JP4989199B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that picks up an electronic component from a component supply device by suction using a suction nozzle and mounts the electronic component on a printed circuit board. More specifically, an electronic component is picked up and picked up by a pick-up nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detecting device, and based on the measurement result of the height level detecting device. The present invention relates to an electronic component mounting apparatus for mounting electronic components on the printed circuit board.

A general electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In the case of a minimal electronic component, the printed circuit board may be warped during the mounting operation and may be taken home without being mounted, or the electronic component may be cracked or the solder may be scattered. For this reason, by using a substrate height level detection device such as a laser displacement meter, the lowering control of the suction nozzle is performed at the time of mounting based on the measurement result.
JP 2006-286707 A

  However, the measurement result of the height level detection device fluctuates with changes in the installation environment temperature of the electronic component mounting device, or the height level detection device of the height level detection device is expanded or contracted due to expansion or contraction of the structure in which the height level detection device is disposed. The measured value changes.

  SUMMARY OF THE INVENTION Accordingly, the present invention has an object to make it possible to cope with the warping of the printed circuit board so that the measurement result of the printed circuit board height level detecting device is not affected by the change in the installation environment temperature of the electronic component mounting device. To do.

Therefore, according to the first aspect of the present invention, the electronic component is picked up and taken out from the component supply device by the suction nozzle, the height level of the positioned printed board is measured by the height level detection device, and the measurement of the height level detection device is performed. In an electronic component mounting apparatus for mounting an electronic component on the printed circuit board based on a result, a substrate height measurement master jig, a recognition camera for imaging the master jig, and an imaging result of the recognition camera A measurement device that performs recognition processing to measure the center of the master jig, and a calculation device that calculates the amount of deviation between the stored set center value and the measurement result of the measurement device are provided and calculated by the calculation device. results the high level of the corrected center position of the master jig on the basis of the shift amount height level detection device is measured and determined by the height level detection device Based on the above the height level of the printed circuit board by correcting the result of measurement by the height level detection device, characterized in that so as to control the descent of the suction nozzle.

According to a second aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detection device. In the electronic component mounting apparatus for mounting an electronic component on the printed circuit board based on this, a substrate height measuring master jig having a detection surface protruding upward from the main body, and a matrix centered on the center coordinates of the master jig A measuring device for measuring the center of the master jig based on the measurement result obtained by measuring the height of the master jig at the height level detecting device at a plurality of positions, and the stored set center value and the measurement A calculation device that calculates the amount of deviation from the measurement result of the device, and the height of the center position of the master jig corrected based on the amount of deviation calculated by the calculation device The level height level detection device measures, on the basis of the result of measurement by the height level detection device, and corrects the measurement result of measuring the height level of the printed circuit board by the height level detection device, The lowering of the suction nozzle is controlled .

  According to a third aspect of the present invention, an electronic component is picked up and picked up by a suction nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detection device, and the measurement result of this height level detection device is used. In the electronic component mounting apparatus for mounting electronic components on the printed circuit board, a board height measurement master jig is provided, and the height of the master jig is measured based on the result of measurement by the height level detection apparatus. The measurement result obtained by measuring the height level of the printed circuit board by the height level detection device before mounting the electronic component on the printed circuit board is corrected to control the lowering of the suction nozzle. It is characterized by that.

  According to the present invention, it is possible to cope with the warp of the printed circuit board by preventing the measurement result of the height level detecting device of the printed circuit board from being affected by the change in the installation environment temperature of the electronic component mounting apparatus.

  Hereinafter, an embodiment of an electronic component mounting apparatus for mounting an electronic component on a printed circuit board will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) are provided on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic parts are mounted on the substrate P positioned and fixed by the positioning mechanism (not shown) by the positioning unit 5, the discharge conveyor 6 is conveyed.

  8A and 8B are a pair of beams that are long in the X direction, each of which rotates a screw shaft 10 by driving a Y-axis motor 9, and along the pair of left and right guides 11, a component take-out portion ( The component suction position) is individually moved in the Y direction.

  Each of the beams 8A and 8B is provided with mounting heads 7A and 7B that move along the guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7A or 7B is equipped with two vertical axis motors 13 for vertically moving the two suction nozzles 17A, 17B or 17C, 17D, and a θ-axis motor 14 for rotating around the vertical axis. Two are installed. Accordingly, the suction nozzles of the two mounting heads 7A and 7B can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.

  Reference numeral 15 denotes a board recognition camera for imaging a plurality of board recognition marks attached to the printed circuit board P, and reference numeral 16 denotes a component recognition camera for imaging electronic components sucked and held by the suction nozzles 17A, 17B, 17C, and 17D. Reference numeral 18 denotes a height level detection device such as a laser displacement meter provided in the mounting heads 7A and 7B, which measures the height level of the printed circuit board P positioned by the positioning unit.

  19 is a steel master jig for measuring the height of the substrate fixed to the base 2, and as shown in FIG. 3, a plane protruding upward with a step on the top surface of the rectangular body 19A. A measuring surface 19B having a rectangular shape is provided. The measurement surface 19B is formed as flat as possible.

  Next, in the control block diagram of FIG. 2, each element of the electronic component mounting apparatus 1 is centrally controlled by the CPU 30, and a ROM 31 storing a program related to this control and a RAM 32 storing various data are connected via a bus line 33. Connected. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. The Y-axis motor 9 and the like are connected to the CPU 30 via a drive circuit 38 and an interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting, and the X direction of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). , Y direction and angle information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 3, that is, component arrangement data. Further, for each component ID, the X of the electronic component is stored. The component library data relating to the direction, the length in the Y direction, thickness information, the nozzle ID of the used suction nozzle, and the like are stored.

  A recognition processing device 37 is connected to the CPU 30 via the interface 36. The recognition processing device 37 performs recognition processing of an image captured by the board recognition camera 15 or the component recognition camera 16. The processing result is sent to the CPU 30. That is, the CPU 30 outputs an instruction to the recognition processing device 37 so as to perform recognition processing (calculation of the amount of misalignment, etc.) of the images picked up by the board recognition camera 15 and the component recognition camera 16, and recognizes the recognition processing result. 37 is received.

  Next, calculation and storage of the offset value of the master jig 19 in the XY direction (plane direction) will be described based on the flowchart of FIG. For example, after the electronic component mounting apparatus is installed in the factory, first, the operator presses the touch panel switch 35 displayed on the monitor 34, and the CPU 30 moves the board recognition camera 15 above the master jig 19 by XY. In this way, the master jig 19 is imaged by the substrate recognition camera 15.

  Then, the recognition processor 37 recognizes the image captured by the board recognition camera 15, and the CPU 30 calculates the XY coordinates of the center of the measurement surface 19 </ b> B of the master jig 19 and stores the calculated XY coordinates in the RAM 32. To do. In this case, the measurement surface 19B is different in color from the surrounding lower surface 19C, and the measurement surface 19B is recognized.

  Thereafter, the CPU 30 calculates the amount of deviation from the design value, which is the theoretical center coordinate of the measurement surface 19B stored in the RAM 32, and stores it in the RAM 32 as an offset value in the XY direction of the master jig 19. That is, as shown in FIG. 5 showing an image captured by the substrate recognition camera 15, the center CO coordinate of the substrate recognition camera 15 as the design value of the measurement surface 19B and the measurement surface 19B of the master jig 19 imaged. The amount of deviation from the center JO coordinate is calculated and stored in the RAM 32 as an offset value in the XY direction of the master jig 19.

  Next, calculation and storage of the offset value in the XY direction (plane direction) of the height level detection device 18 will be described based on the flowchart of FIG. Similar to the calculation and storage of the offset value of the master jig 19 in the X and Y directions, for example, after the electronic component mounting apparatus is installed in the factory, the operator first presses the touch panel switch 35 displayed on the monitor 34. The CPU 30 controls the height level detection device 18 to move XY above the master jig 19 and measures the height level of the master jig 19 with the height level detection device 18.

  In this case, the height level of the master jig 19 is measured by the height level detector 18 at a plurality of matrix-like positions centered on the central coordinates of the master jig 19 (measurement surface 19B). Specifically, as shown in FIG. 7, the height level detector 18 is moved XY above the master jig 19, and the height level is detected at a total of 36 points in 6 columns and 6 rows on the master jig 19. The CPU 30 stores the measurement value of the height level detection device 18 in the RAM 32.

  Next, the CPU 30 compares these measured values with predetermined values stored in the RAM 32 in advance, and the lower measured value is the upper surface of the main body 19A of the master jig 19, and the higher measured value is the measured surface 19B. The measurement position where the measured value of a certain height or more is measured is recognized as the upper surface portion of the master jig 19, that is, the measurement surface 19B.

  Then, the CPU 30 calculates the center coordinates of the upper surface portion of the master jig 19 measured by the height level detection device 18 (the portion that should be the measurement surface 19B with a high measurement value), and stores the calculated value in the RAM 32. To do.

  Then, the amount of deviation between the center coordinates of the upper surface portion of the master jig 19 calculated in this way (the portion that should be the measurement surface 19B with a high measurement value) and the center coordinates of the master jig 19 stored in the RAM 32 in advance. And the amount of deviation is stored in the RAM 32 as a sensor offset value.

  Finally, the operator presses the touch panel switch 35 displayed on the monitor 34, and the CPU 30 causes the height level detection device 18 to be centered on the master jig 19, that is, the master stored in the RAM 32 as described above. The height level detection device 18 is positioned directly above the center position of the master jig 19 corrected based on the offset value in the XY direction of the jig 19 and the offset value in the XY direction of the height level detection device 18. The CPU 30 controls the X-axis motor 12 and the Y-axis motor 9, measures the height level of the master jig 19 with the height level detection device 18, and stores the measurement result in the RAM 32.

  With the above configuration, description will be given below based on the flowchart relating to the production operation shown in FIG. First, when the printed circuit board P is inherited from an upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is moved to the positioning unit 5 and carried in.

  At this time, the printed circuit board P is locked and stopped by a positioning pin (not shown) of the position regulating device as a reference in the substrate transport direction. Then, a Z clamp mechanism (not shown) is operated, and the level in the height direction of the printed board P can be kept constant, the printed board P can be positioned in the vertical direction, and the three-dimensional direction can be positioned. Can be fixed.

  Further, backup pins necessary for the printed circuit board P to be produced are inserted into a plurality of concave grooves of the backup base (not shown), and when the backup base rises, the backup pins hit the back surface of the printed circuit board P. The substrate P is pushed up and supported so as to hold the substrate P horizontally.

  In this way, the positioning operation of the printed circuit board P is completed. When the CPU 30 determines that the positioning has been performed, the X-axis motor 12 and the Y-axis motor 9 are controlled, and the mounting head 7A or 7B The height level detection device 18 is moved, and the height level detection device 18 is positioned above the master jig 19.

  In this case, as described above, the center position of the master jig 19 corrected based on the offset value in the XY direction of the master jig 19 stored in the RAM 32 and the offset value in the XY direction of the height level detection device 18 is stored. The CPU 30 controls the X-axis motor 12 and the Y-axis motor 9 so that the height level detection device 18 is positioned directly above, and the height level at the center position of the corrected master jig 19 is determined as the height level detection device. 18 measures.

  Then, the height level at the center position of the master jig 19 is measured every time a substrate is carried in before the production operation is started or immediately after the production operation is started, or every time a predetermined number of substrates are carried in, and the height level stored in the RAM 32 in advance. That is, when the value at the time of teaching is different from the measurement value of the height level detection device 18 and the difference is not within a certain range, the CPU 30 causes the RAM 32 to use the difference as a difference amount as the drift amount (variation amount) of the measurement value. To store.

  When the value at the time of teaching and the measured value of the height level detection device 18 are the same or when the difference is determined to be within a certain range, immediately after that, and after storing the drift amount (variation amount). The height level detector 18 measures (normally measures) the height level of the printed circuit board P positioned by the positioning unit 5, and the CPU 30 stores the measured value in the RAM 32.

  Thereafter, when the drift amount is stored, the CPU 30 adds the drift amount to the measurement result of the normal measurement, and attaches the electronic component on the printed circuit board so that the suction nozzles 17A, 17B or 17C are mounted. The amount of lowering is controlled by controlling the drive of the vertical shaft motor 13 of 17D. Further, when the drift amount is not stored, the suction nozzles 17A and 17B are arranged so that the electronic component is mounted on the printed circuit board P based on the measurement result of the normal measurement without taking the drift amount into consideration. Alternatively, the descent amount is controlled by controlling the driving of the vertical axis motors 13 of 17C and 17D.

  Conventionally, in extremely small electronic components, the measurement result of the height level detection device fluctuates with changes in the installation environment temperature of the electronic component mounting device, or the structure in which the height level detection device during operation is disposed. The measurement value of the height level detection device changes due to expansion and contraction, etc. Due to the warpage, there was a case where it was taken away without being mounted, or the electronic component was cracked or the solder was scattered. It can cope with the warp of the substrate.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component automatic placement device. It is a control block diagram. It is a perspective view of a master jig. It is a flowchart figure which calculates | requires the offset value of the XY direction of a master jig | tool. It is a figure which shows the imaging screen of a master jig | tool. It is a flowchart figure which calculates | requires the offset value of the XY direction of a height level detection apparatus. It is a figure which shows the relationship between the matrix centering on the center coordinate of a master jig | tool, and the upper surface of a master jig | tool. It is a figure which shows the flowchart which concerns on a production driving | operation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Positioning part 7A, 7B Mounting head 17A, B, C, D Suction nozzle 18 Height level detection apparatus 19 Master jig 30 CPU
32 RAM
34 Monitor 35 Touch Panel Switch P Printed Circuit Board

Claims (3)

An electronic component is picked up and picked up by a suction nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detection device. Based on the measurement result of the height level detection device, the printed circuit board In the electronic component mounting apparatus for mounting the electronic component on the substrate, the master jig for measuring the substrate height, the recognition camera for imaging the master jig, and recognition processing based on the imaging result of the recognition camera, the master jig And a calculation device for calculating a deviation amount between the stored set center value and the measurement result of the measurement device, and corrected based on the deviation amount calculated by the calculation device wherein the height level of the center position of the master fixture height level detection device measures, on the basis of the result of measurement by the height level detection device, wherein the purine The height level of the substrate by correcting the result of measurement by the height level detection device, an electronic component mounting apparatus characterized by said so as to control the descent of the suction nozzle. An electronic component is picked up and picked up by a suction nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detection device. Based on the measurement result of the height level detection device, the printed circuit board In an electronic component mounting apparatus for mounting an electronic component on a substrate, a substrate height measurement master jig having a detection surface protruding upward from the main body, and a plurality of matrix-shaped positions centered on the central coordinates of the master jig A measuring device that measures the center of the master jig based on a measurement result obtained by measuring the height of the master jig with the height level detection device, and a stored set center value and a measurement result of the measuring device. A calculation device for calculating a deviation amount, and the height level of the center position of the master jig corrected based on the deviation amount calculated by the calculation device is Level-detecting device measures, on the basis of the result of measurement by the height level detection device, wherein the printed circuit board of high level to correct the result of measurement by the height level detection device, the suction nozzle An electronic component mounting apparatus characterized in that the lowering is controlled .   An electronic component is picked up and picked up by a suction nozzle from a component supply device, and the height level of the positioned printed circuit board is measured by a height level detection device. Based on the measurement result of the height level detection device, the printed circuit board An electronic component mounting apparatus for mounting an electronic component on the printed circuit board includes a substrate height measurement master jig, and a printed circuit board positioned based on a result of measuring the height of the master jig by the height level detection apparatus. An electronic device characterized by correcting a measurement result obtained by measuring a height level of the printed circuit board with the height level detection device before mounting an electronic component on the electronic component to control the lowering of the suction nozzle. Component mounting device.

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