CN110648981A - Image sensing chip packaging structure and packaging method thereof - Google Patents
Image sensing chip packaging structure and packaging method thereof Download PDFInfo
- Publication number
- CN110648981A CN110648981A CN201910860503.9A CN201910860503A CN110648981A CN 110648981 A CN110648981 A CN 110648981A CN 201910860503 A CN201910860503 A CN 201910860503A CN 110648981 A CN110648981 A CN 110648981A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- image sensing
- sensing chip
- light
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000000853 adhesive Substances 0.000 claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 claims abstract description 69
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims description 51
- 239000004033 plastic Substances 0.000 claims description 48
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 21
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000005304 optical glass Substances 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 230000003667 anti-reflective effect Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 238000012858 packaging process Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- DEVSOMFAQLZNKR-RJRFIUFISA-N (z)-3-[3-[3,5-bis(trifluoromethyl)phenyl]-1,2,4-triazol-1-yl]-n'-pyrazin-2-ylprop-2-enehydrazide Chemical compound FC(F)(F)C1=CC(C(F)(F)F)=CC(C2=NN(\C=C/C(=O)NNC=3N=CC=NC=3)C=N2)=C1 DEVSOMFAQLZNKR-RJRFIUFISA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 150000001540 azides Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The invention provides an image sensing chip packaging structure and a packaging method thereof, wherein the packaging structure comprises: a circuit substrate; the front surface of the image sensing chip is provided with a photosensitive area and a plurality of welding pads arranged around the photosensitive area, the back surface of the image sensing chip is attached to the circuit substrate, and the image sensing chip is electrically connected with the circuit substrate; the light-transmitting cover plate covers the front face of the image sensing chip, the surface area of the light-transmitting cover plate is larger than that of the front face of the image sensing chip, and the front face of the image sensing chip is completely covered by the light-transmitting cover plate; the image sensing chip packaging structure further comprises: the optical transparent adhesive is arranged between the light-transmitting cover plate and the image sensing chip and at least covers the photosensitive area; and the supporting adhesive is arranged on the circuit substrate, surrounds the image sensing chip and supports the light-transmitting cover plate.
Description
Technical Field
The present invention relates to semiconductor chip packaging technologies, and in particular, to a package structure and a package method for an image sensor chip.
Background
With the advent of the digital age, the application and development of various digital image devices have been spotlighted, such as: digital camcorders, digital cameras. With the progress of semiconductor technology, digital imaging devices have been integrated into various consumer electronic products, such as mobile phones, Personal Digital Assistants (PDAs), etc., which also drive the consumer demand of related products.
The main core component of these digital image devices is an image sensing chip, and then peripheral technologies such as signal processing, storage and output are combined to become a representative product in the digital era. The image sensing chip is an electronic device capable of sensing external light and converting the external light into an electrical signal. The image sensor chip is usually manufactured by a semiconductor manufacturing process. After the image sensing chip is manufactured, a series of packaging processes are performed on the image sensing chip to form a packaged structure, so that the packaged structure is used for various electronic devices such as digital cameras, digital video cameras and the like.
The prior art discloses a fan-out packaging scheme of an image sensing chip, wherein the image sensing chip is attached to the front surface of a circuit substrate, and is electrically connected with the circuit substrate in a routing mode, a welding bulge or a connecting welding pad is arranged on the back surface of the circuit substrate, and the circuit substrate is used as a switching board to electrically connect the image sensing chip with an external circuit. The image sensing chip is sensitive to dust and particles present during packaging and use. Therefore, the image sensor chip package generally includes a light-transmitting cover plate disposed on the front surface of the image sensor chip for protecting the light-sensing area of the image sensor chip, wherein the light-transmitting cover plate forms a closed cavity in the light-sensing area to prevent dust from contaminating the light-sensing area.
Please refer to the prior art, chinese patent application No. 200910158498.3. Because the light-transmitting cover plate only covers the photosensitive area, the requirement on the alignment precision of the light-transmitting cover plate and the image sensing chip is high, the fan-out packaging structure comprises a plastic packaging adhesive material, and further, if a welding bulge is formed on the back surface of the circuit substrate, a reflow soldering process is usually carried out, and due to the thermal expansion of the plastic packaging adhesive material and the expansion and contraction of gas in the cavity, the light-transmitting cover plate is easy to incline or misplace, the air tightness of the cavity is damaged, and the packaging qualification rate of the image sensing chip is reduced.
Disclosure of Invention
The invention aims to provide a small and ultrathin image sensing chip packaging structure and a packaging method thereof.
The invention provides an image sensing chip packaging structure, comprising: a circuit substrate; the front surface of the image sensing chip is provided with a photosensitive area and a plurality of welding pads arranged around the photosensitive area, the back surface of the image sensing chip is attached to the circuit substrate, and the image sensing chip is electrically connected with the circuit substrate; the light-transmitting cover plate covers the front face of the image sensing chip, the surface area of the light-transmitting cover plate is larger than that of the front face of the image sensing chip, and the front face of the image sensing chip is completely covered by the light-transmitting cover plate; the image sensing chip packaging structure further comprises: the optical transparent adhesive is arranged between the light-transmitting cover plate and the image sensing chip and at least covers the photosensitive area; and the supporting adhesive is arranged on the circuit substrate, surrounds the image sensing chip and supports the light-transmitting cover plate.
Preferably, the light-transmitting cover plate is connected with the image sensing chip without a cavity.
Preferably, the area where the image sensing chip is overlapped with the light-transmitting cover plate is completely filled with an optically transparent adhesive.
Preferably, the overlapped area of the image sensing chip and the light-transmitting cover plate is filled with an optical transparent adhesive and the supporting adhesive.
Preferably, the supporting glue further surrounds the light-transmitting cover plate and exposes the top surface of the light-transmitting cover plate.
Preferably, the circuit substrate is provided with a chip attaching area and a plurality of connecting pads arranged around the chip attaching area, the image sensing chip is attached to the chip attaching area of the circuit substrate, and the welding pads are electrically connected with the connecting pads through metal wires.
Preferably, the image sensing chip package structure further includes a plastic package body, the plastic package body is disposed on the circuit substrate and surrounds the image sensing chip and the light-transmitting cover plate, and the plastic package body exposes the top surface of the light-transmitting cover plate.
Preferably, the plastic-sealed body includes first plastic packaging glue film and second plastic packaging glue film, the upper surface unevenness of first plastic packaging glue film and being less than the top surface of printing opacity apron, second plastic packaging glue film covers on the first plastic packaging glue film, the upper surface flatness of second plastic packaging glue film and with the top surface of printing opacity apron is located the coplanar, second plastic packaging glue film exposes the top surface of printing opacity apron.
Preferably, the supporting glue is an ultraviolet light curing glue, a thermal curing glue, or an adhesive polyimide or amide resin.
Preferably, the light-transmitting cover plate is optical glass or anti-reflection glass or a transparent plastic sheet or an infrared filter.
Preferably, the circuit substrate is made of polybisamide azide resin, a glass fiber board, a high-temperature-resistant printed circuit board, a polyimide board or a ceramic circuit board.
The invention also provides an image sensing chip packaging method, which comprises the following steps: providing a circuit substrate; providing an image sensing chip, wherein the front surface of the image sensing chip is provided with a photosensitive area and a plurality of welding pads arranged around the photosensitive area; attaching the back surface of the image sensing chip to the circuit substrate, and electrically connecting the image sensing chip with the circuit substrate; providing a light-transmitting cover plate; arranging an optical transparent adhesive on the light-transmitting cover plate or the image sensing chip; arranging supporting glue dispensing on the circuit substrate and around the image sensing chip; the front of the image sensing chip is covered by the light-transmitting cover plate, the surface area of the light-transmitting cover plate is larger than that of the front of the image sensing chip, the front of the image sensing chip is completely covered by the light-transmitting cover plate, the optical transparent adhesive is located between the light-transmitting cover plate and the image sensing chip, the supporting adhesive is located between the circuit substrate and the light-transmitting cover plate, and the supporting adhesive surrounds the image sensing chip and supports the light-transmitting cover plate.
Preferably, after the light-transmitting cover plate is covered on the front surface of the image sensing chip, supporting adhesive dispensing is formed on the circuit substrate and around the image sensing chip in an adhesive dispensing manner.
Preferably, the method for packaging an image sensor chip further includes the following steps: curing the supporting adhesive; and forming a plastic package body on the circuit substrate, wherein the plastic package body surrounds the image sensing chip and the light-transmitting cover plate, and the plastic package body exposes the top surface of the light-transmitting cover plate.
The invention has the beneficial effects that: the surface area through setting up the printing opacity apron is greater than like the positive area of sensing chip, and the printing opacity apron covers the front of image sensing chip completely, has reduced the technology degree of difficulty that both counterpoint, and sets up the no cavity connected mode between the sensitization district of image sensing chip and the printing opacity apron, can carry out fine protection to the sensitization district. When the plastic package body is formed to seal and protect the image sensing chip, the light-transmitting cover plate can bear larger pressure to prevent the image sensing chip from being damaged, and the injection molding plastic package mold can directly act on the light-transmitting cover plate, so that the process is simple and the cost is reduced.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a schematic view of an image sensor chip package according to a first embodiment of the invention;
FIG. 2 is a diagram illustrating an image sensor chip package according to a second embodiment of the present invention;
FIG. 3 is a diagram illustrating an image sensor chip package according to a third embodiment of the present invention;
FIG. 4 is a diagram illustrating an image sensor chip package according to a fourth embodiment of the present invention;
FIGS. 5(a) -5 (f) are schematic structural diagrams illustrating a packaging process for forming the image sensor chip package structure shown in FIG. 1 according to the present invention;
fig. 6(a) -6 (g) are schematic structural diagrams illustrating a packaging process for forming the image sensor chip package structure shown in fig. 2 according to the present invention.
Detailed Description
The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following.
Fig. 1 is a schematic view of an image sensor chip package according to a first embodiment of the invention. The image sensor chip can be a CMOS image sensor chip or a charge coupled device.
The image sensing chip packaging structure comprises: a circuit substrate 10, an image sensor chip 20 and a transparent cover plate 30. The front surface of the image sensor chip 20 has a photosensitive area 21 and a plurality of bonding pads 22 disposed around the photosensitive area. The back surface of the image sensor chip 20 is attached to the circuit substrate 10, and the image sensor chip 20 is electrically connected to the circuit substrate 10. The transparent cover plate 30 covers the front surface of the image sensing chip 20, the surface area of the transparent cover plate 30 is larger than the area of the front surface of the image sensing chip 20, and the front surface of the image sensing chip 20 is completely covered by the transparent cover plate 30.
An optically transparent adhesive 40 is disposed between the image sensor chip 20 and the transparent cover plate 30, a supporting adhesive 50 is disposed between the circuit substrate 10 and the transparent cover plate 30, the supporting adhesive 50 surrounds the side surface of the image sensor chip 20, and the supporting adhesive 50 is used for supporting the transparent cover plate 30.
The image sensor chip 20 has a microlens array in a photosensitive region 21.
The optically transparent adhesive 40 may be an optical adhesive layer made of a single material, the refractive index of the optically transparent adhesive 40 is smaller than that of the light-transmitting cover 30, and preferably, the refractive index of the optically transparent adhesive 40 is similar to that of air.
The optical transparent adhesive layer 40 may also be formed by stacking a plurality of optical adhesive layers with different optical refractive indexes, wherein the first optical adhesive layer covers the microlens array of the image sensing chip 20, the second optical adhesive layer covers the first optical adhesive layer, the transparent cover plate covers the second optical adhesive layer, and the first optical adhesive layer and the second optical adhesive layer are combined to form the optical transparent adhesive layer 40. The refractive index of the second optical adhesive layer is smaller than that of the light-transmitting cover plate 30, and the refractive index of the first optical adhesive layer is smaller than that of the second optical adhesive layer, so that the incident light with large angle is totally reflected at the interface of the first optical adhesive layer and the second optical adhesive layer, and further the light with large angle oblique incidence is totally reflected, so that the micro-lens array has a better collimation effect, and the problem of crosstalk generated by detection results among different photosensitive pixels is avoided.
In the present embodiment, the optically transparent adhesive 40 completely covers the front surface of the image sensor chip 20, and a connection structure without a cavity is formed between the image sensor chip 20 and the transparent cover plate 30.
The supporting glue 50 may be an ultraviolet light curing glue or a thermal curing glue or an adhesive polyimide or amide resin. In the present embodiment, the supporting adhesive 50 is an ultraviolet light curing adhesive, so that the supporting adhesive 50 is in a gel state before being cured by the ultraviolet light.
The light-transmitting cover plate 30 is optical glass or anti-reflection glass or transparent plastic sheet or infrared filter.
The transparent cover 30 is fixed above the front surface of the image sensor chip 20 through the optically transparent adhesive 40 and the supporting dots 50, and since the hardness of the optically transparent adhesive 40 and the supporting dots 50 is lower than that of the transparent cover 30, the optically transparent adhesive 40 and the supporting dots 50 can relieve the stress applied to the transparent cover 30 from the outside of the image sensor chip package structure from transferring to the inside of the device, compared to the cavity structure in the prior art.
The circuit board 10 is made of a polyimide resin, a glass fiber board, a high temperature resistant printed circuit board, a polyimide board or a ceramic circuit board.
Referring to fig. 2, a schematic diagram of an image sensor chip package structure according to a second embodiment of the invention is shown, in which in the second embodiment, the optical transparent adhesive 40 'does not completely cover the front surface of the image sensor chip 20, and the optical transparent adhesive 40' covers the photosensitive area 21 of the image sensor chip 20, so that there is no cavity connection between the transparent cover plate 30 and the photosensitive area 21 of the image sensor chip 20. In order to improve the overall stability of the package structure, the supporting adhesive dots 50 ' surrounding the side surfaces of the image sensor chip 20 are formed by an adhesive dispensing process, and the supporting adhesive dots 50 ' are disposed between the circuit substrate 10 and the transparent cover plate 30 and fill the region between the transparent cover plate 30 and the image sensor chip 20, which is not filled with the optically transparent adhesive 40 ', so that the package structure has no cavity.
Referring to fig. 1, the circuit substrate 10 has a chip attachment region and a plurality of connection pads 11 disposed around the chip attachment region, the image sensor chip 20 is attached to the chip attachment region of the circuit substrate 10, and the bonding pads 22 of the image sensor chip 20 are electrically connected to the connection pads 11 on the circuit substrate 10 through metal wires 60.
The backside of the image sensor chip 20 may be bonded to the chip attachment region of the circuit substrate 10 by a glue, so that the image sensor chip 20 is bonded to the circuit substrate 10.
The surface area of the light-transmitting cover plate 30 is larger than the area of the front surface of the image sensing chip 20, further, when the light-transmitting cover plate 30 covers the front surface of the image sensing chip 20, the projection area of the light-transmitting cover plate 30 on the circuit substrate 10 covers the chip attachment area of the circuit substrate 10 and the plurality of connection pads 11 arranged around the chip attachment area, and when the image sensing chip 20 is electrically connected with the circuit substrate 10 through the metal wires, the projection area also covers the metal wires. The electrical connection structure between the image sensor chip 20 and the circuit substrate 10 is further protected.
The image sensor chip package structure further includes a plastic package body 70, the plastic package body 70 is disposed on the circuit substrate 10 and surrounds the image sensor chip 20 and the transparent cover plate 30, and the plastic package body 70 exposes a top surface of the transparent cover plate 30. The plastic package body 70 is formed on the circuit substrate 10 by a molding process (injection molding), and forms a flat structure having a flat top surface and a flat side surface, and the top surface of the plastic package body 70 and the top surface of the light-transmitting cover plate 30 are located on the same horizontal plane.
In the prior art, a cavity is formed between the light-transmitting cover plate and the image sensing chip, the size of the light-transmitting cover plate is smaller than or equal to that of the image sensing chip, the pressure bearing capacity of the light-transmitting cover plate is weaker, and in order to avoid the breakage of the light-transmitting cover plate, the light-transmitting cover plate cannot directly bear an injection molding plastic package mold, but the size of the light-transmitting cover plate 30 is larger than that of the image sensing chip 20, and no cavity is formed between the light-transmitting cover plate 30 and a light-sensing area of the image sensing chip 10, so that the plastic package body 70 with a flat structure can be directly formed in one step by adopting. The process is simple, and the production cost is saved.
In the third embodiment of the present invention, the plastic package body includes a first plastic package adhesive layer 71 and a second plastic package adhesive layer 72, the upper surface of the first plastic package adhesive layer 71 is uneven and lower than the top surface of the transparent cover plate 30, the second plastic package adhesive layer 72 covers the first plastic package adhesive layer 71, and the upper surface of the second plastic package adhesive layer 72 is flat and located on the same plane as the top surface of the transparent cover plate 30 and exposes the top surface of the transparent cover plate 30.
In the fourth embodiment of the present invention, the plastic package may not be performed by using a plastic package body, and the plastic package of the image sensing chip 20 is performed directly by the supporting glue 50 ″, specifically, in this embodiment, after the transparent cover plate 30 and the image sensing chip 20 are aligned and pressed, the photosensitive region 21 of the image sensing chip 20 is covered by the optically transparent adhesive 40 ', so that there is no cavity connection between the transparent cover plate 30 and the photosensitive region 21 of the image sensing chip 20, the front surface of the image sensing chip 20 is not completely covered by the optically transparent adhesive 40', and the supporting glue 50 ″ shown in fig. 4 is formed by a glue dispensing process or an injection molding process and cured. In the embodiment, the supporting adhesive dots 50 "surround the sides of the image sensor chip 20 and support the areas of the transparent cover 30 that are not overlapped with the image sensor chip 20, and the supporting adhesive dots 50" are filled in the areas of the transparent cover 30 that are overlapped with the image sensor chip 20, i.e., the areas of the transparent cover 30 that are overlapped with the image sensor chip 20 are filled with the optically transparent adhesive 40' and the supporting adhesive dots 50 ", so that the entire package structure of the image sensor chip 20 has no cavity.
The invention adopts a scale production process to form an image sensing chip packaging structure, the packaging structure shown in figure 1 or figure 2 or figure 3 or figure 4 is a small unit obtained after a cutting process, a related packaging process is usually carried out on a large-size circuit substrate, the large-size circuit substrate is formed by arranging the circuit substrates 10 shown in figure 1 or figure 2 or figure 3 or figure 4 in an array manner, a cutting area is arranged between the circuit substrate 10 and the adjacent circuit substrate 10 on the large-size circuit substrate, and the packaging structure shown in figure 1 or figure 2 or figure 3 or figure 4 is formed by cutting the large-size circuit substrate along the cutting area.
Fig. 5(a) to 5(f) are schematic structural diagrams illustrating a packaging process of forming the image sensor chip package structure shown in fig. 1 according to the present invention.
Referring to fig. 5(a), a circuit substrate 10 is provided, and in the mass production, a large-sized circuit substrate is provided, the large-sized circuit substrate is arranged by a plurality of circuit substrates 10 in an array, and a cutting area is provided between the circuit substrate 10 and the adjacent circuit substrate 10 on the large-sized circuit substrate. Only one circuit substrate 10 is shown in this embodiment.
The circuit substrate 10 has a chip attachment area and a plurality of connection pads 11 disposed around the chip attachment area.
The image sensing chip 20 is attached to the chip attachment region of the circuit substrate 10.
Referring to fig. 5(b), the bonding pad 22 of the image sensor chip 20 and the connecting pad 11 on the circuit substrate 10 are electrically connected by a wire bonding process through a metal wire 60.
Referring to fig. 5(c), supporting dots 50 are formed on the circuit substrate 10 by a dot dispensing process, and the supporting dots 50 surround the side surfaces of the image sensor chip 20.
The surface of the light-transmitting cover plate 30 is entirely coated with an optically transparent adhesive 40.
Referring to fig. 5(d), the transparent cover plate 30 and the front surface of the image sensor chip 20 are bonded together by a bonding process. So that the optically transparent adhesive 40 completely covers the front surface of the image sensor chip 20, and the supporting adhesive 50 supports the transparent cover 30.
In other embodiments of the present invention, in order to form the image sensor chip package structure as shown in fig. 1, the supporting adhesive dots 50 may be formed by an adhesive dispensing process after the transparent cover plate 30 and the image sensor chip 20 are aligned and pressed.
Referring to fig. 5(e), a plastic package body 70 is formed by an injection molding process, the plastic package body 70 is disposed on the circuit substrate 10 and surrounds the image sensor chip 20 and the transparent cover plate 30, and the plastic package body 70 exposes a top surface of the transparent cover plate 30. The plastic-sealed body 70 formed through the injection molding process has a flat top surface, and the top surface of the plastic-sealed body 70 and the top surface of the light-transmitting cover plate 30 are located on the same horizontal plane.
The support adhesive dots 50 are cured by a curing process before the molding compound 70 is formed.
Referring to fig. 5(f), a solder bump 80 is formed on the back surface of the circuit substrate 10 by a ball-bonding process.
The structure of the circuit board 10 is not particularly limited in the present invention, and the back surface of the circuit board 10 may be provided with the solder bump 80 for electrical connection with an external circuit, or may be provided with only a metal connection terminal without the solder bump 80 to achieve electrical connection with an external circuit through an SMT process.
And finally, cutting along the cutting area of the large-size circuit substrate by a cutting process to form the image sensing chip packaging structure shown in figure 1.
Fig. 6(a) to fig. 6(g) are schematic structural diagrams illustrating a packaging process of forming the image sensor chip package structure shown in fig. 2 according to the present invention.
Referring to fig. 6(a), a circuit substrate 10 is provided, and in the mass production, a large-sized circuit substrate is provided, the large-sized circuit substrate is arranged by a plurality of circuit substrates 10 in an array, and a cutting area is provided between the circuit substrate 10 and the adjacent circuit substrate 10 on the large-sized circuit substrate. Only one circuit substrate 10 is shown in this embodiment.
The circuit substrate 10 has a chip attachment area and a plurality of connection pads 11 disposed around the chip attachment area.
The image sensing chip 20 is attached to the chip attachment region of the circuit substrate 10.
Referring to fig. 6(b), the bonding pad 22 of the image sensor chip 20 and the connecting pad 11 on the circuit substrate 10 are electrically connected by a wire bonding process through a metal wire 60.
Referring to fig. 6(c), an optically transparent adhesive 40 'is formed on the photosensitive region 21 of the image sensor chip 20, but in other embodiments of the invention, the optically transparent adhesive 40' may be formed on the transparent substrate 30 in a region corresponding to the photosensitive region 21.
Referring to fig. 6(d), the transparent cover plate 30 and the front surface of the image sensor chip 20 are bonded together by a bonding process. So that there is no cavity between the transparent cover plate 30 and the photosensitive area 21 of the image sensor chip 20.
Referring to fig. 6(e), supporting dots 50 ' are formed on the circuit substrate 10 by a dispensing process, and the supporting dots 50 ' surround the side surfaces of the image sensor chip 20 and fill the region between the transparent cover plate 30 and the image sensor chip 20, which is not filled by the optically transparent adhesive 40 ', so that the package structure has no cavity. The support glue 50' supports the transparent cover plate 30.
Referring to fig. 6(f), an injection molding process is used to form a molding compound 70, the molding compound 70 is disposed on the circuit substrate 10 and surrounds the image sensor chip 20 and the transparent cover plate 30, and the molding compound 70 exposes a top surface of the transparent cover plate 30. The plastic-sealed body 70 formed through the injection molding process has a flat top surface, and the top surface of the plastic-sealed body 70 and the top surface of the light-transmitting cover plate 30 are located on the same horizontal plane.
Referring to fig. 6(g), a solder bump 80 is formed on the back surface of the circuit substrate 10 by a ball-bonding process.
And finally, cutting along the cutting area of the large-size circuit substrate by a cutting process to form the image sensing chip packaging structure shown in figure 1.
The invention is described above with reference to the accompanying drawings, it is obvious that the invention is not limited to the above embodiments, and it is within the scope of the invention to adopt various insubstantial modifications of the technical solution of the invention or to apply the concept and technical solution of the invention directly to other occasions without any modification.
Claims (14)
1. An image sensing chip package structure, comprising:
a circuit substrate;
the front surface of the image sensing chip is provided with a photosensitive area and a plurality of welding pads arranged around the photosensitive area, the back surface of the image sensing chip is attached to the circuit substrate, and the image sensing chip is electrically connected with the circuit substrate;
the image sensing chip packaging structure is characterized by further comprising:
the light-transmitting cover plate covers the front face of the image sensing chip, the surface area of the light-transmitting cover plate is larger than that of the front face of the image sensing chip, and the front face of the image sensing chip is completely covered by the light-transmitting cover plate;
the optical transparent adhesive is arranged between the light-transmitting cover plate and the image sensing chip and at least covers the photosensitive area;
and the supporting adhesive is arranged on the circuit substrate, surrounds the side edge of the image sensing chip and supports the light-transmitting cover plate.
2. The image sensor chip package of claim 1, wherein the transparent cover plate is connected to the image sensor chip without a cavity.
3. The image sensor chip package structure of claim 2, wherein an area where the image sensor chip and the transparent cover plate are stacked is entirely filled with an optically transparent adhesive.
4. The image sensor chip package structure of claim 2, wherein an area where the image sensor chip overlaps the transparent cover is filled with an optically transparent adhesive and the supporting dots.
5. The image sensor chip package of claim 4, wherein the support adhesive further surrounds the transparent cover plate and exposes a top surface of the transparent cover plate.
6. The image sensor chip package structure of claim 1, wherein the circuit substrate has a chip attachment region and a plurality of connection pads disposed around the chip attachment region, the image sensor chip is attached to the chip attachment region of the circuit substrate, and the pads are electrically connected to the connection pads via wires.
7. The image sensor chip package structure of claim 1, further comprising a molding compound disposed on the circuit substrate and surrounding the image sensor chip and the transparent cover plate, wherein the molding compound exposes a top surface of the transparent cover plate.
8. The image sensor chip package structure of claim 7, wherein the plastic package body includes a first plastic package adhesive layer and a second plastic package adhesive layer, the upper surface of the first plastic package adhesive layer is uneven and lower than the top surface of the light-transmitting cover plate, the second plastic package adhesive layer covers the first plastic package adhesive layer, the upper surface of the second plastic package adhesive layer is flat and is located on the same plane as the top surface of the light-transmitting cover plate, and the second plastic package adhesive layer exposes the top surface of the light-transmitting cover plate.
9. The image sensor chip package structure of claim 1, wherein the supporting adhesive is an ultraviolet light curable adhesive, a thermal curable adhesive, or an adhesive polyimide or amide resin.
10. The image sensor chip package structure of claim 1, wherein the transparent cover plate is made of optical glass, anti-reflective glass, transparent plastic sheet, or infrared filter.
11. The image sensor chip package structure of claim 1, wherein the circuit substrate is made of a polyimide, glass fiber, high temperature-resistant printed circuit board, polyimide or ceramic circuit board.
12. A method for packaging an image sensing chip, comprising:
providing a circuit substrate;
providing an image sensing chip, wherein the front surface of the image sensing chip is provided with a photosensitive area and a plurality of welding pads arranged around the photosensitive area;
attaching the back surface of the image sensing chip to the circuit substrate, and electrically connecting the image sensing chip with the circuit substrate;
providing a light-transmitting cover plate;
arranging an optical transparent adhesive on the light-transmitting cover plate or the image sensing chip;
arranging supporting glue dispensing on the circuit substrate and around the image sensing chip;
the front of the image sensing chip is covered by the light-transmitting cover plate, the surface area of the light-transmitting cover plate is larger than that of the front of the image sensing chip, the front of the image sensing chip is completely covered by the light-transmitting cover plate, the optical transparent adhesive is located between the light-transmitting cover plate and the image sensing chip, the supporting adhesive is located between the circuit substrate and the light-transmitting cover plate, and the supporting adhesive surrounds the image sensing chip and supports the light-transmitting cover plate.
13. The method of claim 12, wherein the transparent cover is applied over the front surface of the image sensor chip, and a support adhesive is applied to the circuit substrate around the image sensor chip by adhesive dispensing.
14. The method of claim 13, further comprising the steps of:
curing the supporting adhesive;
and forming a plastic package body on the circuit substrate, wherein the plastic package body surrounds the image sensing chip and the light-transmitting cover plate, and the plastic package body exposes the top surface of the light-transmitting cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910860503.9A CN110648981A (en) | 2019-09-11 | 2019-09-11 | Image sensing chip packaging structure and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910860503.9A CN110648981A (en) | 2019-09-11 | 2019-09-11 | Image sensing chip packaging structure and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110648981A true CN110648981A (en) | 2020-01-03 |
Family
ID=69010360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910860503.9A Pending CN110648981A (en) | 2019-09-11 | 2019-09-11 | Image sensing chip packaging structure and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110648981A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261647A (en) * | 2020-01-20 | 2020-06-09 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
| CN111883440A (en) * | 2020-07-30 | 2020-11-03 | 青岛歌尔微电子研究院有限公司 | Glue filling method, module packaging structure and electronic equipment |
| CN112645279A (en) * | 2020-12-23 | 2021-04-13 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
| CN112995480A (en) * | 2021-01-22 | 2021-06-18 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and electronic equipment |
| CN113241329A (en) * | 2021-04-30 | 2021-08-10 | 杭州光智元科技有限公司 | Three-dimensional packaging method and packaging structure of photoelectric chip |
| CN113511628A (en) * | 2021-08-10 | 2021-10-19 | 华天科技（西安）有限公司 | Manufacturing method of MEMS product based on grinding process |
| WO2023070443A1 (en) * | 2021-10-28 | 2023-05-04 | 深圳市大疆创新科技有限公司 | Diode chip packaging structure and method, distance measuring device, and movable platform |
-
2019
- 2019-09-11 CN CN201910860503.9A patent/CN110648981A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261647A (en) * | 2020-01-20 | 2020-06-09 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
| CN111261647B (en) * | 2020-01-20 | 2021-06-08 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
| CN111883440A (en) * | 2020-07-30 | 2020-11-03 | 青岛歌尔微电子研究院有限公司 | Glue filling method, module packaging structure and electronic equipment |
| CN112645279A (en) * | 2020-12-23 | 2021-04-13 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
| CN112645279B (en) * | 2020-12-23 | 2023-09-05 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
| CN112995480A (en) * | 2021-01-22 | 2021-06-18 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and electronic equipment |
| CN113161430A (en) * | 2021-01-22 | 2021-07-23 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and electronic equipment |
| CN113241329A (en) * | 2021-04-30 | 2021-08-10 | 杭州光智元科技有限公司 | Three-dimensional packaging method and packaging structure of photoelectric chip |
| CN113241329B (en) * | 2021-04-30 | 2022-06-17 | 杭州光智元科技有限公司 | Three-dimensional packaging method and packaging structure of photoelectric chip |
| US11789218B2 (en) | 2021-04-30 | 2023-10-17 | Hangzhou Guangzhiyuan Technology Co., Ltd. | Three-dimentional packaging method and package structure of photonic-electronic chip |
| CN113511628A (en) * | 2021-08-10 | 2021-10-19 | 华天科技（西安）有限公司 | Manufacturing method of MEMS product based on grinding process |
| WO2023070443A1 (en) * | 2021-10-28 | 2023-05-04 | 深圳市大疆创新科技有限公司 | Diode chip packaging structure and method, distance measuring device, and movable platform |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110648981A (en) | Image sensing chip packaging structure and packaging method thereof | |
| US7494292B2 (en) | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure | |
| KR100982270B1 (en) | Camera module of method for manufacuturing the same | |
| US20180240831A1 (en) | Solid-state imaging apparatus | |
| US7616250B2 (en) | Image capturing device | |
| US20100155917A1 (en) | Semiconductor device and method for fabricating the same | |
| TWI425825B (en) | Image sensor package structure with predetermined focus | |
| US20060216850A1 (en) | Microelectronic imaging units and methods of manufacturing microelectronic imaging units | |
| US20110096219A1 (en) | Image sensor package and method for manufacturing the same | |
| US7796188B2 (en) | Compact image sensor package and method of manufacturing the same | |
| US20060121184A1 (en) | Photocurable-resin application method and bonding method | |
| JPWO2008032404A1 (en) | Semiconductor device and manufacturing method thereof | |
| US20090256222A1 (en) | Packaging method of image sensing device | |
| TW200541063A (en) | Image pickup device and production method thereof | |
| US20140168510A1 (en) | Imaging element module and method for manufacturing the same | |
| JP2012222546A (en) | Solid-state imaging device, method for manufacturing the same, and electronic apparatus | |
| TWI467747B (en) | Solid photographic apparatus and method of manufacturing the same | |
| CN103378118A (en) | Electronic component, mounting member, electronic apparatus, and their manufacturing methods | |
| CN106449546B (en) | Image sensing chip packaging structure and packaging method thereof | |
| CN104078479A (en) | Wafer level encapsulation method for image sensor and encapsulation structure for image sensor | |
| JP2008277593A (en) | Circuit board, optical device employing the same, camera module, and manufacturing method for the circuit board | |
| CN210628284U (en) | Image sensing chip packaging structure | |
| TWI254997B (en) | Process of manufacturing flip-chips and the apparatus thereof | |
| JP2009123788A (en) | Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and photographic apparatus using the same solid-state imaging apparatus | |
| US20120098080A1 (en) | Method and package for an electro-optical semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |