JP2008028132A - Pasting apparatus for anisotropic conductive tape, and manufacturing method of electric apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten the time required for pasting an anisotropic conductive tape, and to reduce occurrence of displacement of pasting position of the anisotropic conductive tape. <P>SOLUTION: A cutter unit 29 comprising a cutter 30 and a substrate stage 34 for holding a substrate 35 are provided on a Y-axis stage 28 that can move in the direction orthogonal to the transportation direction of a laminate tape 24. The cutter unit 29 and the substrate stage 34 are arranged so that they come away in the direction orthogonal to the transportation direction of the laminate tape 24, and so that the position of a blade of the cutter 30 in the transportation direction of the laminate tape 24 agrees with the end on the upper stream side in the transportation direction of the laminate tape 24, in the region of a substrate 35 where the anisotropic conductive tape is pasted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an anisotropic conductive tape adhering device for adhering an anisotropic conductive tape to a substrate and an electrical apparatus manufacturing method using the anisotropic conductive tape adhering device.

  For example, in the liquid crystal display manufacturing process, ACF (Anisotropic Conductive Film) is used to mount electronic parts such as IC (Integrated Circuit) and FPC (Flexible Printed Circuit) on the liquid crystal cell. An anisotropic conductive tape is used (see, for example, Patent Document 1).

  A first example of the step of attaching the anisotropic conductive tape to a substrate such as a liquid crystal cell will be described with reference to FIGS. As shown in FIG. 14, a conventional anisotropic conductive tape sticking apparatus includes a substrate stage 2 that holds a substrate 1, a cutter unit 3, and a crimping tool 6.

  Above the substrate stage 2 and the cutter unit 3, a laminated tape in which an anisotropic conductive tape 7 and a separator 8 are laminated is supplied from a tape supply unit (not shown), and the laminated tape is guided by guide rollers 9 and 10. Then, it is conveyed in the direction indicated by the arrow in FIG. The cutter unit 3 includes a cutter 4 and a cutter stage 5, and the cutter 4 is driven in the vertical direction by a drive source (not shown) provided on the cutter stage 5 to cut only the anisotropic conductive tape 7 of the laminated tape. To do. The cutter unit 3 is provided upstream of the substrate stage 2 in the transport direction of the laminated tape. The crimping tool 6 is provided opposite to the substrate stage 2 with the laminated tape interposed therebetween, and is movable in the vertical direction by a driving source (not shown).

  When the sticking process is started from the state where the anisotropic conductive tape 7 is cut at the position of the cutter 4 as shown in FIG. 14, first, as shown in FIG. Is sent in the transport direction. Next, as shown in FIG. 16, the cutter 4 is raised and the anisotropic conductive tape 7 is cut. Next, as shown in FIG. 17, the laminated tape is fed so that the cut anisotropic conductive tape 7 a comes to the attachment position of the substrate 1. Next, as shown in FIG. 18, the crimping tool 6 is lowered and the cut anisotropic conductive tape 7 a is crimped to the substrate 1. Next, as shown in FIG. 19, after the crimping tool 6 is raised, the anisotropic conductive tape 7a is peeled from the separator 8 by a peeling mechanism (not shown). Then, as shown in FIG. 20, after replacing the substrate, the process returns to the process shown in FIG. 15, and the subsequent processes are repeated.

  Next, the 2nd example of the process of sticking an anisotropic conductive tape on a board | substrate is demonstrated with reference to FIGS. This second example is a case where the sticking length of the anisotropic conductive tape is shorter than the first example described above. For example, when the cut anisotropic conductive tape is stuck to the substrate, This is a case where the anisotropic conductive tape fed in the downstream direction from the position is longer than the sticking length.

  As shown in FIG. 21, the anisotropic conductive tape sticking apparatus in the second example is different from the anisotropic conductive tape sticking apparatus in the first example shown in FIG. The configuration is replaced with 6a. The length of the crimping tool 6a in the transport direction of the laminated tape is shorter than that of the crimping tool 6 corresponding to the sticking length of the anisotropic conductive tape.

  When the sticking process is started from a state in which the anisotropic conductive tape 7 is cut at the position of the cutter 4 as shown in FIG. 21, first, as shown in FIG. Is sent in the transport direction. Next, as shown in FIG. 23, the cutter 4 is raised and the anisotropic conductive tape 7 is cut. Next, as shown in FIG. 24, the laminated tape is sent so that the cut anisotropic conductive tape 7 b comes to the attachment position of the substrate 1. Next, as shown in FIG. 25, the crimping tool 6 a is lowered to crimp the cut anisotropic conductive tape 7 b to the substrate 1. Next, as shown in FIG. 26, after the crimping tool 6a is raised, the anisotropic conductive tape 7b is peeled from the separator 8 by a peeling mechanism (not shown). At this time, the part sent to the downstream direction from the position of the cutter 4 of the anisotropic conductive tape 7 shall be longer than the sticking length.

Then, as shown in FIG. 27, after replacing the substrate, the cutter 4 is raised and the anisotropic conductive tape 7 is cut as shown in FIG. Since the anisotropic conductive tape 7c cut | disconnected at this time is longer than the sticking length, it is not used for the following board | substrate, but becomes useless. Next, as shown in FIG. 29, the laminated tape is fed in the transport direction by the length of the sticking. Next, as shown in FIG. 30, the cutter 4 is raised and the anisotropic conductive tape 7 is cut. Next, as shown in FIG. 31, the laminated tape is fed so that the cut anisotropic conductive tape 7d comes to the attachment position of the substrate 1a. Next, as shown in FIG. 32, the crimping tool 6 a is lowered and the cut anisotropic conductive tape 7 d is crimped to the substrate 1. Next, as shown in FIG. 33, after the crimping tool 6a is raised, the anisotropic conductive tape 7d is peeled from the separator 8 by a peeling mechanism (not shown). Then, as shown in FIG. 34, after replacing the substrate, the process returns to the process shown in FIG. 22, and the subsequent processes are repeated.
JP-A-8-102584

  As described in the first example above, in the conventional anisotropic conductive tape sticking apparatus, after the anisotropic conductive tape 7 is cut by the cutter 4, the cut anisotropic conductive tape 7a is stuck. A process of feeding the laminated tape so as to be in a position and then crimping with the crimping tool 6 is general. In this case, there is a problem that the number of steps increases and it takes a long time to attach the anisotropic conductive tape. Further, since the laminated tape is fed so that the cut anisotropic conductive tape 7a comes to the adhering position after the anisotropic conductive tape 7 is cut, the anisotropic conductive tape 7a depends on the feeding accuracy of the laminated tape. In some cases, misalignment occurred.

  Further, as described in the second example, there is a problem that the anisotropic conductive tape is wasted depending on the length of the anisotropic conductive tape.

  The present invention has been made in view of the above, and it is possible to reduce the time required for sticking the anisotropic conductive tape and to reduce the occurrence of misalignment of the sticking position of the anisotropic conductive tape. It is an object of the present invention to provide a method for manufacturing an electric device using a sticking apparatus for a anisotropic conductive tape and a sticking apparatus for the anisotropic conductive tape.

  Another object of the present invention is to produce an anisotropic conductive tape sticking device that can suppress the generation of wasted anisotropic conductive tape, and to manufacture electrical equipment using the anisotropic conductive tape sticking device. Is to provide a method.

  In order to achieve the above object, the anisotropic conductive tape sticking apparatus of the present invention includes a tape supply means for supplying a laminated tape in which an anisotropic conductive tape and a separator are laminated, and conveying the laminated tape in a predetermined direction. A tape transporting means, a stage disposed below the tape supply means and the tape transporting means and movable in a direction orthogonal to the transporting direction of the laminated tape, and provided on the stage, the anisotropic conductive Cutting means for cutting the tape into a predetermined length in the transport direction of the laminated tape, holding the substrate, spaced apart from the cutting means on the stage in a direction perpendicular to the transport direction of the laminated tape, and The cutting position of the anisotropic conductive tape in the transport direction of the laminated tape by the cutting means is a region where the anisotropic conductive tape is stuck on the substrate. Substrate holding means provided so as to coincide with the upstream end in the transport direction of the laminated tape, and pressure bonding means for crimping the anisotropic conductive tape cut by the cutting means to the substrate And after cutting the anisotropic conductive tape by the cutting means, the stage is moved in a direction orthogonal to the transport direction of the laminated tape so that the cut anisotropic conductive tape is disposed opposite to the substrate. And a control means for controlling the cut anisotropic anisotropic tape so as to be pressure-bonded to the substrate by the pressure-bonding means after the stage is moved.

  In addition, the method for manufacturing an electrical device of the present invention includes a step of transporting a laminated tape in which an anisotropic conductive tape and a separator are laminated in a predetermined direction, and a stage that is movable in a direction perpendicular to the direction of conveyance of the laminated tape. Cutting the anisotropic conductive tape to a predetermined length in the transport direction of the laminated tape, and moving the stage in a direction perpendicular to the transport direction of the laminated tape A step of disposing the anisotropic conductive tape, which is separated from the cutting means in a direction perpendicular to the transport direction of the laminated tape, and facing a substrate held by a substrate holding means provided on the stage; A step of crimping the cut anisotropic conductive tape to the substrate, and the step of cutting the anisotropic conductive tape is a cutting position in the transport direction of the laminated tape. The step of cutting the anisotropic conductive tape such that the anisotropic conductive tape is located on the substrate at a position that coincides with the upstream end of the laminated tape in the direction of transport of the laminated tape. It is characterized by that.

  ADVANTAGE OF THE INVENTION According to this invention, while the time which sticks an anisotropic conductive tape can be shortened, generation | occurrence | production of the position shift of the sticking position of an anisotropic conductive tape can be reduced. Moreover, generation | occurrence | production of the anisotropic conductive tape which becomes useless can be suppressed.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a front view showing a schematic configuration of an anisotropic conductive tape attaching apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the anisotropic conductive tape attaching apparatus shown in FIG. . 1 and 2, the tape supply unit 21 supplies a laminated tape 24 in which an anisotropic conductive tape 22 and a separator 23 are laminated. The tape collection unit 25 collects the separator 23 from which the anisotropic conductive tape 22 has been peeled off.

  Below the tape supply unit 21 and the tape collection unit 25, guide rollers 26 and 27 for guiding the laminated tape 24 are provided, respectively. The tape supply unit 21 and the tape recovery unit 25 are driven by a motor (not shown), respectively, and constitute tape transport means for transporting the laminated tape 24 in the direction of arrow M shown in FIG. The tape supply unit 21, the tape collection unit 25, and the guide rollers 26 and 27 are connected by a frame (not shown) and are configured to be moved up and down integrally by a drive source (not shown).

  The Y-axis stage 28 is provided below the guide rollers 26 and 27 and is configured to be movable in a direction (Y direction) perpendicular to the transport direction of the laminated tape 24 by a drive source (not shown).

  The cutter unit 29 is provided on the Y-axis stage 28. The cutter unit 29 includes a cutter 30, a stopper block 31, and a cutter stage 32. As shown in FIG. 2, the stopper block 31 has a concave shape when viewed from the side, and the width of the concave portion is larger than the width of the laminated tape 24 and the cutter 30. The cutter 30 is provided so that the tip end portion on which the blade is formed faces upward and the tip end portion is lower than the upper end of the stopper block 31 by a predetermined dimension. The cutter 30 is driven in the vertical direction together with the stopper block 31 by a driving source (not shown) provided on the cutter stage 32.

  A contact member 33 is provided on the Y-axis stage 28. The contact member 33 has a contact surface 33 a parallel to the upper surface of the Y-axis stage 28, and this contact surface 33 a is provided so as to face the cutter 30 and the stopper block 31 with the laminated tape 24 interposed therebetween. . When the anisotropic conductive tape 22 is cut by the cutter 30, when the cutter 30 and the stopper block 31 are raised, the upper ends of the stopper block 31 come into contact with the contact surface 33a. At this time, since a gap is generated between the blade of the cutter 30 and the contact surface 33a, the cutter 30 is prevented from being cut to the separator 23 of the laminated tape 24, and only the anisotropic conductive tape 22 is cut. be able to.

  The substrate stage 34 is provided on the Y-axis stage 28 so as to be spaced apart from the cutter unit 29 in a direction (Y direction) orthogonal to the transport direction of the laminated tape 24, and is an object to which an anisotropic conductive tape is attached. The substrate 35 is held.

  FIG. 3 is a plan view for explaining the positional relationship among the cutter unit 29, the substrate stage 34, and the substrate 35 on the Y-axis stage 28. As shown in FIG. 3, the cutter unit 29, the substrate stage 34, and the substrate 35 are attached to the position of the blade of the cutter 30 in the transport direction of the laminated tape 24 and the anisotropic conductive tape is attached to the substrate 35. It arrange | positions so that it may correspond with the end of the upstream of the conveyance direction of the lamination | stacking tape 24 in an area | region. In the present embodiment, it is assumed that the right end of the substrate 35 is the upstream end in the transport direction of the laminated tape 24 in the region to which the anisotropic conductive tape is to be attached.

  The crimping head 36 includes a crimping tool 37 that presses the laminated tape 24 on its lower surface and crimps the cut portion of the anisotropic conductive tape 22 to the substrate 35, and a heater 38 that heats the crimping tool. The pressure-bonding head 36 is provided to face the substrate stage 34 with the laminated tape 24 interposed therebetween, and is configured to be movable up and down by a vertical drive unit 39. The vertical drive unit 39 is movably installed along the guide rail 40 in the vertical direction. Further, as shown in FIG. 1, the crimping head 36 has an anisotropic conductive tape attached to the substrate 35 at the upstream end in the transport direction of the laminated tape 24 on the lower surface (pressing surface) of the crimping tool 37. It is provided so as to coincide with the upstream end in the transport direction of the laminated tape 24 in the sticking target region. Further, the length of the lower surface (pressing surface) of the crimping tool 37 in the transport direction of the laminated tape 24 is set to be equal to or longer than the length of the laminated tape 24 in the direction of transport of the laminated tape 24 in the substrate 35.

  The control unit 41 controls driving of the tape supply unit 21, the tape collection unit 25, the Y-axis stage 28, the cutter unit 29, and the vertical drive unit 39.

  Next, the operation of adhering the anisotropic conductive tape to the substrate by the anisotropic conductive tape adhering device having the above-described configuration will be described with reference to the flowchart shown in FIG. 4 and FIGS.

  FIG. 5 shows an initial state, FIG. 5 (a) is a plan view of an anisotropic conductive tape sticking device, and FIG. 5 (b) is a front view of the anisotropic conductive tape sticking device. 5 to 12 show main parts necessary for explaining the operation, and other parts are not shown.

  As shown in FIG. 5 (a), in the initial state, the cutter 30 is disposed so as to be under the laminated tape 24, and as shown in FIG. 5 (b), the anisotropic conductive tape 22 is disposed in the cutter tape. It is cut at 30 position. From this state, first, in step S10, the control unit 41, as shown in FIG. 6, the tape supply unit 21 and the tape supply unit 21 so as to send the laminated tape 24 in the transport direction by the length of the anisotropic conductive tape 22 attached. The tape collecting unit 25 is controlled. In this operation, it is assumed that the sticking length of the anisotropic conductive tape 22 is the same as the length in the transport direction of the laminated tape 24 of the substrate 35.

  Next, in step S <b> 20, the control unit 41 controls the cutter unit 29 to raise the cutter 30 and cut the anisotropic conductive tape 22 as shown in FIG. 7. Next, in step S30, as shown in FIGS. 8A and 8B, the control unit 41 arranges the anisotropic conductive tape 22a cut in step S20 so as to face the sticking target region in the substrate 35. Thus, the Y-axis stage 28 is moved in a direction (Y direction) orthogonal to the transport direction of the laminated tape 24.

  Next, in step S40, the control unit 41 lowers the tape supply unit 21, the tape collection unit 25, and the guide rollers 26 and 27 with a drive source (not shown), so that the anisotropic conductive tape 22a contacts the substrate 35. After lowering the laminated tape 24 to the position, as shown in FIG. 9, the up / down drive unit 39 is controlled to lower the crimping head 36 and press the laminated tape 24 with the crimping tool 37 to cut the anisotropic The conductive tape 22a is pressure-bonded to the substrate 35.

  Next, in step S50, as shown in FIG. 10, the control unit 41 controls the vertical drive unit 39 so as to raise the pressure-bonding head 36, and then the anisotropic conductive tape 22a is separated by a peeling mechanism (not shown). Peel from 23.

  Next, in step S60, the control unit 41 raises the laminated tape 24 by raising the tape supply unit 21, the tape collection unit 25, and the guide rollers 26 and 27 with a drive source (not shown), As shown in a) and (b), the Y-axis stage 28 is moved so that the cutter 30 comes under the laminated tape 24 in a state where the anisotropic conductive tape 22a is adhered to the substrate 35.

  In step S70, the control unit 41 determines whether or not the substrate 35 to which the anisotropic conductive tape 22a is attached in step S40 is the last substrate to which the anisotropic conductive tape is attached. When it is the last substrate (YES), the series of anisotropic conductive tape sticking operations is terminated, and when it is not the last substrate (NO), the process proceeds to step S80. In step S80, as shown in FIG. 12, the control unit 41 replaces the substrate by a transport mechanism (not shown). Then, it returns to step S10 and repeats the subsequent processes.

  Thus, according to the present embodiment, the cutter unit 29 having the cutter 30 and the substrate stage 34 holding the substrate 35 on the Y-axis stage 28 that is movable in the direction orthogonal to the transport direction of the laminated tape 24. The cutter unit 29 and the substrate stage 34 are separated from each other in a direction orthogonal to the conveying direction of the laminated tape 24, and the position of the blade of the cutter 30 in the conveying direction of the laminated tape 24 is anisotropically conductive in the substrate 35. After the anisotropic conductive tape 22 is cut to the sticking length by the cutter 30, it is arranged so as to coincide with the upstream end in the transport direction of the laminated tape 24 in the region where the sticking tape is stuck. The Y-axis stage 28 is moved so that the anisotropic conductive tape 22a is disposed opposite to the substrate 35, and then the cut anisotropic conductive tape 22a is pressure-bonded to the substrate 35. .

  For this reason, it is not necessary to carry the laminated tape 24 after cutting the anisotropic conductive tape. Thereby, reduction of the number of processes and reduction of the time required for sticking an anisotropic conductive tape can be aimed at. In addition, occurrence of misalignment of the sticking position due to the conveyance accuracy of the laminated tape 24 can be reduced. Further, when the anisotropic conductive tape is cut, the laminated tape 24 may be transported by the length of the sticking regardless of the sticking length, so even if the sticking length of the anisotropic conductive tape is short. No anisotropic conductive tape is wasted.

  Furthermore, since there is no extra anisotropic conductive tape downstream from the downstream end in the transport direction of the laminated tape 24 in the region where the anisotropic conductive tape is attached, for example, as shown in FIG. Even if the length of the lower surface (pressing surface) of the crimping tool 37a is longer than the length of the anisotropically conductive tape 22b to be adhered, the excess anisotropically conductive tape is adhered to the substrate 35. There is nothing. Therefore, if the length of the anisotropic conductive tape is shorter than the length of the crimping tool, even when changing the size of the substrate to be pasted, without changing the crimping tool, An anisotropic conductive tape can be attached.

It is a front view which shows schematic structure of the sticking apparatus of the anisotropically conductive tape which concerns on one embodiment of this invention. It is a side view of the sticking apparatus of the anisotropically conductive tape shown in FIG. It is a figure for demonstrating the positional relationship of the cutter unit on a Y-axis stage, a substrate stage, and a board | substrate. It is a flowchart which shows the procedure which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure for demonstrating the operation | movement which sticks an anisotropic conductive tape in the sticking apparatus of the anisotropic conductive tape shown in FIG. It is a figure which shows the case where the length of the press surface of a crimping | compression-bonding tool is longer than the sticking length of an anisotropic conductive tape. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 1st example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate. It is a figure for demonstrating the 2nd example of the process of sticking the conventional anisotropic conductive tape on a board | substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 21 ... Tape supply part, 22 ... Anisotropic conductive tape, 23 ... Separator, 24 ... Laminated tape, 25 ... Tape collection | recovery part, 26, 27 ... Guide roller, 28 ... Y-axis stage, 29 ... Cutter unit, 30 ... Cutter 31 ... Stopper block, 32 ... Cutter stage, 33 ... Contacting member, 34 ... Substrate stage, 35 ... Substrate, 36 ... Crimp head, 37 ... Crimping tool, 38 ... Heater, 39 ... Vertical drive, 40 ... Guide rail 41 control unit

Claims (3)

A tape supply means for supplying a laminated tape in which an anisotropic conductive tape and a separator are laminated;
Tape conveying means for conveying the laminated tape in a predetermined direction;
A stage disposed below the tape supply means and the tape transport means and movable in a direction orthogonal to the transport direction of the laminated tape;
Cutting means provided on the stage, and cutting the anisotropic conductive tape into a predetermined length in the transport direction of the laminated tape;
A cutting position of the anisotropic conductive tape by the cutting means that holds the substrate, is spaced apart from the cutting means in a direction perpendicular to the transport direction of the laminated tape on the stage, and in the transport direction of the laminated tape Is a substrate holding means provided so as to coincide with the upstream end in the direction of transport of the laminated tape in the region where the anisotropic conductive tape is attached to the substrate,
Pressure bonding means for pressure bonding the anisotropic conductive tape cut by the cutting means to the substrate;
After cutting the anisotropic conductive tape by the cutting means, the stage is moved in a direction perpendicular to the transport direction of the laminated tape so as to dispose the cut anisotropic conductive tape to the substrate, An anisotropic conductive tape adhering device comprising: control means for controlling the cut anisotropic conductive tape to be crimped to the substrate by the crimping means after the stage is moved.   In the crimping means, the upstream end of the pressing surface that presses the anisotropic conductive tape in the transport direction of the laminated tape has the laminated tape in a region where the anisotropic conductive tape is attached to the substrate. The length of the pressing surface in the transport direction of the laminated tape coincides with the upstream end of the transport direction in the transport direction of the multilayer tape in the region where the anisotropic conductive tape is attached to the substrate. The anisotropic conductive tape sticking device according to claim 1, wherein the anisotropic conductive tape sticking device has a length equal to or longer than a length in a lateral direction. A step of transporting a laminated tape in which an anisotropic conductive tape and a separator are laminated in a predetermined direction;
Cutting the anisotropic conductive tape into a predetermined length in the transport direction of the laminated tape by a cutting means provided on a stage movable in a direction perpendicular to the transport direction of the laminated tape;
The stage is moved in a direction perpendicular to the transport direction of the laminated tape, and the cut anisotropic conductive tape is separated from the cutting means in a direction perpendicular to the transport direction of the laminated tape and placed on the stage. A step of opposingly arranging the substrate held by the provided substrate holding means;
Crimping the cut anisotropic conductive tape to the substrate,
In the step of cutting the anisotropic conductive tape, the cutting position in the transport direction of the laminated tape is on the upstream side in the transport direction of the laminated tape in the region where the anisotropic conductive tape is stuck on the substrate. A method for manufacturing an electrical device, comprising a step of cutting the anisotropic conductive tape so as to coincide with an end.

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