JP4608839B2 - Adhesive tape reel and bonding apparatus - Google Patents

Adhesive tape reel and bonding apparatus Download PDF

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Publication number
JP4608839B2
JP4608839B2 JP2002371889A JP2002371889A JP4608839B2 JP 4608839 B2 JP4608839 B2 JP 4608839B2 JP 2002371889 A JP2002371889 A JP 2002371889A JP 2002371889 A JP2002371889 A JP 2002371889A JP 4608839 B2 JP4608839 B2 JP 4608839B2
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adhesive tape
tape
reel
adhesive
take
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JP2004203945A (en
Inventor
正己 湯佐
俊之 柳川
征宏 有福
功 塚越
泰史 後藤
直樹 福嶋
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Priority to JP2002371889A priority Critical patent/JP4608839B2/en
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008102146483A priority patent/CN101402832B/en
Priority to KR1020097017836A priority patent/KR100970800B1/en
Priority to CN2008102146498A priority patent/CN101417758B/en
Priority to TW092120892A priority patent/TW200409405A/en
Priority to KR1020087019045A priority patent/KR20080075565A/en
Priority to TW097143988A priority patent/TW200913828A/en
Priority to PCT/JP2003/009694 priority patent/WO2004011356A1/en
Priority to CNB038180847A priority patent/CN100548840C/en
Priority to TW097143991A priority patent/TW200913829A/en
Priority to CN201410378540.3A priority patent/CN104152075B/en
Priority to CN2010102460213A priority patent/CN101905817B/en
Priority to CN 201110456093 priority patent/CN102556726A/en
Priority to KR1020107001127A priority patent/KR100953011B1/en
Priority to CN2010102345094A priority patent/CN101920862B/en
Priority to CN2009101730706A priority patent/CN101648658B/en
Priority to CN2008102146479A priority patent/CN101402423B/en
Priority to TW097143987A priority patent/TW200913827A/en
Priority to KR1020087005685A priority patent/KR100981478B1/en
Priority to TW096139425A priority patent/TW200823137A/en
Priority to KR1020067012942A priority patent/KR100690379B1/en
Priority to KR1020067012929A priority patent/KR100700438B1/en
Priority to KR1020077011959A priority patent/KR20070063606A/en
Priority to KR1020107007008A priority patent/KR20100041890A/en
Priority to KR1020087012294A priority patent/KR20080064886A/en
Priority to CN2010102345395A priority patent/CN101920863B/en
Publication of JP2004203945A publication Critical patent/JP2004203945A/en
Publication of JP4608839B2 publication Critical patent/JP4608839B2/en
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【０００１】
【発明の属する技術分野】
本発明は、電子部品と回路基板、又は回路基板同士を接着固定すると共に、両者の電極同士を電気的に接続する接着材テープに関し、特にリール状に巻かれた接着材テープリール及び接着装置に関する。
【０００２】
【従来の技術】
一般に、液晶パネル、ＰＤＰ（プラズマディスプレイパネル）、ＥＬ（蛍光ディスプレイ）パネル、ベアチップ実装などの電子部品と回路基板、回路基板同士を接着固定し、両者の電極同士を電気的に接続する方法として、接着材テープが用いられている。
特許文献１には、基材に接着材が塗布された接着材テープをリール状に巻き取ったものが開示されている。
この種の従来の接着材テープは、幅が１〜３ｍｍ程度であり、リールに巻き取るテープの長さは５０ｍ程度である。
接着材テープを接着装置に装着する場合、接着材テープをリールに巻いた接着材テープリールを接着装置に取り付け、接着材テープの始端部を引き出して、巻取りリールに取り付ける。そして、接着材テープリールから巻き出された接着材テープの基材側から加熱加圧ヘッドで接着剤を回路基板等に圧着し、残った基材を巻取りリールに巻き取っている。
そして、一方の接着材テープリールの接着材テープが終了すると、終了したリールと、基材を巻き取った巻取りリールを外し、新たな巻取りリールと新たな接着材テープリールを接着装置に装着し、接着材テープの始端を巻取りリールに取り付けている。
【０００３】
【特許文献１】
特開２００１−２８４００５号公報
【０００４】
【発明が解決しようとする課題】
しかし、近年のＰＤＰ等におけるパネル画面の大型化にともない回路基板の接着面積が増大し、一度に使用する接着剤の使用量が増加してきた。また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、電子機器の製造工場では、接着材テープリールの交換頻度が多くなり、接着材テープリールの交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。
かかる問題に対して、リールに巻き取る接着材テープの巻き数を多くすることで、１リール当りの接着剤量を増やし、リールの交換頻度を低減することが考えられるが、接着材テープのテープ幅が１〜３ｍｍと狭いため、巻き数を多くすると巻き崩れが生じるおそれがある。また、巻き数を多くするとテープ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から染み出してブロッキングの原因になるおそれがある。
更に、接着材テープの巻き数を増やすと、リールの径寸法も大きくなり、既存の接着装置に装着し難く、既存の接着装置が使用できなくなるおそれがある。
そこで、本発明は、接着材テープリールの交換が簡単にでき、電子機器の生産効率の向上を図ることができる接着材テープリール及び接着装置の提供を目的とする。
【０００５】
前記課題を解決するために、請求項１に記載された発明は、電極接続用の接着剤が基材に塗布された接着材テープを、両側板を有するリールに巻いた巻き部が、接着材テープの幅方向に複数設けられた接着材テープリールであって、一方の接着材テープの終端部と他方の接着材テープの始端部とを接続する連結テープを備え、連結テープが、側板の内側面を沿うように配置され且つ側板の上部に形成された切欠け部分に係止しており、一方の接着材テープの巻き出しが終了すると、続いて他方の接着材テープの繰り出しが開始されることを特徴とする。
この請求項１に記載の発明では、接着材テープの巻き部（巻き部）を複数設けたので、複数の巻き部のうち、一方の巻き部に巻かれた接着材テープの巻き出しが終了すると、巻き出しの終了した巻き部の隣に配置した他方の巻き部の接着材テープを巻取りリールに取り付ける。
このように、一方の接着材テープの巻き出しが終了すると、他方の接着材テープを巻取りリールに取り付けて、接着材テープの交換を行うので、接着装置への新たな接着材テープリールの装着が不要である。従って、新たな接着材テープリールの交換作業が少なくて済み、電子機器の生産効率が高まる。
複数の巻き部に巻かれた接着材テープを順次使用できるので、１つの接着材テープリールあたりの接着材テープの巻き数を増やすことなく、１回の交換作業で使用可能な接着剤量を大幅に増やすことができる。また、接着材テープの巻き数を増やすことがないから、巻き崩れを防止できるとともに、接着剤がテープの幅方向に染み出して巻いた接着材テープ同士が接着するいわゆるブロッキングを防止でき、さらに基材が長くなることで生じ易い基材の伸び等の弊害を防止できる。
また、この請求項１に記載の発明によれば、上記作用効果を奏するとともに、一方の接着材テープの終端部と他方の接着材テープの始端部とが、連結テープで接続されているので、一方の巻き部の接着材テープの巻き出しが終了した後、他方の巻き部の接着材テープを巻取りリールに取り付ける作業が不要となり、電子機器の生産効率がさらに高まる。
【０００７】
請求項２に記載された発明は、請求項１に記載の接着材テープリールと、接着材テープの巻取りリールと、接着材テープリールと巻取りリールとの間に設けられ且つ加熱加圧ヘッドで接着材テープの接着剤を電子機器の回路基板に圧着する圧着部と、連結テープを検知するテープ検知手段とを備えた接着装置であって、テープ検知手段が連結テープを検知した場合には、連結テープが圧着部を通過するまで連結テープを巻取りリールに巻き取ることを特徴とする。
この請求項２に記載の発明によれば、連結テープは自動的に巻取りリールに巻き取られるので、一方の巻き部の接着材テープが終了した後に、順次、次の巻き部から接着材テープを繰り出すことができる。
また、連結テープをテープ検知手段が検知すると、連結テープが圧着部を通過するまで、連結テープを自動的に巻取りリールに巻き取るので、巻取りの手間を省くことができる。尚、テープ検知手段としては例えば接着装置に一対の発光部と受光部とを備え、連結テープを光学的に検知するものである。一方、連結テープの両端には色を付した（例えば黒）マークを設けており、発光部から発したレーザ光により連結テープの両端のマークを受光部が検知することで連結テープを判断している。また連結テープにマークを付する他、連結テープの幅を接着材テープの幅とは異なる幅にする方法、連結テープに複数の孔を形成する方法であっても良い。
【０００８】
【発明の実施の形態】
以下に添付図面を参照しながら本発明の実施の形態について説明するが、まず図１〜図４を参照して本発明の第１実施の形態について説明する。図１は第１実施の形態にかかる接着材テープリールを示す図であり、（ａ）は接着材テープリールを示す斜視図であり、（ｂ）は（ａ）における正面図であり、（ｃ）は（ａ）における連結テープの平面図であり、図２は接着装置における接着剤の圧着工程を示す概略図であり、図３は回路基板同士の接着を示す断面図であり、図４は接着材テープの製造方法を示す工程図である。
【０００９】
図１に示すように、本実施の形態にかかる接着材テープリールＡは、複数の接着材テープの巻き部（以下、巻き部）２、２ａを備えており、巻き部２、２ａはリール３、３ａに接着材テープ１がそれぞれ巻かれている。各リール３、３ａには巻き芯５と接着材テープ１の両幅側に配置した側板７とが設けられている。図２に示すように接着材テープ１は、基材９と、基材９の一側面に塗布された接着剤１１とから構成されている。
複数の巻き部２、２ａのうち、一方の巻き部２に巻かれた接着材テープ（以下、一方の接着材テープ）１の終端部３０と他方の巻き部に巻かれた接着材テープ（以下、他方の接着材テープ）１の始端部３２との間には、両者を接続する連結テープ４１が設けられている。連結テープ４１は、一方の接着材テープ１の終端部３０から、リール３の側板７の内側面を沿うように配置され、側板７の上部に形成された切欠け部分４２に係止して他方の接着材テープ１の始端部３２に接続されている。
また、一方及び他方の接着材テープ１と連結テープ４１との接続部分には、連結テープ４１を認識できるマーク４３、４５が付されており、テープ検出手段（発光部４７、受光部４９）でマーク４３、４５を検出した際は連結テープ４１部分をスキップして、連結テープ４１部分で圧着が行われないようにしている。
【００１０】
基材９は、強度及び異方導電材を構成する接着剤の剥離性の面からＯＰＰ(延伸ポリプロピレン)、ポリテトラフルオロエチレン、シリコーン処理したＰＥＴ(ポリエチレンテレフタレート)などを用いるが、これらに制限するものではない。
接着剤１１は、熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱硬化性樹脂の混合系、ホットメルト系が用いられている。かかる樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、ポリエステル樹脂系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、ビニルエステル系樹脂、アクリル樹脂系、シリコーン樹脂系が用いられる。
【００１１】
接着剤１１には、導電粒子１３が分散されている。導電粒子１３としては、Ａｕ，Ａｇ，Ｐｔ，Ｎｉ，Ｃｕ，Ｗ，Ｓｂ、Ｓｎ，はんだなどの金属粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、プラスチック等の高分子核材等に、前記した導電層を被覆等により形成したものでもよい。さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子や、導電粒子と絶縁粒子の併用等も適用可能である。はんだ等の熱溶融金属や、プラスチック等の高分子核材に導電層を形成したものは、加熱加圧もしくは加圧により変形性を有し、接続後の電極間の距離が減少し、接続時に回路との接触面積が増加し信頼性が向上するので好ましい。特に高分子類を核とした場合、はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。
【００１２】
次に、本実施の形態にかかる接着材テープリールＡの使用方法について説明する。図２に示すように、接着装置１５に接着材テープリールＡと、巻取りリール１７とを装着し、一方の接着材テープ１の始端部３２をガイドピン２２に掛けて巻取りリール１７に取り付け、接着材テープ１を繰り出す（図２中矢印Ｅ）。そして、回路基板２１上に接着材テープ１を配置して、両リール３、１７間に配置された加熱加圧ヘッド１９で接着材テープ１を基材９側から圧接し、接着剤１１を回路基板２１に圧着する。その後、基材９を巻取りリール１７に巻き取る。
上記の圧着後(仮接続)、回路基板２１の電極と配線回路（電子部品）２３の電極を位置合わせして本接続する。本接続は、図３に示すように、回路基板２１に圧着された接着剤１１に配線回路（又は電子部品）２３を配置して、必要によりクッション材として、例えば、ポリテトラフルオロエチレン材２４を介して加熱加圧ヘッド１９により配線回路２３を回路基板２１に加熱加圧する。これにより回路基板２１の電極２１ａと配線回路２３との電極２３ａを接続する。
【００１３】
本実施の形態による接着材テープ１を用いたＰＤＰは、そのサイズが大きくなっており、ＰＤＰの周囲全体に亘り圧着する場合があり、接続部分が多く、接着剤１１は一度に用いる接着剤１１の使用量が従来に比較して格段に多くなる。したがって、リール３に巻いた接着材テープ１の使用量も多くなり、リール３に巻いた接着材テープ１は比較的短時間で巻取りリール１７に巻き取られる。
一方の接着材テープ１の巻き出しが終了したところで、連結テープ４１が切欠け部分４２から外れ、続いて他方の接着材テープ１の繰り出しが行われる。本実施の形態では、一方の接着材テープ１の終端部３０と他方の接着材テープ１の始端部３２との間に両者を接続する連結テープ４１を備えているので、一方の接着材テープ１の巻き出しが終了すると、続けて他方の接着材テープ１の繰り出しを開始することができる。従って、一方の接着材テープ１の巻き出しが終了した後、新たな接着材テープ１を巻取りリール１７に取り付ける作業が不要となり、電子機器の生産効率が高まる。
【００１４】
また、接着装置１５は、図２に示すように、一対の発光部４７と受光部４９とを備えており、連結テープ４１を光学的に検知している。一方の接着材テープ１と他方の接着材テープ１の両者をつなぐ連結テープ４１の両端には黒色のマーク４３、４５を付している。発光部４７はレーザ光を接着材テープ１に向けて連続して発しており、その反射光を受光部４９が受けて、その検知信号を制御装置５１に送っている。そして、受光部４９が連結テープ４１の両端のマーク４３、４５の反射光を受け、その検知信号が制御装置５１に送られる。
検知信号を受けた制御装置５１は、接着装置１５の両リール３、１７を駆動するモータへの制御信号を出力し、モータドライバを介してモータに対する駆動パルスの出力を開始する。そして、モータドライバから印加されるパルス数に応じてモータが回転し、両リール３、１７を通常の速度より速い速度で移動させながら、連結テープ４１の長さに応じた距離だけ接着材テープ１を巻き出し方向に移動させる。
これにより、他方の接着材テープ１が加熱加圧ヘッド１９の位置まで、自動的に繰り出されるので、他方の接着材テープ１の始端部３２が加熱加圧ヘッド１９の位置にくるまで、連結テープ４１を繰り出す手間を省くことができる。
尚、巻取りリール１７では基材９だけを巻き取っているので、接着材テープリールの数本分を巻き取ることができるので、巻取りリール１７の交換回数を少なくすることができ、作業効率が良い。
【００１５】
ここで、図４を参照して本実施の形態にかかる接着材テープリールＡの製造方法について説明する。
巻出機２５から巻きだされた基材（セパレータ）にコーター２７により、樹脂と導電粒子が混合された接着剤を塗布し、乾燥炉２９で乾燥した後、巻取機３１で原反を巻き取る。巻き取られた接着材テープの原反は、スリッタ３３により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯に側板７，７が両側から装着されて、あるいは、側板付巻き芯に巻き取られ、除湿材とともに梱包され、好ましくは、低温（−５℃〜−１０℃）に管理されて出荷される。
【００１６】
次に、本発明の他の実施の形態について説明するが、以下に説明する実施の形態では上述した実施の形態と同一の部分には同一の符合を付することによりその部分の詳細な説明を省略し、以下では上述した実施の形態と異なる点を主に説明する。
図５に示す第２実施の形態では、連結テープ４１の幅Ｔを、前後の接着材テープ１の幅Ｗよりも狭くすることで、連結テープ４１を認識している。また、接着装置１５には、接着材テープ１を挟んだ対向位置に第１実施の形態と同様な発光部及び受光部を設けている。この場合、連結テープ４１の幅狭部分を透過したレーザ光を受光部が受けることで、連結テープ４１を認識している。
【００１７】
図６に示す第３実施の形態では、連結テープ４１に、多数の孔５３を形成して連結テープ４１を認識している。この場合も、連結テープ４１の孔５３を透過したレーザ光を受光部が受けることで、連結テープ４１を認識している。
【００１８】
図７に示す第４実施の形態では、連結テープ４１で接着材テープ１同士の接続を行わず、一方の接着材テープ１の巻き出しが終了すると、他方の接着材テープ１を巻き出しリール１７に巻き付けて、接着材テープ１の交換を行っている。この場合においても、接着装置への新たな接着材テープリールの装着が不要であるので、新たな接着材テープリールの交換作業が少なくて済み、電子機器の生産効率が高まる。
本発明は、上述した実施の形態に限らず、本発明の要旨を逸脱しない範囲で種々変形可能である。
例えば、上述した第１及び第２実施の形態において、巻き部２、２ａは特に制限はなく幾つあってもよい。
第１乃至第３実施の形態において、連結テープ４１を光学的に検知しているが、その他連結テープ４１に磁気テープを巻いて磁気センサでこれを検知するようにしても良い。
【００１９】
請求項１に記載の発明によれば、一方の巻き部に巻かれた接着材テープの巻き出しが終了すると、隣の巻き部に巻かれた接着材テープを巻取りリールに取り付けて、接着材テープの交換を行うので、接着装置への新たな接着材テープリールの装着が不要である。従って、新たな接着材テープリールの交換作業が少なくて済み、電子機器の生産効率が高まる。
請求項１に記載の発明によれば、上記効果を奏するとともに、一方の接着材テープの終端部と他方の接着材テープの始端部とが、連結テープで接続されているので、一方の接着材テープリールの接着材テープの巻き出しが終了した後、他方の巻き部の接着材テープを巻取りリールに取り付ける作業が不要となり、電子機器の生産効率がさらに高まる。
請求項２に記載の発明によれば、連結テープは自動的に巻取りリールに巻き取られるので、一方の巻き部の接着材テープが終了した後に、順次、次の巻き部から接着材テープを繰り出すことができる。
また、連結テープをテープ検知手段が検知すると、連結テープが圧着部を通過するまで、連結テープを自動的に巻取りリールに巻き取るので、巻取りの手間を省くことができる。
【図面の簡単な説明】
【図１】 第１実施の形態にかかる接着材テープリールを示す図であり、（ａ）は接着材テープリールを示す斜視図であり、（ｂ）は（ａ）における正面図であり、（ｃ）は（ａ）における連結テープの平面図である。
【図２】 接着装置における接着剤の圧着工程を示す概略図である。
【図３】 回路基板と配線回路（電子部品）との接着を示す断面図である。
【図４】 接着材テープの製造方法を示す工程図である。
【図５】 本発明の第２実施の形態における、連結テープの平面図である。
【図６】 本発明の第３実施の形態における、連結テープの平面図である。
【図７】 本発明の第４実施の形態における、接着材テープリールを示す斜視図である。
【符号の説明】
Ａ．接着材テープリール、 １．接着材テープ、
２、２ａ．接着材テープの巻き部（巻き部）、 ３、３ａ．リール、
５．巻き芯、 ７．側板、 ９．基材、 １１．接着剤、 １３．導電粒子、
１５．接着装置、 １７．巻取りリール、 １９．加熱加圧ヘッド、
２１．回路基板、 ２２．ガイドピン、 ２３．配線回路(電子部品)、
２５．巻出機、 ２７．コーター、 ２８．エンドマーク、 ２９．乾燥炉、
３０．終端部、 ３１．巻取機、 ３２．始端部、 ３３．スリッタ、
４１．連結テープ、 ４２．切欠け部分、 ４３、４５．マーク、
４７．発光部、 ４９．受光部、 ５１．制御装置。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive tape that bonds and fixes an electronic component and a circuit board or circuit boards and electrically connects both electrodes, and particularly relates to an adhesive tape reel wound in a reel shape and an adhesive device. .
[0002]
[Prior art]
In general, as a method of bonding and fixing an electronic component such as a liquid crystal panel, PDP (plasma display panel), EL (fluorescent display) panel, bare chip mounting, etc., a circuit board, and circuit boards, and electrically connecting both electrodes, Adhesive tape is used.
Patent Document 1 discloses a tape in which an adhesive tape having a base material coated with an adhesive is wound up in a reel shape.
This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around the reel is about 50 m.
When the adhesive tape is mounted on the bonding apparatus, the adhesive tape reel having the adhesive tape wound around the reel is attached to the bonding apparatus, and the starting end portion of the adhesive tape is pulled out and attached to the take-up reel. Then, an adhesive is pressure-bonded to a circuit board or the like with a heating and pressing head from the base material side of the adhesive tape unwound from the adhesive tape reel, and the remaining base material is wound around the take-up reel.
When the adhesive tape of one adhesive tape reel is finished, remove the finished reel and the take-up reel that has wound up the base material, and install a new take-up reel and a new adhesive tape reel in the bonding device. The start end of the adhesive tape is attached to the take-up reel.
[0003]
[Patent Document 1]
JP-A-2001-284005
[Problems to be solved by the invention]
However, with the recent increase in panel screen size in PDPs and the like, the adhesion area of circuit boards has increased, and the amount of adhesive used at one time has increased. Moreover, since the use of adhesives has expanded, the amount of adhesives used has increased. For this reason, in an electronic device manufacturing factory, the frequency of replacement of the adhesive tape reel is increased, and it takes time to replace the adhesive tape reel, so that there is a problem that the production efficiency of the electronic device cannot be improved.
To solve this problem, it is conceivable to increase the number of adhesive tapes wound around the reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. Since the width is as narrow as 1 to 3 mm, if the number of windings is increased, collapse may occur. Further, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape and cause blocking.
Further, when the number of windings of the adhesive tape is increased, the diameter of the reel increases, and it is difficult to mount the reel on the existing bonding apparatus, and the existing bonding apparatus may not be used.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an adhesive tape reel and an adhesive device that can easily replace an adhesive tape reel and can improve the production efficiency of an electronic device.
[0005]
In order to solve the above problems, the invention described in claim 1, the contact Chakuzai tape adhesive for electrode connection is applied to a substrate, the winding portion wound on a reel having a side plate, the adhesive A plurality of adhesive tape reels provided in the width direction of the material tape, comprising a connecting tape that connects a terminal portion of one adhesive tape and a starting end portion of the other adhesive tape, and the connecting tape includes a side plate Arranged along the inner surface and locked to the notch formed on the upper part of the side plate, when the unwinding of one adhesive tape is finished, the feeding of the other adhesive tape is then started. characterized in that that.
In the first aspect of the present invention, since the plurality of winding portions (winding portions) of the adhesive tape are provided, the unwinding of the adhesive tape wound around one of the winding portions is completed. Then, the adhesive tape of the other winding portion arranged next to the winding portion that has been unwound is attached to the take-up reel.
In this way, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel and the adhesive tape is replaced, so that a new adhesive tape reel is mounted on the bonding apparatus. Is unnecessary. Therefore, the replacement work of a new adhesive tape reel can be reduced, and the production efficiency of the electronic device is increased.
Adhesive tape wound around multiple windings can be used in sequence, greatly increasing the amount of adhesive that can be used in a single replacement operation without increasing the number of turns of adhesive tape per adhesive tape reel Can be increased. Further, since the number of windings of the adhesive tape is not increased, the collapse of the adhesive tape can be prevented, and the so-called blocking in which the adhesive tape oozes out as the adhesive oozes out in the width direction of the tape can be prevented. It is possible to prevent adverse effects such as elongation of the base material that are likely to occur due to the length of the material.
In addition, according to the invention described in claim 1, since the above-described effects are achieved, the terminal end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape. After the winding of the adhesive tape of one winding part is completed, the work of attaching the adhesive tape of the other winding part to the take-up reel becomes unnecessary, and the production efficiency of the electronic device is further increased.
[0007]
According to a second aspect of the present invention, there is provided an adhesive tape reel according to the first aspect of the present invention, an adhesive tape take-up reel, an adhesive tape reel and a take-up reel. In the adhesive device having a pressure bonding part for bonding the adhesive of the adhesive tape to the circuit board of the electronic device and a tape detection means for detecting the connection tape, when the tape detection means detects the connection tape The connecting tape is wound around a take-up reel until the connecting tape passes through the crimping portion.
According to the second aspect of the present invention, since the connecting tape is automatically wound on the take-up reel, after the adhesive tape of one winding portion is finished, the adhesive tape is sequentially applied from the next winding portion. Can be paid out.
When the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound on the take-up reel until the connecting tape passes through the crimping portion, so that the time and labor of winding can be saved. As the tape detection means, for example, a bonding device is provided with a pair of a light emitting part and a light receiving part to optically detect the connecting tape. On the other hand, a colored (for example, black) mark is provided at both ends of the connecting tape, and the light receiving unit detects the mark at both ends of the connecting tape by laser light emitted from the light emitting unit, and determines the connecting tape. Yes. In addition to marking the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connecting tape may be used .
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. First, the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a view showing an adhesive tape reel according to the first embodiment, (a) is a perspective view showing the adhesive tape reel, (b) is a front view in (a), and (c) ) Is a plan view of the connecting tape in (a), FIG. 2 is a schematic view showing the pressure bonding step of the adhesive in the bonding apparatus, FIG. 3 is a cross-sectional view showing the bonding between the circuit boards, and FIG. It is process drawing which shows the manufacturing method of an adhesive tape.
[0009]
As shown in FIG. 1, the adhesive tape reel A according to the present embodiment includes a plurality of adhesive tape winding portions (hereinafter referred to as winding portions) 2 and 2a, and the winding portions 2 and 2a are reels 3 respectively. The adhesive tape 1 is wound around 3a. Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in FIG. 2, the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
Among the plurality of winding portions 2 and 2a, an adhesive tape wound around one winding portion 2 (hereinafter referred to as one adhesive tape) 1 and an adhesive tape wound around the other winding portion (hereinafter referred to as one adhesive tape) A connecting tape 41 for connecting the two is provided between the first end 32 of the other adhesive tape 1. The connecting tape 41 is disposed along the inner surface of the side plate 7 of the reel 3 from the end portion 30 of the one adhesive tape 1, and is engaged with a notch portion 42 formed on the upper portion of the side plate 7. It is connected to the start end portion 32 of the adhesive tape 1.
In addition, marks 43 and 45 for recognizing the connecting tape 41 are attached to the connecting portions of the one and the other adhesive tapes 1 and the connecting tape 41, and the tape detecting means (light emitting unit 47, light receiving unit 49) When the marks 43 and 45 are detected, the connecting tape 41 portion is skipped so that pressure bonding is not performed on the connecting tape 41 portion.
[0010]
As the base material 9, OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate), etc. are used in view of strength and releasability of the adhesive constituting the anisotropic conductive material. It is not a thing.
As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such resins include thermoplastic resin systems such as styrene resin systems and polyester resin systems, and thermosetting resin systems that use epoxy resin systems, vinyl ester resins, acrylic resin systems, and silicone resin systems. It is done.
[0011]
Conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like, and polymers such as non-conductive glass, ceramics, and plastics. The above-described conductive layer may be formed on a core material or the like by coating or the like. Furthermore, the insulating covering particle | grains which coat | cover the above-mentioned electrically conductive particle with an insulating layer, combined use of an electrically-conductive particle and an insulating particle, etc. are applicable. Heat melting metal such as solder or polymer core material such as plastic formed with a conductive layer is deformable by heating or pressing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, it does not show a melting point like solder, so the softening state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
[0012]
Next, a method of using the adhesive tape reel A according to this embodiment will be described. As shown in FIG. 2, the adhesive tape reel A and the take-up reel 17 are mounted on the bonding device 15, and the start end portion 32 of one adhesive tape 1 is hung on the guide pin 22 and attached to the take-up reel 17. Then, the adhesive tape 1 is fed out (arrow E in FIG. 2). Then, the adhesive tape 1 is arranged on the circuit board 21, and the adhesive tape 1 is pressed from the substrate 9 side by the heating and pressure head 19 arranged between the reels 3 and 17, and the adhesive 11 is connected to the circuit. Crimp to the substrate 21. Thereafter, the substrate 9 is taken up on the take-up reel 17.
After the above crimping (temporary connection), the electrode of the circuit board 21 and the electrode of the wiring circuit (electronic component) 23 are aligned and finally connected. In this connection, as shown in FIG. 3, a wiring circuit (or electronic component) 23 is disposed on the adhesive 11 that is pressure-bonded to the circuit board 21, and a polytetrafluoroethylene material 24 is used as a cushioning material as necessary. Then, the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19. Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 are connected.
[0013]
The PDP using the adhesive tape 1 according to the present embodiment is large in size, and may be crimped over the entire periphery of the PDP, and there are many connecting portions, and the adhesive 11 is used at once. The amount of use will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound around the reel 3 is increased, and the adhesive tape 1 wound around the reel 3 is wound around the take-up reel 17 in a relatively short time.
When the unwinding of one adhesive tape 1 is completed, the connecting tape 41 is detached from the notch portion 42, and then the other adhesive tape 1 is unwound. In the present embodiment, since the connecting tape 41 is provided between the terminal end 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1, the one adhesive tape 1 When the unwinding is completed, the other adhesive tape 1 can be continuously fed out. Therefore, after the unwinding of one adhesive tape 1 is completed, an operation of attaching a new adhesive tape 1 to the take-up reel 17 becomes unnecessary, and the production efficiency of the electronic device is increased.
[0014]
As shown in FIG. 2, the bonding apparatus 15 includes a pair of light emitting units 47 and light receiving units 49 and optically detects the connecting tape 41. Black marks 43 and 45 are attached to both ends of the connecting tape 41 that connects both the one adhesive tape 1 and the other adhesive tape 1. The light emitting unit 47 continuously emits laser light toward the adhesive tape 1, the light receiving unit 49 receives the reflected light, and sends the detection signal to the control device 51. Then, the light receiving unit 49 receives the reflected light of the marks 43 and 45 at both ends of the connecting tape 41, and the detection signal is sent to the control device 51.
Upon receiving the detection signal, the control device 51 outputs a control signal to the motor that drives the reels 3 and 17 of the bonding device 15 and starts outputting drive pulses to the motor via the motor driver. Then, the motor rotates in accordance with the number of pulses applied from the motor driver, and the adhesive tape 1 is moved by a distance corresponding to the length of the connecting tape 41 while moving both reels 3 and 17 at a speed faster than the normal speed. Is moved in the unwinding direction.
As a result, the other adhesive tape 1 is automatically fed out to the position of the heating and pressurizing head 19, and therefore the connecting tape until the start end portion 32 of the other adhesive tape 1 comes to the position of the heating and pressing head 19. The trouble of paying out 41 can be saved.
Since only the base material 9 is taken up by the take-up reel 17, several parts of the adhesive tape reel can be taken up, so that the number of exchanges of the take-up reel 17 can be reduced and the work efficiency can be reduced. Is good.
[0015]
Here, with reference to FIG. 4, the manufacturing method of the adhesive tape reel A concerning this Embodiment is demonstrated.
An adhesive mixed with resin and conductive particles is applied to a base material (separator) unwound from an unwinder 25 by a coater 27, dried in a drying furnace 29, and then unwound by a winder 31. take. The wound adhesive tape is cut into a predetermined width by a slitter 33 and wound around the winding core, and then the side plates 7 and 7 are attached to the winding core from both sides, or the winding core with the side plate. , Wound together with a dehumidifying material, and preferably shipped at a low temperature (−5 ° C. to −10 ° C.).
[0016]
Next, another embodiment of the present invention will be described. In the embodiment described below, the same reference numerals are given to the same portions as the above-described embodiments, and detailed description of the portions will be given. Omitted, the following description will mainly focus on differences from the above-described embodiment.
In the second embodiment shown in FIG. 5, the connecting tape 41 is recognized by making the width T of the connecting tape 41 smaller than the width W of the front and rear adhesive tapes 1. In addition, the bonding device 15 is provided with a light emitting unit and a light receiving unit similar to those in the first embodiment at opposing positions with the adhesive tape 1 interposed therebetween. In this case, the connection tape 41 is recognized by the light receiving unit receiving the laser beam transmitted through the narrow portion of the connection tape 41.
[0017]
In the third embodiment shown in FIG. 6, the connecting tape 41 is recognized by forming a large number of holes 53 in the connecting tape 41. In this case as well, the coupling tape 41 is recognized by the light receiving unit receiving the laser light transmitted through the hole 53 of the coupling tape 41.
[0018]
In the fourth embodiment shown in FIG. 7, the connecting tape 41 does not connect the adhesive tapes 1 to each other, and when the unwinding of one adhesive tape 1 is completed, the other adhesive tape 1 is unwound. The adhesive tape 1 is exchanged. Even in this case, since it is not necessary to mount a new adhesive tape reel to the bonding apparatus, the replacement work of the new adhesive tape reel can be reduced, and the production efficiency of the electronic device is increased.
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
For example, in the first and second embodiments described above, the winding portions 2 and 2a are not particularly limited and may be any number.
In the first to third embodiments, the connecting tape 41 is optically detected. However, a magnetic tape may be wound around the other connecting tape 41 and this may be detected by a magnetic sensor.
[0019]
According to the first aspect of the present invention, when the unwinding of the adhesive tape wound around one winding portion is completed, the adhesive tape wound around the adjacent winding portion is attached to the take-up reel, and the adhesive material Since the tape is exchanged, it is not necessary to install a new adhesive tape reel in the bonding apparatus. Therefore, the replacement work of a new adhesive tape reel can be reduced, and the production efficiency of the electronic device is increased.
According to the first aspect of the present invention, the above effect is achieved, and since the terminal end of one adhesive tape and the start end of the other adhesive tape are connected by the connecting tape, one adhesive After the unwinding of the adhesive tape on the tape reel is completed, the work of attaching the adhesive tape of the other winding portion to the take-up reel becomes unnecessary, and the production efficiency of the electronic device is further increased.
According to the invention described in claim 2 , since the connecting tape is automatically wound on the take-up reel, after the adhesive tape of one winding portion is finished, the adhesive tape is sequentially applied from the next winding portion. You can pay out.
When the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound on the take-up reel until the connecting tape passes through the crimping portion, so that the time and labor of winding can be saved.
[Brief description of the drawings]
FIG. 1 is a view showing an adhesive tape reel according to a first embodiment, (a) is a perspective view showing an adhesive tape reel, and (b) is a front view in (a). c) is a plan view of the connecting tape in FIG.
FIG. 2 is a schematic view showing a bonding step of an adhesive in the bonding apparatus.
FIG. 3 is a cross-sectional view showing adhesion between a circuit board and a wiring circuit (electronic component).
FIG. 4 is a process diagram showing a method for producing an adhesive tape.
FIG. 5 is a plan view of a connecting tape according to a second embodiment of the present invention.
FIG. 6 is a plan view of a connecting tape in a third embodiment of the present invention.
FIG. 7 is a perspective view showing an adhesive tape reel in a fourth embodiment of the present invention.
[Explanation of symbols]
A. Adhesive tape reel, 1. Adhesive tape,
2, 2a. Winding part (winding part) of adhesive tape 3, 3, 3a. reel,
5. 6. winding core, Side plate, 9. Base material, 11. Adhesive, 13. Conductive particles,
15. Bonding apparatus, 17. Take-up reel, 19. Heating and pressure head,
21. Circuit board, 22. Guide pins, 23. Wiring circuit (electronic parts),
25. Unwinder, 27. Coater, 28. End mark, 29. drying furnace,
30. End portion, 31. Winding machine, 32. The beginning, 33. Slitter,
41. Connecting tape, 42. Notched portion, 43, 45. mark,
47. Light emitting section, 49. Light receiving section, 51. Control device.

Claims (2)

電極接続用の接着剤が基材に塗布された接着材テープを、両側板を有するリールに巻いた巻き部が、接着材テープの幅方向に複数設けられた接着材テープリールであって、
一方の接着材テープの終端部と他方の接着材テープの始端部とを接続する連結テープを備え、
連結テープが、側板の内側面を沿うように配置され且つ側板の上部に形成された切欠け部分に係止しており、
一方の接着材テープの巻き出しが終了すると、続いて他方の接着材テープの繰り出しが開始されることを特徴とする接着材テープリール。An adhesive tape reel in which a plurality of winding portions in which an adhesive tape in which an adhesive for electrode connection is applied to a base material is wound around a reel having both side plates is provided in the width direction of the adhesive tape,
It has a connecting tape that connects the end of one adhesive tape and the start of the other adhesive tape,
The connecting tape is disposed along the inner side surface of the side plate and is locked to a notch portion formed in the upper portion of the side plate,
An adhesive tape reel characterized in that when the unwinding of one adhesive tape is completed, the other adhesive tape is subsequently started to be unwound. 請求項１記載の接着材テープリールと、接着材テープの巻取りリールと、接着材テープリールと巻取りリールとの間に設けられ且つ加熱加圧ヘッドで接着材テープの接着剤を電子機器の回路基板に圧着する圧着部と、連結テープを検知するテープ検知手段とを備えた接着装置であって、
テープ検知手段が連結テープを検知した場合には、連結テープが圧着部を通過するまで連結テープを巻取りリールに巻き取ることを特徴とする接着装置。An adhesive tape reel according to claim 1, an adhesive tape take-up reel, an adhesive tape reel and a take-up reel provided between the adhesive tape reel and the take-up reel. A bonding apparatus including a crimping portion for crimping to a circuit board and a tape detection means for detecting a connecting tape,
An adhesive device characterized in that, when the tape detection means detects the connection tape, the connection tape is wound around a take-up reel until the connection tape passes through the crimping portion.
JP2002371889A 2002-07-30 2002-12-24 Adhesive tape reel and bonding apparatus Expired - Fee Related JP4608839B2 (en)

Priority Applications (26)

Application Number Priority Date Filing Date Title
JP2002371889A JP4608839B2 (en) 2002-12-24 2002-12-24 Adhesive tape reel and bonding apparatus
CN2008102146479A CN101402423B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape and adhesive material tape connector
KR1020097017836A KR100970800B1 (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape
KR1020087019045A KR20080075565A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
PCT/JP2003/009694 WO2004011356A1 (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape
CNB038180847A CN100548840C (en) 2002-07-30 2003-07-30 The method of attachment of adhesive material tape connector and adhesive material tape
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel
CN201410378540.3A CN104152075B (en) 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor
CN2010102460213A CN101905817B (en) 2002-07-30 2003-07-30 Method of connecting adhesive material tape
CN 201110456093 CN102556726A (en) 2002-07-30 2003-07-30 Bonding material band and production method thereof
KR1020107001127A KR100953011B1 (en) 2002-07-30 2003-07-30 Method of producing adhesive material tape
CN2010102345094A CN101920862B (en) 2002-07-30 2003-07-30 Crimping connection method of adhesive tapes
CN2008102146483A CN101402832B (en) 2002-07-30 2003-07-30 Adhesive material tape and anisotropic conductive material tape
CN2008102146498A CN101417758B (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, and adhering apparatus
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
KR1020087005685A KR100981478B1 (en) 2002-07-30 2003-07-30 Connecting structure
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
KR1020067012942A KR100690379B1 (en) 2002-07-30 2003-07-30 Adhesive material tape, adhesive material-tape reel, adhering device and adhesive agent-tape cassette
KR1020067012929A KR100700438B1 (en) 2002-07-30 2003-07-30 Anisotropic electroconductive tape
KR1020077011959A KR20070063606A (en) 2002-07-30 2003-07-30 Adhesive material tape and method of producing the tape
KR1020107007008A KR20100041890A (en) 2002-07-30 2003-07-30 Adhesive material tape
KR1020087012294A KR20080064886A (en) 2002-07-30 2003-07-30 Adhesive material tape
CN2010102345395A CN101920863B (en) 2002-07-30 2003-07-30 Method for producing adhesive materials for tapes composed with the same
CN2009101730706A CN101648658B (en) 2002-07-30 2003-07-30 Connection method of adhesive material tape and adhesive material connector

Applications Claiming Priority (1)

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JP2002371889A JP4608839B2 (en) 2002-12-24 2002-12-24 Adhesive tape reel and bonding apparatus

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JP5190024B2 (en) * 2009-05-27 2013-04-24 株式会社日立ハイテクノロジーズ ACF sticking device and flat panel display manufacturing device
US9248745B1 (en) * 2014-09-16 2016-02-02 Robert Bosch Gmbh Wheel stability control based on the moment of an electrical motor

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JPS5386739A (en) * 1977-01-10 1978-07-31 Yasuhide Inoue Continuous method of supplying adhesive tape strips and adhesive tape
JPS6036572Y2 (en) * 1979-08-31 1985-10-30 東洋インキ製造株式会社 adhesive tape
JPH06263330A (en) * 1993-03-11 1994-09-20 Matsushita Electric Ind Co Ltd Supply reel for conductive film tape
JPH08119524A (en) * 1994-10-12 1996-05-14 Minnesota Mining & Mfg Co <3M> Continuous feeder of continuously attaching tape using a plurality of tape rolls
JPH10310743A (en) * 1997-05-12 1998-11-24 Hitachi Chem Co Ltd Application of anisotropic electroconductive adhesive tape and apparatus therefor
JP2001284005A (en) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd Anisotropic conductive material tape
JP2001354920A (en) * 2000-06-14 2001-12-25 Sekisui Chem Co Ltd Self-adhesive tape roll

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JPS5386739A (en) * 1977-01-10 1978-07-31 Yasuhide Inoue Continuous method of supplying adhesive tape strips and adhesive tape
JPS6036572Y2 (en) * 1979-08-31 1985-10-30 東洋インキ製造株式会社 adhesive tape
JPH06263330A (en) * 1993-03-11 1994-09-20 Matsushita Electric Ind Co Ltd Supply reel for conductive film tape
JPH08119524A (en) * 1994-10-12 1996-05-14 Minnesota Mining & Mfg Co <3M> Continuous feeder of continuously attaching tape using a plurality of tape rolls
JPH10310743A (en) * 1997-05-12 1998-11-24 Hitachi Chem Co Ltd Application of anisotropic electroconductive adhesive tape and apparatus therefor
JP2001284005A (en) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd Anisotropic conductive material tape
JP2001354920A (en) * 2000-06-14 2001-12-25 Sekisui Chem Co Ltd Self-adhesive tape roll

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