CN102298724A - Gluing type whole-mount technology for electronic component of IC card - Google Patents
Gluing type whole-mount technology for electronic component of IC card Download PDFInfo
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- CN102298724A CN102298724A CN2011102282615A CN201110228261A CN102298724A CN 102298724 A CN102298724 A CN 102298724A CN 2011102282615 A CN2011102282615 A CN 2011102282615A CN 201110228261 A CN201110228261 A CN 201110228261A CN 102298724 A CN102298724 A CN 102298724A
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- card
- card chip
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- hard plate
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Abstract
The invention relates to a gluing type whole-mount technology for an electronic component of an IC card. The technology process comprises the following steps that: alignment bonding is carried out on a flexible circuit board and an IC card chip contact by a conductive resin and then horizontal placement is carried out; a proper amount of package resins that have strong adhesiveness and are insulating are dropped on a surface upwards of the IC card chip at an overhead direction and under the gravity affect, the dropped package resins are formed into a small circular ball top, wherein the ball top fully covers the IC card chip as well as the center of the ball top is thinner than edges by taking the IC card chip as a center; when the package resins starts to be solidified and be fixed and still do not reach an incomplete solidified state, an insulated hard plate that is slightly larger than the IC card chip is pressed on the package resins that is eight above the IC card chip and proper extrusion is carried out, so that the insulated hard plate and the package resins are completely bonded; and after the package resins are completely solidified and a gelatinous layer is formed, polishing and moulding are carried out. According to the invention, a whole-mount technology for an electronic component of an IC card is simplified; an IC card chip is effectively protected; technological requirements and costs are reduced; and energy consumption and pollution are also reduced.
Description
Technical field
The present invention relates to the IC-card electronic component, be specially a kind of self-contained technology of veneer type of IC-card electronic component.
Background technology
At present, country is in the development of carrying forward vigorously the Internet of Things industry, IC-card as radio-frequency technique, be widely used in the mobile phone card, mass transit card, bank card, electronic access, aspects such as electronic tag, in the self-contained process of IC-card electronic component, traditional handicraft is: earlier IC-card chip (being the silicon wafer or the brilliant unit of IC-card integrated circuit) is carried out " encapsulation of brilliant unit ", adopt welded type to be connected packaged IC-card chip and IC-card inductive coil (being radio-frequency antenna) again, with host materials such as PVC the IC-card electronic component is carried out overall package then, just become the IC-card of the various type shapes that we see at ordinary times, the self-contained technology of this IC-card electronic component at first is: (connection) conductive weld leg and encapsulation are drawn by brilliant unit, technological requirement is high when encapsulating from brilliant unit guiding electric welding pin with to it, in case bad product occurs, can not take encapsulation again apart, brilliant unit can not use by secondary, causes waste; Simultaneously, energy consumption height during the welding of packaged IC-card chip and radio-frequency antenna, pollute big, correlation technique difficult parameters and reach accurate unification.
" a kind of New Type IC Card inductive coil " (patent No.: ZL2011200411087) of Xie Zhong invention, be modified into the flexible circuit board that the contact by IC-card inductive coil substrate, the on-chip sensor circuit of IC-card inductive coil and connection IC-card chip constitutes with original by the thread IC-card inductive coil of metal, with the IC-card chip be connected the IC-card chip contacts connect whole IC-card electronic component.The not yielding fracture of this flexible circuit board inductive coil, and restore easily after the flexural deformation.
Summary of the invention
Technical matters to be solved by this invention is: for overcoming the defective of prior art; be connected and provide a kind of employing conducting resinl that IC-card chip (brilliant unit) is glued together with IC-card inductive coil (flexible circuit board); utilize packaging plastic and hard plate the partially flexible wiring board around IC-card chip and the IC-card chip to be carried out the encapsulated moulding technology of reinforcement protection again; thereby simplify the self-contained technological process of IC-card electronic component; reduce technological requirement and cost, reduce energy consumption and pollution.
The technical solution adopted for the present invention to solve the technical problems is:
The self-contained technology of a kind of veneer type of IC-card electronic component, its technological process is:
A, the IC-card inductive coil adopts flexible circuit board, when in dustfree environment, the IC-card chip being connected with flexible circuit board, earlier the two connecting terminal that docks of IC-card chip and flexible circuit board is put conducting resinl respectively, by designing requirement each contact is aligned mutually and compresses then, guarantee between IC-card chip contacts and flexible circuit board upper contact bonding, be communicated with, conduction, and no conducting resinl is excessive between each contact, so the IC-card electronic component of forming is when instrument test work is undesired, can take off the IC-card chip, in time wipe the conducting resinl on each contact, reinstall, qualified after tested back the IC-card electronic component, enter next process again.
Glue together good IC-card electronic component with conducting resinl, because correlative factors such as the bounding force of conducting resinl, the IC-card chip is insecure with combining of flexible circuit board, easily come off by external environment influence IC-card chip from flexible circuit board, exposed outside because of the IC-card chip again, if be subjected to external force extruding, bump etc., easily the IC-card chip is caused damage, for guaranteeing IC-card chip difficult drop-off, damage, guarantee the normal durable use of IC-card electronic component energy, also will the position at above-mentioned IC-card chip place be reinforced, encapsulate.
The IC-card electronic component of B, the above-mentioned energy of horizontal operate as normal, make the side of facing up that the IC-card chip has been installed and allow contactless level of IC-card chip upwards, dripping an amount of packaging plastic directly over the IC-card chip then, because action of gravity, packaging plastic is just from top to bottom by flowing to flexible circuit board around the IC-card chip, and it is rounded to diffusion all around on flexible circuit board, final form one and cover the IC-card chip fully and be thicker relatively small circular ball top, the thin relatively middle part in center, peripheral position with the IC-card chip, glue to be packaged solidifies gradually.
C, begin solidifying and setting and not during full solidification at packaging plastic, on the packaging plastic directly over the IC-card chip, press a slice to be slightly larger than the hard plate of IC-card chip, suitably push hard plate, make hard plate and packaging plastic bonding fully, packaging plastic is in certain outside, interior condition solidifies down, after being cured to a certain degree just no longer to around slime flux, completely crued packaging plastic forms gelatinous layer, the IC-card chip is wrapped in the gelatinous layer between flexible circuit board and the hard plate, hard plate at the gelatinous layer top, because of extruding force, gravity, effects such as surface tension, hard plate edge part and the one side that contacts with packaging plastic all form integral body with the packaging plastic close adhesion.
After D, packaging plastic full solidification are shaped into gelatinous layer, polish off the hard plate edge and exceed the colloid that hard plate does not have the glue face, make that hard plate is flat to be embedded in the gelatinous layer top, and parallel, promptly finish the self-contained process of IC-card electronic component with flexible circuit board.Use various host materials to above-mentioned IC-card electronic component overall package again, just become IC-card.
In this technological process, the conducting resinl of point on IC-card chip contacts and flexible circuitry plate contact wants an amount of, can not excessively join together, otherwise IC-card electronic component part cisco unity malfunction; Drip in the packaging plastic of IC-card chip top and want an amount of, make it can cover around IC-card chip on the flexible circuit board (brilliant unit) and the IC-card chip on the flexible circuit board suitably part fully, (contactless that face) has enough gelatinous layers and hard plate to be bonding with above the IC-card chip, the gelatinous layer (about 0.1 millimeter) that suitable thickness is arranged between hard plate and the IC-card chip, gelatinous layer is the step shape by thick to approaching on flexible circuit board, the flat gelatinous layer top that is embedded in of hard plate is parallel with flexible circuit board, after the gelatinous layer full solidification, the part that packaging plastic is arranged around the IC-card chip on the flexible circuit board, the IC-card chip, hard plate holds tightly together, and forms integral body with flexible circuit board; The GPRS on opportunity of placing hard plate is good, before if packaging plastic does not begin to solidify, place too early, can make gelatinous layer between hard plate and the IC-card chip too thin or directly touch the IC-card chip, if after being cured to a certain degree, place again, it is slow to place, and the viscosity between hard plate and the packaging plastic is not enough, can't allow hard plate and packaging plastic form firm integral body.
In this technological process, chip used packaging plastic has extremely strong cohesive, and has insulativity, have certain rigidity, flexibility after the curing, not yielding, non-friable, (brilliant first) is identical with flexible circuit board, hard plate, IC-card chip for thermal expansivity, the energy high-and low-temperature resistance; Hard plate adopts nonmetal hard plate or has the sheet metal of insulation course; has certain intensity and hardness; be subjected to external force such as foreign matter bump when the IC-card die sites and do the time spent; at first put forth effort on hard plate; and then pass to gelatinous layer; IC-card chip in gelatinous layer is damaged, effectively protects the IC-card chip.
When above the IC-card chip, dripping packaging plastic, small gap around below the IC-card chip between position and the flexible circuit board, because of dense thick, the surface tension of packaging plastic, and the effects such as viscous force of conducting resinl on the IC-card chip gravity, each contact, packaging plastic can not infiltrate IC-card chip bottom slit, and the IC-card chip is floated, on the contrary in edge that the IC-card chip contacts with flexible circuit board, because of the packaging plastic cure shrinkage, it is tightr that the IC-card chip is combined with flexible circuit board.
The invention has the advantages that: be connected by adopting conducting resinl that the IC-card chip is glued together with the IC-card inductive coil; utilize packaging plastic and hard plate the partially flexible wiring board around IC-card chip and the IC-card chip to be carried out the encapsulated moulding technology of reinforcement protection again; thereby simplify the self-contained technology of IC-card electronic component; effectively protect the IC-card chip; reduce technological requirement and cost, reduce energy consumption and pollution.
Description of drawings:
The IC-card electronic component structure cut-open view of Fig. 1 for adopting the self-contained technology of this veneer type to make;
The IC-card electronic component front view of Fig. 2 for adopting the self-contained technology of this veneer type to make.
Among the figure: 1-flexible circuit board 2-IC the core of the card sheet 3-gelatinous layer
4-drips glue position 5-hard plate
Embodiment
The present invention will be further described below in conjunction with accompanying drawing.
The self-contained technology of a kind of veneer type of IC-card electronic component, its technological process is:
A, the IC-card inductive coil adopts flexible circuit board 1, when in dustfree environment, IC-card chip 2 being connected with flexible circuit board 1, earlier IC-card chip 2 is put conducting resinl respectively with flexible circuit board 1 the two connecting terminal position of docking, by designing requirement each contact is aligned mutually and compresses then, guarantee between IC-card chip contacts and flexible circuit board upper contact bonding, be communicated with conduction, no conducting resinl is excessive between each contact, so the IC-card electronic component of forming is when instrument test work is undesired, can take off the IC-card chip, in time wipe the conducting resinl on each contact, reinstall by aforesaid operations, qualified after tested back the IC-card electronic component, enter next process again.
Glue together good IC-card electronic component with conducting resinl, because correlative factors such as the bounding force of conducting resinl, the IC-card chip is insecure with combining of flexible circuit board, easily come off by external environment influence IC-card chip, again because of the IC-card chip is exposed outside, if be subjected to external force extruding, bump etc. from flexible circuit board, easily the IC-card chip is caused damage, for guaranteeing IC-card chip difficult drop-off, damage, guarantee the normal durable use of IC-card energy, also to the position at above-mentioned IC-card chip place be reinforced, encapsulate.
Above-mentioned technological process also can adopt the insulating gel point in the contactless position of IC-card chip, and point is around the flexible circuit board upper contact, the IC-card chip contacts is directly connected with the flexible circuit board upper contact, contactless position of IC-card chip and the contactless position of flexible circuit board are bonding, but after being communicated with between contact and the contact, the contact periphery has the slit, remaining air makes the contact easily oxidized in the slit, simultaneously in operating process, if insulating gel is put blocked uply,, all may make the finished product IC-card can not normal durable use just can not well connect mutually between the contact, for these reasons, the present invention adopts the conducting resinl gummed to connect.
B, the IC-card electronic component of the above-mentioned energy of horizontal operate as normal, make the side of facing up that IC-card chip 2 has been installed, and allow 2 contactless levels of IC-card chip upwards, (being to drip glue position 4 in the accompanying drawing) dripped and gone up an amount of packaging plastic directly over IC-card chip 2 then, because effects such as gravity, packaging plastic is just from top to bottom by flowing to flexible circuit board 1 around the IC-card chip 2, and it is rounded to diffusion all around on flexible circuit board, final form one and cover the IC-card chip fully and be the center with the IC-card chip, thicker relatively small circular ball top, thin relatively middle part, periphery position, glue to be packaged solidifies gradually.
C, begin solidifying and setting and not during full solidification at packaging plastic, on the packaging plastic directly over the IC chip, press a slice to be slightly larger than the hard plate of IC-card chip, suitably push hard plate, make hard plate and packaging plastic bonding fully, packaging plastic is in certain outside, interior condition solidifies down, after being cured to a certain degree just no longer to around slime flux, completely crued packaging plastic forms gelatinous layer 5, the IC-card chip is wrapped in the gelatinous layer 5 between flexible circuit board and the hard plate, hard plate at the gelatinous layer top, because of extruding force, gravity, effects such as surface tension, hard plate edge part and the one side that contacts with packaging plastic all form integral body with the packaging plastic close adhesion.
After the typing of D, packaging plastic full solidification forms gelatinous layer, polish off the hard plate edge and exceed the colloid that hard plate does not have the glue face, make that hard plate is flat to be embedded in the gelatinous layer top, and parallel, promptly finish the self-contained process of IC-card electronic component with flexible circuit board.Use various host materials to above-mentioned IC-card electronic component overall package again, just become IC-card.
In this technological process, the conducting resinl of point on IC-card chip contacts and flexible circuitry plate contact wants an amount of, can not excessively join together, otherwise IC-card electronic component part cisco unity malfunction; Above-mentioned manufacture craft part also can adopt the insulating gel point in the contactless position of IC-card chip, and point is around the flexible circuit board upper contact, the IC-card chip contacts is directly connected with the flexible circuit board upper contact, contactless position of IC-card chip and the contactless position of flexible circuit board are bonding, but after being communicated with between contact and the contact, the contact periphery has the slit, remaining air makes the contact easily oxidized in the slit, simultaneously in operating process, if insulating gel is put blocked uply,, all may make the finished product IC-card can not normal durable use just can not connect mutually between the contact, for these reasons, the present invention adopts the conducting resinl gummed to connect; Drip in the packaging plastic of IC-card chip top and want an amount of, make it can cover around IC-card chip on the flexible circuit board (brilliant unit) and the IC-card chip on the flexible circuit board suitably part fully, (contactless that face) has enough gelatinous layers and hard plate to be bonding with above the IC-card chip, the gelatinous layer (about 0.1 millimeter) that suitable thickness is arranged between hard plate and the IC-card chip, gelatinous layer is the step shape by thick to approaching on flexible circuit board, the flat gelatinous layer top that is embedded in of hard plate is parallel with flexible circuit board, after the gelatinous layer full solidification, the part that packaging plastic is arranged around the IC-card chip on the flexible circuit board, the IC-card chip, hard plate holds tightly together, form integral body with flexible circuit board, the IC-card chip is done the time spent in external force such as being subjected to the foreign matter bump and is not damaged.
In this technological process, chip used packaging plastic has extremely strong cohesive, and has insulativity, have certain rigidity, flexibility after the curing, not yielding, non-friable, (brilliant first) is identical with flexible circuit board, hard plate, IC-card chip for thermal expansivity, the energy high-and low-temperature resistance; Hard plate adopts nonmetal hard plate or has the sheet metal of insulation course; has certain intensity and hardness; therefore hard plate is less; so adopt sheet metal can not influence the performance of finished product IC-card; be subjected to external force such as foreign matter bump when the IC-card die sites and do the time spent, at first put forth effort on hard plate, and then pass to gelatinous layer; IC-card chip in gelatinous layer is damaged, effectively protects the IC-card chip.
When above the IC-card chip, dripping packaging plastic, small gap around below the IC-card chip between position and the flexible circuit board, because of dense thick, the surface tension of packaging plastic, and the effects such as viscous force of conducting resinl on the IC-card chip gravity, each contact, packaging plastic can not infiltrate IC-card chip bottom slit, and the IC-card chip is floated, on the contrary in edge that the IC-card chip contacts with flexible circuit board, because of the packaging plastic cure shrinkage, it is tightr that the IC-card chip is combined with flexible circuit board.
This technology is connected by adopting conducting resinl that the IC-card chip is glued together with the IC-card inductive coil; utilize packaging plastic and hard plate the partially flexible wiring board around IC-card chip and the IC-card chip to be carried out the encapsulated moulding technology of reinforcement protection again; thereby simplify the self-contained technological process of IC-card electronic component; effectively protect the IC-card chip; reduce technological requirement and cost, reduce energy consumption and pollution.
Claims (3)
1. the self-contained technology of the veneer type of an IC-card electronic component, its technological process is:
A, IC-card inductive coil adopt flexible circuit board, when in dustfree environment, the IC-card chip being connected with flexible circuit board, earlier the two connecting terminal that docks of IC-card chip and flexible circuit board is put conducting resinl respectively, by designing requirement each contact is aligned mutually and compresses then, guarantee bonding between IC-card chip contacts and flexible circuit board upper contact, be communicated with conduction, no conducting resinl is excessive between each contact, detect qualified back the IC-card electronic component, enter next process;
B, the qualified IC-card electronic component of the described detection of horizontal, make and one of IC-card chip has been installed is faced up, allow contactless level of IC-card chip upwards, dripping an amount of packaging plastic directly over the IC-card chip then, packaging plastic flows to flexible circuit board all around by the IC-card chip from top to bottom under effects such as gravity, and it is rounded to diffusion all around on flexible circuit board, final form one and cover the IC-card chip fully and be thicker relatively small circular ball top, the thin relatively middle part in center, peripheral position with the IC-card chip, glue to be packaged solidifies gradually;
C, begin solidifying and setting and not during full solidification, on the packaging plastic directly over the IC chip, press a slice to be slightly larger than the hard plate of IC-card chip, suitably push hard plate, make hard plate and packaging plastic bonding fully, packaging plastic full solidification formation gelatinous layer at packaging plastic;
After D, the typing of packaging plastic full solidification form gelatinous layer, polish off the hard plate edge and exceed the colloid that hard plate does not have the glue face, promptly finish the self-contained process of IC-card electronic component.
2. according to the self-contained technology of veneer type of the described a kind of IC-card electronic component of claim 1, described packaging plastic adopts the extremely strong insulating gel of cohesive, have certain rigidity, flexibility after the curing, not yielding, non-friable, thermal expansivity and flexible circuit board, hard plate, IC-card chip are identical, can high-and low-temperature resistance.
3. according to the self-contained technology of veneer type of claim 1,2 described a kind of IC-card electronic components, described hard plate adopts nonmetal hard plate or has the sheet metal of insulation course, has certain intensity and hardness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102282615A CN102298724A (en) | 2011-08-03 | 2011-08-03 | Gluing type whole-mount technology for electronic component of IC card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102282615A CN102298724A (en) | 2011-08-03 | 2011-08-03 | Gluing type whole-mount technology for electronic component of IC card |
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| CN102298724A true CN102298724A (en) | 2011-12-28 |
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| CN2011102282615A Pending CN102298724A (en) | 2011-08-03 | 2011-08-03 | Gluing type whole-mount technology for electronic component of IC card |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551589A (en) * | 2013-10-24 | 2015-04-29 | 富士通株式会社 | Component assembly manufacturing method, positioning apparatus, and component assembly |
| CN107016427A (en) * | 2017-05-27 | 2017-08-04 | 山东华冠智能卡有限公司 | A kind of crystal glue-dropping wraps card and preparation method thereof entirely |
| CN109996393A (en) * | 2017-12-29 | 2019-07-09 | 中国石油化工股份有限公司 | Method and apparatus for improving drilling well electronic performance |
| CN113977179A (en) * | 2021-12-07 | 2022-01-28 | 北京中科科仪股份有限公司 | Centering tool and centering method for sensor coil |
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| WO2008141543A1 (en) * | 2007-05-23 | 2008-11-27 | Beijing Golden Spring Technology Development Co., Ltd. | Intelligent label, method and device for coating glue thereof |
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| CN102014573A (en) * | 2009-09-04 | 2011-04-13 | 上海中京电子标签集成技术有限公司 | Printed circuit board with radio frequency identification and production method thereof |
| KR101035209B1 (en) * | 2010-01-26 | 2011-05-17 | 주식회사 영일프레시젼 | A process which protects overflowing of propellent for i.c card that includes heatslug |
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- 2011-08-03 CN CN2011102282615A patent/CN102298724A/en active Pending
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| CN1108811A (en) * | 1994-10-19 | 1995-09-20 | 胡斌 | Integrated circuit electronic information-storage card and its packing method |
| WO2008141543A1 (en) * | 2007-05-23 | 2008-11-27 | Beijing Golden Spring Technology Development Co., Ltd. | Intelligent label, method and device for coating glue thereof |
| CN101587845A (en) * | 2008-05-21 | 2009-11-25 | 资茂科技股份有限公司 | Packaging method and packaging structure of electronic volume label and personnel management-control method in dust free room |
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| KR101035209B1 (en) * | 2010-01-26 | 2011-05-17 | 주식회사 영일프레시젼 | A process which protects overflowing of propellent for i.c card that includes heatslug |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551589A (en) * | 2013-10-24 | 2015-04-29 | 富士通株式会社 | Component assembly manufacturing method, positioning apparatus, and component assembly |
| CN107016427A (en) * | 2017-05-27 | 2017-08-04 | 山东华冠智能卡有限公司 | A kind of crystal glue-dropping wraps card and preparation method thereof entirely |
| CN109996393A (en) * | 2017-12-29 | 2019-07-09 | 中国石油化工股份有限公司 | Method and apparatus for improving drilling well electronic performance |
| CN113977179A (en) * | 2021-12-07 | 2022-01-28 | 北京中科科仪股份有限公司 | Centering tool and centering method for sensor coil |
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Application publication date: 20111228 |