CN113511628A - Manufacturing method of MEMS product based on grinding process - Google Patents
Manufacturing method of MEMS product based on grinding process Download PDFInfo
- Publication number
- CN113511628A CN113511628A CN202110911374.9A CN202110911374A CN113511628A CN 113511628 A CN113511628 A CN 113511628A CN 202110911374 A CN202110911374 A CN 202110911374A CN 113511628 A CN113511628 A CN 113511628A
- Authority
- CN
- China
- Prior art keywords
- glass
- optical chip
- grinding
- plastic package
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00317—Packaging optical devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a manufacturing method of an MEMS product based on a grinding process, which comprises the following steps of connecting a bonding pad to the upper end of a substrate, uniformly coating conductive adhesive on the bonding pad, adhering an optical chip through the conductive adhesive, and fixing the optical chip; connecting one end of a bonding wire with the optical chip, and connecting the other end of the bonding wire with the substrate; adhering glass to the transparent adhesive sheet, cutting the glass into the size required by a product, sucking the glass by using adhesive sheet equipment (the bottom surface of the glass is provided with the transparent adhesive sheet adhesive), and adhering the glass and the optical chip together by using the transparent adhesive sheet adhesive; the glass and the optical chip are both plastically packaged in a plastic package body, and the plastic package body is arranged on the substrate; the grinding amount is accurately controlled by the grinding equipment, the plastic package body is slowly ground in a grinding mode, the ground part is ground and removed until the glass is completely exposed from the plastic package body, and meanwhile, the glass is ground in a small amount, so that the surface of the glass cannot be incompletely exposed due to the fact that the glass inclines.
Description
Technical Field
The invention relates to the technical field related to integrated circuit packaging, in particular to a manufacturing method and a threading method of an MEMS product based on a grinding process.
Background
MEMS (Micro-Electro Mechanical system) heart rate sensor products in the packaging industry are fully called, and the glass of the MEMS products can be completely exposed to ensure that an optical chip below the glass can be completely transparent without influencing normal use; the existing MEMS exposed glass product adopts direct plastic package to expose glass, so that the upper surface of the glass is easy to have plastic package overflowing materials, the glass is easy to incline when being placed, and when a plastic package mold is closed, the glass is cracked, and the like, so that the risk is high.
Therefore, a method for manufacturing a MEMS product based on a grinding process is needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a manufacturing method of an MEMS product based on a grinding process, so as to solve the problems in the background technology.
In order to realize the purpose, the invention provides the following technical scheme: a manufacturing method of an MEMS product based on a grinding process comprises the following preparation steps:
the method comprises the following steps: connecting a bonding pad to the upper end of the substrate, uniformly coating a conductive adhesive on the bonding pad, adhering an optical chip through the conductive adhesive, and fixing the optical chip;
step two: connecting one end of a bonding wire with the optical chip, and connecting the other end of the bonding wire with an auxiliary bonding pad on the substrate;
step three: adhering glass to the transparent adhesive sheet, cutting the glass into the size required by a product, sucking the glass by using adhesive sheet equipment, and adhering the glass and the optical chip together by using the transparent adhesive sheet adhesive;
step four: the glass and the optical chip are both plastically packaged in a plastic package body, and the plastic package body is arranged on the substrate;
step five: and grinding the plastic package body from the upper end of the plastic package body by using grinding equipment, and grinding a small part of glass.
A manufacturing method of a MEMS product based on a grinding process comprises the following steps: glass, plastic-sealed body, optical chip, bonding wire, base plate, the part, transparent bonding film glue, conducting resin and the pad that grind and grind, the upper end of base plate is connected with the pad, the even coating in upper end of pad has conducting resin, the pad passes through conducting resin and bonds with optical chip, optical chip's upper end is evenly pasted and is had transparent bonding film glue, optical chip passes through transparent bonding film glue and bonds with glass, optical chip passes through the bonding wire and is connected with the supplementary pad on the base plate, glass and optical chip are sealed in the plastic-sealed body by the plastic, glass grinds the part that will grind through grinding device and gets rid of and make glass expose.
Preferably, the glass and the optical chip are of a packaging structure which is plastically packaged in the plastic package body, and the lower end of the plastic package body is bonded with the substrate in an adhering mode.
Preferably, the grinding-off part comprises a part of the plastic package body and the glass, so that the upper end of the glass completely leaks out.
Preferably, the area of the glass is smaller than that of the optical chip, the length and width of the glass are smaller than those of the optical chip, the area of the optical chip is smaller than that of the bonding pad, and the length and width of the optical chip are smaller than those of the bonding pad.
Preferably, the glass needs to be ground to a thickness of 50um, and the distance from the surface of the glass to the surface of the plastic package body is 80 um.
Compared with the prior art, the invention has the beneficial effects that:
1. the grinding amount is accurately controlled by grinding equipment, the plastic package body is slowly ground in a grinding mode until the glass is completely exposed out of the plastic package body, and simultaneously, a small amount of glass is ground, so that the surface of the glass cannot be incompletely exposed due to the fact that the glass is inclined;
2. the plastic package body with the thickness of 80 microns is plastically packaged at the upper end of the glass, so that the situation that the glass is cracked when a plastic package mold is closed due to the inclination of the glass is avoided, the problem of glass cracking is solved, the qualification rate of products is improved, the damage rate of the products in the processing process is reduced, the cost is saved, and the working efficiency is greatly improved.
Drawings
FIG. 1 is a schematic cross-sectional view of the structure of the exposed glass product packaging mechanism of the present invention;
FIG. 2 is a schematic structural view of the exposed glass product of the present invention before packaging;
FIG. 3 is a schematic diagram of a ground structure of the exposed glass product packaging mechanism of the present invention.
In the figure: 1. glass; 2. molding the body; 3. an optical chip; 4. a bonding wire; 5. a substrate; 6. grinding the ground-off portion; 7. transparent adhesive sheet glue; 8. a conductive adhesive; 9. and a bonding pad.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: the technical solution of the present patent will be described in further detail with reference to the following embodiments.
A manufacturing method of an MEMS product based on a grinding process comprises the following preparation steps:
the method comprises the following steps: connecting a bonding pad 9 to the upper end of the substrate 5, uniformly coating a conductive adhesive 8 on the bonding pad 9, bonding the optical chip 3 by using the conductive adhesive 8, and fixing the optical chip 3;
step two: connecting one end of a bonding wire 4 with the optical chip 3, and connecting the other end of the bonding wire 4 with an auxiliary bonding pad on the substrate 5;
step three: the glass 1 is adhered to the transparent adhesive sheet glue 7, then the glass 1 is cut into the size required by a product, the glass 1 is sucked up by the adhesive sheet equipment, the transparent adhesive sheet glue 7 is arranged on the bottom surface of the glass 1, and the glass 1 and the optical chip 3 are adhered together by the transparent adhesive sheet glue 7;
step four: the glass 1 and the optical chip 3 are both plastically packaged in a plastic package body 2, and the plastic package body 2 is arranged on a substrate 5;
step five: grinding treatment is carried out from the upper end of the plastic package body 2 through grinding equipment, and a small part of glass 1 is ground off at the same time.
A manufacturing method of a MEMS product based on a grinding process comprises the following steps: glass 1, plastic-sealed body 2, optical chip 3, bonding wire 4, base plate 5, the part 6 that grinds away, transparent bonding die glue 7, conducting resin 8 and pad 9, the upper end of base plate 5 is connected with pad 9, is provided with a plurality of pad 9 on the base plate 5, leaves the clearance between the pad 9, and be contactless between the adjacent pad 9 promptly.
The even coating in upper end of pad 9 has conducting resin 8, and pad 9 bonds with optical chip 3 through conducting resin 8, and conducting resin 8 is used for fixing optical chip 3 on pad 9, can play electrically conductive effect simultaneously, and the material of pad 9 is nickel palladium gold.
Transparent adhesive sheet glue 7 is uniformly pasted on the upper end of the optical chip 3, the optical chip 3 is bonded with the glass 1 through the transparent adhesive sheet glue 7, the area of the glass 1 is smaller than that of the optical chip 3, the length and the width of the glass 1 are smaller than those of the optical chip 3, the transparent adhesive sheet glue 7 is uniformly pasted, and the practical use function and the attractiveness in the later stage are not influenced.
Optical chip 3 is connected with the supplementary pad on the base plate 5 through bonding wire 4, glass 1 and optical chip 3 are in plastic envelope body 2 by the plastic envelope, glass 1 and optical chip 3 are the packaging structure by the plastic envelope in plastic envelope body 2, the lower extreme and the base plate 5 of plastic envelope body 2 combine, sealing connection between plastic envelope body 2 and the base plate 5, glass 1 needs to grind away 50 um's thickness, glass 1's surface is 80um to the surface distance of plastic envelope body 2, 3 one side of optical chip reserves width 300um and is used for the position of being connected with bonding wire 4, glass 1 need grind away 50um thickness and prevents that glass 1 is incomplete to expose, glass 1 thickness 500 um.
The part 6 that glass 1 will grind through grinding equipment and grind and remove and make glass 1 expose, and the part 6 that grinds away includes partial plastic-sealed body 2 and glass 1, makes the upper end of glass 1 leak completely, and the thickness of the part 6 that grinds away is 130 um.
According to the manufacturing method of the MEMS product based on the grinding process, the grinding amount is accurately controlled through grinding equipment, the plastic package body 2 is slowly ground in a grinding mode, the ground part 6 is ground and removed, the thickness of the ground part 6 is 130 micrometers, the glass 1 is completely exposed from the plastic package body 2, and meanwhile, a small amount of grinding is carried out on the glass 1, so that the surface of the glass 1 cannot be incompletely exposed due to the inclination of the glass 1, and the glass 1 is ensured to be completely exposed from the plastic package body 2.
The plastic package body 2 with the thickness of 80 microns is arranged at the upper end of the glass 1 in a plastic package mode, the condition that the glass 1 is fractured when a plastic package mold is closed due to the fact that the glass 1 inclines is avoided, the problem of glass 1 fracturing is solved, the qualified rate of products is improved, meanwhile, the damage rate of the products in the processing process is reduced, the cost is saved, and the working efficiency is greatly improved.
Connect a plurality of pad 9 on base plate 5 before the encapsulation earlier, pad 9 can the equidistance set up, the area of optical chip 3 is less than the area of pad 9, the length and the width of optical chip 3 are less than the length and the width of pad 9, conducting resin 8 on even coating on pad 9, bond together optical chip 3 and pad 9 firmly through conducting resin 8, be connected optical chip 3 and the supplementary pad on the base plate 5 through bonding wire 4, one deck transparent bonding glue 7 evenly pastes in optical chip 3's upper end, bond together glass 1 and optical chip 3 through transparent bonding glue 7, fix glass 1, rethread plastic packaging body 2 encapsulates glass 1 and optical chip 3, make the upper surface of plastic packaging body 2 be higher than glass 1 upper surface 80um, prevent to press fracture glass 1 when the plastic packaging mould compound die.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A manufacturing method of an MEMS product based on a grinding process is characterized in that: the preparation method comprises the following preparation steps:
the method comprises the following steps: connecting a bonding pad (9) to the upper end of the substrate (5), uniformly coating a conductive adhesive (8) on the bonding pad (9), bonding the optical chip (3) through the conductive adhesive (8), and fixing the optical chip (3);
step two: one end of a bonding wire (4) is connected with the optical chip (3), and the other end of the bonding wire (4) is connected with an auxiliary bonding pad on the substrate (5);
step three: the glass (1) is attached to the transparent sheet adhesive (7), then the glass (1) is cut into the size required by a product, the glass (1) is sucked up by sheet adhesive equipment, the transparent sheet adhesive (7) is arranged on the bottom surface of the glass (1), and the glass (1) and the optical chip (3) are adhered together by the transparent sheet adhesive (7);
step four: the glass (1) and the optical chip (3) are both plastically packaged in a plastic package body (2), and the plastic package body (2) is arranged on a substrate (5);
step five: grinding treatment is carried out from the upper end of the plastic package body (2) through grinding equipment, and a small part of glass (1) is ground off at the same time.
2. The method of claim 1, wherein the manufacturing method of the MEMS product based on the grinding process comprises: the method comprises the following steps: glass (1), a plastic package body (2), an optical chip (3), a bonding wire (4), a substrate (5), a ground part (6), transparent bonding glue (7), conductive glue (8) and a bonding pad (9), the upper end of the substrate (5) is connected with a bonding pad (9), the upper end of the bonding pad (9) is uniformly coated with conductive adhesive (8), the bonding pad (9) is bonded with the optical chip (3) through a conductive adhesive (8), transparent adhesive sheet glue (7) is uniformly adhered to the upper end of the optical chip (3), the optical chip (3) is bonded with the glass (1) through a transparent bonding sheet adhesive (7), the optical chip (3) is connected with an auxiliary bonding pad on the substrate (5) through a bonding wire (4), the glass (1) and the optical chip (3) are plastically packaged in the plastic package body (2), the glass (1) is grinded and removed by the grinding part (6) through grinding equipment, so that the glass (1) is exposed.
3. A method of manufacturing a MEMS product based on a grinding process according to claim 2, wherein: the glass (1) and the optical chip (3) are of a packaging structure which is plastically packaged in the plastic packaging body (2), and the lower end of the plastic packaging body (2) is bonded with the substrate (5) in an adhering mode.
4. A method of manufacturing a MEMS product based on a grinding process according to claim 2, wherein: the grinding-off part (6) comprises a part of plastic package body (2) and glass (1), so that the upper end of the glass (1) is completely leaked out.
5. A method of manufacturing a MEMS product based on a grinding process according to claim 2, wherein: the area of the glass (1) is smaller than that of the optical chip (3), the length and the width of the glass (1) are smaller than those of the optical chip (3), the area of the optical chip (3) is smaller than that of the bonding pad (9), and the length and the width of the optical chip (3) are smaller than those of the bonding pad (9).
6. A method of manufacturing a MEMS product based on a grinding process according to claim 2, wherein: glass (1) need grind away 50 um's thickness, the surface distance of the surface of glass (1) to plastic-sealed body (2) is 80 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110911374.9A CN113511628A (en) | 2021-08-10 | 2021-08-10 | Manufacturing method of MEMS product based on grinding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110911374.9A CN113511628A (en) | 2021-08-10 | 2021-08-10 | Manufacturing method of MEMS product based on grinding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113511628A true CN113511628A (en) | 2021-10-19 |
Family
ID=78068908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110911374.9A Pending CN113511628A (en) | 2021-08-10 | 2021-08-10 | Manufacturing method of MEMS product based on grinding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113511628A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050059188A1 (en) * | 2003-09-17 | 2005-03-17 | Bolken Todd O. | Image sensor packages and methods of fabrication |
| CN104658985A (en) * | 2013-11-22 | 2015-05-27 | 万国半导体(开曼)股份有限公司 | Ultrathin semiconductor device and preparation method |
| CN105206546A (en) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | Flip chip failure analysis method and preparation method of detection sample in electric property positioning |
| CN105529308A (en) * | 2015-11-09 | 2016-04-27 | 华天科技（西安）有限公司 | Fingerprint chip package structure with cushion block employing underfill technology and manufacturing method |
| CN106252311A (en) * | 2015-06-04 | 2016-12-21 | 艾马克科技公司 | Fingerprint sensing device and its manufacture method |
| CN106910720A (en) * | 2016-02-23 | 2017-06-30 | 深圳市汇顶科技股份有限公司 | The preparation method of encapsulating structure, electronic equipment and encapsulating structure |
| CN108417538A (en) * | 2018-03-16 | 2018-08-17 | 上海图正信息科技股份有限公司 | A kind of fingerprint sensor glass cover-plate packaging technology and structure |
| CN108496179A (en) * | 2017-04-12 | 2018-09-04 | 深圳市汇顶科技股份有限公司 | The packaging method of optical fingerprint sensor and optical fingerprint sensor |
| WO2018171099A1 (en) * | 2017-03-22 | 2018-09-27 | 中芯长电半导体（江阴）有限公司 | Encapsulation method for encapsulation structure with integrated power transmission chip |
| CN110648981A (en) * | 2019-09-11 | 2020-01-03 | 王之奇 | Image sensing chip packaging structure and packaging method thereof |
| CN210224023U (en) * | 2019-08-09 | 2020-03-31 | 星科金朋半导体（江阴）有限公司 | Packaging structure of formula of windowing chip |
| CN112349595A (en) * | 2019-08-09 | 2021-02-09 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
-
2021
- 2021-08-10 CN CN202110911374.9A patent/CN113511628A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050059188A1 (en) * | 2003-09-17 | 2005-03-17 | Bolken Todd O. | Image sensor packages and methods of fabrication |
| CN104658985A (en) * | 2013-11-22 | 2015-05-27 | 万国半导体(开曼)股份有限公司 | Ultrathin semiconductor device and preparation method |
| CN106252311A (en) * | 2015-06-04 | 2016-12-21 | 艾马克科技公司 | Fingerprint sensing device and its manufacture method |
| CN105206546A (en) * | 2015-09-10 | 2015-12-30 | 宜特(上海)检测技术有限公司 | Flip chip failure analysis method and preparation method of detection sample in electric property positioning |
| CN105529308A (en) * | 2015-11-09 | 2016-04-27 | 华天科技（西安）有限公司 | Fingerprint chip package structure with cushion block employing underfill technology and manufacturing method |
| CN106910720A (en) * | 2016-02-23 | 2017-06-30 | 深圳市汇顶科技股份有限公司 | The preparation method of encapsulating structure, electronic equipment and encapsulating structure |
| WO2018171099A1 (en) * | 2017-03-22 | 2018-09-27 | 中芯长电半导体（江阴）有限公司 | Encapsulation method for encapsulation structure with integrated power transmission chip |
| CN108496179A (en) * | 2017-04-12 | 2018-09-04 | 深圳市汇顶科技股份有限公司 | The packaging method of optical fingerprint sensor and optical fingerprint sensor |
| CN108417538A (en) * | 2018-03-16 | 2018-08-17 | 上海图正信息科技股份有限公司 | A kind of fingerprint sensor glass cover-plate packaging technology and structure |
| CN210224023U (en) * | 2019-08-09 | 2020-03-31 | 星科金朋半导体（江阴）有限公司 | Packaging structure of formula of windowing chip |
| CN112349595A (en) * | 2019-08-09 | 2021-02-09 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
| CN110648981A (en) * | 2019-09-11 | 2020-01-03 | 王之奇 | Image sensing chip packaging structure and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101131366B1 (en) | Production method of semiconductor device and bonding film | |
| JP4097403B2 (en) | Semiconductor device | |
| TWI234854B (en) | Flip chip-in-leadframe package and process | |
| US6620649B2 (en) | Method for selectively providing adhesive on a semiconductor device | |
| CN101186792B (en) | Heat-resistant adhesive tape for manufacturing semiconductor device | |
| CN106601629A (en) | Chip packaging structure with protection piece fitting chip sensing surface | |
| CN102263077A (en) | Double flat carrier-free pin-free IC chip packaging part | |
| CN117524891A (en) | High-power chip packaging bonding method and chip packaging piece | |
| CN113511628A (en) | Manufacturing method of MEMS product based on grinding process | |
| CN102237286A (en) | Tube core chip mounting method for ultrathin wafer process | |
| WO2016107298A1 (en) | Molding packaged mini mobile phone intelligent card, and packing method | |
| CN107564950A (en) | Wafer, semiconductor package assembly and a manufacturing method thereof | |
| CN209880652U (en) | LED structure of white wall of vertical reflection of light | |
| WO2021227045A1 (en) | Semiconductor packaging method and packaging structure thereof | |
| KR100220709B1 (en) | Method and apparatus for applying liquid adhesive to lead, and resulting adhesive layer structure for lead-on-chip(loc) type semiconductor chip package | |
| CN202196776U (en) | Flat carrier-free leadless pin exposed packaging part | |
| JP4207696B2 (en) | Manufacturing method of semiconductor package | |
| CN207265062U (en) | Wafer and wafer unit | |
| CN210778675U (en) | Light-emitting component | |
| CN117747586B (en) | Flexible film type chip packaging structure and packaging method | |
| CN213184260U (en) | Packaging structure of chip | |
| CN109192720A (en) | A kind of staircase stack chip-packaging structure and processing technology based on resin gasket | |
| CN210040173U (en) | Semiconductor packaging structure | |
| CN117511426B (en) | Film for packaging and blocking water vapor, semiconductor film packaging method and structure | |
| CN108831839B (en) | Method for removing burrs generated in semiconductor plastic packaging process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |