.

  In this electronic circuit component mounting machine, the distance D for determining the load detection end point and the detected load recording timing can be arbitrarily set, and the mounting head 50 reaches the descending end position and the descending is finished. If the distance is set to, the load applied to the load cell 190 by the suction nozzle 114 in the steady state is also recorded. This is because the load is stabilized when the mounting head 50 finishes descending, and the load at the end of descending may be regarded as a load in a steady state. In this embodiment, the contact of the suction nozzle 114 with the load cell 190 is notified from the microcomputer 220 to the mounting control computer 260, and the distance D is the distance when the mounting head 50 reaches the lower end position. If set, when the mounting head 50 is lowered by the distance B from the contact, a signal indicating the arrival of the mounting head 50 at the descending end position is output from the mounting control computer 260 to the microcomputer 220, and the load is calculated based on the signal. Detection and recording are terminated. Since the mounting head 50 is accurately lowered by a distance B from the contact of the suction nozzle 114 with the load cell 190, for example, even if the suction surface 120 is worn, the set load can be accurately obtained in a steady state. It is done. A load may be detected for a set time after the mounting head 50 is lowered, and the load in a steady state may be reliably acquired.

  By detecting and recording the load in the steady state, the pressing state in the steady state can also be confirmed. For example, the load in the steady state can be compared with a set value (a set value for determining the quality of the suction nozzle 114 in the steady state) to determine whether a normal pressing force can be obtained in the steady state. The quality of the suction nozzle 114 can be determined based on the determination result or the determination result of the maximum detected load, and the cause of the suction nozzle 114 can be estimated if the suction nozzle 114 is defective. For example, when the sliding resistance increases, the contact load in the steady state may be insufficient due to the insufficient descending distance of the mounting head 50, and the increase in sliding resistance is confirmed in conjunction with the abnormally large maximum load. can do. Alternatively, if the maximum detected load is abnormal but the detected load in the steady state is normal, for example, the occurrence of an abnormal state such as an increase in pressing force due to an increase in sliding resistance can be confirmed, and the steady state It can be estimated that there is an abnormality cause different from the case where the contact load is insufficient. Alternatively, if the maximum detected load is normal but the pressing force in the steady state is abnormal, for example, there is an abnormality in the lowering control of the mounting head 50 by the head lifting device 54, and the lowering distance is insufficient or excessive. It is estimated that the cause of the abnormality can be removed and the component 46 can be received and mounted normally.

  After the end of the load detection, the load detection device 180 may be left attached to the feeder support base 38, removed from the feeder support base 38, and used, for example, for detecting the load of the suction nozzle 114 in another electronic circuit component mounting machine. You can also The RAM 226 of the microcomputer 220 can record detection loads for a plurality of suction nozzles 114, and the load is detected by attaching a plurality of suction nozzles 114 to an electronic circuit component mounting machine that mounts the component 46. be able to. When the load detection device 180 is removed from the feeder support base 38 except when the load is detected, the feeder 40 may be attached to the load detection device attachment portion of the feeder support base 38 and the component 46 may be supplied.

  As is apparent from the above description, in this embodiment, the XY robot 52 and the head elevating device 54 constitute a mounting relative motion imparting device, which also serves as a load detection relative motion imparting device. Further, the control unit 24 controls the XY robot 52 and the like, and the portion that moves the mounting head 50 when the detection execution condition is satisfied and presses the suction nozzle 114 against the load cell 190 controls the relative motion applying device for load detection during non-mounting work. The portion of the microcomputer 220 that causes the microcomputer 220 to convert the input signal from the load cell 190 into the load constitutes a load detecting device control unit during non-mounting work, and these are load detection control during non-mounting work. Part. Further, the RAM 226 of the microcomputer 220 constitutes a detected load recording unit, and is a load detected by the load detection device 180 of the microcomputer 220 and is limited based on a signal input from the mounting control computer 260. A portion for recording the load detected in the RAM 226 constitutes a detected load recording time limiter, and these constitute a load detection result recording part. The microcomputer 220 is provided in the apparatus main body 182, and the load detection result recording unit is provided in the load detection apparatus 180. In this embodiment, the detection and recording of the load are started and ended based on the signal input from the mounting control computer 260, and they are performed at the same time. It can also be considered that the load detection device control unit also serves as the detection load recording time limiting unit. The part for detecting the descending distance of the mounting head 50 of the mounting control computer 260 by counting the number of pulses of the encoder 272, and detecting the decrease of the distance C and the distance D of the mounting head 50 is a detection start time acquiring unit and a recording start time acquiring unit. , A detection end time acquisition unit, and a recording end time acquisition unit. It can also be considered that a part that receives a signal indicating a decrease in the set distance of the mounting head 50 from the mounting control computer 260 of the microcomputer 220 constitutes a detection start time acquisition unit and the like. Further, the portion for determining the quality of the suction nozzle 114 based on the detection load transmitted from the microcomputer 220 of the PC 240 constitutes a nozzle quality determination unit and a detection result analysis unit, and based on the result, a defective nozzle or an abnormal nozzle is determined. The parts displayed on the monitor 244 constitute a nozzle abnormality warning part and a load detection result display part. The nozzle pass / fail judgment unit includes a maximum detected load dependence pass / fail judgment part, a steady state load dependence pass / fail judgment part, and a maximum detected load / steady state load dependence pass / fail judgment part. Furthermore, it can be considered that the load detection device 180 constitutes a part of the self-diagnosis function of the electronic circuit component mounting machine in a state where the load detection device 180 is attached to the feeder support base 38 and can detect the load.

  Note that load detection may be performed a plurality of times for one suction nozzle 114, and a defective nozzle may be determined based on a plurality of load detection results. For example, an average value of each maximum detected load in a plurality of load detections is obtained as the maximum contact load of the suction nozzle 114, and the quality of the suction nozzle 114 is determined by comparing with a set value.

  In the electronic circuit component mounting machine of the above embodiment, one suction nozzle is used for mounting the electronic circuit component, but a plurality of suction nozzles may be used. For example, a plurality of mounting heads 50 are provided on the Y-axis slide 64 along the Y-axis direction. At least one of the plurality of suction nozzles receives an electronic circuit component from the feeder 40 and attaches it to the printed wiring board 30. For each of the plurality of suction nozzles, the load applied to the load cell 190 is detected. If there is a defective nozzle, a warning is issued and appropriate processing such as replacement is performed. The use of the defective nozzle is prohibited but not replaced, and the mounting operation may be started while the mounting head 50 holds the defective nozzle. In this case, for example, the PC 240 and the mounting control computer 260 can communicate with each other, the nozzle pass / fail judgment result and the nozzle use prohibition information are supplied to the mounting control computer 260, and the use prohibition nozzle 114 is not used for mounting. To be. A plurality of suction nozzles 114 are held, and if possible, the use-prohibited nozzle is skipped and not used for mounting, and another non-defective nozzle is mounted instead of the use-prohibited nozzle. In this case, the portion of the PC 240 that prohibits the use of defective nozzles constitutes a nozzle use prohibition portion.

  Further, in the claimable invention, the mounting head is moved to an arbitrary position in a plane parallel to the mounting surface of the circuit board by the mounting head moving device of the XY robot type, and the electronic circuit component is adsorbed and mounted. Not only circuit component mounting machines but other forms of electronic circuit component mounting machines, for example, a component receiving position and a component in which a plurality of mounting heads are swung around a common swivel axis and are one of a plurality of stop positions The present invention can be applied to an electronic circuit component mounting machine that is stopped at a mounting position and receives components from a component supply device and mounts them on a circuit board. This type of electronic circuit component mounting machine includes: (a) a mounting machine main body; (b) at least one rotating body held rotatably around a rotation axis substantially vertical to the mounting machine main body; A mounting head held in each of a plurality of head holding portions provided in the at least one rotating body, each having a head body and a nozzle holding body having at least one nozzle holding portion; (D) By rotating the rotating body, a plurality of mounting heads are turned around the rotation axis, and a component receiving position for receiving an electronic circuit component from the component supply device by the suction nozzle and a circuit for the received electronic circuit component. And a rotating body rotating device that moves to a component mounting position to be mounted on the board. For example, as described in JP-A-6-342998, a rotating body holds all of a plurality of mounting heads, and these mounting heads are rotated by rotation around a vertical rotation axis. As described in Japanese Patent Laid-Open No. 9-237997, a plurality of rotating bodies each hold a mounting head and freely rotate around a vertical rotation axis as described in Japanese Patent Application Laid-Open No. 9-237997. Thus, the mounted mounting heads may be individually turned.

  In this electronic circuit component mounting machine, the load detection device is detachably attached to, for example, a feeder support base constituting the component supply device. The feeder support base is moved by the feeder support base moving device, and each component supply section of the plurality of feeders mounted on the feeder support base is sequentially moved to the component supply position to supply the components. When detecting the load, the detection unit of the load detection device is moved to the component supply position by the movement of the feeder support base, and the suction nozzle of the mounting head that has been moved to the component receiving position is brought into contact with the detection unit and is pressed against the load. Is detected and recorded, and is used for determining the quality of the nozzle. For example, the load detection is performed at the time of non-mounting work, and the mounting head is lowered by a set distance at the time of load detection as in the above-described embodiment. The mounting head lifting / lowering device, for example, shares a drive source with the rotating body rotating device and includes a motion transmission device including a cam and a cam follower, and moves the mounting head up and down. In this case, the descending distance of the mounting head corresponds to the rotation angle of the cam constituting the motion transmission device, and is converted into, for example, the number of pulses of the encoder that detects the rotation angle of the cam, and the load detection, recording start and end It is used for the control. The load detection device may be attached to the feeder support base at the time of load detection, and removed from the feeder support base when the detection is completed and the mounting operation is started. As a result, an increase in the weight of the feeder support base at the time of parts supply is avoided, and for example, an impact acting on the feeder or the like increases due to acceleration or deceleration at the start or stop of movement of the feeder support base, and the supply accuracy decreases. Is avoided. Alternatively, in order to avoid an increase in impact, it is not necessary to reduce the acceleration / deceleration at the start and stop of the movement of the feeder support base, and a reduction in supply efficiency can be avoided. Further, it is possible to avoid an impact at the time of starting and stopping the movement of the feeder support base on the load detecting device and causing a failure or the like.

  If a plurality of heads hold a plurality of suction nozzles, the suction nozzles are sequentially positioned at the operation positions for receiving and mounting the components, and are pressed against the detection unit of the load detection device to detect the load. For example, the quality is determined. If there is a defective nozzle, for example, a warning is issued or the use of the defective nozzle is prohibited. In this case, since the electronic circuit component mounting machine mounts the electronic circuit component on the circuit board by using a plurality of suction nozzles, if a use-prohibited nozzle is generated, for example, the use-prohibited nozzle remains held on the mounting head. However, if the suction nozzle held by another mounting head is replaceable, it is easy to mount the electronic circuit component on the replaceable nozzle. Alternatively, since the mounting head holds a plurality of suction nozzles, if the mounting head that holds the prohibited nozzle has a suction nozzle that can mount an electronic circuit component in place of the prohibited nozzle, that suction You may make it make mounting of an electronic circuit component to a nozzle. Nozzle use prohibition information is supplied to the mounting control computer so that nozzle skip, alternative nozzle use, and nozzle use prohibition are performed. For example, a PC and a mounting control computer may be connected to supply nozzle use prohibition information, or an operator may input information to the mounting control computer.

  Further, if there is a defective nozzle, the replacement of the defective nozzle may be displayed on the display device, and the operator may be prepared for the replacement nozzle. If the defective nozzle is replaced prior to the start of the mounting operation, stoppage of the mounting machine due to nozzle abnormality is avoided. If the mounting operation is started without replacing the defective nozzle with the non-defective nozzle, the replacement nozzle is prepared in advance according to the replacement display before the mounting machine is stopped due to the nozzle abnormality. Since the mounting machine is stopped due to an abnormality in the sliding surface between the nozzle holder and the suction nozzle or the like, the replacement or maintenance of the suction nozzle can be urged, so that the nozzle can be replaced quickly. Even if the mounting operation is started without replacing the defective nozzle, for example, if the electronic circuit component mounting machine holds multiple suction nozzles, it is ensured that the mounting operation will be stopped due to nozzle abnormalities, such as nozzle skipping. Can be avoided. The same applies to an electronic circuit component mounting machine in which at least one mounting head is moved by an XY robot type mounting head moving device.

  The detection and recording start / end of the load is not limited to the signal input from the mounting control computer to the microcomputer, but the detection / recording start / end timing is acquired on the load detection device side. It may be. For example, a head detection device that detects the mounting head is provided together with the load detection device. The head detection device is composed of, for example, a transmissive photoelectric sensor which is a kind of photoelectric sensor. For example, when the suction surface of the suction nozzle reaches a position above the nozzle contact surface of the transmission plate by a preset distance. Are provided so as to detect the mounting head. The suction nozzle may be detected by a nozzle detection device. The detection signal is input to the microcomputer, and based on the detection signal, the load detection device starts detecting the load and records the detected load. In the microcomputer, the time from the detection of the mounting head is measured by a timer, and when the set time has elapsed, the detection and recording of the load are terminated. The set time can be arbitrarily set. For example, the maximum load is detected and set to a recorded length. In this way, the load detection time can be set and the recording time can be limited without performing communication between the computer that controls the load detection device and the mounting control computer. In this case, a part for determining whether or not the mounted head has been lowered to a position where load detection and recording starts based on detection signals from the head detection device and the head detection device of the microcomputer is a detection start timing acquisition unit and recording start The time acquisition unit is configured to determine whether it is time to end load detection and recording based on the time measured by the timer and the microcomputer timer. Part. The load detection device control unit and the detected load recording time limit unit are configured to start and end load detection and recording based on the time acquired by the microcomputer.

  In addition, when the suction nozzle contacts the nozzle contact surface of the load cell transmission plate and the load increases rapidly, a signal indicating that is input from the microcomputer on the load detection device side to the mounting control computer, so the mounting head at the time of contact May be obtained from the number of pulses of the encoder, and this lowered distance may be used for the mounting operation. If the height of the nozzle contact surface of the load cell is the same as the height of the upper surface of the component held by the component feeder and the mounting surface of the printed wiring board, the mounting head is moved down when the component is received and mounted. The distance is lowered by adding the relative movement distance between the suction nozzle and the nozzle holder, and if it is different, the descending distance set for receiving and mounting the parts is corrected based on the obtained descending distance. To lower the mounting head. Thereby, for example, even if the suction surface is worn, the suction nozzle and the nozzle holder are relatively moved by a preset distance, and a predetermined pressing force is applied to the component.

  It is not essential to input the nozzle contact based on the sudden increase in the load to the mounting control computer, and it may be omitted.

  Furthermore, regardless of the number of suction nozzles that can be mounted on the electronic circuit component mounting machine, communication is performed between the PC and the electronic circuit component mounting machine, information is exchanged, for example, nozzle abnormalities are transferred to the electronic circuit component mounting machine. You may make it warn.

  In addition, a control device that controls the relative motion imparting device for mounting the electronic circuit component mounting machine may determine whether or not the suction nozzle is good based on the load detection result, and detects the RAM of the computer that constitutes the control device. A load recording unit may be used. Alternatively, the determination of pass / fail of the suction nozzle may be performed in a control device that controls the load detection device.

  Furthermore, in the above embodiment, for the sake of simplicity, the position of the suction surface in the vertical direction with respect to the nozzle holder is constant, the suction nozzle mass is the same, and the suction nozzle is attached, even if the type of suction nozzle is different. The energizing devices to be energized are the same, and the energizing force by which the energizing device energizes the electronic circuit components is constant, but they are actually different, and control is performed according to the difference. . For example, when detecting the load applied by the suction nozzle, the distance from the mounting head to the position where the suction surface contacts the nozzle contact surface of the load cell from the rising end position, the descending distance of the mounting head after contact, and the detected load A set value or the like when detecting the quality of the suction nozzle based on the above is set according to the type of the suction nozzle, and load detection, quality determination or the like is performed.

  The detection execution condition for determining the load detection timing of the suction nozzle may be set in advance in the electronic circuit component mounting machine.

  Furthermore, in the microcomputer provided with the load cell, the load is constantly detected and recorded based on the output signal of the load cell, and the contact of the suction nozzle to the load cell is detected by the sudden increase in the load. For example, the load until the set time elapses or until the load becomes constant may be recorded as a record and used for nozzle quality determination or the like. Alternatively, the load is always detected, and for example, the recording may be started by acquiring the recording start time due to a sudden increase in the load, and the recording may be ended by acquiring the recording end time when the set time has elapsed. The load detection time may be different from the recording time.

  In addition, it is not essential that the mounting head descending acceleration / deceleration and the relative movement distance between the suction nozzle and the nozzle holder when detecting the load applied by the suction nozzle be the same during mounting and during suction. It may be allowed. At the time of load detection, the mounting head is lowered at the set acceleration / deceleration, and the suction nozzle and the nozzle holder are moved relative to each other by the set distance, and the load applied to the load cell by the suction nozzle is detected and normal. A set value or the like for determining whether or not the nozzle is good can be acquired using a simple suction nozzle.

  The claimable invention can also be applied to an electronic circuit component mounting machine in which a plurality of modularized electronic circuit component mounting units are arranged in series. Although the modularized electronic circuit component mounting unit has not yet been disclosed, as described in the application of Japanese Patent Application No. 2003-115216 by the present applicant, the component supply device, the circuit board holding device, and the mounting are respectively provided. Each of which is equipped with a head and a relative motion imparting device for mounting, in which electronic circuit components are mounted on a circuit board, and an arbitrary number of electronic circuit component mounting units are arranged in an arbitrary order, and an electronic device having a desired configuration A circuit component mounting machine can be obtained. It can also be considered that one electronic circuit component mounting unit constitutes an electronic circuit component mounting machine. The load detection is performed in each of the plurality of electronic circuit component mounting units.

  Although several embodiments of the claimable invention have been described in detail above, these are merely examples, and the claimable invention includes the aspects described in the above [Aspect of the Invention]. It can implement in the aspect which gave various changes based on the knowledge of a trader.

Claims (9)

A component supply device for supplying electronic circuit components;
A board holding device that holds the circuit board,
A circuit board that includes a nozzle holder that holds a suction nozzle that sucks and holds an electronic circuit component by negative pressure so as to be relatively movable in the axial direction, receives the electronic circuit component from the component supply device, and is held by the substrate holding device A mounting head to be mounted on,
A mounting relative motion imparting device for imparting relative motion necessary for mounting electronic circuit components to the mounting head, the substrate holding device, and the component supply device;
A load detection device that includes a detection unit and is provided separately from the mounting head, and detects a load applied by the suction nozzle to the detection unit;
A relative motion imparting device for load detection that imparts a relative motion necessary for detecting the load to the mounting head and the load detection device, and presses the suction nozzle against the detection unit;
A maximum load generated by a decrease in the load detected by the load detection device between the start of contact of the suction nozzle to the detection unit and the end of the approach of the mounting head to the detection unit; and A normal load that is a load detected by the load detection device after the mounting head approaches the detection unit is acquired, and the maximum load is within a preset set maximum load range and is normal. If the steady load is abnormal outside the preset steady load range, it is determined that the relative motion imparting between the mounting head and the load detecting device by the load detecting relative motion imparting device is abnormal. An electronic circuit component mounting machine including means. The electronic circuit component according to claim 1, further comprising means for determining that the sliding resistance of the suction nozzle with respect to the nozzle holder is abnormal when the maximum load is out of a preset maximum load range. Mounting machine. Furthermore, if the maximum load is abnormal and deviates from a preset set maximum load range, but the steady load is within a preset set steady load range and is normal, the nozzle holder of the suction nozzle The electronic circuit component mounting machine according to claim 1, further comprising means for determining that the sliding resistance with respect to is abnormal. The electronic circuit component mounting machine according to claim 2 , further comprising a nozzle use prohibition unit that prohibits use of the suction nozzle based on a determination result of a unit that determines that the sliding resistance is abnormal. 5. The electronic circuit component mounting machine according to claim 2 , further comprising a nozzle abnormality warning unit that warns of an abnormality of the suction nozzle based on a determination result of a unit that determines that the sliding resistance is abnormal. . 6. The electronic circuit component mounting machine according to claim 1, wherein the mounting relative motion applying device also serves as the load detecting relative motion applying device. The detection unit of the load detection device,
A load cell;
One of the two surfaces opposite to each other is a nozzle contact surface larger than the suction surface of the suction nozzle, and the opposite surface includes a contact portion that contacts the input portion of the load cell in a spot shape. The electronic circuit component mounting machine according to any one of claims 1 to 6 , further comprising: a transmission body capable of swinging. The component supplying device comprises a plurality of component supply feeders and feeder support member, the load detection device is at least one selectively the feeder to the support member is detachable claims 1 to 7 of the plurality of component supply feeder The electronic circuit component mounting machine according to any one of the above.   Furthermore, the electronic circuit component mounting machine in any one of Claim 1 thru | or 8 including the load detection result recording part which records the detection result of the load by the said detection part.

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