JP4708896B2 - Adhesive tape sticking device and sticking method - Google Patents

Description

  The present invention relates to an adhesive tape attaching apparatus and an attaching method for attaching an adhesive tape to a terminal portion composed of a plurality of terminals provided on a side surface of a substrate.

  For example, in the manufacturing process of flat panel displays such as liquid crystal display panels and plasma display panels, electronic components such as TCP (Tape Carrier Package) are placed on the upper surface of the side of a glass substrate. There exists the process of sticking through the adhesive tape which consists of.

  Before the electronic component is attached to the upper surface of the side portion of the substrate, there is a step of attaching the adhesive tape cut to a predetermined length to the upper surface of the side portion of the substrate. Adhesive tapes are affixed to a release tape, which is wound around a supply reel.

  When an electronic component is attached to the upper surface of the side portion of the substrate with an adhesive tape, first, the adhesive tape fed out from the supply reel together with the release tape is cut into a predetermined length. The cutting length of the adhesive tape at this time is set to a length corresponding to the length of the terminal portion composed of a plurality of terminals provided on the side surface of the substrate.

  Next, the adhesive tape cut to a predetermined length is pulled out from the supply reel by, for example, a chuck, and positioned so that the cut portion faces the upper surface of the side part of the substrate placed on the table, and then cut. The adhesive tape thus applied is pressed and applied to the substrate.

  When sticking the adhesive tape cut to a predetermined length to the terminal part provided on the side part upper surface of the above substrate, if the substrate and the adhesive tape are not positioned accurately, the attached adhesive The terminal of the terminal part may be exposed from one end part in the longitudinal direction of the tape.

  In such a state, when the electronic component is attached to the substrate via the adhesive tape, a terminal provided on the electronic component may not be reliably connected electrically to the terminal of the substrate. Therefore, when adhering the adhesive tape to the substrate, the substrate and the cut adhesive tape must be accurately positioned.

Conventionally, the positioning of the substrate and the adhesive tape has been performed by controlling the moving distance of the chuck when the adhesive tape is cut out together with the release tape after the adhesive tape is cut. That is, the adhesive tape is positioned with respect to the substrate by controlling the amount of the adhesive tape drawn by the chuck. Such a conventional technique is disclosed in Patent Document 1.
JP-A-7-101618

  However, when controlling the positioning of the adhesive tape according to the moving distance of the chuck, the chuck holds the release tape and pulls the adhesive tape together with the release tape from the supply reel. When it is added, the release tape is stretched, and the adhesive tape cannot be positioned with high accuracy with respect to the substrate due to the stretch.

  In addition, the chuck is mechanically driven to perform positioning control. That is, the drive screw is rotationally driven by the servo motor, and the chuck is linearly driven by the drive screw.

  For this reason, the chuck positioning accuracy is limited by the mechanical clearance between the drive screw and the chuck, and it is impossible to position the adhesive tape with respect to the substrate with high accuracy. There was a thing.

  An object of the present invention is to provide an adhesive tape sticking device and a sticking method which can position an adhesive tape cut to a predetermined length and a substrate with high accuracy.

According to the present invention, a terminal portion composed of a plurality of terminals is provided at a predetermined length on the side surface of the substrate, and the adhesive tape attached to the release tape is cut to a length corresponding to the terminal portion. A sticking device for sticking to the terminal part,
A table on which the substrate is placed;
A cutting unit for cutting the adhesive tape into a predetermined length;
Transport means for transporting and positioning the cut adhesive tape together with the release tape to a position facing the terminal portion of the substrate placed on the table;
Imaging means for simultaneously imaging one end and the other end of the positioned adhesive tape together with positioning marks provided on one end and the other end of the side of the substrate ;
Correction means for correcting the relative position of the adhesive tape and the substrate based on the imaging signal from the imaging means;
A pressure-sensitive adhesive tape attaching apparatus comprising: a pressure means for pressure-adhering the pressure-sensitive adhesive tape to the substrate after position correction by the correction means.

  It is preferable that the correction unit controls the positioning of the table based on an imaging signal of the imaging unit.

  It is preferable that the correction unit controls a transport position of the adhesive tape by the transport unit based on an imaging signal of the imaging unit.

  It is preferable that the adhesive tape attached to the substrate is imaged by the imaging means, and the relative position between the adhesive tape and the substrate is feedback controlled by the imaging signal.

According to the present invention, a terminal portion composed of a plurality of terminals is provided at a predetermined length on the side surface of the substrate, and the adhesive tape attached to the release tape is cut to a length corresponding to the terminal portion. A sticking method for sticking to the terminal part,
Placing the substrate on the table;
Cutting the adhesive tape into a predetermined length;
Transporting and positioning the cut adhesive tape together with the release tape to a position facing the terminal portion of the substrate; and
A step of simultaneously imaging one end and the other end of the positioned adhesive tape together with positioning marks provided on one end and the other end of the side of the substrate ;
Correcting the relative position between the substrate and the adhesive tape based on the imaging result of the adhesive tape and the positioning mark ;
And a step of pressure-bonding the adhesive tape to the substrate after position correction.

  According to the present invention, if the adhesive tape is cut to a predetermined length and then pulled out to a position facing the substrate, one end and the other end of the adhesive tape are imaged, and the imaging signal is obtained. Based on this, the adhesive tape and the substrate are relatively positioned. Therefore, it becomes possible to position and stick the adhesive tape to the substrate with high accuracy by eliminating the influence of errors at the time of drawing.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a sticking apparatus according to an embodiment of the present invention, and this sticking apparatus includes a substrate stage 5. The substrate stage 5 has a base 6, and a table 7 that is driven in the X, Y, and θ directions by an X drive source 6 a, a Y drive source 6 b, and a θ drive source 6 c is provided on the upper surface of the base 6.

  On the table 7, as shown in FIG. 3A, a pair of glass substrates W used for a liquid crystal display panel or the like are supplied and vacuum-sucked. On one side portion of the upper surface of the substrate W, a terminal portion 1 having a plurality of terminals 1a formed at a predetermined interval is provided with a predetermined length. Furthermore, positioning marks m for positioning the substrate W by the table 7 are provided at both ends of the side portion of the substrate W.

  An adhesive tape 2 made of a double-sided adhesive anisotropic conductive member cut to a predetermined length as described later is attached to the terminal portion 1. Then, an electronic component 3 such as TCP is pressure-bonded to the terminal portion 1 to which the adhesive tape 2 is attached, as shown in FIG.

  As shown in FIG. 1, the adhesive tape 2 has a release tape 8 made of a translucent resin tape attached to one side and wound around a supply reel 9, with the adhesive tape 2 facing downward. The pair of guide rollers 11 are guided to run above the terminal portion 1 of the substrate W placed on the table 7.

  A pressurizing tool 13 is provided above the table 7 so as to be movable up and down by a vertical drive mechanism 14. The adhesive tape 2 is cut to a predetermined length by a cutting unit 23 described later, and when the cut portion is conveyed to a position facing the terminal portion 1 of the substrate W placed on the table 7, Stop at position. After stopping, the pressing tool 13 is lowered, and the portion of the adhesive tape 2 cut to a predetermined length is attached to the substrate W. After that, the release tape 8 is peeled off from the adhesive tape 2 by a release roller (not shown) and wound on the take-up reel 12.

  The pressure-sensitive adhesive tape 2 and the release tape 8 are conveyed by a feeding device 20 as a conveying means. The feeding device 20 has a chuck 21 formed so as to be able to sandwich the release tape 8. The chuck 21 is guided in a non-rotatable manner by a guide body (not shown), and is linearly driven by a drive screw 22a that is rotationally driven by a servo motor 22b.

  Therefore, if the chuck 21 holds the release tape 8 and the drive screw 22a is driven to rotate, and the chuck 21 is driven in the direction indicated by the arrow X in FIG. 2 is conveyed in the X direction, and the adhesive tape 2 can be positioned at a predetermined position, that is, a position facing the terminal portion 1 of the substrate W.

  The adhesive tape 2 is cut to a predetermined length by the cutting unit 23 on the upstream side of the substrate W in the transport direction. The cutting unit 23 includes a cutter 24 that is drawn from the supply reel 9 of the adhesive tape 2 and is disposed below the portion that travels horizontally, and a traveling direction of the adhesive tape 2 relative to the cutter 24. It is comprised from the peeling mechanism 25 arrange | positioned facing the downstream lower part. The cutter 24 can be driven in the vertical direction by a drive mechanism (not shown).

  The cutting unit 23 includes a holding block 26 that is disposed to face the cutter 24 and the peeling mechanism 25 on the upper surface side of the adhesive tape 2 to be conveyed. The holding block 26 is slidably provided with an extruding member 27 that presses the upper surface of the adhesive tape 2 through the release tape 8. The pushing member 27 is pressed at a predetermined timing by a cylinder (not shown).

  As shown in FIG. 2, a peeling head 28 is disposed on the lower surface side of the adhesive tape 2 facing the push member 27. The peeling head 28 is attached to the base plate 29. The base plate 29 is provided with a supply reel 32 around which an adhesive tape 31 is wound. The adhesive tape 31 travels along the upper surface of the peeling head 28 and is wound around a take-up reel 33. Yes.

  The base plate 29 is driven up and down by a cylinder 34. When the base plate 29 is driven in the upward direction, the portion cut by the pair of cutting lines 2b of the adhesive tape 2 is pushed down by the pushing member 27. The cutting line 2b is formed when the cutter 24 is driven in the upward direction and abuts against a portion of the adhesive tape 2 facing the lower surface of the holding block 26.

  Accordingly, the cut portion 2 a of the adhesive tape 2 is pressed against the adhesive tape 31 of the peeling head 28, so that the portion 2 a is peeled from the release tape 8. In other words, the adhesive tape 2 has a pair of cutting lines 2b formed at predetermined intervals by the cutter 24 at both end portions of a predetermined length to be adhered to the substrate W, and the portion 2a therebetween is removed by the peeling mechanism 25. After that, the remaining portion is adhered to the terminal portion 1 on the substrate W by the pressure tool 13.

  The adhesive tape 2 is cut into a predetermined length as shown in FIG. 1 by a pair of two cutting lines 2b. The timing of cutting of the adhesive tape 2 by the cutter 24 is performed in conjunction with the movement of the chuck 21 that pulls out the adhesive tape 2 from the supply reel 9, for example.

  The alignment marks m provided at both ends of one side where the terminal portion 1 of the substrate W supplied and placed on the table 7 is provided are the first cameras constituting the imaging means shown in FIG. 36 and the second camera 37.

  When the adhesive tape 2 cut to a predetermined length by the cutting unit 23 is sandwiched by the chuck 21 and pulled out to a position facing the terminal portion 1 of the substrate W on the table 7, the adhesive tape 2 is added. Before being pressure-bonded to the terminal portion 1 by the pressure tool 13, one end portion and the other end portion in the longitudinal direction are imaged by the first camera 36 and the second camera 37.

  The first camera 36 and the second camera 37 are retracted from the imaging position entering the lower surface side of both ends in the longitudinal direction of the pressure tool 13 raised by a drive mechanism (not shown) and the lower surface side of the pressure tool 13. The adhesive tape 2 is provided so as to be driven by a driving mechanism (not shown) between the retraction position and the alignment mark m of the substrate W on the table 7 via the release tape 8 at the imaging position. One end and the other end are imaged simultaneously.

  In this embodiment, one end of the adhesive tape 2 cut to a predetermined length and one alignment mark m can be simultaneously imaged by the first camera 36, and the other alignment mark m and the adhesive tape 2 are captured. The other end of the image can be simultaneously imaged by the second camera 37.

  As shown in FIG. 4, the imaging signals of the first camera 36 and the second camera 37 are input to an image processing unit (not shown) provided in the control device 39 and converted into a digital signal. When the table 7 is positioned at the teaching position, the first camera 36 and the second camera 37 image a pair of alignment marks m on the substrate W, and are supplied and placed on the table 7 by the imaging signal. The positions of the substrate W in the X, Y, and θ directions are calculated.

  The first camera 36 and the second camera 37 image one end and the other end of the adhesive tape 2 simultaneously with the pair of alignment marks m. The control device 39 calculates the X coordinates of the front end and the rear end, which are one end and the other end of the adhesive tape 2, based on the imaging signal. The relative position in the X direction between the substrate W and the adhesive tape 2 is determined from the X coordinate of the pair of alignment marks m on the substrate W and the X coordinate between one end and the other end of the adhesive tape 2.

  Thereby, the control device 39 drives the table 7 in the X, Y and θ directions so that the adhesive tape 2 cut to a predetermined length is positioned between the pair of alignment marks m on the substrate W. Position W. That is, the adhesive tape 2 is positioned so that the longitudinal center of the adhesive tape 2 coincides with the longitudinal center of the terminal portion 1 formed on one side of the substrate W.

  The driving of the X drive source 6a, Y drive source 6b, θ drive source 6c, vertical drive mechanism 14 and servo motor 22b is also controlled by the control device 39.

Next, the case where the adhesive tape 2 is stuck to the substrate W by the sticking apparatus having the above configuration will be described.
First, when the substrate W is supplied and placed on the table 7, the table 7 is driven to the teaching position, that is, below the pressurizing tool 13. At the same time, the release tape 8 is held by the chuck 21 of the feeding device 20 and the adhesive tape 2 cut to a predetermined length by the cutter 24 of the cutting unit 23 is provided on one side of the substrate W. It is pulled out above the part 1.

  Next, the first camera 36 and the second camera 37 are driven to the imaging position below the pressurizing tool 13, and alignment marks m on both ends of one side where the terminal portion 1 of the substrate W is provided. And one end and the other end of the adhesive tape 2 are imaged simultaneously. This state is shown in FIG.

  Imaging signals from the first camera 36 and the second camera 37 are input to the control device 39. Thereby, the amount of deviation between the position of the substrate W on the table 7 and the teaching position is calculated, and the table 7 is driven and positioned so that the deviation is eliminated.

  Further, an X-coordinate deviation amount between one end and the other end of the adhesive tape 2 cut to a predetermined length is calculated with respect to the pair of alignment marks m on the substrate W positioned at the teaching position. Then, the position of the substrate W in the X direction is further corrected so that the amount of deviation of the X coordinate between the pair of left and right alignment marks m and one end and the other end of the adhesive tape 2 becomes equal. As a result, the adhesive tape 2 cut to a predetermined length is positioned so as not to be displaced in the X direction with respect to the terminal portion 1. That is, the adhesive tape 2 is positioned so that the longitudinal center of the adhesive tape 2 coincides with the longitudinal center of the terminal portion 1.

  As described above, when the substrate W and the adhesive tape 2 are positioned, the first camera 36 and the second camera 37 are driven to the retracted position, and then the pressure is applied as shown in FIG. The tool 13 is driven in the downward direction. Thereby, the adhesive tape 2 cut into a predetermined length is attached to the terminal portion 1. After the sticking, the pressing tool 13 is raised and the release tape 8 is peeled from the adhesive tape 2 stuck on the substrate W.

  After peeling, the table 7 moves from below the pressure tool 13, the substrate W adhered to the adhesive tape 2 is taken out from the table 7, a new substrate W is supplied, and the adhesive tape 2 described above is supplied. Adhesion is repeated.

  In this way, the adhesive tape 2 of a predetermined length drawn out above the substrate W by the chuck 21 is imaged together with the alignment mark m formed on the substrate W by the first and second cameras 36 and 37, The adhesive tape 2 and the substrate W were aligned based on the imaging signal, and then the adhesive tape 2 was attached to the substrate W.

  Therefore, even when the adhesive tape 2 cut to a predetermined length is pulled out by the chuck 21, even if the adhesive tape 2 is misaligned with respect to the terminal portion 1 of the substrate W, the misalignment is prevented. It can correct | amend reliably and can affix on the said board | substrate W. FIG.

  Therefore, since the terminal 1a of the terminal part 1 provided on the substrate can be prevented from being exposed from the adhesive tape 2 attached to the terminal part 1, the electronic component 3 is attached to the terminal part 1 with the adhesive tape 2. Thus, it is possible to make an electrical connection reliably.

  In the embodiment described above, correction of the positional deviation in the X direction between the substrate and the adhesive tape is performed so as to correct the position in the X direction of the table (substrate) based on the imaging signals from the first and second cameras. However, the position of the pull-out amount of the adhesive tape by the chuck 21 may be corrected based on the imaging signals from the first and second cameras.

  Imaging of the alignment mark on the substrate and both ends of the adhesive tape is performed simultaneously by the first and second cameras. However, when the distance between the alignment mark and both ends of the adhesive tape is large, each is separate. You may make it image using the imaging camera of.

  Further, after the adhesive tape is stuck on the substrate and the pressure tool is raised, both ends of the adhesive tape are first and second imaged again by the camera to detect the X coordinate, and the detected value If the table is fed back and the table is positioned at the teaching position, the positioning accuracy of the table in the X direction can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the sticking apparatus of the adhesive tape which shows one embodiment of this invention. The block diagram of the cutting unit for cut | disconnecting an adhesive tape to predetermined length. (A) The top view of the state which affixed the adhesive tape cut | disconnected by predetermined length on the terminal part of the one side part of a board | substrate, (b) is the top view which affixed the electronic component on the one side part of a board | substrate. The block diagram of a control system. Explanatory drawing which shows the procedure which sticks an adhesive tape on a board | substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Terminal part, 2 ... Adhesive tape, 3 ... Electronic component, 7 ... Table, 13 ... Pressing tool (pressurizing means), 21 ... Chuck (conveying means), 23 ... Cutting unit, 36 ... 1st camera (Imaging means), 37 ... second camera (imaging means), 39 ... control device (correction means).

Claims (5)

A terminal portion composed of a plurality of terminals is provided on the side surface of the substrate with a predetermined length, and the adhesive tape affixed to the release tape is cut to a length corresponding to the terminal portion to form the terminal portion. A sticking device for sticking,
A table on which the substrate is placed;
A cutting unit for cutting the adhesive tape into a predetermined length;
Transport means for transporting and positioning the cut adhesive tape together with the release tape to a position facing the terminal portion of the substrate placed on the table;
Imaging means for simultaneously imaging one end and the other end of the positioned adhesive tape together with positioning marks provided on one end and the other end of the side of the substrate ;
Correction means for correcting the relative position of the adhesive tape and the substrate based on the imaging signal from the imaging means;
A pressure-sensitive adhesive tape bonding apparatus comprising: a pressure unit that pressure-bonds the pressure-sensitive adhesive tape to the substrate after position correction by the correction unit.   2. The adhesive tape sticking apparatus according to claim 1, wherein the correcting means controls the positioning of the table based on an imaging signal of the imaging means.   The adhesive tape sticking apparatus according to claim 1, wherein the correction unit controls a transport position of the adhesive tape by the transport unit based on an imaging signal of the imaging unit.   2. The adhesive tape according to claim 1, wherein an image of the adhesive tape affixed to the substrate is imaged by the imaging means, and a relative position between the adhesive tape and the substrate is feedback-controlled by the imaging signal. Sticking device. A terminal portion composed of a plurality of terminals is provided on the side surface of the substrate with a predetermined length, and the adhesive tape affixed to the release tape is cut to a length corresponding to the terminal portion to form the terminal portion. A sticking method for sticking,
Placing the substrate on the table;
Cutting the adhesive tape into a predetermined length;
Transporting and positioning the cut adhesive tape together with the release tape to a position facing the terminal portion of the substrate; and
A step of simultaneously imaging one end and the other end of the positioned adhesive tape together with positioning marks provided on one end and the other end of the side of the substrate ;
Correcting the relative position between the substrate and the adhesive tape based on the imaging result of the adhesive tape and the positioning mark ;
A method of applying pressure-sensitive adhesive tape to the substrate after position correction.

Images