JP4667272B2 - Component joining apparatus and component joining method - Google Patents

Description

  The present invention relates to a component bonding apparatus and a component bonding method, and more particularly to a component bonding apparatus and a component bonding method for bonding an electrode of a flat panel display and an electrode of an electronic component with an anisotropic conductive adhesive interposed.

  Conventionally, TAB (Tape Automated Bonding) substrates with electrodes on flat panel displays (hereinafter referred to as flat panels) such as liquid crystal displays and plasma displays with electrodes composed of ITO (Indium Tin Oxide), 2. Description of the Related Art Electronic components such as semiconductor elements and flexible substrates (hereinafter referred to as joined components) are mounted. In this mounting, a flat panel display electrode (hereinafter referred to as a panel electrode) and a bonding component electrode (hereinafter referred to as a component electrode) are bonded. That is, provisional pressure bonding and main pressure bonding of the bonded component to the flat panel are performed with an anisotropic conductive adhesive interposed between the bonded component and the flat panel. In the pre-bonding, the bonded parts are temporarily pressed with a weak pressure by a thermo-compression pressing head, and in the subsequent main pressing, the temporarily-bonded bonded parts are strongly pressed by a thermo-compression pressing head. To be done.

When mounting the above-mentioned joining component, if the panel electrode and the component electrode are not joined with sufficient pressure, or if there is a displacement between the panel electrode and the component electrode, the panel electrode and the component The bonding state with the electrode deteriorates. If the panel electrode and the component electrode are not sufficiently electrically connected, the flat panel is treated as a defective product. For example, a component bonding method described in Patent Document 1 has been proposed in order to eliminate defective products generated due to such mounting component mounting defects. In this component bonding method, the bonding state between the electrodes in the defective product is fed back, and the mounting condition of the next bonding component is changed in consideration of the fed-back bonding state.
JP-A-8-330393

  By the way, in the component bonding method described in Patent Document 1, it is possible to prevent the bonding state between the electrodes from deteriorating with respect to a bonded component mounted after a defective product is generated. However, since it is assumed that defective products are generated, at least one flat panel on which the joining parts are mounted must be sacrificed. As a result, the yield of the flat panel on which the joining component is mounted cannot be greatly improved.

  Further, in the component bonding method described in Patent Document 1, the next bonded component is mounted based on the bonded state in the defective product. However, in the mounting of the next bonded component, the bonded state is the same as the bonded state in the defective product. Does not necessarily occur. Therefore, it is impossible to change the mounting condition of the joining component to an appropriate one, and the yield of the flat panel on which the joining component is mounted cannot be greatly improved.

  In view of the above problems, an object of the present invention is to provide a component bonding apparatus and a component bonding method capable of greatly improving the yield of a flat panel on which bonded components are mounted.

  In order to achieve the above object, a component bonding apparatus according to the present invention is a component bonding apparatus for bonding a panel electrode of a flat panel and a component electrode of a component, the bonding member including conductive particles through the adhesive member. A bonding means for bonding the panel electrode and the component electrode, and particles positioned between the panel electrode and the component electrode bonded by the bonding means when bonding by the bonding means is performed. Imaging means for imaging the particles deformed by the joining by the joining means, and when joining by the joining means is performed, the joining condition of the joining means is determined based on the imaging result of the deformed particles. And a condition changing means for changing.

  The deformation of the particles is caused by being crushed between the panel electrode and the component electrode. That is, the particles are generated by electrically connecting the panel electrode and the component electrode. Therefore, it is possible to recognize the bonding state of the panel electrode and the component electrode by imaging the deformed particles. This recognition is performed in parallel with the joining operation between the electrodes by the joining means, and the joining condition of the joining operation is changed during the joining operation based on the recognition result of the joining state, thereby preventing the occurrence of defective products. As a result, unlike the component bonding method described in Patent Document 1, it is not necessary to sacrifice the flat panel on which the bonded components are mounted. In addition, since the recognition result of the bonding state is used to change the bonding condition between the electrodes for which the recognition has been performed, the mounting condition of the bonded component can be changed to an optimum one. Therefore, it is possible to realize a component bonding apparatus that can greatly improve the yield of the flat panel on which the bonded components are mounted.

  Here, the component joining apparatus further includes an air pressure detecting means for detecting an air pressure for driving the first pressing means when the pressing by the first pressing means is performed, and a pressing by the first pressing means. May be provided with first pressing change means for changing the pressing force of the first pressing means based on the detection result of the air pressure. The joining means includes a stage on which the flat panel is placed, and a pressing head that presses the component against the flat panel on the stage, and the condition changing means includes a pressing force of the pressing head. The pressing condition of the pressing head is changed as the bonding condition, and the component bonding apparatus further detects a pressure from the component received by the pressing head when pressing by the pressing head is performed. A pressure detecting means; and a third pressing changing means for changing a pressing force of the pressing head based on a detection result of the pressure when pressing by the pressing head is performed. The joining means includes a stage on which the flat panel is placed, and a pressing head that presses the component against the flat panel on the stage, and the conditions The further means uses the pressing force of the pressing head as the joining condition, changes the pressing force of the pressing head, and the component joining apparatus further includes the pressing head when pressing by the pressing head is performed. Panel pressure detecting means for detecting the pressure of the flat panel received via the component, and when the pressing by the pressing head is performed, the pressing force of the pressing head is determined based on the detection result of the pressure. You may provide the 4th press change means to change.

  When an extremely large force is applied to the joined part and the flat panel, the joined state between the electrodes or the flat panel and the joined part is damaged. Therefore, it is possible to prevent the occurrence of such damage by detecting the force applied to the joined component and the flat panel and changing the pressing force based on the detected force. As a result, the yield of the flat panel on which the joining component is mounted can be further improved.

  The joining means includes a transparent stage on which the flat panel is placed, and a pressing head that presses the component against the flat panel on the stage, and the imaging means includes the stage via the stage. You may comprise from the camera arrange | positioned on the opposite side to a flat panel, and the microscope arrange | positioned between the said camera and the said stage.

  Further, the present invention is a component bonding method for bonding a panel electrode of a flat panel and a component electrode of a component, wherein the panel electrode and the component electrode are bonded via an adhesive member containing conductive particles. A joining start step to start, an imaging step of imaging the particle deformed by the joining, which is a component located between the panel electrode and the component electrode, and based on the imaging result of the deformed particle, A component joining method comprising: a condition changing step for changing a joining condition of joining; and a joining end step for terminating the joining after performing the joining under the changed joining condition. .

  Thereby, it is possible to realize a component bonding method capable of greatly improving the yield of the flat panel on which the bonded components are mounted.

  The present invention can be implemented not only as such a component joining method, but also as a program for joining a flat panel and a joined component by the method, and as a storage medium for storing the program.

  According to the present invention, recognition of the bonding state between the electrodes is performed in parallel with the bonding operation between the electrodes, and the bonding condition of the bonding operation is changed during the bonding operation based on the recognition result, thereby preventing the occurrence of defective products. To do. Therefore, it is possible to realize a component bonding apparatus and a component bonding method that can greatly improve the yield of the flat panel on which the bonded components are mounted.

  Hereinafter, a component joining apparatus according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of a component joining apparatus according to the present embodiment.

  This component bonding apparatus is a main pressure bonding device that press-bonds a bonded component to a flat panel in which the bonded component is temporarily bonded in a predetermined position via an anisotropic conductive adhesive such as an anisotropic conductive tape (ACF tape). It is provided in the apparatus. Here, the anisotropic conductive adhesive is an adhesive member including a plurality of conductive particles, and electrically and physically connects the joining component and the flat panel. The flat panel is composed of, for example, an array substrate, a color filter, a polarizing substrate, a protective film, and the like.

  The component joining apparatus includes a warp correction unit 101, a pressing unit 102, a backup stage 103, and the like. As shown in FIG. 2, the component bonding apparatus includes a side edge portion of the flat panel 100 b placed on the warp correction unit 101 and the backup stage 103 by a heating process and a pressing process using the pressing head 110 of the pressing unit 102. And the joining component 100a temporarily press-bonded to the flat panel 100b via the anisotropic conductive adhesive 100c is joined. Specifically, the panel electrode of the flat panel 100b and the component electrode of the bonded component 100a are bonded. This joining is performed on different sides of the flat panel 100b by rotating and moving the flat panel 100b on the panel stage. By the joining, a flat panel 100b on which the joining component 100a is mounted as shown in FIG. 3 is obtained. The pressing portion 102 and the backup stage 103 are an example of the joining means of the present invention.

  The warp correction unit 101 corrects the warp of the side edge portion of the flat panel 100b so that the flatness of the flat panel 100b is maintained at the time of joining. The warp correction unit 101 is provided with a plurality of bellows pads 101a and air stopper plugs 101b. The bellows pads 101a are arranged in parallel with the backup stage 103. The bellows pad 101a is connected to a vacuum device (not shown) serving as a vacuum source via a hollow portion inside the warp correction unit 101, and vacuum-sucks the flat panel 100b. By this adsorption, the flatness of the side edge portion of the flat panel 100b is maintained.

  The pressing unit 102 includes a head unit 104 and a vertical axis driving unit 105.

  The head unit 104 includes a plurality of pressing heads 110 and a plurality of air cylinders 111 that drive the pressing heads 110. The air cylinder 111 presses the pressing head 110 toward the flat panel 100 b of the backup stage 103 using air pressure as a driving source. The pressing head 110 presses the joining component 100a toward the flat panel 100b on the backup stage 103, and heats the joining component 100a that it presses. Air cylinder 111 is an example of the 1st press means of the present invention.

  The vertical axis driving unit 105 moves the head unit 104 up and down with respect to the flat panel 100 b on the backup stage 103 using a motor as a driving source. That is, the plurality of pressing heads 110 are simultaneously moved up and down with respect to the flat panel 100b. The vertical axis drive unit 105 includes a servo motor, a motor drive unit that drives the servo motor, and a vertical axis such as a ball screw that engages with a nut provided in the head unit 104 and is driven to rotate by the servo motor. Is done. In the vertical axis drive unit 105 having such a configuration, the vertical axis is rotated by the operation of the servo motor, whereby the head unit 104 is moved up and down.

  The backup stage 103 is a transparent stage for backing up the pressing of the joining component 100a from the back when the joining component 100a is pressed against the side edge of the flat panel 100b. Here, as shown in the enlarged view of the backup stage 103 in FIG. 4, below the backup stage 103, the joined state between the flat panel 100b and the joining component 100a disposed above it, that is, anisotropic conductive adhesion. A bonding recognition unit 106 for recognizing the bonding state between the panel electrode and the component electrode by the agent 100c is provided.

  FIG. 5 is a diagram illustrating a schematic configuration of the joint recognition unit 106.

  The joint recognition unit 106 is movable in the XYZ directions, and after moving below the joint component 100a to be recognized, when the joint by the pressing unit 102 is performed, the joint is recognized. The state of the anisotropic conductive adhesive 100c located between the flat panel 100b and the joining component 100a being performed, specifically, the conductive particles contained in the anisotropic conductive adhesive 100c deformed by the joining An image is taken and the bonding state between the electrodes is recognized. The joint recognition unit 106 includes an illumination 121, a differential interference microscope 122, a moving unit 123, a CCD camera 124, and a recognition control unit 125. The joint recognition unit 106 is an example of the imaging unit of the present invention. Moreover, in this Embodiment, when joining by the press part 102 is performed, after the joining recognition part 106 moves below the joining component which is an imaging target, it moves below other joining components 100a. Or the period from when the flat panel 100b is carried into the backup stage 103 to when it is carried out. Therefore, the recognition of the joining state between the electrodes being joined means that the recognition of the joining state between the electrodes in a state where the pressing by the pressing head 110 is performed and the pressing after the pressing by the pressing head 110 is completed. Recognition of the bonding state between the electrodes in a state where the pressing by the pressing head 110 is not performed until the pressing is performed.

  The illumination 121 includes a halogen light source or an LED, and supplies light to the differential interference microscope 122. The differential interference microscope 122 is disposed between the CCD camera 124 and the backup stage 103, and enlarges the image of the deformed conductive particles. The moving unit 123 moves the differential interference microscope 122 so that the image enlarged by the differential interference microscope 122 is appropriately captured by the CCD camera 124. The CCD camera 124 is disposed on the opposite side of the flat panel 100 b via the backup stage 103 and captures an image magnified by the differential interference microscope 122. The recognition control unit 125 controls the illumination 121 and the CCD camera 124, and transmits image data from the CCD camera 124 to the control unit (not shown).

  FIG. 6 is a block diagram showing the configuration of the control system of the component joining apparatus having the above structure.

  The component joining apparatus includes a control unit 200 that controls the joining operation of the pressing unit 102, and a storage unit 201 that is a hard disk, a memory, or the like in which NC data is stored. The head unit 104 includes a pressure adjusting unit 211 that adjusts the air pressure supplied from the air pressure source 210 to the air cylinder 111 between the air cylinder 111 and the air pressure source 210, and detects the air pressure supplied to the air cylinder 111. And a pressure detector 214 is provided. The vertical axis drive unit 105 is provided with a motor drive unit 215 that controls a servo motor 213 that rotationally drives the vertical axis 212. The control unit 200 is an example of the condition changing unit and the first pressure changing unit of the present invention, and the pressure detecting unit 214 is an example of the air pressure detecting unit of the present invention.

  The control unit 200 controls the pressing unit 102 based on the joining condition indicated by the NC data read from the storage unit 201. Specifically, as shown in FIGS. 7A and 7B, the control unit 200 moves the head until the pressing head 110 comes into contact with the joining component 100 a on the flat panel 100 b placed on the backup stage 103. The unit 104 is lowered. Thereafter, as shown in FIG. 7C, the air pressure supplied to the air cylinder 111 is adjusted so that the pressing head 110 presses the joining component 100a with a constant torque Ta.

  The control unit 200 temporarily changes the NC data read from the storage unit 201 based on the air pressure detection result by the pressure detection unit 214, and changes the joining condition. Specifically, the control unit 200 controls the air cylinder 111 that presses the pressure head 110 that performs the bonding when the pressure head 110 is bonded with a pressing force as a bonding condition indicated by the NC data. When the pressure detection unit 214 detects that the supplied air pressure is larger than the predetermined reference air pressure Pmax and the pressing head 110 presses the joining component 100a with a torque larger than the predetermined reference torque Tmax, the pressure adjustment unit 211 is controlled. Then, the air pressure supplied from the air pressure source 210 to the air cylinder 111 is shut off so that the pressing force of the pressing head 110 by the air cylinder 111 is eliminated, that is, the pressing force of the joining component 100a of the pressing head 110 is eliminated. As shown in FIG. 8, the torque of the pressing head 110 that presses the joining component 100a corresponds to the air pressure supplied to the air cylinder 111, and the reference air pressure Pmax and the reference torque Tmax are between the electrodes. The air pressure and torque may damage the joined state or the flat panel 100b and the joined component 100a.

  The control unit 200 temporarily changes the NC data read from the storage unit 201 based on the image data indicating the imaging result of the conductive particles transmitted by the bonding recognition unit 106, and changes the bonding condition. Specifically, the control unit 200, when joining by the pressing head 110 is performed with the pressing force as the joining condition indicated by the NC data, the joining state between the electrodes performing the joining is based on a predetermined reference. When it is determined by the determination unit 200a that the pressure does not satisfy, the pressure adjusting unit 211 is controlled so that the pressing force of the pressing head 110 by the air cylinder 111 is increased, that is, the pressing force of the joining component 100a of the pressing head 110 is increased. Thus, the air pressure supplied from the air pressure source 210 to the air cylinder 111 is increased. Note that the change in the bonding condition between the electrodes when bonding is being performed means that the change in the bonding condition between the electrodes during the period in which the pressing by the pressing head 110 is performed and the pressing by the pressing head 110 are completed. Change of the joining conditions between the electrodes during a period from when the new pressing is performed.

  Here, determination of the bonding state between the electrodes by the determination unit 200a will be described in detail with reference to FIGS.

  The conductive particles are sandwiched between the panel electrodes and the component electrodes and are crushed and deformed by the pressing by the pressing head 110 when joining the electrodes. That is, the conductive particles are not electrically joined between the electrodes until they are deformed. Therefore, in the above determination, in the image obtained by the bonding recognition unit 106 as shown in FIG. 9, the determination range is determined by the shape of the panel electrode or component electrode, and the deformed conductivity exceeding a predetermined area within the range is determined. This is done by counting the number of particles and comparing that number with a predetermined threshold. When determining the determination range based on the shape of the component electrode, the number of deformed conductive particles larger than a predetermined area in the frame of the component electrode (in the region surrounded by the dotted line in FIG. 9) for every component electrode. Count. Then, the number of conductive particles counted is compared with a predetermined threshold value. If the number of deformed conductive particles in the frame of any of the component electrodes is smaller than this threshold value, the bonding between the electrodes is performed. Determine that the condition does not meet the criteria. In counting the number of conductive particles, if the conductive particles overlap at least partly with other conductive particles, the overlapping conductive particles are counted as one. Further, the comparison with the threshold value may be performed only for the smallest number of deformed conductive particles having a predetermined area or more.

  For example, when the threshold value is 4 and an image as shown in FIG. 10A is obtained, all the component electrodes 1 to 8 have four deformed conductive particles having a predetermined area or more. Because of the above, it is determined that the bonding state between the electrodes satisfies the standard. On the other hand, when the threshold value is 4 and an image as shown in FIG. 10B is obtained, the component electrode 4 has two deformed conductive particles having a predetermined area or more. It is determined that the bonding state between the electrodes does not satisfy the standard, and until the image as shown in FIG. 10C is obtained, that is, the number of deformed conductive particles having a predetermined area or more in the component electrode 4 is four or more. Thus, the air pressure supplied from the air pressure source 210 to the air cylinder 111 is increased.

  Note that the determination is made by counting the number of deformed conductive particles having a predetermined area or more and comparing the number with a predetermined threshold value. However, the calculation may be performed by obtaining the total area of the deformed conductive particles having a predetermined area or more and comparing the total area with a predetermined threshold value. In this case, when the total area is smaller than the threshold value, it is determined that the bonding state between the electrodes does not satisfy the standard.

  For example, when the threshold value is 6 and an image as shown in FIG. 11A is obtained, the total area of the deformed conductive particles having a predetermined area or more in all the component electrodes 1 to 8 is obtained. Therefore, it is determined that the bonding state between the electrodes satisfies the standard. On the other hand, when the threshold value is 6 and an image as shown in FIG. 11B is obtained, the total area of the conductive particles deformed to a predetermined area or more in the component electrode 4 is 4. Therefore, until it is determined that the bonding state between the electrodes does not satisfy the standard and an image as shown in FIG. 11C is obtained, that is, the total area of the deformed conductive particles larger than a predetermined area in the component electrode 4 The air pressure supplied from the air pressure source 210 to the air cylinder 111 is increased so that the air pressure becomes 6 or more.

  The determination may be performed using both of the comparison of the total area and the threshold value and the comparison of the total number and the threshold value. In this case, the air pressure supplied from the air pressure source 210 to the air cylinder 111 is increased when it is determined that the standard is not satisfied in any comparison.

  In addition, the determination is performed within the range of either the panel electrode or the component electrode as a determination range. However, the sizes of the frame of the panel electrode and the component electrode may be compared, and the determination may be performed using the inside of the electrode of the small frame as a determination range.

  Next, the joining operation of the component joining apparatus having the above structure will be described. FIG. 12 is a flowchart showing the joining operation of the component joining apparatus.

  First, the control unit 200 controls the pressing unit 102 based on the joining condition indicated by the NC data read from the storage unit 201, and starts joining the panel electrode and the component electrode (step S30). That is, the control unit 200 starts pressing and heating the joining component 100a to the flat panel 100b placed on the backup stage 103 by the pressing head 110.

  Next, the bonding recognition unit 106 is located between the flat panel 100b to which the bonding is performed and the bonding component 100a, and images the conductive particles deformed by the bonding with the CCD camera 124 (step S31). Thereafter, the image data from the CCD camera 124 is transmitted to the control unit 200.

  Next, the determination unit 200a determines whether or not the bonding state between the electrodes is equal to or less than a predetermined reference based on the deformed conductive particle image obtained by imaging (step S32).

  Next, when the determination unit 200a determines that the joining state between the electrodes does not satisfy the predetermined standard (No in step S32), the control unit 200 controls the pressure adjustment unit 211 to remove air from the air pressure source 210. The air pressure supplied to the cylinder 111 is increased (step S33). As a result, the pressing force of the air cylinder 111 (pressing head 110) as a joining condition increases. On the other hand, when it is determined that the joining state between the electrodes satisfies a predetermined standard (Yes in step S32), the control unit 200 shuts off the air pressure supplied to the air cylinder 111 and raises the vertical shaft 212 to join. End the operation.

  Next, the control unit 200 determines whether the air pressure supplied to the air cylinder 111 by the pressure detection unit 214 is equal to or lower than a predetermined reference air pressure Pmax, that is, whether the torque of the pressing head 110 is equal to or lower than a predetermined reference torque Tmax. Is determined (step S34).

  Next, when it is detected that the pressing head 110 presses the joining component 100a with a torque equal to or less than the predetermined reference torque Tmax (Yes in step S34), the control unit 200 applies the pressure with the increased pressing force to the joining component. 100a is performed (step S35). Then, it returns to step S31 from step S35, and is repeated until joining operation | movement is complete | finished. On the other hand, when it is detected that the pressing head 110 presses the joining component 100a with a torque larger than the predetermined reference torque Tmax (No in step S34), the control unit 200 cuts off the air pressure supplied to the air cylinder 111. Then, the vertical axis 212 is raised to finish the joining operation.

  As described above, according to the component bonding apparatus of the present embodiment, the recognition of the bonding state between the panel electrode and the component electrode is performed in parallel with the bonding operation between the electrodes, and the bonding condition of the bonding operation Is changed during the joining operation based on the recognition result of the joining state, thereby preventing the occurrence of defective products. Therefore, unlike the component bonding method described in Patent Document 1, it is not necessary to sacrifice the flat panel on which the bonded components are mounted. In addition, since the recognition result of the bonding state is used to change the bonding condition between the electrodes for which the recognition has been performed, the mounting condition of the bonded component can be changed to an optimum one. Therefore, the yield of the flat panel on which the joining component is mounted can be greatly improved.

  Further, according to the component joining apparatus of the present embodiment, when the air pressure supplied to the air cylinder 111 is detected by the pressure detection unit 214 and an air pressure larger than a predetermined reference is supplied to the air cylinder 111, The joining operation is finished. Therefore, an extremely large force is not applied to the joined part and the flat panel, and the joined state between the electrodes or the flat panel and the joined part is not damaged. As a result, the yield of the flat panel on which the joining component is mounted can be further improved.

  In the present embodiment, the control unit 200 sets the pressing force of the air cylinder 111 (pressing head 110) as a joining condition indicated by the NC data, and based on the recognition result by the joining recognition unit 106, the air pressure source 210 supplies the air. The air pressure supplied to the cylinder 111 is changed. However, the pressing unit 104 is provided with a time adjusting unit that adjusts the pressing time of the bonding component 100a of the pressing head 110, and the control unit 200 is a bonding unit in which NC data indicates the pressing time of the air cylinder 111 (the pressing head 110). As a condition, the time adjustment unit may be controlled based on the recognition result by the bonding recognition unit 106 to change the pressing time of the air cylinder 111 (pressing head 110). That is, the control unit 200 may lengthen the pressing time of the air cylinder 111 (the pressing head 110) when it is determined that the joining state does not satisfy the standard. In this case, a time detection unit that detects the pressing time of the pressing head 110 is provided in the head unit 104, and when it is detected by the time detection unit that the pressing time is equal to or longer than a predetermined reference, Is set to 0 to end the joining operation.

  In addition, the pressing unit 104 is provided with a temperature adjusting unit that adjusts the heating temperature of the joining component 100a of the pressing head 110, and the control unit 200 is configured by the NC data indicating the heating temperature of the joining component 100a of the pressing head 110 by NC data. The temperature adjusting unit may be controlled based on the recognition result by the bonding recognition unit 106 to change the heating temperature of the bonding component 100a of the pressing head 110. That is, the control unit 200 may increase the heating temperature of the joining component 100a of the pressing head 110 when it is determined that the joining state does not satisfy the standard. In this case, a temperature detection unit that detects the heating temperature of the pressing head 110 is provided in the head unit 104, and when it is detected by the temperature detection unit that the heating temperature is equal to or higher than a predetermined reference, To finish the joining operation.

  Further, the control unit 200 detects the air pressure supplied to the air cylinder 111 by the pressure detection unit 214, and determines whether or not to end the joining operation based on this. However, the control unit 200 may detect the air pressure supplied to the air cylinder 111 based on an instruction to the pressure adjusting unit 211, and may determine whether to end the joining operation based on this.

(Second Embodiment)
This component joining apparatus is different from the component joining apparatus of the first embodiment in that it does not have a vertical axis drive unit, and an air cylinder moves a plurality of pressing heads up and down relative to a flat panel. Hereinafter, a description will be given focusing on differences from the component bonding apparatus according to the first embodiment.

  FIG. 13 is a block diagram showing a configuration of a control system of the component bonding apparatus according to the present embodiment.

  The component bonding apparatus includes a control unit 200 that controls the bonding operation of the pressing unit 402 and a storage unit 201.

  The pressing unit 402 includes a plurality of pressing heads 110, a plurality of air cylinders 411 that individually drive the pressing heads 110, an air pressure source 210, and a pressure adjustment provided between the air cylinder 411 and the air pressure source 210. Part 412 and pressure detection part 414. The air cylinder 411 presses the pressing head 110 toward the flat panel 100b on the backup stage 103 using air pressure as a driving source. The air cylinder 411 moves the pressing head 110 up and down with respect to the flat panel 100 b on the backup stage 103. Air cylinder 411 is an example of the 1st press means of the present invention.

  The pressure adjustment unit 412 includes a plurality of pressure adjustment units 412 a provided for each air cylinder 411, and adjusts the air pressure supplied from the air pressure source 210 to the air cylinder 411. The pressure detection unit 414 includes a plurality of pressure detection units 414 a provided for each air cylinder 411 and detects the air pressure supplied to the air cylinder 411.

  In the pressing unit 402 configured as described above, the pressing force of the pressing head 110 is detected and adjusted for each air cylinder 411 by a pressure detection unit 414a and a pressure adjustment unit 412a provided corresponding to each air cylinder 411.

  As described above, according to the component bonding apparatus of the present embodiment, the yield of the flat panel on which the bonded components are mounted can be greatly improved for the same reason as the component bonding apparatus of the first embodiment. .

  Further, according to the component bonding apparatus of the present embodiment, the pressure detection unit 414 does not damage the bonded state between the electrodes or the flat panel and the bonded component, so the yield of the flat panel on which the bonded component is mounted. Can be greatly improved.

  Further, according to the component joining apparatus of the present embodiment, both the pressing and the vertical movement of the pressing head 110 are caused by the air cylinder 411. Therefore, the configuration of the component joining apparatus can be simplified, and the apparatus can be reduced in size.

(Third embodiment)
This component joining apparatus is different from the component joining apparatus of the first embodiment in that it does not have an air cylinder and the vertical axis drive unit presses the plurality of pressing heads. Hereinafter, a description will be given focusing on differences from the component bonding apparatus according to the first embodiment.

  FIG. 14 is a block diagram showing a configuration of a control system of the component bonding apparatus according to the present embodiment.

  The component bonding apparatus includes a control unit 500 that controls the bonding operation of the pressing unit 502 and a storage unit 201. The control unit 500 is an example of a third press changing unit of the present invention.

  The pressing unit 502 includes a plurality of pressing heads 110, a vertical axis driving unit 505 that individually drives the pressing heads 110, and a pressure detection unit 514 provided between the vertical axis driving unit 505 and the pressing head 110. The The vertical axis driving unit 505 presses the pressing head 110 toward the flat panel 100 b on the backup stage 103 using a motor as a driving source. The vertical axis driving unit 505 moves the pressing head 110 up and down with respect to the flat panel 100 b on the backup stage 103. The vertical axis drive unit 505 is an example of the second pressing means of the present invention.

  The vertical axis driving unit 505 is provided for each pressing head 110 and includes a plurality of vertical axis driving units 505 a that drive the corresponding pressing head 110. Each vertical axis drive unit 505 a is provided with a motor drive unit 515 that controls a servo motor 513 that rotationally drives the vertical axis 512.

  The pressure detection unit 514 includes a plurality of pressure detection units 514a provided for each pressing head 110, and detects the pressure received by the pressing head 110 from the joining component 100a. The pressure detection unit 514 is an example of a head pressure detection unit of the present invention.

  In the pressing unit 502 configured as described above, the pressing force of the pressing head 110 is detected for each pressing head 110 by the pressure detection unit 514a provided in each pressing head 110.

  The control unit 500 controls the pressing unit 502 based on the joining condition indicated by the NC data read from the storage unit 201. Specifically, the control unit 500 lowers the pressing head 110 until the pressing head 110 comes into contact with the joining component 100 a on the flat panel 100 b placed on the backup stage 103. Thereafter, the rotation speed of the servo motor 513 is increased so that the pressing head 110 presses the joining component 100a with a constant torque Ta.

  Based on the pressure detection result by the pressure detection unit 514, the control unit 500 temporarily changes the NC data read from the storage unit 201 and changes the joining condition. Specifically, the controller 500 is a vertical axis drive unit that presses the pressure head 110 that is performing the bonding when the pressure head 110 is bonded with a pressing force as a bonding condition indicated by the NC data. When the pressure detection unit 514 detects that the rotation speed of the servo motor 513 that drives the motor 505a is equal to or higher than a predetermined reference rotation speed and the pressing head 110 presses the joining component 100a with a torque equal to or higher than the predetermined reference torque Tmax. The motor driving unit 515 is controlled so that the pressing force of the pressing head 110 by the vertical axis driving unit 505a is eliminated, and the rotation speed of the servo motor 513 is reduced.

  Based on the recognition result by the bonding recognition unit 106, the control unit 500 temporarily changes the NC data read from the storage unit 201 and changes the bonding condition. Specifically, the control unit 500, when joining by the pressing head 110 is performed with the pressing force as the joining condition indicated by the NC data, the joining state between the electrodes performing the joining is based on a predetermined reference. When the determination unit 200a determines that the condition is not satisfied, the motor driving unit 515 is controlled so that the pressing force of the pressing head 110 by the vertical axis driving unit 505a is increased, and the rotation speed of the servo motor 513 is increased.

  Next, the joining operation of the component joining apparatus having the above structure will be described. FIG. 15 is a flowchart showing the joining operation of the component joining apparatus.

  First, the control unit 500 controls the pressing unit 502 based on the joining condition indicated by the NC data read from the storage unit 201, and starts joining the panel electrode and the component electrode (step S50).

  Next, the bonding recognition unit 106 is located between the flat panel 100b to which the bonding is performed and the bonding component 100a, and images the conductive particles deformed by the bonding with the CCD camera 124 (step S51). Thereafter, the image data from the CCD camera 124 is transmitted to the control unit 500.

  Next, the determination unit 200a determines whether or not the bonding state between the electrodes is equal to or less than a predetermined reference based on the deformed conductive particle image obtained by imaging (step S52).

  Next, when the determination unit 200a determines that the joining state between the electrodes does not satisfy the predetermined reference (No in step S52), the control unit 500 controls the motor driving unit 515 and supplies the current to the servo motor 513. Is increased (step S53). As a result, the pressing force of the pressing head 110 increases. On the other hand, when it is determined that the joining state between the electrodes satisfies a predetermined standard (Yes in step S52), the control unit 500 controls the rotation speed of the servo motor 513 to raise the vertical axis 512 and perform the joining operation. finish.

  Next, the control unit 500 determines whether the pressure received by the pressure head 110 from the joining component 100a by the pressure detection unit 514 is equal to or lower than a predetermined reference pressure, that is, whether the pressure head 110 is equal to or lower than a predetermined reference torque Tmax. Is determined (step S54).

  Next, when it is detected that the pressing head 110 presses the joining component 100a with a torque equal to or less than the predetermined reference torque Tmax (Yes in step S54), the control unit 500 applies the pressure with the increased pressing force to the joining component. 100a is performed (step S55). Then, it returns to step S51 from step S55, and is repeated until joining operation | movement is complete | finished. On the other hand, when it is detected that the pressing head 110 presses the joining component 100a with a torque larger than the predetermined reference torque Tmax (No in step S54), the control unit 500 controls the rotational speed of the servo motor 513 to The shaft 512 is raised to finish the joining operation.

  As described above, according to the component bonding apparatus of the present embodiment, the yield of the flat panel on which the bonded components are mounted can be greatly improved for the same reason as the component bonding apparatus of the first embodiment. .

  Moreover, according to the component joining apparatus of this Embodiment, the pressure which the press head 110 receives by the pressure detection part 514 is detected, and when the press head 110 is receiving the pressure larger than a predetermined reference | standard, joining operation | movement is performed. finish. Therefore, an extremely large force is not applied to the joined part and the flat panel, and the joined state between the electrodes or the flat panel and the joined part is not damaged. As a result, the yield of the flat panel on which the joining component is mounted can be further improved.

  Further, according to the component joining apparatus of the present embodiment, the pressing head 110 is pressed and moved up and down by the vertical axis driving unit 505. Therefore, the configuration of the component joining apparatus can be simplified, and the apparatus can be reduced in size.

  In the component joining apparatus according to the present embodiment, the pressure detection unit 514 detects the pressing force of the pressing head 110, and if this is larger than a predetermined reference, the pressing force of the vertical axis driving unit 505 is changed to be small. Then. However, the pressing unit 502 includes a current detection unit that detects the current value of the servo motor 513, and the control unit 500 assumes that the rotation speed corresponds to the pressing force of the pressing head 110, and the current value detected by the current detection unit. May be smaller by changing the pressing force of the vertical axis drive unit 505.

  As mentioned above, although the component joining apparatus of this invention was demonstrated based on embodiment, this invention is not limited of this embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.

  For example, in the component joining apparatus according to the above-described embodiment, the pressing force of the pressing head is detected by the pressure detection unit provided in the pressing unit. However, for example, as shown in FIG. 16, the pressure detection unit 714 may be provided in the backup stage 103, and the pressure received by the flat panel from the pressing head via the joining component may be detected by the pressure detection unit 714. In this case, when the detected pressure is larger than a predetermined reference, the pressing force of the pressing head is changed and reduced.

  Further, in the component bonding apparatus according to the above-described embodiment, when the bonding state between the electrodes does not satisfy the predetermined standard, the electrode does not satisfy the standard in the obtained image regardless of how much the standard is not satisfied. We decided to change the joining condition uniquely regardless of the number. However, the degree of change (width) of the joining condition may be changed depending on how much the standard is not satisfied. That is, the number of electrodes in a bonding state that do not satisfy the standard in the obtained image may be counted, and the degree of change in bonding conditions may be changed according to the number. In this case, the control unit has a calculation unit that counts the electrodes in the bonding state that do not meet the standard, and the storage unit has a correspondence relationship between the number of electrodes in the bonding state that does not satisfy the standard and the degree of change in the bonding condition Is stored. A control part determines the grade of the change of joining conditions from the calculation result and correspondence table by this calculation part, and changes manufacturing conditions based on this. For example, when the correspondence table as shown in FIG. 17 is used, the control unit changes the increase range of the air pressure supplied to the air cylinder according to the number of electrodes in a joined state that does not satisfy the reference. Thereby, it becomes possible to improve a joining state in a short time.

  In the component bonding apparatus of the above embodiment, as shown in FIG. 18, when the bonding component 900a with the bump 900c is electrically and physically connected to the flat panel 100b, the bump 900c and the panel electrode are connected. The joint state between the two is determined. In this case, the determination is based on the shape of the panel electrode or bump 900c in the image as shown in FIG. 19, and the number of deformed conductive particles having a predetermined area or more in the range is counted. This is done by comparing the number with a predetermined threshold. When the determination range is determined by the shape of the bump 900c, the number of deformed conductive particles having a predetermined area or more in the frame of the bump 900c (in the region surrounded by the dotted line in FIG. 19) for every bump 900c. Count. Then, the number of conductive particles counted is compared with a predetermined threshold value. If the number of deformed conductive particles in the frame of any of the component electrodes is smaller than this threshold value, the bonding between the electrodes is performed. Determine that the condition does not meet the criteria.

  The present invention can be used for a component bonding apparatus and a component bonding method, and in particular, can be used for an apparatus and a method for bonding an electronic component and a flat panel via an anisotropic conductive adhesive.

It is a perspective view of the component joining apparatus of the 1st Embodiment of this invention. It is a figure for demonstrating the operation | movement which joins a flat panel and joining components. It is a top view of the flat panel with which joining components were mounted. It is an enlarged view of a backup stage. It is a figure which shows schematic structure of a joint recognition part. It is a block diagram which shows the structure of the control system of the component joining apparatus. (A) It is a figure for demonstrating the press operation | movement of the joining components by a press head. (B) It is a figure for demonstrating the press operation of the joining components by a press head. (C) It is a figure which shows the time change of the torque of a press head. It is a figure for demonstrating the determination of the joining state between electrodes. It is a figure for demonstrating the determination of the joining state between electrodes. It is a figure for demonstrating the determination of the joining state between electrodes. It is a figure for demonstrating the determination of the joining state between electrodes. It is a flowchart which shows joining operation | movement of the component joining apparatus. It is a block diagram which shows the structure of the control system of the component joining apparatus of the 2nd Embodiment of this invention. It is a block diagram which shows the structure of the control system of the component joining apparatus of the 3rd Embodiment of this invention. It is a flowchart which shows joining operation | movement of the component joining apparatus. It is a block diagram which shows the structure of the control system of the modification of the components joining apparatus of this invention. It is a figure which shows an example of the corresponding | compatible table stored in a memory | storage part. It is a figure for demonstrating determination of the joining state between a bump and a panel electrode. It is a figure for demonstrating determination of the joining state between a bump and a panel electrode.

Explanation of symbols

100a, 900a Joining parts 100b Flat panel 100c Anisotropic conductive adhesive 101 Warp correction unit 101a Bellows pad 101b Air stopper 102, 402, 502 Pressing part 103 Backup stage 104 Head unit 105, 505 Vertical axis driving part 106 Joining recognition part DESCRIPTION OF SYMBOLS 110 Press head 111,411 Air cylinder 121 Illumination 122 Differential interference microscope 123 Moving part 124 CCD camera 125 Recognition control part 200,500 Control part 201 Storage part 210 Air pressure source 211,412 Pressure adjustment part 212,512 Vertical axis 213,513 Servo motor 214, 414, 514, 714 Pressure detection unit 215, 515 Motor drive unit 412a Pressure adjustment unit 414a, 514a Pressure detection unit 505a Vertical axis drive unit Doo 900c bump

Claims (6)

A component bonding apparatus for bonding a panel electrode of a flat panel and a component electrode of a component,
It is composed of a stage on which the flat panel is placed, and a pressing head that presses the component against the flat panel on the stage, and the panel electrode and the component electrode via an adhesive member containing conductive particles Bonding means for bonding,
When the bonding by the bonding means is performed, the particles that are located between the panel electrode and the component electrode that are bonded by the bonding means and that are deformed by the bonding by the bonding means are imaged. Imaging means to perform,
A condition changing unit for changing the pressing time of the pressing head using the pressing time of the pressing head as a bonding condition based on the imaging result of the deformed particles when bonding by the bonding unit is performed. The component joining apparatus characterized by the above-mentioned. A component joining method for joining a panel electrode of a flat panel and a component electrode of a component,
The panel electrode and the component electrode are joined via an adhesive member containing conductive particles by starting the pressing of the component against the flat panel placed on a transparent stage by a pressing head. A joining start step to start;
An imaging step of imaging through the stage the particles that are located between the panel electrode and the component electrode and deformed by the joining;
Based on the imaging result of the deformed particles, the pressing time of the pressing head against the component is set as a joining condition, and a condition changing step for changing the pressing time ;
And a joining end step of terminating the joining after performing the joining under the changed joining conditions. A component joining method, comprising: The component joining method further includes:
A time detecting step for detecting the pressing time;
The component joining method according to claim 2 , further comprising a time changing step of changing the pressing time based on the detection result of the pressing time. The adhesive member includes a plurality of the particles,
In the condition changing step, the total area of the particles in the captured image obtained by the imaging is used as the imaging result, and when the total area of the particles is smaller than a predetermined value, the joining condition is changed. The component joining method according to claim 2 or 3 , characterized in that: The adhesive member includes a plurality of the particles,
In the condition changing step, the total number of the particles in the captured image obtained by the imaging is used as the imaging result, and the joining condition is changed when the total number of the particles is smaller than a predetermined value. The component joining method according to any one of claims 2 to 4 . The component joining method according to any one of claims 2 to 5, wherein, in the joining end step, the joining is finished based on an imaging result of the deformed particles.

Images