TWI322649B - - Google Patents

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Publication number
TWI322649B
TWI322649B TW097143988A TW97143988A TWI322649B TW I322649 B TWI322649 B TW I322649B TW 097143988 A TW097143988 A TW 097143988A TW 97143988 A TW97143988 A TW 97143988A TW I322649 B TWI322649 B TW I322649B
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive tape
tape
substrate
disk
Prior art date
Application number
TW097143988A
Other languages
Chinese (zh)
Other versions
TW200913828A (en
Inventor
Naoki Fukushima
Takashi Tatsuzawa
Takahiro Fukutomi
Kouji Kobayashi
Toshiyuki Yanagawa
Masami Yusa
Motohiro Arifuku
Yasushi Gotoh
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200913828A publication Critical patent/TW200913828A/en
Publication of TWI322649B publication Critical patent/TWI322649B/zh
Application granted granted Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Description

1322649 九、發明說明 【發明所屬之技術領域】1322649 IX. Description of the invention [Technical field to which the invention pertains]

本發明係關係電子構件及電路基板、或電路基板間之 黏著固定、以及實施兩者之電極間之電性連接之黏著材膠 帶、其連接方法、製造方法、壓著方法、黏著材膠帶盤、 黏著裝置、黏著劑膠帶盒、及使用其之黏著劑壓著方法， 尤其是，和捲成盤狀之黏著材膠帶、其連接方法、製造方 法、壓著方法、黏著材膠帶盤、黏著裝置、黏著劑膠帶盒 、使用其之黏著劑壓著方法、及向異導電材膠帶相關。 【先前技術】 一般而言，液晶面板、PDP (電獎顯示面板）、EL( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 手段，係採用黏著材膠帶。The present invention relates to an adhesive tape for fixing an electronic component, a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, a connection method, a manufacturing method, a pressing method, an adhesive tape tray, and Adhesive device, adhesive tape cassette, and adhesive pressing method using the same, in particular, and a disc-shaped adhesive tape, a connection method thereof, a manufacturing method, a pressing method, an adhesive tape tray, an adhesive device, Adhesive tape cassette, adhesive bonding method using the same, and related to the different conductive material tape. [Prior Art] In general, an electronic component such as a liquid crystal panel, a PDP (Electronics Display Panel), an EL (fluorescent display panel), a bare chip package, or a circuit board, or a circuit board, or both, and both The electrical connection means between the electrodes is made of adhesive tape.

日本特開200 1 _284〇05號公報，係記載著將在基材塗 布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶的長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 -6- 1322649 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 【發明內容】Japanese Laid-Open Patent Publication No. 2001- 284-2005 discloses that the adhesive tape of the adhesive material applied to the substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. -6- 1322649 Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. [Summary of the Invention]

近年來，隨著PDP等之面板畫面之大型化，電路基板 之黏著面積（或周圍之一邊尺寸）亦增大，一次使用之黏 著劑的使用量亦增加。又，因爲黏著劑用途之擴大，黏著 劑之使用量亦增加。因此，電子機器之製造工廠之黏著材 盤的更換更爲頻繁，因爲黏著材盤之更換十分麻煩，故有 無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 的捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置》 因此，本發明之目的係在提供一種黏著材膠帶之連接 方法、黏著材膠帶、其製造方法、壓著方法、黏著材膠帶 盤、黏著裝置、黏著劑膠帶盒、使用其之黏著劑壓著方法 、及向異導電材膠帶，使黏著材盤之更換十分簡單，且可 1322649 提高電子機器之生產效率。In recent years, as the panel size of a PDP or the like has increased, the adhesion area (or the size of one side of the periphery) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Also, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic device is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be attached because it cannot be attached to the existing adhesive device. Therefore, the object of the present invention is to provide a Adhesive tape connection method, adhesive tape, manufacturing method thereof, pressing method, adhesive tape tray, adhesive device, adhesive tape cassette, adhesive pressing method using the same, and adhesive tape to the opposite conductive material The replacement of the material plate is very simple, and the 1322649 can increase the production efficiency of the electronic machine.

申請專利範圍第1項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠帶 之終端部反折，使一方之黏著材膠帶之黏著劑面及另一方 之黏著材膠帶之黏著劑面重疊，並實施兩者之重疊部份的 加熱壓著使其連接。 此申請專利範圍第1項記載之發明時，係利用黏著材 膠帶之黏著劑來黏著全部捲出之黏著材膠帶之終端部、及 新裝著之黏著材膠帶之始端部，實施黏著材盤之更換，故 很簡單即可將新黏著材膠帶裝著至黏著裝置。又，因爲無 需在每次更換新黏著材膠帶時都更換捲取膠帶、將新黏著 材膠帶之始端裝設至捲取盤之作業、以及在特定路徑設定 導引銷等之作業，只需要較少時間即可更換新黏著材盤， 故可提高電子機器之生產效率。 因係將全部捲出之黏著材膠帶之終端部反折，並將黏 著材膠帶之黏著劑面及新裝著之黏著材膠帶之黏著劑面重 疊黏著，故具有較高之連接強度。 連接部份之加熱壓著若採用裝著著黏著材盤之黏著裝 置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第2項記載之發明，係如申請專利範圍 第1項記載之發明，其特徵爲，一方之黏著材膠帶之終端 部標示著結束標記。 -8- 1322649 此申請專利範圍第2項記載之發明時，除了具有和申 請專利範圍第1項記載之發明相同之作用效果以外，尙可 在結束標記露出時實施全部捲出之黏著材膠帶之切斷，故 實施切斷及連接作業之部份容易解開，而且，可利用必要 最小之位置實施連接，而可防止黏著材膠帶之浪費。The invention described in claim 1 is an adhesive tape for attaching one of the pads to which the electrode for the electrode connection is applied to the substrate, and the other for the disk to be wound onto the other disk. A method for attaching an adhesive tape of one of the adhesive tapes, characterized in that the end portion of one of the adhesive tapes is folded back so that the adhesive surface of one of the adhesive tapes and the adhesive of the other adhesive tape overlap. And carry out the heating and pressing of the overlapping parts of the two to make them connected. In the invention described in the first aspect of the patent application, the adhesive portion of the adhesive tape is used to adhere the end portion of the adhesive tape which is completely unwound, and the beginning end portion of the newly attached adhesive tape, and the adhesive sheet is applied. Replacement, it is very simple to put the new adhesive tape to the adhesive device. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of installing the new adhesive tape to the take-up reel, and the setting of the guide pin in a specific path, it is only necessary to The new adhesive sheet can be replaced in a small amount of time, thereby increasing the production efficiency of the electronic machine. Since the end portion of the adhesive tape which is completely rolled out is folded back, and the adhesive surface of the adhesive tape and the adhesive surface of the newly attached adhesive tape are overlapped, the connection strength is high. If the heating portion of the connecting portion is heated and pressed, if the heating and pressing head of the bonding device with the adhesive sheet is used, the adhesive device can be used reasonably. The invention of claim 2 is the invention of claim 1, wherein the end portion of one of the adhesive tapes is marked with an end mark. -8- 1322649 In the invention described in the second aspect of the patent application, in addition to the same effects as those of the invention described in the first aspect of the patent application, the adhesive tape can be completely rolled out when the end mark is exposed. Since the cutting and the joining work are easily performed, the connection can be performed at the minimum necessary position, and the waste of the adhesive tape can be prevented.

申請專利範圍第3項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲’另一方之黏著材膠帶 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，在將一方之黏著材膠帶之終端部反 折後，再使前導膠帶之黏著劑面和一方之黏著材膠帶之終 端部之黏著劑面重疊，實施重疊部份之加熱壓著。The invention described in claim 3 is for attaching an adhesive tape coated on the substrate to one of the discs coated with the electrode-bonding adhesive, and winding the tape onto the other tray. A method for attaching an adhesive tape of one of the adhesive tapes, characterized in that the beginning of the adhesive tape of the other side is stopped by attaching the leading tape to the surface of the adhesive tape substrate attached to the disk, After the end portion of one of the adhesive tapes is folded back, the adhesive surface of the leading tape and the adhesive surface of the end portion of one of the adhesive tapes are overlapped, and the overlapping portions are heated and pressed.

此申請專利範圍第3項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶來黏著全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部，故很簡單即可實施黏著材膠帶間之黏著。 申請專利範圍第4項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 -9- 1322649 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，使前導膠帶之黏著劑面和一方之黏 著材膠帶之終端部之黏著劑面重疊，實施重疊部份之加熱 壓著。In the invention described in the third paragraph of the patent application, as in the invention described in claim 1, it is very simple to attach the new adhesive tape to the adhesive device, and it takes only a small time to replace the new one. Adhesive trays can increase the productivity of electronic machines. Further, since the end portion of the adhesive tape which is completely unwound and the beginning end of the newly attached adhesive tape are adhered by the adhesive tape before the adhesive tape, the adhesion between the adhesive tapes can be easily performed. The invention described in claim 4 is for attaching an adhesive tape to which one of the substrates for coating the electrode for attachment to the substrate is wound up to one of the disks, and for winding onto the other disk. A method for attaching an adhesive tape of one of the adhesive tapes, characterized in that the other end of the adhesive tape 9-13322649 is attached to the surface of the adhesive tape substrate by attaching the leading tape to the disk. This is stopped, and the adhesive surface of the leading tape and the adhesive surface of the end portion of one of the adhesive tapes are overlapped, and the overlapping portions are heated and pressed.

此申請專利範圍第4項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 申請專利範圍第5項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，在兩者 之重疊部份插入卡止銷來實施連接。 此申請專利範圍第5項記載之發明時，因爲係以卡止 銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏著 材膠帶之始端部，故連接十分簡單。又，因爲無需在每次 更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 申請專利範圍第6項記載之發明，係利用卡止構件來 -10- 1322649In the invention described in the fourth aspect of the patent application, as in the invention described in claim 1, it is very simple to attach the new adhesive tape to the adhesive device, and it takes only a small time to replace the new one. Adhesive trays can increase the productivity of electronic machines. In addition, since the adhesive tape is not required to be folded back, the adhesive tape can be taken up to the take-up reel to prevent possible winding up. The invention described in claim 5 is for attaching an adhesive tape coated on the substrate to the one of the disks on which the electrode for connection is applied, and to the other of the disks. A method for attaching an adhesive tape of one of the adhesive tapes, wherein the end portion of one of the adhesive tapes and the other end of the adhesive tape are overlapped, and a locking pin is inserted in an overlapping portion of the adhesive tape Implement the connection. In the invention described in the fifth aspect of the patent application, since the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are fixed by the locking pin, the connection is very simple. Moreover, since it is not necessary to change the take-up tape every time the new adhesive tape is replaced, the operation of installing the new adhesive tape to the take-up reel, and the setting of the guide pin in a specific path, it is only necessary to The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The invention described in the sixth paragraph of the patent application is made by using a locking member -10- 1322649

連接用以連接基材上塗布著電極連接用黏著劑之捲取至一 方之盤上之一方之黏著材膠帶、及捲取至另一方之盤上之 另一方之黏著材膠帶的黏著材膠帶之黏著材膠帶連接方法 ，其特徵爲，卡止構件具有配設於一方及另一方端部之爪 部、及配設於爪部間之彈性構件，一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部會互相抵接，配設於 卡止構件之一端之爪部會卡止於一方之黏著材膠帶之終端 部，配設於另一端之爪部會卡止於另一方之黏著材膠帶之 始端部，以彈性構件拉近兩方之爪部。 此申請專利範圍第6項記載之發明時，因爲使卡止構 件之一方之爪部卡止於一方之黏著材膠帶之終端部，而且 ，使卡止構件之另一方之爪部卡止於另一方之黏著材膠帶 之始端部，實施兩者之互相連接，故連接十分容易。又， 因爲一方之爪部及另一方之爪部之間具有彈性構件，故， 彈性構件可伸展而使卡止構件之另一方之爪部卡止於另一 方之黏著材膠帶之始端部之任意位置上，而爲具有高自由 度之連接。 又，因係使一方之黏著材膠帶之終端部、及另一方之 黏著材膠帶之始端部互相抵接之狀態實施連接，而無需使 膠帶互相重疊，可利用必要最小之位置實施連接，而可防 止黏著材膠帶之浪費。 申請專利範圍第7項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 -11 - 1322649 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，以橫剖 面略呈3字形之可彈性變形之夾子實施兩者之重疊部份的 夾持固定。 此申請專利範圍第7項記載之發明時，因爲只需以夾 子夾住一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部之重疊部份即可實施連接，連接作業十分容易An adhesive tape for attaching one of the adhesive tapes coated on the substrate to the one of the disks, and the adhesive tape of the other adhesive tape to the other disk The adhesive tape connecting method is characterized in that the locking member has a claw portion disposed at one end and the other end portion, and an elastic member disposed between the claw portions, and a terminal portion of the adhesive tape and the other side of the adhesive tape The beginning end of the adhesive tape will abut each other, and the claw portion disposed at one end of the locking member will be locked at the end portion of one of the adhesive tapes, and the claw portion disposed at the other end will be locked to the other side. At the beginning of the adhesive tape, the elastic members are used to draw the claws of both sides. In the invention described in claim 6, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and the other claw of the locking member is locked to the other portion. The beginning of the adhesive tape on one side is connected to each other, so the connection is very easy. Moreover, since the elastic member is provided between the claw portion of one of the claws and the claw portion of the other, the elastic member can be extended to lock the other claw portion of the locking member to the beginning of the other adhesive tape. In position, it is a connection with a high degree of freedom. Further, since the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are brought into contact with each other, it is not necessary to overlap the tapes, and the connection can be performed at the minimum necessary position. Prevent the waste of adhesive tape. The invention described in claim 7 is for attaching an adhesive tape on a substrate to which one of the disks for coating an electrode for electrode bonding is wound up, and winding the tape onto the other disk. A method for attaching an adhesive tape of one of the adhesive tapes -11 to 1322649, which is characterized in that the end portion of one of the adhesive tapes and the other end of the adhesive tape are overlapped, and the cross section is slightly 3-shaped. The elastically deformable clip performs the clamping and fixing of the overlapping portions of the two. In the invention described in the seventh aspect of the patent application, since the end portion of the adhesive tape of one of the adhesive tapes and the overlapping portion of the other end of the adhesive tape can be sandwiched by the clip, the connection can be performed. easily

申請專利範圍第8項記載之發明，其特徵爲，係以橫 剖面略呈3字形之金屬製夾持片夾住一方之黏著材膠帶及 另一方之黏著材膠帶之重疊部份，並從重疊部份之兩面壓 扁夾持片來連接兩者。 此申請專利範圍第8項記載之發明時，因係從重疊部 份之兩面壓扁夾持片來連接兩者，故可提高黏著材膠帶之 重疊部份的連接強度。 申請專利範圍第9項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部之其中任何一 方之黏著劑面重疊於另一方之基材面上，兩者之重疊長度 爲黏著劑膠帶寬度之2至50倍之範圍，以兩者之加熱壓 著實施連接。 此申請專利範圍第9項記載之發明時，因係利用黏著 -12- 1322649 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部來實施黏著材盤之更換，故很 簡單即可將新黏著材盤裝著至黏著裝置上。又，因爲無需 在每次更換新黏著材盤時都更換捲取盤、及將新黏著材之 始端裝設至捲取盤之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。The invention according to claim 8 is characterized in that the metal holding piece having a substantially three-shaped cross section sandwiches the overlapping portion of one of the adhesive tape and the other adhesive tape, and is overlapped The two sides of the part are flattened by a clamping piece to connect the two. In the invention described in the eighth aspect of the invention, since the two pieces are flattened from both sides of the overlapping portion to join the two, the joint strength of the overlapping portion of the adhesive tape can be improved. The invention described in claim 9 is for attaching an adhesive tape to which one of the pads for coating the electrode for electrode bonding is applied to one of the substrates, and for winding onto the other disk. A method for attaching an adhesive tape of one of the adhesive tapes, wherein the adhesive portion of one of the end portions of one of the adhesive tapes and the other end of the adhesive tape is overlapped with the other base On the surface of the material, the overlapping length of the two is in the range of 2 to 50 times the width of the adhesive tape, and the connection is performed by heating and pressing the two. In the invention described in claim 9 of the patent application, the adhesive is applied to the end portion of the used adhesive tape and the beginning portion of the newly attached adhesive tape by the adhesive of the adhesive tape -12-1322649. The replacement of the adhesive sheet is very simple, so that the new adhesive sheet can be attached to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, and the beginning of the new adhesive material is attached to the take-up reel, it takes only a small time to replace the new adhesive disc, so Improve the production efficiency of electronic machines.

重疊部份之長度爲黏著材膠帶寬度之2倍至50倍， 其理由如下所示，小於2倍時無法獲得充分之連接強度， 大於50倍時則連接部份使用之黏著材會增加過多而造成 黏著材之浪費。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑者，亦可以爲只有絕緣性黏著劑者，或者 ，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 〇項記載之發明，係用以連接基材 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另—方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲’將一方之黏著材膠 帶之終端部折向黏著劑相對之方向’而將另一方之黏著材 膠帶之始端部折向黏著劑相對之方向’使兩者之彎折部份 互相卡止重疊且使兩者之黏著材面相對’實施重疊部份之 加熱壓著。 此申請專利範圍第10項記載之發明時’除了具有和 -13- 1322649 申請專利範圍第1項記載之發明相同之作用效果以外，一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 會互相形成鈎狀卡止，且兩者之黏著劑面會互相連接，故 有較高之連接強度。 申請專利範圍第11項記載之發明，係如申請專利範 圍第9或10項記載之發明，一方之黏著材膠帶之終端部 會標示著結束標記。The length of the overlapping portion is 2 to 50 times the width of the adhesive tape. The reason is as follows. When the thickness is less than 2 times, sufficient joint strength cannot be obtained. When the thickness is more than 50 times, the adhesive material used in the joint portion is excessively increased. Causes waste of adhesive materials. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be used reasonably. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The invention described in the first aspect of the patent application is for attaching an adhesive tape coated on a substrate to an adhesive for electrode bonding to one of the disks, and winding it onto another disk. The adhesive tape bonding method of the adhesive tape of the other side is characterized in that: the end portion of the adhesive tape of one side is folded toward the direction of the adhesive, and the beginning end of the adhesive tape of the other side is folded toward the adhesive. The opposite direction is such that the bent portions of the two are overlapped with each other and the adhesive surfaces of the two are pressed against each other by the heating of the overlapping portions. In the case of the invention described in claim 10, the end portion of the adhesive tape and the adhesive tape of the other side are the same as those of the invention described in the first aspect of the application of the Japanese Patent Application No. 13-1322649. The beginning ends will form a hook-like snap to each other, and the adhesive faces of the two will be connected to each other, so that the joint strength is high. The invention described in claim 11 is the invention described in claim 9 or claim 10, wherein the end portion of the adhesive tape of one of the parties is marked with an end mark.

此申請專利範圍第11項記載之發明時，除了具有和 申請專利範圍第9或1 0項記載之發明相同之作用效果以 外，因爲一方之黏著材膠帶之終端部係利用結束標記部份 ’執行連接作業之部份容易解開且可利用必要最小之位置 實施連接，而可防止黏著材膠帶之浪費。又，可自動檢測 結束標記部份，故可利用該檢測信號控制裝置’若能發出 警報，則可提高作業效率。 申請專利範圍第1 2項記載之發明’係如申請專利範 圍第9〜11項之其中任一項記載之發明，其特徵爲，以形 成凹凸之一方之模具、及和其咬合之另一方之模具’夾住 一方之黏著材膠帶及另一方之黏著材膠帶之重疊部份’實 施加熱壓著。 此申請專利範圍第12項記載之發明時，除了具有和 申請專利範圍第9〜11項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成凹凸而可擴大連接面 積，同時，可利用凹凸部之卡合來提高黏著材膠帶之拉伸 方向（縱向）之連接強度。 -14- 1322649 申請專利範圍第1 3項記載之發明，係如申請專利範 圍第9〜11項之其中任一項記載之發明，其特徵爲，在一 方之黏著材膠帶及另一方之黏著材膠帶之重疊部份形成貫 通孔後，實施重疊部份之加熱壓著。In the invention described in the eleventh aspect of the patent application, in addition to the same effects as the invention described in claim 9 or 10, the end portion of one of the adhesive tapes is executed by the end mark portion The part of the joining operation is easy to unravel and the connection can be made with the least necessary position, and the waste of the adhesive tape can be prevented. Further, since the end mark portion can be automatically detected, the detection signal control means can be used to increase the work efficiency if an alarm can be issued. The invention according to any one of claims 9 to 11, wherein the mold having one of the irregularities and the other one of the occlusions The mold 'clamping one of the adhesive tape and the other overlapping part of the adhesive tape' is heated and pressed. In addition to the effects of the invention described in any one of claims 9 to 11, the invention has the same effect as the invention described in any one of claims 9 to 11, and the connection portion is formed with irregularities to expand the connection area. At the same time, the engagement of the uneven portions can be utilized to increase the joint strength of the direction of the adhesive tape (longitudinal direction). The invention described in any one of claims 9 to 11 is characterized in that the adhesive tape on one side and the other adhesive material are in the invention. After the overlapping portions of the tape are formed into the through holes, the overlapping portions are heated and pressed.

此申請專利範圍第1 3項記載之發明時，除了具有如 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成貫通孔，黏著劑會滲 出至貫通孔之內緣，而增加黏著劑之黏著面積，故可進一 步提高連接強度。 申請專利範圍第1 4項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 著材膠帶的黏著材膠帶連接方法，其特徵爲，一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部會重疊或 抵接，以跨越兩黏著材膠帶之矽處理基材之表面部份的方 式貼附矽黏著膠帶，實施兩黏著材膠帶之連接。 此申請專利範圍第14項記載之發明時，已捲取一方 之黏著材膠帶之黏著材盤、及只捲取黏著材膠帶之基材之 捲取盤係裝著於黏著裝置上，黏著材盤之黏著材膠帶用完 時’已用完之黏著材膠帶（一方之黏著材膠帶）之終端部 、及新裝著之黏著材盤之黏著材膠帶（另一方之黏著材膠 帶）之始端部會以矽黏著膠帶連接，新黏著材盤會取代已 用完之黏著材盤而裝著於黏著裝置上。 本發明時，只需連接已用完之黏著材膠帶及新黏著材 -15- 1322649 膠帶即可更換連接盤，故很容易即可將新黏著材盤裝著至 黏著裝置上。又，因爲無需在每次更換新黏著材盤時都更 換捲取盤、或將新黏著材膠帶之始端裝設至捲取盤並引導 黏著材膠帶之作業，故只需要較少時間即可更換新黏著材 盤，而可提高電子機器之生產效率。In addition to the same effects as the invention described in any one of the claims 9 to 11 of the patent application, the connection portion may form a through-hole, an adhesive. It will ooze out to the inner edge of the through hole, and increase the adhesive area of the adhesive, so that the joint strength can be further improved. The invention described in claim 14 is an adhesive tape for attaching one side of a disk coated with an electrode-bonding adhesive to one of the disks, and to the other disk. The adhesive tape bonding method of the adhesive tape of the other side is characterized in that the end portion of one of the adhesive tapes and the other end of the adhesive tape overlap or abut each other to span the two adhesive tapes. The method of treating the surface portion of the substrate is attached to the adhesive tape to perform the connection of the two adhesive tapes. In the invention described in claim 14, the adhesive sheet of the adhesive tape of one of the adhesive tapes and the take-up reel of the substrate of only the adhesive tape are attached to the adhesive device, and the adhesive tray is attached. When the adhesive tape is used up, the end portion of the used adhesive tape (the adhesive tape of one side) and the adhesive tape of the newly installed adhesive tape (the adhesive tape of the other side) will be Attached by adhesive tape, the new adhesive sheet will replace the used adhesive sheet and attach it to the adhesive device. In the present invention, the connection plate can be replaced by simply connecting the used adhesive tape and the new adhesive material -15- 1322649 tape, so that the new adhesive material plate can be easily attached to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, or to install the beginning of the new adhesive tape to the take-up reel and guide the adhesive tape, it takes less time to replace Newly adhered to the tray to increase the productivity of electronic machines.

黏著材膠帶之基材係利用矽實施表面處理，使用之黏 著膠帶亦使用矽黏著劑，可減少兩者之表面張力的差異而 提高密著力，故可實現傳統上較困難之兩者的黏著。 黏著材膠帶之黏著劑可以爲將導電粒子分散於絕緣性 黏著劑中之向異導電性黏著者，亦可以爲只有絕緣性黏著 劑者，或者，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 5項記載之發明，其特徵爲，申請 專利範圍第14項記載之矽黏著膠帶之黏著劑面之表面張 力及黏著材膠帶之矽處理基材之表面張力之差爲l〇mN/m (1 0 d y n e / c m )以下。 此申請專利範圍第15項記載之發明時，除了具有和 申請專利範圍第1 4項記載之發明相同之作用效果以外， 因爲矽黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽 處理基材之表面張力之差爲10mN/m(10dyne/cm)以下， 可獲得較強之密著力，而可確實黏著兩者。表面張力係以 潮濕試劑或接觸角來檢測。 黏著材膠帶之矽處理基材及矽黏著膠帶之黏著劑面的 表面張力差應爲 〇〜5mN/m(5dyne/cm)。表面張力之差 愈小愈好，若超過l〇mN/m ( 10dyne/cm )則可能無法獲得 -16- 1322649 充分密著強度。 申請專利範圍第1 6項記載之發明，係如申請專利範 圍第2項記載之發明，其特徵爲，矽黏著膠帶之黏著力係 100g/25mm 以上。The base material of the adhesive tape is subjected to surface treatment by using 矽, and the adhesive tape used is also a 矽 adhesive, which can reduce the difference in surface tension between the two and increase the adhesion, so that the adhesion which is conventionally difficult can be achieved. The adhesive for the adhesive tape may be a dissimilar conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive alone, or disperse the insulating spacer particles in the adhesive. By. The invention described in claim 15 is characterized in that the difference between the surface tension of the adhesive surface of the adhesive tape and the surface tension of the adhesive substrate of the adhesive tape described in claim 14 is l〇 mN/m (1 0 dyne / cm ) or less. In the invention of the fifteenth aspect of the patent application, the surface tension of the adhesive surface of the adhesive tape and the treatment base of the adhesive tape are the same as those of the invention described in claim 14 of the patent application. The difference in surface tension of the material is 10 mN/m (10 dyne/cm) or less, and a strong adhesion can be obtained, and both can be surely adhered. Surface tension is measured by wet reagents or contact angles. The surface tension difference between the adhesive substrate of the adhesive tape and the adhesive surface of the adhesive tape should be 〇~5mN/m (5dyne/cm). The smaller the difference in surface tension, the better. If it exceeds l〇mN/m (10dyne/cm), the full adhesion strength of -16-1322649 may not be obtained. The invention described in claim 16 is the invention according to claim 2, wherein the adhesive tape of the adhesive tape is 100 g/25 mm or more.

此申請專利範圍第16項記載之發明時，除了具有和 申請專利範圍第2項記載之發明相同之作用效果以外，一 方及另一方之黏著材膠帶的連接係利用對兩者之黏著劑面 張貼矽黏著膠帶來實施黏著，一方及另一方之黏著材膠帶 可獲得兩面之黏著（或密著），故可以高強度實施黏著。 尤其是，因爲黏著力爲l〇〇g/25mm以上，一方及另一 方之黏著材膠帶之兩黏著劑面的黏著會更爲強固。 黏著強度愈大可得到愈強之黏著強度，然而，小於 100g/25mm則可無法獲得特定強度。 申請專利範圍第1 7項記載之發明，其特徵爲，使一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 重疊或抵接，並將申請專利範圍第16項記載之矽黏著膠 帶張貼於兩黏著材膠帶之兩面來實施連接。 此申請專利範圍第17項記載之發明時’除了具有和 申請專利範圍第1 6項記載之發明相同之作用效果以外， 係以其兩面實施一方及另一方之黏著材膠帶之連接，故可 得到更爲強固之連接。 申請專利範圍第1 8項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至—方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 -17- 1322649 著材膠帶的黏著材膠帶連接方法’其特徵爲，以一方之黏 著材膠帶之終端部及另~方之黏著材膠帶之始端部間夾著 兩面塗布著矽黏著劑之矽黏著膠帶之方式來實施兩黏著材 膠帶之連接，兩面之矽黏著劑和矽基材之表面張力之差爲 1 0 m N / m ( 1 0 d y n e / c m )以下，且黏著力爲1 〇 〇 g / 2 5 m m以上In the invention described in the sixteenth aspect of the patent application, in addition to the effects similar to those of the invention described in claim 2, the bonding of one of the other adhesive tapes is carried out by using the adhesive faces of the two. Adhesive tape is used for adhesion, and the adhesive tape of one side and the other can be adhered (or adhered) on both sides, so that adhesion can be performed with high strength. In particular, since the adhesive force is l〇〇g/25 mm or more, the adhesion of the two adhesive faces of the adhesive tape of one side and the other is stronger. The stronger the adhesion strength, the stronger the adhesion strength, however, less than 100 g/25 mm, a specific strength cannot be obtained. The invention according to claim 17 is characterized in that the end portion of one of the adhesive tapes and the other end portion of the adhesive tape are overlapped or abutted, and the application is described in item 16 of the patent application. Adhesive tape is applied to both sides of the two adhesive tapes to perform the connection. In the invention described in the seventeenth aspect of the patent application, in addition to the effects similar to the invention described in claim 16 of the patent application, the bonding of the adhesive tape of one of the other and the other is performed on both sides, so that A stronger connection. The invention described in claim 18 is for attaching an adhesive tape coated with an electrode for attaching an electrode to an enamel-treated substrate to one side of the disk, and winding it to the other side. The other side of the disc is -17- 1322649. The method of attaching the adhesive tape to the tape is characterized in that the end portion of one of the adhesive tapes and the other end of the adhesive tape are coated on both sides. The adhesive tape is used to bond the two adhesive tapes, and the difference between the surface tension of the adhesive on both sides and the base material is 10 m N / m (10 dyne / cm ) or less. Adhesive strength is 1 〇〇g / 2 5 mm or more

此申請專利範圍第18項記載之發明時，因爲使用兩 面黏著劑之矽黏著膠帶，而可以一方及另一方之黏著材膠 帶間夾著兩面矽黏著膠帶之方式來實施兩者之黏著（或密 著），故兩者之連接十分簡單且容易。 申請專.利範圍第1 9項記載之發明，係用以連接基板 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部會重疊或抵接 ，使糊狀之樹脂製黏著劑附著於重疊部份或抵接部份，並 以糊狀之樹脂製黏著劑之硬化來實施兩者之連接。 此申請專利範圍第19項記載之發明時，因爲已用完 之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始端部 係以糊狀之樹脂製黏著劑實施固定，故連接十分簡單。又 ’因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、 將新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定 路徑設定導引銷等之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 -18 - 1322649 因爲一方之黏著材膠帶之終端部、及另一方之黏著材 膠帶之始端部的重疊部份或抵接部份附著著樹脂製黏著劑 ，故連接具有高自由度。 申請專利範圍第2 0項記載之發明，係如申請專利範 圍第19項記載之發明，其特徵爲，樹脂製黏著劑係從熱 硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑之群組中選 取之至少1種材料所構成。In the invention described in claim 18, since the adhesive tape of the double-sided adhesive is used, the adhesive tape of the two sides can be adhered between the adhesive tape of one side and the other. ), so the connection between the two is very simple and easy. The invention described in the ninth aspect of the invention is for attaching an adhesive tape coated with an electrode-bonding adhesive to one of the disks on one of the substrates, and winding the tape onto the other disk. The adhesive tape bonding method of the adhesive tape of the other side is characterized in that the end portion of one of the adhesive tapes and the beginning end of the other adhesive tape are overlapped or abutted, so that the paste-like resin is adhered. The agent is attached to the overlapping portion or the abutting portion, and is bonded by a paste-like resin-based adhesive. In the invention described in claim 19, since the end portion of the used adhesive tape and the beginning portion of the newly-adhered adhesive tape are fixed by a paste-like resin adhesive, the connection is very simple. 'Because there is no need to change the take-up tape every time the new adhesive tape is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path. The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. -18 - 1322649 Since the adhesive portion of the end portion of one of the adhesive tapes and the other end of the adhesive tape is adhered to the resin adhesive, the connection has a high degree of freedom. The invention according to claim 19, wherein the resin adhesive is a group of a thermosetting resin, a photocurable resin, and a hot metal adhesive. At least one material selected from the group consists of.

此申請專利範圍第20項記載之發明時，除了具有和 申請專利範圍第1 9項記載之發明相同之作用效果以外， 因爲可從熱硬化性樹脂、光硬化性樹脂、熱金屬黏著劑之 群組中選取適合用於黏著材膠帶間之連接的樹脂製黏著劑 ，故可提高黏著材膠帶間之連接強度。 申請專利範圍第2 1項記載之發明，其特徵爲，裝著 著黏著材膠帶之黏著裝置上，裝設著用以供應申請專利範 圍第19或20項記載之樹脂製黏著劑的充塡機。In addition to the same effects as the invention described in claim 19, the invention according to the ninth aspect of the invention is applicable to a group of thermosetting resins, photocurable resins, and hot metal adhesives. In the group, a resin adhesive suitable for the connection between the adhesive tapes is selected, so that the connection strength between the adhesive tapes can be improved. The invention described in claim 2, characterized in that the adhesive device with the adhesive tape is provided with a filling machine for supplying the resin adhesive described in claim 19 or 20. .

此申請專利範圍第21項記載之發明時，因爲黏著裝 置內配設著用以供應申請專利範圍第19或20項記載之樹 脂製黏著劑的充塡機，故無另行準備充塡機，而可防止連 接作業之浪費。 又’黏著裝置內除了充塡機以外，亦可具有以實施熱 硬化性樹脂之硬化爲目的之加熱器、或以實施光硬化性樹 脂之光照射爲目的之紫外線》 申請專利範圍第22項記載之發明，係用以將基材上 塗布著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材 -19- 1322649 膠帶盤’其特徵爲，黏著材膠帶盤在膠帶之寬度方向配設 著複數黏著材膠帶之捲部。 此申請專利範圍第22項記載之發明時，因爲配設著 複數黏著材膠帶之捲部（捲部），複數之捲部當中，捲取 至一方之捲部之黏著材膠帶之全部捲出時，會將配置於全 部捲出之捲部之旁邊的另一方之捲部之黏著材膠帶裝設至 捲取盤。In the invention described in claim 21, since the filling device for supplying the resin-made adhesive described in claim 19 or 20 is disposed in the adhesive device, the charging device is not separately prepared. It can prevent waste of connection work. In addition, the heat sink for the purpose of curing the thermosetting resin or the ultraviolet light for the purpose of light irradiation of the photocurable resin may be included in the adhesive device. The invention relates to an adhesive material for winding an adhesive tape coated with an electrode connecting adhesive on a substrate to a disk -19- 1322649. The tape tray is characterized in that the adhesive tape is disposed in the width direction of the tape. The roll of the multiple adhesive tape. In the invention described in the 22nd aspect of the invention, the roll portion (roll portion) of the plurality of adhesive tapes is disposed, and when all the adhesive tapes wound up to one of the plurality of rolls are unwound The adhesive tape of the other roll portion disposed beside the rolled-out portion is attached to the take-up reel.

如此，因爲一方之黏著材膠帶全部捲出時，會將另一 方之黏著材膠帶裝設至捲取盤，而實施黏著材膠帶之更換 ，故無需將新黏著材膠帶盤裝著至黏著裝置上。因此，新 黏著材膠帶盤之更換作業會較少，故可提高電子機器之生 產效率。 因爲可依序使用捲取至複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第2 3項記載之發明，係如申請專利範 圍第22項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部間，具有用以連接 兩者之連結膠帶，一方之黏著材膠帶之全部捲出時，會接 著開始捲出另一方之黏著材膠帶。 -20- 1322649 此申請專利範圍第23項記載之發明時，除了具有和 申請專利範圍第22項記載之發明相同之作用效果以外’ 因爲一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部係以連結膠帶實施連接，無需在一方之捲部之黏著 材膠帶之全部捲出後將另一方之捲部之黏著材膠帶裝設至 捲取盤上之作業，故可進一步提高電子機器之生產效率。In this way, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the take-up reel, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. . Therefore, the replacement of the new adhesive tape can be reduced, so that the productivity of the electronic machine can be improved. Since the adhesive tape taken up to the plurality of rolls can be sequentially used, it is possible to greatly increase the usable adhesive amount for one replacement operation without increasing the number of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention of claim 2, wherein the invention according to claim 22 is characterized in that the end portion of one of the adhesive tapes and the other end of the adhesive tape are used for When the bonding tape of the two is connected, when all of the adhesive tape of one side is unwound, the adhesive tape of the other side is then rolled out. -20- 1322649 In the invention described in claim 23, in addition to the same effects as the invention described in claim 22, the end portion of the adhesive tape and the other adhesive tape are used. Since the beginning end portion is connected by a connecting tape, it is not necessary to attach the adhesive tape of the other winding portion to the take-up reel after the entire adhesive tape of one of the rolls is unwound, so that the electronic device can be further improved. Machine production efficiency.

申請專利範圍第24項記載之發明，係具有申請專利 範圍第23項記載之黏著材膠帶盤、黏著材膠帶之捲取盤 、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏 著材膠帶之黏著材壓著至電子機器之電路基板的壓著部、 以及用以檢測連結膠帶之膠帶檢測手段的黏著裝置，其特 徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通過 壓著部爲止，會將連結膠帶捲取至捲取盤。 此申請專利範圍第24項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，故一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，黏著裝置具有膠帶檢測手段，係由成對之發光部 及受光部所構成，用以實施連結膠帶之光學檢測。另一方 面，連結膠帶之兩端配設著有顏色之（例如黑色）標記， 受光部會利用發光部發出之雷射光檢測連結膠帶兩端之標 記來檢測連結膠帶。又，除了在連結膠帶附加標記以外， -21 - 1322649 可採用使連結膠帶之寬度和黏著材膠帶之寬度不同的方法 、或在連結膠帶上形成複數之孔的方法。 申請專利範圍第25項記載之發明，係利用卡止具連 接一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始 端部的黏著材膠帶盤，其特徵爲，連接部份係以黏著材膠 帶覆蓋卡止具。The invention described in claim 24 is the adhesive tape tray of the patent application scope 23, the take-up reel of the adhesive tape, the adhesive tape disc and the take-up reel, and heated The pressure head presses the adhesive material of the adhesive tape to the pressing portion of the circuit board of the electronic device, and the adhesive device for detecting the tape detecting means for connecting the tape, wherein when the tape detecting means detects the connecting tape, When the connecting tape passes through the pressing portion, the connecting tape is taken up to the take-up reel. In the invention described in claim 24, since the connecting tape is automatically taken up to the take-up reel, the adhesive tape of one of the rolls is completely unwound, and the adhesive material is sequentially taken out from the next roll. tape. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. Further, the adhesive device has a tape detecting means composed of a pair of light-emitting portions and a light-receiving portion for performing optical detection of the connecting tape. On the other hand, a color (for example, black) mark is disposed at both ends of the connecting tape, and the light receiving portion detects the connecting tape by detecting the mark at both ends of the connecting tape by the laser light emitted from the light emitting portion. Further, in addition to attaching a mark to the connecting tape, -21 - 1322649 may be a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the connecting tape. The invention described in claim 25 is an adhesive tape tray in which the end portion of the adhesive tape of one of the adhesive tapes and the other end of the adhesive tape are bonded by a locking device, wherein the connecting portion is adhered. The tape covers the card holder.

此申請專利範圍第2 5項記載之發明時，因爲利用卡 止具來連接全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，實施黏著材膠帶盤之更換，故將新黏 著材膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每 次更換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠 帶之始端裝設至捲取盤之作業、以及在特定路徑設定導引 銷等之作業，只需較少時間即可更換新黏著材膠帶盤，故 可提高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又’ 一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好’同時，可防止連接部份之卡止具接觸黏著 -22- 1322649 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又’以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折180度，使黏 著材膠帶覆蓋卡止具。 又’亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止In the invention described in the twenty-fifth patent application, the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are connected by the locking device, and the adhesive tape is replaced. Therefore, it is very simple to install the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time the new adhesive tape is replaced, the operation of attaching the beginning of the new adhesive tape to the take-up reel, and setting the guide pin in a specific path, it is only necessary The new adhesive tape tray can be replaced in less time, which can improve the production efficiency of the electronic machine. Since the adhesive tape is used in sequence, it is possible to greatly increase the adhesive amount that can be used for one replacement operation without increasing the number of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. In addition, the connection between the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side is good because the adhesive tape is used to cover the locking device, and at the same time, the locking of the connecting portion can be prevented. It has a contact adhesive -22- 1322649 material tape and damages the adhesive tape, or a heating and pressing head or a support table that damages the adhesive device. In addition, the method of covering the card holder with the adhesive tape should be the reverse of the longitudinal direction of the tape after the end portion of the adhesive tape of the one side of the card holder and the beginning end of the adhesive tape of the other side. Fold 180 degrees to make the adhesive tape cover the card holder. Also, other adhesive tapes can be used to cover the connection to cover the card.

申請專利範圍第26項記載之發明，係具有申請專利 範圍第〗項記載之黏著材膠帶盤、黏著材膠帶之捲取盤、 配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏著 材膠帶之黏著材壓著至電子機器之電路基板的壓著部、以 及用以檢測膠帶之連接部份的連接部檢測手段之黏著裝置 ’其特徵爲’連接部檢測手段檢測到膠帶之連接部份時， 至連接部份通過壓著部爲止’會將一方之黏著材膠帶捲取 至捲取盤。 此申請專利範圍第26項記載之發明時，連接部檢測 手段若檢測到連接部份，則因爲至連接部份通過壓著部爲 止’會將一方之黏著材膠帶捲取至捲取盤，故可防止連接 部份到達壓者部時實施壓著動作之問題。又，至連接部份 通過壓著部爲止’因爲會自動將一方之黏著材膠帶捲取至 捲取盤，故可省略捲取之麻煩。 申請專利範圍第2 7項記載之發明’係如申請專利範 圍第2 6項記載之發明’其特徵爲，連接部檢測手段係 -23- 1322649 CCD攝影機、厚度檢測感測器、及透射率檢測感測器之其 中之一。 此申請專利範圍第27項記載之發明時，除了具有和 申請專利範圍第26項記載之發明相同之作用效果以外， 以簡單之構成即可實施連接部份之檢測，而且，可利用這 些手段提高檢測精度。The invention described in claim 26 is the adhesive tape tray of the patent application scope, the winding tray of the adhesive tape, the adhesive tape tray and the take-up tray, and is heated and added. The bonding head presses the adhesive material of the adhesive tape to the pressing portion of the circuit board of the electronic device, and the bonding device for detecting the connecting portion of the connecting portion of the adhesive tape, which is characterized in that the connecting portion detecting means detects When the connecting portion of the tape is passed, the adhesive portion of one of the adhesive tapes is taken up to the take-up reel until the connecting portion passes through the pressing portion. In the invention described in claim 26, when the connecting portion detecting means detects the connecting portion, since the connecting portion passes through the pressing portion, one of the adhesive tapes is taken up to the take-up reel, so It can prevent the problem of the pressing action when the connecting portion reaches the pressure part. Further, since the connecting portion passes through the pressing portion, since one of the adhesive tapes is automatically taken up to the take-up reel, the trouble of winding can be omitted. The invention described in claim 27 is the invention described in claim 26, characterized in that the connection detecting means is a -23- 1322649 CCD camera, a thickness detecting sensor, and a transmittance detecting method. One of the sensors. In the invention described in claim 27, in addition to the same effects as those of the invention described in claim 26, the connection portion can be detected with a simple configuration, and these means can be used to improve Detection accuracy.

例如，採用CCD攝影機做爲連接部檢測手段時，可 使連接部份之表面顯示於監視畫面，以比較圖素之濃淡來 檢測連接部份。又，採用厚度檢測感測器時，因爲連接部 份之厚度會大於黏著材膠帶之厚度，因可以比較厚度之變 化來檢測連接部份。又，採用透射率感測器時，會因爲連 接部份之厚度較厚，且因爲有卡止具而使透射率降低，故 可以比較透射率之値來檢測連接部份。 申請專利範圍第28項記載之黏著材膠帶連接方法， 其特徵爲，利用卡止具連接一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部，連接部份會以黏著材膠帶 覆蓋卡止具。 此申請專利範圍第2 8項記載之發明時，係利用卡止 具連接全部捲出之黏著材膠帶之終端部及新裝著之黏著材 膠帶之始端部來實施黏著材膠帶盤之更換，故將新黏著材 膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每次更 換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需較少時間即可更換新黏著材膠帶盤，故可提 -24- 1322649 高電子機器之生產效率。For example, when a CCD camera is used as the connection detecting means, the surface of the connecting portion can be displayed on the monitor screen, and the connected portion can be detected by comparing the shades of the pixels. Further, when the thickness detecting sensor is used, since the thickness of the connecting portion is larger than the thickness of the adhesive tape, the connecting portion can be detected by comparing the thickness variations. Further, when the transmittance sensor is used, since the thickness of the connecting portion is thick and the transmittance is lowered by the use of the locking member, the connection portion can be detected by comparing the transmittance. The method for attaching an adhesive tape according to claim 28, wherein the end portion of the adhesive tape and the other end of the adhesive tape are connected by a locking device, and the connecting portion is adhesive tape. Cover the card holder. In the invention described in the twenty-eighth aspect of the patent application, the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are connected by the stopper to perform the replacement of the adhesive tape. It is very simple to install the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time the new adhesive tape is replaced, the operation of attaching the beginning of the new adhesive tape to the take-up reel, and setting the guide pin in a specific path, it is only necessary The new adhesive tape tray can be replaced in less time, so the production efficiency of the high electronic machine of -24- 1322649 can be improved.

因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ’故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞’而且’亦可防止因爲基材較長而容易發生之伸 展等弊病。 又’ 一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ’故外觀良好’同時，可防止連接部份之卡止具接觸黏著 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又’以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後’將連接部份朝膠帶之縱向反折180度，使黏 著材膠帶覆蓋卡止具。 又’亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第29項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，基材上會 在膠帶之縱向上配置著複數條黏著劑。 此申請專利範圍第29項記載之發明時，若使用黏著 劑膠帶，將已捲取黏著劑膠帶之盤及空盤裝著至黏著裝置 -25- 1322649 ，對電路基板實施黏著劑之加熱加壓後，並以將基材捲至 空盤之方式裝著。Since the adhesive tape is used in sequence, it is possible to greatly increase the adhesive amount that can be used for one replacement operation without increasing the number of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, the adhesive can be prevented from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, it can be prevented. Blocking 'and' can also prevent the disadvantages such as stretching that is prone to occur due to the long substrate. In addition, the connection between the end portion of the adhesive tape of one side and the beginning end of the adhesive tape of the other side is because the adhesive tape is used to cover the locking device, so that the appearance is good, and the connection portion can be prevented from being locked. A component such as a heated pressure head or a support table that is in contact with the adhesive tape and damages the adhesive tape or the carding device that damages the adhesive device. In addition, the method of covering the card holder with the adhesive tape should be such that the connection portion is facing the longitudinal direction of the tape after the end portion of the adhesive tape of the one side of the card holder and the beginning end of the adhesive tape of the other side. Fold 180 degrees to make the adhesive tape cover the card holder. Also, other adhesive tapes may be used to wrap the connecting portion to cover the card stopper. The invention described in claim 29 is an adhesive tape coated on a substrate and wound into a disk-like adhesive tape, characterized in that a plurality of adhesives are disposed on the substrate in the longitudinal direction of the tape. In the invention described in claim 29, if an adhesive tape is used, the disk and the empty disk on which the adhesive tape has been taken up are attached to the adhesive device -25- 1322649, and the adhesive is heated and pressurized on the circuit substrate. Then, it is loaded in such a manner that the substrate is wound up to an empty tray.

其次，對電路基板實施黏著劑之加熱加壓時，將配設 於基材之寬度方向的複數條黏著劑當中之1條壓著至電路 基板，壓著後之殘餘黏著劑條會和基材同時被捲取至空盤 。其次，盤上之黏著劑膠帶全部捲出後，會使盤之旋轉方 向逆轉，而使黏著劑膠帶之供應方向逆轉。如此，在各次 使用1條黏著劑後，會同時捲取殘餘之黏著劑及基材，並 重複依序使用殘餘之黏著劑條。因此，因爲會依序逐條使 用複數條黏著劑，故無需增加膠帶之捲數，即可大幅增加 1盤（2倍以上）可使用之黏著劑量。 本發明時，無需增加黏著劑膠帶之捲數，可大幅增加 使用黏著劑量。而且，因爲未增加黏著劑膠帶之捲數，故 可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度方向 滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可防止 阻塞，此外，亦可防止因爲基材較長而容易發生之伸展等 弊病（基材之損傷或切斷）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高製造效率。 又，黏著劑膠帶之製造上，因爲每1盤之黏著劑量較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 又，結束第1條黏著劑之壓著而將黏著劑膠帶捲取至 空盤後，爲了使用下1條黏著劑，不逆轉旋轉方向而更換 -26- 1322649 裝著於黏著裝置之2個盤亦可。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 基材之寬度應爲5mm〜1000mm，然而，可依1條黏 著劑之寬度或黏著劑之條數而任意選取。1條黏著劑之寬 度應爲〇.5mm〜10.0mm。Next, when the adhesive is heated and pressurized on the circuit board, one of the plurality of adhesives disposed in the width direction of the substrate is pressed against the circuit substrate, and the residual adhesive strip and the substrate after pressing are pressed. At the same time, it is taken to an empty disk. Secondly, after the adhesive tape on the disc is completely unwound, the rotation direction of the disc is reversed, and the supply direction of the adhesive tape is reversed. Thus, after each adhesive is used, the residual adhesive and the substrate are simultaneously taken up, and the residual adhesive strip is repeatedly used in sequence. Therefore, since a plurality of adhesives are used one by one in order, it is possible to greatly increase the adhesive amount that can be used for one disk (more than 2 times) without increasing the number of tapes. In the present invention, it is not necessary to increase the number of the adhesive tape, and the adhesive amount can be greatly increased. Moreover, since the number of the adhesive tape is not increased, the winding can be prevented from being scattered, and at the same time, the adhesive can be prevented from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, it can be prevented. The clogging can also prevent disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). Manufacturing facilities for electronic components can reduce the number of replacements of new adhesive tapes, thereby increasing manufacturing efficiency. Further, in the manufacture of the adhesive tape, since the amount of the adhesive per one disk is large, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. Then, after the first adhesive is pressed and the adhesive tape is taken up to the empty tray, in order to use the next adhesive, the rotation direction is not reversed and the -26-1322649 is attached to the two discs of the adhesive device. Also. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The width of the substrate should be 5 mm to 1000 mm, however, it can be arbitrarily selected according to the width of one adhesive or the number of adhesives. The width of one adhesive should be 〇5mm~10.0mm.

基材之寬度應爲 5mm〜1 000mm，基材之寬度低於 5mm時，配設於基材上之黏著劑之條數及黏著劑之寬度會 受到制限，大於l〇〇〇mm時，則無裝著至既存之黏著裝置 申請專利範圍第3 0項記載之發明，係如申請專利範 圍第29項記載之發明，其特徵爲，複數條黏著劑之相鄰 的黏著劑條具有間隔。 此申請專利範圍第30項記載之發明時，除了具有和 申請專利範圍第29項記載之發明相同的作用效果以外’ 同時，因爲相鄰之黏著劑條間爲互相分離，故容易實施黏 著劑之逐條壓著。 申請專利範圍第31項記載之發明，係如申請專利範 圍第2 9項記載之發明，其特徵爲，黏著劑係利用在膠帶 之縱向上形成縫隙來分離成複數條。 此申請專利範圍第31項記載之發明時，除了具有和 申請專利範圍第29項相同的作用效果以外，同時’在基 材之單面全面塗布黏著劑，並將黏著劑壓著至電路基板之 -27- 1322649 前一瞬間，亦即，在使用黏著劑膠帶之前一瞬間，尙以切 刃等使黏著劑具有切痕之方式來形成縫隙。 又’縫隙之形成上，亦可在製造黏著劑膠帶時，以切 刃等使黏著劑具有切痕而形成縫隙。 縫隙之形成上，除了利用切刃以外，亦可利用雷射或 電熱線等來形成。 本發明時，可增加配置於基材上之黏著劑條的條數。The width of the substrate should be 5mm~1 000mm. When the width of the substrate is less than 5mm, the number of adhesives disposed on the substrate and the width of the adhesive will be limited. When it is greater than l〇〇〇mm, then The invention described in claim 30, which is the invention described in claim 29, wherein the adjacent adhesive strips of the plurality of adhesives have a space. In addition to the same effects as those of the invention described in claim 29, the invention described in claim 30 is also easy to carry out the adhesive because the adjacent adhesive strips are separated from each other. Pressed one by one. The invention described in claim 31 is the invention of claim 29, wherein the adhesive is separated into a plurality of strips by forming a slit in the longitudinal direction of the tape. In the invention described in claim 31, in addition to the same effect as the application of claim 29, the adhesive is completely applied to one side of the substrate, and the adhesive is pressed onto the circuit substrate. -27- 1322649 The moment before, that is, immediately before the use of the adhesive tape, the gap is formed by cutting the edge of the adhesive with a cutting edge or the like. Further, in the formation of the gap, when the adhesive tape is produced, the adhesive may be cut by a cutting edge or the like to form a slit. The formation of the slit can be formed by using a laser or a heating wire in addition to the cutting edge. In the present invention, the number of the adhesive strips disposed on the substrate can be increased.

申請專利範圍第32項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，以在基材之寬度方向具有間隔之方式配置之塗布器， 對以連續方式搬運之基材面上供應黏著劑來對基材實施複 數條黏著劑之塗布。 此申請專利範圍第3 2項記載之發明時，可以利用既 存設備製造如申請專利範圍第3 0項記載之黏著劑膠帶。 塗布器可以爲配設於基材之寬度方向的複數滾筒，亦 可以爲噴嘴。 申請專利範圍第3 3項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，在一方之基材之單面全面塗布黏著劑，並在黏著劑上 形成縱向之縫隙後，在黏著劑面上配置另一方之基材，以 一方及另一方之基材夾住黏著劑，然後再使一方之基材及 另一方之基材互相分離，一方及另一方之基材上分別交互 貼附著複數條黏著劑，而在一方及另一方之基材上以具有 間隔之方式配置複數條黏著劑。 -28- 1322649 此申請專利範圍第33項記載之發明時，因爲可以同 時製造2個如申請專利範圍第2項記載之黏著劑膠帶，故 具有良好製造效率。The invention described in claim 32 is an adhesive tape manufacturing method in which an adhesive is applied to a substrate and wound into a disk shape, and is characterized in that it is disposed so as to have a space in the width direction of the substrate. The applicator applies a plurality of adhesives to the substrate by supplying an adhesive to the substrate surface conveyed in a continuous manner. In the invention described in the third aspect of the patent application, the adhesive tape described in claim 30 of the patent application can be manufactured by using an existing device. The applicator may be a plurality of rollers disposed in the width direction of the substrate, or may be nozzles. The invention described in claim 3 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, characterized in that the adhesive is completely applied to one side of one of the substrates. After forming a longitudinal slit in the adhesive, the other substrate is disposed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one substrate and the other substrate are placed on the adhesive substrate. Separate from each other, a plurality of adhesives are alternately attached to one or the other of the substrates, and a plurality of adhesives are disposed on the one and the other of the substrates at intervals. -28- 1322649 In the invention described in claim 33, since two adhesive tapes as described in the second paragraph of the patent application can be simultaneously produced, good manufacturing efficiency is obtained.

申請專利範圍第34項記載之發明，係在基材上塗布 黏著劑，並利用捲成盤狀之黏著劑膠帶將黏著劑壓著至電 路基板之黏著劑壓著方法，其特徵爲，基材之單面全面會 塗布著黏著劑，對黏著劑膠帶之寬度方向的部份黏著劑從 基材側沿膠帶之縱向實施加熱加壓形成條狀，降低經過加 熱之部份之黏著劑的凝聚力並壓著至電路基板，壓著後， 將殘餘之黏著劑和基材同時捲成盤狀，並再度利用捲成盤 狀之黏著劑膠帶對電路基板實施殘餘之黏著劑的加熱加壓 此申請專利範圍第3 4項記載之發明時，以對部份黏 著劑加熱來降低該部份之凝聚力（以下簡稱爲「凝聚力降 低線」），從凝聚力降低線將經過加熱之部份的黏著劑壓 著至電路基板，而和基材分離。殘餘之黏著劑會保持殘留 於基材上之情形下，和基材同時被捲取至空盤。 本發明時，因爲只是使黏著劑膠帶之寬度較傳統稍爲 寬一點而已，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑寬度，可以改變加熱 區域來進行任意設定，故壓著黏著劑寬度具有較高之自由 度。 又，和申請專利範圍第29項記載之發明相同，黏著 劑膠帶全部捲出至空盤時，使盤之旋轉方向逆轉，而使膠 -29- 1322649 帶之供應方向逆轉、或保持盤之旋轉方向但將盤相互交換 。利用此方式，因爲會依逐條對基材上之黏著劑加熱並壓 著至電路基板，可在不增加膠帶之捲數的情形下，大幅增 加1盤可使用之黏著劑量。The invention described in claim 34 is an adhesive coating method in which an adhesive is applied to a substrate and the adhesive is pressed onto the circuit substrate by a disk-shaped adhesive tape, which is characterized in that the substrate is The adhesive is applied to one side of the adhesive tape, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed from the side of the substrate along the longitudinal direction of the adhesive tape to form a strip shape, thereby reducing the cohesive force of the adhesive portion of the heated portion. After pressing onto the circuit substrate, after pressing, the residual adhesive and the substrate are simultaneously wound into a disk shape, and the adhesive of the residual adhesive is applied to the circuit substrate by using the adhesive tape which is wound into a disk shape. In the invention described in the third aspect, the cohesive force of the portion is reduced by heating a part of the adhesive (hereinafter referred to as "cohesion reducing line"), and the heated portion is pressed against the cohesive force reducing line. To the circuit substrate, and separated from the substrate. The residual adhesive will remain on the substrate and will be taken up to the empty tray at the same time as the substrate. In the present invention, since the width of the adhesive tape is only slightly wider than the conventional one, the adhesive tape can be directly produced by using the existing equipment. Further, by pressing the width of the adhesive to the circuit board, the heating area can be changed to be arbitrarily set, so that the width of the adhesive is pressed with a high degree of freedom. Further, in the same manner as the invention described in claim 29, when the adhesive tape is completely unwound to the empty tray, the rotation direction of the disk is reversed, and the supply direction of the glue -29-1322649 is reversed, or the rotation of the disk is maintained. Direction but swap the disks. In this manner, since the adhesive on the substrate is heated and pressed to the circuit substrate one by one, the adhesive amount which can be used for one disk can be greatly increased without increasing the number of tapes.

又，和申請專利範圍第29項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 膠帶寬度應爲5mm〜1000mm，壓著至電路基板之黏 著劑應爲〇_5mm〜1.5mm。膠帶寬度爲5mm〜1000mm之 理由如下，因爲膠帶寬度低於5mm時，每1盤之黏著劑 壓著次數會較少，而大於1000mm時，將無法裝著至既存 之黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑、亦可以爲只有絕緣性黏著劑者、或者將 絕緣性之隔件粒子分散於這些黏著劑中者》 申請專利範圍第35項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，黏著劑膠 帶之寬度爲和電路基板之一邊之長度相同或以上，且在膠 帶之寬度方向上配置著複數條黏著劑。 此申請專利範圍第3 5項記載之發明時，係以寬度和 電路基板之一邊重疊的方式來配置黏著劑膠帶，故可直接 沿著電路基板之一邊對配設於黏著劑膠帶之寬度方向的1 條黏著劑實施加熱加壓。 -30- 1322649 因爲黏著劑膠帶之寬度爲電路基板之一邊之長度以上 ，黏著劑膠帶只需拉出黏著劑之條寬即可。 其次，將黏著劑壓著至電路基板之一邊後，旋轉電路 基板，使另一邊位於黏著劑膠帶之寬度方向的位置，對另 一邊實施黏著劑條之加熱加壓。如此，依序對電路基板之 其他邊實施黏著劑之壓著，很容易即可對電路基板之四周 實施黏著劑之壓著。Further, in the same manner as the invention described in claim 29, since the amount of the adhesive is increased without increasing the number of rolls, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent clogging due to the bleeding of the adhesive and prevent it from being prevented. The effect of the disadvantage caused by the stretching of the substrate. The tape width should be 5mm~1000mm, and the adhesive pressed to the circuit board should be 〇5mm~1.5mm. The reason why the tape width is 5 mm to 1000 mm is as follows. Since the tape width is less than 5 mm, the number of times of adhesion per one disk is small, and when it is more than 1000 mm, it cannot be attached to the existing adhesive device. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive, or an insulating spacer particle may be dispersed in these adhesives. The invention of claim 35 is characterized in that the adhesive is applied to a substrate and wound into a disk-shaped adhesive tape, wherein the width of the adhesive tape is the same as or longer than the length of one side of the circuit substrate, and A plurality of adhesives are disposed in the width direction of the tape. In the invention described in claim 35, the adhesive tape is disposed so as to overlap one of the widths of the circuit board, so that it can be disposed directly along the side of the circuit board in the width direction of the adhesive tape. One adhesive is heated and pressurized. -30- 1322649 Since the width of the adhesive tape is longer than the length of one side of the circuit board, the adhesive tape only needs to be pulled out of the width of the adhesive. Next, after the adhesive is pressed to one side of the circuit board, the circuit board is rotated so that the other side is positioned at the width direction of the adhesive tape, and the other side is heated and pressurized. In this way, the adhesive is pressed against the other side of the circuit board in this order, and it is easy to apply the adhesive to the periphery of the circuit board.

因此，因爲可依序逐條使用具有電路基板之一邊之長 度以上之黏著劑，而一次之使用量爲黏著劑條之寬度尺寸 份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可使 用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面，因電子構件之製造工廠可減少新黏著劑膠 帶之更換次數，故可提高製造效率。 又，黏著劑膠帶之製造上，因每I盤之黏著劑量會較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 -31 - 1322649 黏著劑膠帶之寬度爲電路基板之一邊之尺寸以上，例 如，5mm〜3000mm。又，即使尺寸小於電路基板之一邊之 尺寸的黏著劑膠帶，亦可以在黏著劑膠帶之寬度方向配置 複數條相鄰接之方式來使其具有電路基板之一邊之尺寸。 此時，因很容易即可對應不同尺寸之電路基板故可提高生 產效率。1條黏著劑之寬度應爲例如〇.5mm〜10.〇mm。Therefore, since the adhesive having a length longer than one side of the circuit board can be used one by one, and the amount of use of the adhesive strip is one time, the width of the adhesive strip can be increased, and the number of the adhesive tape can be increased without increasing the number of the adhesive tape. Adhesive dose that can be used. Moreover, since the number of the adhesive tape is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from being clogging due to the adhesion of the adhesive tape from the width direction of the adhesive tape, and also It is possible to prevent the disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved. Further, in the manufacture of the adhesive tape, since the amount of adhesion per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. -31 - 1322649 The width of the adhesive tape is greater than the size of one side of the circuit board, for example, 5mm to 3000mm. Further, even if the adhesive tape having a size smaller than the size of one side of the circuit board, a plurality of adjacent strips may be disposed in the width direction of the adhesive tape to have a size of one side of the circuit board. In this case, it is easy to adapt to different sizes of circuit boards, which improves production efficiency. The width of one adhesive should be, for example, 〇5mm~10.〇mm.

黏著劑膠帶之寬度爲5mm〜3000mm之理由如下，電 路基板之一邊之尺寸很少會小於5mm，而大於3000mm時 ，盤之寬度會太寬，而可能無法裝著至既存之黏著裝置。 申請專利範圍第3 6項記載之發明，係如申請專利範 圍第35項記載之發明，其特徵爲，以相鄰之黏著劑條具 有間隔之方式配設複數條黏著劑。 此申請專利範圍第36項記載之發明時，除了具有和 申請專利範圍第3 5項記載之發明相同之作用效果以外， 因爲鄰接之黏著劑條爲分離，很容易即可將黏著劑逐條從 基材剝離並實施壓著。 申請專利範圍第3 7項記載之發明，係如申請專利範 圍第35項記載之發明，其特徵爲，黏著劑係利用形成於 膠帶之寬度方向的縫隙而分離成複數條。 此申請專利範圍第37項記載之發明時，除了具有和 申請專利範圍第35項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間’利用以切刃等使黏著劑具有切 -32- 1322649 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 本發明時，除了可增加配置於基材上之黏著劑條的條 數以外，在膠帶之寬度方向配置複數條黏著劑之黏著劑膠 帶的製造更爲容易。The reason why the width of the adhesive tape is 5 mm to 3000 mm is as follows. The size of one side of the circuit substrate is rarely less than 5 mm, and when it is larger than 3000 mm, the width of the disk may be too wide and may not be attached to the existing adhesive device. The invention described in claim 36 is the invention of claim 35, wherein a plurality of adhesives are disposed in such a manner that adjacent adhesive strips are spaced apart. In addition to the effects of the invention described in claim 35 of the patent application, in addition to the effects of the invention described in claim 35, since the adjacent adhesive strips are separated, the adhesive can be easily removed one by one. The substrate is peeled off and pressed. The invention according to claim 35, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in claim 37, in addition to the same effects as those in claim 35, the adhesive tape is applied by applying an adhesive to one side of the substrate and drying it. Immediately before the adhesive is pressed to the circuit board, that is, immediately before the use of the adhesive tape, the gap is formed by cutting the edge with a cutting edge or the like so that the adhesive has a cut of -32 to 1322649. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. In the present invention, in addition to the increase in the number of the adhesive strips disposed on the substrate, the adhesive tape in which a plurality of adhesives are disposed in the width direction of the tape is easier to manufacture.

申請專利範圍第3 8項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，將黏著劑塗布於一方之基材之全面，並在黏著劑上沿 著膠帶之寬度方向形成縫隙後，在黏著劑面上配置另一方 之基材，以一方及另一方之基材夾住黏著劑，然後再使一 方之基材及另一方之基材互相分離，一方及另一方之基材 上分別交互貼附著複數條黏著劑，而在一方及另一方之基 材上以具有間隔之方式配置著複數條黏著劑。 此申請專利範圍第3 8項記載之發明時，因爲可以利 用既存設備同時製造2個如申請專利範圍第2項記載之黏 著劑膠帶，故具有良好製造效率》 申請專利範圍第3 9項記載之發明，係一種黏著劑膠 帶壓著方法，其特徵爲，將申請專利範圍第35〜37項之 其中任一項記載之黏著劑膠帶配置於電路基板上，沿著寬 度方向對黏著劑膠帶實施加熱加壓，將黏著劑條壓著至電 路基板之一邊。此壓著方法亦可採用如下之方式，亦即， 將黏著劑膠帶配置於電路基板上，沿著寬度方向對黏著劑 -33- 1322649 膠帶實施加熱加壓，將黏著劑條壓著至電路基板之一邊’ 其次，變更電路基板之位置，並沿著黏著劑膠帶之寬度方 向對電路基板之另一邊實施黏著劑膠帶之加熱加壓，將下 一黏著劑條壓著至電路基板之另一邊。The invention described in claim 3 is a method for producing an adhesive tape by applying an adhesive to a substrate and winding it into a disk shape, wherein the adhesive is applied to one of the base materials. After forming a gap in the width direction of the adhesive on the adhesive, the other substrate is placed on the adhesive surface, and the adhesive is sandwiched between one and the other substrate, and then one of the substrates and the other is placed. The substrates are separated from each other, and a plurality of adhesives are alternately attached to one of the other substrates, and a plurality of adhesives are disposed on one or the other of the substrates at intervals. In the invention described in the third aspect of the patent application, since it is possible to simultaneously manufacture two adhesive tapes as described in claim 2 of the patent application, it is possible to use the existing equipment to have good manufacturing efficiency. The adhesive tape pressing method according to any one of claims 35 to 37, wherein the adhesive tape described in any one of claims 35 to 37 is disposed on a circuit board, and the adhesive tape is heated in the width direction. Pressurize and press the adhesive strip against one side of the circuit board. The pressing method may also be performed by disposing an adhesive tape on a circuit board, heating and pressing the adhesive-33- 1322649 tape along the width direction, and pressing the adhesive strip to the circuit substrate. One side' Next, the position of the circuit board is changed, and the other side of the circuit board is heated and pressurized along the width direction of the adhesive tape, and the next adhesive strip is pressed to the other side of the circuit board.

此申請專利範圍第39項記載之發明時，除了具有和 申請專利範圍第35〜37項之其中任一項記載之作用效果 以外，將黏著劑膠帶裝著於黏著裝置後，可將電路基板之 一邊配置於黏著劑膠帶之寬度方向，將黏著劑壓著至電路 基板之一邊，其次，將電路基板旋轉大約90度，使電路 基板之另一邊位於和黏著劑膠帶之寬度方向成爲平行之位 置上，並將黏著劑壓著至電路基板之另一邊。如此，可依 序將電路基板旋轉90度並實施回黏著劑之壓著，很簡單 即可將黏著劑壓著於電路基板之四周，而提高電子構件之 製造工廠的作業效率。 申請專利範圍第40項記載之發明的特徵如下，至少 在移動電路基板之搬運路上配置2條申請專利範圍第35〜 37項之其中任一項記載之黏著劑膠帶，一方之黏著劑膠帶 之配置上，其寬度方向和搬運路成垂直，另一方之黏著劑 膠帶之配置上，其寬度方向係沿著搬運路之方向，一方之 黏著劑膠帶係針對電路基板之相對2邊沿著寬度方向實施 黏著劑膠帶之加熱加壓將黏著劑條壓著至電路基板之相對 2邊，其次，使電路基板朝另一方之黏著劑膠帶移動，針 對電路基板之其餘2邊從基材側沿著寬度方向實施黏著劑 膠帶之加熱加壓，將黏著劑條壓著於電路基板之四周。 -34- 1322649 此申請專利範圍第40項記載之發明時，除了具有和 申請專利範圍第35〜37項記載之作用效果以外，無需旋 轉電路基板而將其移至一方之黏著劑膠帶及另一方之黏著 劑膠帶之位置，在各位置上沿著寬度方向實施加熱加壓， 而很容易即可將黏著劑壓著於電路基板之四周，具有良好 作業效率。In the invention described in claim 39, in addition to the effects described in any one of claims 35 to 37, the adhesive tape can be attached to the adhesive device, and the circuit substrate can be placed. The adhesive is pressed to one side of the circuit board while being disposed in the width direction of the adhesive tape, and then the circuit board is rotated by about 90 degrees so that the other side of the circuit board is positioned parallel to the width direction of the adhesive tape. And pressing the adhesive to the other side of the circuit board. In this way, the circuit board can be rotated by 90 degrees and the adhesive is pressed, and the adhesive can be pressed around the circuit board in a simple manner, thereby improving the work efficiency of the manufacturing unit of the electronic component. The invention of the invention of claim 40 is characterized in that at least one of the adhesive tapes described in any one of claims 35 to 37 is disposed on the moving path of the mobile circuit board, and the adhesive tape is disposed on one of the adhesive tapes. In the upper direction, the width direction is perpendicular to the conveying path, and the other adhesive tape is disposed in the width direction along the conveying path, and one of the adhesive tapes is adhered to the opposite sides of the circuit board in the width direction. The adhesive tape is pressed and pressed to the opposite sides of the circuit substrate, and then the circuit substrate is moved toward the other adhesive tape, and the remaining two sides of the circuit substrate are implemented from the substrate side along the width direction. The adhesive tape is heated and pressurized to press the adhesive strip around the circuit substrate. In the invention described in claim 40, in addition to the effects described in the claims 35 to 37, the adhesive tape is not transferred to one of the adhesive tapes and the other is not required to be rotated. The position of the adhesive tape is heated and pressurized in the width direction at each position, and the adhesive can be easily pressed around the circuit substrate to have good work efficiency.

申請專利範圍第4 1項記載之發明，係在基材之單面 全面塗布黏著劑，並利用捲成盤狀之黏著劑膠帶對電路基 板實施黏著劑之壓著的黏著劑膠帶壓著方法，其特徵爲， 黏著劑膠帶之寬度爲電路基板之一邊之長度以上，從寬度 方向實施黏著劑膠帶之寬度方向之部份黏著劑的加熱加壓 ，降低加熱部份之黏著劑的凝聚力，將黏著劑壓著至電路 基板。 此申請專利範圍第4 1項記載之發明時，在將黏著劑 壓著至電路基板之周圍時，係將黏著劑膠帶裝著至黏著裝 置並沿著寬度方向實施黏著劑膠帶之加熱加壓，降低該部 份之凝聚力（以下簡稱爲「凝聚力降低線」），加熱部份 之黏著劑會沿著凝聚力降低線從基材分離而壓著至電路基 板上。其次，將電路基板旋轉約90度，使相鄰之邊位於 黏著劑膠帶之寬度方向之位置上，沿著寬度方向實施下一 黏著劑條之加熱加壓，將黏著劑條之黏著劑壓著至相鄰之 邊。如此，可依序將黏著劑壓著至電路基板之四邊，而有 良好作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可， -35- 1322649 故可直接利用既存設備製造黏著劑膠帶》 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。The invention described in claim 4 is a method in which an adhesive is applied to a single surface of a substrate, and an adhesive tape which is pressed against a circuit board by a disk-shaped adhesive tape is pressed. The adhesive tape has a width greater than or equal to the length of one side of the circuit substrate, and a part of the adhesive in the width direction of the adhesive tape is heated and pressurized from the width direction to reduce the cohesive force of the adhesive in the heated portion, and the adhesive is adhered. The agent is pressed against the circuit substrate. In the invention described in the fourth aspect of the patent application, when the adhesive is pressed around the circuit board, the adhesive tape is attached to the adhesive device, and the adhesive tape is heated and pressurized in the width direction. The cohesive force of the portion (hereinafter referred to as "cohesion reduction line") is lowered, and the adhesive portion of the heating portion is separated from the substrate along the cohesive force reduction line and pressed onto the circuit substrate. Next, the circuit substrate is rotated by about 90 degrees so that the adjacent side is located at the position of the width direction of the adhesive tape, and the heating and pressing of the next adhesive strip is performed along the width direction to press the adhesive of the adhesive strip. To the adjacent side. In this way, the adhesive can be sequentially pressed to the four sides of the circuit board, and the work efficiency is good. Moreover, since it is only necessary to apply the adhesive to the adhesive tape in an all-round way, the adhesive tape can be directly used by the existing equipment. In addition, the width of the adhesive pressed to the circuit substrate can be changed by heating. The pressing region is arbitrarily set, so that the adhesive width of the pressing has a high degree of freedom.

又，和申請專利範圍第3 5項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明的特徵，係具有一 方之盤、另一方之盤、以及用以收容以可自由旋轉方式裝 設之這些盤的殻體，一方之盤上捲繞著在基材上塗布著黏 著劑之黏著劑膠帶，另一方之盤則固定著黏著劑膠帶之一 端，黏著劑膠帶上沿著膠帶之縱向至少配置著2條黏著劑 此申請專利範圍第42項記載之發明時，將黏著劑膠 帶盒裝著至黏著裝置，以和電路基板之一邊重疊之方式， 對配置於黏著劑膠帶之寬度方向上之至少2條沿著縱向形 成之黏著劑的1條，從基材側實施加熱加壓，使1條之黏 著劑壓著至電路基板。如此，可依序將黏著劑壓著至電路 基板，從一方之盤依序捲出黏著劑膠帶，同時，將殘餘之 1條塗布著黏著劑之黏著劑膠帶捲取至另一方之盤。其次 ，捲繞於一方之盤的黏著劑膠帶全部捲出時，將盒反轉並 再度裝著至壓著裝置。 利用此方式，因爲一方之盤及另一方之盤會互換，而 -36- 1322649 變成從另一方之盤捲出黏著劑膠帶，可再實施1條黏著劑 之壓著。 在黏著劑膠帶上形成2條以上之黏著劑時，亦可改變 寬度方向之位置，並以依序或以具有間隔之方式實施壓著Moreover, the invention is the same as the invention described in claim 35, because the amount of the adhesive is increased without increasing the number of rolls, so that the winding can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive can be prevented, and Prevents the effects of defects such as stretching of the substrate. The invention of claim 42 is characterized in that it has one disk, the other disk, and a casing for accommodating the disks rotatably mounted, and one of the disks is wound around the base. The adhesive tape is coated on the material, and the other end of the disk is fixed with one end of the adhesive tape. At least two adhesives are disposed on the adhesive tape along the longitudinal direction of the adhesive tape. At the time of attaching the adhesive tape cartridge to the adhesive device, at least two adhesives disposed along the longitudinal direction of the adhesive tape are overlapped with one side of the circuit substrate. The material side is heated and pressurized to press one of the adhesives onto the circuit board. Thus, the adhesive can be sequentially pressed onto the circuit substrate, and the adhesive tape is sequentially taken out from one of the trays, and the remaining adhesive tape coated with the adhesive is taken up to the other tray. Next, when the adhesive tape wound around one of the discs is completely unwound, the cartridge is reversed and reattached to the pressing device. In this way, since one of the discs and the other of the discs are interchanged, and -36- 1322649 becomes the adhesive tape from the other side of the disc, one additional adhesive can be pressed. When two or more adhesives are formed on the adhesive tape, the position in the width direction may be changed, and the pressing may be performed in a sequential or intermittent manner.

如上所示，本發明時，黏著劑板上至少在寬度方向上 並排著2條黏著劑，並可逐條使用，至1盤至少可使用2 盤份，而可在無需增加黏著劑膠帶之捲數的情形，使1盤 可使用之黏著劑量增加成2倍以上^ 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）》 另一方面，形成2條黏著劑時，電子構件之製造工廠 在用完1盤份（1條黏著劑）時只需反轉盒即可，故下一 裝著更爲容易。 又，因黏著劑膠帶係採盒方式，故在黏著裝置上將黏 著劑膠帶裝設於盤上時沒有繁複之步驟，只要將盒裝著至 黏著裝置即可，故處理上十分容易，而且具有良好之裝設 及更換作業性。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 -37- 1322649 申請專利範圍第4 3項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，複數條黏著劑之相鄰 之黏著劑條具有間隔。 此申請專利範圍第43項記載之發明時，除了具有和 申請專利範圍第42項記載之發明相同之作用效果以外’ 相鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑 並實施壓著。As shown above, in the present invention, at least two adhesives are arranged side by side in the width direction of the adhesive sheet, and can be used one by one, and at least two trays can be used for one tray, without the need to increase the volume of the adhesive tape. In the case of a number, the adhesive amount that can be used for one disk is increased by more than 2 times. Moreover, since the number of the adhesive tape is not increased, the winding can be prevented from being scattered, and at the same time, the adhesive can be prevented from being in the width direction of the tape. Exudation causes clogging caused by adhesion between the tapes being taken up, and also prevents disadvantages such as stretching which is likely to occur due to the long substrate (damage or cutting of the substrate). On the other hand, two adhesive bonds are formed. In the case of the agent, the manufacturing unit of the electronic component only needs to reverse the cartridge when one disk (one adhesive) is used up, so that it is easier to install the next one. Moreover, since the adhesive tape is a cassette type method, there is no complicated step when the adhesive tape is mounted on the disc on the adhesive device, as long as the cartridge is attached to the adhesive device, it is easy to handle and has Good installation and replacement workability. The adhesive may be a dissimilar conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The invention described in claim 4 is the invention of claim 42, wherein the adjacent adhesive strips of the plurality of adhesives have a space. In the invention described in the 43rd aspect of the patent application, in addition to the same effects as those of the invention described in claim 42 of the patent application, the adjacent adhesive strips are separated, so that they can be pulled away from the substrate one by one. Adhesive and pressed.

申請專利範圍第44項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，黏著劑係利用膠帶之 寬度方向上形成之縫隙來分離成複數條。 此申請專利範圍第44項記載之發明時，除了具有和 申請專利範圍第42項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間，利用以切刃等使黏著劑具有切 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 申請專利範圍第45項記載之發明的特徵，係將：具 有一方之盤、另一方之盤、以及用以收容以可自由旋轉方 式裝設之這些盤的殼體；及一方之盤上捲繞著在基材上塗 布著黏著劑之黏著劑膠帶’而另一方之盤固定著黏著劑膠 帶之一端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑 -38- 1322649 膠帶盒將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之 寬度方向之一部份進行加熱加壓，降低加熱部份之黏著劑 的凝聚力，將寬度方向之部份黏著劑壓著至電路基板。 此申請專利範圍第45項記載之發明時，利用對黏著 劑膠帶之寬度方向的一部份實施加熱加壓，降低該部份之 黏著劑之凝聚力（以下簡稱爲「凝聚力降低線」），可從 凝聚力降低線使加熱部份之黏著劑從基材分離並壓著至電The invention described in claim 44 is the invention according to claim 42, wherein the adhesive is separated into a plurality of strips by a slit formed in the width direction of the tape. In the invention described in the 44th aspect of the patent application, in addition to the same effect as the application of the 42nd item of the patent application, the adhesive tape is applied by applying the adhesive to one side of the substrate and drying it. The gap is formed immediately before the adhesive is pressed to the circuit board, that is, immediately before the adhesive tape is used, by using a cutting edge or the like to make the adhesive have a cut. Further, in the formation of the slit, it is also possible to form a slit by cutting the adhesive with a cutting edge or the like in the production of the adhesive tape, and in addition to the cutting edge, it may be formed by using a laser or a heating wire. The invention of claim 45 is characterized in that: one of the discs, the other disc, and a casing for accommodating the discs rotatably mounted; and one of the discs are wound Adhesive tape coated with an adhesive on the substrate' and the other end of the disk is fixed with one end of the adhesive tape; the adhesive tape cartridge is attached to the pressing device, from the adhesive -38- 1322649 tape box The adhesive tape is pulled out onto the circuit board, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive in the heating portion, and a part of the adhesive in the width direction is pressed against the circuit substrate. In the invention described in claim 45, a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive (hereinafter referred to as "cohesion reduction line"). From the cohesive force reduction line, the heated part of the adhesive is separated from the substrate and pressed to the electricity

路基板。 本發明時，因爲黏著劑膠帶只需在基材之全面塗布黏 著劑即可，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 申請專利範圍第46項記載之發明，係一種利用黏著 劑膠帶盒之黏著劑壓著方法，其特徵爲，將：具有一方之 盤、另一方之盤、以及用以收容以可自由旋轉方式裝設之 這些盤的殼體；及一方之盤上捲繞著在基材上塗布著黏著 劑之黏著劑膠帶，而另一方之盤則固定著黏著劑膠帶之一 端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒 將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之寬度方 向的一部份實施加熱加壓，降低加熱部份之黏著劑的凝聚 力，將寬度方向之部份黏著劑壓著至電路基板，捲取至一 方之盤上之黏著劑膠帶全部捲出後，將黏著劑膠帶盒反轉 ，再將殘餘之部份黏著劑壓著至電路基板。 -39- 1322649Road substrate. In the present invention, since the adhesive tape only needs to be completely coated with the adhesive on the substrate, the adhesive tape can be directly produced by using the existing equipment. Further, the width of the adhesive pressed to the circuit board can be arbitrarily set by changing the heating and pressurizing region, so that the adhesive width of the pressing has a high degree of freedom. The invention described in claim 46 is an adhesive pressing method using an adhesive tape cassette, which is characterized in that it has one disk, the other disk, and is housed in a freely rotatable manner. a housing of the discs; and one of the discs is wound with an adhesive tape coated with an adhesive on the substrate, and the other disc is fixed with one end of the adhesive tape; the adhesive tape cassette is loaded To the pressing device, the adhesive tape is pulled out from the adhesive tape cassette onto the circuit substrate, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the adhesive portion of the heating portion, and the width is increased. A part of the adhesive in the direction is pressed against the circuit substrate, and after the adhesive tape wound on one of the disks is completely unwound, the adhesive tape cassette is reversed, and the remaining adhesive is pressed onto the circuit substrate. -39- 1322649

此申請專利範圍第46項記載之發明時，除了具有和 申請專利範圍第45項相同的作用效果以外，同時，捲取 至一方之盤上之黏著劑膠帶全部捲出時，將盒反轉並再度 裝著至壓著裝置，而將殘餘部份之黏著劑壓著至電路基板 ，故和申請專利範圍第1項記載之發明相同，在未增加捲 數之情形下可增加黏著劑量，故可防止捲取散亂，同時， 得到可防止因黏著劑之滲出而造成之阻塞、及防止因基材 之伸展而造成之弊病等之效果。此外，電子構件之製造工 廠在1盤份（1條份之黏著劑）全部捲出時，只要反轉盒 即可，下一裝著會更爲容易。因爲採用盒之方式，處理上 更爲容易，且具有良好之裝設及更換作業性。 申請專利範圍第4 7項記載之發明，係塗布於基材上 之捲成盤狀之黏著劑膠帶，其特徵爲，基材具有熱熔融劑 層及支持層。 此申請專利範圍第4 7項記載之發明時，若使用黏著 φ 材膠帶，將捲取黏著材膠帶之盤及空盤裝著至黏著裝置， 對電路基板實施黏著材之加熱加壓後，會將基材捲取至空 盤。其次，使已全部捲出之捲取至一方之盤上之一方之黏 著材膠帶之終端部、及新捲取至另一方之盤上之另一方之 黏著材膠帶之始端部互相重疊或抵接，對此部份進行加熱 ，使熱熔融劑層熔融後，利用冷卻來使熱熔融劑固化，用 以連接黏著材膠帶。 利用黏著材膠帶之基材黏著全部捲出之黏著材膠帶之 終端部及新裝著之黏著材膠帶之始端部，來實施黏著材盤 -40 - 1322649 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。又 ，因爲無需每次更換新黏著材盤時都更換捲取盤、將新黏 著材之始端裝設至捲取盤、及捲附至導引銷之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。In the invention described in claim 46, in addition to the same effect as the application of claim 45, when the adhesive tape wound onto one of the discs is completely unwound, the cartridge is reversed and Once again, the adhesive is applied to the pressing device, and the residual adhesive is pressed onto the circuit board. Therefore, the invention is the same as the invention described in claim 1, and the adhesive amount can be increased without increasing the number of rolls. It is possible to prevent the coiling from being scattered, and at the same time, it is possible to prevent the clogging caused by the oozing of the adhesive and to prevent the disadvantage caused by the stretching of the substrate. In addition, when the manufacturing unit of the electronic component is completely unrolled in one serving (one adhesive), it is easier to reverse the cartridge as long as it is reversed. Because of the way of using the box, it is easier to handle, and has good installation and replacement workability. The invention described in claim 47 is a disk-shaped adhesive tape coated on a substrate, characterized in that the substrate has a hot melt layer and a support layer. In the invention described in the fourth aspect of the patent application, if the adhesive tape of the adhesive tape is used, the disk and the empty disk of the adhesive tape are attached to the adhesive device, and the adhesive is heated and pressurized on the circuit substrate. Wind the substrate to an empty tray. Next, the end portion of the adhesive tape which has been wound up to one of the discs on one side and the beginning end of the adhesive tape which is newly wound onto the other side of the disc are overlapped or abutted. The part is heated to melt the hot melt layer, and then the hot melt is solidified by cooling to connect the adhesive tape. The adhesive pad 40 - 1322649 is replaced by the end of the adhesive tape and the beginning of the newly attached adhesive tape, and the adhesive is very simple. The material plate is attached to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive material is attached to the take-up reel, and the roll is attached to the guide pin, it takes only a small time to replace the new one. Adhesive trays can increase the productivity of electronic machines. The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be used reasonably.

申請專利範圍第48項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，支持層夾於熱熔融劑層 之間。 此申請專利範圍第48項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之作用效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。又，因爲熱 熔融劑層形成於膠帶之縱向全體，重疊長度無需嚴格定位 ，故連接具有高自由度。 申請專利範圍第49項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，熱熔融劑層夾於支持層 之間。 此申請專利範圍第49項記載之發明時，除了具有和 申請專利範圍第47項記載之發明相同之作用效果以外， 黏著材膠帶之連接上，係在一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部互相抵接之位置上，利用黏 -41 - 1322649 著裝置之加熱加壓頭進行加熱。加熱時熱熔融劑會熔解滲 出，利用冷卻來使熱熔融劑固化，實施黏著材膠帶間之連 接。此時，因爲熱熔融劑層係夾於支持層之間，故可防止 熔融劑層曝露於大氣之下而因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層之黏著強度。The invention described in claim 48 is the invention of claim 1, wherein the support layer is sandwiched between the hot melt layers. In the invention described in claim 48, in addition to the same effects as those of the invention described in claim 1, since the hot melt layer is located on the surface of the substrate, the adhesive faces at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. The invention described in claim 49 is the invention according to claim 1, wherein the hot melt layer is sandwiched between the support layers. In the invention described in claim 49, in addition to the effects similar to the invention described in claim 47, the adhesive tape is attached to the end portion of the adhesive tape and the other side of the adhesive tape. At the position where the beginning ends of the adhesive tape abut each other, the heating head is heated by the adhesive-41 - 1322649 device. The hot melt is melted and bleed during heating, and the hot melt is solidified by cooling to effect the connection between the adhesive tapes. At this time, since the hot melt layer is sandwiched between the support layers, it is possible to prevent the molten material layer from being exposed to the atmosphere and to lower the adhesion strength of the hot melt layer due to moisture absorption or adhesion of moisture.

申請專利範圍第50項記載之發明，係用以連接捲取 至一方之盤之一方之黏著材膠帶、及捲取至另一方之盤上 之另一方之黏著材膠帶的黏著材膠帶連接方法，其特徵爲 ，黏著材膠帶具有以脫模劑實施表面處理之基材及黏著劑 ，除去其中任何一方之黏著材膠帶之基材端部之脫模劑， 使另一方之黏著材膠帶之黏著劑面重疊於該部份，以實施 兩者之重疊部份的加熱壓著來進行連接。 此申請專利範圍第5 0項記載之發明時，在其中任何 一方之黏著材膠帶之基材面上重疊另一方之黏著材膠帶之 黏著劑面，實施重疊部份之加熱壓著，利用連接全部捲出 之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部來 實施黏著材盤之更換，故很簡單即可將新黏著材盤裝著至 黏著裝置。 因爲無需每次更換新黏著材盤時都更換捲取盤、將新 黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路徑 設定導引銷等之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 又，在黏著材膠帶捲繞於盤上之狀態下，爲了避免黏 著劑面及基材面發生黏著，基材之表面上會塗布脫模劑。 -42 - 1322649 本發明時’會除去一方之黏著材膠帶之脫模劑，並將另一 方之黏著材膠帶之黏著劑面重疊於該部份並進行黏著，故 黏著材膠帶間之連接十分簡單。 連接部份之加熱壓著上，若採用裝著著黏著材盤之黏 著裝置的加熱加壓頭，則可合理利用黏著裝置。The invention described in claim 50 is an adhesive tape connecting method for attaching an adhesive tape which is taken up to one of the trays of one side, and an adhesive tape which is wound up to the other of the trays, The adhesive tape has a substrate and an adhesive which are surface-treated with a release agent, and the release agent of the substrate end portion of the adhesive tape is removed, and the adhesive tape of the other adhesive tape is used. The surface is superposed on the portion, and the connection between the two is performed by heating and pressing. In the invention described in claim 50, the adhesive surface of the other adhesive tape is superposed on the surface of the adhesive tape of either one of the adhesive tapes, and the overlapping portions are heated and pressed, and all the connections are used. The end of the adhesive tape and the beginning of the newly attached adhesive tape are used to replace the adhesive disc, so that the new adhesive disc can be attached to the adhesive device. Since it is not necessary to change the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, it takes less time. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. Further, in a state in which the adhesive tape is wound around the disk, a release agent is applied to the surface of the substrate in order to prevent adhesion between the adhesive surface and the substrate surface. -42 - 1322649 In the present invention, the release agent of one of the adhesive tapes is removed, and the adhesive surface of the other adhesive tape is superposed on the portion and adhered, so that the connection between the adhesive tapes is very simple. . The heating portion of the connecting portion is pressed, and if the heating and pressing head with the adhesive device of the adhesive sheet is used, the adhesive device can be reasonably utilized.

申請專利範圍第5 1項記載之發明，係如申請專利範 圍第5 0項記載之發明，其特徵爲，脫模劑之除去係利用 電漿放電、紫外線照射、雷射照射之其中任何一種方式來 實施。 此申請專利範圍第5 1項記載之發明時，除了具有和 申請專利範圍第/5 0項記載之發明相同之作用效果以外， 因係利用電漿放電、紫外線照射、雷射照射之其中任何一 種方法來除去脫模劑，和以手剝離時相比，可以更短之時 間、更正確地除去脫模劑。 脫模劑之除去方法上，採用電漿放電時，係使處於電 漿狀態之氣體分解而成爲容易產生之狀態（激發狀態）， 並以對基材之表面實施放電來除去脫模劑。又，紫外線照 射時，例如，採用水銀燈當做光源，利用照射一定時間之 來自水銀燈之紫外線來實施。又，雷射照射時，係以利用 雷射振盪器照射之雷射光來對脫模劑進行加熱並使其熔解 ，用以除去脫模劑。 申請專利範圍第5 2項記載之發明，係將基材上塗布 著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材膠帶 盤，其特徵爲，黏著材膠帶盤之膠帶之寬度方向上配設著 -43- 1322649 複數之黏著材膠帶之捲部。 此申請專利範圍第52項記載之發明時，因配設著複 數之黏著材膠帶捲部（捲部），複數捲部當中之捲繞於一 方之捲部的黏著材膠帶全部捲出時，會捲取配置於全部捲 出之捲部之隔壁的另一方之捲部的黏著材膠帶並將其裝設 至盤。The invention described in claim 5 is the invention described in claim 50, wherein the removal of the release agent is by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. To implement. In the invention described in the fifth aspect of the patent application, in addition to the effects similar to those of the invention described in claim 0.000, the plasma discharge, ultraviolet irradiation, and laser irradiation are used. The method removes the release agent, and the release agent can be removed more accurately in a shorter time than when the hand is peeled off. In the method of removing the release agent, when the plasma is discharged, the gas in the plasma state is decomposed to be easily generated (excited state), and the surface of the substrate is discharged to remove the release agent. Further, in the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and is irradiated with ultraviolet rays from a mercury lamp for a predetermined period of time. Further, in the case of laser irradiation, the release agent is heated and melted by laser light irradiated with a laser oscillator to remove the release agent. The invention described in claim 5 is an adhesive tape for winding an adhesive tape coated with an electrode connecting adhesive onto a substrate, which is characterized in that the width direction of the adhesive tape of the adhesive tape is It is equipped with a roll of adhesive tape of -43- 1322649. In the invention described in claim 52, when a plurality of adhesive tape rolls (rolls) are disposed, and all of the adhesive tapes wound around one of the plurality of rolls are unwound, The adhesive tape disposed on the other roll portion of the entire wall of the rolled-out roll portion is taken up and attached to the disk.

如此，一方之黏著材膠帶全部捲出時，會將另一方之 黏著材膠帶裝設至盤，而實施黏著材膠帶之更換，故無需 將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少之新 黏著材膠帶盤之更換作業，故可提高電子機器之生產效率 因爲係依序使用捲繞於複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第5 3項記載之發明，係如申請專利範 圍第52項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部之間具有用以連接 兩者之連結膠帶，一方之黏著材膠帶全部捲出時，會接著 開始捲出另一方之黏著材膠帶。 此申請專利範圍第53項記載之發明時，除了具有和 -44- 1322649 申請專利範圍第5 2項記載之發明相同之作用效果以外’ 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 部係利用連結膠帶實施連接，一方之捲部之黏著材膠帶全 部捲出後，無需將另一方之捲部之黏著材膠帶捲取至盤之 裝設作業，故可進一步提高電子機器之生產效率。Thus, when one of the adhesive tapes is completely unwound, the other adhesive tape is attached to the disk, and the adhesive tape is replaced, so that the new adhesive tape is not required to be attached to the adhesive device. Therefore, it is only necessary to replace the new adhesive tape disc, so that the production efficiency of the electronic machine can be improved because the adhesive tape wound around the plurality of rolls is sequentially used, and it is not necessary to add the adhesive tape of one adhesive tape. The number of rolls of the tape can greatly increase the amount of adhesive that can be used in one replacement operation. Moreover, since it is not necessary to increase the number of rolls of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. The invention described in claim 5 is the invention of claim 52, wherein the end portion of one of the adhesive tapes and the other end of the adhesive tape are used between When the adhesive tape of the two is connected, when the adhesive tape of one of the adhesive tapes is completely rolled out, the adhesive tape of the other side is then rolled out. In the invention described in the 53rd aspect of the patent application, the end portion of the adhesive tape and the adhesive tape of the other side are the same as those of the invention described in the fifth paragraph of the patent application No. -44- 1322649. Since the beginning end portion is connected by the connecting tape, and the adhesive tape of one of the winding portions is completely unwound, the adhesive tape of the other winding portion is not required to be taken up to the tray, so that the electronic device can be further improved. Productivity.

申請專利範圍第54項記載之發明，係具有如申請專 利範圍第53項記載之黏著材膠帶盤、黏著材膠帶之捲取 盤、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將 黏著材膠帶之黏著材壓著至電子機器之電路基板上之壓著 部、以及用以檢測連結膠帶之膠帶檢測手段之黏著裝置， 其特徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶 通過壓著部爲止會將連結膠帶捲取至捲取盤。 此申請專利範圍第5 4項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部捲 出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，膠帶檢測手段上，例如黏著裝置具有一對發光部 及受光部’以光學方式檢測連結膠帶。另一方面，連結膠 帶之兩端配設著有顔色之（例如黑色）標記，受光部會利 用發光部發出之雷射光檢測連結膠帶兩端之標記來檢測連 結膠帶。又，除了在連結膠帶附加標記以外，可採用使連 結膠帶之寬度和黏著材膠帶之寬度不同的方法、或在連結 -45- 1322649 膠帶上形成複數之孔的方法。The invention described in claim 54 is characterized in that the adhesive tape tray of the adhesive material of claim 53 and the take-up reel of the adhesive tape are disposed between the adhesive tape tray and the take-up reel and heated. The pressing head presses the adhesive material of the adhesive tape to the pressing portion on the circuit board of the electronic device, and the adhesive device for detecting the adhesive tape detecting means of the connecting tape, wherein the tape detecting means detects the connecting tape When the connecting tape passes through the pressing portion, the connecting tape is taken up to the take-up reel. In the invention described in the fifth paragraph of the patent application, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive material is sequentially unwound from the next roll. tape. Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. Further, in the tape detecting means, for example, the adhesive device has a pair of light-emitting portions and a light-receiving portion' to optically detect the connecting tape. On the other hand, the two ends of the adhesive tape are provided with a color (for example, black) mark, and the light receiving portion detects the tie tape by detecting the marks on both ends of the link tape by the laser light emitted from the light-emitting portion. Further, in addition to attaching a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape or a method of forming a plurality of holes in the -45- 1322649 tape may be employed.

申請專利範圍第59項記載之發明，係具有一方之盤 、另一方之盤、使一方之盤及另一方之盤連動旋轉之齒輪 單元、收容前述諸元件之殻體、配置於殼體之開口部之加 熱構件、以及對加熱構件供應電力之電源手段之黏著具， 其特徵爲，一方之盤上捲繞著在基材上塗布著黏著劑之黏 著劑膠帶，另一方之盤則固定著黏著劑膠帶之一端，加熱 構件具有利用供應之電力實施發熱之電熱構件，將捲取至 一方之盤上之黏著劑膠帶拉至殼體之開口部，以加熱構件 從基材側對位於開口部之黏著劑膠帶實施加熱加壓，將黏 著劑壓著至電路基板，以另一方之盤捲取黏著劑被剝離之 基材。 此申請專利範圍第5 9項記載之發明，在將黏著劑壓 著至電路基板時，係以單手握持殻體，將露出黏著劑膠帶 之開口部壓抵電路基板，配設於開口部之黏著劑膠帶基材 側之加熱構件會抵接位於開口部之黏著劑膠帶，而將黏著 劑壓著至電路基板。其次，在抵接位於加熱構件下之黏著 劑膠帶的情形下使黏著具前進，會從一方之盤拉出黏著劑 膠帶，而在從盤拉出黏著劑膠帶時，盤會旋轉，故固定於 一方之盤之同軸上的齒輪會旋轉，而和其齒合之另一方之 盤之齒輪亦會旋轉，以另一方之盤捲取黏著劑已被剝離之 基材。 對加熱構件之電力供應上，可以利用配設於殼體之開 關來切換電力之供應，或者，亦可在加熱構件上配設感壓 -46 - 1322649 開關，加熱構件被推壓時，可感測到該推壓而對加熱構件 供應電力。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著，亦可以爲只有絕緣性黏著劑者，或者’爲 將絕緣性隔件粒子分散於黏著劑中者。 申請專利範圍第60項記載之發明，係塗布於基材上 之黏著材膠帶，其特徵爲，基材係金屬膜或芳香族聚醯胺The invention described in claim 59 is a gear unit having one disk, the other disk, a disk that rotates one disk and the other disk, a casing that houses the components, and an opening that is disposed in the casing. An adhesive member for a heating member and a power source for supplying power to the heating member, wherein one of the disks is wound with an adhesive tape coated with an adhesive on the substrate, and the other disk is fixedly adhered. One end of the adhesive tape, the heating member has an electric heating member that performs heat generation by using the supplied electric power, and the adhesive tape wound up to one of the disks is pulled to the opening of the casing, and the heating member is located at the opening from the substrate side The adhesive tape is subjected to heat and pressure to press the adhesive onto the circuit substrate, and the other substrate is used to wind up the substrate from which the adhesive is peeled off. According to the invention of the fifth aspect of the invention, when the adhesive is pressed against the circuit board, the casing is held by one hand, and the opening of the exposed adhesive tape is pressed against the circuit board, and is disposed in the opening. The heating member on the substrate side of the adhesive tape abuts the adhesive tape located at the opening, and presses the adhesive to the circuit substrate. Secondly, when the adhesive tape is advanced against the adhesive tape under the heating member, the adhesive tape is pulled out from one of the disks, and when the adhesive tape is pulled out from the disk, the disk rotates, so it is fixed at The gear on the coaxial side of one of the discs will rotate, and the gear of the other of the discs that rotates with it will also rotate, and the other disc will take up the substrate from which the adhesive has been peeled off. For the power supply of the heating member, the supply of the electric power can be switched by the switch provided in the casing, or the pressure sensitive -46 - 1322649 switch can be arranged on the heating member, and the heating member can be felt when pressed. The pressing is detected to supply electric power to the heating member. The adhesive may be a conductive adhesive which disperses the conductive particles in the insulating adhesive, or may be an insulating adhesive alone or a dispersion of the insulating spacer particles in the adhesive. The invention described in claim 60 is an adhesive tape applied to a substrate, characterized in that the substrate is a metal film or an aromatic polyamide.

膜所構成。 此申請專利範圍第60項記載之發明時，因爲黏著材 膠帶之基材係採用金屬膜（或金屬箔）或芳香族聚醯胺膜 ，即使基材之厚度較薄時，亦可防止基材伸展或切斷等問 題。 因此，利用由厚度較薄之基材所構成之黏著材膠帶， 可以增加每1盤之捲數，而增加1盤可使用之黏著劑量。 又，使用本發明之黏著材膠帶，每1盤之捲數會增多，電 子構件之製造工廠只需較少新黏著材膠帶之更換次數即可 ，故可提高作業效率。此外，黏著材膠帶之製造上，因可 以減少製造之盤數，且可減少盤材及濕氣防止材之使用量 ，故可降低製造成本。 金屬膜應採用伸展性較高之金屬，例如，銅、鋁、不 銹鋼、鐵、錫等。 芳香族聚醯胺膜之具體實例如對位芳香族聚醯胺纖維 膜（MICTRON ; TORAY株式會社製商品名稱）等。 黏著劑係採用熱可塑性樹脂、熱硬化性樹脂、或熱可 -47- 1322649 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，熱硬化性樹脂系則以 環氧樹脂系、壓克力樹脂系、以及矽樹脂系爲代表。 黏著劑亦可分散著導電粒子》導電粒子係如Au、Ag 、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、或碳、 石墨等，亦可在前述之物及/或非導電性之玻璃、陶瓷、 塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子。Made up of membranes. In the invention described in claim 60, since the substrate of the adhesive tape is made of a metal film (or metal foil) or an aromatic polyamide film, the substrate can be prevented even when the thickness of the substrate is thin. Problems such as stretching or cutting. Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased, and the adhesive amount that can be used for one disk can be increased. Further, with the adhesive tape of the present invention, the number of rolls per one disk increases, and the manufacturing unit of the electronic component only needs to replace the number of times of the new adhesive tape, so that work efficiency can be improved. Further, in the manufacture of the adhesive tape, the number of the manufactured sheets can be reduced, and the amount of the disc and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. The metal film should be made of a highly stretchable metal such as copper, aluminum, stainless steel, iron, tin, or the like. Specific examples of the aromatic polyamide film are, for example, a para-aramid fiber membrane (MICTRON; trade name, manufactured by TORAY Co., Ltd.). The adhesive is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. The adhesive may also disperse conductive particles. The conductive particles are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may also be in the foregoing and/or A conductive core such as a non-conductive glass, ceramic, or plastic polymer material covers the conductive layer or the like to form conductive particles.

此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 申請專利範圍第6 1項記載之發明，係如申請專利範 圍第60項記載之發明，其特徵爲，基材之厚度爲1/zm〜 基材之厚度爲lym〜25;zm之理由如下，基材之厚 度低於lMm時，基材無法得到充分之拉伸強度，而容易 斷裂。又，基材之厚度若超過25//m時，每1盤之捲數方 面無法得到可滿足之捲數。 申請專利範圍第62項記載之發明，係如申請專利範 -48- 1322649 圍第60或61項記載之發明，其特徵爲，基材之拉伸強度 在25□時爲300MPa以上。 基材之拉伸強度爲3 00M Pa以上之理由如下，基材之 拉伸強度小於3 00MPa時，基材容易延展，且黏著材膠帶 容易斷裂。Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. The invention described in claim 60 is the invention according to claim 60, wherein the thickness of the substrate is 1/zm~ the thickness of the substrate is lym 25; zm The reason is as follows. When the thickness of the substrate is less than 1 Mm, the substrate cannot obtain sufficient tensile strength and is easily broken. Further, when the thickness of the substrate exceeds 25/m, the number of windings per one disk cannot be obtained. The invention described in the 60th or 61st aspect of the invention is characterized in that the tensile strength of the substrate is 300 MPa or more at 25 □. The reason why the tensile strength of the substrate is 300 MPa or more is as follows. When the tensile strength of the substrate is less than 300 MPa, the substrate is easily stretched, and the adhesive tape is easily broken.

申請專利範圍第63項記載之發明，係如申請專利範 圍第60至62項之其中任一項記載之發明，其特徵爲，基 材對黏著劑之厚度比爲〇 . 〇 1〜1 . 〇。 基材對黏著劑之厚度比爲〇.〇1〜1.0之理由如下，基 材對黏著劑之厚度比低於0.01時，基材會太薄，而使黏 著材膠帶無法具有足充分之強度。又，基材對黏著劑之厚 度比超過1.0時，基材之厚度會過厚，每1盤之捲數會不 夠多。 申請專利範圍第64項記載之發明，係如申請專利範 圍第60至63項之其中任一項記載之發明，其特徵爲，基 材之表面粗細度Rmax爲0.5 m以下。 基材之表面粗細度Rmax應爲〇.5#m以下之理由如下 ，Rmax若超過〇.5 /zm，則因爲基材表面之凹凸，將黏著 劑壓著至電路基板時，黏著劑不易從基材分離。 申請專利範圍第6 5項記載之發明，係利用在基材上 塗布黏著劑並捲成盤狀之黏著材膠帶在被覆體上形成黏著 劑之黏著材膠帶黏著材形成方法，其特徵爲，分別從複數 盤拉出黏著材膠帶，使各黏著材膠帶重疊成一體，剝離一 方之基材即可在被覆體上形成重疊成一體之黏著劑。 -49- 1322649 此申請專利範圍第65項記載之發明時’從一方之盤 捲出之黏著材膠帶之黏著劑面、及從另一方之盤捲出之黏 著材膠帶之黏著劑面會重疊而使黏著材膠帶成爲一體。另 —方之黏著材膠帶之基材會會捲取至捲取用盤，而重疊成 一體之黏著材膠帶之黏著劑則會被加壓加熱頭壓著至被覆 體。被覆體係電子構件或電路基板，如引線框架或引線框 架之晶片等。The invention according to any one of claims 60 to 62, wherein the thickness ratio of the substrate to the adhesive is 〇. 〇1 to 1. 〇 . The reason why the thickness ratio of the substrate to the adhesive is 〇.〇1 to 1.0 is as follows. When the thickness ratio of the substrate to the adhesive is less than 0.01, the substrate is too thin, so that the adhesive tape cannot have sufficient strength. Further, when the thickness ratio of the substrate to the adhesive exceeds 1.0, the thickness of the substrate is too thick, and the number of rolls per one disk may not be sufficient. The invention according to any one of claims 60 to 63, wherein the surface roughness Rmax of the base material is 0.5 m or less. The reason why the surface roughness Rmax of the substrate should be 〇.5#m or less is as follows. If Rmax exceeds 〇.5 /zm, the adhesive is not easily adhered to the circuit board due to the unevenness of the surface of the substrate. The substrate is separated. The invention described in claim 65 is a method for forming an adhesive tape adhesive material for forming an adhesive on a coated body by applying an adhesive to a substrate and winding the adhesive tape into a disk, which is characterized in that The adhesive tape is pulled out from the plurality of discs, and the adhesive tapes are integrally laminated, and one of the substrates can be peeled off to form an adhesive which is integrally formed on the covering. -49- 1322649 In the invention described in claim 65, the adhesive surface of the adhesive tape which is rolled up from one of the disks and the adhesive surface of the adhesive tape which is wound from the other disk overlap. Make the adhesive tape into one. Alternatively, the substrate of the adhesive tape will be taken up to the take-up reel, and the adhesive of the adhesive tape which is superposed and integrated will be pressed against the cover by the pressurized heating head. The system electronic component or circuit substrate, such as a lead frame or a lead frame wafer, is coated.

如此，在被覆體上形成黏著劑之前一步驟 > 可使一方 之黏著材膠帶之黏著劑、及另一方之黏著材膠帶之黏著劑 重疊，在得到期望之黏著劑厚度再在被覆體上形成黏著劑 ，在增多黏著材膠帶之捲數的情形，卻可縮小每1盤之黏 著材膠帶的捲繞直徑。因此，可增加每1盤之黏著材膠帶 之捲數，而大幅增加1次更換作業之可使用的黏著劑量。 因此，只需較少之新黏著材膠帶之更換作業即可，故可提 高電子機器之生產效率。 申請專利範圍第66項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，只有一方之黏著材膠帶 之黏著劑含有硬化劑。 此申請專利範圍第66項記載之發明時，除了具有和 申請專利範圍第65項記載之發明相同之作用效果以外， 因爲只有一方之黏著材膠帶之黏著劑含有硬化劑，故另一 方之黏著材膠帶之黏著劑不需要硬化劑。因此，未含有硬 化劑之黏著劑之黏著材膠帶無需低溫管理。因此，可減少 必須實施低溫管理之黏著材膠帶的數量，而可使黏著材膠 -50- 1322649 帶之運送及保管獲得有效率之管理。又，未調合硬化劑之 黏著材膠帶、及調合著硬化劑之黏著材膠帶的黏著劑，係 以不會和硬化劑產生反應之成分做爲另一方之黏著劑，除 了以不會和硬化劑產生反應之成分做爲硬化劑以外，尙以 使用之黏著劑做爲一方之黏著劑，故可提高黏著劑之保存 安定性。Thus, a step before the formation of the adhesive on the covering body can overlap the adhesive of one of the adhesive tapes and the adhesive of the other adhesive tape, and the desired thickness of the adhesive can be obtained and formed on the coated body. Adhesives, in the case of increasing the number of rolls of adhesive tape, can reduce the winding diameter of the adhesive tape of each disk. Therefore, the number of rolls of the adhesive tape per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the production efficiency of the electronic machine can be improved. The invention described in claim 66 is the invention according to claim 1, wherein only one of the adhesive tape adhesives contains a curing agent. In the invention described in claim 66, in addition to the same effects as the invention described in claim 65, since only one of the adhesive tape adhesives contains a hardener, the other adhesive material Adhesives for tape do not require a hardener. Therefore, the adhesive tape which does not contain the adhesive of the hardener does not require low temperature management. Therefore, the number of adhesive tapes that must be subjected to low temperature management can be reduced, and the transportation and storage of the adhesive glue -50-1322649 can be efficiently managed. Further, the adhesive tape of the unbonded hardener and the adhesive of the adhesive tape of the hardener are made of the adhesive which does not react with the hardener as the other adhesive, except that the hardener is not used. In addition to the component which produces the reaction as the hardener, the adhesive used as the adhesive is used as one of the adhesives, so that the preservation stability of the adhesive can be improved.

申請專利範圍第67項記載之發明係向異導電材膠帶 ，其特徵爲，在芯材之縱向上實施具有膜狀黏著劑之向異 導電材之多數次捲繞積層。 又，申請專利範圍第68項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之單面配設基材膜之2層構造 的向異導電材。 又，申請專利範圍第69項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之兩面配設基材膜之3層構造 之向異導電材。 又，申請專利範圍第70項記載之發明’係如申請專 利範圍第68或69項記載之向異導電材膠帶’其特徵爲， 對基材膜之單面或兩面實施剝離處理。 又，申請專利範圍第7 1項記載之發明’係如申請專 利範圍第67至70項之其中任一項記載之向異導電材膠帶 ，膜狀黏著劑之寬度爲0.5〜5 mm。 又，申請專利範圍第72項記載之發明’係如申請專 -51 - 1322649 利範圍第08至71項之其中任一項記載之向異導電材膠帶 ，基材膜之強度爲12kg/mm2以上、伸展爲60〜200%、厚 度爲1 00 以下。其次，若基材膜爲有色透明或有色不 透明之著色時’很容即可實施基材膜及黏著劑之判別，又 ，亦很容易判別捲出部之位置，故可提高作業性。 【實施方式】The invention described in claim 67 is a conductive material tape which is characterized in that a plurality of turns of a conductive adhesive having a film-like adhesive are applied in the longitudinal direction of the core material. The invention described in claim 68 is the dissimilar conductive tape according to claim 67, wherein the dissimilar conductive material is provided on a single side of the film adhesive. A conductive material of a two-layer structure of a film. The invention according to claim 69, wherein the dissimilar conductive material is provided on the both surfaces of the film-like adhesive, and the base film is disposed on both sides of the film-like adhesive. The three-layer structure is a conductive material. Further, the invention described in the 70th aspect of the invention is the tape of the electrically conductive material tape according to the invention of claim 68 or 69, wherein the one or both surfaces of the base film are subjected to a peeling treatment. The invention according to any one of claims 67 to 70, wherein the width of the film-like adhesive is 0.5 to 5 mm. In addition, the invention of the invention of the invention of the invention of the invention of the invention of the invention of the invention of the invention of the invention of The stretch is 60 to 200% and the thickness is less than 100. Next, when the base film is colored or transparent, the color of the base film and the adhesive can be determined, and the position of the unwinding portion can be easily determined, so that workability can be improved. [Embodiment]

其次’參照附錄圖面，針對本發明之實施形態進行說 明。又’以下之說明中，同一或同等之構成要素會附與相 同符號。 首先，參照第1圖〜第5圖，針對申請專利範圍第1 〜4項記載之發明之實施形態進行說明。 第1圖係第1實施形態之黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第2圖A及B係第1圖之連接部 份（A)之連接步驟圖，第2圖A係已使用之黏著材膠帶 之端膠帶的剖面斜視圖，第2圖B係反折已使用之黏著材 膠帶來連接新黏著材膠帶之斜視圖，第3圖係黏著裝置之 黏著劑壓著步驟的槪略圖，第4圖係電路基板間之黏著的 剖面圖，第5圖係黏著材膠帶之製造方法的步驟圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3' 3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。亦即，各盤3、3a具有捲軸5、及分別配置於黏著材膠 帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -52- 1322649 之黏著劑1 1所構成^ 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。Next, an embodiment of the present invention will be described with reference to the attached drawings. In the following description, the same or equivalent components will be denoted by the same reference numerals. First, an embodiment of the invention described in claims 1 to 4 will be described with reference to Figs. 1 to 5 . Fig. 1 is a perspective view showing the connection between the adhesive sheets of the adhesive tape connecting method of the first embodiment, and Fig. 2 and Fig. 2 are the connection steps of the connecting portion (A) of Fig. 1, Fig. 2 A section oblique view of the end tape of the adhesive tape used in the A system, and Fig. 2B is a perspective view of the adhesive tape used to re-fold the new adhesive tape, and Fig. 3 is the adhesive of the adhesive device. FIG. 4 is a cross-sectional view showing adhesion between circuit boards, and FIG. 5 is a step view showing a method of manufacturing an adhesive tape. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3' to 3a. That is, each of the disks 3, 3a has a reel 5 and side plates 7 which are respectively disposed on the two width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9 - 52 - 1322649. The strength and the peeling property of the adhesive to the different conductive material are The material 9 should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium-treated PET (polyethylene terephthalate), etc., however, it is not limited thereto.

黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子13係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等’亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋構成前述導電粒子13之材料 所構成之導電層等來形成導電粒子i 3。此外，亦可應用以 絕緣層覆蓋前述導電粒子13之絕緣覆膜粒子、或倂用導 電粒子13及絕緣粒子等。在焊錫等之熱熔融金屬、或塑 膠等之高分子核材上形成導電層者，會具有因加熱加壓或 加壓而產生變形之變形性，故連接後之電極間距離會縮小 ，連接時可增加和電路之接觸面積，而可提高信賴性。尤 其是，以高分子類做爲核材更佳，因導電粒子13如焊錫 並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 -53- 1322649The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., and may be in the aforementioned materials and non-conductive glass, ceramics, plastics, and the like. The conductive particles i 3 are formed by covering a conductive layer or the like constituting the material of the conductive particles 13 with a polymer core material or the like. Further, an insulating coating particle covering the conductive particles 13 with an insulating layer, or conductive particles 13 for use, insulating particles, or the like may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability can be improved. In particular, it is more preferable to use a polymer as a core material, since the conductive particles 13 such as solder do not have a melting point, and can be controlled to a softened state at a wide connection temperature, and the thickness of the corresponding electrode can be easily obtained. A connecting member that is inaccurate in flatness. -53- 1322649

其次’針對本實施形態之黏著材膠帶〗之使用方法進 行說明°如第3圖所不’將黏著材膠帶1之盤3a、及捧取 盤17裝著至黏著裝置15’將捲繞於盤3a上之黏著材膠帶 1的前端經由導引銷22裝設至捲取盤17,並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上’以配置於兩盤3a、17間之加熱加壓 頭19從基材9側實施黏著材膠帶1之壓接，將黏著劑n 壓著至電路基板21。其後，將基材9捲取至捲取盤ι7β 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接如第4圖所示’在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，必要時，可 將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭19對 電路基板2 1實施配線電路23之加熱加壓。利用此方式， 可連接電路基板21之電極21a及配線電路23之電極23a 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑Π的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記28(參照第1圖）。 本發明之黏著材膠帶之連接方法可以分成下述2種’ -54 - 1322649 (a)直接使用捲取盤17，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤17，（b)將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤17使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b)時，如第1圖所示，爲了將盤3a更換成新黏著 材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏著材Next, the method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disk 3a of the adhesive tape 1 and the holding tray 17 are attached to the adhesive device 15' to be wound around the disk. The leading end of the adhesive tape 1 on 3a is attached to the take-up reel 17 via the guide pin 22, and the adhesive tape 1 (arrow E in Fig. 3) is taken up. Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17 to press the adhesive n to the adhesive substrate n. Circuit board 21. Thereafter, the substrate 9 is wound up to the take-up reel ι 7β. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. As shown in FIG. 4, the wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressing head 19 heats and presses the wiring circuit 23 on the circuit board 2 1 . In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP. There will be more parts, and the amount of adhesive used in one use will be much larger than the traditional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (see Fig. 1). The joining method of the adhesive tape of the present invention can be divided into the following two types - '54 - 1322649 (a) directly using the take-up reel 17, replacing the adhesive tape of the adhesive tape 1 which has been used, and having a small number of residual rolls, and The new adhesive tape and the take-up reel 17 are connected, (b) the adhesive tape having the remaining number of remaining adhesive tapes 1 is used as the take-up reel 17, and the new adhesive tape and the residual roll number are connected. Less adhesive tape. (b), as shown in Fig. 1, in order to replace the disk 3a with the new adhesive disk 3, the adhesive material of the disk 3a is applied to the adhesive tape 1 of the disk 3a.

膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於新黏 著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1之始 端部3 2之連接。The end portion 30 of the tape (one adhesive tape) 1 and the end portion 32 of the adhesive tape (the other adhesive tape) 1 wound around the new adhesive sheet 3 are joined.

此黏著材膠帶1之連接上，在露出已使用之盤3a之 黏著材膠帶1之結束標記28時，會如第2圖A所示，會 從黏著材膠帶1之結束標記28附近切斷（B)，並將黏著 材膠帶1之終端部30反折，使黏著材膠帶1之黏著劑11 面位於上側（第2圖B)。其次，將新黏著材盤3之黏著 φ 材膠帶1之始端部32之黏著劑11面重疊於已使用之盤3a 之黏著材膠帶1之終端部30之黏著劑11面上（第2圖B 其次，如第4圖所示，將兩者之重疊部份置於工作台 1〇4上，以黏著裝置15之加熱加壓頭19實施加熱加壓進 行黏著。利用此方式，即可連接捲繞於已使用之盤3a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1。其 次，將已使用之盤3a及新盤3互相對換，將新盤3裝著 至黏著裝置15。因此，無需實施將黏著材膠帶1裝著至捲 -55- 1322649 取盤1 7之作業。又，因以黏著劑丨丨面間之重疊來進行黏 著，故有較高之連接強度。When the adhesive tape 1 is joined, when the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it will be cut from the vicinity of the end mark 28 of the adhesive tape 1 as shown in Fig. 2A ( B), and the end portion 30 of the adhesive tape 1 is folded back so that the adhesive 11 of the adhesive tape 1 is positioned on the upper side (Fig. 2B). Next, the adhesive 11 of the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 is superposed on the surface of the adhesive 11 of the end portion 30 of the adhesive tape 1 of the used disc 3a (Fig. 2B) Next, as shown in Fig. 4, the overlapping portion of the two is placed on the table 1〇4, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized for adhesion. The adhesive tape 1 around the used disc 3a and the adhesive tape 1 wound on the new disc 3. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is loaded. To the adhesive device 15. Therefore, it is not necessary to carry out the operation of attaching the adhesive tape 1 to the roll-55- 1322649 to take the disk 17. Further, since the adhesive is adhered by the overlap between the adhesive faces, it is higher. Connection strength.

又，黏著材膠帶1上之結束標記28之位置，當黏著 材膠帶1從已使用之盤（黏著材膠帶1完全捲出之盤）3a 延伸至加熱加壓頭19爲止時，應爲從黏著材膠帶1固定 於已使用之盤3a上之固定位置至加熱加壓頭19爲止之長 度的位置上。此時，從結束標記28之附近切斷，即使從 必要之最小位置切斷黏著材膠帶1，除了可防止黏著材膠 帶1之浪費以外，當可避免將拆下已使用之盤3a並移動 已使用之盤3 a使結束標記2 8到達加熱加壓頭1 9之位置 的繁複作業。 此實施形態時，因黏著裝置1 5具有加熱加壓頭1 9， 並利用此加熱加壓頭19來實施已使用之盤3a之黏著材膠 帶1之終端部30之黏著劑11、及新黏著材盤3之黏著材 膠帶1之始端部32之黏著劑11的連接，故無需另外使用 φ 以實施黏著劑Π間之壓著爲目的之壓著用器具，即可實 施已捲繞著黏著材膠帶1之盤3、3a之更換。 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤17之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶1 之結束標記28附近切斷，將殘留於捲取盤17側之黏著材 膠帶之終端部反折，使黏著劑1 1面成爲上側。其次，使 此黏著材膠帶1之終端部之黏著劑11面、及新黏著材盤3 -56- 1322649 之黏著材膠帶1之始端部32之黏著劑11面互相重g。其 次，將兩者之重疊部份置於工作台104上，以黏著裝置15 之加熱加壓頭1 9進行加熱加壓實施黏著。利用此方式， 可連接捲繞於捲取盤17上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1。利用此方式，因爲捲取盤I?只會捲 取基材9’故可捲取數個黏著材盤份，減少捲取盤I?之更 換次數，而有良好之作業效率。Further, the position of the end mark 28 on the adhesive tape 1 should be adhered when the adhesive tape 1 is extended from the used disk (the disk in which the adhesive tape 1 is completely unwound) 3a to the heating and pressing head 19. The material tape 1 is fixed at a position from the fixed position on the used disk 3a to the length of the heating and pressing head 19. At this time, cutting from the vicinity of the end mark 28, even if the adhesive tape 1 is cut from the necessary minimum position, in addition to preventing waste of the adhesive tape 1, it is possible to avoid removing the used disk 3a and moving it. The use of the disc 3 a causes the end mark 28 to reach the complicated operation of the position of the heating press head 19. In this embodiment, since the adhesive device 15 has the heating and pressing head 19, and the heating and pressing head 19 is used to carry out the adhesive 11 of the end portion 30 of the adhesive tape 1 of the used disk 3a, and the new adhesive Since the adhesive 11 of the beginning end portion 32 of the adhesive tape 1 of the material tray 3 is connected, it is not necessary to use φ to carry out the pressing device for the purpose of pressing the adhesive between the adhesive sheets 3, and the adhesive material can be wound. Replacement of the discs 3, 3a of the tape 1. When the reeling tape 17 of (a) is used as it is, the adhesive tape which has the remaining number of remaining adhesive tapes 1 is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are connected. When the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape 1, and the end portion of the adhesive tape remaining on the take-up reel 17 side is folded back. The surface of the adhesive 1 1 is the upper side. Next, the surface of the adhesive 11 on the end portion of the adhesive tape 1 and the adhesive 11 on the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 - 56 - 1322649 are mutually weighted by g. Next, the overlapping portions of the two are placed on the table 104, and the heating and pressing heads of the bonding device 15 are heated and pressurized to perform adhesion. In this manner, the adhesive tape 1 wound around the take-up reel 17 and the adhesive tape 1 wound around the new disc 3 can be joined. In this way, since the take-up reel I? only takes up the substrate 9', it is possible to take up a plurality of adhesive discs, reduce the number of times of reeling, and have a good work efficiency.

此處，參照第5圖’針對本實施形態之黏著材膠帶1 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑n，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機33切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上 ，或者’捲取至附側板之捲軸上，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-10 °C )之管理並進行出貨。 其次’針對本發明之第2實施形態進行說明，以下之 說明係以和上述實施形態不同之點爲主。 第6圖所示之第2實施形態時，係利用新黏著材盤3 之黏著材膠帶1之始端部32具有之前導膠帶41，實施新 黏著材盤3之黏著材膠帶1、及捲繞於已使用之盤3a上之 黏著材膠帶1之連接。前導膠帶41係由基材63及其背面 之黏著劑43面所構成，新黏著材盤3之黏著材膠帶1之 始端部32，係利用前導膠帶41貼附於捲附至盤上之黏著 •57- 1322649Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Fig. 5'. On a substrate 9 that is unwound from the unwinder 25, an adhesive n obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, and then taken up by a winding machine 31. Take the original material. The original material of the adhesive tape 1 that has been taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side panels 7, 7 are attached to the reel from both sides, or 'rolled to the reel of the side panel In the above, it is bundled with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. Next, the second embodiment of the present invention will be described. The following description is mainly based on differences from the above embodiment. In the second embodiment shown in Fig. 6, the beginning end portion 32 of the adhesive tape 1 using the new adhesive sheet 3 has the adhesive tape 41, the adhesive tape 1 for the new adhesive sheet 3, and the winding tape 1 The connection of the adhesive tape 1 on the disc 3a that has been used. The leading tape 41 is composed of a substrate 63 and a surface of the adhesive 43 on the back side, and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 is attached to the adhesive tape attached to the disk by the leading tape 41. 57- 1322649

材膠帶1之基材9面來固定。其次，從基材9面剝離前導 膠帶41，並使其和反折之黏著材膠帶1之終端部3〇之黏 著劑11面重疊。將兩者之重疊部份置於工作台104上， 以黏著裝置15之加熱加壓頭19進行加熱加壓實施黏著。 如此，因爲利用黏著材膠帶1之前導膠帶41實施全部捲 出之黏著材膠帶1之終端部30、及新裝著之黏著材膠帶1 之始端部32的黏著，故黏著材膠帶1間之連接十分簡單 。此時，配設於前導膠帶4 1之基材63之背面側的黏著劑 43面具有黏著性，亦可只利用使其重疊於反折之黏著材膠 帶1之終端部30之黏著劑11面的方式來實施連接。 本發明並未受限於上述之實施形態，只要在未背離本 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，不反折捲繞於已使用 之盤3a上之黏著材膠帶1，而如第7圖所示，從基材9面 剝離新裝著之黏著材膠帶1之始端部32之前導膠帶41， 並將其貼附於背面之黏著劑11面，使前導膠帶41連接於 已使用之黏著材膠帶1之終端部30之黏著劑11面，再以 黏著裝置15之加熱加壓頭19進行加熱加壓實施黏著亦可 。此時，因無需反折全部捲出之黏著材膠帶1，故可防止 將黏著材膠帶1捲取至捲取盤時可能發生之捲取散亂。 此時，從基材9面剝離黏著材膠帶1之始端部32之 前導膠帶41，並將前導膠帶41黏著於已使用之黏著材膠 帶1之基材9面亦可》 其次，針對申請專利範圍第5〜8項記載之發明進行 -58- 1322649 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5〜8項記載之發明之背 景技術進行說明。The base material 9 of the material tape 1 is fixed. Next, the front tape 41 is peeled off from the surface of the substrate 9 and overlapped with the adhesive 11 of the end portion 3 of the adhesive tape 1 which is folded back. The overlapping portion of the two is placed on the table 104, and the heating and pressing head 19 of the bonding device 15 is heated and pressurized to perform adhesion. In this manner, since the adhesive tape 41 is used to carry out the adhesion of the terminal portion 30 of the adhesive tape 1 and the initial end portion 32 of the newly attached adhesive tape 1 by the adhesive tape 41, the connection between the adhesive tapes 1 is performed. Very simple. At this time, the surface of the adhesive 43 disposed on the back surface side of the base material 63 of the leading tape 4 1 has adhesiveness, and it is also possible to use only the adhesive 11 surface of the end portion 30 of the adhesive tape 1 which is folded over. The way to implement the connection. The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, in the second embodiment described above, the adhesive tape 1 wound on the used disk 3a is not folded back, and as shown in Fig. 7, the newly attached adhesive tape 1 is peeled off from the surface of the substrate 9. The tape end 41 is guided by the leading end portion 32, and is attached to the surface of the adhesive 11 on the back side, so that the leading tape 41 is attached to the surface of the adhesive 11 of the end portion 30 of the adhesive tape 1 to be used, and the adhesive device 15 is attached thereto. The heating and pressing head 19 may be heated and pressurized to perform adhesion. At this time, since it is not necessary to fold the adhesive tape 1 which is completely unwound, it is possible to prevent the winding which may occur when the adhesive tape 1 is taken up to the take-up reel. At this time, the tape 41 is peeled off from the beginning end portion 32 of the adhesive tape 1 from the surface of the substrate 9, and the leading tape 41 is adhered to the surface of the substrate 9 of the adhesive tape 1 that has been used. The invention described in items 5 to 8 is described in -58 to 1322649. These inventions relate to an adhesive tape for attaching and fixing an electronic component and a circuit board or a circuit board, and an electrical connection between electrodes of the two, in particular, a method of joining the adhesive tape wound into a disk shape. Next, the background technology of the invention described in the fifth to eighth patent applications will be described.

一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 方法，係採用黏著材膠帶。 日本特開2001 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 '及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 •59- 1322649 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, or a circuit between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray 'and the take-up tray of the take-up substrate are removed, the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is adhered. The beginning of the tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel images such as PDPs, the adhesion area of circuit boards has also increased, and the amount of adhesive used at one time has increased from 59 to 1322649. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved.

針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5〜8項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率》 其次，參照第8圖A〜C、第3圖〜第5圖，針對本 發明之第1實施形態進行說明。第8圖A〜C係第1實施 形態之黏著材膠帶之連接方法圖，第8圖A係黏著材盤間 之連接的斜視圖，第8圖B係第8圖A之連接部份之連接 方法的斜視圖，第8圖C係第8圖A之連接部份之平面圖 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 -60- 1322649 7。本實施形態時，黏著材膠帶1之長度約爲50m、寬度 W約爲5 mm。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claims 5 to 8 is to provide a method of connecting an adhesive tape, which makes it easier to replace the adhesive disk and improve the production efficiency of the electronic device. 8A to C and 3rd to 5th, the first embodiment of the present invention will be described. Figs. 8A to 8C are views showing a method of connecting the adhesive tape of the first embodiment, Fig. 8A is a perspective view showing the connection between the adhesive sheets, and Fig. 8B is a connection of the connecting portion of Fig. 8A. The oblique view of the method, Fig. 8C is a plan view of the connecting portion of Fig. 8A. The adhesive tape 1 is wound around the discs 3, 3a, and the reels 5 are disposed on the discs 3, 3a, and are disposed on the discs. Side plate of the width side of the tape 1 -60-1322649 7. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 5 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however,

黏著劑Π係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W' Sb、Sn、焊錫等之金屬粒子、 φ 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋構成前述導電粒子13之材料 所構成之導電層等來形成導電粒子13。此外，亦可應用以 絕緣層覆蓋前述導電粒子13之絕緣覆膜粒子、或倂用導 電粒子13及絕緣粒子等。在焊錫等之熱熔融金屬、或塑 膠等之高分子核材上形成導電層者，會具有因加熱加壓或 加壓而產生變形之變形性，故連接後之電極間距離會縮小 ，連接時可增加和電路之接觸面積，而可提高信賴性。尤 其是，以高分子類做爲核材更佳，因導電粒子13如焊錫 -61 - 1322649 並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。The adhesive is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W'Sb, Sn, and solder, φ or carbon, graphite, etc., and may be used in the above-mentioned materials and non-conductive glass, ceramics, and the like. The conductive particles 13 are formed by covering a conductive layer or the like which constitutes the material of the conductive particles 13 with a polymer core material such as plastic. Further, an insulating coating particle covering the conductive particles 13 with an insulating layer, or conductive particles 13 for use, insulating particles, or the like may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. The contact area with the circuit can be increased, and the reliability can be improved. In particular, it is more preferable to use a polymer as a core material, since the conductive particles 13 such as solder-61 - 1322649 have no melting point, and can be controlled to a softened state at a wide connection temperature, and can be easily obtained. A connecting member for the error of the thickness and flatness of the electrode.

其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取 盤丨7裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤17，並捲出黏著材 膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上，以配置於兩盤3 a、1 7間之加熱加壓 頭19從基材9側實施黏著材膠帶1之壓接，將黏著劑11 壓著至電路基板21。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）23，必要時，可 將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭19對 電路基板21實施配線電路23之加熱加壓。利用此方式， 可連接電路基板21之電極21a及配線電路23之電極23a 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 -62-Next, a method of using the adhesive tape 1 of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 7 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached via the guide pin 22. To the take-up tray 17, and roll out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the pressure-adhesive tape 19 placed between the two trays 3a and 17 is pressed against the adhesive tape 1 from the substrate 9 side to press the adhesive 11 The circuit board 21 is placed. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. As shown in FIG. 4, the wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressing head 19 applies heat and pressure to the wiring circuit 23 to the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP. There will be more parts, and the amount of the adhesive 11 used at one time will be much larger than the conventional use. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is in a relatively short period of time - 62-

1322649 內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上5 膠帶1之結束標記28(參照第8圖A)。 本發明之黏著材膠帶之連接方法可以分成下述 (a)直接使用捲取盤17，更換已使用之黏著材膠 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帮 盤17， （b)將已使用之黏著材膠帶1之殘餘捲® 黏著劑膠帶當做捲取盤17使用，並連接新黏著齊! 殘餘捲數變少的黏著劑膠帶。 (b)時，如第8圖A所示，爲了將盤3a更接 著材盤3，在盤3a之黏著材膠帶1露出結束標記 會實施盤3a之黏著材膠帶（一方之黏著材膠帶）1 部30、及捲繞於新黏著材盤3上之黏著材膠帶（另 黏著材膠帶）之始端部32之連接（參照第8圖A) 此黏著材膠帶1之連接上，如第8圖B及C所 針對黏著材盤3a之黏著材膠帶1之終端部30、及 材盤3之黏著材膠帶1之始端部32，使始端部32 劑11面重疊於終端部30之基材9面上。其次，將 字形之卡止銷46插入重疊部份，實施黏著材膠帶 端部30、及新黏著材盤3之黏著材膠帶1之始端若 連接。 利用此方式，可實施捲繞於已使用之盤3a上 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連 此，可以卡止銷46固定已全部捲出之黏著材膠帶 端部30、及新裝著之黏著材膠帶1之始端部32, :黏著材 2種， 帶1之 5及捲取 [變少的 丨膠帶及 t成新黏 28時， 之終端 ,一方之 〇 示，會 新黏箸 之黏箸 略呈口 1之終 P 32之 之黏著 接。如 1之終 故連接 -63-The inside of the 1322649 is taken up to the take-up reel 1 7 and the end mark 28 of the tape 1 wound around the disc 3a is exposed (refer to Fig. 8A). The bonding method of the adhesive tape of the present invention can be divided into the following (a) directly using the take-up reel 17, replacing the adhesive tape having a reduced number of residual adhesives of the adhesive, and connecting the new adhesive adhesive pad 17, (b) Use the Residual Roll® Adhesive Tape of the Adhesive Tape 1 that has been used as the take-up reel 17 and attach the new adhesive to the adhesive tape with less residual reel. (b), as shown in Fig. 8A, in order to further laminate the disk 3a to the material tray 3, the adhesive tape 1 on the disk 3a is exposed, and the adhesive tape (the adhesive tape of one side) of the disk 3a is implemented. The connection of the portion 30 and the beginning end portion 32 of the adhesive tape (additional adhesive tape) wound on the new adhesive sheet 3 (refer to Fig. 8A), the connection of the adhesive tape 1, as shown in Fig. 8 And the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a and the beginning end portion 32 of the adhesive tape 1 of the material tray 3, and the surface of the starting end portion 32 is superposed on the surface of the substrate 9 of the end portion 30. . Next, the glyph lock pin 46 is inserted into the overlapping portion, and the adhesive tape end portion 30 and the beginning end of the adhesive tape 1 of the new adhesive sheet 3 are joined. In this way, the adhesive tape 1 wound on the used disc 3a and the adhesive tape 1 wound on the new disc 3 can be implemented, and the pin 46 can be locked to fix the adhesive tape which has been completely unwound. The end portion 30 and the beginning end portion 32 of the newly-adhesive adhesive tape 1 are: 2 kinds of adhesive materials, 5 of the tape 1 and the winding [the less defective tape and the new adhesive 28, the terminal, one side It shows that the adhesive of the new adhesive will be slightly adhered to the end of the mouth P32. If the end of 1 is connected -63-

1322649 十分簡單。 其次，將已使用之盤3a及新盤3互相對換， 裝著至黏著裝置15»因此，無需實施將新黏著材 著至捲取盤17之作業。 直接使用（a)之捲取盤17，將已使用之黏著 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠 實施新黏著劑膠帶及捲取盤17之連接時，在露出 之盤3a之黏著材膠帶1之結束標記28時從黏著和 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之 膠帶之終端部30、及新黏著材盤3之黏著材膠帶1 部32重疊。其次，將略呈3字形之卡止銷46插入 重疊部份，實施黏著材膠帶1之終端部30、及新黏 3之黏著材膠帶1之始端部32之連接。 因爲捲取盤17只會捲取基材9，故可捲取數個 盤份。因此，可減少捲取盤17之更換次數，而有 φ 作業效率。 其次’針對申請專利範圍第5〜8項記載之發明 〜第4實施形態進行說明，以下說明之實施形態中 部份會附與相同符號並省略該部份之詳細說明，以 明係以和上述第1實施形態不同之點爲主。 第9圖所示之第2實施形態時，係利用具有配 方及另一方之端部之爪部48、49、及連結兩端之/] 、49之彈性構件50的卡止構件47，實施一方之黏 帶1之終端部30及另一方之黏著材膠帶1之始端音 ί新盤3 帶1裝 材膠帶 帶，並 已使用 '膠帶1 黏著材 之始端 兩者之 著材盤 黏著材 良好之 的第2 ，相同 下之說 設於一 V部48 著材膠 $ 32之 •64- 1322649 連接。具體而言，使一方之黏著材膠帶1之終端部30及 另一方之黏著材膠帶1之始端部32互相抵接，使配設於 卡止構件47之一端之爪部48卡止於終端部30，並使配設 於另一端之爪部49卡止於始端部32，並以彈性構件50拉 近一方之爪部48及另一方之爪部49。又，爪部48、47係 在板構件之背面配設前端爲尖形之複數爪51者。1322649 is very simple. Next, the used disc 3a and the new disc 3 are mutually exchanged and attached to the adhesive device 15», therefore, there is no need to carry out the work of bringing the new adhesive material to the take-up reel 17. Directly using the reeling tray 17 of (a), replacing the adhesive tape which has been used in the residual number of the adhesive 1 with a new adhesive tape, and when the new adhesive tape and the take-up reel 17 are connected, the exposed adhesive tape is exposed. When the end mark 28 of the adhesive tape 1 of the disk 3a is cut off from the vicinity of the adhesive end mark 28, the end portion of the tape remaining on the side of the take-up disk 17 and the adhesive tape of the new adhesive disk 3 are removed. 1 part 32 overlaps. Next, a slightly triangular-shaped card stopper 46 is inserted into the overlapping portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive 3 are joined. Since the take-up reel 17 only winds up the substrate 9, a plurality of discs can be taken up. Therefore, the number of replacements of the take-up reel 17 can be reduced, and φ work efficiency can be achieved. In the following description, the invention will be described with reference to the fourth to eighth embodiments of the invention, and the same reference numerals will be given to the embodiments in the following description, and the detailed description of the parts will be omitted. The first embodiment differs mainly. In the second embodiment shown in Fig. 9, one of the claw members 48 and 49 having the end portion of the formula and the other end, and the locking member 47 for connecting the elastic members 50 of the ends/49, 49 are used. The end portion 30 of the adhesive tape 1 and the beginning of the adhesive tape 1 on the other side ί new disk 3 with 1 loading tape tape, and the tape of the tape 1 is used at the beginning of the adhesive tape. The second, the same as the next is said to be located in a V part 48 with a glue $32 of 64- 1322649 connection. Specifically, the end portion 30 of one of the adhesive tapes 1 and the other end portion 32 of the other adhesive tape 1 are brought into contact with each other, and the claw portion 48 disposed at one end of the locking member 47 is locked to the terminal portion. 30, the claw portion 49 disposed at the other end is locked to the start end portion 32, and the one claw portion 48 and the other claw portion 49 are pulled by the elastic member 50. Further, the claw portions 48, 47 are provided with a plurality of claws 51 having a pointed tip end on the back surface of the plate member.

因係使配設於卡止構件47之一端之爪部48卡止於終 端部30，並使配設於另一端之爪部49卡止於始端部32來 連接兩者，故連接十分容易。又，因爲一方之爪部48及 另一方之爪部49之間具有彈性構件50，彈性構件50可伸 展而將卡止構件47之另一方之爪部49卡止於另一方之黏 著材膠帶1之始端部32之任意位置上，故連接具有高自 由度。 第10圖所示之第3實施形態時，會針對捲繞於已使 用之盤3a上之黏著材膠帶1之終端部30、及新黏著材盤 φ 3之黏著材膠帶1之始端部32，使始端部32之黏著劑11 面重疊於終端部3 0之基材9面上，其次，以橫剖面略呈 3字形之可彈性變形之夾子53夾住重疊部份實施固定。 因爲只以夾子53夾住重疊部份來實施連接，故連接作業 十分容易。 第1 1圖所示之第4實施形態時，係在第1實施形態 中，以橫剖面略呈〕字形之金屬製夾持片55覆蓋重疊部 份，並從重疊部份之兩面壓扁夾持片55來連接兩者。因 係從重疊部份之兩面壓扁夾持片55來實施連接，故可利 -65- 1322649 用重疊部份獲得強固之連接。 申請專利範圍第5〜8項記載之發明並未受限於上述 實施形態，只要未背離申請專利範圍第5〜8項記載之發 明之要旨的範圍內，可實施各種變形。 例如，上述之第1實施形態時，卡止銷46並非略呈 3字形，而爲1支線狀銷亦可，此時，應以複數個銷來固 定重疊部份。Since the claw portion 48 disposed at one end of the locking member 47 is locked to the terminal portion 30, and the claw portion 49 disposed at the other end is locked to the starting end portion 32 to connect the two, the connection is easy. Further, since the elastic member 50 is provided between the one claw portion 48 and the other claw portion 49, the elastic member 50 can be stretched to lock the other claw portion 49 of the locking member 47 to the other adhesive tape 1 At any position of the beginning end portion 32, the connection has a high degree of freedom. In the third embodiment shown in Fig. 10, the end portion 30 of the adhesive tape 1 wound around the used disk 3a and the beginning end portion 32 of the adhesive tape 1 of the new adhesive disk φ 3 are The surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the base material 9 of the end portion 30, and secondly, the elastically deformable clip 53 having a substantially three-dimensional cross section is sandwiched and fixed. Since the connection is carried out only by sandwiching the overlapping portion with the clip 53, the connection work is very easy. In the fourth embodiment shown in Fig. 1, in the first embodiment, the metal holding piece 55 having a substantially U-shaped cross section covers the overlapping portion and is squashed from both sides of the overlapping portion. A piece 55 is held to connect the two. Since the connection is performed by flattening the holding pieces 55 from both sides of the overlapping portion, the -65- 1322649 can be used to obtain a strong connection by overlapping portions. The invention described in the fifth to eighth aspects of the invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first embodiment described above, the locking pin 46 is not slightly triangular, but may be a linear pin. In this case, the overlapping portion is fixed by a plurality of pins.

第2實施形態時，亦可配合黏著材膠帶1之寬度來使 用複數個卡止構件47。 第3實施形態及第4實施形態時，亦可使用複數個夾 子53或夾持片55，並分別從黏著材膠帶1之重疊部份之 兩側進行固定。 其次，針對申請專利範圍第9〜1 3項記載之發明進行 說明。 這些發明係關於電子構件及電路基板、或電路基板間 φ 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第9〜1 3項記載之發明之背 景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -2 84005號公報，係記載著將在基材上 -66- 1322649 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。In the second embodiment, a plurality of locking members 47 may be used in combination with the width of the adhesive tape 1. In the third embodiment and the fourth embodiment, a plurality of clips 53 or holding pieces 55 may be used and fixed from both sides of the overlapping portion of the adhesive tape 1. Next, the invention described in the claims 9 to 13 will be described. These inventions relate to an adhesive tape of an electronic component and a circuit board, or an adhesion between φ of a circuit board, and an electrical connection between electrodes of the two, in particular, a connection method of an adhesive tape wound into a disk shape. . Next, the background technology of the invention described in the claims 9 to 13 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-B 84005 discloses that the adhesive tape to which the adhesive material is applied to the substrate - 66 - 1322649 is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m.

將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 -67- 1322649 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第9〜13項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may be increased from -67 to 1322649, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 9 to 13 is to provide a method of joining adhesive tapes, which makes it easier to replace the adhesive sheets and improve the production efficiency of the electronic equipment.

其次，參照附錄圖面，針對申請專利範圍第9〜1 3項 記載之發明之實施形態進行說明，首先，參照第1 2圖A 、B、第3圖〜第5圖，針對申請專利範圍第9〜13項記 載之發明之第1實施形態進行說明。第1 2圖A〜C係第1 實施形態之黏著材膠帶之連接方法圖，第12圖A係黏著 材盤間之連接的斜視圖，第12圖B係第12圖A之連接部 份之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲50m、寬度 W約爲3 mm。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 -68- 1322649 熱 表 代 爲 系 旨 ΠΒ 樹 醋 聚 及 系 脂 樹 烯 乙 苯 以 係 系 脂 樹 性 塑 可 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13»導電粒子13係如 Au' Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取盤 17裝著至黏著裝置15，捲繞於盤3a上之黏著材膠帶1之 前端裝設至捲取盤7，並捲出黏著材膠帶1(第3圖中之 箭頭E)。其次，將黏著材膠帶1配置於電路基板21上 ，以配置於兩盤3 a、1 7間之加熱加壓頭1 9從基材9側實 施黏著材膠帶1之壓接，將黏著劑11壓著至電路基板21 。其後，將基材9捲取至捲取盤17。 上述壓著後（暫時連接）’實施電路基板21之電極 -69- 1322649 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑11上配置配線電路（或電子構件）23，必要時 ，可將例如聚四氟乙烯材2 4當做緩衝材，以加熱加壓頭 19對電路基板21實施配線電路23之加熱加壓。利用此方 式，可連接電路基板21之電極21a及配線電路23之電極 23a。Next, an embodiment of the invention described in the claims 9 to 13 will be described with reference to the attached drawings. First, referring to FIG. 2A, FIG. The first embodiment of the invention described in the items 9 to 13 will be described. Fig. 2 is a perspective view showing a method of connecting the adhesive tape of the first embodiment, Fig. 12A is a perspective view showing the connection between the adhesive sheets, and Fig. 12B is a connection portion of Fig. 12A. An oblique view of the connection method. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 7 disposed on both width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 3 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. Heat-68- 1322649 heat meter for the purpose of the ΠΒ vinegar polyglycol and phyllo-ethyl benzene to the system of fat tree plastic sturdy resin, epoxy resin, vinyl ester resin, acrylic Resin type and enamel resin are representative. The conductive particles 13»the conductive particles 13 are dispersed in the adhesive 11 such as metal particles such as Au'Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may be in the foregoing / or non-conductive glass, ceramics, plastics and other polymer core materials covering the conductive layer or the like to form. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the take-up reel 7, and Roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3a and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and the adhesive 11 is applied. Pressed to the circuit substrate 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrodes of the circuit board 21, 69- 1322649 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. On the official connection, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 11 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 23 on the circuit board 21. In this way, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected.

利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記2 8 (參照第12圖A )。 申請專利範圍第9〜13項記載之發明之黏著材膠帶之 連接方法可以分成下述2種，（a)直接使用捲取盤17’ 更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠帶 ，並連接新黏著劑膠帶及捲取盤17，（b)將已使用之黏 著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤17 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 (b)時，如第12圖A所示’爲了將盤3&更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3&之黏 著材膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於 -70- 1322649 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部32之連接（參照第12圖A)。The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more. The amount of the adhesive 11 used at one time is much larger than that of the conventional one. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 12A). The method of connecting the adhesive tape of the invention described in the ninth to thirteenth aspect of the invention can be divided into the following two types: (a) directly using the take-up reel 17', and replacing the used adhesive tape 1 with a smaller number of remaining reels Adhesive tape, and a new adhesive tape and a take-up reel 17, (b) an adhesive tape having a reduced number of remaining reels of the used adhesive tape 1 is used as the take-up reel 17, and a new adhesive tape is attached. And when the adhesive tape (b) having a small remaining number of reels is used, as shown in Fig. 12A, in order to replace the disc 3&ample with the new adhesive disc 3, the disc 3& The end portion 30 of the adhesive tape (one adhesive tape) 1 and the end portion 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive sheet 3 of -70-1322649 (Refer to Figure 12A).

此黏著材膠帶1之連接上，如第12圖B所示’會針 對黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材 盤3之黏著材膠帶1之始端部32，使始端部32之黏著劑 11面重疊於終端部30之基材9面上。兩者之重疊長度Η 爲黏著劑膠帶1之寬度W的大約2.5倍，將其置於工作台 3 6上，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施 黏著。利用此方式，可實施捲繞於已使用之盤3a上之黏 著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。 其次，將已使用之盤3a及新盤3互相對換，將新盤3裝 著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝著 至捲取盤1 7之作業》 此實施形態因係利用加熱加壓頭1 9，無需另行採用黏 著劑間之壓著用器具，即可更換捲繞著黏著材1之盤3、 3 a ° 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤17之連接時，在露出已使用 之盤3a之黏著材膠帶1之結束標記28時從黏著材膠帶I 之結束標記28附近切斷，使殘留於捲取盤17側之黏著材 膠帶之終端部30'及新黏著材盤3之黏著材膠帶1之始端 部32互相重疊。其次，以黏著裝置15之加熱加壓頭19 對兩者之重疊部份進行加熱加壓實施黏著。因爲捲取盤17 -71 - 1322649 只會捲取基材9，故可捲取數個黏著材盤份，減少捲取盤 17之更換次數，而有良好之作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶j 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布The connection of the adhesive tape 1 is such that, as shown in Fig. 12B, the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a and the beginning portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are used. The surface of the adhesive 11 of the starting end portion 32 is superposed on the surface of the substrate 9 of the terminal portion 30. The overlapping length 两者 of the two is about 2.5 times the width W of the adhesive tape 1, and is placed on the table 36, and the heating and pressing heads of the bonding device 15 are heated and pressurized to perform adhesion. In this manner, the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound around the new disk 3 can be connected. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the operation of attaching the new adhesive tape 1 to the take-up reel 1". In this embodiment, the heating press head 19 is used, and the roll can be replaced without using an adhesive device between the adhesives. The disc 17 of (a) is directly used around the disc 3, 3 a ° of the adhesive material 1, and the adhesive tape of the used adhesive tape 1 having a small remaining number of rolls is replaced with a new adhesive tape, and is implemented. When the new adhesive tape and the take-up reel 17 are connected, when the end mark 28 of the adhesive tape 1 of the used disc 3a is exposed, it is cut from the vicinity of the end mark 28 of the adhesive tape I to remain on the take-up reel 17 The end portion 30' of the adhesive tape on the side and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 overlap each other. Next, the overlapping portions of the two are heated and pressurized by the heating and pressing head 19 of the bonding device 15 to perform adhesion. Since the take-up reel 17-71 - 1322649 only winds up the substrate 9, a plurality of adhesive discs can be taken up, reducing the number of replacements of the take-up reel 17, and having good work efficiency. Here, a method of manufacturing the adhesive tape j of the present embodiment will be described with reference to Fig. 5 . On a substrate 9 which is unwound from the unwinder 25, for coating

機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。被 捲取之黏著材膠帶之原始材料，以切割機33切成特定寬 度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上， 或者，捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（-5°C〜-10°C )之管理並進行出貨。 其次，針對申請專利範圍第9〜13項記載之發明之其 他實施形態進行說明，以下說明之實施形態中，和上述實 施形態相同之部份會附與相同符號並省略該部份之詳細說 明，以下之說明係以和上述實施形態不同之點爲主。 第1 3圖所示之第2實施形態時，以表面爲參差不齊 (凹凸）44而爲互相嵌合之一方之模具56、及另一方之 模具57夾持黏著材膠帶1之重疊部份34，使重疊部份34 形成凹凸58。如此，利用形成凹凸58，可增加重疊部份 34之黏著面積’且利用重疊部份34之凹凸58的卡合可提 高拉伸方向（黏著材膠帶之縱向）之強度。形成凹凸時， 黏著劑1 1會流動而以黏著劑黏著重疊部份之端面間，可 進一步提高重疊部份34之拉伸方向的強度。 第14圖A及第14圖B所示之第3實施形態時，會將 -72- 1322649The machine 27 is coated with an adhesive 11 obtained by mixing a resin and conductive particles 13, and dried in a drying oven 29, and then the raw material is taken up by a winding machine 31. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. It is packaged together with the dehumidifying material, and is managed at a low temperature (-5 ° C to -10 ° C) and shipped. In the following, the embodiments of the invention described in the ninth to thirteenth aspect of the invention will be described. In the embodiments described below, the same reference numerals will be given to the same parts as the above, and the detailed description of the parts will be omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 3, the overlapping portion of the adhesive tape 1 is sandwiched between the mold 56 having the surface unevenness (concavity and convexity) 44 and the other mold 57. 34, the overlapping portion 34 is formed with the unevenness 58. Thus, by forming the unevenness 58, the adhesion area ' of the overlapping portion 34 can be increased and the engagement of the unevenness 58 of the overlapping portion 34 can increase the strength of the stretching direction (the longitudinal direction of the adhesive tape). When the unevenness is formed, the adhesive 1 1 flows and the adhesive adheres to the end faces of the overlapping portions, so that the strength of the overlapping portion 34 in the stretching direction can be further improved. In the third embodiment shown in Figs. 14A and 14B, -72- 1322649 will be used.

捲取至新黏著材1之盤3之始端部32彎折成略呈V字形 ’捲繞於已使用之盤3a上之黏著材膠帶！之終端部3〇亦 彎折成略呈V字形，使雨者成爲鈎狀必須黏著劑u互相 相對並卡止（第1 4圖A)，以加熱加壓頭1 9實施加熱加 壓來連接兩者（第14圖B)。此第3實施形態時，因終 端部30及始端部32係以鈎狀連結而可獲得強固之連結， 同時’因利用黏著劑1 1之重疊來連接，故可得到更爲強 固之連接。和上述相同，因爲黏著劑會在重疊部份流動並 黏著端面，故可獲得更強固之連接。 第15圖A及第15圖B所示之第4實施形態，係在第 1實施形態之加熱加壓前、或加熱加壓之同時在重疊部份 3 4形成貫通孔5 9。利用形成貫通孔5 9，加熱加壓時可使 黏著劑11從貫通孔59之周圍滲出並實施黏著而提高黏著 力，重疊部34可獲得強固之連接。 申請專利範圍第9〜13項記載之發明並未受限於上述 之實施形態，只要不背離申請專利範圍第9〜1 3項記載之 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時，凹凸5 8不必爲山型 ，亦可以爲具弧形之九形。 第4實施形態時，貫通孔5 9之數並無特別限制，可 以爲任何數量。又，貫通孔5 9之直徑並無限制。又，第2 、第3實施形態時，亦可進一步在重疊部份34上形成貫 通孔5 9。 其次，針對申請專利範圍第1 4〜1 8項記載之發明進 -73- 1322649 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 背景技術進行說明。The beginning end portion 32 of the disc 3 taken up to the new adhesive material 1 is bent into a slightly V-shaped 'adhesive tape wound on the used disc 3a! The terminal portion 3〇 is also bent into a V-shape, so that the rainer is hook-shaped, and the adhesive u must be opposed to each other and locked (Fig. 14A), and the heating and pressing head 19 is heated and pressurized to be connected. Both (Figure 14 B). In the third embodiment, since the end portion 30 and the start end portion 32 are connected in a hook shape, strong connection can be obtained, and at the same time, the connection is made by the overlapping of the adhesives 1, so that a stronger connection can be obtained. As in the above, since the adhesive flows in the overlapping portion and adheres to the end faces, a stronger connection can be obtained. In the fourth embodiment shown in Fig. 15 and Fig. 15B, the through hole 5 is formed in the overlapping portion 34 before the heating and pressurization or the heating and pressing in the first embodiment. When the through hole 5 9 is formed by heating and pressurizing, the adhesive 11 can be oozing out from the periphery of the through hole 59 to be adhered to increase the adhesive force, and the overlapping portion 34 can be strongly connected. The invention described in the ninth to thirteenth aspect of the invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention as set forth in the claims 9 to 13 of the patent application. For example, in the second embodiment described above, the unevenness 5 8 does not have to be a mountain shape, and may have a curved nine shape. In the fourth embodiment, the number of the through holes 590 is not particularly limited and may be any number. Further, the diameter of the through hole 5.9 is not limited. Further, in the second and third embodiments, the through hole 5 9 may be further formed in the overlapping portion 34. Next, the invention described in the claims 1 to 14 of the patent application is described in the paragraph -73- 1322649. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to a method of connecting an adhesive tape wound into a disk shape. Next, the background art of the invention described in the claims 1 to 11 will be described.

一般而言，液晶面板、PDP (電漿顯示面板）、EL( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -28 4005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度》捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。黏著材盤之裝著後， 從自黏著材盤捲出之黏著材膠帶之基材側以加熱加壓頭將 黏著劑壓著至電路基板等上，再以捲取盤捲取殘餘之基材 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，將黏著材膠帶之始端經由黏著裝置之導引銷裝 設至捲取盤。 -74- 1322649 然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and a circuit between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-2804005 describes a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. After the adhesive material tray is mounted, the adhesive is pressed onto the circuit substrate by a heating and pressing head from the substrate side of the adhesive tape which is rolled out from the adhesive material tray, and the residual substrate is taken up by the take-up reel. Secondly, when the adhesive tape of the adhesive material plate is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive material tray are mounted on the adhesive device, and the adhesive tape is used. The beginning is attached to the take-up reel via a guide pin of the adhesive device. -74- 1322649 However, in recent years, as the panel screen of PDP and the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved.

針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，而可能 因爲黏著劑從膠帶兩側滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 另一方面，以黏黏著材膠帶貼附黏著材膠帶及黏著材 膠帶並無法充分黏著力實施黏著。爲了使黏著材膠帶具有 良好黏著材剝離性，會在其上塗布氟系脫模劑或矽系脫模 劑等，而上述情形就是因爲其影響。 因此’申請專利範圍第14〜18項記載之發明的目的 ’係在提供一種黏著材膠帶之連接方法，尤其是黏著材膠 帶之基材採用經過矽處理之基材時，亦可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第14〜18 -75- 1322649 項記載之發明之實施形態進行說明，首先，參照第1 6圖 A、B、第3圖〜第5圖，針對申請專利範圍第14〜18項 記載之發明之第1實施形態進行說明。第1 6圖A及B係 第1實施形態之黏著材膠帶之連接方法圖，第16圖A係 黏著材盤間之連接的斜視圖，第16圖B係第16圖A之連 接部份（b )之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3' 3a，各盤3、3a上In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may become a cause of clogging because the adhesive oozes from both sides of the tape. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. On the other hand, the adhesive tape and the adhesive tape are adhered by the adhesive tape, and the adhesive is not sufficiently adhered. In order to impart good adhesive peelability to the adhesive tape, a fluorine-based release agent or a bismuth-based release agent or the like is applied thereon, which is because of the influence thereof. Therefore, the object of the invention described in the claims of claims 14 to 18 is to provide a method for joining adhesive tapes, in particular, when the substrate of the adhesive tape is treated with a ruthenium-treated substrate, the adhesive tray can also be used. The replacement is relatively simple, and the production efficiency of the electronic machine is improved. Next, an embodiment of the invention described in the patent application No. 14 to 18-75- 1322649 will be described with reference to the drawings. First, referring to Figs. 16A, B, and 3rd to 5th, the application is made. The first embodiment of the invention described in the claims 14 to 18 will be described. Fig. 6 is a perspective view showing a method of connecting the adhesive tape of the first embodiment, Fig. 16A is a perspective view showing the connection between the adhesive sheets, and Fig. 16B is a connecting portion of Fig. 16A (Fig. 16). b) An oblique view of the connection method. Adhesive tape 1 is wound around disc 3' 3a, respectively, on each disc 3, 3a

配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7 〇 黏著材膠帶1係由矽處理基材9、及塗布於矽處理基 材9之一側面之黏著劑1 i所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 矽處理基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 PET (聚對苯二甲酸乙二酯）等之基材所構成，其表面利 用矽樹脂等實施表面處理。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3 »導電粒子1 3係如The reel 5 and the side plate 7 disposed on the two width sides of the adhesive tape 1 are disposed, and the adhesive tape 1 is treated by the enamel substrate 9 and the adhesive 1 i applied to one side of the enamel substrate 9 Composition. The ruthenium treated substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or PET (polyethylene terephthalate), etc., in terms of strength and releasability of the adhesive to the electrically conductive material. The base material is formed, and the surface thereof is subjected to surface treatment using a resin or the like. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. Conductive particles 1 3 are dispersed in the adhesive 1 1 » conductive particles 1 3 are as

Au、Ag、Pt、Ni ' Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子 -76- 1322649 膜融 覆熔 緣熱 絕之 之等 子錫 粒焊 電在 導。 述等 前 子 蓋粒 覆緣 層絕 緣及 絕子 以 粒 用電 應導 可用 亦併 ’ 或 外、 此子 。 粒 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取盤 17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶1 之前端裝設至捲取盤17，並捲出黏著材膠帶1 (第3圖中 之箭頭E)。其次，將黏著材膠帶1配置於電路基板21 上，以配置於以配置於兩盤3 a、1 7間（；：配置之加熱加壓 頭19從矽處理基材9側實施黏著材膠帶1之壓接，將黏 著劑11壓著至電路基板21。其後，將矽基材9捲取至捲 取盤17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接上，如第4圖所示，在壓著至電路基板21上 之黏著劑11上配置配線電路（或電子構件）23，必要時 ，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓頭 19對電路基板21實施配線電路23之加熱加壓。利用此方 -77- 1322649 式，可連接電路基板21之電極21a及配線電路23之電極 2 3 a °Metal particles such as Au, Ag, Pt, Ni'Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., may be used in the above-mentioned materials and non-conductive glass, ceramics, plastics, and the like. Covering the above-mentioned conductive layer or the like to form conductive particles - 76 - 1322649 film melting edge heat is absolutely the same as the tin soldering. The precursor granules are covered by a layer of insulation and the neutrons are used to granulate the electricity and can be used either or not. When a conductive layer is formed on a polymer core material such as a granular metal or a plastic, deformation due to deformation by heating, pressurization or pressurization is caused, so that the distance between the electrodes after the connection is reduced, and the contact with the circuit can be increased during the connection. The area can be increased to increase reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound around the disc 3a is attached to the take-up reel 17, And roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive tape 1 is placed on the circuit board 21 so as to be disposed between the two trays 3a and 17 (the heat-adhesive head 19 is disposed, and the adhesive tape 1 is applied from the side of the enamel-treated substrate 9 After the pressure bonding, the adhesive 11 is pressed against the circuit board 21. Thereafter, the crucible base material 9 is taken up to the take-up reel 17. After the pressing (temporary connection), the electrode and the wiring circuit of the circuit board 21 are implemented ( The electrodes of the electronic component 23 are positioned and connected in a formal manner. As shown in FIG. 4, the wiring circuit (or electronic component) 23 is placed on the adhesive 11 pressed onto the circuit board 21, if necessary, For example, the polytetrafluoroethylene material 24 can be used as a buffer material, and the heating and pressurizing head 19 can be used to heat and press the wiring circuit 23 on the circuit board 21. The electrode 21a of the circuit board 21 can be connected by the formula -77- 1322649 and Electrode 2 of the wiring circuit 23 3 a °

利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記28 (參照第16圖A)。 申請專利範圍第14〜18項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a)直接使用捲取盤17 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17，（b)將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤17 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 (b)時，如第16圖A所示，爲了將盤3a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部30、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部32之連接。 此黏著材膠帶1之連接上，如第16圖B所示，黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部32會互相抵接，以跨越兩黏著材 -78- 1322649 膠帶1、1之矽處理基材9、9之表面的方式貼附矽黏著膠 帶60，實施兩黏著材膠帶1、1之連接。 此矽黏著膠帶60係由基材63及塗布於基材63之單 面之矽黏著劑62所構成。基材63之材質並無特別限制， 然而，本實施形態係聚醯亞胺樹脂材。又，第16圖B中 ，黏著材膠帶之黏著劑11及矽黏著膠帶60之黏著劑部份 43分別以斜線表示。The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more. The amount of the adhesive 11 used at one time is much larger than that of the conventional one. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 16A). The method of connecting the adhesive tape of the invention described in the above-mentioned patents No. 14 to 18 can be classified into the following two types: (a) directly using the take-up reel 17, and replacing the number of remaining reels of the used adhesive tape 1 Adhesive tape, and a new adhesive tape and a take-up reel 17, (b) an adhesive tape having a reduced number of remaining reels of the used adhesive tape 1 is used as the take-up reel 17, and a new adhesive tape is attached. When the adhesive tape (b) having a small remaining number of reels is used, as shown in Fig. 16A, in order to replace the disc 3a with the new adhesive sheet 3, the adhesion of the disc 3a is performed on the adhesive tape 1 of the disc 3a. The end portion 30 of the tape (one adhesive tape) 1 and the beginning end portion 32 of the adhesive tape (the other adhesive tape) 1 wound around the new adhesive sheet 3 are connected. The connection of the adhesive tape 1 is as shown in Fig. 16B, and the end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the beginning end 32 of the adhesive tape 1 of the new adhesive sheet 3 abut each other. The adhesive tape 60 is attached to the surface of the substrates 9 and 9 so as to cover the surfaces of the substrates 9 and 9 across the two adhesive materials -78-1322649, and the two adhesive tapes 1 and 1 are joined. The adhesive tape 60 is composed of a base material 63 and an adhesive 62 applied to one side of the base material 63. The material of the substrate 63 is not particularly limited. However, the present embodiment is a polyimide resin material. Further, in Fig. 16B, the adhesive 11 of the adhesive tape and the adhesive portion 43 of the adhesive tape 60 are indicated by oblique lines, respectively.

此處，針對矽黏著膠帶60之黏著進行說明。一方及 另一方之黏著材膠帶1、1之矽處理基材9、9因爲分別覆 蓋著矽，故難以利用黏著劑進行黏著，然而，本實施形態 時，因矽黏著膠帶60之黏著劑43係採用矽樹脂，兩矽處 理基材9、9之表面張力差會較小，利用密著（黏著）可 使一方之黏著材膠帶1之終端部30及另一方之黏著材膠 帶1之始端部32有良好之連接。矽黏著膠帶60之矽黏著 劑62表面、及矽處理基材9、9表面之表面張力差應爲 10mN/m ( lOdyne/cm )以下，本實施形態時，幾乎沒有表 面張力差。 一般而言，一方之黏著材膠帶1之終端部30及另一 方之黏著材膠帶1之兩矽處理基材9、9之表面張力爲 25mN/m〜60mN/m ( 25〜60dyne/cm)，例如，表面張力爲 30mN/m時，矽黏著膠帶60之矽黏著劑62之表面張力應 設定成20mN/m以上、40mN/m以下。 矽系黏著劑主要係由矽橡膠及矽樹脂所構成，一般而 言，係使兩者產生少許縮合反應而具有黏著性，其次，利 -79-Here, the adhesion of the adhesive tape 60 will be described. Since the adhesive substrates 1 and 1 of the adhesive tape 1 and 1 of the other side are covered with the enamel, it is difficult to adhere with the adhesive. However, in the present embodiment, the adhesive 43 of the adhesive tape 60 is adhered. With the enamel resin, the difference in surface tension between the two substrates 9 and 9 is small, and the end portion 30 of the adhesive tape 1 on one side and the beginning end portion 32 of the adhesive tape 1 on the other side can be made by adhesion (adhesion). Have a good connection. The surface tension difference between the surface of the adhesive tape 62 and the surface of the ruthenium-treated substrate 9 and 9 should be 10 mN/m (10 odyne/cm) or less, and in the present embodiment, there is almost no difference in surface tension. Generally, the surface tension of the two end treatment portions 9 and 9 of the end portion 30 of the adhesive tape 1 and the other adhesive tape 1 of the adhesive tape 1 is 25 mN/m to 60 mN/m (25 to 60 dyne/cm). For example, when the surface tension is 30 mN/m, the surface tension of the adhesive agent 62 of the adhesive tape 60 should be set to 20 mN/m or more and 40 mN/m or less. The lanthanum adhesive is mainly composed of yttrium rubber and yttrium resin. Generally speaking, it causes a little condensation reaction between the two and has adhesiveness. Secondly, the -79-

1322649 用過氧化物、白金觸媒之砂氫化反應使其交 溫度爲-1 〇 〇 °c以下者。上述皆爲市販品，可 用。 如此，利用矽黏著膠帶60實施捲繞於 材盤3a上之黏著材膠帶1、及捲繞於新黏著 著材膠帶1之連接。其次，將已使用之黏毫 黏著材盤3互相對換，將新黏著材盤3裝著 。因此，無需拉出新黏著材盤3之黏著材膠 材膠帶裝著至捲取盤17、或將新黏著材膠帶 裝置15之導引銷36之作業，故黏著材盤3 良好之作業效率。如此，因爲已全部捲出之 之終端部30、及新裝著之黏著材膠帶1之免 矽黏著膠帶進行連接，故連接十分簡單。 其次，將已使用之盤3a及新盤3互相g 裝著至黏著裝置15。因此，無需將新黏著材 φ 捲取盤1 7之作業》 直接使用（a)之捲取盤17，將已使用 1之殘餘捲數變少的黏著劑膠帶更換成新黏 實施新黏著劑膠帶及捲取盤17之連接時，ί 之黏著材膠帶1之結束標記28露出時，會$ 之結束標記28附近實施切斷，使殘留於捲耳 著材膠帶之終端部30、及新黏著材盤3之黏 始端部32互相抵接。其次’在兩者之抵接 著膠帶實施黏著材膠帶1之終端部30、及新 聯，玻璃轉移 選擇適當者使 已使用之黏著 材盤3上之黏 [材盤3a及新 於黏著裝置15 帶1並將黏著 1裝設至黏著 、3a之更換有 黏著材膠帶1 4端部32係以 f換，將新盤3 膠帶1裝著至 之黏著材膠帶 著劑膠帶，並 己使用之盤3 a :黏著材膠帶1 之盤1 7側之黏 著材膠帶1之 部份利用矽黏 黏著材盤3之 -80- 1322649 黏著材膠帶1之始端部32的連接。因爲捲取盤17只會捲 取基材9，故可捲取數個黏著材盤份，減少捲取盤17之更 換次數，而有良好之作業效率。 其次，參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。1322649 Hydrogenation reaction of peroxide and platinum catalyst is carried out to make the temperature below -1 〇 〇 °c. All of the above are marketable and available. Thus, the adhesive tape 1 wound around the material disk 3a and the connection wound around the new adhesive tape 1 are carried out by the adhesive tape 60. Next, the used adhesive sheets 3 are replaced with each other, and the new adhesive sheet 3 is loaded. Therefore, it is not necessary to pull out the adhesive material tape of the new adhesive sheet 3 to the take-up tray 17, or the guide pin 36 of the new adhesive tape device 15, so that the adhesive sheet 3 has a good work efficiency. In this way, since the terminal portion 30 which has been completely unwound and the adhesive tape 1 of the newly attached adhesive tape 1 are connected, the connection is very simple. Next, the used disc 3a and the new disc 3 are attached to the adhesive device 15 to each other. Therefore, it is not necessary to use the new adhesive material φ to take up the tray 1 7". The reeling tape 17 of the (a) is directly used, and the adhesive tape which has been used with less residual volume is replaced with a new adhesive to form a new adhesive tape. When the winding tape 17 is connected, when the end mark 28 of the adhesive tape 1 is exposed, the cutting is performed in the vicinity of the end mark 28, and the end portion 30 remaining in the tape-forming tape and the new adhesive are placed. The sticky end portions 32 of the disk 3 abut each other. Next, 'the two end parts 30 of the adhesive tape 1 and the new joint are applied to the tape, and the glass transfer is selected to make the adhesive on the used adhesive sheet 3 [the tray 3a and the new adhesive device 15 belt 1 and attach the adhesive 1 to the adhesive, replace the adhesive with 3a, the adhesive tape is used, the end portion of the adhesive tape is replaced by f, and the new tape 3 tape 1 is attached to the adhesive tape adhesive tape, and the used tray 3 is used. a: The portion of the adhesive tape 1 on the side of the tray 1 of the adhesive tape 1 is connected by the end portion 32 of the adhesive tape 1 to the -80-1322649 of the adhesive sheet 3. Since the take-up reel 17 only retracts the substrate 9, a plurality of adhesive discs can be taken up, reducing the number of replacements of the take-up reel 17, and having good work efficiency. Next, a method of manufacturing the adhesive tape i of the present embodiment will be described with reference to Fig. 5 .

在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後，以捲取機3 1捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機33切成特定寬度並捲 取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者， 捲取至附側板之捲軸上，將其和除濕材一起綑包，實施低 溫（-5 °C〜-1 〇 °C )之管理並進行出貨。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第17圖所示之第2實施形態時，除了如上述之第1 實施形態以外，在一方之黏著材膠帶1之終端部3 0、及另 -方之黏著材膠帶之始端部3 2之黏著劑1 1面側亦貼附著 矽黏著膠帶60。此第2實施形態之矽黏著膠帶60之矽黏 著劑62，其黏著力爲100g/25mm以上，本實施形態時則 舄 700g/25mm〜1 400g/25mm。又，矽黏著膠帶60之矽黏 1322649 1 OmN/m ( 1 〇dyne/cm )以下。此第2實施形態時，一方之 黏著材膠帶1之終端部30及另一方之黏著材膠帶之始端 部32之兩面，因以矽黏著膠帶60實施黏著，可以較第1 實施形態更高之強度來實施兩黏著材膠帶1、1之黏著。On a substrate 9 which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, dried in a drying furnace 29, and then wound up by a coiler 31. original material. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. It is bundled with the dehumidifying material, and is managed at a low temperature (-5 °C to -1 〇 °C) and shipped. In the following, the other embodiments of the invention described in the first and fourth embodiments of the invention are described, and the same reference numerals are given to the same parts as the above-mentioned embodiments, and the detailed description of the parts is omitted. The difference from the above embodiment is mainly. In the second embodiment shown in Fig. 17, in addition to the first embodiment described above, the end portion 30 of the adhesive tape 1 and the beginning end portion 3 of the other adhesive tape are adhered. The adhesive tape 60 is also attached to the side of the agent 1 1 . In the second embodiment, the adhesive agent 62 of the adhesive tape 60 has an adhesive force of 100 g/25 mm or more, and in the present embodiment, 舄 700 g / 25 mm to 1 400 g / 25 mm. Further, the adhesive tape 60 has a viscosity of 1322649 1 OmN/m (1 〇dyne/cm) or less. In the second embodiment, both ends of the end portion 30 of the adhesive tape 1 and the other end portion 32 of the other adhesive tape can be adhered by the adhesive tape 60, and the strength can be higher than that of the first embodiment. To carry out the adhesion of the two adhesive tapes 1, 1.

第18圖所示之第3實施形態，係以重疊方式配置一 方之黏著材膠帶1之終端部30及另一方之黏著材膠帶1 之始端部3 2，其矽處理基材9側面及黏著材1 1側面則貼 附著第2實施形態之矽黏著膠帶6 0，利用此第3實施形態 ，可獲得和第2實施形態相同之作用效果。 第19圖所示之第4實施形態，係在一方之黏著材膠 帶1之終端部30、及另一方之黏著材膠帶1之始端部32 之間，存在基材之兩面塗布著矽黏著劑62之矽黏著膠帶 6 1，用以連接終端部3 0及始端部3 2。利用此第4實施形 態，因係使用兩面之矽黏著膠帶61，一方之黏著材膠帶1 之終端部30及另一方之黏著材膠帶1之始端部32的連接 更爲十分簡單且容易》 其次，針對申請專利範圍第1 9〜2 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第19〜21項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( -82 - 1322649 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。In the third embodiment shown in Fig. 18, the end portion 30 of one of the adhesive tapes 1 and the other end portion 3 of the other adhesive tape 1 are placed in an overlapping manner, and the side surface of the substrate 9 and the adhesive are processed. The adhesive tape 60 of the second embodiment is attached to the side surface of the first embodiment, and the third embodiment can provide the same operational effects as those of the second embodiment. In the fourth embodiment shown in Fig. 19, between the end portion 30 of one of the adhesive tapes 1 and the other end portion 32 of the other adhesive tape 1, the adhesive is applied to both surfaces of the substrate. Then, the adhesive tape 6 1 is used to connect the terminal portion 30 and the start end portion 3 2 . According to the fourth embodiment, since the adhesive tape 61 is used on both sides, the connection between the end portion 30 of one of the adhesive tapes 1 and the beginning end portion 32 of the other adhesive tape 1 is more simple and easy. The invention described in the Patent Application No. 19-2-1 will be described. These inventions relate to an adhesive tape for fixing an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and in particular, to a method of connecting an adhesive tape wound into a disk shape. Next, the background art of the invention described in the claims 19 to 21 will be described. In general, a liquid crystal panel, a PDP (plasma display panel), an EL (-82 - 1322649 fluorescent display) panel, an electronic component such as a bare chip package, a circuit board, or a circuit board, or a circuit board, and both The method of electrically connecting the electrodes is to use an adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m.

將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 者材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大’一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加》因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏箸材膠帶之膠帶寬度爲較狹窄之1〜 -83- 1322649 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. . Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased. The amount of the adhesive used at one time has also increased. Moreover, because of the expansion of the use of the adhesive, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive tray of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive material tray is very troublesome, so it is impossible to improve the electronic machine. The problem of production efficiency. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrow 1~ -83- 1322649 3 mm, if the number of rolls is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device.

因此，申請專利範圍第19〜21項記載之發明的目的 ，係黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。Therefore, the object of the invention described in the claims 19 to 21 is a method of joining the adhesive tape, which makes it possible to easily replace the adhesive disk and improve the production efficiency of the electronic device.

其次’參照附錄圖面，針對申請專利範圍第1 9〜第 2 1項記載之發明之實施形態進行說明，首先，參照第2 0 圖A〜C、第21圖、第4圖、及第5圖，針對申請專利範 圍第1 9〜2 1項記載之發明之第1實施形態進行說明。第 20圖A〜C係本實施形態之黏著材膠帶之連接方法圖，第 20圖A係黏著材盤間之連接的斜視圖，第20圖B及C係 第20圖A之連接部份之連接方法的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 黏者材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， -84 · 1322649 並不限於此。 黏著劑Μ係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、砂樹脂系爲代表。Next, the embodiments of the invention described in the patent application scopes ninth to twenty-first are described with reference to the drawings. First, reference is made to Figs. 2 to A, C, 21, 4, and 5. In the drawings, the first embodiment of the invention described in the claims 1-9 to 2 will be described. 20A to C are connection diagrams of the adhesive tape of the present embodiment, and Fig. 20A is a perspective view showing the connection between the adhesive sheets, and Fig. 20B and the connection portion of Fig. 20A of Fig. 20 A cross-sectional view of the connection method. The adhesive tape 1 is wound around the discs 3 and 3a, and the reels 5 are disposed on the discs 3 and 3a, and the side panel adhesive tape 1 disposed on the two width sides of the adhesive tape 1 is made of the substrate 9. And an adhesive 11 coated on one side of the substrate 9. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and ruthenium treated PET (polyethylene terephthalate) in terms of strength and peelability of the adhesive to the different conductive material. ), etc., however, -84 · 1322649 is not limited to this. The adhesive is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acryl resin type, or a sand resin type.

黏著劑1 1內分散著導電粒子13。導電粒子1 3係如 Au' Ag、Pt、Ni' Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層而形成者。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小，連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點， 在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很容 易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第21圖所示，將黏著材膠帶1之盤3a'及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶 1之前端經由導引銷22裝設至捲取盤17，並捲出黏著材 膠帶1(第21圖中之箭頭E)。其次，將黏著材膠帶1配 置於電路基板21上，利用配置於兩盤3、17間之加熱加 -85- 1322649 壓頭19從基材9側實施黏著材膠帶1之壓接，將黏著劑 11壓著至電路基板21。其後，將基材9捲取至捲取盤17The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au'Ag, Pt, Ni'Cu, W, Sb, Sn, solder, or the like, carbon, graphite, etc., and may also be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. A polymer core or the like is formed to cover the conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 21, the disc 3a' of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. The disc 17 is taken up and the adhesive tape 1 is unwound (arrow E in Fig. 21). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating-85- 1322649 indenter 19 disposed between the two trays 3 and 17, and the adhesive is applied. 11 is pressed to the circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17

上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）23，必要 時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭19對電路基板21實施配線電路2 3之加熱加壓。利用 此方式，可連接電路基板21之電極21a及配線電路23之 電極2 3 a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著材 膠帶1之結束標記28(參照第20圖A)。 申請專利範圍第19〜21項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a)直接使用捲取盤17 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17， （b)將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤17 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶 -86- 1322649 (b)時，如第2〇圖A所示，爲了將盤3a更換成新 黏著材盤3,在盤3a之黏著材膠帶丨露出結束標記28時 ’盤3a之黏著材膠帶（一方之黏著材膠帶）1之終端部 3〇、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之黏 著材膠帶）1之始端部32係利用樹脂製黏著劑64實施連 接。After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. On the official connection, as shown in Fig. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 1 1 pressed onto the circuit board 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurizing head 19 is used to heat and press the wiring circuit 2 to the circuit board 21. In this manner, the electrode 21a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 23 can be connected. The PDP of the adhesive tape 1 of the present embodiment has a large size, and may be pressed against the entire periphery of the PDP, and the connection portion may be more. The amount of the adhesive 11 used at one time is much larger than that of the conventional one. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 20A). The method of connecting the adhesive tape of the invention described in the above-mentioned Japanese Patent Application No. 19 to 21 can be divided into the following two types: (a) the use of the take-up reel 17 is directly used, and the number of remaining reels of the used adhesive tape 1 is reduced. Adhesive tape, and a new adhesive tape and a take-up reel 17, (b) an adhesive tape having a reduced number of remaining reels of the used adhesive tape 1 is used as the take-up reel 17, and a new adhesive tape is attached. And the adhesive tape-86- 1322649 (b) in which the number of remaining reels is small, as shown in Fig. 2A, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape on the disc 3a is exposed. When marking 28, the end portion 3 of the adhesive tape (one adhesive tape) 1 of the disk 3a, and the adhesive tape (the other adhesive tape) 1 wound around the new adhesive disk 3 The 32 series is connected by a resin adhesive 64.

樹脂製黏著劑64係例如環氧樹脂、氰酸樹脂、二馬 來醯亞胺樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂、醇酸 樹脂、壓克力樹脂、不飽和聚酯樹脂、苯二酸二烯丙酯樹 脂、矽樹脂、間苯二酚甲醛樹脂、二甲苯樹脂、呋喃樹脂 、聚胺酯樹脂、酮樹脂、三聚烯丙基胺氰樹脂等。 此黏著材膠帶1之連接如第20圖B所示，針對黏著 材盤3a之黏著材膠帶1之終端部30、及新黏著材盤3之 黏著材膠帶1之始端部32，使始端部32之黏著劑11面重 疊於終端部3 0之基材9面。其次，利用組合於黏著裝置 15之充塡機65將糊狀之樹脂製黏著劑64塗布於重疊部份 «其次，如第20圖C所示，此樹脂製黏著劑64爲熱硬化 性樹脂時，利用組合於黏著裝置15之加熱器66之加熱實 施硬化，連接黏著材膠帶1之終端部30、及新黏著材盤3 之黏著材膠帶1之始端部32。 利用此方式，可實施捲繞於已使用之盤3a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，以樹脂製黏著劑64固定已全部捲出之黏著材膠帶1 -87-The resin adhesive 64 is, for example, an epoxy resin, a cyanic resin, a bismaleimide resin, a phenol resin, a urea resin, a melamine resin, an alkyd resin, an acrylic resin, an unsaturated polyester resin, or a phthalic acid. A diallyl resin, an anthracene resin, a resorcinol formaldehyde resin, a xylene resin, a furan resin, a polyurethane resin, a ketone resin, a trimeric allylamine cyanide resin, or the like. The connection of the adhesive tape 1 is as shown in Fig. 20B. The end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are made to have the starting end portion 32. The surface of the adhesive 11 is superposed on the surface of the substrate 9 of the terminal portion 30. Next, the paste-form resin adhesive 64 is applied to the overlapping portion by the charging device 65 combined with the adhesive device 15. Next, as shown in Fig. 20C, the resin adhesive 64 is a thermosetting resin. The curing is performed by heating by the heater 66 combined with the adhesive device 15, and the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the adhesive tape 1 of the new adhesive sheet 3 are joined. In this manner, the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound around the new disk 3 can be joined. Thus, the adhesive tape 64 which has been completely rolled out is fixed by the resin adhesive 64 - 87-

1322649 之終端部30、及新裝著之黏著材膠帶1之始端部 連接十分簡單。 其次，將已使用之盤3a及新盤3互相對換， 裝著至黏著裝置15»因此，無需實施將新黏著材 著至捲取盤17之作業。 直接使用（a)之捲取盤17’將已使用之黏ί 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑® 實施新黏著劑膠帶及捲取盤17之連接時’已使用 之黏著材膠帶1之結束標記28露出時會從黏著木 之結束標記28附近實施切斷，使殘留於捲取盤Π 著材膠帶之終端部30及新黏著材盤3之黏著材朦 始端部32重疊。其次，在兩者之重疊部份塗布揭 脂製黏著劑64，依據使用之樹脂製黏著劑之種類養 、紫外線照射等使其發揮黏著力，實施終端部3 0、 著材盤3之黏著材膠帶1之始端部32之連接。g 盤17只會捲取基材9，故可捲取數個黏著材盤份， 取盤17之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著和 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上， 機27塗布由樹脂及導電粒子13混合而成之黏著劑 以乾燥爐29實施乾燥後，以捲取機31捲取原始相 捲取之黏著材膠帶之原始材料，以切割機33切成 度並捲取至捲軸後，從兩側將側板7、7裝著於捲 32，故 f新盤3 ?帶1裝 :材膠帶 !帶，並 之盤3a 卜膠帶1 側之黏 帶1之 丨狀之樹 :施加熱 及新黏 丨爲捲取 減少捲 •膠帶1 以塗布 1 1，並 料。被 特定寬 軸上， -88- 1322649 或者，捲取至附側板之捲軸上，將其和除濕材一起綑包， 實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 申請專利範圍第19〜21項記載之發明並未受限於上 述之實施形態’只要未背離申請專利範圍第19〜21項記 載之發明之要旨的範圍內，可實施各種變形。The connection between the end portion 30 of 1322649 and the beginning of the newly attached adhesive tape 1 is very simple. Next, the used disc 3a and the new disc 3 are mutually exchanged and attached to the adhesive device 15», therefore, there is no need to carry out the work of bringing the new adhesive material to the take-up reel 17. Use the reel tray 17' of (a) directly to replace the adhesive tape with less residual reel used to the new adhesive agent. When the new adhesive tape and the take-up reel 17 are connected, 'used When the end mark 28 of the adhesive tape 1 is exposed, the cutting is performed from the vicinity of the end mark 28 of the adhesive tape to leave the end portion of the end portion 30 of the take-up tape and the new adhesive sheet 3 at the beginning end of the adhesive material. 32 overlap. Then, a grease-removing adhesive 64 is applied to the overlapping portion of the two, and the adhesive is applied according to the type of the resin-based adhesive to be used, and ultraviolet rays are applied to the adhesive portion, and the adhesive material of the terminal portion 30 and the saucer 3 is implemented. The connection of the beginning end 32 of the tape 1. The g disk 17 only winds up the substrate 9, so that a plurality of adhesive material discs can be taken up, and the number of replacements of the tray 17 can be taken, and the working efficiency is good. Here, a method of manufacturing the adhesive and the present embodiment will be described with reference to Fig. 5. On a substrate which is unwound from the unwinding machine 25, the machine 27 applies an adhesive obtained by mixing a resin and conductive particles 13 to dry in a drying furnace 29, and then takes up the original phase coiled by a coiler 31. The original material of the adhesive tape is cut into degrees by the cutter 33 and taken up to the reel, and the side plates 7 and 7 are attached to the roll 32 from both sides, so the new plate 3 is equipped with a tape: And the tray 3a tape on the side of the tape 1 side of the braided tree: the application of heat and new adhesive for the coil to reduce the volume of the tape 1 to coat 1 1, and material. On a specific wide shaft, -88- 1322649 or, take it onto the reel with the side plate, bundle it with the dehumidifying material, and manage the low temperature (-5 °C~-1 0 °C) and ship it. . The invention described in the claims 19 to 21 is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims.

本實施形態時，樹脂製黏著劑6 4係以熱硬化性樹脂 爲例’然而，亦可以光硬化性樹脂取代熱硬化性樹脂，以 紫外線等之光照射實施硬化性樹脂之硬化，實施黏著材膠 帶1間之連接。 此時’光硬化性樹脂可採用在具有丙烯酸基或甲基丙 烯酸基之樹脂調合光聚合起動劑之組成物、或含有芳香族 重偶氮鹽、二烯丙基碘氫基鹽、鎏鹽等光硬化劑之環氧樹 脂等。 又，樹脂製黏著劑亦可採用以乙烯乙酸乙烯酯樹脂或 聚烯烴樹脂爲主成分之熱金屬黏著材，例如板狀之熱金屬 黏著材時，將板狀之熱金屬黏著劑置於黏著材膠帶1間之 重疊部份上，以加熱器66對熱金屬黏著劑進行加熱使其 熔融後，再以冷卻使熱金屬黏著劑固化，實施黏著材膠帶 1間之連接。 使用於黏著材膠帶1之連接之樹脂製黏著劑，亦可從 熱硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑所構成之 群組中選取複數種來使用。 上述之實施形態時，使黏著材盤3a之黏著材膠帶1 之終端部30之基材9面、及新黏著材盤3之黏著材膠帶1 -89- 1322649 之始端部32之黏著劑11面互相重疊，並塗布樹脂製黏著 劑之熱硬化性樹脂來實施連接，然而，亦可反折黏著材盤 3a之黏著材膠帶1之終端部30，並以重疊黏著劑11面來 實施兩者之黏著後，再以熱硬化性樹脂固定。 其次，針對申請專利範圍第22〜24項記載之發明進 行說明。In the present embodiment, the resin-based adhesive 64 is exemplified by a thermosetting resin. However, the photocurable resin may be substituted for the thermosetting resin, and the curable resin may be cured by light irradiation such as ultraviolet rays to form an adhesive. The connection between the tapes 1. In this case, the photocurable resin may be a composition of a photopolymerization initiator which has an acrylic group or a methacryl group, or an aromatic diazo salt, a diallyl iodide salt, a phosphonium salt, or the like. Epoxy resin of light hardener, etc. Further, the resin adhesive may be a hot metal adhesive mainly composed of an ethylene vinyl acetate resin or a polyolefin resin, for example, a plate-shaped hot metal adhesive, and a plate-shaped hot metal adhesive is placed on the adhesive. On the overlapping portion between the tapes 1, the hot metal adhesive is heated by the heater 66 to be melted, and then the hot metal adhesive is solidified by cooling to bond the adhesive tape 1. The resin adhesive used for the connection of the adhesive tape 1 may be selected from a group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. In the above embodiment, the surface of the substrate 9 of the end portion 30 of the adhesive tape 1 of the adhesive sheet 3a and the adhesive 11 of the beginning portion 32 of the adhesive tape 1 - 89 - 1322649 of the new adhesive sheet 3 are provided. The thermosetting resin coated with a resin adhesive is applied to each other to be joined, but the terminal portion 30 of the adhesive tape 1 of the adhesive sheet 3a may be folded back, and the adhesive layer 11 may be overlapped. After the adhesion, it is fixed with a thermosetting resin. Next, the invention described in the claims 22 to 24 will be described.

這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶盤及黏著裝置相關。 其次，針對申請專利範圍第22〜24項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL〔 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從黏著材膠帶盤捲出之黏 著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基板 等，再以捲取盤捲取殘餘之基材。 -90- 1322649 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。These inventions relate to an adhesive tape for fixing an electronic component and a circuit substrate, or a circuit board, and an electrical connection between electrodes, in particular, relating to a disk-shaped adhesive tape disk and an adhesive device. . Next, the background art of the invention described in the claims 22 to 24 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, or a circuit between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the substrate side of the adhesive tape which is unwound from the adhesive tape is pressed against the circuit substrate by a heating and pressing head, and the residual substrate is taken up by a take-up reel. -90- 1322649 Next, when the adhesive tape of one of the adhesive tapes is used up, remove the used tray and the take-up tray of the take-up substrate, and pack the new take-up tray and the new adhesive tape. To the bonding device, and install the beginning of the adhesive tape on the take-up reel.

然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第22〜24項記載之發明的目的 ，係在提供一種黏著材膠帶盤、及黏著裝置，可使黏著材 膠帶盤之更換更爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第22〜24 項記載之發明之實施形態進行說明，首先，參照第22圖 -91 - 1322649 A〜C、第23圖、第4圖、及第5圖，針對申請專利範圍 第22〜24項記載之發明之第1實施形態進行說明。第22 圖A〜C係第1實施形態之黏著材膠帶盤圖，第22圖A 係黏著材膠帶盤的斜視圖，第22圖B係第22圖A之正面 圖，第22圖C係第22圖A之連結膠帶之平面圖，第23 圖係黏著裝置之黏著劑壓著步驟的槪略圖。However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 22 to 24 is to provide an adhesive tape tray and an adhesive device which can easily replace the adhesive tape and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in claim 22 to 24 will be described with reference to the drawings. First, reference is made to Figs. 22-91 - 1322649 A to C, 23, 4, and 5. In the drawings, the first embodiment of the invention described in the claims 22 to 24 will be described. Fig. 22A to Fig. 4C are diagrams showing the adhesive tape of the first embodiment, Fig. 22A is a perspective view of the adhesive tape tray, Fig. 22B is a front view of Fig. 22, and Fig. 22 is a 22 Figure A is a plan view of the bonding tape, and Figure 23 is a schematic view of the adhesive pressing step of the adhesive device.

如第22圖A所示，本實施形態之黏著材膠帶盤A具 有複數之黏著材膠帶之捲部（以下簡稱爲捲部）2、2a， 捲部2、2a之盤3、3a上分別捲繞著黏著材膠帶1。各盤 3、3a上配設著捲軸5、及配置於黏著材膠帶1之兩寬度 側之側板7。如第23圖所示，黏著材膠帶1係由基材9、 及塗布於基材9之一側面的黏著劑1 1所構成》 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部30、及 捲繞於另一方之捲部之黏著材膠帶（以下稱爲另一方之黏 著材膠帶）1之始端部32間，配設著用以連接兩者之連結 膠帶41。從一方之黏著材膠帶1之終端部30沿著盤3之 側板7之內側面配置著連結膠帶67，前述連結膠帶67會 卡止於側板7之上部之切口部份68而連接於另一方之黏 著材膠帶1之始端部32。 又，一方及另一方之黏著材膠帶1、及連結膠帶67之 連接部份，會標示著用以辨識連結膠帶67之標記69、70 ，以膠帶檢測手段（發光部7 1、受光部72 )檢測到標記 69、70時，會跳過連結膠帶67部份而不對連結膠帶67部 -92- 1322649 份實施壓著。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系β熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13係如As shown in Fig. 22A, the adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as rolls) 2, 2a of the adhesive tape, and the rolls 3, 3a of the rolls 2, 2a are respectively wound. Around the adhesive tape 1. Each of the disks 3, 3a is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Fig. 23, the adhesive tape 1 is composed of a base material 9 and an adhesive 1 1 applied to one side surface of the base material 9 in a plurality of winding portions 2 and 2a, and is wound around one of the wound portions. The end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape" 1) and the adhesive tape (hereinafter referred to as the other adhesive tape) 1 wound around the other roll portion 1 A connecting tape 41 for connecting the two is disposed. A connecting tape 67 is disposed from the end portion 30 of one of the adhesive tapes 1 along the inner side surface of the side plate 7 of the disk 3, and the connecting tape 67 is locked to the slit portion 68 at the upper portion of the side plate 7 to be connected to the other side. The beginning end portion 32 of the adhesive tape 1. Moreover, the connecting portions of the adhesive tape 1 and the connecting tape 67 of one of the other and the other are marked with the marks 69 and 70 for identifying the connecting tape 67, and the tape detecting means (the light-emitting portion 7 1 and the light-receiving portion 72) When the marks 69, 70 are detected, the portion of the bonding tape 67 is skipped without pressing the bonding tape 67 - 92 - 1322649 portions. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal-based β thermoplastic resin is represented by a styrene resin or a polyester resin. The thermosetting resin is represented by an epoxy resin, a vinyl ester resin, an acrylic resin, or an anthracene resin. Conductive particles 13 are dispersed in the adhesive 11. Conductive particles 13 are like

Au、Ag' Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、Metal particles such as Au, Ag' Pt, Ni, Cu, W, Sb, Sn, solder, etc.

或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述之導電層等而形成者。此 外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶盤A之使用方法 進行說明。如第23圖所示，將黏著材膠帶盤A、及捲取 -93- 1322649 盤〗7裝著至黏著裝置15’經由導引銷22將一方之黏著材 膠帶1之始端部32裝設至捲取盤17,並捲出黏著材膠帶 】（第23圖中之箭頭E)。其次’將黏著材膠帶1配置於 電路基板21上，利用配置於兩盤3、17間之加熱加壓頭 19從基材9側實施黏著材膠帶1之壓接，將黏著劑u壓 著至電路基板21。其後，將基材9捲取至捲取盤17。Or carbon, graphite, or the like may be formed by covering the above-mentioned conductive layer or the like with the above-mentioned materials and non-conductive glass, ceramics, plastics, and the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape tray A of the present embodiment will be described. As shown in Fig. 23, the adhesive tape tray A and the take-up -93- 1322649 tray 7 are attached to the adhesive device 15' via the guide pin 22 to attach the beginning end portion 32 of one of the adhesive tapes 1 to Roll up the tray 17 and roll out the adhesive tape] (arrow E in Fig. 23). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3 and 17, and the adhesive u is pressed to Circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17.

上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上’如第4圖所示，在壓著至電路基板21 上之黏著劑1 1上配置配線電路（或電子構件）2 3，必要 時’可將例如聚四氟乙烯材24當做緩衝材，以加壓加壓 頭19對電路基板21實施配線電路23之加熱加壓。利用 此方式’可連接電路基板21之電極21a及配線電路23之 電極23a及奁連接。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 φ 大’有時會對PDP之周圍全體實施壓著，連接部份會較多 ，一次使用之黏著劑11的使用量會遠大於傳統上之使用 量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦會變 多’捲繞於盤3上之黏著材膠帶1在相對較短之時間內會 被捲取至捲取盤17。 一方之黏著材膠帶1全部捲出時，連結膠帶67會脫 離切口部份68，接著，會捲出另一方之黏著材膠帶1。本 實施形態時’因爲在一方之黏著材膠帶1之終端部30及 另一方之黏著材膠帶1之始端部32之間，具有用以連接 -94- 1322649 兩者之連結膠帶67，故一方之黏著材膠帶1全部捲出時， 會接著開始捲出另一方之黏著材膠帶1。因此，無需實施 在一方之黏著材膠帶1之全部捲出後將新黏著材膠帶1裝 設至捲取盤17之作業，故可提高電子機器之生產效率。After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. Formally connected as shown in Fig. 4, a wiring circuit (or electronic component) 23 is disposed on the adhesive 1 1 pressed onto the circuit substrate 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a buffer. The material is subjected to heating and pressurization of the wiring circuit 23 on the circuit board 21 by the pressurizing pressurizing head 19. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected to each other. According to the PDP of the adhesive tape 1 of the present embodiment, the size of the PDP of the adhesive tape 1 is larger than φ. Sometimes the entire periphery of the PDP is pressed, and the number of the connecting portions is large, and the amount of the adhesive 11 used at one time is much larger than that of the PDP. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased. The adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time. When one of the adhesive tapes 1 is completely unwound, the connecting tape 67 will be separated from the slit portion 68, and then the other adhesive tape 1 will be unwound. In the present embodiment, "the connection tape 67 for connecting both -94 to 1322649 is provided between the end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the other adhesive tape 1 . When the adhesive tape 1 is completely unwound, it will then start to roll out the other adhesive tape 1. Therefore, it is not necessary to carry out the operation of attaching the new adhesive tape 1 to the take-up reel 17 after all of the adhesive tape 1 has been unwound, so that the production efficiency of the electronic device can be improved.

又，如第23圖所示，黏著裝置15具有一對發光部71 及受光部72，用以實施連結膠帶67之光學檢測。用以連 接一方之黏著材膠帶1及另一方之黏著材膠帶1之兩者的 連結膠帶67之兩端上，標示著黑色標記69、70。發光部 71會對黏著材膠帶1連續發出雷射光，受光部72則會接 收其反射光，並將檢測信號傳送至控制裝置79。受光部 72會接收到連結膠帶67之兩端之標記69、70之反射光， 並將該檢測信號傳送至控制裝置79。 接收到檢測信號之控制裝置7 9，會對用以驅動黏著裝 置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅動 器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅動 器施加之脈衝數實施旋轉，使兩盤3、17以比通常速度更 快之速度移動，並使黏著材膠帶1朝捲出方向移動對應連 結膠帶67之長度的距離》 利用此方式，另一方之黏著材膠帶1會自動捲出至加 熱加壓頭19之位置，可省略以使另一方之黏著材膠帶1 之始端部32位於加熱加壓頭19之位置而捲出連結膠帶67 之作業。 又，因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤17之更換次數，而有良好之 -95- 1322649 作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶盤 A之製造方法進行說明》Further, as shown in Fig. 23, the adhesive device 15 has a pair of light-emitting portions 71 and a light-receiving portion 72 for performing optical detection of the connecting tape 67. Black marks 69, 70 are indicated on both ends of the connecting tape 67 for connecting both the adhesive tape 1 of one side and the other adhesive tape 1 of the other. The light-emitting portion 71 continuously emits laser light to the adhesive tape 1, and the light-receiving portion 72 receives the reflected light and transmits the detection signal to the control device 79. The light receiving unit 72 receives the reflected light of the marks 69 and 70 connecting the both ends of the tape 67, and transmits the detection signal to the control device 79. The control means 7 for receiving the detection signal outputs a control signal to the motors for driving the two disks 3, 17 of the bonding device 15, and the motor driver starts to output a driving pulse to the motor. Next, the motor rotates in accordance with the number of pulses applied by the motor driver, causing the two disks 3, 17 to move at a faster speed than the normal speed, and moving the adhesive tape 1 in the unwinding direction by the distance corresponding to the length of the connecting tape 67. In this manner, the other adhesive tape 1 is automatically unwound to the position of the heating and pressing head 19, and can be omitted so that the other end portion 32 of the adhesive tape 1 is located at the position of the heating and pressing head 19 to be unscrewed. The operation of the tape 67. Further, since the take-up reel 17 only winds up the substrate 9, it is possible to take up a plurality of adhesive tape discs and reduce the number of replacements of the take-up reel 17, and has a good work efficiency of -95 - 1322649. Here, the method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 5

在從捲出機25捲出之基材（separat〇r) 9上，以塗布 機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾燥 爐29實施乾燥後，以捲取機31捲取原始材料。被捲取之 黏著材膠帶之原始材料，以切割機33切成特定寬度並捲 取至捲軸後，從兩側將側板7 ' 7裝著於捲軸上，或者， 捲取至附側板之捲軸上’將其和除濕材一起綑包，實施低 溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對申請專利範圍第2 2〜2 4項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第24圖所示之第2實施形態時，因爲連結膠帶67之 寬度T小於前後之黏著材膠帶1之寬度W，故可辨識連結 膠帶67。又，黏著裝置15上，夾著黏著材膠帶1之相對 位置上配設著和第1實施形態相同之發光部及受光部。此 時，利用受光部接收透射連結膠帶67之寬度較狹部份的 雷射光來辨識連結膠帶67。 第25圖所示之第3實施形態時，連結膠帶67會形成 用以辨識連結膠帶67之多數孔53。此時，亦可利用受光 部接收透射連結膠帶67之孔53的雷射光來辨識連結膠帶 67 〇 -96- 1322649 第26圖所示之第4實施形態時，並未利用連結膠帶 67實施黏著材膠帶1間之連接，而在一方之黏著材膠帶1 全部捲出時，捲出另一方之黏著材膠帶1使其捲附於盤17 上來實施黏著材膠帶1之更換。此時，因爲無需將新黏著 材膠帶盤裝著至黏著裝置，而只需較少之新黏著材膠帶盤 之更換作業，故可提高電子機器之生產效率。On the substrate (separat〇r) 9 which is unwound from the unwinding machine 25, an adhesive obtained by mixing a resin and conductive particles is applied by a coater 27, dried in a drying furnace 29, and then wound up by a coiler 31. Take the original material. The original material of the adhesive tape which is taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plate 7'7 is attached to the reel from both sides, or is taken up to the reel of the side plate. 'Bundle it together with the dehumidifying material, and manage it at a low temperature (-5 °C to -10 °C) and ship it. In the following, the other embodiments of the invention described in the second and second aspects of the patent application are described. In the embodiments described below, the same reference numerals will be given to the same parts as the above embodiments, and the details of the parts will be omitted. Note that the following description is mainly based on differences from the above embodiment. In the second embodiment shown in Fig. 24, since the width T of the connecting tape 67 is smaller than the width W of the adhesive tape 1 before and after, the connecting tape 67 can be recognized. Further, the light-emitting portion and the light-receiving portion which are the same as those of the first embodiment are disposed on the adhesive device 15 at a position opposite to the adhesive tape 1. At this time, the light-receiving portion receives the laser light of the narrow portion of the width of the transmission connecting tape 67 to recognize the connecting tape 67. In the third embodiment shown in Fig. 25, the connecting tape 67 forms a plurality of holes 53 for identifying the connecting tape 67. At this time, the light receiving unit can receive the connecting tape 67 by using the laser beam of the hole 53 of the transmission connecting tape 67. When the fourth embodiment shown in Fig. 26 is recognized, the bonding material is not used for the bonding material. When the adhesive tape 1 is completely unwound, the other adhesive tape 1 is rolled up and attached to the disk 17 to perform the replacement of the adhesive tape 1. At this time, since the new adhesive tape is not required to be attached to the adhesive device, less replacement of the new adhesive tape is required, so that the production efficiency of the electronic device can be improved.

申請專利範圍第22〜24項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第22〜24項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之第1及第2實施形態時，捲部2、2 a之 個數並無任何限制，而可以爲任何個數。 第1至第3實施形態係以光學方式檢測連結膠帶67， 然而，亦可在連結膠帶6 7上附加磁性膠帶並以磁性感測 器來進行檢測。 其次，針對申請專利範圍第2 5〜2 8項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 。又，係關於在將半導體元件（晶片）黏著•固定至引線 框架之固定用支持基板或引線框架之晶片、或半導體元件 載置用支持基板之半導體裝置上所使用之黏著材膠帶，尤 其是，和捲成盤狀之黏著材膠帶盤、黏著裝置、及黏著材 膠帶之連接方法相關。 其次，針對申請專利範圍第2 5〜2 8項記載之發明之 -97- 1322649 背景技術進行說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、LOC膠帶、晶粒結著膠帶、微 BGA · CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。The invention described in the claims 22 to 24 is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first and second embodiments described above, the number of the rolls 2 and 2a is not limited, and may be any number. In the first to third embodiments, the connecting tape 67 is optically detected. However, a magnetic tape may be attached to the connecting tape 67 and detected by a magnetic sensor. Next, the invention described in the claims 25 to 28 will be described. These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes between the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the method of connecting the disc-shaped adhesive tape, the adhesive device, and the adhesive tape. Next, the background art of -97- 1322649 of the invention described in the Patent Application No. 25-28 is explained. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Further, the adhesive tape is also applied to a lead fixing tape of a lead frame, a LOC tape, a die-bonding tape, an adhesive film such as a micro BGA/CSP, etc., and the purpose thereof is to improve the productivity and reliability of the entire semiconductor device.

日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統電極連接用黏著材膠帶之寬度爲1〜3mm程 度，捲取至盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出之 黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基 板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上》 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 -98- 1322649 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題》Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the adhesive tape for the conventional electrode connection is 1 to 3 mm, and the length of the tape taken up to the disk is 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape tape around which the adhesive tape is wound is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive side of the adhesive tape which is unwound from the self-adhesive tape is pressed against the circuit board by a heating and pressing head, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. And the beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, with the enlargement of the panel image of the PDP, the adhesion area of the circuit board is also increased, and the amount of the adhesive used at one time is also increased. . Also, because of the expansion of the use of the adhesive, the amount of the adhesive used is also increased from -98 to 1322649. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, so there is a problem that the production efficiency of the electronic machine cannot be improved.

針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第25〜28項記載之發明的目的 ，係在提供一種黏著材膠帶盤、黏著裝置、及連接方法， 可使黏著材膠帶盤之更換更爲簡單，而提高電子機器之生 產效率。 其次，參照附錄圖面，針對申請專利範圍第25〜28 項記載之發明之實施形態進行說明，首先，參照第27圖 A〜C、第28圖、第4圖、第29圖、及第5圖，針對申請 專利範圍第25〜28項記載之發明之第1實施形態進行說 明。第27圖A〜C係第1實施形態之黏著材膠帶盤圖，第 27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 ，第28圖係黏著裝置之黏著劑壓著步驟的槪略圖，第29 -99- 1322649 圖係PDP之黏著劑之使用狀態的斜視圖。 本實施形態之黏著材膠帶盤A具有複數之黏著材膠帶 1之捲部（以下稱爲捲部）2、2a，捲部2、2a具有捲繞著 黏著材膠帶1之盤3、3a。各盤3、3a上配設著捲軸5、 及配置於黏著材膠帶1之兩寬度側之側板7。如第28圖所 示，黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in claim 25 to 28 is to provide an adhesive tape tray, an adhesive device, and a connection method, which can make the replacement of the adhesive tape tray easier and improve the production of the electronic device. effectiveness. Next, an embodiment of the invention described in the claims 25 to 28 will be described with reference to the attached drawings. First, reference is made to Figs. 27A to A, 28, 4, 29, and 5. In the drawings, the first embodiment of the invention described in the claims 25 to 28 will be described. 27A to C are the adhesive tape disk diagrams of the first embodiment, and Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27B is a front view of Fig. 27, and Fig. 27C is the 27 is a cross-sectional view of the connecting portion of Fig. A, and Fig. 28 is a schematic view showing the adhesive pressing step of the adhesive device, and the 29-99-1322649 is a perspective view showing the state of use of the adhesive of the PDP. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter referred to as rolls) 2, 2a of the adhesive tape 1, and the rolls 2, 2a have the disks 3, 3a around which the adhesive tape 1 is wound. Each of the disks 3, 3a is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9.

複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部30、及 捲繞於另一方之捲部2a之黏著材膠帶（以下稱爲另一方 之黏著材膠帶）1之始端部32係以卡止具76實施連接》 卡止具76係例如剖面略呈3字形之卡止銷，使一方之黏 著材膠帶1之終端部30及另一方之黏著材膠帶1之始端 部32互相重疊，將卡止銷插入此重疊部份來連接兩者。 其次，本實施形態時，連接部份74如第27圖C所示 ，以卡止具76連接終端部30及始端部32之後，將連接 部份74朝膠帶之縱向反折180度，使黏著材膠帶1覆蓋 卡止具7 6。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏著劑1 1係熱可塑性樹脂、熱硬化性樹脂' 或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 -100- 1322649 苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹脂系 則以環氧樹脂系 '壓克力樹脂系、及矽樹脂系爲代表。Among the plurality of rolls 2 and 2a, the end portion 30 of the adhesive tape (hereinafter referred to as "adhesive tape") 1 wound around one of the rolls 2 and the roll wound around the other roll 2a The beginning end portion 32 of the tape (hereinafter referred to as the other adhesive tape) is connected by the locking tool 76. The card holder 76 is, for example, a locking pin having a substantially three-shaped cross section, so that one of the adhesive tapes 1 is The terminal portion 30 and the other end portion 32 of the other adhesive tape 1 overlap each other, and the locking pin is inserted into the overlapping portion to connect the two. Next, in the present embodiment, as shown in FIG. 27C, the connecting portion 74 is connected to the end portion 30 and the starting end portion 32 by the locking member 76, and the connecting portion 74 is folded back 180 degrees toward the longitudinal direction of the tape to adhere. The material tape 1 covers the locking device 7 6 . The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and ruthenium treated PET (polyethylene terephthalate) in terms of strength and peelability of the adhesive to the different conductive material. ), etc., however, is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin' or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type and a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type "acrylic resin type" and an enamel resin type.

黏著劑11內亦可分散著導電粒子13。導電粒子13係 如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶盤之使用方法進 行說明。如第28圖所示，將黏著材膠帶盤A、及捲取盤 17裝著至黏著裝置15，經由導引銷22將一方之黏著材膠 帶1之始端部32裝設至捲取盤17，並捲出黏著材膠帶1 (第28圖中之箭頭E)。其次，將黏著材膠帶1配置於 電路基板21上，以配置於兩盤3、17間之加熱加壓頭19 從基材9側實施黏著材膠帶1之壓接，將黏著劑11壓著 至電路基板21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 1322649 著劑11上配置配線電路（或電子構件）23，可將聚四氟 乙烯材24當做緩衝材，以加熱加壓頭19對電路基板21 實施配線電路23之加熱加壓。利用此方式，可連接電路 基板21之電極21a及配線電路23之電極23a«Conductive particles 13 may also be dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A polymer core material such as plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape tray of the present embodiment will be described. As shown in Fig. 28, the adhesive tape tray A and the take-up reel 17 are attached to the adhesive device 15, and the start end portion 32 of one of the adhesive tapes 1 is attached to the take-up reel 17 via the guide pin 22. And roll out the adhesive tape 1 (arrow E in Figure 28). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and the adhesive 11 is pressed thereto. Circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the adhesive 132649 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 can be used as a cushioning material to heat and pressurize. The head 19 applies heat and pressure to the wiring circuit 23 to the circuit board 21. In this manner, the electrode 21a of the circuit substrate 21 and the electrode 23a of the wiring circuit 23 can be connected.

如第29圖之利用本實施形態之黏著材膠帶！之PDP 26之連接部份所示，黏著劑1丨係壓著於PDP 26之周圍 全體’故一次使用之黏著劑11之使用量明顯遠大於傳統 上之使用量。因此’黏著材膠帶1之使用量亦會變多，捲 繞於盤3、3a上之黏著材膠帶1在相對較短之時間內會被 捲取至捲取盤17。 本實施形態時’一方之黏著材膠帶1全部捲出時，連 接部份74會脫離切口 75，接著，會捲出另一方之黏著材 膠帶1 (第27圖B )。本實施形態時，係以卡止具76連 接一方之黏著材膠帶1之終端部30及另一方之黏著材膠 帶1之始端部32’ 一方之黏著材膠帶1全部捲出時，會接 φ 著開始捲出另一方之黏著材膠帶1。因此，無需實施在一 方之黏著材膠帶1之全部捲出後將新黏著材膠帶1裝設至 捲取盤17之作業，故可提高電子機器之生產效率。又， 連接部份74上因以黏著材膠帶1覆蓋卡止具76，故外觀 良好’同時’可防止連接部份74之卡止具76接觸黏著材 膠帶1而傷害到黏著材膠帶1。 又’如第28圖所示’黏著裝置15具有當做連接部檢 測感測器4 7使用之厚度檢測感測器，實施連接部份7 4之 光學檢測’使加熱加壓頭1 9跳過連接部份7 4。一方之黏 -102-Use the adhesive tape of this embodiment as shown in Fig. 29! As shown in the connection portion of the PDP 26, the adhesive 1 is pressed around the entire PDP 26, so the amount of the adhesive 11 used at one time is significantly larger than that of the conventional use. Therefore, the amount of the adhesive tape 1 used is also increased, and the adhesive tape 1 wound around the discs 3, 3a is taken up to the take-up reel 17 in a relatively short period of time. In the present embodiment, when all of the adhesive tape 1 is unwound, the connecting portion 74 is separated from the slit 75, and then the other adhesive tape 1 is unwound (Fig. 27B). In the present embodiment, when the end portion 30 of the adhesive tape 1 to which the locking device 76 is attached and the adhesive tape 1 of the other end portion 32' of the other adhesive tape 1 are all unwound, the φ is Start rolling out the adhesive tape 1 on the other side. Therefore, it is not necessary to carry out the operation of attaching the new adhesive tape 1 to the take-up reel 17 after all of the adhesive tape 1 has been unwound, so that the production efficiency of the electronic device can be improved. Further, since the engaging portion 76 is covered with the adhesive tape 1 on the connecting portion 74, the appearance is good 'at the same time', and the engaging member 76 of the connecting portion 74 is prevented from coming into contact with the adhesive tape 1 to damage the adhesive tape 1. Further, as shown in Fig. 28, the "adhesive device 15 has a thickness detecting sensor used as the connecting portion detecting sensor 47, and the optical detecting of the connecting portion 74 is performed" so that the heating and pressing head 19 is skipped. Part 7 4. Sticky to one side -102-

1322649 著材膠帶1及另一方之黏著材膠帶1之連接部份 度，如第27圖C所示，會大於黏著材膠帶1之 檢測不同厚度來辨識連接部份74。厚度檢測感測 隨時檢測黏著材膠帶1之厚度，並將檢測信號傳 裝置79。 接收到檢測信號之控制裝置79，會對用以驅 置15之兩盤3、1 7之馬達輸出控制信號，利用 器開始對馬達輸出驅動脈衝。其次，馬達會對應 器施加之脈衝數實施旋轉，使兩盤3、17以比通 快之速度旋轉，並使黏著材膠帶1朝捲出方向移 接部份74之搬運方向之長度的特定距離。 利用此方式，另一方之黏著材膠帶1會移動 壓頭19之位置，故可防止一方及另一方之黏著 之連接部份74移至加熱加壓頭1 9之位置並執行 之問題。又，至連接部份41通過加熱加壓頭19 自動地將一方之黏著材膠帶1捲取至捲取盤17, 捲取之麻煩。 又，利用厚度檢測感測器4 7辨識連接部份74 部41a及後端部41b，並只避開連接部份74，則可 用黏著材膠帶1。 又’因爲捲取盤17只會捲取基材9，故可捲取 著材膠帶盤份而減少捲取盤17之更換次數，而有 作業效率。 此處，參照第5圖’針對本實施形態之黏著材 74的厚 :度，以 ! 47會 :至控制 |黏著裝 達驅動 達驅動 速度更 對應連 加熱加 膠帶1 著動作 止，會 可省略 之前端 有效利 數個黏 良好之 膠帶1 -103- 1322649 之製造方法進行說明。1322649 The connecting portion of the tape 1 and the other adhesive tape 1 is, as shown in Fig. 27C, the thickness of the adhesive tape 1 is greater than the thickness of the adhesive tape 1 to identify the connecting portion 74. Thickness Detection Sensing The thickness of the adhesive tape 1 is detected at any time, and the detection signal is transmitted to the device 79. The control means 79, which receives the detection signal, outputs a control signal to the motor for driving the two disks 3, 17 of 15, and the driver starts to output a drive pulse to the motor. Next, the motor rotates by the number of pulses applied by the counterpart, so that the two discs 3, 17 are rotated at a faster speed and the adhesive tape 1 is moved in the unwinding direction by a specific distance of the length of the conveying direction of the portion 74. In this manner, the other adhesive tape 1 moves the position of the ram 19, so that the bonding portion 74 of one and the other can be prevented from moving to the position of the heating head 19 and performing the problem. Further, the attachment portion 41 automatically winds one of the adhesive tapes 1 to the take-up reel 17 by the heating and pressing head 19, which is troublesome to take up. Further, the thickness detecting sensor 47 recognizes the connecting portion 74 portion 41a and the rear end portion 41b, and only avoids the connecting portion 74, and the adhesive tape 1 can be used. Further, since the take-up reel 17 only winds up the substrate 9, the tape of the tape can be taken up to reduce the number of replacements of the take-up reel 17, and work efficiency is obtained. Here, referring to Fig. 5', the thickness of the adhesive material 74 of the present embodiment is as follows: to the control|adhesive|adhesive loading drive speed, the driving speed is more corresponding to the heating and the tape 1 operation, and may be omitted. The manufacturing method of the adhesive tape 1 -103 - 1322649 which is effective at the front end is described.

在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布樹脂及導電粒子13混合之黏著劑，並以乾燥爐 29實施乾燥後’以捲取機31捲取原始材料。被捲取之黏 著材膠帶之原始材料’以切割機33切成特定寬度並捲取 至捲軸後’從兩側將側板7、7裝著於捲軸上，將其和除 濕材一起綑包’實施低溫（-5 t：〜-10 t)之管理並進行出 貨。 其次’針對申請專利範圍第25〜28項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第30圖所示之第2實施形態時，未使用具有複數捲 部2、2a之黏著材膠帶盤a，而使用具有1個捲部之黏著 材膠帶盤2c。此時，黏著材膠帶1係捲繞於捲取盤17, 當一方之黏著材膠帶1露出結束標記28時，爲了將一方 之黏著材膠帶盤2b更換至新黏著材膠帶盤2c，而連接一 方之黏著材膠帶1之終端部30、及另一方之黏著材膠帶1 之始端部32。 此時，亦利用連接部檢測手段之厚度檢測感測器77 檢測連接部份74，而使加熱加壓頭1 9避開連接部份74。 申請專利範圍第25〜28項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第25〜28項 記載之發明之要旨的範圍內，可實施各種變形。 -104- 例如，上述之第1及第2實施形態時，用以連接黏著 材膠帶1間之卡止具76並未限定爲卡止銷，其方法亦可 以橫剖面略呈3字形之可彈性變形之夾子來夾住並固定兩 者之重疊部份，或者，亦可以橫剖面略呈3字形之金屬片 夾住兩者之重疊部份，並從重疊部份之兩面壓扁夾持片來 連接兩者。 第1及第2實施形態係利用厚度檢測感測器47檢測 連接部份74之厚度來辨識連接部份74，然而，並不限於 此，亦可利用透射率檢測感測器來辨識連接部份74、或利 用 CCD攝影機使連接部份之表面呈現於監視畫面並以圖 素之濃淡比較來檢測連接部份。 第31圖‘A、第31圖B、第32圖A〜C係用以實施引 線框架之固定用支持基板、半導體元件載置用支持基板、 或引線框架之晶片和半導體元件之連接之黏著材膠帶當中 ，將半導體元件黏著·固定於引線框架之固定用支持基板 及引線框架之LOC ( Lead on Chip)構造之1實例。 實施厚度之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25；am之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏著 材膠帶，而可得到第31圖B所示之LOC構造之半導體裝 置。將第31圖A所示之黏著材膠帶，以第32圖A〜C所 示之黏著裝置之冲切模具87(公模（凸部）95、母模（凹 部）96 )冲切成細長形，例如，在厚度0.2mm之鐵-鎳合 金製引線框架上，以400°C、3MPa之壓力、3秒鐘之加壓 -105- 1322649On a substrate 9 which is unwound from the unwinding machine 25, an adhesive mixed with a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, and the raw material is taken up by a coiler 31. . The original material of the taken up adhesive tape is cut into a specific width by the cutter 33 and taken up to the reel. 'The side panels 7, 7 are attached to the reel from both sides, and they are bundled together with the dehumidifying material. Low temperature (-5 t: ~-10 t) is managed and shipped. In the following, the other embodiments of the invention described in the claims 25 to 28 are described, and the same reference numerals are given to the same parts as those in the above-described embodiments, and the detailed description thereof will be omitted. The implementation is different. In the second embodiment shown in Fig. 30, the adhesive tape tray 2c having the plurality of winding portions 2, 2a is not used, and the adhesive tape tray 2c having one winding portion is used. At this time, the adhesive tape 1 is wound around the take-up reel 17, and when one of the adhesive tapes 1 is exposed to the end mark 28, one of the adhesive tapes 2b is replaced with the new adhesive tape 2c. The end portion 30 of the adhesive tape 1 and the beginning end portion 32 of the other adhesive tape 1 are formed. At this time, the thickness detecting sensor 77 of the connecting portion detecting means also detects the connecting portion 74, so that the heating pressurizing head 19 avoids the connecting portion 74. The invention described in the claims 25 to 28 is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the first and second embodiments described above, the locking device 76 for connecting the adhesive tape 1 is not limited to the locking pin, and the method can also be slightly elastic in cross section. The deformed clip is used to clamp and fix the overlapping portions of the two, or a three-shaped metal piece having a cross section may be sandwiched between the overlapping portions, and the holding piece may be flattened from both sides of the overlapping portion. Connect the two. In the first and second embodiments, the thickness detecting portion 47 detects the thickness of the connecting portion 74 to identify the connecting portion 74. However, the present invention is not limited thereto, and the transmittance detecting sensor may be used to identify the connecting portion. 74. Or use a CCD camera to display the surface of the connected portion on the monitor screen and detect the connected portion by comparing the shades of the pixels. FIG. 31A, FIG. 31B, and FIG. 32A to C are adhesive materials for fixing a support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a wafer of a lead frame and a semiconductor element. Among the tapes, an example of a LOC (Lead on Chip) structure in which a semiconductor element is adhered and fixed to a fixing support substrate of a lead frame and a lead frame. The adhesive film layer 80 having a thickness of 25; am a polyaldimine adhesive layer or the like having both sides of the support film 78 having a thickness of the surface treated polyimine film has the constitution as shown in FIG. 31A. The adhesive tape is used to obtain the semiconductor device of the LOC structure shown in FIG. 31B. The adhesive tape shown in Fig. 31A is punched into a slender shape by a punching die 87 (male die (protrusion) 95, mother die (recess) 96) of the adhesive device shown in Figs. 32A to C. For example, on a lead frame of iron-nickel alloy having a thickness of 0.2 mm, with a pressure of 400 ° C, 3 MPa, and a pressure of 3 seconds - 105 - 1322649

實施壓著，形成0.2mm間隔、〇.2mm寬度之內引線，製成 附有半導體用黏著膜之引線框架。其次，在其他步驟實施 350°C之溫度、3MPa之壓力、3秒鐘之加壓，將半導體元 件壓著至此附有半導體用黏著膜之引線框架之黏著劑層面 ’其後，以金線實施引線框架及半導體元件之絲焊，以連 續成形使用環氧樹脂成形材料等密封材實施密封，得到第 31圖B所不之半導體裝置。第31圖A、B中，81係以黏 著材膠帶冲切所得之半導體用黏著膜，82係半導體元件， 83係引線框架，84係密封材，85係焊絲，86係匯流排條 。第32圖A、B、C係黏著裝置，第32圖a'b中，87 係冲切模具’ 8 8係引線框架搬運部，6 1係黏著劑膠帶冲 切貼附部’ 90係加熱器部，91係黏著材膠帶盤（黏著材 膠帶捲出部），92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第32圖C中，94係黏著材 膠帶（半導體用黏著膜），95係公模（凸部），96係母 模（凹部）’ 97係膜壓板。黏著材膠帶92會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部8 9冲切成細長形且黏著至引線框架之引線部 份’將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體兀件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接•黏著。黏著材膠帶只單純用 -106- 1322649 於黏著•固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑’若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第29〜34項記載之發明進 行說明。The bonding was carried out to form a lead wire having a width of 0.2 mm and a width of 〇. 2 mm to form a lead frame with an adhesive film for a semiconductor. Next, in another step, a temperature of 350 ° C, a pressure of 3 MPa, and a pressurization of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the adhesive film for semiconductors, and then the gold wire is applied. Wire bonding of the lead frame and the semiconductor element is performed by sealing with a sealing material such as an epoxy resin molding material for continuous molding, and a semiconductor device according to FIG. 31B is obtained. In Figs. 31A and AB, 81 is an adhesive film for a semiconductor obtained by die-bonding tape, an 82-type semiconductor element, an 83-type lead frame, an 84-series sealing material, an 85-series welding wire, and an 86-series bus bar. Fig. 32A, B, and C are adhesion devices, and in Fig. 32 a'b, 87 is a die-cutting mold '8 8 series lead frame conveying portion, and 6 1 is an adhesive tape punching and attaching portion' 90-type heater Department, 91 series adhesive tape tape (adhesive tape roll-out part), 92-series adhesive tape (semiconductor adhesive film), 93-series adhesive tape roll-out roller. Further, in Fig. 32C, the 94-series adhesive tape (adhesive film for semiconductor), the 95-type male mold (protrusion), and the 96-series male mold (concave portion) '97-type film press plate. The adhesive tape 92 is continuously unwound from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is taken out as a lead frame with a semiconductor adhesive film and carried out from the lead frame transport unit. The adhesive tape obtained by die cutting is taken out from the roller 93 by the adhesive tape. In the same manner as described above, the semiconductor element is bonded to the semiconductor chip mounting support substrate by an adhesive tape. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame are carried out in the same manner. Adhesive tape is only used with -106- 1322649. When it is adhered and fixed, it can be contacted between electrodes or electrically connected with conductive particles, and the adhesive to be used for the purpose can be used. It will consist solely of adhesives. Next, the invention described in claim 29 to 34 will be described.

這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著劑膠帶 ，尤其是，和捲成盤狀之黏著劑膠帶、黏著劑膠帶之製造 方法、及黏著劑膠帶之壓著方法相關。 其次，針對申請專利範圍第29〜34項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲5 0m程度，黏著劑膠帶被從盤捲出並將 黏著劑壓著至電路基板等後，即不再使用。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又’因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此’上述之電子機器之製造工廠之捲繞著黏著劑 -107- 1322649 膠帶之盤的更換更爲頻繁，因爲新盤之更換十分麻煩，故 有無法提高電子機器之生產效率之問題。These inventions relate to an adhesive tape for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, in particular, and an adhesive tape or an adhesive tape which is wound into a disk shape. The manufacturing method and the pressing method of the adhesive tape are related. Next, the background art of the invention described in claim 29 to 34 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. After the adhesive tape is rolled out from the disk and the adhesive is pressed onto the circuit substrate, etc., reuse. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, the use of adhesives has also increased due to the expansion of the use of adhesives. Therefore, the replacement of the adhesive tape of the above-mentioned electronic machine manufacturing factory -107 - 1322649 tape is more frequent, because the replacement of the new disk is troublesome, and there is a problem that the production efficiency of the electronic device cannot be improved.

針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膜的壓力會升高，而可能從 黏著劑膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著劑膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第2 9〜3 4項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在無需增加黏著劑膠帶之捲數 的情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第2 9〜3 4 項記載之發明之實施形態進行說明，首先，參照第3 3圖 A、B、第3圖、第4圖、第34圖、第5圖、第35圖，針 對申請專利範圍第29〜34項記載之發明之第〗實施形態 進行說明。第33圖A及B係黏著劑膠帶圖，第33圖A 係捲繞著黏著劑膠帶之盤之斜視圖，第3 3圖B係第3 3圖 A之A-A剖面圖’第34圖係PDP之黏著劑之使用狀態的 斜視圖，第3 5圖係在基材上塗布黏著劑之步驟的剖面圖 -108- 1322649 本實施形態之黏著劑膠帶1係捲繞於盤3，盤3上配 設著捲軸5及配置於黏著劑膠帶1之兩寬度側之側板7。 本實施形態時，黏著劑膠帶1之長度約爲50m'寬度W約 爲 1 0mm 〇 黏者劑膠帶1係由基材9、及塗布於基材9上之黏著 劑11所構成’基材9上以具有間隔之方式配置著每條寬 度爲0.5mm之5條黏著劑11。In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the adhesive film wound into a tape shape may increase, and may bleed out from both sides of the adhesive tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the Patent Application No. 29-34 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without adding an adhesive tape. The amount of adhesive is increased in the case of the number of rolls. Next, an embodiment of the invention described in the Patent Application No. 29-34 will be described with reference to the attached drawings. First, referring to FIG. 3, FIG. 3, FIG. 3, FIG. 3, FIG. 4, FIG. In the fifth and thirty-fifth embodiments, the embodiment of the invention described in the claims 29 to 34 will be described. Fig. 33A and B are adhesive tape diagrams, Fig. 33A is a perspective view of a disk wrapped with an adhesive tape, and Fig. 3B is a sectional view of the AA section of Fig. 3A. Fig. 34 is a PDP FIG. 3 is a cross-sectional view showing a step of applying an adhesive to a substrate. FIG. 3 is a cross-sectional view of a step of applying an adhesive to a substrate. The adhesive tape 1 of the present embodiment is wound around a disk 3 and is provided on the disk 3. A reel 5 and side plates 7 disposed on both width sides of the adhesive tape 1 are provided. In the present embodiment, the adhesive tape 1 has a length of about 50 m' and a width W of about 10 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to the substrate 9 to form a substrate 9. Five adhesives 11 each having a width of 0.5 mm are disposed in a spaced manner.

從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）'聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13係如The substrate 9 should be made of OPP (extended polypropylene) 'polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, a vinyl ester type resin, an acrylic resin type, or an anthracene resin type. Conductive particles 13 are dispersed in the adhesive 11. Conductive particles 13 are like

Au、Ag、Pt' Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或併用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 -109- 1322649 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。Metal particles such as Au, Ag, Pt'Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, etc., may also be in the above-mentioned materials and/or non-conductive glass, ceramics, plastics, and the like. The material or the like is formed by covering the aforementioned conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or a combination of conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation by heating, pressurization or pressurization may occur, so that the distance between the electrodes after the connection is -109 - 1322649. Reduced, the area of contact with the circuit can be increased when connected, and the reliability can be improved. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member.

其次，針對本實施形態之黏著劑膠帶之使用方法進行 說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著裝置 15，將捲繞於盤3之黏著劑膠帶1之前端裝設至空盤17, 並捲出黏著劑膠帶1(第3圖中之箭頭E)。其次，在電 路基板21上配置黏著劑膠帶1，以配置於兩盤3、17間之 加熱加壓頭19從基材9側實施將黏著劑膠帶1之壓接， 將1條份之黏著劑1 1壓著至電路基板。其後，將殘餘黏 著劑11和基材9 一起捲取至空盤17。 上述之壓著後（暫時連接），實施電路基板21之電 極及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接上，在壓著於電路基板21上之黏著劑11上 配置配線電路（或電子構件）2 3，必要時，可將例如聚四 氟乙烯材24當做緩衝材，以加熱加壓頭19對電路基板21 實施配線電路23之加熱加壓。利用此方式，可連接電路 基板21之電極21a及配線電路23之電極23a。 如第3 4圖所示’利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對Pdp之周圍全體實施黏著，— 次使用之黏著劑11之使用量會遠大於傳統之使用量。因 此，捲繞於盤3上之黏著劑膠帶1之使用量亦會變多，捲 繞於盤3上之黏著劑膠帶1在相對較短之時間內會被捲取 -110- 1322649 至空盤17，盤3會變成空的。 當盤3變成空的時，分別使盤3及盤17逆轉，此時 ，會以空的盤3捲取，而使黏著劑膠帶1朝相反方向移動 (第3圖中之箭頭F)。 如此，每1條黏著劑1 1都會依序改變黏著劑膠帶1 之捲取方向（E、F)，而將黏著劑11壓著至電路基板21Next, a method of using the adhesive tape of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15, the front end of the adhesive tape 1 wound around the disc 3 is attached to the empty tray 17, and the adhesive tape 1 is unwound (3rd Arrow E) in the figure. Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 19 placed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the substrate 9 side, and one adhesive is applied. 1 1 is pressed onto the circuit board. Thereafter, the residual adhesive 11 and the substrate 9 are taken up together to the empty tray 17. After the above-described pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and officially connected. In the case of the connection, the wiring circuit (or electronic member) 2 is placed on the adhesive 11 pressed against the circuit board 21, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material to heat the pressing head 19. The circuit board 21 is subjected to heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 34, 'the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment is adhered to the entire periphery of the Pdp, and the amount of the adhesive 11 used in the second use is much larger than that of the conventional use. the amount. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up in a relatively short period of time -110 - 1322649 to the empty tray 17, disk 3 will become empty. When the disk 3 becomes empty, the disk 3 and the disk 17 are respectively reversed. At this time, the empty disk 3 is taken up, and the adhesive tape 1 is moved in the opposite direction (arrow F in Fig. 3). Thus, each of the adhesives 1 1 sequentially changes the winding direction (E, F) of the adhesive tape 1, and the adhesive 11 is pressed against the circuit substrate 21

此處，參照第5圖及第35圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑Η，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。如 第35圖所示，相對於基材9之10mm寬度配置著5個塗 布機27，塗布10mm寬度之5條黏著劑11。被捲取之黏 著劑膠帶之原始材料，以切割機33切成特定寬度並捲取 至捲軸後，從兩側將側板7、7裝著於捲軸上，或者，捲 取至附側板之捲軸上，將其和除濕材一起綑包，實施低溫 (-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對申請專利範圍第29〜34項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第36圖A〜C所示之第2實施形態時，黏著劑膠帶1 之基材之單面全面上塗布著寬度W之黏著劑，利用形成 -111 - 1322649Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Figs. 5 and 35. On a substrate 9 which is unwound from the unwinder 25, an adhesive Η which is obtained by mixing a resin and conductive particles 13 is applied by a coater 27, dried in a drying furnace 29, and then wound up. Machine 31 takes up the original material. As shown in Fig. 35, five applicators 27 were disposed with a width of 10 mm from the substrate 9, and five adhesives 11 having a width of 10 mm were applied. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel from both sides, or taken up to the reel of the side plate. It is packaged together with the dehumidifying material, and is managed at a low temperature (-5 °C to -1 0 °C) and shipped. In the following, the other embodiments of the invention described in the claims are set forth in the appended claims, and the same reference numerals are given to the same parts as the above-mentioned embodiments, and the detailed description of the parts is omitted. The implementation is different. In the second embodiment shown in Figs. 36A to AC, the adhesive of the width W is applied to the entire surface of the base material of the adhesive tape 1 to form -111 - 1322649

於基材之縱向的縫隙35將黏著劑隔離成寬度W方向上之 複數條。此第2實施形態之黏著劑膠帶1時，縫隙3 5應 在將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓著至 電路基板21之前一瞬間形成。此時，亦可在黏著裝置15 之盤裝著部附近（如第3圖之S所示）裝設工作面而在捲 出之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在 第5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙 者捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機31 捲取之前一瞬間形成縫隙者。 將第2實施形態之黏著劑膠帶1使用於黏著裝置15 時，和第1實施形態相同，以縫隙3 5隔離之黏著劑會逐 條以加熱加壓頭1 9從基材9側實施壓著，而如第3 6圖A 、B、C所示，依序逐條使用。 此第2實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到複數條之黏著 劑1 1，十分容易製造。 第37圖A〜C所示之第3實施形態時，基材9之全面 塗布著黏著劑11(第37圖A)，基材9及黏著劑11之寬 度W，係和上述實施形態相同之5〜1000mm。其次，使用 時亦和第1實施形態相同，將其裝著至黏著裝置15，將從 盤3捲出之黏著劑膠帶1配置於電路基板21上，對黏著 劑膠帶1之寬度W方向之部份黏著劑（1條份）實施加熱 加壓（第37圖B)，降低該部份之凝聚力，只有加熱加 壓之部份黏著劑會從基材剝離而壓著至電路基板21 (第 -112 - 1322649 37 圖 C ) » 此時，會沿著加熱加壓頭19之邊線形成凝聚力降低 線，實施加熱加壓部份之全部黏著劑應爲呈現軟化流動（ 簡易指標爲1 〇〇〇泊以下）而未開始黏著劑之硬化反應、 或低位狀態（簡易指標爲反應率20%以下）’加熱溫度應 對應使用之黏著劑系來進行選擇。A slit 35 in the longitudinal direction of the substrate separates the adhesive into a plurality of strips in the width W direction. In the adhesive tape 1 of the second embodiment, the slit 35 is formed immediately after the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the disk mounting portion of the adhesive device 15 (as shown by S in FIG. 3) to form a slit 3 5 on the adhesive 1 1 of the adhesive tape 1 which is unwound. The gap formed in the refurbishing step of the adhesive tape shown in Fig. 5 may be taken up to the disc, or may be formed immediately after the drying at the coating step and before the coiler 31 is taken up. The gap. When the adhesive tape 1 of the second embodiment is used in the adhesive device 15, as in the first embodiment, the adhesive which is separated by the slits 35 is pressed from the base material 9 side by the heating and pressing head 1 by one. And as shown in Figure 3, Figure A, B, and C, use one by one. In the second embodiment, it is only necessary to form the slits 3 5 by the adhesive on the substrate obtained by the same procedure as the conventional one, so that a plurality of adhesives 11 can be obtained, which is easy to manufacture. In the third embodiment shown in Figs. 37A to AC, the substrate 9 is entirely coated with the adhesive 11 (Fig. 37A), and the width W of the substrate 9 and the adhesive 11 is the same as that of the above embodiment. 5~1000mm. Then, in the same manner as in the first embodiment, it is attached to the adhesive device 15, and the adhesive tape 1 wound from the disk 3 is placed on the circuit board 21, and the width of the adhesive tape 1 in the W direction is applied. The adhesive (1 part) is subjected to heat and pressure (Fig. 37B) to reduce the cohesive force of the portion, and only a part of the adhesive which is heated and pressurized is peeled off from the substrate and pressed to the circuit substrate 21 (first - 112 - 1322649 37 Figure C) » At this point, a cohesive force reduction line is formed along the edge of the heated pressurizing head 19, and all the adhesives applied to the heated and pressurized portion should exhibit a softening flow (simple indicator is 1 berth The following) does not start the hardening reaction of the adhesive or the low state (the simple index is the reaction rate of 20% or less). The heating temperature should be selected according to the adhesive system used.

此第3實施形態時，黏著劑Π在使用時，只有在寬 度W當中之1條份會軟化流動化且被壓著至基板電路’ 故和上述之實施形態相同，只要利用黏著劑膠帶1之盤3 及空盤的正轉及逆轉，即可使用複數次份。 又，如上述之實施形態在黏著劑1 1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑11即可，故黏著劑膠帶之製造十分容易。 第3 8圖A〜C所示之第4實施形態，係第1實施形態 之黏著劑膠帶的其他製造方法，在塗布於基材9a上之黏 著劑1 1上形成縫隙9 8後（第3 8圖A )，以使黏著劑1 1 夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另一方 之基材9b (第38圖B)。其次，剝離一方及另一方之基 材9a、9b，各基材9a、9b上會以間隔1條之式配置著黏 著劑條1 1 a、1 1 b。此第4實施形態時，爲了在—方及另一 方之基材9a、9b上交互配置黏著劑條11a、lib，可從一 方之基材9 a或9 b側以間隔1條之方式實施黏著劑條π a 、1 1 b之加熱加壓，而將黏著劑條U a、1 1 b以間隔1條之 方式配置於各基材9a、9b上》 -113- 1322649 申請專利範圍第29〜34項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第29〜34項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 上述之實施形態時，形成於基材9上之黏著劑的條數 可以爲任意條，至少爲2條以上即可。In the third embodiment, when the adhesive crucible is used, only one of the widths W is softened and fluidized and pressed against the substrate circuit. Therefore, the adhesive tape 1 is used as in the above embodiment. The normal rotation and reversal of the disc 3 and the empty disc can be used in multiple copies. Further, in the above embodiment, the gap 3 5 is formed in the adhesive 1 1 and is not required to be divided into a plurality of strips, and it is only necessary to apply the adhesive 11 on one side of the wider base material, so that the adhesive tape is used. Manufacturing is very easy. The fourth embodiment shown in Figs. 3A to 8C is another manufacturing method of the adhesive tape according to the first embodiment, after the slit 9 8 is formed on the adhesive 1 1 applied to the substrate 9a (third 8A), the other substrate 9b is attached to the adhesive 1 1 so that the adhesive 1 1 is sandwiched between the substrates 9a and 9b (Fig. 38B). Next, the base materials 9a and 9b of one of the other and the other are peeled off, and the adhesive strips 1 1 a and 1 1 b are disposed on each of the base materials 9a and 9b at intervals of one. In the fourth embodiment, in order to alternately dispose the adhesive strips 11a and 11b on the base materials 9a and 9b, the adhesive can be applied from one side of the base material 9a or 9b at intervals of one. The strips π a and 1 1 b are heated and pressurized, and the adhesive strips U a and 1 1 b are disposed on each of the substrates 9a and 9b at intervals of one. -113- 1322649 Patent Application No. 29~ The invention described in the above is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention as set forth in the appended claims. For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 1 1 may be used. In the above embodiment, the number of the adhesives formed on the substrate 9 may be any number of at least two or more.

其次，針對申請專利範圍第3 5〜4 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 、黏著劑膠帶之製造方法、及黏著劑膠帶之壓著方法。 其次，針對申請專利範圍第35〜41項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開2001-284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 -114- 1322649 黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。Next, the invention described in the patent application No. 35-41 will be described. These inventions relate to an adhesive tape for fixing an electronic component, a circuit board, or a circuit board, and an electrical connection between electrodes, a method of manufacturing an adhesive tape, and a method of pressing an adhesive tape. Next, the background art of the invention described in the claims 35 to 41 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit substrate, the adhesive tape is pulled along one side of the circuit substrate and the adhesive is pressed. Since it is applied to the periphery of the circuit substrate, it will be -114- 1322649. The adhesive is pressed against the periphery of the circuit substrate. However, in recent years, as the panel size of a PDP or the like has increased, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine is more frequently replaced by the disk on which the adhesive tape is wound, and since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved.

針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第35〜41項記載之發明的目的 ’係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在未增加黏著劑膠帶之捲數的 情形下增加黏著劑量》 其次，參照附錄圖面，針對申請專利範圍第35〜41 項記載之發明之實施形態進行說明，首先，參照第3 9圖 A、B、第40圖、第34圖、第5圖、第41圖，針對申請 專利範圍第3 5〜4 1項記載之發明之第1實施形態進行說 明。第39圖A及B係黏著劑膠帶圖，第39圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從從黏著劑側 觀看第39圖A之黏著劑膠帶時之平面圖，第40圖係黏著 -115 - 1322649 裝置之黏著劑壓著步驟的斜視圖。 本實施形態之黏著劑膠帶1係捲繞於盤3上者，盤3 上配設著捲軸5、及配置於黏著劑膠帶1之兩側的側板7 。本實施形態時，黏著劑膠帶1之長度約爲50m，寬度W 則爲和電路基板之一邊大致相同尺寸之約1 500mm。In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. Therefore, the object of the invention described in claims 35 to 41 is to provide an adhesive tape, a method for producing an adhesive tape, and a method for pressing an adhesive tape, without increasing the number of adhesive tapes. In the case of the present invention, the embodiment of the invention described in the patent application No. 35-41 will be described with reference to the appended drawings. First, reference is made to Figure 39, A, B, 40, and 34. Fig. 5 and Fig. 41 show the first embodiment of the invention described in the patent application No. 35-41. Fig. 39 is a view showing the adhesive tape of the adhesive tape, Fig. 39 is a perspective view of the disk around which the adhesive tape is wound, and Fig. 39 is a view of the adhesive tape of Fig. 39A viewed from the adhesive side. The plan view, Fig. 40 is an oblique view of the adhesive pressing step of the device - 115 - 1322649. The adhesive tape 1 of the present embodiment is wound around the disk 3. The disk 3 is provided with a reel 5 and side plates 7 disposed on both sides of the adhesive tape 1. In the present embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 1,500 mm which is substantially the same size as one side of the circuit board.

黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑11所構成，基材9上之膠帶之寬度方向上，以等間隔 方式配置著1條寬度爲0.5mm之黏著劑11。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化，桂樹脂之混合物、或熱金屬系。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表， φ 又’熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基 酯系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶瓷 、塑膠等高分子核材等覆蓋前述導電層而形成者。此外， 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、或 倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 -116- 1322649 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小，連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點， 在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很容 易即可對應電極之厚度及平坦性之誤差的連接構件。The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to the substrate 9, and an adhesive having a width of 0.5 mm is disposed at equal intervals in the width direction of the tape on the substrate 9. 11. The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin, a mixture of a lauric resin or a hot metal. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the φ and 'thermosetting resin type are an epoxy resin type, an acrylic type, a vinyl ester type resin type, and an anthracene resin type. representative. The conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or the like, carbon, graphite, etc., and may be in the above-mentioned materials and non-conductive glass, ceramics, and plastics. A polymer core or the like is formed to cover the conductive layer. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot-melt metal such as solder or a polymer core material such as plastic, there is deformation due to deformation due to heating and pressing -116-1322649 or pressurization, so the distance between the electrodes after the connection will be Reduced, the area of contact with the circuit can be increased when connected, and the reliability can be improved. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member.

其次，針對本實施形態之黏著劑膠帶1之使用方法進 行說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著裝 置15，將捲繞於盤3上之黏著劑膠帶1之前端裝設空盤 17並捲出黏著劑膠帶1(第40圖中之箭頭E)。其次， 在電路基板21上配置黏著劑膠帶1，以配置於兩盤3、17 間之加熱加壓頭1 9從基材9側實施黏著劑膠帶1之壓接 ，將1條份之黏著劑11壓著至黏著劑膠帶之寬度方向上 之電路基板之一邊，只有該條份之黏著劑11會被捲取至 空盤1 7。 其次，將電路基板21旋轉約90度，使電路基板21 ^ 之鄰邊位於黏著劑膠帶1之寬度方向上，利用加熱加壓頭 19將黏著劑11壓著至電路基板21之另一邊。如此，將電 路基板21旋轉約90度並壓著黏著劑11，可將黏著劑η 壓著至電路基板21之四周。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）23之電極的定位並進行正式連接 。正式連接上，將黏著劑11壓著至電路基板21之四周後 ，在黏者劑11上配置配線電路（或電子構件）23，必要 時，可將例如聚四氟乙煤材24當做緩衝材，以加熱加壓 1322649 頭19對電路基板21實施配線電路23之加熱加壓（參照 第4圖）。利用此方式，可連接固定電路基板21之電極 21a及配線電路23之電極23a。Next, a method of using the adhesive tape 1 of the present embodiment will be described. The disc 3 of the adhesive tape 1 and the empty tray 17 are attached to the adhesive device 15, and the empty tray 17 is attached to the front end of the adhesive tape 1 wound on the disc 3 and the adhesive tape 1 is unwound (Fig. 40) Arrow E). Next, the adhesive tape 1 is placed on the circuit board 21, and the heat-adhesive head 19 disposed between the two trays 3 and 17 is pressed against the adhesive tape 1 from the side of the substrate 9, and one adhesive is applied. 11 is pressed to one side of the circuit substrate in the width direction of the adhesive tape, and only the adhesive 11 of the strip is taken up to the empty tray 17. Next, the circuit board 21 is rotated by about 90 degrees so that the adjacent side of the circuit board 21^ is positioned in the width direction of the adhesive tape 1, and the adhesive 11 is pressed against the other side of the circuit board 21 by the heating and pressing head 19. Thus, by rotating the circuit substrate 21 by about 90 degrees and pressing the adhesive 11, the adhesive η can be pressed to the periphery of the circuit board 21. After the pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and connected. In the case of the connection, the adhesive 11 is pressed around the circuit board 21, and the wiring circuit (or electronic member) 23 is placed on the adhesive 11, and if necessary, for example, the polytetrafluoroethylene material 24 can be used as a cushioning material. The heating and pressurization of the wiring circuit 23 is performed on the circuit board 21 by heating and pressing 1322649 head 19 (refer to Fig. 4). In this manner, the electrode 21a of the fixed circuit substrate 21 and the electrode 23a of the wiring circuit 23 can be connected.

如第3 4圖所示’利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份’會對Pdp之周圍全體實施黏著，一 次使用之黏著劑11之使用量會遠大於傳統之使用量。然 而，因爲黏著劑膠帶1之寬度W和電路基板21之一邊之 長度Η大致相等，即使和黏著劑膠帶1之寬度w較大之 傳統者相同之捲數，其黏著劑量亦遠多於傳統之物，故盤 之更換次數遠少於傳統之物。 此處’參照第5圖及第41圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑11，並 以乾燥爐2 9實施乾燥後，以捲取機31捲取原始材料。塗 布機27會左右移動，以等間隔在基材9上塗布條狀黏著 劑。被捲取之黏著劑膠帶之原始材料，以切割機33切成 特定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲 軸上’或者’捲取至附側板之捲軸上，將其和除濕材一起 綑包’實施低溫（-5 °C〜-10 °C)之管理並進行出貨。 其次’針對申請專利範圍第3 5〜4 1項記載之發明之 其他實施形態進行說明’和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 -118- 1322649As shown in Fig. 34, 'the connecting portion of the PDP 26 of the adhesive tape 1 of the present embodiment' will adhere to the entire periphery of the Pdp, and the amount of the adhesive 11 used at one time will be much larger than the conventional use. . However, since the width W of the adhesive tape 1 and the length 之一 of one side of the circuit substrate 21 are substantially equal, even if the number of windings is the same as that of the conventional one having the larger width w of the adhesive tape 1, the adhesive amount is much larger than that of the conventional one. Things, so the number of replacements is far less than the traditional things. Here, a method of manufacturing the adhesive tape 1 of the present embodiment will be described with reference to Figs. 5 and 41. On a substrate 9 which is unwound from the unwinder 25, an adhesive 11 obtained by mixing a resin and conductive particles 13 is applied by a coater 27, dried in a drying oven 29, and then taken up by a coiler. 31 take the original material. The applicator 27 is moved left and right to apply a strip of adhesive on the substrate 9 at equal intervals. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are mounted on the reel from both sides 'or' to be reeled onto the reel of the side plate. It is packaged with the dehumidifying material 'implementation of low temperature (-5 °C ~ -10 °C) and shipped. In the following, the description of the other embodiments of the invention described in the appended claims is incorporated by reference. The difference from the above embodiment is mainly. -118- 1322649

第41圖所示之第2實施形態時，黏著裝置15上有2 處裝著至黏著劑膠帶1，以互相垂直之方式裝設一方之黏 著劑膠帶1及另一方之黏著劑膠帶1。其次，一方之黏著 劑膠帶1將黏著劑11壓著至電路基板21之相對縱邊N上 (第1步驟），另一方之黏著劑膠帶1則將黏著劑11壓 著至相對橫邊Μ上（第2步驟），2個步驟即可將黏著劑 壓著至電路基板21之四周。此第2實施形態時，在第1 步驟及第2步驟之間無需旋轉電路基板21之方向，可將 第1步驟中載置之電路基板21直接移至第2步驟，故可 實現黏著劑之自動壓著，此外，亦可提高作業效率。此時 ，亦可將電路基板21載置於搬運帶而實現自動搬運。 第42圖Α〜C所示之第3實施形態時，基材之單面全 面上會塗布寬度W之黏著劑，利用形成於基材之寬度W 方向上之縫隙35，寬度W方向上將黏著劑分隔成複數條 。此第3實施形態之黏著劑膠帶1時，縫隙3 5應形成於 將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓著至電 路基板21之前一瞬間。此時，亦可在黏著裝置15之盤裝 著部附近（如第40圖之S所示）裝設工作面而在捲出之 黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在第5 圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙者捲 取至盤者，亦可在塗工步驟時之乾燥後、以捲取機31捲 取之前一瞬間形成縫隙者。又，無論何種實施形態，工作 面亦可爲在黏著劑板1之寬度W方向往返移動者。 又’將第3實施形態之黏著劑膠帶1使用於黏著裝置 -119- 1322649 1 5時’和第1實施形態相同，以縫隙3 5隔離之黏著劑會 逐條以加熱加壓頭從基材9側實施壓著，而從前端側依序 逐條使用。 此第3實施形態時’只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到配設於寬度方 向之複數條黏著劑Π，十分容易製造。In the second embodiment shown in Fig. 41, the adhesive tape 15 is attached to the adhesive tape 1 at two places, and one adhesive tape 1 and the other adhesive tape 1 are attached to each other perpendicularly. Next, one adhesive tape 1 presses the adhesive 11 against the opposite longitudinal side N of the circuit substrate 21 (first step), and the other adhesive tape 1 presses the adhesive 11 against the opposite lateral edge. (Second step), the adhesive can be pressed to the periphery of the circuit board 21 in two steps. In the second embodiment, the direction in which the circuit board 21 is rotated is not required between the first step and the second step, and the circuit board 21 placed in the first step can be directly moved to the second step, so that the adhesive can be realized. Automatic pressing, in addition, can also improve work efficiency. At this time, the circuit board 21 can be placed on the conveyance belt to realize automatic conveyance. In the third embodiment shown in Figs. 42A to C, the adhesive of the width W is applied to the entire surface of the substrate, and the slit 35 formed in the width W direction of the substrate is adhered in the width W direction. The agent is divided into a plurality of strips. In the adhesive tape 1 of the third embodiment, the slit 35 should be formed immediately before the disk 3 is attached to the adhesive device 15 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the disk mounting portion of the adhesive device 15 (as shown by S in FIG. 40) to form a slit 3 5 on the adhesive 1 1 of the adhesive tape 1 which is unwound. The gap formed in the refurbishing step of the adhesive tape shown in Fig. 5 may be taken up to the disc, or may be formed immediately after the drying at the coating step and before the coiler 31 is taken up. The gap. Further, in any embodiment, the working surface may be reciprocated in the width W direction of the adhesive sheet 1. Further, when the adhesive tape 1 of the third embodiment is used in the adhesive device-119- 1322649 1 5', the adhesive which is separated by the slits 35 is heated one by one from the substrate. The 9 side is pressed and used one by one from the front end side. In the third embodiment, it is only necessary to form the slits 35 by the adhesive on the substrate obtained by the same procedure as the conventional one, so that a plurality of adhesives disposed in the width direction can be obtained, which is very easy to manufacture.

第43圖Α〜C所示之第4實施形態時，係在基材9之 單面全面塗布黏著劑11 (第43圖A)，基材9及黏著劑 1 1之寬度W和上述實施形態相同，係和電路基板之一邊 長度大致相同之尺寸。其次，使用時係以和第1實施形態 相同之方式裝著，對黏著劑膠帶1之寬度W方向之部份 黏著劑（1條份）實施加熱加壓（第4 3圖B )，降低該部 份之凝聚力，只有實施加熱加壓之部份的黏著劑會從基材 分離並壓著至電路基板21 (第43圖C)。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線，加熱加壓部份之全部黏著劑應爲呈現軟化流動（簡易 指標爲1 000泊以下）而未開始黏著劑之硬化反應、或低 位狀態（簡易指標爲反應率20%以下），加熱溫度應對應 使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，會逐條使 寬度W方向上之1條份軟化流動化並壓著至基板電路。 又，如上述之實施形態在黏著劑1 1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑11即可，故黏著劑膠帶之製造十分容易。 -120- 1322649In the fourth embodiment shown in Figs. 43A to C, the adhesive 11 is integrally applied to one surface of the substrate 9 (Fig. 43A), the width W of the substrate 9 and the adhesive 1 1 and the above embodiment. Similarly, the length of one side of the circuit board and the circuit board are substantially the same. Next, when it is used, it is attached in the same manner as in the first embodiment, and a part of the adhesive (one part) in the width W direction of the adhesive tape 1 is heated and pressurized (Fig. 4B). Part of the cohesive force, only the adhesive which is subjected to heat and pressure is separated from the substrate and pressed to the circuit substrate 21 (Fig. 43C). At this time, a cohesive force reduction line is formed along the side line of the heating and pressing head 19, and all the adhesives in the heated and pressurized portion should exhibit a softening flow (simple index is less than 1 000 poise) without starting the hardening reaction of the adhesive. Or the low state (simple indicator is the reaction rate of 20% or less), and the heating temperature should be selected according to the adhesive system used. In the fourth embodiment, when the adhesive 1 1 is used, one portion in the width W direction is softened and fluidized one by one and pressed against the substrate circuit. Further, in the above embodiment, the gap 3 5 is formed in the adhesive 1 1 and is not required to be divided into a plurality of strips, and it is only necessary to apply the adhesive 11 on one side of the wider base material, so that the adhesive tape is used. Manufacturing is very easy. -120- 1322649

第44圖A〜C所示之第5實施形態，係第1實施形態 之黏著劑膠帶1之其他製造方法，在塗布於基材9a上之 黏著劑1 1上形成縫隙9 8後（第4 4圖A )，以使黏著劑 1 1夾於基材9a、9b之間之方式，在黏著劑1 !上貼附另— 方之基材9b (第44圖B)。其次，剝離一方及另一方之 基材9a、9b ’各基材9a、9b上會以間隔丨條之方式配置 著黏著劑條11a、lib。此第5實施形態時，爲了在一方及 另一方之基材9a、9b上交互配置黏著劑條iia、ub，亦 可從一方之基材9a或9b側以間隔1條之方式實施黏著劑 條1 1 a、1 1 b之加熱加壓，而將黏著劑條丨1 a、丨1 b依序貼 附至各基材9a、9b。 申請專利範圍第3 5〜4 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第3 5〜4 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 其次，針對申請專利範圍第42〜46項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 盒、及利用黏著劑膠帶盒之黏著劑壓著方法。 其次，針對申請專利範圍第42〜46項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( -121 - 1322649 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。The fifth embodiment shown in Figs. 44A to AC is another manufacturing method of the adhesive tape 1 of the first embodiment, after the slit 9 8 is formed on the adhesive 1 1 applied to the substrate 9a (fourth embodiment) 4A), the other substrate 9b (Fig. 44B) is attached to the adhesive 1! so that the adhesive 11 is sandwiched between the substrates 9a and 9b. Next, the adhesive strips 11a and 11b are placed on the base materials 9a and 9b of one of the base materials 9a and 9b'. In the fifth embodiment, in order to alternately dispose the adhesive strips iia and ub on one of the other base materials 9a and 9b, the adhesive strip may be applied from one side of the base material 9a or 9b at intervals of one. The heat and pressure of 1 1 a and 1 1 b are applied, and the adhesive strips 1 a and 1 b are sequentially attached to the respective substrates 9a and 9b. The invention described in the third to fifth aspects of the patent application is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in claims 35 to 41. . For example, in the above embodiment, an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 1 1 may be used. Next, the invention described in the patent application section 42 to 46 will be described. These inventions relate to an adhesive tape cartridge for bonding an electronic component and a circuit board, or a circuit board, and an electrical connection between electrodes, and an adhesive pressing method using an adhesive tape cartridge. Next, the background art of the invention described in the patent application section 42 to 46 will be described. In general, a liquid crystal panel, a PDP (plasma display panel), an EL (-121 - 1322649 fluorescent display) panel, an electronic component such as a bare chip package, a circuit board, or a circuit board, or a circuit board, and both The method of electrically connecting the electrodes is to use an adhesive tape. Japanese Laid-Open Patent Publication No. 2001-284005 discloses the use of an adhesive tape for applying an adhesive to a substrate to take up a disk shape.

此種傳統黏著劑膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至電 路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠帶 並實施黏著劑之壓著，因係針對電路基板之四周，故會將 黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積（一邊之尺寸）亦會增大，一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大， 黏著劑之使用量亦增加。因此，上述之電子機器之製造工 廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之更 換十分麻煩，故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第42〜46項記載之發明的目的 ，係在提供一種黏著劑膠帶盒、及利用黏著劑膠帶盒之黏 -122- 1322649 著劑壓著方法，可在未增加黏著劑膠帶之捲數的情形下增 加黏著劑量，且盤之更換更爲簡易。The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit board, the adhesive tape is pulled along one side of the circuit board and the adhesive is pressed, because the adhesive is pressed against the periphery of the circuit board. To the periphery of the circuit board. However, in recent years, as the panel size of a PDP or the like has increased, the adhesion area (the size of one side) of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, as the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the above-mentioned manufacturing of the electronic machine is more frequently replaced by the disk on which the adhesive tape is wound, and since the replacement of the disk is troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, it is conceivable to increase the number of adhesive tapes taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of rolls is increased, the pressure acting on the tape-like adhesive tape may increase, and the adhesive may bleed out from both sides of the tape to cause clogging. Therefore, the object of the invention described in claim 42 to 46 is to provide an adhesive tape cassette and a pressure-122- 1322649 adhesive pressing method using an adhesive tape cassette, without adding an adhesive tape. In the case of the number of rolls, the amount of adhesive is increased and the replacement of the disk is easier.

其次，參照添附圖面，針對申請專利範圍第42〜46 項記載之發明之實施形態進行說明，首先，參照第45圖 A、B、第46圖、第47圖、第4圖、第34圖、及第48圖 ，針對申請專利範圍第42〜46項記載之發明之第1實施 形態進行說明。爲了說明上之方便，針對黏著劑膠帶配置 2條黏著劑時進行說明，然而，亦可形成複數條。第45圖 A及B係申請專利範圍第42〜46項記載之發明之第1實 施形態之黏著劑膠帶盒圖，第4 5圖A係黏著劑膠帶盒之 斜視圖，第45圖B係第45圖A之A-A切剖面圖，第46 圖係第45圖A及B所示之膠帶盒之盤裝設狀態的剖面圖 ，第47圖係黏著裝置之黏著劑壓著步驟的正面圖，第48 圖係黏著劑膠帶盒之製造方法的步驟圖。 本實施形態之黏著劑膠帶盒100之主要構成係一方之 盤3、另一方之盤17、以及收容前述盤之殻體99，一方之 盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之另一端9a則 固定於另一方之盤17。 殼體99之一側會形成開口 1 1，可從此開口 1 1拉出黏 著劑膠帶1。又，開口 1 1之兩側則配設著用以導引黏著劑 膠帶1之移動的導引件31、31。 殼體99係由半殼體99a、99b嵌合而成，配設於黏著 裝置27(後述）上之滑軸17(參照第46圖）嵌插於一方 及另一方之盤3、5上，而嵌合於各盤3、5。 -123-Next, an embodiment of the invention described in the patent application Nos. 42 to 46 will be described with reference to the drawings. First, reference is made to Figs. 45A, B, 46, 47, 4, and 34. And Fig. 48, the first embodiment of the invention described in the patent application claims 42 to 46 will be described. For the convenience of description, two adhesives are disposed for the adhesive tape, however, a plurality of adhesives may be formed. Fig. 45 is a perspective view of an adhesive tape cassette according to a first embodiment of the invention of the inventions of the inventions of the invention, and a fourth embodiment of the invention is a perspective view of an adhesive tape cassette, and Fig. 45B is a 45A is a cross-sectional view taken along the line AA of FIG. A, and Fig. 46 is a sectional view showing the state of the tape mounting of the tape cassette shown in Figs. 45 and A, and Fig. 47 is a front view showing the step of adhering the adhesive of the adhesive device, 48 Figure is a step diagram of a method of manufacturing an adhesive tape cassette. The main component of the adhesive tape cartridge 100 of the present embodiment is a disk 3, a disk 17 and a case 99 in which the disk is housed, and an adhesive tape 1 is wound around one of the disks 3, and an adhesive tape 1 is attached. The other end 9a is fixed to the other disk 17. An opening 1 1 is formed on one side of the casing 99, from which the adhesive tape 1 can be pulled out. Further, guide members 31, 31 for guiding the movement of the adhesive tape 1 are disposed on both sides of the opening 1 1. The casing 99 is fitted by the half casings 99a and 99b, and the sliding shaft 17 (see FIG. 46) disposed on the bonding device 27 (described later) is inserted into one and the other of the disks 3 and 5. It is fitted to each of the discs 3, 5. -123-

1322649 此處，參照第46圖針對各盤3、5、及各盤3、ί 體99之嵌合進行說明。各盤3'5之內緣側會形成互 黏著裝置2 7之滑軸1 7的嵌合條1 9，而外圍側則會开 可旋轉之方式嵌合於殼體99之突部7c的嵌合溝21» 如第45圖B所示，黏著劑膠帶1之基材9之骂 ，在寬度方向上會塗布著2條並排之黏著劑11a、1 條黏著劑1 1 a、1 1 b間會有間隔。 本實施形態時’黏著劑膠帶1之長度約爲50m， W則約爲4mm。各條黏著劑lla、lib之寬度約爲】 從強度、及構成向異導電材之黏著劑之剝離性甬 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或糸j 處理之PET (聚對苯二甲酸乙二酯）等所構成，然兩 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹月| φ 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬男 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代赛 ，熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙炤 系樹脂系、及矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13 Au、Ag、pt、Ni、cu、W、Sb、Sn、焊錫等之金屬軺 或碳、石墨等’亦可在前述之物及非導電性之玻璃、 、塑膠寺闻分子核材等覆蓋前述導電層等來形成。坩 亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 ί及殻 『嵌合 $成以 【面上 lb 〇 2 寬度 .2mm (言， 丨過矽 [，並 丨、或 …熱 :，又 •基酯 係如 子、 陶瓷 外’ 、或 -124- 1322649 併用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、或 塑膠等之高分子核材上形成導電層者，會具有因加熱加壓 或加壓而產生變形之變形性，故連接後之電極間距離會縮 小，連接時可增加和電路接觸之面積，而可提高信賴性。 尤其是，以高分子類做爲核材更佳，焊如焊錫因沒有融點 ，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 容易即可對應電極之厚度及平坦性之誤差的連接構件。1322649 Here, the fitting of each of the disks 3, 5, and each of the disks 3 and 99 will be described with reference to Fig. 46. On the inner edge side of each of the discs 3'5, the fitting strips 149 of the sliding shafts 17 of the mutual adhesive means 27 are formed, and the peripheral side is rotatably fitted to the projections 7c of the housing 99. Closure 21» As shown in Fig. 45B, the substrate 9 of the adhesive tape 1 is coated with two side-by-side adhesives 11a and one adhesive 1 1 a, 1 1 b in the width direction. There will be intervals. In the present embodiment, the length of the adhesive tape 1 is about 50 m, and W is about 4 mm. The width of each of the adhesives 11a, 11b is about 】 from the strength, and the peeling property of the adhesive to the different conductive material. The substrate 9 should be treated by OPP (extended polypropylene), polytetrafluoroethylene, or 糸j. PET (polyethylene terephthalate) or the like is formed, but the two are not limited thereto. The adhesive 1 1 is made of a thermoplastic resin, a thermosetting resin, a mixture of φ thermoplastic resin and a thermosetting resin, or a hot metal male plastic resin system, which is a styrene resin or a polyester resin. The thermosetting resin system is represented by an epoxy resin type, an acrylic type, an acetonitrile type resin type, and an anthracene resin type. Conductive particles 13 are dispersed in the adhesive 11. Conductive particles 13 Au, Ag, pt, Ni, cu, W, Sb, Sn, metal such as solder or carbon, graphite, etc. can also be used in the aforementioned materials and non-conductive glass, plastic temples and molecular materials The conductive layer or the like is covered to form.坩Alternatively, it is also possible to apply the insulating film particles and the shell of the above-mentioned conductive particles with an insulating layer to form a chisel $ into a surface lb 〇 2 width. 2 mm (say, 丨 矽 , [, 丨, or ... heat:, Further, if the base ester is made of a ceramic or a ceramic, or a conductive particle or an insulating particle, a conductive layer such as a hot molten metal such as solder or a polymer such as a plastic may be formed. The deformability of the deformation is caused by heating, pressurizing or pressurizing, so that the distance between the electrodes after the connection is reduced, and the area in contact with the circuit can be increased during the connection, and the reliability can be improved. In particular, the polymer is used as the core material. More preferably, since the solder is soldered without a melting point, it can be controlled to a softened state at a wide connection temperature, and a connecting member which is easy to correspond to the thickness and flatness of the electrode can be obtained.

其次，針對本實施形態之黏著劑膠帶盒1 00之使用方 法進行說明。如第47圖所示，將黏著劑膠帶盒1 00裝著 至黏著裝置27。黏著裝置27以具有間隔之方式配設著盒 用之滑軸17、17(參照第46圖），使滑軸17' 17卡合於 黏著劑膠帶盒1〇〇之各盤3、5。因此，黏著劑膠帶盒100 之裝著只需單觸即可完成，而無需實施傳統上將捲繞於盤 之黏著劑膠帶1之另一端9a裝設至空盤之作業等。 其次，從黏著劑膠帶盒1〇〇拉出黏著劑膠帶1，穿過 黏著裝置27之導引件31、31。 其次，驅動黏著裝置27之滑軸17捲出黏著劑膠帶1 (第47圖之箭頭E方向），將黏著劑膠帶1配置於電路 基板2 1上，以加熱加壓頭1 9從基材9側實施黏著劑膠帶 1之壓接，寬度方向之一側上的1條份黏著劑被壓著 至電路基板21之一邊，殘餘之1條黏著劑lib及基材9 會被捲取至另一方之盤17。如此’可將黏著劑11a壓著至 電路基板21之四周。 其次，在捲繞於一方之盤3之黏著劑膠帶1全部捲出 -125-Next, a method of using the adhesive tape cassette 100 of the present embodiment will be described. As shown in Fig. 47, the adhesive tape cassette 100 is attached to the adhesive device 27. The adhesive device 27 is provided with the slide shafts 17 and 17 for the cartridges (see Fig. 46) with a space therebetween, and the slide shafts 17' 17 are engaged with the respective discs 3, 5 of the adhesive tape cartridge 1A. Therefore, the attachment of the adhesive tape cartridge 100 can be completed by a single touch without performing the operation of conventionally attaching the other end 9a of the adhesive tape 1 wound around the disk to the empty tray. Next, the adhesive tape 1 is pulled out from the adhesive tape cartridge 1 and passed through the guide members 31, 31 of the adhesive device 27. Next, the sliding shaft 17 of the driving adhesive device 27 is taken up by the adhesive tape 1 (the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the circuit substrate 2 1 to heat the pressing head 19 from the substrate 9. The side is subjected to pressure bonding of the adhesive tape 1, and one adhesive on one side in the width direction is pressed to one side of the circuit substrate 21, and the remaining one adhesive lib and the substrate 9 are taken up to the other side. Plate 17. Thus, the adhesive 11a can be pressed to the periphery of the circuit board 21. Next, the adhesive tape 1 wound around one of the trays 3 is completely rolled out -125-

1322649 後，將黏著劑膠帶盒100拆下並以反向裝著，重複 步驟。黏著劑膠帶上形成2條以上之黏著劑時，可 度方向之位置依序或以間隔方式實施壓著。 上述壓著後（暫時連接），實施電路基板21 33a及配線電路（電子構件）37之電極37a的定位 正式連接。正式連接上，在將黏著劑11a壓著至電 21之四周後，在黏著劑11a上配置配線電路（或電 )37，必要時，可將例如聚四氟乙烯材39當做緩 以加熱加壓頭19對電路基板21實施配線電路23 加壓（參照第4圖）。利用此方式，可連接固定電 21之電極33a及配線電路23之電極3 7a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶】 實施黏著之PDP 26之連接部份，在本實施形態中裔 著於PDP 26之周圍全體，一次使用之黏著劑11的值 會遠大於傳統上之使用量。然而，因爲黏著劑膠帶1 度W方向上配置著2條黏著劑1 1 a、1 1 b，即使爲禾丨 相同之捲數，其黏著劑量可爲傳統之2倍，故可減4 更換次數。 又，黏著劑膠帶1係採用盒1之型式，故更換、 、及裝著都十分容易，而具有良好之作業性。 此處，參照第48圖，針對本實施形態之黏著齊 盒1〇〇之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上， 布機28塗布由樹脂及導電性粒子30混合而成之黏著 :述之 〔變寬 :電極 i進行 F基板 -構件 丨材， :加熱 [基板 ^ 100 :會黏 :用量 之寬 I傳統 盒之 處理 膠帶 以塗 劑1 1 -126- 1322649 ’並以乾燥爐29實施乾燥後，以捲取機31捲取原始材料 。塗布機28會在基材9上塗布多數條黏著劑。被捲取之 黏著劑膠帶之原始材料，整修步驟時，以切割機33切成 特定寬度（2條黏著劑條之寬度）並捲取至盤3後，以夾 於半殼體99a、99b之間的方式嵌合盤3及空盤5，製成黏 著劑膠帶盒1〇〇。After 1322649, the adhesive tape cartridge 100 is removed and loaded in the reverse direction, and the steps are repeated. When two or more adhesives are formed on the adhesive tape, the pressing direction is performed in a sequential manner or in a spaced manner. After the pressing (temporary connection), the positioning of the electrode 37a of the circuit board 21 33a and the wiring circuit (electronic component) 37 is officially connected. On the formal connection, after the adhesive 11a is pressed to the periphery of the electricity 21, a wiring circuit (or electricity) 37 is disposed on the adhesive 11a, and if necessary, for example, the polytetrafluoroethylene material 39 can be heated and pressurized. The head 19 presses the wiring circuit 23 on the circuit board 21 (see Fig. 4). In this manner, the electrode 33a of the fixed electric 21 and the electrode 3 7a of the wiring circuit 23 can be connected. As shown in Fig. 34, the adhesive portion of the PDP 26 to be adhered by the adhesive tape of the present embodiment is used in the present embodiment, and the value of the adhesive 11 for one use is used. Far greater than the traditional usage. However, since the adhesive tape is provided with two adhesives 1 1 a, 1 1 b in the W direction, even if it is the same number of rolls, the adhesive dose can be twice as long as the conventional one, so the number of replacements can be reduced by 4 . Further, since the adhesive tape 1 is of the type of the cartridge 1, it is easy to replace, and mount, and has good workability. Here, a method of manufacturing the adhesive cartridge 1A of the present embodiment will be described with reference to Fig. 48. On a substrate 23 that is unwound from the unwinding machine 25, the cloth machine 28 is coated with a mixture of a resin and conductive particles 30: [widening: the electrode i is subjected to the F substrate-member coffin, : Heating [Substrate ^ 100 : Adhesive: The width of the treatment I of the conventional box is applied to the coating agent 1 1 -126 - 1322649 ' and dried in a drying oven 29, and the original material is taken up by the winding machine 31. The coater 28 coats a plurality of adhesives on the substrate 9. The original material of the adhesive tape to be taken up is cut into a specific width (the width of two adhesive strips) by the cutter 33 during the refurbishing step, and is taken up to the tray 3 to be sandwiched between the half shells 99a, 99b. The fitting disk 3 and the empty disk 5 are interposed to form an adhesive tape cassette 1〇〇.

將黏著劑膠帶盒100和除濕材一起綑包，實施低溫 (-5°C〜- l〇°C )之管理並進行出貨。 其次’針對申請專利範圍第42〜46項記載之發明之 其他實施形態進行說明’以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第4 9圖所示之第2實施形態時，係一次即將黏著劑 11壓著至電路基板21之一邊全體者，黏著裝置27上配設 著可從黏著劑膠帶盒1〇〇拉出很長之黏著劑膠帶1的導引 件1 0 1。此第2實施形態時，因係一次即將黏著劑壓著至 電路基板21之一邊全體，而有良好之作業效率。 第50圖所示之第3實施形態時，在基材9之單面全 面塗布寬度W之黏著劑1 1，並利用縫隙1 02將黏著劑分 隔成2條。此第3實施形態之黏著劑膠帶丨時，縫隙1 〇2 應形成於將黏著劑膠帶盒100裝著至黏著裝置27後、將 黏著劑膠帶1壓著至電路基板21之前一瞬間。此時，亦 可在黏著裝置27之盒裝著部附近（如第47圖之S所示） 裝設工作面而在捲出之黏著劑膠帶1之黏著劑11上形成 -127- 1322649 縫隙102，亦可將第48圖所示之黏著劑膠帶之製造時之整 修步驟中形成縫隙者捲取至盤3者，亦可在塗工步驟乾燥 後，以捲取機31捲取之前一瞬間形成縫隙102者。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材9上之黏著劑1 1形成縫隙1 02，即可得到2條黏 著劑1 1 a、1 1 b，十分容易製造。The adhesive tape cassette 100 and the dehumidifying material are bundled together, and management at a low temperature (-5 ° C to - l ° ° C) is carried out and shipped. In the following description of the embodiments of the invention described in the claims of the present invention, the same reference numerals are given to the same parts as the above-mentioned embodiments, and the detailed description of the parts is omitted. The following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 49, the adhesive 11 is pressed to one side of the circuit board 21 at a time, and the adhesive device 27 is disposed so as to be long from the adhesive tape cassette 1 The guide member 1 0 1 of the adhesive tape 1 . In the second embodiment, the adhesive is pressed to the entire side of the circuit board 21 at a time, and the work efficiency is good. In the third embodiment shown in Fig. 50, the adhesive 1 of the width W is applied to the entire surface of the substrate 9 and the adhesive is divided into two by the slit 102. In the case of the adhesive tape of the third embodiment, the slit 1 〇 2 should be formed immediately before the adhesive tape cartridge 100 is attached to the adhesive device 27 and the adhesive tape 1 is pressed against the circuit substrate 21. At this time, a working surface may be provided in the vicinity of the boxed portion of the adhesive device 27 (as shown by S in Fig. 47) to form a -127- 1322649 slit 102 on the adhesive 11 of the adhesive tape 1 which is unwound. Alternatively, the gap formed in the refurbishing step of the adhesive tape shown in Fig. 48 may be taken up to the tray 3, or may be formed immediately after the coiler 31 is taken up after the coating step is dried. The gap 102 is. In the third embodiment, it is only necessary to form the slits 102 in the adhesive 1 1 on the substrate 9 obtained in the same manner as the conventional one, thereby obtaining two adhesives 1 1 a and 1 1 b, which is very easy. Manufacturing.

第51圖A及B所示之第4實施形態時，基材9之單 面全面塗布著黏著劑11(第51圖A)，將收容此黏著劑 膠帶1之黏著劑膠帶盒1 〇〇以和第1實施形態相同之方式 裝著至黏著裝置27，對黏著劑膠帶1之寬度W方向之部 份黏著劑Π ( 1條份）實施加熱加壓，降低該部份之凝聚 力，只有加熱加壓之部份黏著劑11a會從基材9剝離而壓 著至電路基板21 (第51圖B)。 此時，會沿著加熱加壓頭19之周圍形成凝聚力降低 線1 03 (第5 1圖A )，實施加熱加壓部份之全部黏著劑應 φ 舄呈現軟化流動（簡易指標爲1 〇〇〇泊以下）而未開始黏 蓍劑之硬化反應、或低位狀態（簡易指標爲反應率20%以 下），加熱溫度應對應使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑Η在使用時’只有寬度 W方向之1條份25a會軟化流動化而被壓著至基板電路。 其次，針對申請專利範圍第47〜49項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板同 間之黏著固定及兩者之電極間之電性連接的黏著材膠帶’ -128- 1322649 尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第47〜49項記載之發明之 背景技術進行說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。In the fourth embodiment shown in Figs. 51A and A, the adhesive material 11 (Fig. 51A) is entirely applied to one surface of the substrate 9, and the adhesive tape cassette 1 for accommodating the adhesive tape 1 is used. In the same manner as in the first embodiment, the adhesive device 27 is attached to the adhesive device 27, and a part of the adhesive Π (1 part) in the width W direction of the adhesive tape 1 is heated and pressurized to reduce the cohesive force of the portion, and only the heating is applied. The pressure-sensitive adhesive portion 11a is peeled off from the substrate 9 and pressed against the circuit board 21 (Fig. 51B). At this time, a cohesive force reduction line 103 (Fig. 5A) is formed along the periphery of the heating and pressurizing head 19, and all the adhesives subjected to the heating and pressurizing portion should exhibit a softening flow of φ 舄 (simple index is 1 〇〇) The following curing conditions are not carried out, and the curing reaction of the adhesive is not started, or the low state (the simple index is 20% or less), and the heating temperature should be selected according to the adhesive system to be used. In the fourth embodiment, when the adhesive Η is used, only one of the portions 25a in the width W direction is softened and fluidized and pressed against the substrate circuit. Next, the invention described in the claims 47 to 49 will be described. These inventions relate to an adhesive tape of an electronic component and a circuit board, or a circuit board, and an electrical connection between the electrodes of the two, '128- 1322649, in particular, related to a disk-shaped adhesive tape. . Next, the background art of the invention described in the claims of claims 47 to 49 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape.

曰本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0m程度》 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上》 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子Japanese Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape is attached (hereinafter referred to as "adhesive". The material plate" is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive sheet is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive sheet are mounted on the adhesive device, and the adhesive material is attached. The beginning of the tape is mounted on the take-up reel. However, in recent years, as the panel size of the PDP and the like has increased, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is very troublesome, so it is impossible to raise the electronic

1322649 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。1322649 The problem of the productivity of the machine. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging.

此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第4 7〜4 9項記載之發明的目的 ’係在提供一種黏著材膠帶，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第47〜49 項記載之發明之實施形態進行說明。 參照第52圖A、B、第3圖、第4圖、第29圖、及 第5圖’針對申請專利範圍第47〜49項記載之發明之第1 實施形態進行說明。第5 2圖A及B係本實施形態之黏著 材膠帶之連接圖，第5 2圖A係黏著材盤間之連接的斜視 圖’第52圖B係第52圖A之連接部份的剖面圖。 黏著材膠帶1係分別捲繞於盤3' 3a，各盤3、3a上 配設著捲軸5'及配置於黏著材膠帶1之兩寬度側之側板 黏著材膠帶1係由基材9、及塗布於基材9之一側面 -130- 1322649 之黏著劑11所構成。 基材9具有支持層9b、及從兩側夾住前述支持層9b 之熱熔融劑層（熱金屬層）9a，構成熱熔融劑層9a之熱 熔融劑（熱金屬）係採用熱可塑性樹脂之聚乙嫌、SB S( 苯乙Μ 丁一燦苯乙嫌嵌段共聚物）、耐綸等，支持層9b 則係使用OPP (延伸聚丙稀）、聚四氟乙烦、或PET (聚 對苯二甲酸乙二酯）等之塑膠、玻璃纖維、芳香族聚醯胺 纖維、或碳纖維等之強化纖維。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂 '或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又、熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 黏著劑11內亦可分散著導電粒子13。導電粒子13係 如Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 φ 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷 '塑膠等高分子核材等覆蓋前述之導電層而形成 者。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子 '或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 '沒胃融點’在廣泛之連接溫度下亦可控制於軟化狀態，而 -131 - 1322649 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 4-7 to 49 is to provide an adhesive tape which can easily replace the adhesive disk and improve the production efficiency of the electronic device. Next, an embodiment of the invention described in claims 47 to 49 of the patent application will be described with reference to the attached drawings. Referring to Fig. 52, A, B, Fig. 3, Fig. 4, Fig. 29, and Fig. 5', the first embodiment of the invention described in claims 47 to 49 will be described. Fig. 5A and Figs. 2A and B are connection diagrams of the adhesive tape of the present embodiment, and Fig. 5A is a perspective view of the connection between the adhesive sheets. Fig. 52B is a section of the connecting portion of Fig. 52A. Figure. The adhesive tape 1 is wound around the disc 3' 3a, and the reel 5' is disposed on each of the discs 3, 3a, and the side panel adhesive tape 1 disposed on the two width sides of the adhesive tape 1 is made of the substrate 9, and The adhesive 11 is applied to one side of the substrate 9 - 130 - 1322649. The substrate 9 has a support layer 9b and a hot melt layer (hot metal layer) 9a sandwiching the support layer 9b from both sides, and a hot melt (hot metal) constituting the hot melt layer 9a is made of a thermoplastic resin. Polyethylene, SB S (styrene), nylon, etc., support layer 9b is OPP (extended polypropylene), polytetrafluoroethylene, or PET (poly pair) A reinforcing fiber such as plastic, glass fiber, aromatic polyamide fiber, or carbon fiber such as ethylene phthalate. The adhesive 1 1 is a mixture of a thermoplastic resin, a thermosetting resin, or a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type as the representative adhesive agent 11. The conductive particles 13 are dispersed. The conductive particles 13 are metal particles φ such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, or solder, or carbon, graphite, or the like, and may be in the foregoing and/or non-conductive glass, A ceramic polymer such as plastic is covered with the above-mentioned conductive layer. Further, 'the insulating coating particles of the conductive particles covered with an insulating layer' or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is better to use a polymer as a core material. For example, solder can be controlled to soften at a wide connection temperature due to 'no stomach melting point', and -131 - 1322649 can be easily obtained to correspond to an electrode. A connecting member that is inaccurate in thickness and flatness.

其次’針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取盤 17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠帶1 之前端經由導引銷22裝設至捲取盤7，並捲出黏著材膠帶 1(第3圖中之箭頭E)。其次，將黏著材膠帶1配置於 電路基板21上’以配置於兩盤3a、17間之加熱加壓頭19 從基材9側實施黏著材膠帶1之壓接，將黏著劑U壓著 至電路基板。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑11上配置配線電路（或電子構件）23，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭19對電路基板21實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑11會壓著至PDP 26之周圍 全體，一次使用之黏著劑11的使用量會明顯大於傳統上 之使用量。因此，捲繞於盤3a上之黏著材膠帶1之使用 量亦會變多，因爲捲繞於盤3a上之黏著材膠帶1會在相 對較短之時間內被捲取至捲取盤17，而露出捲繞於盤3a 上之黏著材膠帶1之結束標記28(參照第52圖A)。 如第52圖A所示，在盤3a之黏著材膠帶1露出結束 標記28時，爲了將盤3a更換成新黏著材盤3，連接盤3a -132- 1322649 之黏著材膠帶（一方之黏著材膠帶）1之終端部30'及捲 繞於新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶 )1之始端部32。Next, the method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 3, the disc 3a of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3a is attached to the front end via the guide pin 22. The disc 7 is taken up and the adhesive tape 1 is unwound (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21. The pressure-adhesive tape 1 is pressed from the substrate 9 side by the heating and pressing head 19 disposed between the two trays 3a and 17, and the adhesive U is pressed to Circuit board. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the adhesive 11 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as a cushioning material to heat the pressing head 19 The circuit board 21 performs heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed against the entire periphery of the PDP 26, and the amount of the adhesive 11 used at one time is significantly larger than that of the conventional one. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased because the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a relatively short period of time. The end mark 28 of the adhesive tape 1 wound around the disk 3a is exposed (refer to Fig. 52A). As shown in Fig. 52A, when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, in order to replace the disc 3a with the new adhesive sheet 3, the adhesive tape of the gusset 3a - 132 - 1322649 (adhesive material of one side) The end portion 30' of the tape) 1 and the beginning end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive sheet 3.

此黏著材膠帶1之連接上，如第52圖B所示’針對 黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部32，使始端部32之黏著劑Π 面重疊於終端部30之基材9之熱熔融劑層9a上，並將此 部份置於工作台104上。其次，以黏著裝置15之加熱加 壓頭19實施重疊部份之加熱，使熱熔融劑層9a熔融後， 利用冷卻來使熱熔融劑固化，實施終端部30及始端部32 之連接。利用此方式，可實施捲繞於已使用之盤3a上之 黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接 其次，將已使用之盤3a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 φ 著至捲取盤17之作業。又’因爲捲取盤17係只捲取基材 9，故可捲取數個黏著材盤份，減少捲取盤17之更換次數 ，而有良好之作業效率。 此處’參照第5圖，針對本實施形態之黏著材膠帶j 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗$ 機27塗布由樹脂及導電粒子13混合而成之黏著劑u，並 以乾燥爐29實施乾燥後’以捲取機31捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機33切成特定 -133- 1322649 將其和 並進行 發明之 和上述 之詳細 主。 1之基 時，如 —方之 1之始 加壓頭 融劑從 ，實施 係夾於 等之附 限於上 -49項 兩側夾 ，並不 著裝置 寬度並捲取至捲軸後，從兩側將側板裝著至捲軸， 除濕材一起綑包，實施低溫（-5 °C〜-10 °C )之管理 出貨。 其次，針對申請專利範圍第47〜49項記載之 其他實施形態進行說明，以下說明之實施形態中， 實施形態相同之部份會附與相同符號並省略該部份 說明，以下之說明係以和上述實施形態不同之點爲The connection of the adhesive tape 1 is as shown in Fig. 52B, 'the end portion 30 of the adhesive tape 1 for the adhesive sheet 3a, and the beginning end 32 of the adhesive tape 1 of the new adhesive sheet 3, so that the beginning The adhesive portion of the portion 32 is superposed on the hot melt layer 9a of the substrate 9 of the terminal portion 30, and this portion is placed on the table 104. Then, the heating portion 15 of the bonding device 15 is heated by the overlapping portion to melt the hot melt layer 9a, and then the hot melt is solidified by cooling to connect the terminal portion 30 and the start end portion 32. In this manner, the adhesive tape 1 wound on the used tray 3a and the adhesive tape 1 wound on the new tray 3 can be connected, and the used tray 3a and the new tray 3 can be mutually opposed. Change, the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17. Moreover, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive discs can be taken up, and the number of replacements of the take-up reel 17 can be reduced, and the work efficiency is good. Here, a method of manufacturing the adhesive tape j of the present embodiment will be described with reference to Fig. 5 . On the substrate which is unwound from the unwinding machine 25, the adhesive u obtained by mixing the resin and the conductive particles 13 is applied by the coating machine 27, and dried in the drying furnace 29, and then taken up by the winding machine 31. Take the original material. The original material of the adhesive tape 1 to be taken up is cut into specific ones by a cutter 33 - 133 - 1322649 and is combined and invented and detailed above. When the base of 1 is the same as the beginning of the 1st, the pressure of the head is from the side, and the attachment is limited to the upper-49 items on both sides of the clamp, without the width of the device and after being taken up to the reel, from both sides The side plates are attached to the reels, and the dehumidifying materials are bundled together, and the low temperature (-5 ° C to -10 ° C) is managed and shipped. In the following description of the embodiments of the present invention, the same reference numerals are given to the same parts in the embodiments described below, and the same reference numerals will be given to the same parts, and the following description will be omitted. The difference between the above embodiments is

第5 3圖所示之第2實施形態時，黏著材膠帶 材9上，熱熔融劑層9a會夾於支持層9b之間。此 第3圖所示，爲了實施黏著材膠帶1間之連接，在 黏著材膠帶1之終端部30及另一方之黏著材膠帶 端部32互相抵接之位置上，以黏著裝置15之加熱 19實施熱熔融劑層9a之加熱。實施加熱會使熱熔 熱熔融劑層9a滲出，利用冷卻來使熱熔融劑固化 黏著材膠帶1間之連接。如此，因熱熔融劑層9a φ 支持層9b之間，而可防止因爲濕氣之吸濕或灰塵 著而降低熱熔融劑層9a之黏著強度。 申請專利範圍第4 7〜4 9項記載之發明並未受 述之實施形態，只要在未背離申請專利範圍第4 7 〃 記載之發明之要旨的範圍內，可實施各種變形。 第1實施形態時，基材9係由支持層9b、及從 住支持層9b之熱熔融劑層9a之3層所構成，然而 限於此，亦可以爲4層以上》 本實施形態時，連接部份之加熱壓著係利用黏 -134- 1322649 1 5之加熱加壓頭1 9，然而，亦可採用其他加熱器來取代 加熱加壓頭19，對連接部份進行加熱，實施黏著材膠帶1 間之連接。 其次，針對申請專利範圍第5 0〜5 1項記載之發明進 行說明。In the second embodiment shown in Fig. 5, the hot melt layer 9a is sandwiched between the support layers 9b on the adhesive tape material 9. As shown in Fig. 3, in order to carry out the connection between the adhesive tapes 1, the end portion 30 of the adhesive tape 1 and the other end portion 32 of the adhesive tape abut each other with the heat of the adhesive device 15 19 Heating of the hot melt layer 9a is carried out. Heating is performed to bleed out the hot-melt hot-melt layer 9a, and the hot-melt agent is solidified by cooling to bond the adhesive tape 1 therebetween. Thus, since the hot melt layer 9a φ supports between the layers 9b, it is possible to prevent the adhesion strength of the hot melt layer 9a from being lowered due to moisture absorption or dust. The invention described in the claims of the invention is not limited to the scope of the invention, and various modifications can be made without departing from the spirit and scope of the invention as described in the appended claims. In the first embodiment, the base material 9 is composed of the support layer 9b and the three layers of the hot melt layer 9a of the support layer 9b. However, the present invention may be four or more layers. Part of the heating and pressing system uses the heat-pressing head of the adhesive -134- 1322649 15 5, however, other heaters may be used instead of the heating and pressing head 19, and the connecting portion is heated to implement the adhesive tape. 1 connection. Next, the invention described in the claims 50 to 5 will be described.

這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著•固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板之半導體裝置上所使用之黏著材膠帶，尤其是 ，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第50〜5 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 φ 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶、微BGA· CSP等之黏著膜等 ’其目的則在提高半導體裝置全體之生產性及信賴性。 日本特開2001 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統之黏著材膠帶，爲了避免黏著劑固著於基材 上、或較容易剝離，會在基材之兩面實施矽處理。 -135- 1322649 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. In addition, the adhesive tape used for the semiconductor device in which the semiconductor element (wafer) is adhered and fixed to the fixing support substrate of the lead frame or the lead frame, or the semiconductor device mounting substrate is used, in particular, It is related to the connection method of the adhesive tape which is rolled into a disk shape. Next, the background art of the invention described in the claims 50 to 5 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, φ or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Further, the adhesive tape is also applied to a lead frame fixing tape, a LOC tape, a die-bonding tape, an adhesive film such as a micro BGA/CSP, etc., and the purpose is to improve the productivity and reliability of the entire semiconductor device. Japanese Laid-Open Patent Publication No. 2001-284005 discloses a method in which an adhesive tape coated with an adhesive material on a substrate is wound into a disk shape. Such conventional adhesive tapes are treated on both sides of the substrate in order to prevent the adhesive from sticking to the substrate or to be easily peeled off. -135- 1322649 When the adhesive tape is attached to the adhesive device, the adhesive tape plate (hereinafter referred to as "adhesive plate") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and installed. Roll up the disk. Next, the adhesive is pressed onto the circuit board or the like by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the remaining substrate is taken up by a take-up reel.

其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新黏著材盤裝著至黏著裝置， 並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第50〜51項記載之發明的目的 -136- 1322649 ，係提供一種黏著材膠帶之連接方法’可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。Secondly, when the adhesive tape of the adhesive material disc is used up, the used disc and the take-up reel of the take-up substrate are removed, the new adhesive disc is loaded to the adhesive device, and the beginning of the adhesive tape is installed. On the take-up tray. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3 mm, if the number of volumes is increased, the winding may be scattered. Further, if the number of windings is increased, the pressure applied to the adhesive tape which is wound into a tape shape is increased, and the adhesive may be oozing out from both sides of the tape to cause clogging. In addition, if the number of rolls of the adhesive tape is increased, the diameter of the disk may also increase, and the existing adhesive device may not be used because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the 50th to 51st patents is -136- 1322649, which provides a method of joining adhesive tapes, which makes it easier to replace the adhesive disk and improve the production efficiency of the electronic device.

其次，參照附錄圖面，針對申請專利範圍第50〜51 項記載之發明之實施形態進行說明。首先，參照第54圖 A〜C、第55圖、第56圖、第4圖、及第29圖，針對申 請專利範圍第5 0〜5 1項記載之發明之第1實施形態進行 說明。第54圖A〜C係第55圖之連接部份之連接步驟的 剖面圖，第54圖A係放電前之黏著材膠帶之狀態，第54 圖B係放電後之黏著材膠帶之狀態，第54圖C係連接部 份之加熱壓著圖。第55圖係黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第5 6圖係黏著裝置之黏著劑壓 著步驟的槪略圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及黏著劑11之剝離性而言，基材9應採用 0PP (延伸聚丙烯）、聚四氟乙烯、及PET (聚對苯二甲 酸乙二醋）等’以脫模劑9a實施表面處理。脫膜劑係採 用稀系脫模劑、乙二醇廿八碳酸酯、棕櫚蠟、石油系蠟等 低融點蠟 '低分子量氟樹脂、矽系或氟系之界面活性劑、 油、躐、樹脂、聚酯變性矽樹脂等，一般爲矽樹脂。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 -137- 熱可塑性樹脂及熱硬化性樹脂之混合物 係以苯乙烯樹脂系及聚酯樹脂系爲代表 脂系係以環氧樹脂系、壓克力樹脂系、Next, an embodiment of the invention described in the claims 50 to 51 will be described with reference to the attached drawings. First, a first embodiment of the invention described in the patent claims 50 to 5 will be described with reference to Figs. 54A to C, 55, 56, 4, and 29. Fig. 54 is a cross-sectional view showing the connection step of the connecting portion of Fig. 55 to Fig. 55, Fig. 54A showing the state of the adhesive tape before discharge, and Fig. 54B showing the state of the adhesive tape after discharge. Figure 54 is a heating and pressing diagram of the connecting portion. Fig. 55 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method, and Fig. 56 is a schematic view showing the adhesive pressing step of the adhesive device. The adhesive tape 1 is wound around the discs 3, 3a, respectively, and the reels 5 and the side plates 配置 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 3a. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. From the viewpoint of the strength and the releasability of the adhesive 11, the substrate 9 should be treated with a release agent 9a using 0PP (stretched polypropylene), polytetrafluoroethylene, and PET (polyethylene terephthalate). Surface treatment. The release agent is a low melting point wax such as a rare mold release agent, ethylene glycol octacarbonate, palm wax or petroleum wax, low molecular weight fluororesin, lanthanide or fluorine surfactant, oil, hydrazine, Resin, polyester modified enamel resin, etc., generally enamel resin. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, or a mixture of -137-thermoplastic resin and thermosetting resin, and a styrene resin or a polyester resin is a resin system. Acrylic resin system,

1322649 黏著劑11內亦可分散著導電粒子] 如 Au、 Ag、 Pt、 Ni、 Cu、 W、 Sb、 Sn 子、或碳、石墨等，亦可在前述之物i 璃、陶瓷、塑膠等高分子核材等覆蓋前 。此外，亦可應用以絕緣層覆蓋前述導 粒子、或倂用導電粒子及絕緣粒子等。 金屬、或塑膠等之高分子核材上形成導 加熱加壓或加壓而產生變形之變形性， 距離會縮小，連接時可增加和電路接觸 信賴性。尤其是，以高分子類做爲核材 有融點，在廣泛之連接溫度下亦可控制 得到很容易即可對應電極之厚度及平坦 件。 其次，針對本實施形態之黏著材膠 說明。如第5 6圖所示，將黏著材膠帶 盤17裝著至黏著裝置15，將捲繞於盤 1之前端經由導引銷22裝設至捲取盤 膠帶1(第56圖中之箭頭E)。其次， 置於電路.基板21上，利用配置於兩盤 壓頭19從基材9側實施黏著材膠帶1 。熱可塑性樹脂系 ’又，熱硬化性樹 及矽樹脂系爲代表 3。導電粒子1 3係 、焊錫等之金屬粒 t /或非導電性之玻 述導電層等來形成 電粒子之絕緣覆膜 在焊錫等之熱熔融 電層者，會具有因 故連接後之電極間 之面積，而可提高 更佳，如焊錫因沒 於軟化狀態，而可 性之誤差的連接構 帶之使用方法進行 1之盤3a、及捲取 3a上之黏著材膠帶 1 7，並捲出黏著材 將黏著材膠帶1配 3、1 7間之加熱加 之壓接，將黏著劑 -138-1322649 The conductive particles may also be dispersed in the adhesive 11] such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, or carbon, graphite, etc., and may also be in the above-mentioned materials such as glass, ceramics, and plastic. Molecular nuclear material before covering. Further, it is also possible to apply the insulating particles to cover the above-mentioned conductive particles, or to use conductive particles and insulating particles. The polymer core material such as metal or plastic is deformed by heating, pressurizing or pressurizing, and the distance is reduced. When connected, the reliability of contact with the circuit can be increased. In particular, the use of polymers as a core material has a melting point, and can be controlled at a wide range of connection temperatures to obtain a thickness and a flat part of the electrode. Next, the adhesive material of the present embodiment will be described. As shown in Fig. 5, the adhesive tape tray 17 is attached to the adhesive device 15, and the front end wound around the disk 1 is attached to the take-up reel tape 1 via the guide pin 22 (arrow E in Fig. 56). ). Next, it is placed on the circuit board 21, and the adhesive tape 1 is applied from the substrate 9 side by the two plate nips 19. The thermoplastic resin is further represented by a thermosetting tree and an anthracene resin. An insulating film formed of conductive particles such as a conductive particle 13 or a metal particle t such as a solder or a non-conductive conductive layer or the like may be formed between the electrodes of the solder and the like. The area can be improved, for example, if the solder is not softened, and the connection of the variability is used, the bonding tape of the disk 3a, and the adhesive tape of the winding 3a are rolled out and rolled out. Adhesive material will be adhesive tape 1 with 3, 17 heat and pressure bonding, the adhesive -138-

1322649 11壓著至電路基板21。其後，將基材9捲取至捲取 其次，如第4圖所示，在壓著至電路基板21 著劑11上配置配線電路（或電子構件）23，將聚 烯材24當做緩衝材，以加熱加壓頭19對電路基板 施配線電路23之加熱加壓。利用此方式，可連接 板21之電極21a及配線電路23之電極23a。 如第2 9圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑1 1會壓著至PDP 26之 全體，可知一次使用之黏著劑11的使用量會遠大於 上之使用量。因此，捲繞於盤3a上之黏著材膠帶1 用量亦會增多，捲繞於盤3a上之黏著材膠帶1在相 短之時間內會被捲取至捲取盤17，而露出捲繞於盤 之黏著材膠帶1之結束標記28 (參照第55圖）。 如第55圖所示，爲了將盤3a更換成新黏著材蓮 會在盤3a之黏著材膠帶1上連接盤3a之黏著材膠帶 方之黏著材膠帶）1之終端部30、及捲繞於新黏著相 上之黏著材膠帶（另一方之黏著材膠帶）1之始端部 此黏著材膠帶1之連接上’如第54圖B所示’ 使用之盤3a之黏著材膠帶1之終端部30置於放電榜 之照射位置。其次，對基材9之表面實施放電，去除 劑9a。 其次，使另一方之黏著材膠帶1之始端部32之 劑11面重疊於已去除脫模劑9a之基材9面（第541322649 11 is pressed to the circuit substrate 21. Thereafter, the substrate 9 is taken up to the winding second, and as shown in Fig. 4, the wiring circuit (or electronic member) 23 is placed on the substrate 11 of the circuit substrate 21, and the polyene material 24 is used as a cushioning material. The heating and pressurizing head 19 heats and presses the wiring circuit 23 of the circuit board. In this manner, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in the connection portion of the adhesive tape 1 of the present embodiment shown in Fig. 29, the adhesive 11 is pressed against the entire PDP 26, and it is understood that the amount of the adhesive 11 used at one time is much larger than that of the PDP 26. The amount used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a is also increased, and the adhesive tape 1 wound on the disk 3a is taken up to the take-up reel 17 in a short time, and is exposed and wound. The end mark 28 of the adhesive tape 1 of the disc (refer to Fig. 55). As shown in Fig. 55, in order to replace the disk 3a with a new adhesive material, the end portion 30 of the adhesive tape 1 of the adhesive tape of the disk 3a is attached to the adhesive tape 1 of the disk 3a, and is wound around Adhesive tape on the newly adhered phase (adhesive tape on the other side) 1 is connected to the adhesive tape 1 at the beginning of the adhesive tape 1 as shown in Fig. 54B. The end portion 30 of the adhesive tape 1 of the disc 3a used. Placed on the discharge position of the discharge chart. Next, discharge is applied to the surface of the substrate 9 to remove the agent 9a. Next, the surface of the agent 11 of the other end of the adhesive tape 1 is superposed on the surface of the substrate 9 from which the release agent 9a has been removed (54th).

盤1 7 :之黏 I氟乙 21實 〖路基 PDP :周圍 〖傳統 之使 丨對較 3 a上 13, s ~ [•盤3 32。 將已 I 105 :脫模 黏著 圖C -139- 1322649 )。將兩者之重疊部份置於工作台’以黏著裝置15之加 熱加壓頭19進行加熱加壓實施黏著。利用此方式’可實 施捲繞於已使用之盤3a上之黏著材膠帶1、及捲繞於新盤 3上之黏著材膠帶1之連接。 其次，將已使用之盤3a及新盤3互相對換，將新盤3 裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1裝 著至捲取盤17之作業。Disk 1 7 : Sticky I fluoroethylene 21 〖 Subgrade PDP: Around 〖Traditional 丨 丨 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对Will have I 105 : release the adhesive figure C - 139 - 1322649 ). The overlapping portion of the two is placed on the table, and the bonding is performed by heating and pressing the heating head 19 of the bonding device 15. By this means, the bonding of the adhesive tape 1 wound around the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be realized. Next, the used disc 3a and the new disc 3 are mutually exchanged, and the new disc 3 is attached to the adhesive device 15. Therefore, it is not necessary to carry out the work of attaching the new adhesive tape 1 to the take-up reel 17.

此實施形態因係利用加熱加壓頭1 9，而無需使用其他 黏著材膠帶1間之連接器具，即可更換已捲繞著黏著材膠 帶1之盤3、3a。又，因爲捲取盤17只會捲取基材9，故 可捲取數個黏著材盤份，減少捲取盤17之更換次數，而 有良好之作業效率。 申請專利範圍第5 0〜5 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 0〜5 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，去除已結束捲取之一方之 黏著材膠帶1之基材9之脫模劑9a，將新黏著材膠帶1之 黏著劑1 1面重疊於此部份，並以加熱加壓頭1 9實施加熱 加壓進行黏著來連接兩者’然而’亦可去除新黏著材膠帶 1之基材9之脫模劑9a，將已結束捲取之一方之黏著材膠 帶1之黏著劑11面重疊於此部份來連接兩者。 去除脫模劑9a之方法，除了電漿放電以外，亦可以 爲紫外線照射或雷射照射之方法’紫外線照射時，例如將 水銀燈當做光源使用，實施一定時間之水銀燈的紫外線照 -140- 1322649 射。其次，雷射照射時，則利用以雷射振盪器照射之雷射 光來分解飛散脫模劑9a，去除脫模劑9a » 上述係針對電子構件及電路基板、以及電路基板間之 黏著固定時進行說明，然而，亦可應用於將半導體元件（ 晶片）黏著•固定至引線框架之固定用支持基板、引線框 架之晶片、半導體元件載置用支持基板之半導體裝置所使 用之黏著材膠帶。In this embodiment, the discs 3, 3a around which the adhesive tape 1 has been wound can be replaced by using the heating and pressing head 19 without using a connecting device between the other adhesive tapes 1. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive disc portions can be taken up, and the number of replacement of the take-up reel 17 can be reduced, and the work efficiency is good. The invention described in the claims 5th to 5th is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in the claims 50 to 51. . For example, in the above embodiment, the release agent 9a of the base material 9 of the adhesive tape 1 which has been wound up is removed, and the surface of the adhesive 1 1 of the new adhesive tape 1 is superposed on this portion, and The heating and pressing head 19 is heated and pressurized to adhere to the two. However, the releasing agent 9a of the substrate 9 of the new adhesive tape 1 can be removed, and the adhesive tape 1 which has been wound up is finished. Adhesive 11 overlaps this portion to connect the two. The method of removing the release agent 9a, in addition to the plasma discharge, may also be a method of ultraviolet irradiation or laser irradiation. When ultraviolet irradiation is used, for example, a mercury lamp is used as a light source, and ultraviolet light of a mercury lamp is irradiated for a certain period of time - 140-1322649 . Next, in the case of laser irradiation, the scattering release agent 9a is decomposed by the laser light irradiated by the laser oscillator, and the release agent 9a is removed. The above is performed for the adhesion between the electronic component, the circuit board, and the circuit board. In addition, it is also applicable to an adhesive tape used for a semiconductor device in which a semiconductor element (wafer) is adhered and fixed to a fixing support substrate of a lead frame, a wafer of a lead frame, and a semiconductor device mounting substrate.

其次，針對申請專利範圍第52〜58項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定及兩者之電極間之電性連接的黏著材膠帶。又 ，係關於在將半導體元件（晶片）黏著♦固定至引線框架 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板所使用之半導體裝置使用之黏著材膠帶，尤其 是，和捲成盤狀之黏著材膠帶盤相關。 其次，針對申請專利範圍第52〜58項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶等’例如，使用引線固定膠帶 之目的，係用以固定引線框架之引線銷，提高引線框架自 -141 - 1322649 體或半導體裝置全體之生產性及信賴性。Next, the invention described in the patent application section 52 to 58 will be described. These inventions relate to an adhesive tape for electrically connecting an electronic component and a circuit board, or a circuit board, and electrically connecting the electrodes of the two. In addition, the adhesive tape used in the semiconductor device used for fixing the semiconductor element (wafer) to the fixing support substrate or the lead frame of the lead frame or the semiconductor device mounting substrate, in particular, It is associated with a roll of adhesive tape that is rolled into a disk shape. Next, the background art of the invention described in the patent application section 52 to 58 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or a circuit board, and an electric connection between the electrodes The method of sexual connection is to use adhesive tape. Also, 'adhesive tape is also applied to lead frame fixing tape, LOC tape, die-bonded tape, etc.' For example, the purpose of using lead fixing tape is to fix the lead pin of the lead frame, and to improve the lead frame from - 141 - 1322649 Productivity and reliability of the entire body or semiconductor device.

隨著電子機器之小型·輕量化發展，半導體裝置亦推 展被稱爲微BGA (球形陣列）或CSP (晶片尺寸封裝）之 小型封裝之開發，前述微BGA (球形陣列）或CSP (晶片 尺寸封裝）係在半導體裝置（封裝）下部以區域陣列狀配 置其外部端子，這些封裝之構造上，係在具有1層或多層 配線構造之玻璃環氧基板或聚醯亞胺基板等半導體元件載 置用支持基板上，利用黏著劑載置半導體元件（晶片）， 半導體元件側之端子及基板之配線板側端子則以絲焊或倒 裝晶片方式連接，連接部、及晶片上面部或端面部以環氧 系密封材或環氧系液狀密封材進行密封，在配線基板背面 以區域陣列狀配置焊球等金屬端子。又，QFN ( Quad FlatWith the development of small and lightweight electronic devices, semiconductor devices are also developing a small package called Micro BGA (Spherical Array) or CSP (Chip Size Package), the aforementioned micro BGA (spherical array) or CSP (wafer size package). The external terminals are arranged in a region array in the lower portion of the semiconductor device (package), and the structure of these packages is for semiconductor element mounting such as a glass epoxy substrate or a polyimide substrate having a one-layer or multi-layer wiring structure. On the support substrate, a semiconductor element (wafer) is placed on the substrate, and the terminal on the semiconductor element side and the wiring board side terminal on the substrate are connected by wire bonding or flip chip bonding, and the connection portion and the upper surface portion or the end surface portion of the wafer are looped. The oxygen-based sealing material or the epoxy-based liquid sealing material is sealed, and metal terminals such as solder balls are arranged in an array of regions on the back surface of the wiring board. Again, QFN ( Quad Flat

Non-leaded Package )或 SON ( Small Outline Non-leaded Package )等亦採用黏著材膠帶。其次，在電子機器之基 板上，以迴焊方式實施高密度之複數個上述封裝之全面一 φ 齊安裝。其次，利用黏著劑載置引線框架之晶片及半導體 元件（晶片），以絲焊連接半導體元件側之端子及引線框 架端子，以環氧系密封材或環氧系液狀密封材密封連接部 、及晶片上面部或端面部。此種半導體裝置之黏著劑亦採 用黏著材膠帶。 日本特開2001-284005號公報中，電極間之電性連接 方法係將基材上塗布著黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 -142- 1322649 將黏著材膠帶裝著於黏著裝置時，將盤上捲繞著黏著 材膠帶之黏著材膠帶盤裝設至黏著裝置，拉出黏著材膠帶 之始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出 之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路 基板等，再以捲取盤捲取殘餘之基材。Adhesive tape is also used for Non-leaded Package or SON (Small Outline Non-leaded Package). Next, on the substrate of the electronic machine, a full-scale φ-mounting of a plurality of the above-mentioned packages of high density is performed by reflow. Next, the wafer and the semiconductor element (wafer) on which the lead frame is placed by the adhesive are used to wire-bond the terminal on the semiconductor element side and the lead frame terminal, and the connection portion is sealed with an epoxy-based sealing material or an epoxy-based liquid sealing material. And the upper face or the end face of the wafer. Adhesive tapes are also used for the adhesives of such semiconductor devices. In Japanese Laid-Open Patent Publication No. 2001-284005, the method of electrically connecting the electrodes is to roll the adhesive tape on the substrate coated with the adhesive material into a disk shape. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. -142- 1322649 When the adhesive tape is attached to the adhesive device, the adhesive tape tape on which the adhesive tape is wound is mounted on the adhesive device to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel . Next, the adhesive is pressed against the substrate or the like by a heating and pressing head from the substrate side of the adhesive tape wound from the adhesive tape, and the remaining substrate is taken up by a take-up reel.

其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化，電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材膠帶盤的更換 更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無法 提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因，或者，盤之 直徑尺寸增大而可能因無法裝著於既存之黏著裝置上而無 法使用既存之黏著裝置。 其次，黏著材膠帶盤若使黏著材膠帶直接曝露於大氣 -143- 1322649 下，則可能因爲灰塵或濕氣而導致品質降低。 因此，申請專利範圍第52〜58項記載之發明的目的 ，係在提供一種黏著材膠帶盤，黏著材膠帶盤之更換比較 簡單，而可提高電子機器之生產效率及維持黏著材膠帶之 品質。Secondly, when the adhesive tape of one of the adhesive tapes is used up, the used tray and the take-up tray of the take-up substrate are removed, and the new take-up tray and the new adhesive tape are loaded onto the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, as the panel image of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive tape of the electronic machine manufacturing factory is more frequent, because the replacement of the adhesive tape is very troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount per disk, in order to reduce the frequency of replacement of the disk, however, because the tape width of the adhesive tape is narrower. 1 to 3mm, if the number of volumes is increased, the winding may be scattered. Moreover, if the number of rolls is increased, the pressure of the adhesive tape which is applied to the tape-like tape may increase, and the adhesive may leak out from both sides of the tape to cause blockage, or the diameter of the disk may increase due to the increase in the diameter of the disk. It cannot be attached to an existing adhesive device and cannot use an existing adhesive device. Secondly, if the adhesive tape is directly exposed to the atmosphere -143-1322649, the quality may be degraded due to dust or moisture. Therefore, the object of the invention described in claims 52 to 58 is to provide an adhesive tape tray in which the replacement of the adhesive tape is relatively simple, and the production efficiency of the electronic device can be improved and the quality of the adhesive tape can be maintained.

其次，參照附錄圖面，以電極連接用之黏著材膠帶爲 例，針對申請專利範圍第52〜5 8項記載之發明之實施形 態進行說明，然而，半導體元件連接用之黏著材膠帶亦相 同。首先，參照第57圖A〜C、第3圖、第4圖、第29 圖、及第5 8圖，針對申請專利範圍第5 2〜5 8項記載之發 明之第1實施形態進行說明。第5 7圖A〜C係第1實施形 態之黏著材膠帶盤圖，第57圖A係黏著材膠帶盤的斜視 圖，第57圖B係第57圖A之正面圖，第57圖C係第57 圖A之蓋體構件之正面圖，第58圖係黏著材膠帶之製造 方法的步驟圖。 本實施形態之黏著材膠帶盤A，具有複數之黏著材膠 帶1之捲部（以下簡稱爲捲部）2、2a，捲部2、2a具有 已捲繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著 捲軸5、及配置於黏著材膠帶1之兩寬度側之側板7、7a 、7b。如第3圖所示，黏著材膠帶1係由基材9、及塗布 於基材9之一側面之黏著劑1 1所構成。未使用之捲部2a 上，覆蓋捲繞於盤3a上之黏著材膠帶1之周圍的蓋體構 件8，以可自由裝卸之方式裝設於盤3a上。 又，捲部2、2 a之內側之側板7 a上，配設著乾燥劑 -144- 1322649 之收容部（收容空間）12，收容剖12內收容著矽凝膠 等乾燥劑10，用以從內部去除未使用之捲部2a內之濕氣 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。Next, the embodiment of the invention described in the patent application Nos. 52 to 58 will be described with reference to the drawings of the appendix, and the adhesive tape for the connection of the semiconductor elements is the same. However, the adhesive tape for the connection of the semiconductor elements is also the same. First, the first embodiment of the invention described in the claims 5 to 5 will be described with reference to Figs. 57A to A, 3, 4, 29, and 58. Fig. 7A to Fig. 7C are diagrams showing the adhesive tape of the first embodiment, Fig. 57A is a perspective view of the adhesive tape tray, and Fig. 57B is a front view of Fig. 57, and Fig. 57C Fig. 57 is a front view of the cover member, and Fig. 58 is a step view showing a method of manufacturing the adhesive tape. The adhesive tape sheet A of the present embodiment has a plurality of roll portions (hereinafter simply referred to as rolls) 2, 2a of the adhesive tape 1, and the roll portions 2, 2a have the disks 3, 3a around which the adhesive tape 1 has been wound. . Each of the disks 3, 3a is provided with a reel 5 and side plates 7, 7a, 7b disposed on both width sides of the adhesive tape 1. As shown in Fig. 3, the adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. On the unused roll portion 2a, the cover member 8 covering the periphery of the adhesive tape 1 wound around the disk 3a is detachably attached to the disk 3a. Further, the side plate 7a on the inner side of the rolls 2, 2a is provided with a receiving portion (accommodating space) 12 of a desiccant -144 - 1322649, and a desiccant 10 such as a gel is accommodated in the receiving section 12 for From the inside, the moisture in the unused roll portion 2a is removed from the strength and the peeling property of the adhesive to the different conductive material, and the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or The composition is PET (polyethylene terephthalate) or the like, but is not limited thereto.

黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 黏著劑11內亦可分散著導電粒子13。導電粒子13係 如 Au、Ag' Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 φ 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點’在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 -145-The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type as the representative adhesive agent 11. The conductive particles 13 are dispersed. The conductive particles 13 are metal particles such as Au, Ag'Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass ray, A polymer core material such as ceramics or plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle in which the conductive particles are covered with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, such as solder having no melting point, which can be controlled to a softened state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection structure-145-

1322649 件。 其次，針對本實施形態之黏著材膠帶之使用方法 說明。如第3圖所示’將黏著材膠帶盤A、及捲取| 裝著至黏著裝置15，將一方之黏著材膠帶1之始端部 導引銷22裝設至捲取盤17，並捲出黏著材膠帶1( 圖中之箭頭Ε)。其次’將黏著材膠帶1配置於電路 21上，利用配置於兩盤3、1 7間之加熱加壓頭1 9從 9側實施黏著材膠帶1之壓接，將黏著劑Η壓著至電 板21。其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上 著劑1 1上配置配線電路（或電子構件）2 3，將聚四 烯材24當做緩衝材，以加熱加壓頭19對電路基板： 施配線電路23之加熱加壓。利用此方式，可連接電 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑11會被壓著至PDP 2 6 圍全體，一次使用之黏著劑Π的使用量會遠大於傳 之使用量。因此，黏著材膠帶1之使用量亦較多，捲 盤3、3a上之黏著材膠帶1會在相對較短之時間內被 至捲取盤1 7。 在一方之捲部2之黏著材膠帶1上露出結束標記 將其更換成新捲部2a之黏著材膠帶1。本實施形態時 使用之捲部2a上，配設著蓋體構件8，拆下此蓋體構 後，捲出黏著材膠帶1並將其裝設至捲取盤17。 進行 裳1 7 經由 第3 基板 基材 路基 之黏 氟乙 il實 路基 PDP 之周 統上 繞於 捲取 時， ，未 件8 -146- 1322649 如此，一方之捲部2全部捲出時，可將另一方之捲部 2a之黏著材膠帶1裝設至捲取盤17而實施黏著材膠帶i 之更換，故無需將新黏著材膠帶盤裝著至黏著裝置15。因 此，只需較少之新黏著材膠帶盤之更換作業，故可提高電 子機器之生產效率》1322649 pieces. Next, a description will be given of a method of using the adhesive tape of the present embodiment. As shown in Fig. 3, 'adhesive tape tray A, and take-up| are attached to the adhesive device 15, and the leading end guide pin 22 of one of the adhesive tapes 1 is attached to the take-up reel 17, and is unwound. Adhesive tape 1 (arrow Ε in the figure). Next, the adhesive tape 1 is placed on the circuit 21, and the adhesive tape 1 is pressed from the side 9 by the heating and pressing heads 19 disposed between the two disks 3, 17 to press the adhesive to the electricity. Board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 11 on the circuit board 21, and the polytetraene material 24 is used as a buffer material to heat the pressing head 19 Circuit board: The heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connecting portion of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed to the entire PDP 26, and the amount of the adhesive used in one use is much larger than that of the transfer. The amount of use. Therefore, the adhesive tape 1 is also used in a large amount, and the adhesive tape 1 on the reels 3, 3a is taken to the take-up reel 17 in a relatively short period of time. The end mark is exposed on the adhesive tape 1 of the one roll portion 2, and the adhesive tape 1 is replaced with the new roll portion 2a. In the roll portion 2a used in the present embodiment, the lid member 8 is disposed, and after the lid body structure is removed, the adhesive tape 1 is taken up and attached to the take-up reel 17. When the winding of the viscous fluorinated solid road base PDP of the third substrate base is carried out, the unwinding is carried out, and the unwound part is 2 - 146 - 1322649. Since the adhesive tape 1 of the other roll portion 2a is attached to the take-up reel 17, and the adhesive tape i is replaced, it is not necessary to attach the new adhesive tape to the adhesive device 15. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved.

又，因爲未使用之捲部2a上配設著蓋體構件8，黏著 材膠帶1不會直接曝露於大氣下，故黏著材膠帶1不易因 灰麈或濕氣而發生黏著力降低等情形。因此，即使配設著 複數捲部2、2a時，亦可利用在未使用之捲部2a上配設 蓋體構件8來防止黏著材膠帶1之品質降低。 又’因爲捲取盤17只會捲取基材9，故可捲取數個黏 著材膠帶盤份而減少捲取盤17之更換次數，而有良好之 作業效率。 此處’參照第5 8圖，針對本實施形態之黏著材膠帶 盤A之製造方法進行說明。 在從捲出機25捲出之基材（separat〇r)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑，並以 乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。被捲 取之黏著材膠帶之原始材料，以切割機33切成特定寬度 並捲取至捲軸後’從兩側將側板7、7a、7b裝著於捲軸上 ’然後’實施蓋體構件8之裝著，將其和除濕材—起綑包 ’實施低溫（-5 °C〜-1 0 °c )之管理並進行出貨。 其次’針對申請專利範圍第5 2〜5 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 -147- 1322649 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第59圖所示之第2實施形態時，裝設於捲部2、2a 之蓋體構件8，具有黏著材膠帶1之拉出口 1〇6。此時， 因爲可從蓋體構件8之拉出口 106捲出黏著材膠帶1，不 拆下捲部2、2a之蓋體構件8亦可從捲部2、2a直接捲出 黏著材膠帶1。Further, since the cover member 8 is disposed on the unused roll portion 2a, the adhesive tape 1 is not directly exposed to the atmosphere, so that the adhesive tape 1 is less likely to be lowered in adhesion due to ash or moisture. Therefore, even when the plurality of winding portions 2, 2a are disposed, the lid member 8 can be disposed on the unused roll portion 2a to prevent the quality of the adhesive tape 1 from being lowered. Further, since the take-up reel 17 only winds up the substrate 9, a plurality of adhesive tape discs can be taken up to reduce the number of replacements of the take-up reel 17, and the work efficiency is good. Here, a method of manufacturing the adhesive tape tray A of the present embodiment will be described with reference to Fig. 5-8. On the substrate (separat〇r) which is unwound from the unwinder 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 27, and dried in a drying furnace 29, and then taken up by a coiler 3. 1 Take the original material. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7a, 7b are mounted on the reel from both sides, and then the cover member 8 is implemented. It is installed, and it is managed and shipped at a low temperature (-5 °C to -1 0 °c) with the dehumidification material. In the following, the other embodiments of the invention described in the fifth and second aspects of the patent application are described, and the same reference numerals will be given to the same parts as the above-mentioned embodiments, and the same reference numerals will be given, and the detailed description of the parts will be omitted. The description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 59, the lid member 8 attached to the rolls 2, 2a has the pull-out port 1〇6 of the adhesive tape 1. At this time, since the adhesive tape 1 can be unwound from the take-out opening 106 of the lid member 8, the cover member 8 can be directly unwound from the rolls 2, 2a without removing the cover member 8 of the rolls 2, 2a.

第60圖A及B所示之第3實施形態時，捲部2、2a 、2b係不同之個體，以可自由滑動方式，裝設於黏著裝置 15本體上之軸1〇7上。其次’一方之捲部2全部捲出時， 拆下裝設於軸107之前端的蓋帽108，從黏著裝置15取下 一方之捲部2。其次，使另一方之捲部2a移動至黏著位置 並拆下蓋體構件8後，將另一方之捲部2a之黏著材膠帶1 捲裝至捲取盤17，實施黏著材膠帶1之更換。此時，因爲 複數之捲部2、2a、2b係不同之個體，故很容易處理。 第6 1圖所示之第4實施形態時，和第3實施形態相 同，捲部2、2a、2b係不同之個體，使捲部2、2a、2b之 側板7、7a互相嵌合，將其裝著至黏著裝置15。如第61 圖所示，另一方之捲部2 a之側板7 a上，配設著橫剖面略 呈3字形之被嵌合部110，將配設於一方之捲部2之側板 7上之被嵌合部49，從上側嵌合至被嵌合部11〇，可連接 兩者。將全部捲出之一·方之捲部2從黏著裝置15拆下時 ，只要將一方之捲部2向上提起即可解除嵌合，很簡單即 可拆下一方之捲部2。 -148- 1322649 申請專利範圍第52〜58項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第52〜58項 記載之發明之要旨的範圍內，可實施各種變形。 例如’上述之實施形態時，捲部2、2a之數量並無特 別限制，可以爲任意個。In the third embodiment shown in Figs. 60A and B, the individual portions of the roll portions 2, 2a, and 2b are slidably attached to the shaft 1〇7 of the body of the adhesive device 15. Next, when all of the roll portions 2 are unwound, the cap 108 attached to the front end of the shaft 107 is removed, and the roll portion 2 is removed from the adhesive device 15. Next, after the other roll portion 2a is moved to the adhesive position and the lid member 8 is removed, the adhesive tape 1 of the other roll portion 2a is wound up to the take-up reel 17, and the adhesive tape 1 is replaced. At this time, since the plural rolls 2, 2a, and 2b are different individuals, they are easy to handle. In the fourth embodiment shown in Fig. 6, the same as the third embodiment, the rolled portions 2, 2a, and 2b are different, and the side plates 7, 7a of the rolled portions 2, 2a, and 2b are fitted to each other. It is attached to the adhesive device 15. As shown in Fig. 61, the side plate 7a of the other roll portion 2a is provided with a fitting portion 110 having a substantially three-dimensional cross section, and is disposed on the side plate 7 of one of the rolls 2 The fitted portion 49 is fitted to the fitted portion 11 from the upper side, and both can be connected. When one of the rolled-out portions 2 is removed from the adhesive device 15, the one of the rolled portions 2 can be released by simply lifting one of the rolled portions 2 upwards, and the one-rolled portion 2 can be easily removed. -148- 1322649 The invention described in the scope of claims 52 to 58 is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention described in the 52nd to 58th claims. . For example, in the above embodiment, the number of the rolls 2, 2a is not particularly limited, and may be any number.

第4實施形態時，係以使側板7 ' 7 a上下滑動來嵌合 —方及另一方之捲部2、2a，然而，亦可在一方之側板7 上形成嵌合孔，而在另一方之側板7a上配設嵌合突起， 並從膠帶之寬度方向將嵌合突起壓入嵌合孔內來使兩者嵌 合。 第31圖A、B係用以實施引線框架之固定用支持基板 、半導體元件載置用支持基板、或引線框架之晶片和半導 體元件之連接1黏著材膠帶當中，將半導體元件黏著.固 定於引線框架之固定用支持基板及引線框架之LOC ( Lead on Chip )構造的1個實例。 實施厚度50 //m之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度υμίη之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖Α之構成之黏著 材膠帶，而可得到第31圖B所示之LOC構造之半導體裝 置。將第31圖A所示之黏著材膠帶，以第32圖A〜C所 示之黏著裝置之冲切模具87 (公模（凸部）95、母模（凹 部）96)冲切成細長形，例如，在厚度〇.2mm之鐵-鎳合 金製引線框架上，以400°C、3 MPa之壓力、3秒鐘之加壓 實施壓著，形成0_2mm間隔、0.2mm寬度之內引線，製成 -149- X322649 附有半導體用黏著膜之引線框架。其次，在其他步驟實施 3 50°C之溫度、3M Pa之壓力、3秒鐘之加壓，將半導體元 件壓著至此附有半導體用黏著膜之引線框架之黏著劑層面 ’其後’以金線實施引線框架及半導體元件之絲焊，以連 續成形使用環氧樹脂成形材料等密封材實施密封，得到第 31圖B所示之半導體裝置。第η圖a、b中，U係以黏 著材膠帶冲切所得之半導體用黏著膜，54係半導體元件，In the fourth embodiment, the side plates 7' 7a are slid up and down to fit the other and the other roll portions 2, 2a. However, the fitting holes may be formed in one of the side plates 7, and the other side may be formed on the other side. A fitting projection is disposed on the side plate 7a, and the fitting projection is press-fitted into the fitting hole from the width direction of the tape to fit the both. FIGS. 31A and A are diagrams showing a fixing support substrate for a lead frame, a support substrate for mounting a semiconductor element, or a connection between a wafer of a lead frame and a semiconductor element. The adhesive element is adhered to the lead. One example of the LOC (Lead on Chip) structure of the support substrate and the lead frame for fixing the frame. The adhesive film layer 80 having a polyacetal-based adhesive layer having a thickness of υμίη on both sides is formed on the both sides of the support film 78 such as a polyimide film having a surface thickness of 50 // m, as shown in Fig. 31. The adhesive tape is constructed to obtain the semiconductor device of the LOC structure shown in Fig. 31B. The adhesive tape shown in Fig. 31A is punched into a slender shape by a punching die 87 (male die (protrusion) 95, female die (recess) 96) of the bonding device shown in Figs. 32A to C. For example, on a lead frame of an iron-nickel alloy having a thickness of 22 mm, a press is applied at a pressure of 400 ° C and a pressure of 3 MPa for 3 seconds to form a lead having a width of 0 2 mm and a width of 0.2 mm. Cheng-149- X322649 A lead frame with an adhesive film for semiconductors. Next, in another step, a temperature of 3 50 ° C, a pressure of 3 M Pa, and a pressurization of 3 seconds are applied, and the semiconductor element is pressed to the adhesive layer of the lead frame with the semiconductor adhesive film, and then the gold is pressed. Wire bonding of the lead frame and the semiconductor element is performed on the wire, and sealing is performed by using a sealing material such as an epoxy resin molding material in a continuous molding to obtain a semiconductor device shown in FIG. 31B. In the first FIGS. a and b, U is an adhesive film for semiconductor obtained by punching an adhesive tape, and a 54-series semiconductor element.

8 3係引線框架’ 8 4係密封材，8 5係焊絲，8 6係匯流排條 。第32圖A、B、C係黏著裝置，第32圖A、B中，87 係冲切模具’ 8 8係引線框架搬運部，6 1係黏著劑膠帶冲 切貼附部’ 90係加熱器部，91係黏著材膠帶盤（黏著材 膠帶捲出部）’92係黏著材膠帶（半導體用黏著膜），93 係黏著材膠帶捲出滾輪。又，第32圖C中，94係黏著材 膠帶（半導體用黏著膜）’95係公模（凸部），96係母 模（凹部）’ 97係膜壓板。黏著材膠帶92會從黏著材膠 帶盤（黏著材膠帶捲出部）91連續捲出，並在黏著材膠帶 冲切貼附部89冲切成細長形且黏著至引線框架之引線部 份’將其視爲附有半導體用黏著膜之引線框架而從引線框 架搬運部搬出。冲切所得之黏著材膠帶則從黏著材膠帶捲 出滾輪93搬出。 和上述相同’利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接·黏著。黏著材膠帶只單純用 於黏著•固定時，可以電極間之接觸、或以導電性粒子實 -150- 1322649 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第59項記載之發明進行說 明。 此發明係關於將電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑壓著 至電路基板之黏著具。8 3 series lead frame ' 8 4 series sealing material, 8 5 series welding wire, 8 6 series bus bar. Fig. 32 A, B, and C adhesive devices, Fig. 32, Figs. A and B, 87 is a punching die '8 8 series lead frame conveying portion, and 6 1 is an adhesive tape punching and attaching portion '90 series heater Department, 91 series adhesive tape tape (adhesive tape roll-out part) '92 adhesive tape (semiconductor adhesive film), 93-series adhesive tape roll out roller. Further, in Fig. 32C, the 94-series adhesive tape (adhesive film for semiconductor) '95 is a male mold (protrusion), and 96 is a master (concave) '97-type film press. The adhesive tape 92 is continuously unwound from the adhesive tape disc (adhesive tape unwinding portion) 91, and is punched into a slender shape and adhered to the lead portion of the lead frame at the adhesive tape punching and attaching portion 89. This is considered to be carried out from the lead frame transport unit as a lead frame with an adhesive film for a semiconductor. The adhesive tape obtained by die cutting is taken out from the roller 93 by the adhesive tape. The same as described above, the semiconductor element is connected to the semiconductor element mounting support substrate by an adhesive tape. Further, the connection and adhesion of the wafer and the semiconductor element of the lead frame were carried out in the same manner. Adhesive tape is only used for adhesion. When it is fixed, it can be contacted between electrodes or electrically connected with conductive particles -150- 1322649. For the purpose of selecting the adhesive to be used, if the support film is used, It will consist of adhesive alone. Next, the invention described in claim 59 of the patent application will be described. This invention relates to an adhesive for adhering an electronic component, a circuit board, or a circuit board to an electric circuit, and an adhesive for electrically connecting the electrodes between the electrodes to the circuit board.

其次，針對申請專利範圍第5 9項記載之發明之背景 技術進行說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。Next, the background art of the invention described in claim 59 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape.

日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者，將此黏著劑膠帶之 盤（以下稱爲「黏著劑盤」）裝著於自動黏著機械來使用 自動黏著機械具有黏著劑盤之裝著部、空盤之裝著部 、配設於前述盤間之加熱加壓構件、以及用以載置基板之 工作台，從黏著劑盤將黏著劑膠帶拉出至基板上，利用加 熱加壓構件從基材之背面側實施黏著劑膠帶之加熱加壓， 將黏著劑壓著至基板上。 然而，傳統之自動黏著機械較爲大型，欲在部份基板 上實施黏著劑之壓著時、壓著黏著劑之面積較小時、或暫 -151 - 時壓著時等，會因爲較爲大型，反而有不易操作之問題。 另一方面’若爲和此種大型自動黏著機械不同之小型 卻可很簡單地進行操作’故在局部或暫時壓著時，希望能 有不使用大型裝置卻可實施黏著劑之壓著的器具。 因此’申請專利範圍第59項記載之發明的目的，係 提供一種黏著具，十分小型且可以單手操作，並且很容易 即可對基板之一部份實施黏著劑之壓著。 其次，參照附錄圖面，針對申請專利範圍第5 9項記 載之發明之實施形態進行說明。第6 2圖A及B係申請專 利範圍第59項記載之發明之第1實施形態之黏著具圖， 弟62圖A係黏者具之斜視圖，第62圖B係第62圖A之 A-A剖面圖’第63圖係用以說明第62圖A及B所示之黏 著具之使用方法的側面圖，第64圖係黏著具之製造方法 的步驟圖。 本實施形態之黏著具1 1 1之主要構成係一方之盤（供 應盤）3、另一方之盤（空盤）5、以及收容前述盤之殼體 99，一方之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶〗之 —端9a則固定於另一方之盤5。 殻體99之形成上，係可以單手把持之尺寸，從側面 觀看時，角部具有弧度而大致呈三角形，係容易把持之形 狀。略呈三角形之殼體99之角部上，會形成開口部113， 黏著劑膠帶9會從此開口部113露出。 又，開口部1 1 3上突設著加熱構件1 1 4，從側面觀看 時，此加熱構件114亦略呈三角形，用以引導從上面13a -152-Japanese Laid-Open Patent Publication No. 2001-284005 discloses that a tape of an adhesive tape coated with an adhesive on a substrate is taken up, and a disk of the adhesive tape (hereinafter referred to as an "adhesive disk") is attached. The automatic adhesive machine uses an automatic adhesive machine having an adhesive disk mounting portion, an empty disk mounting portion, a heating and pressing member disposed between the disks, and a table for mounting the substrate, from the adhesive The disk pulls the adhesive tape onto the substrate, and heats and presses the adhesive tape from the back side of the substrate by a heating and pressing member to press the adhesive onto the substrate. However, the conventional automatic bonding machine is relatively large, and it is necessary to carry out the pressing of the adhesive on some of the substrates, when the area of the adhesive is small, or when the pressing is temporarily performed at -151 - Large, but it is difficult to operate. On the other hand, 'if it is small compared to such a large automatic adhesive machine, it can be easily operated'. Therefore, when it is partially or temporarily pressed, it is desirable to have a device that can be pressed without using a large device. . Therefore, the object of the invention described in the 59th application of the patent application is to provide an adhesive which is extremely small and can be handled by one hand, and it is easy to apply an adhesive to a part of the substrate. Next, an embodiment of the invention described in the ninth application of the patent application will be described with reference to the attached drawings. Fig. 6 is a perspective view of the first embodiment of the invention described in claim 59, and Fig. 62 is a perspective view of the adhesive device, and Fig. 62B is the AA of Fig. 62A. Fig. 63 is a side view for explaining the method of using the adhesive shown in Figs. 62 and A, and Fig. 64 is a step view showing the manufacturing method of the adhesive. The main structure of the adhesive 1 1 1 of the present embodiment is a disk (supply disk) 3, another disk (empty disk) 5, and a casing 99 for accommodating the disk, and the disk 3 is wound on one side. The adhesive tape 1 and the adhesive tape are fixed to the other disk 5 at the end 9a. The housing 99 is formed to be gripped by one hand. When viewed from the side, the corner portion has a curvature and is substantially triangular, and is easily gripped. An opening portion 113 is formed in a corner portion of the slightly triangular casing 99, and the adhesive tape 9 is exposed from the opening portion 113. Further, the heating member 1 14 is protruded from the opening portion 1 1 3, and the heating member 114 is also slightly triangular when viewed from the side for guiding the 13a-152- from above.

1322649 沿著下面1 3b拉出之黏著劑膠帶1，其下面側 板 1 1 5。 加熱構件114之形狀呈棒狀，在以電熱板1 熱構件114之情形下拉出黏著材膠帶9時，可利 件114之旋轉而順利拉出膠帶9。又，電熱板1 若配設聚四氟乙烯、矽橡膠、或雙方，則實施黏 壓著時，可獲得均一之壓力。 殻體99係由半殻體99a、99b嵌合而成，一 方之盤3、5係收容於殼體內。殼體內配設著導: 用以引導黏著劑膠帶1之移動。又，殼體99a每 中任一方之底面之一方上，會形成板狀之導引件 導引件抵壓至電路基板之邊緣之情形下，將黏著 電路基板，則可沿著電路基板實施精度良好之黏 一方之盤3上會以同軸方式固定著一方之齒 另一方之盤17上亦以同軸方式固定著另一方之撞 —方之齒輪116及另一方之齒輪117會互相齒合 之盤3旋轉而使黏著劑膠帶1被拉出時，另一： 會實施黏著劑膠帶1之拉出量的旋轉，並捲取基 ，齒輪單元118係由一方之齒輪116及另一方之 所構成。 又，殼體99之側面配設著對加熱構件1 1 4 之第三殼體（電源手段）119，第三殼體119內 乾電池以外，尙會收容供應給加熱構件114之電 丨設著電熱 1 5覆蓋加 ί用加熱構 1 5之外側 著劑9之 方及另一 弓I件16 ， 3 7b之其 ，在使此 劑壓著至 著劑壓著 輪 1 16， Ϊ 輪 117， ，當一方 与之盤17 材9。又 齒輪1 1 7 供應電力 除了收容 力之調整 -153- 1322649 電路。又，第三殼體119上配設著電源開關120,可以把 持黏著具111之手的手指實施ΟΝ/OFF之操作》 如第62圖B所示，黏著劑膠帶！上之基材9之單面 上塗布著黏著劑1 1。 本實施形態時，黏著劑膠帶1之長度約爲20m、寬度 W 約爲 1 · 2 mm。1322649 Adhesive tape 1 pulled along the lower side 1 3b, with the lower side panel 1 1 5 . The heating member 114 has a rod shape, and when the adhesive tape 9 is pulled down by the hot member 114 of the hot plate 1, the tape 9 can be smoothly pulled out by the rotation of the member 114. Further, when the hot plate 1 is provided with polytetrafluoroethylene, ruthenium rubber, or both, a uniform pressure can be obtained when the pressure is applied. The casing 99 is formed by fitting the half casings 99a and 99b, and the ones of the disks 3 and 5 are housed in the casing. A guide is disposed in the housing to guide the movement of the adhesive tape 1. Further, in the case where one of the bottom surfaces of each of the casings 99a is formed such that a plate-shaped guide member is pressed against the edge of the circuit board, the circuit board can be adhered to perform precision along the circuit board. The good adhesive side of the disc 3 will be fixed coaxially with one of the teeth. The other side of the disc 17 is also coaxially fixed with the other side of the collision - the square gear 116 and the other gear 117 will be mutually engaged 3, when the adhesive tape 1 is pulled out, the other is: the rotation of the amount of the adhesive tape 1 is rotated, and the base is wound, and the gear unit 118 is composed of one of the gears 116 and the other. Further, a third casing (power source means) 119 for the heating member 1 14 is disposed on the side surface of the casing 99, and an electric heater for supplying the heating member 114 to the heating member 114 is provided with electric heating other than the dry battery in the third casing 119. 1 5 cover plus ί with heating structure 1 5 outside the side of the agent 9 and another bow I 16 , 3 7b, in the agent is pressed to the agent pressing wheel 1 16, 轮 wheel 117, When a party with a plate 17 material 9. The gear 1 1 7 supplies power in addition to the accommodation force adjustment -153 - 1322649 circuit. Further, the third casing 119 is provided with a power switch 120, and the finger of the hand holding the adhesive 111 can be turned on/off. As shown in Fig. 62B, the adhesive tape is attached! The adhesive 1 1 is coated on one side of the upper substrate 9. In the present embodiment, the adhesive tape 1 has a length of about 20 m and a width W of about 1 · 2 mm.

從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苹乙烯樹脂系及聚酯樹脂系爲代表，又 ’熱硬化性樹脂系係以環氧樹脂系、乙烯基酯系樹脂、壓 克力系樹脂、及矽樹脂系爲代表。 黏著劑11內分散著導電粒子13。導電粒子13係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、 或碳、石墨等，亦可在前述之物及/或非導電性之玻璃、 陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。此 外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子 、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬 、或塑膠等之高分子核材上形成導電層者，會具有因加熱 加壓或加壓而產生變形之變形性，故連接後之電極間距離 會縮小，連接時可增加和電路接觸之面積，而可提高信賴 -154- 1322649 性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融 點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到 很容易即可對應電極之厚度及平坦性之誤差的連接構件。The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate) in terms of strength and releasability of the adhesive to the electrically conductive material. ), etc., however, is not limited to this. The adhesive 11 is made of a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. The thermoplastic resin system is represented by a vinyl-based resin and a polyester resin, and the thermosetting resin system is represented by an epoxy resin, a vinyl ester resin, an acrylic resin, and an anthracene resin. . Conductive particles 13 are dispersed in the adhesive 11. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. A polymer core material such as plastic is formed to cover the conductive layer or the like. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles may be used. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit, and can improve the reliability -154 - 1322649. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member.

其次，針對本實施形態之黏著具111之使用方法進行 說明。如第63圖所示，以單手握持黏著具1 1 1，將電源開 關120切至ON。其次，使露出黏著劑膠帶1之開口部 113抵壓電路基板27。因爲開口部11上之黏著劑膠帶1 之基材9側配設著加熱構件1 1 4，壓附位於加熱構件1 1 4 下面側之黏著劑膠帶1，對電路基板27實施黏著劑11之 加熱壓著。 在將黏著具111壓向下方之狀態下朝前方（第63圖 中之箭頭E)移動，會依序拉出黏著劑膠帶1，加熱構件 114會朝E方向前進，同時，新黏著劑9會位於加熱構件 114之下，而將黏著劑11依序壓著至電路基板27。 如此’從一方之盤3拉出黏著劑膠帶1時，因一方之 ^ 盤3會旋轉，故和一方之盤3以同軸方式固定之一方之齒 輪116亦會旋轉，和其齒合之另一方之齒輪117亦會隨之 旋轉’而將已剝離黏著劑25之基材9捲取至另一方之盤 17。 利用本實施形態，欲將黏著劑n壓著至電路基板2 7 上之任意位置時，只要以單手握持黏著具並向前推， 很簡單即可實施黏著劑1 1之壓著。如此，因爲很黏著劑 1 1之壓著很簡單，特別適合例如將電子構件（配線電路） 37暫時黏著於電路基板27上時 '或只對電路基板27之一 -155- 1322649 部份實施電子構件（配線電路）37之壓著時。 上述之壓著後（暫時連接），實施電路基板27之電 極及電子構件（配線電路）37之電極的定位並進行正式連Next, a method of using the adhesive 111 of the present embodiment will be described. As shown in Fig. 63, the power switch 120 is turned ON by holding the adhesive 1 1 1 with one hand. Next, the opening portion 113 exposing the adhesive tape 1 is pressed against the circuit board 27. Since the heating member 141 is disposed on the substrate 9 side of the adhesive tape 1 on the opening portion 11, the adhesive tape 1 on the lower side of the heating member 1 1 4 is pressed, and the adhesive of the adhesive 11 is applied to the circuit substrate 27. Pressed. Moving toward the front (arrow E in Fig. 63) while pressing the adhesive 111 downward, the adhesive tape 1 is sequentially pulled out, and the heating member 114 is advanced in the E direction, and at the same time, the new adhesive 9 will Located under the heating member 114, the adhesive 11 is sequentially pressed to the circuit substrate 27. When the adhesive tape 1 is pulled out from one of the trays 3, the disc 3 is rotated by one of the discs 3, and the one of the discs 3 is fixed coaxially with one of the discs 3, and the other one of the teeth is rotated. The gear 117 will also rotate with it', and the substrate 9 from which the adhesive 25 has been peeled off will be taken up to the other disk 17. According to this embodiment, when the adhesive n is to be pressed to any position on the circuit board 27, the adhesive 1 can be pressed by simply holding the adhesive with one hand and pushing it forward. Thus, since the adhesion of the adhesive 11 is very simple, it is particularly suitable for, for example, when the electronic component (wiring circuit) 37 is temporarily adhered to the circuit substrate 27, or only one of the circuit substrates 27 - 155 - 1322649 is implemented. When the member (wiring circuit) 37 is pressed. After the above-described pressing (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are positioned and officially connected.

接。正式連接上，對電路基板27實施黏著劑n之壓著後 ，在黏著劑11上配置電子構件（配線電路）37,必要時 ，可將聚四氟乙烯材39當做緩衝材’以加熱加壓頭19對 電路基板27實施電子構件（配線電路）37之加熱加壓（ 參照第4圖）。利用此方式，可連接固定電路基板27之 電極27a及電子構件（配線電路）37之電極37a。 又’因爲構成上，黏著劑膠帶1係收容於殼體99內 且直接使用，故十分容易處理而具有良好之作業性。 此處’參照第6 4圖’針對本實施形態之黏著具n j 之製造方法進行說明。 在從捲出機25捲出之基材（separat〇r) 23上，以塗 布機28塗布由樹脂及導電粒子13混合而成之黏著劑，並 以乾燥爐29實施乾燥後’以捲取機31捲取原始材料。被 捲取之黏著劑膠帶之原始材料，在整修步驟中以切割機33 切成特定寬度並捲取至盤3後，以夾於半殼體99a、99b 間之方式嵌合一方之盤3及另一方之盤（空盤）5，且組 裝收容著加熱構件114及乾電池等之第三殼體119，製成 黏著具1 1 1。 將黏著具111和除濕材—起綑包，實施低溫 1〇 °C )之管理並進行出貨。 其次，針對申請專利範圍第6〇〜64項記載之發明進 -156-Pick up. After the adhesive is applied to the circuit board 27 by the adhesive n, the electronic component (wiring circuit) 37 is placed on the adhesive 11 and, if necessary, the polytetrafluoroethylene material 39 can be used as a cushioning material. The head 19 applies heat and pressure to the electronic component (wiring circuit) 37 to the circuit board 27 (refer to Fig. 4). In this manner, the electrode 27a of the fixed circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 can be connected. Further, since the adhesive tape 1 is housed in the casing 99 and used directly, it is easy to handle and has good workability. Here, a method of manufacturing the adhesive n j of the present embodiment will be described with reference to Fig. 6 4 . On the substrate (separat〇r) 23 which is unwound from the unwinding machine 25, an adhesive obtained by mixing a resin and conductive particles 13 is applied by a coater 28, and dried in a drying furnace 29, and then taken up by a coiler 31 take the original material. The original material of the adhesive tape to be taken up is cut into a specific width by the cutter 33 in the refurbishing step and taken up to the tray 3, and then the one of the trays 3 is fitted between the half-shells 99a and 99b. The other disk (empty disk) 5 is assembled with a third casing 119 in which a heating member 114 and a dry battery are housed to form an adhesive 1 1 1 . The adhesive 111 and the dehumidifying material are bundled and managed at a low temperature of 1 ° C to be shipped. Secondly, the invention described in Sections 6 to 64 of the patent application scope -156-

1322649 行說明。 這些發明係關於電子構件及電路基板、或電 之黏著固定、以及兩者之電極間之電性連接的黏 ，尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第60〜64項記載 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板 螢光顯示）面板、裸晶片封裝等之電子構件及電 或電路基板間之黏著固定、以及兩者之電極間之 方法，係採用黏著材膠帶。 日本特開200卜2 8400 5號公報，係記載著將 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度 盤之膠帶之長度爲5 0m程度，黏著材膠帶從盤捲 著劑壓著至電路基板等後，即不會再度使用。 然而，近年來，隨著PDP等之面板畫面之大 路基板之黏著面積亦增大，一次使用之黏著劑的 增加。又，因爲黏著劑之用途之擴大，黏著劑之 增加。因此，電子機器之製造工廠之黏著材盤的 頻繁，因爲黏著材盤之更換十分麻煩，故有無法 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏 之捲數，來增加每1盤之黏著劑量，用以降低盤 率，然而，因爲黏著材膠帶之厚度較厚，很難增 路基板間 著材膠帶 之發明之 )、EL ( 路基板、 電性連接 在基材上 ，捲取至 出並將黏 型化，電 使用量亦 使用量亦 更換更爲 提高電子 著材膠帶 之更換頻 J口每1盤 -157- 1322649 之捲數。 又’若考慮減少黏著材膠帶之厚度，則因爲使用經過 矽處理之PET (聚對苯二甲酸乙二酯）當做基材，基材之 厚度若太薄’會有容易發生基材伸展或斷裂等之問題。 因此，申請專利範圍第60〜64項記載之發明的目的 ，係在提供一種黏著材膠帶，可增加每1盤之捲數，而提 高電子機器之生產效率。1322649 Line description. These inventions relate to the adhesion of electronic components and circuit boards, or to electrical bonding, and the electrical connection between the electrodes of the two, and in particular to the adhesive tape wound into a disk shape. Next, the background art described in the claims 60 to 64 will be described. In general, a method of bonding between an electronic component such as a liquid crystal panel, a PDP (plasma display panel fluorescent display) panel, a bare chip package, and an electric or circuit substrate, and an electrode between the electrodes is an adhesive tape. . Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The width of the conventional adhesive tape is about 1 to 3 mm. The length of the tape is about 50 m. After the adhesive tape is pressed from the coil to the circuit board, it is not used again. However, in recent years, as the adhesion area of the large-sized substrate of the panel image of the PDP or the like is also increased, the adhesive for one use is increased. Also, because of the expansion of the use of the adhesive, the adhesive increases. Therefore, the adhesive sheet of the manufacturing factory of the electronic machine is frequent, and since the replacement of the adhesive sheet is troublesome, there is a problem that the productivity of the machine cannot be obtained. In view of this problem, it is conceivable to increase the number of rolls of the roll to the disk to increase the adhesion amount per disk to reduce the disk rate. However, because the thickness of the adhesive tape is thick, it is difficult to increase the distance between the substrates. The invention of the material tape), EL (the circuit board, the electrical connection on the substrate, the coil is taken out and will be adhered, and the amount of electricity used is also replaced, and the replacement frequency of the electronic tape is further improved. The number of rolls per plate -157- 1322649. Also, if you consider reducing the thickness of the adhesive tape, the thickness of the substrate is determined by using the treated PET (polyethylene terephthalate) as the substrate. If it is too thin, there is a problem that the substrate is likely to be stretched or broken. Therefore, the object of the invention described in claims 60 to 64 is to provide an adhesive tape which can increase the number of rolls per one disk. Improve the production efficiency of electronic machines.

其次’參照附錄圖面，針對申請專利範圍第60〜64 項記載之發明之實施形態進行說明。參照第65圖A、B、 第3圖、第4圖、第29圖、及第5圖，針對申請專利範 圍第60〜64項記載之發明之第1實施形態進行說明。第 65圖A及B係第1實施形態之黏著材膠帶圖，第65圖A 係黏著材盤的斜視圖，第65圖B係第65圖A之A-A剖 面圖。 黏著材膠帶1係捲繞於盤3者，盤3上配設著捲軸5 、及配置於黏著材膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成》 基材9係採用銅膜（銅箔）。基材9之厚度（第65 圖B中之S)爲l〇#m，基材9之25°C時之拉伸強度爲 50 0MPa，基材9對黏著劑1 1之厚度比（S/T )爲〇.5，黏 著劑11之厚度爲20 "m。基材9之表面粗細度Rmax爲 0 · 2 5 " m。 又，亦製成採用芳香族聚醯胺膜（MICTRON )當做基 -158- 材9者。製作上，基材9之厚度、拉伸強度、及基材9對 黏著劑1 1之厚度比（S/T )皆和銅膜相同。 其次，針對上述之黏著材膠帶之使用方法進行說明。 如第3圖所示，將黏著材膠帶1之盤3、及捲取盤17裝著 至黏著裝置15,捲繞於盤3上之黏著材膠帶1之前端會經 由導引銷22裝設至捲取盤17並捲出黏著材膠帶1(第3 圖中之箭頭E)。其次，將黏著材膠帶1配置於電路基板 21上，以配置於兩盤3、1 7間之加熱加壓頭1 9從基材9 側壓接黏著材膠帶1，將黏著劑11壓著至電路基板21。 其後，將基材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑11上配線電路（或電子構件）23，將聚四氟乙烯材 24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實施配線 電路23之加熱加壓。利用此方式，可連接電路基板21之 電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP之周圍全體 ，可知一次使用之黏著劑11的使用量會遠大於傳統上之 使用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦 會增多，捲繞於盤3上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而使盤3成爲空的。 盤3成爲空的時，更換已使用之盤3及新盤，將新盤 裝著至黏著裝置15。其次，如上面所述，重複將黏著劑 11壓著至電路基板21並將基材9捲取至捲取盤17之動作 -159- 1322649 結果’採用銅膜做爲基材9者、及採用芳香族聚醯胺 膜做爲基材9者，皆和傳統黏著材膠帶1同樣容易處理， 且沒有基材9伸展或斷裂之問題。其次，相對於基材η 之厚度較傳統品（50/zm)爲薄之部份，黏著材膠帶之捲 數會增多，故可減少盤之更換頻率而提高生產性。Next, an embodiment of the invention described in the claims 60 to 64 will be described with reference to the attached drawings. The first embodiment of the invention described in the claims 60 to 64 will be described with reference to Figs. 65, A, B, 3, 4, 29, and 5. Fig. 65 is a perspective view of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive disk, and Fig. 65B is a cross-sectional view taken along line A-A of Fig. 65A. The adhesive tape 1 is wound around the disk 3, and the disk 3 is provided with a reel 5 and a side plate 7 disposed on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9 . The substrate 9 is made of a copper film (copper foil). The thickness of the substrate 9 (S in Fig. 65B) is l〇#m, the tensile strength of the substrate 9 at 25 ° C is 50 0 MPa, and the thickness ratio of the substrate 9 to the adhesive 1 1 (S/ T) is 〇.5, and the thickness of the adhesive 11 is 20 "m. The surface roughness Rmax of the substrate 9 is 0 · 2 5 " m. Further, an aromatic polyimide film (MICTRON) was also used as the base-158-material. In the production, the thickness of the substrate 9, the tensile strength, and the thickness ratio (S/T) of the substrate 9 to the adhesive 11 are the same as those of the copper film. Next, the method of using the above-mentioned adhesive tape will be described. As shown in Fig. 3, the disc 3 of the adhesive tape 1 and the take-up reel 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disc 3 is attached to the front end via the guide pin 22. The reel 17 is taken up and the adhesive tape 1 is unwound (arrow E in Fig. 3). Next, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressure-bonded from the substrate 9 side to the heating and pressing head 19 disposed between the two trays 3 and 17 to press the adhesive 11 to Circuit board 21. Thereafter, the substrate 9 is taken up to the take-up reel 17. Next, as shown in Fig. 4, the wiring circuit (or electronic member) 23 is pressed onto the adhesive 11 pressed onto the circuit board 21, and the polytetrafluoroethylene material 24 is used as a buffer material to heat the pressurizing head 19 pair. The circuit board 2 1 performs heating and pressurization of the wiring circuit 23. In this manner, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connection portion of the PDP 26 of the adhesive tape 1 of the present embodiment, the adhesive 11 is pressed against the entire periphery of the PDP, and it is understood that the amount of the adhesive 11 used at one time is much larger than that of the PDP. Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disc 3 is also increased, and the adhesive tape 1 wound on the disc 3 is taken up to the take-up reel 17 in a relatively short period of time, thereby Disk 3 becomes empty. When the disc 3 becomes empty, the used disc 3 and the new disc are replaced, and the new disc is attached to the adhesive device 15. Next, as described above, the action of pressing the adhesive 11 to the circuit substrate 21 and winding the substrate 9 to the take-up reel 17 is repeated - 159 - 1322649. The result is 'using a copper film as the substrate 9 and adopting The aromatic polyamide film as the substrate 9 is treated as easily as the conventional adhesive tape 1, and there is no problem that the substrate 9 is stretched or broken. Secondly, the thickness of the adhesive tape is increased relative to the thickness of the substrate η compared to the conventional product (50/zm), so that the frequency of replacement of the disk can be reduced to improve productivity.

此處’參照第5圖’針對本實施形態之黏著材膠帶！ 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機27塗布由樹脂及導電粒子13混合而成之黏著劑U，並 以乾燥爐29實施乾燥後，以捲取機31捲取原始材料。被 捲取之黏著材膠帶1之原始材料，以切割機33切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸s 上，將其和除濕材一起綑包，實施低溫（-5 °C〜-1 0 °C )之 管理並進行出貨。 又，針對基材9之厚度爲4;zm、20//m、25^1X1之銅 膜及芳香族聚醯胺膜，製作黏著材膠帶1，如上面所述之 實際使用上，未發生基材9之伸展或斷裂等之問題。 又，針對基材9對黏著劑11之厚度比（S/T)爲〇.〇1 、0.05、1.0之銅膜及芳香族聚醯胺膜，製作黏著材膠帶！ ，如上面所述之實際使用上，未發生基材9之伸展或斷裂 等之問題。 其次，針對申請專利範圍第65〜66項記載之發明進 行說明.。 -160- 1322649 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接黏著材膠帶之 黏著材形成方法。又，係關於在將半導體元件（晶片）黏 著·固定至引線框架之固定用支持基板或引線框架之晶片 、或半導體元件載置用支持基板之半導體裝置上所使用之 黏著材膠帶之黏著材形成方法，尤其是，和捲成盤狀之黏 著材膠帶盤之黏著材形成方法相關。Here, the adhesive tape of the present embodiment is referred to in Fig. 5! The manufacturing method will be described. The adhesive U obtained by mixing the resin and the conductive particles 13 is applied onto a substrate unwound from the unwinder 25, and dried by a drying furnace 29, and then wound up by a coiler 31. Take the original material. The original material of the adhesive tape 1 to be taken up is cut into a specific width by the cutter 33 and taken up to the reel, and the side plates 7, 7 are attached to the reel s from both sides, and are bundled together with the dehumidifying material. Carry out low temperature (-5 °C ~ -1 0 °C) management and ship. Further, for the copper film of the substrate 9 having a thickness of 4; zm, 20//m, 25^1X1 and an aromatic polyamide film, the adhesive tape 1 was produced, and as described above, the base did not occur. The problem of stretching or breaking of the material 9. Further, an adhesive tape was prepared for a copper film and an aromatic polyimide film having a thickness ratio (S/T) of the substrate 9 to the adhesive 11 of 〇.〇1, 0.05, and 1.0. As described above, the problem of stretching or breaking of the substrate 9 does not occur in practical use as described above. Next, the invention described in the patent application Nos. 65 to 66 will be described. -160- 1322649 These inventions relate to a method of forming an adhesive material for adhering and fixing an electronic component and a circuit board, or a circuit board, and electrically connecting an adhesive tape between electrodes. Further, the adhesive material is formed of an adhesive tape used for bonding and fixing a semiconductor element (wafer) to a fixing support substrate or a lead frame of a lead frame or a semiconductor device for supporting a semiconductor element mounting substrate. The method, in particular, relates to a method of forming an adhesive material that is rolled into a disk-shaped adhesive tape.

其次，針對申請專利範圍第65〜66項記載之發明之 背景技術進行說明。 —般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法’係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、LOC膠帶、晶粒結著膠帶、微 BG A · CSP等之黏著膜等，其目的則在提高半導體裝置全 φ 體之生產性及信賴性。 日本特開200 1 -2 8400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 -161 - 1322649 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，新黏著材盤及新捲取盤全裝著至 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。Next, the background art of the invention described in the claims 65 to 66 will be described. In general, an electronic component such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, or a bare chip package, and a circuit board, or an adhesion between circuit boards, and electrodes between the two The electrical connection method uses adhesive tape. Further, the adhesive tape is also applied to a lead frame fixing tape, a LOC tape, a die-bonding tape, an adhesive film such as a micro BG A · CSP, etc., and the purpose thereof is to improve the productivity of the entire φ body of the semiconductor device. Trustworthiness. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The width of the conventional adhesive tape is about 1 to 3 mm, and the length of the tape taken up to the disk is about 50 m. When the adhesive tape is attached to the adhesive device, the adhesive tape (hereinafter referred to as "adhesive plate") is attached to the adhesive device, and the beginning end of the adhesive tape is pulled out and attached to the take-up reel. Next, the adhesive is pressed onto the substrate of the -161 - 1322649 circuit by a heating and pressing head from the substrate side of the adhesive tape which is taken up from the adhesive sheet, and the residual substrate is taken up by a take-up reel. Secondly, when the adhesive tape of the adhesive material plate is used up, the used tray and the take-up tray of the take-up substrate are removed, the new adhesive material tray and the new take-up tray are all loaded to the adhesive device, and the adhesive material is adhered. The beginning of the tape is mounted on the take-up reel.

然而，近年來，隨著PDP等之面板畫面之大型化’電 路基板之黏著面積亦增大，一次使用之黏著劑的使用量亦 增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量亦 增加。因此，電子機器之製造工廠之黏著材盤的更換更爲 頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電子 機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每I盤之黏著劑量，用以降低盤之更換頻 率，然而，黏著材膠帶之捲數若增加，盤之黏著材膠帶捲 繞直徑之尺寸（以下稱爲「捲繞直徑」）亦會較大，可能 因無法裝著於既存之黏著裝置上而無法使用既存之黏著裝 置。 因此，申請專利範圍第65〜66項記載之發明的目的 ，係在提供一種黏著材膠帶之形成方法，可不增加黏著材 膠帶之捲繞直徑，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第65〜66 項記載之發明之實施形態進行說明。參照第66圖A及B 、第67圖、第68圖、第4圖、第29圖、及第5圖，針 對申請專利範圍第6 5〜6 6項記載之發明之第1實施形態 進行說明。第66圖A及B係第1實施形態之黏著材膠帶 -162- 1322649 之黏著樹形成步驟圖，第66圖A係將各黏著材膠帶重疊 成一體並將一方之基材捲取至捲取用盤之步驟的槪略圖’ 第66圖B係第66圖A之黏著劑間之重疊部份的剖面圖， 第67圖係在被覆體上形成黏著裝置之黏著劑之步驟的槪 略圖，第68圖係捲繞著黏著材膠帶之盤之斜視圖，第4 圖係電路基板間之黏著的剖面圖，第29圖係PDP之黏著 劑之使用狀態的斜視圖，第5圖係黏著材膠帶之製造方法However, in recent years, as the panel screen of a PDP or the like has increased in size, the adhesion area of the circuit board has also increased, and the amount of the adhesive used at one time has also increased. Moreover, since the use of the adhesive is expanded, the amount of the adhesive is also increased. Therefore, the replacement of the adhesive sheet of the manufacturing plant of the electronic machine is more frequent, because the replacement of the adhesive sheet is troublesome, and there is a problem that the production efficiency of the electronic machine cannot be improved. In view of this problem, it is conceivable to increase the number of rolls of the adhesive tape taken up to the disk to increase the adhesion amount of each disk, in order to reduce the frequency of replacement of the disk. However, if the number of rolls of the adhesive tape is increased, the disk is increased. The size of the winding diameter of the adhesive tape (hereinafter referred to as "winding diameter") is also large, and it may not be possible to use the existing adhesive device because it cannot be attached to the existing adhesive device. Therefore, the object of the invention described in the claims 65 to 66 is to provide a method for forming an adhesive tape which can improve the production efficiency of an electronic device without increasing the winding diameter of the adhesive tape. Next, an embodiment of the invention described in the claims 65 to 66 will be described with reference to the attached drawings. The first embodiment of the invention described in the claims 65th to 6th is described with reference to FIGS. 66A and A, 67, 68, 4, 29, and 5; . Fig. 66A and Fig. B are diagrams showing an adhesive tree forming step of the adhesive tape-162- 1322649 of the first embodiment, and Fig. 66A is an embodiment in which the adhesive tapes are integrally laminated and one of the substrates is taken up to the take-up. FIG. 66 is a cross-sectional view of the overlapping portion between the adhesives of FIG. 66A, and FIG. 67 is a schematic diagram showing the steps of forming an adhesive for the adhesive device on the covering, Figure 68 is a perspective view of the disc with the adhesive tape wound, Figure 4 is a cross-sectional view of the adhesive between the circuit boards, Figure 29 is a perspective view of the adhesive state of the PDP, and Figure 5 is an adhesive tape. Manufacturing method

的步驟圖。 黏著材膠帶1分別捲繞於盤3、121，各盤3、121上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。黏著材膠帶1係由基材9、及塗布於基材9之一側面之 黏著劑1 1所構成。 從強度、及黏著劑之剝離性而言，基材9應由OPP ( 延伸聚丙烯）、聚四氟乙烯、或經過矽處理之PET (聚對 苯二甲酸乙二醋）等所構成，然而，並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 者劑11內亦可分散者導電粒子13。導電粒子13係 如Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒 子、或碳、石墨等，亦可在前述之物及/或非導電性之玻 璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成 -163- 1322649Step diagram. The adhesive tape 1 is wound around the discs 3, 121, respectively, and the reels 5 and the side plates 7 disposed on the width sides of the adhesive tape 1 are disposed on the respective discs 3, 121. The adhesive tape 1 is composed of a substrate 9 and an adhesive 1 1 applied to one side of the substrate 9. In terms of strength and adhesion of the adhesive, the substrate 9 should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or ruthenium treated PET (polyethylene terephthalate), however Not limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an acrylic resin type, and an anthracene resin type. Disperse conductive particles 13. The conductive particles 13 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon, graphite, or the like, and may be in the above-mentioned materials and/or non-conductive glass or ceramics. Polymer core materials such as plastic cover the above-mentioned conductive layer to form -163- 1322649

。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜 粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融 金屬、或塑膠等之高分子核材上形成導電層者，會具有因 加熱加壓或加壓而產生變形之變形性，故連接後之電極間 距離會縮小，連接時可增加和電路接觸之面積，而可提高 信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒 有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可 得到很容易即可對應電極之厚度及平坦性之誤差的連接構 件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第66圖A所示，將2個黏著材膠帶1之盤3、 121、及捲取用之盤17、18裝著至黏著裝置15，將捲繞於 —方之盤3上之黏著材膠帶1之前端經由導引銷22裝設 至一方之捲取盤17，並捲出黏著材膠帶1 (第66圖A甲 箭頭E)。又，捲繞於另一方之盤121上之黏著材膠帶1 φ 之前端亦裝設至另一方之捲取盤18，並捲出黏著材膠帶1 從盤3、121捲出之黏著材膠帶1，會利用配置於盤3 、121及加熱加壓頭19之間之壓著滾輪122，使各黏著材 膠帶1重疊成一體。其次，將另一方之黏著材膠帶1之基 材9捲取至捲取盤18。 其次，將一方之黏著材膠帶1配置於電路基板21上 ，以加熱加壓頭1 9從基材9側實施黏著材膠帶1之壓接 ，將黏著劑11壓著至被覆體之電路基板21。其後，將基 -164-. Further, an insulating coating particle covering the conductive particles with an insulating layer, or conductive particles and insulating particles for use may be applied. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, deformation due to deformation due to heating, pressurization or pressurization is caused, so that the distance between the electrodes after connection is reduced. It can increase the area of contact with the circuit and improve reliability. In particular, it is preferable to use a polymer as a core material, for example, since the solder has no melting point, it can be controlled to a soft state at a wide connection temperature, and an error which can easily correspond to the thickness and flatness of the electrode can be obtained. Connection member. Next, a method of using the adhesive tape of the present embodiment will be described. As shown in Fig. 66A, the discs 3, 121 of the two adhesive tapes 1, and the reels 17 and 18 for winding are attached to the adhesive device 15, and the adhesive material wound on the disc 3 is wound. The front end of the tape 1 is attached to one of the take-up reels 17 via the guide pins 22, and the adhesive tape 1 is unwound (Fig. 66A, arrow A). Further, the front end of the adhesive tape 1 φ wound on the other disk 121 is also attached to the other take-up reel 18, and the adhesive tape 1 is unwound from the adhesive tape 1 which is unwound from the discs 3, 121. The pressure-sensitive adhesive tapes 1 disposed between the disks 3 and 121 and the heating and pressing head 19 are used to overlap the adhesive tapes 1 . Next, the base material 9 of the other adhesive tape 1 is taken up to the take-up reel 18. Next, one of the adhesive tapes 1 is placed on the circuit board 21, and the pressure-sensitive adhesive tape 1 is pressed against the substrate 9 from the substrate 9 side, and the adhesive 11 is pressed against the circuit board 21 of the covering body. . Thereafter, the base -164-

1322649 材9捲取至捲取盤17。 其次，如第4圖所示，在壓著至電路基板21上 著劑Η上配置配線電路（或電子構件）23，將聚四 烯材24當做緩衝材’以加熱加壓頭19對電路基板： 施配線電路23之加熱加壓。利用此方式，可連接電 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑η會被壓著至pdp 26 圍全體’一次使用之黏著劑11的使用量會遠大於傳 之使用量。因此，捲繞於盤3、121之黏著材膠帶1 用量亦會增多，捲繞於盤3、121之黏著材膠帶1會 對較短之時間內被捲取至捲取盤17' 18。 此實施形態時，將黏著劑11壓著至電路基板21 —步驟中，會使一方之黏著材膠帶1之黏著劑11、及 方之黏著材膠帶1之黏著劑11重疊，得到期望之黏 11之厚度後，再將黏著劑11壓著至電路基板21，故 著材膠帶1之厚度只要一半即可。因此，可增加每1 黏著材膠帶1之捲數，而可大幅增加1次更換作業之 用的黏著劑量。因此，只需較少之新黏著材膠帶1之 作業’故可提高電子機器之生產效率。 此處，參照第5圖，針對本實施形態之黏著材膠 製造方法進行說明。 在從捲出機25捲出之基材（separator ) 9上，以 爲通常之大約一半的方式利用塗布機27塗布由樹脂 之黏 氣乙 Η實 路基 PDP 之周 統上 之使 在相 之前 另一 著劑 各黏 盤之 可使 更換 帶之 厚度 及導 -165- 1322649 電粒子13混合而成之黏著劑u，並以乾燥爐29實施乾燥 後’以捲取機31捲取原始材料。被捲取之黏著材膠帶1 之原始材料’以切割機33切成特定寬度並捲取至捲軸5 後’從兩側將側板7、7裝著於捲軸5上，將其和除濕材 一起綑包，實施低溫（-5°C〜- ίο )之管理並進行出貨。 又，黏著材膠帶1亦可以爲黏著劑11中含有後述之硬化 劑者。1322649 The material 9 is taken up to the take-up reel 17. Next, as shown in FIG. 4, a wiring circuit (or electronic member) 23 is placed on the substrate 压 which is pressed against the circuit board 21, and the polytetraene material 24 is used as a buffer material to heat the pressing head 19 to the circuit substrate. : Heating and pressurizing the wiring circuit 23. In this manner, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, as shown in the connection portion of the adhesive tape 1 of the present embodiment, the adhesive η is pressed to the entire periphery of the pdp 26. The amount of the adhesive 11 used at one time is much larger than that of the adhesive 11 Usage amount. Therefore, the amount of the adhesive tape 1 wound around the discs 3, 121 is also increased, and the adhesive tape 1 wound around the discs 3, 121 is taken up to the take-up reel 17' 18 for a short period of time. In this embodiment, the adhesive 11 is pressed against the circuit board 21, and the adhesive 11 of the adhesive tape 1 and the adhesive 11 of the adhesive tape 1 are superimposed to obtain a desired adhesive. After the thickness is applied, the adhesive 11 is pressed against the circuit board 21, so that the thickness of the tape 1 can be half. Therefore, the number of rolls per 1 adhesive tape 1 can be increased, and the amount of adhesive for replacement work can be greatly increased. Therefore, less work of the new adhesive tape 1 is required, so that the production efficiency of the electronic machine can be improved. Here, a method of manufacturing an adhesive paste according to the present embodiment will be described with reference to Fig. 5 . On the substrate 9 which is unwound from the unwinding machine 25, the coating machine 27 is used to coat the periphery of the PMS of the resin by the coater 27 in a manner of about half of the usual manner. The adhesives of the adhesive tapes can be made by mixing the thickness of the replacement tape and the conductive particles u of the conductive particles 13 and dried in the drying oven 29, and the raw materials are taken up by the coiler 31. The original material 'the original material of the taken up adhesive tape 1 is cut into a specific width by the cutter 33 and taken up to the reel 5'. The side plates 7, 7 are attached to the reel 5 from both sides, and are bundled with the dehumidifying material. Package, implement low temperature (-5 ° C ~ - ίο ) management and ship. Further, the adhesive tape 1 may be one in which the adhesive 11 described later contains a curing agent.

其次，針對申請專利範圍第6 5〜6 6項記載之發明之 其他實施形態進行說明’以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第69圖A所示之第2實施形態時，亦可製作黏著劑 11a含有硬化劑及導電粒子13之黏著材膠帶ia'及不含 有硬化劑及導電粒子13之黏著材膠帶ib，如第69圖A 所示，使含有硬化劑等之黏著材膠帶la、及不含有硬化劑 等之黏著材膠帶lb重疊成一體，再將重疊之物壓著至電 路基板21。此時’因爲只有一方之黏著材膠帶ia之黏著 劑11a含有硬化劑，另一方之黏著材膠帶lb之黏著劑lib 即無需含有硬化劑。因此，未含有硬化劑之黏著劑1 1 b之 黏著材膠帶lb無需實施低溫管理。 因此，可減少需要低溫管理之黏著材膠帶la之數， 黏著材膠帶之運送及保管可實現較有效率之管理。 又，黏著劑爲環氧樹脂系時，環氧樹脂之硬化劑應爲 咪唑系、胺醯亞胺、銨鹽、聚胺類、及聚硫醇等。 -166- 1322649 又，如第69圖B所示，含有硬化劑之一方之黏著材 膠帶la之黏著劑11a含有導電粒子13而爲2層構成，因 被壓著側未含有導電粒子，樹脂會流動，不會從導電粒子 相對峙之電路間流出，加熱加壓時可確實使導電粒子13 保持留在電極21a及電極23a之間。In the following, the embodiments of the invention described in the sixth to fifth aspects of the invention are described. In the embodiments described below, the same portions as those in the above-described embodiments will be denoted by the same reference numerals and the details of the parts will be omitted. Note that the following description is mainly based on differences from the above embodiments. In the second embodiment shown in Fig. 69A, the adhesive 11a containing the curing agent and the conductive particles 13 and the adhesive tape ib which does not contain the curing agent and the conductive particles 13 can be produced, as in the 69th embodiment. As shown in Fig. A, an adhesive tape la containing a curing agent or the like and an adhesive tape lb not containing a curing agent are integrally stacked, and the superposed substances are pressed against the circuit board 21. At this time, since only one of the adhesive tapes ia of the adhesive tape ia contains a hardener, the adhesive lib of the other adhesive tape lb does not need to contain a hardener. Therefore, the adhesive tape lb of the adhesive 1 1 b which does not contain a hardener does not need to be subjected to low temperature management. Therefore, the number of adhesive tapes that require low temperature management can be reduced, and the transportation and storage of the adhesive tape can achieve more efficient management. Further, when the adhesive is an epoxy resin, the curing agent of the epoxy resin should be an imidazole type, an amine imide, an ammonium salt, a polyamine, or a polythiol. Further, as shown in Fig. 69B, the adhesive 11a of the adhesive tape la containing one of the curing agents contains the conductive particles 13 and is composed of two layers. Since the pressed side does not contain conductive particles, the resin will The flow does not flow out from the circuit between the conductive particles and the crucible, and the conductive particles 13 can be surely kept between the electrode 21a and the electrode 23a when heated and pressurized.

申請專利範圍第65〜66項記載之發明並未受限於上 述之實施形態，申請專利範圍第65〜66項記載之發明之 要旨的範圍內，可實施各種變形。 第1實施形態時，黏著劑1 1係含有導電粒子1 3，然 而，亦可以爲未含有導電粒子1 3之黏著劑1 1。 上面所述係針對電子構件及電路基板、以及電路基板 間之黏著固定時進行說明，然而，亦可應用於將半導體元 件（晶片）黏著·固定於引線框架之固定用支持基板、引 線框架之晶片、或半導體元件載置用支持基板之半導體裝 置上。 其次，針對申請專利範圍第67〜72項記載之發明進 行說明。 這些發明係關於例如液晶面板、PDP面板、EL面板 、裸晶片封裝等之電子構件及電路板、或電路板間之黏著 固定、以及以提供用以實施兩者之電極間之電性連接之向 異導電材爲目的之向異導電材膠帶，尤其是，和向異導電 材之捲取形態相關。 其次，針對申請專利範圍第67〜72項記載之發明之 背景技術進行說明。 -167- 1322649 利用向異導電材膠帶之電子構件及電路板、或電路板 間之連接方法，係利用相對峙之電極間夾著膜狀黏著劑之 向異導電材，以加熱加壓實施電子構件及電路板、或電路 板間之連接。膜狀之黏著劑中，混合著以實現電極間之導 通爲目的之導電粒子，採用之樹脂爲熱可塑性樹脂、熱硬 化性樹脂、熱可塑性樹脂及熱硬化性樹脂之混合物、以及 光硬化性樹脂（例如，參照日本特開昭5 5 - 1 0 4 0 0 7號公報The invention described in the claims 65 to 66 is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the invention as set forth in the claims 65 to 66. In the first embodiment, the adhesive 11 contains the conductive particles 13 or, however, the adhesive 11 which does not contain the conductive particles 13 may be used. The above description is directed to the case where the electronic component, the circuit board, and the circuit board are fixed to each other. However, the present invention can also be applied to a wafer for fixing and fixing a semiconductor element (wafer) to a fixing support substrate of a lead frame or a lead frame. Or on a semiconductor device on which a semiconductor substrate is mounted. Next, the invention described in the claims 67 to 72 will be described. These inventions relate to electronic components such as liquid crystal panels, PDP panels, EL panels, bare chip packages, and the like, and to the adhesion between the boards, and to provide electrical connection between the electrodes of the two. The conductive material for the purpose of the different conductive material is, in particular, related to the winding form of the different conductive material. Next, the background art of the invention described in the claims 67 to 72 will be described. -167- 1322649 A method of connecting an electronic component to a different-conductive conductive tape, a circuit board, or a circuit board, by using a conductive adhesive material sandwiching a film-like adhesive between opposing electrodes, and performing electron heating and pressing The connection between components and boards, or boards. In the film-like adhesive, conductive particles for the purpose of conducting conduction between the electrodes are mixed, and the resin used is a mixture of a thermoplastic resin, a thermosetting resin, a thermoplastic resin, and a thermosetting resin, and a photocurable resin. (For example, refer to Japanese Patent Publication No. 5 5 - 1 0 4 0 0 7

又，採用不含導電粒子而只由樹脂所構成之向異導電 材的電路連接方法亦爲大家所熟知（例如，參照日本特開 昭60-262430號公報）。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 表，又，熱硬化性樹脂系則以環氧樹脂系、矽樹脂系、及 壓克力樹脂系爲代表。熱可塑性樹脂系及熱硬化性樹脂系 之連接上，皆需要實施加熱加壓。其目的係爲了使熱可塑 性樹脂系之樹脂流動並得到和被覆體間之密著力、以及爲 了使熱硬化性樹脂系能獲得進一步之樹脂之硬化反應。近 年來，以連接信賴性之角度而言，係以熱可塑性樹脂及熱 硬化性樹脂之混合物、及熱硬化性樹脂系爲主流。又，可 以低溫度實施連接之光硬化樹脂系亦開始被應用於工業上Further, a circuit connection method using a conductive material composed of a resin and containing a conductive material is also known (for example, refer to Japanese Laid-Open Patent Publication No. SHO 60-262430). The thermoplastic resin system is represented by a styrene resin type or a polyester resin type, and the thermosetting resin type is represented by an epoxy resin type, an anthracene resin type, and an acrylic resin type. Both the thermoplastic resin and the thermosetting resin are required to be heated and pressurized. The purpose is to allow a resin of a thermoplastic resin to flow and to obtain a adhesion between the resin and the coating, and to obtain a further curing reaction of the resin in order to obtain a thermosetting resin. In recent years, from the viewpoint of connection reliability, a mixture of a thermoplastic resin and a thermosetting resin, and a thermosetting resin are mainly used. Moreover, the photohardenable resin which can be connected at a low temperature has also been applied to industrial applications.

又’近年來’爲了防止被連接體之反翹及伸展，要求 向異導電材之連接時之連接溫度的低溫化。又，隨著向異 導電材之連接用途的擴大、以及液晶面板、PDP面板、EL -168- 1322649 面板、及裸晶片封裝等之需要的擴大，對連接時之工作時 間之短時間化的要求愈來愈強。Further, in recent years, in order to prevent the warpage and stretching of the connected body, the connection temperature at the time of connection to the different conductive material is required to be lowered. In addition, with the expansion of the use of the conductive material to the conductive material, and the expansion of the liquid crystal panel, the PDP panel, the EL-168-1322649 panel, and the bare chip package, the time required for the connection is shortened. It is getting stronger and stronger.

又’隨著向異導電材之連接需要及用途之擴大，不但 要求短時間之連接’尙要求能提高生產性。因爲液晶面板 、PDP面板、EL面板、及裸晶片封裝等之需要的擴大， 向異導電材之使用量亦增加。另一方面，隨著液晶面板之 大畫面及PDP面板等大畫面平板之需要的擴大，向異導電 材之1片面板所使用之使用量亦增加。傳統上，向異導電 材之提供係採用將膜狀之黏著劑重疊捲繞於剖面爲圓形芯 材上的盤形狀，盤之更換時間妨礙生產性之提高。 另一'方面’隨者液晶面板之細邊緣化，向異導電材亦 朝狹窄化發展，傳統上捲繞於同一圓芯狀之盤形狀很容易 發生捲取散亂，進而導致製造步驟之廢料率的惡化。 有鑑於上述缺點，申請專利範圍第6 7〜7 2項記載之 發明的目的，係在提供一種向異導電材膠帶，可延長盤之 更換時間之間隔’且以避免捲取散亂所導致之作業性的降 低’而可提局生產性。 其次’針對申請專利範圍第67〜72項記載之發明之 實施形態進行說明。 第70圖係申請專利範圍第67〜72項記載之發明之第 1實施形態之模式圖。 如第70圖所示，本實施形態之向異導電材膠帶，係 將由膜狀黏著劑11、及兩面經過剝離處理之基材膜（基材 )9之2層構造所構成之向異導電材，以多捲數方式積層 -169-In addition, as the connection to the different conductive materials is required and the use is expanded, not only is it required to be connected for a short period of time, but it is required to improve productivity. Since the demand for liquid crystal panels, PDP panels, EL panels, and bare chip packages has increased, the amount of use of the conductive material has also increased. On the other hand, with the expansion of large screens such as liquid crystal panels and large-screen panels such as PDP panels, the amount of use for one panel of a different conductive material has also increased. Conventionally, the supply of the electrically conductive material has been carried out by superimposing a film-like adhesive on a disk shape having a circular core shape, and the replacement time of the disk hinders the improvement of productivity. Another aspect is that the thinner edge of the liquid crystal panel is developed, and the conductive material is also narrowed. The shape of the disk which is conventionally wound in the same core shape is prone to coiling and scattering, which leads to waste in the manufacturing process. The rate has deteriorated. In view of the above disadvantages, the object of the invention described in the claims 6-7 to 7 is to provide a tape for the electrically conductive material, which can extend the interval between replacement times of the disk and avoid the disorder of the winding. The reduction in workability' can lead to productivity. Next, the embodiment of the invention described in the claims 67 to 72 will be described. Fig. 70 is a schematic view showing a first embodiment of the invention described in the claims 67 to 72. As shown in Fig. 70, the dissimilar conductive material tape of the present embodiment is a cross-conductive material composed of a two-layer structure of a film-like adhesive 11 and a base film (substrate) 9 subjected to release treatment on both sides. , layered in multiple volumes -169-

1322649 於芯材5之縱向上而成爲捲線狀，第70匱 之供應形態。第7 0圖中’芯材5之兩端部 板7。又，向異導電材膠帶係由基材膜9、 膜9上之向異導電材之膜狀黏著劑11所構 材膠帶因係應用於高精細化之電子構件之連 止無機及有機物之異物及污染，基材膜9會 外側。 採用向異導電材之連接上，要求縮短工 求向異導電材之迅速轉錄性。如上面所述， 以多捲數方式積層於附有側板7之芯材（捲 上而成捲線狀，可提供不會發生捲取散亂之 電材。因此，可延長向異導電材膠帶之更換 提高生產性。 上述向異導電材膠帶時，基材膜 9之 12kg/mm2以上、基材膜9之斷裂伸展應爲 此，基材膜9因爲具有強度且伸展較小，在 電材之膜狀黏著劑11轉錄至電路基板等連 過程中，可防止膜狀黏著劑11伸展、厚度 度變細。又，以處理及環境保護之角度而言 厚度應爲100#m以下。因爲基材膜9太薄 果之劣化，故基材膜9之厚度應爲0.5/zm以 其次，上述向異導電材膠帶所採用之基 度、及構成向異導電材之黏著劑之剝離性的 採用經過矽及氟剝離處理之PP(聚丙烯）、 丨係向異導電材 ;分別配設著側 及塗布於基材 丨成，向異導電 接上，爲了防 位於黏著劑之 作時間，且要 將向異導電材 ;軸）5之縱向 長方形向異導 時間之間隔而 拉伸強度應爲 6 0 ~ 2 0 0 % =因 將構成向異導 接構件之前的 變薄、以及寬 ，基材膜9之 會導致上述效 :上。 材膜9，從強 角度而言，應 OPP (延伸聚 -170- 1322649 烯 丙 及 不 並 9 而 然 等 \ly 酯二 乙 酸 甲二 苯 對 聚 現，只在 9之表面 之背面轉 膜狀黏著 具有剝離 化性樹脂 且具有良 低之溫度 膜狀之黏 壓克力系 發明之第 圖相同之 膠帶有2 方式構成 向異導電 第 71圖 施過剝離 捲軸側之 限於此。 基材膜9之剝離處理，以矽或氟處理即可實 基材膜9之單面實施剝離處理的話，可使基材膜 及背面具有不同之脫模性，而可防止對基材膜9 錄。又，對基材膜9之兩面實施剝離處理時，對 劑11面實施矽及氟處理，而使膜狀黏著劑11面 性。 膜狀之黏著劑1 1係使用具高信賴性之熱硬 系之環氧樹脂系、以黏著劑之低應力化爲目的而 好黏著劑相溶性之矽樹脂系、以及可以較上述爲 及較短之時間實施連接之自由基系之物，然而， 著劑並未受限於此。自由基系之黏著劑1 1係以 黏著劑爲主。 第71圖係申請專利範圍第67〜72項記載之 2實施形態的模式圖。又，第71圖中，和第70 構成要素會附與相同符號並省略詳細說明。 如第71圖所示，本實施形態之向異導電材 種基材膜，除了採用以前述基材模夾住黏著劑之 之向異導電材以外，其餘構成和第1實施形態之 體膠帶相同。亦即，本實施形態之向異導電材如 所示，係由膜狀之黏著劑11、及黏著劑Π面實 處理之2種基材9a、9b之3層構造所構成。 構成向異導電材之黏著劑較軟時，可以利用 -171 -1322649 is a winding form in the longitudinal direction of the core material 5, and a supply form of the 70th. In Fig. 70, the both ends of the core material 5 are plate 7. Moreover, the tape of the film-like adhesive 11 which is made of the base film 9 and the film of the different conductive material on the film 9 is applied to the high-definition electronic component and the foreign matter of the inorganic and organic substances. And the contamination, the substrate film 9 will be outside. The use of a connection to a different electrically conductive material requires a shortening of the rapid transcription of the electrically conductive material. As described above, the core material with the side plates 7 is laminated in a multi-volume manner (the coil is wound into a coil shape, and the electric material which does not cause the coiling and scattering to be provided can be provided. Therefore, the replacement of the tape to the different conductive material can be extended. When the above-mentioned conductive material tape is used, the base film 9 is 12 kg/mm 2 or more, and the base film 9 is broken and stretched. For this reason, the base film 9 has a small strength and a small stretch, and is formed in a film shape of the electric material. When the adhesive 11 is transcribed into a circuit board or the like, the film-like adhesive 11 can be prevented from being stretched and the thickness thereof is reduced. Further, the thickness should be 100 or less in terms of handling and environmental protection. If the thickness of the base film 9 is 0.5/zm, the basis weight of the above-mentioned conductive conductive tape and the peeling property of the adhesive to the different conductive material may be used. Fluorine stripping treatment of PP (polypropylene) and bismuth-oriented conductive materials; respectively, the side is disposed and applied to the substrate, and is placed on the opposite side of the conductive material, in order to prevent the time of the adhesive from being placed, and to be different Conductive material; axis) 5 longitudinal rectangular to different time Spacing the tensile strength should be 60 ~ 200% = constituting the thinned by contact before anisotropic conductive member, and the width of the substrate film 9 will cause the above effect: on. The film 9, from a strong point of view, should be OPP (extended poly-170- 1322649 ally and not 9 and then \ly ester diacetate diphenyl pair can be concentrated, only on the back surface of the 9 film Adhesive having a peeling resin and having a low temperature film shape is the same as the first embodiment of the invention. The two types of the structure are limited to the side of the peeling reel. In the peeling treatment, if the peeling treatment is performed on one side of the solid substrate film 9 by hydrazine or fluorine treatment, the base film and the back surface can have different releasability, and the substrate film 9 can be prevented from being recorded. When the both sides of the base film 9 are subjected to the release treatment, the surface of the agent 11 is subjected to a ruthenium treatment and a fluorine treatment to form a film-like adhesive 11 having a surface property. The film-like adhesive 1 1 is a thermosetting system having high reliability. An epoxy resin, a resin which is compatible with the adhesive for the purpose of low stress, and a radical which can be connected to the above-mentioned and for a short period of time. However, the agent is not Limited by this. Free radical adhesive 1 1 is adhesive Fig. 71 is a schematic view showing a second embodiment of the application of the patents in the range of the first to the sixth, and the same reference numerals are given to the same components in the seventh embodiment, and the detailed description is omitted. It is to be noted that the conductive material substrate film of the present embodiment is the same as the body tape of the first embodiment except that the conductive material is sandwiched between the substrate molds. The conductive material of the present embodiment is composed of a film-like adhesive 11 and a three-layer structure of two types of substrates 9a and 9b which are treated by an adhesive agent as shown in the figure. When the agent is soft, you can use -171 -

1322649 如下所示之基材膜來防止黏著劑變形。 其次，基材膜9a、9b之物性値上，基材膜 拉伸強度應爲1.2kg/mm2以上、基材膜9a、9b 展應爲60〜200 %之理由，和第1實施形態時柯 此方式，基材膜9a、9b可得到物理強度，而π； 膜狀黏著劑之伸展而產生薄膜化、以及寬度方向 又，基材9a、9b之厚度應爲100#m以下，如it) 及環境保護都可有良好之對應。 又，上述第1及第2實施形態時，若構成向 之膜狀黏著劑11爲無黏著性且不會出現阻塞現 可在無基材膜9或9a ' 9b之狀態下單獨其膜狀 捲成捲線狀。 以下，針對實施例進行說明，然而，申請專 67〜72項記載之發明並未受限於這些實施例。 (實施例1 ) (1)向異導電材膜之製作 製作乙酸乙酯之30重量百分率溶液，對其 粒徑爲2.5//m、5體積百分率之Ni粉。其次， 乙酯溶液添加當做膜形成材之苯氧基樹脂（高分 樹脂）50g、環氧樹脂20g、及咪唑5g，得到黏 用溶液。另一方面，準備在著色成淡藍色之透明 50//m之聚對苯二甲酸乙二酯膜（斷裂強度爲 、斷裂伸展爲130% )之兩面實施矽處理之基材 9a 、 9b 之 之斷裂伸 !同。利用 ’防止因爲 丨之變細。 ;，在操作 丨異導電材 ，象者，則 黏著劑1 1 利範圍第 添加平均 上述乙酸 子量環氧 著劑形成 、厚度爲 25kg/mm2 膜。其次 -172-1322649 A substrate film as shown below to prevent deformation of the adhesive. Next, the physical properties of the base film 9a and 9b are such that the tensile strength of the base film is 1.2 kg/mm2 or more, and the base film 9a and 9b are 60 to 200%, and in the first embodiment, In this manner, the substrate films 9a, 9b can obtain physical strength, and π; the film-like adhesive is stretched to form a film, and the width direction is further, and the thickness of the substrate 9a, 9b should be 100 #m or less, such as it) And environmental protection can have a good correspondence. Further, in the first and second embodiments, the film-like adhesive 11 is formed to be non-adhesive and does not clog, and the film roll can be separately formed in the state without the substrate film 9 or 9a ' 9b. Rolled into a line. Hereinafter, the embodiments will be described. However, the inventions described in the applications of Sections 67 to 72 are not limited to these embodiments. (Example 1) (1) Preparation of a film of an isoelectric material A 30 wt% solution of ethyl acetate was prepared to have a particle size of 2.5/m and a volume fraction of Ni powder. Next, 50 g of a phenoxy resin (high-scoring resin) as a film-forming material, 20 g of an epoxy resin, and 5 g of an imidazole were added to the ethyl ester solution to obtain a viscous solution. On the other hand, the base material 9a, 9b which is subjected to the ruthenium treatment on both sides of a polyethylene terephthalate film (breaking strength, breaking elongation of 130%) which is colored in a light blue transparent 50/m is prepared. The break is stretched! Same. Use ' to prevent it from becoming thinner. ;, in the operation of the different conductive materials, the image, the adhesive 1 1 range of the addition of the above average acetic acid amount of epoxy agent formation, thickness of 25kg / mm2 film. Second -172-

1322649 ，在此基材膜之單面上以滾塗機塗布上述 1之5分鐘乾燥，得到厚度50/zm之向異 物。 (2)向異導電材膠帶之製作 將上述向異導電材膜之捲繞物切割成寬 多捲數方式積層於附有側板之直徑48mm、 芯材（捲軸）之縱向上而成爲捲線狀，得到 向異導電材膠帶。 將此捲繞成捲線狀之向異導電材，亦 材膠帶裝設於向異導電材膠帶自動壓著機 電材時，在向異導電材之轉錄性及伸展試 果，而且，可減少盤之裝設次數、無需裝 免轉錄性及黏著劑之伸展所導致之貼附作 些效果可提高生產性。 液，實施110 電材膜的捲繞 度 1 _ 5mm，以 寬度100mm之 300m長度之 丨，將向異導電 :並供應向異導 i中獲得良好結 :時間、以及避 :的重複，而這1322649, drying on the single side of the base film by a roll coater for 5 minutes to obtain a foreign matter having a thickness of 50/zm. (2) Production of a different-conductive conductive material tape The above-mentioned winding material of the different-conductive conductive material film is cut into a wide multi-volume number to be laminated in a longitudinal direction of a core material (reel) having a side plate of 48 mm, and is wound in a line shape. A tape of a different conductive material is obtained. This is wound into a coil-shaped conductive material, and the tape is mounted on the electrically conductive material when the electroconductive material is automatically pressed against the electrically conductive material tape, and the transcription and extension of the conductive material are tested, and the disk can be reduced. The number of times of installation, the need to attach transcription-free, and the extension of the adhesive can be used to improve the productivity. Liquid, the implementation of the 110 electrical film winding degree 1 _ 5mm, with a width of 100mm 300m length, will be the opposite conductivity: and supply a good junction to the conduction of i: time, and avoid: repeat, and this

(實施例2 ) 製作和實施例1相同之向異導電材膠费 ，在基材膜及黏著劑之積層體上，以2基右 之方式，層壓另1種類之厚度爲25"m之哥 烯酯基材膜（斷裂強度爲25kg/mm2、斷裂] ’得到3層構造之向異導電材膜之捲物。ΐ 1相同，將此膜之捲物切割成寬度1.5mm， 附有側板之直徑48mm、寬度1 00mm之芯材 之捲物。其次 膜夾住黏著劑 對苯二甲酸乙 I展爲1 3 0 % ) 次，和實施例 並將其捲取至 (捲軸）而成 -173- 1322649 爲捲線狀，得到300m長度之向異導電材膠帶。 實施例2亦和實施例1相同，可得到良好之生產性。 (實施例3 )(Example 2) The same non-conductive material was produced in the same manner as in Example 1. The thickness of the other type was 25"m on the base film and the laminate of the adhesive on the base film and the adhesive. Glutamine substrate film (breaking strength: 25 kg/mm2, fracture] 'A roll of a three-layer structure of a dissimilar conductive film was obtained. The same as ΐ 1, the roll of the film was cut into a width of 1.5 mm, with a side plate attached thereto. a coil of core material having a diameter of 48 mm and a width of 100 mm. The second film is sandwiched with the adhesive terephthalic acid, and is rolled up to (reel) - 173- 1322649 is a coiled shape, and a 300m length of dissimilar conductive tape is obtained. Also in Example 2, as in Example 1, good productivity was obtained. (Example 3)

除了基材膜採用厚度50/zm之聚四氟乙烯膜（斷裂強 度爲4.6kg/mm2、斷裂伸展爲350%)以外，得到和實施例 1相同之向異導電材膜之捲繞物，此外，和實施例1相同 ，將此膜之捲繞物切割成寬度1 .5mm，捲繞於附有側板之 直徑48mm、幅1 OOmm之芯材（捲軸）而成爲捲線狀，得 到3 00m長度之向異導電材膠帶。此時，亦可捲繞3 00m 之長度。 (比較例1 ) 得到和實施例1相同之向異導電材膜之捲繞物，此外 ，和實施例1相同，將此膜之捲繞物切割成寬度1.5 mm， φ 以同一圓芯狀捲繞至傳統之盤，得到l〇〇m長度之向異導 電材膠帶。 將此捲繞成捲線狀之向異導電材膠帶裝著至向異導電 材膠帶自動壓著機，並供應向異導電材時，向異導電材之 轉錄性及伸展試驗皆獲得良好結果，然而，盤之裝設次數 爲實施例之3倍，裝設時間及調整時間都增加。 本發明之產業上的利用可能性如下所示。 如以上說明所示，利用申請專利範圍第1項記載之發 明時’係利用黏著材膠帶之黏著劑來黏著全部捲出之黏著 -174- 1322649 材膠帶（一方之黏著材膠帶）之終端部、及新裝著之黏著 材膠帶（另一方之黏著材膠帶）之始端部，實施黏著材盤 之更換，很簡單即可將新黏著材膠帶裝著至黏著裝置。 又，因爲無需在每次更換新黏著材膠帶時都更換捲取 膠帶、將新黏著材膠帶之始端裝設於捲取盤上之作業、以 及在特定路徑設定導引銷等之作業，只需要較少時間即可 更換新黏著材盤，故可提高電子機器之生產效率。A coiled product of the same conductive material film as in Example 1 was obtained except that a polytetrafluoroethylene film having a thickness of 50/zm (having a breaking strength of 4.6 kg/mm 2 and a tensile elongation of 350%) was used as the substrate film. In the same manner as in the first embodiment, the wound material of the film was cut into a width of 1.5 mm, and wound into a core material (reel) having a diameter of 48 mm and a width of 100 mm, which was attached to the side plate, and was wound into a line shape to obtain a length of 300 m. Tape to the different conductive material. At this time, it is also possible to wind a length of 300 m. (Comparative Example 1) A wound material of the same conductive material film as in Example 1 was obtained, and in the same manner as in Example 1, the wound material of the film was cut into a width of 1.5 mm, and φ was wound in the same core shape. Wrap around to the traditional plate to obtain a strip of dissimilar conductive material of l〇〇m length. When the tape is wound into a coil-shaped conductive material tape to the isoconductive tape automatic crimping machine and supplied to the isoelectric material, the transcription and stretching tests to the isoelectric material are good, however, The number of times the disk is installed is three times that of the embodiment, and the installation time and the adjustment time are increased. The industrial utilization possibilities of the present invention are as follows. As described above, when the invention described in the first aspect of the patent application is used, the adhesive portion of the adhesive tape is used to adhere the end portion of the adhesive tape-174- 1322649 tape (one adhesive tape). And the newly-installed adhesive tape (the other side of the adhesive tape) at the beginning of the implementation of the adhesive plate replacement, it is very simple to put the new adhesive tape to the adhesive device. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the operation of mounting the beginning of the new adhesive tape on the take-up reel, and the setting of the guide pin in a specific path, only The new adhesive plate can be replaced in less time, which can increase the production efficiency of the electronic machine.

因爲一方之黏著材膠帶及另一方之黏著材膠帶係以重 疊黏著劑面來進行黏著，故有較高之連接強度。 利用申請專利範圍第2項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之效果以外，全部捲 出之黏著材膠帶之切斷係在露出結束標記時實施，切斷及 執行連接作業之部份容易解開且可利用必要最小之位置實 施連接，而可防止黏著材膠帶之浪費。 利用申請專利範圍第3項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶黏著全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 ，故很簡單即可實施黏著材膠帶間之黏著。 利用申請專利範圍第4項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 -175- 1322649 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。Since one of the adhesive tapes and the other adhesive tape are adhered by overlapping adhesive faces, there is a high connection strength. In the case of the invention described in the second paragraph of the patent application, in addition to the effects similar to those of the invention described in the first aspect of the patent application, the cutting of the entire adhesive tape is performed when the end mark is exposed, and the cutting is performed. The part that performs the joining operation is easy to unravel and the connection can be performed with the minimum necessary position, and the waste of the adhesive tape can be prevented. When the invention described in the third paragraph of the patent application is applied, the effect of the invention described in the first aspect of the patent application is the same, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. The new adhesive plate can be replaced, which can improve the production efficiency of the electronic machine. In addition, since the end portion of the adhesive tape which is completely unwound and the beginning end of the newly attached adhesive tape are adhered by the adhesive tape before the adhesive tape, the adhesion between the adhesive tapes can be easily performed. When the invention described in claim 4 is applied, the effect of the invention described in the first aspect of the patent application is the same, and the new adhesive tape can be easily attached to the adhesive device, and only a small amount of time is required. Can be more -175- 1322649 to replace the new adhesive plate, so it can improve the production efficiency of electronic machines. In addition, since the adhesive tape is not required to be folded back, the adhesive tape can be taken up to the take-up reel to prevent possible winding up.

利用申請專利範圍第5項記載之發明時，因爲係以卡 止銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏 著材膠帶之始端部，故連接十分簡單。又，因爲無需在每 次更換新黏著材盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設於捲取盤上作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 利用申請專利範圍第6項記載之發明時，卡止構件之 一方之爪部會卡止於一方之黏著材膠帶之終端部，其後， 配設於卡止構件之另一方之爪部會卡止於另一方之黏著材 膠帶之始端部，實施兩者之互相連接，故連接十分容易。 因爲一方之爪部及另一方之爪部之間具有彈性構件， 故，彈性構件可伸展而使卡止構件之另一方之爪部卡止於 另一方之黏著材膠帶之始端部之任意位置上，故連接具有 高自由度。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部會在互相抵接之狀態進行連接，無需重疊膠帶 ，可利用必要最小之位置實施連接，而可防止黏著材膠帶 之浪費。 利用申請專利範圍第7項記載之發明時，只需以夾子 —方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 -176- 1322649 部之重疊部份即可連接，連接作業十分容易。 利用申請專利範圍第8項記載之發明時，係從重疊部 份之兩面壓扁夾持片來連接兩者，可提高黏著材膠帶之重 疊部份的連接強度。According to the invention described in the fifth paragraph of the patent application, since the end portion of the adhesive tape which is completely unwound and the beginning end portion of the newly attached adhesive tape are fixed by the locking pin, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. According to the invention described in claim 6, the claw portion of one of the locking members is locked to the end portion of one of the adhesive tapes, and thereafter, the other claw portion of the locking member is engaged. At the beginning of the adhesive tape on the other side, the two are connected to each other, so the connection is very easy. Since there is an elastic member between the claw portion of one of the claws and the claw portion of the other, the elastic member can be stretched so that the other claw portion of the locking member is locked at any position of the beginning end portion of the other adhesive tape. Therefore, the connection has a high degree of freedom. Further, the end portion of the adhesive tape of one of the adhesive tapes and the other end portion of the adhesive tape are connected to each other without overlapping the tape, and the connection can be performed at the minimum necessary position, thereby preventing the adhesive tape. waste. When using the invention described in the seventh paragraph of the patent application, it is only necessary to connect the end portion of the adhesive tape to the end of the adhesive tape and the overlap of the other end of the adhesive tape -176 to 1322649. easily. According to the invention described in the eighth aspect of the invention, the holding pieces are flattened from both sides of the overlapping portion to join the two, and the joint strength of the overlapping portion of the adhesive tape can be improved.

利用申請專利範圍第9項記載之發明時，係利用黏著 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，因爲無需 每次更換新黏著材盤時都更換基材之捲取盤、及將新黏著 材之始端裝設至捲取盤，只需要較少時間即可更換新黏著 材盤，故可提高製造效率。 利用申請專利範圍第1 0項記載之發明時，除了具有 和申請專利範圍第9項記載之發明相同之效果以外，一方 之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部會 互相形成鈎狀卡止，而且，兩者係以黏著劑面互相連接， 故有較高之連接強度。 利用申請專利範圍第1 1項記載之發明時，除了具有 和申請專利範圍第9或1 0項記載之發明相同之效果以外 ’一方之黏著材膠帶之終端部係結束標記之部份，執行連 接作業之部份容易解開，且防止黏著材膠帶之浪費。 利用申請專利範圍第12項記載之發明時，除了具有 和申請專利範圍第9項〜11之其中任一項記載之發明相同 之效果以外，因爲連接部份會形成凹凸，可擴大連接面積 ’同時，可提高連接部份之黏著材膠帶之拉伸方向（縱向 -177- 1322649 )之強度。 利用申請專利範圍第1 3項記載之發明時，除了具有 和申請專利範圍第9項〜第n項之其中任一項記載之發 明相同之效果以外’連接部份會形成貫通孔，貫通孔之內 緣會有黏著劑滲出’可增加黏著劑之黏著面積，而進一步 提高連接強度。 利用申請專利範圍第1 4項記載之發明時，只需連接 φ 已用完之黏著材膠帶（一方之黏著材膠帶）、及新黏著材 膠帶（另一方之黏著材膠帶）即可更換盤，故很簡單即可 將新黏著材盤裝著至黏著裝置。又，因爲無需每次更換新 黏著材盤時都更換捲取盤、將新黏著材膠帶之始端裝設於 捲取盤上、以及將黏著材膠帶裝設於導引件之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 黏著材膠帶之處理基材所使用之處理劑係矽系樹脂， φ 且黏著膠帶亦使用矽黏著劑，因可降低兩者之表面張力差 而提高密著力，故可實現傳統上十分困難之兩者之黏著。 利用申請專利範圍第1 5項記載之發明時，除了具有 和申請專利範圍第1 4項記載之發明相同之效果以外，矽 黏著膠帶之黏著劑面之表面張力及黏著材膠帶之矽處理基 材之表面張力之差爲1 OmN/m ( 1 Odyne/cm )以下，可得到 強密著力，而可確實黏著兩者。 利用申請專利範圍第1 6項記載之發明時，除了具有 和申請專利範圍第15項記載之發明相同之效果以外，因 -178- 1322649 爲黏著力爲1 〇〇g/25 mm以上’可使一方及另一方之黏著材 膠帶之兩黏著劑面之黏著更爲強固。 利用申請專利範圍第1 7項記載之發明時，除了具有 和申請專利範圍第1 6項記載之發明相同之效果以外，係 利用兩面連接一方及另一方之黏著材膠帶，故可得到更爲 強固之連接。When the invention described in claim 9 is applied, the adhesive portion of the adhesive tape is adhered to the end portion of the used adhesive tape and the beginning portion of the newly attached adhesive tape. Replacement, it is very simple to put the new adhesive plate to the adhesive device. Moreover, since it is not necessary to replace the winding disc of the substrate every time the new adhesive sheet is replaced, and the beginning of the new adhesive material is attached to the take-up reel, it takes only a small time to replace the new adhesive disc, so Improve manufacturing efficiency. When the invention described in claim 10 is the same as the invention described in claim 9, the end portion of one of the adhesive tapes and the other end of the adhesive tape are mutually in contact with each other. A hook-like snap is formed, and the two are connected to each other with an adhesive surface, so that the joint strength is high. When the invention described in the first paragraph of the patent application is applied, the end portion of the end portion of the adhesive tape is attached to the end portion of the adhesive tape of the first application, and the connection is performed. Part of the job is easy to unravel and prevent the waste of adhesive tape. In addition to the effects of the invention described in any one of the nineteenth to eleventh aspects of the patent application, the connection portion is formed with irregularities, and the connection area can be enlarged. It can increase the strength of the direction of stretching of the adhesive tape (length -177 - 1322649) of the joint portion. When the invention described in claim 13 is the same as the invention described in any one of the claims 9 to n, the connecting portion forms a through hole, and the through hole is formed. The adhesive oozing out of the inner edge can increase the adhesive area of the adhesive and further increase the joint strength. When using the invention described in the first paragraph of the patent application, it is only necessary to connect the φ used adhesive tape (one adhesive tape) and the new adhesive tape (the other adhesive tape) to replace the disk. Therefore, it is very simple to put the new adhesive plate to the adhesive device. Moreover, since it is not necessary to replace the take-up reel every time a new adhesive sheet is replaced, the beginning of the new adhesive tape is mounted on the take-up reel, and the adhesive tape is installed on the guide member, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. The treatment agent used for the treatment of the adhesive tape is a lanthanum resin, φ and the adhesive tape also uses a 矽 adhesive, which can reduce the surface tension difference between the two and increase the adhesion, so that two conventionally difficult ones can be realized. Sticky to the person. When the invention described in the fifteenth aspect of the patent application is used, the surface tension of the adhesive surface of the adhesive tape and the treatment of the substrate of the adhesive tape are treated in addition to the same effects as the invention described in claim 14 of the patent application. The difference in surface tension is 1 OmN/m (1 Odyne/cm) or less, and a strong force can be obtained, and both can be surely adhered. When the invention described in claim 16 is used, the adhesion is 1 〇〇g/25 mm or more because -178- 1322649 has the same effect as the invention described in claim 15 The adhesion of the two adhesive faces of the adhesive tape of one side and the other is stronger. When the invention described in claim 17 is used, it has the same effect as the invention described in claim 16 of the patent application, and the adhesive tape of one side and the other is connected by both sides, so that it can be made stronger. The connection.

利用申請專利範圍第1 8項記載之發明時，因爲採用 兩面黏著劑之矽黏著膠帶，利用將兩面矽黏著膠帶夾於一 方及另一方之黏著材膠帶間之方式來實施兩者之黏著（或 密著），故兩者之連接十分簡單且容易。 利用申請專利範圍第1 9項記載之發明時，因已全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部係以糊狀樹脂製黏著劑固定，故連接十分簡單。又， 因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、將 新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路 徑設定導引銷等之作業，只需要較少時間即可更換新黏著 材盤，故可提高電子機器之生產效率。 利用申請專利範圍第2 0項記載之發明時，除了具有 和申請專利範圍第1 9項記載之發明相同之作用效果以外 ，因樹脂製黏著劑可從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取適合黏著材膠帶間之連接的樹 脂製黏著劑，故可提高黏著材膠帶間之連接強度。 利用申請專利範圍第21項記載之發明時，黏著裝置 內因配設著供應申請專利範圍第19或20項記載之樹脂製 -179- 1322649 黏著劑之充塡機，無需另行準備充塡機，故可防止連接作 業之浪費。In the case of the invention described in claim 18, since the adhesive tape of the double-sided adhesive is used, the adhesive tape of the two sides is sandwiched between the adhesive tape of one of the other and the adhesive tape of the other (or Closely, so the connection between the two is very simple and easy. When the invention described in claim 19 is used, since the end portion of the adhesive tape which has been completely rolled out and the beginning end portion of the newly attached adhesive tape are fixed by a paste-like resin adhesive, the connection is very simple. Moreover, since it is not necessary to replace the take-up tape every time a new adhesive tape is replaced, the beginning of the new adhesive tape is attached to the take-up reel, and the guide pin is set in a specific path, only The new adhesive plate can be replaced in a small amount of time, so that the production efficiency of the electronic machine can be improved. When the invention described in claim 20 is the same as the invention described in claim 19, the resin-based adhesive can be made of a thermosetting resin, a photocurable resin, and In the group of hot metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected, so that the joint strength between the adhesive tapes can be improved. When the invention described in claim 21 is used, the charging device is provided with a resin-filled 179- 1322649 adhesive which is described in claim 19 or 20 of the patent application, and there is no need to separately prepare a charging machine. It can prevent waste of connection work.

利用申請專利範圍第22項記載之發明時，捲繞於一 方之捲部的黏著材膠帶全部捲出時，將捲繞於相鄰捲部之 黏著材膠帶裝設至捲取盤，實施黏著材膠帶之更換，因爲 無需將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少 之新黏著材膠帶盤之更換作業，故可提高電子機器之生產 效率。 利用申請專利範圍第2 3項記載之發明時，除了具有 和申請專利範圍第22項記載之發明相同之效果以外，因 係以連結膠帶連接一方之黏著材膠帶之終端部及另一方之 黏著材膠帶之始端部，故一方之黏著材膠帶盤之黏著材膠 帶全部捲出後，無需將另一方之捲部之黏著材膠帶裝設至 盤之作業，故可進一步提高電子機器之生產效率。 利用申請專利範圍第24項記載之發明時，因爲連結 膠帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，連結膠帶會被自動捲取至捲取盤，故可省 略捲取之麻煩》 利用申請專利範圍第25項記載之發明時，一方之黏 著材膠帶之終端部及另一方之黏著材膠帶之始端部之連接 部份，因爲係以黏著材膠帶覆蓋卡止具，故外觀良好，同 時，可防止連接部份之卡止具接觸黏著材膠帶而使黏著材 -180- 1322649 膠帶或黏著裝置受損。 利用申請專利範圍第26項記載之發明時，連接部檢 測手段檢測到連接部份，至連接部份通過壓著部爲止，會 將一方之黏著材膠帶捲取至捲取盤，可防止連接部份到達 壓著部時實施壓著動作之問題。又，至連接部份通過壓著 部爲止，因爲會自動將一方之黏著材膠帶捲取至捲取盤， 故可省略捲取之麻煩。In the invention described in claim 22, when the adhesive tape wound around one of the rolls is completely unwound, the adhesive tape wound around the adjacent roll is attached to the take-up reel, and the adhesive is applied. The replacement of the tape, because it is not necessary to put the new adhesive tape on the adhesive device. Therefore, it is only necessary to replace the new adhesive tape tray, so that the production efficiency of the electronic machine can be improved. In the case of the invention described in the second paragraph of the patent application, in addition to the effect similar to the invention described in claim 22, the end portion of the adhesive tape and the other adhesive material are joined by a connecting tape. Since the adhesive tape of the adhesive tape of one of the adhesive tapes is completely unwound, the adhesive tape of the other roll portion is not required to be attached to the disk, so that the production efficiency of the electronic device can be further improved. When the invention described in claim 24 is used, since the connecting tape is automatically taken up to the take-up reel, and the adhesive tape of one of the rolls is completely unwound, the adhesive tape is sequentially unwound from the next roll. . Further, when the tape detecting means detects the connecting tape, the connecting tape is automatically taken up to the take-up reel until the connecting tape passes through the pressing portion, so that the trouble of winding up can be omitted. When the end portion of the adhesive tape of one of the adhesive tapes and the joint portion of the adhesive tape of the other adhesive tape are covered with the adhesive tape, the appearance is good and the connection portion can be prevented from being locked. Adhesive tape-180- 1322649 tape or adhesive device is damaged by contact with adhesive tape. According to the invention described in claim 26, the connecting portion detecting means detects the connecting portion, and when the connecting portion passes through the pressing portion, the adhesive tape of one side is taken up to the take-up reel to prevent the connecting portion. The problem of the pressing action when the part reaches the pressing part. Further, since the connecting portion passes through the pressing portion, since one of the adhesive tapes is automatically taken up to the take-up reel, the trouble of winding can be omitted.

利用申請專利範圍第27項記載之發明時，除了具有 和申請專利範圍第26項記載之發明相同之作用效果以外 ，以簡單之構成即可實施連接部份之檢測，而且，可利用 這些手段來提高檢測精度。 利用申請專利範圍第29項記載之發明時，因可依序 逐條使用複數條黏著劑，可在不增加膠帶之捲數的情形下 ，可使1盤可使用之黏著劑的量增加成傳統之2倍以上。 因未增加捲數，故可防止捲取散亂，同時，可防止因 φ 爲黏著劑從膠帶之寬度方向滲出而使捲取之膠帶間發生黏 著所導致之阻塞，此外，亦可防止因爲膠帶狀之基材較長 而容.易發生之伸展等弊病（基材之損傷或斷裂）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高作業效率。 又，黏著劑膠帶之製造上，因可減少製造之盤數，可 減少盤材及濕氣防止材之使用量，故可降低製造成本。 利用申請專利範圍第30項記載之發明時，除了具有 和和申請專利範圍第29項記載之發明相同之效果以外， 1322649 因相鄰之黏著劑條間具有間隔，很容易即可實施逐條分離 ，而使對電路基板之壓著更爲容易。 利用申請專利範圍第31項記載之發明時，除了具有 和申請專利範圍第29項相同之效果以外，只需在塗布於 基材之單面全面上之黏著劑上形成縫隙即可，製造十分容 易’而且’相鄰之黏著劑條間的間隙很小，故可增加配置 於基材上之黏著劑條之條數。When the invention described in claim 27 is used, the detection of the joint portion can be performed with a simple configuration, in addition to the same effects as those of the invention described in claim 26, and these means can be utilized. Improve detection accuracy. When the invention described in claim 29 is used, since a plurality of adhesives can be used one by one in order, the amount of adhesive which can be used in one disk can be increased to a conventional one without increasing the number of tapes. More than 2 times. Since the number of rolls is not increased, it is possible to prevent the winding from being scattered, and at the same time, it is possible to prevent the clogging caused by the adhesion of the tape which is oozing out from the width direction of the tape by the adhesive, and also prevent the tape from being blocked. The substrate of the shape is long and has a disadvantage such as stretching which is easy to occur (damage or breakage of the substrate). Since the manufacturing unit of the electronic component can reduce the number of replacement of the new adhesive tape, the work efficiency can be improved. Further, in the manufacture of the adhesive tape, since the number of the manufactured disks can be reduced, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in claim 30 is applied, in addition to the same effect as the invention described in claim 29, 1322649 can be easily separated one by one due to the interval between adjacent adhesive strips. This makes it easier to press the circuit board. When the invention described in claim 31 is used, in addition to the same effect as the application of claim 29, it is only necessary to form a slit on the adhesive applied to the entire surface of the substrate, which is easy to manufacture. 'And the gap between adjacent adhesive strips is small, so the number of adhesive strips disposed on the substrate can be increased.

利用申請專利範圍第3 2項記載之發明時，很容易即 可製造申請專利範圍第3 0項記載之黏著劑膠帶。 利用申請專利範圍第3 3項記載之發明時，因可同時 製造2條黏著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 4項記載之發明時，因係實施 部份黏著劑之加熱來降低該部份之凝聚力並將其壓著至電 路基板’而黏著劑膠帶係使用在基材之單面全面塗布黏著 劑者’故可直接利用既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用變更加熱區 域而進行任意設定，故壓著之黏著劑寬度具有高自由度。 和申請專利範圍第29項記載之發明相同，因爲會依 逐條對基材上之黏著劑加熱並壓著至電路基板，.可在不增 加膠帶之捲數的情形下，將1盤可使用黏著劑量增加成2 倍以上。 因無需增加捲數即可增加黏著劑量，故和申請專利範 圍第29項記載之發明相同，可防止捲取散亂，同時，亦 可防止因黏著劑之滲出而導致之阻塞及基材伸展之弊病。 -182- 1322649 利用申請專利範圍第3 5項記載之發明時，因爲黏著 劑膠帶之寬度具有電路基板之一邊以上之長度，故可在增 加黏著劑量，同時，減少黏著劑膠帶之捲數。 因爲無需增加黏著劑膠帶之捲數即可大幅增加使用黏 著劑量，故可防止捲取散亂，同時，可防止阻塞、基材之 損傷或斷裂。又，因電子構件之製造工廠可減少新黏著劑 膠帶之更換次數，故可提高製造效率。When the invention described in the third paragraph of the patent application is applied, it is easy to manufacture the adhesive tape described in claim 30 of the patent application. When the invention described in the third paragraph of the patent application is applied, since two adhesive tapes can be simultaneously produced, it has good manufacturing efficiency. When the invention described in claim 4 is applied, heating of a part of the adhesive is performed to reduce the cohesive force of the portion and press it to the circuit substrate', and the adhesive tape is used on one side of the substrate. Adhesive tape can be made directly from existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating area, so that the adhesive width of the pressing has a high degree of freedom. It is the same as the invention described in claim 29, because the adhesive on the substrate is heated and pressed to the circuit substrate one by one, and one disk can be used without increasing the number of tapes. The adhesive dose is increased by more than 2 times. Since the adhesive amount can be increased without increasing the number of rolls, the same as the invention described in claim 29, the roll-up can be prevented from being scattered, and at the same time, the blockage due to the bleeding of the adhesive and the stretching of the substrate can be prevented. Disadvantages. In the invention described in claim 35, since the width of the adhesive tape has a length of one side or more of the circuit board, the amount of the adhesive can be increased and the number of the adhesive tape can be reduced. Since the amount of the adhesive tape can be increased without increasing the number of adhesive tapes, the coiling can be prevented from being scattered, and at the same time, the clogging, damage or breakage of the substrate can be prevented. Further, since the manufacturing unit of the electronic component can reduce the number of replacements of the new adhesive tape, the manufacturing efficiency can be improved.

此外，黏著劑膠帶之製造上，因增加每1盤之黏著劑 量，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 利用申請專利範圍第3 6項記載之發明時，除了具有 和申請專利範圍第3 5項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容易即可逐條將黏著劑從基材剝 離並實施壓著。 利用申請專利範圍第3 7項記載之發明時，除了具有 和申請專利範圍第35項相同之效果以外，尙可增加配置 於基材上之黏著劑條之條數且製造更爲容易。 利用申請專利範圍第3 8項記載之發明時，因爲可利 用既存設備同時製造2條申請專利範圍第36項記載之黏 著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 9項記載之發明時，除了可得 到申請專利範圍第35項〜第37項之其中任一項記載之效 果以外，很簡單即可將黏著劑壓著至電路基板之一邊，而 可提高電子構件之製造工廠之作業效率。 -183- 散亂， 利用申請專利範圍第40 到申請專利範圍第3 5項〜第 旋轉電路基板，而只要移動一 黏著劑膠帶之位置，很容易良[] 之四周，故有良好之作業效率 利用申請專利範圍第4 1 壓著至電路基板之周圍時，會 實施條狀加熱加壓，很容易即 ，而有良好之作業效率。 又，因爲只需在黏著劑膠 故可直接利用既存設備製造黏 此外，壓著至電路基板之 加熱加壓區域來實施任意設定 高自由度。 又，和申請專利範圍第3 未增加捲數卻可增加黏著劑量 ，得到可防止因黏著劑之滲出 材之伸展而造成之弊病等之效 申請專利範圍第42項記 配置於黏著劑板上之寬度方向 至少可使用2盤份，無需增力口 幅增加1盤可使用之黏著劑量 而且，因爲未增加黏著劑 同時，可防止因爲黏著 項記載之發明時，除了可得 37項記載之效果以外，無需 •方之黏著劑膠帶及另一方之 1可將黏著劑壓著至電路基板 〇 項記載之發明時，將黏著劑 沿著寬度方向對黏著劑膠帶 可將黏著劑壓著至電路基板 帶之全面塗布黏著劑即可， 著劑膠帶。 黏著劑的寬度，可利用改變 ，故壓著之黏著劑寬度具有 5項記載之發明相同，因爲 ，故可防止捲取散亂，同時 而造成之阻塞、及防止因基 果。 載之發明時’因係逐條使用 的至少2條黏著劑，每1盤 黏著劑膠帶之捲數’即可大 〇 膠帶之捲數，故可防止捲取 劑從膠帶之寬度方向滲出而 -184- 1322649 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或斷 裂）。 因黏著劑膠帶係盒形式’黏著裝置上無需實施將黏著 劑膠帶裝設至盤之繁複業作，而只要將盒裝著至黏著裝置 即可’處理上更爲容易，且具有良好之裝設及更換作業性Further, in the manufacture of the adhesive tape, since the amount of the adhesive per one disk is increased, the amount of the disk material and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in claim 36 is applied, the adhesive strips are separated, and the adhesive can be easily removed one by one, in addition to the same effects as the invention described in claim 35. The substrate is peeled off and pressed. When the invention described in claim 3 of the patent application is used, in addition to the same effect as the item 35 of the patent application, the number of the adhesive strips disposed on the substrate can be increased and the manufacturing can be made easier. When the invention described in the third paragraph of the patent application is applied, since the adhesive tape described in item 36 of the two patent applications can be simultaneously manufactured by using the existing equipment, it has good manufacturing efficiency. When the invention described in claim 39 is applied, the adhesive can be pressed to one side of the circuit board in addition to the effects described in any one of claims 35 to 37. The work efficiency of the manufacturing plant of the electronic component can be improved. -183- Distracted, using the patent application range 40 to the patent scope of the 35th ~ the rotating circuit substrate, and as long as the position of the adhesive tape is moved, it is easy to be good [], so there is good work efficiency When the patent application range 4 1 is pressed to the periphery of the circuit board, strip heating and pressurization is performed, which is easy, and has good work efficiency. Further, since it is only necessary to use an adhesive for the adhesive, it is possible to directly manufacture the adhesive by using an existing device, and press it to the heated and pressed region of the circuit board to carry out an arbitrary setting with a high degree of freedom. Moreover, and the number of the third application does not increase the number of rolls, but the amount of the adhesive can be increased, and the disadvantages caused by the stretching of the exudation material of the adhesive can be prevented, and the effect of the patent application is set on the adhesive sheet. It is possible to use at least 2 discs in the width direction, and it is possible to increase the adhesive amount which can be used for one disc without increasing the force. Moreover, since the adhesive is not added, it is possible to prevent the invention described in the adhesive item, in addition to the effect of 37 items. When the adhesive tape of the other side is not required, and the adhesive can be pressed to the circuit substrate, the adhesive can be adhered to the circuit substrate tape along the width direction of the adhesive tape. It can be coated with adhesive and coated tape. The width of the adhesive can be changed, so that the width of the adhesive to be pressed is the same as that of the five inventions described above, because the winding can be prevented from being scattered, and at the same time, the blockage and the cause of the cause are prevented. In the invention of the invention, "at least two adhesives used one by one, the number of rolls of adhesive tape per one disk" can greatly reduce the number of rolls of the tape, so that the take-up agent can be prevented from seeping out from the width direction of the tape - 184- 1322649 The clogging caused by the adhesion between the tapes taken up, and the disadvantages such as stretching which is likely to occur due to the long substrate (damage or breakage of the substrate) can be prevented. Because the adhesive tape is in the form of a box, it is not necessary to implement the complicated operation of attaching the adhesive tape to the tray, and it is easier to handle the cartridge as long as the cartridge is attached to the adhesive device, and has a good installation. And replacement workability

利用申請專利範圍第4 3項記載之發明時，除了具有 和申請專利範圍第4 2項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑並 實施壓著。 利用申請專利範圍第44項記載之發明時，除了具有 和申請專利範圍第4 2項相同之效果以外，黏著劑膠帶只 需在基材之單面全面塗布黏著劑並形成縫隙即可，故製造 十分容易。 利用申請專利範圍第4 5項記載之發明時，因爲黏著 劑膠帶只需在基材之全面塗布黏著劑即可，故可直接利用 既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用改變加熱加 壓區域來實施任意設定，故壓著之黏著劑寬度具有高自由 度。 利用申請專利範圍第4 6項記載之發明時，除了具有 和申請專利範圍第4 5項相同之效果以外，尙和申請專利 範圍第1項記載之發明相同，因爲未增加捲數卻可增加黏 -185- 1322649 著劑量，故可防止捲取散亂，同時，得到可防止因黏著劑 之滲出而造成之阻塞、及防止因基材之伸展而造成之弊病 等之效果。使用時，1盤份全部捲出時，只需反轉盒即可 ，故下一次之裝著十分容易。因採用盒形式，處理上更爲 容易，且具有良好之裝設及更換作業性》When the invention described in claim 4 of the patent application is used, in addition to the same effect as the invention described in claim 4, the adjacent adhesive strips are separated, and it is easy to pull one by one from the substrate. Remove the adhesive and apply it. When the invention described in claim 44 is applied, in addition to the same effect as the fourth item of the patent application range, the adhesive tape only needs to be completely coated on one side of the substrate to form a gap, thereby manufacturing. Very easy. When the invention described in the Patent Application No. 45 is used, since the adhesive tape only needs to be completely coated with the adhesive on the substrate, the adhesive tape can be directly produced by using the existing equipment. The width of the adhesive pressed against the circuit board can be arbitrarily set by changing the heating and pressing region, so that the adhesive width of the pressing has a high degree of freedom. When the invention described in claim 46 is used, the invention is the same as the invention described in the first paragraph of the patent application, except that it has the same effect as the item 45 of the patent application, because the number of windings is increased, but the viscosity is increased. -185- 1322649 The dose is taken to prevent the coiling from being scattered, and at the same time, it is possible to prevent the clogging caused by the oozing of the adhesive and to prevent the disadvantage caused by the stretching of the substrate. When using, when all the 1 disk is rolled out, just reverse the box, so it is very easy to install the next time. Due to the box form, it is easier to handle and has good installation and replacement workability.

利用申請專利範圍第47項記載之發明時，利用黏著 材膠帶之基材黏著全部捲出之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，無需每次 更換新黏著材盤時都更換捲取盤、及將新黏著材盤之始端 裝設至捲取盤之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 利用申請專利範圍第48項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。 又，因爲熱熔融劑層形成於膠帶之縱向全體，重疊長 度無需嚴格定位，故連接具有高自由度。 利用申請專利範圍第49項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 熱熔融劑層係夾於支持層之間，可防止熱熔融劑層曝露於 大氣下，故可防止濕氣之吸濕或灰塵等之附著而導致熱熔 融劑層之黏著強度降低。 -186- 1322649 利用申請專利範圍第50項記載之發明時，去除基材 端部之以脫模劑實施表面處理之部份，利用黏著材膠帶之 黏著劑黏著全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，來實施黏著材盤之更換，故很簡單即 可將新黏著材盤裝著至黏著裝置。When the invention described in claim 47 is applied, the end portion of the adhesive tape which is completely unwound is adhered to the substrate of the adhesive tape, and the beginning end of the newly attached adhesive tape is used to perform the replacement of the adhesive disk. Therefore, it is very simple to put the new adhesive plate to the adhesive device. Moreover, it is not necessary to replace the take-up reel when replacing the new adhesive sheet, and to install the new adhesive sheet at the beginning of the new adhesive tray to the take-up reel, and it takes only a small time to replace the new adhesive disc, thereby improving Production efficiency of electronic machines. When the invention described in the 48th application of the patent application has the same effect as the invention described in claim 47, since the hot melt layer is located on the surface of the substrate, the adhesive surface at the beginning end can be overlapped. The hot melt layer at the end of the adhesive tape of one of the layers is heated and pressed to connect the two, so that the connection is very simple. Further, since the hot melt layer is formed in the longitudinal direction of the tape, the overlap length does not need to be strictly positioned, so the connection has a high degree of freedom. When the invention described in claim 49 is used, the hot melt layer is prevented from being exposed to the hot melt layer by being sandwiched between the support layers, in addition to the effects similar to those of the invention described in claim 47. Under the atmosphere, it is possible to prevent moisture from adhering to moisture or dust, and the adhesion strength of the hot melt layer is lowered. -186- 1322649 When the invention described in claim 50 is used, the portion of the end portion of the substrate which is subjected to the surface treatment by the release agent is removed, and the end of the adhesive tape which is completely unwound is adhered by the adhesive of the adhesive tape. The beginning and the end of the newly-adhesive adhesive tape are used to replace the adhesive disc, so it is very simple to install the new adhesive disc to the adhesive device.

利用申請專利範圍第51項記載之發明時，除了具有 和申請專利範圍第50IX 記載之發明相同之效果以外， 因係利用電漿放電、紫外線照射、及雷射照射之其中任何 一種方法去除脫模劑，可在短時間內正確地去除脫模劑。 利用申請專利範圍第5 2項記載之發明時，因爲黏著 材膠帶盤上配設著複數個將黏著材膠帶捲繞於盤上之黏著 材膠帶之捲部（捲部），複數之捲部當中，一個捲部之黏 著材膠帶全部捲出時，會使用和全部捲出之捲部爲相鄰配 置之其他捲部之黏著材膠帶，因爲無需將新黏著材膠帶盤 裝著至黏著裝置，只需較少之新黏著材膠帶盤之更換作業 φ ，故可提高電子機器之生產效率。又，因爲係依序使用複 數之黏著材膠帶，無需增加1個黏著材膠帶盤之黏著材膠 帶的捲數’即可大幅增加1次更換作業之可使用的黏著劑 量。又，因爲無需增加黏著材膠帶之捲數，故可防止捲取 散亂，同時’可防止黏著劑從膠帶之寬度方向滲出而使已 捲取之黏著材膠帶間發生黏著，亦即，可防止阻塞，而且 ，亦可防止因爲基材較長而容易發生之伸展等弊病。 利用申請專利範圍第5 3項記載之發明時，因爲盤之 側板上配設著乾燥劑之收容部，除了具有和申請專利範圍 -187- 1322649 第5 2項記載之發明相同之作用效果以外，尙可從內部確 實除去黏著材膠帶盤內之濕氣，故可進一步防止黏著材膠 帶因濕氣之吸濕而發生品質降低下。When the invention described in claim 51 is used, the mold release, ultraviolet irradiation, and laser irradiation are used to remove the mold release in addition to the effects similar to those of the invention described in claim 50IX. The agent can remove the release agent correctly in a short time. In the invention described in claim 5, the adhesive tape is provided with a plurality of roll portions (rolled portions) of the adhesive tape on which the adhesive tape is wound on the disk, among the plurality of rolls When the adhesive tape of one roll is completely unwound, the roll portion of the other roll portion which is used and which is completely rolled out is used, because it is not necessary to put the new adhesive tape on the adhesive device, only The replacement work φ of the new adhesive tape is required, so that the production efficiency of the electronic machine can be improved. Further, since the plurality of adhesive tapes are sequentially used, it is possible to greatly increase the amount of adhesive which can be used for one replacement operation without increasing the number of rolls of the adhesive tape of one adhesive tape. Moreover, since it is not necessary to increase the number of the adhesive tape, it is possible to prevent the winding from being scattered, and at the same time 'to prevent the adhesive from oozing out from the width direction of the tape to cause adhesion between the wound adhesive tapes, that is, to prevent It is also blocked, and it can also prevent the disadvantages such as stretching which is prone to occur due to the long substrate. When the invention described in the fifth paragraph of the patent application is applied, the accommodating portion of the desiccant is disposed on the side plate of the disk, and the same effect as the invention described in the fifth aspect of the patent application- 187- 1322649 is applied. The crucible can reliably remove the moisture in the adhesive tape tray from the inside, so that the adhesive tape can be further prevented from being deteriorated due to moisture absorption.

利用申請專利範圍第54項記載之發明時，因爲覆蓋 捲繞於盤上之黏著材膠帶之周圍的蓋體構件，係以可自由 裝卸之方式配設於盤上，黏著材膠帶不會直接曝露於大氣 下，故可防止灰塵或大氣之濕氣對黏著材膠帶產生不良影 響。因此，即使配設複數之捲部時，對未使用之捲部配設 蓋體構件，可防止黏著材膠帶之品質降低。 又’因爲以可自由裝卸之方式配設蓋體構件，只要拆 下蓋體構件’即可簡單地從黏著材膠帶盤捲出黏著材膠帶 利用申請專利範圍第5 5項記載之發明時，除了具有 和申請專利範圍第5 2至5 4項之其中任—項記載之發明相 同之作用效果以外，因爲尙可從蓋體構件之拉出口捲出黏 著材膠帶’故無需拆下黏著材膠帶盤之蓋體構件，而可直 接從黏著材膠帶盤捲出黏著材膠帶。 利用申請專利範圍第5 6項記載之發明時，具有和申 請專利範圍第52至55項之其中任一項記載之發明相同之 效果以外，尙因爲捲部之側板係以可自由裝卸之方式互相 嵌合’一方之捲部之黏著材膠帶全部捲出後，解除其和另 一方之捲部之嵌合’即可依序從下一捲部捲出黏著材膠帶 利用申請專利範圍第5 7、5 8項記載之發明時，具有 -188- 1322649 和申請專利範圍第52至56項之其中任一項記載之發明相 同之作用效果，尤其是，黏著材膠帶爲將用以連接相對電 極之電極連接用黏著劑塗布於基材上之黏著材膠帶、黏著 材膠帶爲用以實施引線框架之固定用支持基板、半導體元 件載置用支持基板、或引線框架之晶片和半導體元件之連 接的黏著材膠帶時特別有用。When the invention described in claim 54 is applied, the cover member covering the periphery of the adhesive tape wound around the disk is detachably attached to the disk, and the adhesive tape is not directly exposed. Under the atmosphere, it can prevent dust or atmospheric moisture from adversely affecting the adhesive tape. Therefore, even when a plurality of rolls are provided, the cover member is disposed on the unused roll portion, and the quality of the adhesive tape can be prevented from being lowered. In addition, since the cover member can be detachably attached, the cover member can be simply removed, and the adhesive tape can be simply unwound from the adhesive tape, using the invention described in claim 5, except In addition to the same effects as the invention described in any one of the claims 5 to 5, since the crucible can be rolled out of the adhesive tape from the pull-out opening of the cover member, it is not necessary to remove the adhesive tape tray. The cover member can be rolled out of the adhesive tape directly from the adhesive tape. In addition to the effects of the invention described in any one of claims 52 to 55, the side plates of the roll portion are detachably attached to each other. After the adhesive tape of the one-side roll portion is completely unwound, the fitting of the adhesive tape to the other side is released, and the adhesive tape can be rolled out from the next roll portion in sequence. In the case of the invention described in the above, the adhesive tape is an electrode to be used for connecting the opposite electrode, in particular, the invention has the same effect as the invention described in any one of the claims 52 to 56. The adhesive tape and the adhesive tape which are applied to the substrate by the adhesive for bonding are the fixing substrate for fixing the lead frame, the support substrate for mounting the semiconductor element, or the bonding of the wafer of the lead frame and the semiconductor element. This is especially useful when using tape.

利用申請專利範圍第5 9項記載之發明時，以單手握 持殼體，使露出黏著劑膠帶之開口部抵壓電路基板，加熱 構件從基材側實施加熱壓著，將黏著劑壓著至電路基板， 故十分小型且可以單手操作，尙且，很容易即可將黏著劑 壓著至基板之一部份。 利用申請專利範圍第60項記載之發明時，因爲黏著 材膠帶之基材係金屬膜或芳香族聚醯胺膜，即使基材之厚 度較薄時，亦可防止基材伸展或斷裂等之問題。 因此，利用厚度較薄之基材所構成之黏著材膠帶，可 φ 增加每1盤之捲數，而增加1盤可使用之黏著劑量。又， 使用本發明之黏著材膠帶時，因可增加每1盤之捲數，電 子構件之製造工廠只需實施較少之新黏著材膠帶之更換次 數’故可提高作業效率。其次，黏著材膠帶之製造上，可 減少製造之盤數，並可減少盤材及濕氣防止材之使用量， 故可降低製造成本。 利用申請專利範圍第61項記載之發明時，除了具有 和申請專利範圍第60項記載之發明相同之效果以外，尙 可獲得較薄且具高拉伸強度之黏著材膠帶。 -189- 1322649 利用申請專利範圍第6 2項記載之發明時，除了具有 和申請專利範圍第60或61項記載之發明相同之效果以外 ，因爲基材之拉伸強度爲3 OOMPa以上，不易發生基材伸 展或斷裂之問題。According to the invention described in claim 59, the casing is held by one hand, the opening of the adhesive tape is exposed to press against the circuit board, and the heating member is heated and pressed from the substrate side to press the adhesive. It is very small and can be operated with one hand, and it is easy to press the adhesive to a part of the substrate. According to the invention described in claim 60, since the base material of the adhesive tape is a metal film or an aromatic polyamide film, even when the thickness of the substrate is thin, the substrate can be prevented from being stretched or broken. . Therefore, by using an adhesive tape composed of a substrate having a relatively small thickness, the number of rolls per one disk can be increased by φ, and the adhesive amount that can be used for one disk can be increased. Further, when the adhesive tape of the present invention is used, since the number of rolls per disk can be increased, the manufacturing facility of the electronic component only needs to perform a small number of replacements of the new adhesive tape, so that work efficiency can be improved. Secondly, in the manufacture of the adhesive tape, the number of manufactured disks can be reduced, and the amount of the disk and the moisture preventing material can be reduced, so that the manufacturing cost can be reduced. When the invention described in claim 61 is used, in addition to the effects similar to those of the invention described in claim 60, a thin and high tensile strength adhesive tape can be obtained. -189- 1322649 When the invention described in claim 6 is the same as the invention described in claim 60 or 61, since the tensile strength of the substrate is 300 MPa or more, it is unlikely to occur. The problem of stretching or breaking the substrate.

利用申請專利範圍第6 3項記載之發明時，除了具有 和申請專利範圍第60至62項之其中任一項記載之發明相 同之效果以外，因爲基材對黏著劑之厚度比爲0.01〜1.0 ，此外，尙可得到較薄且具有高拉伸強度之黏著材膠帶。 利用申請專利範圍第64項記載之發明時，除了具有 和申請專利範圍第60至63項之其中任一項記載之發明相 同之效果以外，基材之表面粗細度Rmax爲0.5 # m以下， 基材之表面十分平滑，將黏著劑壓著至電路基板時，黏著 劑容易從基材分離。 利用申請專利範圍第6 5項記載之發明時，在被覆體 上形成黏著劑之前一步驟，使一方之黏著材膠帶之黏著劑 '及另一方之黏著材膠帶之黏著劑重疊，得到期望之黏著 劑之厚度後，再在被覆體上形成黏著劑，故各黏著材膠帶 之厚度較薄，雖然黏著材膠帶之捲數增多，每1盤之黏著 材膠帶之捲繞直徑卻更小。 因此，可增加每1盤之黏著材膠帶之捲數，而可大幅 增加1次更換作業之可使用的黏著劑量。因此，只需較少 之新黏著材膠帶之更換作業即可，故可提高電子機器之生 產效率。 利用申請專利範圍第6 6項記載之發明時，除了具有 -190- 1322649 和申請專利範圍第65項記載之發明相同之效果以外’可 減少需要低溫管理之黏著材膠帶之數量’黏著材膠帶之運 送及保管可實施更有效率之管理。When the invention described in the sixth paragraph of the patent application is applied, the thickness ratio of the substrate to the adhesive is 0.01 to 1.0, except for the same effect as the invention described in any one of claims 60 to 62. In addition, 尙 can obtain a thin and high tensile strength adhesive tape. In the invention of the invention of claim 64, the surface roughness Rmax of the substrate is 0.5 # m or less, in addition to the effects similar to those of the invention described in any one of claims 60 to 63. The surface of the material is very smooth, and the adhesive is easily separated from the substrate when the adhesive is pressed against the circuit board. When the invention described in claim 65 is applied, the adhesive of one of the adhesive tapes and the adhesive of the other adhesive tape are superimposed one step before the formation of the adhesive on the covering to obtain the desired adhesion. After the thickness of the agent, an adhesive is formed on the covering, so that the thickness of each adhesive tape is thin. Although the number of the adhesive tape is increased, the winding diameter of the adhesive tape per one disk is smaller. Therefore, the number of rolls of the adhesive tape per one disk can be increased, and the amount of adhesive which can be used for one replacement operation can be greatly increased. Therefore, it is only necessary to replace the new adhesive tape, so that the productivity of the electronic machine can be improved. When the invention described in the sixth paragraph of the patent application is applied, the number of the adhesive tape which requires low temperature management can be reduced, in addition to the effects of the invention described in the -190- 1322649 and the scope of the patent application. Transportation and storage can implement more efficient management.

利用申請專利範圍第67項〜72項之其中任一項記載 之發明時，因爲對被連接構件具有良好轉錄性（貼附性） 及良好連接信賴性，且可在改善步驟內之廢料率、及提高 作業性之情形下，提供傳統之長方形向異導電材膠帶，故 可提高生產性及作業性。 【圖式簡單說明】 第1圖係第1實施形態之黏著材膠帶連接方法時之黏 著材盤間之連接斜視圖。 第2圖A及第2圖B係第1圖之連接部份的連接步驟 斜視圖。 第3圖係黏著裝置之黏著劑的壓著步驟槪略圖。 第4圖係電路基板間之黏著的剖面圖。 第5圖係黏著材膠帶製造方法之步驟圖。 第6圖係本發明第2實施形態之黏著材膠帶連接方法 的斜視圖。 第7圖係本發明第2實施形態之變形例之黏著材膠帶 連接方法的斜視圖。 第8圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第8圖A係黏著材盤間之連接的斜視圖，第8圖b係 第8圖A之連接部份之連接方法的斜視圖，第8圖C係第 -191 - 1322649 8圖A之連接部份的平面圖。 第9圖係本發明第2實施形態之黏著材膠帶連接方法 的剖面圖。 第10圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第11圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。When the invention described in any one of the items 67 to 72 of the patent application is used, since the member to be connected has good transcription property (adhesiveness) and good connection reliability, and the scrap rate in the improvement step, In the case of improving the workability, the conventional rectangular-oriented conductive tape is provided, so that productivity and workability can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the connection between the adhesive sheets in the method of joining the adhesive tapes of the first embodiment. Fig. 2A and Fig. 2B are oblique views of the connecting step of the connecting portion of Fig. 1. Fig. 3 is a schematic view showing the step of pressing the adhesive of the adhesive device. Fig. 4 is a cross-sectional view showing adhesion between circuit boards. Figure 5 is a step diagram of a method of manufacturing an adhesive tape. Fig. 6 is a perspective view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 7 is a perspective view showing a method of connecting an adhesive tape according to a modification of the second embodiment of the present invention. 8A to C are views showing a method of connecting an adhesive tape according to a first embodiment, Fig. 8A is a perspective view showing a connection between the adhesive sheets, and Fig. 8 is a connection method of a connecting portion of Fig. 8A. Oblique view, Fig. 8C is a plan view of the connecting portion of Fig. A of -191 - 1322649 8 . Fig. 9 is a cross-sectional view showing a method of connecting an adhesive tape according to a second embodiment of the present invention. Fig. 10 is a cross-sectional view showing a method of joining an adhesive tape according to a third embodiment of the present invention. Figure 11 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention.

第12圖A及B係第1實施形態之黏著材膠帶連接方 法圖，第1 2圖A係黏著材盤間之連接的斜視圖，第〗2圖 B係第12圖A之連接部份之連接方法的斜視圖。 第13圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。. 第14圖A及第14圖B係本發明第3實施形態之黏著 材膠帶連接方法的剖面圖，第14圖A係加熱加壓前之狀 態，第1 4圖B係加熱加壓後之狀態。 第15圖A及第15圖B係本發明第4實施形態之黏著 材膠帶連接方法圖，第15圖A係剖面圖，第15圖B係平 面圖。 第16圖A及第16圖B係第1實施形態之黏著材膠帶 連接方法圖，第16圖A係黏著材盤間之連接的斜視圖， 第1 6圖B係第1 6圖A之連接部份（b )的斜視圖。 第17圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第18圖係本發明第3實施形態之黏著材膠帶連接方 -192- 1322649 法的剖面圖。 第19圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第20圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第20圖A係黏著材盤間之連接的斜視圖，第20圖b 及C係第20圖A之連接部份之連接方法的剖面圖。 第21圖係黏著裝置之黏著劑壓著步驟的槪略圖。12A and B are views showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 2A is a perspective view showing a connection between the adhesive sheets, and Fig. 2B is a connection portion of Fig. 12A. An oblique view of the connection method. Figure 13 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. 14A and FIG. 14B are cross-sectional views showing a method of connecting an adhesive tape according to a third embodiment of the present invention, and FIG. 14A is a state before heating and pressurization, and FIG. status. Fig. 15 is a plan view showing a method of connecting an adhesive tape according to a fourth embodiment of the present invention, Fig. 15 is a cross-sectional view, and Fig. 15B is a plan view. Fig. 16A and Fig. 16B are diagrams showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 16A is a perspective view showing a connection between the adhesive sheets, and Fig. 6 is a connection of Fig. 6A. An oblique view of part (b). Figure 17 is a cross-sectional view showing a method of joining an adhesive tape according to a second embodiment of the present invention. Fig. 18 is a cross-sectional view showing the method of attaching the adhesive tape of the third embodiment of the present invention to the method of -192 to 1322649. Figure 19 is a cross-sectional view showing a method of joining an adhesive tape according to a fourth embodiment of the present invention. 20A to C are views showing a method of connecting an adhesive tape according to a first embodiment, and Fig. 20A is a perspective view showing a connection between the adhesive sheets, and Fig. 20b and Fig. 20 are a connection portion of Fig. 20A. A cross-sectional view of the connection method. Figure 21 is a schematic view of the adhesive pressing step of the adhesive device.

第22圖A〜C係第1實施形態之黏著材膠帶盤圖，第 22圖A係黏著材膠帶盤的斜視圖，第22圖B係第22圖 A之正面圖，第22圖C係第22圖A之連結膠帶之平面圖 第23圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第24圖係本發明第2實施形態之連結膠帶之平面圖 第25圖係本發明第3實施形態之連結膠帶之平面圖Fig. 22A to Fig. 4C are diagrams showing the adhesive tape of the first embodiment, Fig. 22A is a perspective view of the adhesive tape tray, Fig. 22B is a front view of Fig. 22, and Fig. 22 is a Figure 23 is a plan view of the adhesive tape of Figure A. Figure 23 is a schematic view of the adhesive pressing step of the adhesive device. Figure 24 is a plan view of a connecting tape according to a second embodiment of the present invention. Figure 25 is a plan view of a connecting tape according to a third embodiment of the present invention.

第2 6圖係本發明第4實施形態之黏著材膠帶盤的斜 視圖。 第27圖A〜C係第I實施形態之黏著材膠帶盤圖，第 27圖A係黏著材膠帶盤的斜視圖，第27圖b係第27圖 A之正面圖，第27圖C係第27圖A之連接部份之剖面圖 第28圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第29圖係PDP之黏著劑之使用狀態的斜視圖。 -193- 1322649 第30圖係本發明第2實施形態之黏著材膠帶盤的斜 視圖。 第31圖A係將本發明之黏著材膠帶盤之黏著材膠帶 應用於LOC構造之半導體裝置時之黏著材膠帶之剖面圖 ’第31圖B係將本發明之黏著材膠帶盤之黏著材膠帶應 用於LOC構造之半導體裝置時之LOC構造之半導體裝置 之剖面圖。Fig. 26 is a perspective view of the adhesive tape tray of the fourth embodiment of the present invention. Fig. 27A to Fig. C are diagrams showing the adhesive tape of the first embodiment, Fig. 27A is a perspective view of the adhesive tape tray, and Fig. 27b is a front view of Fig. 27, and Fig. 27C Figure 27 is a cross-sectional view of the connecting portion of Figure A. Figure 28 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 29 is a perspective view showing the state of use of the adhesive of the PDP. -193- 1322649 Fig. 30 is a perspective view of the adhesive tape tray of the second embodiment of the present invention. Figure 31A is a cross-sectional view of an adhesive tape when the adhesive tape of the adhesive tape of the present invention is applied to a semiconductor device of the LOC structure. Fig. 31B is an adhesive tape of the adhesive tape of the present invention. A cross-sectional view of a semiconductor device of the LOC structure applied to a semiconductor device of the LOC structure.

第32圖A〜C係應用本發明之黏著材膠帶盤的黏著裝 置之槪略圖，第32圖A係正面圖，第32圖B係側面圖， 第32圖C係第32圖B之黏著材膠帶冲切貼附部89的重 要部位放大圖。 第33圖A及B係黏著劑膠帶圖，第33圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第33圖B係第33圖A之 A-A剖面圖。 第34圖係PDP之黏著劑之使用狀態的斜視圖。32A to C are schematic views of an adhesive device for applying an adhesive tape tray of the present invention, Fig. 32A is a front view, Fig. 32B is a side view, and Fig. 32C is a 32#Fig. B adhesive material An enlarged view of an important part of the tape punching and attaching portion 89. Fig. 33A and Fig. B are diagrams of the adhesive tape, Fig. 33A is a perspective view of the disk around which the adhesive tape is wound, and Fig. 33B is a cross-sectional view taken along line A-A of Fig. 33A. Figure 34 is a perspective view showing the state of use of the adhesive of the PDP.

第35圖係將黏著劑塗布於基材之步驟的剖面圖。 第36圖A〜C係本發明第2實施形態之黏著劑膠帶之 剖面圖。 第37圖Α〜C係本發明第3實施形態之黏著劑膠帶及 其壓著方法的步驟圖。 第38圖A〜C係本發明第4實施形態之黏著劑膠帶製 造方法的步驟圖。 第39圖A及B係黏著劑膠帶圖，第39圖A係捲繞 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從黏著劑側觀 -194- 1322649 看第39圖A之黏著劑膠帶時的平面圖。 第40圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第4 1圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第42圖A〜C係本發明第3實施形態之黏著劑膠帶之 剖面圖。 第43圖A〜C係本發明第4實施形態之黏著劑膠帶及 其壓著方法的步驟圖。Figure 35 is a cross-sectional view showing the step of applying an adhesive to a substrate. Fig. 36 is a cross-sectional view showing an adhesive tape according to a second embodiment of the present invention. Fig. 37 is a flow chart showing the adhesive tape of the third embodiment of the present invention and a pressing method therefor. Fig. 38 is a flow chart showing a method of producing an adhesive tape according to a fourth embodiment of the present invention. Fig. 39A and Fig. B are adhesive tape diagrams, Fig. 39A is a perspective view of the disk with the adhesive tape wound, and Fig. 39B is from the side view of the adhesive - 194 - 1322649, see Fig. 39 Plan view of the adhesive tape. Figure 40 is a schematic view of the adhesive pressing step of the adhesive device. Fig. 4 is a schematic view showing an adhesive pressing step of the adhesive device according to the second embodiment of the present invention. 42A to C are cross-sectional views showing an adhesive tape according to a third embodiment of the present invention. Fig. 43 is a flow chart showing the steps of the adhesive tape and the method of pressing the same according to the fourth embodiment of the present invention.

第44圖A〜C係本發明第5實施形態之黏著劑膠帶製 造方法的步驟圖。 第45圖A及B係本發明第1實施形態之黏著劑膠帶 盒圖，第45圖A係黏著劑膠帶盒之斜視圖，第45圖B係 第45圖A之A-A剖面圖。 第46圖係第45圖A所示之膠帶盒之盤的裝設狀態剖 面圖。Fig. 44 is a flow chart showing a method of producing an adhesive tape according to a fifth embodiment of the present invention. Fig. 45 is a perspective view of the adhesive tape cartridge according to the first embodiment of the present invention, Fig. 45A is a perspective view of the adhesive tape cartridge, and Fig. 45B is a cross-sectional view taken along line A-A of Fig. 45A. Fig. 46 is a cross-sectional view showing the mounting state of the disc cartridge of Fig. 45A.

第47圖係黏著裝置之黏著劑壓著步驟的正面圖。 第48圖係黏著劑膠帶盒之製造方法的步驟圖。 第49圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第50圖係本發明第3實施形態之黏著劑膠帶之剖面 圖。 第51圖A及B係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第52圖A及B係第1實施形態之黏著材膠帶圖，第 -195- 1322649 52圖A係黏著材盤間之連接的斜視圖，第52圖B係第52 圖A之連接部份的剖面圖。 第53圖係第2實施形態之黏著材膠帶的剖面圖。 第54圖A〜C係第55圖之連接部份之連接步驟的剖 面圖，第54圖A係放電前之狀態，第54圖B係放電後之 狀態，第54圖C係連接部份之加熱壓著圖。 第55圖係黏著材膠帶連接方法之黏著材盤間之連接 的斜視圖。Figure 47 is a front elevational view of the adhesive pressing step of the adhesive device. Figure 48 is a step diagram of a method of manufacturing an adhesive tape cartridge. Fig. 49 is a schematic view showing the step of adhering the adhesive to the adhesive device according to the second embodiment of the present invention. Figure 50 is a cross-sectional view showing an adhesive tape according to a third embodiment of the present invention. Fig. 51 is a step diagram showing an adhesive tape and a method of pressing the same according to a fourth embodiment of the present invention. Fig. 52 is a perspective view of the adhesive tape of the first embodiment, and Fig. 195- 1322649 52 is a perspective view of the connection between the adhesive sheets, and Fig. 52B is the connection portion of Fig. 52A. Sectional view. Figure 53 is a cross-sectional view showing an adhesive tape of a second embodiment. Fig. 54 is a cross-sectional view showing the connecting step of the connecting portion of Fig. 55 to Fig. 55. Fig. 54 is a state before discharge, Fig. 54B is a state after discharge, and Fig. 54 is a connection portion of Fig. 54 Heat the drawing. Fig. 55 is a perspective view showing the connection between the adhesive sheets of the adhesive tape joining method.

第56圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第57圖A〜C係第1實施形態之黏著材膠帶盤圖，第 57圖A係黏著材膠帶盤的斜視圖，第57圖B係第57圖 A之正面圖，第57圖C係第57圖A之蓋體構件之正面圖 第58圖係黏著材膠帶盤之製造方法的步驟圖。 第5 9圖係本發明第2實施形態之黏著材膠帶盤之側Figure 56 is a schematic view of the adhesive pressing step of the adhesive device. 57A to C are the adhesive tape trays of the first embodiment, and Fig. 57A is a perspective view of the adhesive tape tray, and Fig. 57B is a front view of Fig. 57, and Fig. 57C is the first 57. Front view of the cover member of Fig. A Fig. 58 is a step diagram of a method of manufacturing an adhesive tape. Figure 5 is a side view of the adhesive tape tray of the second embodiment of the present invention

第60圖A及B係本發明第3實施形態之黏著材膠帶 盤之正面圖、及黏著劑膠帶之更換說明圖。 第6 1圖係本發明第4實施形態之捲部之側板的斜視 圖。 第62圖A及B係本發明第1實施形態之黏著具圖， 第62圖A係黏著具之斜視圖，第62圖B係第62圖A之 A-A剖面圖。 第63圖係用以說明第62圖A及第62圖B所示之黏 -196- 1322649 著具之使用方法的側面圖。 第64圖係黏著具之製造方法的步驟圖。 第65圖A及B係第1實施形態之黏著材膠帶圖，第 65圖A係黏著材膠帶捲繞於盤之斜視圖’第65圖A係第 65圖A之A-A剖面圖。Fig. 60 is a front view of the adhesive tape tray and a replacement explanatory view of the adhesive tape according to the third embodiment of the present invention. Fig. 61 is a perspective view showing a side plate of a winding portion according to a fourth embodiment of the present invention. Fig. 62 is a perspective view of the first embodiment of the present invention, Fig. 62 is a perspective view of the adhesive, and Fig. 62B is a cross-sectional view taken along line A-A of Fig. 62A. Fig. 63 is a side view for explaining the method of use of the adhesive-196- 1322649 shown in Figs. 62A and 62B. Fig. 64 is a step diagram of the manufacturing method of the adhesive. Fig. 65 is a cross-sectional view of the adhesive tape of the first embodiment, and Fig. 65A is a cross-sectional view of the adhesive tape wound around the disk. Fig. 65A is a cross-sectional view taken along line A-A of Fig. 65A.

第66圖A及B係第1實施形態之黏著材膠帶之黏著 材形成步驟圖，第66圖A係使各黏著材膠帶重疊成一體 且將一方之基材捲取至捲取用盤之步驟的槪略圖，第66 圖B係第6 6圖A之黏著劑間之重疊部份的剖面圖。 第67圖係黏著裝置在被覆體上形成黏著劑之步驟的 槪略圖。 第68圖係捲繞著黏著材膠帶之盤之斜視圖。 第69圖A係第2實施形態之黏著材膠帶之黏著材形 成步驟的剖面圖，第69圖B係應用第69圖A之黏著材實 施電路基板間之黏著的剖面圖。Fig. 66 is a view showing a step of forming an adhesive material of the adhesive tape according to the first embodiment, and Fig. 66A is a step of integrally laminating the adhesive tapes and winding one of the substrates onto the winding tray. Figure 66 is a cross-sectional view of the overlap between the adhesives of Figure 66A. Figure 67 is a schematic view showing the steps of the adhesive device forming an adhesive on the covering. Figure 68 is a perspective view of the disk around which the adhesive tape is wound. Fig. 69 is a cross-sectional view showing the steps of forming the adhesive material of the adhesive tape of the second embodiment, and Fig. 69B is a cross-sectional view showing the adhesion between the circuit boards using the adhesive material of Fig. 69A.

第70圖係本發明之2層構成向異導電材膠帶之供應 形態的模式圖。 第71圖係本發明之3層構成向異導電材膠帶之供應 形態的模式圖。 【主要元件對照表】 1 黏著材膠帶 2 捲部 2a 捲部 -197- 1322649Fig. 70 is a schematic view showing a form of supply of a two-layer structure to a different-conductive conductive tape of the present invention. Fig. 71 is a schematic view showing a form of supply of a three-layer structure of the present invention to a different-conductive conductive tape. [Main component comparison table] 1 Adhesive tape 2 Roll 2a Roll -197- 1322649

2b 黏著材膠帶盤 2c 黏著材膠帶盤 3 盤 3a 盤 5 捲軸 7 側板 7a 側板 7b 側板 8 蓋體構件 9 基材 ^ a 基材 )b 基材 l 0 乾燥劑 l 1 膜狀黏著劑 .la 黏著劑 lb 黏著劑 2 收容部 3 導電粒子 5 黏著裝置 6 導引件 7 捲取盤 9 加熱加壓頭 1 電路基板 la 電極 -198 221322649 23 23a 24 25 26 272b Adhesive tape tray 2c Adhesive tape tray 3 Disc 3a Disc 5 Reel 7 Side panel 7a Side panel 7b Side panel 8 Cover member 9 Substrate ^ a Substrate) b Substrate l 0 Desiccant l 1 Film adhesive. La Adhesive Agent lb Adhesive 2 accommodating portion 3 Conductive particles 5 Adhesive device 6 Guide member 7 Coiling disk 9 Heating and pressing head 1 Circuit substrate la Electrode -198 221322649 23 23a 24 25 26 27

28 29 30 3 1 3 2 3 3 34 3 528 29 30 3 1 3 2 3 3 34 3 5

36 4 1 4 3 44 46 4 7 48 4 9 5 0 導引銷 配線電路 電極 聚四氟乙烯材 捲出機 PDP 塗布機 結束標記 乾燥爐 終端部 捲取機 始％部 切割機 重疊部份 縫隙 工作台 連結膠帶 黏著劑 凹凸 卡止銷 卡止構件 爪部 爪部 彈性構件 -199- 1322649 5 1 爪 53 夾子 55 夾持片 56 模具 57 模具 58 凹凸36 4 1 4 3 44 46 4 7 48 4 9 5 0 Guide pin wiring circuit electrode PTFE roll-out machine PDP coater end mark drying furnace end part coiler start part part cutting machine overlap part gap work Table connection tape adhesive embossing card stopper pin locking member claw portion claw elastic member -199 - 1322649 5 1 claw 53 clip 55 holding piece 56 mold 57 mold 58 concave and convex

59 60 6 1 62 貫通孔 矽黏著膠帶 矽黏著膠帶 矽黏著劑 63 基材 64 樹脂製黏著劑 65 充塡機 66 6759 60 6 1 62 Through-hole 矽 Adhesive tape 矽 Adhesive tape 矽 Adhesive 63 Substrate 64 Resin adhesive 65 Charger 66 67

68 69 加熱器 連結膠帶 切口部份 標記 70 標記 71 發光部 72 受光部 7 4 連接部份 7 5 切口 7 6 卡止具 77 厚度檢測感測器 -200 1322649 78 支持膜 79 控制裝置 8 0 黏著劑層 81 半導體用黏著膜 82 半導體元件 83 引線框架 84 密封材68 69 Heater connection tape Notch part mark 70 Marker 71 Light-emitting part 72 Light-receiving part 7 4 Connection part 7 5 Notch 7 6 Card holder 77 Thickness detection sensor -200 1322649 78 Support film 79 Control device 8 0 Adhesive Layer 81 Adhesive film for semiconductor 82 Semiconductor element 83 Lead frame 84 Sealing material

85 焊絲 86 匯流排條 87 冲切模具 8 8 引線框架搬運部 89 黏著材膠帶冲切貼附部 90 加熱器部 91 黏著材膠帶盤 92 黏著材膠帶85 Welding wire 86 Bus bar 87 Punching die 8 8 Lead frame handling part 89 Adhesive tape punching and attaching part 90 Heater part 91 Adhesive tape tray 92 Adhesive tape

93 黏著材膠帶捲出滾輪 94 黏著材膠帶 9 5 公模 96 母模 97 膜壓板 98 縫隙 99 殼體 99a 半殼體 99b 半殼體 -201 132264993 Adhesive Tape Roll-Off Roller 94 Adhesive Tape 9 5 Male Mold 96 Female Mold 97 Membrane Pressure Plate 98 Gap 99 Housing 99a Half Housing 99b Half Housing -201 1322649

1 00 黏著劑膠帶盒 10 1 導引件 102 縫隙 1 03 凝聚力降低線 1 04 工作台 1 05 放電機 1 06 拉出口 1 07 軸 1 08 蓋帽 110 被嵌合部 111 黏著具 113 開口部 114 加熱構件 115 電熱板 116 齒輪 117 齒輪 118 齒輪單元 119 第三殼體 120 電源開關 12 1 jftTL· 盤1 00 Adhesive tape cassette 10 1 Guide member 102 Slit 1 03 Cohesion reduction line 1 04 Table 1 05 Release motor 1 06 Pull outlet 1 07 Shaft 1 08 Cap 110 Fitted portion 111 Adhesive 113 Opening portion 114 Heating member 115 electric heating plate 116 gear 117 gear 118 gear unit 119 third housing 120 power switch 12 1 jftTL · disk

Claims (1)

1322649 年//月/t!谱(更)正替換頁1322649 / / month / t! spectrum (more) is replacing page 十、申請專利範圍 第97 1 43988號專利申請案 中文申請專利範圍修正本 民國98年1 1月16 1. 一種黏著裝置，係具有：黏著材膠帶捲盤、 膠帶之捲取捲盤、配設於黏著材膠帶捲盤及捲取捐 且以加熱加壓頭將黏著材膠帶之黏著材壓著至電1¾ 壓著部、以及用以檢測膠帶之連接部份的連接部杉 ，其中，該黏著材膠帶捲盤係利用卡止具連接一戈 材膠帶之終端部及另一方之黏著材膠帶之始端部， 部份係以黏著材膠帶覆蓋卡止具：其特徵爲： 連接部檢測手段檢測到膠帶之連接部份時，3 份通過壓著部爲止，會將一方之黏著材膠帶捲取3 Art. 盤0 2. 如申請專利範圍第1項記載之黏著裝置，其 連接部檢測手段係CCD攝影機、厚度檢測雇 及透射率檢測感測器之其中之一。 3修正 黏著材 ί盤之間 [基板之 【測手段 _之黏著 且連接 :連接部 :捲取捲 中 丨測器、X. Application for Patent Scope No. 97 1 43988 Patent Application Revision of Chinese Patent Application Scope of the Republic of China 98 January 1 January 16. 1. Adhesive device with: adhesive tape reel, tape reel, and distribution Adhesive tape reel and coiling donation and pressing the adhesive tape of the adhesive tape to the electric pressing portion and the connecting portion for detecting the connecting portion of the adhesive tape, wherein the adhesive is attached The tape reel is connected with the end portion of the e-goping tape and the beginning end of the adhesive tape of the other side by using the card holder, and the part is covered with the adhesive tape to cover the card: the connection detecting means detects When the bonding portion of the tape is passed, three parts pass through the pressing portion, and one of the adhesive tapes is taken up. 3 Art. Disk 0 2. As shown in the patent application, the connection device is CCD. One of a camera, a thickness inspection employer, and a transmittance detection sensor. 3Correct Adhesive material ί Between the discs [Substrate [Measurement _ _ Adhesive and connected: Connection: Rolling coil in the detector,
TW097143988A 2002-07-30 2003-07-30 Adhesive material reel TW200913828A (en)

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TWI322649B true TWI322649B (en) 2010-03-21

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