JPH06164115A - Method for transfering anisotropically conductive adhesive - Google Patents

Abstract

PURPOSE:To transfer an anisotropically conductive adhesive which has high uniformity of film thickness to a predetermined position by thermocompression bonding. CONSTITUTION:A carrier tape 3 moves intermittently in arrow-X direction. An extremely narrow base tape 4 to whose lower surface an anisotropically conductive adhesive 5 is continuously applied moves intermittently in arrow-Y direction. Then, in the crossing part of those tapes 3 and 4, the anisotropically conductive adhesive 5 applied to on the lower surface of the tape 4 is transferred to the upper surface of the carrier tape 3. At this time, a front end 5a and a rear end 5b of the anisotropically conductive adhesive 5 are separated from the anisotropically conductive adhesive 5 easily by stripper film 6 provided on the lower surface. Accordingly, even if the base tape 4 to whose lower surface the anisotropically conductive adhesive 5 is continuously applied is used, transfer of the anisotropically conductive adhesive 5 to the base tape 4 can be attained by solid coating using a roll coater without any problem.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for transferring an anisotropic conductive adhesive.

[0002]

2. Description of the Related Art For example, when a liquid crystal display panel and a carrier tape having an IC chip for driving the liquid crystal display panel are electrically connected, a carrier tape is provided on an upper surface of a connection portion including connection terminals of the liquid crystal display panel. Anisotropic conductive adhesive composed of a binder and conductive particles provided in advance on the connection portion including the connection terminal of,
The connection terminals of the liquid crystal display panel and the connection terminals of the carrier tape are conductively connected through the conductive particles in the anisotropic conductive adhesive by thermocompression bonding, and the connection terminals including the connection terminals of the liquid crystal display panel are also connected. The part and the connection part including the connection terminal of the carrier tape may be bonded to each other via a binder in an anisotropic conductive adhesive. In this case, it is inefficient to provide one anisotropic conductive adhesive on each connection part including the connection terminal of each carrier tape.

Therefore, conventionally, an anisotropic conductive adhesive transfer device as shown in FIG. 6 is used. In this anisotropic conductive adhesive transfer device, the thermocompression bonding head 2 is provided above the table 1.
Is provided so as to be movable up and down, the long carrier tape 3 runs intermittently in the direction of the arrow along the upper surface of the table 1, and the long base tape 10 immediately above the carrier tape 3 serves as the carrier tape 3. It is designed to run intermittently in the same direction in synchronization with running. IC chips (not shown) are mounted on the upper surface of the carrier tape 3 at equal intervals. Base tape 1 with almost the same width as carrier tape 3
Anisotropic conductive adhesive 11 is provided on the lower surface of 0 at equal intervals. The anisotropic conductive adhesive 11 is the base tape 10
Has a strip shape that is long in the width direction and short in the long direction of the base tape 10. Here, the anisotropic conductive adhesive 11 is provided on the lower surface of the base tape 10 by screen printing. Both the carrier tape 3 and the base tape 10 can be continuously processed by reel-to-reel.

Then, the carrier tape 3 and the base tape 10 synchronously run intermittently in the direction of the arrow,
At the time of the stop, the thermocompression bonding head 2 descends and its thermocompression bonding surface 2
When a predetermined portion of the base tape 10 is pressed against the upper surface of the table 1 via a predetermined portion of the carrier tape 3 by a, the anisotropic conductive adhesive 11 provided on the lower surface of the base tape 10 at the pressed portion. Is transferred to a predetermined position on the upper surface of the carrier tape 3 by thermocompression bonding. After that, when the long carrier tape 3 is appropriately cut, a strip-shaped anisotropic conductive adhesive 11 is preliminarily provided on the connection portion including the connection terminal of each cut carrier tape 3 efficiently. Obtainable.

[0005]

However, in the conventional method for transferring the anisotropic conductive adhesive, the anisotropic conductive adhesive 11 is screen-printed to form the base tape 10.
Are provided at equal intervals on the lower surface of the printed circuit board, but in the case of screen printing, the end portion of the printed anisotropic conductive adhesive 11 becomes thicker than the central portion in comparison with solid coating by a roll coater, for example. Easy and therefore anisotropic conductive adhesive 11
Of the anisotropic conductive adhesive 11 is too thick, the binder constituting the anisotropic conductive adhesive 11 becomes thick, and in the subsequent thermocompression bonding step, the anisotropic conductive adhesive 11 It becomes difficult to electrically connect the connection terminals of the liquid crystal display panel and the connection terminals of the carrier tape by the conductive particles constituting the above, and the adhesive force of the anisotropic conductive adhesive 11 decreases at a too thin portion. However, there was a problem that connection failure occurred. An object of the present invention is to provide a transfer method for transferring an anisotropic conductive adhesive having good film thickness uniformity.

[0006]

SUMMARY OF THE INVENTION According to the present invention, an anisotropic conductive adhesive is formed on a lower surface of an elongated carrier tape having IC chips mounted at equal intervals by intermittently traveling in the X direction in the longitudinal direction. Are continuously provided, and a plurality of stripper films are arranged on the lower surface of the anisotropic conductive adhesive at regular intervals in the longitudinal direction. A base located between a plurality of stripper films at the intersection of the carrier tape and the base tape when the carrier tape and the base tape both stop running intermittently in the Y direction orthogonal to the X direction in synchronization with the running. The anisotropic conductive adhesive provided on the lower surface of the tape is transferred to the upper surface of the carrier tape by thermocompression bonding.

[0007]

According to the present invention, even if the shape of the anisotropic conductive adhesive to be transferred is a strip shape, the anisotropic conductive adhesive corresponding to the short sides of the strip shape is narrow, It becomes easier to separate it from the anisotropic conductive adhesive that is continuous with this, and by disposing a stripper film on the lower surface, the anisotropic conductive adhesive on the upper and lower parts of the portion where the stripper film is arranged on the lower surface, respectively. The pressure is sandwiched between the base tape and the stripper film, and this reduces the thickness of the anisotropic conductive adhesive in the area where the stripper film is placed on the lower surface, so that the anisotropic conductivity at the front and rear ends of the strip shape is reduced. Can be separated more easily between the conductive adhesive and the two anisotropically conductive adhesives in the portion where the stripper film is provided on the lower surface adjacent to each of them, and also in the long side direction of the strip shape. To both ends interposed and the base tape and the stripper film, thereby possible to suppress the anisotropic conductive adhesive extends indefinite long side, it can be transferred at a constant shape at a predetermined position.

As described above, since there is no problem even if the anisotropic conductive adhesive is continuously provided on the lower surface of the base tape, it is possible to roll the anisotropic conductive adhesive on the base tape. It can be performed by solid coating using a coater or the like, and the film thickness uniformity of the anisotropic conductive adhesive can be improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1, 2 and 3 show the essential parts of an anisotropic conductive adhesive transfer device to which an embodiment of the present invention is applied.

In this anisotropic conductive adhesive transfer device, a thermocompression bonding head 2 is provided above the table 1 so as to be vertically movable, and below the thermocompression bonding head 2 along the upper surface of the table 1 in the longitudinal direction. A long carrier tape 3 which is intermittently run in the arrow X direction is arranged. Carrier tape 3
Consists of resin tape such as polyimide or polyester,
Further, as shown in FIG. 2, the IC chips 9 are mounted in two rows in the arrow X direction at equal intervals. The dashed-dotted line in FIG. 2 indicates a punching line when the long carrier tape 3 is punched into each carrier tape 3 in a post process.

Above the carrier tape 3, there is arranged a long base tape 4 which is synchronized with the running of the carrier tape 3 and runs in the arrow Y direction which is orthogonal to the arrow X direction. The base tape 4 is made of a resin tape such as polyether sulfone which is considerably narrower than the carrier tape 3, and an anisotropic conductive adhesive 5 which is narrower than the base tape 4 is continuously provided on the lower surface thereof. Base tape 4
A plurality of stripper films 6 having the same width and a short length are provided on the lower surface between the portion corresponding to one transfer of the anisotropic conductive adhesive 5 and the portion corresponding to the next one transfer. They are arranged at equal intervals in the scale direction. Carrier tape 3
Both the base tape 4 and the base tape 4 can be continuously processed by reel-to-reel. Further, the carrier tape 3 and the base tape 4 which have passed over the table 1 can be changed in their running directions downward by the guide rollers 7 and 8, respectively.

The carrier tape 3 and the base tape 4 are intermittently run in the directions of the arrow X and the arrow Y, respectively, in synchronization with each other, and the stripper film 6 disposed on the lower surface of the anisotropic conductive adhesive 5 has a different shape. The one-side conductive adhesive 5 is stopped so as to be placed at a predetermined position with a portion corresponding to one transfer. When the thermocompression bonding head 2 descends at the time of stop, the thermocompression bonding surface 2a of the thermocompression bonding head 2 as shown in FIG.
The base tape 4 is fixed to the carrier tape 3
Is pressed against the upper surface of the table 1 through a predetermined position. When the thermocompression bonding head 2 is lifted after the thermocompression bonding is completed, as shown in FIG.
As shown in FIG. 4, the base tape 4 elastically returns to a predetermined running position, and the anisotropic conductive adhesive 5 interposed between the stripper films 6 at the front and rear is transferred to a predetermined position on the upper surface of the carrier tape 3. . In this case, since the carrier tape 3 and the base tape 4 are orthogonal to each other, the anisotropic conductive adhesive 5 provided on the lower surface of the base tape 4 at these intersections is transferred to the upper surface of the carrier tape 3.
After that, when the long carrier tape 3 is punched out along the punching line of the one-dot chain line shown in FIG. 2, the anisotropic conductive adhesive 5 is preliminarily formed on the connection portion including the connection terminal of each punched carrier tape 3. The provided one can be obtained efficiently.

Here, the shape of the anisotropic conductive adhesive 5 corresponding to one transfer is a strip shape, and the front end portion 5a of the anisotropic conductive adhesive 5 corresponding to the short side of this strip shape and the The rear end portion 5b is considerably narrow, so that the anisotropic conductive adhesive 5 is easily separated at the front end portion 5a and the rear end portion 5b, and further, the stripper film is formed on the lower surface of the anisotropic conductive adhesive 5. Since the base tape 4 and the stripper film 6 sandwich the upper and lower portions of the portion where the 6 is disposed, the thickness of the anisotropic conductive adhesive 5 in this portion becomes thin,
It becomes easier to separate. In addition, strip-shaped long sides of the anisotropic conductive adhesive 5 in which two stripper films 6 at the front and rear, which are fixed by the pressure between the thermocompression bonding surface 2a of the thermocompression bonding head 2 and the carrier tape 3, are interposed between them It is possible to suppress the extension in the direction and transfer it to a predetermined position with a constant shape.

As described above, even if the lower surface of the base tape 4 on which the anisotropic conductive adhesive 5 is continuously provided is used, there is no problem. Therefore, the anisotropic conductive adhesive 5 on the base tape 4 is used. Can be formed by solid coating using a roll coater or the like, and therefore, the uniformity of the film thickness of the anisotropic conductive adhesive 5 can be improved as compared with the case of screen printing.

In the above embodiment, in order to transfer the anisotropic conductive adhesive 5 for each IC chip mounted on the carrier tape 3 at equal intervals, the stripper film 6 is transferred for each transfer. The case where the anisotropic conductive adhesive 5 is arranged and used at two positions before and after is described, but the present invention is not limited to this. For example, the anisotropic conductive adhesive 5 can be transferred to predetermined two positions by providing the stripper film 6 at three positions for one transfer.

[0016]

As described above, according to the present invention, the base tape is made orthogonal to the carrier tape and is provided on the lower surface of the base tape located between the plurality of stripper films at these intersections. Since the conductive adhesive is transferred to the upper surface of the carrier tape by thermocompression bonding, even if the transferred anisotropic conductive adhesive has a strip shape, the anisotropic conductive material corresponding to the short side of the strip shape is used. Since the elastic adhesive is narrow, it is easy to separate it from the anisotropic conductive adhesive that is continuous with it, and the base tape is placed above and below the portion where the stripper film is arranged on the lower surface of the anisotropic conductive adhesive. Since the pressure is sandwiched between the stripper film and the stripper film, the film thickness of the anisotropic conductive adhesive in the portion where the stripper film is arranged on the lower surface becomes thin, which allows the front end of the anisotropic conductive adhesive. Further, it is possible to more easily separate the rear end portion and the two anisotropic conductive adhesives in the portion where the stripper film is provided on the lower surface adjacent thereto, and the thermocompression bonding of the thermocompression bonding head is performed. The stripper films at the two front and rear positions, which are fixed by the clamping force between the surface and the carrier tape, can prevent the anisotropic conductive adhesive interposed between them from extending in the long side direction of the strip shape, and can be transferred to a predetermined position at a certain shape. it can. As a result, in the subsequent thermocompression bonding process, the problem that the connection between the lead of the liquid crystal display panel and the electrode of the IC chip is not caused does not occur. Therefore, there is no problem in using an anisotropic conductive adhesive continuously provided on the lower surface of the base tape.Therefore, use a roll coater or the like to form the anisotropic conductive adhesive on the base tape. It is possible to improve the uniformity of the film thickness of the anisotropically conductive adhesive agent.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part of an anisotropic conductive adhesive transfer device to which an embodiment of the present invention is applied.

FIG. 2 is a plan view seen from above in FIG.

3 is a sectional view taken along the line AA of FIG.

FIG. 4 is a sectional view similar to FIG. 3, showing a state in which the thermocompression bonding head is lowered in this anisotropic conductive adhesive transfer device.

FIG. 5 is a sectional view similar to FIG. 3, showing a state in which the thermocompression bonding head is raised at the end of thermocompression bonding in this anisotropic conductive adhesive transfer device.

FIG. 6 is a perspective view of a part of a conventional anisotropic conductive adhesive transfer device.

[Explanation of symbols]

 2 Thermocompression bonding head 3 Carrier tape 4 Base tape 5 Anisotropic conductive adhesive 6 Stripper film

Claims (1)

[Claims] 1. A long carrier tape on which IC chips are mounted at equal intervals is intermittently run in the long direction in the X direction, and an anisotropic conductive adhesive is continuously provided on the lower surface. The lengthwise direction of a long base tape having a plurality of stripper films arranged on the lower surface of the anisotropic conductive adhesive at regular intervals in the lengthwise direction is synchronized with the running of the carrier tape on the upper side of the carrier tape. When the carrier tape and the base tape are stopped by traveling intermittently in the Y direction orthogonal to the X direction, the carrier tape and the base tape are located between the plurality of stripper films at the intersections of the carrier tape and the base tape. An anisotropic conductive adhesive, wherein the anisotropic conductive adhesive provided on the lower surface of the base tape is transferred to the upper surface of the carrier tape by thermocompression bonding. Transfer method.