JP4417028B2 - Device for attaching dicing tape to dicing frame - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
This invention is a semiconductor product manufacturing process, Dicing frame Daishin to Gute Loop pasting device, more details Dicing tape pasting device that prevents sticking to unnecessary parts when dicing tape is stuck and does not damage the dicing frame when cutting the tape It is about.
[0002]
[Prior art]
In general, in the manufacturing process of a semiconductor product, a substrate such as a semiconductor wafer on which a large number of circuit patterns are formed is cut into individual functional elements (dicing process) into individual semiconductor chips (die). A semiconductor chip is mounted on a die pad such as a lead frame and fixed (die bonding process), followed by wire bonding, etc., and if necessary, sealing with a mold resin to complete a product such as an IC or LSI. ing.
[0003]
In the wafer dicing process, a dicing tape is affixed to the back surface on which no circuit pattern is formed, the wafer is mounted on a dicing frame via the dicing tape, and the wafer is diced from the front surface. The UV curable dicing tape is removed from the wafer by irradiating ultraviolet rays from the back side of the tape.
[0004]
Also, in the die bonding process, conventionally, a silver paste or the like is applied in advance to a die pad portion such as a lead frame on which a semiconductor chip is to be stacked, and after mounting the semiconductor chip, the semiconductor chip is die pad by heat curing of the silver paste or the like. Although it was fixed to the top, since it is difficult to apply an appropriate amount of silver paste or the like to the die pad portion, a die bond tape having a function as a die bonding material has been used recently.
[0005]
As this die-bonding tape, for example, a tape using a polymer alloy type adhesive composed of thermoplastic resin (polyimide resin, acrylic resin, etc.) and thermosetting resin (epoxy resin, phenol resin, etc.) as components. In general, there is no adhesive property, and there is a material that exhibits adhesiveness by heating (for example, 100 ° C. to 160 ° C.).
[0006]
In order to mount and fix the semiconductor chip on the die pad of the lead frame using such a die bond tape, the die bond tape is applied to the entire back surface of the semiconductor wafer, and then the semiconductor wafer and the die bond tape are integrally cut, A semiconductor chip with a die-bonding tape is formed on the back surface, and this is mounted on a die pad of a lead frame and then heated and fixed.
[0007]
In order to attach the die bond tape to the back surface of the semiconductor wafer, a two-layer tape of a die bond tape (corresponding to an adhesive sheet) and a cover film (corresponding to a release film) having a width larger than the outer diameter of the semiconductor wafer is used. By pulling out a predetermined amount of this die bond tape from the reel, attaching the die bond tape to the heated back surface of the semiconductor wafer while peeling the cover film, and then cutting the die bond tape along the outer peripheral edge of the semiconductor wafer. A die bond tape is attached to a semiconductor wafer (for example, Patent Document 1).
[0008]
By the way, the die bond tape is first attached to the wafer, then the die bond tape is cut into a wafer shape, and the dicing frame and the wafer are integrated using the dicing tape in a separate process, and then the dicing frame is cut on the die. Since the dicing tape is cut out in the shape of the dicing frame by running the blade, the number of steps and labor are required.
[0009]
Recently, miniaturization has been required for semiconductor chips for mobile phones and IC cards, and so-called stacked packages in which a plurality of semiconductor chips are stacked are used to increase the degree of integration. In order to increase the thickness of the wafer and the substrate, a wafer having a thickness of 100 μm or less has been used.
[0010]
For this reason, in a conventional method in which a die bond tape having a width wider than the outer periphery of the wafer is applied to the wafer and the cutter blade is cut along the outer periphery of the wafer with the cutter blade, the cutter blade contacts the wafer and the outer peripheral portion of the wafer is damaged. There is a risk that the wafer may be attached or the wafer may be broken, and handling in the apparatus becomes difficult.
[0011]
In order to prevent breakage of the wafer by the cutter blade as described above, and to further reduce the size of the apparatus and shorten the process, a die bond tape (corresponding to the second adhesive layer) and a dicing tape (on the base tape) (Equivalent to a laminate of the first adhesive layer) is integrated into a two-layer structure on the entire surface, and the dicing tape and die bond tape are pasted to the wafer by one pasting operation and cutting both tapes into a dicing frame shape. Dicing die-bonding tapes (corresponding to wafer fixing tapes) that can be used are also being used (for example, Patent Document 2).
[0012]
However, since the dicing die-bonding tape uses a relatively expensive die-bonding tape up to an extra portion other than the wafer, there is a problem that the cost is high. Further, in this method, the die bonding tape comes into contact with the dicing frame, and it is usually necessary to heat the dicing frame in order to adhere the die bonding tape that generates adhesiveness when heated, and handling such as storage of the dicing frame after heating is required. It becomes difficult.
[0013]
As another method of using the dicing die-bonding tape having the entire two-layer structure described above, a method of separately forming an adhesive layer around the die-bonding tape in accordance with the dicing frame attaching portion can be considered. However, it is necessary to newly provide an adhesive layer. There was a problem that it took time and money. In addition, the die bond tape was wasted as described above.
[0014]
Therefore, in addition to the purpose of preventing breakage due to the cutter blade of the wafer as described above, as shown in FIGS. 15 and 16, for the purpose of reducing waste of a relatively expensive die bond tape, a die bond tape having a wafer shape in advance is used. A dicing die-bonding tape 1 having a three-layer structure in which 3 is sandwiched between a dicing tape 2 wider than the wafer and a cover film 4 has been developed.
[0015]
After the dicing die bond tape 1 is peeled off the cover film 4 as shown in FIG. 16, a wafer 5 is attached to the position of the die bond tape 3 as shown in FIGS. 17 and 18, and the dicing tape 2 is attached in a ring shape. After being attached to the dicing frame 6, it is cut into a circular shape that matches the shape of the dicing frame 6, and a pasted product 7 (wafer-mounted dicing frame) is obtained. In addition, 5a is an orientation flat for positioning the wafer 5, and 6a is a notch for positioning the dicing frame 6.
[0016]
[Patent Document 1]
JP-A-10-112494 (second page, third page, FIG. 1, FIG. 3)
[Patent Document 2]
Japanese Unexamined Patent Publication No. 7-263382 (second page, FIG. 1 and FIG. 2)
[0017]
[Problems to be solved by the invention]
By the way, the conventional technology as described above When the dicing tape 2 is attached to the ring-shaped dicing frame 6 and then cut into a circular shape that matches the shape of the dicing frame 6 There were the following problems.
[0018]
( 1 ) Attaching tape to unnecessary parts when attaching dicing tape to dicing frame
A dicing tape that is wider than the dicing frame is affixed to the dicing frame, and the dicing frame is affixed to the dicing frame by punching out the dicing tape. There was a problem that the tape feeding would be hindered.
[0019]
( 2 ) Dicing frame is damaged when dusting tape is applied, and dust and dirt are generated inside the equipment.
When a dicing tape is attached to the dicing frame, a dicing tape wider than the dicing frame is attached, and the cutter blade runs on the dicing frame so that the cutting edge comes into contact with the dicing frame. The cutter blade life is shortened. There is also a problem that dust or dust generated by cutting the dicing frame is generated in the apparatus, leading to contamination of the substrate and tapes.
[0020]
The present invention solves the above problems. To dicing frame Prevent sticking to unnecessary parts when applying dicing tape, and damage the dicing frame when cutting the tape No Iyo Nada An apparatus for attaching an icing tape is provided.
[0021]
[Means for Solving the Problems]
In order to solve the above problems, This The invention of In a dicing tape attaching apparatus for attaching a wide dicing tape to a dicing frame, a mounting table for fixing the dicing frame by appropriate means, an open state in which the mounting table is retracted from the mounting surface, and the dicing frame A closed state that covers the outside of the portion of the dicing frame to which the dicing tape is to be attached in a mounted state is free, the mask member having a non-adhesive surface with respect to the dicing tape, and the mask member in a closed state. A dicing tape affixing roller capable of crimping a dicing tape to the upper surface of the mask member and a portion of the mounting table on which the dicing frame is to be pasted, and a step portion between the mask member of the crimped dicing tape and the dicing frame. The cutting edge against the raised part A cutter blade that can be moved forward and backward to cut the dicing tape and to move circumferentially to cut the dicing tape along the circumferential direction, and provided with protective members slightly protruding from the blade edge on both sides, and the cutter blade The dicing to the dicing frame is characterized by comprising at least one pressing roller that presses the cutting end of the dicing tape against the dicing frame in conjunction with the circumferential movement of the dicing tape. This is a tape attaching device.
[0022]
According to the above invention, when applying the dicing tape to the dicing frame, by applying a non-adhesive mask member in addition to the dicing tape application portion, it is possible to prevent the dicing tape from sticking to other than the necessary portion, and to feed the tape. Cut the dicing tape so that the dicing tape does not damage the dicing frame by inserting a cutter blade between the mask member and the dicing frame. Can do.
[0023]
Since the part where the dicing tape is lifted is inclined at the step part of the mask member from the dicing frame, the cutter blade that cuts this part also faces the mask member from the direction perpendicular to the surface of the dicing frame. It is preferable to cut in a state inclined to approximately (around 60 ° from the horizontal direction).
[0024]
Furthermore, by providing protective members on both sides of the cutter blade, when the cutter blade is lowered, this protective member arrives at the dicing frame (covered with dicing tape) before the cutter blade, Lowering is prevented so that the cutter blade does not contact the dicing frame. The protective member is preferably a member that does not interfere with the movement of the cutter blade, such as a roller, and may be configured to hold the tape with the protective member at the same time.
[0025]
Also, the end of the dicing tape after being cut is pressed against the dicing frame by at least one pressing roller (preferably a plurality of pressing rollers) to prevent the tape from lifting up. The cutting end of the dicing tape immediately after cutting can be moved in conjunction with the circumferential movement for cutting the tape (for example, by rotating the pressing roller together with the cutter blade on the rotary drive unit at the same time). Since it can be pressed against the dicing frame, rapid processing is possible.
[0026]
In addition, This The dicing tape attaching device of the above Conventional technology It is possible to use the dicing and die bonding tape affixed to the substrate with the substrate-shaped die bonding tape affixed to the wide dicing tape, as well as the normal wide dicing tape (whether the substrate has already been affixed) It can also be used when affixing to a dicing frame.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0028]
FIG. 1 is a plan view showing the overall structure of a dicing die-bonding tape affixing device for a substrate (semiconductor wafer) according to the present invention. Then, a dicing frame supply unit 9 that moves up and down, and a dicing that is located to the right of the supply unit 9 and that attaches a dicing die-bonding tape to the supplied dicing frame 6 and mounts the wafer 5 on the dicing frame 6 The die bond tape attaching part 10, the horizontal movement along the rail 12 provided over the supply part 9 and the attaching part 10 and the vertical movement by the cylinder 13 are freely movable, and the dicing frame of the supply part 9 by the suction pad 14 A dicing frame suction / conveyance arm 11 that sucks 6 and supplies it to the pasting unit 10 is provided. That.
[0029]
A wafer supply unit 15 is provided in front of the dicing die bond tape application unit 10, and a wafer alignment region 16 is disposed between the application unit 10 and the wafer supply unit 15. In the wafer alignment region 16, The wafer 5 is sucked and rotated by the suction rotating unit 17, and the position of the orientation flat 5 a is confirmed by an appropriate means such as a sensor (not shown) to position the wafer 5.
[0030]
Further, on the side of the wafer supply unit 15 and the wafer alignment region 16, the wafer 5 of the wafer supply unit 15 is transported to the wafer alignment region 16, and the wafer 5 is further transferred from the wafer alignment region 16 to the dicing / die bond tape applying unit 10. A wafer suction / transport robot 18 for transport is provided.
[0031]
Further, a support table 19 that adsorbs and supports the upper surface of the wafer 5 via the dicing die-bonding tape 1 on the lower surface thereof after the pressure bonding process of the die-bonding tape 3 and the wafer 5 at the dicing / die-bonding tape applying portion 10 is provided on the support table moving rail 20. The cylinder 21 can be moved up and down and moved up and down by the cylinder 21.
[0032]
Further, between the dicing die-bonding tape attaching part 10 and the dicing frame supply part 9 and in the middle of the moving path of the dicing frame suction / conveying arm 11, a wafer-mounted dicing frame (attachment completion product 7) after the attachment is completed. ) Is provided, and a frame reversing arm 23 is provided in front of the pasted product discharge unit 22 so that the pasted product 7 can be moved forward by a motor 24. A dicing frame pushing arm 27 is arranged to push the pasted product 7 reversed and taken out by the frame reversing arm 23 along the rail 26 provided on the rail support base 25 in the left direction in the figure. The pasted product 7 pushed in along enters the pasted product storage unit 28, and the pasted product storage unit 28 moves up and down. Slide into a multi-stage storage more a patch complete product 7 in the vertical direction.
[0033]
FIG. 2 is a view taken along the line AA in FIG. 1, and shows the dicing frame supply unit 9, the dicing die bond tape applying unit 10 and the pasted product discharge unit 22 as viewed from the front.
[0034]
In the dicing / die-bonding tape attaching section 10, the dicing / die-bonding tape 1 is wound around a dicing / die-bonding tape supply reel 29, and a plurality of dicing / die-bonding tapes 1 are appropriately arranged in the course of being transferred to the dicing tape take-up reel 30. The guide roller 31 and the peeling roller 32 are used so that the dicing tape 2 side is the upper surface and the die bonding tape 3 is the lower surface, and the cover film 4 of the dicing die bonding tape 1 is peeled off by the peeling roller 32. The film is taken up on the cover film take-up reel 33.
[0035]
On the upper side of the running path of the dicing tape 2 and the die bond tape 3, a die bond tape sticking roller 34 for reciprocating along the running direction of the tape and pressing the die bond tape 3 onto the upper surface of the wafer 5, as well as the tape A dicing tape sticking roller 35 for reciprocating along the running direction and pressing the dicing tape 2 onto the upper surface of the dicing frame 6 is disposed.
[0036]
An adsorption heating table 36 that horizontally adsorbs and heats the wafer 5 supplied to the upper surface is installed below the traveling path of the dicing tape 2 and the die bond tape 3 so as to be movable up and down by the action of the cylinder 37. A lifting table 38 is provided below the adsorption heating table 36 so as to be movable up and down separately from or in synchronization with the adsorption heating table 36 by a cylinder 39.
[0037]
The details of the vicinity of the suction heating table 36 are as shown in FIGS. 3 to 7, and a dicing frame mounting table 40 having a donut shape surrounding the suction heating table 36 and capable of sucking the dicing frame by appropriate means. However, the cylinder unit 43 is installed so as to be movable up and down with respect to the mask unit moving table 42 integrated by the lifting table 38 and the fixed shaft 41.
[0038]
On the upper side of the dicing frame mounting table 40, a mask member 44 divided into four parts has a mask fixing screw 46 and its both sides facing inward from the upper ends of the four mask fixing plates 45 surrounding the dicing frame mounting table 40. Each mask fixing plate 45 is provided in a lateral direction along a slider mechanism 49 provided on the mask unit moving table 42 by a cylinder 48 provided on the elevating table 38. The four mask members 44 are movable back and forth from the open position shown in FIGS. 3 and 5 to the closed position shown in FIGS. 4 and 6 that proceed toward the center of the dicing frame mounting table 40.
[0039]
The mask member 44 needs to have a non-tacky surface, for example, is subjected to fluororesin processing so that the mask member 44 can be easily peeled off without being bonded even after the dicing tape 2 is pressure-bonded to the surface of the mask member 44. It has become.
[0040]
In the drawing, 50 is a cylinder shaft connected to the lifting cylinder 37 of the adsorption heating table 36, and 51 is a cylinder shaft connected to the lifting cylinder 39 of the lifting table 38.
[0041]
Further, the support table 19 indicated by a two-dot chain line in FIG. 2 moves forward and backward by the support table moving rail 20 to a position facing the adsorption heating table 36 on the transition path of the dicing tape 2 and the die bond tape 3, and is moved up and down by the cylinder 21. The wafer 5 is adsorbed and supported via the dicing tape 2 and the die bond tape 3 during the press bonding process of the die bond tape 2 and the wafer 5 by the up and down movement.
[0042]
Further, a cutter unit 52 that can be moved up and down by an elevating cylinder 53 is provided on the opposite upper surface of the adsorption heating table 36 on the transition path between the dicing tape 2 and the die bonding tape 3.
[0043]
As shown in FIGS. 8 and 9, the cutter unit 52 is fixed to the lower end of the cylinder shaft 54 connected to the elevating cylinder 53, and is moved up and down by a slider 57 that moves along the elevating rail 56 provided on the support frame 55. The rotation of the cutter rotation drive motor 58 is transmitted to the rotation shaft 60 by the belt 59, and the cutter blade 62 and the circumference of the circular rotation drive unit 61 fixed below the rotation shaft 60 A dicing frame protection and tape pressing roller 63 provided on both sides of the cutter blade 62 and a plurality of tape pressing rollers 64 arranged concentrically are provided so that a circle is drawn on the same circumference by the rotation of the rotating shaft 60. Move to.
[0044]
The cutter blade 62 and the dicing frame protection and tape pressing roller 63 provided on both sides of the cutter blade 62 move along a rail 65 provided with an inclination toward the outside (60 ° is optimal with respect to the horizontal). The cutter blade 62 can be moved to about 60 ° C. by the heater unit 69 that is energized by the heater wire 68. Until it is heated.
[0045]
Further, the dicing frame protection and tape pressing roller 63 has a lowermost position at a position slightly lower than the cutting edge of the cutter blade 62, and when it is lowered, it reaches the horizontal surface before the cutter blade 62 and prevents further lowering of the cutter blade 62. The cutter blade 62 does not damage the horizontal plane (actually the surface of the dicing frame 6).
[0046]
A plurality of tape pressing rollers 64 arranged on the circumference run inside the mask member 44 on the dicing frame 6 placed on the dicing frame placement table 40 as the rotation drive unit 61 rotates, and springs A pressing force is applied downward by 70 to press the cut end of the dicing tape 2.
[0047]
In addition, in order to detect the position of the rotating cutter blade 62, a positioning plate 71 and a sensor 72 that are linked to the motor shaft of the cutter rotation drive motor 58 are provided.
[0048]
Next, the process of applying the dicing die-bonding tape 1 to the wafer 5 in the application unit 10 and the subsequent application process of the dicing tape 2 to the dicing frame 6 will be described with reference to the process diagrams of FIGS. .
[0049]
First, the wafer-shaped die bond tape 3 formed on the dicing tape 2 while the cover film 4 of the three-layer dicing die bond tape 1 is peeled off by the peeling roller 32 is placed on the wafer attachment planned position, for example, dicing. It is positioned and supplied by appropriate means such as recognizing an alignment mark provided at a predetermined position on the tape 2 side or inserting a pin into a positioning hole for positioning.
[0050]
Next, the wafer 5 positioned in the wafer alignment region 16 is supplied onto the adsorption heating table 36, and the pattern surface side of the wafer 5 is adsorbed and heated (FIG. 10A). The pattern surface side of the wafer 5 is preferably protected by attaching a support substrate via a protective tape or a double-sided adhesive tape composed of a UV curable adhesive or a heat-peelable adhesive. As the support substrate, an ultraviolet transparent and hard substrate (for example, glass, sapphire, resin, etc.) is preferably used.
[0051]
The adsorption heating table 36 on which the wafer 5 is placed at the attaching position rises to the tape running position, and the die bond tape attaching roller 34 advances to the attaching position (FIG. 10B).
[0052]
The die bond tape application roller 34 is pressed onto the wafer 5 from above the dicing tape 2, and the die bond tape 3 is attached to the wafer 5 (FIG. 10C).
[0053]
After the attaching step, the die bond tape attaching roller 34 moves backward to the initial position. Subsequently, the support table 19 enters the affixing portion 10 and descends to the upper surface of the dicing tape 2 and sucks and supports the wafer 5 from the back surface of the dicing tape 2 through the dicing tape 2 (FIG. 10D).
[0054]
While the support table 19 is being sucked, the suction heating table 36 is unsucked and the suction heating table 36 is lowered. At this time, the wafer 5 is sucked and held on the support table 19 via the die bonding tape 3 and the dicing tape 2 (FIG. 11E).
[0055]
The dicing frame 6 is positioned and mounted on the dicing frame mounting table 40 by the dicing frame suction / conveyance arm 11 from the dicing frame supply unit 9 with appropriate means (for example, a positioning pin, an optical sensor, etc.) and sucked. It is fixed by appropriate means (FIG. 11 (f)).
[0056]
The mask member 44 advances to the dicing frame mounting table 40 side, and then the dicing frame mounting table 40 and the adsorption heating table 36 are raised in synchronization, whereby the mask member 44 is applied to the dicing frame 6 (FIG. 11 (g)).
[0057]
The dicing frame 6 to which the mask member 44 is applied moves up to the tape running position, which is the affixing position, in synchronization with the suction heating table 36 and the dicing frame mounting table 40. Subsequently, the adsorption heating table 36 adsorbs the wafer 5 (FIG. 11 (h)).
[0058]
The support table 19 is lifted by releasing the suction of the support table 19, and is retracted from the tape applying unit 10. Subsequently, the dicing tape application roller 35 advances to the application position (FIG. 12 (i)).
[0059]
The dicing tape application roller 35 is driven to apply the dicing tape 2 to the dicing frame 6. (FIG. 12 (j)).
[0060]
At this time, as shown in the enlarged cross-sectional view of FIG. 13A, the dicing tape 2 is in a state of being lifted up without contacting any of the steps between the dicing frame 6 and the mask member 44.
[0061]
Subsequently, the dicing tape applying roller 35 moves backward to the initial position, and the rotational drive unit 61 of the cutter unit 52 is lowered. Subsequently, the heated cutter blade 62 is inserted into the gap between the mask member 44 and the dicing frame 6 in the dicing tape 2 and the rotary shaft 60 is driven to rotate, whereby the cutter blade 62 is moved along a circle, and the dicing tape 2 is moved. Cut (FIG. 12 (k)).
[0062]
At this time, the cutter blade 62 does not reach the surface of the dicing frame 6 due to the presence of the dicing frame protection and tape pressing roller 63 on both sides of the cutter blade 62 as shown in the enlarged sectional view of FIG. The surface is not damaged. As shown in the drawing, the end of the mask member 44 is inclined so as to increase the area on the upper surface side, so that interference with the cutter blade 62 is avoided.
[0063]
Further, the tape pressing roller 64 is also driven to rotate in synchronization with the cutter blade 62, and the surface of the dicing frame 6 immediately after being cut by the cutter blade 62, as shown in the enlarged sectional views of FIGS. 13 (c) and 13 (d). Then, the dicing tape 2 that has been lifted from is pressed against the surface of the dicing frame 6.
[0064]
Thereafter, the dicing tape 2 in which the adsorbing heating table 36 and the dicing frame mounting table 40 are moved down in synchronization and the adhesive portion to the dicing frame 6 is cut off by the cutter blade 62 is non-adhesive. The sheet is naturally separated without being attached, and is sent to the take-up reel 30 side until the next die bond tape 3 portion comes, so that the next wafer 5 is attached.
[0065]
Next, the dicing frame (attachment completion product 7) on which the wafer is mounted by retracting the mask member is discharged onto the attachment completion product placement table 73 of the application completion product discharge section 22 by the dicing frame suction / conveyance arm 11. As shown in FIG. 14, after being attracted to the suction pad 74 of the frame reversing arm 23, the motor 24 is driven to reverse about the rotating shaft 75, and the rail 5 is placed with the pattern forming surface side up. It is transferred onto the rail 26 on the support base 25 and stored in the pasted product storage section 28 through the push-in arm 27.
[0066]
When the wafer 5 is integrated with the protective tape and the support substrate, the wafer surface is protected during the period from the pasted product discharge unit 22 to the pasted product storage unit 28 in the apparatus of the present invention. It is good also as a structure which provides the means (not shown) which peels a tape and a support substrate by ultraviolet irradiation or a heating. As a result, the next dicing process can be performed immediately. Or it is good also as a structure transferred to the peeling apparatus (not shown) of a protective tape or a support substrate as a next process.
[0067]
【The invention's effect】
As above According to the invention, since the non-adhesive mask member is used when the dicing tape is attached, there is no sticking to unnecessary portions even if a dicing tape wider than the dicing frame is used, which hinders tape feeding. As a result, maintenance is easy and production efficiency is improved.
[0068]
In addition, the dicing frame is not damaged by cutting the tape using the gap between the mask member and the dicing frame, and the dicing frame protection member is provided around the cutter blade so that the dicing frame is damaged. There was no. As a result, it was possible to prevent dust and dust from being generated in the apparatus and to prolong the life of the dicing frame and the cutter blade.
[0069]
In addition, when cutting the dicing tape along the mask member, a tape pressing roller is provided around it to prevent the tape from lifting even if an angle is provided when cutting the tape, preventing damage to the dicing frame and cutter blade. However, it became possible to paste the dicing frame with high accuracy.
[Brief description of the drawings]
FIG. 1 is a plan view of an apparatus according to the present invention.
FIG. 2 is an AA arrow view of FIG.
FIG. 3 is a plan view of the mask member in the open position.
FIG. 4 is a plan view of the mask member in the closed position.
FIG. 5 is a view taken along arrows C-C in FIG.
6 is a view taken along arrows D-D in FIG. 4;
FIG. 7 is a sectional view of the dicing tape attaching process.
[Fig. 8] Right side view of the cutter unit
[Fig. 9] Plan view of the cutter unit
FIGS. 10A to 10D are process diagrams for applying a dicing die-bonding tape.
11 (e) to (h) are dicing and die bonding tape application process diagrams.
12 (i) to (k) are process diagrams for applying a dicing die-bonding tape.
FIGS. 13A to 13D are enlarged sectional views of a dicing tape attaching operation.
FIG. 14 is a view taken along arrow B in FIG. 1B showing the dicing frame reversing mechanism.
FIG. 15 is a sectional view of a dicing die-bonding tape.
FIG. 16 is a perspective view of a dicing die-bonding tape.
[Figure 17] Plan view of the finished product with a wafer attached
[Figure 18] Cross-sectional view of the finished product with a wafer attached
[Explanation of symbols]
1 Dicing die bond tape
2 Dicing tape
3 Die bond tape
4 Cover film
5 Wafer
5a orientation flat
6 Dicing frame
6a Notch
7 Pasted products
8 units
9 Dicing frame supply section
10 Dicing die bond tape application part
11 Dicing frame suction / transport arm
12 rails
13 cylinders
14 Suction pad
15 Wafer supply section
16 Wafer alignment area
17 Adsorption rotation part
18 Wafer suction and transfer robot
19 Support table
20 Support table moving rail
21 cylinders
22 Completed product discharge section
23 Frame reversing arm
24 motor
25 rail support stand
26 rails
27 Dicing frame push-in arm
28 Attached product storage
29 Dicing die bond tape supply reel
30 Dicing tape take-up reel
31 Guide roller
32 Peeling roller
33 Cover film take-up reel
34 Die bond tape application roller
35 Dicing tape application roller
36 Adsorption heating table
37 cylinders
38 Lifting table
39 cylinders
40 Dicing frame mounting table
41 Fixed shaft
42 Mask unit moving table
43 cylinders
44 Mask material
45 Mask fixing plate
46 Mask fixing screw
47 Mask fixing pin
48 cylinders
49 Slider mechanism
50 Cylinder shaft
51 Cylinder shaft
52 Cutter unit
53 Lifting cylinder
54 Cylinder shaft
55 Support frame
56 Lift rail
57 Slider
58 Cutter rotation drive motor
59 belt
60 axis of rotation
61 Rotation drive unit
62 Cutter blade
63 Dicing frame protection and tape pressing roller
64 Tape pressing roller
65 rails
66 Slider
67 Stopper
68 Heater wire
69 Heater unit
70 Spring
71 Positioning plate
72 sensors
73 Pasting product placement table
74 Suction pad
75 Rotating shaft

Claims (1)

In a dicing tape attaching device for attaching a wide dicing tape to a dicing frame,
A mounting table for fixing the dicing frame by appropriate means;
With respect to the mounting table described above, the table can be freely opened and retracted from the mounting surface, and can be closed when the dicing frame is mounted and covers the outside of the dicing tape to be attached to the dicing tape. A non-adhesive mask member,
A mask member leave a closed state, and the dicing tape applying roller capable crimp the dicing tape to the attachment portion reserved for dicing frame on the top surface and the mount table of the mask member in the closed state,
Cutting the forward and backward movement and the dicing tape to cut the dicing tape by inserting edge against the raised portion formed in the crimped stepped portion between the dicing tape of the mask member and the dicing frame along a circumferential direction A cutter blade capable of circumferential movement and provided with protective members slightly projecting from the blade edge on both sides;
An apparatus for attaching a dicing tape to a dicing frame, comprising: at least one pressing roller that presses the cutting end of the dicing tape against the dicing frame in conjunction with the circumferential movement of the cutter blade.

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