JP2004323621A - Adhesive material tape - Google Patents

Adhesive material tape Download PDF

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Publication number
JP2004323621A
JP2004323621A JP2003118286A JP2003118286A JP2004323621A JP 2004323621 A JP2004323621 A JP 2004323621A JP 2003118286 A JP2003118286 A JP 2003118286A JP 2003118286 A JP2003118286 A JP 2003118286A JP 2004323621 A JP2004323621 A JP 2004323621A
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JP
Japan
Prior art keywords
base material
adhesive
adhesive tape
reel
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003118286A
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Japanese (ja)
Inventor
Masahiro Arifuku
征宏 有福
Isao Tsukagoshi
功 塚越
Yasushi Goto
泰史 後藤
Naoki Fukushima
直樹 福嶋
Masami Yusa
正己 湯佐
Toshiyuki Yanagawa
俊之 柳川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2003118286A priority Critical patent/JP2004323621A/en
Priority to TW097143991A priority patent/TW200913829A/en
Priority to CNB038180847A priority patent/CN100548840C/en
Priority to KR1020107007008A priority patent/KR20100041890A/en
Priority to PCT/JP2003/009694 priority patent/WO2004011356A1/en
Priority to KR1020087012294A priority patent/KR20080064886A/en
Priority to KR1020107001127A priority patent/KR100953011B1/en
Priority to KR1020087019045A priority patent/KR20080075565A/en
Priority to KR1020067012929A priority patent/KR100700438B1/en
Priority to KR1020097017836A priority patent/KR100970800B1/en
Priority to KR1020077011959A priority patent/KR20070063606A/en
Priority to TW096139425A priority patent/TW200823137A/en
Priority to TW092120892A priority patent/TW200409405A/en
Priority to TW097143988A priority patent/TW200913828A/en
Priority to KR1020067012942A priority patent/KR100690379B1/en
Priority to KR1020087005685A priority patent/KR100981478B1/en
Priority to TW097143987A priority patent/TW200913827A/en
Priority to CN201410378540.3A priority patent/CN104152075B/en
Publication of JP2004323621A publication Critical patent/JP2004323621A/en
Pending legal-status Critical Current

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive material tape which increases the number of turns per reel and can improve the production efficiency of electronic equipment. <P>SOLUTION: In the adhesive material tape 1 coated on a base material, the base material 9 is composed of a metallic film or an aromatic polyamide film, the thickness of the base material 9 is 1 to 25 μm, the tensile strength at 25°C of the base material 9 is ≥300 MPa, the ratio of the base material 9 to the adhesive 11 is 0.01-1.0, and the surface roughness R<SB>max</SB>of the base material is ≤0.5 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品と回路基板、又は回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続する接着材テープに関し、特にリール状に巻かれた接着材テープに関する。
【０００２】
【従来の技術】
一般に、液晶パネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＬ（蛍光ディスプレイ）パネル、ペアチップ実装などの電子部品と回路基板、回路基板同士を接着固定し、両者の電極同士を電気的に接続する方法として、接着材テープが用いられている。
特許文献１には、基材に接着材が塗布された接着材テープをリール状に巻き取ったものが開示されている。
この種の従来の接着材テープは、幅が１〜３ｍｍ程度であり、リールに巻き取るテープの長さは５０ｍ程度であり、接着材テープは一度リールから巻き出されて接着剤を回路基板等に圧着した後は、再び使用されることがない。
【０００３】
【特許文献１】
特開２００１−２８４００５号公報
【０００４】
【発明が解決しようとする課題】
しかし、近年のＰＤＰ等におけるパネル画面の大型化にともない回路基板の接着面積が増大し、一度に使用する接着剤の使用量が増加してきた。また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、電子機器の製造工場では、接着材リールの交換頻度が多くなり、接着材リールの交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。
かかる問題に対して、リールに巻き取る接着材テープの巻き数を多くすることで、１リール当りの接着剤量を増やし、リールの交換頻度を低減することが考えられるが、接着材テープの厚さが厚いため、１リール当りの巻き数を増やし難い。
また、接着材テープの厚みを薄くすることが考えられるが、基材としてシリコン処理したＰＥＴ（ポリエチレンテレフタレート）が使用されているため、基材の厚みを薄くすると、基材の伸びや、切断などの不具合が生じ易くなるおそれがある。
そこで、本発明は、１リール当たりの巻き数を増やし、電子機器の生産効率の向上を図ることができる接着材テープの提供を目的とする。
【０００５】
【課題を解決するための手段】
前記課題を解決するために、請求項１に記載された発明は、基材に塗布された接着材テープであって、基材は金属フィルム又は芳香族ポリアミドフィルムからなることを特徴とする。
この請求項１に記載の発明では、接着材テープの基材を金属フィルム（又は金属箔）又は芳香族ポリアミドフィルムとすることで、基材の厚みを薄くした場合でも、基材が伸びや、切断などの不具合を防止できる。
よって、厚みの薄い基材からなる接着材テープを利用することで、１つのリール当たりの巻き数を多くすることができ、１リールで使用可能な接着剤量を増やすことができる。また、本発明の接着材テープを用いれば、１リール当たりの巻き数が多いので、電子部品の製造工場では、新しい接着材テープの交換回数が少なくて済み、作業効率が高まる。さらに、接着材テープの製造においては、製造するリール数を少なくできるので、リール材や湿気防止材の使用量を削減でき、製造コストを低減できる。
金属フィルムは、伸展性の高い金属が好ましく、銅、アルミニウム、ステンレス、鉄、錫などが用いられる。
芳香族ポリアミドフィルムは、具体的には、パラ系アラミドフィルム（ミクトロン；東レ株式会社製商品名）などが用いられる。
接着剤は、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系が用いられている。かかる樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、アクリル樹脂系、シリコン樹脂系が用いられる。
接着剤には、導電粒子が分散されていてもよい。導電粒子としては、Ａｕ，Ａｇ，Ｐｔ，Ｎｉ，Ｃｕ，Ｗ，Ｓｂ、Ｓｎ，はんだなどの金属粒子やカーボン、黒鉛などがあり、これら及び／または非導電性のガラス、セラミックス、プラスチック等の高分子核材等に、前記した導電層を被覆等により形成したものでもよい。さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子や、導電粒子と絶縁粒子の併用等も適用可能である。はんだ等の熱溶融金属や、プラスチック等の高分子核材に導電層を形成したものは、加熱加圧もしくは加圧により変形性を有し、接続後の電極間の距離が減少し、接続時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。
【０００６】
請求項２に記載された発明は、請求項１に記載の発明において、基材の厚さは１μｍ〜２５μｍであることを特徴とする。
基材の厚さを１μｍ〜２５μｍとしているのは、基材の厚さが１μｍ未満の場合には基材の十分な引張強さが得られず、切れ易くなるからである。また、基材の厚さが２５μｍを超える場合には、１リール当たりの巻き数について満足の得られる巻き数が得られ難いからである。
【０００７】
請求項３に記載された発明は、請求項１又は請求項２に記載の発明において、基材の引張強度は２５℃で３００ＭＰａ以上であることを特徴とする。
基材の引張強度を３００ＭＰａ以上としているのは、基材の引張強度が３００ＭＰａより小さいと、基材が伸びやすく、また接着材テープが切断し易くなるからである。
【０００８】
請求項４に記載された発明は、請求項１ないし請求項３のいずれかに記載の発明において、基材の接着剤に対する厚みの比が０．０１〜１．０であることを特徴とする。
基材の接着剤に対する厚みの比を０．０１〜１．０としているのは、基材の接着剤に対する厚みの比が０．０１未満の場合には、基材が薄すぎて接着材テープの強度が十分得られないからである。また、基材の接着剤に対する厚みの比が１．０を超えると、基材の厚みが厚くなりすぎて、１リール当たりの巻き数を多くできないからである。
【０００９】
請求項５に記載された発明は、請求項１ないし請求項４のいずれかに記載の発明において、基材の表面粗さＲｍａｘが０．５μｍ以下であることを特徴とする。
基材の表面粗さＲｍａｘを０．５μｍ以下としているのは、Ｒｍａｘが０．５μｍを超えると、基材の表面の凹凸により、回路基板に接着剤を圧着する際に接着剤が基材から分離し難くなるからである。
【００１０】
【発明の実施の形態】
以下に添付図面を参照しながら本発明の実施の形態について説明する。図１〜図５は、本発明の第１実施の形態を説明するものである。図１は第１実施の形態にかかる接着材テープの図であり、（ａ）は接着材リールを示す斜視図であり、（ｂ）は（ａ）におけるＡ−Ａ断面図であり、図２は接着装置における接着剤の圧着工程を示す概略図であり、図３は回路基板同士の接着を示す断面図であり、図４はＰＤＰにおける接着剤の使用状態を示す斜視図であり、図５は接着材テープの製造方法を示す工程図である。
【００１１】
接着材テープ１はリール３に巻かれたものであり、リール３には巻き芯５と接着材テープ１の両幅側に配置した側板７とが設けられている。
接着材テープ１は、基材９と、基材９の一側面に塗布された接着剤１１とから構成されている。
基材９には、銅フィルム（銅箔）を用いた。基材９の厚さ（図１（ｂ）中、Ｓで示す）は１０μｍ、基材９の２５℃での引張強度は５００ＭＰａ、基材９の接着剤１１に対する厚みの比（Ｓ／Ｔ）は、０．５とし、接着剤１１の厚さは２０μｍとした。基材９の表面粗さＲｍａｘは、０．２５μｍとした。
尚、基材９に芳香族ポリアミドフィルム（ミクトロン）を用いたものも作製した。基材９の厚さ、引張強度、基材９の接着剤１１に対する厚みの比（Ｓ／Ｔ）を夫々銅フィルムと同じように作製した。
【００１２】
次に、上述した接着材テープの使用方法について説明する。図２に示すように、接着装置１５に接着材テープ１のリール３と、巻取りリール１７とを装着し、リール３に巻いた接着材テープ１の先端をガイドピン２２に掛けて巻取りリール１７に取り付け、接着材テープ１を繰り出した（図２中矢印Ｅ）。そして、回路基板２１上に接着材テープ１を配置して、両リール３、１７間に配置された加熱加圧ヘッド１９で接着材テープ１を基材９側から圧接し、接着剤１１を回路基板２１に圧着した。その後、基材９を巻取りリール１７に巻き取った。
次に、図３に示すように、回路基板２１に圧着された接着剤１１に配線回路（又は電子部品）２３を配置して、クッション材としてポリテトラフルオロエチレン材２４を介して加熱加圧ヘッド１９により配線回路２３を回路基板２１に加熱加圧した。これにより回路基板２１の電極２１ａと配線回路２３との電極２３ａを接続した。
【００１３】
図４に本実施の形態による接着材テープ１を用いたＰＤＰ２６の接続部分を示すように、接着剤１１はＰＤＰの周囲全体に亘り圧着しており、一度に用いる接着剤１１の使用量が従来に比較して格段に多くなることが明らかである。したがって、リール３に巻いた接着材テープ１の使用量も多くなり、リール３に巻いた接着材テープ１は比較的短時間で巻取りリール１７に巻き取られ、リール３は空になる。
リール３が空になったところで、使用済みのリール３と新たなリールを入れ替えて、新たなリールを接着装置１５に装着した。そして、上述したように、接着剤１１を回路基板２１に圧着し、基材９を巻取りリール１７に巻き取る動作を繰り返した。
その結果、基材９に銅フィルムを用いたもの及び芳香族ポリアミドフィルムを用いたもの、何れにおいても従来の接着材テープ１と同様に取り扱い易く且つ基材９の伸びや切断もなかった。そして、基材１１の厚みが従来品（５０μｍ）と比べ薄くなっている分、接着材テープの巻き数が多くなり、リールの交換頻度が少なくなり生産性が向上した。
【００１４】
ここで、図５を参照して本実施の形態にかかる接着材テープ１の製造方法について説明する。
巻出機２５から巻き出された基材（セパレータ）にコーター２７により、樹脂と導電粒子１３が混合された接着剤１１を塗布し、乾燥炉２９で乾燥した後、巻取機３１で原反を巻き取る。巻き取られた接着材テープ１の原反は、スリッタ３３により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯５に側板７，７が両側から装着されて、除湿材とともに梱包され、好ましくは、低温（−５℃〜−１０℃）に管理されて出荷される。
尚、基材９の厚さが、４μｍ、２０μｍ、２５μｍの銅フィルム及び芳香族ポリアミドフィルムの場合についても、接着材テープ１を作製し、上述のように実際に使用してみたところ、基材９の伸びや、切断などの不具合が生じなかった。
また、基材９の接着剤１１に対する厚みの比（Ｓ／Ｔ）を、０．０１、０．０５、１．０とした銅フィルム及び芳香族ポリアミドフィルムの場合についても、接着材テープ１を作製し、上述のように実際に使用してみたところ、基材９の伸びや、切断などの不具合が生じなかった。
【００１５】
【発明の効果】
請求項１に記載の発明によれば、接着材テープの基材を金属フィルム又は芳香族ポリアミドフィルムとすることで、基材の厚みを薄くした場合でも、基材が伸びや、切断などの不具合を防止できる。
よって、厚みの薄い基材からなる接着材テープを利用することで、１つのリール当たりの巻き数を多くすることができ、１リールで使用可能な接着剤量を増やすことができる。また、本発明の接着材テープを用いれば、１リール当たりの巻き数が多いので、電子部品の製造工場では、新しい接着材テープの交換回数が少なくて済み、作業効率が高まる。さらに、接着材テープの製造においては、製造するリール数を少なくできるので、リール材や湿気防止材の使用量を削減でき、製造コストを低減できる。
【００１６】
請求項２に記載の発明によれば、請求項１に記載の発明と同様の効果を奏するとともに、薄く且つ引張強度の高い接着材テープが得られる。
請求項３に記載の発明によれば、請求項１又は請求項２に記載の発明と同様の効果を奏するとともに、基材の引張強度を３００ＭＰａ以上とすることで、基材が伸び難く、また切断し難い。
【００１７】
請求項４に記載の発明によれば、請求項１ないし請求項３のいずれかに記載の発明と同様の効果を奏するとともに、基材の接着剤に対する厚みの比を０．０１〜１．０にすることで、さらに薄く且つ引張強度の高い接着材テープが得られる。
請求項５に記載の発明によれば、請求項１ないし請求項４のいずれかに記載の発明と同様の効果を奏するとともに、基材の表面粗さＲｍａｘを０．５μｍ以下とすることで、基材の表面が平滑となり、回路基板に接着剤を圧着する際に接着剤が基材から分離しやすい。
【図面の簡単な説明】
【図１】第１実施の形態にかかる接着材テープを示す図であり、（ａ）は接着材テープがリールに巻かれた斜視図であり、（ｂ）は（ａ）におけるＡ−Ａ断面図である。
【図２】接着装置における接着剤の圧着工程を示す概略図である。
【図３】回路基板と配線回路（電子部品）との接着を示す断面図である。
【図４】ＰＤＰにおける接着剤の使用状態を示す斜視図である。
【図５】接着材テープの製造方法を示す工程図である。
【符号の説明】
１．接着材テープ、 ３．リール、 ５．巻き芯、 ７．側板、
９．基材、 １１．接着剤、 １３．導電粒子、 １５．接着装置、
１７．巻取りリール、 １９．加熱加圧ヘッド、 ２１．回路基板、
２２．ガイドピン、 ２３．配線回路（電子部品）、 ２５．巻出機、
２６．ＰＤＰ、 ２７．コーター、 ２９．乾燥炉、 ３１．巻取機、
３３．スリッタ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adhesive tape for adhesively fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape.
[0002]
[Prior art]
2. Description of the Related Art Generally, a method for bonding and fixing electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a pair chip to a circuit board and the circuit boards, and electrically connecting both electrodes to each other is as follows. Adhesive tape is used.
Patent Literature 1 discloses that an adhesive tape in which an adhesive is applied to a base material is wound in a reel shape.
The conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound on a reel is about 50 m, and the adhesive tape is once unwound from the reel to apply the adhesive to a circuit board or the like. After being crimped, it is not used again.
[0003]
[Patent Document 1]
JP 2001-284005 A
[Problems to be solved by the invention]
However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing factory, the frequency of exchanging the adhesive reel increases, and it takes time and effort to exchange the adhesive reel. Therefore, there is a problem that the production efficiency of the electronic device cannot be improved.
To solve this problem, it is conceivable to increase the amount of adhesive tape wound on the reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. It is difficult to increase the number of turns per reel because of the large thickness.
It is also conceivable to reduce the thickness of the adhesive tape. However, since silicon-treated PET (polyethylene terephthalate) is used as the base material, if the base material is thinned, elongation of the base material, cutting, etc. May easily occur.
Therefore, an object of the present invention is to provide an adhesive tape capable of increasing the number of windings per reel and improving the production efficiency of electronic devices.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention described in claim 1 is an adhesive tape applied to a substrate, wherein the substrate is made of a metal film or an aromatic polyamide film.
According to the first aspect of the present invention, the base material of the adhesive tape is made of a metal film (or a metal foil) or an aromatic polyamide film. Problems such as cutting can be prevented.
Therefore, by using an adhesive tape made of a thin base material, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. In addition, when the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency is improved. Further, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the amount of the reel material and the moisture prevention material used can be reduced, and the production cost can be reduced.
As the metal film, a metal having high extensibility is preferable, and copper, aluminum, stainless steel, iron, tin, or the like is used.
As the aromatic polyamide film, specifically, a para-aramid film (Mictron; trade name, manufactured by Toray Industries, Inc.) is used.
As the adhesive, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
Conductive particles may be dispersed in the adhesive. Examples of the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and / or non-conductive glass, ceramics, plastics, and the like. The above-mentioned conductive layer may be formed by coating the molecular nucleus material or the like. Furthermore, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. A conductive layer formed on a hot-melt metal, such as solder, or a polymer nucleus material, such as plastic, has deformability due to heating and pressurizing or pressurizing, and the distance between the electrodes after connection decreases. This is preferable because the contact area with the circuit is increased and the reliability is improved. Particularly when a polymer is used as a nucleus, it does not show a melting point like solder, so that a softened state can be widely controlled by a connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness is more preferable. .
[0006]
According to a second aspect of the present invention, in the first aspect, the base material has a thickness of 1 μm to 25 μm.
The reason why the thickness of the base material is 1 μm to 25 μm is that if the thickness of the base material is less than 1 μm, sufficient tensile strength of the base material cannot be obtained and the base material is easily cut. Further, when the thickness of the substrate exceeds 25 μm, it is difficult to obtain a satisfactory number of turns per reel.
[0007]
The invention described in claim 3 is the invention according to claim 1 or 2, wherein the tensile strength of the base material is 300 MPa or more at 25 ° C.
The reason why the tensile strength of the base material is 300 MPa or more is that if the tensile strength of the base material is smaller than 300 MPa, the base material is easily stretched and the adhesive tape is easily cut.
[0008]
The invention described in claim 4 is the invention according to any one of claims 1 to 3, wherein the ratio of the thickness of the base material to the adhesive is 0.01 to 1.0. .
The reason that the ratio of the thickness of the base material to the adhesive is 0.01 to 1.0 is that when the ratio of the thickness of the base material to the adhesive is less than 0.01, the base material is too thin and the adhesive tape is used. This is because sufficient strength cannot be obtained. Also, if the ratio of the thickness of the base material to the adhesive exceeds 1.0, the thickness of the base material becomes too thick, and the number of windings per reel cannot be increased.
[0009]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the surface roughness R max of the base material is 0.5 μm or less.
The reason for setting the surface roughness R max of the base material to 0.5 μm or less is that if the R max exceeds 0.5 μm, the adhesive base is used when the adhesive is pressed on the circuit board due to the unevenness of the surface of the base material. This is because it becomes difficult to separate from the material.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 to 5 illustrate a first embodiment of the present invention. FIG. 1 is a view of an adhesive tape according to a first embodiment, (a) is a perspective view showing an adhesive reel, (b) is a cross-sectional view taken along line AA in (a), and FIG. FIG. 3 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus, FIG. 3 is a cross-sectional view showing the bonding between circuit boards, FIG. 4 is a perspective view showing a use state of the adhesive in a PDP, and FIG. FIG. 4 is a process diagram showing a method for manufacturing an adhesive tape.
[0011]
The adhesive tape 1 is wound around a reel 3, and the reel 3 is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
The adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
As the substrate 9, a copper film (copper foil) was used. The thickness of the substrate 9 (indicated by S in FIG. 1B) is 10 μm, the tensile strength of the substrate 9 at 25 ° C. is 500 MPa, and the ratio of the thickness of the substrate 9 to the adhesive 11 (S / T). Was 0.5, and the thickness of the adhesive 11 was 20 μm. The surface roughness R max of the substrate 9 was set to 0.25 μm.
In addition, the thing using the aromatic polyamide film (microtron) for the base material 9 was also produced. The thickness and tensile strength of the substrate 9 and the ratio (S / T) of the thickness of the substrate 9 to the adhesive 11 were each produced in the same manner as the copper film.
[0012]
Next, a method of using the above-described adhesive tape will be described. As shown in FIG. 2, the reel 3 of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15, and the leading end of the adhesive tape 1 wound around the reel 3 is hung on the guide pin 22 to take up the take-up reel. 17 and the adhesive tape 1 was drawn out (arrow E in FIG. 2). Then, the adhesive tape 1 is disposed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, and the adhesive 11 is applied to the circuit. It was crimped to the substrate 21. Thereafter, the substrate 9 was wound on a take-up reel 17.
Next, as shown in FIG. 3, a wiring circuit (or an electronic component) 23 is arranged on the adhesive 11 which has been crimped to the circuit board 21, and a heating / pressing head is placed via a polytetrafluoroethylene material 24 as a cushion material. 19, the wiring circuit 23 was heated and pressed on the circuit board 21. Thus, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 were connected.
[0013]
As shown in FIG. 4, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive 11 is pressure-bonded over the entire periphery of the PDP, and the amount of the adhesive 11 used at one time is less than the conventional amount. It is clear that the number is much greater than Therefore, the amount of the adhesive tape 1 wound on the reel 3 is increased, and the adhesive tape 1 wound on the reel 3 is wound on the take-up reel 17 in a relatively short time, and the reel 3 is emptied.
When the reel 3 became empty, the used reel 3 was replaced with a new reel, and the new reel was mounted on the bonding device 15. Then, as described above, the operation of pressing the adhesive 11 against the circuit board 21 and winding the substrate 9 around the take-up reel 17 was repeated.
As a result, in both the case where the copper film was used as the base material 9 and the case where the aromatic polyamide film was used, as in the case of the conventional adhesive tape 1, the handling was easy and the base material 9 was not stretched or cut. Since the thickness of the base material 11 is smaller than that of the conventional product (50 μm), the number of windings of the adhesive tape is increased, the frequency of reel replacement is reduced, and the productivity is improved.
[0014]
Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
The adhesive 11 in which the resin and the conductive particles 13 are mixed is applied to the base material (separator) unwound from the unwinding machine 25 by the coater 27, dried in the drying furnace 29, and then rolled by the winding machine 31. Take up. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slitter 33 and wound on a core, and then the side plates 7, 7 are attached to the core 5 from both sides, and packed together with a dehumidifying material. Preferably, it is shipped at a controlled low temperature (−5 ° C. to −10 ° C.).
In addition, when the thickness of the base material 9 was 4 μm, 20 μm, and 25 μm for a copper film and an aromatic polyamide film, the adhesive tape 1 was produced and actually used as described above. No troubles such as elongation of 9 and cutting occurred.
Also, in the case of a copper film and an aromatic polyamide film in which the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 was 0.01, 0.05, and 1.0, the adhesive tape 1 was used. When fabricated and actually used as described above, problems such as elongation of the base material 9 and cutting did not occur.
[0015]
【The invention's effect】
According to the first aspect of the present invention, the base material of the adhesive tape is a metal film or an aromatic polyamide film, so that even when the thickness of the base material is reduced, the base material may be stretched or cut. Can be prevented.
Therefore, by using an adhesive tape made of a thin base material, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. In addition, when the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency is improved. Further, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the amount of the reel material and the moisture prevention material used can be reduced, and the production cost can be reduced.
[0016]
According to the second aspect of the invention, the same effect as that of the first aspect of the invention can be obtained, and an adhesive tape that is thin and has high tensile strength can be obtained.
According to the third aspect of the invention, the same effects as those of the first or second aspect of the invention are obtained, and the tensile strength of the base material is set to 300 MPa or more, so that the base material is hardly stretched. Hard to cut.
[0017]
According to the invention as set forth in claim 4, the same effects as those of the invention as set forth in any one of claims 1 to 3 are obtained, and the ratio of the thickness of the base material to the adhesive is set to 0.01 to 1.0. By doing so, a thinner adhesive tape having a higher tensile strength can be obtained.
According to the invention as set forth in claim 5, the same effect as the invention as set forth in any one of claims 1 to 4 is exerted, and the surface roughness R max of the base material is set to 0.5 μm or less. In addition, the surface of the substrate becomes smooth, and the adhesive is easily separated from the substrate when the adhesive is pressed on the circuit board.
[Brief description of the drawings]
FIGS. 1A and 1B are views showing an adhesive tape according to a first embodiment, wherein FIG. 1A is a perspective view in which the adhesive tape is wound around a reel, and FIG. FIG.
FIG. 2 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
FIG. 3 is a cross-sectional view showing adhesion between a circuit board and a wiring circuit (electronic component).
FIG. 4 is a perspective view showing a use state of an adhesive in a PDP.
FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
[Explanation of symbols]
1. 2. adhesive tape; Reel, 5. 6. winding core; Side plate,
9. 10. a substrate; Adhesive, 13. 14. conductive particles; Bonding equipment,
17. Take-up reel, 19. Heating and pressing head, 21. Circuit board,
22. Guide pin, 23. 25. wiring circuit (electronic component); Unwinder,
26. PDP, 27. Coater, 29. Drying oven, 31. Winder,
33. Slitter

Claims (5)

基材に塗布された接着材テープであって、基材は金属フィルム又は芳香族ポリアミドフィルムからなることを特徴とする接着材テープ。An adhesive tape applied to a substrate, wherein the substrate is made of a metal film or an aromatic polyamide film. 基材の厚さは１μｍ〜２５μｍであることを特徴とする請求項１に記載の接着材テープ。The adhesive tape according to claim 1, wherein the thickness of the base material is 1 m to 25 m. 基材の引張強度は２５℃で３００ＭＰａ以上であることを特徴とする請求項１又は請求項２に記載の接着材テープ。The adhesive tape according to claim 1, wherein the base material has a tensile strength of 300 MPa or more at 25 ° C. 4. 基材の接着剤に対する厚みの比が０．０１〜１．０であることを特徴とする請求項１ないし請求項３のいずれかに記載の接着材テープ。The adhesive tape according to any one of claims 1 to 3, wherein a ratio of a thickness of the base material to the adhesive is 0.01 to 1.0. 基材の表面粗さＲｍａｘが０．５μｍ以下であることを特徴とする請求項１ないし請求項４のいずれかに記載の接着材テープ。The adhesive tape according to any one of claims 1 to 4, wherein the substrate has a surface roughness R max of 0.5 µm or less.
JP2003118286A 2002-07-30 2003-04-23 Adhesive material tape Pending JP2004323621A (en)

Priority Applications (18)

Application Number Priority Date Filing Date Title
JP2003118286A JP2004323621A (en) 2003-04-23 2003-04-23 Adhesive material tape
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel
CNB038180847A CN100548840C (en) 2002-07-30 2003-07-30 The method of attachment of adhesive material tape connector and adhesive material tape
KR1020107007008A KR20100041890A (en) 2002-07-30 2003-07-30 Adhesive material tape
PCT/JP2003/009694 WO2004011356A1 (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape
KR1020087012294A KR20080064886A (en) 2002-07-30 2003-07-30 Adhesive material tape
KR1020107001127A KR100953011B1 (en) 2002-07-30 2003-07-30 Method of producing adhesive material tape
KR1020087019045A KR20080075565A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020067012929A KR100700438B1 (en) 2002-07-30 2003-07-30 Anisotropic electroconductive tape
KR1020097017836A KR100970800B1 (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
KR1020077011959A KR20070063606A (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020067012942A KR100690379B1 (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette
KR1020087005685A KR100981478B1 (en) 2002-07-30 2003-07-30 Connecting structure
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN201410378540.3A CN104152075B (en) 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor

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JP2012182490A (en) * 2012-05-30 2012-09-20 Sony Chemical & Information Device Corp Manufacturing method for solar cell
JP2015524923A (en) * 2012-07-31 2015-08-27 エレクトリシテ・ドゥ・フランス Sealing cracks in a nuclear facility pool using robots
US10522258B2 (en) 2012-07-31 2019-12-31 Electricite De France Sealing of a crack in a pool of a nuclear facility, using a robot

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