JP5987205B2 - Electronic circuit component mounting machine positioning failure detection method - Google Patents

Description

The present invention relates to position-decided Me failure detection method for an electronic circuit component mounting machine, in particular, it relates to position-decided Me failure detection of the positioning device for performing a relative positioning of the substrate holding device and the mounting head.

In the electronic circuit component mounting machine, various detections are performed in order to mount the electronic circuit component on the circuit substrate without any trouble. For example, in the electronic circuit component mounting machine described in Patent Document 1 below, a reference mark is provided on a mounting head that holds and moves the suction nozzle, and is imaged together with the electronic circuit component held by the suction nozzle. Thus, the holding position error of the electronic circuit component is detected. The relative position between the reference mark and the suction nozzle is determined by design, and the holding position error is detected from the relative position and the position of the electronic circuit component relative to the reference mark, and the positioning accuracy between the suction nozzle and the imaging device The holding position error can be detected with high accuracy even when the value is low. Therefore, the electronic circuit component can be imaged by the imaging device while the suction nozzle is moving, and the mounting cycle time can be shortened while accurately mounting the electronic circuit component on the circuit board by correcting the holding position error.
Moreover, in the electronic circuit component mounting machine described in Patent Document 2, two reference marks provided on the board conveyor, and one reference mark provided on a component imaging device provided with a fixed position, Is imaged by a substrate imaging device that is moved together with the mounting head, and the expansion rate of each ball screw shaft in the X-axis direction and the Y-axis direction constituting the head moving device is detected. Then, the target mounting position of the electronic circuit component is corrected based on the expansion coefficient data, and the electronic circuit component is mounted on the circuit board with high accuracy.
In the electronic circuit component mounting machine described in Patent Document 3, a driving unit for moving the suction nozzle of the electronic circuit component mounting machine in the X-axis, Y-axis, and Z-axis directions and a driving unit for rotating around the axis line Detected speed deviation (difference between command value and actual value), position deviation (difference between command position and actual position) and drive voltage during driving, and default values acquired in advance when the drive unit is normal An abnormality is detected by comparing with. The detection is performed at the time of the test after the assembly is completed at the time of manufacture of the electronic circuit component mounting machine and at the time of maintenance, and the machine of the drive device such as defective assembly at the time of manufacture, belt tension failure, loose mounting screw, failure of the motor itself, etc. Anomalies that occur due to common causes are detected.
In the electronic circuit component mounting machine described in Patent Document 4, a container that houses a plurality of suction nozzles is detachably provided, and an identification mark is provided on each of the suction nozzle and the container. When the suction nozzle currently held by the mounting head and the suction nozzle stored in the container are replaced, the identification mark of the suction nozzle is read to confirm the type, and the wrong type of suction nozzle is found. It is not held. In addition, the type of the container is confirmed based on the reading of the identification mark of the container, and if it is different from the planned type of container, the mounting of the electronic circuit component on the circuit board can be stopped. ing.
In the electronic circuit component mounting machine described in Patent Document 5, the reference mark provided on the substrate conveyor is imaged by the substrate imaging device that is moved together with the suction nozzle at the time of initial setting and after execution of the mounting operation. The suction nozzle is imaged by a component imaging device provided with a fixed position, and a positional shift due to thermal expansion is detected for each of the reference mark and the suction nozzle. By aligning these positional shifts, the positional shift between the board imaging device and the suction nozzle is acquired, the movement position of the suction nozzle is corrected, and the electronic circuit component is mounted on the circuit board with high accuracy.

JP-A-5-63398 JP-A-8-18289 JP 2005-38910 A JP 2003-69289 A Japanese Patent Laid-Open No. 8-236995

The present invention has been made under the above circumstances, and detects a positioning failure while detecting an excessive backlash of an apparatus for positioning a relative position between a substrate holding device and a mounting head in an electronic circuit component mounting machine. It is an object to provide a method for doing this.

In order to solve the above-described problem, a positioning failure detection method for an electronic circuit component mounting machine according to the present invention includes:
(a) a substrate holding device for holding a circuit substrate; (b) a component supply device for supplying an electronic circuit component; and (c) an electronic circuit component received from the component supply device by a component holder, and the substrate A mounting head mounted on the circuit substrate held by the holding device; and (d) a circuit base that is provided with a drive source and a motion transmission device and that holds the substrate holding device and the mounting head on the substrate holding device. In an electronic circuit component mounting machine including a positioning device that performs relative positioning between the base material holding device and the mounting head by relative movement in a direction parallel to the surface of the material, a plurality of components including at least excessive backlash of the positioning device A method for detecting a positioning failure due to a cause of a type and estimating the cause of the positioning failure,
An imaging device for imaging the detected portion with respect to one of the base material holding device and the mounting head and an imaging device for imaging the detected portion with respect to the other are fixedly provided, and the operation of the drive source is performed in the positioning device. An operating position detection device for detecting the position is provided,
When the drive source is operated in normal and reverse directions with acceleration / deceleration smaller than normal acceleration / deceleration until the detection values of the operating position detection device are equal to each other, A deviation amount between the two images of the detected portion in the screen is detected, a backlash amount is detected based on the deviation amount, and the positioning failure is detected when the detected backlash amount exceeds a set amount. And estimating the cause of the positioning failure as excessive backlash in the positioning device,
In the case where the drive source is operated until the detection values of the operation position detection device are the same, by changing the drive source in the forward direction and the reverse direction, and by changing the acceleration to a plurality of types including acceleration larger than the normal acceleration, When the amount of deviation between the two images of the detected portion in the screen of the imaging device is detected and the amount obtained by subtracting the backlash amount from the maximum amount of deviation is equal to or larger than a set amount, the cause of the positioning failure is The present invention is characterized in that it is estimated as a loose shift caused by a loosening of a fastening device between a detected part and the imaging device.

In the positioning failure detection method for an electronic circuit component mounting machine according to the present invention, the motion transmission device includes a feed screw mechanism including a male screw member and a nut screwed together, and the backlash includes a backlash of the feed screw mechanism. May be. The mounting head includes a suction nozzle that sucks and holds the electronic circuit component by negative pressure, and the positioning device is parallel to the surface of the circuit substrate held by the substrate holding device. It may include a suction nozzle positioning device that moves in any direction and positions the suction nozzle with respect to the circuit substrate.

If the positioning device has backlash, when the drive source is continuously operated in the forward direction and the reverse direction, the relative position between the detected portion and the imaging device in at least one of these operations is the case where there is no backlash. It will be in a different position. Therefore, the absolute difference in the difference between the position of the image of the detected portion obtained by imaging in each operation and the planned position of the image of the detected portion with respect to the detection value of the operating position detection device when there is no backlash. The value corresponds to the magnitude of the backlash, and an excessive backlash can be detected by comparing the absolute value with the set backlash value. The positional deviation is calculated by adding a positive / negative sign for each operation in the positive and reverse directions of the drive source. However, each positional deviation has a different positive / negative sign (including the case where one of the positional deviations is 0). The backlash amount is obtained based on the absolute value of the difference between them. By obtaining the difference between the positional deviations of the two images of the detected portion, errors such as positioning errors between the imaging device and the mounting head and their assembly errors are canceled out, and the backlash amount is acquired. . In this way, if excessive backlash is detected based on the image of the detected part, the backlash is excessively early compared to the case where a decrease in mounting accuracy is detected in the inspection after mounting the electronic circuit component on the circuit substrate. Can be detected, and generation of defective products can be avoided.
The drive source may be operated until the detection value of the operation position detection device becomes the same in the forward direction and the reverse direction, or may be operated until a different detection value set in advance in each direction.

Positioning failure of the positioning device is caused by various causes. The excessive backlash is one of them, and according to the positioning failure detection method according to the present invention, in addition to being able to detect the positioning failure caused by the excessive backlash , the fastening between the detected portion and the imaging device is performed. It is possible to detect a positioning failure caused by a loose shift caused by the looseness of the apparatus.
In addition, when the detection values of the operation position detecting device at the time of each operation in the forward direction and the reverse direction of the drive source are made the same, it is easy to control the drive source at the time of detecting a positioning failure. Furthermore, as long as there is no other cause, the absolute value of the deviation amount of the two images of the detected portion obtained by imaging in each operation is the backlash amount. For example, the backlash amount is displayed by displaying the deviation amount, and the operator Easy to understand.

Aspects of the Invention

  In the following, the invention which is recognized as being claimable in the present application (hereinafter, referred to as “claimable invention”. The claimable invention is a subordinate concept invention of the present invention which is the invention described in the claims) And may include inventions of a superordinate concept of the present invention or other concepts). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

In addition, in each of the following items, a limitation on “detection of positioning failure due to loose displacement of the fastening device” is added to item (10), which corresponds to claim 1, and item (2) in claim 1 The addition of the technical feature is equivalent to claim 2, and the addition of the technical feature of (3) to claim 1 or claim 2 corresponds to claim 3 .

(1) (a) a substrate holding device for holding a circuit substrate, (b) a component supply device for supplying an electronic circuit component, and (c) receiving an electronic circuit component from the component supply device by a component holder, A mounting head mounted on the circuit substrate held by the substrate holding device; and (d) a driving source and a motion transmission device, and the substrate holding device and the mounting head are held by the substrate holding device. In an electronic circuit component mounting machine including a positioning device that performs relative positioning between the substrate holding device and the mounting head by moving the substrate in a direction parallel to the surface of the circuit substrate, the backlash of the positioning device is excessive. A method of detecting that
An imaging device for imaging the detected portion with respect to one of the base material holding device and the mounting head and an imaging device for imaging the detected portion with respect to the other are fixedly provided, and the operation of the drive source is performed in the positioning device. An operating position detecting device for detecting a position is provided, the detected value of the operating position detecting device and the screen of the imaging device when the drive source is operated in the forward direction and the reverse direction and operated in the forward direction The backlash of the positioning device is detected on the basis of the relationship between the position of the image of the detected part in the image and the relationship between the detected value and the position of the image when operated in the reverse direction. An excessive backlash detection method for an electronic circuit component mounting machine, wherein an excessive backlash of the positioning device is detected when the backlash exceeds a set backlash value.
The detected portion and the imaging device may be provided on the base material holding device or the constituent member of the mounting head itself, or may be provided on a member that is separate from the constituent member but is not relatively movable. The component member itself or a part of another member can be used as the detected portion, or the detected member component member separate from the component member can be fixed to the substrate holding device or the mounting head as the detected portion. In any case, the detected part is fixedly provided on the substrate holding device or the mounting head. The imaging device may be built on the base material holding device or the mounting head, or a separate imaging device may be fixed, whereby the imaging device is fixedly provided on the base material holding device or the mounting head. However, it is desirable to provide it at a portion where the relative position change is as close as possible to the relative position change between the circuit substrate held by the substrate holding device and the portion where the relative positioning accuracy of the mounting head is most required.
A plurality of detected parts may be provided at different positions. Thereby, for example, the location where excessive backlash has occurred can be specified based on the relationship between the positions of a plurality of images obtained by imaging each of the plurality of detected parts and the detection value of the operating position detection device. Is possible.
The positioning device may be a device that positions one of the mounting head and the substrate holding device in two directions orthogonal to each other in a plane parallel to the surface of the circuit substrate, and positions one in one of the two directions. And it is good also as an apparatus which positions the other to the other of two directions.
For example, (a) a printed wiring board on which an electronic circuit component is not yet mounted, (b) an electronic circuit component is mounted on one surface and electrically connected to the circuit substrate, and the other surface is Includes a printed circuit board with no electronic circuit components mounted, (c) a base material on which a bare chip is mounted to form a substrate with a chip, (d) a base material on which an electronic circuit component with a ball grid array is mounted It is. “Circuit board” is a general term for printed wiring boards and printed circuit boards.
(2) The backlash excessive detection method according to (1), wherein the motion transmission device includes a feed screw mechanism including a male screw member and a nut screwed together, and the backlash includes a backlash of the feed screw mechanism.
As the feed screw mechanism, a normal feed screw mechanism in which a nut having a female screw thread is screwed to a male screw member having a male screw thread and the female screw thread and the male screw thread are directly screwed can be adopted. However, it is desirable to use a ball screw mechanism that holds a plurality of balls on a circular track and is screwed with a male screw member via the balls. When the motion transmission device includes one or more gear pairs that mesh with each other, the backlash of the gear pair is included in the backlash of the positioning device, and when the feed screw mechanism and the gear pair are included, the feed screw mechanism and the gear pair are included. And both backlashes included.
If most of the cause of excessive backlash is wear of the female thread of the nut, the backlash amount is acquired even if the detected portion is imaged in any position with respect to the male screw member. The detection value of the operation position detecting device at the time of each operation in the forward direction and the reverse direction of the drive source may be the same or different. On the other hand, if the wear of the external thread of the external thread member cannot be ignored as a cause of excessive backlash, the entire external thread member may not be evenly worn, so when the drive source is operated in the forward and reverse directions, respectively. It is desirable that the detected portion is imaged at the same location, and it is desirable that the detection value of the operation position detection device at each operation is the same. When the male screw member and the nut are made of the same material, excessive backlash tends to occur in the nut. When the nut is made of a material having higher wear resistance than the male screw member or is replaced earlier than the male screw member, wear of the male screw member cannot be ignored. In the former case, it is only necessary to provide one detected portion, but in the latter case, it is preferable to provide a plurality of detected portions, and it is preferable to provide a plurality of detected portions in a portion where the largest backlash is detected.
(3) The mounting head includes a suction nozzle that sucks and holds the electronic circuit component by negative pressure, and the positioning device places the suction nozzle on the surface of the circuit substrate held by the substrate holding device. The backlash excessive detection method according to item (1) or (2), including a suction nozzle positioning device that moves in a parallel direction and positions the suction nozzle with respect to the circuit substrate.
The suction nozzle is a kind of component holder. The component holder may be a gripper that includes a plurality of gripping members and grips and releases the electronic circuit component by opening and closing them.
(10) (a) a substrate holding device for holding a circuit substrate, (b) a component supply device for supplying an electronic circuit component, and (c) receiving an electronic circuit component from the component supply device by a component holder, A mounting head mounted on the circuit substrate held by the substrate holding device; and (d) a driving source and a motion transmission device, and the substrate holding device and the mounting head are held by the substrate holding device. In an electronic circuit component mounting machine including a positioning device that performs relative positioning between the substrate holding device and the mounting head by moving the substrate in a direction parallel to the surface of the circuit substrate, at least the backlash of the positioning device is excessive. A method of detecting a positioning failure caused by a plurality of types of causes including and estimating the cause of the positioning failure,
An imaging device for imaging the detected portion with respect to one of the base material holding device and the mounting head and an imaging device for imaging the detected portion with respect to the other are fixedly provided, and the operation of the drive source is performed in the positioning device. When an operating position detecting device for detecting a position is provided, and the drive source is operated in the forward direction and in the reverse direction until the detected values of the operating position detecting device are the same, the screen of the imaging device A misalignment amount between the two images of the detected portion is detected, a backlash is detected based on the misalignment amount, and when the detected backlash exceeds a set backlash, the misalignment is detected and the misalignment is detected. A method of detecting a positioning failure in an electronic circuit component mounting machine, wherein the cause of the above is estimated to be an excessive backlash in the positioning device.
The matters described in the above (2) or (3) can also be applied to the positioning failure detection method of the electronic circuit component mounting machine.
(20) (a) a substrate holding device for holding a circuit substrate, (b) a component supply device for supplying an electronic circuit component, and (c) receiving an electronic circuit component from the component supply device by a component holder, A mounting head mounted on the circuit substrate held by the substrate holding device; and (d) a driving source and a motion transmission device, and the substrate holding device and the mounting head are held by the substrate holding device. By detecting relative positioning in the direction parallel to the surface of the circuit substrate, the positioning failure in the electronic circuit component mounting machine including the positioning device that performs relative positioning between the substrate holding device and the mounting head is detected. A method for estimating the cause of positioning failure,
An imaging device for imaging the detected portion with respect to one of the base material holding device and the mounting head and an imaging device for imaging the detected portion with respect to the other are fixedly provided, and the operation of the drive source is performed in the positioning device. An operating position detecting device for detecting a position is provided, and the base material holding device and the mounting are installed based on a relationship between a detection value of the operating position detecting device and the position of the image of the detected portion in the screen of the imaging device. What is claimed is: 1. A positioning failure detection method for an electronic circuit component mounting machine, comprising: detecting a relative positioning failure with a head, estimating a cause of the relative positioning failure, and notifying the relative positioning failure together with the estimated cause.
If there is a relative positioning defect, the position of the object to be detected by the positioning device is different from the position when it is normal, and the position of the image of the detected part in the screen is different from the position planned when there is no defect. A relative positioning failure is detected. The cause of the relative positioning failure can be estimated by analyzing the position of the image of the detected part in the screen, and the operator can respond to the relative positioning failure by notifying the relative positioning failure and the estimated cause. It is easy to handle. In addition, it is possible to more reliably specify the cause of the positioning failure by inferring other information together with the analysis result of the position of the image of the detected portion in the screen.
If detection, cause estimation, and notification of these relative positioning failures are performed at a time other than when the electronic circuit component is mounted on the circuit base material, it is possible to prompt the operator to perform maintenance and the like. The cause of the defect can be eliminated before the defective product is produced due to the defect. Therefore, if a defect is detected due to the occurrence of a defective product, it will be necessary to resolve the defect during the mounting operation, and the production plan will be changed suddenly, but this situation will be avoided. can do.
However, there is a cause of failure caused by execution of mounting work, such as thermal expansion described later, and it is also effective to detect a relative positioning failure during the mounting work. In addition, even if relative positioning failure that can be detected at the time of non-working, such as mounting failure of the detachable portion to be described later, is detected even during work, so that the failure occurs. It is possible to respond quickly.
In addition, by storing information such as the cause of relative positioning failure and the time of occurrence of failure with a computer, etc., maintenance is performed slightly before the occurrence of failure is expected, etc. Can always be managed in good condition.
(21) The positioning device includes (i) a stationary member, (ii) a movable member movable with respect to the stationary member, and (iii) the drive source and the motion transmission device. A drive device that moves in both forward and reverse directions with respect to a stationary member; and (iv) an operation position detection device that detects an operation position of the drive source, and includes one of the detected portion and the imaging device. The fixed position is provided with respect to the movable member, the other of the detected part and the imaging device is fixedly provided with respect to the stationary member, and the operating position is detected in the forward direction and the reverse direction. When the detection values of the device are operated until they are the same, the amount of deviation between the two images of the detected portion in the screen of the imaging device is detected, and the backlash is detected based on the amount of deviation, The detected backlash exceeds the set backlash. (20) The positioning failure detection method according to (20), which includes a step of detecting the positioning failure and estimating the cause of the positioning failure as excessive backlash in the positioning device.
The same operation and effect as the positioning failure detection method described in the item (10) can be obtained.
(22) At least one of the substrate holding device and the mounting head includes a detachable portion that can be attached to and detached from the attached portion, and one of the detected portion and the imaging device serves as the detachable portion. After the attachment of the detachable part to the attached part and before the start of the mounting operation by the electronic circuit component mounting machine, the detected value and the imaging of the operating position detection device When a relationship with the position of the image of the detected portion in the screen of the apparatus is acquired, and the acquired relationship is different from a preset relationship by a set state or more, the positioning failure is detected. The positioning failure detection method according to item (20) or (21), wherein the cause of the positioning failure is estimated that the attachment of the detachable portion to the mounted portion is defective.
The to-be-detected part should just have a function as a reference mark used as a reference for detecting the position of the member provided with it, and also has a function which makes it possible to identify the kind of member provided with it. It may be an identification mark. In the case of a dedicated reference mark, it is possible to detect a defect in the mounting position of the member itself provided with the detected portion based on the fact that the detected portion does not exist in the vicinity of the planned position. In the case of an identification mark, it is possible to detect at least one of a defective attachment position of the member provided with the detected portion and an inappropriate member type as a defect. For example, the mark formation position is the same, but the mark shapes are different from each other, and the type can be identified based on the difference in shape, or the mark shape itself is the same but the position where it is formed. When at least one of the numbers is different to multiple types, the type of the member provided with the detected part can be identified by the difference in formation position or number, and those marks cannot be detected within the setting range If at least one of the type and mounting method of the member provided with the detected part is defective, or the mark shape is different from the expected one even if it can be detected within the set range For example, it is detected that the type of the member provided with the detected portion is defective.
Prior to the start of the mounting operation by the electronic circuit component mounting machine, the relationship between the detected value of the operating position detection device and the position of the image of the detected part is acquired, and the attachment failure of the removable part to the mounted part is detected. For this reason, it is easy to distinguish from a failure that occurs based on the operation of the positioning device after the work starts, and to determine a mounting failure.
(23) The electronic circuit component mounting machine includes a plurality of members fixed to each other by a fastening device between the detected portion and the imaging device, and the misalignment between the plurality of members is caused by the poor positioning. The positioning failure detection method according to any one of items (20) to (22), which is estimated to be the cause of the above.
The shift between the plurality of members includes a loose shift that occurs due to the looseness of the fastening device and a forced shift that occurs due to an excessive force acting between the multiple members. The slack shift occurs when the drive device is operated in the forward direction and stopped, and when the drive device is operated in the reverse direction and stopped, the detected value of the operating position detection device and the detected portion in the screen of the imaging device. The backlash is similar to excessive backlash in that the relationship with the position of the image differs by more than the set state, but the backlash increases gradually with the increase of the operation time or operation amount of the electronic component mounting machine, whereas the loose shift is Since it increases rapidly, it is possible to distinguish between the two by paying attention to the difference. The forced deviation is similar to the loose deviation in that it increases suddenly, but it operates when the drive source is operated in the forward direction and stopped when operated in the opposite direction. Since the relationship between the detection value of the position detection device and the position of the image of the detected portion in the screen of the imaging device does not change more than the set state, it can be determined that the displacement is loose and the backlash is excessive.
In addition, as a fastening device, what mainly has screw members, such as a volt | bolt and a nut, is suitable, and in addition to that, it can also include auxiliary members, such as a clamp.
(24) Provided with storage means for storing the relationship between the position of the image of the detected portion in the screen of the imaging device and the detection value of the operating position detection device each time a predetermined condition is satisfied, When a positioning failure between the base material holding device and the mounting head is detected, the relationship between the position of the image and the detection value of the operating position detection device at that time, and the storage means are stored by that time. The positioning according to any one of (20) to (23), wherein the cause of the positioning failure is estimated based on one or more relationships between the position of the image and the detection value of the operating position detection device. Defect detection method.
Information for estimating the cause of positioning failure increases, and the cause of positioning failure is easily estimated.
As will be described in the embodiment, the positional deviation amount of the image of the detected part in the screen of the imaging device is obtained by the position of the image of the detected part in the screen of the imaging device and the detection value of the operating position detection device. . The positional deviation amount represents the relationship between the position of the image of the detected portion in the screen of the imaging device and the detection value of the operating position detection device, and the positional deviation amount may be stored in the storage unit. At this time, if the detection value of the operating position detection device is stored in association with the positional deviation amount, for example, the acquisition position of the positional deviation amount can be specified. Further, the position of the image of the detected part in the screen of the imaging device and the detection value of the operating position detection device may be associated with each other and stored in the storage means. The same applies to item (28).
(25) The predetermined condition includes an operation duration condition in which the operation duration from the start of operation of the electronic circuit component mounting machine is increased every predetermined first set time. Positioning failure detection method.
In the method described in the items (25) to (30), the amount of change increases as the operation duration time of the electronic circuit component mounting machine increases as in the case of thermal expansion. Effective when discriminating between poor positioning due to reversible state changes that decrease if the amount drops, and poor positioning where the amount of change increases during operation and the amount of change does not decrease even if the cause of the increase disappears. .
The first set time may be an invariable constant length while storing the relationship between the position of the image of the detected part in the screen of the imaging device and the detection value of the operating position detection device. It may be differentiated and lengthened over time. The same applies to the second set time described later.
(26) A stop continuation time, which is a time during which the electronic circuit component mounting machine is continuously stopped before the start of the operation, is divided into a plurality of stages, and a stop continuation time before each operation of the electronic circuit component mounting machine is started. And the storage means stores the relationship between the position of the image and the detection value of the operating position detection device for each of the first set times in association with the stop duration stage to which the measured stop duration belongs. The positioning failure detection method according to item (25), wherein the positioning failure is detected when a deviation amount of the stored relationship from the standard relationship exceeds a set deviation amount.
During operation of the electronic circuit component mounting machine, the temperature of the constituent members rises due to the heat generated by the drive source and the sliding portion, but the rise varies depending on the temperature of the constituent members at the start of operation. If the temperature at the start of operation is high, the temperature rise after the start of operation is small, and if the temperature at the start of operation is low, the temperature rise after the start of operation is usually large. This is because the temperature of the constituent members in the steady state is almost constant, whereas if the stop duration before the operation is started is short, the temperature at the start of the operation is high. If defect detection and cause estimation are performed based on the amount of deviation from the relationship, their reliability can be improved.
(27) The standard relationship between the position of the image and the detection value of the operating position detection device at each first set time associated with the stop duration time stage is the same as that of the electronic circuit component mounting machine. It is obtained in advance using an electronic circuit component mounting machine that has a configuration and it is clear that a positioning failure does not occur, and is stored in the storage means of the electronic circuit component mounting machine (26) Positioning failure detection method.
The standard relationship is preferably acquired according to the work environment of the electronic circuit component mounting machine (for example, region, temperature, humidity, installation density), but in many cases, the work environment of the electronic circuit component mounting machine is Since it is controlled to a substantially constant standard environment, the relation in the standard environment is acquired in advance and stored in the storage means. According to the aspect of this section, whether the change in the relationship between the position of the image of the detected portion and the detection value of the operating position detection device is a normal change according to the work environment of the workplace, or based on the special situation of the device itself. Therefore, it is possible to classify whether the change should occur as a positioning failure. When the working environment changes and a new relationship between the position of the image of the detected portion and the detected value of the operating position detection device is obtained, it is desirable to update the standard relationship.
(28) Provided with storage means for storing the relationship between the position of the image of the detected portion in the screen of the imaging device and the detection value of the operating position detection device each time a predetermined condition is satisfied, When a positioning failure between the substrate holding device and the mounting head is detected, the electronic circuit component mounting machine is stopped, and the position of the image after the stop and the detection value of the operating position detection device are stored. The cause of the positioning failure is estimated based on the relationship between the positions of the plurality of images stored in the storage means and the detection values of the operating position detection device (20) to (23) The positioning failure detection method according to any one of the above.
The features described in this section can be adopted together with the features described in each of paragraphs (24) to (27), in which case the `` predetermined conditions '' described in paragraph (24) are used. “Predetermined first condition” and “predetermined condition” described in paragraph (28) shall be read as “predetermined second condition”.
(29) The predetermined condition includes a stop duration condition in which the stop duration from the operation stop of the electronic circuit component mounting machine is increased every second predetermined set time. Positioning failure detection method.
It should be noted that while the temperature of the component rises as the operation duration increases and the thermal expansion increases, the thermal expansion of the component decreases as the stop duration increases, it is included in the drive device, for example, When backlash exists in the motion transmission device, at least a part of the increase and decrease in the thermal expansion is absorbed by the backlash and does not appear as a change in the position of the image of the detected part in the screen of the imaging device. A change in the position of the image of the detection unit may not accurately represent an increase or decrease in thermal expansion. In order to avoid this, the detection of the relationship between the position of the image of the detected part in the screen and the detection value of the operating position detection device accompanying the increase in the operation continuation time or the stop continuation time is performed by increasing or decreasing the thermal expansion. It is necessary to carry out without being absorbed by the backlash.
(30) When a positioning failure is detected, it is clear that the relationship between the position of the detected portion and the detection value of the operating position detection device has returned to a standard relationship based on the relationship stored in the storage means. Or if the relationship between the position of the detected portion and the detected value of the operating position detection device returns to a standard relationship if the stop duration is sufficiently long, the cause of the positioning failure is The positioning failure detection method according to item (29), wherein the positioning device is estimated to be overloaded.
When the stop duration is sufficiently long, the relationship between the position of the detected portion and the detected value of the operating position detection device returns to the standard relationship. This is because the cause of the positioning failure is a component of the electronic circuit component mounting machine, In particular, it is reasonable to estimate that the load on the positioning device is excessive for some reason due to the temperature rise of the components of the positioning device. In particular, when a positioning failure is detected by the method described in paragraph (26), the fact that the deviation from the standard relationship stored in the storage means exceeds the set deviation is a reversible cause. That is, the thermal expansion of the components of the positioning device is large, and the cause estimation of the positioning failure by the method described in this section is appropriate.
The cause of the positioning failure is that the positioning device is overloaded. After the electronic circuit component mounting machine is stopped due to the detection of the positioning failure, the image position and the operating position of the detected part are detected each time a preset condition is satisfied. Without storing the relationship with the detected value of the device in the storage means, it is obvious that after returning to the standard relationship after the stop, the position of the image of the detected portion and the operating position detection device It can also be estimated by acquiring the relationship with the detected value.
(31) The relationship between the position of the image and the detection value of the operating position detection device at each second set time increase after the stop has the same configuration as the electronic circuit component mounting machine, and positioning Positioning failure according to item (30), acquired in advance using an electronic circuit component mounting machine that is clearly free from defects, and stored in the storage means of the electronic circuit component mounting machine as the standard relationship Detection method.
(32) One or more temperature sensors for detecting the temperature are provided in the electronic circuit component mounting machine, and the detection results of the temperature sensors are used for estimating the cause of the positioning failure. The positioning failure detection method according to claim 1.
Thermal expansion of components of the electronic circuit component mounting machine may contribute to poor positioning, and the amount of thermal expansion is closely related to the temperature change of the component, so a temperature sensor is provided on the electronic circuit component mounting machine. Then, effective information can be obtained in estimating the cause of the positioning failure. For example, the driving source of the positioning device is the main heat source, which is continuously stopped for a long time, and the relationship between the position of the detected portion and the detection value of the operating position detection device is a standard relationship. When the electronic component mounting machine is started to operate, the temperature of the drive source starts to rise earlier compared to other parts, and the rising gradient reaches the maximum value relatively early, so the drive source If a temperature sensor is provided, it is possible to predict the occurrence of positioning failure due to abnormal thermal expansion of the components of the positioning device due to excessive load or the like at an early stage. In addition, if temperature sensors are provided in a plurality of portions of the positioning device, the thermal expansion state of the entire positioning device can be estimated more accurately.
(33) One or more temperature sensors for detecting the temperature are provided in the electronic circuit component mounting machine, and the predetermined condition is that the temperature rises every time the detection temperature of any one of the temperature sensors rises to the set temperature. The positioning failure detection method according to item (24), including conditions.
The “any one of the one or more temperature sensors” indicates that the temperature rise state associated with the continuation of the operation of the positioning device is based on the position of the image of the detected portion in the screen of the imaging device and the detection value of the operating position detection device. It is desirable to detect the temperature of a portion (which may be a space or a component of the positioning device) that corresponds as best as possible to the change in the relationship. The amount of increase in the temperature detected by such a temperature sensor may more accurately represent the amount of operation of the electronic circuit component mounting machine than the operation continuation time from the start of operation of the electronic circuit component mounting machine. Adopting the characteristics of the terms is effective.

1 is a perspective view showing an electronic circuit component mounting system including a plurality of mounting modules, which are electronic circuit component mounting machines, on which a backlash excessive detection method and a positioning failure detection method according to an embodiment of the claimable invention are implemented. It is a perspective view which shows two units | sets of the said some mounting module. It is a top view which shows schematically the board | substrate conveyance apparatus of the said mounting module. It is a perspective view which shows the mounting apparatus of the said mounting module. It is a disassembled perspective view which shows the head moving apparatus of the said mounting apparatus. It is a perspective view which shows three types of mounting heads which comprise the said mounting apparatus. It is a top view which shows roughly the said 3 types of mounting head. It is a perspective view which shows one of the said 3 types of mounting heads. It is a perspective view which shows the head attachment apparatus for attaching the said mounting head to the X-axis slide of the said head moving apparatus, FIG.9 (a) is a part by the side of the mounting head of a head attachment apparatus, FIG.9 (b) is X-axis. It is a figure which shows the part by the side of a slide. It is a figure which shows the clamp apparatus of the said head attachment apparatus, Fig.9 (a) is side sectional drawing, FIG.10 (b) is AA sectional drawing in Fig.10 (a). It is a block diagram which shows notionally the structure of the control apparatus which controls the said mounting module. It is a routine memorized in RAM of a computer which constitutes the main part of the above-mentioned control device, and is a flow chart which shows a part of routine for detecting positioning failure in the above-mentioned mounting module. It is a flowchart which shows the continuation of the said routine. 14 is a flowchart showing a continuation of the routine shown in FIG. 13. It is a figure explaining the path | route for changing the position with respect to the components imaging device of a mounting head in the case of the said positioning defect detection. It is a flowchart which shows a part of routine for implementing the backlash excessive detection method and positioning failure detection method which are another embodiment. It is a flowchart which shows a part of routine for implementing the backlash excessive detection method and the positioning defect detection method which are another embodiment.

  Hereinafter, several embodiments of the claimable invention will be described with reference to the drawings. In addition to the following embodiment, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section.

  FIG. 1 shows the appearance of an electronic circuit component mounting system (hereinafter abbreviated as a mounting system). The present mounting system is configured by a plurality of mounting modules 10 being arranged and fixed in a row adjacent to each other on a common base 12. Each of the plurality of mounting modules 10 is an electronic circuit component mounting machine that is a type of anti-circuit base material working machine, and shares and performs mounting of electronic circuit components on a circuit board that is a type of circuit base material. .

The mounting module 10 is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-104075, and parts other than the part relating to the claimable invention will be briefly described.
As shown in FIG. 2, each mounting module 10 includes a module main body 18 that is a mounting machine main body, a substrate transfer device 20 that is a base material transfer device, a substrate holding device 22 that is a base material holding device, a component supply device 24, and a mounting device 26. , A reference mark imaging device 28 (see FIG. 4), a component imaging device 30 and a control device 32 (see FIG. 11).

  As shown in FIG. 2, the substrate transport device 20 includes two conveyors 50 and 52 in the present embodiment, and is provided at the center of the bed 36 constituting the module body 18 in the front-rear direction of the mounting module 10. The circuit board 54 is transported in a horizontal direction that is parallel to the direction in which the plurality of mounting modules 10 are arranged. In the present embodiment, the conveyance direction of the circuit board 54 is the X-axis direction, and the direction orthogonal to the X-axis direction in a horizontal plane is the Y-axis direction. The left-right direction or the width direction of the mounting module 10 is parallel to the X-axis direction, and the front-rear direction is parallel to the Y-axis direction. For conveying the circuit board 54, at least one of the conveyors 50 and 52 is used.

  On the bed 36, as shown in FIG. 2, two pairs of side frames 56, 58 extending in parallel in the X-axis direction and forming a pair are provided side by side in the Y-axis direction. In the mounting module 10, among the side frames 56 and 58 provided with the conveyor 50 provided on the front side of the mounting module 10, the side frame 56 positioned on the front side is provided with a fixed position on the bed 36. The side frames 56 and 58 provided with the side frame 58 and the conveyor 52 are provided so as to be movable in the Y-axis direction, and can be moved by a width changing device (not shown) to change the substrate conveyance width of the conveyors 50 and 52. It is said that.

  In the present embodiment, as shown in FIG. 3, at least one reference mark 59 is provided on the upper surface of one of the pair of side frames 56, 58, for example, the fixed side frame 56, for example, a plurality or three. More than one, in the present embodiment, three are provided at regular intervals in the direction parallel to the substrate transport direction, and in the present embodiment, they are provided at equal intervals. In the present embodiment, the fiducial mark 59 has a circular shape in plan view, and is provided on the upper surface of the side frame 56 by appropriate means such as printing or sticking a seal. Hereinafter, the reference mark 59 is referred to as a rail reference mark 59.

  As shown in FIG. 2, the substrate holding device 22 is provided for each of the two conveyors 50 and 52. In the present embodiment, although not shown, the substrate holding device 22 includes a substrate support device and a pair of clamp members, 54 is held in such a posture that the mounted surface which is the surface thereof is horizontal. The substrate support apparatus includes a plurality of support pins that are support members for supporting the circuit board 54 from below, and the pair of clamp members cooperate with the pressing portions provided on the side frames 56 and 58. Hold both side edges parallel to the transport direction. The side frames 56 and 58 are also components of the substrate holding device 22, and the rail reference mark 59 constitutes a detected portion that is fixed to the substrate holding device 22.

  As shown in FIG. 2, the component supply device 24 is provided on one side of the bed 36 with respect to the substrate transfer device 20 in the Y-axis direction and on the front side of the mounting module 10. The component supply device 24 supplies electronic circuit components by a plurality of tape feeders (hereinafter abbreviated as feeders) 60 which are a kind of feeder as a component supply tool.

  As shown in FIG. 4, the mounting device 26 includes a mounting head 70 (70 a, 70 b, 70 c) and a head moving device 72 that moves the mounting head 70. The head moving device 72 includes an X-axis direction moving device 80 and a Y-axis direction moving device 82. In the present embodiment, the Y-axis direction moving device 82 is provided with a linear motor 90 provided on the crown 84 constituting the module main body 18 so as to straddle the component supply unit of the component supply device 24 and the two substrate holding devices 22. And a Y-axis slide 92 as a moving member as a movable member is moved to an arbitrary position in the Y-axis direction. The movement position of the Y-axis slide 92 is detected by a linear scale 94 (see FIG. 11).

  In this embodiment, the X-axis direction moving device 80 is provided on the Y-axis slide 92 and is moved in the X-axis direction with respect to the Y-axis slide 92 as shown in FIG. X-axis slides 100 and 102 as movable members that are relatively moved, and X-axis slide drive devices 104 and 106 that move the slides 100 and 102 in the X-axis direction, respectively. Each of the X-axis slide drive devices 104 and 106 includes, for example, an electric motor 110 that is a drive source, a male screw member 112 and a nut 114 that are screwed together, and a feed screw mechanism 116 that is a motion transmission device. Yes. The X-axis slide 102 and the X-axis slide driving device 106 are provided on the X-axis slide 100, and the X-axis slides 100 and 102 are respectively moved in both the forward and reverse directions in the X-axis direction with respect to the module body 18. It can be moved to any position in the direction. In the present embodiment, the feed screw mechanism 116 is a ball screw mechanism. In each feed screw mechanism 116 of the X-axis slide drive devices 104 and 106, each nut 114 is fixed to the X-axis slide 100 and 102, and each male screw member 112 is rotatable to the Y-axis slide 92 and X-axis slide 100, respectively. The male screw member 112 is rotated by the electric motor 110 and is attached so as not to be relatively movable in the axial direction. In this embodiment, a servo motor with an encoder is used as the electric motor. The servo motor is an electric motor capable of controlling the rotation angle. A pulse motor can also be used.

  By moving the mounting head 70 by both of the X-axis slides 100 and 102, the circuit board 54 held across the two mounting modules 10 adjacent to the mounting head 70 is moved to the boundary portion between the two mounting modules 10. The electronic circuit component can be attached to the located region. The mounting of the electronic circuit component on the circuit board 54 in the mounting area set in the mounting module 10 is performed only by driving the X-axis slide 102 by the X-axis slide driving device 106. Only by driving the X-axis slide 100 by the X-axis slide drive device 104, the mounting head 70 can move the mounting area in the mounting module 10 in the X-axis direction. The head moving device may be one in which a Y-axis direction moving device is provided on the X-axis slide.

  The mounting head 70 sucks and holds the electronic circuit component with negative pressure by a suction nozzle 120 (120a, 120b, 120c) which is a kind of component holder. As shown in FIG. 6, a plurality of types of mounting heads 70 that hold the suction nozzle 120 and have different numbers of nozzle holders 122 (122a, 122b, 122c) that constitute the holder holding portion are prepared, and electronic circuit components are provided. Is selectively attached to the X-axis slide 102 in accordance with the type of the circuit board 54 to which it is attached.

  For example, the mounting head 70a shown in FIG. 6A includes one nozzle holder 122a, and holds one suction nozzle 120a. The mounting head 70b shown in FIG. 6B includes a plurality of nozzle holders 122b, for example, 3 or more (12 in the illustrated example), and can hold a maximum of 12 suction nozzles 120b. The mounting head 70c shown in FIG. 6 (c) includes a plurality of nozzle holders 122c, and has intermediate characteristics with the mounting heads 70a and 70b.

  Each of the mounting heads 70a, 70b, and 70c includes head main bodies 124a, 124b, and 124c as schematically shown in FIG. 7, and the nozzle holders 122a, 122b, and 122c are provided on the head main bodies 124a, 124b, and 124c, respectively. It is moved up and down by the holder lifting device and rotated around its own axis by the holder rotating device. Further, the supply of negative pressure and positive pressure to the suction nozzles 120a, 120b, and 120c is allowed and blocked by switching the valves (not shown) provided for the suction nozzles 120a, 120b, and 120c.

  As shown in FIG. 8, twelve nozzle holders 122b in the mounting head 70b are equiangular on a circumference around the rotation axis of the rotating body 130 held rotatably by the head body 124b around the vertical axis. It is provided at intervals. The twelve nozzle holders 122 b are sequentially positioned at the component suction mounting position by the rotating body 130 being rotated by the rotating body rotating device 132, and are moved up and down by the holder lifting device 134. The nozzle holder 122b is also rotated about its own axis by the holder rotating device 136.

  When the mounting device 26 is provided on the module main body 18, although not shown, a fastening device such as a bolt and a nut is used for fastening various members constituting the mounting device 26. Typically, for example, the male screw member 112 and the nut 114 of the feed screw mechanism 116 are used for attachment to the Y-axis slide 92 and the X-axis slides 100 and 102. Further, when the head main bodies 124a, 124b, 124c and the rotating body 130 are formed by integrally assembling a plurality of members, bolts and nuts can be used for the assembly.

  7, the reference marks 140a, 140b, and 140c (hereinafter referred to as head marks) are provided on the surfaces of the head bodies 124a, 124b, and 124c that face downward when mounted on the X-axis slide 102 and can be imaged from below. Reference marks 140a, 140b, and 140c) are provided to constitute a detected portion. In the present embodiment, the head reference marks 140a, 140b, and 140c have a circular shape in plan view, and are provided one by one by appropriate means such as printing and sticking a seal. When the head main body 124 is formed by integrally assembling a plurality of members, the head reference mark 140 is preferably provided on a member that holds the nozzle holder 122 among the plurality of members. The head reference mark 140 may be provided on the rotating body 130 in the mounting head 140b.

  The mounting heads 70a, 70b, and 70c are removably attached to the X-axis slide 102 by a head attaching device 148 shown in FIGS. 9 and 10, and the circuit board 54 held on the substrate holding device 22 by the head moving device 72. Are moved in a direction parallel to the horizontal surface of the substrate, and moved to an arbitrary position in a moving plane extending over the supply unit of the component supply device 24 and the two substrate holding devices 22. The portions of the mounting heads 70a, 70b, and 70c that are attached to the X-axis slide 102 are similarly configured, and are selectively attached to the X-axis slide 102. The head mounting device 148 is configured in the same manner as the head mounting device described in Japanese Patent Application Laid-Open No. 2004-221518, and will be briefly described by taking the mounting head 70a as an example.

  As shown in FIG. 9, the head mounting device 148 includes a positioning device 150 and a clamp device 152. The positioning device 150 includes two leg portions 156 provided at the lower portion of the back surface portion 154 of the head main body 124a, two engagement blocks 158 provided at the upper portion, and two portions provided at the lower portion of the front portion 160 of the X-axis slide 102. Engagement provided on the upper part of the front part 160, above the two lower engagement rollers 164 and two lower engagement rollers 164 provided slightly above the leg support part 162 and leg support part 162. Two upper engagement rollers 168 are provided in the hole 166.

  As shown in FIG. 10, the clamp device 152 has a structure in which a latch pin 172 is engaged with a latch roller 170 that is rotatably provided on an upper portion of the engagement block 158. The latch pin 172 is fitted to the upper portion of the front portion 160 so as to be movable in the vertical direction, and is moved by the latch pin operating device 180.

  The latch pin actuating device 180 includes a rod 182, a disc-shaped cam plate 184 eccentrically provided at one end of the rod 182, a generally pipe-shaped rod support member 186 that rotatably supports the rod 182, And a grip 188 that is provided at the other end of the rod 182 and constitutes an operation unit for rotating the rod 182. The latch pin actuating device 180 is attached to the upper portion of the front portion 160 of the X-axis slide 102 by a bolt and a nut in the rod support member 186 (see FIG. 9). A groove 190 having a width slightly larger than the outer diameter of the cam plate 184 is formed in the upper portion of the latch pin 172, and the cam plate 184 is engaged with the groove 190.

  Attachment and removal of the mounting head 70a from the X-axis slide 102 is performed by an operator. At the time of attachment, the operator rotates the grip 188 in one direction (counterclockwise as viewed from the front in this embodiment) and moves the latch pin 172 upward by the cam plate 184, and the tip has a wedge shape. The formed leg 156 is fitted to the leg support 162 having a V-shape. Thereby, the vertical position of the mounting head 70a with respect to the X-axis slide 102 and the position of the lower part of the head main body 124a in the front-rear direction are defined. Further, the opposing side surfaces of the portion where the interval between the upper portions of the leg portions 156 is reduced engage with the outer peripheral surfaces of the two lower engaging rollers 164, and both side surfaces of the engaging block 158 are the two upper engaging surfaces. By fitting between the rollers 168, the horizontal position of the mounting head 70a with respect to the X-axis slide 102 is defined.

  In this state, the operator rotates the grip 188 in the opposite direction (clockwise as viewed from the front in this embodiment). As a result, the latch pin 172 descends, and the inclined surface 192 formed at the lower end of the latch pin 172 contacts the outer periphery of the latch roller 170, and the mounting head 70 a is pressed downward by the action of the inclined surface 192. The latch roller 170 is latched while the main body 124a is pressed against the X-axis slide 102 with almost no gap, and the upper portion of the head main body 124a is positioned in the front-rear direction. In the present embodiment, the latch pin 172 and the latch roller 170 are also components of the positioning device. The latching state includes a frictional force generated between the outer periphery of the cam plate 184 and the lower surface of the groove 190, and a latching pin 172 of the rod 182 by the torsion spring 194 provided between the rod 182 and the rod support member 186. Is maintained by biasing in the downward direction. In order to detach the mounting head 70a from the X-axis slide 102, the grip 188 may be rotated in the opposite direction.

  As shown in FIG. 4, the reference mark imaging device 28 is a reference mark that is mounted on the X-axis slide 102, moved together with the mounting head 70 by the head moving device 72, and provided on the mounting surface of the circuit board 54. A certain substrate reference mark 196 (see FIG. 3) is imaged. The head moving device 72 also serves as a reference mark imaging device moving device. The reference mark imaging device 28 is fixed to the X-axis slide 102 using, for example, bolts and nuts, and is fixed to the mounting head 70. A plurality of substrate reference marks 196, for example, two, are provided in a diagonal direction. The reference mark imaging device 28 is constituted by, for example, a CCD camera or a CMOS camera.

  As shown in FIG. 2, the component imaging device 30 is provided at a position between the component supply device 24 of the bed 36 and the board transfer device 20 with a position fixed using, for example, bolts and nuts. In this embodiment, the component imaging device 30 can simultaneously image the electronic circuit components held by all of the suction nozzles 120b in a state where the maximum number of suction nozzles 120b that can be held by the mounting head 70b is held. It is supposed to be. The substrate holding device 22 and the component imaging device 30 are both provided on the bed 36, and the component imaging device 30 is fixedly provided on the substrate holding device 22.

  As shown in FIG. 11, the control device 32 is mainly composed of a control computer 200, and controls drive sources and the like of various devices constituting the mounting module 10 such as a linear motor 90 via a drive circuit 202. The display screen 206 is controlled via the control circuit 204. The control circuit 204 and the display screen 206 constitute a display device 208 serving as a notification device, and various information and the like are displayed using characters, graphics, and the like. As the notification device, it is possible to employ a device that notifies information in various modes, such as lighting of a lamp, blinking, sounding of a buzzer, announcement by voice, and communication with a portable terminal held by an operator.

  An input / output interface of the control computer 200 includes an image processing computer 212 that processes data obtained by imaging of the reference mark imaging device 28 and the component imaging device 30, and a head that detects attachment of the mounting head 70 to the X-axis slide 102. An encoder 216 (one of which is representatively shown in FIG. 11) provided in the detection sensor 214, the linear scale 94, the electric motor 110, and the like are connected. In the present embodiment, the head detection sensor 214 is provided on the X-axis slide 102, and is configured by a reflective photoelectric sensor that is a type of non-contact sensor. The head detection sensor 214 is configured to output an ON signal when the mounting head 70 is attached to the X-axis slide 102, and to output an OFF signal when the mounting head 70 is detached. Is also provided so that attachment to the X-axis slide 102 can be detected.

  Also connected to the input / output interface are a control device 32 of another mounting module 10 and a system control device 220 that performs overall control of the entire mounting system via a communication cable 222. Further, the RAM of the control computer 200 stores various programs and data for mounting electronic circuit components on the circuit board 54, including the routines shown in the flowcharts of FIGS.

  By executing the routines shown in FIGS. 12 to 14, the relative positioning failure between the substrate holding device 22 and the mounting head 70 is detected, and the cause of the failure is estimated and notified. In this embodiment, after the start of the operation of the mounting module 10 is instructed and before the normal operation is started, the backlash of the feed screw mechanisms 116 of the X-axis slide drive devices 104 and 106 is excessive, and the reference mark imaging device 28 side. In addition, on the mounting head 70 side, a plurality of members fixed to each other by bolts and nuts are deviated from each other, forcibly displaced, improper mounting of the mounting head 70 and relative positioning failure due to unknown causes, and cause estimation and notification are performed. The thermal expansion of the male screw member 112, loose deviation, forced deviation and positioning failure due to unknown causes, cause estimation and notification are performed. Excessive backlash occurs over time, and no defective mounting method of the mounting head 70 occurs during operation. Therefore, detection of relative positioning failure caused by them is detected in this embodiment before the start of normal operation. Only done.

  In this routine, based on the imaging of the rail reference mark 59 by the reference mark imaging device 28, the backlash is detected excessively, loosely shifted, forcedly shifted, thermal expansion and positioning failure due to unknown causes, and the cause of the failure is estimated and notified. Based on the imaging of the head reference mark 140 by the component imaging device 30, the mounting head 70 is detected to be defective in mounting, loosely shifted, forcedly shifted, and misaligned due to unknown causes, and the cause of the failure is estimated and notified. Has been. Further, the two X-axis slide drive devices 104 and 106 constituting the X-axis direction moving device 80 are individually operated, and a positioning failure is detected for each operation.

  This routine is started by an operation start instruction of the mounting module 10. The operation start instruction is transmitted from the system control device 220 to each control computer 200 of all the mounting modules 10, for example. In step 1 (hereinafter abbreviated as S1. The same applies to other steps), the stop duration time of the mounting module 10 is stored and the measurement of the operation duration time is started. In this embodiment, the duration time is acquired by reading the time of a clock provided in the control computer 200. Therefore, the time is read in S1. This time is a stop end time and is also an operation start time. The stop duration is the time from the previous stop of the mounting module 10 to the start of the current operation, and the stop duration is calculated from the time read in S1 and the stop time stored in the stop time memory. , Stored in the stop duration memory. The read time is stored in the operation start time memory. The stop time memory, the stop duration memory, and the operation start time memory are provided in the RAM of the control computer 200 and constitute storage means. The same applies to the other memories described below.

  Next, S2 to S13 are executed. First, the movement of the reference mark imaging device 28 by the operation of the X-axis slide 102 and the X-axis slide driving device 106, the imaging of the rail reference mark 59 and the excessive backlash, the looseness deviation based on the imaging, Detection of positioning failure due to forced displacement and unknown cause is performed. Here, the X-axis slide 100 is stopped with respect to the Y-axis slide 92, and only the X-axis slide 102 is moved in the X-axis direction for detection.

  In S2, the rail reference mark 59 is imaged. In the present embodiment, a defect is detected based on imaging of a predetermined one of the three rail reference marks 59 provided on the side frame 56, for example, the middle rail reference mark 59. If each of the three rail reference marks 59 is imaged, the occurrence state of backlash can be obtained for the entire male screw member 112. Here, for the sake of simplicity, it is assumed that the wear of the male screw thread of the male screw member 112 is the largest. The center rail reference mark 59 corresponding to the estimated portion, for example, the central portion where the movement path of the X-axis slide 102 most overlaps is taken.

  The reference mark imaging device 28 is driven by the X-axis slide drive device 106 to drive the X-axis slide 102. In this embodiment, the imaging center that is the center of the imaging screen in this embodiment is the center of the rail reference mark 59. The rail reference mark 59 is imaged by moving to a position where it is expected to match. The movement position of the reference mark imaging device 28 is set with respect to the imaging center, is defined by the detection value of the encoder 216 of the electric motor 110 in the X-axis direction, and is defined by the detection value of the linear scale 94 of the linear motor 90 in the Y-axis direction. Is done. The imaging position that is the movement position of the reference mark imaging device 28 scheduled at the time of imaging the rail reference mark 59 is referred to as a rail reference mark normal imaging position, and the detection value of the encoder 216 that defines the imaging position is the rail reference mark normal imaging position. This is called a specified value. The rail reference mark normal imaging position stipulated value is set in advance in the design of the mounting module 10. Further, the acceleration / deceleration during movement is set to a size set for moving the mounting head 70b between the component supply device 24 and the substrate holding device 22 during normal operation. This acceleration / deceleration is called normal acceleration / deceleration.

  The imaging data is processed by the image processing computer 212, and if an image of the rail reference mark 59 is obtained, the position of the image in the imaging screen is calculated. If an image of the rail reference mark 59 is not obtained, the reference mark imaging device 28 is moved along a route set in advance with respect to the rail reference mark 59, and imaging is performed by changing the position. For example, as illustrated in FIG. 15, this path is a path in which the reference mark imaging device 28 is alternately made different in each position in the X-axis direction and the Y-axis direction and moves away from the rail reference mark normal imaging position. The reference mark imaging device 28 is stopped at the direction change position (position indicated by a black circle in the figure), and imaging is performed. An imaging position different from the rail reference mark normal imaging position is referred to as a rail reference mark scanning imaging position. The rail reference mark scanning imaging position is also defined by the detection value of the encoder 216. If the image of the rail reference mark 59 is obtained, the imaging is completed at that time. If the image of the rail reference mark 59 is not obtained, the reference mark imaging device 28 is moved to the next rail reference mark scanning imaging position. Imaging is performed. If an image of the rail reference mark 59 is obtained, the detection value of the encoder 216 of the electric motor 110 when the reference mark imaging device 28 is moved to the rail reference mark scanning imaging position is stored in the rail reference mark scanning imaging position specified value memory. It is memorized. The scanning range is set in advance, and even if an image of the rail reference mark 59 is not obtained, the scanning is completed if imaging is performed in the entire scanning range.

  Then, S3 is executed, and it is determined whether or not the rail reference mark 59 has been successfully imaged. This determination is made based on whether or not an image of the rail reference mark 59 is obtained. If an image is obtained, S4 is executed, and whether or not the position of the rail reference mark 59 obtained by imaging is a normal position. Is determined. If an image of the rail reference mark 59 is obtained by imaging in a state where the reference mark imaging device 28 is positioned at the rail reference mark normal imaging position, the center position of the image of the rail reference mark 59 in the imaging screen, and imaging A deviation amount in the X-axis direction from the center position of the screen is calculated and compared with the set amount. If the image of the rail reference mark 59 is obtained by imaging in a state where the reference mark imaging device 28 is located at the rail reference mark scanning imaging position, the rail reference mark normal imaging position and the rail reference mark scanning imaging position are determined. The sum of the deviation amount in the X-axis direction and the deviation amount in the X-axis direction between the center position of the image of the rail reference mark 59 and the center position of the imaging screen in the imaging screen is the positional deviation amount of the rail reference mark 59. Compared with the set amount. Each deviation amount is obtained by adding a positive or negative sign, and the comparison with the set amount is performed on the absolute value of the calculated positional deviation amount of the rail reference mark 59.

  If there is no deviation in the position of the rail reference mark 59 or if it is less than the set amount even if there is a deviation, the position of the rail reference mark 59 will be normal, and excessive backlash will be detected by executing the steps after S5. Done. In this embodiment, the detection is performed by rotating the electric motor 110 of the X-axis slide drive device 106 in the forward direction and the reverse direction until the detection values of the encoder 216 become the same value, respectively. Is moved in the forward direction and the reverse direction, the rail reference mark 59 is imaged at a position defined by the same detection value of the encoder 216, and the deviation of the image of the two rail reference marks 59 obtained by each imaging is detected. Is done. The detection value of the encoder 216 is referred to as a backlash excessive detection imaging position specified value, and the position specified by the specified value is referred to as a backlash excessive detection imaging position. If an image of the rail reference mark 59 is obtained by imaging at the rail reference mark normal imaging position during the execution of S2, the rail reference mark normal imaging position specified value is set as the backlash excessive detection imaging position specified value. Further, if an image of the rail reference mark 59 is obtained by imaging at the rail reference mark scanning imaging position, the rail reference mark scanning imaging position specified value is set as an imaging position specified value for excessive backlash detection.

  The moving direction of the reference mark imaging device 28 at the time of the first imaging depends on, for example, whether the reference mark imaging device 28 is located on the positive side or the negative side in the X-axis direction with respect to the rail reference mark 59. It is decided. The position of the reference mark imaging device 28 with respect to the rail reference mark 59 is obtained by imaging the rail reference mark 59 in S2. Further, if the distance between the reference mark imaging device 28 and the rail reference mark 59 in the X-axis direction is equal to or smaller than the set distance, the reference mark imaging device 28 temporarily moves in the direction opposite to the moving direction during imaging in the X-axis direction. It is moved to a position where the distance from the rail reference mark 59 exceeds the set distance, and even if there is excessive backlash, the distance can be reduced and stopped after acceleration and constant speed movement. And moved from the position toward the rail reference mark 59. Further, the acceleration / deceleration during movement is smaller than the normal acceleration / deceleration in the present embodiment. Specifically, when the reference mark imaging device 28 starts moving, the acceleration does not leave the female thread from the male thread due to an impact when the male thread of the male screw member 112 and the female thread of the nut 114 come into contact with each other. The deceleration is such that the internal thread is not separated from the external thread due to inertia when the reference mark imaging device 28 is stopped, and can be stopped while maintaining the contact state. .

  In S5, the position of the image of the two rail reference marks 59 in the image pickup screen is acquired with a positive or negative sign by moving the reference mark imaging device 28 in the positive direction and the reverse direction and imaging the rail reference mark 59. Then, the difference between these positions is calculated. The forward / backward difference, which is the absolute value of this difference, is stored in the forward / backward difference memory. The forward / reverse difference is caused by backlash of the feed screw mechanism 116 or loose displacement of a plurality of members fastened by bolts and nuts between the reference mark imaging device 28 and the rail reference mark 59. These members can be displaced from each other if the screwing of the bolts and nuts is loosened. Typically, a loose shift may occur between the feed screw mechanism 116 of the X-axis slide drive devices 104 and 106 and the X-axis slides 100 and 102 and between the reference mark imaging device 28 and the X-axis slide 102. However, when the fiducial mark imaging device 28 is moved, the looseness deviation is large, and when a large acceleration is applied to a plurality of members fixed to each other by bolts and nuts, these members are displaced by inertia. In the present embodiment, the acceleration / deceleration during the movement is set to a size that does not cause a loose shift. Accordingly, the positional deviation between the two images of the rail reference mark 59 caused by the movement of the reference mark imaging device 28 in S5 is considered to be caused by the backlash of the feed screw mechanism 116, and the acquired forward / backward difference is the backlash. And is also stored in the backlash amount memory.

  Then, in S6, the forward / backward difference is compared with the set amount, and if it is equal to or greater than the set amount, it is estimated that the backlash is excessive. Such backlash detection includes the detection value of the encoder 216 when the electric motor 110 rotates in the forward direction, the position of the image of the rail reference mark 59 in the imaging screen, and the detection value of the encoder 216 when the electric motor 110 rotates in the reverse direction. The detection is based on the relationship with the position of the image of the rail reference mark 59 in the imaging screen. The difference between the positions of the two images is an absolute value of the difference in consideration of the sign of the deviation of each image with respect to the imaging center, and the movement position of the reference mark imaging device 28 is set with respect to the center position of the imaging screen. is there.

  If the forward / backward difference is excessive and excessive backlash is detected, S7 is executed, and that fact is displayed on the display screen 206 to notify the operator. The size of the backlash may also be displayed. When excessive backlash is detected, the mounting module 10 may be stopped. However, since backlash occurs gradually over time, it does not increase rapidly after it is detected that it is excessive, and the operation is continued as it is, and work is performed at the time of setup change, maintenance, and inspection that are performed for the first time after notification. In this embodiment, only the notification is performed without stopping the mounting module 10 because there is no problem even if the person responds. As a result, the operator can make preparations such as maintenance of the feed screw mechanism 116.

  After detection of excessive backlash, S8 is executed, and in the same manner as in S5, the reference mark imaging device 28 is moved in the forward and reverse directions by moving only the X-axis slide 102, and the rail reference mark 59 is imaged. The forward / backward difference is calculated and stored. In S8, the acceleration of the reference mark imaging device 28 is differentiated into a plurality of types, and the reference mark imaging device 28 is moved, the rail reference mark 59 is imaged, and the like. It is desirable that the acceleration be different from three or more types. In the present embodiment, the acceleration is different from three types, one is smaller than the normal acceleration as in the execution of S5, and one is the normal acceleration. One is usually larger than the acceleration. The forward / backward difference due to the movement at the minimum acceleration has already been acquired, and in S8, only the movement of the reference mark imaging device 28 at two types of acceleration, the normal acceleration and the acceleration larger than the normal acceleration, and the imaging of the rail reference mark 59 are performed. Is done. Even if the acceleration is increased, it is not always the case that a slack deviation occurs, or all the possible slack deviations may occur, so that imaging is performed with different accelerations. In addition, as described above, the loose displacement of a plurality of members fastened together by bolts and nuts appears when acceleration is large, but if the deceleration is increased, the displacement caused at the start of movement is reduced due to inertia. There is a risk of being made. For this reason, the deceleration is reduced, and the vehicle is stopped in a state where a deviation has occurred.

  Then, in S9, it is determined whether the forward / reverse difference is excessive. This determination is obtained by subtracting the backlash amount stored in S5 from the maximum normal / reverse difference among the three normal / reverse differences acquired by making the fiducial mark imaging device 28 different in magnitude of acceleration. This is performed depending on whether or not it is greater than the set amount. This set amount may be the same as the set amount used for the determination of S6, or may be made larger.

  If the value obtained by subtracting the backlash amount from the maximum forward / reverse difference is equal to or larger than the set amount, it is determined in S10 whether or not the fluctuation of the forward / backward difference is large, and the loose shift is detected. As described above, when the acceleration is small, no loose shift occurs, whereas when the acceleration is large, the loose shift occurs, the forward / backward difference is large, and the fluctuation of the forward / backward difference due to the difference in acceleration increases. Therefore, in S10, among the three types of forward / backward differences, the minimum forward / backward difference is subtracted from the maximum forward / backward difference, and if the difference is equal to or greater than the set value, the fluctuation is considered to be large, and S11 is executed to mount the mounting module 10 Is stopped, and the occurrence of the loose shift is notified. This loose shift is a shift detected by imaging the rail reference mark 59 by the reference mark image pickup device 28, and is a shift generated on the reference mark image pickup device 28 side.

  On the other hand, if the fluctuation of the forward / reverse difference is small, S12 is executed, the mounting module 10 is stopped, and the occurrence of an abnormality of unknown cause is notified. If the cause of the positioning failure is an unknown error including loose displacement or forced displacement, the suction nozzle 120 has a large influence on the holding accuracy of the electronic circuit component and the mounting accuracy of the electronic circuit component on the circuit board 54, or The mounting module 10 is stopped because it may become larger.

  When an image of the rail reference mark 59 is not obtained when the rail reference mark 59 is imaged by the execution of S2, or even if an image is obtained, if the position of the rail reference mark 59 is largely shifted and the position is not normal, The cause of the positioning failure between the fiducial mark imaging device 28 and the rail fiducial mark 59 is, for example, a forced displacement or other cause, and is estimated to be an unknown cause. For example, the forcible displacement occurs when a portion where the reference mark imaging device 28 or the reference mark imaging device 28 of the X-axis slide 102 is fixed hits an obstacle during operation. Then, S13 is executed, the mounting module 10 is stopped, and it is notified that the occurrence of the positioning failure and the cause of the failure are defects including a forced deviation detected by imaging the rail reference mark 59 of the reference mark imaging device 28. Is done.

  If there is no loose shift, forced shift, or cause unknown abnormality, S14 is executed after execution of S9. Based on the movement of the reference mark imaging device 28 by the movement of the X-axis slide 100 and the imaging of the rail reference mark 59, X The failure including the backlash, loose deviation, and forced deviation of the feed screw mechanism 116 of the shaft slide drive device 104 and the abnormality of unknown cause are detected. These detections are performed when the X-axis slide 102 is stopped with respect to the X-axis slide 100 and only the X-axis slide 100 is moved in the X-axis direction to move the reference mark imaging device 28. Since the detection is performed in the same manner as in the case where the X-axis slide 102 is moved, detailed description thereof is omitted.

  If no defect other than excessive backlash is detected based on the imaging of the rail reference mark 59, the steps from S15 are executed, and the head reference mark 140 is imaged by the component imaging device 30, and the mounting head 70 is not attached correctly. Detects defects including loose and forced deviations, and abnormalities of unknown cause. This loose shift is a shift that occurs on the mounting head 70 side, and is typically between the feed screw mechanism 116 and the X-axis slides 100 and 102 of the X-axis slide driving devices 104 and 106, and between the mounting head 70 and the X-axis. It can occur between the slide 102. For example, if the bolts and nuts that fix the latch pin actuating device 180 of the head mounting device 148 to the X-axis slide 102 are loosened, a deviation may occur between the mounting head 70 and the X-axis slide 102. Further, the forced displacement occurs, for example, when the mounting head 70 or the portion of the X-axis slide 102 to which the mounting head 70 is attached hits an obstacle during operation. These defects are also detected by moving the X-axis slides 100 and 102 separately. Since excessive backlash has already been detected, it is not performed based on the imaging of the head reference mark 140. First, imaging of the head reference mark 140 by the movement of the X-axis slide 102 and detection of positioning failure will be described.

  For example, if the mounting head 70b is used for mounting the electronic circuit component on the circuit board 54 and is mounted on the X-axis slide 102, the mounting head 70b is preset by the head moving device 72 by executing S15. The image pickup position, in this embodiment, the center of the head reference mark 140b is moved to a position where the center of the image pickup screen of the component image pickup device 30 is scheduled to coincide with the image of the head reference mark 140b.

  In this embodiment, the movement position of the mounting head 70b is set with respect to the rotation axis of the rotating body 130, is defined by the detection value of the encoder 216 of the electric motor 110 in the X-axis direction, and the linear motor 90 is moved in the Y-axis direction. It is defined by the detected value of the linear scale 94. The imaging position that is the movement position of the mounting head 70b scheduled at the time of imaging the head reference mark 140b is referred to as a head reference mark normal imaging position, and the detection value of the encoder 216 that defines the imaging position is referred to as the head reference mark normal imaging position specification value. Called. Further, the X-axis slide 102 is moved at the normal acceleration / deceleration. Similarly to the imaging of the rail reference mark 59, when the head reference mark 140b is imaged, if the image of the head reference mark 140b is not obtained, the mounting head 70b follows the path preset for the component imaging device 30. The image is taken by changing the position.

  After imaging the head reference mark 140b, S16 to S22 are executed in the same manner as S3, S4, and S8 to S12. When the positioning failure is detected based on the imaging of the head reference mark 140b, the excessive backlash has not already been detected. Therefore, in S18, the mounting head 70b is positive, The head reference mark 140b is imaged, and three types of forward / backward difference are acquired.

  If the image of the head reference mark 140b is not obtained when the head reference mark 140b is captured by the execution of S15, or if an image is obtained, the positional deviation of the head reference mark 140b is large and the position is not normal. This is executed to determine whether or not the mounting head 70b has been removed. This is because if the mounting head 70b is detached, the displacement of the head reference mark 140b may increase due to, for example, an incorrect mounting position, a defective mounting method, or an incorrect type of the mounted mounting head 70.

  Whether or not the mounting head 70b has been removed is determined by, for example, detection of the mounting head 70b by the head detection sensor 214. If the detection signal of the head detection sensor 214 changes from an ON signal to an OFF signal while the mounting module 10 is stopped, and further changes from an OFF signal to an ON signal, the fact that the mounting head 70 has been detached is stored in the mounting head removable memory. Be made. The data stored in the mounting head detaching memory is cleared when the operation of the mounting module 10 is stopped, and no detachment is performed. The head detection sensor 214 may not be provided, and an operator may input the attachment / detachment of the mounting head 70 to the control computer 200 using an input device, and store it in the mounting head removal / removal memory.

  If the mounting head 70b is detached, it is presumed that the mounting head 70b is positioned incorrectly because the mounting head 70b is mounted incorrectly, and the mounting module 10 is stopped by the execution of S24, and the positioning is defective. The display device 208 notifies that the occurrence and the cause of the failure are estimated to be a mounting failure of the mounting head 70b. Further, if the mounting head 70b is not attached or detached, it is presumed that the cause of the positioning failure of the mounting head 70b is a forced displacement or other cause and an unknown cause. Then, the mounting module 10 is stopped in S25, and it is notified that the occurrence of the positioning failure and the cause of the failure are defects including a forced deviation detected by imaging the head reference mark 140b.

  If no positioning failure is detected based on the movement of the mounting head 70b by driving the X-axis slide 102 and the imaging of the head reference mark 140b, S26 is executed, and the positioning failure is detected based on the driving of the X-axis slide 100. Is called. If no defect that stops the mounting module 10 is detected by either the imaging of the rail reference mark 59 or the imaging of the head reference mark 140b, the steps after S27 are executed, and the normal operation of the mounting module 10 is started. The

The detection and cause estimation of the positioning failure during normal operation will be described.
When the normal operation is started by executing S27 shown in FIG. 13, the mounting program stored in the RAM of the control computer 200 is executed, and the electronic circuit component is mounted on the circuit board 54. In brief, the mounting head 70b is moved to the component supply device 24, and the plurality of suction nozzles 120b sequentially suck the electronic circuit components supplied by the tape feeder 60. After receiving the electronic circuit component, the mounting head 70b is moved to the component imaging position to image the electronic circuit component. In this embodiment, the component imaging position is a position where the rotation axis of the rotating body 130 is scheduled to coincide with the center of the imaging screen, and is defined by the value of the encoder 216. The imaging data is subjected to image processing, and the holding position error of the electronic circuit component by the suction nozzle 120b is calculated. The holding position error includes each position error and rotation position error (position error around the axis line of the electronic circuit component) in the X-axis direction and the Y-axis direction.

  After the imaging, the mounting head 70 b is moved to the board holding device 22 and the held electronic circuit component is mounted on the component mounting portion of the circuit board 54. The circuit board 54 is transferred by the board transfer device 20 and stopped at the mounting position which is a preset work position. After the stop, the circuit board 54 is held by the board holding device 22, and the board reference mark 196 is imaged by the reference mark imaging device 28. Then, position errors and rotational position errors in the X-axis and Y-axis directions of the component mounting location are acquired, and are corrected together with the holding position error of the electronic circuit component by the suction nozzle 120b when mounting the electronic circuit component. The correction of the position error in the X-axis and Y-axis directions is performed by correcting the movement position of the mounting head 70b, and the rotation position error is corrected by rotating the suction nozzle 120b. If the holding position error is so large that it cannot be corrected, the electronic circuit component is discarded in a storage box (not shown) and is not mounted on the circuit board 54.

  In the mounting module 10, by executing S28, the rail reference mark 59 and the head reference mark 140b are imaged even during normal operation, and a positioning failure is detected. These imaging and the like are performed every time the first set time elapses, and if the normal operation is started, the elapse of the first set time is waited (S28a). In S28a, the time of the clock provided in the control computer 200 is repeatedly read, and it is determined whether or not the first set time has elapsed with the first read time as the start time. If the first set time has elapsed, S28b is executed, the reference mark imaging device 28 is moved to the rail reference mark 59, and the rail reference mark 59 is imaged. At this time, if the mounting head 70b holds an electronic circuit component, imaging is performed after the mounting on the circuit board 54 is completed. Here, as in the case of detecting an excessive backlash, the middle rail reference mark 59 among the three rail reference marks 59 is imaged. In the mounting module 10, the male screw member 112 of each feed screw mechanism 116 of the X-axis slide driving devices 104, 106 has a Y-axis slide 92 (the X-axis of the Y-axis slide 92) at the end opposite to the electric motor 110. The portion that holds the slide drive device 104) and the X-axis slide 100 are held so as to be rotatable via a bearing and expandable and contractable in the X-axis direction, and the amount of thermal expansion when the temperature rises is the largest. However, since the temperature of the male screw member 112 decreases as the distance from the electric motor 110 decreases, the amount of thermal expansion per unit length is small, and if the amount of thermal expansion is integrated, the total 3 / This is because the thermal expansion amount of the entire male screw member 112 can be obtained by imaging the rail reference mark 59 in the middle.

  In this embodiment, during normal operation, only the X-axis slide drive device 106 is operated in the X-axis direction, and the reference mark imaging device 28 detects the value detected by the encoder 216 of the electric motor 110 by the movement of the X-axis slide 102. Is moved to a position that becomes the rail reference mark normal imaging position prescribed value. If the movement direction of the reference mark imaging device 28 is the same as the previous movement, it is moved as it is, and if the movement direction is the reverse of the previous movement, the distance larger than the amount of backlash stored in S5. The fiducial mark imaging device 28 is moved so that the influence of the backlash of the feed screw mechanism 116 is removed. The reference mark imaging device 28 is moved at the normal acceleration / deceleration.

  If the imaging data is image-processed and an image of the rail reference mark 59 is not obtained, the reference mark imaging device 28 is moved in the same manner as when imaging the rail reference mark 59 before the start of normal operation, and the position of the rail reference mark 59 is changed. Imaging of the mark 59 is performed. After imaging, S28c and S28d are executed in the same manner as S3 and S4, and an image of the rail reference mark 59 is not obtained. Even if it is obtained, the amount of positional deviation is large and the position of the rail reference mark 59 is not normal. The operation of the mounting module 10 is stopped and the occurrence of a defect including a forced deviation is notified (S28f).

  If an image of the rail reference mark 59 is obtained and the absolute value of the positional deviation amount is equal to or less than the set amount, S28e is executed, and the absolute value of the positional deviation amount of the rail reference mark 59 is the rail reference mark positional deviation amount during normal operation. Stored in memory. The positional deviation amount is stored in association with the stop duration stage. The stop duration is stored in the stop duration memory in S1, and the stop duration is determined and stored in which of the stop durations divided in advance into a plurality of stages. . The multiple stages of stop duration are stored in a stop duration stage memory. The positional deviation amount of the rail reference mark 59 corresponds to the relationship between the detection value of the encoder 216 and the position of the image of the rail reference mark 59 in the imaging screen. The position of the reference mark imaging device 28 is defined by the detection value of the encoder 216 with respect to the center of the imaging screen, and the positional deviation amount of the rail reference mark 59 is the position of the image of the rail reference mark 59 relative to the imaging center and the reference mark imaging device. It is because it is acquired based on 28 positions. The storage of the positional deviation amount in the rail reference mark positional deviation amount memory during normal operation is a storage of the relationship between the position of the image of the rail reference mark 59 and the detection value of the encoder 216 in the imaging screen. The detected value of the encoder 216 at the time of imaging the rail reference mark 59 is also stored in the rail reference mark position deviation amount memory during normal operation. If imaging is performed at a position defined by the rail reference mark normal imaging position specified value, the specified value is stored, and imaging is a position different from the position specified by the rail reference mark normal imaging position specified value. If it is performed in step S1, the rail reference mark normal imaging position regulation value and the regulation value of the encoder 216 that defines the position where imaging was performed are stored. By storing the specified value, for example, it can be determined which position of the rail reference mark 59 is obtained based on which rail reference mark 59 is obtained.

  Next, S28g to S28k are executed, imaging of the head reference mark 140b, acquisition of the positional deviation amount of the head reference mark 140b, the positional deviation amount to the head reference mark positional deviation amount memory during normal operation, the position where the imaging was performed, and the like. Is stored in the specified value of the encoder 216. The imaging of the head reference mark 140b and the acquisition of the positional deviation amount are performed in the same manner as before the start of normal operation only by driving the X-axis slide 102, and the acquired positional deviation amount is stored in association with the stop duration time stage. .

  During normal operation, it is determined whether or not the positional deviation amount of the rail reference mark 59 and the positional deviation amount of the head reference mark 140b are excessive (S281, S28m). The latest positional deviation amount respectively stored in the rail reference mark position deviation amount memory during normal operation and the head reference mark position deviation amount memory during normal operation is compared with the set value. If the positional deviation amount of the rail reference mark 59 is larger than the set value, the steps after S37 shown in FIG. 14 are executed. If the positional deviation amount of the head reference mark 140b is larger than the set value, the steps after S137 are executed, Positioning failure detection and cause estimation are performed. This will be described later. In this embodiment, the set value for performing the determination of S28l and S28m is set to a size equal to the deviation in the X-axis direction with respect to the component mounting location allowed when the electronic circuit component is mounted on the circuit board 54. Has been.

  During normal operation, it is also determined whether or not an operation interruption of the mounting module 10 has been commanded (S28n). The interruption command is difficult to continue the operation, for example, input by an operator, trouble in execution of the mounting operation in the mounting module 10, for example, defective component supply by the feeder 60, out of components, unloading of the circuit board 54, etc. Issued based on the occurrence of the situation. If an interruption command is issued, S29 is executed and the mounting module 10 is stopped. In S30, the time is read and stored in the stop time memory, and the measurement of the stop measurement time is started.

  Next, S31 is executed, and it is determined whether or not a set time has elapsed since S31 was executed for the first time. Although the operation of the mounting module 10 is stopped for some reason, the stop time may be short. For this reason, the set time used for the determination of S31 is relatively short, and is set to such a length that the temperature drop of the feed screw mechanism 116 and the like caused by the operation stop of the mounting module 10 can be ignored. Called. If the short set time has not elapsed, it is determined in S32 whether or not operation restart of the mounting module 10 has been commanded. The operation restart command is issued in the same manner as the operation start instruction. If operation restart is instructed before the short set time has elapsed, S28 is executed. The stoppage of the mounting module 10 due to a short interruption of operation is not taken into account in detecting a positioning failure between the mounting head 70 and the substrate holding device 22.

  If the short set time has elapsed without commanding the restart of operation, S33 is executed, and it is determined whether or not the long set time, which is a set time longer than the short set time, has elapsed. For example, even if the cause of the operation interruption is a malfunction of the device constituting the mounting module 10, the operation may be resumed if it is resolved. Therefore, the long set time is to determine whether or not the operation stop state has continued for a slightly longer time than expected when the operation is stopped due to the occurrence of a problem and the operation is expected to be resumed due to the resolution of the problem. Is set to a length that can be

  If the long set time has not elapsed, S34 is executed, and it is determined whether or not operation resumption has been commanded. If restart of operation is instructed before the long set time elapses, S1 is executed. At this time, in S1, the stop duration is calculated based on the stop start time stored in the stop time memory in S30, and is stored in the stop duration memory. Since the stop time of the mounting module 10 due to the interruption is long, the stop continuation time is acquired and taken into consideration for the detection of positioning failure and the like. If the long set time elapses without a command to resume operation, the execution of the routine ends.

  During the normal operation, it is further determined whether or not the operation end of the mounting module 10 has been commanded (S28o). The operation of the mounting module 10 is terminated when, for example, the mounting of the electronic circuit components on the set number or type of circuit boards 54 is completed, the work end time is reached, or the like. The end command is instructed from the system controller 220 in the same manner as the start instruction. An end command may be input by an operator. If termination is instructed, S35 is executed, and after completion processing, for example, storage of the stop time in the stop time memory is performed, the mounting module 10 is stopped (S36).

  If the amount of positional deviation is excessive as a result of imaging the rail reference mark 59 during normal operation, the steps after S37 are executed. In S37, it is determined whether or not the positional deviation amount of the rail reference mark 59 has increased rapidly. This determination is made based on the positional deviation amount of the rail reference mark 59 accumulated by the execution of S28e. For example, a value obtained by subtracting the previous positional deviation amount from the latest positional deviation amount is compared with a set value. If the value is equal to or larger than the set value, the value is rapidly increased.

  This set value is larger than the increasing gradient of the positional deviation amount of the rail reference mark 59 caused by the thermal expansion of the male screw member 112, and more than the increasing gradient of the positional deviation amount of the rail reference mark 59 caused by the loose deviation or the forced deviation. The size is small. This is because the thermal expansion gradually increases with the temperature rise of the constituent members after the operation of the mounting module 10 is started, whereas the loose shift and the forced shift occur suddenly. Further, the increasing gradient of the positional deviation amount of the rail reference mark 59 due to thermal expansion becomes larger as the stop duration time is longer. This is because the longer the stop duration, the lower the temperature of the mounting module 10 at the start of operation and the greater the temperature rise gradient after the start of operation. It is smaller than the increasing gradient of the positional deviation amount of the mark 59. Therefore, the first set time of S28a is set to a length in which the increasing gradient of the positional deviation amount of the rail reference mark 59 due to thermal expansion is smaller than the increasing gradient of the positional deviation amount due to loose deviation or forced deviation. The set value for the determination is set to be larger than the maximum value of the increase gradient of the positional deviation amount of the rail reference mark 59 due to thermal expansion and smaller than the increase gradient of the positional deviation amount due to the loose deviation or the forced deviation. ing.

  If the positional deviation amount of the rail reference mark 59 has not increased rapidly, it is determined in S38a whether or not the increasing gradient of the positional deviation amount is larger than the standard increasing gradient. The standard increase gradient is an increase gradient of the amount of displacement when the thermal expansion is not excessive, and is set for each of a plurality of stop duration stages. This is because as the operation stop time of the mounting module 10 is longer as described above, the increasing gradient of the positional deviation amount of the rail reference mark 59 due to thermal expansion becomes larger.

  The standard increasing gradient is acquired for the mounting module 10 in which the mounting module 10 is in a new state or the same model as the mounting module 10 is guaranteed to be normal. The mounting module 10 is operated, stopped for a set time, and then restarted. The rail reference mark 59 is imaged at each first set time to obtain the amount of positional deviation of the image, and the amount of positional deviation is increased. Get the gradient. Then, a plurality of types of increase gradients are acquired by changing the stop duration to a plurality of types, and stored in the standard increase gradient memory in association with the stop duration time stage. The increasing gradient may be acquired by setting one stop duration for each of a plurality of stop duration stages, or may be acquired by setting a plurality of stop durations within one stop duration. You may acquire based on the increase gradient of. For example, an average of a plurality of increasing gradients is set as a standard increasing gradient. In S38a, the standard increase slope set for the stop duration stage to which the stop duration stored in S1 belongs is read out. Then, the setting gradient is determined by multiplying the standard increasing gradient by a factor larger than 1, and compared with the actual increasing gradient, whether or not the deviation amount of the actual increasing gradient from the standard increasing gradient exceeds the setting deviation amount. Determined. The actual increase gradient is acquired from, for example, the latest positional deviation amount stored in S28e and one positional deviation amount immediately before or a plurality of positional deviation quantities immediately before. It may be acquired based on the latest positional deviation amount and the oldest positional deviation amount.

  If the actual increase gradient of the positional deviation amount is equal to or less than the set increase gradient, S38a becomes NO, S38b is executed, and after the mounting module 10 is stopped, S44 is executed. S44 will be described later. If the actual increase gradient is larger than the set gradient, S39 is executed, and the operation of the mounting module 10 is stopped. In S40, the time is read and stored in the stop time memory, and the measurement of the stop duration is started. Further, the operation continuation time is calculated based on the read time and the operation start time stored in the operation start time memory, and stored in the operation continuation time memory.

  Next, S41 is executed, and it is determined whether or not the set time has elapsed. This set time is set to a length sufficient to eliminate normal thermal expansion that is not excessive, and is referred to as thermal expansion cancellation set time. When the thermal expansion is excessive, the temperature of the male screw member 112 is higher than when the thermal expansion is not excessive, but the temperature decrease gradient after the operation is stopped is large, and the contraction gradient of the male screw member 112 is large. Therefore, if the cause of the positioning failure is excessive thermal expansion, the amount of positional deviation of the rail reference mark 59 is a standard amount, that is, the thermal expansion of the rail reference mark 59 after a sufficient time has passed to eliminate normal thermal expansion. This is because it is close to the amount in the absence state, and it can be seen that a situation larger than the standard increase gradient of the increase amount of the positional deviation amount of the rail reference mark 59 is caused by excessive thermal expansion.

  In the present embodiment, a plurality of types of thermal expansion elimination setting times are set in advance according to the operation duration time. It is acquired by the mounting module 10 in which the mounting module 10 is in a new state or the same model as the mounting module 10 is guaranteed to be normal. The mounting module 10 is operated, and the mounting operation of the electronic circuit component on the circuit board 54 by the mounting head 70 is simulated and then stopped. After the stop, the reference mark imaging device 28 images the rail reference mark 59 at every set time, and the positional deviation amount is acquired. This set time is shorter than the thermal expansion elimination set time, and may be the same as or different from the first set time of S28a. Then, if the positional deviation amount of the rail reference mark 59 becomes a value that can be regarded as the thermal expansion being eliminated, the elapsed time from the operation stop of the mounting module 10 at that time is acquired. The elapsed time is acquired by changing the operation continuation time of the mounting module 10 into a plurality of types. The mounting module 10 may be stopped for some reason after the operation starts and before the steady state where the temperature of the constituent members rises and becomes constant. In this case, since the temperature of the constituent members of the mounting module 10 has not yet reached the steady temperature, the temperature decrease gradient after the stop varies depending on the length of the operation continuation time, and the positional deviation amount of the rail reference mark 59 This is because the decrease gradients are different and the time required to reduce the positional deviation amount is also different. And the operation continuation time before the operation stop is divided into a plurality of stages, and for each stage, at least one operation continuation time for obtaining the thermal expansion elimination set time is set, one in this embodiment. The elapsed time is acquired and stored in the thermal expansion cancellation setting time memory in association with the operation duration time stage as the thermal expansion cancellation setting time. In S41, the operation continuation time stored in S40 is read, and the thermal expansion elimination set time is determined.

  After the set time has elapsed, S42 is executed. Then, the reference mark imaging device 28 is moved to image the rail reference mark 59, and the amount of positional deviation of the rail reference mark 59 is calculated and compared with the set value. At the time of this imaging, the reference mark imaging device 28 is first moved to a position where the value of the encoder 216 becomes the rail reference mark normal imaging position specified value. Further, the reference mark imaging device 28 is moved so as to eliminate the influence of backlash. If an image of the rail reference mark 59 is not obtained, the reference mark imaging device 28 performs imaging at different positions. Detection of excessive thermal expansion is performed in a state where an image of the rail reference mark 59 is obtained by imaging during normal operation. Therefore, an image of the rail reference mark 59 is also obtained during imaging in S42, and the amount of positional deviation is calculated. Is done. The set value for performing the determination in S42 is a positional deviation amount in a state where the male screw member 112 has returned to a state where there is no thermal expansion, and is caused by an imaging error, a positioning error of the reference mark imaging device 28, and an assembly error. It is set to a value that is slightly larger than the absolute value of the positional deviation amount of the rail reference mark 59 that is expected.

  If the absolute value of the positional deviation amount is equal to or less than the set value, it is estimated that an excessive positional deviation caused during normal operation is caused by excessive thermal expansion. This is because the thermal expansion has a feature that it decreases with the passage of time regardless of whether it is excessive or not, and the positional deviation amount is thereby reduced. It is displayed on the display screen 206 and notified that the thermal expansion of the male screw member 112 is estimated to be excessive. As a cause of excessive thermal expansion, for example, the load of the electric motor 110 is excessive, the air conditioner provided in the mounting module 10 is abnormal, the temperature around the male screw member 112 increases, and the temperature of the male screw member 112 increases. It is presumed that the temperature rises excessively and excessive thermal expansion occurs. This estimation is also notified.

  On the other hand, if the amount of misalignment is larger than the set value, S44 is executed to notify that the occurrence of the positioning failure and the cause of the failure are unknown. If the misalignment amount is still large even when the mounting module 10 is stopped and the misalignment due to the thermal expansion is eliminated, the misalignment amount does not increase suddenly. This is not clear, but it is unclear. The same applies to the case where the amount of misalignment increases during normal operation, but the increase is not abrupt, the increase gradient is standard, and S38a is NO, and the cause is unknown by executing S44. The occurrence of a failure is notified.

  If an excessive displacement occurs during normal operation, S45 to S48 are executed. S45 and S46 are executed in the same manner as S8 and S10. In S45, the reference mark imaging device 28 is moved and the rail reference mark 59 is imaged by varying the acceleration to three types. And if the fluctuation | variation of the minimum and the largest forward / reverse difference is large among the acquired 3 forward / backward differences, it is estimated that the cause of the positioning defect is a loose shift (S47). If the fluctuation is small, it is estimated that the cause of the positioning failure is a forced deviation (S48). The reason why S45 to S48 are executed is that the amount of positional deviation of the image of the rail reference mark 59 obtained by imaging in S28b has increased rapidly. Then, occurrence of a defect, notification of an estimated cause, and stop of the mounting module 10 are performed.

  Based on the estimated cause of the positioning failure displayed on the display screen 206, the worker performs maintenance or the like to eliminate the positioning failure. If the cause is unknown, the cause is investigated and resolved.

  After execution of S37 to S48, the flag F is set to ON in S49, indicating that a positioning failure based on the imaging of the rail reference mark 59 has been detected. Then, S50 is executed in the same manner as S28m, and it is determined whether or not the positional deviation amount obtained by imaging the head reference mark 140b during the normal operation is larger than the set amount. If the displacement amount is larger than the set amount, S137 to S148 are executed, and the cause of the positioning failure based on the imaging of the head reference mark 140b is detected. The steps for performing this detection are as follows. The reference mark to be imaged is the head reference mark 140b as shown by adding each step number to S37 to S48 plus 100. This is executed in the same manner as S37 to S48 except that it is performed by the imaging device 30. However, even if the increasing gradient of the positional deviation amount is not large, since excessive thermal expansion has already been detected, S51 becomes YES, S138 to S144 are not executed, S52 is executed, and the flag F is set. Reset to OFF. If the positional deviation amount of the head reference mark 140b is equal to or less than the set amount, S50 is NO and S52 is executed.

  During normal operation, the positional deviation amount of the rail reference mark 59 is not excessive, but if the positional deviation amount of the head reference mark 140b is excessive, the determination result of S281 is NO and the determination result of S28m is YES, and S137 to S148 are Executed. If the positional deviation amount of the head reference mark 140b has not increased rapidly, the determination result in S137 is NO and S51 is executed, but excessive thermal expansion has not been detected yet, and the flag F is set. Therefore, the determination result in S51 is NO, and S138 to S144 are executed.

  As apparent from the above description, in the present embodiment, the module main body 18 constitutes a stationary member, the encoder 216 of the electric motor 110 constitutes an operating position detection device, the X-axis direction moving device 80, the Y-axis direction. The suction nozzle positioning device is configured together with the moving device 82. Further, the portion provided with the components of the head mounting device 148 such as the leg support portion 162 of the X-axis slide 102 constitutes the mounted portion, and the head mounting device such as the leg portion 156 of the head main body 124 of the mounting head 70. A portion provided with 148 components constitutes a detachable portion, and the head reference mark 140 is fixedly provided to the detachable portion.

An excessive backlash of the feed screw mechanism 116 may be detected based on the image of the head reference mark 140. Even when the rail reference mark 59 is imaged before the start of operation, a defect including a loose deviation, a forced deviation, or an abnormality of unknown cause is detected, and the positioning defect may be detected by imaging the head reference mark 140. Good.
Further, the determination in S10 may be omitted, and if the result of the determination in S9 is that the forward / backward difference is excessive, a defect may have occurred. In this case, the cause of failure includes a loose shift and an abnormality whose cause is unknown.

  The cause of positioning failure of the positioning device is that the positioning device is overloaded, which means that the relationship between the detection value of the operating position detection device and the position of the image of the detected part has returned to the standard relationship. May be estimated without waiting. The embodiment will be described with reference to FIG.

  In the present embodiment, the routine for detecting the positioning failure and estimating the cause of the failure replaces S41, S42, S141, and S142 in order to detect excessive thermal expansion of the male screw member 112. S61 to S64, S161 to S164 Except that is executed, the routine is configured in the same manner as the routine of the above embodiment. In S61, it is determined whether or not the second set time has elapsed. In S61, the time is read repeatedly, and it is determined whether or not the second set time has elapsed based on the passage of time from the time read for the first time. When the second set time has elapsed, S62 is executed, the count value N of the counter is incremented by 1, and the rail reference mark 59 is imaged, the position deviation amount is acquired, and stored in the stop position deviation amount memory. . The reference mark imaging device 28 is moved so that the influence of backlash is eliminated.

  Next, in S63, it is determined whether or not the mounting module 10 has been stopped for a set time or longer depending on whether or not the count value N is equal to or greater than the set value Nsr. If the cause of the positioning failure is excessive thermal expansion, the thermal expansion amount of the male screw member 112 decreases due to a temperature drop due to operation stop, and the positional deviation amount of the rail reference mark 59 decreases with time. Therefore, if the decrease gradient of the positional deviation amount of the rail reference mark 59 is a magnitude that is estimated to be close to the quantity when the male screw member 112 is not thermally expanded if the stop time is sufficiently long. It can be estimated that the cause of the positioning failure is excessive thermal expansion. The decreasing gradient can be acquired in a time shorter than the time required for the positional deviation amount to be close to the amount when the male screw member 112 is not thermally expanded after the mounting module 10 is stopped. It is set to a value at which the positional deviation amount of the rail reference mark 59 is acquired for a time required to obtain a decreasing gradient of the positional deviation amount corresponding to the expansion.

  A plurality of types of set values Nsr are set in advance according to the operation duration time. Similar to the setting of the thermal expansion cancellation setting time for determining whether or not a sufficient time has passed for the thermal expansion to be canceled in S41, the main mounting module 10 is in a new state or the main mounting. After the mounting module 10 of the same model as the module 10 that is guaranteed to be normal is activated and stopped, the rail reference mark 59 is imaged at predetermined time intervals to obtain the amount of displacement. The time required for the decrease gradient to become the set decrease gradient is set. The decreasing gradient of the positional deviation amount of the rail reference mark 59 due to the temperature drop varies depending on the temperature of the male screw member 112 at the time of operation stop and varies depending on the operation duration time. Therefore, the operation continuation time before the operation stop is divided into a plurality of stages. Thus, at least one operation continuation time is set for each stage, in the present embodiment, one by one, and a decrease gradient of the positional deviation amount after the operation is stopped and a time required to acquire the decrease gradient are acquired. This time is converted into a set value Nsr and stored in the thermal expansion cancellation set value memory in association with the operation duration stage. The decreasing gradient is also stored as a set decreasing gradient. The second setting time of S61, which is the time interval for acquiring the positional deviation amount of the rail reference mark 59 after the mounting module 10 is stopped, is for imaging of the rail reference mark 59 performed when acquiring the set value Nsr, for example. It is set to the same length as the time interval. The second set time may be the same length as the first set time or may be a different length. In S63, the set value Nsr is determined based on the operation continuation time stored in S40.

  S61 to S63 are repeatedly executed until the count value N becomes equal to or greater than the set value Nsr. The reference mark image pickup device 28 remains stopped at the position where the rail reference mark 59 is picked up after the first execution of S62, and the rail reference mark 59 is picked up by the reference mark image pickup device 28 as it is. Each time S62 is executed, the reference mark imaging device 28 may be moved toward the rail reference mark 59 so that the rail reference mark 59 is imaged.

  If the count value N reaches the set value Nsr, S64 is executed, and it is determined whether or not the decrease gradient of the positional deviation amount of the rail reference mark 59 is substantially equal to the set decrease gradient. This determination is made based on the positional deviation amount acquired every time the second set time has elapsed in S62. For example, a decreasing gradient of the positional deviation amount is calculated based on the latest positional deviation amount and the oldest positional deviation amount. And compared with the set decreasing slope. The setting decrease gradient is determined based on the operation continuation time stored in S40. If the calculated actual decrease gradient is within a range that can be regarded as the set decrease gradient, the thermal expansion decreases with the passage of time, and the amount of misalignment of the rail reference mark 59 is the amount in the state without thermal expansion. It is estimated that the relationship between the rail reference mark 59 and the detected value of the encoder 216 returns to the standard relationship, the cause of the failure is estimated to be excessive thermal expansion, and S43 is executed. If the decreasing gradient is a value that cannot be regarded as the set decreasing gradient, the cause of the failure is unknown and S44 is executed. The count value N is reset to 0 after the determination in S63 is YES, and is reset in, for example, S43 and S44.

  Similarly, when a positioning failure is detected based on the imaging of the head reference mark 140b by the component imaging device 30, the cause of the positioning failure is excessive due to the magnitude of the decreasing gradient of the positional deviation amount of the head reference mark 140b. A determination is made whether or not it is inflated. The set value Nsh and the set decrease gradient used for each determination of S163 and S164 are such that the mounting module 10 is operated with different types of operation durations, and the head reference mark 140b is imaged at each set time after stopping. Acquired by causing the device 30 to take an image.

  Next, another embodiment of detection of backlash and slack deviation will be described based on FIG. In the embodiment described based on the flowchart shown in FIG. 12, it is assumed that no loose shift occurs if the acceleration / deceleration is sufficiently small when the reference mark imaging device 28 is moved in the forward direction and the reverse direction. However, in this embodiment, the backlash and the slack deviation are detected without this premise. Only the different parts from the flowchart shown in FIG. 12 will be described with different step numbers.

  In this embodiment, S71 is performed similarly to said S8 after execution of S1-S4. Then, in S72, it is determined whether or not the forward / reverse difference is excessive. It is determined whether or not the maximum forward / reverse difference among a plurality of, for example, three forward / backward differences acquired in S71 is greater than or equal to the set value. If it is smaller than the set value, S73 is executed, and the maximum forward / backward difference is The backlash amount is stored in the backlash amount memory. Although the forward / reverse difference may be caused by a loose shift, the maximum forward / reverse difference due to the loose shift is larger than the backlash that is not excessive. Therefore, the set value is set to a size that can discriminate between loose deviation and excessive backlash, and backlash that is not excessive, and the maximum forward / backward difference smaller than the set value is determined to be due to backlash that is not excessive. Is done. The backlash amount memory stores data even when the power of the mounting module 10 is turned off. In S73, the backlash amount memory is acquired in S71 instead of the backlash amount actually stored in the backlash amount memory. The maximum positive / negative difference is memorized.

  If the maximum forward / reverse difference is greater than or equal to the set value, some positioning failure has occurred, and S74 is executed to determine whether the forward / backward difference has increased rapidly. This determination is made based on whether or not the backlash amount stored in the backlash amount memory is subtracted from the maximum normal / reverse difference of the three normal / reverse differences acquired in S71, and whether or not the difference is equal to or larger than the set value. Is called. The backlash amount stored in the backlash amount memory is the same day as the current execution of S74, and may be the amount stored prior to the execution of S74, or the day before the current execution of S74. It may be the amount that has been executed and stored. In any case, the backlash amount stored in the backlash amount memory is the latest, and if the difference with respect to it is smaller than the set value and the forward / backward difference does not increase rapidly, the forward / backward difference can be attributed to the backlash. . This is because the backlash amount gradually increases.

  If the determination result in S74 is NO, S75 is executed to notify the excessive backlash, and the maximum forward / backward difference used in the determination in S74 is the backlash amount that is currently stored in the backlash amount memory. It is stored instead of the quantity. On the other hand, if the forward / reverse difference has increased rapidly, the excessive forward / backward difference is not due to backlash, and the determination of S74 is YES and S10 to S12 are executed. The looseness deviation is detected depending on whether or not.

  When a positioning failure is detected by imaging the head reference mark 140, three forward / backward differences are obtained by executing S18, and then S76 is executed in the same manner as S74 to determine whether the forward / backward difference has increased rapidly. The detection of the excessive backlash has been completed by imaging the rail reference mark 59. If the forward / backward difference has not increased rapidly, S26 is executed. If the forward / backward difference is increasing rapidly, S20 to S22 are executed, and the detection of looseness deviation or the like is performed.

  The excessive backlash of the positioning device may be detected during normal operation of the electronic circuit component mounting machine.

In addition, excessive thermal expansion, loose shift, and forced shift may be detected for the Y-axis direction moving device 82 that uses the linear motor 90 as a drive source. In that case, the linear scale 94 is made of a material having as small a coefficient of thermal expansion as possible, and the position and state where the linear motor 90 is not affected by the temperature rise of the linear motor 90 as much as possible (not easily affected by radiant heat). Etc.) is desirable.
Further, the Y-axis direction moving device may include a feed screw mechanism, and excessive backlash may be detected.

Further, a plurality of rail reference marks, which are detected portions provided in the substrate holding device, may be respectively imaged to detect a positioning failure. In this case, for example, by comparing the positional deviation amounts of the plurality of rail reference marks, it is possible to identify the location where excessive backlash occurs or to acquire the state of excessive thermal expansion.
A plurality of detected parts may be provided on the mounting head side. In this case, for example, a plurality of members that can move the detected portion with respect to the imaging device, for example, two or more members that are separate from each other, such as the mounting head 70, the X-axis slides 100 and 102, and the reference mark imaging device 28, Each member is provided at at least one of two or more locations separated in the X-axis direction and images are taken, and each positional deviation amount is acquired. For example, it is possible to specify the occurrence of backlash, thermal expansion, the looseness deviation, and the location where forced deviation occurs, based on the plurality of acquired positional deviation amounts.

  22: substrate holding device 24: component supply device 32: control device 70: mounting head 72: head moving device 80: X-axis direction moving device 82: Y-axis direction moving device 100, 102: X-axis slide 104, 106: X-axis Slide drive device 110: Electric motor 112: Male screw member 114: Nut 116: Feed screw mechanism 120: Adsorption nozzle 216: Encoder

Claims (3)

(a) a substrate holding device for holding a circuit substrate; (b) a component supply device for supplying an electronic circuit component; and (c) an electronic circuit component received from the component supply device by a component holder, and the substrate A mounting head mounted on the circuit substrate held by the holding device; and (d) a circuit base that is provided with a drive source and a motion transmission device and that holds the substrate holding device and the mounting head on the substrate holding device. In an electronic circuit component mounting machine including a positioning device that performs relative positioning between the base material holding device and the mounting head by relative movement in a direction parallel to the surface of the material, a plurality of components including at least excessive backlash of the positioning device A method for detecting a positioning failure due to a cause of a type and estimating the cause of the positioning failure,
An imaging device for imaging the detected portion with respect to one of the base material holding device and the mounting head and an imaging device for imaging the detected portion with respect to the other are fixedly provided, and the operation of the drive source is performed in the positioning device. An operating position detection device for detecting the position is provided,
When the drive source is operated in normal and reverse directions with acceleration / deceleration smaller than normal acceleration / deceleration until the detection values of the operating position detection device are equal to each other, A deviation amount between the two images of the detected portion in the screen is detected, a backlash amount is detected based on the deviation amount, and the positioning failure is detected when the detected backlash amount exceeds a set amount. And estimating the cause of the positioning failure as excessive backlash in the positioning device ,
In the case where the drive source is operated until the detection values of the operation position detection device are the same, by changing the drive source in the forward direction and the reverse direction, and by changing the acceleration to a plurality of types including acceleration larger than the normal acceleration, When the amount of deviation between the two images of the detected portion in the screen of the imaging device is detected and the amount obtained by subtracting the backlash amount from the maximum amount of deviation is equal to or larger than a set amount, the cause of the positioning failure is A positioning failure detection method for an electronic circuit component mounting machine, characterized by estimating a loose displacement caused by a looseness of a fastening device between a detected part and the imaging device . 2. The positioning failure detection method for an electronic circuit component mounting machine according to claim 1, wherein the motion transmission device includes a feed screw mechanism including a male screw member and a nut screwed together, and the backlash includes a backlash of the feed screw mechanism. . The mounting head includes a suction nozzle that sucks and holds an electronic circuit component by negative pressure, and the positioning device has a direction parallel to the surface of the circuit substrate held by the substrate holding device. The positioning failure detection method of the electronic circuit component mounting machine according to claim 1, further comprising: a suction nozzle positioning device that moves the suction nozzle to position the suction nozzle with respect to the circuit substrate .

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