JPS596058B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a manufacturing apparatus for semiconductor devices, and in particular to converting a semiconductor element of a semiconductor device into an optical image and automatically detecting, positioning, and attaching the semiconductor element to an element attachment member. The invention relates to manufacturing equipment.

2. Description of the Related Art In the manufacture of semiconductor devices, there is a step of positioning and attaching semiconductor elements (hereinafter referred to as elements) obtained by dividing a semiconductor wafer to an element attaching member.

This process has conventionally been carried out manually using the device shown in side cross-section in FIG. 1, or with tweezers. The device shown in FIG. 1 has a large number of elements 1, V...
A malleable sheet 2 that adheres ... on its main surface opposite to its active surface.
is placed with the element above, and the push rod 3 is placed below the seat.
Also, a suction nozzle 4 is provided above the element side.
In addition, 5 in the figure is a cassette ring for spreading the above-mentioned malleable sheet 2. In the above apparatus, the sheet 2 is first heated and spread, the suction nozzle 4 is lowered, and then pushed up with the push rod 3 to bring one element 1 close to the nozzle of the suction nozzle 4. The suction nozzle 4 suctions the element 1 under negative pressure, transports it onto an electronic attachment member, and then attaches it.
The above-described device has the following drawbacks.

(a) Even if the element 1 is positioned in a predetermined position, it will be displaced during transportation by the suction nozzle, and a positional deviation will occur when it is mounted on a mounting member.

(b) The element may break during suction by the suction nozzle, and the tip of the suction nozzle is very small, making it difficult to hold the element by suction and causing deviation.

(c) Manual alignment one by one is extremely inefficient and is a major obstacle to automating the device.

(d) When an element near the edge of the extensible sheet is poked with a push rod, the stress generated around the push rod becomes uneven (greater toward the edge of the sheet), causing the element to tilt (see FIG. 11).

This limits the distance the push rod can hit.
The present invention provides a structure for a semiconductor device manufacturing apparatus that overcomes the above-mentioned conventional drawbacks.

The semiconductor device manufacturing apparatus according to the present invention includes a force setting method in which a sheet in which a plurality of semiconductor devices are bonded at their active surfaces is stretched horizontally with the semiconductor devices below, and a back-up spring that presses down the sheet centering on one of the semiconductor elements and brings the semiconductor element into contact with a lower semiconductor element mounting member; A push unit needle which is pressed against the element mounting member through the sheet and without tearing the sheet and which rises after the back up spring is raised after the pressing, and the push unit needle and the back up ring are moved up and down in the above correlation. A vertical movement mechanism, a light projecting section that projects a slit light onto the semiconductor element surface through the malleable sheet, and a light receiving section that receives a reflected image of the transmitted light on the semiconductor element surface and includes a two-dimensional image sensor are arranged in a predetermined position with respect to each other. An optical system mechanism arranged at an angle of An attachment member feeding mechanism that systematically moves horizontally in accordance with the element arrangement position, and an element feeding mechanism that is provided with the force setting and moves horizontally in accordance with the amount of information of the automatic positioning device. In order to attach the semiconductor element to the element attachment member, the semiconductor element is characterized by being equipped with a mechanism that automatically detects the element, corrects the position of the element, and automatically attaches it to the attachment member using an optical mechanism. .

Next, the present invention will be described in detail with reference to the drawings regarding an embodiment of a semiconductor device manufacturing apparatus.

In FIG. 2 showing a perspective view of an apparatus according to an embodiment of the present invention, reference numeral 12 is a malleable sheet made of vinyl chloride film with a thickness of 0.2 mm, which is stretched horizontally on a force setting ring 15 and has a lower surface. A plurality of semiconductor elements 1, ``...
... is glued on its active surface.

A push needle 13 is opposed to the force setting ring and descends perpendicularly so as to press the element against the element mounting member below through the sheet.

Next, a back-up spring 6 that descends concentrically with the push unit needle and pushes one of the elements on the lower surface is supported by a vertical movement mechanism 136 so as to move up and down at different timing from the push unit needle 13. It will be done. Furthermore, the center of the optical system mechanism 7 including the two-dimensional image sensor is located within a vertical plane that includes the axes of the push unit needle 13 and the backup spring 6, and the parts constituting the optical system mechanism are aligned in the vertical direction. The angles of the light-receiving side and the light-emitting side are each set to 20 degrees to make it suitable for removing reflected light from the sheet, and the space directly above is left open, making it easier to operate the push needle and the like. Further, the force setting ring 15 is held by a force setting ring holder 15a, and can be moved horizontally. Furthermore, the element feeding mechanism 8 allows the element mounting member 8 below the force setting ring to be displaced in the horizontal direction.
A pulse motor 8 is arranged at 0 and serves as a driving means in the vertical and horizontal directions.
The displacement can be finely adjusted by 0Y and 80X. The interrelated automatic drive mechanism of each part will be described later, and the outline of the operation of each part will be explained step by step with reference to FIGS. 3 to 8. FIG. 3 The push unit needle 13 and the back-up spring 6 are both located above the malleable sheet 12 stretched over the force setting ring 15, and the elements 1, 1
"...... are glued to the bottom surface of the sheet at each active surface.

The above sheet is an example of a 0.2 mm thick vinyl chloride film, and after dividing the semiconductor wafer on the sheet,
The sheet is heated and stretched. The element mounting member 8 is a sheet 12
The conductive adhesive layer 8a is provided on the upper surface. FIG. 4 Backup spring 6 descends (dashed arrow) and stops while pushing the sheet. In this state, in order to prevent undesired reflected light from being reflected from the light projecting part 7a of the optical system 7 to the pattern of the element mounting member,
A slit light having a width of m is projected, and the optical shape of the light that has passed through the sheet 12 and reflected from the element surface has passed through the sheet again is projected as an image on the two-dimensional image sensor installed in the light receiving section 7b. In this state, the microcomputer (processing section) determines that "the element is present." Next, the deviation with respect to the absolute coordinate center of the two-dimensional image sensor itself is calculated for the above image, and a pulse with an amount of information based on this value is sent to the pulse motor installed in the element feeding mechanism (150 (Fig. 2)). (15X (not shown), 15Y), thereby aligning the element by horizontal movement (in the X and Y directions) by a predetermined amount. FIG. 5 The push unit needle 13 also descends at the same time and pushes the malleable sheet 12 into the element attachment member 8.
Attach it on top. Figure 6 Raise the back up spring 6.

Figure 7 Raise the push unit needle 13. Figure 8
A feeding mechanism 150 (
A signal is given to the pulse motors 15X and 15Y of FIG. The element mounting member also moves in response to another signal, and the next one is positioned. Note that the push needle 13 and the back-up spring 6 are driven up and down by a vertical movement mechanism 136.

Further, horizontal movement of the element by a predetermined distance is achieved by the element feeding mechanism 150. Furthermore, the element mounting member 8
is placed on the element attachment member support stand and is sent by the element attachment member feeding mechanism 80. Further, the control system of each part including the above-mentioned element positioning is shown in a block diagram in FIG.

A in the figure is an example of a microcontroller, which incorporates a camera interface N, is closely connected to an interface logic B, and is connected to a digital switch C. The interface logic B includes an operation panel F1, a pellet edge sensor w, a connection circuit H to a pulse motor (80X, 80Y in FIG. 2) that directly drives the XY table (80 in FIG. 2), and an edge sensor J' for the board. The pulse motors (150X, 150Y (both not shown)) that directly drive the equipped XY table (150 in Fig. 2) are connected to the connection circuits J, and the manufacturing equipment main body K1 pellet counter G1 photo array camera and optical The system D is further connected to each of the monitors E and a signal is applied thereto. That is, the optical system mechanism 7 automatically detects the element through the malleable sheet, calculates the amount of deviation with respect to the absolute coordinate center, and commands the amount of information for this by the microcomputer (10 The element feeding mechanism 150 (FIG. 2) (processing section) positions the elements according to this amount of information. Further, the element attachment member 8 to which the element is attached is moved by a predetermined distance determined in advance by the feeding mechanism 80. When the attachment work for one element is completed, the element attachment member 8 is moved by a predetermined programmed distance by the element feeding mechanism 150. The device is horizontally moved in the Y direction (by the pulse motors 80X and 80Y), and the same operation is repeated to mount the devices on the device mounting member 8 one after another. The following FIG. 10 is a perspective view of another embodiment of the manufacturing device according to the present invention, and the arrangement of each part is different from that of the manufacturing device of the embodiment shown in FIG. The symbols of each part have been added in the same way as in Figure 2 for clarity.

According to this invention, there is an advantage that the semiconductor element can be directly mounted on the element mounting member from the sheet to which the semiconductor element is bonded.

This includes automatically detecting semiconductor elements using an optical mechanism,
This is because both efficiency and yield can be achieved favorably by back-up springs while performing position correction. First, the effect of the back-up spring according to the present invention is that the tensioning force of the sheet suspended on the force-setting ring to the semiconductor element can be made uniform regardless of the portion of the sheet, for example, the center and the edges.

This is because, as shown in Figure 12, the stress Fl, f2 (f1 and F2 are on opposite sides of the sheet with the pusher needle inside) generated in the sheet when it is poked with the pusher needle is applied to both the center and the edge of the sheet. But they are always equal. To further explain this, in the conventional technology that does not use a back-up spring, as shown in FIG.
≦, fl>f≦, and the element is tilted and rotated in the direction of the arrow. For this reason, the protrusion distance of the push rod is restricted, and protrusion exceeding the distance restriction is a cause of misalignment. The present invention includes the following steps: after pushing a part of the sheet to the center of the semiconductor element using a back-up spring so that the semiconductor element is in sufficient contact with the element mounting member, the semiconductor element is mounted using a push unit needle; As shown in Fig. 7 and Fig. 7, the back-up spring first retreats (raises) after mounting;
At this time, the push needle is still pushing the semiconductor element against the element mounting member, so that the adhesive force of the sheet is supported when the sheet is peeled off from the semiconductor element, and the mountability is not deteriorated. Furthermore, the push unit needle is used to press and mount the semiconductor device through a sheet, and since the active surface of the semiconductor device is adhered to the adhesive surface of the sheet, there is no risk of puncturing or tearing the sheet. Since the sheet does not sag or tear, both the semiconductor elements taken out first from the sheet and the semiconductor elements taken out later have the advantage that a certain good mounting can be achieved in combination with the back-up spring effect. As mentioned above, in the present invention, when mounting a semiconductor element, the semiconductor element is automatically positioned and mounted directly on the element mounting member via a sheet, so that positional deviation is less likely to occur, and therefore process efficiency is improved. In addition to showing remarkable improvements in mounting yield, quality yield, etc., there is also the advantage that damage to semiconductor elements is greatly reduced because adjacent semiconductor elements do not rub against each other due to the sheet soil.

[Brief explanation of the drawing]

1 is a sectional view of a conventional semiconductor device manufacturing apparatus, FIG. 2 is a perspective view of a semiconductor device manufacturing apparatus according to an embodiment of the present invention, and FIGS. 3 to 8 are a sectional view of a conventional semiconductor device manufacturing apparatus according to an embodiment of the present invention. FIG. 9 is a side view, partially in cross section, showing the mounting process using the semiconductor device manufacturing equipment; FIG. 9 is a block diagram showing the control system in the manufacturing equipment; and FIG. 10 is a perspective view showing another embodiment of the present invention. 11 is a cross-sectional view for explaining the operation of a conventional push rod, and FIG. 12 is a cross-sectional view for explaining the back-up spring according to the present invention. Note that the same reference numerals in the figures indicate the same or corresponding parts, respectively.
1,1/... Element, 6... Backup spring, 7... Optical system mechanism, 7a, 7b...
... Light emitting section in the optical system mechanism, 8 ... Element mounting member, 10 ... Control section, 12.
...Multiple sheet, 13...Push unit needle, 15...Force setting, 15X,
15Y...Pulse motor for horizontal movement of force setting, 80...Element attachment member feeding mechanism, 80
X, 80Y...Horizontal movement pulse motor of element mounting member feeding mechanism, 136...Vertical movement mechanism of push unit needle and back up spring, 150...
...Horizontal movement mechanism for force settling.

Claims (1)

[Claims] 1 A cassette ring in which a sheet to which a plurality of semiconductor devices are glued on their active surfaces is stretched horizontally with the semiconductor devices below; a backup ring that brings the semiconductor element into contact with the semiconductor element attachment member; and a backup ring that descends concentrically with the backup ring after the descent of the backup ring to press the semiconductor element against the element attachment member through the sheet without tearing the sheet; a push needle that rises after the backup ring rises after pressing; a vertical movement mechanism that moves the push needle and the backup ring up and down with the correlation; and a slit light beam that passes through the malleable sheet and onto the semiconductor element surface. an optical system mechanism in which a light projecting section for projecting light and a light receiving section that receives a reflected image on the light-transmitting semiconductor element surface and includes a two-dimensional image sensor are arranged at a predetermined angle to each other; and the image receiving pattern and the two-dimensional image. an automatic positioning device section including a microcomputer that corrects the deviation of the sensor with respect to the absolute coordinates; a mounting member feeding mechanism for placing a semiconductor element mounting member and systematically horizontally moving the semiconductor element mounting member in accordance with the element placement position; A semiconductor device manufacturing apparatus comprising: an element feeding mechanism in which the cassette ring is disposed and moves horizontally in accordance with the amount of information of the automatic positioning device.