CN104152075A - Adhesive material band and crimping method therefor - Google Patents

Adhesive material band and crimping method therefor Download PDF

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Publication number
CN104152075A
CN104152075A CN201410378540.3A CN201410378540A CN104152075A CN 104152075 A CN104152075 A CN 104152075A CN 201410378540 A CN201410378540 A CN 201410378540A CN 104152075 A CN104152075 A CN 104152075A
Authority
CN
China
Prior art keywords
adhesive material
material tape
adhesive
caking agent
spool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410378540.3A
Other languages
Chinese (zh)
Other versions
CN104152075B (en
Inventor
福岛直树
立泽贵
福富隆广
小林宏治
柳川俊之
汤佐正己
有福征宏
后藤泰史
塚越功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN104152075A publication Critical patent/CN104152075A/en
Publication of CN104152075B publication Critical patent/CN104152075B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Abstract

The invention relates to an adhesive material band and a crimping method therefor. The adhesive material band is an adhesive belt on which an adhesive agent is coated and is rolled into a shaft shape. The adhesive material band is characterized in that pluralities of adhesive agent bars are arranged in the width direction of the band. According to the adhesive material band and the crimping method, an terminal end part of the adhesive material band where the adhesive agents are used up and a starting end part of a newly installed adhesive material band are bonded, and the adhesive material reel can be changed. Thus, each time a new adhesive material band is changed, operation of changing the rolling shaft and installing the starting end of the adhesive material band on the rolling shaft is not needed. Thus new adhesive material band change time can be saved, and electronic machine production efficiency can be improved.

Description

Adhesive material tape and compression bonding method thereof
The application submits on July 30th, 2003, application number is 03818084.7, and name is called < < adhesive material tape and attaching method thereof, manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, uses their compression bonding method of caking agent and dividing an application of the patent application of anisotropic conductive material band > >.
Technical field
The present invention relates to a kind of by electronic devices and components and circuit card, or when being adhesively fixed between circuit card, make adhesive material tape being electrically connected between the electrode of the two and attaching method thereof, manufacture method, compression bonding method, adhesive material tape spool, adhering device, adhesive agent-tape cassette, use the compression bonding method of the caking agent of adhesive agent-tape cassette, particularly be rolled into adhesive material tape of reel and attaching method thereof, manufacture method, compression bonding method, adhesive material tape spool, adhering device, adhesive agent-tape cassette, use compression bonding method and the anisotropic conductive material band of the caking agent of adhesive agent-tape cassette.
Background technology
As being adhesively fixed between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, and make the means that are electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, announced the adhesive material tape that is rolled into reel that is coated with adhesives on base material.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape rolling out from adhesive material reel, is crimped onto circuit card etc. with thermal head by caking agent upper, and residual base material is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
Along with the maximization of the panel of PDP in recent years etc., the bond area of circuit card (or around the size on a limit) also increases, and the consumption of the caking agent that once used also constantly increases.In addition, because the purposes of caking agent is also extended, the consumption of caking agent is increased.Therefore, it is many that the replacing frequency of the adhesive material reel of the manufacturing works of e-machine becomes, and owing to changing adhesive material reel trouble, the problem therefore existing is to improve the production efficiency of e-machine.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, reduce the replacing frequency of spool, but, because the bandwidth of adhesive material tape is too narrow to 1～3mm, if the number of turns increases, just likely occur to roll up to collapse phenomenon.In addition, if the number of turns increases, act on the increased pressure being rolled on banded adhesive material tape, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the diameter dimension of spool also can become greatly so, is difficult to be arranged on existing adhering device, and existing adhering device likely cannot be used again.
Summary of the invention
Therefore, the object of the present invention is to provide and a kind ofly can carry out simply the replacing of adhesive material reel, realize the adhesive material tape that the production efficiency of e-machine improves method of attachment and adhesive material tape, its manufacture method, compression bonding method, adhesive material tape spool, adhering device, adhesive agent-tape cassette, use compression bonding method and the anisotropic conductive material band of their caking agent.
The method of attachment of the adhesive material tape of the 1st scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part of upset one side's adhesive material tape, make a side the adhesive side of adhesive material tape and the adhesive side of the opposing party's adhesive material tape overlapping, the lap of the two is carried out to hot pressing and make its connection.
According to the invention of the 1st scheme, owing to using the caking agent of adhesive material tape that the terminal part that unreels complete adhesive material tape is bonded together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material tape be installed simply.In addition, while carrying out the replacing of new adhesive material tape at every turn, needn't carry out coiling band replacing, the top of new adhesive material tape is installed to operation on winding off spindle, the operation of pilot pin etc. is set on given route, therefore, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
In addition, owing to unreeling the terminal part upset of complete adhesive material tape, the adhesive side of adhesive material tape and the adhesive side of the new adhesive material tape of installing are overlapped each other and be bonded together, so strength of joint is high.
If the thermo-compressed of connection portion is used the thermal head of the adhering device that adhesive material reel is installed, can reasonably utilize adhering device.
The method of attachment of the adhesive material tape of the 2nd scheme of the present invention is on the basis of the 1st scheme, it is characterized in that, on the terminal part of a side adhesive material tape, is provided with terminal marking.
According to the invention of the 2nd scheme, when can play the action effect identical with the 1st scheme, owing to can unreel the cut-out of complete adhesive material tape when having exposed terminal marking, therefore, easily distinguish the part of cutting off and connecting operation, and can connect in the minimal position of necessity, thereby can prevent the waste of adhesive material tape.
The method of attachment of the adhesive material tape of the 3rd scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the top part of the opposing party's adhesive material tape, directed band is pasted and fixed on the substrate surface that is wound on the adhesive material tape on spool, after upset one side's the terminal part of adhesive material tape, make the adhesive side overlaid of the terminal part of the adhesive side of pilot tape and a side adhesive material tape, lap is carried out to thermo-compressed.
According to the invention of the 3rd scheme, identical with the invention of the 1st scheme, can to adhering device, new adhesive material tape be installed simply, in addition, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
In addition, owing to utilizing the pilot tape of adhesive material tape, the terminal part that unreels complete adhesive material tape and the top part of the new adhesive material tape of installing are bonded together, therefore, can carry out simply bonding between adhesive material tape.
The method of attachment of the adhesive material tape of the 4th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the top part of the opposing party's adhesive material tape, directed band is pasted and fixed on the substrate surface that is wound on the adhesive material tape on spool, make the adhesive side overlaid of the terminal part of the adhesive side of pilot tape and a side adhesive material tape, lap is carried out to thermo-compressed.
According to the invention of the 4th scheme, identical with the invention of the 1st scheme, can to adhering device, new adhesive material tape be installed simply, in addition, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
In addition, owing to not needing upset to unreel complete adhesive material tape, therefore, in the time of can preventing from reeling adhesive material tape on winding off spindle, likely there is volume and collapse.
The method of attachment of the adhesive material tape of the 5th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape, at the two lap, insert engaging pin and connect.
According to the invention of the 5th scheme, owing to will unreeling the terminal part of complete adhesive material tape and the top partial fixing of the new adhesive material tape of installing by engaging pin, therefore, connection is simple.In addition, while carrying out the replacing of new adhesive material reel at every turn, due to needn't carry out coiling band replacing, the top of new adhesive material tape is installed to operation on winding off spindle, the operation of pilot pin etc. is set on given route, therefore, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
The method of attachment of the adhesive material tape of the 6th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, the adhesive material tape that connection is wound on to the adhesive material tape of the side on a side spool and is wound on the adhesive material tape of the opposing party on the opposing party's spool is used engagement device to couple together, it is characterized in that: engagement device has the claw on the end that is arranged on a side and the opposing party and is arranged on the elastic component between claw, by the top part of the terminal part of a side adhesive material tape and the opposing party's adhesive material tape toward each other, to be arranged on claw engaging on one end of engagement device on the terminal part of a side adhesive material tape, to be arranged on claw engaging on the other end in the top of the opposing party's adhesive material tape part, by elastic component, two sides' claw is furthered.
According to the invention of the 6th scheme, due to by a side's of engagement device claw engaging on the terminal part of a side adhesive material tape, afterwards by the opposing party's of engagement device claw engaging in the top of the opposing party's adhesive material tape part, the two is interconnected, therefore, connect easily.In addition, owing to thering is elastic component between a side claw and the opposing party's claw, therefore elastic component can be by the opposing party's of engagement device claw engaging on the optional position of the top of the opposing party's adhesive material tape part after extending, and the degree of freedom therefore connecting is high.
In addition, under top part state respect to one another due to the terminal part of the adhesive material tape a side and the opposing party's adhesive material tape, be connected, therefore, do not need belt to overlap each other, owing to connecting, thereby can prevent the waste of adhesive material tape on necessary minimal position.
The method of attachment of the adhesive material tape of the 7th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part that makes a side adhesive material tape, top part overlaid with the opposing party's adhesive material tape, with cross section, be roughly the clip of the elastically deformable of コ font, the lap of the two is clamped and fixed.
According to the invention of the 7th scheme, owing to only the terminal part of one side's adhesive material tape just being clamped and can be connected with the lap of the top part of the opposing party's adhesive material tape with clip, therefore, connect operation easy.
The method of attachment of the adhesive material tape of the 8th scheme of the present invention, it is characterized in that: the metal holding piece processed that is roughly コ font with cross section, the lap of one side's adhesive material tape and the opposing party's adhesive material tape is clamped, thereby press holding piece from the two sides side of lap, the two is coupled together.
According to the invention of the 8th scheme, owing to pressing holding piece from the two sides of lap, the two is coupled together, therefore, can improve the strength of joint of the lap of adhesive material tape.
The method of attachment of the adhesive material tape of the 9th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part that makes a side adhesive material tape, either party's substrate surface and the opposing party's adhesive side overlaid with the top part of the opposing party's adhesive material tape, make the overlap length of the two in the scope of 2 times to 50 times of the width of adhesive tapes, the two is carried out to thermo-compressed and make its connection.
According to the invention of the 9th scheme, owing to utilizing the caking agent of adhesive material tape, the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing are bonded together, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesive material reel at every turn, due to needn't carry out winding off spindle replacing, the top of new adhesives is installed to the operation on winding off spindle, therefore, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
2 times to 50 times of the width that the length that why makes lap is adhesive tapes, are because if be less than 2 times, just cannot obtain enough strength of joint, if surpass 50 times, the adhesives that connection portion is used just too much, produces the waste of adhesives.
If the thermo-compressed of connection portion is used the thermal head of the adhering device that adhesive material reel is installed, just can rationally utilize adhering device.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, can be dispersed with the spacer particle of insulativity in these caking agents.
The method of attachment of the adhesive material tape of the 10th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the direction bending that the terminal part of a side adhesive material tape is faced mutually towards caking agent, the direction bending that the top part of the opposing party's adhesive material tape is faced mutually towards caking agent, make the mutual engaging of dogleg section of the two overlapping, and the adhesive side of the two is faced mutually, lap is carried out to thermo-compressed.
According to the invention of the 10th scheme, when can play the identical action effect of invention with the 1st scheme, owing to making a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape mutually with hook-shaped engaging, and the adhesive side of the two is interconnected, so strength of joint is high.
The method of attachment of the adhesive material tape of the 11st scheme of the present invention be the 9th or the basis of the 10th scheme on, it is characterized in that, at the terminal part of a side adhesive material tape, be provided with terminal marking.
According to the invention of the 11st scheme, when can play the action effect identical with the 9th or the invention of the 10th scheme, because the terminal part of a side adhesive material tape can partly carry out in terminal marking, therefore, easily distinguish the part that connects operation, and can connect in necessary inferior limit position, can prevent the waste of adhesive material tape.In addition, sense terminals mark part, controls device according to this detection signal, or gives the alarm automatically, thereby can improve operating efficiency.
The method of attachment of the adhesive material tape of the 12nd scheme of the present invention is on the basis of any one of 9th～11 schemes, it is characterized in that, with the mould that forms an irregular side, and with the opposing party's of its interlock mould, the lap of clamping a side adhesive material tape and the opposing party's adhesive material tape carries out thermo-compressed.
According to the invention of the 12nd scheme, can play when inventing identical action effect with 9th～11 scheme any one, concavo-convex by forming in connection portion, thereby can expand connection area, can improve because of the engaging of jog the strength of joint of the draw direction (length direction) of adhesive material tape simultaneously.
The method of attachment of the adhesive material tape of the 13rd scheme of the present invention is on the basis of any one of 9th～11 schemes, it is characterized in that, after the lap of a side adhesive material tape and the opposing party's adhesive material tape has formed through hole, lap is carried out to thermo-compressed.
According to the invention of the 13rd scheme, can play when inventing identical action effect with 9th～11 scheme any one, by form through hole in connection portion, thereby make caking agent oozing out in interior week at through hole, increase the bond area of caking agent, therefore can further improve strength of joint.
The method of attachment of the adhesive material tape of the 14th scheme of the present invention is, on the silicone-treated base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, with silicone adhesion zone, paste the surperficial part across the silicone-treated base material of two adhesive material tapes, thereby two adhesive material tapes are coupled together.
According to the invention of the 14th scheme, the adhesive material reel of a side adhesive material tape will be wound with, be arranged in adhering device with the winding off spindle of the base material of the adhesive material tape of only having reeled, when the adhesive material tape of adhesive material reel has been used up, by silicone adhesion zone, the terminal part of end-of-use adhesive material tape (side adhesive material tape) and the top part of the adhesive material tape (the opposing party's adhesive material tape) of the new adhesive material reel of installing are coupled together, replace end-of-use adhesive material reel, new adhesive material reel is installed in adhering device.
In the present invention, owing to only end-of-use adhesive material tape and new adhesive material tape being coupled together, carry out the replacing of spool, therefore, can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesive material reel at every turn, due to needn't carry out winding off spindle replacing, the top of new adhesive material tape is installed on winding off spindle or by adhesive material tape and hangs over the operation on guiding piece, therefore, the replacing time of new adhesive material reel need not be oversize, improved the production efficiency of e-machine.
By with silicone, the base material of adhesive material tape being carried out to surface treatment, on used splicing tape, also use silicone tackiness agent, owing to can reducing the two surface tension poor, improve closing force, before therefore can realizing, very difficult boths' is bonding.
The caking agent of adhesive material tape can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, also the spacer particle of insulativity can be dispersed in these caking agents.
The method of attachment of the adhesive material tape of the 15th scheme of the present invention is on the basis of the 14th scheme, it is characterized in that, the surface tension of the tackiness agent face of silicone adhesion zone, with the difference of the surface tension of the silicone-treated base material of adhesive material tape below 10mN/m (10dyne/cm).
According to the invention of the 15th scheme, when can playing the action effect identical with the invention of the 14th scheme, by making the difference of the surface tension of adhesive side of silicone adhesion zone and the surface tension of the silicone-treated base material of adhesive material tape, be below 10mN/m (10dyne/cm), can access strong closing force, thereby the two can be bonded together reliably.Surface-tension energy is measured with moistening reagent, contact angle.
The difference of the surface tension of the silicone-treated base material of adhesive material tape and the adhesive side of silicone adhesion zone is preferably 0～5mN/m (5dyne/cm).This is because the difference of surface tension is the smaller the better, if its value greatly when over 10mN/m (10dyne/cm), likely can not obtain enough dhering strengths.
The method of attachment of the adhesive material tape of the 16th scheme of the present invention be the 14th or the basis of 15 schemes on, it is characterized in that, the bonding force of silicone adhesion zone is more than 100g/25mm.
According to the invention of the 16th scheme, when can play the action effect identical with the 14th or the invention of 15 schemes, in connection due to the adhesive material tape a side and the opposing party, can in the adhesive side of the two, all paste silicone adhesion zone carries out bonding, therefore, by a side and the opposing party's adhesive material tape bonding from two sides (or closely sealed) is got up, can carry out bonding with high strength.
Particularly, by making bonding force, be more than 100g/25mm, can carry out more firmly and two adhesive side of a side and the opposing party's adhesive material tape between bonding.
If bonding force is large, can obtain strong bonding strength, when being less than 100g/25mm, likely can not obtain the intensity of regulation.
The method of attachment of the adhesive material tape of the 17th scheme of the present invention is characterised in that, make the terminal part of a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, the silicone adhesion zone of pasting described in the 16th scheme along the two sides of two adhesive material tapes connects.
According to the invention of the 17th scheme, when can play the action effect identical with the 16th invention, due to a side is connected on its two sides with the opposing party's adhesive material tape, therefore can access more firmly and connect.
The method of attachment of the adhesive material tape of the 18th scheme of the present invention is, on the silicone-treated base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: at the terminal part of a side adhesive material tape, and between the top part of the opposing party's adhesive material tape, clipping two sided coatings has the silicone adhesion zone of silicone tackiness agent, and two adhesive material tapes are coupled together; The difference of the silicone tackiness agent on two sides and the surface tension of silicone-treated base material is below 10mN/m (10dyne/cm), and bonding force is more than 100g/25mm.
According to the invention of the 18th scheme, owing to using the silicone adhesion zone of two-sided tackiness agent, thereby two-sided silicone adhesion zone can be clipped between a side and the opposing party's adhesive material tape and the two be connected to (or closely sealed), so the connection of the two is simple and easily.
The method of attachment of the adhesive material tape of the 19th scheme of the present invention is, on the base material of adhesive material tape, be coated with electrode connecting adhesive, be wound on the adhesive material tape of the side on a side spool, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: the terminal part that makes a side adhesive material tape, with the top part overlaid of the opposing party's adhesive material tape or toward each other, the resin caking agent of pasty state is attached in lap or part respect to one another, by making the resin adhesive hardens of pasty state, and the two is coupled together.
According to the invention of the 19th scheme, due to by the resin caking agent of pasty state, by unreeling the terminal part of complete adhesive material tape and the top partial fixing of the new adhesive material tape of installing, therefore connect simple.In addition, while carrying out the replacing of new adhesive material reel at every turn, needn't carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
Due to the terminal part of the adhesive material tape a side, and adhere to resin caking agent in the lap of the top part of the opposing party's adhesive material tape or part respect to one another, the degree of freedom therefore connecting is high.
The method of attachment of the adhesive material tape of the 20th scheme of the present invention is on the basis of the 19th scheme, it is characterized in that, resin caking agent consists of at least one material of selecting from thermosetting resin, light-cured resin, heatmeltable caking agent group.
According to the invention of the 20th scheme, when can play the identical action effect of invention with the 19th scheme, as resin caking agent, can from thermosetting resin, light-cured resin, heatmeltable caking agent group, select to be suitable for the resin caking agent of the connection between adhesive material tape, thereby can improve the strength of joint between adhesive material tape.
The adhering device of the adhesive material tape of the 21st scheme of the present invention, is characterized in that, is provided with the plugger of supplying with the resin caking agent as described in the 19th or 20 schemes.
According to the invention of the 21st scheme, owing to being provided with the plugger of the resin caking agent described in the 19th or 20 schemes of supplying with in adhering device, therefore do not need to prepare in addition plugger, thereby can prevent from connecting the waste of operation.
In addition, in adhering device, except plugger, can also have for making the well heater of thermosetting resin sclerosis, or for light-cured resin is carried out to light-struck ultraviolet ray.
The adhesive material tape spool of the 22nd scheme of the present invention, on spool, be wound with the adhesive material tape that is coated with electrode connecting adhesive on base material, it is characterized in that: adhesive material tape spool is provided with the winding part of a plurality of adhesive material tapes on the width of belt.
According to the invention of the 22nd scheme, owing to being provided with the winding part (winder) of a plurality of adhesive material tapes, therefore, when in a plurality of winders, the adhesive material tape that is wound on a winder unreels when complete, just will be installed on winding off spindle with this adhesive material tape that unreels other winders of complete winder disposed adjacent.
Like this, when an adhesive material tape unreels when complete, another adhesive material tape is installed on winding off spindle, carries out the replacing of adhesive material tape, therefore do not need new adhesive material tape spool to be installed in adhering device.So the replacing operation of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.
Owing to can using in turn the adhesive material tape of reeling in a plurality of winders, therefore do not increase the number of turns of the adhesive material tape on each adhesive material tape spool, just can change operation by 1 time increases spendable bonding dosage significantly.In addition, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can also prevent that caking agent from oozing out from the width of belt, the adhesive material tape winding up is bonded together mutually to this so-called adhesion, and then can prevents the drawbacks such as stretching because of the elongated base material easily producing of base material.
The adhesive material tape spool of the 23rd scheme of the present invention is on the basis of the 22nd scheme, it is characterized in that, between a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape, be provided with the connecting band that connects the two, when a side adhesive material tape unreels when complete, then start to extract out the opposing party's adhesive material tape.
According to the invention of the 23rd scheme, when can play the identical action effect of invention with the 22nd scheme, owing to by connecting band, the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape being coupled together, therefore, after the adhesive material tape of one side's winder unreels, do not need the adhesive material tape of the opposing party's winder to be installed on winding off spindle, can further improve the production efficiency of e-machine.
The adhering device of the 24th scheme of the present invention, the adhesive material tape spool that comprises the 23rd scheme, the winding off spindle of adhesive material tape, be arranged between adhesive material tape spool and winding off spindle and with thermal head, the adhesives of adhesive material tape be crimped onto to the pressure contact portion on the circuit card of e-machine, and the band proofing unit of detection connecting band, it is characterized in that: in the situation that being with proofing unit connecting band to be detected, connecting band is wound up on winding off spindle, until connecting band has passed through pressure contact portion.
According to the invention of the 24th scheme, due to connecting band by auto reeling to winding off spindle, therefore after the adhesive material tape of a side winder has been used up, can be in turn from next winder extraction adhesive material tape.
In addition, when band proofing unit detects connecting band, owing to automatically connecting band being wound up on winding off spindle, until connecting band passes through pressure contact portion, the trouble that therefore can save coiling.
In addition, as band proofing unit, for example, in adhering device, there is a pair of luminescent part and light-receiving part, connecting band is carried out to optical detection.On the other hand, the mark of band look (for example black) is set at the two ends of connecting band, utilizes the laser sending from luminescent part, by light-receiving part, detect the mark at the two ends of connecting band, thereby judge connecting band.In addition, except mark on connecting band subscript, can also adopt and make the width of connecting band and the width diverse ways of adhesive material tape, and on connecting band, form the method in a plurality of holes.
The adhesive material tape spool of the 25th scheme of the present invention, is used fastener that the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, and it is characterized in that: connection portion is with the coated fastener of adhesive material tape.
According to the invention of the 25th scheme, owing to using fastener that the terminal part that unreels complete adhesive material tape is coupled together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material tape spool, therefore, can to adhering device, new adhesive material tape spool be installed simply.In addition, while carrying out the replacing of new adhesive material tape spool at every turn, owing to needn't carrying out the replacing of winding off spindle and the top of new adhesive material tape being installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.
Owing to can using in turn adhesive material tape, therefore can not increase the number of turns of the adhesive material tape on each adhesive material tape spool, by 1 time, changing operation just can significantly increase spendable bonding dosage.In addition, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape winding up is bonded together mutually to this so-called adhesion, can also prevents the drawbacks such as stretching because of the elongated base material easily producing of base material.
In addition, because the fastener of the connection portion of a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape is coated by adhesive material tape, when therefore outward appearance is good, the fastener that can prevent connection portion contacts with adhesive material tape, thereby damage adhesive material tape, the formation component such as the thermal head of adhering device, support platform also can not be subject to the damage of fastener.
In addition, as the method with the coated fastener of adhesive material tape, preferably by connect a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape with fastener after, turned back with 180 degree at the length direction of belt in connection portion, thereby with the coated fastener of adhesive material tape.
In addition, also can be coated fastener with other adhesive material tape coiling connection portions.
The adhering device of the 26th scheme of the present invention, comprise the adhesive material tape spool described in the 25th scheme, the winding off spindle of adhesive material tape, be arranged between adhesive material tape spool and winding off spindle and with thermal head, the adhesives of adhesive material tape be crimped onto to the pressure contact portion on the circuit card of e-machine, and the connection section proofing unit of the connection portion of detection band, it is characterized in that: in the situation that connection section proofing unit detects the connection portion of belt, one side's adhesive material tape is reeled on winding off spindle, until pressure contact portion has been passed through in connection portion.
According to the invention of the 26th scheme, when connection section proofing unit detects connection portion, due to a side adhesive material tape is reeled on winding off spindle, until pressure contact portion is passed through in connection portion, therefore, can prevent that connection portion from arriving pressure contact portion and carrying out this unsuitable situation of crimping action.In addition, owing to automatically a side adhesive material tape being reeled on winding off spindle, until pressure contact portion is passed through in connection portion, the trouble that therefore can save coiling.
The 27th scheme of the present invention is on the basis of the 26th scheme, it is characterized in that, connection section proofing unit is any one in CCD photographic camera, thickness detecting sensor, transmittance detecting sensor.
According to the invention of the 27th scheme, when can play the identical action effect of invention with the 26th scheme, can carry out with simple structure the detection of connection portion, and, can be by using these devices to improve accuracy of detection.
For example, in the situation that using CCD photographic camera as connection section proofing unit, the surface of connection portion is taken in monitor picture, by comparing the deep or light of pixel, detected connection portion.In addition, the in the situation that of used thickness detecting sensor, because the thickness of the Thickness Ratio adhesive material tape of connection portion is large, therefore, by the relatively variation of thickness, detect connection portion.In addition, in the situation that using transmittance sensor, due to the thickness thickening of connection portion, and there is fastener, so its transmittance reduction, by comparing the value of transmittance, detect connection portion.
The method of attachment of the adhesive material tape of the 28th scheme of the present invention, it is characterized in that: use fastener that the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, connection portion is with the coated fastener of adhesive material tape.
According to the invention of the 28th scheme, use fastener that the terminal part that unreels complete adhesive material tape is coupled together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material tape spool, therefore, can to adhering device, new adhesive material tape spool be installed simply.In addition, while carrying out the replacing of new adhesives tape spool at every turn, owing to needn't carrying out the replacing of winding off spindle and the top of new adhesive material tape being installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.
Owing to can using in turn adhesive material tape, therefore can not increase the number of turns of the adhesive material tape on each adhesives tape spool, by 1 time, changing operation just can increase spendable bonding dosage significantly.Owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape winding up is bonded together mutually to this so-called adhesion, can also prevents the drawbacks such as stretching because of the elongated base material easily producing of base material.
In addition, because the fastener of the connection portion of a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape is coated with adhesive material tape, when therefore outward appearance is good, the damage adhesive material tape thereby the fastener that can prevent connection portion contacts with adhesive material tape, the formation component such as the thermal head of adhering device, support platform also can not be subject to the damage of fastener.
In addition, as the method with the coated fastener of adhesive material tape, preferably by connect a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape with fastener after, turned back with 180 degree at the length direction of belt in connection portion, thereby with the coated fastener of adhesive material tape.
In addition, also can be coated fastener with other adhesive material tape coiling connection portions.
The adhesive tapes of the 29th scheme of the present invention, is coated with caking agent on base material, and is wound into spool shape, it is characterized in that: on base material, configure many caking agents on the length direction of belt.
According to the invention of the 29th scheme, while using adhesive material tape, by being wound with the spool of adhesive tapes and empty spool, be arranged in adhering device, after caking agent hot pressing is on circuit card, base material is wound up on empty spool and is installed.
Afterwards, the in the situation that of being hot bonding agent on circuit card, of being provided with on the width of base material in many caking agents of many is crimped onto on circuit card, remaining strip of glue after crimping is wound up on empty spool together with base material.Afterwards, when from spool, adhesive tapes is unreeled complete after, make the sense of rotation reversion of spool, make the direction of the supply reversion of adhesive tapes.Like this, repeat following operation: after being finished a caking agent, by remaining caking agent and rolls around, use in turn remaining strip of glue.Therefore therefore,, owing to can using one by one in turn many caking agents, can not increase the number of turns of belt and spendable bonding dosage in 1 spool is significantly increased to (more than 2 times).
According to the present invention, can not increase the number of turns of adhesive tapes and used bonding dosage is significantly increased.And, owing to not increasing the number of turns of adhesive tapes, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape winding up is bonded together mutually to this adhesion, can also prevents drawbacks such as stretching because of the elongated base material easily producing of base material (damage of base material and break).
In the manufacturing works of electronic devices and components, because the replacing number of times of new adhesive tapes can be not too many, so operating efficiency improves.
In addition, in the manufacture of adhesive tapes, owing to can increasing the bonding dosage of each spool, the usage quantity that therefore can cut down spool material and moisture proof material, reduces manufacturing expense.
In addition, for the crimping at the 1st caking agent completes and uses next caking agent after on empty spool that adhesive tapes is reeled, also can not make sense of rotation reversion, and change, be arranged on 2 spools in adhering device.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, can be dispersed with the spacer particle of insulativity in these caking agents.
The width of base material is preferably 5mm～1000mm, can select arbitrarily according to the number of the width of a caking agent, caking agent.The width of one of caking agent is preferably 0.5mm～10.0mm.
The width that why makes base material is 5mm～1000mm, because in the situation that the width of base material is less than 5mm, the number of set caking agent on base material, the width of caking agent can be restricted, simultaneously, if be greater than 1000mm, just likely cannot be arranged on again on existing adhering device.
The adhesive tapes of the 30th scheme of the present invention is on the basis of the 29th scheme, it is characterized in that: between the strip of glue adjacent each other of many caking agents, have interval in vain.
According to the invention of the 30th scheme, when can play the identical action effect of invention with the 29th scheme, owing to making there is distance between adjacent strip of glue, therefore can easily caking agent be carried out to crimping one by one.
The adhesive tapes of the 31st scheme of the present invention is on the basis of the 29th scheme, it is characterized in that: the slit that caking agent is formed on the length direction of belt is separated into many.
According to the invention of the 31st scheme, when can play the identical action effect of invention with the 29th scheme, preferably on the whole surface of the one side of base material, coating adhesive is manufactured, before just caking agent is crimped onto on circuit card shortly,, before being about to use adhesive tapes, with cutting knife etc., cut caking agent to form slit.
In addition, slit also can form with incision caking agents such as cutting knifes when manufacturing adhesive tapes.
The formation of slit, except using cutting knife, also can utilize the formation such as laser, heating wire.
According to the present invention, can make the number that is configured in the strip of glue on base material increase.
The manufacture method of the adhesive tapes of the 32nd scheme of the present invention is, manufacture on base material and be coated with caking agent, and be wound into the adhesive tapes of spool shape, it is characterized in that: the coater of opening arranged spaced by the width overhead by base material, give on the substrate surface transmitting continuously and supply with caking agent, thereby on base material, be coated with many caking agents.
According to the invention of the 32nd scheme, can utilize existing installation to manufacture the adhesive tapes of the 30th scheme.
Coater, both can be arranged on a plurality of rollers of the width of base material, can be also nozzle.
The manufacture method of the adhesive tapes of the 33rd scheme of the present invention is, manufacture on base material and be coated with caking agent, and be wound into the adhesive tapes of reel, it is characterized in that: coating adhesive on the whole surface of the one side of a side base material, next after forming the slit of length direction on caking agent, in adhesive side, configure the opposing party's base material, by a side base material and the opposing party's base material, clamp caking agent, next make a side base material and the opposing party's base material disconnected from each other and make all alternately to paste on a side and the opposing party base material separately many caking agents, thereby produce at a side and the opposing party's the base material overhead standard width of a room in an old-style house every the adhesive tapes that disposes many caking agents.
According to the invention of the 33rd scheme, owing to can manufacture the adhesive tapes of 2 the 29th schemes simultaneously, therefore manufacture efficiency good.
The 34th scheme of the present invention the compression bonding method of adhesive tapes be, use on base material and be coated with caking agent and be wound into the adhesive tapes of reel and caking agent is crimped on circuit card, it is characterized in that: on the whole surface of base material one side, be coated with caking agent, by a part for the caking agent on the width of adhesive tapes, length direction from base material side along belt carries out strip hot pressing, when being reduced, the cohesive force of the caking agent of hot spots is crimped onto on circuit card, remaining caking agent after crimping is wound into spool shape together with base material, reuse the adhesive tapes that is wound into spool shape, by remaining caking agent hot pressing on circuit card.
According to the invention of the 34th scheme, by the part to caking agent, heat, the cohesive force of this part is declined (being called " cohesive force droop line " below), from this cohesive force droop line, the caking agent of hot spots is crimped onto circuit card, leave base material.Remaining caking agent is winding on empty spool with the state remaining on base material together with base material.
According to the present invention, owing to only making, the width of adhesive tapes is wider than in the past, therefore, can former state use existing device fabrication adhesive tapes.
In addition, be crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing heating region, the degree of freedom of the caking agent width of crimping is high.
In addition, the same with the invention of the 29th scheme, when adhesive tapes, to empty spool, extract out when complete, make the sense of rotation reversion of spool, thereby make the direction of the supply reversion of belt, or keep the sense of rotation of spool, spool is exchanged.Like this, due to the caking agent on a rule heated substrate in turn and be crimped onto on circuit card, therefore can not increase the number of turns of belt, the bonding dosage that can use in 1 spool is increased significantly.
In addition, the same with the invention of the 29th scheme, owing to can not increasing the number of turns, increase bonding dosage, therefore, can prevent that volume is when collapsing, can obtain the drawback texts that the stretching that can prevent the caused adhesion of oozing out of caking agent and prevent base material causes.
Bandwidth is preferably 5mm～1000mm, and the caking agent being crimped on circuit card is preferably 0.5mm～1.5mm.Why bandwidth is 5mm～1000mm, is that the caking agent crimping number of times on each spool is few because in the situation that bandwidth is less than 5mm,, if be greater than 1000mm, just likely cannot be arranged on existing adhering device meanwhile again.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, also can in these caking agents, be dispersed with the spacer particle of insulativity.
The adhesive tapes of the 35th scheme of the present invention, is coated with caking agent on base material, and is wound into spool shape, it is characterized in that: the width of adhesive tapes is more than or equal to the length on one side of circuit card, and disposes many caking agents at the width of belt.
In the invention of the 35th scheme, make one side overlay configuration of width and the circuit card of adhesive tapes, to being arranged on of caking agent on the width of adhesive tapes, along one side hot pressing of circuit card.
Because the width of adhesive tapes is more than or equal to the length on one side of circuit card, therefore, adhesive tapes is only pulled out wide use of bar of caking agent.
Afterwards, after one side of circuit card crimping caking agent, rotation circuit plate, makes the other side be positioned at the width of adhesive tapes, and strip of glue is hot-pressed onto on the other side.Like this, if also crimping caking agent on other limits of circuit card in turn, can be easily at the surrounding crimping caking agent of circuit card.
Therefore, due to the rule in turn, use the caking agent of the edge lengths be more than or equal to circuit card, therefore, usage quantity once be only that the width of strip of glue is big or small, thereby can not increase the number of turns of adhesive tapes, and increase significantly spendable bonding dosage in 1 spool.
And, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the belt winding up is bonded together mutually to formation adhesion, can also prevents drawbacks such as stretching because of the elongated base material easily producing of base material (damage of base material and break).
In addition, in the manufacturing works of electronic devices and components, because the replacing number of times of new adhesive tapes can be not too many, so operating efficiency improves.
In addition, in the manufacture of adhesive tapes, owing to can increasing the bonding dosage of each spool, the usage quantity that therefore can cut down spool material and moisture proof material, reduces manufacturing expense.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, also can in these caking agents, be dispersed with the spacer particle of insulativity.
Owing to being greater than an edge lengths that equals circuit card, thereby the width of adhesive tapes is for example 5mm～3000mm.In addition, even do not there is the big or small adhesive tapes on one side of circuit card, also can be by be adjacent to configure many sizes with one side of circuit card on the width of adhesive tapes.In this case, owing to can, easily corresponding to the circuit card varying in size, therefore enhancing productivity.The width of one of caking agent is for example 0.5mm～10.0mm.
Why making the width of adhesive tapes is 5mm～3000mm, is that meanwhile, if be greater than 3000mm, the width of spool is excessive, likely cannot be arranged on existing adhering device again because the size on one side of circuit card is seldom less than 5mm.
The adhesive tapes of the 36th scheme of the present invention is on the basis of the 35th scheme, it is characterized in that: between the strip of glue adjacent to each other of many caking agents, have interval in vain.
According to the invention of the 36th scheme, when can play the identical action effect of invention with the 35th scheme, owing to having distance between adjacent strip of glue, therefore easily a rule separated caking agent from base material carries out crimping.
The adhesive tapes of the 37th scheme of the present invention is on the basis of the 35th scheme, it is characterized in that: the slit that caking agent is formed by the width along belt is separated into many.
According to the invention of the 37th scheme, when can play the identical action effect of invention with the 35th scheme, preferred use coating adhesive dried adhesive tapes on the whole surface of the one side of base material, before just caking agent is crimped onto on circuit card shortly,, before being about to use adhesive tapes, utilize the incision caking agents such as cutting knife to form slit.
In addition, slit also can form with incision caking agents such as cutting knifes when manufacturing adhesive tapes, except using cutting knife, also can utilize the formation such as laser and heating wire.
According to the present invention, can increase the number that is configured in the strip of glue on base material, and can easily be manufactured on the adhesive tapes that disposes many caking agents on the width of belt.。
The manufacture method of the adhesive tapes of the 38th scheme of the present invention, manufacture on base material and be coated with caking agent, and be wound into the adhesive tapes of spool shape, it is characterized in that: coating adhesive on the whole surface of a side base material, next after on caking agent, broad ways forms slit, in adhesive side, configure the opposing party's base material, base material by a side and the opposing party is clamped caking agent, next by making, a side base material and the opposing party's base material are disconnected from each other makes all alternately to paste on a side and the opposing party base material separately many caking agents, thereby produce the adhesive tapes that disposes with interval many caking agents in a side and the opposing party's base material overhead.
According to the invention of the 38th scheme, can utilize existing installation, manufacture the adhesive tapes of 2 the 35th schemes simultaneously, therefore manufacture efficiency excellence.
The compression bonding method of the adhesive tapes of the 39th scheme of the present invention, it is characterized in that: the adhesive tapes of any one in the 35th to 37 schemes is configured on circuit card, by along width, adhesive tapes being carried out to hot pressing, thus on one side of circuit card crimping strip of glue.
In this compression bonding method, adhesive tapes is configured on circuit card, by along width to adhesive tapes thermo-compressed, crimping strip of glue on one side of circuit card, next, by changing the position of circuit card, along width by adhesive tapes hot pressing on the other side of circuit card, thereby can be on the other side of circuit card the next strip of glue of crimping.
According to the invention of the 39th scheme, can play when inventing identical action effect with any one in the 35th～37th scheme, after in adhesive tapes is arranged on to adhering device, one side of circuit card is configured on the width of adhesive tapes, one side crimping caking agent to circuit card, next, for example rotates about 90 degree by circuit card, make the other side of circuit card be positioned at the position parallel with the width of adhesive tapes, crimping caking agent on the other side of circuit card.Like this, by making in turn circuit card 90-degree rotation crimping caking agent, can, simply at the surrounding crimping caking agent of circuit card, in the manufacturing works of electronic devices and components, can improve operating efficiency.
The compression bonding method of the adhesive tapes of the 40th scheme of the present invention, it is characterized in that: the adhesive tapes that is at least provided with any one in 2 the 35th to the 37th schemes on the transmission road of walking circuit plate, the width of one side's adhesive tapes is configured in and transmits in vertical direction, and the width of the opposing party's adhesive tapes is configured in along transmitting in the direction in road; In one side's adhesive tapes, for the 2 relative limits of circuit card, by be hot bonding agent band along width, thereby strip of glue is crimped on the 2 relative limits of circuit card; Next circuit card is shifted to the opposing party's adhesive tapes, the 2 remaining limits for circuit card, by be hot bonding agent band from base material side along width, thereby are crimped on strip of glue the surrounding of circuit card.
According to the invention of the 40th scheme, when can play the identical action effect of invention with any one in the 35th～37th scheme, do not need rotation circuit plate, by the position of a mobile side adhesive tapes and the opposing party's adhesive tapes, on position separately along width hot pressing, just can be easily at the surrounding crimping caking agent of circuit card, operating efficiency is good.
The compression bonding method of the adhesive tapes of the 41st scheme of the present invention, use the adhesive tapes that is coated with caking agent on the whole surface of one side of base material and is wound into spool shape, and caking agent is crimped onto on circuit card, it is characterized in that: the width of adhesive tapes is more than or equal to the length on one side of circuit card, a part by the caking agent on the width of adhesive tapes is carried out hot pressing at width, thereby the cohesive force of the caking agent of hot spots is reduced, and caking agent is crimped onto on circuit card.
According to the invention of the 41st scheme, in the situation that the surrounding of circuit card crimping caking agent, adhesive tapes is installed in adhering device, by along width to adhesive tapes hot pressing, the cohesive force of this part is declined (being called " cohesive force droop line " below), from this cohesive force droop line, make the caking agent of hot spots leave base material and be crimped into circuit card.Next, circuit card is for example rotated to about 90 degree, make adjacent side be positioned at the width with adhesive tapes, along the next strip of glue of width hot pressing, strip of glue is crimped onto on adjacent side.Like this, can be in turn at the surrounding crimping caking agent of circuit card, operating efficiency is good.
In addition, owing to can, at the whole surface coated caking agent of adhesive tapes, therefore can former state using existing device fabrication adhesive tapes.
In addition, be crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing hot pressing region, the degree of freedom of caking agent width of carrying out crimping is high.
In addition, the same with the invention of the 35th scheme, owing to can not increasing the number of turns, increase bonding dosage, therefore, when can prevent that volume from collapsing, can obtain the caused drawback texts of stretching that prevents the caused adhesion of oozing out of caking agent and prevent base material.
The adhesive agent-tape cassette of the 42nd scheme of the present invention, it is characterized in that: there is a side spool, the opposing party's spool and the box body that can keep with rotating freely and hold these two spools, on one side's spool, be wound with the adhesive tapes that has been coated with caking agent on base material, on the opposing party's spool, be fixed wtih one end of adhesive tapes, the length direction along belt on adhesive tapes at least disposes 2 caking agents.
According to the invention of the 42nd scheme, adhesive agent-tape cassette is arranged on adhering device, make one of formed at least 2 caking agents alongst of the width of the adhesive tapes one side overlay configuration with circuit card, from the hot pressing of base material side, a caking agent is crimped onto on circuit card.Like this, in turn caking agent is crimped onto on circuit card, when extracting adhesive tapes out in turn from a side spool, on the opposing party's spool, reels and be coated with the adhesive tapes of a remaining caking agent.Afterwards, when the adhesive tapes on the spool that is wound on a side has been used up, upset tape drum is arranged on it on adhering device again.
Like this, due to a side spool and the opposing party's changing reel, therefore, from the opposing party's spool, extract adhesive tapes, the crimping of the caking agent being left out specifically.
In the situation that be formed with more than 2 caking agents on adhesive tapes, the position that also can change width in turn or have compartment of terrain in vain and carry out crimping.
Like this, in the present invention, on adhesive tapes, caking agent is at least set side by side with 2 at width and also uses to 1 rule, therefore, at least 1 spool can be used the amount of 2 spools, therefore can not increase the number of turns of adhesive tapes, and spendable bonding dosage in 1 spool is increased to more than 2 times.
And, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the band winding up is bonded together mutually to this adhesion, can also prevents drawbacks such as stretching because of the elongated base material easily producing of base material (damage of base material and break).
On the other hand, in the situation that being formed with 2 caking agents, in the manufacturing works of electronic devices and components, when 1 spool amount (1 caking agent) has been used up, the tape drum that only need to overturn, can easily carry out next time and install.
In addition, due to adhesive tapes is made to tape drum, therefore in adhering device, do not need effort that adhesive tapes is installed on spool, but only tape drum is installed in adhering device, so processing ease, and the workability of installing and changing is good.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, also can in these caking agents, be dispersed with the spacer particle of insulativity.
The adhesive agent-tape cassette of the 43rd scheme of the present invention is on the basis of the 42nd scheme, it is characterized in that: strip of glue adjacent one another are in many caking agents is had interval in vain.
According to the invention of the 43rd scheme, when can play the identical action effect of invention with the 42nd scheme, owing to having distance between adjacent strip of glue, therefore easily a rule separated caking agent from base material carries out crimping.
The adhesive agent-tape cassette of the 44th scheme of the present invention is on the basis of the 42nd scheme, it is characterized in that: the slit that caking agent is formed on the length direction of belt is separated into many.
According to the invention of the 44th scheme, when can play the identical action effect of invention with the 42nd scheme, preferred use coating adhesive dried adhesive tapes on the whole surface of the one side of base material, before just caking agent is crimped onto on circuit card shortly,, before being about to use adhesive tapes, utilize the incision caking agents such as cutting knife to form slit.
In addition, slit also can utilize the incision caking agents such as cutting knife to form when manufacturing adhesive tapes, except utilizing cutting knife, and also can be by formation such as laser and heating wires.
The compression bonding method of the caking agent of the use adhesive agent-tape cassette of the 45th scheme of the present invention, it is characterized in that: will there is a side spool, the opposing party's spool, and the box body that can keep with rotating freely and hold these two spools, and on a side spool, be wound with the adhesive tapes that has been coated with caking agent on base material, the adhesive agent-tape cassette that is fixed wtih one end of adhesive tapes on the opposing party's spool is arranged in compression bonding apparatus, adhesive tapes is pulled out on circuit card from adhesive agent-tape cassette, by a part for the width of adhesive tapes is carried out to hot pressing, thereby the cohesive force of the caking agent of hot spots is reduced, and the caking agent of a part for width is crimped onto on circuit card.
According to the invention of the 45th scheme, by a part of hot pressing to width in adhesive tapes, the cohesive force of the caking agent of this part is declined (being called " cohesive force droop line " below), from this cohesive force droop line, make the caking agent of hot spots leave base material and be crimped into circuit card.
In the present invention, owing to can, at the whole surface coated caking agent of the base material of adhesive tapes, therefore can former state using existing device fabrication adhesive tapes.
In addition, be crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing hot pressing region, the degree of freedom of caking agent width of carrying out crimping is high.
The compression bonding method of the caking agent of the use adhesive agent-tape cassette of the 46th scheme of the present invention, it is characterized in that: will there is a side spool, the opposing party's spool, and the box body that can keep with rotating freely and hold these two spools, and on a side spool, be wound with the adhesive tapes that has been coated with caking agent on base material, the adhesive agent-tape cassette that is fixed wtih one end of adhesive tapes on the opposing party's spool is arranged in compression bonding apparatus, adhesive tapes is drawn out on circuit card from adhesive agent-tape cassette, by a part for the width of adhesive tapes is carried out to hot pressing, thereby the cohesive force of the caking agent of hot spots is reduced, and the caking agent of a part for width is crimped onto on circuit card, after the adhesive tapes of reeling on a side spool has been used up, upset adhesive agent-tape cassette, the caking agent of remainder is crimped onto on circuit card.
According to the invention of the 46th scheme, when can play the identical action effect of invention with the 45th scheme, when the adhesive tapes on the spool that is wound on a side has been used up, owing to overturning, tape drum is arranged in compression bonding apparatus again, the caking agent of remainder is crimped onto on circuit card, therefore, the same with the invention of the 42nd scheme, do not increase the number of turns and just can increase bonding dosage, can prevent that volume is when collapsing, can obtain and prevent that caking agent from oozing out caused adhesion and preventing the caused drawback texts of stretching of base material.And then, in the manufacturing works of electronic devices and components, after 1 spool amount (1 amount caking agent) has been used up, due to only need upset tape drum can, therefore easily install next time.Owing to adopting tape drum, so processing ease, and the workability of installing and changing is good.
The adhesive material tape of the 47th scheme of the present invention, is the bonding material band that is coated on base material and is rolled into reel, it is characterized in that: base material has heat and melts agent layer and supporting layer.
According to the invention of the 47th scheme, while using adhesive material tape, by being wound with the spool of adhesive material tape and empty spool, be arranged in adhering device, be hot bonding material on circuit card after, base material is winding on empty spool to be installed.Afterwards, make to unreel the terminal part of a side's who reels on a complete side's spool adhesive material tape, partly overlap with the top of the opposing party's who reels on new the opposing party's spool adhesive material tape or toward each other, heat this part, make after heat melts agent layer fusing, by cooling, make heat melt agent to solidify, thereby adhesive material tape is interconnected.
Owing to utilizing the base material of adhesive material tape, the terminal part that unreels complete adhesive material tape is bonded together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material reel, therefore can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesives tape spool at every turn, owing to needn't carrying out the replacing of winding off spindle and the top of new adhesives being installed on winding off spindle, and be wound on the operation on pilot pin, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
If the thermo-compressed of connection portion is used the thermal head of the adhering device that adhesive material reel is installed, can rationally utilize adhering device.
The adhesive material tape of the 48th scheme of the present invention is on the basis of the 47th scheme, it is characterized in that: supporting layer is melted agent layer by heat and clamps.
According to the invention of the 48th scheme, when can play the identical action effect of invention with the 47th scheme, because the surface of base material has heat to melt agent layer, thereby the heat of the terminal part of a side adhesive material tape can be melted to the adhesive side overlaid of agent layer and top part, this part is carried out thermo-compressed and the two is coupled together, therefore connect simple.In addition, because heat is melted on the whole length direction that agent layer is formed on belt, therefore to overlap length, needn't carry out strict location, the degree of freedom of connection is high.
The adhesive material tape of the 49th scheme of the present invention is on the basis of the 47th scheme, it is characterized in that: heat is melted agent layer and is supported layer clamping.
According to the invention of the 49th scheme, when can play the identical action effect of invention with the 47th scheme, for adhesive material tape is interconnected, make a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape in position respect to one another, with the thermal head of adhering device, heat.During heating, heat is melted agent layer fusing and is oozed out, and makes heat melt agent to solidify, thereby adhesive material tape is interconnected by cooling.At this moment, because heat is melted agent layer and is supported layer clamping, therefore, can prevent that heat from melting agent layer and being exposed in atmosphere, because the caused heat of adhering to of the absorption of moisture, dust etc. is melted the bonding strength of agent layer and declined.
The method of attachment of the adhesive material tape of the 50th scheme of the present invention is, the adhesive material tape of a side on a side spool will be wound on, couple together with the adhesive material tape that is wound on the opposing party on the opposing party's spool, it is characterized in that: adhesive material tape has with parting agent has implemented surface-treated base material and caking agent, the parting agent of the base material end of removal either party's adhesive material tape, make the adhesive side overlaid of this part and the opposing party's adhesive material tape, the lap of the two is carried out to thermo-compressed and make its connection.
According to the invention of the 50th scheme, owing to making, either party's the substrate surface of adhesive material tape and the adhesive side of the opposing party's adhesive material tape are overlapping, lap is carried out to thermo-compressed, the terminal part that unreels complete adhesive material tape is coupled together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material reel be installed simply.
While carrying out the replacing of new adhesive material reel at every turn, owing to needn't carrying out the replacing of winding off spindle and the top of new adhesive material tape being installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
In addition, for the surface of base material, at adhesive material-tape reel, become under the state of reel, in order to make adhesive side and substrate surface not bonding, on the surface of base material, be coated with parting agent.In the present invention, owing to removing the parting agent of a side adhesive material tape, make that this part and the opposing party's the adhesive side of adhesive material tape is overlapping carries out bondingly, so the connection between adhesive material tape is simple.
If the thermo-compressed of connection portion is used the thermal head of the adhering device that adhesive material reel is installed, can rationally utilize adhering device.
The method of attachment of the adhesive material tape of the 51st scheme of the present invention is on the basis of the 50th scheme, it is characterized in that: remove parting agent and undertaken by any method in plasma discharge, uviolizing, laser radiation.
According to the invention of the 51st scheme, when can play the identical action effect of invention with the 50th scheme, owing to using any method in plasma discharge, uviolizing, laser radiation, remove parting agent, thereby with peel manually from situation compare, can reliably and carry out the removal of parting agent with the short period of time.
As the removal method of parting agent, in the situation that using plasma discharge, by making the decomposing gas of isoionic state, the state in easily reacting (excited state), by discharging and remove parting agent on the surface of base material.In addition, the in the situation that of uviolizing, for example mercuryvapour lamp is used as light source, by irradiate the ultraviolet ray of certain hour from mercuryvapour lamp, is undertaken.In addition, the in the situation that of laser radiation, utilize laser that laser oscillator launches by parting agent heat fused, to remove parting agent.
The adhesive material tape spool of the 52nd scheme of the present invention, be that the adhesive material tape that is coated with electrode connecting adhesive on base material is wound on the adhesive material tape spool on spool, it is characterized in that: adhesive material tape spool is provided with the winding part of a plurality of adhesive material tapes on the width of belt.
According to the invention of the 52nd scheme, owing to being provided with the winding part (winder) of a plurality of adhesive material tapes, therefore, in a plurality of winders, the adhesive material tape that one side's winder is reeled unreels when complete, just will be installed on winding off spindle with the adhesive material tape that unreels other winders of complete winder disposed adjacent.
Like this, when a side adhesive material tape unreels when complete, the opposing party's adhesive material tape is installed on winding off spindle, carries out the replacing of adhesive material tape, therefore do not need new adhesive material tape spool to be installed in adhering device.So the replacing operation of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.
Owing to can using in turn the adhesive material tape of reeling in a plurality of winders, therefore can not increase the number of turns of the adhesive material tape on each adhesive material tape spool, and can increase significantly spendable bonding dosage by the replacing operation of 1 time.In addition, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out from the width of belt, the adhesive material tape winding up is bonded together mutually to this so-called adhesion, can also prevents the drawbacks such as stretching because of the elongated base material easily producing of base material.
The adhesive material tape spool of the invention of the 53rd scheme of the present invention is on the basis of the 52nd scheme, it is characterized in that: the accommodation section that is provided with siccative on the side plate of spool.
The adhesive material tape spool of the 54th scheme of the present invention is on the basis of the 52nd scheme or 53 schemes, it is characterized in that: on spool, be provided with the cover for the surrounding of the adhesive material tape of reeling on spool is coated that can freely install and remove.
The adhesive material tape spool of the invention of the 55th scheme of the present invention is on the basis of the 54th scheme, it is characterized in that: cover has the mouth of pulling out of adhesive material tape.
The adhesive material tape spool of the 56th scheme of the present invention is on the basis of the 52nd scheme or 53 schemes, it is characterized in that: the side plate of the winder of adhesive material tape can freely be installed and removed chimeric each other.
The adhesive material tape spool of the 57th scheme of the present invention is on the basis of the 52nd scheme or 53 schemes, it is characterized in that: adhesive material tape is the adhesive material tape that is coated with the electrode connecting adhesive that connects relative electrode on base material.
The adhesive material tape spool of the 58th scheme of the present invention is on the basis of the 52nd scheme or 53 schemes, it is characterized in that: adhesive material tape is the fixing with support substrate or the tube core of support substrate or lead frame and the adhesive material tape of semiconductor element for semiconductor element mounting of connecting lead wire frame.
The adhering apparatus of the 59th scheme of the present invention, the spool with a side, the opposing party's spool, make the gear unit of the rotating gang of a side spool and the opposing party's spool, the box body that holds them, be configured in box body peristome heater block and to the supply unit of heater block power supply, it is characterized in that: on a side spool, be wound with the adhesive tapes that has been coated with caking agent on base material, on the opposing party's spool, be fixed with one end of adhesive tapes, heater block has and passes through the electroheat member that supplied with electric energy generates heat, the adhesive tapes being wound on a side spool is pulled out from the peristome of box body, by heater block, from base material side, to being positioned at the adhesive tapes of peristome, carry out hot pressing, thereby caking agent is crimped onto on circuit card, and the base material that caking agent is stripped from is wound up on the opposing party's spool.
According to the invention of the 59th scheme, to circuit card crimping caking agent in the situation that, by to be hold by one hand box body, by the peristome that exposes adhesive tapes by being pressed on circuit card, and the heater block that makes to be arranged on the adhesive tapes base material side of peristome presses the adhesive tapes that is positioned at peristome, thereby caking agent is crimped onto on circuit card.Like this, when on one side, press the adhesive tapes being positioned under heater block, while advancing adhering apparatus on one side, owing to pulling out adhesive tapes from a side spool, and just rotation of spool when spool is pulled out adhesive tapes, therefore also rotate with a side the co-axially fixed gear of spool, with the gear rotation of the opposing party's spool of its interlock, the base material that caking agent has been stripped from is wound up on the opposing party's spool.
Power supply to heater block, can utilize the switch power supply being arranged on box body, or, also can pressure-sensitive switch be set on heater block, when sensing that heater block is pressed, heater block is powered.
Caking agent can be both in the caking agent of insulativity, to be dispersed with the caking agent of the anisotropic conductive of conducting particles, can be also insulativity caking agent, can be dispersed with the spacer particle of insulativity in these caking agents.
The invention of the 60th scheme of the present invention, is the adhesive material tape being coated on base material, and base material consists of metallic film or aromatic polyamide film.
In the invention of the 60th scheme, by making the base material of adhesive material tape, be metallic film (or tinsel) or aromatic polyamide film, even in the situation that the thinner thickness of base material, also can prevent the faults such as the stretching of base material and fracture.
In addition, by the adhesive material tape that utilizes the base material of thinner thickness to form, can make the number of turns on each spool increase, thereby can increase spendable bonding dosage on 1 spool.In addition, if use adhesive material tape of the present invention, because the number of turns on each spool is many, therefore, in the manufacturing works of electronic devices and components, the replacing number of times of new adhesive material tape can be not too many, improved operating efficiency.In addition, in the manufacture of adhesive material tape, owing to can reducing the spool number of manufacture, the usage quantity that therefore can cut down spool material, moisture proof material, reduces manufacturing expense.
Metallic film is the high metal of ductility preferably, can adopt copper, aluminium, stainless steel, iron, tin etc.
Aromatic polyamide film, specifically, can adopt contraposition aromatic polyamide film (ミ Network ト ロ Application, Dongli Ltd.'s trade(brand)name processed).
Caking agent can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.In the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, have epoxy resin, crylic acid resin, silicone resin class.
In caking agent, can be dispersed with conducting particles, as conducting particles, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on the polymer cores such as these and/or dielectric glass, pottery, plastics, the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle forming with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, be preferred.
The adhesive material tape of the 61st scheme of the present invention is on the basis of the 60th scheme, it is characterized in that: the thickness of base material is 1 μ m～25 μ m.
The thickness that why makes base material is 1 μ m～25 μ m, is that base material cannot obtain enough tensile strengths because in the situation that the thickness of base material is less than 1 μ m, easily fracture.In addition, in the situation that the thickness of base material has surpassed 25 μ m, be difficult to obtain the gratifying number of turns in each spool.
The adhesive material tape of the 62nd scheme of the present invention be the 60th or the basis of the 61st scheme on, it is characterized in that: the tensile strength of base material at 25 ℃ for more than 300MPa.
The tensile strength that why makes base material is more than 300MPa, be because in base material tensile strength than 300MPa hour, base material is easily stretched, adhesive material tape easily ruptures in addition.
The adhesive material tape of the 63rd scheme of the present invention is on the basis of the 60th arbitrary scheme to the 62nd scheme, it is characterized in that: the Thickness Ratio of base material and caking agent is 0.01～1.0.
Why making the Thickness Ratio of base material and caking agent is 0.01～1.0, is that base material is excessively thin because in the situation that the Thickness Ratio of base material and caking agent is less than 0.01, and adhesive material tape cannot obtain enough intensity.In addition, in the situation that the Thickness Ratio of base material and caking agent has surpassed 1.0, base material is blocked up, can not increase the number of turns of each spool.
The adhesive material tape of the 64th scheme of the present invention is on arbitrary scheme basis of the 60th to the 63rd scheme, it is characterized in that: the surfaceness R of base material maxbe below 0.5 μ m.
Why make the surfaceness R of base material maxbeing below 0.5 μ m, is because if R maxsurpassed 0.5 μ m, concavo-convex due to substrate surface, when to circuit card crimping caking agent, caking agent is difficult to from base material separated.
The caking agent formation method of the adhesive material tape of the 65th scheme of the present invention, use the adhesive material tape that is coated with caking agent on base material and is rolled into reel, in bonded object, form caking agent, it is characterized in that: from a plurality of spools, pull out respectively adhesive material tape, make that each adhesive material tape is overlapping to be integrated, when peeling off a side base material, the overlapping caking agent being integrated is formed in bonded object.
In the invention of the 65th scheme, by the adhesive side of the adhesive material tape of extracting out the spool from a side, overlapping with the adhesive side of the adhesive material tape of extracting out spool from the opposing party, adhesive material tape is made of one.The base material of the opposing party's adhesive material tape is wound up on the spool that batches use, utilizes thermal head, the caking agent of the overlapping adhesive material tape being integrated is crimped onto in bonded object.Bonded object is the tube core of electronic devices and components, circuit card, lead frame and lead frame etc.
Like this, in bonded object, form in the operation before caking agent, make a side the caking agent of adhesive material tape and the caking agent of the opposing party's adhesive material tape overlapping, after forming desired thickness, in bonded object, form caking agent, therefore,, although increased the number of turns of adhesive material tape, can reduce the winding diameter of the adhesive material tape on each spool.So, can increase the number of turns of the adhesive material tape of each spool, thereby can increase significantly spendable bonding dosage by 1 replacing operation.Therefore, the replacing operation of new adhesive material tape can be not too many, improved the production efficiency of e-machine.
The caking agent formation method of the adhesive material tape of the 66th scheme of the present invention is on the basis of the 65th scheme, it is characterized in that: only have in a side the caking agent of adhesive material tape and contain solidifying agent.
According to the invention of the 66th scheme, when can play the identical action effect of invention with the 65th scheme, owing to only having in a side the caking agent of adhesive material tape, contain solidifying agent, therefore, in the caking agent of the opposing party's adhesive material tape, do not need solidifying agent.So the adhesive material tape that does not contain the caking agent of solidifying agent does not need low temperature management.Thereby can reduce the number of the adhesive material tape that needs low temperature management, thereby can manage efficiently the conveying of adhesive material tape, keeping.In addition, for not being added with the adhesive material tape of solidifying agent and being added with the caking agent of the adhesive material tape of solidifying agent, by the caking agent using the composition reacting with solidifying agent as the opposing party, using the caking agent that uses the caking agent of the composition not reacting with solidifying agent as a side, thereby can improve the storage stability of caking agent together with solidifying agent.
The anisotropic conductive material band of the 67th scheme of the present invention, is characterized in that: will have the anisotropic conductive material of the caking agent of film like, the multireel lamination of reeling on the length direction of core forms.
The anisotropic conductive material band of the 68th scheme of the present invention is on the basis of the 67th scheme, it is characterized in that: above-mentioned anisotropic conductive material is the anisotropic conductive material that is provided with 2 layers of structure of base material film on the one side of the caking agent of film like.
The anisotropic conductive material band of the 69th scheme of the present invention is on the basis of the 67th scheme, it is characterized in that: above-mentioned anisotropic conductive material is on the caking agent of film like two-sided, to be provided with the anisotropic conductive material of 3 layers of structure of base material film.
The anisotropic conductive material band of the 70th scheme of the present invention is on the basis of the 68th scheme or the 69th scheme, it is characterized in that: the single or double to above-mentioned base material film has been implemented lift-off processing.
The anisotropic conductive material band of the 71st scheme of the present invention is on the basis of any one in the 67th scheme to the 70 schemes, it is characterized in that: the width of the caking agent of above-mentioned film like is 0.5～5mm.
In addition, the anisotropic conductive material band of the 72nd scheme of the present invention is on the basis of the arbitrary scheme of the 68th scheme to the 71 scheme, it is characterized in that: base material film strength is 12kg/mm 2above, unit elongation is 60～200%, and thickness is below 100 μ m.Afterwards, if base material film is coloured to colored transparent or coloured opaque, the differentiation of base material film and caking agent is just easier to, and in addition, the position of winder is also easily differentiated, and has improved workability.
Accompanying drawing explanation
Fig. 1 is in the method for attachment of the adhesive material tape of the 1st embodiment, represents the stereographic map of the connection between adhesive material reel.
Fig. 2 A and Fig. 2 B are the stereographic map of connection operation of the connection portion of presentation graphs 1.
Fig. 3 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Fig. 4 is the bonding sectional view between indication circuit plate.
Fig. 5 is for representing the process picture sheet of the manufacture method of adhesive material tape.
Fig. 6 is the stereographic map of the method for attachment of the adhesive material tape of expression the 2nd embodiment of the present invention.
Fig. 7 is the stereographic map of the method for attachment of the adhesive material tape of the variation of expression the 2nd embodiment of the present invention.
Fig. 8 A～Fig. 8 C is the schematic diagram of the method for attachment of the adhesive material tape of expression the 1st embodiment, Fig. 8 A is for representing the stereographic map of the connection between adhesive material reel, Fig. 8 B is the stereographic map of method of attachment of the connection portion of presentation graphs 8A, and Fig. 8 C is the vertical view of the connection portion of Fig. 8 A.
Fig. 9 is the sectional view of the method for attachment of the adhesive material tape of expression the 2nd embodiment of the present invention.
Figure 10 is the sectional view of the method for attachment of the adhesive material tape of expression the 3rd embodiment of the present invention.
Figure 11 is the sectional view of the method for attachment of the adhesive material tape of expression the 4th embodiment of the present invention.
Figure 12 A and Figure 12 B be for representing the schematic diagram of method of attachment of the adhesive material tape of the 1st embodiment, and Figure 12 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 12 B is the stereographic map of method of attachment of the connection portion of presentation graphs 12A.
Figure 13 is the sectional view of the method for attachment of the adhesive material tape of expression the 2nd embodiment of the present invention.
Figure 14 A and Figure 14 B are the sectional view of the method for attachment of the adhesive material tape of expression the 3rd embodiment of the present invention, and Figure 14 A represents the state before hot pressing, and Figure 14 B represents the state after hot pressing.
Figure 15 A and Figure 15 B are the schematic diagram of the method for attachment of the adhesive material tape of expression the 4th embodiment of the present invention, and Figure 15 A is sectional view, and Figure 15 B is vertical view.
Figure 16 A and Figure 16 B are the schematic diagram of the method for attachment of the adhesive material tape of expression the 1st embodiment, and Figure 16 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 16 B is the stereographic map of the connection portion (b) of presentation graphs 16A.
Figure 17 is the sectional view of the method for attachment of the adhesive material tape of expression the 2nd embodiment of the present invention.
Figure 18 is the sectional view of the method for attachment of the adhesive material tape of expression the 3rd embodiment of the present invention.
Figure 19 is the sectional view of the method for attachment of the adhesive material tape of expression the 4th embodiment of the present invention.
Figure 20 A～Figure 20 C is for representing the schematic diagram of method of attachment of the adhesive material tape of the 1st embodiment, and Figure 20 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 20 B and Figure 20 C are the sectional view of method of attachment of the connection portion of presentation graphs 20A.
Figure 21 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Figure 22 A～22C is for representing the schematic diagram of the adhesive material tape spool of the 1st embodiment, and Figure 22 A is for representing the stereographic map of adhesive material tape spool, and Figure 22 B is the front view of Figure 22 A, and Figure 22 C is the vertical view of the connecting band of Figure 22 A.
Figure 23 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Figure 24 is the vertical view of the connecting band of the 2nd embodiment of the present invention.
Figure 25 is the vertical view of the connecting band of the 3rd embodiment of the present invention.
Figure 26 is for representing the stereographic map of the adhesive material tape spool of the 4th embodiment of the present invention.
Figure 27 A～27C is for representing the schematic diagram of the adhesive material tape spool of the 1st embodiment, and Figure 27 A is for representing the stereographic map of adhesive material tape spool, and Figure 27 B is the front view of Figure 27 A, and Figure 27 C is the sectional view of the connection portion of Figure 27 A.
Figure 28 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Figure 29 is the stereographic map of the use state of the caking agent of expression PDP.
Figure 30 is for representing the stereographic map of the adhesive material tape spool of the 2nd embodiment of the present invention.
Figure 31 A is by the adhesive material tape of adhesive material tape spool of the present invention in the situation for the semiconductor device of LOC structure, the sectional view of adhesive material tape.
Figure 31 B is by the adhesive material tape of adhesive material tape spool of the present invention in the situation for the semiconductor device of LOC structure, the sectional view of the semiconductor device of LOC structure.
Figure 32 A～Figure 32 C is for represent being used the schematic diagram of the adhering device of adhesive material tape spool of the present invention, and Figure 32 A is front view, and Figure 32 B is side-view, Figure 32 C be Figure 32 B adhesive material tape punching press paste section 89 want portion's enlarged view.
The figure that Figure 33 A and Figure 33 B are adhesive tapes, Figure 33 A is for rolling up the stereographic map of the spool that has adhesive material tape, and Figure 33 B is the A-A line sectional view of Figure 33 A.
Figure 34 is the stereographic map of the use state of the caking agent of expression PDP.
Figure 35 is the sectional view that is illustrated in the operation of coating adhesive on base material.
Figure 36 A～Figure 36 C is the sectional view of the adhesive tapes of the 2nd embodiment of the present invention.
Figure 37 A～Figure 37 C is for representing the 3rd adhesive tapes of embodiment of the present invention and the process picture sheet of compression bonding method thereof.
Figure 38 A～Figure 38 C is the process picture sheet of the manufacture method of the adhesive tapes of expression the 4th embodiment of the present invention.
The figure that Figure 39 A and Figure 39 B are adhesive tapes, Figure 39 A is for rolling up the stereographic map of the spool that has adhesive tapes, and Figure 39 B is the vertical view that the adhesive tapes of Figure 39 A is seen from caking agent side.
Figure 40 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Figure 41 is the schematic diagram of the crimping process of the caking agent of the adhering device of expression the 2nd embodiment of the present invention
Figure 42 A～Figure 42 C is the sectional view of the adhesive tapes of the 3rd embodiment of the present invention.
Figure 43 A～Figure 43 C is for representing the 4th adhesive tapes of embodiment of the present invention and the process picture sheet of compression bonding method thereof.
Figure 44 A～Figure 44 C is the process picture sheet of the manufacture method of the adhesive tapes of expression the 5th embodiment of the present invention.
Figure 45 A and Figure 45 B are the figure of the adhesive agent-tape cassette of the 1st embodiment of the present invention, the stereographic map that Figure 45 A is adhesive agent-tape cassette, and Figure 45 B is the A-A line sectional view of Figure 45 A.
Figure 46 is the sectional view of installment state of the spool of the tape drum shown in presentation graphs 45A.
Figure 47 is the front view of the crimping process of the caking agent of expression adhering device.
Figure 48 is for representing the process picture sheet of the manufacture method of adhesive agent-tape cassette.
Figure 49 is the schematic diagram of the crimping process of the caking agent of the adhering device of expression the 2nd embodiment of the present invention
Figure 50 is the sectional view of the adhesive tapes of the 3rd embodiment of the present invention.
Figure 51 A and Figure 51 B are for representing the 4th adhesive tapes of embodiment of the present invention and the process picture sheet of compression bonding method thereof.
Figure 52 A and Figure 52 B are for representing the figure of the adhesive material tape of the 1st embodiment, and Figure 52 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 52 B is the sectional view of the connection portion of presentation graphs 52A.
Figure 53 is for representing the sectional view of the adhesive material tape of the 2nd embodiment.
Figure 54 A～Figure 54 C is the sectional view of the connection operation of the connection portion of expression Figure 55, and Figure 54 A represents the state before electric discharge, and Figure 54 B represents the state after electric discharge, and Figure 54 C is for representing the figure of the thermo-compressed of connection portion.
Figure 55 is the stereographic map of the connection between the adhesive material reel in the method for attachment of expression adhesive material tape.
Figure 56 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Figure 57 A～Figure 57 C is for representing the figure of the adhesive material tape spool of the 1st embodiment, and Figure 57 A is for representing the stereographic map of adhesive material tape spool, and Figure 57 B is the front view of Figure 57 A, and Figure 57 C is the front view of the cover of Figure 57 A.
Figure 58 is for representing the process picture sheet of the manufacture method of adhesive material tape spool.
Figure 59 is the side-view of the adhesive material tape spool of the 2nd embodiment of the present invention.
Figure 60 A and Figure 60 B are the front view of the adhesive material tape spool of the 3rd embodiment of the present invention, are the figure of the replacing of explanation adhesive tapes.
Figure 61 is the stereographic map of the side plate of the winder of expression the 4th embodiment of the present invention.
Figure 62 A and Figure 62 B are the figure of the adhering apparatus of the 1st embodiment of the present invention, the stereographic map that Figure 62 A is adhering apparatus, and Figure 62 B is the A-A line sectional view of Figure 62 A.
Figure 63 is the side-view of the using method of the adhering apparatus shown in explanatory view 62A and Figure 62 B.
Figure 64 is for representing the process picture sheet of the manufacture method of adhering apparatus.
Figure 65 A and Figure 65 B are for representing the figure of the adhesive material tape of the 1st embodiment, and Figure 65 A is for representing that adhesive material tape is wound on the stereographic map on spool, and Figure 65 B is the A-A line sectional view of Figure 65 A.
Figure 66 A and Figure 66 B form the figure of operation for representing the adhesives of the adhesive material tape of the 1st embodiment, Figure 66 A is for representing to make each adhesive material tape overlapping and be made of one, one side's base material is wound up into the schematic diagram of the operation on the spool of coiling use, Figure 66 B is the sectional view of the part that overlaps each other between the caking agent of presentation graphs 66A.
Figure 67 is for representing the caking agent of adhering device to be formed on the schematic diagram of the operation in bonded object.
Figure 68 is for rolling up the stereographic map of the spool that has adhesive material tape.
Figure 69 A forms the sectional view of operation for representing the adhesives of the adhesive material tape of the 2nd embodiment.
Figure 69 B is the bonding sectional view between the circuit card of the adhesives of expression use Figure 69 A.
Figure 70 is the schematic diagram of the supply mode of the anisotropic conductive material band of expression 2 layers of structure of the present invention.
Figure 71 is the schematic diagram of the supply mode of the anisotropic conductive material band of expression 3 layers of structure of the present invention.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are elaborated.In addition, in the following description, identical or equal integrant is put on to identical symbol.
First, with reference to Fig. 1～Fig. 5, the embodiment of the 1st scheme～4th scheme of the present invention is described.
Fig. 1 is the stereographic map of the connection between the adhesive material reel in the method for attachment of the adhesive material tape of expression the 1st embodiment, Fig. 2 A and Fig. 2 B are the connection process picture sheet of the connection portion (A) of presentation graphs 1, the stereographic map of Fig. 2 A for representing the magnetic tape trailer of end-of-use adhesive material tape to cut off, the stereographic map of Fig. 2 B for representing the upset of end-of-use adhesive material tape to be connected with new adhesive material tape, Fig. 3 is the schematic diagram of the crimping process of the caking agent of expression adhering device, Fig. 4 is the bonding sectional view between indication circuit plate, Fig. 5 is for representing the process picture sheet of the manufacture method of adhesive material tape.
Adhesive material tape 1 is wound on respectively spool 3,3a is upper, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 on each spool 3,3a.Also, each spool 3,3a have the side plate 7 of rolling up core 5 and being configured in respectively the width both sides of adhesive material tape 1.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 that is coated on a side of base material 9.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, by formations such as OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), but is not limited in this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, have the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc.Conducting particles 13, can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, are formed with the made conductive layer of material that forms above-mentioned conducting particles 13.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles 13 as above of insulation layer, and conducting particles 13 and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, conducting particles 13 is owing to can not show fusing point as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape 1 of present embodiment is described.As shown in Figure 3, spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3a is hung on pilot pin 22 and is arranged on winding off spindle 17, extracts adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out: as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through cushioning material, for example polytetrafluoroethylmaterial material 24 if desired, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses present embodiment adhesive material tape 1, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is a lot, with regard to caking agent 11, the usage quantity of nonrecoverable caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, and the adhesive material tape twisting on spool 3a is just rolled on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Fig. 1) of the adhesive material tape 1 twisting on spool 3a.
The method of attachment of adhesive material tape of the present invention, has (a) and (b) two kinds of situations.(a) situation is to continue to use winding off spindle 17, changes the adhesive tapes that remains a small amount of volume of the adhesive material tape 1 being finished, and new adhesive tapes is connected on winding off spindle 17; (b) situation is the volume number of the adhesive material tape being finished 1 to be remained to a small amount of adhesive tapes as winding off spindle 17, use, and new adhesive tapes is remained to a small amount of adhesive tapes with volume number and be connected.
In (b) situation, as shown in Figure 1, on the adhesive material tape 1 of spool 3a, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of reeling on new adhesive material reel 3.
As described below the carrying out of connection of this adhesive material tape 1, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, as shown in Figure 2 A, to near the terminal marking of adhesive material tape 1 28, cut off (B), the terminal part 30 of upset adhesive material tape 1, makes caking agent 11 faces of adhesive material tape 1 be positioned at upside (Fig. 2 B).Next, by 11 of the caking agents of the terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a, with 11 overlaids of caking agent (Fig. 2 B) of the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.
Next, as shown in Figure 4, the lap of the two is placed on platform 104, utilizes the thermal head 19 of adhering device 15 to carry out hot pressing, make it bonding.Like this, the adhesive material tape 1 of reeling on end-of-use spool 3a, has just been connected with the adhesive material tape 1 of reeling on new spool 3.Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.So, do not need adhesive material tape 1 to be installed to the operation on winding off spindle 17.In addition, owing to making, 11 of caking agents are overlapped and bonding, so strength of joint is high.
In addition, in adhesive material tape 1, while moving adhesive material tape 1 to thermal head 19 from end-of-use spool (spool that adhesive material tape 1 is extracted out completely) 3a, preferably make terminal marking 28 in the position being fixed at end-of-use spool 3a from adhesive material tape 1 on the extension position thermal head 19.In this case, if cut off near terminal marking 28, adhesive material tape 1 is cut in necessary inferior limit position, when can prevent the waste of adhesive material tape 1, can avoid in order to take off end-of-use spool 3a and terminal marking 28 to be delivered to thermal head 19 and the operation of this trouble of mobile end-of-use spool 3a.
In present embodiment, because adhering device 15 has thermal head 19, utilize this thermal head 19, carry out the caking agent 11 of terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a, with being connected between the caking agent 11 of the top part 32 of the adhesive material tape 1 of new adhesive material reel 3, therefore, do not need to be used for caking agent 11 to be crimped on mutually apparatus for pressure welding together in addition, just can roll up the spool 3 of adhesive material tape 1, the replacing of 3a.
Continuing to use winding off spindle 17, the volume number of the adhesive material tape being finished 1 is remained to a small amount of adhesive tapes and new adhesive tapes is changed, new adhesive tapes is connected in the situation (a) on winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, to near the terminal marking of adhesive material tape 1 28, cut off, upset remains in the terminal part of the adhesive material tape of winding off spindle 17 sides, makes caking agent 11 faces be positioned at upside.Next, make 11 of the caking agents of the terminal part of this adhesive material tape 1, with 11 overlaids of caking agent of the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.Afterwards, the lap of the two is placed on platform 104, utilizes the thermal head 19 of adhering device 15 to carry out hot pressing, make it bonding.Like this, be wound on the adhesive material tape 1 on winding off spindle 17, be just connected with the adhesive material tape 1 of reeling on new spool 3.Like this, due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) 9 that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape 1 of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next the 2nd embodiment of the present invention is described, below main explanation point different from the embodiment described above.
In the 2nd embodiment shown in Fig. 6, utilize the pilot tape 41 being provided with in the top part 32 of adhesive material tape 1 of new adhesive material reel 3, being connected between the adhesive material tape 1 that carries out new adhesive material reel 3 and the adhesive material tape 1 of reeling on the spool 3a using.Pilot tape 41 consists of base material 45 and 43 of the caking agents of its inner side, and the top part 32 of the adhesive material tape 1 of new adhesive material reel 3 utilizes pilot tape 41 paste and be fixed on 9 of the base materials of the adhesive material tape 1 being wound on spool.Afterwards, from 9 of base materials, peel off pilot tape 41, make it overlapping with 11 of the caking agents of the terminal part 30 of the adhesive material tape 1 having overturn.The lap of the two is placed on platform 104, utilizes thermal head 19 hot pressing of adhering device 15, make it bonding.Like this, owing to utilizing the pilot tape 41 of adhesive material tape 1, will unreel the terminal part 30 of complete adhesive material tape 1, couple together with the top part 32 of the adhesive material tape 1 of new installation, therefore, the connection between adhesive material tape 1 is simple.In addition, in this case, due to the set caking agent 43 mask toughness in inner side of the base material 45 of pilot tape 41, as long as it just can be connected with 11 overlaids of caking agent of the terminal part 30 of the adhesive material tape 1 having reversed, this method is also feasible.
The present invention is not limited to above-mentioned embodiment, can carry out without departing from the spirit and scope of the invention various distortion.
For example, in above-mentioned the 2nd embodiment, the adhesive material tape 1 that can not overturn and reel on end-of-use spool 3a, but as shown in Figure 7, the pilot tape 41 of the top part 32 of the adhesive material tape 1 of newly installing is peeled off from 9 of base materials, 11 of caking agents that stick on inner side are upper, and pilot tape 41 is connected with caking agent 11 faces of the terminal part 30 of end-of-use adhesive material tape 1, thereby the thermal head 19 of recycling adhering device 15 carries out hot pressing, carry out bonding.At this moment, owing to not needing upset to unreel complete adhesive material tape 1, thereby can prevent from occurring the danger that volume collapses when adhesive material tape 1 is wound on winding off spindle.
In addition, in this case, also the pilot tape 41 of the top part 32 of adhesive material tape 1 can be peeled off from 9 of base materials, and pilot tape 41 is mutually bonding with 9 of the base materials of end-of-use adhesive material tape 1.
Next, the invention of the 5th scheme～8th scheme is described.
It is bonding and fixedly between electronic devices and components and circuit card or circuit card time that these inventions relate to, and makes to realize the adhesive material tape being electrically connected between the two electrode, relates in particular to the method for attachment of the adhesive material tape that is wound into spool shape.
Next, the background technology of the invention of the 5th scheme～8th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and owing to changing adhesive material reel trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 5th scheme～8th scheme is to provide a kind of can carry out the replacing of adhesive material reel simply, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine improves.
Next, with reference to Fig. 8 A～Fig. 8 C, Fig. 3～Fig. 5, the 1st embodiment of the present invention is described.Fig. 8 A～Fig. 8 C is the figure of the method for attachment of the adhesive material tape of expression the 1st embodiment, Fig. 8 A is for representing the stereographic map of the connection between adhesive material reel, Fig. 8 B is the stereographic map of method of attachment of the connection portion of presentation graphs 8A, and Fig. 8 C is the vertical view of the connection portion of Fig. 8 A.
Adhesive material tape 1 is twisted in spool 3 respectively, 3a is upper, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 in each spool 3,3a.In present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 5mm.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 that is coated on a side of base material 9.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, by formations such as OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, have the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc.Conducting particles 13, can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, are formed with the made conductive layer of material that forms above-mentioned conducting particles 13.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles 13 as above of insulation layer, and conducting particles 13 and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, conducting particles 13 is owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape 1 of present embodiment is described.As shown in Figure 3, spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3a is hung on pilot pin 22 and is arranged on winding off spindle 17, extracts adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses present embodiment adhesive material tape 1, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is many, with regard to caking agent 11, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, and the adhesive material tape twisting on spool 3a is just rolled on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Fig. 8 A) of the adhesive material tape 1 twisting on spool 3a.
The method of attachment of adhesive material tape of the present invention, has (a) and (b) two kinds of situations.(a) situation is to continue to use winding off spindle 17, and the volume number of changing the adhesive material tape 1 being finished remains a small amount of adhesive tapes, and new adhesive tapes is connected on winding off spindle 17; (b) situation is the volume number of the adhesive material tape being finished 1 to be remained to a small amount of adhesive tapes as winding off spindle 17, use, and new adhesive tapes is remained to a small amount of adhesive tapes with volume number and be connected.
In (b) situation, as shown in Figure 8 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of reeling on new adhesive material reel 3 (with reference to Fig. 8 A).
The connection of this adhesive material tape 1, as shown in Fig. 8 B and Fig. 8 C, for the terminal part 30 of the adhesive material tape 1 of adhesive material reel 3a, the top part 32 with the adhesive material tape 1 of new adhesive material reel 3, makes 9 of the base materials of terminal part 30 overlapping with 11 of the caking agents of top part 32.Afterwards, on lap, insert the engaging pin 46 be roughly コ font, by the terminal part of adhesive material tape 1 30, couple together with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.
Therefore, the adhesive material tape 1 of reeling on end-of-use spool 3a, is connected with the adhesive material tape 1 of reeling on new spool 3.Like this, owing to engaging pin 46, the terminal part 30 that unreels complete adhesive material tape 1 being fixed up with the top part 32 of the new adhesive material tape 1 of installing, make to connect simple.
Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Therefore, do not need new adhesive material tape 1 to be installed to the operation on winding off spindle 17.
Continuing to use winding off spindle 17, the volume number of the adhesive material tape being finished 1 is remained to a small amount of adhesive tapes and new adhesive tapes is changed, new adhesive tapes is connected in the situation (a) on winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, to near the terminal marking of adhesive material tape 1 28, cut off, make to remain in the terminal part 30 of the adhesive material tape of winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.Afterwards, on the lap of the two, insert the engaging pin 46 be roughly コ font, by the terminal part of adhesive material tape 1 30, couple together with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.
Owing to being only wound with base material 9 on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling.Therefore, can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, the 2nd～4th embodiment to the invention of the 5th scheme～8th scheme describes, below in illustrated embodiment by same section is put on to same-sign, omit the detailed description of this part, below mainly to describing with above-mentioned the 1st embodiment difference.
In the 2nd embodiment shown in Fig. 9, the claw 48,49 that use has an end that is arranged on a side and the opposing party and the engagement device 47 of elastic component 50 that is connected the claw 48,49 at two ends, couple together the terminal part of a side adhesive material tape 1 30 and the top part 32 of the opposing party's adhesive material tape 1.Detailed says, make a side the terminal part 30 of adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape 1 toward each other, to be arranged on claw 48 engagings on engagement device 47 one end on terminal part 30, to be arranged on claw 49 engagings on the other end in top part 32, a side claw 48 furthers with the opposing party's claw 49 use elastic components 50.In addition, claw 48,49 is provided with the pawl 51 of a plurality of front end points in the inner side of board member.
Owing to being arranged on claw 48 engagings on one end of engagement device 47 on terminal part 30, afterwards, by being arranged on claw 49 engagings on the other end in top part 32, the two is interconnection, therefore make to connect easily.In addition, owing to being provided with elastic component 50 between a side claw 48 and the opposing party's claw 49, therefore claw 49 engagings that extend the opposing party that just can make engagement device 47 by elastic component 50 are on the optional position of the top part 32 of the opposing party's adhesive material tape 1, so the degree of freedom connecting is high.
In the 3rd embodiment shown in Figure 10, terminal part 30 for the adhesive material tape 1 of reeling on end-of-use spool 3a, top part 32 with the adhesive material tape 1 of new adhesive material reel 3, make 9 of the base materials of terminal part 30 overlapping with 11 of the caking agents of top part 32, afterwards, with the clip 53 that cross section is roughly the elastically deformable of コ font, clamp and fixing lap.Owing to only lap just being clamped and can be connected by clip 53, therefore connect operation easy.
In the 4th embodiment shown in Figure 11, the metal holding piece 55 that is roughly コ font by cross section encases the lap in the 1st embodiment, presses holding piece 55 the two is coupled together from the two sides of lap.Owing to connecting by pressing holding piece 55 from the two sides of lap, therefore can firmly be connected at lap.
The invention of the 5th scheme～8th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 5th scheme～8th scheme, can carry out various distortion.
For example, in above-mentioned the 1st embodiment, engaging pin 46 can not be コ the font roughly but pin of 1 wire in this case, is preferably used fixedly lap of many pins.
In the 2nd embodiment, engagement device 47 can be used a plurality of corresponding to the width of adhesive material tape 1.
In the 3rd embodiment and the 4th embodiment, clip 53 or holding piece 55 can be used a plurality of, and it is fixed from the both sides of the lap of adhesive material tape 1 respectively.
Next, the invention of the 9th scheme～13rd scheme is described.
These inventions relate to bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape that is electrically connected between the electrode of the two, are particularly rolled into the method for attachment of the adhesive material tape of reel.
Next, the background technology of the invention of the 9th scheme～13rd scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and owing to changing adhesive material reel trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 9th scheme～13rd scheme is, providing a kind of can carry out the replacing of adhesive material reel simply, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine improves.
Next, with reference to accompanying drawing, the working of an invention mode of the 9th scheme～13rd scheme is described.First, with reference to Figure 12 A, Figure 12 B, Fig. 3～Fig. 5, the 1st embodiment of the invention of the 9th scheme～13rd scheme is described.Figure 12 A, Figure 12 B be for representing the figure of method of attachment of the adhesive material tape of the 1st embodiment, and Figure 12 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 12 B is the stereographic map of method of attachment of the connection portion of presentation graphs 12A.
Adhesive material tape 1 is twisted in spool 3 respectively, 3a is upper, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 in each spool 3,3a.In present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 3mm.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 that is coated on a side of base material 9.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, adopts OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, have the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc.Can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape 1 of present embodiment is described.As shown in Figure 3, spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3a is arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses present embodiment adhesive material tape 1, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is many, with regard to caking agent 11, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, the adhesive material tape twisting on spool 3a is just rolled on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Figure 12 A) of the adhesive material tape 1 twisting on spool 3a.
The method of attachment of the adhesive material tape of the 9th scheme to the 13 schemes of the present invention, has (a) and (b) two kinds of situations.(a) situation is to continue to use winding off spindle 17, and the volume number of changing the adhesive material tape 1 being finished remains a small amount of adhesive tapes, and new adhesive tapes is connected on winding off spindle 17; (b) situation is the volume number of the adhesive material tape being finished 1 to be remained to a small amount of adhesive tapes as winding off spindle 17, use, and new adhesive tapes is remained to a small amount of adhesive tapes with volume number and be connected.
In (b) situation, as shown in Figure 12 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) of reeling on new adhesive material reel 3 (with reference to Figure 12 A).
The connection of this adhesive material tape 1, as shown in Figure 12 B, for the terminal part 30 of the adhesive material tape 1 of adhesive material reel 3a, the top part 32 with the adhesive material tape 1 of new adhesive material reel 3, makes 9 of the base materials of terminal part 30 overlapping with 11 of the caking agents of top part 32.Make the two overlap length H be about 2.5 times of width W of adhesive tapes 1, be positioned on platform 36, utilize thermal head 19 hot pressing of adhering device 15 to carry out bonding.Like this, the adhesive material tape 1 of reeling on end-of-use spool 3a, has just been connected with the adhesive material tape 1 of reeling on new spool 3.Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Therefore, do not need adhesive material tape to be installed to the operation on winding off spindle 17.
In the present embodiment, owing to utilizing thermal head 19, thereby do not need to use in addition the apparatus for pressure welding between caking agent, just can change spool 3, the 3a of coiling adhesive material tape 1.
Continuing to use winding off spindle 17, the volume number of the adhesive material tape being finished 1 is remained to a small amount of adhesive tapes and new adhesive tapes is changed, new adhesive tapes is connected in the situation (a) on winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, to near the terminal marking of adhesive material tape 1 28, cut off, make to remain in the terminal part 30 of the adhesive material tape of winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.Afterwards, utilize the two the lap of thermal head 19 hot pressing of adhering device 15 to make it bonding.Due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of this adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 9th scheme～13rd scheme describe, in following illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, below main to describing with the difference of above-mentioned embodiment.
In the 2nd embodiment shown in Figure 13, a side's of the hackle mark being had by surface (concavo-convex) 44 mutual interlocks mould 56 and the opposing party's mould 57, the lap 34 of clamping adhesive material tape 1 forms concavo-convex 58 on lap 34.Concavo-convex 58 by such formation, can increase the bond area of lap 34, and by concavo-convex 58 combination of lap 34, can increase the intensity of draw direction (length direction of adhesive material tape).Form when concavo-convex, caking agent 11 flows, and will between the end face of lap, be bonded together, and then the intensity of the draw direction of lap 34 is increased by caking agent.
In the 3rd embodiment shown in Figure 14 A and Figure 14 B, there is the top part 32 of the spool 3 of new adhesives 1 to be bent into roughly V font volume, the terminal part 30 of the adhesive material tape 1 of reeling on end-of-use spool 3a is also bent into roughly V font, thereby the two is made hook-shaped and caking agent 11 is faced one another block (Figure 14 A), utilize thermal head 19 hot pressing, the two is coupled together (Figure 14 B).In the 3rd embodiment, due to terminal part 30 and top part 32 are to hook-shaped, couple together, when therefore connecting securely, because caking agent 11 overlaps each other, connect, thereby can access more firmly, connect.Same as described above, the caking agent of lap flows, and end face is also bonded together, and therefore can access more firmly and connect.
In the 4th embodiment shown in Figure 15 A and Figure 15 B, before the hot pressing in carrying out the 1st embodiment or in hot pressing, at lap 34, open through hole 59.By opening through hole 59, caking agent 11 can ooze out they are bonded together from the surrounding of through hole 59 owing to carrying out hot pressing, therefore, can improve bonding force, thereby can firmly be connected at lap 34.
The invention of the 9th scheme～13rd scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 9th scheme～13rd scheme, can carry out various distortion.
For example, in above-mentioned the 2nd embodiment, concavo-convex 58 can not be trilateral, but with the round of circular arc.
In the 4th embodiment, the number of through hole 59 is had no particular limits, several can.In addition to the diameter of through hole 59 also not restriction.In addition, in the 2nd, 3 embodiments, also can on lap 34, form through hole 59.
Next, the invention of the 14th scheme～18th scheme is described.
These inventions relate to bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel that between the electrode of the two, are electrically connected to.
Next, the background technology of the invention of the 14th scheme～18th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.After adhesive material reel is installed, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and its top are installed on winding off spindle when adhesive material tape being hung on the guiding piece of adhering device.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and owing to changing adhesive material reel trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
On the other hand, even paste with adhesion adhesive material tape between adhesive material tape and adhesive material tape, can not be bonding with enough bonding forces.This is because be coated with the parting agent of fluorine class, due to the impact of the parting agent of silicone on adhesive material tape in order to make to have good separability between adhesive material tape and adhesives.
Therefore, the object of the invention of the 14th scheme～18th scheme is to provide a kind of method of attachment of adhesive material tape, particularly in the situation that the base material of adhesive material tape use by the base material of silicone-treated, also can carry out simply the replacing of adhesive material reel, realize the raising of the production efficiency of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 14th scheme～18th scheme is described.First, with reference to Figure 16 A, 16B, Fig. 3～Fig. 5, the 1st embodiment of the invention of the 14th scheme～18th scheme is described.Figure 16 A and Figure 16 B be for representing the figure of method of attachment of the adhesive material tape of the 1st embodiment, and Figure 16 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 16 B is the stereographic map of method of attachment of the connection portion (b) of presentation graphs 16A.
Adhesive material tape 1 is twisted in spool 3 respectively, 3a is upper, and each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.
Adhesive material tape 1 consists of silicone-treated base material 9 and the caking agent 11 being coated on a side of silicone-treated base material 9.
Silicone-treated base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, use the base materials such as OPP (extended polypropylene), tetrafluoroethylene, PET (polyethylene terephthalate), on its surface, utilize silicone resin etc. to carry out surface treatment.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in Figure 3, spool 3a and the winding off spindle 17 of adhesive material tape 1 is installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3a is arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spool 3a, 17, from 9 side pressures of silicone-treated base material, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, silicone-treated base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses present embodiment adhesive material tape 1, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is many, with regard to caking agent 11, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, the adhesive material tape twisting on spool 3a is just rolled on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Figure 16 A) of the adhesive material tape 1 twisting on spool 3a.
The method of attachment of the adhesive material tape of the invention of the 14th scheme～18th scheme, has (a) and (b) two kinds of situations.(a) situation is to continue to use winding off spindle 17, and the volume number of changing the adhesive material tape 1 being finished remains a small amount of adhesive tapes, and new adhesive tapes is connected on winding off spindle 17; (b) situation is the volume number of the adhesive material tape being finished 1 to be remained to a small amount of adhesive tapes as winding off spindle 17, use, and new adhesive tapes is connected with the adhesive tapes that volume number remains a small amount of volume.
In (b) situation, as shown in Figure 16 A, on the adhesive material tape 1 of spool 3a, exposed terminal marking 28, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) of reeling on new adhesive material reel 3.
The connection of this adhesive material tape 1, as shown in Figure 16 B, make the terminal part 30 of the adhesive material tape 1 of adhesive material reel 3a, with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3 toward each other, across the surface of the silicone-treated base material 9,9 of two adhesive material tapes 1,1, paste upper silicone adhesion zone 60, two adhesive material tapes 1,1 are coupled together.
This silicone adhesion zone 60, consists of base material 63 and the silicone tackiness agent 62 being coated with on the one side of base material 63.To the material of base material 63, there is no particular limitation, in present embodiment, is polyimide resin material.In addition, in Figure 16 B, the caking agent 11 of adhesive material tape represents with oblique line respectively with the caking agent part 43 of silicone adhesion zone 60.
Here, to describing by the bonding of silicone adhesion zone 60.On the silicone-treated base material 9,9 of one side and the opposing party's adhesive material tape 1,1, be coated with respectively silicone, therefore utilize caking agent bonding very difficult; But in the present embodiment, by adopting silicone resin in the tackiness agent 43 at silicone adhesion zone 60, make the capillary difference between itself and two silicone-treated base materials 9,9 less, by making its closely sealed (bonding), the terminal part of a side adhesive material tape 1 30 and the top part 32 of the opposing party's adhesive material tape 1 are coupled together well.Surface tension between the surface of the silicone tackiness agent 62 in silicone adhesion zone 60 and silicone-treated base material 9,9 surfaces is poor preferably below 10mN/m (10dyne/cm), and in present embodiment, surface tension is poor almost not to be had.
In general, the terminal part 30 of one side's adhesive material tape 1 is 25mN/m～60mN/m (25～60dyne/cm) with the surface tension of two silicone-treated base materials 9,9 of the opposing party's adhesive material tape 1, for example, surface tension is in the situation of 30mN/m, more than the surface tension of the silicone tackiness agent 62 of silicone adhesion zone 60 is set as to 20mN/m, below 40mN/m.
Silicone tackiness agent mainly consists of silicon rubber and silicone resin, make the two that condensation reaction occur slightly and show tackiness, in addition, generally crosslinked by utilizing the hydrosilylation reactions of superoxide, platinum catalyzer to produce, make glass tansition temperature for below-100 ℃.These silicone tackiness agents are existing commercially available, can be advantageously applied to this.
Like this, use silicone adhesion zone 60, by the adhesive material tape 1 of reeling on end-of-use adhesive material reel 3a, couple together with the adhesive material tape 1 of reeling on new adhesive material reel 3.Next, change end-of-use adhesive material reel 3a and new adhesive material reel 3, new adhesive material reel 3 is installed on adhering device 15.Therefore, owing to not needing that the adhesive material tape of new adhesive material reel 31 is extracted out, adhesive material tape is installed on winding off spindle 17, or new adhesive material tape 1 is hung over to the first-class operation of guiding piece 36 of adhering device 15, so the replacing operating efficiency of adhesive material reel 3,3a is fine.Like this, owing to unreeling the terminal part 30 of complete adhesive material tape 1, utilize silicone adhesion zone to be connected with the top part 32 of the adhesive material tape 1 of new installation, therefore connect simple.
Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Therefore, do not need adhesive material tape 1 to be installed to the operation on winding off spindle 17.
Continuing to use winding off spindle 17, the volume number of the adhesive material tape being finished 1 is remained to a small amount of adhesive tapes and new adhesive tapes is changed, new adhesive tapes is connected in the situation (a) on winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, to near the terminal marking of adhesive material tape 1 28, cut off, make to remain in the terminal part 30 of the adhesive material tape of winding off spindle 17 sides, with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3 toward each other.Afterwards, in the part toward each other of the two, utilize silicone adhesion zone by the terminal part of adhesive material tape 1 30, be connected with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.Due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of this adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent that utilizes coater 27 coating resins and conducting particles to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 14th scheme～18th scheme describe, in following illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, below main to describing with the difference of above-mentioned embodiment.
In the 2nd embodiment shown in Figure 17, be on the basis of above-mentioned the 1st embodiment, in 11 sides of caking agent of a side the terminal part 30 of adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape, also pasted silicone adhesion zone 60.The silicone tackiness agent 62 of the silicone adhesion zone 60 of the 2nd embodiment, its bonding force is more than 100g/25mm, in present embodiment, is 700g/25mm～1400g/25mm.In addition, the surface tension of the silicone tackiness agent 62 of silicone adhesion zone 60, the same with above-mentioned embodiment, the difference between the surface tension of the silicone base material of a side and the opposing party's adhesive material tape is set as below 10mN/m (10dyne/cm).In this 2nd embodiment, on the terminal part 30 of the adhesive material tape 1 a side and the two sides of the top part 32 of the opposing party's adhesive material tape, therefore by silicone adhesion zone 60, undertaken bondingly, can two adhesive material tapes 1,1 be bonded together with the intensity higher than the 1st embodiment.
In the 3rd embodiment shown in Figure 18, top part 32 overlay configuration by the terminal part of a side adhesive material tape 1 30 with the opposing party's adhesive material tape 1, in its silicone-treated base material 9 sides and adhesives 11 sides, paste the silicone adhesion zone 60 of the 2nd embodiment, by adopting the 3rd embodiment, can play the action effect identical with the 2nd embodiment.
In the 4th embodiment shown in Figure 19, between a side the terminal part 30 of adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape 1, by the two sides of base material, be all coated with the silicone adhesion zone 61 of silicone tackiness agent 62, terminal part 30 and top part 32 are coupled together.By adopting the 4th embodiment, by using two-sided silicone adhesion zone 61, can allow between a side the terminal part 30 of adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape 1 be connected more simple and easily.
Next, the invention of the 19th scheme～21st scheme is described.
These inventions relate to bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel that between the electrode of the two, are electrically connected to.
Next, the background technology of the invention of the 19th scheme～21st scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and owing to changing adhesive material reel trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 19th scheme～21st scheme is to provide a kind of can carry out the replacing of adhesive material reel simply, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine improves.
Next, with reference to accompanying drawing, the working of an invention mode of the 19th scheme～21st scheme is described.First, with reference to Figure 20 A～Figure 20 C, Figure 21, Fig. 4 and Fig. 5, the 1st embodiment of the invention of the 19th scheme～21st scheme is described.Figure 20 A～Figure 20 C is for representing the figure of method of attachment of the adhesive material tape of present embodiment, and Figure 20 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 20 B and Figure 20 C are the sectional view of method of attachment of the connection portion of presentation graphs 20A.
Adhesive material tape 1 is twisted in spool 3 respectively, 3a is upper, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 in each spool 3,3a.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 that is coated on a side of base material 9.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in figure 21, spool 3a and the winding off spindle 17 of adhesive material tape 1 are installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3a is hung on pilot pin 22 and is arranged on winding off spindle 17, extracts adhesive material tape 1 (arrow E in Figure 21) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses present embodiment adhesive material tape 1, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is many, with regard to caking agent 11, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, the adhesive material tape twisting on spool 3a is just rolled on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Figure 20 A) of the adhesive material tape 1 twisting on spool 3a.
The method of attachment of the adhesive material tape of the invention of the 19th scheme～21st scheme, has (a) and (b) two kinds of situations.(a) situation is to continue to use winding off spindle 17, and the volume number of changing the adhesive material tape 1 being finished remains a small amount of adhesive material tape, and new adhesive tapes is connected on winding off spindle 17; (b) situation is the volume number of the adhesive material tape being finished 1 to be remained to a small amount of adhesive tapes as winding off spindle 17, use, and new adhesive tapes is remained to a small amount of adhesive tapes with volume number and be connected.
In (b) situation, as shown in FIG. 20 A, while having exposed terminal marking 28 on the adhesive material tape 1 of spool 3a, for spool 3a is replaced by new adhesive material reel 3, use resin caking agent 64 by the terminal part 30 of the adhesive material tape of spool 3a (side adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of reeling on new adhesive material reel 3.
As resin caking agent 64, for example can enumerate epoxy resin, cyanate ester resin, bimaleimide resin, resol, urea resin, melamine resin, Synolac, acrylic resin, unsaturated polyester resin, diallyl phthalate ester resin, silicone resin, resorcinol formaldehyde resin, xylene resin, furane resin, polyurethane resin, ketone resin, triallyl cyanurate resin etc.
The connection of this adhesive material tape 1, as shown in Figure 20 B, for the terminal part 30 of the adhesive material tape 1 of adhesive material reel 3a, the top part 32 with the adhesive material tape 1 of new adhesive material reel 3, makes 9 of the base materials of terminal part 30 overlapping with 11 of the caking agents of top part 32.Afterwards, from the tucker 65 being assembled in adhering device 15, the resin caking agent 64 of pasty state is coated on lap.Afterwards, as shown in Figure 20 C, by being assembled in the heating of the well heater 66 in adhering device 15, in the situation that resin caking agent 64 is thermosetting resin, by making its sclerosis, the terminal part of adhesive material tape 1 30 and the top part 32 of the adhesive material tape 1 of new adhesive material reel 3 are coupled together.
Therefore, the adhesive material tape 1 of reeling on end-of-use spool 3a, is connected with the adhesive material tape 1 of reeling on new spool 3.Like this, owing to resin caking agent 64, the terminal part 30 that unreels complete adhesive material tape 1 being fixed up with the top part 32 of the new adhesive material tape 1 of installing, connect simple.
Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Therefore, do not need adhesive material tape 1 to be installed to the operation on winding off spindle 17.
Continuing to use winding off spindle 17, the volume number of the adhesive material tape being finished 1 is remained to a small amount of adhesive tapes and new adhesive tapes is changed, new adhesive tapes is connected in the situation (a) on winding off spindle 17, when the terminal marking 28 of the adhesive material tape 1 of end-of-use spool 3a is exposed, to near the terminal marking of adhesive material tape 1 28, cut off, make to remain in the terminal part 30 of the adhesive material tape of winding off spindle 17 sides, overlapping with the top part 32 of the adhesive material tape 1 of new adhesive material reel 3.Afterwards, the resin caking agent 64 of pasty state is coated on the lap of the two, according to the kind of used resin caking agent heat, uviolizing etc., can bring into play bonding force, terminal part 30 and the top part 32 of the adhesive material tape 1 of new adhesive material reel 3 are coupled together.Due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape 1 of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
The invention of the 19th scheme～21st scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 19th scheme～21st scheme, can carry out various distortion.
In present embodiment, as resin caking agent 64, take thermosetting resin as example, but also can use light-cured resin to replace thermosetting resin, by rayed such as ultraviolet rays, light-cured resin is hardened, carry out the connection between adhesive material tape 1.
In this case, as light-cured resin, can use and in thering is acrylate-based or methacrylate based resin, be combined with the composition of Photoepolymerizationinitiater initiater, the epoxy resin that contains the light curing agents such as aromatic series diazonium salt, diallyl salt compounded of iodine, sulfonium salt etc.
In addition, as resin caking agent, can use the heatmeltable adhesives that main component is cyclopropyl acetoacetic ester resin and polyolefin resin, for example, in the situation that using laminar heatmeltable adhesives, the part overlapping each other at adhesive material tape 1, laminar heatmeltable caking agent on volume, heats and makes after its fusing with 66 pairs of heatmeltable caking agents of well heater, by the cooling heatmeltable caking agent that makes, solidify, thereby adhesive material tape 1 is interconnected.
The resin caking agent that is used for the connection of adhesive material tape 1, can be used select from thermosetting resin, light-cured resin, heatmeltable caking agent group multiple.
In above-mentioned embodiment, by making 9 of the base materials of terminal part 30 of the adhesive material tape 1 of adhesive material reel 3a, overlap with 11 of the caking agents of the top part 32 of the adhesive material tape 1 of new adhesive material reel 3, coating connects as the thermosetting resin of resin caking agent, but the terminal part 30 of the adhesive material tape 1 of the adhesive material reel 3a that also can overturn, caking agent 11 faces are overlapped each other and after the two is bonding, then be fixed by thermosetting resin.
Next, the invention of the 22nd scheme～24th scheme is described.
These inventions relate to bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape that is electrically connected between the electrode of the two, are particularly rolled into adhesive material tape spool and the adhering device of reel.
Next, the background technology of the invention of the 22nd scheme～24th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, there is the adhesive material tape spool of adhesive material tape to be arranged on adhering device volume on spool, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material tape spool, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of a side adhesive material tape spool is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material tape spool are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material tape spool increases, and owing to changing adhesive material tape spool trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 22nd scheme～24th scheme is to provide a kind of can carry out the replacing of adhesive material tape spool simply, realizes adhesive material tape spool and the adhering device of the production efficiency raising of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 22nd scheme～24th scheme is described.First, with reference to Figure 22 A～Figure 22 C, Figure 23, Fig. 4 and Fig. 5, the 1st embodiment of the invention of the 22nd scheme～24th scheme is described.Figure 22 A～Figure 22 C is for representing the figure of the adhesive material tape spool of the 1st embodiment, Figure 22 A is for representing the stereographic map of adhesive material tape spool, Figure 22 B is the front view of Figure 22 A, Figure 22 C is the vertical view of the connecting band of Figure 22 A, and Figure 23 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
As shown in Figure 22 A, the adhesive material tape spool A of present embodiment, has winding part (hereinafter referred to as winder) 2, the 2a of a plurality of adhesive material tapes, in winder 2,2a, is wound with respectively adhesive material tape 1 on spool 3,3a.Each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 23, adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
In a plurality of winders 2,2a, the terminal part 30 of the adhesive material tape of reeling in one side's winder 2 (hereinafter referred to as a side adhesive material tape) 1, and between the top part 32 of the adhesive material tape of reeling in the opposing party's winder (hereinafter referred to as the opposing party's adhesive material tape) 1, be provided with the connecting band 67 that connects the two.Connecting band 67, the medial surface configuration from the terminal part 30 of a side adhesive material tape 1 along the side plate 7 of spool 3, and be stuck in the formed notch part 68 in top of side plate 7 and be connected with the top part 32 of the opposing party's adhesive material tape 1.
In addition, in the part that one side and the opposing party's adhesive material tape 1 is connected with connecting band 67, be provided with the mark 69,70 that can identify connecting band 67, when detecting mark 69,70 with belt proofing unit (luminescent part 71, light-receiving part 72), skip connecting band 67 parts, in connecting band 67 parts, do not carry out crimping.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily connecting material corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape spool A of present embodiment is described.As shown in figure 23, adhesive material tape spool A and winding off spindle 17 are installed on adhering device 15, the top part 32 of a side adhesive material tape 1 are hung on pilot pin 22 and be arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Figure 23) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect in fact as described below carrying out, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The PDP that uses the adhesive material tape 1 of present embodiment, its size is larger, sometimes will carry out crimping around to the whole of PDP, connection portion is many, with regard to caking agent 11, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3 also becomes many, and the adhesive material tape twisting on spool 3 is just rolled on winding off spindle 17 for 1 within a short period of time.
One side's adhesive material tape 1 unreel complete after, connecting band 67 is taken out from notch part 68, next carry out the extraction of the opposing party's adhesive material tape 1.In present embodiment, owing to thering is the connecting band 67 that is connected both between the terminal part 30 of the adhesive material tape 1 a side and the top part 32 of the opposing party's adhesive material tape 1, once thereby a side adhesive material tape 1 unreels completely, can then start to extract out the opposing party's adhesive material tape 1.Therefore, after a side adhesive material tape 1 has unreeled, do not need new adhesive material tape 1 to be installed to the operation on winding off spindle 17, improved the production efficiency of e-machine.
In addition, adhering device 15 has a pair of luminescent part 71 and light-receiving part 72 as shown in figure 23, and connecting band 67 is carried out to optical detection.Connecting the two the two ends of connecting band 67 of a side adhesive material tape 1 and the opposing party's adhesive material tape 1 and be provided with the mark 69,70 of black.Luminescent part 71, continuously to adhesive material tape 1 Emission Lasers, receives its reflected light by light-receiving part 72, and this detection signal is sent to control device 79.Like this, the reflected light of the mark 69,70 at the two ends of light-receiving part 72 reception connecting bands 67, sends to control device 79 by this detection signal.
Received the control device 79 of detection signal, the motor output control signal to driving two spools 3,17 of adhering device 15, starts to motor, to export driving pulse by motor driver.Afterwards, motor, corresponding to the umber of pulse rotation applying from motor driver, makes two spools 3,17 move to exceed the speed of common speed, makes adhesive material tape 1 move the distance corresponding to the length of connecting band 67 to unreeling direction simultaneously.
Like this, because the opposing party's adhesive material tape 1 is retracted to the position of thermal head 19 automatically, therefore, until the top part 32 of the opposing party's adhesive material tape 1 arrives before the position of thermal heads 19, can save the trouble of extracting connecting band 67 out.
In addition, due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape spool A of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent that utilizes coater 27 coating resins and conducting particles to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 22nd scheme～24th scheme describe, in following illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the 2nd embodiment shown in Figure 24, by the width T of connecting band 67 is done littlely than the width W of the adhesive material tape of front and back 1, identify connecting band 67.In addition, in adhering device 15, on the position of facing mutually of adhesive material tape 1, be provided with luminescent part and the light-receiving part identical with the 1st embodiment clipping.In this case, by light-receiving part, receive the laser seeing through from the width narrower part of connecting band 67, connecting band 67 is identified.
In the 3rd embodiment shown in Figure 25, by form a plurality of holes 53 on connecting band 67, identify connecting band 67.In this case, also by light-receiving part, receive the laser seeing through from the hole 53 of connecting band 67, connecting band 67 is identified.
In the 4th embodiment shown in Figure 26, the connection of not undertaken between adhesive material tape 1 by connecting band 67, but when a side adhesive material tape 1 unreel complete after, the opposing party's adhesive material tape 1 is wound up on winding off spindle 17, carry out the replacing of adhesive material tape 1.In this case too, owing to not needing the adhesive material tape spool by new to be installed on adhering device, therefore, can reduce the replacing operation of new adhesive material tape spool, improve the production efficiency of e-machine.
The invention of the 22nd scheme～24th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 22nd scheme～24th scheme, can carry out various distortion.
For example, in the above-mentioned the 1st and the 2nd embodiment, to the not special restriction of winder 2,2a, be several can.
In the 1st to the 3rd embodiment, connecting band 67 is carried out to optical detection, but also can on this connecting band 67, roll up and have tape, with Magnetic Sensor, it is detected.
Next, the invention of the 25th scheme～28th scheme is described.
These inventions relate to a kind of when between electronic devices and components and circuit card or circuit card, crimping is fixed up, and make the adhesive material tape being electrically connected between the electrode of the two.In addition, also relate to the fixing tube core with support substrate, lead frame at lead frame, the adhesive material tape using in semiconductor device bonding on support substrate and fixedly semiconductor element (chip), particularly a kind of method of attachment that is rolled into adhesive material tape spool, adhering device and the adhesive material tape of reel for semiconductor element mounting.
Next, the background technology of the invention of the 25th scheme～28th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.In addition, adhesive material tape is for the adhesive film of the lead-in wire fixing strip of lead frame, LOC band, chips incorporate band, micro-BGACSP etc. etc., for improving productivity, the reliability of semiconductor device integral body.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with adhesives on base material has been wound into reel.
Electrode connecting adhesive material webs before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, there is the adhesive material tape spool of adhesive material tape to be arranged on adhering device volume on spool, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material tape spool, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of a side adhesive material tape spool is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material tape spool are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material tape spool increases, and owing to changing adhesive material tape spool trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 25th scheme～28th scheme is to provide a kind of can carry out the replacing of adhesive material tape spool simply, realizes adhesive material tape spool, adhering device and the method for attachment of raising of the production efficiency of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 25th scheme～28th scheme is described.First, with reference to Figure 27 A～Figure 27 C, Figure 28, Fig. 4, Figure 29 and Fig. 5, the 1st embodiment of the invention of the 25th scheme～28th scheme is described.Figure 27 A～27C is for representing the figure of the adhesive material tape spool of the 1st embodiment, and Figure 27 A is for representing the stereographic map of adhesive material tape spool, and Figure 27 B is the front view of Figure 27 A, and Figure 27 C is the sectional view of the connection portion of Figure 27 A.Figure 28 is the schematic diagram of the crimping process of the caking agent of expression adhering device, and Figure 29 is the stereographic map of the use state of the caking agent of expression PDP.
The adhesive material tape spool A of present embodiment, has winding part (hereinafter referred to as winder) 2, the 2a of a plurality of adhesive material tapes 1, has the spool 3, the 3a that are wound with adhesive material tape 1 on winder 2,2a.Each spool 3,3a are provided with volume core 5 and are configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 28, adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
In a plurality of winders 2,2a, the terminal part 30 of the adhesive material tape of reeling in one side's winder 2 (hereinafter referred to as a side adhesive material tape) 1, and between the top part 32 of the adhesive material tape of reeling on the opposing party's winder 2a (hereinafter referred to as the opposing party's adhesive material tape) 1, use fastener 76 to couple together.Fastener 76 is for example roughly the engaging pin of コ font for cross section, make a side the terminal part 30 of adhesive material tape 1 and the top part 32 of the opposing party's adhesive material tape 1 overlapping, inserts engaging pin both are coupled together at this lap.
In addition, in present embodiment, connection portion 74 is as shown in Figure 27 C, after terminal part 30 and top part 32 being coupled together by fastener 76, by by connection portion 74 at the length direction of belt 180 degree that turn back, thereby with adhesive material tape 1, fastener 76 is covered.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, crylic acid resin, silicone resin class.
In caking agent 11, can be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and/or dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape spool of present embodiment is described.As shown in figure 28, adhesive material tape spool A and winding off spindle 17 are installed on adhering device 15, the top part 32 of a side adhesive material tape 1 are hung on pilot pin 22 and be arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Figure 28) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connects adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through the polytetrafluoroethylmaterial material 24 as cushioning material, utilizes thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The connection portion of the PDP26 of the adhesive material tape 1 of use present embodiment is as shown in figure 29 known, and caking agent 11 around carries out crimping the whole of PDP, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, it is many that the usage quantity of adhesive material tape 1 also becomes, and the adhesive material tape twisting on spool 3,3a is just rolled onto on winding off spindle 17 for 1 within a short period of time.
In present embodiment, a side adhesive material tape 1 unreel complete after, connection portion 74 is taken out from notch part 75, next the opposing party's adhesive material tape 1 is extracted out to (Figure 27 B).In present embodiment, because a side the terminal part 30 of adhesive material tape 1 and the top part 32 use fasteners 76 of the opposing party's adhesive material tape 1 are connected, therefore,, once that a side adhesive material tape 1 unreels is complete, can then start to extract out the opposing party's adhesive material tape 1.Therefore, when a side adhesive material tape 1 unreel complete after, do not need new adhesive material tape 1 to be installed to the operation on winding off spindle 17, improved the production efficiency of e-machine.In addition, in connection portion 74, because fastener 76 is covered by adhesive material tape 1, so outward appearance is good, meanwhile, can prevent that the fastener 76 of connection portion 74 from contacting with adhesive material tape 1, damage adhesive material tape 1.
In addition, adhering device 15 as shown in figure 28, has the thickness detecting sensor as connection section detecting sensor 47, and optical detection is carried out in connection portion 74, makes connection portion 74 skip the part of thermal head 19.One side's adhesive material tape 1 and the connection portion 74 of the opposing party's adhesive material tape 1, as shown in Figure 27 C, compare greatly with the thickness of adhesive material tape 1, by detecting the difference of thickness, thus identification connection portion 74.Thickness detecting sensor 47, detects the thickness of adhesive material tape 1 when normal, and this detection signal is sent to control device 79.
Received the control device 79 of detection signal, the motor output control signal to driving two spools 3,17 of adhering device 15, starts to motor, to export driving pulse by motor driver.Afterwards, motor rotates corresponding to the umber of pulse being applied by motor driver, make two spools 3,17 to exceed the speed rotation of common speed, make simultaneously adhesive material tape 1 to unreel direction move length with the delivery direction of connection portion 74 corresponding to set a distance.
Like this, because the opposing party's adhesive material tape 1 is sent to the position of thermal head 19, therefore, the connection portion 74 that can prevent a side and the opposing party's adhesive material tape 1 arrives the position of thermal heads 19 and implements the fault of crimping action and so on.In addition, until the trouble of reeling, by before thermal head 19, owing to automatically a side adhesive material tape 1 being wound up on winding off spindle 17, thereby can be saved in connection portion 74.
In addition, utilize thickness detecting sensor 47, can identify leading section 74a and the rearward end 74b of connection portion 74, if only allow connection portion 74 skip, thereby can effectively utilize adhesive material tape 1.
In addition, due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is high.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, together wires up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 25th scheme～28th scheme describe, below in illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the 2nd embodiment shown in Figure 30, do not use the adhesive material tape spool A with a plurality of winders 2,2a, and use the adhesive material tape spool 2c with 1 winder.In this case, when adhesive material tape 1 is wound up on winding off spindle 17, while having exposed terminal marking 28 on one side's adhesive material tape 1, for a side adhesive material tape spool 2b and new adhesive material tape spool 2c are changed, the terminal part of a side adhesive material tape 1 30 and the top part 32 of the opposing party's adhesive material tape 1 are coupled together.
In this case, also can detect connection portion 74 by the thickness detecting sensor 77 as connection section proofing unit, connection portion 74 is skipped from the part of thermal head 19.
The invention of the 25th scheme～28th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 25th scheme～28th scheme, can carry out various distortion.
For example, in the above-mentioned the 1st and the 2nd embodiment, by the fastener 76 that connects adhesive material tape 1 and be interconnected, be not limited to engaging pin, the method that can also the lap of the two be clamped and is fixed up for be roughly the clip of the elastically deformable of コ font with cross section, or the tinsel that is roughly コ font with cross section is clamped the lap of the two, from the two sides of lap, presses holding piece, the method that the two is coupled together.
In the 1st and the 2nd embodiment, by used thickness detecting sensor 47, detect the thickness of connection portion 74, connection portion 74 is identified, but be not limited to this, can also use transmitance detecting sensor identification connection portion 74, or use CCD photographic camera, the surface of connection portion is absorbed in monitor picture, by comparing the deep or light of pixel, detect connection portion.
In Figure 31 A, Figure 31 B, Figure 32 A～Figure 32 C, represented by the fixing adhesive material tape being connected with semiconductor element with the tube core of support substrate or lead frame with support substrate, semiconductor element mounting of lead frame fixing bonding and be fixed to an example of LOC (the Lead on Chip) structure on lead frame with support substrate and semiconductor element by lead frame.
Use the carrying out of thick 50 μ m the two sides of the supporting films 78 such as surface-treated polyimide film, add the adhesive material tape of formation of this Figure 31 A of bond layer 80 such as polyamideimides bond layer of thick 25 μ m, obtain the semiconductor device of the LOC structure shown in Figure 31 B.Use the press tool 87 (punch (protuberance) 95, die (recess) 96) of the adhering device shown in Figure 32 A～Figure 32 C, adhesive material tape shown in Figure 31 A is struck out to rectangle, for example, on the lead frame of making at the iron nickel alloy of thick 0.2mm, lift-launch is spaced apart 0.2mm, wide is the internal lead of 0.2mm, under the pressure of 400 ℃ and 3MPa, pressurizes and within 3 seconds, carries out crimping, makes the lead frame with adhesive film for semiconductor.Next, by other operations, in caking agent aspect at this with the lead frame of adhesive film for semiconductor, under the pressure of the temperature of 350 ℃ and 3MPa, to semiconductor element, crimping is carried out in pressurization for 3 seconds, afterwards, with metal wire, lead frame and semiconductor element wire-bonded are got up, use the packaged materials such as epoxy resin molding material, by transfer moudling, encapsulate, obtain the semiconductor device as shown in Figure 31 B.In Figure 31 A, Figure 31 B, 81 is the adhesive film for semiconductor being stamped to form by adhesive material tape, and 82 is semiconductor element, and 83 is lead frame, and 84 is packaged material, and 85 is bonding wire, and 86 is bus.Figure 32 A, Figure 32 B, Figure 32 C are adhering device, in Figure 32 A, Figure 32 B, 87 is that press tool, 88 is that lead frame transport unit, 89 is that adhesive tapes punching press paste section, 90 is that heater block, 91 is that adhesive material tape spool (adhesive material tape unreels portion), 92 is that adhesive material tape (adhesive film for semiconductor), 93 is adhesive material tape let off roll.In addition, in Figure 32 C, 94 is that adhesive material tape (adhesive film for semiconductor), 95 is that punch (protuberance), 96 is that die (recess), 97 is pressuring diaphragm.Adhesive material tape 92, from adhesive material tape spool (adhesive material tape unreels portion) 91, unreeled continuously, by adhesive material tape punching press paste section 89, strike out rectangle, mutually bonding with the leading part of lead frame, as the lead frame with adhesive film for semiconductor, from lead frame transport unit, be transmitted out.The adhesive material tape being stamped to form sends out from adhesive material tape let off roll 93.
Same as described above, use adhesive material tape that semiconductor element is connected on semiconductor element mounting substrate.In addition, the tube core of lead frame is connected with semiconductor element and is bonded together equally.Adhesives is with following situation: just for bonding and fixing situation; According to object, use the caking agent that passes through contact or be electrically connected to through electroconductive particle between electrode, and use the situation of supporting film; Situation about only being formed by caking agent.
Next, the invention of the 29th scheme～34th scheme is described.
These inventions relate to bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive tapes being electrically connected between the electrode of the two, particularly a kind of compression bonding method that is rolled into the adhesive tapes of reel, the manufacture method of adhesive tapes and adhesive tapes.
Next, the background technology of the invention of the 29th scheme～34th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive tapes.
In TOHKEMY 2001-284005 communique, disclose the adhesive tapes that is coated with caking agent on base material has been wound into reel.
Adhesive tapes before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right, first adhesive tapes is unreeled and after caking agent is crimped onto on circuit card, is not just re-used from spool.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, and due to the spool trouble more renewing, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive tapes on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive tapes is narrow in 1～3mm, if the number of turns increases, just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive film and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive tapes, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 29th scheme～34th scheme is to provide a kind of number of turns that does not increase adhesive tapes just can increase the compression bonding method of the adhesive tapes of bonding dosage, the manufacture method of adhesive tapes and adhesive tapes.
Next, with reference to accompanying drawing, the working of an invention mode of the 29th scheme～34th scheme is described.First, with reference to Figure 33 A, Figure 33 B, Fig. 3, Fig. 4, Figure 34, Fig. 5 and Figure 35, the 1st embodiment of the invention of the 29th scheme～34th scheme is described.The figure that Figure 33 A and Figure 33 B are adhesive tapes, Figure 33 A is for rolling up the stereographic map of the spool that has adhesive tapes, and Figure 33 B is the A-A line sectional view of Figure 33 A.Figure 34 is the stereographic map of the use state of the caking agent of expression PDP.Figure 35 is the sectional view that is illustrated in the operation of coating adhesive on base material.
The adhesive tapes 1 of present embodiment is twisted on spool 3, is provided with volume core 5 and the side plate 7 that is configured in the width both sides of adhesive tapes 1 on spool 3.In present embodiment, the length of adhesive tapes 1 is about 50m, and width W is about 10mm.
Adhesive tapes 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9, is spaced the caking agent 11 that 5 every width are 0.5mm on base material 9.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, crylic acid resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive tapes of present embodiment is described.Spool 3 and empty winding off spindle 17 that adhesive tapes 1 is installed on adhering device 15, be arranged on the front end that twists in the adhesive tapes 1 of spool 3 on empty winding off spindle 17, extracts adhesive tapes 1 (arrow E in Fig. 3) out.Afterwards, adhesive tapes 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connects adhesive tapes 1, the caking agent of 1 amount 11 is crimped onto on circuit card.Afterwards, base material 9 is rolled onto on empty winding off spindle 17 with together with remaining caking agent 11.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect exactly wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21 in fact, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
As shown in figure 34, use the connection portion of PDP26 of the adhesive tapes 1 of present embodiment, PDP whole, carry out crimping around, nonrecoverable caking agent 11 amounts with compared in the past very many.Therefore, the usage quantity that twists in the adhesive tapes 1 on spool 3 also becomes many, and the adhesive tapes twisting on spool 3 is just rolled on empty winding off spindle 17 for 1 within a short period of time, and spool 3 becomes empty.
When spool 3 becomes empty, spool 3 and winding off spindle 17 reverses respectively, specifically by become sky spool 3 reel, the travel direction of adhesive tapes 1 is by (the arrow F in Fig. 3) conversely.
Like this, each of caking agent 11 is converted to the coiling direction (E, F) of adhesive tapes 1 in turn, caking agent 11 is crimped onto on circuit card 21.
Next, with reference to Fig. 5 and Figure 35, the manufacture method of the adhesive tapes 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.As shown in figure 35, the width to the 10mm of base material 9, disposes 5 coaters 27 to coater 27, is coated with 5 caking agents 11 on the width of 10mm.The master of the adhesive tapes of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 29th scheme～34th scheme describe, below in illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, thereby omit the detailed description of this part, mainly point different from the embodiment described above is described below.
On the adhesive tapes 1 of the 2nd embodiment shown in Figure 36 A～Figure 36 C, on the whole surface of the one side of base material, with width W coating adhesive, by the slit 35 being formed on the length direction of base material, caking agent is separated into many in width W direction.In the adhesive tapes 1 of the 2nd embodiment, preferably, after spool 3 is arranged on adhering device 15, before being about to be crimped onto on circuit card 21, adhesive tapes 1 forms slit 35.In this case, both can be near the spool installation portion of adhering device 15 (in Fig. 3, with S, representing) cutting knife is installed, on the caking agent 11 of unreeled adhesive tapes 1, form slit 35, also can be when the manufacture of adhesive tapes as shown in Figure 5, in completing operation, form slit, be wound up into afterwards on spool, before can also being about to reel with up-coiler 31, be formed slit in applying operation after dry.
While using the adhesive tapes 1 of the 2nd embodiment in adhering device 15, identical with the 1st embodiment, from base material 9 sides, with 19 pairs of thermal heads, every 1 caking agent by slit 35 separation carries out crimping, as shown in Figure 36 A, 36B, 36C, uses in turn.
In the 2nd embodiment, owing to only just obtaining many caking agents 11 by forming slit 35 on the caking agent on the resulting base material of the operation the same as before, therefore easy to manufacture.
In the 3rd embodiment shown in Figure 37 A～Figure 37 C, be coated with caking agent 11 (Figure 37 A) on the whole surface of base material 9, the width W of base material 9 and caking agent 11 is identical with above-mentioned embodiment, is 5～1000mm.And, also be arranged on adhering device 15 on the same with the 1st embodiment in use, the adhesive tapes of extracting out from spool 31 is configured on circuit card 21, a part (one) by the caking agent in the width W direction to adhesive tapes 1 is carried out hot pressing (Figure 37 B), the cohesive force of this part is reduced, thereby only allow by the caking agent of hot pressing part separated and be crimped into (Figure 37 C) on circuit card 21 from base material.
In this case, preferably the circumferential wire along thermal head 19 forms cohesive force droop line, make caking agent softened and flow by the major part of hot pressing part, (target is that 100 pools are following), and the sclerous reaction in caking agent not yet starts or low-end trim (target is that reactivity is below 20%), and Heating temperature is selected according to used caking agent class.
According to the 3rd embodiment, because thereby caking agent 11 only allows in width W softening flowing one by one be crimped on circuit card in use, therefore, identical with above-mentioned embodiment, by making spool 3 and empty winding off spindle forward and the reversion of adhesive tapes 1, can use repeatedly.
In addition, owing to not needing, as above-mentioned embodiment, to form slit 35 on caking agent 11, or separation arranges many, and only need to be on the whole surface of the one side of wider base material coating adhesive 11, so adhesive material tape is easy to manufacture.
The 4th embodiment shown in Figure 38 A～Figure 38 C has represented other manufacture method of the adhesive tapes of the 1st embodiment, formed slit 98 on the caking agent 11 being coated with on base material 9a after (Figure 38 A), on caking agent 11, paste other base materials 9b, thereby make base material 9a, 9b clamp caking agent 11 (Figure 38 B).Next, a side and the opposing party's base material 9a, 9b strip off are made to its separation, and make to be arranged with on each base material 9a, 9b strip of glue 11a, the 11b of one of space.In the 4th embodiment, in order to make to be alternately arranged with strip of glue 11a, 11b on a side and the opposing party's base material 9a, 9b, can, by strip of glue 11a, 11b being heated and pressurizeed from a side base material 9a or one of 9b side space, strip of glue 11a, one of 11b space be configured on each base material 9a, 9b.
The invention of the 29th scheme～34th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 29th scheme～34th scheme, can carry out various distortion.
For example, in above-mentioned embodiment, can be the insulativity caking agent that is not dispersed with conducting particles 13 in caking agent 11.
In above-mentioned embodiment, the number that is formed on the caking agent on base material 9 be several can, so long as 2 above.
Next, the invention of the 35th scheme～41st scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive tapes, the manufacture method of adhesive tapes and the compression bonding method of adhesive tapes that between the electrode of the two, are electrically connected to.
Next, the background technology of the invention of the 35th scheme～41st scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive tapes.
In TOHKEMY 2001-284005 communique, disclose the adhesive tapes that is coated with caking agent on base material has been wound into reel.
Adhesive tapes before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.And, when caking agent is crimped onto to the surrounding of circuit card, one side by adhesive tapes along circuit card pull out and crimping caking agent, the surrounding of circuit card is carried out to this operation, at the surrounding crimping caking agent of circuit card.
But along with the maximization of the panel of PDP in recent years etc., the bond area of circuit card (around size) on one side also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, and owing to changing spool trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive tapes on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive tapes is narrow in 1～3mm, if the number of turns increases, just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive tapes and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
Therefore, the object of the invention of the 35th scheme～41st scheme is, provides a kind of number of turns that does not increase adhesive tapes just can increase the compression bonding method of the adhesive tapes of bonding dosage, the manufacture method of adhesive tapes and adhesive tapes.
Next, with reference to accompanying drawing, the working of an invention mode of the 35th scheme～41st scheme is described, first, with reference to Figure 39 A, Figure 39 B, Figure 40, Figure 34, Fig. 5 and Figure 41, the 1st embodiment of the invention of the 35th scheme～41st scheme is described.The figure that Figure 39 A and Figure 39 B are adhesive tapes, Figure 39 A is for rolling up the stereographic map of the spool that has adhesive tapes, and Figure 39 B is the vertical view from the adhesive tapes of caking agent side 39A with the aid of pictures.Figure 40 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
The adhesive tapes 1 of present embodiment is twisted on spool 3, and spool 3 is provided with volume core 5 and the side plate 7 that is configured in the both sides of adhesive tapes 1.In present embodiment, the length of adhesive tapes 1 is about 50m, and the size on one side of width W and circuit card is roughly the same, is about 1500mm.
Adhesive tapes 1 consists of base material 9 and the caking agent 11 being coated on base material 9, on base material 9 uniformly-spaced and on the width of belt, be provided with the caking agent 11 that every width is 0.5mm.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, acrylic acid or the like, vinyl ester resinoid, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive tapes 1 of present embodiment is described.Spool 3 and empty winding off spindle 17 that adhesive tapes 1 is installed on adhering device 15, be arranged on the front end that twists in the adhesive tapes 1 of spool 3 on empty winding off spindle 17, extracts adhesive tapes 1 (arrow E in Figure 40) out.Afterwards, adhesive tapes 1 is configured on circuit card 21, by being arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connect adhesive tapes 1, the caking agent of 1 amount 11 is crimped onto on a limit of the circuit card that is positioned at adhesive tapes width, caking agent 11 is only wound on empty winding off spindle 17 with this width extent.
Next, make about 90 degree of circuit card 21 rotation, make the adjacent side of circuit card 21 be positioned at the width of adhesive tapes 1, utilize thermal head 19 that caking agent 11 is crimped onto on another limit of circuit card 21.Like this, by making about 90 degree the crimping caking agents 11 of circuit card 21 rotations, in turn caking agent 11 is crimped onto to the surrounding of circuit card 21.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect as described below carrying out in fact: caking agent 11 is crimped on after the surrounding of circuit card 21, wired circuit (or electronic devices and components) 23 is configured on caking agent 11, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto to (with reference to Fig. 4) on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
As shown in figure 34, use the connection portion of PDP26 of the adhesive tapes 1 of present embodiment, the whole of PDP, carry out crimping around, once use the usage quantity of caking agent 11 with compared in the past very many.But, due to the length H on the width W of adhesive tapes 1 and one side of circuit card 21 about equally, therefore, it is large that the width W of adhesive tapes 1 becomes, still, even if the number of turns is with identical in the past, bonding dosage also becomes very many with comparing in the past, and therefore, the replacing of spool becomes considerably less with comparing in the past.
Next, with reference to Fig. 5 and Figure 41, the manufacture method of the adhesive tapes 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.Coater 27 moves left and right, on base material 9 to be uniformly-spaced coated with the caking agent of strip.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core from both sides, or be wound on the volume core with side plate, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 35th scheme～41st scheme describe, below in illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the adhering device 15 of the 2nd embodiment shown in Figure 41, at two positions, adhesive tapes 1, one side's adhesive material tape 1 is installed and the opposing party's adhesive tapes 1 is arranged in mutually perpendicular direction.And, on a side adhesive tapes 1, caking agent 11 is crimped onto on a pair of longitudinal edge N facing mutually of circuit card 21 (the 1st operation), caking agent 11 is crimped onto on a pair of horizontal edge M facing mutually of circuit card 21 (the 2nd operation) to the surrounding crimping caking agent by these two operations at circuit card 21 on the opposing party's adhesive tapes 1.In the 2nd embodiment, between the 1st operation and the 2nd operation, do not need rotation circuit plate 21 towards, by circuit card 21 former states that load in the 1st operation are moved in the 2nd operation, just can automatically carry out the crimping of caking agent, can further improve operating efficiency.In this case, circuit card 21 can be carried and automatically transmits on travelling belt.
In the 3rd embodiment shown in Figure 42 A～Figure 42 C, on the whole surface of the one side of base material, with width W coating adhesive, by the slit 35 being formed in the width W direction of base material, caking agent is separated into many in width W direction.In the adhesive tapes 1 of the 3rd embodiment, preferably after spool 3 being arranged on adhering device 15, just adhesive tapes 1 forms slit 35 before being crimped onto on circuit card 21 shortly.In this case, both can be near the spool installation portion of adhering device 15 (in Figure 40, with S, representing) cutting knife is installed, on the caking agent 11 of unreeled adhesive tapes 1, form slit 35, also can be when the manufacture of adhesive tapes as shown in Figure 5, in completing operation, form slit, be wound up into afterwards on axle, before being about to reel with up-coiler 31 after can also being dried, formed slit in applying operation.In addition, in each situation, can make cutting knife to-and-fro movement in the width W direction of adhesive tapes 1.
In addition, while using the adhesive tapes 1 of the 3rd embodiment in adhering device 15, identical with the 1st embodiment, from base material 9 sides with thermal head to being carried out crimping by 1 rule caking agent of slit 35 separation, from front, use in turn.
In the 3rd embodiment, only by forming slit 35 on the caking agent on the resulting base material of the operation the same as before, just can access many caking agents 11 that are arranged on width, therefore easy to manufacture.
In the 4th embodiment shown in Figure 43 A～Figure 43 C, on the whole surface of the one side of base material 9, be coated with caking agent 11 (Figure 43 A), the width W of base material 9 and caking agent 11 and above-mentioned embodiment are roughly the same with the length dimension on one side of circuit card in the same manner.And, also similarly install with the 1st embodiment in use, by a part for caking agent () being carried out to hot pressing (Figure 43 B) in the width W direction at adhesive tapes 1, the cohesive force of this part is reduced, thereby only allow by the caking agent of hot pressing part separated and be crimped onto (Figure 43 C) on circuit card 21 from base material.
In this case, preferably the circumferential wire along thermal head 19 forms cohesive force droop line, make caking agent softened and flow by the major part of hot pressing part, (target is that 100 pools are following), and the sclerous reaction in caking agent not yet starts or low-end trim (target is that reactivity is below 20%), and Heating temperature is selected according to used caking agent class.
According to the 4th embodiment, thereby caking agent 11 can only allow softening flowing of amount be crimped on circuit card in use in width W direction.
In addition, owing to not needing, as above-mentioned embodiment, to form slit 35 on caking agent 11, or separation arranges many, and only need to be on the whole surface of the one side of wider base material coating adhesive 11, so adhesive tapes is easy to manufacture.
What the 5th embodiment shown in Figure 44 A～Figure 44 C represented is other manufacture method of the adhesive tapes 1 of the 1st embodiment, formed slit 98 on the caking agent 11 being coated with on base material 9a after (Figure 44 A), on caking agent 11, paste other base materials 9b, thereby clamp caking agent 11 (Figure 44 B) with base material 9a, 9b.Next, a side and the opposing party's base material 9a, 9b strip off are made to its separation, one of space ground placement of adhesives bar 11a, 11b on each base material 9a, 9b.In the 5th embodiment, in order to make a side and the opposing party's the upper alternative arrangement strip of glue of base material 9a, 9b 11a, 11b, can by from a side base material 9a or ground, one of 9b side space to strip of glue 11a, 11b hot pressing, thereby strip of glue 11a, 11b are sticked on each base material 9a, 9b in turn.
The invention of the 35th scheme～41st scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 35th scheme～41st scheme, can carry out various distortion.
For example, in above-mentioned embodiment, can be the insulativity caking agent that is not dispersed with conducting particles 13 in caking agent 11.
Next, the invention of the 42nd scheme～46th scheme is described.
These inventions relate to a kind of being used for, by bonding between electronic devices and components and circuit card or circuit card and fixing time, makes the adhesive agent-tape cassette being electrically connected between the electrode of the two and the caking agent compression bonding method that uses adhesive agent-tape cassette.
Next, the background technology of the invention of the 42nd scheme～46th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive tapes.
In TOHKEMY 2001-284005 communique, disclose the adhesive tapes that is coated with caking agent on base material has been wound into reel.
Adhesive tapes before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.And, when surrounding crimping caking agent at circuit card, adhesive tapes is pulled out along a limit of circuit card and crimping caking agent, the surrounding of circuit card is carried out to this operation, at the surrounding crimping caking agent of circuit card.
But along with the maximization of the panel of PDP in recent years etc., the bond area of circuit card (around size) on one side also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of the spool of coiling adhesive tapes increases, and owing to changing spool trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive tapes on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive tapes is narrow in 1～3mm, if the number of turns increases, just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive tapes and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
Therefore, the object of the invention of the 42nd scheme～46th scheme is, a kind of number of turns that does not increase adhesive tapes is provided, and can increases bonding dosage, and can carry out simply the connecing agent tape drum and use the compression bonding method of the caking agent of adhesive agent-tape cassette of replacing of spool.
Next, with reference to accompanying drawing, the working of an invention mode of the 42nd scheme～46th scheme is described.First, with reference to Figure 45 A, Figure 45 B, Figure 46, Figure 47, Fig. 4, Figure 34 and Figure 48, the 1st embodiment of the invention of the 42nd scheme～46th scheme is described.For convenience of explanation, and describe disposing the occasion of 2 caking agents on adhesive tapes, but caking agent also can be formed with many.Figure 45 A and Figure 45 B are the figure of adhesive agent-tape cassette of the 1st embodiment of the invention of the 42nd scheme～46th scheme, Figure 45 A is the stereographic map of adhesive agent-tape cassette, Figure 45 B is the A-A line sectional view of Figure 45 A, Figure 46 is the sectional view of installment state of the spool of the tape drum shown in presentation graphs 45A and Figure 45 B, Figure 47 is the front view of the crimping process of the caking agent of expression adhering device, and Figure 48 is for representing the process picture sheet of the manufacture method of adhesive agent-tape cassette.
The adhesive agent-tape cassette 100 of present embodiment, mainly consists of a side spool 3 and the opposing party's winding off spindle 17 and the box body 99 that holds them, on a side spool 3, is wound with adhesive tapes 1, and the other end 1a of adhesive tapes 1 is fixed on the opposing party's winding off spindle 17.
In box body 99, one side is formed with opening 123, from this opening 123, pulls out adhesive tapes 1.In addition, the both sides of opening 123 are provided with the guiding piece 124,124 that guiding adhesive tapes 1 moves.
Box body 99 by by half box 99a, 99b is chimeric makes, on a side and the opposing party's spool 3,17, be interspersed be arranged on adhering device 128 (aftermentioned) around axle 126 (with reference to Figure 46), with each spool 3,17 tablings.
Next, with reference to Figure 46, to describing coordinating between each spool 3,17 and each spool 3,17 and box body 99.On each spool 3,17, its inner circumferential side is formed with the setting strip matching around axle 126 125 with adhering device 128, and its outer circumferential side is formed with the embeded slot 127 of tabling rotatably with the protuberance 99c of box body 99.
On adhesive tapes 1, as shown in Figure 45 B, on the one side of base material 9, on width, be coated with side by side two caking agent 11a, 11b.Between these two caking agent 11a, 11b, leaving compartment of terrain arranges.
The length of the adhesive tapes 1 of present embodiment is about 50m, width W be about 4mm.The width of each caking agent 11a, 11b is about 1.2mm.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt mixture class, the thermosol thing class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, acrylic acid or the like, vinyl ester resinoid, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive agent-tape cassette 100 of present embodiment is described.As shown in figure 47, in adhering device 128, adhesive agent-tape cassette 100 is installed.In adhering device 128, have compartment of terrain in vain and be provided with tape drum and use around axle 126,126 (with reference to Figure 46), each spool 3,17 of adhesive agent-tape cassette 100 with around axle 126,126, match.Therefore, the installation of adhesive agent-tape cassette 100 can complete by simple operations (one touch), does not need as before the other end 1a that twists in the adhesive tapes 1 on spool to be installed to the first-class operation of empty winding off spindle.
Next, from adhesive agent-tape cassette 100, pull out adhesive tapes 1, hang on the guiding piece 124,124 of adhering device 128.
Next, drive adhering device 128 around axle 126, extract adhesive tapes 1 (the arrow E direction in Figure 47) out, adhesive tapes 1 is configured on circuit card 21, utilize thermal head 19 to connect adhesive tapes 1 from base material 9 side pressures, the caking agent 11a that is positioned at 1 amount of the side on width is crimped onto on one side of circuit card 21, residue bar caking agent 11b and base material 9 are wound up on the opposing party's winding off spindle 17.Like this, will meet caking agent 11a and be crimped in turn the surrounding of circuit card 21.
Afterwards, the adhesive tapes 1 of reeling on a side spool 3 first takes off after adhesive agent-tape cassette 100 after having used up, and is loaded on conversely, repeats above-mentioned operation.In the situation that form more than 2 caking agents on adhesive tapes, change the position of width, just can be in turn or devices spaced apart carry out crimping.
After above-mentioned crimping (connect), the electrode 21a of circuit card 21 and the electrode 23a position of wired circuit (electronic devices and components) 23 are coincided carry out reality to connect temporarily.Connect as described below carrying out in fact: caking agent 11a is crimped on after the surrounding of circuit card 21, wired circuit (or electronic devices and components) 23 is configured on caking agent 11a, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto to (with reference to Fig. 4) on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
As shown in figure 34, use present embodiment adhesive agent-tape cassette 100 to carry out the connection portion of bonding PDP26, in present embodiment, the whole of PDP26, carry out crimping around, once use the usage quantity of caking agent 11 with compared in the past very many.But owing to disposing 2 caking agent 11a, 11b in adhesive tapes 1 in width W, therefore, even if the number of turns is with identical in the past, because bonding dosage also becomes former twice, thereby the replacing number of times of tape drum can be not too many.
In addition, owing to adhesive tapes 1 being made to the form of tape drum 1, therefore replacing, operation, installation are all easier to, good work.
Next, with reference to Figure 48, the manufacture method of the adhesive agent-tape cassette 100 of present embodiment is described.
From rolling out the base material (spacer) 9 that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.Coater 27 is coated with many caking agents on base material 9.The master of the adhesive material tape of reeling is cut into given width (being the width of 2 strip of glue) by longitudinal cutter 33 in completing operation, after being wound up on core, by making, half box 99a, 99b are chimeric clamps spool 3 and empty winding off spindle 17, manufactures adhesive agent-tape cassette 100.
Adhesive agent-tape cassette 100 wires up together with siccative, preferably under low temperature (5 ℃～-10 ℃), takes care of and outbound.
Next, other embodiments to the invention of the 42nd scheme～46th scheme describe, below in illustrated embodiment, by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In embodiment 2 shown in Figure 49, once the whole limit crimping caking agent 11 to circuit card 21, in adhering device 128, is provided with the guiding piece 101 that is configured to pull out long one section of adhesive tapes 1 from adhesive agent-tape cassette 100.According to the 2nd embodiment, due to the whole limit crimping caking agent to circuit card 21 once, so operating efficiency is good.
In the 3rd embodiment shown in Figure 50, on the whole surface of the one side of base material 9, with width W coating adhesive 11, by slit 102, caking agent is separated into 2.In the adhesive tapes 1 of the 3rd embodiment, preferably after adhesives tape drum 100 being installed on adhering device 128, formed slit 102 before adhesive tapes 1 is about to be crimped onto on circuit card 21.In this case, both can be near the tape drum installation portion of adhering device 128 (in Figure 47, with S, representing) cutting knife is installed, on the caking agent 11 of unreeled adhesive tapes 1, form slit 102, also can be when the manufacture of adhesive tapes as shown in figure 48, in completing operation, form slit, be wound up into afterwards on spool 3, after can also being dried, before being about to reel by up-coiler 31, formed slit 102 in applying operation.
In the 3rd embodiment, due to only, by forming slit 102 on the caking agent 11 on the resulting base material 9 of the operation the same as before, just can access 2 caking agent 11a, 11b, thus easy to manufacture.
In the 4th embodiment shown in Figure 51 A and Figure 51 B, on the whole surface of the one side of base material 9, be coated with caking agent 11 (Figure 51 A), be installed on adhering device 128 box 100 that holds this adhesive tapes 1 is the same with the 1st embodiment, a part (amount) for caking agent 11 by the width W direction to adhesive tapes 1 is carried out hot pressing, the cohesive force of this part is reduced, thereby only allow the caking agent 11a of hot pressing part separated and be crimped into (Figure 51 B) on circuit card 21 from base material 9.
In this case, preferably along surrounding's formation cohesive force droop line 103 (Figure 51 A) of thermal head 19, make caking agent softened and flow by the major part of hot pressing part, (target is that 1000 pools are following), and the sclerous reaction in caking agent not yet starts or low-end trim (target is that reactivity is below 20%), and Heating temperature is selected according to used caking agent class.
According to the 4th embodiment, thereby caking agent 11 can only make softening flowing of amount 11a in width W direction be crimped on circuit card in use.
Next, the invention of the 47th scheme～49th scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape, particularly a kind of adhesive material tape that is rolled into reel that between the electrode of the two, are electrically connected to.
Next, the background technology of the invention of the 47th scheme～49th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with caking agent on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of a side adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and owing to changing adhesive material reel trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive material tape is narrow in 1～3mm, if increasing, the number of turns just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can increase, and is difficult to be arranged on existing adhering device, and likely existing adhering device no longer can be used.
Therefore, the object of the invention of the 47th scheme～49th scheme is to provide a kind of can carry out the replacing of adhesive material reel simply, realizes the adhesive material tape of raising of the production efficiency of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 47th scheme～49th scheme is described.
With reference to Figure 52 A, Figure 52 B, Fig. 3, Fig. 4, Figure 29 and Fig. 5, the 1st embodiment of the invention of the 47th scheme～49th scheme is described.Figure 52 A and Figure 52 B are the figure of the connection of the adhesive material tape of expression present embodiment, and Figure 52 A is for representing the stereographic map of the connection between adhesive material reel, and Figure 52 B is the sectional view of the connection portion of presentation graphs 52A.
Adhesive material tape 1 twists in respectively spool 3,3a is upper, and each spool 3,3a are provided with volume core 5 and the side plate 7 that is configured in the width both sides of adhesive material tape 1.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
Base material 9, the heat that has supporting layer 9b and clamp supporting layer 9b from both sides is melted agent layer (heat is melted layer) 9a, form hot heat of melting agent layer 9a and melt agent (heat is melted), be used as polyethylene, SBS (styrene butadiene styrene segmented copolymer) and the nylon etc. of thermoplastic resin, supporting layer 9b adopts the reinforcing fibres such as plastics, glass fibre, Kevlar, carbon fiber such as OPP (extended polypropylene), tetrafluoroethylene, PET (polyethylene terephthalate).
Caking agent 11, can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, crylic acid resin, silicone resin class.
In caking agent 11, can be dispersed with conducting particles 13, as conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and/or dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in Figure 3, spool 3a and the winding off spindle 17 of adhesive material tape 1 are installed on adhering device 15, after the front end that twists in the adhesive material tape 1 on spool 3a is hung on pilot pin 22, be arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, utilizes and be arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connect adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through the polytetrafluoroethylmaterial material 24 as cushioning material, utilizes thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment being represented from Figure 29, caking agent 11 has carried out crimping the whole of PDP on around, once the usage quantity of the caking agent that uses 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, the adhesive material tape twisting on spool 3a is just rolled onto on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Figure 52 A) of the adhesive material tape 1 twisting on spool 3a.
As shown in Figure 52 A, while having exposed terminal marking 28 on the adhesive material tape 1 of spool 3a, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side's adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of reeling on new adhesive material reel 3.
The connection of this adhesive material tape 1, as shown in Figure 52 B, terminal part 30 for the adhesive material tape 1 of adhesive material reel 3a, top part 32 with the adhesive material tape 1 of new adhesive material reel 3, make the heat of the base material 9 of terminal part 30 melt 11 of the caking agents of agent layer 9a and top part 32 overlapping, lap is placed on platform 104.Afterwards, utilize the 19 pairs of laps of the thermal head heating of adhering device 15, heat is melted after agent layer 9a melt, then make heat melt agent to solidify by cooling, thereby terminal part 30 and top part 32 are coupled together.Like this, the adhesive material tape 1 of reeling on end-of-use spool 3a, just couples together with the adhesive material tape 1 of reeling on new spool 3.
Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.So, do not need adhesive material tape 1 to be installed to the operation on winding off spindle 17.In addition, due to winding off spindle 17 base material 9 of mainly only reeling, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is good.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate is installed to volume core from both sides, together wires up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 47th scheme～49th scheme describe, below in illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the 2nd embodiment shown in Figure 53, in the base material 9 of adhesive material tape 1, heat is melted agent layer 9a and is supported a layer 9b clamping.In this case, as shown in Figure 3, for adhesive material tape 1 is interconnection, by the terminal part of a side adhesive material tape 1 30, with the top part 32 of the opposing party's adhesive material tape 1 toward each other, on this position, utilize 19 pairs of heat of thermal head of adhering device 15 to melt agent layer 9a and heat.During heating, heat is melted agent and is melted in agent layer 9a and oozed out by heat, makes heat melt agent to solidify, thereby adhesive material tape 1 is interconnected by cooling.Like this, because heat is melted agent layer 9a and is supported a layer 9b clamping, therefore can prevent that the adhering to of absorption, dust etc. of moisture from causing that heat melts the bonding strength of agent layer 9a and reduce.
The invention of the 47th scheme～49th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 47th scheme～49th scheme, can carry out various distortion.
In the 1st embodiment, base material 9 is by supporting layer 9b and by heat, melt agent layer 9b and from both sides, clamp these 3 layers of supporting layer 9b and form, but is not limited to this, can be also more than 4 layers.
In present embodiment, use 19 pairs of bonding portions of thermal head of adhering device 15 to carry out thermo-compressed, but also can use other well heater to replace thermal head 19, connection portion is heated, carry out the connection between adhesive material tape 1.
Next, the invention of the 50th scheme～51st scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape being electrically connected between the electrode of the two.In addition, also relate to semiconductor element (chip) is bonding and be fixed on the fixing tube core with support substrate, lead frame of lead frame, the adhesive material tape using in the semiconductor device on support substrate, particularly a kind of method of attachment that is rolled into the adhesive material tape of reel for semiconductor element mounting.
Next, the background technology of the invention of the 50th scheme～51st scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In addition, adhesive material tape is for the adhesive film of the lead-in wire fixing strip of lead frame, LOC band, chips incorporate band, micro-BGACSP etc. etc., for improving productivity, the reliability of semiconductor device integral body.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with caking agent on base material has been wound into reel.
Adhesive material tape before this, in order to make bonding insecure between caking agent and base material, or in order easily to peel off, and implement silicone-treated on the two sides of base material.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, pull out the top part of adhesive material tape, be installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new adhesive material reel is installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and due to more changing-over material webs axle trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive tapes on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive tapes is narrow in 1～3mm, if the number of turns increases, just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become greatly, caking agent likely can ooze out from the both sides of belt, becomes the reason of adhesion.
In addition, if increase the number of turns of adhesive material tape, the radial dimension of spool also can become greatly, is difficult to be arranged on existing adhering device, likely cannot re-use existing adhering device.
Therefore, the object of the invention of the 50th scheme～51st scheme is, providing a kind of can carry out the replacing of adhesive material reel simply, realizes the method for attachment of adhesive material tape of raising of the production efficiency of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 50th scheme～51st scheme is described.First, with reference to Figure 54 A～Figure 54 C, Figure 55, Figure 56, Fig. 4, Figure 29, the 1st embodiment of the invention of the 50th scheme～51st scheme is described.Figure 54 A～54C is the sectional view of the connection operation of the connection portion of expression Figure 55, and Figure 54 A represents the state of the adhesive material tape before electric discharge, and Figure 54 B represents the state of the adhesive material tape after electric discharge, and Figure 54 C is for representing the figure of the thermo-compressed of connection portion.Figure 55 for representing in the method for attachment of adhesive material tape, the stereographic map of the connection between adhesive material reel.Figure 56 is the schematic diagram of the crimping process of the caking agent of expression adhering device.
Adhesive material tape 1 is twisted in spool 3 respectively, 3a is upper, and each spool 3,3a are provided with volume core 5 and the side plate 7 that is configured in the width both sides of adhesive material tape 1.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
Base material 9, from the separability aspect of intensity and caking agent 11, adopts OPP (extended polypropylene), tetrafluoroethylene, PET (polyethylene terephthalate) etc., with parting agent 9a, implements surface treatment.Parting agent can adopt tensio-active agent, oil, wax, resin, polyester modification silicone resin of the low melt waxes such as olefines parting agent, montanic acid glycol ester, carnauba wax, paraffin, low-molecular-weight fluoro-resin, silicone or fluorine class etc., particularly generally adopts silicone resin.
Caking agent 11, can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, crylic acid resin, silicone resin class.
In caking agent 11, can be dispersed with conducting particles 13.As conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and/or dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in Figure 56, spool 3a and the winding off spindle 17 of adhesive material tape 1 are installed on adhering device 15, after the front end that twists in the adhesive material tape 1 on spool 3a is hung on pilot pin 22, be arranged on winding off spindle 17, extract adhesive material tape 1 (arrow E in Figure 56) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, utilizes and be arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connect adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through the polytetrafluoroethylmaterial material 24 as cushioning material, utilizes thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
Figure 29 has represented to use the connection portion of PDP26 of the adhesive material tape 1 of present embodiment, and hence one can see that, and caking agent 11 has carried out crimping the whole of PDP on around, once the usage quantity of the caking agent that uses 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3a also becomes many, and the adhesive material tape twisting on spool 3a is just rolled onto on winding off spindle 17 for 1 within a short period of time, exposes the terminal marking 28 (with reference to Figure 55) of the adhesive material tape 1 twisting on spool 3a.
As shown in Figure 55, while having exposed terminal marking 28 on the adhesive material tape 1 of spool 3a, for spool 3a is replaced by new adhesive material reel 3, by the terminal part 30 of the adhesive material tape of spool 3a (side's adhesive material tape) 1, be connected with the top part 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 of reeling on new adhesive material reel 3.
The connection of this adhesive material tape 1, as shown in Figure 54 B, is placed in the terminal part 30 of the adhesive material tape 1 of end-of-use spool 3a at the irradiation position place of Electrical Discharge Machine 105.Afterwards, by discharging and remove parting agent 9a on the surface of base material 9.
Afterwards, 9 of the base materials of parting agent 9a have been made to remove, with 11 of the caking agents overlapping (Figure 54 C) of the top part 32 of the opposing party's adhesive material tape 1.The lap of the two is placed on platform, utilizes the thermal head 19 of adhering device 15 to carry out hot pressing and make it bonding.Like this, the adhesive material tape 1 of reeling on end-of-use spool 3a, just couples together with the adhesive material tape 1 of reeling on new spool 3.
Next, change end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.So, do not need adhesive material tape 1 to be installed to the operation on winding off spindle 17.
In present embodiment, owing to utilizing thermal head 19, therefore do not need to use in addition the connection apparatus between adhesive material tape 1, just can change the spool 3, the 3a that are wound with adhesive material tape 1.In addition, due to 17 coiling base materials 9 of winding off spindle, the amount of a plurality of adhesive material reels of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is good.
The invention of the 50th scheme～51st scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 50th scheme～51st scheme, can carry out various distortion.
For example, in above-mentioned embodiment, the parting agent 9a of the base material 9 of the complete side's that reels adhesive material tape 1 is removed, make 11 of the caking agents of this part and new adhesive material tape 1 overlapping, utilizing thermal head 19 to carry out hot pressing makes it bonding, the two is coupled together, but also the parting agent 9a of the base material of new adhesive material tape 19 can be removed, 11 of caking agents making this part and the complete side's that reels adhesive material tape 1 are overlapping and couple together.
As the method for removing parting agent 9a, except plasma discharge, can also be for adopting the method for uviolizing or laser radiation, in the situation that adopting uviolizing, adopt for example mercuryvapour lamp as light source, by irradiated the ultraviolet ray of certain hour by mercuryvapour lamp, to be undertaken.In addition, the in the situation that of laser radiation, utilize the laser that laser oscillator irradiates that parting agent 9a is decomposed and dispersed out, thereby remove parting agent 9a.
In above-mentioned, situation about being adhesively fixed between electronic devices and components and circuit card, circuit card is illustrated, but for semiconductor element (chip) is bonding and be fixed on the fixing tube core with support substrate, lead frame of lead frame, the adhesive material tape that semiconductor element mounting is used with the semiconductor device on support substrate also can similarly carry out.
Next, the invention of the 52nd scheme～58th scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing while, make the adhesive material tape being electrically connected between the electrode of the two.In addition, relate to the fixing tube core with support substrate, lead frame at lead frame, semiconductor element mounting with on support substrate, the adhesive material tape using in semiconductor device bonding and fixedly semiconductor element (chip), particularly a kind of adhesive material tape spool that is rolled into reel.
Next, the background technology of the invention of the 52nd scheme～58th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In addition, adhesive material tape is for the lead-in wire fixing strip of lead frame, LOC band, chips incorporate band etc., and the fixing strip that for example goes between, for the wire lead leg of lead frame is fixed up, improves productivity, the reliability of lead frame self or semiconductor device integral body.
Small-sized along with e-machine, light-weighted progress, in semiconductor device, what its outside terminal was that area array shape is configured in semiconductor device (encapsulation) bottom is called microballoon grid array (BGA-ball grid array), the exploitation development of the compact package of CSP (wafer-level package), in these encapsulation, there is the glass epoxy substrate of 1 layer or multi-layer circuit structure, the semiconductor element mounting such as polyimide substrate are with on support substrate, by caking agent, semiconductor element (chip) is installed, the terminal of the running board side of the terminal of semiconductor element side and substrate is coupled together with wire-bonded mode or flip chip, with epoxies packaged material or the aqueous packaged material of epoxies, the upper surface portion of connection section and chip or end face portion are encapsulated, employing is by metal terminals such as solder ball the structure that area array shape is configured in the inner side of circuit board.In addition, quad flat no-lead (QFN) seals to turn in (QFN-Quad Flat Non-leaded Package) and little gabarit non-leaded package (SON-Small Outline Non-leaded Package) etc. and also uses adhesive material tape.And the mode of complete installation is docked in a plurality of employings in these encapsulation on the substrate of e-machine with high-density by scolding tin reflux type.In addition, tube core and the semiconductor element (chip) of lead frame are installed by caking agent, the terminal of the terminal of semiconductor element side and lead frame is coupled together by wire-bonded, and by epoxies packaged material or the aqueous packaged material of epoxies, the upper surface portion of connection section and chip and end face portion are encapsulated.The caking agent of such semiconductor device is also used adhesive material tape.
In TOHKEMY 2001-284005 communique, as by the method being electrically connected between electrode, the adhesive material tape that is rolled into reel that is coated with caking agent on base material is disclosed.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the adhesive material tape spool that adhesive material tape is wound on spool is arranged on adhering device, pulls out the top part of adhesive material tape, is installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material tape spool, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of a side adhesive material tape spool is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material tape spool are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP in recent years etc., the bond area of circuit card increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material tape spool increases, and owing to changing adhesive material tape spool trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive tapes on spool, thereby increase the bonding dosage of each spool, to reduce the scheme of the replacing frequency of spool, but, because the bandwidth of adhesive tapes is narrow in 1～3mm, if the number of turns increases, just likely there will be volume to collapse.In addition, if the number of turns increases, act on the pressure being rolled on banded adhesive material tape and will become large, caking agent likely can ooze out from the both sides of belt, become the reason of adhesion, the radial dimension of spool also can become greatly, is difficult to be arranged on existing adhering device, and existing adhering device likely cannot re-use.
In addition, if adhesive material tape is directly exposed in atmosphere in adhesive material tape spool, likely can cause quality to decline because of dust, moisture.
Therefore, the object of the invention of the 52nd scheme～58th scheme is, providing a kind of can carry out the replacing of adhesive material tape spool simply, can realize the raising of production efficiency of e-machine and the adhesive material tape spool that maintains adhesive material tape quality.
Next, with reference to accompanying drawing, the adhesive material tape that the electrode of take connects use is example, the working of an invention mode of the 52nd scheme～58th scheme is described, but the adhesive material tape of semiconductor element connection use is also identical therewith.First, with reference to Figure 57 A～Figure 57 C, Fig. 3, Fig. 4, Figure 29 and Figure 58, the 1st embodiment of the invention of the 52nd scheme～52nd scheme is described.Figure 57 A～Figure 57 C is for representing the figure of the adhesive material tape spool of the 1st embodiment, Figure 57 A is for representing the stereographic map of adhesive material tape spool, Figure 57 B is the front view of Figure 57 A, and Figure 57 C is the front view of the cover of Figure 57 A, and Figure 58 is for representing the process picture sheet of the manufacture method of adhesive material tape.
The adhesive material tape spool A of present embodiment, has winding part (hereinafter referred to as winder) 2, the 2a of a plurality of adhesive material tapes 1, and winder 2,2a are provided with spool 3, the 3a that is wound with adhesive material tape 1.Each spool 3,3a are provided with volume core 5 and are configured in side plate 7,7a, the 7b of the width both sides of adhesive material tape 1.As shown in Figure 3, adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.Untapped winder 2a is upper, can freely install and remove and be provided with the cover 8 that covers the surrounding that is wound on the adhesive material tape 1 on spool 3a on spool 3a.
In addition, the side plate 7a of the inner side of winder 2,2a is upper, is provided with the accommodation section (spatial accommodation) 12 of siccative 10.By hold the siccative such as silica gel 10 in accommodation section 12, from inside, remove the moisture in untapped winder 2a.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, adopts OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, crylic acid resin, silicone resin class.
In caking agent 11, can be dispersed with conducting particles 13.As conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and/or dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in Figure 3, adhesives tape spool A and winding off spindle 17 are installed on adhering device 15, the top part of a side adhesive material tape 1 is hung on pilot pin 22 and is arranged on winding off spindle 17 afterwards, extract adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, utilizes and be arranged on the thermal head 19 between two spool 3a, 17, from base material 9 side pressures, connect adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through the polytetrafluoroethylmaterial material 24 as cushioning material, utilizes thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
As the connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment representing in Figure 29, can learn, caking agent 11 around carries out crimping the whole of PDP26, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, it is many that the usage quantity of adhesive material tape 1 also becomes, and the adhesive material tape twisting on spool 3,3a is just rolled on winding off spindle 17 for 1 within a short period of time.
While having exposed terminal marking on the adhesive material tape 1 of a side winder 2, be replaced by the adhesive material tape 1 of new winder 2a.In present embodiment, on untapped winder 2a, be provided with cover 8, after this cover 8 is taken off, extract adhesive material tape 1 out and be installed on winding off spindle 17.
Like this, when a side winder 2 unreels when complete, due to the adhesive material tape of the opposing party's winder 2a 1 is installed on winding off spindle 17, carry out the replacing of adhesive material tape 1, therefore, do not need new adhesive material tape spool to be installed on adhering device 15.So the replacing operation of new adhesive material tape spool can be not too many, improve the production efficiency of e-machine.
In addition, owing to being provided with cover 8 on untapped winder 2a, therefore, adhesive material tape 1 can not be directly exposed in atmosphere, and adhesive material tape 1 is difficult to occur to cause degradation under bonding force because of dust, moisture.Therefore,, even in the situation that being provided with a plurality of winders 2,2a, by cover 8 is set on untapped winder 2a, also can prevent that the quality of adhesive material tape 1 from declining.
In addition, due to the base material 9 of only reeling on winding off spindle 17, the amount of a plurality of adhesive material tape spools of therefore can reeling, thus can reduce the replacing number of times of winding off spindle 17, operating efficiency is good.
Next, with reference to Figure 58, the manufacture method of the adhesive material tape spool A of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7a, 7b are installed to volume core from both sides, mounting cover parts 8, together wire up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
Next, other embodiments to the invention of the 52nd scheme～58th scheme describe, below in illustrated embodiment, by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the 2nd embodiment shown in Figure 59, on the cover 8 of installing on winder 2,2a, what be provided with adhesive material tape 1 pulls out mouthfuls 106.In this case, owing to can therefore not needing to take off the cover 8 of winder 2,2a from mouthful 106 extraction adhesive material tapes 1 of pulling out of cover 8, can directly from winder 2,2a, extract adhesive material tape 1 out.
In the 3rd embodiment shown in Figure 60 A and Figure 60 B, winder 2,2a, 2b are arranged separately respectively, can be arranged on sliding freely on the axle 107 that is located at adhering device 15 main bodys.And, when a side winder 2 unreels when complete, take off the cover 108 of the front end that is arranged on axle 107, from adhering device 15, take out a side winder 2.Afterwards, the opposing party's winder 2a is moved to bonding location place, after taking off cover 8, the adhesive material tape of the opposing party's winder 2a 1 is rolled onto on winding off spindle 17, carry out the replacing of adhesive material tape 1.In this case, because a plurality of winders 2,2a, 2b are arranged separately respectively, so processing ease.
In the 4th embodiment shown in Figure 61, the same with the 3rd embodiment, winder 2,2a, 2b are arranged separately respectively, by making side plate 7,7a between winder 2,2a, 2b chimeric mutually, are arranged on adhering device 15.As shown in Figure 61, on the side plate 7a of the opposing party's winder 2a, be provided with the portion that is fitted 109 that cross section is roughly コ font, by fitting portion set on the side plate of a side winder 27 110 is fitted to the portion of being fitted 109 from upside, the two is coupled together.In the situation that the winder 2 that unreels a complete side is taken off from adhering device 15, only by by a side winder 2 to upside mention just can remove chimeric, thereby can take off simply a side winder 2.
The invention of the 52nd scheme～58th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 52nd scheme～58th scheme, can carry out various distortion.
For example, in above-mentioned embodiment, winder 2,2a are had no particular limits, be several can.
In the 4th embodiment, by side plate 7,7a are slided up and down mutually, and a side and the opposing party's winder 2,2a is chimeric, but also can on a side side plate 7, form embeded slot, on the opposing party's side plate 7a, mosaic process is set, by the width at belt, mosaic process is pressed and entered in embeded slot, thus the two is chimeric.
In Figure 31 A, Figure 31 B, represented the fixing with support substrate, semiconductor element mounting support substrate of connecting lead wire frame, or in the tube core of lead frame and the adhesive material tape of semiconductor element, fixing bonding and be fixed to an example of LOC (Lead on Chip) on lead frame structure with support substrate and semiconductor element by lead frame.
Use at thickness, be 50 μ m enforcement the two sides of the supporting films 78 such as surface-treated polyimide film, add the adhesive material tape of structure of this Figure 31 A of the bond layers 80 such as polyamideimides bond layer of thick 25 μ m, obtain the semiconductor device of the LOC structure shown in Figure 31 B.Use the press tool 87 (punch (protuberance) 95, die (recess) 96) of the adhering device shown in Figure 32 A～32C, adhesive material tape shown in Figure 31 A is struck out to rectangle, for example, on the lead frame of making at the iron nickel alloy of thick 0.2mm, lift-launch is spaced apart 0.2mm, wide is the internal lead of 0.2mm, under the pressure of 400 ℃ and 3MPa, pressurizes and within 3 seconds, carries out crimping, makes the lead frame with adhesive film for semiconductor.Next, by other operations, in caking agent aspect at this with the lead frame of adhesive film for semiconductor, pressure with the temperature of 350 ℃ and 3MPa pressurizes and within 3 seconds, carries out crimping semiconductor element, afterwards, with metal wire, lead frame and semiconductor element wire-bonded are got up, use the packaged materials such as epoxy resin molding material, by transfer mould moulding method, encapsulate, obtain the semiconductor device as shown in Figure 31 B.In Figure 31 A, 31B, 81 is the adhesive film for semiconductor being punched down from adhesive material tape, and 82 is semiconductor element, and 83 is lead frame, and 84 is packaged material, and 85 is bonding wire, and 86 is bus.Figure 32 A, 32B, 32C are adhering device, in Figure 32 A, 32B, 87 is that press tool, 88 is that lead frame transport unit, 89 is that adhesive tapes punching press paste section, 90 is that heater block, 91 is that adhesive material tape spool (adhesive material tape unreels portion), 92 is that adhesive material tape (adhesive film for semiconductor), 93 is adhesive material tape let off roll.In addition, in Figure 32 C, 94 is that adhesive material tape (adhesive film for semiconductor), 95 is that punch (protuberance), 96 is that die (recess), 97 is pressuring diaphragm.Adhesive material tape 92, from adhesive material tape spool (adhesive material tape unreels portion) 91, unreel continuously, in adhesive material tape punching press paste section 89, strike out rectangle, mutually bonding with the leading part of lead frame, as the lead frame with adhesive film for semiconductor, from lead frame transport unit, send out.The adhesive material tape that has carried out punching press sends out from adhesive material tape let off roll 93.
Same as described above, use adhesive material tape that semiconductor element is connected to semiconductor element mounting with on support substrate.In addition, the tube core of lead frame is connected with semiconductor element and is bonded together equally.Adhesive material tape has following situation: only carry out bonding and fixing situation; According to object, use the caking agent that passes through contact or be electrically connected to through electroconductive particle between electrode, and use the situation of supporting film; Situation about only being formed by caking agent.
Next, the invention of the 59th scheme is described.
This invention relates to a kind of by for bonding between electronic devices and components and circuit card or circuit card and fixing time, makes the caking agent being electrically connected between the electrode of the two be crimped onto the adhering apparatus on circuit card.
Next, the background technology of the invention of the 59th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive tapes.
In TOHKEMY 2001-284005 communique, disclose the adhesive tapes that is coated with caking agent on base material and is rolled into reel, recorded the spool of this adhesive tapes (hereinafter referred to as " adhesive tapes spool ") is arranged in automatic sticking machine and is used.
Automatic sticking machine, there is the installation portion of adhesive tapes spool and the installation portion of empty spool, be arranged on the hot press parts between these spools, and the platform of placement substrate, adhesive tapes is pulled out on substrate from adhesive tapes spool, utilize hot press parts from the rear side of base material to adhesive tapes hot pressing, caking agent is crimped onto on substrate.
Yet former automatic sticking machine is all large-scale, in the time of carrying out the part crimping of caking agent on substrate, or the area of crimping caking agent hour, or while carrying out interim crimping etc., owing to being main equipment, have on the contrary this problem of operational difficulty.
On the other hand, wish a kind of from so large-scale automatic sticking machine different, small-sized and can operate simply, the in the situation that of local or interim crimping, do not need to use the utensil that large-scale plant just can crimping caking agent.
Therefore, the object of the invention of the 59th scheme is, provides a kind of small-sized and can be with one-handed performance, and can easily caking agent be crimped onto to the adhering apparatus in the part of substrate.
Next, with reference to accompanying drawing, the working of an invention mode of the 59th scheme is described.Figure 62 A and Figure 62 B are the figure of the adhering apparatus of the 1st embodiment of the invention of expression the 59th scheme, Figure 62 A is the stereographic map of adhering apparatus, Figure 62 B is the A-A line sectional view of Figure 62 A, Figure 63 is the side-view of the using method of the adhering apparatus shown in explanatory view 62A and Figure 62 B, and Figure 64 is for representing the process picture sheet of the manufacture method of adhering apparatus.
The adhering apparatus 111 of present embodiment, mainly by a side spool (supply spool) 3 and the opposing party's winding off spindle (empty spool) 17, and the box body 99 that holds them forms, on one side's spool 3, be wound with adhesive tapes 1, one end 1a of adhesive tapes 1 is fixed on the opposing party's winding off spindle 17.
It can in side-view, be the general triangular of angular distortion with the size being hold by one hand that box body 99 has, and makes the shape of easy gripping.Bight at the box body 99 of general triangular is formed with peristome 113, from this peristome 113, exposes adhesive tapes 1.
In addition, be provided with outstanding heater block 114 in peristome 113, these heater block 114 side-lookings are general triangular, and the adhesive tapes 1 along pulling out to lower surface 114b from upper surface 114a is guided, and in lower face side, are provided with hot plate 115.
Being shaped as of heater block 114 is bar-shaped, by by the coated heater block 114 of hot plate 115, when pulling out adhesive tapes 1, by heater block 114 rotations, can smoothly adhesive tapes 1 be pulled out.In addition, the outside of hot plate 115 is preferably provided with tetrafluoroethylene, silicon rubber or the two, to when crimping adhesive tapes 1, apply uniform pressure.
Box body 99 by half box 99a, 99b is chimeric forms, a side and the opposing party's spool 3,17 is contained in box body.In box body, be also provided with guiding piece 16, the movement of adhesive tapes 1 is guided.In addition, on a side of the bottom surface of any in half box 99a or 99b, be formed with tabular guiding piece, while caking agent being crimped onto on circuit card in the edge that this guiding piece is pressed to circuit card, just can be along circuit card crimping caking agent accurately.
In one side's spool 3, be fixed with coaxially a gear 116, on the opposing party's winding off spindle 17, be also fixed with coaxially another gear 117, one side's gear 116 is engaged with the opposing party's gear 117, when one side's spool 3 rotates and pulls out adhesive tapes 1, the opposing party's winding off spindle 17 also only rotates the amount of pulling out of this adhesive tapes 1 base material 9 of reeling.In addition, a side gear 116 and the opposing party's gear 117 form gear assembly 118.
In addition, the side of box body 99 is provided with when accommodating drying battery in the 3rd 119, the 3 box portions 119 of box portion (supply unit) of heater block 114 power supply, also accommodates to the Circuit tuning of heater block 114 power supplies.In addition, the 3rd box portion 119 is provided with power switch 120, can carry out ON/OFF operation by the finger that grips the hand of adhering apparatus 111.
Adhesive tapes 1, as shown in Figure 62 B, has caking agent 11 at the single spreading of base material 9.
The length of the adhesive tapes 1 of present embodiment is about 20m, and width is about 1.2mm.
Base material 9, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, is used OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but is not limited to this.
Caking agent 11, adopts mixture class, the heat of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin to melt thing class.In the representative of this resin, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, vinyl ester resinoid, acrylic resin, silicone resin class.
In caking agent 11, be dispersed with conducting particles 13.As conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhering apparatus 111 of present embodiment is described.As shown in Figure 63, one hand is held adhering apparatus 111, turns on the power switch 120.Afterwards, by the peristome 113 that exposes adhesive tapes 1 by being pressed on circuit card 21.In peristome 113, in base material 9 sides of adhesive tapes 1, be provided with heater block 114, by pressing the adhesive tapes 1 of side below that is positioned at heater block 114, caking agent 11 be hot-pressed onto on circuit card 21.
Press adhering apparatus 111 forwards (arrow E in Figure 63) propelling on one side on one side downwards, pull out in turn adhesive tapes 1, when advancing heater block 114 towards E direction, new adhesive tapes 1 is positioned under heater block 114, and caking agent 11 is crimped onto on circuit card 21 in turn.
Like this, when a side spool 3 is pulled out adhesive tapes 1, spool 3 rotations due to a side, therefore also can rotate with a side the co-axially fixed side's of spool 3 gear 116, with the opposing party's gear 117 rotations of its interlock, thereby the base material 9 after caking agent 11 is peeled off is wound up on the opposing party's winding off spindle 17.
According to present embodiment, be in the situation that crimping caking agent 11 on the optional position of circuit card 21, as long as to be hold by one hand adhering apparatus 111 and to make it just advance crimping caking agent 11 simply.Like this, due to crimping caking agent 11 simply, for example, on circuit card 21 interim crimping electronic devices and components (wired circuit) 23 in the situation that, or only in the situation that in a part for circuit card 21 crimping electronic devices and components (wired circuit) 23 effective especially.
After above-mentioned crimping (connect), the electrode of circuit card 21 and the electrode position of electronic devices and components (wired circuit) 23 are coincided carry out reality to connect temporarily.In connecing in fact, after caking agent 11 is crimped onto on circuit card 21, electronic devices and components (wired circuit) 23 are configured on caking agent 11, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that electronic devices and components (wired circuit) 23 are hot-pressed onto to (with reference to Fig. 4) on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and electronic devices and components (wired circuit) 23 is coupled together.
In addition, owing to making, adhesive tapes 1 is contained in box body 99 and the structure of using with this state, thus processing ease, good work.
Next, with reference to Figure 64, the manufacture method of the adhering apparatus 111 of present embodiment is described.
From rolling out the base material (spacer) 9 that machine 25 rolls out, the caking agent that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33 in completing operation, after being wound up on spool 3, by making, half box 99a, 99b are chimeric clamps a side spool 3 and the opposing party's winding off spindle (empty spool) 17, and in assembling, held the 3rd box portion 119 of heater block 114 and drying battery etc., thereby produced adhering apparatus 111.
Adhering apparatus 111 together wires up with siccative, preferably under low temperature (5 ℃～-10 ℃), takes care of and outbound.
Next, the invention of the 60th scheme～64th scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesive material tape that is electrically connected between the electrode of the two, are particularly rolled into the adhesive material tape of reel.
Next, the background technology of the invention of the 60th scheme～64th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.
In TOHKEMY 2001-284005 communique, disclose the adhesive material tape that is coated with caking agent on base material has been wound into reel.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right, once adhesive material tape from spool unreel and by caking agent be crimped onto circuit card etc. upper after, just can not reuse.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and due to more changing-over material webs axle trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, reduce the scheme of the replacing frequency of spool, but because the thickness of adhesive material tape is thicker, the number of turns on each spool is difficult to increase.
In addition, can consider to reduce the method for the thickness of adhesive material tape, but owing to using silicone-treated PET (polyethylene terephthalate) as base material, therefore, once, just there is the danger of the drawbacks such as stretching that base material easily occurs, fracture in the thickness attenuation of base material.
Therefore, the object of the invention of the 60th scheme～64th scheme is, a kind of number of turns that can increase on each spool is provided, and realizes the adhesive material tape of the production efficiency raising of e-machine.
Next, with reference to accompanying drawing, the working of an invention mode of the 60th scheme～64th scheme is described.Figure 65 A, Figure 65 B, Fig. 3, Fig. 4, Figure 29 and Fig. 5 are for describing the 1st embodiment of the invention of the 60th scheme～64th scheme.Figure 65 A and Figure 65 B are the figure of the adhesive material tape of the 1st embodiment, and Figure 65 A is for representing the stereographic map of adhesive material reel, and Figure 65 B is the A-A line sectional view of Figure 65 A.
Adhesive material tape 1 is twisted on spool 3, and spool 3 is provided with volume core 5 and the side plate 7 that is configured in the width both sides of adhesive material tape 1.
Adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
Base material 9 is used copper film (Copper Foil).The thickness of base material 9 (S of take in Figure 65 B represents) is 10 μ m, and the tensile strength of base material 9 at 25 ℃ is 500MPa, and base material 9 is 0.5 with the Thickness Ratio (S/T) of caking agent 11, and the thickness of caking agent 11 is 20 μ m.The surfaceness R of base material 9 maxbe 0.25 μ m.
In addition, can also make base material 9 and adopt aromatic polyamide film (ミ Network ト ロ Application).Thickness, tensile strength, the base material 9 of making base material 9 are all identical with copper film respectively with the Thickness Ratio (S/T) of caking agent 11.
Next, the using method of above-mentioned adhesive material tape is described.As shown in Figure 3, spool 3 and the winding off spindle 17 of adhesive material tape 1 is installed on adhering device 15, the front end that twists in the adhesive material tape 1 on spool 3 hangs on pilot pin 22 and is arranged on winding off spindle 17, extracts adhesive material tape 1 (arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured on circuit card 21, utilizes and be arranged on the thermal head 19 between two spools 3,17, from base material 9 side pressures, connect adhesive material tape 1, caking agent 11 is crimped onto on circuit card 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, if desired through cushioning material, for example polytetrafluoroethylmaterial material 24, utilize thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
The connection portion of the PDP26 of the adhesive material tape 1 of the use present embodiment representing as Figure 29, can learn, caking agent 11 carries out crimping around the whole of PDP, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in adhesive material tape 1 on spool 3 also becomes many, and the adhesive material tape twisting on spool 3 is just rolled onto on winding off spindle 17 for 1 within a short period of time, and spool 3 becomes empty.
When spool 3 has become empty, end-of-use spool 3 is replaced by new spool, new spool is installed on adhering device 15.Afterwards, as mentioned above, repeat caking agent 11 to be crimped onto on circuit card 21, base material 9 is wound up into the action on winding off spindle 17.
Consequently, base material 9 use in copper film and aromatic polyamide film which kind of all with the same easily operation of former adhesive material tape 1, and base material 9 can not stretch or rupture yet.And product (50 μ m) is thin before the Thickness Ratio of base material 9, correspondingly the number of turns of adhesive material tape increases, thereby the minimizing of the replacing frequency of spool, boosts productivity.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape 1 of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, the caking agent 11 that utilizes coater 27 coating resins and conducting particles 13 to mix, after being dried, with up-coiler 31 coiling masters in drying oven 29.The master of the adhesive material tape of reeling is cut into given width by longitudinal cutter 33, after being wound up on core, side plate 7,7 is installed to volume core 5 from both sides, together wires up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of and outbound.
In addition, even in the situation that the thickness of base material 9 is copper film and the aromatic polyamide film of 4 μ m, 20 μ m, 25 μ m, manufacturing adhesive material tape 1,, there is not the faults such as stretching, fracture of base material 9 in actual trying out as mentioned above yet.
In addition, even in the situation that the Thickness Ratio (S/T) of base material 9 and caking agent 11 is 0.01,0.05,1.0 copper film and aromatic polyamide film, manufacturing adhesive material tape 1,, there is not the faults such as stretching, fracture of base material 9 in actual trying out as mentioned above yet.
Next, the invention of the 65th scheme～66th scheme is described.
These inventions relate to a kind of by bonding between electronic devices and components and circuit card or circuit card and fixing time, make the adhesives formation method of the adhesive material tape that is electrically connected between the electrode of the two.In addition, also relate to the fixing tube core with support substrate, lead frame at lead frame, semiconductor element mounting with on support substrate, the adhesives formation method of the adhesive material tape using in semiconductor device bonding and fixedly semiconductor element (chip), particularly a kind of adhesives formation method that is rolled into the adhesive material tape spool of reel.
Next, the background technology of the invention of the 65th scheme～66th scheme is described.
As by bonding and fixing between the electronic devices and components of liquid crystal display, PDP (plasma panel), EL (fluorescence display) screen, bare chip installation etc. and circuit card, circuit card, make the method being electrically connected between the electrode of the two, generally adopt adhesive material tape.In addition, adhesive material tape is for the adhesive film of the lead-in wire fixing strip of lead frame, LOC band, chips incorporate band, micro-BGACSP etc. etc., for improving all productivitys of semiconductor device, reliability.
In TOHKEMY 2001-284005 communique, disclose and will on base material, be coated with the adhesive material tape that is rolled into reel of adhesives.
Adhesive material tape before this, its width is 1～3mm left and right, the length that twists in the belt on spool is 50m left and right.
In the situation that adhesive material tape is installed on adhering device, the spool of adhesive material tape (being designated hereinafter simply as " adhesive material reel ") is arranged on adhering device, the top part of pulling out adhesive material tape is installed on winding off spindle.Afterwards, the base material side of the adhesive material tape unreeling from adhesive material reel, utilizes thermal head that caking agent is crimped onto to circuit card etc. upper, and residual base material is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, take off the winding off spindle that the spool that is finished and volume have base material, new winding off spindle and new adhesive material reel are installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But along with the maximization of the panel of PDP etc. in recent years, the bond area of circuit card also increases, the usage quantity of the caking agent that once used constantly increases.In addition, because the purposes of caking agent also expands, the usage quantity of caking agent is increased.Therefore, in the manufacturing works of e-machine, the replacing frequency of adhesive material reel increases, and due to more changing-over material webs axle trouble, therefore exists the production efficiency that cannot realize e-machine to improve this problem.
For this problem, can consider to twist in by increase the number of turns of the adhesive material tape on spool, thereby increase the bonding dosage of each spool, reduce the scheme of the replacing frequency of spool, but if the number of turns of adhesive material tape increases, the radial dimension (hereinafter referred to as " coil diameter ") that twists in the adhesive material tape on spool also increases, be difficult to be arranged on existing adhering device the problem that exists existing adhering device likely cannot re-use.
Therefore, the object of the invention of the 65th scheme～66th scheme is, a kind of coil diameter that can not increase adhesive material tape is provided, and realizes the formation method of the adhesive material tape that the production efficiency of e-machine improves.
Next, with reference to accompanying drawing, the working of an invention mode of the 65th scheme～66th scheme is described.First, with reference to Figure 66 A and Figure 66 B, Figure 67, Figure 68, Fig. 4, Figure 29 and Fig. 5, the 1st embodiment of the invention of the 65th scheme～66th scheme is described.Figure 66 A and Figure 66 B form the schematic diagram of operation for representing the caking agent of the adhesive material tape of the 1st embodiment, Figure 66 A is integrated each adhesive material tape is overlapping for representing, by a side base material be wound up into reel for the schematic diagram of the operation on spool, Figure 66 B is the sectional view of the part that overlaps each other between the caking agent of presentation graphs 66A.Figure 67 is for representing the caking agent of adhering device to be formed on the schematic diagram of the operation in bonded object.Figure 68 is for rolling up the stereographic map of the spool that has adhesive material tape.Fig. 4 is the bonding sectional view between indication circuit plate.Figure 29 is the stereographic map of the use state of the caking agent of expression PDP.Fig. 5 is for representing the process picture sheet of the manufacture method of adhesive material tape.
Adhesive material tape 1 is wound on respectively on spool 3,121, is provided with the side plate 7 of rolling up core 5 and being configured in the width both sides of adhesive material tape 1 in each spool 3,121.Adhesive material tape 1 consists of base material 9 and the caking agent 11 being coated on a side of base material 9.
Base material 9, from the separability aspect of intensity and caking agent 11, adopt OPP (extended polypropylene), tetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Caking agent 11, can adopt the mixture class of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.With regard to the representative of these resins, as type thermoplastic resin, there are polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, can adopt epoxy resin, crylic acid resin, silicone resin class.
In caking agent 11, can be dispersed with conducting particles 13.As conducting particles 13, there are the metallicss such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin and carbon, graphite etc., can be on polymer cores such as these and/or dielectric glass, pottery, plastics etc., the mode such as to be coated, be formed with above-mentioned conductive layer.In addition, can also be suitable for the insulating wrapped particle obtaining with the coated conducting particles as above of insulation layer, and conducting particles and insulating particle and use etc.Form conductive layer on the polymer cores such as the heatmeltable metals such as scolding tin and plastics after, owing to having deformability by hot pressing or pressurization, the distance between the electrode after connection reduces, during connection and the contact area of circuit increase, improved reliability, therefore preferably.In the situation that the high score subclass of particularly take is core, owing to there is no fusing point clearly as scolding tin, therefore can in very wide connection temperature range, control soft state, thereby can access the easily transom corresponding with the thickness of electrode and the fluctuation of flatness, thereby preferably.
Next, the using method of the adhesive material tape of present embodiment is described.As shown in Figure 66 A, the spool 3,121 of 2 adhesive material tapes 1 is installed on adhering device 15, and reel with winding off spindle 17,18, the front end of the adhesive material tape of reeling on one side's spool 31 hung on pilot pin 22 and be arranged on a side winding off spindle 17, extracting adhesive material tape 1 (arrow E in Figure 66 A) out.In addition, the front end of the adhesive material tape of reeling on the opposing party's spool 121 1 is also arranged on the opposing party's winding off spindle 18, extracts adhesive material tape 1 out.
The adhesive material tape 1 of extracting out from spool 3,121, utilizes and is configured in the crimping roller 122 between spool 3,121 and thermal head 19, and each adhesive material tape 1 is overlapped and is integral.Afterwards, the base material of the opposing party's adhesive material tape 19 is wound up on winding off spindle 18.
Afterwards, a side adhesive material tape 1 is configured on circuit card 21, utilizes thermal head 19 to connect adhesive material tape 1 from base material 9 side pressures, caking agent 11 crimping on the circuit card 21 as bonded object is formed.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, as shown in Figure 4, wired circuit (or electronic devices and components) 23 is configured on the caking agent 11 being crimped on circuit card 21, through the polytetrafluoroethylmaterial material 24 as cushioning material, utilizes thermal head 19 that wired circuit 23 is hot-pressed onto on circuit card 21.Like this, the electrode 23a of the electrode 21a of circuit card 21 and wired circuit 23 is coupled together.
Figure 29 has represented to use the connection portion of PDP26 of the adhesive material tape 1 of present embodiment, and hence one can see that, and caking agent 11 carries out crimping around the whole of PDP26, once use the usage quantity of caking agent 11 with compared in the past very many.Therefore, the usage quantity that twists in the adhesive material tape 1 on spool 3,121 also becomes many, and the adhesive material tape twisting on spool 3,121 is just rolled on winding off spindle 17,18 for 1 within a short period of time.
In present embodiment, in operation before caking agent 11 is about to be crimped onto circuit card 21, due to the caking agent of a side adhesive material tape 1 11 is overlapping with the caking agent 11 of the opposing party's adhesive material tape 1, after forming the thickness of desired caking agent 11, caking agent 11 is crimped onto on circuit card 21, therefore, can make the thickness of each adhesive material tape 1 is half.So, can increase the number of turns of the adhesive material tape 1 on each spool, can increase significantly spendable bonding dosage by once changing operation.Therefore, the replacing operation of new adhesive material tape 1 can be not too many, improves the production efficiency of e-machine.
Next, with reference to Fig. 5, the manufacture method of the adhesive material tape of present embodiment is described.
From rolling out the base material (spacer) that machine 25 rolls out, utilize the caking agent 11 common only about half of thickness of coater 27 coating, that resin and conducting particles 13 mix, after being dried in drying oven 29, use up-coiler 31 coiling masters.The master of the adhesive material tape 1 of reeling is cut into given width by longitudinal cutter 33, be wound up on core 5, afterwards side plate 7,7 is installed to volume core to 5 from both sides, together wires up with siccative, preferably under low temperature (5 ℃～-10 ℃), take care of also outbound.In addition, in the caking agent 11 of adhesive material tape 1, can contain solidifying agent described later.
Next, other embodiments to the invention of the 65th scheme～66th scheme describe, below in illustrated embodiment by the part identical with above-mentioned embodiment put on to identical symbol, omit the detailed description of this part, mainly point different from the embodiment described above is described below.
In the 2nd embodiment described in Figure 69 A, can carry out the adhesive material tape 1a that contains solidifying agent and conducting particles 13 in caking agent 11a, with the two the manufacture of adhesive material tape 1b that does not contain solidifying agent and conducting particles 13 in caking agent 11a, as shown in Figure 69 A, the adhesive material tape 1a that makes to contain solidifying agent etc. overlaps and is integral with the adhesive material tape 1b that does not contain solidifying agent etc., and the adhesive material tape after overlapping is crimped onto on circuit card 21.In this case, owing to only having in a side the caking agent 11a of adhesive material tape 1a, contain solidifying agent, so do not need solidifying agent in the caking agent 11a of the opposing party's adhesive material tape 1b.Therefore the adhesive material tape 1b that, does not contain the caking agent 11b of solidifying agent does not need low temperature keeping.Thereby can reduce the number of the adhesive material tape 1a that need to carry out low temperature keeping, effectively carry out the transportation of adhesive material tape, the management of keeping.
In addition, in the situation that caking agent is epoxy resin, as the solidifying agent of epoxy resin, can list imidazoles, aminimide, salt, polyamine class, polythiol etc.
In addition, as shown in Figure 69 B, in the caking agent 11a of a side's of containing solidifying agent adhesive material tape 1a, contain conducting particles 13, make 2 layers of structure, owing to being crimped side, do not contain conducting particles, thereby conducting particles 13 can, along with flowing of resin flowed out between the circuit of face-off mutually, can not remain on conducting particles 13 between electrode 21a and electrode 23a reliably when hot pressing.
The invention of the 65th scheme～66th scheme is not limited to above-mentioned embodiment, in the scope of purport of invention that does not depart from the 65th scheme～66th scheme, can carry out various distortion.
In the caking agent 11 of the 1st embodiment, contain conducting particles 13, but can be also the caking agent 11 that does not contain conducting particles 13.
In above-mentioned, situation about being adhesively fixed between electronic devices and components and circuit card and circuit card is illustrated, but with on support substrate, semiconductor device bonding and fixedly semiconductor element (chip) also can similarly carry out for the fixing tube core with support substrate, lead frame at lead frame, semiconductor element mounting.
Next, the invention of the 67th scheme～72nd scheme is described.
These inventions relate to a kind of being used to provide bonding between the electronic devices and components such as liquid crystal display, PDP screen, EL screen, bare chip installation etc. and circuit card, circuit card and fixing time, make the winding method of the anisotropic conductive material band, particularly anisotropic conductive material of the anisotropic conductive material that is electrically connected between the electrode of the two.
Next, the background technology of the invention of the 67th scheme～72nd scheme is described.
As the method for attachment adopting between the electronic devices and components of anisotropic conductive material band and circuit card, circuit card, normally between relative electrode, clamping, as the anisotropic conductive material of the caking agent of film like, is carried out being connected between electronic devices and components and circuit card, circuit card by hot pressing.In the caking agent of film like, be mixed with for obtaining the conducting particles of conducting between electrode, as resin, can adopt mixture class, the light-cured resin (reference example is as Japanese kokai publication sho 55-104007 communique) of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin.
In addition, known also have use not contain conducting particles, the circuit connecting method (reference example is as Japanese kokai publication sho 60-262430 communique) of the anisotropic conductive material only consisting of resin.
In representative resin, known have, and as type thermoplastic resin, has polystyrene resin class, alkyd resin class, in addition, as type thermosetting resin, has epoxy resin, silicone resin class, crylic acid resin.In order to connect, type thermoplastic resin and type thermosetting resin all must carry out hot pressing.For type thermoplastic resin, be in order to make resin flows obtain the closing force with bonded object, and for type thermosetting resin, be in order further to carry out hardening of resin reaction.In recent years, from the reliability connecting, mixture class and the type thermosetting resin of thermoplastic resin and thermosetting resin have become main flow.The light-cured resin class that can connect at low temperatures in addition, is also brought into use in industry.
In addition, in recent years, in order to prevent from being connected warpage and the stretching of thing, require the low temperature of the connection temperature of anisotropic conductive material when connecting.In addition, be accompanied by the expansion that the expansion of connection purposes of anisotropic conductive material and liquid crystal display, PDP screen, EL screen, bare chip installation etc. need, the requirement of the shortening of the production interval time when connecting is more and more stronger.
In addition, be accompanied by the connection needs of anisotropic conductive material and the expansion of purposes, not only require the short period of time to connect, also require to boost productivity.Along with the expansion that liquid crystal display, PDP screen, EL screen, bare chip installation etc. need, the usage quantity of anisotropic conductive material is also in continuous increase.In addition, along with the expansion of the needs of the large flat screens of picture such as the large picture of liquid crystal display and PDP screen, the usage quantity that anisotropic conductive material is used in 1 screen also increases.In the past, anisotropic conductive material be take and supplied with at the reel of cross section caking agent of overlapping coiled film shape on circular core, and the replacing time of spool has hindered productive raising.
On the other hand, be accompanied by the narrow limit of liquid crystal display, the change in a narrow margin of anisotropic conductive material constantly makes progress, and is wound on reel in the past identical circular core, volume can occur and collapse, and the qualification rate in manufacturing process is reduced.
The invention of the 67th scheme～72nd scheme, in view of the above-mentioned shortcoming existing, its object is to provide a kind of replacing timed interval that can extend spool, can not cause that workability reduces, and contributes to the anisotropic conductive material band of boosting productivity because occurring to roll up to collapse.
Below, the working of an invention mode of the 67th scheme～72nd scheme is described.
Figure 70 is the schematic diagram of the 1st embodiment of the invention of expression the 67th scheme～72nd scheme.
As shown in Figure 70, the anisotropic conductive material band of present embodiment is anisotropic conductive material that 2 layers of base material film (base material) 9 structure of lift-off processing the form lamination of repeatedly reeling on the length direction of core 5 have been carried out in the caking agent by film like 11 and two sides become spool-like to form, and what Figure 70 represented is the supply form of anisotropic conductive material.In Figure 70, the both ends of core 5 are provided with respectively side plate 7.In addition, anisotropic conductive material band, by base material film 9 and the film like caking agent 11 as anisotropic conductive material being coated on base material film 9, formed, for the connection for precise electronic components and parts, prevent inorganic and organic foreign matter and pollution, therefore in anisotropic conductive material band, make base material film 9 be positioned at the outside of caking agent.
Use the connection of anisotropic conductive material, require to improve and produce interval time, require the rapid replicability of anisotropic conductive material.As mentioned above, by lamination that anisotropic conductive material is repeatedly reeled on the length direction of the core with side plate 7 (volume core) 5, become around axle shape, thereby can provide, the longer anisotropic conductive material that volume collapses does not occur.Therefore, can extend the replacing timed interval of anisotropic conductive material band, boost productivity.
In above-mentioned anisotropic conductive material band, the tensile strength that preferably makes base material film 9 is 12kg/mm 2above, making the tension set of base material film 9 is 60～200%.Like this, because base material film 9 keeps intensity, stretch less, therefore can be in the processing that the film like caking agent 11 that forms anisotropic conductive material is copied to before the transoms such as circuit card, the caking agent 11 that prevents film like is stretched, thickness attenuation, and width attenuates.In addition, from operation and environment this respect, consider, the thickness of base material film 9 is preferably below 100 μ m.If base material film 9 is thin, above-mentioned effect will variation, therefore, and more than the thickness of base material film 9 is preferably 0.5 μ m.
In addition, as the base material film 9 using in above-mentioned anisotropic conductive material band, from intensity and form the separability aspect of the caking agent of anisotropic conductive material, can adopt PP (polypropylene), OPP (extended polypropylene), PET (polyethylene terephthalate) of silicon and fluorine lift-off processing etc., but be not limited to this.
The lift-off processing of base material film 9 is processed and can easily be carried out by carrying out silicon or fluorine, when only the one side of base material film 9 being carried out to lift-off processing, can separability be set in the inside and outside both sides of base material film 9 poor, thereby can prevent the back side of base material film 9 to copy.In addition, when lift-off processing is carried out in the two sides of base material film 9, caking agent 11 faces of film like are carried out to silicon and fluorine processing, and make caking agent 11 masks of film like have separability.
The caking agent 11 of film like, can adopt as the epoxy resin with the type thermosetting resin of high reliability, can realize the low-stress of caking agent and contribute to the silicone resin class of the intermiscibility of caking agent, and the material of the free radical being connected with lower temperature and shorter time with above-mentioned two resinoid phase specific energys, but the caking agent 11 of film like is not limited to this.Caking agent 11 as radical type, is mainly used acrylic-based adhesives.
Figure 71 is the schematic diagram of the 2nd embodiment of the invention of expression the 67th scheme～72nd scheme.In addition, in Figure 71, the integrant identical with Figure 70 put on to identical symbol, description is omitted.
The anisotropic conductive material band of present embodiment, as shown in Figure 71, except using, have 2 kinds of base material films, outside anisotropic conductive material caking agent clamping being formed with these 2 kinds of base material films, other all have identical structure with the anisotropic conductive material band of the 1st embodiment.Also, the anisotropic conductive material of present embodiment, as shown in Figure 71, consists of the caking agent 11 of film like and 2 kinds of these 3-tier architectures of base material 9a, 9b 11 of caking agents having been implemented to lift-off processing.
In the situation that form the caking agent softness of anisotropic conductive material, can prevent from rolling up the caking agent distortion that the next base material film of core side causes.
In addition, as the physical characteristic value of base material film 9a, 9b, the tensile strength that preferably makes base material film 9a, 9b is 12kg/mm 2above, the tension set that makes base material film 9 is 60～200%, and this point is identical with the 1st embodiment.Like this, the physical strength having due to base material film 9a, 9b, thereby can prevent from being accompanied by film like caking agent stretching and its filming, width are attenuated.In addition, the thickness of base material film 9a, 9b is preferably below 100 μ m, like this can be corresponding with operation and environment this respect.
In addition, in the above-mentioned the 1st and the 2nd embodiment, form the caking agent 11 of the film like of anisotropic conductive material, if there is no tackiness, do not show adhesion phenomenon, so just do not need base material film 9 or 9a, 9b, can separately the caking agent of film like 11 be wound into spool-like.
Below embodiment is described, but the invention of the 67th scheme～72nd scheme is not subject to the restriction of these embodiment.
Embodiment 1
(1) making of anisotropic conductive material film
The 30 % by weight solution of making vinyl acetic monomer, the average particle diameter that adds wherein 5 volume % is the Ni powder of 2.5 μ m.Afterwards, in above-mentioned vinyl acetic monomer solution, add the 50g phenoxy resin (high molecular expoxy resin), 20g epoxy resin and the 5g imidazoles that as film-shaped, become material, obtain caking agent and form solution.On the other hand, prepare light blue transparent, (breaking tenacity is 25kg/mm for pet film that thickness is 50 μ m 2, tension set is 130%) two sides carried out the base material film that silicon is processed.Afterwards, use paint roller on the one side of this base material film, to be coated with above-mentioned solution, at 110 ℃, be dried 5 minutes, obtaining thickness is the coiled strip of the anisotropic conductive material film of 50 μ m.
(2) making of anisotropic conductive material band
By the coiled strip of above-mentioned anisotropic conductive material film is longitudinally cut into wide 1.5mm, at the length direction of the core (volume core) of the diameter 48mm with side plate, the wide 100mm lamination of repeatedly reeling, be wound into spool-like, obtaining length is the anisotropic conductive material band of 300m.
This is wound into the anisotropic conductive material of spool-like, also be that anisotropic conductive material band is installed on anisotropic conductive material band automatic crimping machine, supply with in the situation of anisotropic conductive material, can obtain the replicability of anisotropic conductive material and the good result in tension test, and can reduce the installation number of times of spool, eliminate the repetition of the needed time being installed and coming from the caused sticking operation of stretching of replicability, caking agent, by these effects, improved productivity.
Embodiment 2
Make similarly to Example 1 the coiled strip of anisotropic conductive material band.Afterwards, in the multilayer body of base material film and caking agent, the polyethylene terephthalate base material film of more a kind of thick 25 μ m of lamination (breaking tenacity is 25kg/mm 2, tension set is 130%), make 2 base material films clamp caking agent, thereby obtain the coiled strip of the anisotropic conductive material film of 3 layers of structure.Afterwards, in the same manner as in Example 1, by the coiled strip of above-mentioned anisotropic conductive material film is longitudinally cut into wide 1.5mm, the length direction of while at the core (volume core) of the diameter 48mm with side plate, wide 100mm is wound into spool-like, and obtaining length is the anisotropic conductive material band of 300m.
Embodiment 2 also in the same manner as in Example 1, can access good productivity.
Embodiment 3
Identical with embodiment 1, but use the polytetrafluoroethylene film of thick 50 μ m, (breaking tenacity is 4.6kg/mm 2tension set is 350%) as base material film, in addition, other are all identical with embodiment 1, obtain the coiled strip of anisotropic conductive material film, and then in the same manner as in Example 1, the coiled strip of this film is longitudinally cut into wide 1.5mm, core (volume core) by the diameter 48mm with side plate, wide 100mm is wound into spool-like simultaneously, and obtaining length is the anisotropic conductive material band of 300m.In this case, also can be wound up into the length of 300m.
Comparative example 1
In the same manner as in Example 1, obtain the coiled strip of anisotropic conductive material film, and then in the same manner as in Example 1, the coiled strip of this film is longitudinally cut into wide 1.5mm, on simultaneously former spool, be wound into same round core shape, obtaining length is the anisotropic conductive material band of 100m.
The anisotropic conductive material band that this is wound into spool-like is installed on anisotropic conductive material band automatic crimping machine, supply with in the situation of anisotropic conductive material, though can obtain the replicability of anisotropic conductive material and the good result in tension test, but the installation number of times of spool is embodiment 3 times, increased and installed needed time and the time for adjusting.
According to the invention of the 1st scheme as above, utilize the caking agent of adhesive material tape, the terminal part that unreels complete adhesive material tape (side adhesive material tape) is bonded together with the top part of the new adhesive material tape (the opposing party's adhesive material tape) of installing, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material tape be installed simply.
In addition, while carrying out the replacing of new adhesive material tape at every turn, owing to needn't carrying out the replacing of winding off spindle and the top of new adhesive material tape being installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
Due to the adhesive side of a side adhesive material tape and the opposing party's adhesive material tape is overlapped each other, be bonded together, so strength of joint is high.
According to the invention of the 2nd scheme, when can play the identical action effect of invention with the 1st scheme, owing to unreeling the cut-out of complete adhesive material tape, can when having exposed terminal marking, carry out, therefore, can distinguish at an easy rate the part of cutting off and connecting operation, and owing to connecting in the minimal position of necessity, thereby can prevent the waste of adhesive material tape.
According to the invention of the 3rd scheme, identical with the effect of the invention of the 1st scheme, can to adhering device, new adhesive material tape be installed simply, in addition, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
In addition, owing to utilizing the pilot tape of adhesive material tape, the terminal part that unreels complete adhesive material tape and the top part of the new adhesive material tape of installing are bonded together, therefore, can carry out simply bonding between adhesive material tape.
According to the invention of the 4th scheme, identical with the effect of the invention of the 1st scheme, can to adhering device, new adhesive material tape be installed simply, in addition, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
In addition, owing to not needing upset to unreel complete adhesive material tape, therefore, in the time of can preventing from reeling adhesive material tape on winding off spindle, there is volume and collapse.
According to the invention of the 5th scheme, owing to will unreeling the terminal part of complete adhesive material tape and the top partial fixing of the new adhesive material tape of installing by engaging pin, therefore, connection is simple.In addition, while carrying out the replacing of new adhesive material reel at every turn, needn't carry out winding off spindle replacing, the top of new adhesive material tape is installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
According to the invention of the 6th scheme, due to by a side's of engagement device claw engaging on the terminal part of a side adhesive material tape, afterwards by the opposing party's of engagement device claw engaging in the top of the opposing party's adhesive material tape part, the two is interconnected, therefore, connect simply.
Owing to thering is elastic component between a side claw and the opposing party's claw, therefore can tensile elasticity member, by the opposing party's of engagement device claw engaging, on the optional position of the top of the opposing party's adhesive material tape part, the degree of freedom therefore connecting is high.
In addition, under top part state respect to one another due to the terminal part of the adhesive material tape a side and the opposing party's adhesive material tape, be connected, therefore, do not need belt to overlap each other, owing to connecting with the minimal position of necessity, thereby can prevent the waste of adhesive material tape.
According to the invention of the 7th scheme, owing to only the terminal part of one side's adhesive material tape just being clamped and can be connected with the lap of the top part of the opposing party's adhesive material tape by clip, therefore, connect simple.
According to the invention of the 8th scheme, owing to pressing holding piece from the two sides of lap, the two is coupled together, therefore, can improve the strength of joint of the lap of adhesive material tape.
According to the invention of the 9th scheme, utilize the caking agent of adhesive material tape, the terminal part of end-of-use adhesive material tape and the top part of the new adhesive material tape of installing are bonded together, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesive material reel at every turn, do not need base material winding off spindle replacing and the top of new adhesives is installed on winding off spindle, therefore, the replacing time of new adhesive material reel can be not too many, improved manufacture efficiency.
According to the invention of the 10th scheme, when can play the identical action effect of invention with the 9th scheme, make a side the terminal part of adhesive material tape and the top part of the opposing party's adhesive material tape make hook-shaped mutual engaging, and the adhesive side of the two is interconnected, so strength of joint is high.
According to the invention of the 11st scheme, when can play the identical action effect of invention with the 9th scheme or the 10th scheme, because the terminal part of a side adhesive material tape can partly carry out in terminal marking, therefore, the part that connects operation is easily distinguished, and can be prevented the waste of adhesive material tape.
According to the invention of the 12nd scheme, when can play the identical action effect of invention with any one in the 9th scheme～11st scheme, concavo-convex by forming in connection portion, connection area can be expanded, and the intensity of the draw direction (length direction) of the adhesive material tape of connection portion can be improved.
According to the invention of the 13rd scheme, when can play the identical action effect of invention with any one in the 9th scheme～11st scheme, by form through hole in connection portion, due to caking agent oozing out in interior week at through hole, the bond area of caking agent is increased, therefore can further improve strength of joint.
According to the invention of the 14th scheme, owing to only end-of-use adhesive material tape (side adhesive material tape) and new adhesive material tape (the opposing party's adhesive material tape) being coupled together, carry out the replacing of spool, therefore, can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesive material reel at every turn, do not need winding off spindle replacing, the top of new adhesive material tape is installed on winding off spindle or by adhesive material tape and hangs over the operation on guiding piece, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
By being used in the treatment agent of the processing base material of adhesive material tape, be silicone resin class, also use silicone tackiness agent in adhesion zone, can reduce the capillary poor of the two, improve closing force, before therefore can realizing, very difficult the two is bonding.
According to the invention of the 15th scheme, when can play the identical action effect of invention with the 14th scheme, by making the difference of the surface tension of tackiness agent face of silicone adhesion zone and the surface tension of the silicone-treated base material of adhesive material tape, be below 10mN/m (10dyne/cm), can access strong closing force, thereby the two can be bonded together reliably.
According to the invention of the 16th scheme, when can play the identical action effect of invention with the 15th scheme, by further making bonding force, be more than 100g/25mm, can carry out more firmly bonding between two adhesive side of adhesive material tape of a side and the opposing party.
According to the invention of the 17th scheme, when can play the identical action effect of invention with the 16th scheme, because carry out on its two sides that is connected to of a side and the opposing party's adhesive material tape, therefore can access more firmly and connect.
According to the invention of the 18th scheme, owing to using the silicone adhesion zone of two-sided tackiness agent, thereby can between a side and the opposing party's adhesive material tape, clip two-sided silicone adhesion zone by the two bonding (or closely sealed), so the connection of the two is simple and easy.
According to the invention of the 19th scheme, due to the resin caking agent with pasty state, by unreeling the terminal part of complete adhesive material tape and the top partial fixing of the new adhesive material tape of installing, therefore connect simple.In addition, while carrying out the replacing of new adhesive material reel at every turn, do not need the replacing of winding off spindle and the top of new adhesive material tape is installed to the operation on winding off spindle, and on given route, the operations such as pilot pin are set, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
According to the invention of the 20th scheme, when can play the identical action effect of invention with the 19th scheme, as resin caking agent, can be from thermosetting resin, light-cured resin, heatmeltable caking agent, selection is suitable for the resin caking agent of the connection between adhesive material tape, thereby can improve the strength of joint between adhesive material tape.
According to the invention of the 21st scheme, owing to being provided with the plugger of the resin caking agent of the 19th scheme of supply or the 20th scheme in adhering device, therefore do not need to prepare in addition plugger, thereby can prevent from connecting the waste of operation.
According to the invention of the 22nd scheme, the adhesive material tape of reeling in a side winder unreels complete, the adhesive material tape of reeling in adjacent winder is installed on winding off spindle, carry out the replacing of adhesive material tape, therefore do not need new adhesive material tape spool to be installed on adhering device.So the replacing operation of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.
According to the invention of the 23rd scheme, when can play the identical action effect of invention with the 22nd scheme, owing to passing through connecting band, the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape is coupled together, therefore, after the adhesive material tape of one side's adhesive material tape spool unreels, do not need the adhesive material tape of the opposing party's winder to be installed to the operation on winding off spindle, can further improve the production efficiency of e-machine.
According to the invention of the 24th scheme, because connecting band can automatically be wound up on winding off spindle, therefore after the adhesive material tape of a side winder has been used up, can be in turn from next winder extraction adhesive material tape.
In addition, when detecting connecting band with band proofing unit, due to until connecting band can automatically be wound up into connecting band on winding off spindle by before pressure contact portion, therefore can save the trouble of coiling.
According to the invention of the 25th scheme, the connection portion of the top part of the terminal part of one side's adhesive material tape and the opposing party's adhesive material tape, because fastener is coated by adhesive material tape, therefore outward appearance is good, the fastener that meanwhile, can prevent connection portion contacts with adhesive material tape and damages adhesive material tape or damage adhering device.
According to the invention of the 26th scheme, when connection section proofing unit detects connection portion, due to until connection portion, by automatically a side adhesive material tape being reeled on winding off spindle before pressure contact portion, therefore, can prevent that connection portion from arriving pressure contact portion and carrying out crimping and move this fault.In addition, due to until automatically reel a side adhesive material tape on winding off spindle by before pressure contact portion in connection portion, therefore can save the trouble of coiling.
According to the invention of the 27th scheme, when can play the identical action effect of invention with the 26th scheme, can carry out with simple structure the detection of connection portion, and, can be by using these devices to improve accuracy of detection.
According to the invention of the 29th scheme, therefore owing to can using one by one in turn many caking agents, can not increase the number of turns of belt, before spendable bonding dosage in 1 spool is increased to more than 2 times.
Owing to not increasing the number of turns, when therefore can prevent that volume from collapsing, can prevent that thereby caking agent from oozing out and making that the belt that winds up is bonding mutually causes adhesion from the width of belt, and then, can prevent drawbacks such as stretching because of the elongated base material easily producing of banded base material (damage of base material and break).
In the manufacturing works of electronic devices and components, because the replacing number of times of new adhesive tapes can be not too many, so operating efficiency is high.
In addition, in the manufacture of adhesive tapes, owing to can reducing the spool number of manufacturing, the usage quantity that therefore can cut down spool material and moisture proof material, reduces manufacturing expense.
According to the invention of the 30th scheme, when can play the identical action effect of invention with the 29th scheme, due to separated between adjacent strip of glue, therefore easily a rule is carried out separation, thereby can easily be crimped onto on circuit card.
According to the invention of the 31st scheme, when can play the identical action effect of invention with the 29th scheme, owing to only forming slit in the caking agent on being coated on the whole one side of base material, therefore easy to manufacture, and, due to almost very close to each other between adjacent strip of glue, thereby can increase the number that is configured in the strip of glue on base material.
According to the invention of the 32nd scheme, can easily manufacture the adhesive tapes of the 30th scheme.
According to the invention of the 33rd scheme, owing to can manufacture 2 adhesive tapes simultaneously, therefore manufacture efficiency excellence.
According to the invention of the 34th scheme, by the part to caking agent, heat, make the cohesive force of this part decline and be crimped onto on circuit card, therefore, the adhesive tapes of use coating adhesive on the whole surface of the one side of base material, so can directly be used existing device fabrication adhesive tapes.
Be crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing heating region, the degree of freedom of caking agent width of carrying out crimping is high.
The same with the invention of the 29th scheme, due to the caking agent on a rule heated substrate in turn and be crimped onto on circuit card, therefore can not increase the number of turns of belt, spendable bonding dosage in 1 spool is increased to more than 2 times.
Owing to can not increasing the number of turns, increase bonding dosage, therefore the same with the invention of the 29th scheme, when can prevent that volume from collapsing, can prevent the caused adhesion of oozing out of caking agent, prevent the drawback that the stretching of base material causes.
According to the invention of the 35th scheme, more than the length due to the width of the adhesive tapes one side that is circuit card, therefore, can, when increasing bonding dosage, reduce the number of turns of adhesive tapes.
Owing to can not increasing the number of turns of adhesive tapes, increase significantly the bonding dosage using, when therefore can prevent that volume from collapsing, can prevent the damage of adhesion and base material and break.In addition, in the manufacturing works of electronic devices and components, because the replacing number of times of new adhesive tapes can be not too many, therefore manufacture efficiency high.
In addition, in the manufacture of adhesive tapes, owing to can increasing the bonding dosage of each spool, therefore, can cut down the usage quantity of spool material and moisture proof material, reduce manufacturing expense.
According to the invention of the 36th scheme, when can play the identical action effect of invention with the 35th scheme, due to separated between adjacent strip of glue, therefore easily a rule separated caking agent from base material carries out crimping.
According to the invention of the 37th scheme, when can play the identical action effect of invention with the 35th scheme, can increase the number that is configured in the strip of glue on base material, and manufacture and be easier to.
According to the invention of the 38th scheme, can utilize existing installation, manufacture the adhesive tapes of 2 the 36th schemes simultaneously, therefore manufacture efficiency excellence.
According to the invention of the 39th scheme, can play when inventing identical action effect with any one in the 35th scheme～37th scheme, crimping caking agent on one side of circuit card simply, can improve the operating efficiency in the manufacturing works of electronic devices and components.
According to the invention of the 40th scheme, can play when inventing identical action effect with any one in the 35th scheme～37th scheme, the position that does not need rotation circuit plate just can move a side adhesive tapes and the opposing party's adhesive tapes, thereby can be easily at the surrounding crimping caking agent of circuit card, functioning efficiency is good.
According to the invention of the 41st scheme, in the situation that the surrounding of circuit card crimping caking agent carries out hot pressing by being strip along width to adhesive tapes, thereby crimping caking agent on circuit card easily, operating efficiency is good.
In addition, due to can be on the whole surface of adhesive tapes coating adhesive, therefore can directly use existing device fabrication adhesive tapes.
And then, being crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing heating and pressurizing region, the degree of freedom of caking agent width of carrying out crimping is high.
In addition, the same with the invention of the 35th scheme, owing to can not increasing the number of turns, increase bonding dosage, therefore, can obtain and can prevent that volume is when collapsing, can prevent the caused adhesion of oozing out of caking agent and prevent the caused drawback texts of stretching of base material.
According to the invention of the 42nd scheme, owing at least disposing 2 caking agents 1 rule on its width on caking agent sheet, use, therefore, utilize 1 spool at least can use the amount of 2 spools, therefore can not increase the number of turns of adhesive tapes, and increase significantly spendable bonding dosage in 1 spool.
And, owing to not increasing the number of turns of adhesive tapes, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out and the belt winding up is bonded together mutually causes adhesion from the width of band, in addition, can also prevent drawbacks such as stretching because of the elongated base material easily producing of base material (damage of base material and break).
Because adhesive tapes is installed in tape drum, so in adhering device, do not need adhesive tapes to be installed on spool, owing to only tape drum being installed in adhering device, therefore easily operation, and the workability of installing and changing is good.
According to the invention of the 43rd scheme, when can play the identical action effect of invention with the 42nd scheme, due to separated between adjacent strip of glue, therefore easily a rule separated caking agent from base material carries out crimping.
According to the invention of the 44th scheme, when can play the identical action effect of invention with the 42nd scheme, due to adhesive tapes coating adhesive form slit on the whole surface of the one side of base material only, therefore easy to manufacture.
According to the invention of the 45th scheme, owing to can, at the whole surface coated caking agent of the base material of adhesive tapes, therefore can directly using existing device fabrication adhesive tapes.
Be crimped onto the width of the caking agent on circuit card, can set arbitrarily by changing heating and pressurizing region, the degree of freedom of caking agent width of carrying out crimping is high.
According to the invention of the 46th scheme, can play the action effect identical with the invention of the 45th scheme, and, the same with the invention of the 1st scheme, owing to can not increasing the number of turns, increase bonding dosage, therefore,, when can prevent that volume from collapsing, can be prevented the caused drawback texts of stretching of the caused adhesion of oozing out of caking agent and base material.During use, after using the amount of 1 spool, the tape drum that only need to overturn, therefore ensuing installation is easy.Owing to adopting tape drum, so processing ease, and the workability of installing and changing is good.
According to the invention of the 47th scheme, owing to utilizing the base material of adhesive material tape, the terminal part that unreels complete adhesive material tape is bonded together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material reel, therefore can to adhering device, new adhesive material reel be installed simply.In addition, while carrying out the replacing of new adhesive material reel at every turn, do not need the replacing of winding off spindle and the top of new adhesive material reel is installed to the operation on winding off spindle, therefore, the replacing time of new adhesive material reel can be not too many, improved the production efficiency of e-machine.
According to the invention of the 48th scheme, when can play the identical action effect of invention with the 47th scheme, because the surface of base material has heat to melt agent layer, by making the heat of terminal part of a side adhesive material tape, melt the adhesive side overlaid of agent layer and top part, this part is carried out hot pressing and the two is coupled together, therefore connect simple.
In addition, because heat is melted on the whole length direction that agent layer is formed on belt, so overlap length do not need to carry out tight location, and the degree of freedom of connection is high.
According to the invention of the 49th scheme, when can play the identical action effect of invention with the 47th scheme, because heat is melted agent layer and is supported layer clamping, therefore, can prevent that heat from melting agent layer and being exposed in atmosphere, because the caused heat of adhering to of moisture absorption, dust etc. is melted the bonding strength of agent layer and declined.
According to the invention of the 50th scheme, that removes base material end has carried out surface-treated part with parting agent, utilize the caking agent of adhesive material tape that the terminal part that unreels complete adhesive material tape is bonded together with the top part of the new adhesive material tape of installing, carry out the replacing of adhesive material reel, therefore, can to adhering device, new adhesive material reel be installed simply.
According to the invention of the 51st scheme, when can play the identical action effect of invention with the 50th scheme, owing to using any method in plasma discharge, uviolizing, laser radiation to remove parting agent, therefore can accurately and carry out in short time the removal of parting agent.
According to the invention of the 52nd scheme, in adhesive material tape spool, be provided with the winding part (winder) that is wound with the adhesive material tape of adhesive material tape on a plurality of spools, therefore, in a plurality of winders, after the adhesive material tape of 1 winder unreels, just use and the adhesive material tape that unreels other winders of complete winder disposed adjacent, therefore, do not need new adhesive material tape spool to be installed in adhering device, the replacing operation of new adhesive material tape spool can be not too many, improved the production efficiency of e-machine.In addition, owing to can using in turn a plurality of adhesive material tapes, therefore can not increase the number of turns of 1 adhesive material tape on adhesive material tape spool, and increase significantly spendable bonding dosage by the replacing operation of 1 time.In addition, owing to not increasing the number of turns of adhesive material tape, when therefore can prevent that volume from collapsing, can prevent that caking agent from oozing out and so-called adhesion that the adhesive material tape winding up is bonded together mutually from the width of belt, in addition, can prevent the drawbacks such as stretching because of the elongated base material easily producing of base material.
According to the invention of the 53rd scheme, owing to being provided with the accommodation section of siccative on the side plate of spool, therefore, when can play the identical action effect of invention with the 52nd scheme, by removing reliably the moisture in adhesive material tape spool from inside, the quality that can further suppress to produce because of adhesive material tape moisture absorption declines.
According to the invention of the 54th scheme, owing to being provided with the cover for the surrounding of the adhesive material tape of reeling on spool is coated that can freely install and remove on spool, therefore adhesive material tape can not be directly exposed in atmosphere, thereby can prevent that adhesive material tape is because of detrimentally affect that in dust, atmosphere, moisture brings.Therefore,, even in the situation that being provided with a plurality of winder, by cover being set in untapped winder, also can prevent that the quality of adhesive material tape from declining.
In addition, because cover is configured to freely to install and remove, therefore, cover is just taken off and can from adhesive material tape spool, extract adhesive material tape out simply.
According to the invention of the 55th scheme, can play when inventing identical action effect with any one in the 52nd scheme to the 54 schemes, owing to extracting adhesive material tape out from the opening of cover, therefore do not need to take off the cover of adhesive material tape spool, just can directly from adhesive material tape spool, extract adhesive material tape out.
According to the invention of the 56th scheme, can play when inventing identical action effect with any one in the 52nd scheme to the 55 schemes, because the side plate of winder can freely be installed and removed chimeric mutually, therefore, after the adhesive material tape of a side winder has been used up, by removing chimeric with the opposing party's winder, can from next winder, extract adhesive material tape out in turn.
According to the invention of the 57th scheme, the 58th scheme, can play with any one in the 52nd scheme to the 56 schemes and invent identical action effect, particularly, at adhesive material tape, be the adhesive material tape that has been coated with the electrode connecting adhesive that the electrode of facing is mutually coupled together on base material, or in the situation that adhesive material tape be by lead frame fixing with support substrate or for semiconductor element mounting tube core and the adhesive material tape that semiconductor element couples together of support substrate, lead frame particularly useful.
According to the invention of the 59th scheme, due to be hold by one hand box body, by the peristome that exposes adhesive tapes by being pressed on circuit card, heater block carries out hot pressing and caking agent is crimped onto circuit card from base material side, therefore can miniaturization and can be with one-handed performance, and can easily carry out crimping in a part that caking agent is crimped onto to substrate time.
According to the invention of the 60th scheme, by making the base material of adhesive material tape, be metallic film or aromatic polyamide film, even in the situation that the thinner thickness of base material, also can prevent the faults such as the stretching of base material and fracture.
In addition, by the adhesive material tape that utilizes the base material of thinner thickness to form, can make 1 number of turns on spool increase, thereby can increase spendable bonding dosage on 1 spool.In addition, the adhesive material tape of the application of the invention, because the number of turns on each spool is more, so in the manufacturing works of electronic devices and components, the replacing number of times of new adhesive material tape can be not too many, improved operating efficiency.In addition, in the manufacture of adhesive material tape, owing to can reducing the number of the spool of manufacturing, the usage quantity that therefore can cut down spool material and moisture proof material, reduces manufacturing expense.
According to the invention of the 61st scheme, when can play the identical action effect of invention with the 60th scheme, can access adhesive material tape thin and that tensile strength is high.
According to the invention of the 62nd scheme, when can play the identical action effect of invention with the 60th scheme or the 61st scheme, by making the tensile strength of base material, be more than 300MPa, make base material be difficult to be stretched or break.
According to the invention of the 63rd scheme, can play when inventing identical action effect with any one in the 60th scheme to the 62 schemes, by making the Thickness Ratio of base material and caking agent, be 0.01～1.0, can access adhesive material tape thinner and that tensile strength is higher.
According to the invention of the 64th scheme, can play when inventing identical action effect with any one in the 60th scheme to the 63 schemes, by making the surfaceness R of base material maxbe below 0.5 μ m, make the surface smoothing of base material, on circuit card, caking agent is easily separated from base material during crimping caking agent.
According to the invention of the 65th scheme, in bonded object, form in the operation before caking agent, owing to making, a side the caking agent of adhesive material tape and the caking agent of the opposing party's adhesive material tape are overlapping, after forming desired caking agent thickness, again caking agent is formed in bonded object, therefore, can makes the thinner thickness of each adhesive material tape, even if increased the number of turns of adhesive material tape, also can reduce the winding diameter of the adhesive material tape on each spool.
So, can increase the number of turns of the adhesive material tape of each spool, thereby increase significantly 1 time, change spendable bonding dosage in operation.Therefore, the replacing operation of new adhesive material tape can be not too many, improved the production efficiency of e-machine.
According to the invention of the 66th scheme, when can play the identical action effect of invention with the 65th scheme, can reduce the number of the adhesive material tape that needs low temperature keeping, thereby can carry out the transportation of adhesive material tape, the efficient management of keeping.
According to any one invention in the 67th scheme～72nd scheme, can provide and there is good replicability (adhibit quality) to being connected member, and there is good connection reliability, thereby can improve the qualification rate of in-process, further improve workability, the anisotropic conductive material band longer with comparing in the past size, thus productivity, workability improved.

Claims (20)

1. an adhesive tapes, is the adhesive tapes that is coated with caking agent on base material and is wound into spool shape, it is characterized in that: on the width of belt, configure many caking agents.
2. adhesive tapes as claimed in claim 1, is characterized in that: between the strip of glue adjacent to each other of many caking agents, have interval in vain.
3. adhesive tapes as claimed in claim 1, is characterized in that: the slit that caking agent is formed by the width along belt is separated into many.
4. the adhesive tapes as described in any one in claim 1～3, is characterized in that: the width of adhesive tapes is more than or equal to the length on one side of circuit card.
5. the adhesive tapes as described in any one in claim 1～4, is characterized in that: the width of adhesive tapes is 5mm～3000mm.
6. the adhesive tapes as described in any one in claim 1～5, is characterized in that: the width of of caking agent is 0.5mm～10.0mm.
7. the adhesive tapes as described in any one in claim 1～6, is characterized in that: the width of adhesive tapes is the size roughly the same with one side of circuit card.
8. adhesive tapes as claimed in claim 1 or 2, is characterized in that: caking agent is set up to have equally spaced mode in vain.
9. the adhesive tapes as described in any one in claim 1～8, is characterized in that: the polyethylene terephthalate that base material is extended polypropylene, tetrafluoroethylene or silicone-treated.
10. the adhesive tapes as described in any one in claim 1～9, is characterized in that: caking agent is mixture class or the hot-melt object class of thermoplastic resin, thermosetting resin, thermoplastic resin and thermosetting resin.
11. adhesive tapes as claimed in claim 10, is characterized in that: thermosetting resin is epoxy resin, crylic acid resin, vinyl ester resin class or silicone resin class.
12. adhesive tapes as described in any one in claim 1～11, is characterized in that: in caking agent, be dispersed with conducting particles.
13. adhesive tapes as claimed in claim 12, is characterized in that: conducting particles is metallics, carbon, graphite, or, be the particle that coated with conductive layer forms on these or dielectric glass, pottery or polymer core.
14. adhesive tapes as described in any one in claim 1～11, is characterized in that: caking agent is the insulativity caking agent that is not dispersed with conducting particles.
The compression bonding method of 15. 1 kinds of adhesive tapes, is characterized in that: the adhesive tapes described in any one in claim 1～14 is configured on circuit card, by adhesive tapes is carried out to hot pressing along width, thus on one side of circuit card crimping strip of glue.
The compression bonding method of 16. adhesive tapes as claimed in claim 15, is characterized in that: before caking agent is crimped on to circuit card, on the width of caking agent, form slit.
The compression bonding method of 17. adhesive tapes as claimed in claim 16, is characterized in that: before soon adhesive tapes being crimped onto on circuit card, form described slit.
The compression bonding method of 18. adhesive tapes as described in claim 16 or 17, is characterized in that: to being used with thermal head crimping from base material side by 1 rule caking agent of slit separation.
The compression bonding method of 19. adhesive tapes as described in any one in claim 15～18, is characterized in that: by the caking agent of the part of hot pressing, being softened and flow, is below 100 pools.
The compression bonding method of 20. adhesive tapes as described in any one in claim 15～19, is characterized in that: by the reactivity of the caking agent of hot pressing, be below 20%.
CN201410378540.3A 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor Expired - Lifetime CN104152075B (en)

Applications Claiming Priority (34)

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JP2003-002092 2003-01-08
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JP2003-118286 2003-04-23
JP2003-118287 2003-04-23
JP2003130197A JP4238626B2 (en) 2003-05-08 2003-05-08 Adhesive tape reel, adhesive device, connection method, and adhesive tape connector
JP2003-130197 2003-05-08
JP2003130196A JP2004331833A (en) 2003-05-08 2003-05-08 Tape reel for adhesive materials
JP2003-130196 2003-05-08
JP2003176321A JP2005330296A (en) 2003-06-20 2003-06-20 Connecting method of adhesive material tape
JP2003-176321 2003-06-20
JP2003-176322 2003-06-20
JP2003176322A JP2005330297A (en) 2003-06-20 2003-06-20 Method of forming adhesive material by adhesive material tape

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CNB038180847A Division CN100548840C (en) 2002-07-30 2003-07-30 The method of attachment of adhesive material tape connector and adhesive material tape

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CN104152075B CN104152075B (en) 2017-04-12

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