TWI624913B - Mold-sealing apparatus - Google Patents

Abstract

A molding device uses a detection device to detect the state of a motor of a transmission device, so as to avoid the problem of insufficient tension of a film conveyed by the transmission device due to unstable transmission power of the motor.

Description

Moulding equipment

The present invention relates to a semiconductor device, and more particularly to a molding device.

Generally, a lead frame or a substrate is used as the packaging structure of the carrier. The manufacturing process is to connect the chip to the lead frame or the substrate by a bonding wire or a bump, and then use a molding operation to encapsulate the chip and The wire (or bump) is sealed to prevent external moisture from entering.

Traditional molding operations are performed using a molding machine. The conventional molding machine usually includes an upper mold, a lower mold, and a filling device. When performing the molding operation, the electronic components are first placed in a cavity between the upper mold and the lower mold, and then the packaging gel is filled with the filling device. In the cavity, the encapsulating colloid is used to cover the electronic component, and then the encapsulating colloid is heat-set. Finally, the mold is removed to remove the cured encapsulating colloid and the electronic component covered by the encapsulating colloid.

In addition, in order to improve the operation efficiency of the aforementioned demolding and taking out of the packaged electronic components, the industry has used a molding device with a film film. As shown in FIG. 1A, the conventional molding equipment 1 includes a mold 10, a transfer device 11, and a filler (not shown). Specifically, the mold 10 includes an upper mold 10a and a lower mold 10b, and the transmission device 11 includes a servo horse. 110 and an orientation structure 111 to transport a film film 9 to the mold 10, wherein the servo motor 110 moves the film film 9 and the orientation structure 111 adjusts the moving direction of the film film 9.

Please refer to FIG. 1B. When performing the molding operation, first use the transmission device 11 to place the film 9 on the upper mold 10a, and then cover the upper mold 10a and the lower mold 10b so that at least A carrier 60 of an electronic component is located in a cavity 100. Then, the encapsulating gel 62 is filled, the encapsulating gel 62 will cover the carrier 60 provided with at least one electronic component, and the encapsulating gel 62 will contact and adhere to the film 9. After the encapsulating gel 62 is cured, when the mold is released, the film 9 only needs to be pulled up. The carrier 60 provided with at least one electronic component and the electronic product 6 composed of the encapsulating gel 62 can follow the film. The film 9 is released from the cavity 100.

However, in the conventional mold sealing equipment 1, the servo motor 110 drives the film film 9 to transport, and the power supplied by the servo motor 110 is often not constant due to operation loss, resulting in insufficient tension of the film film 9a. As shown in FIG. 1C, the film film 9a is wrinkled, and the film film 9a cannot be flatly attached to the surface of the upper mold 10a, that is, the film film 9a is not fixed on the mold 10, which causes overflow. The glue (such as the encapsulating material 62a shown in FIG. 1C) occurs.

In addition, the servo motor 110 of the conventional molding equipment 1 has no detection device, so when an abnormality occurs (such as the film film 9a is wrinkled as described above), the process of filling the plastic material is continued, and problems such as overflow of glue occur, leading to subsequent Make bad products.

Therefore, how to overcome the problems in the above-mentioned conventional technologies has become a reality. Problems to be solved urgently.

In view of the lack of the above-mentioned conventional technology, the present invention provides a mold sealing device, which includes: a mold; a transmission device for transporting the film body to the mold; and a detection device for electrically connecting the transmission device to detect the The operating status of the transmission device.

In the aforementioned mold sealing equipment, the mold includes a first mold and a second mold, and an accommodation space is formed between the first mold and the second mold. The membrane system passes through the accommodation space.

In the aforementioned molding equipment, the transmission device includes a rolling member for setting up the film body, and a motor for rotating the rolling member to drive the film body to move. In the aforementioned molding equipment, the detection device includes a measuring device and a data processor. The measuring device is a torque measuring device, and the data processor is used for analyzing and processing the torque value measured by the measuring device. The data processor is built-in torque target value and allowable range. The target torque value is 10N-m ~ 300N-m, and the allowable range of the torque is 5N-m ~ 500N-m.

In the aforementioned molding equipment, the transmission device further includes a directional structure to adjust the moving direction of the film body. The orientation structure transfers the film body to the mold by a roller.

In the aforementioned molding equipment, the motor is a servo motor.

In the aforementioned molding equipment, the detecting device measures the torque of the motor.

The aforementioned molding equipment further includes a warning device connected to the detection device to notify the occurrence of an abnormal condition.

It can be known from the above that the molding device of the present invention detects the state of the motor by the detection device to avoid the problem that the transmission power of the motor is unstable and the membrane body is wrinkled. Therefore, compared with the conventional technology The mold sealing device of the present invention can avoid the occurrence of overflow of glue, and can avoid the problem of making defective products due to overflow of glue.

1,2‧‧‧Moulding equipment

10,20‧‧‧Mould

10a‧‧‧Mould

10b‧‧‧Down

100‧‧‧Mould cavity

11,21‧‧‧Transmission device

110,210‧‧‧Servo motor

111,211‧‧‧directional structure

20a‧‧‧First module

20b‧‧‧Second module

200‧‧‧ accommodation space

21a, 21b

212‧‧‧roller

22‧‧‧Detection device

3‧‧‧ membrane

5‧‧‧ human-machine interface

50, 51, 52 ‧ ‧ ‧ box

53‧‧‧ Light

6‧‧‧Electronic products

60‧‧‧carriage

62‧‧‧ encapsulated colloid

9,9a‧‧‧ film

62a‧‧‧sealing plastic

Figure 1A is a schematic diagram of a conventional molding device; Figure 1B is a partially enlarged view of Figure 1A when the operation is normal; Figure 1C is a partially enlarged view of Figure 1A when the operation is abnormal; and Figure 2 is a mold of the invention Figure 3 is a block diagram of the measuring method of the detection device in Figure 2; Figure 4 is a partial diagram of the method of operation of the molding equipment of the present invention; and Figure 5 is the present invention Part of the human-machine interface of the molding equipment.

The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the invention The qualifications are not technically meaningful. Any modification of the structure, the change of the proportional relationship, or the adjustment of the size will not affect the functions that the invention can produce. Under the effect and the goal that can be achieved, it should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "up", "down", "first", "second", and "one" etc. cited in this specification are for clarity only and are not intended to limit the scope of the invention. The scope of implementation, the change or adjustment of its relative relationship, without substantial changes in the technical content, should also be regarded as the scope of the present invention.

Please refer to FIG. 2, which is a schematic diagram of the molding device 2 according to the present invention. The molding device 2 includes: a mold 20 and a transmission device 21 (the layout position is simply shown in the figure, and it is not shown). Detailed mechanism) and a detection device 22 electrically connected to the transmission device 21 (only the connection relationship is shown in the figure, and the detailed mechanism is not shown).

The mold 20 is formed with at least one accommodating space 200 during the mold-closing state of the mold-sealing operation, so that an object to be packaged (such as a carrier 60 provided with at least one electronic component) is located therein.

In this embodiment, the mold 20 includes a first mold (such as the upper mold) 20a and a second mold (the lower mold) 20b, and the first mold 20a and the second mold are joined by a force. A module 20b, so that the accommodating space 200 is formed between the first and second modules 20a, 20b.

Furthermore, the molding equipment 2 includes a filler (not shown in the figure), which communicates with the inside of the mold 20, so that the molding material (not shown in the figure) is filled into the containing space of the mold 20 during the molding operation. In step 200, the molding material covers the carrier 60 provided with at least one electronic component.

The carrier 60 is, for example, a package substrate having a core layer and a circuit structure or a coreless circuit structure or Other supporting units, such as lead frames, which can be used to carry electronic components such as wafers, are not particularly limited.

In addition, the electronic component (not shown) is an active component, a passive component, or a combination of the two, etc., wherein the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor. Specifically, the electronic component is electrically connected to the carrier by a flip-chip method, a wire bonding method, or other methods.

The transmission device 21 is used to transport a film-type film body 3 to the first module 20a of the mold 20 and pass through the accommodating space 200.

In this embodiment, the transmission device 21 is, for example, a roller-type transmission device, which includes a plurality of rolling elements 21a, 21b, a power source such as a servo motor 210, and a plurality of directional structures 211, wherein the rolling elements 21a, 21b are It is used to set up the membrane body 3, and the servo motor 210 is used to rotate at least one of the rolling elements 21b to drive the membrane body 3 to move, and the orientation structure 211 is used to adjust the movement direction of the membrane body 3 and pass through a plurality of rollers 212 transfers the film body 3 to the first module 20a.

In addition, there are various adjustment methods related to the directional structure 211, which can be designed according to requirements without any particular restrictions.

The detecting device 22 measures the torque of the servo motor 210 (ie, the power source) to detect the state of the servo motor 210 and determine whether the tension state of the film body 3 is normal.

In this embodiment, the detecting device 22 includes a measuring device (not shown) and a data processor (not shown). The measuring device is, for example, a torque measuring device, which is connected to the servo motor 210. To measure and collect the servo motor 210 The torque value of the output pivot, and the data processor is, for example, a computer, which is installed with specific software (or program) to analyze and process the torque value measured by the measuring device.

Furthermore, as shown in Figure 3, the data processor has a built-in torque target value (such as between 10N-m ~ 300N-m) and an allowable range (such as between 5N-m ~ 500N-m). ) To determine whether the torque value measured by the measuring device is normal, that is, whether the magnitude of the power supplied by the servo motor 210 is stable and normal.

For example, if the data processor analyzes and processes the torque value a detected by the measuring device between 10N-m ~ 300N-m (that is, 10 ≦ a ≦ 300), it means that the servo motor 210 supplies The magnitude of the power is normal, the data processor makes the transmission device 21 continue to operate, so the transmission device 21 can continue to transport the film body 3 to the first module 20 a of the mold 20.

In addition, if the torque value a does not reach the target torque value, but is within the allowable range, that is, when 5 ≦ a <10 or 300 <a ≦ 500, it means that the torque of the servo motor 210 needs to be corrected (such as operation The power supplied by the servo motor 210 is not constant due to the loss), the data processor will cause the transmission device 21 to adjust the torque value, so that the torque reaches the target torque value after compensation (or adjustment) (that is, 10 ≦ a ≦ 300 ), At this time, it is not necessary to stop the operation of the transmission device 21 (or the molding equipment 2).

In addition, if a <5 or a> 500 indicates that the torque of the servo motor 210 is abnormal, the data processor will request the transmission device 21 (or the molding device 2) to stop operating and replace the servo motor 210 .

The following is a clear explanation of the molding equipment with reference to Figures 4 and 5. Operation method.

When using the molding device 2, an object to be packaged (such as a carrier 60 with at least one electronic component) is first set on the second module 20b, and a resin that has been pre-heated to be semi-dissolved (such as The molding compound of the encapsulant is filled in the filler. Next, the transmission device 21 is activated to transport the film body 3 to the first module 20a, and at the same time, the state of the output torque of the servo motor 210 is detected by the detection device 22.

In this embodiment, after the detection device 22 is activated, the target torque value can be set in the data processor of the detection device 22 and presented on a human-machine interface 5 (which can be set in the Boxes 51 and 52 (for example, 500N-m and 5N-m) of the upper and lower torque limits of the motor torque on the machine or on the machine or connected to the operator's mobile device), and set the target torque value ( (Eg 200N-m) to determine whether the torque supplied by the servo motor 210 is stable, that is, whether the servo motor 210 is normal.

Furthermore, as shown in FIG. 4, after the measurement by the measurement device of the detection device 22, the data processor of the detection device 22 analyzes and processes the torque value a measured by the measurement device, and Presented in box 50 of the motor torque shown in FIG. If the torque value a is between 10N-m and 300N-m, it means that the servo motor 210 is normal, so the transmission device 21 (or the molding device 2) can continue to operate.

In addition, if 5 ≦ a <10 or 300 <a ≦ 500, it means that the servo motor 210 needs to be compensated (such as adjusting and setting the torque of the servo motor 210) so that the torque reaches the target value after compensation (that is, 10 ≦ a ≦ 300) to ensure that the first module 20a and the second module 20b are joined (showing a mold seal) In the clamping state of the operation), the film body 3 is flatly attached to the surface of the first mold 20a. If the torque value a exceeds the range of 5N-m ~ 500N-m, that is, when a <5 or a> 500, it means that the servo motor 210 is abnormal. At this time, the data processor of the detection device 22 will instruct The warning device (such as the light number 53 shown in Figure 5) issues a warning to remind the operator to replace or repair the servo motor 210, and stop the operation of the transmission device 21 (or the molding equipment 2). After the servo motor 210, the transmission device 21 (or the molding device 2) is restarted.

In addition, there are many types of the warning device, such as animations, icons, sounds, lights, smells, etc., and are not limited to the light number 53 shown in FIG. 5, so the warning device can be designed according to requirements.

After the servo motor 210 of the transmission device 21 is normal, the first mold 20a is joined with the second mold 20b, so that the mold 20 is in a mold-clamping state. Then, a molding material is filled into the accommodating space 200 by the filler to cover the object to be packaged (such as a carrier 60 provided with at least one electronic component). In addition, the molding device 2 can also Contains a heater for curing the molding material, and after the molding material is cured, the mold 20 is opened to remove the finished product (that is, the packaged object) through the film body 3 leaving the accommodation space 200. .

In summary, the molding device 2 of the present invention detects the torque state of the servo motor 210 by the detection device 22 to avoid the insufficient tension of the membrane body 3 due to the unstable transmission power of the servo motor 210. When the problem occurs, compared with the conventional technology, the film body 3 cannot be flatly attached to the first mold 20a due to wrinkles, so the mold sealing device 2 of the present invention can avoid mold The sealing material overflows and can avoid the problem of making defective products due to the overflowing glue.

The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (11)

A molding device includes a mold, wherein the mold includes a first module and a second module, and the first module and the second module are joined by joining the first module and the second module. An accommodation space is formed between the modules; a transmission device is used to transport the membrane body to the mold; and a detection device is electrically connected to the transmission device to detect the operating state of the transmission device. The molding equipment according to item 1 of the scope of patent application, wherein the accommodation space is provided in the film system. The molding device according to item 1 of the scope of patent application, wherein the transmission device includes a rolling member for setting up the film body, and a motor for rotating the rolling member to drive the film body to move. The molding device as described in the third item of the patent application scope, wherein the detecting device measures the torque of the motor. The molding device according to item 1 of the scope of patent application, wherein the detection device includes a measuring device and a data processor. The molding device according to item 5 of the scope of patent application, wherein the measuring device is a torsion force measuring device, and the data processor is used for analyzing and processing the torque value measured by the measuring device. The molding device according to item 6 of the scope of patent application, wherein the data processor has a built-in target torque value and an allowable range. The molding equipment as described in item 7 of the scope of patent application, wherein the target value of the torque is 10N-m ~ 300N-m, and the allowable range of the torque is 5N-m ~ 500N-m. The molding device according to item 1 of the scope of patent application, wherein the transmission device further comprises an directional structure for adjusting a moving direction of the film body. The molding device according to item 9 of the patent application scope, wherein the orientation structure transfers the film body to the mold by a roller. The molding device described in item 1 of the scope of patent application, further includes a warning device connected to the detection device to notify the occurrence of an abnormal condition.