CN108688049A - Molding equipment - Google Patents
Molding equipment Download PDFInfo
- Publication number
- CN108688049A CN108688049A CN201710260043.7A CN201710260043A CN108688049A CN 108688049 A CN108688049 A CN 108688049A CN 201710260043 A CN201710260043 A CN 201710260043A CN 108688049 A CN108688049 A CN 108688049A
- Authority
- CN
- China
- Prior art keywords
- molding equipment
- equipment according
- torsion
- membrane body
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims description 60
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 239000012528 membrane Substances 0.000 claims description 25
- 238000005096 rolling process Methods 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000000084 colloidal system Substances 0.000 description 11
- 238000012856 packing Methods 0.000 description 11
- 239000003292 glue Substances 0.000 description 7
- 239000012778 molding material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012792 core layer Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
- B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76822—Phase or stage of control
- B29C2945/76829—Feeding
- B29C2945/76836—Feeding inserts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A mold sealing device detects the state of a motor of a conveying device through a detection device so as to avoid the problem that the tension of a film body conveyed by the conveying device is insufficient due to unstable transmission power of the motor.
Description
Technical field
The present invention is about a kind of semiconductor equipment, especially with regard to a kind of molding equipment.
Background technology
It is generally the encapsulating structure of load-bearing part with lead frame (Leadframe) or substrate (Substrate), processing procedure passes through
After chip is connected to lead frame or substrate by bonding wire or convex block, recycle molding operation with packing colloid by chip and bonding wire (or
Convex block) it seals, use the intrusion for preventing outside moisture.
Traditional molding operation is carried out using molding board.Existing molding board generally comprises upper die and lower die and tucker
Tool, and when carrying out molding operation, first electronic component is placed in the die cavity between upper mold and lower die, then filled by filling utensil
Packing colloid is filled in die cavity, making the packing colloid coat the electronic component, the packing colloid of thermosetting later is finally demoulded
To take out the electronic component of cured packing colloid and its cladding.
In addition, to improve the operating efficiency for the electronic component that aforementioned demoulding and taking-up encapsulation are completed, industry uses one kind then
Molding equipment with film film.As shown in Figure 1A, existing molding equipment 1 include a mold 10, a transmitting device 11 with
An and tucker (figure omits).Specifically, which includes an a upper mold 10a and lower die 10b, and the transmitting device 11 includes to watch
Motor 110 and oriented structure 111 are taken, by a film film 9 transport to the mold 10, wherein the servo motor 110 movement should
Film film 9, and the oriented structure 111 is to the moving direction that adjusts the film film 9.
Please refer to Figure 1B, when carrying out molding operation, the film film 9 is positioned over first with the transmitting device 11
On upper mold 10a, then covers and close upper mold 10a and lower die 10b to enable the load-bearing part 60 for being equipped with an at least electronic component be located at one
In die cavity 100.Packing colloid 62 is filled later, which can coat the load-bearing part for being equipped with an at least electronic component
60, and the packing colloid 62 can be contacted and be attached on the film film 9.After the packing colloid 62 to be solidified, when demoulding, only need
The pull-up film film 9 is somebody's turn to do the electronic product 6 that the load-bearing part 60 equipped with an at least electronic component is constituted with the packing colloid 62
It can be detached from the die cavity 100 with the film film 9.
However, in existing molding equipment 1, the transport of the film film 9 is driven by the servo motor 110, often because of operation
The power size for being lost and the servo motor 110 being made to be supplied is not fixed, and causes film film 9a tension insufficient, such as Fig. 1 C institutes
Show, film film 9a is caused to generate fold, and keep film film 9a smooth on the surface of upper mold 10a, also
It is that film film 9a is not fixed on really on the mold 10, thus causes excessive glue (packaging adhesive material 62a as shown in Figure 1 C)
It happens.
In addition, the servo motor 110 of existing molding equipment 1 has no detection device, therefore in being abnormal (such as above-mentioned film
Film 9a generates fold) when, the problems such as continuing to be filled glue material processing procedure, and excessive glue occurs, cause subsequently to produce bad
Product.
Therefore, how to overcome above-mentioned variety of problems in the prior art, have become the project for wanting to solve at present in fact.
Invention content
In view of the missing of the above-mentioned prior art, the present invention provides a kind of molding equipment then, to avoid occurring because of the motor
Transmission dynamic instability and the problem for making the tension deficiency for the membrane body that the transmitting device conveyed.
The present invention molding equipment include:Mold;Transmitting device, to transport membrane body to the mold;And detection dress
It sets, is electrically connected the transmitting device, to detect the operating state of the transmitting device.
In molding equipment above-mentioned, which includes the first module and the second module, and in first module and the second mould
Accommodating space is formed between part.The membrane body wears the accommodating space.
In molding equipment above-mentioned, which includes setting up the rolling member of the membrane body, and to rotate the rolling
Moving part is to drive the motor of the membrane body displacement.In molding equipment above-mentioned, which includes at a measurer and a data
Manage device.The measurer is torsion force measuring device, and the data processor is analyzing and handle the torsion number that the measurer measures
Value.Torsion desired value and permissible range are had in the data processor.The torsion desired value is 10N-m~300N-m, the torsion
Permissible range is 5N-m~500N-m.
In molding equipment above-mentioned, which includes again oriented structure, to adjust the moving direction of the membrane body.This is fixed
The membrane body is transmitted to the mold with idler wheel to structure.
In molding equipment above-mentioned, which is servo motor.
In molding equipment above-mentioned, which measures the torsion of the motor.
In molding equipment above-mentioned, multiple includes the alarming device for connecting the detection device to notify unusual condition to occur.
From the foregoing, it will be observed that the molding equipment of the present invention, the state of the motor is detected by the detection device, to avoid the motor
Transmission dynamic instability and so that the membrane body is led to the problem of fold, therefore compared to the prior art, molding equipment energy of the invention
The case where avoiding excessive glue occurs, and is avoided that the problem of producing defective products because of excessive glue.
Description of the drawings
Figure 1A is the schematic diagram of existing molding equipment;
Figure 1B is partial enlarged views of Figure 1A when operating normal;
Fig. 1 C are partial enlarged views of Figure 1A when operating abnormal;
Fig. 2 is the schematic diagram of the molding equipment of the present invention;
Fig. 3 is the block diagram of the measurement mode of the detection device of Fig. 2;
Fig. 4 is the partial schematic diagram of the operating method of the molding equipment of the present invention;And
Fig. 5 is the partial schematic diagram of the man-computer interface of the molding equipment of the present invention.
Symbol description:
1,2 molding equipment
10,20 molds
10a upper molds
10b lower dies
100 die cavitys
11,21 transmitting devices
110,210 servo motors
111,211 oriented structures
The first modules of 20a
The second modules of 20b
200 accommodating spaces
21a, 21b rolling member
212 idler wheels
22 detection devices
3 membrane bodies
5 man-computer interfaces
50,51,52 boxes
53 cressets
6 electronic products
60 load-bearing parts
62 packing colloids
9,9a film films
62a packaging adhesive materials.
Specific implementation mode
Illustrate that embodiments of the present invention, those skilled in the art can be by this explanations below by way of particular specific embodiment
The revealed content of book understands other advantages and effect of the present invention easily.
It should be clear that structure, ratio, size etc. depicted in this specification institute accompanying drawings, only coordinating specification to be taken off
The content shown is not limited to the enforceable qualifications of the present invention for the understanding and reading of those skilled in the art, therefore
Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the present invention
Under the effect of can be generated and the purpose that can reach, it should all still fall and obtain the model that can cover in disclosed technology contents
In enclosing.Meanwhile cited such as "upper" in this specification, "lower", " first ", " second " and " one " term, be also only just
In being illustrated for narration, rather than to limit the scope of the invention, relativeness is altered or modified, without substantive change
Under more technology contents, when being also considered as the enforceable scope of the present invention.
Referring to Fig. 2, its schematic diagram for the molding equipment 2 of the present invention, the molding equipment 2 include:One mold 20,
One transmitting device 21 (its installation position only simply being indicated in figure, do not show its detailed mechanism) and one be electrically connected the transmission
The detection device 22 (its connection relation only being indicated in figure, do not show its detailed mechanism) of device 21.
The mold 20 is formed with an at least accommodating space 200 when carrying out the molding state of molding operation, is intended to enabling
The object (load-bearing part 60 as being equipped with an at least electronic component) of encapsulation is located therein.
In this present embodiment, which includes one first module (such as upper mold) 20a and one second module (such as lower die)
20b, and the first module 20a and second module 20b are engaged by an active force, in first and second module 20a,
The accommodating space 200 is formed between 20b.
In addition, the molding equipment 2 includes a tucker (figure omits) again, it is connected to the inside of the mold 20, in progress mould
Molding material (figure omits) is inserted in the accommodating space 200 of the mold 20 when sealing operation, makes molding material cladding that should be equipped at least one
The load-bearing part 60 of electronic component.
Also, the load-bearing part 60 is, for example, package substrate (substrate) or coreless with core layer and line construction
The line construction of layer (coreless) or other load bearing units for carrying such as chip electronic component, such as lead frame
(leadframe), there is no particular restriction.
In addition, the electronic component (figure omits) is active member, passive device or the two combination etc., wherein the active element
Part is such as semiconductor chip, and the passive device is such as resistance, capacitance and inductance.Specifically, the electronic component is with flip
Mode, routing mode or other means are electrically connected the load-bearing part.
On membrane body 3 to the first module 20a of the mold 20 of the transmitting device 21 to transport a jelly-roll type and wear
If the accommodating space 200.
In this present embodiment, which is, for example, roller type drive apparatus, it includes multiple rolling member 21a,
21b, power source and multiple oriented structures 211 just like servo motor 210, wherein the rolling member 21a, 21b are setting up the film
Body 3, and the servo motor 210 is to rotate at least one of rolling member 21b, to drive 3 displacement of membrane body, and the oriented structure
211 adjust the moving direction of the membrane body 3 and through on multiple idler wheels 212 transmission membrane body 3 to first module 20a.
In addition, the adjustment mode in relation to the oriented structure 211 is various, can design on demand, there is no particular restriction.
The detection device 22 measures the torsion of the servo motor 210 (i.e. power source), to detect the servo motor 210
State, and judge whether the tension state of the membrane body 3 normal.
In this present embodiment, which includes a measurer (figure omits) and a data processor (figure omits), the amount
It is, for example, torsion force measuring device to survey device, the servo motor 210 is linked to, to measure and collect the output shaft of the servo motor 210
Torsion (torque) numerical value of (output pivot), and the data processor is such as computer, installation specific software (or journey
Sequence) to analyze and handle the torsion numerical value that the measurer measures.
In addition, as shown in figure 3, having a torsion desired value in the data processor (such as between 10N-m~300N-m)
And a permissible range (such as between 5N-m~500N-m), to judge whether the torsion numerical value that the measurer measures is normal,
Namely judge whether the power size that the servo motor 210 is supplied is stablized normally.
If for example, the data processor analysis with handle the measurer detected by torsion numerical value a be located at 10N-m~
Between 300N-m when (i.e. 10≤a≤300), then it represents that the power size that the servo motor 210 is supplied is normal, at the data
Even device 21 continued operation of transmitting device is managed, thus the transmitting device 21 can continue to transport the membrane body 3 to the of the mold 20
On one module 20a.
If also, the torsion numerical value a and not up to torsion desired value, but in permissible range, that is, as 5≤a ﹤ 10 or
When 300 ﹤ a≤500, then it represents that the torsion of the servo motor 210 need to be corrected (such as activity loss and make the servo motor 210
The power size supplied is not fixed), even the data processor transmitting device 21 adjusts torque value, keep torsion compensated
Reach torsion desired value (namely 10≤a≤300) after (or adjustment), is not required to stop the transmitting device 21 (or molding at this time
Equipment 2) start.
If in addition, as a ﹤ 5 or a > 500, indicate that the torsion of the servo motor 210 is abnormal, then the data processor can be wanted
It asks the transmitting device 21 (or the molding equipment 2) to stop start, and replaces the servo motor 210.
Below together with reference to figure 4 and Fig. 5 with the clear operating method for illustrating the molding equipment 2.
When using the molding equipment 2, first by object (load-bearing part 60 as being equipped with an at least electronic component) for package
On second module 20b, and by warmed-up the filling is filled in the resin (the molding material of such as packing colloid) partly dissolved
In device.Then, start the transmitting device 21 to transport on the membrane body 3 to first module 20a, while being examined with the detection device 22
Survey the state of the outputting torsion of the servo motor 210.
In this present embodiment, it after the detection device 22 startup, can be set in the data processor of the detection device 22
Torsion desired value, and be presented in and (can be set on the suitable board of the molding equipment 2 or line just like man-computer interface shown in fig. 55
To the running gear of operator) on the motor torque upper limit and lower limit box 51,52 in (such as 500N-m and 5N-m), and set
Torsion desired value (such as 200N-m) to judge whether the torsion that the servo motor 210 is supplied is stablized, that is, judges the servo
Whether motor 210 is normal.
In addition, as shown in figure 4, after the measurer of the detection device 22 is measured, at the data of the detection device 22
The torsion numerical value a that the measurer measures can be analyzed and be handled to reason device, and be presented in the box 50 of motor torque shown in fig. 5
In.If torsion numerical value a is between 10N-m~300N-m, then it represents that the servo motor 210 is normal, thus the transmission
Device 21 (or the molding equipment 2) can continue start.
If also, as 5≤a ﹤ 10 or 300 ﹤ a≤500, indicate that the servo motor 210 need to compensate (as adjustment setting should
The torque magnitude of servo motor 210), make to reach desired value (namely 10≤a≤300) after torsion is compensated, with ensure this
When one module 20a engages the molding state of molding operation (present in) with second module 20b, membrane body 3 is smooth fits in this for this
On the surface of first module 20a.If torsion numerical value a exceeds the range of 5N-m~500N-m, that is, as a ﹤ 5 or a > 500
When, then it represents that the servo motor 210 is abnormal, and the data processor of the detection device 22 can indication warning device (such as Fig. 5 at this time
Shown in cresset 53) give a warning, to remind operating personnel to replace or repair the servo motor 210, and stop the transmitting device
The start of 21 (or the molding equipment 2) after the repair servo motor 210, then restarts the transmitting device 21 (or molding
Equipment 2).
In addition, the type of the alarming device is various, as animation, shown in, sound, light, smell etc., however it is not limited to Fig. 5 institutes
The cresset 53 shown, therefore the alarming device can be designed on demand.
After the servo motor 210 of the transmitting device 21 is presented normally, the first module 20a and the second module 20b phases
Engagement, to enable the mold 20 that the molding state of molding operation is presented.Then, molding material is inserted by the accommodating sky by the tucker
Between in 200, to coat object for package (load-bearing part 60 as being equipped with an at least electronic component), in addition, the molding equipment 2 is also
It may include a heater, to cure the molding material, and after molding material solidification, the mold 20 opened, to pass through the membrane body 3
It is detached from the accommodating space 200 and takes out finished product (i.e. packaged object).
In conclusion the molding equipment 2 of the present invention detects the torsion shape of the servo motor 210 by the detection device 22
State occurs the problem of the tension deficiency of the membrane body 3 to avoid the transmission dynamic instability because of the servo motor 210, therefore phase
Compared with the prior art, the membrane body 3 will not can not be smooth on first module 20a due to generating fold, thus the mould of the present invention
Envelope equipment 2 is avoided that molding material, and there is a situation where excessive glues, and are avoided that the problem of making defective products because of excessive glue.
Above-described embodiment is only to be illustrated the principle of the present invention and its effect, and is not intended to limit the present invention.Appoint
What one of ordinary skill in the art can without violating the spirit and scope of the present invention modify to above-described embodiment.Therefore
The scope of the present invention, should be as listed in the claims.
Claims (12)
1. a kind of molding equipment, it is characterized in that, which includes:
Mold;
Transmitting device, to transport membrane body to the mold;And
Detection device is electrically connected the transmitting device, to detect the operating state of the transmitting device.
2. molding equipment according to claim 1, it is characterized in that, which includes the first module and the second module, and in
It is formed with accommodating space between first module and the second module.
3. molding equipment according to claim 2, it is characterized in that, which wears the accommodating space.
4. molding equipment according to claim 1, it is characterized in that, which includes to set up the rolling of the membrane body
Part, and to rotate the rolling member to drive the motor of the membrane body displacement.
5. molding equipment according to claim 4, it is characterized in that, which measures the torsion of the motor.
6. molding equipment according to claim 1, it is characterized in that, which includes that a measurer and a data are handled
Device.
7. molding equipment according to claim 6, it is characterized in that, which is torsion force measuring device, the data processor
To analyze and handle the torsion numerical value that the measurer measures.
8. molding equipment according to claim 7, it is characterized in that, torsion desired value is had in the data processor and is allowed
Range.
9. molding equipment according to claim 8, it is characterized in that, which is 10N-m~300N-m, the torsion
Permissible range is 5N-m~500N-m.
10. molding equipment according to claim 1, it is characterized in that, which also includes to adjust the membrane body
The oriented structure of moving direction.
11. molding equipment according to claim 10, it is characterized in that, which transmits the membrane body to the mould with idler wheel
Tool.
12. molding equipment according to claim 1, this feature are, which further includes connecting the detection device to notify
The alarming device that unusual condition occurs.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106112014A TWI624913B (en) | 2017-04-11 | 2017-04-11 | Mold-sealing apparatus |
| TW106112014 | 2017-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108688049A true CN108688049A (en) | 2018-10-23 |
Family
ID=62951578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710260043.7A Pending CN108688049A (en) | 2017-04-11 | 2017-04-20 | Molding equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108688049A (en) |
| TW (1) | TWI624913B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004296691A (en) * | 2003-03-26 | 2004-10-21 | Towa Corp | Device and method for supplying resin sealing film |
| CN103910242A (en) * | 2012-12-31 | 2014-07-09 | 东莞市雅康精密机械有限公司 | Motor pulling type material belt tension control mechanism |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100690379B1 (en) * | 2002-07-30 | 2007-03-12 | 히다치 가세고교 가부시끼가이샤 | Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette |
| TWM478584U (en) * | 2014-01-13 | 2014-05-21 | Testo Industry Corp | Automatic clamping size adjustment control apparatus of C- ring clamping tool |
-
2017
- 2017-04-11 TW TW106112014A patent/TWI624913B/en active
- 2017-04-20 CN CN201710260043.7A patent/CN108688049A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004296691A (en) * | 2003-03-26 | 2004-10-21 | Towa Corp | Device and method for supplying resin sealing film |
| CN103910242A (en) * | 2012-12-31 | 2014-07-09 | 东莞市雅康精密机械有限公司 | Motor pulling type material belt tension control mechanism |
Non-Patent Citations (1)
| Title |
|---|
| 孙玉秋: "《印刷过程自动化》", 31 December 2007, 印刷工业出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI624913B (en) | 2018-05-21 |
| TW201838106A (en) | 2018-10-16 |
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Application publication date: 20181023 |