JPH10107404A - Component-mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent thermal deformation of a pressurizing tool, and to secure flatness of a tip surface, when a substrate and a component are connected through an anisotropic conductive film. SOLUTION: A pressurizing tool 13 and a pressure-driving mechanism 14, with which a pressurizing tool 13 is moved vertically, are provided on the pressure bonding head positioned on the upper part of a backup mechanism 11, which supports the backside of the circumferential part of a glass substrate 5. A pressure detector 20, which detects the pressurizing force of a pressurizing part 19, is provided between the base part 16 of the pressurizing tool 13 and the pressurizing part 19. A pressure force control part, which controls a pressure-driving device 14, is provided based on the detection signal of the pressure detector 20. A heat-irradiating mechanism 22, with which heat rays are mode for irradiating the lower part of the press-bonded head 10. When an anisotropic conductive film 7 is temporarily press-bonded and a TAB part is installed, heat irradiating is conducted on the anisotropic conductive film 7 using a heat-irradiating mechanism 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting apparatus for connecting a component having a lead portion to a substrate having a terminal portion via an anisotropic conductive film.

[0002]

In recent years, a film carrier component (TAB) having an IC chip mounted on a carrier tape has been developed.
A component mounting apparatus for automatically mounting a component) on, for example, a glass substrate of an LCD has been provided. This component mounting apparatus includes a glass substrate supply mechanism for supplying a glass substrate, a punching mechanism for punching a TAB component from a long carrier tape, a pressure bonding head for mounting the punched TAB component on the glass substrate, and a lead portion of the TAB component. And a visual recognition mechanism for aligning the terminal with the terminal portion of the glass substrate.

[0003] The glass substrate is provided with a terminal portion along the edge thereof, and an anisotropic conductive film (ACF) is arranged on the upper surface of the terminal portion.
This anisotropic conductive film is generally formed by dispersing metal particles in a base material made of a thermosetting resin, and performs electrical conduction only in the thickness direction while performing a function as an adhesive. It is intended. The pressure bonding head includes a pressure tool having a heater embedded therein, and the TAB component is arranged in a state in which a lead portion thereof is aligned with a terminal portion with the anisotropic conductive film interposed therebetween. Thus, the lead portion is heated and pressed while being pressed.

In the above-mentioned pressurizing tool, it is necessary to ensure flatness (parallelism with respect to a glass substrate) of a tip surface (pressing surface) in order to pressurize a connection portion between a lead portion and a terminal portion uniformly. . Particularly, in recent years, the miniaturization and densification of the lead portion (and, consequently, the terminal portion of the glass substrate) of components have been attempted, and more strict flatness is required for the tip end surface of the pressing tool. .

[0005] However, in the above-mentioned conventional device, the heat of the heater embedded in the pressurizing tool causes a deformation such as warpage of the pressurizing tool, and the flatness (parallelism) of the tip surface is impaired. there were. If the flatness of the distal end surface of the pressure tool is impaired, poor connection between the lead portion and the terminal portion occurs, or the connection strength is reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to connect a substrate and a component via an anisotropic conductive film. It is an object of the present invention to provide a component mounting apparatus which can prevent the occurrence of the problem and can secure the flatness of the front end surface.

[0007]

According to a first aspect of the present invention, there is provided a component mounting apparatus for connecting a terminal portion of a substrate and a lead portion of a component via an anisotropic conductive film exhibiting thermosetting properties. A pressing tool provided on the crimping head for pressing a connecting portion between the lead portion and the terminal portion, a pressing drive mechanism for driving the pressing tool in a pressing direction, and applying heat to the connecting portion. And a heat irradiation mechanism for performing the above.

[0008] According to this, the connection between the lead portion and the terminal portion sandwiching the anisotropic conductive film is heated by the heat irradiation mechanism, and the anisotropic conductive film is temporarily softened. In this state, the lead portion and the terminal portion are electrically connected by being pressed by the pressing tool in this state, and thereafter the anisotropic conductive film is cured, so that the electrical and mechanical connection is completed. I do. At this time, the heat irradiating mechanism serves as a heating source for heating the connection portion, and performs heating in a non-contact manner by heat irradiation from the outside of the pressurizing tool, so that the pressurizing tool itself does not become so high in temperature.

In this case, a step of temporarily pressing the anisotropic conductive film on the terminal portion of the substrate is performed, and the anisotropic conductive film disposed on the terminal portion is subjected to a heat irradiation mechanism. If the pressure is applied by the pressing tool while performing the heat irradiation (the invention of claim 2), the anisotropic conductive film can be formed on the terminal portion without increasing the temperature of the pressing tool itself. Can be pasted.

According to a third aspect of the present invention, there is provided a component mounting apparatus for connecting a terminal portion of a substrate and a lead portion of a component via an anisotropic conductive film exhibiting ultraviolet curability. A pressing tool for pressing a connecting portion between the lead portion and the terminal portion, a pressing drive mechanism for driving the pressing tool in a pressing direction, and ultraviolet light for irradiating the connecting portion with ultraviolet light. It is characterized by having a light irradiation mechanism.

According to this, again, the pressure tool itself does not become so hot. In this case, the step of temporarily pressing the anisotropic conductive film on the terminal portion of the substrate is performed, and the anisotropic conductive film disposed on the terminal portion is irradiated with ultraviolet light by an ultraviolet light irradiation mechanism. Is configured to be pressurized by the pressurizing tool while irradiating (claim 2).
Invention), the anisotropic conductive film can be stuck on the terminal portion without the temperature of the pressing tool itself being too high.

Further, in each of the above component mounting apparatuses, a pressing force detecting means for detecting a pressing force by a pressing tool, and a pressing control means for controlling a pressing driving mechanism based on the detection of the pressing force detecting means. May be provided (the invention of claim 5). According to this, it is possible to appropriately control the pressing force by the pressing tool.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below by using a TAB component (carrier tape component) on a glass substrate (liquid crystal cell) of an LCD.
An embodiment in which the present invention is applied to a component mounting apparatus in which is mounted will be described with reference to FIGS.
This embodiment corresponds to claims 1, 2, and 5.

First, as shown in FIG.
Is formed by mounting an IC chip 4 (inner lead bonding) on a carrier tape 3 on which a lead portion 2 having a large number of leads 2a is formed in advance. This T
A large number of AB parts 1 are continuously formed on a long carrier tape 3 and are individually separated by punching.

On the other hand, the glass substrate 5 of the LCD, which is a substrate,
A terminal portion 6 having a large number of terminals 6a is provided on the edge. In the TAB component 1, the lead portion 2 and the terminal portion 6 are overlapped via a narrow tape-like anisotropic conductive film (ACF) 7, and are mounted in an electrically connected state. ing. At this time, as is well known, the anisotropic conductive film 7 is formed by dispersing metal particles in a base material made of a thermosetting resin, and has a thickness while acting as an adhesive. Electrical conduction is achieved only in the direction. The component mounting apparatus according to the present embodiment uses the glass substrate 5
The anisotropic conductive film 7 is temporarily press-bonded (attached) onto the terminal portion 6 of the above, and then the TAB component 1 is mounted by crimping.

Although not shown in detail, the component mounting apparatus according to this embodiment is roughly divided into a long carrier tape 3
Punching part for punching TAB part 1 from
A component mounting portion for mounting the AB portion 1 on the glass substrate 5 is provided. Each mechanism of the component mounting apparatus is controlled by a control device (not shown) according to a predetermined mounting program, so that the work of punching and mounting the TAB component 1 is automatically executed.

The component punching section includes a tape feed mechanism that pulls out a long carrier tape 4 from a supply reel and feeds it to a take-up reel, and a TAB component that is provided in the middle of a transport path through which the carrier tape 4 is fed. Punching mechanism with lower and upper dies for punching 1, TAB parts 1
And the like.

On the other hand, as shown in FIG. 1 and FIG. 2, the component mounting section has a substrate mounting table 8 on which the glass substrate 5 is set in a positioning state, and the substrate mounting table 8 can be freely moved in a horizontal direction. A substrate supply mechanism 9 to be moved, a pressure bonding head 10 for mounting the TAB component 1 on the glass substrate 5, a backup mechanism 11 positioned below the pressure bonding head 10 and supporting the back surface of the edge of the glass substrate 5; It is provided with an ACF supply mechanism for supplying the anisotropic conductive film 7, a visual recognition mechanism for aligning the terminal portions 6 of the glass substrate 5 by visual recognition, and the like.

As shown in FIGS. 1 and 2, the pressure bonding head 10 is mounted on a mounting frame 12 by a pressing tool 13.
And a pressurizing drive mechanism 1 for vertically moving the pressurizing tool 13 with respect to the mounting frame 12.
4 is provided. The pressurizing tool 13 includes a base 16 that can move up and down on the mounting frame 12 via a linear guide 15, and a pressurizing unit mounted on the base 16 via a pair of shafts 17 and springs 18. 19 are provided. The pressurizing unit 1
As shown in FIG. 1, 9 has a T-shaped side surface, and its elongated and flat tip surface presses the anisotropic conductive film 7 and the lead portion 2 of the TAB component 1.

Further, in this embodiment, the pressing tool 1
3, two pressure detectors 20 are provided between the base part 16 and the pressure part 19 as pressure detection means for detecting the pressure by the pressure part 19. As shown in FIG. 2, a detection signal of the pressure detector 20 is input to a pressing force control unit 21 of a control device serving as a pressurizing control unit, and the pressing force control unit 21 generates a pressing force based on the detection signal. Is controlled to keep the pressure driving device 14 at a predetermined value.

Then, as shown in FIG.
At 0, a heat irradiation mechanism 22 is provided in the vicinity of the pressure tool 13. The heat irradiating mechanism 22 includes, for example, a lamp heater or the like, and irradiates a heat ray toward a lower part of the pressing tool 13. As a result, as described later, when the anisotropic conductive film 7 is temporarily compressed,
When the AB component 1 is mounted, the heat irradiating mechanism 22 irradiates heat to the connection portion (the anisotropic conductive film 7 portion).

Next, the operation of the above configuration will be described. In temporarily bonding the anisotropic conductive film 7 on the terminal portion 6 of the glass substrate 5, first, the terminal portion of the glass substrate 5, which is set on the backup mechanism 11 by the substrate supply mechanism 9, is aligned. An anisotropic conductive film 7 is supplied onto the substrate 6 by an ACF supply mechanism (not shown). Then, heat irradiation is performed on the anisotropic conductive film 7 by the heat irradiation mechanism 22 of the pressure bonding head 10, and the anisotropic conductive film 7 is heated and softened.

Next, the pressing tool 13 is lowered, and the anisotropic conductive film 7 is pressed by the pressing portion 19, and the glass substrate 5 is pressed.
Is temporarily crimped on the terminal portion 6 of the above. At this time, when the anisotropic conductive film 7 is pressed, the pressing force of the pressing tool 13 is detected by the pressure detector 20, and the pressing driving mechanism 14 is controlled by the pressure control unit 21. The pressing force is set to an appropriate constant value.

Thereafter, the step of crimping the TAB component 1 is performed. In this step, first, the TAB component 1 is pressed.
However, the lead portion 2 is set on the edge of the glass substrate 5 so as to be aligned with the terminal portion 6 with the anisotropic conductive film 7 interposed therebetween. Then, from this state, heat irradiation is performed toward the connection portion (anisotropic conductive film 7) by the heat irradiation mechanism 22, whereby the anisotropic conductive film 7 is heated and softened, and then the pressing tool 13 is lowered. And the pressing unit 19
The lead portion 2 of the B component 1 is pressed, and the TAB component 1 is pressed on the glass substrate 5.

Thereafter, as the anisotropic conductive film 7 cures, the electrical and mechanical connection between the glass substrate 5 and the TAB component 1 is completed. Also at this time, the pressing force of the pressing tool 13 is detected by the pressure detector 20, and the pressing driving mechanism 14 is controlled by the pressure control unit 21, so that the pressing force of the pressing tool 13 is set to an appropriate constant value. It has become.

In the present embodiment, however, as described above, when the anisotropic conductive film 7 is temporarily pressed and the TAB component 1 is mounted,
In heating the anisotropic conductive film 7, unlike a conventional method in which heating is performed by a heater buried in a pressing tool, a heat irradiation mechanism 22 provided separately from the pressing tool 13 includes a connecting portion. It becomes a heating source for heating. Accordingly, the anisotropic conductive film 7 is heated in a non-contact manner by heat irradiation from the outside of the pressurizing portion 19 of the pressurizing tool 13, and the pressurizing tool 13 (the pressurizing portion 19) itself is much less. It does not get hot.

Therefore, according to this embodiment, the glass substrate 5
And the TAB component 1 are connected via the anisotropic conductive film 7, and unlike the conventional one in which deformation such as warpage may occur in the pressurizing tool due to the heat of the heater,
Thermal deformation of the pressing tool 13 (pressing portion 19) can be prevented, and flatness of the distal end surface can be ensured.
As a result, it is possible to prevent the occurrence of connection failure between the lead portion 2 and the terminal portion 6 and the reduction in connection strength.

Further, in the present embodiment, in particular, in the pressure tool 1
3 and a pressure control unit 21 for controlling the pressure drive mechanism 14 based on the detection of the pressure detector 20. It is possible to obtain an advantage that the pressing force can be appropriately controlled and a stable connection operation can be performed.

FIG. 4 shows another embodiment of the present invention.
4 (corresponding to No. 4). This embodiment is different from the first embodiment in that an anisotropic conductive film 31 exhibiting ultraviolet curability is used, and an ultraviolet light irradiation mechanism such as an ultraviolet lamp is used instead of the heat irradiation mechanism 22. 32 are provided. According to this, after all,
The connecting operation can be performed without raising the temperature of the pressing tool 13 (the pressing section 19) itself, and the flatness of the tip end surface of the pressing tool 13 (the pressing section 19) can be ensured. is there.

The present invention is not limited to the above-described embodiments. For example, the heat irradiation mechanism 22 and the ultraviolet light irradiation mechanism 32 may be used separately or may be used separately. May be used to perform the connection operation.
The present invention is not limited to the glass substrate of D, but can be applied to any component mounting apparatus using an anisotropic conductive film.

[0031]

As is clear from the above description, according to the component mounting apparatus of the present invention, the board and the component are connected via the anisotropic conductive film, Since a heat irradiation mechanism (or ultraviolet light irradiation mechanism) that performs heat irradiation (or ultraviolet light irradiation) on the connection part is provided separately from the pressure tool for pressing the , And an excellent practical effect that flatness of the tip end surface can be ensured.

Further, by providing a pressing force detecting means for detecting the pressing force by the pressing tool and a pressing control means for controlling the pressing driving mechanism based on the detection of the pressing force detecting means, The pressing force by the pressure tool can always be appropriately controlled, which is more effective.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention and is a side view of a main part.

FIG. 2 is a front view of a main part.

FIG. 3 is an enlarged perspective view showing a state of connection between a terminal portion and a lead portion.

FIG. 4 is a view corresponding to FIG. 1, showing another embodiment of the present invention.

[Explanation of symbols]

In the drawing, 1 is a TAB component (component), 2 is a lead portion, 5 is a glass substrate (substrate), 6 is a terminal portion, 7 and 31 are anisotropic conductive films, 10 is a pressure bonding head, 13 is a pressure tool, 19 is a pressurizing unit, 20 is a pressure detector (pressurizing force detecting means), 21 is a pressurizing force control unit (pressurizing control means), 22 is a heat irradiation mechanism, 32
Indicates an ultraviolet light irradiation mechanism.

Claims (5)

[Claims] 1. A component having a lead portion is pressed against a substrate having a terminal portion by a pressure bonding head so that the terminal portion and the terminal portion are connected via an anisotropic conductive film exhibiting thermosetting properties. A press tool for pressurizing a connection portion between the lead portion and the terminal portion, the press tool being provided on the crimping head, and pressurizing the press tool in a press direction. A component mounting apparatus, comprising: a driving mechanism; and a heat irradiation mechanism for irradiating the connection portion with heat. 2. In the step of temporarily compressing an anisotropic conductive film on a terminal portion of a substrate, the anisotropic conductive film disposed on the terminal portion is subjected to heat irradiation by a heat irradiation mechanism.
The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to perform pressing by a pressing tool. 3. A component having a lead portion is pressed against a substrate having a terminal portion by a pressure bonding head such that the lead portion and the terminal portion are connected via an anisotropic conductive film exhibiting ultraviolet curability. A press tool provided on the crimping head for pressurizing a connection portion between the terminal portion and the lead portion, and a pressurizing device for driving the pressurizing tool in a pressurizing direction. A component mounting apparatus comprising: a driving mechanism; and an ultraviolet light irradiation mechanism that irradiates the connection portion with ultraviolet light. 4. A step of temporarily compressing an anisotropic conductive film on a lead portion of a substrate, wherein the anisotropic conductive film disposed on the terminal portion is irradiated with ultraviolet light by an ultraviolet light irradiation mechanism. 4. The component mounting apparatus according to claim 3, wherein a pressure is applied by a pressing tool while performing. 5. A pressurizing force detecting means for detecting a pressurizing force by a pressurizing tool, and pressurizing control means for controlling a pressurizing drive mechanism based on the detection of the pressurizing force detecting means. Item 5. The component mounting apparatus according to any one of Items 1 to 4.