JP4434281B2 - Adhesive tape connection method and adhesive tape connector - Google Patents

Adhesive tape connection method and adhesive tape connector Download PDF

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Publication number
JP4434281B2
JP4434281B2 JP2008004826A JP2008004826A JP4434281B2 JP 4434281 B2 JP4434281 B2 JP 4434281B2 JP 2008004826 A JP2008004826 A JP 2008004826A JP 2008004826 A JP2008004826 A JP 2008004826A JP 4434281 B2 JP4434281 B2 JP 4434281B2
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Prior art keywords
adhesive tape
adhesive
silicone
reel
tape
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JP2008156126A (en
Inventor
正己 湯佐
俊之 柳川
征宏 有福
功 塚越
泰史 後藤
直樹 福嶋
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5042—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like covering both elements to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like
    • B29C65/5021—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5092—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the tape handling mechanisms, e.g. using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4622—Abutting article or web portions, i.e. edge to edge
    • B65H2301/46222—Abutting article or web portions, i.e. edge to edge involving double butt splice, i.e. adhesive tape applied on both sides of the article or web portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
    • B65H2301/4631—Adhesive tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Replacement Of Web Rolls (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

本発明は、電子部品と回路基板、又は回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続する接着剤テープに関し、特にリール状に巻かれた接着剤テープの接続方法、及び接着剤テープ接続体に関する。   The present invention relates to an adhesive tape that bonds and fixes an electronic component and a circuit board, or circuit boards, and electrically connects both electrodes, and in particular, a method for connecting an adhesive tape wound in a reel shape, and The present invention relates to an adhesive tape connector.

一般に、液晶パネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＬ（蛍光ディスプレイ）パネル、ベアチップ実装などの電子部品と回路基板、回路基板同士を接着固定し、両者の電極同士を電気的に接続する方法として、接着剤テープが用いられている。
特許文献１には、基材に接着剤が塗布された接着剤テープをリール状に巻き取ったものが開示されている。
この種の従来の接着剤テープは、幅が１〜３ｍｍ程度であり、リールに巻き取るテープの長さは５０ｍ程度である。
接着剤テープを接着装置に装着する場合、接着剤テープのリール（以下、単に「接着剤リールという」）を接着装置に取り付け、接着剤テープの始端部を引き出して、巻取りリールに取り付ける。接着剤リールの装着後、接着剤リールから巻き出された接着剤テープの基材側から加熱加圧ヘッドで接着剤を回路基板等に圧着し、残った基材を巻取りリールに巻き取っている。
そして、接着剤リールの接着剤テープが終了すると、終了したリールと、基材を巻き取った巻取りリールを外し、新たな巻取りリールと新たな接着剤リールを接着装置に装着し、接着剤テープを接着装置のガイドに掛けるとともに始端を巻取りリールに取り付けている。 In general, as a method of bonding and fixing an electronic component such as a liquid crystal panel, PDP (plasma display panel), EL (fluorescent display) panel, bare chip mounting, etc., a circuit board, and circuit boards, and electrically connecting both electrodes, Adhesive tape is used.
Patent Document 1 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive in a reel shape.
This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around the reel is about 50 m.
When the adhesive tape is attached to the adhesive device, the reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) is attached to the adhesive device, the starting end of the adhesive tape is pulled out and attached to the take-up reel. After mounting the adhesive reel, press the adhesive onto the circuit board with a heating and pressure head from the base of the adhesive tape unwound from the adhesive reel, and wind up the remaining base on the take-up reel. Yes.
When the adhesive tape on the adhesive reel is finished, the finished reel and the take-up reel on which the base material has been taken up are removed, and a new take-up reel and a new adhesive reel are mounted on the adhesive device. The tape is hung on the guide of the bonding apparatus and the start end is attached to the take-up reel.

特開２００１−２８４００５号公報JP 2001-284005 A

しかし、近年のＰＤＰ等におけるパネル画面の大型化にともない回路基板の接着面積が増大し、一度に使用する接着剤の使用量が増加してきた。また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、電子機器の製造工場では、接着剤リールの交換頻度が多くなり、接着剤リールの交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。
かかる問題に対して、リールに巻き取る接着剤テープの巻き数を多くすることで、１リール当りの接着剤量を増やし、リールの交換頻度を低減することが考えられるが、接着剤テープのテープ幅が１〜３ｍｍと狭いため、巻き数を多くすると巻き崩れが生じるおそれがある。また、巻き数を多くするとテープ状に巻いた接着剤テープに作用する圧力が高くなり接着剤がテープの両幅から染み出してブロッキングの原因になるおそれがある。
更に、接着剤テープの巻き数を増やすと、リールの径寸法も大きくなり、既存の接着装置に装着し難く、既存の接着装置が使用できなくなるおそれがある。
一方、接着剤テープと接着剤テープを粘接着剤テープで貼り付けようとしても十分な接着力で接着することができなかった。これは、接着剤テープに、接着剤との剥離性を良好とするためフッ素系離型剤やシリコーン系離型剤等が塗布され、その影響によるためである。
そこで、本発明は、特に接着剤テープの基材がシリコーン処理された基材を用いている場合でも、接着剤リールの交換が簡単にでき、電子機器の生産効率の向上を図ることができる接着剤テープの接続方法、及びその製造方法により製造される接着剤テープ接続体の提供を目的とする。 However, with the recent increase in panel screen size in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive used at one time has increased. Moreover, since the use of adhesives has expanded, the amount of adhesives used has increased. For this reason, there is a problem in the electronic device manufacturing factory that the frequency of replacement of the adhesive reel is increased, and it takes time to replace the adhesive reel, so that the production efficiency of the electronic device cannot be improved.
To deal with this problem, it is conceivable to increase the number of adhesive tapes wound around the reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. Since the width is as narrow as 1 to 3 mm, if the number of windings is increased, collapse may occur. Further, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape and cause blocking.
Furthermore, when the number of windings of the adhesive tape is increased, the reel diameter is also increased, and it is difficult to mount the reel on the existing bonding apparatus, and the existing bonding apparatus may not be usable.
On the other hand, even if it was going to stick an adhesive tape and an adhesive tape with an adhesive tape, it was not able to adhere with sufficient adhesive force. This is because a fluorine-based release agent, a silicone-based release agent, or the like is applied to the adhesive tape in order to improve the releasability from the adhesive, and the influence thereof.
Therefore, the present invention provides an adhesive that can easily replace the adhesive reel and improve the production efficiency of electronic equipment, even when the base of the adhesive tape is a silicone-treated base. It is an object of the present invention to provide a method for connecting an adhesive tape and an adhesive tape connector manufactured by the manufacturing method.

前記課題を解決するために、本発明（１）は、電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープと他方のリールに巻いた他方の接着剤テープとを接続する接着剤テープの接続方法であって、一方の接着剤テープの終端部と他方の接着剤テープの始端部を重ね合わせ又は突き合せて、両接着剤テープのシリコーン処理基材の表面に跨る部分をシリコーン粘着テープで貼り付けて両接着剤テープを接続することを特徴とする。
本発明（１）では、一方の接着剤テープを巻いた接着剤リールと接着剤テープの基材のみを巻き取る巻取りリールが接着装置に装着してあり、接着剤リールの接着剤テープが終了したときに、終了した接着剤テープ（一方の接着剤テープ）の終端部と、新たに装着する接着剤リールの接着剤テープ（他方の接着剤テープ）の始端部とをシリコーン粘着テープで接続して、終了した接着剤リールに換えて新たな接着剤リールを接着装置に装着する。
本発明では、終了した接着剤テープと新たな接着剤テープとを接続してリールの交換を行うだけなので、接着装置への新たな接着剤リールの装着が簡単にできる。また、新たな接着剤リールの交換毎に巻取りリールの交換や、新規接着剤テープの始端を巻取りリールに取り付けたり、接着剤テープをガイドに掛ける作業が必要ないので、新しい接着剤リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
接着剤テープの基材はシリコーンで表面処理してあり、用いる粘着テープにもシリコーン粘着剤を用いることにより、両者の表面張力の差を小さくして密着力を高めているので、従来困難であった両者の接着を実現できる。
接着剤テープの接着剤は、絶縁性接着剤中に導電粒子を分散した異方導電性接着であってもよいし、絶縁性接着剤のみであってもよいし、これらの接着剤中に絶縁性のスペーサ粒子を分散したものであってもよい。 In order to solve the above-mentioned problems, the present invention (1) is characterized in that an adhesive tape for electrode connection is applied to a silicone-treated substrate, and one adhesive tape wound around one reel and the other wound around the other reel. A method for connecting an adhesive tape to the other adhesive tape, in which the end portion of one adhesive tape and the start end portion of the other adhesive tape are overlapped or butted together, and the silicone treatment of both adhesive tapes A part straddling the surface of the base material is attached with a silicone adhesive tape, and both adhesive tapes are connected.
In the present invention (1), an adhesive reel wound with one adhesive tape and a take-up reel that winds only the base material of the adhesive tape are mounted on the adhesive device, and the adhesive tape of the adhesive reel is finished. When finished, connect the end of the finished adhesive tape (one adhesive tape) and the beginning of the adhesive tape (the other adhesive tape) of the newly installed adhesive reel with silicone adhesive tape. Then, in place of the completed adhesive reel, a new adhesive reel is mounted on the bonding apparatus.
In the present invention, since the completed adhesive tape and the new adhesive tape are simply connected and the reel is exchanged, the new adhesive reel can be easily attached to the bonding apparatus. In addition, it is not necessary to replace the take-up reel every time a new adhesive reel is replaced, or to attach the starting edge of the new adhesive tape to the take-up reel or to hang the adhesive tape on the guide. The replacement time is short, and the production efficiency of electronic equipment is increased.
The adhesive tape base material is surface-treated with silicone, and silicone adhesive is also used for the adhesive tape to be used, thereby reducing the difference in surface tension between the two and increasing the adhesive force. Adhesion between the two can be realized.
The adhesive of the adhesive tape may be anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be insulated in these adhesives. Alternatively, dispersed spacer particles may be dispersed.

本発明（２）は、本発明（１）のシリコーン粘着テープにおいて、その粘着剤面の表面張力と接着剤テープのシリコーン処理基材の表面張力との差を１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下とすることを特徴とする。
この本発明（２）によれば、本発明（１）と同様な作用効果を奏するとともに、シリコーン粘着テープにおける粘着剤面の表面張力と接着剤テープにおけるシリコーン処理基材の表面張力との差を１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下とすることにより、強い密着力を得ることができ、両者を確実に接着できる。表面張力は、濡れ試薬や接触角で測定することができる。
接着剤テープのシリコーン処理基材とシリコーン粘着テープの粘着剤面との表面張力の差は、好ましくは０〜５ｍＮ／ｍ（５ｄｙｎｅ／ｃｍ）である。表面張力の差は小さいほどよく、１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）を超えて大きくすると充分な密着強度が得られないおそれがあるからである。 The present invention (2) is the silicone pressure-sensitive adhesive tape of the present invention (1), wherein the difference between the surface tension of the pressure-sensitive adhesive surface and the surface tension of the silicone-treated substrate of the adhesive tape is 10 mN / m (10 dyne / cm) or less. It is characterized by.
According to the present invention (2), the same effect as that of the present invention (1) is obtained, and the difference between the surface tension of the pressure-sensitive adhesive surface in the silicone pressure-sensitive adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape is determined. By setting it to 10 mN / m (10 dyne / cm) or less, strong adhesion can be obtained, and both can be securely bonded. The surface tension can be measured by a wet reagent or a contact angle.
The difference in surface tension between the silicone-treated substrate of the adhesive tape and the pressure-sensitive adhesive surface of the silicone pressure-sensitive adhesive tape is preferably 0 to 5 mN / m (5 dyne / cm). The difference in surface tension is preferably as small as possible, and if it exceeds 10 mN / m (10 dyne / cm), sufficient adhesion strength may not be obtained.

本発明（３）は、本発明（２）において、シリコーン粘着テープは、接着力が１００ｇ／２５ｍｍ以上であることを特徴とする。
この本発明（３）によれば、本発明（２）と同様な作用効果を奏するとともに、一方及び他方の接着剤テープの接続において、両者の接着剤面にもシリコーン粘着テープを張り付けて接着できるので、一方及び他方の接着剤テープを両面から接着（又は密着）することにより、高い強度で接着できる。
特に、接着力を１００ｇ／２５ｍｍ以上とすることにより、一方及び他方の接着剤テープの両接着剤面との接着をより強固におこなうことができる。
接着強度は、大きければ強い接着強度を得ることができるが、１００ｇ／２５ｍｍよりも小さいと所定の強度が得られないおそれがある。 The present invention (3) is characterized in that, in the present invention (2), the silicone adhesive tape has an adhesive strength of 100 g / 25 mm or more.
According to the present invention (3), the same operational effects as those of the present invention (2) can be obtained, and at the time of connection of one and the other adhesive tape, the adhesive surface of both can be adhered with a silicone adhesive tape. Therefore, it can adhere | attach with high intensity | strength by adhere | attaching (or adhering) one and the other adhesive tape from both surfaces.
In particular, by setting the adhesive force to be 100 g / 25 mm or more, it is possible to more firmly bond the both adhesive surfaces of one and the other adhesive tapes.
If the adhesive strength is high, strong adhesive strength can be obtained, but if it is less than 100 g / 25 mm, there is a possibility that a predetermined strength cannot be obtained.

本発明（４）は、本発明（３）において、本発明（３）のシリコーン粘着テープを、一方の接着剤テープの終端部と他方の接着剤テープの始端部を重ね合わせ又は突き合せて、両接着剤テープの両面に亘って張り付けて接続することを特徴とする。
本発明（４）によれば、本発明（３）と同様な作用効果を奏するとともに、一方と他方の接着剤テープをその両面で接続するので、更に強固な接続を得ることができる。 In the present invention (4), in the present invention (3), the silicone adhesive tape of the present invention (3) is overlapped or butted with the end portion of one adhesive tape and the start end portion of the other adhesive tape, It is characterized in that both adhesive tapes are pasted and connected across both surfaces.
According to this invention (4), while having the same effect as this invention (3), since one and the other adhesive tape are connected on both surfaces, a still stronger connection can be obtained.

本発明（５）（請求項１に係る発明）は、電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープと他方のリールに巻いた他方の接着剤テープとを接続する接着剤テープの接続方法であって、一方の接着剤テープの終端部と他方の接着剤テープの始端部との間にシリコーン粘着剤を両面に塗布したシリコーン粘着テープを、一方及び他方の接着剤テープのうちどちらかがシリコーン処理基材側で、それ以外の接着剤テープが接着剤側で接続されるように挟んで両接着剤テープを接続し、両面のシリコーン粘着剤はシリコーン基材の表面張力との差が１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下で、且つ接着力が１００ｇ／２５ｍｍ以上としていることを特徴とする。
本発明（５）によれば、両面粘着剤のシリコーン粘着テープを用いているので、一方と他方の接着剤テープ間に両面シリコーン粘着テープを挟んで両者を接着（又は密着）できるから、両者の接続が簡単且つ容易である。
本発明（６）は、電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープの終端部と、他方のリールに巻いた他方の接着剤テープの始端部とを接続する接続部分を有する接着剤テープ接続体であって、上記接続部分は、一方の接着剤テープの終端部と他方の接着剤テープの始端部を重ね合わせ又は突き合せて、両接着剤テープのシリコーン処理基材の表面に跨る部分をシリコーン粘着テープで貼り付けて両接着剤テープを接続することにより設けられていることを特徴とする。
本発明（７）（請求項２に係る発明）は、電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープの終端部と、他方のリールに巻いた他方の接着剤テープの始端部とを接続する接続部分を有する接着剤テープ接続体であって、上記接続部分は、一方の接着剤テープの終端部と他方の接着剤テープの始端部との間にシリコーン粘着剤を両面に塗布したシリコーン粘着テープを、一方及び他方の接着剤テープのうちどちらかがシリコーン処理基材側で、それ以外の接着剤テープが接着剤側で接続されるように挟んで両接着剤テープを接続することにより設けられており、両面のシリコーン粘着剤はシリコーン処理基材の表面張力との差が１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下で、且つ接着力が１００ｇ／２５ｍｍ以上であることを特徴とする。 According to the present invention (5) (the invention according to claim 1), an adhesive tape for electrode connection is applied to a silicone-treated substrate, and one adhesive tape wound on one reel and the other wound on the other reel. A method for connecting an adhesive tape to a first adhesive tape, wherein a silicone adhesive is applied on both sides between a terminal portion of one adhesive tape and a starting end portion of the other adhesive tape. The two adhesive tapes are connected so that either one of the adhesive tape and the other adhesive tape is connected on the silicone-treated substrate side, and the other adhesive tape is connected on the adhesive side. The pressure-sensitive adhesive is characterized in that the difference from the surface tension of the silicone base material is 10 mN / m (10 dyne / cm) or less and the adhesive force is 100 g / 25 mm or more.
According to the present invention (5), since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, both sides of the double-sided silicone pressure-sensitive adhesive tape can be bonded (or closely adhered) to each other. Connection is simple and easy.
In the present invention (6), the terminal part of one adhesive tape wound around one reel and the other adhesive tape wound around the other reel, in which an adhesive for electrode connection is applied to a silicone-treated substrate An adhesive tape connection body having a connection portion for connecting the start end portion of the adhesive tape, wherein the connection portion overlaps or abuts the end portion of one adhesive tape and the start end portion of the other adhesive tape, The adhesive tape is provided by attaching a portion of both adhesive tapes across the surface of the silicone-treated substrate with a silicone adhesive tape and connecting the two adhesive tapes.
According to the present invention (7) (the invention according to claim 2), the terminal part of one adhesive tape wound around one reel and the other reel are coated with an adhesive for electrode connection on a silicone-treated substrate. An adhesive tape connection body having a connection portion for connecting the other end of the adhesive tape wound around the adhesive tape, wherein the connection portion includes a terminal end of one adhesive tape and a start end of the other adhesive tape. The silicone adhesive tape with silicone adhesive applied on both sides is connected to either the one or the other adhesive tape on the silicone-treated substrate side, and the other adhesive tape is connected to the adhesive side. The two adhesive tapes are connected to each other in such a manner that the difference in surface tension of the silicone-treated base material is 10 mN / m (10 dyne / cm) or less and the adhesive strength is 10 And characterized in that g / 25 mm or more.

本発明（１）によれば、終了した接着剤テープ（一方の接着剤テープ）と新たな接着剤テープ（他方の接着剤テープ）とを接続してリールの交換を行うだけなので、接着装置への新たな接着剤リールの装着が簡単にできる。また、新たな接着剤リールの交換毎に巻取りリールの交換や、新規接着剤テープの始端を巻取りリールに取り付けたり、接着剤テープをガイドに掛ける作業が必要ないので、新しい接着剤リールの交換時間が少なくて済み、電子機器の生産効率が高まる。
接着剤テープの処理基材に用いる処理剤はシリコーン系樹脂であり、粘着テープにもシリコーン粘着剤を用いることにより、両者の表面張力の差を小さくして密着力を高めているので、従来困難であった両者の接着を実現できる。
本発明（２）によれば、本発明（１）と同様な効果を奏するとともに、シリコーン粘着テープにおける粘着剤面の表面張力と接着剤テープにおけるシリコーン処理基材の表面張力との差を１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下とすることにより、強い密着力を得ることができ、両者を確実に接着できる。
本発明（３）によれば、本発明（２）と同様な効果を奏するとともに、更に接着力を１００ｇ／２５ｍｍ以上とすることにより、一方及び他方の接着剤テープの両接着剤面との接着をより強固におこなうことができる。
本発明（４）によれば、本発明（３）と同様な効果を奏するとともに、一方と他方の接着剤テープをその両面で接続するので、更に強固な接続を得ることができる。
本発明（５）によれば、両面粘着剤のシリコーン粘着テープを用いているので、一方と他方の接着剤テープ間に両面シリコーン粘着テープを挟んで両者を接着（又は密着）できるから、両者の接続が簡単且つ容易である。 According to the present invention (1), since the completed adhesive tape (one adhesive tape) and a new adhesive tape (the other adhesive tape) are connected and the reel is exchanged, the adhesive tape is transferred to the bonding apparatus. The new adhesive reel can be easily installed. In addition, it is not necessary to replace the take-up reel every time a new adhesive reel is replaced, or to attach the starting edge of the new adhesive tape to the take-up reel or to hang the adhesive tape on the guide. The replacement time is short, and the production efficiency of electronic equipment is increased.
The treatment agent used for the adhesive tape treatment substrate is a silicone resin, and by using a silicone adhesive for the adhesive tape, the difference in surface tension between the two is reduced to increase the adhesion, making it difficult in the past. It was possible to realize the adhesion between the two.
According to the present invention (2), the same effect as that of the present invention (1) can be obtained, and the difference between the surface tension of the pressure-sensitive adhesive surface in the silicone pressure-sensitive adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape is 10 mN / By setting it to m (10 dyne / cm) or less, strong adhesion can be obtained, and both can be securely bonded.
According to the present invention (3), the same effect as that of the present invention (2) can be obtained, and further, the adhesive strength is set to 100 g / 25 mm or more, so that the one and the other adhesive tapes can be bonded to both adhesive surfaces. Can be performed more firmly.
According to the present invention (4), the same effects as those of the present invention (3) can be obtained, and since one and the other adhesive tapes are connected on both surfaces, a stronger connection can be obtained.
According to the present invention (5), since the double-sided pressure-sensitive adhesive silicone adhesive tape is used, both sides of the double-sided silicone pressure-sensitive adhesive tape can be bonded (or closely adhered) to each other. Connection is simple and easy.

以下に添付図面を参照しながら本発明の実施の形態について説明するが、まず図１〜図４を参照して本発明の第１実施の形態について説明する。図１は第１実施の形態にかかる接着剤テープの接続方法を示す図であり、（ａ）は接着剤リール同士の接続を示す斜視図であり、（ｂ）は（ａ）における接続部分（ｂ）の接続方法を示す斜視図であり、図２は接着装置における接着剤の圧着工程を示す概略図であり、図３は回路基板同士の接着を示す断面図であり、図４は接着剤テープの製造方法を示す工程図である。
接着剤テープ１はリール３、３ａにそれぞれ巻かれており、各リール３、３ａには巻き芯５と接着剤テープ１の両幅側に配置した側板７とが設けられている。
接着剤テープ１は、シリコーン処理基材９と、シリコーン処理基材９の一側面に塗布された接着剤１１とから構成されている。
シリコーン処理基材９は、強度及び異方導電材を構成する接着剤の剥離性の面からＯＰＰ(延伸ポリプロピレン)、ポリテトラフルオロエチレン、ＰＥＴ(ポリエチレンテレフタレート)等の基材を用い、この表面にシリコーン樹脂等により表面処理されている。 Embodiments of the present invention will be described below with reference to the accompanying drawings. First, the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a view showing a method of connecting an adhesive tape according to the first embodiment, (a) is a perspective view showing connection between adhesive reels, and (b) is a connection portion (a) ( FIG. 2 is a perspective view showing a connection method of b), FIG. 2 is a schematic view showing a bonding step of an adhesive in the bonding apparatus, FIG. 3 is a cross-sectional view showing bonding between circuit boards, and FIG. 4 is an adhesive. It is process drawing which shows the manufacturing method of a tape.
The adhesive tape 1 is wound around reels 3 and 3 a, respectively. Each reel 3 and 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
The adhesive tape 1 is composed of a silicone-treated substrate 9 and an adhesive 11 applied to one side surface of the silicone-treated substrate 9.
The silicone-treated base material 9 uses a base material such as OPP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate) and the like on the surface in terms of strength and releasability of the adhesive constituting the anisotropic conductive material. The surface is treated with a silicone resin or the like.

接着剤１１は、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系、ホットメルト系が用いられている。かかる樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、ビニルエステル系樹脂、アクリル樹脂系、シリコーン樹脂系が用いられる。   As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such resins include thermoplastic resin systems such as styrene resin systems and polyester resin systems, and thermosetting resin systems that use epoxy resin systems, vinyl ester resins, acrylic resin systems, and silicone resin systems. It is done.

接着剤１１には、導電粒子１３が分散されている。導電粒子１３としては、Ａｕ，Ａｇ，Ｐｔ，Ｎｉ，Ｃｕ，Ｗ，Ｓｂ、Ｓｎ，はんだなどの金属粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、プラスチック等の高分子核材等に、前記した導電層を被覆等により形成したものでもよい。さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子や、導電粒子と絶縁粒子の併用等も適用可能である。はんだ等の熱溶融金属や、プラスチック等の高分子核材に導電層を形成したものは、加熱加圧もしくは加圧により変形性を有し、接続後の電極間の距離が減少し、接続時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。   Conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and polymers such as non-conductive glass, ceramics, and plastics. The above-mentioned conductive layer may be formed on the core material by covering or the like. Furthermore, the insulating covering particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, combined use of an electrically-conductive particle and an insulating particle, etc. are applicable. Heat-melted metal such as solder, or polymer core material such as plastic with a conductive layer formed is deformable by heating or pressing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, it does not show a melting point like solder, so that the softening state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained. .

次に、本実施の形態にかかる接着剤テープの使用方法について説明する。図２に示すように、接着装置１５に接着剤テープ１のリール３ａと、巻取りリール１７とを装着し、リール３ａに巻いた接着剤テープ１の先端を巻取りリール１７に取り付け、接着剤テープ１を繰り出す（図２中矢印Ｅ）。そして、回路基板２１上に接着剤テープ１を配置して、両リール３ａ、１７間に配置された加熱加圧ヘッド１９で接着剤テープ１をシリコーン処理基材９側から圧接し、接着剤１１を回路基板２１に圧着する。その後、シリコーン基材９を巻取りリール１７に巻き取る。
上記の圧着後(仮接続)、回路基板２１の電極と配線回路（電子部品）２３の電極を位置合わせして本接続する。本接続は、図３に示すように、回路基板２１に圧着された接着剤１１に配線回路（又は電子部品）２３を配置して、必要によりクッション材として、例えば、ポリテトラフルオロエチレン材２４を介して加熱加圧ヘッド１９により配線回路２３を回路基板２１に加熱加圧する。これにより回路基板２１の電極２１ａと配線回路２３との電極２３ａを接続する。
本実施の形態による接着剤テープ１を用いたＰＤＰは、そのサイズが大きくなっており、ＰＤＰの周囲全体に亘り圧着する場合があり、接続部分が多く、接着剤１１は一度に用いる接着剤１１の使用量が従来に比較して格段に多くなる。したがって、リール３ａに巻いた接着剤テープ１の使用量も多くなり、リール３ａに巻いた接着剤テープ１は比較的短時間で巻取りリール１７に巻き取られて、リール３ａに巻かれた接着剤テープ１のエンドマーク２８が露出される（図１参照）。 Next, the usage method of the adhesive tape concerning this Embodiment is demonstrated. As shown in FIG. 2, the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15, and the tip of the adhesive tape 1 wound around the reel 3 a is attached to the take-up reel 17. The tape 1 is fed out (arrow E in FIG. 2). Then, the adhesive tape 1 is disposed on the circuit board 21, and the adhesive tape 1 is pressed from the silicone-treated substrate 9 side by the heating and pressing head 19 disposed between the reels 3 a and 17. Is crimped to the circuit board 21. Thereafter, the silicone base material 9 is taken up on the take-up reel 17.
After the above crimping (temporary connection), the electrode of the circuit board 21 and the electrode of the wiring circuit (electronic component) 23 are aligned and finally connected. In this connection, as shown in FIG. 3, a wiring circuit (or electronic component) 23 is disposed on the adhesive 11 that is pressure-bonded to the circuit board 21, and a polytetrafluoroethylene material 24 is used as a cushioning material as necessary. Then, the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19. Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.
The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is used at once. The amount of use will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound around the reel 3a is increased, and the adhesive tape 1 wound around the reel 3a is wound around the take-up reel 17 in a relatively short time, and the adhesive tape 1 is wound around the reel 3a. The end mark 28 of the agent tape 1 is exposed (see FIG. 1).

本発明の接着剤テープの接続方法は、（ａ）巻取りリール１７をそのまま使用し、使用済みの接着剤テープ１の巻きが残り少なくなった接着剤テープを交換し、新たな接着剤テープと巻取りリール１７を接続する場合と、（ｂ）巻取りリール１７として使用済みの接着剤テープ１の巻きが残り少なくなった接着剤テープを使用し、新たな接着剤テープと巻きが残り少なくなった接着剤テープを接続する場合がある。   The method for connecting the adhesive tape of the present invention is as follows: (a) The take-up reel 17 is used as it is, the adhesive tape with the used adhesive tape 1 remaining less wound is replaced, and a new adhesive tape and winding are used. When the take-up reel 17 is connected, and (b) an adhesive tape in which the winding of the used adhesive tape 1 is reduced as the take-up reel 17 is used, and a new adhesive tape and an adhesive in which the winding is reduced. A tape may be connected.

（ｂ）の場合、図１に示すように、リール３ａの接着剤テープ１にエンドマーク２８が露出したところで、リール３ａを新たな接着剤リール３と交換するため、リール３ａの接着剤テープ（一方の接着剤テープ）１の終端部３０と、新たな接着剤リール３に巻かれた接着剤テープ（他方の接着剤テープ）の始端部３２とを接続する。
この接着剤テープ１の接続は、図１（ｂ）に示すように、接着剤リール３ａの接着剤テープ１の終端部３０と、新たな接着剤リール３の接着剤テープ１の始端部３２とを突き合せ、両接着剤テープ１、１のシリコーン処理基材９、９の表面に跨ってシリコーン粘着テープ４１を貼り付けて、両接着剤テープ１、１を接続する。
このシリコーン粘着テープ４１は、基材４５と基材４５の片面に塗布されたシリコーン粘着剤４３とから構成されている。基材４５は、その材質は特に限定されないが、本実施の形態では、ポリイミド樹脂材である。尚、図１において、接着剤テープの接着剤１１及びシリコーン粘着テープ４１の粘着剤部分４３は、それぞれ斜線で示している。
ここで、シリコーン粘着テープ４１による接着について説明する。一方及び他方の接着剤テープ１、１において、シリコーン処理基材９、９はそれぞれシリコーンがコーティングしたあるため、接着剤による接着が困難であるが、本実施の形態では、シリコーン粘着テープ４１の粘着剤４３にシリコーン樹脂を用いることにより、両シリコーン処理基材９、９との表面張力の差を少なくして、密着（接着）させることにより一方の接着剤テープ１の終端部３０と他方の接着剤テープ１の始端部３２とが良好に接続される。シリコーン粘着テープ４１におけるシリコーン粘着剤４３の表面とシリコーン処理基材９、９表面との表面張力の差は１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下とすることが好ましく、本実施の形態では表面張力の差はほとんどない。
一般的には、一方の接着剤テープ１の終端部３０と他方の接着剤テープ１の両シリコーン処理基材９、９の表面張力は２５ｍＮ／ｍ〜６０ｍＮ／ｍ（２５〜６０ｄｙｎｅ／ｃｍ）であり、例えば、表面張力が３０ｍＮ／ｍの場合には、シリコーン粘着テープ４１におけるシリコーン粘着剤４３の表面張力を２０ｍＮ／ｍ以上、４０ｍＮ／ｍ以下に設定する。
シリコーン系粘着剤は、主としてシリコーンガムとシリコーンレジンからなり、両者をわずかに縮合反応させ粘着性を発現させ、さらに、過酸化物、白金触媒によるヒドロシリル化反応により架橋させてガラス転移温度を−１００℃以下としたものが一般的である。これらは、市販されており、それを好適に用いることができる。
このように、シリコーン粘着テープ４１を用いて、使用済みの接着剤リール３ａに巻かれた接着剤テープ１と、新たな接着剤リール３に巻かれた接着剤テープ１とが接続される。次に、使用済みの接着剤リール３ａと新たな接着剤リール３を入れ替えて、新たな接着剤リール３を接着装置１５に装着する。したがって、新たな接着剤リール３の接着剤テープ１を引き出して、巻取りリール１７に接着剤テープを装着したり、接着装置１５のガイド３６に新たな接着剤テープ１を掛けたりする作業が必要ないので、接着剤リール３、３ａの交換の作業効率が良い。このように、巻出しが終了した接着剤テープ１の終端部３０と、新たに装着する接着剤テープ１の始端部３２とをシリコーン粘着テープで接続するので、接続が簡単である。
次に、使用済みのリール３ａと新たなリール３を入れ替えて、新たなリール３を接着装置１５に装着する。したがって、巻取りリール１７に新たに接着剤テープ１を装着する作業が必要ない。 In the case of (b), as shown in FIG. 1, when the end mark 28 is exposed on the adhesive tape 1 of the reel 3a, the reel 3a is replaced with a new adhesive reel 3. The terminal portion 30 of one adhesive tape) 1 is connected to the start end portion 32 of the adhesive tape (the other adhesive tape) wound around the new adhesive reel 3.
As shown in FIG. 1B, the adhesive tape 1 is connected to the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3. And the adhesive tapes 1 and 1 are connected to each other by sticking the silicone adhesive tape 41 across the surfaces of the silicone-treated substrates 9 and 9 of the adhesive tapes 1 and 1.
The silicone adhesive tape 41 is composed of a base material 45 and a silicone adhesive 43 applied to one side of the base material 45. The material of the base material 45 is not particularly limited, but is a polyimide resin material in the present embodiment. In FIG. 1, the adhesive 11 of the adhesive tape and the adhesive portion 43 of the silicone adhesive tape 41 are indicated by oblique lines.
Here, adhesion by the silicone adhesive tape 41 will be described. In one and the other adhesive tapes 1 and 1, since the silicone-treated base materials 9 and 9 are coated with silicone, respectively, adhesion with an adhesive is difficult. By using a silicone resin for the agent 43, the difference in surface tension between the two silicone-treated base materials 9 and 9 is reduced, and adhesion (adhesion) is performed, whereby the terminal portion 30 of one adhesive tape 1 is bonded to the other. The starting end 32 of the agent tape 1 is connected well. The difference in surface tension between the surface of the silicone adhesive 43 in the silicone adhesive tape 41 and the surface of the silicone-treated substrates 9 and 9 is preferably 10 mN / m (10 dyne / cm) or less. In this embodiment, the surface tension There is almost no difference.
In general, the surface tension of the silicone-treated base materials 9 and 9 of the terminal portion 30 of one adhesive tape 1 and the other adhesive tape 1 is 25 mN / m to 60 mN / m (25 to 60 dyne / cm). Yes, for example, when the surface tension is 30 mN / m, the surface tension of the silicone adhesive 43 in the silicone adhesive tape 41 is set to 20 mN / m or more and 40 mN / m or less.
The silicone-based pressure-sensitive adhesive is mainly composed of silicone gum and silicone resin, and both are subjected to a slight condensation reaction to develop an adhesive property, and further crosslinked by a hydrosilylation reaction with a peroxide and a platinum catalyst to have a glass transition temperature of −100. In general, the temperature is not higher than ° C. These are commercially available and can be suitably used.
In this way, the adhesive tape 1 wound around the used adhesive reel 3 a and the adhesive tape 1 wound around the new adhesive reel 3 are connected using the silicone adhesive tape 41. Next, the used adhesive reel 3 a and the new adhesive reel 3 are exchanged, and the new adhesive reel 3 is mounted on the bonding device 15. Accordingly, it is necessary to draw out the adhesive tape 1 of the new adhesive reel 3 and attach the adhesive tape to the take-up reel 17 or to apply the new adhesive tape 1 to the guide 36 of the bonding apparatus 15. Therefore, the work efficiency of exchanging the adhesive reels 3 and 3a is good. In this way, since the end portion 30 of the adhesive tape 1 that has been unwound and the start end portion 32 of the adhesive tape 1 to be newly attached are connected by the silicone adhesive tape, the connection is simple.
Next, the used reel 3 a and the new reel 3 are exchanged, and the new reel 3 is mounted on the bonding device 15. Accordingly, there is no need to newly attach the adhesive tape 1 to the take-up reel 17.

（ａ）の巻取りリール１７をそのまま使用し、使用済みの接着剤テープ１の巻きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、新たな接着剤テープと巻取りリール１７を接続する場合は、使用済みリール３ａの接着剤テープ１のエンドマーク２８が露出したときに接着剤テープ１のエンドマーク２８付近を切断し、巻取りリール１７側に残った接着剤テープの終端部３０と新たな接着剤リール３の接着剤テープ１の始端部３２を突き合わせる。そして、両者の突き合せ部分にシリコーン粘着テープを用いて接着剤テープ１の終端部３０と、新たな接着剤リール３の接着剤テープ１の始端部３２とを接続する。
巻取りリール１７では基材９だけを巻き取っているので、接着剤リールの数本分を巻き取ることができるので、巻取りリール１７の交換回数を少なくすることができ、作業効率が良い。 The take-up reel 17 of (a) is used as it is, and the adhesive tape in which the used adhesive tape 1 has hardly been wound is replaced with a new adhesive tape, and the new adhesive tape and the take-up reel 17 are replaced. In the case of connection, when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 is cut, and the end portion of the adhesive tape remaining on the take-up reel 17 side. 30 and the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are abutted. And the terminal part 30 of the adhesive tape 1 and the start end part 32 of the adhesive tape 1 of the new adhesive reel 3 are connected using a silicone adhesive tape at both abutting portions.
Since only the base material 9 is taken up by the take-up reel 17, several adhesive reels can be taken up, so that the number of exchanges of the take-up reel 17 can be reduced and the working efficiency is good.

次に、図４を参照して本実施の形態にかかる接着剤テープ１の製造方法について説明する。
巻出機２５から巻きだされた基材（セパレータ）にコーター２７により、樹脂と導電粒子が混合された接着剤を塗布し、乾燥炉２９で乾燥した後、巻取機３１で原反を巻き取る。巻き取られた接着剤テープの原反は、スリッタ３３により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯に側板７、７が両側から装着されて、あるいは、側板付巻き芯に巻き取られ、除湿材とともに梱包され、好ましくは、低温（−５℃〜−１０℃）に管理されて出荷される。 Next, with reference to FIG. 4, the manufacturing method of the adhesive tape 1 concerning this Embodiment is demonstrated.
An adhesive mixed with resin and conductive particles is applied to a base material (separator) unwound from an unwinder 25 by a coater 27, dried in a drying furnace 29, and then unwound by a winder 31. take. The wound adhesive tape is cut into a predetermined width by a slitter 33 and wound on a winding core, and then side plates 7 and 7 are attached to the winding core from both sides, or a winding core with a side plate. , Wound together with a dehumidifying material, and preferably shipped at a low temperature (−5 ° C. to −10 ° C.).

次に、本発明の他の実施の形態について説明するが、以下に説明する実施の形態では上述した実施の形態と同一の部分には同一の符合を付することによりその部分の詳細な説明を省略し、以下では上述した実施の形態と異なる点を主に説明する。
図５に示す第２実施の形態では、上述した第１実施の形態に加えて、一方の接着剤テープ１の終端部３０と他方の接着剤テープの始端部３２との接着剤１１面側にもシリコーン粘着テープ４１を貼着したものである。この第２実施の形態におけるシリコーン粘着テープ４１のシリコーン粘着剤４３は、接着力が１００ｇ／２５ｍｍ以上であり、本実施の形態では、７００ｇ／２５ｍｍ〜１４００ｇ／２５ｍｍである。尚、シリコーン粘着テープ４１におけるシリコーン粘着剤４３の表面張力は、上述した実施の形態と同様に、一方及び他方の接着剤テープにおけるシリコーン基材の表面張力との差を１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下に設定している。この第２実施の形態では、一方の接着剤テープ１の終端部３０と他方の接着剤テープの始端部３２との両面において、シリコーン粘着テープ４１で接着しているので、第１実施の形態よりも高い強度で両接着剤テープ１、１を接着することができる。 Next, another embodiment of the present invention will be described. In the embodiment described below, the same reference numerals are given to the same portions as the above-described embodiments, and detailed description of the portions will be given. Omitted, the following description will mainly focus on differences from the above-described embodiment.
In the second embodiment shown in FIG. 5, in addition to the first embodiment described above, the adhesive 11 surface side of the end portion 30 of one adhesive tape 1 and the start end portion 32 of the other adhesive tape 1 is provided. Also, the silicone adhesive tape 41 is attached. The silicone adhesive 43 of the silicone adhesive tape 41 in the second embodiment has an adhesive strength of 100 g / 25 mm or more, and in this embodiment, 700 g / 25 mm to 1400 g / 25 mm. Note that the surface tension of the silicone adhesive 43 in the silicone adhesive tape 41 is 10 mN / m (10 dyne / cm), as in the case of the above-described embodiment, with the difference between the surface tension of the silicone substrate in one and the other adhesive tape. ) The following is set. In this 2nd Embodiment, since it adhere | attached with the silicone adhesive tape 41 in both surfaces of the terminal part 30 of one adhesive tape 1, and the start end part 32 of the other adhesive tape, from 1st Embodiment The two adhesive tapes 1 and 1 can be bonded with high strength.

図６に示す第３実施の形態は、一方の接着剤テープ１の終端部３０と他方の接着剤テープ１の始端部３２とを重ねて配置し、そのシリコーン処理基材９側面と接着剤１１側面とに第２実施の形態にかかるシリコーン粘着テープ４１を貼着したものであり、この第３実施の形態によれば、第２実施の形態と同様な作用効果を奏することができる。   In the third embodiment shown in FIG. 6, the terminal end 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are arranged so as to overlap each other, and the side surface of the silicone-treated substrate 9 and the adhesive 11 are arranged. The silicone pressure-sensitive adhesive tape 41 according to the second embodiment is adhered to the side surface. According to the third embodiment, the same operational effects as those of the second embodiment can be achieved.

図７に示す第４実施の形態は、一方の接着剤テープ１の終端部３０と他方の接着剤テープ１の始端部３２との間に、基材の両面にシリコーン粘着剤４３を塗布したシリコーン粘着テープ４７を介在して、終端部３０と始端部３２とを接続したものである。この第４実施の形態によれば、両面のシリコーン粘着テープ４７を用いることにより、更に、一方の接着剤テープ１の終端部３０と他方の接着剤テープ１の始端部３２との接続が簡単に且つ容易にできる。   In the fourth embodiment shown in FIG. 7, the silicone adhesive 43 is applied to both surfaces of the base material between the terminal end 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1. The terminal portion 30 and the starting end portion 32 are connected with an adhesive tape 47 interposed therebetween. According to the fourth embodiment, by using the double-sided silicone adhesive tape 47, the connection between the end portion 30 of one adhesive tape 1 and the start end portion 32 of the other adhesive tape 1 can be simplified. And easily.

第１実施の形態にかかる接着剤テープの接続方法を示す図であり、（ａ）は接着剤リール同士の接続を示す斜視図であり、（ｂ）は（ａ）における接続部分（ｂ）を示す斜視図である。It is a figure which shows the connection method of the adhesive tape concerning 1st Embodiment, (a) is a perspective view which shows the connection of adhesive reels, (b) is the connection part (b) in (a). It is a perspective view shown. 接着装置における接着剤の圧着工程を示す概略図である。It is the schematic which shows the crimping | compression-bonding process of the adhesive agent in an adhesion | attachment apparatus. 回路基板と配線回路（電子部品）との接着を示す断面図である。It is sectional drawing which shows adhesion | attachment with a circuit board and a wiring circuit (electronic component). 接着剤テープの製造方法を示す工程図である。It is process drawing which shows the manufacturing method of an adhesive tape. 本発明の第２実施の形態における、接着剤テープの接続方法を示す断面図である。It is sectional drawing which shows the connection method of the adhesive tape in 2nd Embodiment of this invention. 本発明の第３実施の形態における、接着剤テープの接続方法を示す断面図である。It is sectional drawing which shows the connection method of the adhesive tape in 3rd Embodiment of this invention. 本発明の第４実施の形態における、接着剤テープの接続方法を示す断面図である。It is sectional drawing which shows the connection method of the adhesive tape in 4th Embodiment of this invention.

符号の説明Explanation of symbols

１．接着剤テープ、３、３ａ．リール、 ５．巻き芯、 ７．側板、９．シリコーン処理基材、 １１．接着剤、 １３．導電粒子、１５．接着装置、 １７．巻き取りリール、 １９．加熱加圧ヘッド、２１．回路基板、２３．配線回路（電子部品）、 ２５．巻出機、２７．コーター、 ２８．エンドマーク、 ２９．乾燥炉、 ３０．終端部、３１．巻取機、 ３２．始端部、 ３３．スリッタ、４１、４７．シリコーン粘着テープ、４３．シリコーン粘着剤、４５．基材。
1. Adhesive tape, 3, 3a. Reel, 5. 6. winding core, Side plates, 9. 10. silicone-treated substrate; Adhesive, 13. Conductive particles, 15. Bonding apparatus, 17. Take-up reel, 19. Heating and pressing head, 21. Circuit board, 23. Wiring circuit (electronic component), 25. Unwinder, 27. Coater, 28. End mark, 29. Drying oven, 30. End portion, 31. Winding machine, 32. The beginning, 33. Slitter, 41, 47. Silicone adhesive tape, 43. Silicone adhesive, 45. Base material.

Claims (2)

電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープと他方のリールに巻いた他方の接着剤テープとを接続する接着剤テープの接続方法であって、一方の接着剤テープの終端部と他方の接着剤テープの始端部との間にシリコーン粘着剤を両面に塗布したシリコーン粘着テープを、一方及び他方の接着剤テープのうちどちらかがシリコーン処理基材側で、それ以外の接着剤テープが接着剤側で接続されるように挟んで両接着剤テープを接続し、両面のシリコーン粘着剤はシリコーン処理基材の表面張力との差が１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下で、且つ接着力が１００ｇ／２５ｍｍ以上であることを特徴とする接着剤テープの接続方法。 An adhesive tape connecting method in which one adhesive tape wound on one reel and the other adhesive tape wound on the other reel are connected with an electrode connecting adhesive applied to a silicone-treated substrate. A silicone adhesive tape in which a silicone adhesive is applied on both sides between the terminal end of one adhesive tape and the start end of the other adhesive tape , and one of the one and the other adhesive tape is silicone. Both adhesive tapes are connected so that the other adhesive tape is connected to the adhesive side on the treated substrate side, and the double-sided silicone adhesive has a difference of 10 mN from the surface tension of the silicone treated substrate. / M (10 dyne / cm) or less, and the adhesive strength is 100 g / 25 mm or more. 電極接続用の接着剤がシリコーン処理基材に塗布された、一方のリールに巻いた一方の接着剤テープの終端部と、他方のリールに巻いた他方の接着剤テープの始端部とを接続する接続部分を有する接着剤テープ接続体であって、
前記接続部分は、一方の接着剤テープの終端部と他方の接着剤テープの始端部との間にシリコーン粘着剤を両面に塗布したシリコーン粘着テープを、一方及び他方の接着剤テープのうちどちらかがシリコーン処理基材側で、それ以外の接着剤テープが接着剤側で接続されるように挟んで両接着剤テープを接続することにより設けられており、
両面のシリコーン粘着剤はシリコーン処理基材の表面張力との差が１０ｍＮ／ｍ（１０ｄｙｎｅ／ｃｍ）以下で、且つ接着力が１００ｇ／２５ｍｍ以上であることを特徴とする接着剤テープ接続体。 Connect the terminal part of one adhesive tape wound on one reel and the starting part of the other adhesive tape wound on the other reel, in which an adhesive for electrode connection is applied to the siliconized substrate. An adhesive tape connecting body having a connecting portion,
The connecting portion is formed by applying a silicone adhesive tape in which a silicone adhesive is applied on both sides between a terminal portion of one adhesive tape and a starting end portion of the other adhesive tape , and either one of the adhesive tapes. Is provided by connecting both adhesive tapes sandwiched so that the other adhesive tape is connected on the adhesive side on the silicone-treated substrate side ,
A double-sided silicone pressure-sensitive adhesive has a difference from the surface tension of the silicone-treated substrate of 10 mN / m (10 dyne / cm) or less, and an adhesive strength of 100 g / 25 mm or more.
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