JP4417893B2 - Adhesive tape sticking device and sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhering device for reliably adhering an adhesive tape cut at a predetermined length to a base plate. <P>SOLUTION: The adhering device comprises a feeder 20 for carrying and positioning the adhesive tape cut at a predetermined length together with a separative tape, a table 7 for holding the base plate and carrying and positioning the base plate so that its terminal portion is opposed to a cut portion of the adhesive tape 2 positioned by the carrying device. a pressure tool 13 for adhering the cut portion of the adhesive tape to the base plate under pressure heating, and a control device for measuring a time after the cut portion of the adhesive tape is carried and positioned by the feeder but before the base plate is positioned, comparing the time with a preset time, and controlling whether the cut portion of the adhesive tape is adhered or not to the base plate by the adhering means, in accordance with the comparison. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to an adhesive tape attaching apparatus and an attaching method for attaching an adhesive tape to a terminal portion composed of a plurality of terminals provided on a side surface of a substrate.

  For example, in the manufacturing process of flat panel displays such as liquid crystal display panels and plasma display panels, electronic parts such as TCP (Tape Carrier Package) are attached to the terminal parts provided on the upper side surfaces of glass substrates. There is a step of attaching via an adhesive tape as an anisotropic conductive member formed of a thermosetting resin containing metal particles having a diameter of μm.

  Before the electronic component is attached to the terminal portion on the upper surface of the side portion of the substrate, the adhesive tape cut to a predetermined length is attached to the upper surface of the side portion of the substrate. The adhesive tape is wound around the supply reel in a state of being stuck to the release tape.

  When an electronic component is attached to the upper surface of the side portion of the substrate with an adhesive tape, first, the adhesive tape fed out from the supply reel together with the release tape is cut into a predetermined length. The cutting length of the adhesive tape at this time is set to a length corresponding to the terminal portion provided on the side surface of the substrate.

Next, the adhesive tape cut to a predetermined length is pulled out from the supply reel together with the release tape by a chuck or the like, for example, and the cut portion is applied to the terminal portion on the side surface of the substrate placed on the table. Position to face each other. Next, the cut adhesive tape is attached to the substrate by applying pressure and heat to the substrate with a pressure tool having a heater as an attaching means, and the release tape is peeled off and wound up on a take-up reel. . Patent Document 1 discloses a technique in which an adhesive tape is attached to a substrate by applying pressure and heat.
JP-A-7-101618

  By the way, when the adhesive tape cut to a predetermined length is pulled out by the chuck, the adhesive tape is positioned so as to face the pressure tool having a heater and waits. Thereafter, the substrate is transported by the table, and the side portion on which the terminal portion is provided is positioned so as to face the lower side of the cut portion of the adhesive tape waiting. Next, the pressure tool is lowered, and the portion of the adhesive tape cut to a predetermined length is adhered to the substrate while being heated under pressure.

  By the way, the portion of the adhesive tape cut to a predetermined length is radiated from the pressurizing tool during standby until it is pulled out to the position facing the pressurizing tool and stuck to the substrate. Will receive.

  The adhesive tape is made of a thermosetting resin. Therefore, if it takes too much time to position the substrate by the table after the portion of the adhesive tape cut to a predetermined length is positioned, the adhesive tape receives radiant heat from the pressure tool. The time will be longer. As a result, the surface of the cut portion of the adhesive tape may be cured before being attached to the substrate.

  Even if the pressure tool is lowered in such a state and the pressure-sensitive adhesive tape is pressurized and heated to the substrate by this pressure tool, the surface is cured and the adhesiveness is reduced or lost. Sometimes it is not worn. In such a case, it may be necessary to stop and check the sticking operation, or the substrate may be sent to the next process in a state where the adhesive tape is not securely stuck.

  In the present invention, when the portion cut to the predetermined length of the adhesive tape is heated too much before being attached to the substrate, the new portion is attached without attaching the portion to the substrate. It is in providing the adhesive tape sticking apparatus and the sticking method which enabled it to prevent the sticking failure of an adhesive tape by doing.

In the present invention, a terminal portion is provided on the upper surface of a side portion of a substrate, and an adhesive tape made of a thermosetting resin bonded to a release tape and cut to a predetermined length is attached to the terminal portion. A sticking device,
A feeding means for feeding and positioning the adhesive tape cut to a predetermined length together with the release tape;
Conveying means for conveying and positioning the substrate so that the terminal portion faces the cut portion of the adhesive tape which is held by the feeding means and holds the substrate;
A portion of the adhesive tape cut by being provided in a vertically movable manner so as to be opposed to the upper portion of the adhesive tape that is positioned by the feeding means and cut in a predetermined length, and driven in a descending direction. An adhering means for adhering to the substrate while pressurizing and heating,
Measure the time from when the cut portion of the adhesive tape is fed by the feeding means to the position facing the lower side of the sticking means until the substrate is positioned, and set the time in advance And a control means for controlling whether or not to stick the cut portion of the adhesive tape to the substrate by the sticking means based on the comparison. It is in an adhesive tape sticking device.

The control means includes
A measuring unit that measures the time from when the portion cut to a predetermined length of the adhesive tape is positioned by the feeding means until the substrate is positioned;
A setting unit for presetting the time until the cut portion of the positioned adhesive tape is hardened to be stuck to the substrate by radiant heat from the sticking means;
A comparison unit for comparing the measurement time measured by the measurement unit with the set time set by the setting unit;
When the measurement time compared by the comparison unit is shorter than the set time, the adhesive tape is attached to the substrate by the attaching means, and when the measurement time is longer than the set time, the adhesive means is used by the feeding means. It is preferable to include a determination unit that transports the tape and causes the new cut portion to face the terminal portion of the substrate and then adheres the tape to the substrate by the attaching means.

In the present invention, a terminal portion is provided on the upper surface of a side portion of a substrate, and an adhesive tape made of a thermosetting resin bonded to a release tape and cut to a predetermined length is attached to the terminal portion. A sticking method,
Placing the substrate on the table;
A step of conveying and positioning the adhesive tape cut to a predetermined length together with the release tape;
Positioning the substrate so that the terminal portion of the substrate faces the cut portion of the positioned adhesive tape;
If the terminal portion of the substrate is positioned with respect to the cut portion of the adhesive tape, the adhering means provided so as to be movable up and down opposite to the cut portion of the adhesive tape. And a step of adhering to the substrate while pressurizing and heating the cut portion of the adhesive tape,
Before stuck to the substrate while heating the cut portion of the adhesive tape pressurized and by the sticking means, a position cut portions of said adhesive tape is opposed to below the sticking means The time from the positioning until the substrate is positioned is measured, the time is compared with a preset time, and the cut portion of the adhesive tape is attached to the substrate based on the comparison. And a step of determining whether or not the adhesive tape is attached.

  It is preferable that the adhesive tape is attached to the substrate when the time from when the cut portion of the adhesive tape is positioned until the substrate is positioned is shorter than a preset time.

  According to this invention, the time from when the cut portion of the adhesive tape is positioned to when the substrate is positioned with respect to this portion is measured, and the time is compared with a preset time. Since it is determined whether or not the cut portion of the adhesive tape is attached to the substrate, the cut portion of the adhesive tape can be prevented from being attached to the substrate in a cured state.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a sticking apparatus according to an embodiment of the present invention, and this sticking apparatus includes a substrate stage 5. The substrate stage 5 has a base 6, and a table 7 that is driven in the X, Y, and θ directions by an X drive source 6 a, a Y drive source 6 b, and a θ drive source 6 c is provided on the upper surface of the base 6.

  On the table 7, as shown in FIG. 3A, a substrate W made of a liquid crystal display panel is supplied and vacuum-sucked. On one side of the upper surface of the substrate W, as shown in FIG. 3 (b), a plurality of terminals 1a formed with a plurality of terminals 1a at a predetermined interval, in this embodiment, three terminal portions 1 are provided.

  On the upper surface of the side portion of the substrate W on which the terminal portion 1 is provided, an adhesive tape 2 made of a double-sided adhesive anisotropic conductive member, which is cut to a length over the three terminal portions 1 as will be described later. It is attached as shown in FIG. The adhesive tape 2 is made of a thermosetting resin mixed with metal particles. Then, an electronic component 3 such as TCP is attached to each terminal portion 1 via an adhesive tape 2.

  As shown in FIG. 1, the adhesive tape 2 is attached to a release tape 8 made of a translucent resin tape and wound around a supply reel 9, and a pair of guides with the adhesive tape 2 facing down. Guided by a roller 11. Thereby, the adhesive tape 2 runs so as to face the upper portion of the terminal portion 1 of the substrate W placed on the table 7.

  Above the table 7, a pressurizing tool 13 as a sticking means having a heater 13a is provided so as to be movable up and down by a vertical drive mechanism. The adhesive tape 2 is cut into a predetermined length by a cutting unit 23 described later, and the portion, that is, the cutting portion 2 a is positioned below the pressure tool 13 as described later.

  When the cut portion 2a of the adhesive tape 2 is positioned, the pressurizing tool 13 is lowered and the cut portion 2a of the adhesive tape 2 is attached to the portion where the terminal portion 1 on the side portion of the substrate W is provided. Worn. Thereafter, the release tape 8 is peeled off from the adhesive tape 2 by a release roller (not shown), and only the release tape 8 is taken up on the take-up reel 12.

  The cut portion 2 a of the adhesive tape 2 is adhered to the substrate W while being heated by the pressure tool 13 in order to improve the adhesion to the substrate W. However, since the heating by the pressure tool 13 at this time is a sufficiently short time as compared with the time of the main pressure bonding, the cut portion 2 a of the adhesive tape 2 is not melt-cured by the pressure tool 13.

  The adhesive tape 2 and the release tape 8 are transported by a feeding device 20 as a feeding means. The feeding device 20 has a chuck 21 formed so as to be able to sandwich the release tape 8. The chuck 21 is guided in a non-rotatable manner by a guide body (not shown), and is linearly driven by a drive screw 22a that is rotationally driven by a servo motor 22b.

  Therefore, if the chuck 21 holds the release tape 8 and the drive screw 22a is driven to rotate, and the chuck 21 is driven in the direction indicated by the arrow X in FIG. 2 is fed out in the X direction, and the cut portion 2 a can be positioned below the pressurizing tool 13.

  The adhesive tape 2 is cut to a predetermined length by the cutting unit 23 on the upstream side of the substrate W in the transport direction. The cutting unit 23 includes a cutter 24 and a peeling mechanism 25.

  The cutter 24 is disposed with its tip opposed below a portion that is pulled out from the supply reel 9 of the adhesive tape 2 and runs horizontally, and can be driven in the vertical direction by a drive mechanism (not shown). The peeling mechanism 25 is disposed to face the lower side of the adhesive tape 2 in the traveling direction of the adhesive tape 2 than the cutter 24.

  The cutting unit 23 includes a holding block 26 that is disposed to face the cutter 24 and the peeling mechanism 25 on the upper surface side of the adhesive tape 2 to be conveyed. The holding block 26 is slidably provided with an extruding member 27 that presses the upper surface of the adhesive tape 2 through the release tape 8. The pushing member 27 is pressed at a predetermined timing by a cylinder (not shown).

  As shown in FIG. 2, a peeling head 28 is disposed on the lower surface side of the adhesive tape 2 facing the push member 27. The peeling head 28 is attached to the base plate 29. The base plate 29 is provided with a supply reel 32 around which an adhesive tape 31 is wound. The adhesive tape 31 travels along the upper surface of the peeling head 28 and is wound around a take-up reel 33. Yes.

  The base plate 29 is driven up and down by a cylinder 34. When the base plate 29 is driven in the upward direction, the portion cut by the pair of cutting lines 2b of the adhesive tape 2 is pushed down by the pushing member 27. The cutting line 2b is formed when the cutter 24 is driven in the upward direction and abuts against a portion of the adhesive tape 2 facing the lower surface of the holding block 26.

  Accordingly, the portion 2c cut by the pair of cutting lines 2b of the adhesive tape 2 is pressed against the adhesive tape 31 of the peeling head 28, and the portion 2c is peeled from the release tape 8. In other words, the adhesive tape 2 has a pair of cutting lines 2b formed at predetermined intervals by the cutter 24 at both end portions of a predetermined length attached to the substrate W, and the portion 2c therebetween is removed by the peeling mechanism 25. After that, the remaining portion, that is, the above-described cutting portion 2 a having a predetermined length is adhered to the terminal portion 1 on the substrate W by the pressing tool 13.

The cutting timing of the adhesive tape 2 by the cutter 24 is performed in conjunction with the movement of the chuck 21 that pulls out the adhesive tape 2 from the supply reel 9, for example.
By the cutting unit 23, the cut portion 2 a having a predetermined length of the adhesive tape 2 is sandwiched and pulled out by the chuck 21 and positioned at a predetermined position, that is, below the pressure tool 13. When the cut portion 2a is pulled out and positioned, the table 7 on which the substrate W is placed is driven in the X, Y, and θ directions, and the terminal portion 1 on one side of the substrate W is bonded to the adhesive tape 2. Is positioned so as to face the cut portion 2a. That is, one side portion of the substrate W is positioned to face the lower side of the pressing tool 13.

  When the substrate is positioned, the pressing tool 13 is driven in the downward direction by the vertical drive mechanism 14, and the cut portion 2 a of the adhesive tape 2 is pressurized and heated to the substrate W through the release tape 8. Thereby, the cut portion 2 a of the adhesive tape 2 is adhered to the substrate 2.

  The driving of the pressurizing tool 13 and the feeding device 20 is controlled by a control device 41. As shown in FIG. 4, the control device 41 includes a measurement unit 42 and a setting unit 43. The measurement part 42 is a position where the cut portion 2a of the adhesive tape 2 is pulled out to a predetermined position by the feeding device 20 and positioned, and then the substrate W is a position where the cut portion 2a is adhered by the table 7. A time t <b> 1 until it is positioned below the pressing tool 13 is measured. This time t1 is taken as a measurement time.

  The setting portion 43 is a time shorter by a predetermined time than the time when the cut portion 2a of the adhesive tape 2 pulled out and positioned by the feeding device 20 receives radiant heat from the pressing tool 13 and the surface is cured, that is, the cut portion. Is set to a time t2 at which the material is not cured by the radiant heat. This time t2 is set as the set time.

  That is, when the adhesive tape 2 receives radiant heat from the heater 13a of the pressurizing tool 13 for a predetermined time or more, the surface is cured by the heat and the adhesiveness is reduced or lost. Even if it is pressurized by W, it may not stick.

  Therefore, the setting unit 43 sets the maximum time during which the adhesive tape 2 can maintain adhesiveness without curing the surface of the cut portion 2a even when the adhesive tape 2 receives radiant heat from the heater 13a of the pressurizing tool 13. Set as t2. Note that the set time t2 varies depending on the temperature of the heating tool 13, the distance between the heating tool 13 and the cutting portion 2a, the surrounding environment, and the like, and thus is preferably obtained experimentally.

  The measurement time t1 measured by the measurement unit 42 and the set time t2 set by the setting unit 43 are compared by the comparison unit 44. The comparison result in the comparison unit 44 is output to the determination unit 45. The determination unit 45 outputs a signal to the first drive unit 46 when the relationship between the measurement time t1 compared with the comparison unit 44 and the set time t2 is (t1> t2). The first drive unit 46 outputs a drive signal for driving the feeding device 20.

  That is, when (t1> t2), the cut portion 2a of the adhesive tape 2 has received the radiant heat from the heater 13a of the pressurizing tool 13 for a set time t2 or more, and thus the surface of the cut portion 2a has a surface. Curing will reduce the adhesive strength. Therefore, even if the cut portion 2a is pressed against the substrate W by the pressing tool 13, it may not be attached.

  Therefore, in such a case, the adhesive tape 2 is pulled by the feeding device 20 and wound around the take-up reel 12 without sticking the cut portion 2a to the substrate W, and the new cut portion 2a is pressed with the pressure tool. Then, the pressure tool 13 is driven in the downward direction after being positioned below 13, and a new cut portion 2 a is adhered to the substrate W.

  When the relationship between the measurement time t1 and the set time t2 compared by the comparison unit 44 is (t1 <t2), the surface of the cut portion 2a of the adhesive tape 2 positioned under the pressing tool 13 and waiting is added. It will not be heated until it hardens | cures with the radiant heat from the pressure tool 13. FIG.

  Therefore, in that case, a signal is output from the determination unit 45 to the second drive unit 47. The second drive unit 47 outputs a drive signal to the vertical drive mechanism 14 to drive the pressing tool 13 in the downward direction. As a result, the cut portion 2 a is pressed and stuck to the substrate W by the pressing tool 13.

Next, the operation of adhering the cut portion 2a of the adhesive tape 2 to the substrate W by the adhering device having the above configuration will be described with reference to the flowchart of FIG.
First, in step (hereinafter referred to as “S”) 1, the cut portion 2 a cut to a predetermined length by the cutting unit 23 of the adhesive tape 2 is pulled out by the feeding device 20 and positioned below the pressing tool 13. The This positioning can be performed precisely by imaging both ends of the cut portion with a camera (not shown).

  In S2, the substrate W is supplied to the table 7. The substrate W supplied to the table 7 is imaged with positioning marks (not shown) provided at both ends of one side of the substrate W by a camera (not shown). Driving in the Y and θ directions, the side portion of the substrate W is positioned so as to face the cut portion 2 a of the adhesive tape 2. That is, the substrate W is positioned below the pressing tool 13.

  If the substrate W is positioned, in S3, the measurement time t1 measured by the measuring unit 42, that is, the measurement from when the cut portion 2a of the adhesive tape 2 is positioned until the substrate W is positioned at the cut portion 2a. The comparison unit 44 compares the time t1 with the set time t2 set by the setting unit 43.

  In S4, the determination unit 45 determines the comparison result between the measurement time t1 and the set time t2. If the result is (t1 <t2), the pressing tool 13 is lowered in S5, and the cut portion 2a is moved to the substrate W. Adhere to.

  When the determination result in the determination unit 45 is (t1> t2), the time during which the cut portion 2a of the positioned adhesive tape 2 is heated by the radiant heat from the pressing tool 13 becomes too long, and the cut portion. The surface of 2a is cured and the adhesiveness is lowered or lost.

  Therefore, in S6, the cut portion 2a is not attached to the substrate W, and the feeding device 20 is driven to wind the cut portion 2a around the take-up reel 12, and the new cut portion 2a is opposed to the side portion of the substrate W. Transport to position.

  If the new cutting portion 2a is transported and positioned, a drive signal is output to the vertical drive mechanism 14, the pressing tool 13 is driven in the downward direction, and the cutting portion 2a is adhered to the substrate W. .

  Note that the measurement time t1 may be compared with the set time t2 by the comparison unit 44 after the new cut portion 2a is pulled out and positioned. In this case, since the substrate W is positioned in advance, the relationship between the measurement time t1 and the set time t2 is (t1 <t2). Accordingly, in this case as well, the new cut portion 2 a is stuck to the substrate W by the pressing tool 13 without being sent by the feeding device 20.

  Thus, after positioning the cutting | disconnection part 2a cut | disconnected by the predetermined length of the adhesive tape 2, after positioning the board | substrate W with the table 7, when sticking the said cutting | disconnection part 2a to the board | substrate W, it cut | disconnects. The time from when the portion 2a is positioned to when the substrate W is positioned is measured, and if the measurement time t1 is equal to or longer than the preset time t2, the cut portion 2a is not attached to the substrate W. Then, it was wound around the take-up reel 12, and a new cut portion 2a was fed out and adhered to the substrate W.

  Therefore, when the cutting part 2a receives radiant heat from the pressurizing tool 13 for a long time and the sticking property is lost or lost, the cutting part 2a does not stick to the substrate W. It is possible to reliably prevent the sticking failure of the adhesive tape 2 from occurring.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the sticking apparatus of the adhesive tape which shows one embodiment of this invention. The block diagram of the cutting unit for cut | disconnecting an adhesive tape to predetermined length. (A) is a top view which shows the state which affixed the electronic component on the one side part of a board | substrate, (b) is a top view which shows the terminal part provided in the one side part of the board | substrate. The block diagram of a control system. The flowchart which shows the procedure which sticks an adhesive tape on a board | substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Terminal part, 2 ... Adhesive tape, 3 ... Electronic component, 7 ... Table, 8 ... Release tape, 13 ... Pressure tool (sticking means), 21 ... Chuck (feeding means), 23 ... Cutting unit, DESCRIPTION OF SYMBOLS 41 ... Control apparatus, 42 ... Measuring part, 43 ... Setting part, 44 ... Comparison part, 45 ... Determination part.

Claims (4)

Terminal portions provided on the side surface of the substrate, in sticking apparatus for sticking an adhesive tape is adhered to the release tape to the terminal portion of a predetermined length to cut thermosetting resin There,
A feeding means for feeding and positioning the adhesive tape cut to a predetermined length together with the release tape;
Conveying means for conveying and positioning the substrate so that the terminal portion faces the cut portion of the adhesive tape which is held by the feeding means and holds the substrate;
A portion of the adhesive tape cut by being provided in a vertically movable manner so as to be opposed to the upper portion of the adhesive tape that is positioned by the feeding means and cut in a predetermined length, and driven in a descending direction. An adhering means for adhering to the substrate while pressurizing and heating,
Measure the time from when the cut portion of the adhesive tape is fed by the feeding means to the position facing the lower side of the sticking means until the substrate is positioned, and set the time in advance And a control means for controlling whether or not to stick the cut portion of the adhesive tape to the substrate by the sticking means based on the comparison. Adhesive tape sticking device. The control means includes
A measuring unit for measuring the time from when the portion of the adhesive tape cut to a predetermined length is positioned by the feeding means until the substrate is positioned;
A setting unit for presetting the time until the cut portion of the positioned adhesive tape is hardened to be stuck to the substrate by radiant heat from the sticking means;
A comparison unit for comparing the measurement time measured by the measurement unit with the set time set by the setting unit;
When the measurement time compared by the comparison unit is shorter than the set time, the adhesive tape is attached to the substrate by the attaching means, and when the measurement time is longer than the set time, the adhesive means is used by the feeding means. The pressure-sensitive adhesive according to claim 1, further comprising: a determination unit that transports the tape and causes the new cut portion to face the terminal portion of the substrate and then adheres the tape to the substrate by the attaching means. Tape sticking device. A terminal part is provided on the upper surface of the side part of the substrate, and a sticking method of sticking an adhesive tape made of a thermosetting resin attached to a release tape and cut to a predetermined length on the terminal part. There,
Placing the substrate on the table;
A step of conveying and positioning the adhesive tape cut to a predetermined length together with the release tape;
Positioning the substrate so that the terminal portion of the substrate faces the cut portion of the positioned adhesive tape;
If the terminal portion of the substrate is positioned with respect to the cut portion of the adhesive tape, the adhering means provided so as to be movable up and down opposite to the cut portion of the adhesive tape. And a step of adhering to the substrate while pressurizing and heating the cut portion of the adhesive tape,
Before stuck to the substrate while heating the cut portion of the adhesive tape pressurized and by the sticking means, a position cut portions of said adhesive tape is opposed to below the sticking means The time from the positioning until the substrate is positioned is measured, the time is compared with a preset time, and the cut portion of the adhesive tape is attached to the substrate based on the comparison. And a step of determining whether or not the adhesive tape is attached.   When the time until the substrate is positioned after the cut portion of the adhesive tape is positioned is shorter than a preset time, the adhesive tape is attached to the substrate. The sticking method of the adhesive tape of Claim 3 to do.

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