CN111739901B - Sensor packaging structure and packaging method - Google Patents

Sensor packaging structure and packaging method Download PDF

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Publication number
CN111739901B
CN111739901B CN202010854085.5A CN202010854085A CN111739901B CN 111739901 B CN111739901 B CN 111739901B CN 202010854085 A CN202010854085 A CN 202010854085A CN 111739901 B CN111739901 B CN 111739901B
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cover plate
packaging
substrate
chip
accommodating groove
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CN111739901A (en
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钟磊
何正鸿
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention provides a sensor packaging structure and a packaging method, and belongs to the technical field of semiconductors. A sensor package structure comprising: the base plate, the response chip sets up on the face of base plate, and the workspace orientation of response chip keeps away from one side of base plate, the circuit of response chip is connected through the binding line with the circuit of base plate, be formed with first storage tank on the face of encapsulation apron, the intussuseption of first storage tank is filled with insulating colloid, one side that the base plate set up the response chip is located to encapsulation apron lid, the binding line holding is in order to be gomphosis with insulating colloid in first storage tank, insulating colloid is used for bonding encapsulation apron on the base plate, one side that the encapsulation apron is close to the response chip is formed with the second storage tank, the response chip holding is in the second storage tank. The invention aims to provide a sensor packaging structure and a packaging method, which can better set and protect a binding line connected between an induction chip and a substrate, improve the yield of the packaging structure and reduce the packaging cost.

Description

Sensor packaging structure and packaging method
Technical Field
The invention relates to the technical field of semiconductors, in particular to a sensor packaging structure and a packaging method.
Background
With the iteration of the semiconductor industry, the types and structures of sensing chips of sensors are continuously updated, and sensing chips such as a Charge Coupled Device (CCD), a CMOS chip, and a Contact Image Sensor (CIS) are developed. In general, in practical applications, the sensing chip needs to be packaged to constitute a sensor device for use.
Current sensor packaging structure includes base plate, response chip, printing opacity glass and plastic-sealed body, and wherein, the response chip pastes the dress and binds on the base plate and through the binding line, and printing opacity glass passes through the colloid and bonds on the workspace of response chip (for example the sensitization district of sensitization chip), and response chip, printing opacity glass and binding line pass through the plastic-sealed body encapsulation.
However, in the conventional sensor package structure, when a plastic package body is manufactured for packaging, due to the high injection pressure and mold clamping pressure, the defects of glue overflow, punching and bending of a wire arc of a binding wire, mold blocking of glue and the like easily exist, and the yield of the sensor package structure is low. In addition, the plastic package body needs to be manufactured by using an injection molding machine and corresponding molds with different structures, so that the current packaging cost is higher.
Disclosure of Invention
The invention aims to provide a sensor packaging structure and a packaging method, which can better set and protect a binding line connected between an induction chip and a substrate, improve the yield of the packaging structure and reduce the packaging cost.
The embodiment of the invention is realized by the following steps:
in one aspect of the embodiments of the present invention, a sensor package structure is provided, including: the base plate, the response chip sets up on the face of base plate, and the workspace orientation of response chip keeps away from one side of base plate, the circuit of response chip is connected through the binding line with the circuit of base plate, be formed with first storage tank on the face of encapsulation apron, the intussuseption of first storage tank is filled with insulating colloid, one side that the base plate set up the response chip is located to encapsulation apron lid, the binding line holding is in order to be gomphosis with insulating colloid in first storage tank, insulating colloid is used for bonding encapsulation apron on the base plate, one side that the encapsulation apron is close to the response chip is formed with the second storage tank, the response chip holding is in the second storage tank.
Optionally, the package cover plate includes a functional area corresponding to the working area of the sensor chip and a peripheral area surrounding the functional area, and the first receiving groove is located in the peripheral area.
Optionally, the package cover plate covers the first receiving groove on the substrate and is in a closed structure.
Optionally, the sensing chip is a photosensitive chip, and the functional region of the package cover plate is made of a light-transmitting material.
Optionally, the material of the encapsulation cover plate is transparent glass.
Optionally, the light transmittance of the package cover plate is greater than 90%.
Optionally, the insulating gel is a light absorbing material.
Optionally, the insulating gel is a thermoplastic material.
In another aspect of the embodiments of the present invention, a sensor packaging method is provided, including:
mounting an induction chip on a substrate, and routing to form a binding line for conducting the circuit of the induction chip and the substrate;
covering a packaging cover plate with a first accommodating groove on the substrate to cover the sensing chip and enable the binding line to be accommodated in the first accommodating groove, wherein the first accommodating groove is formed on the surface of the packaging cover plate, an insulating colloid is filled in the first accommodating groove, and the binding line is embedded in the insulating colloid;
and curing the insulating colloid to bond the packaging cover plate on the substrate.
Optionally, the method further includes, before the package cover plate formed with the first receiving groove is covered on the substrate to cover the sensing chip and accommodate the binding line in the first receiving groove:
a first containing groove corresponding to the binding line is formed on the surface of the packaging cover plate, and insulating colloid is filled in the first containing groove.
Optionally, the package cover plate includes a functional area corresponding to the working area of the sensor chip and a peripheral area surrounding the functional area, and the first receiving groove is located in the peripheral area; form the first storage tank corresponding to the binding line on the face of encapsulation apron to pack insulating colloid in the first storage tank, include:
covering a protective film on one side plate of the packaging cover plate, wherein the protective film is positioned in the functional area of the packaging cover plate;
performing laser grooving on the peripheral area of the packaging cover plate to form a first accommodating groove corresponding to the binding line;
and filling the first accommodating groove with an insulating colloid.
The embodiment of the invention has the beneficial effects that:
the embodiment of the invention provides a sensor packaging structure which comprises a substrate, an induction chip and a packaging cover plate. The induction chip is arranged on the surface of the substrate, the working area of the induction chip faces to one side far away from the substrate, and the induction chip and the substrate are bound through the binding line, so that the circuit of the induction chip and the circuit of the substrate can be conducted. A first containing groove is formed in the surface of the packaging cover plate, insulating colloid is filled in the first containing groove, the packaging cover plate is covered on one side of the substrate where the sensing chip is arranged, the binding line is contained in the first containing groove to be embedded with the insulating colloid, a second containing groove is formed in one side of the packaging cover plate close to the sensing chip, and the sensing chip is contained in the second containing groove. The sensing chip is accommodated in the second accommodating groove through the packaging cover plate, so that the sensing chip can be packaged and protected. And the binding line is accommodated in the first accommodating groove formed by the packaging cover plate, and the first accommodating groove is filled with the insulating colloid, so that the binding line can be fixed and protected by the insulating colloid, and the binding line is prevented from being influenced by external force and being defective. And the packaging cover plate can be bonded on the substrate by using the insulating colloid in the first accommodating groove so as to fix the packaging cover plate. According to the sensor packaging structure, plastic packaging is not carried out by using a plastic packaging body, so that the defects of glue overflow, binding wire arc punching and bending, glue blocking and the like in the packaging process can be reduced, the yield of the sensor packaging structure is improved, and the packaging cost is reduced. In addition, the packaging structure is relatively simple, so that the packaging process of the sensor can be simplified, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a sensor package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a package cover plate of a sensor package structure according to an embodiment of the present invention;
fig. 3 is a second schematic structural diagram of a sensor package structure according to an embodiment of the invention;
FIG. 4 is a flowchart illustrating a method for packaging a sensor according to an embodiment of the present invention;
fig. 5 is a second schematic flow chart of a sensor packaging method according to an embodiment of the invention.
Icon: 110-a substrate; 120-a sensing chip; 121-a working area; 130-a binding line; 140-a package cover plate; 141-a first receiving groove; 142-a second accommodating groove; 143-functional region; 144-peripheral area.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
With the continuous development of the semiconductor industry, the induction chip applied in the field of sensors is continuously updated.
The current sensor package structure is usually packaged by a plastic package body, so as to protect the sensing chip and a binding line between the sensing chip and the substrate by using the plastic package body. However, in the conventional sensor package structure, when a plastic package body is manufactured for packaging, due to the high injection pressure and mold clamping pressure, the defects of glue overflow, punching and bending of a wire arc of a binding wire, mold blocking of glue and the like easily exist, and the yield of the sensor package structure is low. In addition, the plastic package body needs to be manufactured by using an injection molding machine and corresponding molds with different structures, so that the current packaging cost is higher.
Accordingly, an embodiment of the present invention provides a sensor package structure, as shown in fig. 1, including: the substrate 110, the sensing chip 120 is disposed on the surface of the substrate 110, and the working area 121 of the sensing chip 120 faces the side away from the substrate 110, the circuit of the sensing chip 120 is connected to the circuit of the substrate 110 through the binding line 130, a first receiving groove 141 is formed on the surface of the package cover plate 140, an insulating colloid is filled in the first receiving groove 141, the package cover plate 140 is covered on the side of the substrate 110 where the sensing chip 120 is disposed, the binding line 130 is received in the first receiving groove 141 to be embedded with the insulating colloid, the insulating colloid is used for bonding the package cover plate 140 to the substrate 110, as shown in fig. 2, a second receiving groove 142 is formed on the side of the package cover plate 140 close to the sensing chip 120, and the sensing chip 120 is received in the second receiving groove 142.
The sensing chip 120 is usually provided with a working area 121 and at least one bonding area, and the bonding area has a connection point (pad point) on the circuit of the sensing chip 120 for corresponding connection with the circuit of the substrate 110, and correspondingly, the substrate 110 is provided with the corresponding bonding area and pad point. Generally, the binding line 130 is formed by wire bonding to connect corresponding pad points of the substrate 110 and the sensing chip 120, so as to conduct the circuit between the sensing chip 120 and the substrate 110.
In practical applications, the sensing chip 120 and the substrate 110 have a plurality of sets of pad points corresponding thereto, and accordingly, the binding line 130 has a plurality of sets, so that the first receiving groove 141 for receiving the binding line 130 can be disposed in a plurality corresponding to each binding line 130. Of course, for a plurality of binding lines 130 located in the same binding area, a larger first receiving groove 141 may be provided to receive a plurality of binding lines 130 in the same binding area at the same time. Therefore, in the embodiment of the present invention, the number of the first receiving grooves 141 and the corresponding relationship between the first receiving grooves 141 and the binding lines 130 are not particularly limited, as long as all the binding lines 130 can be received in the first receiving grooves 141. For example, corresponding first receiving grooves 141 are respectively formed in the package cover plate 140 corresponding to each binding line 130, or corresponding to different binding regions, and the first receiving grooves 141 are formed in the package cover plate 140 to receive the binding lines 130 of different binding regions in the same first receiving groove 141, so that the number of the first receiving grooves 141 is reduced, and the efficiency of setting the first receiving grooves 141 is improved.
It should be noted that, in the sensor package structure, the package cover plate 140 protects the sensing chip 120, and the package cover plate 140 and the substrate 110 are bonded and fixed by the insulating adhesive in the first accommodating groove 141, so that it can be avoided that the adhesive is dispensed on the working area 121 of the sensing chip 120 to bond the transparent glass, and thus the adhesive dispensed on the working area 121 of the sensing chip 120 overflows to the pad point of the sensing chip 120, which results in that the bonding line 130 cannot be set by wire bonding. Therefore, the sensor packaging structure can have higher yield.
The sensor package structure provided by the embodiment of the invention includes a substrate 110, an inductive chip 120, and a package cover plate 140. The sensing chip 120 is disposed on the surface of the substrate 110, and the working area 121 of the sensing chip 120 faces a side away from the substrate 110, and the sensing chip 120 and the substrate 110 are bound by the binding line 130, so that the circuit of the sensing chip 120 and the circuit of the substrate 110 can be conducted. The first receiving groove 141 is formed on the surface of the package cover plate 140, the first receiving groove 141 is filled with an insulating adhesive, the package cover plate 140 is covered on one side of the substrate 110 where the sensing chip 120 is disposed, the binding line 130 is received in the first receiving groove 141 to be embedded with the insulating adhesive, a second receiving groove 142 is formed on one side of the package cover plate 140 close to the sensing chip 120, and the sensing chip 120 is received in the second receiving groove 142. The sensing chip 120 is covered on the substrate 110 by the package cover 140, and the sensing chip 120 is accommodated in the second accommodating groove 142, so that the sensing chip 120 can be packaged and protected. Moreover, the binding line 130 is accommodated in the first accommodating groove 141 formed by the encapsulating cover plate 140, and the first accommodating groove 141 is filled with an insulating colloid, so that the binding line 130 can be fixed and protected by using the insulating colloid, and the binding line 130 is prevented from being affected by an external force to cause defects. In addition, the package cover 140 can be bonded to the substrate 110 by the insulating adhesive in the first receiving groove 141, so as to fix the package cover 140. According to the sensor packaging structure, plastic packaging is not carried out by using a plastic packaging body, so that the defects of glue overflow, punching and bending of the 130-wire arc of the binding wire, mold blocking of glue and the like in the packaging process can be reduced, the yield of the sensor packaging structure is improved, and the packaging cost is reduced. In addition, the packaging structure is relatively simple, so that the packaging process of the sensor can be simplified, and the production efficiency is improved.
Optionally, as shown in fig. 3, the package cover plate 140 includes a functional area 143 corresponding to the working area 121 of the sensor chip 120 and a peripheral area 144 surrounding the functional area 143, and the first receiving groove 141 is located in the peripheral area 144.
By disposing the first receiving groove 141 in the peripheral region 144, it can be avoided that a part of the insulating colloid filled in the first receiving groove 141 covering the package cover 140 to the substrate 110 contacts the working area 121 of the sensor chip 120, which affects the normal operation of the working area 121 of the sensor chip 120.
In the embodiment of the present invention, in order to make the connection strength between the package cover 140 and the substrate 110 higher, an insulating adhesive may be further disposed in other areas that do not affect the working area 121 of the sensor chip 120 to bond the package cover 140 and the substrate 110. For example, an insulating adhesive may be coated on the peripheral region 144 of the package cover 140 except for the first receiving groove 141 to bond and fix the package cover 140 and the substrate 110.
Optionally, the package cover 140 covers the first receiving cavity 141 of the substrate 110 to form a closed structure.
It should be noted that, the package cover 140 covers the first receiving groove 141 on the substrate 110 to form a closed structure, that is, only one side of the first receiving groove 141 close to the substrate 110 has an opening for the entry of the binding line 130 and the filling of the insulating glue. Therefore, when the package cover 140 covers the substrate 110, the first receiving groove 141 is a closed structure, so as to prevent the colloid filled therein from overflowing from a side far away from the substrate 110.
Certainly, in practical applications, the side of the first receiving groove 141 away from the substrate 110 may also be provided with an opening, so that after the package cover plate 140 is covered on the substrate 110, the insulating colloid is filled from the opening of the first receiving groove 141 away from the substrate 110, which is not limited herein.
Optionally, the sensing chip 120 is a photosensitive chip, and the functional region 143 of the package cover 140 is a light-transmitting material.
The photo sensor chip may be a Charge Coupled Device (CCD), a CMOS chip, a Contact Image Sensor (CIS), or the like, and the photo sensor chip is not limited herein as long as it is the sensor chip 120 capable of receiving an optical signal and converting the optical signal into an electrical signal by using the working area 121.
When the sensor chip 120 is configured as a light sensing chip, the functional region 143 of the package cover 140 is correspondingly configured as a light transmissive material, so that the optical signal can be received by the working region 121 of the sensor chip 120 through the package cover 140.
It should be noted that, when the sensing chip 120 is set as a photosensitive chip, because this sensor package structure does not need to glue in order to bond the light-transmitting glass at the working area 121 (photosensitive surface) of the photosensitive chip, therefore, the photosensitive surface of the photosensitive chip can be prevented from being shielded by the colloid, and thus compared with the existing sensor package structure based on the photosensitive chip, the light-transmitting property can be improved, and the sensing effect of the photosensitive chip can be improved.
In practical applications, in order to reduce the cost and the production difficulty of disposing the functional region 143 of the package cover 140 as a light-transmitting material, the package cover 140 may be made of a light-transmitting material as a whole. Illustratively, the material of the package cover plate 140 is transparent glass, so that on the basis of having better light transmittance, the package cover plate 140 has relatively higher strength and heat resistance to protect the sensing chip 120 well.
For example, in order to satisfy the sensitive chip of the sensitivity, the light transmittance of the package cover 140 may be set to be greater than 90%. Of course, those skilled in the art may also specifically set the light transmittance of the package cover plate 140 according to the requirement of the light signal receiving intensity of the working area 121 of the photo sensor chip, which is not limited herein.
Optionally, the insulating gel is a light absorbing material.
Through setting up the insulating colloid into the extinction material, can make the insulating colloid utilize the extinction to avoid light to take place scattering, refraction or reflection in the insulating colloid to avoid the insulating colloid to cause harmful effects to the optical signal reception of the workspace 121 (sensitization face) of sensitization chip.
Optionally, the insulating gel is a thermoplastic material.
The insulating colloid in the sensor packaging structure is set to be thermoplastic material, and in practical application, the sensor packaging structure can be heated to enable the insulating colloid to flow and deform, so that the bonding between the packaging cover plate 140 and the substrate 110 is removed, and the detachability of the sensor packaging structure is realized. Thereby facilitating replacement and maintenance of the sensor chip 120 or the substrate 110.
In another aspect of the embodiments of the present invention, there is provided a sensor packaging method, as shown in fig. 4, including:
s201: the substrate is provided with the sensing chip in a mounting mode, and the bonding wire is used for forming a bonding wire for conducting the sensing chip and the circuit of the substrate in a bonding mode.
S202: the packaging cover plate which is formed with a first containing groove is covered on the substrate so as to cover the induction chip and enable the binding line to be contained in the first containing groove. The first accommodating groove is formed in the surface of the packaging cover plate, insulating glue is filled in the first accommodating groove, and the binding line is embedded in the insulating glue.
S203: and curing the insulating colloid to bond the packaging cover plate on the substrate.
In practical application, after the insulating colloid is cured, the sensor package structure can be connected with other circuit boards or devices through the ball (solder ball and the like) or the arranged pin on the side of the substrate far away from the sensing chip.
It should be noted that, depending on the structure of the first receiving groove, the filling of the insulating colloid may be performed before or after the package cover plate is covered on the substrate. For example, when the package cover is covered on the substrate, the first receiving groove is in a closed structure, the insulating colloid is filled before the package cover is covered on the substrate, and when one side of the first receiving groove, which is far away from the substrate, is an opening, the insulating colloid can be filled through the opening after the package cover is covered on the substrate.
In practical applications, the package cover plate formed with the first receiving groove may be directly customized by a package cover plate factory or may be manufactured by itself. And when the insulating colloid is filled in the first accommodating groove before the packaging cover plate is covered with the substrate, the packaging cover plate filled with the insulating colloid in the first accommodating groove can be directly customized by a packaging cover plate factory, and the packaging cover plate factory is not limited here.
It should be noted that the substrate may be configured as a substrate array overall structure formed by a plurality of substrate units, each corresponding substrate unit is provided with a sensing chip, and the first receiving groove of the package cover plate may be configured corresponding to the binding line of each substrate unit and the sensing chip. Based on this, after S203, package structure cutting may be performed, so as to form a single sensor package structure including one sensing chip.
In the method, the mounting of the sensor chip on the substrate and the routing of the binding wire can be performed by those skilled in the art according to conventional processes, which are not described herein again.
The sensor packaging method provided by the embodiment of the invention can be used for firstly mounting the sensing chip on the substrate, carrying out routing binding, then covering the packaging cover plate with the first containing groove on the substrate to cover the sensing chip and enable the binding line to be contained in the first containing groove, wherein the first containing groove is formed on the plate surface of the packaging cover plate, the first containing groove is filled with the insulating colloid, and the binding line is embedded in the insulating colloid. And then curing the insulating colloid to bond the packaging cover plate on the substrate, thereby forming the sensor packaging structure. Establish on the base plate through the encapsulation apron lid to cover the response chip, can encapsulate the protection to the response chip. And the binding line is accommodated in the first accommodating groove formed by the packaging cover plate, and the first accommodating groove is filled with the insulating colloid, so that the binding line can be fixed and protected by the insulating colloid, and the binding line is prevented from being influenced by external force and being defective. And the packaging cover plate can be bonded on the substrate by using the insulating colloid in the first accommodating groove so as to fix the packaging cover plate. According to the sensor packaging structure, plastic packaging is not carried out by using a plastic packaging body, so that the defects of glue overflow, binding wire arc punching and bending, glue blocking and the like in the packaging process can be reduced, the yield of the sensor packaging structure is improved, and the packaging cost is reduced. Moreover, the packaging method is relatively simple, and the production efficiency can be improved.
When the package cover plate is manufactured by itself, optionally, the package cover plate formed with the first receiving groove is covered on the substrate to cover the sensing chip and before the binding line is received in the first receiving groove, the method further includes:
a first containing groove corresponding to the binding line is formed on the surface of the packaging cover plate, and insulating colloid is filled in the first containing groove.
It should be noted that, when the insulating colloid is a thermoplastic material, after the insulating colloid is filled, the insulating colloid may be cured first to facilitate the transfer and storage of the package cover plate, and when the package cover plate is closed, the insulating colloid may be softened again to enable the binding line to be embedded into the insulating colloid.
Optionally, the package cover plate includes a functional area corresponding to the working area of the sensor chip and a peripheral area surrounding the functional area, and the first receiving groove is located in the peripheral area; forming a first receiving groove corresponding to the binding line on the surface of the package cover plate, and filling the first receiving groove with an insulating colloid, as shown in fig. 5, including:
s301: and covering a protective film on one side plate of the packaging cover plate, wherein the protective film is positioned in the functional area of the packaging cover plate.
S302: and laser grooving is carried out on the peripheral area of the packaging cover plate so as to form a first accommodating groove corresponding to the binding line.
S303: and filling the first accommodating groove with an insulating colloid.
The protective film covered on the package cover plate may be removed after laser grooving, for example, after the protective film is removed, the insulating colloid is filled, or after the insulating colloid is filled, the protective film is removed. Of course, the protective film may be removed after the insulating adhesive is cured to form the sensor package structure, and therefore, the timing of specifically removing the protective film after the laser grooving is not limited herein.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, specific embodiments and effects of the substrate, the sensing chip, the binding line, the package cover plate, and the like related to the above-described sensor packaging method may refer to corresponding descriptions and explanations in the foregoing sensor packaging structure embodiment, and are not described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A sensor package structure, comprising: the induction chip is arranged on the surface of the substrate, the working area of the induction chip faces to one side far away from the substrate, the circuit of the induction chip is connected with the circuit of the substrate through a binding line, the packaging cover plate is covered on one side of the substrate where the induction chip is arranged, a first accommodating groove is formed in the surface of the packaging cover plate, an insulating colloid is filled in the first accommodating groove, the binding line is accommodated in the first accommodating groove to be embedded with the insulating colloid, the insulating colloid is used for bonding the packaging cover plate on the substrate, a second accommodating groove is formed in one side of the packaging cover plate close to the induction chip, and the induction chip is accommodated in the second accommodating groove;
the packaging cover plate comprises a functional area corresponding to the working area of the induction chip and a peripheral area surrounding the functional area, and the first accommodating groove is located in the peripheral area;
the sensing chip is a photosensitive chip, the functional area of the packaging cover plate is made of a light-transmitting material, the insulating colloid is made of a light-absorbing material, and the insulating colloid is made of a thermoplastic material.
2. The sensor package structure of claim 1, wherein the package cover plate covers the substrate, and the first receiving cavity is a closed structure.
3. The sensor package structure of claim 1, wherein the material of the package cover is a light-transmissive glass.
4. The sensor package structure of claim 3, wherein the package cover plate has a light transmittance of greater than 90%.
5. A method of packaging a sensor, comprising:
mounting an induction chip on a substrate, and routing to form a binding line for conducting the induction chip and a circuit of the substrate;
covering a packaging cover plate with a first accommodating groove to cover the sensing chip and accommodating the binding line in the first accommodating groove, wherein the first accommodating groove is formed on the surface of the packaging cover plate, an insulating colloid is filled in the first accommodating groove, and the binding line is embedded in the insulating colloid; the packaging cover plate comprises a functional area corresponding to the working area of the induction chip and a peripheral area surrounding the functional area, and the first accommodating groove is located in the peripheral area; the induction chip is a photosensitive chip, the functional area of the packaging cover plate is made of a light-transmitting material, the insulating colloid is a light-absorbing material, and the insulating colloid is a thermoplastic material;
and curing the insulating colloid to bond the packaging cover plate on the substrate.
6. The method for packaging a sensor according to claim 5, wherein the packaging cover plate having a first receiving groove formed therein is covered on the substrate to cover the sensor chip and before the bonding wire is received in the first receiving groove, the method further comprises:
and forming a first accommodating groove corresponding to the binding line on the surface of the packaging cover plate, and filling the insulating colloid into the first accommodating groove.
7. The method for packaging a sensor according to claim 6, wherein the forming a first receiving groove corresponding to the binding line on the surface of the package cover plate and filling the insulating gel into the first receiving groove comprises:
covering a protective film on one side face of the packaging cover plate, wherein the protective film is positioned in a functional area of the packaging cover plate;
performing laser grooving on the peripheral area of the packaging cover plate to form a first accommodating groove corresponding to the binding line;
and filling the insulating colloid into the first accommodating groove.
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