JP2011197461A - Assembling device of fpd module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the mounting device of a flat panel display which can stably stick an ACF to an electronic component.SOLUTION: An FPD module assembly line includes: an ACF sticking part 230 with a sticking means, a cut means, and a peeling means; and a loading part 280 having a plurality of loading heads 293. The sticking means of the ACF sticking part 230 sticks a TAB 2 to the ACF of ACF tape consisting of a base film and the ACF. The cut means makes cuts to the ACF to which the TAB 2 is stuck, and the peeling means peels off the base film of the ACF with the cuts formed on the ACF. The loading part 280 simultaneously performs loading operation of the TAB 2 to which the ACF is stuck to three sides of a display substrate 1.

Description

  The present invention relates to an FPD module assembling apparatus for mounting electronic components on a display panel of a flat panel display (FPD).

  Examples of the FPD include a liquid crystal display, an organic EL (Electro-Luminescence) display, and a plasma display. In the FPD, a driving IC is mounted on the periphery of the display substrate, and TAB (Tape Automated Bonding) connection such as COF (Chip on Film) or FPC (Flexible Printed Circuit) is performed. A peripheral substrate such as a PCB (Printed Circuit Board) is mounted around the display substrate. As a result, the FPD module is assembled.

  The assembly line of the FPD module is a device that mounts a driving IC, a TAB, a PCB, and the like on the peripheral portion and the periphery of the display substrate of the FPD by sequentially performing a plurality of processing work steps. Hereinafter, the display substrate is simply abbreviated as “substrate”, and in the case of another substrate, for example, a PCB, it is specified as “PCB substrate”.

  Examples of processing steps in the assembly line of the FPD module include (1) a terminal cleaning step for cleaning the TAB attachment portion at the end of the substrate, and (2) an anisotropic conductive film (ACF: Anisotropic Conductive on the end of the substrate after cleaning). There is an ACF process for attaching a film. In addition, there are (3) a mounting step in which the TAB or IC is positioned and mounted at the position where the ACF is attached to the substrate, and (4) a pressing step in which the mounted TAB or IC is heat-pressed and fixed by the ACF. Further, (5) there is a PCB process in which a PCB substrate on which an ACF has been pasted is pasted and mounted on the side opposite to the TAB substrate side. The PCB process is composed of a plurality of processes.

  The ACF may be attached in advance to either one of the members to be joined. That is, in another example of the ACF process, the ACF is attached in advance to the TAB or IC side. Further, the display substrate module assembly line requires a processing device that rotates the substrate according to the number of sides of the substrate to be processed, the number of TABs and ICs to be processed, the number of processing devices, and the like.

  Through such a series of steps, the electrodes on the substrate and the electrodes provided on the TAB, IC, etc. are thermocompression bonded, and the electrodes are electrically connected through the conductive particles inside the ACF. Is called. When the crimping process is completed, the ACF base resin is cured, so that the substrate and the TAB or IC are mechanically connected simultaneously with the electrical connection of both electrodes.

  Generally, as the number of TABs and ICs to be mounted increases, the number of ACFs to be attached also increases. Although there is a method of attaching the ACF to the display substrate in the form of a long single sheet, the ACF attached to a portion where no TAB or IC is mounted is not preferred because it is wasted.

  Here, the electronic component referred to as TAB in the present invention is referred to as TCP (Tape Carrier Package) or COF (Chip On Film) due to the difference in the detailed shape and thickness of the members. These TCP and COF are constructed by mounting an IC chip on an FPC (Flexible Printed Circuit) in which a long polyimide film having sprocket holes is wired and cutting it out. There is no difference. Also, depending on the panel design, only an FPC without an IC chip may be mounted. In the FPD mounting and assembly process, these parts are not substantially different, and therefore referred to as TAB in the present invention.

  For example, Patent Document 1 discloses a method of attaching ACF to the TAB side in advance and mounting the ACF on the panel. However, Patent Document 1 does not describe a mechanism for attaching the ACF to the TAB. Patent Document 2 discloses a method in which only the ACF on the base film is trimmed to a predetermined length, and then the base film is peeled off by being attached to the TAB.

JP-A-4-352442 JP-A-7-74208

  Here, the point which tends to produce elongation becomes a subject on the characteristic of ACF. The ACF is formed by applying an ACF having a thickness of about 30 μm on a base film made of PET (Polyethylene Terephthalate) having a thickness of about 30 μm, and is supplied by a reel. For this reason, even if a cut such as a half cut is made in advance in the ACF so that the ACF is cut out at a necessary length, an error occurs in the length of the ACF due to the elongation of the base film. The half-cut here refers to a process of giving a cut to the ACF layer and cutting the base film layer so that the base film layer is not completely separated but maintains continuity.

  In an FPD module assembly process conventionally used, a long cut ACF is pasted on the glass FPD panel side in advance, and the TAB is positioned and pasted. Therefore, it is not necessary to increase the accuracy of the ACF half-cut interval. However, when the ACF is pasted on the TAB side, the following problems are likely to occur.

  First, when the ACF attachment length is shorter than the TAB width, the peel strength after TAB attachment is reduced. This is because stress concentrates on the starting point of the ACF between the glass panel and the TAB with respect to the external force that tries to peel off the TAB. Therefore, when the ACF attachment length is shorter than the width of the TAB, the peel strength is weaker than when the ACF is slightly protruded from the TAB and the outer edge of the TAB is embedded in the ACF.

  On the other hand, when ACF is made longer than TAB, the reliability of peeling of the base film is lowered. As described above, since both the ACF and the base film are thin and flexible resin films, when the ACF attached to a relatively strong TAB is peeled off from the base film, the base film is folded back with respect to the ACF. It is necessary to remove. At this time, if the ACF is long, the stress concentrates on the boundary between the ACF and TAB, and even if a half cut is formed on the ACF, the ACF is peeled off from the TAB and attached to the base film side. It is easy to have a problem that

  Moreover, since the uncured ACF is soft, the ACF that protrudes from the TAB for a long time is easily bent. As a result, even when the ACF can be peeled off successfully from the base film, the ACF may be folded and adhered when the TAB is attached to the panel.

  Thus, when the ACF is longer than the TAB, problems are likely to occur when the base film is peeled off and when the TAB is applied, and when the ACF is shorter, the possibility that the TAB is peeled off during use increases. Even if the length of the cut is adjusted in anticipation of ACF elongation, an error occurs in the ACF application position, and it is difficult to stably apply the half-cut ACF to the TAB.

  An object of the present invention is to provide a flat panel display mounting apparatus capable of stably attaching an ACF to an electronic component (TAB) in consideration of the actual situation in the prior art.

In order to solve the above problems and achieve the object of the present invention, an FPD module assembling apparatus according to the present invention comprises an ACF adhering portion having an attaching means, a cutting means and a peeling means, and a mounting portion having a plurality of mounting heads. It has.
The sticking means of the ACF sticking part sticks an electronic component to the ACF of the ACF tape composed of the base film and the ACF. The cutting means cuts the ACF on which the electronic component is attached, and the peeling means peels the base film of the ACF tape in which the cut is formed in the ACF.
The mounting unit simultaneously performs the mounting operation of the electronic component having the ACF attached to at least two sides of the display substrate.

The FPD module assembling apparatus of the present invention includes a provisional pressure bonding unit and a main pressure bonding unit.
The temporary pressure bonding unit is provided with an ACF attaching portion for attaching the ACF to the electronic component, and a mounting portion for mounting the electronic component attached with the ACF on the peripheral portion of the display substrate. And a cutting means and a peeling means. The sticking means of the ACF sticking part sticks an electronic component to the ACF of the ACF tape composed of the base film and the ACF. The cutting means cuts the ACF on which the electronic component is attached, and the peeling means peels the base film of the ACF tape in which the cut is formed in the ACF.
The main pressure bonding unit has a plurality of main pressure bonding portions, and simultaneously performs a pressure bonding operation of electronic components mounted on at least two sides of the display substrate.

  According to the FPD module assembling apparatus of the present invention, when the ACF is attached to the electronic component (TAB), the ACF half-cut can be applied to the outside in the vicinity of the outer edge of the electronic component. There are advantages that can be realized. In addition, there is an advantage that the ACF can be used without waste by arranging electronic components close to each other.

  Furthermore, the apparatus can be miniaturized by simultaneously mounting the electronic component on which the ACF is attached to at least two sides of the display substrate. In addition, the apparatus can be reduced in size by simultaneously performing the crimping operation of the electronic component in which the present crimping unit is mounted along at least two sides of the display substrate.

It is a top view which shows schematic structure of the FPD module which performs mounting assembly by this invention. It is a floor layout figure of the FPD module assembly line which shows a 1st embodiment of the FPD module assembly device of the present invention. It is a top view which shows the temporary crimping | compression-bonding unit which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention. FIG. 4A is a plan view of an ACF attaching portion in the temporary pressure bonding unit shown in FIG. 3, and FIG. 4B is a side view of the ACF attaching portion. FIG. 5 (a) is an explanatory view of an ACF sticking portion according to the second embodiment of the FPD module assembling apparatus of the present invention, and FIG. 5 (b) is a TAB chuck of the ACF sticking portion according to the second embodiment. It is explanatory drawing of the state which the ACF stage moved by pinching the ACF tape. FIG. 6A is a plan view of an ACF attaching portion according to the third embodiment of the FPD module assembling apparatus of the present invention, and FIG. 6B is a side view of the ACF attaching portion according to the third embodiment. is there. It is a side view of the ACF sticking part which concerns on 4th Embodiment of the FPD module assembly apparatus of this invention. FIG. 8A is an enlarged plan view of a notch portion in the guide block of the ACF attachment portion according to the fourth embodiment, and FIG. 8B is along the line AA in FIG. 8A. It is sectional drawing. It is a side view of the ACF sticking part which concerns on 5th Embodiment of the FPD module assembly apparatus of this invention.

  Hereinafter, an embodiment for implementing an FPD (flat panel display) module assembling apparatus will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the common member in each figure.

[FPD module]
First, the FPD module will be described with reference to FIG.
FIG. 1 is a plan view showing a schematic configuration of an FPD module for mounting and assembling according to the present invention.

  As shown in FIG. 1, the FPD module 7 is configured by connecting a plurality of TABs 2 to the peripheral portion of the display substrate 1 by ACF bonding, and connecting PCBs 6 to some TABs 2 by ACF. TAB 2 is an electronic component in which an IC chip 5 is mounted on an FPC (Flexible Printed Circuit) 4 in which a printed circuit (not shown) made of copper foil is applied to a flat rectangular polyimide film. The IC chip 5 is mounted substantially at the center of the FPC 4. A printed circuit is provided on the lower surface of the FPC 4, and outer lead terminals (not shown) are provided on both sides (two long sides) in the longitudinal direction.

  Depending on the type of TAB2, there is a case where the IC chip 5 is on the lower surface side (COF type) and a case where there is no IC chip (FPC type). FIG. 1 shows, as an example, a type (TAB type) in which an IC chip 5 is fitted into a hole of the FPC 4. The TAB 2 and the PCB 6 are different from each other in terms of circuit depending on the connection part, but are not shown in the description of the mounting and mounting, and are therefore shown as the same.

1. First embodiment [FPD module assembly line]
Next, the FPD module assembly line which is the first embodiment of the FPD module assembly apparatus of the present invention will be described with reference to FIG.
FIG. 2 is a floor layout diagram showing the entire FPD module assembly line.

  The FPD module assembly line 10 includes a receiving unit 100, a provisional pressure bonding unit 200, a main pressure bonding unit 300, a PCB connection unit 400, and a carry-out unit 500. Each unit has frames 103, 203, 303, 403, and 503. Conveying rails 101, 201, 301, 401, and 501 are provided on the operation surface side of each frame, and adjacent conveying rails are connected.

  The transport rails 101, 201, 301, and 401 are supported so that the transport stages 102, 202, 302, and 402 can move. These transfer stages 102, 202, 302 and 402 transfer the display substrate 1 to the work position of the next unit. Note that a device for receiving the display substrate 1 is separately provided in the last carry-out unit 500, but the carry-out from the carry-out unit 500 is generally omitted here because the specifications differ from factory to factory.

  The temporary pressure bonding unit 200, the main pressure bonding unit 300, and the PCB connection unit 400 are provided with reference bars 204, 304, and 404 on which the working side of the display substrate 1 is placed. These reference bars 204, 304, and 404 absorb the working side of the display substrate 1 and flatten the display substrate 1. These reference bars 204, 304 and 404 together with the rear end support (not shown) of each unit 200, 300 and 400 stably hold the display substrate 1 in operation.

  The temporary press-bonding unit 200 temporarily press-bonds TAB 2 to the three sides of one long side and both short sides of the display substrate 1 by ACF. The configuration for temporarily pressing the TAB 2 (see FIG. 1) will be described in detail later.

  The main crimping unit 300 has three main crimping portions 320A, 320B, and 320C, and simultaneously performs the crimping operation of TAB2 (see FIG. 1) mounted on three sides of the display substrate 1. The three main crimping portions 320A, 320B, and 320C include a main crimping head having an upper blade and a lower blade. The upper blade and the lower blade are heated by a heater, and the TAB 2 is heated and pressurized to connect to the display substrate 1.

  In order to press-bond the TAB 2 to the display substrate 1, the display substrate 1 on which the TAB 2 is temporarily bonded is pressed by the upper blade while being supported from the lower side by the lower blade. The ACF pressurized by the upper blade is heated and cured at 190 ° C. for 5 seconds, for example.

  The main press bonding unit 300 needs a moving mechanism for moving the main press bonding portions 320B and 320C for main press bonding the TAB 2 on the gate side temporarily bonded to both short sides of the display substrate 1 in the left-right direction (direction in which the units are arranged). Become. However, since the main crimping operation with the longest tact time can be performed simultaneously, there is an advantage that the entire around time can be shortened.

  The PCB connection unit 400 connects the PCB substrate to the TAB 2 on the source side connected to the long side of the display substrate 1. The PCB connection unit 400 includes a PCB supply device 430, an ACF sticking device 440, a transfer device 450, and a main pressure bonding part 460.

  The PCB supply device 430 supplies PCB substrates supplied by a tray (not shown) one by one to the left and right ACF sticking devices 440. The ACF sticking device 440 sticks the ACF to the PCB substrate supplied from the PCB supply device 430. The transfer device 450 conveys the PCB substrate on which the ACF has been pasted to the main crimping unit 460. Then, the main crimping unit 460 pressurizes and heats the PCB substrate and connects the plurality of TABs 2 on the source side.

[Temporary crimping unit]
Next, the temporary pressure bonding unit 200 will be described with reference to FIGS. 3 and 4.
FIG. 3 is a plan view of the provisional pressure bonding unit 200. 4A is a plan view showing an ACF sticking portion of the temporary pressure bonding unit 200, and FIG. 4B is a side view of the ACF sticking portion.

  As shown in FIG. 3, the provisional pressure bonding unit 200 includes a TAB supply unit 220, an ACF attachment unit 230, and a mounting unit 280. The TAB supply unit 220 includes a reel 221, a reel feed mechanism 222 that rotates the reel 221, and a punching mechanism 223.

  The TAB 2 mounted on the display substrate 1 is wound around a reel 221 as a long ribbon film. The reel 221 is rotated by a reel feeding mechanism 222 to feed a ribbon-like film at a specified pitch. The punching mechanism 223 punches out the ribbon-like film sent out by the reel 221 and cuts out the TAB 2 individually. The cut out TAB 2 is supplied to the ACF pasting unit 230.

  The ACF attaching unit 230 attaches the ACF 3a of the ACF tape 3 to one side (one long side) of the supplied TAB 2 in the longitudinal direction. As shown in FIG. 4, the ACF sticking unit 230 includes a supply reel 233, a guide roller 234, a pinch roller 235, and a collection reel 236. Further, the ACF sticking unit 230 includes an ACF stage 250, a knife edge 251, a TAB stage 252, a TAB chuck 261, a peeling chuck 266, a cutter blade 270, an upper and lower arm 271, and an elevating unit 272. .

  The ACF tape 3 is formed by applying ACF 3a (20 to 30 μm) on one side of a ribbon-like base film 3b having a thickness of 35 μm, and is wound around a supply reel 233 with the ACF 3a inside.

  The supply reel 233 feeds the ACF tape 3 while controlling the feed length and speed by a feed motor (not shown). Since the feed amount of the ACF tape 3 is affected by the remaining amount of the tape on the supply reel 233, the feed amount of the ACF tape 3 is measured by a guide roller 234 with a hook. Usually, when managing the tape feed amount, a rubber pinch roller is provided on the surface facing the guide roller 234 and pressed so that the tape does not slip. However, in this embodiment, since the ACF 3a having adhesiveness sticks to the pinch roller, the pinch roller is not used.

  The direction of the ACF tape 3 is changed by the guide roller 234 and is sent to a fixed position on the ACF stage 250. The ACF stage 250 is a stainless steel member having a smooth surface, and the surface of the region facing the TAB chuck 261 is subjected to fluororesin processing. As a result, the ACF 3 a that protrudes from the base film 3 b is not fixed to the ACF stage 250.

  The TAB chuck 261 is provided on the arm 260 (see FIG. 3), conveys the TAB 2 by vacuum suction, and presses it against the ACF 3 a of the ACF tape 3 stretched along the ACF stage 250. Here, the TAB chuck 261 is a specific example of the chuck block according to the present invention. The TAB chuck 261 and the ACF stage 250 are an example of a pasting unit according to the present invention.

  A heater is built in a portion of the TAB chuck 261 facing the ACF tape 3 to heat the TAB 2 to, for example, 70 to 90 ° C. In this state, the TAB chuck 261 that has adsorbed the TAB 2 is pushed downward so as to be, for example, a pressure of 2 MPa against the surface of the ACF tape 3. The surface temperature of TAB 2 and the pressure applied to the ACF tape 3 are appropriately set according to the characteristics of the ACF used.

  After the pressurization, the TAB chuck 261 releases the vacuum suction to the atmosphere, and places the TAB 2 on the TAB stage 252. The TAB stage 252 is a belt conveyor having cylindrical drums (not shown) at both ends, and the feed amount and feed speed of the TAB 2 are controlled by the cylindrical drums at both ends.

  The TAB 2 released from the TAB chuck 261 is fed by one pitch by the feed of the TAB stage 252 and the ACF tape 3 fed from the supply reel 233 in synchronization therewith. This one pitch eliminates the waste of the ACF tape 3, securely peels the base film 3b, and prevents the excess ACF 3a from being bent when the TAB 2 is mounted, rather than the longer side of the TAB 2 (side where the ACF 3a is attached). Make it slightly longer. In this example, one pitch is an amount obtained by adding 0.5 mm to the length in the longitudinal direction of TAB2.

  The shorter the length of the ACF tape 3 protruding from the TAB 2, the more stably the base film 3b can be peeled off. However, the half cut described below can be stably performed and cannot be reduced to zero.

  When the TAB 2 is arranged and sent at a predetermined interval (for example, 0.5 mm), the ACF 3 a between the adjacent TABs 2 is cut by the cutter blade 270. Specifically, the elevating unit 272 pushes down the upper and lower arms 271. As a result, the tip of the cutter blade 270 attached to the upper and lower arms 271 moves 20 to 30 μm above the surface of the ACF stage 250, and half-cuts the ACF tape 3. In the half cut, in order to cut the ACF 3a reliably, the cutter blade 270 is held at the bottom dead center position for 0.1 to 0.2 seconds to secure a time for the internal stress of the base film 3b to be creep-released. Thereby, ACF tape 3 will be in the state where ACF3a was cut off and base film 3b maintained continuity.

  Thus, the cutter blade 270, the upper and lower arms 271 and the elevating part 272 are an example of the cutting means according to the present invention.

  In addition, in order to withstand wear, the portion where the ACF stage 250 is subjected to half-cutting is inlaid with high-speed tool steel that has undergone hardening treatment on the surface. This high speed tool steel is adapted to be replaced when worn.

  The TAB 2 sent out by feeding the TAB stage 252 and the ACF tape 3 is sent to the knife edge 251 provided at the end of the ACF stage 250. Then, vacuum suction is performed by the peeling chuck 266. The peeling chuck 266 has a suction pad made of a porous ceramic, not a normal vacuum suction hole, and reliably vacuum-sucks TAB2.

  The peeling chuck 266 adsorbs the TAB 2 and pulls it out to the left in FIG. 4 at a speed synchronized with the feeding speed of the ACF tape 3 immediately before the half cut on the front side in the traveling direction of the TAB 2 reaches the knife edge 251. Thereby, the base film 3b is peeled and the peeling process is completed. At this time, the base film 3b is peeled off from the TAB 2 while being rubbed at the acute angle portion of the knife edge 251, so that the base film 3b can be stably peeled off.

  In particular, in the vicinity of the left end portion (the front end portion in the traveling direction) of TAB 2 that is the starting point of peeling, the ACF 3a is half-cut in advance, and it is easy to obtain a trigger for peeling. Even if the ACFs 3a adjacent to each other with the half-cut adhered again, the ACF 3a on the front side of the half-cut is stretched by the previous peeling in the left direction in FIG. 4, and the thread drawing direction of the base film 3b Separation is likely to occur because it is not in the traveling direction.

  The peeled base film 3b is wound up on a collection reel 236 by being wound up at a specified feed rate by a guide roller 234 with a hook and a pinch roller 235 processed with rubber at a specified feed speed. Here, since the pinch roller 235 winds up the base film 3b from which the ACF 3a has already been peeled off, there is no fear that the ACF 3a adheres to the surface of the pinch roller 235 or the guide roller 234 and becomes dirty.

  Thus, the collection reel 236, the knife edge 251 and the peeling chuck 266 are an example of a peeling unit according to the present invention.

  The peeling chuck 266 is moved by the discharge arm 265 and transfers the TAB 2 to which the ACF 3a is attached to the transfer unit 275 (see FIG. 3). The delivery unit 275 is supported by the X-axis guide 276 so as to be movable. The delivery unit 275 delivers the TAB 2 received from the ACF pasting unit 230 to the mounting unit 280.

Next, the mounting unit 280 will be described.
As shown in FIG. 3, the mounting unit 280 includes a long side mounting unit 280A that mounts TAB2 on the long side of the display substrate 1, and short side mounting units 280B and 280C that mount TAB2 on the short side of the display substrate 1, respectively. It is configured. These long side mounting part 280A and short side mounting parts 280B and 280C receive TAB2 from the delivery part 275.

  The long side mounting portion 280A includes a shuttle chuck 281, a Y-axis guide 282, an X-axis guide 283, a mounting block 285, an X-axis guide 286, and a camera unit 287.

  The shuttle chuck 281 receives TAB2 from the delivery unit 275. The shuttle chuck 281 is movably supported by the Y-axis guide 282. The Y-axis guide 282 is supported by the X-axis guide 283 so as to be movable. Thereby, the shuttle chuck 281 is movable in the horizontal direction. Two shuttle chucks 281 and two Y-axis guides 282 are provided. The two Y-axis guides 282 share the X-axis guide 283.

  The mounting block 285 includes a mounting base 291, a TAB base 292, a mounting head 293, and a delivery head 294. The mounting base 291 is movably supported by the X-axis guide 286 and moves to the TAB mounting position on the long side of the display substrate 1. The TAB base 292, the mounting head 293, and the delivery head 294 are disposed on the mounting base 291.

  The shuttle chuck 281 approaches the mounting base 291 and transfers TAB 2 to the TAB table 292. The delivery head 294 delivers TAB2 on the TAB table 292 to the mounting head 293. The mounting head 293 temporarily presses (mounts) the TAB 2 supplied from the delivery head 294 to the TAB mounting position of the display substrate 1. At this time, prior to the movement of the mounting base 291, the pair of camera units 287 previously waiting below both ends of the mounting position each have a two-field lens, and image the mounting mark on the display substrate 1 and the positioning mark on the TAB 2. Do. The positioning error calculated by the image measurement is transmitted to the mounting head 293, and the mounting head 293 mounts the TAB 2 on the display substrate 1 while adjusting (positioning) the mounting position with the received individual adjustment value.

  Two sets of mounting blocks 285 and camera units 287 of the long side mounting unit 280A are provided corresponding to the shuttle chuck 281. The two mounting bases 291 share the X-axis guide 286.

  The short side mounting portions 280B and 280C have the same configuration as the long side mounting portion 280A. That is, the short side mounting portions 280B and 280C each include a shuttle chuck 281, an X axis guide 296, a Y axis guide 297, a mounting block 285, a Y axis guide 298, and a camera unit (not shown). .

  The shuttle chucks 281 of the short side mounting portions 280B and 280C are movably supported by the X axis guide 296, and the X axis guide 296 is movably supported by the Y axis guide 297. The mounting bases 291 of the short side mounting portions 280B and 280C are movably supported by the Y-axis guide 298 and move to the TAB mounting position on the short side of the display substrate 1.

  When the display substrate 1 is placed on the reference bar 204, the reference marks at both ends are photographed in advance by the camera unit 287 and delivered in a state where rough alignment adjustment is performed. However, in order to avoid the displacement of the mounting position due to the dimensional error of the display substrate 1, the alignment is performed individually even when mounting by the mounting head 293.

  The first embodiment of the FPD module assembling apparatus of the present invention has been described above with reference to FIGS. 1 to 4, but the present invention can be modified as follows by taking advantage of the gist thereof.

2. Second embodiment [ACF sticking apparatus]
Next, a second embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIG.
Fig.5 (a) is a top view of the ACF sticking part which concerns on 2nd Embodiment of the FPD module assembly apparatus of this invention. FIG. 5B is an explanatory diagram showing a state in which the TAB chuck and the ACF stage of the ACF sticking portion have moved while sandwiching the ACF tape.

  The FPD module assembling apparatus according to the second embodiment has the same configuration as the FPD module assembling line 10 (see FIG. 2) of the first embodiment. The second embodiment of the FPD module assembling apparatus is different from the FPD module assembling line 10 in the ACF attaching portion 230A. Therefore, here, the ACF attaching portion 230A will be described, and the description of the configuration common to the FPD module assembly line 10 will be omitted.

  As shown in FIG. 5A and FIG. 5B, the ACF attachment part 230A has the same configuration as the ACF attachment part 230 (see FIG. 4) of the first embodiment. The ACF attaching part 230A is different from the ACF attaching part 230 in the TAB chuck 261A and the ACF stage 250A.

  The TAB chuck 261A and the ACF stage 250A are configured to be movable in the longitudinal direction of the ACF tape 3 (left and right direction in FIG. 5). The ACF stage 250A is shorter than the ACF stage 250 of the first embodiment by a feed amount for one pitch of the ACF tape. Therefore, the ACF stage 250 </ b> A does not interfere with the knife edge 251 even if it moves in the feeding direction of the ACF tape 3.

  The TAB chuck 261A that has adsorbed the TAB 2 is pushed downward so that the surface of the ACF tape 3 is pressurized at, for example, 2 MPa (see FIG. 5A). As a result, the ACF tape 3 and TAB 2 are sandwiched between the TAB chuck 261A and the ACF stage 250A, and the ACF 3a and TAB 2 come into contact with each other.

  Next, the TAB chuck 261A and the ACF stage 250A move by one pitch in the feed direction of the ACF tape 3 (left direction in FIG. 5) in synchronization with the feed of the ACF tape 3 and the TAB stage 252 (FIG. 5 ( b)). Thereby, the feeding operation of the TAB 2 and the ACF tape 3 and the crimping operation of the ACF 3a and the TAB 2 can be performed simultaneously. As a result, the work time until the ACF 3a is attached to the TAB 2 can be shortened. Further, the feed amount of the ACF tape 3 can be stabilized without being affected by the error caused by the elongation of the ACF 3a or TAB 2.

  Further, when the ACF stage 250A moves in the feeding direction of the ACF tape 3, a cut (half cut) is made by the cutter blade 270 in the ACF 3a between the adjacent TABs 2. At this time, the TAB chuck 261A moves to adsorb the TAB 2 to be pressed against the ACF 3a. When the half cut is formed in the ACF 3a, the ACF stage 250A moves to the TAB clamping position (see FIG. 5A).

3. Third embodiment [ACF sticking device]
Next, a third embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIG.
FIG. 6A is a plan view of an ACF attaching portion according to the third embodiment of the FPD module assembling apparatus of the present invention. FIG.6 (b) is a side view of the ACF sticking part which concerns on 3rd Embodiment.

  The third embodiment of the FPD module assembling apparatus has the same configuration as the FPD module assembling line 10 (see FIG. 2) of the first embodiment. The third embodiment of the FPD module assembling apparatus is different from the FPD module assembling line 10 in the ACF attaching portion 230B. Therefore, here, the ACF attaching portion 230B will be described, and the description of the configuration common to the FPD module assembly line 10 will be omitted.

  As shown in FIG. 6A and FIG. 6B, the ACF sticking portion 230B has the same configuration as the ACF sticking portion 230 (see FIG. 4) of the first embodiment. This ACF sticking portion 230B is different from the ACF sticking portion 230 in that two sets of mechanisms relating to feeding of the ACF tape 3 and recovery of the base film 3b are prepared and arranged on both sides of the TAB stage 252.

  According to the ACF attaching part 230B configured as described above, the ACF 3a can be attached to both the terminal on the display substrate 1 side of the TAB 2 and the terminal on the PCB substrate side. This eliminates the need to attach the ACF to the PCB substrate side. As a result, it is not necessary to provide the ACF sticking device 440 in the PCB connection unit 400 (see FIG. 2). Moreover, since the ACF 3a is attached by the ACF attaching portion 230B at a time, the apparatus cost can be further reduced.

  As shown in FIG. 1, the PCB 6 may not be connected to the TAB 2 mounted on the short side of the display substrate 1. In that case, the ACF 3a is pasted to the TAB 2 mounted on the short side by the ACF pasting portion 230 of the first embodiment or the ACF pasting portion 230A of the second embodiment.

  In the first to third embodiments described above, the base film 3b can be easily peeled by making the knife edge 251 an acute edge. However, as the ACF sticking part according to the present invention, the base film 3b can be easily peeled by applying ultrasonic vibration to the knife edge 251. This mechanism can also be applied to a knife edge 251 having an acute edge. In order to start the peeling of the base film 3b more effectively, the knife edge 251 may be vibrated in a direction perpendicular to the bonding surface of the ACF 3a.

  In addition, when carelessly strong ultrasonic vibration is applied to the knife edge 251, the ACF 3a itself may be heated and softened to cause cracks or damage to the base film 3b. Therefore, it is necessary to adjust the vibration applied to the knife edge 251 to an appropriate power according to the ACF tape 3 and TAB 2 to be used.

  In order to avoid the influence on the ACF tape 3 and the TAB 2, it is preferable to stop the ultrasonic vibration when the peeling is started. By applying an appropriate ultrasonic vibration to the knife edge 251, it is possible to smoothly start peeling at the edge of the TAB 2, reducing the problem of peeling the ACF 3 a together when the base film 3 b is peeled off. can do.

  Further, the TAB chuck 261A and the ACF stage 250A related to the ACF sticking portion 230A of the second embodiment described above can also be applied as a TAB chuck and an ACF stage according to the third embodiment. That is, the ACF sticking portion according to the present invention has two sets of mechanisms relating to feeding of the ACF tape 3 and recovery of the base film 3b, and the TAB chuck and the two sets of ACF stages move in the feeding direction of the ACF tape 3. A possible configuration may be used.

4). 4th Embodiment [ACF sticking apparatus]
Next, a fourth embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIGS.
FIG. 7 is a side view of an ACF attaching part according to the fourth embodiment of the FPD module assembling apparatus of the present invention. Fig.8 (a) is the top view to which the notch part in the guide block of the ACF sticking part which concerns on 4th Embodiment was expanded. FIG.8 (b) is sectional drawing which follows the AA line of Fig.8 (a).

  The fourth embodiment of the FPD module assembly apparatus has the same configuration as the FPD module assembly line 10 (see FIG. 2) of the first embodiment. The fourth embodiment of the FPD module assembling apparatus is different from the FPD module assembling line 10 in the ACF attaching part 630. Therefore, here, the ACF attaching part 630 will be described, and the description of the configuration common to the FPD module assembly line 10 will be omitted.

  As shown in FIG. 7, the ACF sticking unit 630 according to the fourth embodiment sticks the ACF 3a (see FIG. 8) of the ACF tape 3 to both sides (two long sides) in the longitudinal direction of the supplied TAB 2. . The ACF sticking unit 630 includes a supply reel 631, a delivery drive roller 632, guide rollers 633 A to 633 D, tension rollers 634 A and 634 B, a pinch roller 635, a capstan roller 636, and a folding roller 637. Yes.

  The ACF attaching part 630 includes a guide block 650, a TAB chuck 651, a pressure-bonding block 652, a pressure-bonding block driving part 653, a first cutter blade 654A, a second cutter blade 654B, and a hollow arm 655. And a peeling chuck 656. Further, the ACF pasting unit 630 includes a position detecting unit 661, a pasting detecting unit 662, a moving chuck 663, a fixed chuck 664, and a collecting unit 665.

  The TAB chuck 651 is a specific example of a chuck block according to the present invention. The TAB chuck 651, the guide block 650, and the crimping block 652 are an example of a pasting unit according to the present invention. Further, the cutter blades 654A and 654B and an elevating unit (not shown) for operating the cutter blades 654A and 654 are an example of a cutting means according to the present invention. Further, the moving chuck 663, the folding roller 637, and the peeling chuck 656 are an example of a peeling unit according to the present invention.

  The guide block 650 is a stainless steel member having a smooth surface, and the surface facing the TAB chuck 651 is subjected to fluororesin processing. As a result, the ACF 3 a that protrudes from the base film 3 b is not fixed to the guide block 650. The guide block 650 supports the TAB 2 placed on the ACF tape 3 and the ACF 3a of the ACF tape 3 so as to be movable. The guide block 650 is provided with a notch 650 a for avoiding interference with the crimping block 652.

  The crimping block 652 is driven by the crimping block driving unit 653. As a result, the crimping block 652 moves in the notch 650a of the guide block 650 by one pitch in the feeding direction of the ACF tape 3 or in the direction opposite to the feeding direction. The crimping block 652 has a crimping blade 671 and a lower support 672 for temporarily crimping the TAB2 and the ACF tape 3 therebetween.

  The crimping blade 671 and the lower support 672 of the crimping block 652, the peeling chuck 656, and the moving chuck 663 are connected by a belt 675 and are driven in synchronization. The means for synchronizing the crimping blade 671, the peeling chuck 656, the moving chuck 663 and the like is not limited to the belt, and for example, each member that operates the members such as the crimping blade 671, the peeling chuck 656, and the moving chuck 663. A method of driving the servo motors synchronously may be used.

  As shown in FIG. 8A, a plurality of wires 676 are attached to the notch 650 a of the guide block 650. These wires 676 support TAB2 from below. When the ACF tape 3 is attached to the COF from which the IC chip 5 protrudes on the lower surface side, it is necessary to hang the wire 676 at a position that does not interfere with the IC chip 5 (see FIG. 8B).

  The lower support 672 of the present embodiment includes a first lower support 672A and a second lower support 672B that face each other in a direction substantially orthogonal to the ACF tape feed direction. The first base material 672A supports one ACF tape 3, and the second base material 672B supports the other ACF tape 3.

  The lower receiving members 672A and 672B are movable in a direction substantially orthogonal to the feeding direction of the ACF tape 3. As a result, even if the application position of the ACF tape 3 changes depending on the type of TAB, the lower receiving materials 672A and 672B can be arranged at the application position, and therefore, a common support for a plurality of types of TABs. 672 can be used.

Next, the operation of the ACF pasting unit 630 will be described with reference to FIG.
The direction of the ACF tape 3 is changed by the guide rollers 633A and 633B and the tension roller 634A, and is disposed at a fixed position on the guide block 650. The TAB chuck 651 conveys the TAB 2 by vacuum suction and places it on the ACF 3 a of the ACF tape 3 stretched along the guide block 650.

  At this time, the crimping blade 671 of the crimping block 652 is lowered by an elevating mechanism (not shown), and the TAB 2 and the ACF tape 3 are sandwiched between the presser block 672 and the lower support 672, and is pressurized at 2 MPa, for example. In addition, a heater is built in a portion of the crimping blade 671 and the lower support 672 facing the ACF tape 3, and the TAB 2 and the ACF tape 3 are heated at, for example, 70 to 90 ° C. The heating temperature and the applied pressure are appropriately set according to the characteristics of the ACF used.

  On the other hand, the cutter blades 654A and 654B are lowered by an elevating mechanism (not shown), and a cut is made in the ACF 3a between adjacent TABs 2. Specifically, the tips of the cutter blades 654A and 654B move to 20 to 30 μm above the surface of the guide block 650, and half-cut the ACF tape 3. As a result, the ACF tape 3 is in a state in which the ACF 3a is cut off and the base film 3b is kept continuous.

  In the case where a cut is made in the ACF 3a between the adjacent TABs 2, the position detection unit 661 captures the opposite ends of the adjacent TABs 2 and detects the position of the TAB 2. Based on the detected position of TAB2, the angle of the cutter blades 654A and 654B around the vertical axis and the position in the feed direction are adjusted. Note that the angle and position of the second cutter blade 654B are adjusted based on the previous detection result, not the current detection result.

  The portion of the guide block 650 where the half cut is performed is inlaid with a hardened high-speed tool steel on the surface in order to withstand abrasion. This high speed tool steel is adapted to be replaced when worn. Further, the hollow arm 655 descends together with the second cutter blade 654B, and the excess ACF 3a between the two half cuts between the adjacent TABs 2 is attached to the adhesive tape and removed.

  Further, the peeling chuck 656 is lowered by an elevating mechanism (not shown) in synchronization with the lowering operation of the crimping blade 671, and vacuum-sucks the TAB 2 reaching the folding roller 637. In synchronization with the downward movement of the crimping blade 671, the moving chuck 663 sandwiches the base film 3b of the ACF tape 3, and the fixed chuck 664 opens the base film 3b of the ACF tape 3.

  Next, the crimping block 652 is driven by the crimping block driving unit 653 with the TAB 2 and the ACF tape 3 sandwiched therebetween, and moves in the feeding direction of the ACF tape 3. Thereby, the TAB 2 and the ACF tape 3 are fed by one pitch in the feeding direction, and the tension roller 634A at the reference position is raised.

  One pitch, which is the amount of feed, is slightly longer than the long side of TAB 2 (side where ACF 3 a is pasted). In this example, one pitch is a length obtained by adding 0.5 mm to the length in the longitudinal direction of TAB2. Thereby, waste of the ACF tape 3 can be omitted, the base film 3b can be surely peeled off, and the excess ACF 3a can be prevented from being bent when the TAB 2 is mounted.

  On the other hand, the peeling chuck 656 moves in the same feeding direction as the pressure bonding blade 671 by a moving mechanism (not shown) in synchronization with the horizontal movement operation of the pressure bonding blade 671, and peels the base film 3b from the TAB2. At this time, since the base film 3b is peeled off while being squeezed by the folding roller 637, the base film 3b can be stably peeled off. Further, the sticking detection unit 662 images the lower surface of the TAB 2 adsorbed by the peeling chuck 656, and detects whether or not the ACF 3a is stuck.

  The moving chuck 663 sandwiching the base film 3b of the ACF tape 3 is lowered by an elevating mechanism (not shown) in synchronization with the horizontal movement operation of the crimping blade 671. As a result, the tension roller 634B at the reference position is lowered.

  Thereafter, the fixed chuck 664 sandwiches the base film 3b of the ACF tape 3, and the moving chuck 663 opens the base film 3b. Subsequently, the capstan roller 636 rotates to send the excess base film 3b to the collection unit 665. The capstan roller 636 is rotationally controlled based on the lowered position of the tension roller 634B, and feeds the base film 3b until the tension roller 634B returns to the reference position.

  On the other hand, the feed drive roller 632 is controlled to rotate based on the raised position of the tension roller 634A, and feeds the ACF tape 3 by rotating the supply reel 631 until the tension roller 634A returns to the reference position. Further, the peeling chuck 656 is moved by the discharge arm 265, and transfers the TAB 2 with the ACF 3a attached thereto to the transfer unit 275 (see FIG. 3).

  Next, the pressure-bonding block 652 opens the TAB 2 and the ACF tape 3 and is driven by the pressure-bonding block driving unit 653 to move in a direction opposite to the feeding direction of the ACF tape 3. At the timing of the horizontal movement operation of the crimping blade 671 in the crimping block 652, the peeling chuck 656 is moved in the same direction as the crimping blade 671 by a moving mechanism (not shown) and is positioned above TAB2 reaching the folding roller 637. . As a result, the operation of the ACF attaching unit 630 is completed, and the TAB 2 is placed on the ACF 3a by the TAB chuck 651.

  According to the ACF attaching part 630, the ACF tape 3 is sandwiched between the crimping block 652 and the moving chuck 663 and moved by one pitch. At this time, the pressure-bonding block 652 moves the ACF tape 3 while heat-pressing the TAB 2 and the ACF 3a. Thereby, the feeding operation of the TAB 2 and the ACF tape 3 and the crimping operation of the ACF 3a and the TAB 2 can be performed simultaneously. As a result, the work time until the ACF 3a is attached to the TAB 2 can be shortened.

  Further, since the ACF tape 3 is sandwiched by the crimping block 652 and the moving chuck 663 and moved by one pitch, the supply reel 631 (feeding drive roller 632) and the capstan roller 636 are always constant even if they are not controlled with high precision. Can be obtained.

5. Fifth embodiment [ACF sticking device]
Next, a fifth embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIG.
FIG. 9 is a side view of the ACF attaching part according to the fifth embodiment of the FPD module assembling apparatus of the present invention.

  The FPD module assembly apparatus according to the fifth embodiment has the same configuration as that of the FPD module assembly line 10 (see FIG. 2) according to the first embodiment. The fifth embodiment of the FPD module assembling apparatus is different from the FPD module assembling line 10 in an ACF attaching portion 730. Therefore, here, the ACF attaching part 730 will be described, and the description of the configuration common to the FPD module assembly line 10 will be omitted.

  Moreover, the ACF sticking part 730 has the same configuration as the ACF sticking part 630 according to the fourth embodiment. The ACF sticking part 730 is different from the ACF sticking part 630 in a crimping block 752. Therefore, here, the crimping block 752 will be described, and the description of the configuration common to the ACF attaching part 630 will be omitted.

  As shown in FIG. 9, the guide block 650 of the ACF attaching part 730 is provided with a notch part 750 for avoiding interference with the crimping block 752. The crimping block 752 is driven by a crimping block driving unit (not shown). As a result, the crimping block 752 moves in the notch 650a of the guide block 650 by one pitch in the feeding direction of the ACF tape 3 or in the direction opposite to the feeding direction.

  The pressure-bonding block 752 includes a first pressure-bonding part 753 and a second pressure-bonding part 754 that are arranged side by side in the feeding direction of the ACF tape 3. The first crimping portion 753 is disposed on the TAB chuck 651 side, and has a crimping blade 671A and a lower support 672A for temporarily crimping the TAB2 and the ACF tape 3 therebetween. The second crimping portion 754 is disposed on the first cutter blade 654A side, and includes a crimping blade 671B and a lower support 672B that temporarily press-bond the TAB2 and the ACF tape 3 therebetween. The crimping blades 671 and 672 of these crimping portions 753 and 754 are driven in synchronization with the peeling chuck 656 and the moving chuck 663.

  According to the ACF attaching part 730, the ACF tape 3 is sandwiched between the pressure-bonding block 752 and the moving chuck 663 and moved by one pitch. Then, thermocompression bonding is performed twice on one TAB 2 and the ACF 3 a attached to the TAB 2 by the crimping portions 753 and 754. Therefore, the crimping time in each crimping part 753, 754 can be shortened, and the work time until the ACF 3a is pasted on TAB 2 can be shortened as compared with the ACF pasting part 630 of the fourth embodiment.

  In this embodiment, the crimping operation is divided into two parts. However, as the ACF attaching portion according to the present invention, the crimping operation is performed in consideration of the balance between other operations (cutting operation, peeling operation, etc.) and the crimping time. It can also be divided into three or more.

  According to the first to fifth embodiments described above, the ACF 3a is attached to the TAB 2 (electronic component), and then the outer side of the ACF 3a of the ACF tape 3 near the outer edge of the TAB 2 is cut (half cut). As a result, an error is less likely to occur in the length of the cut ACF 3a, so that the ACF can be attached stably. Furthermore, by disposing the TAB 2 close to the ACF 3a of the ACF tape 3, the ACF 3a can be used without waste.

  According to the first to fifth embodiments described above, the mounting operation of the TAB 2 to which the ACF 3a is attached is performed simultaneously on the three sides (one long side and both short sides) of the display substrate 1. Further, the TAB 2 mounted on the three sides of the display substrate 1 is simultaneously pressed. Therefore, the number of units can be reduced, and downsizing of the apparatus can be realized.

  In the first to fifth embodiments described above, the mounting operation of the TAB 2 to which the ACF 3 a is attached is performed simultaneously on the three sides of the display substrate 1. However, some PDF modules connect a TAB 2 (electronic component) to one long side and one short side. Therefore, the mounting unit according to the present invention may be configured to perform the TAB 2 mounting operation on at least two sides of the display substrate. Similarly, the main pressure bonding unit according to the present invention may be configured to simultaneously perform the pressure bonding operation of the TAB 2 mounted on at least two sides of the display substrate 1.

  The embodiment of the FPD module assembling apparatus according to the present invention has been described above including the effects thereof. However, the FPD module assembling apparatus of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention described in the claims.

  DESCRIPTION OF SYMBOLS 1 ... Display board, 2 ... TAB (electronic component), 3 ... ACF tape, 3a ... ACF, 3b ... Base film, 4 ... FPC (Flexible Printed Circuit), 5 ... IC chip, 6 ... PCB (Printed Circuit Board), 7 ... FPD (Flat Panel Display) module, 10 ... FPD module assembly line (FPD module assembly device), 100 ... receiving unit, 200 ... temporary crimping unit, 220 ... TAB supply unit, 230, 230A, 230B, 630, 730 ... ACF sticking part, 233 ... supply reel, 234 ... guide roller, 235 ... pinch roller, 236 ... collection reel, 250,250A ... ACF stage, 251 ... knife edge, 252 ... TAB stage, 260 ... arm, 261,261A ... TAB chuck, 266 ... peeling chuck 270 ... Cutter blade 271 ... Upper / lower arm 272 ... Elevating part 275 ... Transfer part 276 ... X-axis guide 280A ... Long side mounting part 280B, 280C ... Short side mounting part 281 ... Shuttle chuck, 282 ... Y-axis guide, 283 ... X-axis guide, 285 ... Mounting block, 286 ... X-axis guide, 287 ... Camera unit, 291 ... Mounting base, 292 ... TAB base, 293 ... Mounting head, 294 ... Delivery head, 296 ... X-axis Guide, 297 ... Y-axis guide, 298 ... Y-axis guide, 300 ... Main crimping unit, 320A, 320B, 320C ... Main crimping part, 400 ... PCB connection unit, 430 ... PCB supply device, 440 ... ACF sticking device, 450 ... Transfer device, 460 ... main crimping part, 500 ... unloading unit

Claims (8)

An affixing means for affixing an electronic component to the ACF of an ACF tape comprising a base film and an ACF, a notch means for incising the ACF to which the electronic component is affixed, and an ACF tape having an incision in the ACF A peeling means for peeling the base film;
A mounting unit having a plurality of mounting heads and simultaneously mounting an electronic component having the ACF attached to at least two sides of the display substrate;
FPD module assembly apparatus comprising: An ACF attaching part for attaching ACF to an electronic component; and a provisional pressure bonding unit provided with a mounting part for mounting the electronic component attached with the ACF on a peripheral portion of a display substrate;
A pressure bonding unit having a plurality of main pressure bonding portions and simultaneously performing a pressure bonding operation of an electronic component mounted along at least two sides of the display substrate;
The ACF sticking portion includes a sticking means for sticking an electronic component to the ACF of an ACF tape made of a base film and an ACF, a cutting means for making a cut in the ACF to which the electronic component is attached, and a cut in the ACF. An FPD module assembling apparatus, comprising: a peeling unit that peels off the base film of the ACF tape put therein. The sticking means of the ACF sticking portion includes a chuck block that presses the electronic component against the ACF, and a tape support portion that supports the ACF tape,
The FPD module assembling apparatus according to claim 1, wherein the chuck block and the tape support part attach an electronic component to the ACF with the electronic component and the ACF tape interposed therebetween. The FPD module assembling apparatus according to claim 3, wherein the chuck block and the tape support part move in a feeding direction of the ACF tape while sandwiching the electronic component and the ACF tape. The affixing means of the ACF affixing unit affixes one side of the electronic component to the ACF of the first ACF tape and affixes the other side opposite to the one side of the electronic component to the ACF of the second ACF tape. The assembly apparatus of the FPD module in any one of Claims 1-4. The FPD module assembly apparatus according to claim 1, further comprising a PCB connection unit that connects a PCB to a part of the electronic component connected to the display substrate. The ACF sticking part is
A crimping block that moves in the feeding direction of the ACF tape in a state of sandwiching the electronic component and the ACF tape;
A moving chuck that sandwiches the base film from which the ACF has been peeled and moves in the feeding direction of the ACF tape;
The FPD module assembling apparatus according to claim 1, further comprising: a synchronization unit that synchronizes operations of the crimping block, the moving chuck, the cutting unit, and the peeling unit. The crimp block is
A first pressure-bonding portion that pressurizes the electronic component and the ACF tape, and a second pressure-bonding portion that pressurizes the electronic component and the ACF tape that have been pressed by the first pressure-bonding portion. The apparatus for assembling an FPD module according to claim 7.

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