WO2004011356A1 - Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape - Google Patents

Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape Download PDF

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Publication number
WO2004011356A1
WO2004011356A1 PCT/JP2003/009694 JP0309694W WO2004011356A1 WO 2004011356 A1 WO2004011356 A1 WO 2004011356A1 JP 0309694 W JP0309694 W JP 0309694W WO 2004011356 A1 WO2004011356 A1 WO 2004011356A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive tape
reel
tape
wound
Prior art date
Application number
PCT/JP2003/009694
Other languages
French (fr)
Japanese (ja)
Inventor
Naoki Fukushima
Takashi Tatsuzawa
Takahiro Fukutomi
Kouji Kobayashi
Toshiyuki Yanagawa
Masami Yusa
Motohiro Arifuku
Yasushi Gotoh
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Publication of WO2004011356A1 publication Critical patent/WO2004011356A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Definitions

  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, a connection method thereof, a manufacturing method, and a crimping method.
  • TECHNICAL FIELD The present invention relates to a method, an adhesive tape reel, an adhesive device, an adhesive tape cassette and an adhesive pressure bonding method using the same, and particularly to an adhesive tape wound in a reel shape, a connection method thereof, a manufacturing method, a pressure bonding method, and an adhesive tape. Reel, bonding equipment, adhesive tape
  • the present invention relates to pukaset, an adhesive bonding method using the same, and an anisotropic conductive material tape.
  • a liquid crystal panel a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare-chip mounting
  • a circuit board and a circuit board are adhered and fixed to each other, and both electrodes are electrically connected.
  • Adhesive tape is used as a means for making the connection.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. I have.
  • a conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • a reel of the adhesive tape (hereinafter, simply referred to as “adhesive reel”) is attached to the adhesive device, and the starting end of the adhesive tape is pulled out. Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. . '
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • the present invention provides a method of connecting an adhesive tape, which enables easy replacement of an adhesive reel and can improve the production efficiency of an electronic device, an adhesive tape, and its production. It is an object of the present invention to provide a method, a crimping method, an adhesive tape, a bonding device, an adhesive tape cassette, a method for crimping an adhesive using the cassette, and an anisotropic conductive material tape.
  • the invention described in claim 1 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the end of the unwound adhesive tape using the adhesive of the adhesive tape and the end of the newly mounted adhesive tape Since the adhesive reel is replaced by bonding to the start end, it is easy to attach a new adhesive tape to the bonding device.
  • there is no need to replace the take-up tape attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on the predetermined path each time a new adhesive tape is replaced. Reel replacement time is reduced, and the production efficiency of electronic equipment is increased.
  • connection portion can be rationally used by using the heating and pressurizing head of the bonding device for mounting the adhesive reel.
  • the invention described in claim 2 is characterized in that, in the invention described in claim 1, the end mark of one of the adhesive tapes is provided with an end mark.
  • the adhesive tape having the same effects as the first aspect of the present invention and the unwinding is completed. Can be cut when the endmark is exposed, so the cutting and connecting parts are easy to understand and can be connected at the minimum necessary position, so there is no adhesive tape! : Can be prevented.
  • the invention described in claim 3 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other reel.
  • Roll A method of connecting an adhesive tape to the other adhesive tape wherein a starting end of the other adhesive tape is attached to a base material surface of an adhesive tape wound around a reel with a lead tape. After turning over the end of one adhesive tape, the adhesive surface of the lead tape is overlapped with the adhesive surface of the end of one adhesive tape, and the overlapped portion is heated and pressed.
  • the third aspect of the present invention it is possible to easily attach a new adhesive tape to the bonding apparatus, similarly to the first aspect of the present invention.
  • the time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • the invention described in claim 4 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the invention described in claim 5 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel.
  • Roll T / JP2003 / 009694 This is a method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are overlapped with each other. It is characterized in that a locking pin is inserted into the overlapped portion for connection.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are fixed with the locking pins. So the connection is easy.
  • there is no need to replace the take-up tape attach the starting end of the new adhesive tape to the take-up reel, and set guide bins or the like in a predetermined path every time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
  • the invention described in claim 6 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • a method of connecting an adhesive tape for connecting the other adhesive tape to the other adhesive tape using a locking member wherein the locking member is provided with a claw provided at one and the other end.
  • An elastic member is provided between the claws, and the end of one adhesive tape and the start of the other adhesive tape are abutted to each other. It is characterized in that it is locked to the end of the material tape, the claw provided at the other end is locked to the start of the other adhesive tape, and both claws are pulled by an elastic member.
  • one claw portion of the locking member is locked to the end portion of the one adhesive tape, and then the locking member is The other claw portion is locked to the starting end of the other adhesive tape and the two are connected to each other, so that the connection is easy.
  • the elastic member is provided between the one claw portion and the other claw portion, the elastic member is extended, and the other claw portion of the locking member is positioned at an arbitrary position of the starting end of the other adhesive tape. The connection can be locked, so the degree of freedom of connection is high.
  • connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other. Can be connected, so that the adhesive tape can be prevented from being wasted.
  • the invention described in claim 7 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • the overlapping portion of one adhesive tape and the other adhesive tape is formed by combining one adhesive tape with the other adhesive tape. It is characterized in that a portion to be overlapped with the lip is sandwiched by metal holding pieces having a substantially U-shaped cross section, and the holding pieces are crushed from both sides of the overlapping portion to connect the two. According to the invention as set forth in claim 8, since the sandwiching pieces are crushed from both sides of the overlapping portion to connect them, the connection strength of the overlapping portion of the adhesive tape is increased. be able to.
  • the invention described in claim 9 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel.
  • V A method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are connected to one of the base surfaces. The other adhesive surface is overlapped, and the overlap length of the two is set in a range of 2 to 50 times the width of the adhesive tape, and the two are connected by heating and pressing.
  • the end of the adhesive tape completed by using the adhesive of the adhesive tape and the start of the adhesive tape to be newly mounted are provided.
  • the adhesive reel is replaced by bonding the new adhesive reel to the new adhesive reel. Also, each time a new adhesive reel is replaced, Since there is no need to replace the tape or attach the beginning of the new adhesive to the take-up reel, the time required to replace the new adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
  • the length of the overlapped portion is set to 2 to 50 times the width of the adhesive tape is that if it is less than 2 times, sufficient connection strength cannot be obtained, and 50 times or more. If it is too large, too much adhesive will be used for the connection, and the adhesive will be wasted.
  • connection portion can be rationally used by using a heating and pressurizing head of the bonding device for mounting the adhesive reel.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 10 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel.
  • This is a method of connecting an adhesive tape to connect the other adhesive tape wound, wherein the end of one adhesive tape is bent in a direction facing the adhesive, and the starting end of the other adhesive tape is bent.
  • the method is characterized in that the adhesive is bent in a direction facing each other, the bent portions of the two are overlapped with each other, and the surfaces of the adhesives are opposed to each other, and the overlapped portion is heat-pressed.
  • the same operation and effect as those of the first aspect of the present invention can be obtained, and at the same time, the one end of the adhesive tape and The starting end of the other adhesive tape is hooked to each other and locked, and the two connect the adhesive surfaces to each other, so that the connection strength is high.
  • the invention described in claim 11 is the invention according to claim 9 or claim 10, wherein one end of the adhesive tape is Is characterized by having an end mark.
  • the end of one adhesive tape can be made at the end mark portion, so that the connecting portion is easy to understand and Since the connection can be made at the minimum necessary position, waste of the adhesive tape can be prevented.
  • the end mark can be automatically detected, and the device can be controlled or an alarm can be issued based on the detection signal to improve work efficiency.
  • the method is characterized in that a portion to be overlapped with the mold is sandwiched between one mold having irregularities and the other mold that fits in the mold, and then heat-pressed.
  • connection area can be increased, and the connection strength in the tensile direction (longitudinal direction) of the adhesive tape can be increased by the engagement of the concavo-convex portions.
  • the invention described in claim 5 is the invention according to any one of claims 1 to 3, wherein one of the adhesive tapes and the other is After forming a through hole in the overlapped portion of the above, the overlapped portion is heat-pressed.
  • the invention described in claim 14 is characterized in that an adhesive for electrode connection is applied to a silicone-treated substrate, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the two adhesive tapes are connected to each other by affixing or joining the portions of the two adhesive tapes straddling the surface of the silicone-treated base material with a silicone adhesive tape.
  • the reel for winding one of the adhesive tapes and the winding reel for winding only the base material of the adhesive tape are provided.
  • the end of the completed adhesive tape (one adhesive tape) and the adhesive tape on the newly installed adhesive reel Connect the start end of one tape (the other adhesive tape) with the silicone adhesive tape, and replace the finished adhesive reel with a new adhesive reel and attach it to the bonding machine o
  • the new adhesive reel is mounted on the bonding apparatus. Can be easily done. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, attach the start end of the new adhesive tape to the take-up reel, or hang the adhesive tape on the guide. The replacement time is short, and the production efficiency of electronic equipment is increased.
  • the base material of the adhesive tape is surface-treated with silicone, and by using a silicone adhesive also for the adhesive tape to be used, the difference in surface tension between the two is reduced, and the adhesive force is increased. Therefore, the bonding between the two, which has been difficult in the past, can be realized.
  • the adhesive of the adhesive tape may be anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be only an insulating adhesive. Insulating spacer particles may be dispersed in the adhesive.
  • the invention described in claim 15 is a silicone adhesive tape according to claim 14, wherein the surface tension of the adhesive surface and the silicone tape of the adhesive tape are reduced. Characterized in that the difference from the surface tension of the coated substrate is 1 OmNZm (10 dyne / cm) or less.
  • claim 1 In addition to providing the same effect as the invention described in Item 4, the difference between the surface tension of the adhesive surface of the silicone adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape is 1 OmN. By setting it to / m (10 dyne / cm) or less, a strong adhesion can be obtained and both can be securely bonded. Surface tension can be measured by wetting reagent or contact angle.
  • the difference in surface tension between the silicone-treated base material of the adhesive tape and the adhesive surface of the silicone adhesive tape is preferably 0 to 5 mNZm (5 dyne / cm). The reason for this is that the smaller the difference in surface tension, the better. If the difference exceeds 1 OmN / m (10 dyne / cm), sufficient adhesion strength may not be obtained.
  • the invention described in claim 16 is the invention described in claim 2, wherein the silicone adhesive tape has an adhesive force of 100 gZ25 mm or more. There is a feature.
  • the same operation and effect as those of the invention described in claim 2 can be obtained, and the connection of one and the other adhesive tapes can be achieved. Since a silicone pressure-sensitive adhesive tape can be adhered to both surfaces of the adhesive, the adhesive tape can be adhered with high strength by adhering (or adhering) one and the other adhesive tapes from both surfaces.
  • the adhesive force is 100 ⁇ / 25111111 or more, it is possible to more firmly bond the one and the other adhesive tapes to both adhesive surfaces.
  • the adhesive strength is large, a strong adhesive strength can be obtained, but if it is smaller than 100 g / 25 mm, a predetermined strength may not be obtained.
  • the invention described in claim 17 is the invention described in claim 16, wherein the silicone pressure-sensitive adhesive tape described in claim 16 is used for: The end portion of the adhesive tape and the start end of the other adhesive tape are overlapped or abutted, and attached to both sides of both adhesive tapes for connection. According to the invention as set forth in claim 17, the same operation and effect as those of the invention as set forth in claim 16 can be obtained, and one and the other adhesive materials can be used. Since the loops are connected on both sides, a stronger connection can be obtained.
  • the invention described in claim 18 is characterized in that an adhesive for electrode connection is applied to a silicone-treated base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the two adhesive tapes are connected by sandwiching a silicone adhesive tape coated on both sides with a silicone adhesive, and the difference between the silicone adhesive on both sides and the surface tension of the silicone substrate is 10 mN / m (10 dyneZcm) or less.
  • the adhesive strength is 100 g / 25 mm or more.
  • a double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape.
  • the two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
  • the invention described in claim 19 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are made of a paste-like resin. Connection is easy because it is fixed with adhesive.
  • the take-up tape is replaced and the beginning of the new adhesive tape is attached to the take-up reel. Since there is no need to perform the work of setting the guide pins etc. on the predetermined path, the time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • a resin adhesive is applied at a portion where the end of one adhesive tape is overlapped or abutted with the beginning of the other adhesive tape, so that the degree of freedom of connection is high.
  • the invention described in claim 20 is the invention according to claim 19, wherein the resin adhesive is a thermosetting resin, a photocurable resin, or a hot melt resin. It is characterized by being made of at least one material selected from the group of adhesives.
  • thermosetting resin adhesive is used.
  • a suitable resin adhesive for connecting adhesive tapes can be selected from the group of adhesive resins, photo-curing resins, and hot melt adhesives, and the connection strength between adhesive tapes can be increased. it can.
  • the invention described in claim 21 is a bonding apparatus to which an adhesive tape is mounted, wherein the resin according to claim 19 or claim 20 is provided. It is characterized by being provided with a filler for supplying a bonding agent.
  • the resin adhesive according to claim 19 or claim 20 is provided in the bonding apparatus. Since a filling machine is provided, it is not necessary to prepare a separate filling machine, and waste of connection work can be prevented.
  • the bonding apparatus may be provided with a heater for curing the thermosetting resin or an ultraviolet ray for irradiating the photocurable resin with light.
  • the invention set forth in claim 22 is an adhesive tape that is formed by applying an adhesive for electrode connection to a base material and winding an adhesive tape on a reel.
  • the adhesive tape reel has a plurality of adhesive tape windings in the width direction of the tape. It is characterized by.
  • the invention described in claim 23 is the invention according to claim 22, wherein the end of one adhesive tape and the start of the other adhesive tape are provided. And a connecting tape for connecting the two, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
  • the same operation and effect as those of the invention described in claim 22 can be obtained, and the end of one of the adhesive tapes can be obtained. Is connected to the start end of the other adhesive tape by the connecting tape, so that after the unwinding of the adhesive tape of one winding part is completed, the adhesive tape of the other winding part is finished. There is no need to attach the reels to the take-up reel, further increasing the production efficiency of electronic equipment. Bureau.
  • the invention described in claim 24 is an adhesive tape reel according to claim 23, a winding reel for an adhesive tape, and an adhesive material.
  • a crimping portion provided between the tape reel and the take-up reel and for crimping the adhesive of the adhesive tape onto the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the connection tape. And when the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the pressure bonding portion.
  • the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
  • the tape detecting means detects the connecting tape
  • the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion. Can be omitted.
  • the tape detecting means for example, a bonding device is provided with a pair of light emitting units and a light receiving unit, and optically detects the connecting tape.
  • colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the mark at both ends of the connecting tape by the laser beam emitted from the light emitting unit, and judges the connecting tape. are doing.
  • a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
  • the invention described in claim 25 is an adhesive tape in which the end of one adhesive tape and the start of the other adhesive tape are connected using a fastener.
  • the reel is characterized in that the connecting portion is covered with the adhesive tape by the adhesive tape.
  • the unwinding is completed.
  • the end of the adhesive tape and the beginning of the new adhesive tape are connected using a fastener, and the adhesive tape reel is replaced, so a new adhesive tape to the bonding device is used.
  • Easy installation of prills there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced.
  • New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
  • Adhesive tapes can be used sequentially, so that the adhesive tape can be used in one exchange without increasing the number of adhesive tapes wound per adhesive tape.
  • the dosage can be greatly increased.
  • the number of windings of the adhesive tape is not increased, it is possible to prevent winding collapse and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. Further, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur due to the longer base material.
  • connection between the end of one adhesive tape and the start of the other adhesive tape covers the locking member with the adhesive tape, so that the appearance is good.
  • fastener at the connection part from being in contact with the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine with the fastener. I will not let you.
  • the end of one adhesive tape and the starting end of the other adhesive tape are connected by the locking tool, and then the connection is performed. It is preferable to fold the portion by 180 degrees in the longitudinal direction of the tape so that the locking member is covered with the adhesive tape.
  • connection portion may be wound with another adhesive tape so as to cover the locking member.
  • the invention described in claim 26 is the adhesive tape reel described in claim 1, an adhesive tape take-up reel, and an adhesive tape reel. And a take-up reel, and the adhesive tape is connected by a heating / pressing head.
  • An adhesive device that includes a crimping part for crimping an adhesive to a circuit board of an electronic device and a connection part detecting means for detecting a tape connection part, wherein the connection part detection means detects a tape connection part.
  • the method is characterized in that one adhesive tape is wound on a winding reel until the connection portion passes through the crimping portion.
  • connection portion detecting means detects the connection portion
  • one of the adhesive tapes is applied until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Also, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
  • connection portion detection means is a CCD camera, a thickness detection sensor, a transmittance detection sensor. Characterized in that:
  • connection portion can be detected with a simple configuration.
  • detection accuracy can be improved by using these means.
  • connection detecting means when a CCD camera is used as the connection detecting means, the connection is detected by capturing the surface of the connection on a monitor screen and comparing the density of pixels.
  • a thickness detection sensor when a thickness detection sensor is used, the thickness of the connection is greater than the thickness of the adhesive tape, so the change in thickness is compared to detect the connection.
  • a transmittance sensor when a transmittance sensor is used, the connection portion becomes thicker, and the transmittance decreases due to the presence of the locking member, and the connection portion is detected by comparing the transmittance values.
  • the method of connecting an adhesive tape according to claim 28 is a method for connecting an end portion of one adhesive tape and a start end portion of the other adhesive tape using a fastener. Contact Subsequently, the connection portion is characterized by covering the locking device with an adhesive tape.
  • the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are locked by using a fastener. Connection, and the adhesive tape reel is replaced, so that a new adhesive tape can be easily attached to the bonding equipment.
  • there is no need to replace the take-up tape attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced.
  • New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
  • the connecting portion between the end of one adhesive tape and the beginning of the other adhesive tape covers the locking member with the adhesive tape, so that it has good appearance and In this way, it is possible to prevent the adhesive at the connection part from contacting the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine. None.
  • the connecting portion may be wound with another adhesive tape so as to cover the locking member.
  • the invention described in claim 29 is a method in which an adhesive is applied to a base material.
  • the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, After heating and pressurizing the adhesive on the circuit board, the substrate is mounted so as to be wound up on an empty reel.
  • the amount of adhesive to be used can be greatly increased without increasing the number of windings of the adhesive tape.
  • the number of windings of the adhesive tape is not increased, it is possible to prevent the collapse of the winding, and to prevent the adhesive from leaking out in the width direction of the tape and blocking the wound tapes from adhering to each other.
  • the amount of adhesive per reel can be increased, so that the amount of reel material / moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive tape is wound on an empty reel, and then the adhesive of the next adhesive is used. The two reels mounted on the bonding machine may be exchanged.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the width of the substrate is 5 mn!
  • the thickness is preferably 1000 mm, but is arbitrarily selected depending on the width of one adhesive and the number of adhesives.
  • the width of one line of the adhesive is preferably from 0.5 mm to 1.0 mm.
  • the width of the base material is 5 mm or more: L000 mm is set when the width of the base material is less than 5 mm, the number of the adhesives provided on the base material divided by the adhesion. This is because not only is the width of the agent limited, but if it is larger than 100 mm, it may not be possible to attach it to existing bonding equipment.
  • the invention described in claim 30 is the invention described in claim 29, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
  • the invention described in claim 31 is the invention according to claim 29, wherein the adhesive is formed by a slit formed in the longitudinal direction of the tape. It is characterized by being separated into articles.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like when the adhesive tape is manufactured.
  • the slit may be formed by a laser, a heating wire, or the like, in addition to the cutting edge.
  • the number of the adhesive strips arranged on the base material can be increased.
  • the invention described in claim 32 is a method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, wherein an interval is provided in a width direction of the base material.
  • a plurality of adhesives are applied to the substrate by supplying the adhesive onto the surface of the substrate that is continuously conveyed from the applicator that is disposed.
  • the adhesive tape according to claim 30 can be manufactured using existing equipment.
  • the applicator may be a plurality of rolls provided in the width direction of the base material or a nozzle.
  • the invention described in claim 33 is a method of manufacturing an adhesive tape in which an adhesive is applied to a substrate and wound in a reel shape, wherein the adhesive tape is adhered to one entire surface of one substrate. After applying an adhesive, and then forming a longitudinal slit in the adhesive, the other substrate is placed on the adhesive surface, the adhesive is sandwiched between one and the other substrates, and then the one substrate And the other substrate are separated from each other, and a plurality of adhesives are alternately adhered to each of the one and the other substrates, and the plurality of adhesives are arranged at intervals on the one and the other substrates It is characterized by manufacturing things.
  • two adhesive tapes described in claim 3 can be manufactured at the same time, so that the manufacturing efficiency is excellent.
  • the invention described in claim 34 is a method for crimping an adhesive, in which an adhesive is applied to a base material and the adhesive is pressure-bonded to a circuit board using an adhesive tape wound in a reel shape.
  • the adhesive is applied to the entire surface of the base material, and the adhesive is A portion of the adhesive in the width direction of the tape is heated and pressed in a strip shape along the longitudinal direction of the tape from the base material side, thereby reducing the cohesive force of the adhesive in the heated portion and pressing the adhesive to the circuit board.
  • the remaining adhesive is wound up in a reel shape together with the base material, and the adhesive is heated and pressed onto the circuit board again using the adhesive tape wound up in the reel shape.
  • cohesive strength reduction line by heating a part of the adhesive, the cohesive strength of the part is reduced (hereinafter referred to as “cohesive strength reduction line”). ), The adhesive in the heated area from the cohesive strength reduction line is pressed against the circuit board and separates from the substrate. The remaining adhesive is wound onto an empty reel together with the substrate while remaining on the substrate.
  • the adhesive tape since the width of the adhesive tape is merely wider than in the past, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be pressed onto the circuit board can be set arbitrarily by changing the heating area, and the degree of freedom of the width of the adhesive to be pressed is high.
  • the tape width is 5 mn! ⁇ 100 mm is preferable, and the adhesive to be crimped to the circuit board is 0.5 mn! ⁇ 1.5 mm is preferred. Tape width from 5 mm to 100 m The reason for m is that if the tape width is less than 5 mm, the number of times the adhesive is crimped per reel will be reduced, and if it is more than 100 mm, it may not be possible to attach it to existing bonding equipment. Because there is.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of these adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 35 is an adhesive tape in which an adhesive is applied to a base material and wound on a reel, wherein the width of the adhesive tape is a circuit board.
  • the length of one side is equal to or longer than that of one side, and a plurality of adhesives are arranged in the width direction of the tape.
  • the adhesive tape is arranged so that the width thereof overlaps one side of the circuit board, and the adhesive tape provided in the width direction of the adhesive tape is provided.
  • One strip is directly heated and pressed along one side of the circuit board.
  • the adhesive tape may be drawn out by the width of the adhesive and used.
  • the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape, and the adhesive strip is heated and pressed to the other side. In this way, if the adhesive is sequentially pressed on the other side of the circuit board, the adhesive can be easily pressed on the four circumferences of the circuit board.
  • the adhesive having the length of one side or more of the circuit board is sequentially used one by one, and the amount of use at one time is only the width of the adhesive strip.
  • the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of windings.
  • the amount of the adhesive per reel can be increased, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be an insulating adhesive. May be dispersed.
  • the width of the adhesive tape is equal to or greater than the dimension of one side of the circuit board, and is, for example, 5 mm to 3000 mm.
  • the adhesive tape may have the dimension of one side of the circuit board by arranging a plurality of adjacent strips in the width direction of the adhesive tape. In this case, production efficiency can be improved because the circuit board can be easily adapted to circuit boards having different dimensions.
  • the width of one strip of the adhesive is, for example, 0.5 mm to 10.0 mm.
  • the width of the adhesive tape is 5 mn!
  • the reason why it is set to 3000 mm is that the dimension of one side of the circuit board is less than 5 mm in many cases, and if it is larger than 3000 mm, the width of the reel becomes too wide, and it is difficult to mount it on existing bonding equipment. This is because it may not be possible.
  • the plurality of adhesives are such that adhesives adjacent to each other are spaced apart from each other. It is characterized.
  • the invention described in claim 37 is as claimed in claim 35.
  • the adhesive is separated into a plurality of strips by slits formed in a width direction of the tape.
  • the same operation and effect as those in claim 35 can be obtained, and the adhesive tape is applied to the entire surface of one side of the base material. It is preferable that a slit is formed by cutting the adhesive with a cutting blade or the like immediately before the adhesive is pressed onto the circuit board, that is, immediately before the adhesive tape is used, using a dried and coated adhesive.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a laser or a heating wire other than the cutting blade may be used. It may be formed by
  • the invention described in claim 38 is a method for manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, The adhesive is applied to the entire surface, and then a slit is formed in the adhesive along the width direction of the tape. Then, the other substrate is placed on the adhesive surface and the adhesive is applied to one and the other substrates. Then, one substrate and the other substrate are separated from each other, and a plurality of adhesives are alternately attached to those of the one and the other substrates, so that a plurality of adhesives are attached to the one and the other substrates. It is characterized in that it is manufactured by arranging strip adhesives at intervals.
  • two adhesive tapes described in claim 2 can be simultaneously manufactured using existing equipment, so that manufacturing efficiency can be improved. Excellent.
  • the invention described in claim 39 is a method of disposing the adhesive tape according to any one of claims 1 to 3 on a circuit board, and the adhesive tape having a width.
  • the adhesive strip is pressed against one side of the circuit board by applying heat and pressure along the direction.
  • This is a method for crimping an adhesive tape, wherein an adhesive strip is crimped to one side of a circuit board by heating and pressing the tape along the width direction.
  • an adhesive tape is placed on a circuit board, the adhesive tape is heated and pressed along the width direction to press the adhesive strip on one side of the circuit board, and then the position of the circuit board is changed.
  • the next adhesive strip can also be pressed on the other side of the circuit board by heating and pressing the adhesive tape along the width direction on the other side of the circuit board.
  • the effects described in any of claims 35 to 37 can be obtained, and the adhesive can be used.
  • the other side is positioned parallel to the width direction of the adhesive tape, and the adhesive is pressed on the other side of the circuit board.
  • the adhesive can be easily pressed on the four circumferences of the circuit board, thereby improving work efficiency in an electronic component manufacturing plant.
  • the invention described in claim 40 is that at least two adhesive tapes according to any one of claims 35 to 37 are provided on a transport path for moving a circuit board.
  • One adhesive tape is placed in the direction perpendicular to the transport path, and the other adhesive tape is placed in the width direction along the transport path.
  • the adhesive strip is pressed on the two opposing sides of the circuit board by heating and pressing the adhesive tape along the width direction on the two opposing sides of the circuit board, and then the circuit board is bonded to the other adhesive.
  • the adhesive tape is crimped on the four circumferences of the circuit board by moving to the tape and heating and pressing the adhesive tape along the width direction from the base material side on the remaining two sides of the circuit board.
  • the adhesive is applied to the entire surface of one side of the base material, and the adhesive is pressure-bonded to the circuit board using an adhesive tape wound in a reel shape.
  • An adhesive tape crimping method in which the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed in the width direction. In this way, the adhesive is pressed onto the circuit board while reducing the cohesive force of the adhesive in the heated portion.
  • the adhesive tape is attached to the bonding device, and the adhesive tape is attached along the width direction.
  • the adhesive tape is heated and pressurized, the cohesive strength of that part is reduced (hereinafter referred to as the “cohesive strength reduction line”), and the adhesive of the heated part from the cohesive strength reduction line separates from the base material. It is crimped to the circuit board. Next, rotate the circuit board by about 90 degrees, position the adjacent side in the width direction of the adhesive tape, and heat and press the next adhesive strip along the width direction to place the adhesive strip next to the adhesive strip. Press the adhesive on the sides. In this way, the adhesive can be sequentially pressed on the four sides of the circuit board, and the working efficiency is good.
  • the adhesive tape may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be pressed onto the circuit board can be arbitrarily set by changing the heating and pressing area, and the degree of freedom of the width of the adhesive to be pressed is high.
  • the invention described in claim 42 includes one reel, the other reel, and a case for housing these reels while holding them rotatably.
  • One of the reels has an adhesive tape coated with an adhesive applied to a base material, the other reel has one end of the adhesive tape fixed thereto, and the adhesive tape has a longitudinal direction of the tape. Characterized in that at least two lines of adhesive are arranged along the line.
  • the adhesive tape cassette is mounted on the bonding device, and is formed along the longitudinal direction with at least two in the width direction of the adhesive tape.
  • One piece of the adhesive is arranged so as to overlap one side of the circuit board, and the one piece of the adhesive is pressed onto the circuit board by applying heat and pressure from the substrate side.
  • the adhesive is sequentially pressed on the circuit board, the adhesive tape is sequentially fed out from one of the reels, and the adhesive tape on which the other adhesive is applied to the other reel. And wind up. Then, when the adhesive tape wound on one of the reels is completed, the cassette is turned over and mounted on the crimping device again.
  • the pressure bonding can be performed sequentially or at intervals by changing the position in the width direction.
  • At least two lines of the adhesive are arranged in the width direction in the adhesive sheet, and the adhesive is used one by one. It can be used, and the amount of adhesive that can be used on one reel can be more than doubled without increasing the number of turns of adhesive tape.
  • the adhesive tape is used as a cassette, there is no need to attach the adhesive tape to the reel in the bonding device, and it is easy to handle since only the cassette is mounted on the bonding device. Also, the workability of installation and replacement is good.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
  • the invention described in claim 43 is the invention described in claim 42, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
  • the invention described in claim 44 is the invention described in claim 42, wherein the adhesive is formed into a plurality of strips by slits formed in the width direction of the tape. It is characterized by being separated.
  • the slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a slit or a laser or a heating wire may be used. May be formed.
  • the invention described in claim 45 includes one reel, the other reel, and a case for rotatably holding and storing these reels,
  • One reel has an adhesive tape coated with an adhesive applied to a base material
  • the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device. Attach, pull out the adhesive tape from the adhesive tape cassette onto the circuit board, and apply heat and pressure to a part of the adhesive tape in the width direction to reduce the cohesive force of the adhesive in the heated part and reduce the width in the width direction. It is characterized in that a part of the adhesive is pressed onto the circuit board.
  • cohesive strength reduction line by heating and pressing a part of the adhesive tape in the width direction, the cohesive force of the adhesive in the part is reduced. (Hereinafter referred to as “cohesive strength reduction line”), and the adhesive in the portion heated from the cohesive strength reduction line is separated from the base material and pressed onto the circuit board.
  • the adhesive tape may be applied to the entire surface of the base material, so that the existing equipment can be used as it is to manufacture the adhesive tape.
  • the width of the adhesive to be bonded to the circuit board can be arbitrarily set by changing the heating / pressing area, and the width of the adhesive to be bonded is high.
  • the invention described in claim 46 includes one reel, the other reel, and a case for rotatably holding and storing these reels.
  • One of the reels has an adhesive tape coated with an adhesive applied to a base material
  • the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device.
  • the tape is pulled out of the adhesive tape cassette onto the circuit board, and a part of the adhesive tape in the width direction is heated and pressurized to reduce the cohesive force of the adhesive in the heated part and reduce the part of the width in the width direction.
  • the adhesive is pressure-bonded to the circuit board, and when the adhesive tape wound around one of the reels is completed, the adhesive tape cassette is turned over and the remaining adhesive is pressure-bonded to the circuit board.
  • the invention described in claim 47 is an adhesive tape applied to a base material and wound in a reel shape, wherein the base material has a hot-melt agent layer and a support layer. It is characterized by having.
  • the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, and a circuit is mounted. After heating and pressing the adhesive on the substrate, the substrate is mounted so as to be wound up on an empty reel. Then, the end of one adhesive tape wound on one reel where the unwinding is completed and the start end of the other adhesive tape wound on another new reel are overlapped or abutted, and such a portion is heated. Then, after the hot-melt agent layer is melted, the hot-melt agent is solidified by cooling, so that the adhesive tapes are connected to each other.
  • the bonding device can be used rationally by using the heating and pressing head of the bonding device for mounting the adhesive reel.
  • the invention described in claim 48 is characterized in that, in the invention described in claim 1, the support layer is sandwiched between the hot melt layers. .
  • the same function and effect as the invention described in claim 1 can be obtained, and the hot-melt agent layer is formed on the surface of the base material. Therefore, the adhesive surface at the start end is superimposed on the hot-melt agent layer at the end of one adhesive tape, and such a portion can be heated and pressed to connect the two, and the connection is simple. In addition, since the hot-melt agent layer is formed over the entire length of the tape, it is not necessary to strictly determine the overlapping length, and the degree of freedom of connection is high.
  • the invention described in claim 49 is characterized in that, in the invention described in claim 1, the hot-melt agent layer is interposed between the support layers.
  • the adhesive tapes can be connected to each other. Is heated by a heating and pressing head of the bonding apparatus at a position where the end of one adhesive tape and the start of the other adhesive tape are abutted. When heated, the hot melt dissolves and exudes, and upon cooling, the hot melt solidifies, so that the adhesive tapes are connected. In this case, since the hot-melt layer is sandwiched between the support layers, it is possible to prevent the hot-melt layer from being exposed to the outside air and reducing the adhesive strength of the hot-melt layer by adhesion of moisture and dust. it can.
  • the invention described in claim 50 is a bonding material for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel.
  • a method of connecting tapes wherein the adhesive tape includes a base material surface-treated with a release agent and an adhesive, and the release agent at the end of the base material of one of the adhesive tapes is removed. It is characterized in that the adhesive surface of the other adhesive tape is superimposed on the part, and the two superposed parts are connected by thermocompression bonding.
  • the base material surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped with each other, Then, the end of the unwound adhesive tape is connected to the start of the newly installed adhesive tape, and the adhesive reel is replaced. Adhesive reel can be easily installed.
  • the bonding device can be used rationally by using the heating and pressurizing head of the bonding device for mounting the adhesive material reel.
  • the invention described in claim 51 is the invention according to claim 50, wherein the release agent is removed by any of plasma discharge, ultraviolet irradiation, and laser irradiation. It is characterized by one or more.
  • the same operation and effect as those of the invention described in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, laser Since the release agent is removed by using any one of the irradiation methods, the release agent can be removed more accurately and in a shorter time than when the release agent is peeled off by hand.
  • the gas in the plasma state is decomposed, and the gas is discharged to the surface of the base material in a state in which it is easy to react (excitation state).
  • excitation state a state in which it is easy to react
  • To remove the release agent In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and irradiation is performed from the mercury lamp for a certain period of time.
  • laser irradiation the laser irradiated by the laser oscillator 2003/009694 The release agent is heated and melted by the light, and the release agent is removed.
  • the invention described in claim 52 is an adhesive tape reel in which an adhesive tape is wound around a reel, the adhesive for electrode connection being applied to a base material.
  • the adhesive tape reel is characterized in that a plurality of winding portions of the adhesive tape are provided in the width direction of the tape.
  • Adhesive tape wound on multiple winding sections can be used sequentially, so it can be used in one exchange work without increasing the number of adhesive tape turns per adhesive tape reel It is possible to greatly increase the amount of adhesive required. In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent collapse of the tape and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. In addition, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur when the base material is elongated.
  • the invention described in claim 53 is the invention described in claim 52.
  • the end of one adhesive tape and the start of the other adhesive tape are provided.
  • a connection tape for connecting the two is provided between the first and second parts, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
  • claim 5 In addition to providing the same operation and effect as the invention described in paragraph 2, the end end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape, so that After the unwinding of the adhesive tape of the winding part is completed, the work of attaching the adhesive tape of the other winding part to the take-up reel becomes unnecessary, and the production efficiency of electronic equipment is further improved.
  • the invention described in claim 54 is the adhesive tape reel described in claim 53, a winding reel of the adhesive tape, and an adhesive tape.
  • a crimping portion provided between the reel and the take-up reel and for crimping the adhesive of the adhesive tape to the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the coupling tape.
  • the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the crimping portion.
  • the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
  • the tape detecting means detects the connecting tape
  • the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, so that the time and effort for winding can be reduced. be able to.
  • the tape detecting means for example, an adhesive device is provided with a pair of light emitting portions and a light receiving portion, and the connecting tape is optically detected.
  • colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the marks at both ends of the connecting tape by the laser beam emitted from the light emitting unit to determine the connecting tape.
  • a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
  • the invention described in claim 59 is one of a reel and the other.
  • Is equipped with an electric heating member that generates heat by the supplied electric power pulls out the adhesive tape wound on one of the reels into the opening of the case, and heats the adhesive tape in the opening with the heating member from the base material side.
  • the adhesive is pressed against the circuit board by pressing, and the base material from which the adhesive has been peeled off is wound up with the other reel.
  • the adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be an adhesive. Insulating particles may be dispersed.
  • the invention described in claim 60 is an adhesive tape applied to a substrate, wherein the substrate is made of a metal film or an aromatic polyamide film. JP2003 / 009694.
  • the base material of the adhesive tape is a metal film (or a metal foil) or an aromatic polyamide film, so that the thickness of the base material is reduced. Even in this case, problems such as stretching of the base material and cutting can be prevented. [0206] Therefore, by using an adhesive tape having a small thickness, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. . Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the metal film is preferably a metal having high extensibility, and copper, aluminum, stainless steel, iron, tin, or the like is used.
  • aromatic polyamide film specifically, para-aramid film (Microtron; trade name, manufactured by Toray Industries, Inc.) is used.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
  • the adhesive may have conductive particles dispersed therein.
  • the conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic.
  • insulating coating particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder, or polymer nucleus material such as plastic with a conductive layer formed on It is preferable because it has deformability by pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability.
  • a polymer when a polymer is used as a core, it is more preferable because a softening state can be widely controlled by a connection temperature because it does not have a melting point unlike solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained. .
  • the invention described in claim 61 is the invention described in claim 60, wherein the thickness of the base material is ⁇ ! 225 ⁇ .
  • the reason for setting the thickness to 25 ⁇ is that if the thickness of the substrate is less than 1 ⁇ m, sufficient tensile strength of the substrate cannot be obtained and the substrate is easily cut. Further, when the thickness of the base material exceeds 25 ⁇ , it is difficult to obtain a satisfactory number of windings per reel.
  • the invention described in claim 62 is the invention according to claim 60 or claim 61, wherein the tensile strength of the base material is 25. It is characterized by being at least 300 MPa by mouth.
  • the reason why the tensile strength of the base material is 30 OMPa or more is that if the tensile strength of the base material is less than 30 OMPa, the base material is easily stretched and the adhesive tape is cut. It is because it becomes easy.
  • the invention described in claim 63 is the invention according to any one of claims 60 to 62, wherein the adhesive for the base material is The ratio of the thickness to the thickness is 0.01 to 1.0.
  • the ratio of the thickness of the base material to the adhesive is set to 0.01 to 1.0 when the ratio of the thickness of the base material to the adhesive is less than 0.01. This is because the material is too thin and the strength of the adhesive tape cannot be obtained sufficiently. Also, if the ratio of the thickness of the base material to the adhesive exceeds 1.0, the thickness of the base material becomes too thick, and the number of turns per reel cannot be increased.
  • the invention described in claim 64 is the invention according to any one of claims 60 to 63, wherein the surface roughness of the substrate is R R mA x is 0.5 ⁇ or less.
  • an adhesive is applied to a base material, and the adhesive is formed on the adherend using an adhesive tape wound in a reel shape.
  • An adhesive tape forming method in which an adhesive tape is pulled out from each of a plurality of reels, each adhesive tape is overlapped and integrated, and one of the base materials is peeled off and overlapped to be integrated. The adhesive is formed on the adherend.
  • the bonding between the adhesive surface of the adhesive tape unwound from one reel and the adhesive tape unwound from the other reel is performed.
  • the adhesive surface is integrated with the agent surface.
  • the base material of the other adhesive tape is wound on a winding reel, and the adhesive of the adhesive tape integrated by lamination is pressure-bonded to the adherend by a pressurized heating head.
  • the adherend is an electronic component or a circuit board, such as a lead frame or a lead frame die.
  • the adhesive of one adhesive tape and the adhesive of the other adhesive tape are overlapped with each other to obtain a desired adhesive tape. Since the adhesive is formed on the adherend after the thickness of the adhesive is increased, the winding diameter of the adhesive tape per reel should be reduced even though the number of windings of the adhesive tape is increased. Can be. Therefore, the number of windings of the adhesive tape per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape is reduced, and the production efficiency of electronic equipment is improved.
  • Claim 6 In addition to providing the same function and effect as the invention described in Item 5, only the adhesive of one adhesive tape contains a curing agent, so the adhesive of the other adhesive tape does not require a curing agent. Become. Therefore, low-temperature control is not required for adhesive tapes made of adhesives that do not contain a curing agent. Therefore, the number of adhesive tapes requiring low-temperature management can be reduced, and the transport and storage of the adhesive tapes can be efficiently managed.
  • the adhesive of the adhesive tape containing no curing agent and the adhesive tape containing the curing agent include the component reacting with the curing agent as the other adhesive, and the component not reacting with the curing agent as the curing agent. The storage stability of the adhesive can be improved by using one of the adhesives used together with the ligne.
  • the invention described in claim 67 is characterized in that an anisotropic conductive material having a film-like adhesive is wound and laminated many times in the longitudinal direction of the core material. This is a conductive tape.
  • the anisotropic conductive material is a two-layer anisotropic conductive material in which a base film is provided on one surface of a film-like adhesive.
  • the anisotropic conductive material tape according to claim 67 which is a material.
  • the anisotropic conductive material is a film-like adhesive.
  • This is an anisotropic conductive material tape that is a three-layered anisotropic conductive material with a base material film provided on both sides of the agent.
  • the invention described in claim 70 is the anisotropic conductive material tape according to claim 68 or claim 69, wherein the base film is This is an anisotropic conductive material tape in which one or both surfaces of the film are subjected to a peeling treatment.
  • the invention described in claim 71 is the anisotropic conductive material tape according to any one of claims 67 to 70, This is an anisotropic conductive material tape in which the width of the film adhesive is 0.5 to 5 mm.
  • the invention described in claim 72 is the claim 6 In anisotropic conductive material tape according to any one of item 8 to claims 71, wherein the strength of the base film, at 12 kg / mm 2 or more, elongation, from 60 to 200%, Thickness is 10 This is an anisotropic conductive material tape having a thickness of ⁇ or less.
  • the base film is colored to be transparent or colored and opaque, it is easy to distinguish the base film from the adhesive, and the position of the unwinding portion is easy, so that the workability is improved.
  • FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tapes according to the first embodiment.
  • FIGS. 2A and 2B are oblique perspective views showing the connection process of the connection portion in FIG.
  • FIG. 3 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • FIG. 4 is a cross-sectional view showing adhesion between circuit boards.
  • FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
  • FIG. 6 is a perspective view showing an adhesive tape connection L0 method in the second embodiment of the present invention.
  • FIG. 7 is a perspective view showing a method of connecting an adhesive tape in a modification of the second embodiment of the present invention.
  • FIGS. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 8A is a perspective view showing the connection between the adhesive reels
  • 8L5B is a perspective view showing a connection method of the connection portion in FIG. 8A
  • FIG. 8C is a plan view of the connection portion in FIG. 8A.
  • FIG. 9 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
  • FIG. 10 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
  • FIGS. 12 and 12B are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 12A is a perspective view showing the connection between the adhesive reels
  • FIG. 12B is a perspective view showing a connection method of the connection portion in FIG. 12A.
  • FIGS. 13A and 13B show the adhesive tape in the second embodiment of the present invention. It is sectional drawing which shows a continuation method.
  • Figs. 14A and 14B are cross-sectional views illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • Fig. 14A illustrates a state before heating and pressing. Indicates the state after heating and pressing.
  • Fig. 15A and Fig. 15B are views showing a method of connecting an adhesive tape in the fourth embodiment of the present invention
  • Fig. 15A is a cross-sectional view
  • Fig. 15B is a plan view. It is.
  • FIGS. 16A and 16B are diagrams showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 16A is a perspective view showing the connection between the adhesive reels
  • 16B is a perspective view showing a connection portion (b) in FIG. 16A.
  • Fig. 17 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
  • Fig. 18 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
  • Fig. 19 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
  • Figs. 20A to 20C are diagrams showing a method of connecting the adhesive tape according to the first embodiment
  • Fig. 2 OA is a perspective view showing the connection between the adhesive reels
  • 20B and 20C are cross-sectional views showing a connection method of a connection portion in FIG. 2 OA.
  • Fig. 21 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding device.
  • FIGS. 22A to 22C are diagrams showing an adhesive tape reel according to the first embodiment
  • FIG. 22A is a perspective view showing an adhesive tape reel
  • FIG. FIG. 22C is a front view of FIG. 22A
  • FIG. 22C is a plan view of the connecting tape of FIG. 22A.
  • Fig. 23 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 24 is a plan view of the connecting tape according to the second embodiment of the present invention.
  • Fig. 25 is a plan view of a connecting tape according to the third embodiment of the present invention.
  • Fig. 26 is a perspective view showing an adhesive tape reel according to the fourth embodiment of the present invention.
  • FIGs. 27A to 27C are diagrams illustrating an adhesive tape according to the first embodiment, and Fig. 27A is a perspective view illustrating the adhesive tape.
  • FIG. 27B is a front view in FIG. 27A, and
  • FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A.
  • FIG. 28 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 29 is a perspective view showing a use state of the adhesive in the PDP.
  • Fig. 30 is a perspective view showing an adhesive tape reel according to the second embodiment of the present invention.
  • FIG. 31A is a cross-sectional view of an adhesive tape in a case where the adhesive tape of the adhesive tape of the present invention is used for a semiconductor device having a LOC structure.
  • FIG. 31B is a cross-sectional view of a semiconductor device having a LOC structure when the adhesive tape of the adhesive tape reel of the present invention is used for a semiconductor device having a LOC structure.
  • FIGs. 32A to 32C are schematic diagrams of a bonding apparatus using the adhesive tape of the present invention.
  • Fig. 32A is a front view
  • Fig. 32B is a side view
  • Figs. FIG. 34 is an enlarged view of a main part of the adhesive tape punching and sticking section 89 in FIG. 32B.
  • FIGS. 33A and 33B are views of an adhesive tape
  • FIG. 33A is a perspective view of a reel on which an adhesive tape is wound
  • Fig. 34 is a perspective view showing a use state of the adhesive in the PDP.
  • Fig. 35 is a cross-sectional view showing a step of applying an adhesive to a base material.
  • Figs. 36A to 36C are cross-sectional views of the adhesive tape according to the second embodiment of the present invention.
  • Figs. 37A to 37C are process diagrams illustrating an adhesive tape and a method for crimping the same, according to the third embodiment of the present invention.
  • Figs. 38A to 38C show an adhesive tape according to a fourth embodiment of the present invention.
  • FIG. 3 is a process chart showing a method for producing a loop.
  • FIG. 39A and Fig. 39B are views of the adhesive tape
  • Fig. 39A is a perspective view of a reel around which the adhesive tape is wound
  • Fig. 39B is the adhesive tape of Fig. 39A.
  • FIG. 3 is a plan view as viewed from an adhesive side.
  • Fig. 40 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
  • Fig. 41 is a second embodiment of the present invention, and is a schematic view illustrating a pressure bonding step of an adhesive in a bonding apparatus.
  • Figs. 42A to 42C are cross-sectional views of the adhesive tape according to the third embodiment of the present invention.
  • Figs. 43A to 43C are process diagrams illustrating an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
  • Figs. 44A to 44C are process diagrams showing a method of manufacturing an adhesive tape according to the fifth embodiment of the present invention.
  • FIGs. 45A and 45B are views of an adhesive table cassette according to the first embodiment of the present invention
  • Fig. 45A is a perspective view of an adhesive tape cassette
  • Fig. 45B is a view of Fig. 45A.
  • FIG. 4 is a sectional view taken along line A-A.
  • Fig. 46 is a view showing reel removal in the tape cassette shown in Fig. 45A. It is sectional drawing which shows an attachment state.
  • FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Fig. 48 is a process diagram showing a method for producing an adhesive tape cassette.
  • Fig. 49 is a second embodiment of the present invention, and is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
  • FIG. 50 is a cross-sectional view of the adhesive tape according to the third embodiment of the present invention.
  • FIGS. 51A and 51B are process diagrams showing an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
  • FIGS. 52A and 52B are views showing the adhesive tape according to the first embodiment, and FIG. 52A is a perspective view showing the connection between the adhesive reels. FIG. 52B is a cross-sectional view showing a connection portion in FIG. 52A.
  • FIG. 53 is a cross-sectional view illustrating an adhesive tape according to the second embodiment.
  • FIGS. 54A to 54C are cross-sectional views showing a connection step of a connection portion in FIG. 55, FIG. 54A shows a state before discharging, and FIG. FIG. 54C is a view showing a thermocompression bonding of a connection portion.
  • Fig. 55 is a perspective view showing the connection between the adhesive reels in the method of connecting the adhesive tape.
  • Fig. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • FIG. 57A to FIG. 57C are views showing an adhesive tape reel according to the first embodiment
  • FIG. 57A is a perspective view showing an adhesive tape reel
  • 57B is a front view in FIG. 57A
  • FIG. 57C is a front view of the cover member in FIG. 57A.
  • Fig. 58 is a process diagram showing a method for manufacturing an adhesive tape reel.
  • Fig. 59 is a side view of the adhesive tape in the second embodiment of the present invention.
  • FIG. 6OA and FIG. 60B are front views of the adhesive tape reel according to the third embodiment of the present invention, and are views illustrating replacement of the adhesive tape.
  • Fig. 61 is a perspective view showing a side plate of a winding portion in the fourth embodiment of the present invention.
  • Figs. 62A and 62B are diagrams of the adhesive tool according to the first embodiment of the present invention, and Fig. 62A is a perspective view of the adhesive tool. B is a sectional view taken along line AA of FIG. 62A.
  • FIG. 63 is a side view for explaining how to use the bonding tool shown in FIG. 62A and FIG. 62B.
  • FIG. 64 is a process diagram illustrating a method for manufacturing an adhesive tool.
  • Fig. 65A and Fig. 65B are diagrams showing an adhesive tape according to the first embodiment.
  • Fig. 65A is a perspective view in which the adhesive tape is wound around a reel.
  • FIG. 65A is a perspective view in which the adhesive tape is wound around a reel.
  • 65A is a sectional view taken along the line AA in FIG. 65A.
  • FIGS. 66A and 66B are diagrams showing an adhesive forming process of the adhesive tape according to the first embodiment
  • FIG. FIG. 66B is a schematic view showing a step of winding one of the base materials onto a winding reel
  • FIG. 66B is a cross-sectional view showing a portion where adhesives are overlapped in FIG. 66A.
  • FIG. 67 is a schematic view showing a step of forming an adhesive on an adherend in the bonding apparatus.
  • FIG. 68 is a perspective view of a reel on which an adhesive tape is wound.
  • FIG. 69A is a cross-sectional view showing a step of forming an adhesive material on an adhesive tape according to the second embodiment.
  • FIG. 69B shows adhesion between circuit boards using the adhesive of FIG. 69A.
  • FIG. 70 is a schematic diagram of a supply form of the two-layer anisotropic conductive material tape of the present invention.
  • FIG. 71 is a schematic diagram of a supply form of the three-layer anisotropic conductive material tape of the present invention.
  • FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tape according to the first embodiment
  • FIGS. 2A and 2B are diagrams in FIG. Fig. 2A is a perspective view showing the cutting of an end tape of a used adhesive tape
  • Fig. 2B is a view showing a used adhesive tape turned upside down to obtain a new adhesive material.
  • FIG. 3 is a schematic view showing an adhesive bonding step in a bonding apparatus
  • FIG. 4 is a cross-sectional view showing bonding between circuit boards
  • FIG. 5 is a method of manufacturing an adhesive tape.
  • the adhesive tape 1 is wound around the reels 3 and 3a, and the reels 3 and 3a are arranged on both sides of the winding core 5 and the adhesive tape 1.
  • a side plate 7 is provided. That is, each of the reels 3, 3 a has a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of ⁇ PP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • resins include styrene resin as thermoplastic resin, and polyester resin.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, copper, graphite, and the like.
  • the conductive particles 13 include these and non-conductive glass.
  • a conductive layer made of the material constituting the above-described conductive particles 13 may be formed by coating a polymer nucleus material such as ceramic, plastic, or the like with a coating.
  • insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc., it is deformable by heating or pressurizing, and the distance between the electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and the connection can easily cope with variations in electrode thickness and flatness.
  • the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is hung on the guide bin 22 and wound. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the two reels 3 a, 17, and the adhesive 11 To the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluorocarbon.
  • Ethylene 24 The ffi wire circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressurizing head 19 via JP2003 / 009694.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
  • the adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When the tape is replaced and a new adhesive tape is connected to the take-up reel 17, and (b) the adhesive tape 1 used as the take-up reel 17 has a small number of used adhesive tapes 1 In some cases, a new adhesive tape is connected to an adhesive tape with less winding.
  • the end mark 28 is used for the adhesive tape 1 from the used reel (reel from which the adhesive tape 1 is completely fed) 3a to the heating and pressurizing mode.
  • the adhesive tape 1 is stretched to a position where the adhesive tape 1 is fixed to the used reel 3a, it is desirable to attach the adhesive tape 1 to a position extending from the fixing position to the heating and pressing head 19.
  • the adhesive tape 1 will be cut at the minimum necessary position, and the waste of the adhesive tape 1 can be prevented, and the used reel 3 a It is possible to prevent the troublesome work of removing the used reel 3a so that the end mark 28 can reach the heating / pressing head 19 by heating.
  • the bonding apparatus 15 has a heating / pressing head 19, and the heating / pressing head 19 is used to remove the used reel 3a.
  • the adhesive 1 1 at the end 30 of the adhesive tape 1 and the adhesive 1 1 at the beginning 3 2 of the adhesive tape 1 on the new adhesive reel 3 are connected.
  • the reels 3 and 3a on which the adhesive tape 1 is wound can be exchanged without using a separate crimping tool for crimping.
  • the overlapped portion of the two is placed on the table 104, and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond.
  • the adhesive tape 1 wound on the take-up reel 17 and the adhesive tape 1 wound on the new reel 3 are connected.
  • only the base material 9 is wound on the take-up reel 17, so that several adhesive material reels can be wound, and the number of times of changing the take-up reel 17 can be reduced. Work efficiency is good.
  • a new adhesive material is provided by using the lead tape 41 provided on the start end 32 of the adhesive tape 1 of the new adhesive material reel 3.
  • the connection is made between the adhesive tape 1 of the reel 3 and the adhesive tape 1 wound on the used reel 3a.
  • the lead tape 4 1 consists of the base material 6 3 and the adhesive 4 3 on the back surface, and the beginning 3 2 of the adhesive tape 1 of the new adhesive reel 3 is wound around the reel by the lead tape 4 1
  • the adhesive tape 1 is attached to the base material 9 surface of the adhesive tape 1 and stopped. Then, the lead tape 41 is peeled off from the surface of the base material 9 and superposed on the adhesive 11 surface of the terminal end portion 30 of the adhesive tape 1 turned over.
  • the present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist of the present invention.
  • the adhesive to be newly mounted as shown in FIG. 7 without turning over the adhesive tape 1 wound around the used reel 3a.
  • the adhesive may be connected to one surface and bonded by heating and pressing with a heating and pressing head 19 of a bonding device 15.
  • the lead tape 41 of the female end portion 32 of the adhesive tape 1 is peeled off from the base material 9 surface, and the lead tape 41 is used as the base material of the used adhesive tape 1. It may be adhered to 9 surfaces.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes to each other, and more particularly to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. .
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound up on a take-up reel. .
  • the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse. Also, if the number of turns is large, The pressure acting on the adhesive tape wound in a loop may increase, and the adhesive may ooze out from both sides of the tape and cause blocking.
  • the inventions described in claims 5 to 8 are directed to an adhesive material that can easily replace an adhesive material reel and can improve the production efficiency of electronic equipment.
  • the purpose is to provide a method for connecting tapes.
  • FIG. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 8A is a perspective view showing the connection between the adhesive reels
  • FIG. FIG. 8C is a perspective view showing a connection method of the connection portion in FIG. 8
  • FIG. 8C is a plan view of the connection portion in FIG. 8A.
  • Adhesive tape 1 is wound around reels 3 and 3a, and each reel has a core 5 and adhesive tape 1 on both width sides.
  • a side plate 7 is provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 5 mm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • resins include styrene resin as thermoplastic resin, and polyester resin. Epoxy resin, vinyl ester resin, acrylic resin, and silicone resin.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, and graphite.
  • the conductive particles 13 include A conductive layer made of the material constituting the conductive particles 13 described above may be formed by coating a non-conductive glass, ceramic, plastic, or other polymer nucleus material or the like. Further, insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc.
  • a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc.
  • the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness More preferable because a connecting member can be obtained
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is inserted into the guide bin 22.
  • the tape is attached to the take-up reel 17 and the adhesive tape 1 is paid out (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 a and 17.
  • the adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. Polyethylene material 2 4
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19 through the heating circuit.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. End mark 2 8 of adhesive tape 1 wound on a is exposed
  • the adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When replacing the tape and connecting a new adhesive tape to the take-up reel 17, and (b) using the adhesive tape 1 with a small number of used adhesive tapes 1 remaining as the take-up reel 17 In some cases, a new adhesive tape and an adhesive tape with few remaining windings may be connected.
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a to the new adhesive material.
  • the adhesive 11 of the starting end 32 is superimposed on the base 9 surface of the end 30.
  • a substantially U-shaped locking pin 46 is inserted into the overlapped portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are formed.
  • the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. In this way, the end 30 of the adhesive tape 1 after the unwinding and the start 32 of the adhesive tape 1 to be newly mounted are fixed by the locking pins 46, so that connection is easy. is there.
  • the elastic members 50 connecting the pawls 48, 49 provided at one end and the other end and the pawls 48, 49 at both ends are provided.
  • the end 30 of one adhesive tape 1 and the start of the other adhesive tape 1 using a locking member 47 provided with 3 and 2 are connected.
  • the end 30 of one adhesive tape 1 and the starting end 32 of the other adhesive tape 1 are abutted, and the claw 48 provided at one end of the locking member 47 is connected to the end 30.
  • the claw portion 49 provided at the other end is engaged with the start end portion 32 so that the one claw portion 48 and the other claw portion 49 are attracted by the elastic member 50.
  • the claw portions 48 and 47 are provided with a plurality of sharpened claws 51 on the back surface of the plate member.
  • the claw portion 48 provided at one end of the locking member 47 is locked to the terminal portion 30 and the claw portion 49 provided at the other end is subsequently locked to the starting end portion 32. Then, both are connected to each other, so that connection is easy.
  • the elastic member 50 is provided between the one claw portion 48 and the other claw portion 49, the elastic member 50 is extended, and the other claw portion 49 of the locking member 47 is connected to the other claw portion 49. Since it can be locked at any position of the starting end 32 of the adhesive tape 1, the degree of freedom of connection is high.
  • the end portion 30 of the adhesive tape 1 wound around the used reel 3a and the new adhesive reel 3 are bonded.
  • the adhesive 1 1 of the start end 3 2 is superimposed on the surface 9 of the base material at the end 30, and the superposed portion has a substantially U-shaped elastic cross section. It is clamped between deformable clips 53 and fixed. Connection can be performed simply by sandwiching the overlapped portion between clips 53, so that connection work is easy.
  • the overlapping portion is covered with a metal holding piece 55 having a substantially U-shaped cross section in the first embodiment.
  • the nip pieces 55 are crushed from both sides to connect them. Since the holding pieces 55 are crushed from both sides of the overlapped portion for connection, a strong connection can be obtained at the overlapped portion.
  • the locking pin 46 may be a single linear pin without being formed in a substantially U-shape. It is desirable to use a plurality of pins to fix the fixing portion.
  • a plurality of locking members 47 may be used according to the width of the adhesive tape 1.
  • a plurality of clips 53 or sandwiching pieces 55 are used, and they are fixed from both sides of the overlapping portion of the adhesive tape 1 respectively. May be.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape obtained by applying an adhesive to a base material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
  • [0 3 7 1] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. And wound from the adhesive reel
  • the adhesive is pressure-bonded to a circuit board or the like from the base material side of the released adhesive tape with a heating and pressing head, and the remaining base material is wound up on a take-up reel.
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • the inventions described in claims 9 to 13 are directed to an adhesive tape capable of easily replacing an adhesive reel and improving the production efficiency of electronic equipment.
  • the purpose is to provide a connection method.
  • FIGS. 12A to 12C are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 12A is a perspective view showing the connection between the adhesive reels.
  • FIG. 2 is a perspective view showing a connection method of a connection portion in FIG. 12A.
  • the adhesive tape 1 is wound around each of the reels 3 and 3a, and each reel 3 and 3a has a side plate disposed on both width sides of the winding core 5 and the adhesive tape 1. 7 are provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 3 mm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and the releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type.
  • a silicone resin system is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer described above may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, Sometimes the contact surface with the circuit This is preferable because the product increases and the reliability improves.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the take-up reel 7. Attach and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the two reels 3 a and 17. Then, the adhesive 11 1 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP. 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
  • the method for connecting an adhesive tape according to the invention described in claims 9 to 13 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining winding of 1 and run it with a new adhesive tape When the reel 17 is connected, (b) Use the adhesive tape with the remaining tape of the used adhesive tape 1 remaining as the take-up reel 17 and use the new adhesive tape and the remaining winding. In some cases, a connected adhesive tape is connected.
  • connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 as shown in Fig. 12B.
  • the adhesive 11 of the starting end 32 is superimposed on the base material 9 surface of the end 30.
  • the overlapping length H of the two is set to about 2.5 of the width W of the adhesive tape 1, placed on the table 36, and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 .
  • the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • the used reel 3 a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15.
  • An adhesive 11 containing resin and conductive particles 13 is applied to the base material (separate resin) unwound from the unwinding machine 25 by a co-exit 27 and dried. After drying in the furnace 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core, and side plates 7 and 7 are attached to the winding core from both sides. Alternatively, it is wound around a core with a side plate, packed with a dehumidifying material, and preferably shipped at a low temperature ( ⁇ 5 ° C. to 110 ° C.).
  • the overlapping portion 34 of the adhesive tape 1 is replaced with one of the molds 5 6 on which the jaggedness (unevenness) 44 on the surface is fitted. And the other mold 57 to form an unevenness 58 in the overlapped portion 34.
  • the irregularities 58 By forming the irregularities 58 in this manner, the bonding area at the overlapping portion 34 can be increased, and the pulling direction can be increased by the engagement of the irregularities 58 of the overlapping portion 34.
  • a new adhesive material is used.
  • the leading end 3 2 of the reel 3 on which 1 is wound is bent into a substantially V shape, and the end portion 30 of the adhesive tape 1 wound on the used reel 3 a is also bent into a substantially V shape.
  • the hooks are hooked and the adhesives 11 are opposed to each other and locked together (Fig. 14A), and heated and pressed with a heating and pressing head 19 to connect them (Fig. 14B).
  • the terminal end portion 30 and the start end portion 32 are connected in a hook shape, so that they can be connected firmly.
  • the adhesive 11 is overlapped and connected to each other, a stronger connection is obtained. be able to.
  • the adhesive in the overlapped portion flows and is also adhered to the end face, so that a stronger connection can be obtained.
  • the overlapped portions 34 before or simultaneously with the heating and pressurizing are added to the overlapped portions 34.
  • Drill through holes 59 By drilling the through-hole 59, the adhesive 11 leaks out from the periphery of the through-hole 59 at the time of heating and pressurization, and they adhere to each other. Connection can be obtained.
  • the unevenness 58 may be a rounded round shape without forming a mountain shape.
  • the number of through holes 59 is not particularly limited, and may be any number. Further, the diameter of the through hole 59 is not limited. Further, in the second and third embodiments, a through hole 59 may be formed in the overlapping portion 34.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape.
  • the present invention relates to a method for connecting material tapes.
  • Japanese Patent Application Laid-Open Publication No. 2001-280405 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. .
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as "adhesive reel") to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. After mounting the adhesive reel, the adhesive is pressed against the circuit board, etc. from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound. It is wound on a take-up reel.
  • the invention described in claims 14 to 18 may be applied to an adhesive reel even if the adhesive tape is made of a silicone-treated substrate. It is an object of the present invention to provide a method for connecting an adhesive tape, which can easily replace the adhesive tape and improve the production efficiency of electronic equipment.
  • FIGS. 16A and 16B are views showing a method of connecting the adhesive tape according to the first embodiment
  • FIG. 16A is a perspective view showing the connection between the adhesive reels
  • FIG. 16 is a perspective view showing a connection method of a connection portion (b) in FIG. 16A.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both sides of core 5 and adhesive tape 1, respectively. Are provided.
  • the adhesive tape 1 is composed of a siliconized base material 9 and a siliconized base. And an adhesive 11 applied to one side of the material 9.
  • the silicone-treated substrate 9 has a strength and an adhesive that constitutes an anisotropic conductive material is peeled off.] From a raw surface, 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), etc. The surface of this substrate is treated with a silicone resin or the like.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type.
  • a silicone tree system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, A :, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer described above may be formed by coating a polymer core material such as glass, ceramics, and plastic on the core. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding apparatus 15 and the tip of the adhesive tape 1 wound on the reel 3a is taken up by the take-up reel 17 , And pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 was placed on the circuit board 2 1 and placed between the two reels 3 a and 17.
  • the adhesive tape 1 is pressed from the side of the silicone-treated base material 9 with the heating and pressing head 19, and the adhesive 11 is pressed onto the circuit board 21. Thereafter, the silicone base material 9 is wound up on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening) 23 are aligned and permanently connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound up on the winding reel 17 in a relatively short time, and is wound on the reel 3a. The end mark 2 8 of the wound adhesive tape 1 is exposed.
  • connection method of the adhesive tape according to the invention described in claims 14 to 18 is as follows: (a) The take-up reel 17 is used as it is, and the used adhesive tape is used. Replace the adhesive tape with the remaining winding of 1 remaining, and connect the new adhesive tape to the take-up reel 17; and (b) the winding of the adhesive tape 1 used as the take-up reel 17 In some cases, a new adhesive tape is used to connect to an adhesive tape with less winding, using an adhesive tape with less remaining adhesive.
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel. Abut the starting end 3 2 of the adhesive tape 1 of 3 and apply silicone adhesive tape 60 over the surfaces of the silicone-treated base materials 9 and 9 of both adhesive tapes 1 and 1 to attach both adhesive tapes. Connect tapes 1 and 1.
  • the silicone pressure-sensitive adhesive tape 60 includes a base material 63 and a silicone pressure-sensitive adhesive 62 applied to one surface of the base material 63.
  • the material of the base material .63 is not particularly limited, but is a polyimide resin material in the present embodiment.
  • the adhesive portion 11 of the adhesive tape and the adhesive portion 43 of the silicone adhesive tape 60 are indicated by diagonal lines.
  • the silicone-treated substrates 9 and 9 are each coated with silicone, so that it is difficult to bond them with an adhesive.
  • a silicone resin for the adhesive 43 the difference in surface tension between the two silicone-treated substrates 9, 9 is reduced, and the adhesive tape 1 is adhered to the end of one adhesive tape 1. 30 and the start end 32 of the other adhesive tape 1 are connected well.
  • the difference in surface tension between the surface of the silicone adhesive 62 in the silicone adhesive tape 60 and the surface of the silicone-treated base material 9, 9 should be 10 mN / m (10 dyne / cm) or less.
  • the surface tension of both the silicone-treated base materials 9 and 9 of one end of the adhesive tape 1 and the other adhesive tape 1 is 25 mN / m or less. 6 O mN / m (25-60 dyne / cm) .
  • the surface tension of the silicone adhesive 62 on the silicone adhesive tape 60 is 2 O mN / m. Set to not less than m and not more than 4 O mN / m.
  • the silicone-based pressure-sensitive adhesive is mainly composed of a silicone gum and a silicone resin.
  • the silicone-based pressure-sensitive adhesive is slightly condensed to exhibit tackiness, and is further subjected to a hydrosilylation reaction using a peroxidized product and a platinum catalyst. It is general that the glass transition temperature is reduced to 100 ° C. or lower by crosslinking. These are commercially available and can be suitably used.
  • the adhesive tape 1 wound around the used adhesive material reel 3a and the new adhesive material tape 3 are wound around the adhesive tape 1a.
  • the adhesive tape 1 is connected.
  • the used adhesive reel 3a and the new adhesive reel 3 are exchanged, and the new adhesive reel 3 is mounted on the bonding apparatus 15. Therefore, pull out the adhesive tape 1 of the new adhesive reel 3 and attach the adhesive tape to the take-up reel 17 or hang the new adhesive tape 1 on the guide 36 of the bonding device 15. Work is not required, and the work efficiency of exchanging the adhesive reels 3 and 3a is high.
  • the connection is simple.
  • [0 4 3 1] Use the take-up reel 17 in (a) as it is, and replace the used adhesive tape 1 with the remaining tape 1 with the remaining tape with a new adhesive tape.
  • T JP2003 / 009694 In the take-up reel 17, only the base material 9 is taken up, so that several adhesive reels can be taken up. And work efficiency is good.
  • the silicone pressure-sensitive adhesive 62 of the silicone pressure-sensitive adhesive tape 60 in the embodiment has an adhesive force of 100 gZ25 mm or more, and in the present embodiment, 7.00 25 mm to 140 0 25 It is 111111.
  • the surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is, as in the above-described embodiment, the difference between the surface tension of the silicone base material in one of the adhesive tapes and the surface tension of the silicone base material in the other adhesive tape.
  • the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are arranged so as to overlap with each other.
  • the silicone adhesive tape 60 according to the second embodiment is adhered to the side surface of the processing base material 9 and the side surface of the adhesive material 1 1, and according to the third embodiment, The same operation and effect as those of the embodiment can be obtained.
  • the fourth embodiment shown in FIG. 19 is different from the first embodiment in that both ends of the base material are placed between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1.
  • the end 30 and the start 32 are connected via a silicone adhesive tape 61 coated with a silicone adhesive 62.
  • the use of the double-sided silicone adhesive tape 61 further reduces the connection between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1. Can be done easily and easily.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. It relates to a method of connecting a material tape.
  • electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected.
  • Adhesive tape is used as a method for making the connection.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, The length of the tape wound on a roll is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach the adhesive tape reel (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • adhesive tape reel hereinafter simply referred to as “adhesive reel”
  • the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur.
  • the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
  • An object of the present invention is to provide a method for connecting an adhesive tape.
  • FIGS. 20A to 20C are diagrams showing a method of connecting the adhesive tape according to the present embodiment
  • FIG. 2OA is a perspective view showing the connection between the adhesive reels
  • 20C is a cross-sectional view showing a connection method of a connection portion in FIG. 2 OA.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and each reel 3 and 3a is disposed on both width sides of winding core 5 and adhesive tape 1.
  • a side plate 7 is provided.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acrylic resin type and a silicone type as a thermosetting resin type.
  • One resin system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 1 3 A u, A g , P t, N i 5 C u, W, S b, S n, include metal particles or carbon, graphite, such as solder, these and non-conductive glass Formed by coating the above-mentioned conductive layer on a polymer nucleus material such as plastic, ceramics, plastic, etc. May be. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is connected to the guide bin 22. And attach it to the take-up reel 17 'and pay out the adhesive tape 1 (arrow E in Fig. 21). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening / closing opening) 23 are aligned and permanently connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24. This connects the electrode 21 a of the circuit board 21 and the electrode 23 a of the spring circuit 23.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. Then, the end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed (see FIG. 2 OA).
  • the method for connecting an adhesive tape according to the invention described in claims 19 to 21 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining number of windings 1 remaining, replace the new adhesive tape with the take-up reel 17 and (b) use the adhesive tape 1 used as the take-up reel 17 In some cases, an adhesive tape with less winding is used, and a new adhesive tape is connected to the adhesive tape with less winding.
  • the glue S 4 made of Sumi includes, for example, epoxy finesse, epoxy resin, bismaleimide resin, phenol resin, urea resin, melamine resin, alkyl resin, acryl resin, and unsaturated resin. Polyester resin, diaryl phthalate resin, silicone resin g, resorcinol formaldehyde resin, xylene resin S, furan resin, polyurethane resin, ketone resin, triaryl cyanurate resin, and the like.
  • connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 to each other.
  • the adhesive 11 surface of the start end 32 is superimposed on the base 9 surface of the end 30.
  • a paste-like resin adhesive 64 is applied to the overlapped portion from a filling machine 65 incorporated in the bonding apparatus 15.
  • the resin adhesive 64 is a thermosetting resin by the heating of the heater 66 incorporated in the bonding apparatus 15
  • the adhesive tape is cured by curing the resin adhesive 64. End of 1 3 009694
  • [0 4 6 5] Use the take-up reel 17 of (a) as it is, and replace the used adhesive tape 1 with the remaining adhesive tape 1 with a small amount of remaining tape with a new adhesive tape and perform new bonding.
  • the adhesive tape is connected to the take-up reel 17, when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 The tape is cut, and the end 30 of the adhesive tape remaining on the take-up reel 17 side and the starting end 32 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Then, a paste-like resin adhesive 64 is applied to the overlapped portion of both, and heating, ultraviolet irradiation, etc.
  • Adhesive 11 containing resin and conductive particles 13 is applied to base material (separate one night) unwound from unwinding machine 25 by means of one second 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core.
  • Plates 7, 7 are mounted on both sides or wound on a core with side plates, packed with dehumidifying material, and preferably shipped at a low temperature (-5 ° C to 110 ° C) Is done.
  • thermosetting resin is used as an example of the resin adhesive 64.
  • a light-hardening resin is used, and light such as ultraviolet light is used.
  • the adhesive tapes 1 may be connected to each other by curing the photocurable resin by irradiation.
  • the photocurable resin a composition in which a photopolymerization initiator is blended with a resin having an acrylate group or a methyl acrylate group, an aromatic diazonium salt, a diaryl methacrylate, etc.
  • An epoxy resin containing a photocuring agent such as a donium salt or a sulfonium salt is used.
  • a hot-melt adhesive containing ethylene vinyl acetate resin or polyolefin resin as a main component may be used as the resin adhesive.
  • a sheet-like hot-melt adhesive is wound around the portion where the adhesive tapes 1 overlap, and the hot-melt adhesive is heated and melted by a heater 66 and then solidified by cooling.
  • a plurality of resin adhesives used for connecting the adhesive tape 1 may be used from the group of a thermosetting resin, a photocurable resin, and a hot melt adhesive.
  • the base material 9 surface of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the starting end of the adhesive tape 1 of the new adhesive reel 3 The adhesive 1 of the part 35 2 is superimposed on one side, and a thermosetting resin, which is a resin adhesive, is applied and connected.
  • a thermosetting resin which is a resin adhesive
  • the terminal part 30 of the adhesive tape 1 on the adhesive reel 3a is used.
  • the adhesive 11 may be fixed with a thermosetting resin after the surfaces are superimposed and bonded together.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape.
  • the present invention relates to a material tape reel and an adhesive device.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape in which an adhesive is applied to a base material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • the adhesive tape reel in which the adhesive tape is wound on a reel is attached to the bonding device, the starting end of the adhesive tape is pulled out, and the take-up reel is taken out. Attach to Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • An object of the present invention is to provide an adhesive tape reel and an adhesive device.
  • FIGS. 22A to 22C are views showing the adhesive tape reel according to the first embodiment
  • FIG. 22A is a perspective view showing the adhesive tape reel
  • FIG. 22B is FIG.
  • FIG. 2C is a front view of FIG. 2A
  • FIG. 22C is a plan view of the connecting tape of FIG. 22A
  • FIG. 23 is a schematic view showing a pressure bonding step of an adhesive in an adhesive device.
  • the adhesive tape A includes a plurality of adhesive tape winding portions (hereinafter, winding portions) 2, 2a.
  • the winding portions 2 and 2a have the adhesive tape 1 wound on the reels 3 and 3a, respectively.
  • Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • connection tape 41 is provided between the adhesive tape 1 (hereinafter referred to as the other adhesive tape) 1 wound around the contact portion and the start end 32 of the adhesive tape.
  • the connecting tape 67 is arranged along the inner surface of the side plate 7 of the reel 3 from the terminal end 30 of one of the adhesive tapes 1, and a cutout portion 6 8 formed on the upper portion of the side plate 7. And is connected to the start end 32 of the other adhesive tape 1.
  • Marks 69 and 70 for recognizing the connecting tape 67 are attached to the connecting portions between the adhesive tape 1 and the connecting tape 67 on one side and the other, and the tape is provided.
  • the detection means detects the marks 69, 70, skip the connecting tape 67 and prevent crimping at the connecting tape 67. I have.
  • the substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin S type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin as a thermosetting resin type.
  • Ril resin type and silicone resin type are used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, etc., and these and non-conductive glass.
  • the conductive layer may be formed by coating the conductive layer on a polymer core material such as ceramic, plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • a polymer is used as the core, the melting point is not exhibited like solder, so that the softened state can be widely controlled by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness. It is more preferable because it can be obtained.
  • the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide pin 22.
  • the tape is attached to the take-up reel 17 and the adhesive tape 1 is fed out (arrow E in FIG. 23).
  • the adhesive tape 1 is arranged on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 arranged between the two reels 3 and 17.
  • the adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 1 1.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected.
  • a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the polyethylene material 24. This connects the electrode 21a of the circuit board 21 to the electrode 23a of the wiring circuit 23c.
  • the PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 1 in a relatively short time.
  • the connecting tape 67 is disengaged from the cutout 68, and then the other adhesive tape 1 is fed out.
  • a connecting tape 67 is provided between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 so as to connect them.
  • the bonding device 15 includes a pair of a light-emitting unit 71 and a light-receiving unit 72, and optically detects the connection tape 67. I have. Both the adhesive tape 1 and the other adhesive tape 1 are connected to each other, and black marks 69 and 70 are provided at both ends of the connecting tape 67.
  • the light emitting section 7 1 uses a laser tape for adhesive tape.
  • the light is continuously emitted toward 1, and the reflected light is received by the light receiving section 72, and the detection signal is sent to the control device 79. Then, the light receiving section 72 receives the reflected lights of the marks 69 and 70 on both ends of the connecting tape 67, and the detection signal is sent to the control device 79.
  • the other adhesive tape 1 is automatically fed out to the position of the heating and pressing head 19, so that the starting end 3 2 of the other adhesive tape 1 is heated and pressed. Until the position of the head 19 is reached, it is not necessary to pay out the connecting tape 67.
  • the connecting tape 67 is recognized by making the width T of the connecting tape 67 smaller than the width W of the front and rear adhesive tapes 1. are doing. Further, the bonding device 15 is provided with a light emitting unit and a light receiving unit similar to those of the first embodiment at opposing positions with the adhesive tape 1 interposed therebetween. In this case, the connection tape 67 is recognized by receiving the laser beam transmitted through the narrow portion of the connection tape 67 by the light receiving unit.
  • the connecting tape 67 has many holes.
  • the connecting tape 6 7 is recognized by forming 5 3.
  • the connection tape 67 is recognized by the light receiving portion receiving the laser beam transmitted through the hole 53 of the connection tape 67.
  • connection between the adhesive tapes 1 is not performed by the connecting tape 67, and when the unwinding of one adhesive tape 1 is completed, The adhesive tape 1 is exchanged by winding the other adhesive tape 1 around the unwinding reel 17.
  • the replacement work of a new adhesive tape reel is reduced, and the production efficiency of electronic equipment is increased.
  • the number of the winding portions 2 and 2a is not particularly limited, and may be any number.
  • the connecting tape 67 is optically detected.
  • a magnetic tape may be wound around the connecting tape 67 and detected by a magnetic sensor. You may do it.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or between circuit boards, and for electrically connecting both electrodes.
  • the present invention relates to an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor element (chip) to a supporting substrate for fixing a lead frame, a die for a lead frame, and a supporting substrate for mounting a semiconductor element.
  • the present invention relates to an adhesive tape reel wound in a reel shape, an adhesive device, and a method of connecting an adhesive tape.
  • Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
  • Japanese Patent Laying-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
  • This type of conventional adhesive tape for electrode connection has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • the adhesive tape reel on which the adhesive tape is wound around the reel is mounted on the bonding device, the starting end of the adhesive tape is pulled out, and the tape is wound on the take-up reel. Attach. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel with a heating and pressing head, and the remaining base material is wound on a take-up reel. taking it.
  • claims 25 to 28 can easily replace the adhesive tape reel and improve the production efficiency of electronic devices. It is an object of the present invention to provide an adhesive tape reel, a bonding device and a connection method.
  • FIGS. 27A to 27C are diagrams illustrating an adhesive tape reel according to the first embodiment
  • FIG. 27A is a perspective view illustrating the adhesive tape reel
  • FIG. 27C is a front view
  • FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A
  • FIG. 28 is a schematic view showing a bonding step of the adhesive in the bonding apparatus.
  • FIG. 4 is a perspective view showing a use state of an adhesive in a PDP.
  • the adhesive tape A includes winding portions (hereinafter referred to as winding portions) 2 and 2a of a plurality of adhesive tapes 1. Parts 2 and 2a are provided with reels 3 and 3a on which adhesive tape 1 is wound. Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of the base material 9 and the adhesive applied to one side of the base material 9.
  • the starting end 32 of the adhesive tape 1 (hereinafter referred to as the other adhesive tape) wound around the portion 2 a is connected using a locking member 76.
  • the locking member 76 is, for example, a locking pin having a substantially U-shaped cross section.
  • the terminal 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are overlapped.
  • a locking pin is inserted into the overlapping portion to connect the two.
  • the connecting portion 74 connects the terminal end portion 30 and the start end portion 32 with the locking member 76,
  • the connecting part 74 is folded back 180 degrees in the longitudinal direction of the tape, so that the locking member 76 is covered with the adhesive tape 1.
  • the base material 9 is made of OPP (rolled ⁇ 3 polypropylene), polytetrafluoroethylene, or silicon-treated PET (PET) in view of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • OPP rolled ⁇ 3 polypropylene
  • PET silicon-treated PET
  • Polyethylene terephthalate etc., but are not limited to these
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated 9694 It is preferable because it has deformability under pressure or pressure, reduces the distance between electrodes after connection, increases the contact area with the circuit at the time of connection, and improves reliability. Particularly when a polymer is used as a nucleus, the melting point is not exhibited unlike solder, so that the softened state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
  • the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide bin 22. Attach it to the take-up reel 17 and hang out the adhesive tape 1 (arrow E in Fig. 28). Then, the adhesive tape 1 is placed on the circuit board 2 1 and both reels 3,
  • the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between 17 and the adhesive 11 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a winding reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time.
  • the bonding device 15 includes a thickness detection sensor as the connection portion detection sensor 47, and optically detects the connection portion 74 to perform connection.
  • the part 74 is to skip the part of the heating and pressing head 19.
  • the connecting portion 74 of one adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape 1 as shown in Fig. 27C, and the difference in thickness is detected.
  • the thickness detection sensor 47 constantly detects the thickness of the adhesive tape 1 and transmits a detection signal to the control device 79.
  • the control device 79 Upon receiving the detection signal, the control device 79 outputs a control signal to the motor driving the reels 3 and 17 of the bonding device 15 and outputs the control signal to the motor via the motor driver. The output of the drive pulse to is started. Then, the motor rotates according to the number of pulses applied from the motor driver, and while rotating both reels 3 and 17 at a speed higher than the normal speed, the length of the connecting portion 74 in the transport direction is increased. The adhesive tape 1 is moved in the unwinding direction by a predetermined distance corresponding to the distance.
  • the other adhesive tape 1 is transported to the position of the heating and pressing head 19, so that the connection portion 74 of the one and the other adhesive tape 1 is heated and pressed.
  • the problem that the crimping operation is performed at the position of the pad 19 can be prevented.
  • one adhesive tape 1 is automatically wound on the take-up reel 17 until the connection portion 41 passes through the heating / pressing head 19, so that the time and effort for winding can be reduced. it can.
  • the tip 41a of the connection part ⁇ 4 The adhesive tape 1 can be used effectively by recognizing the rear end 4 lb and skipping only the connecting portion 7 4.
  • an adhesive tape reel having one winding portion is used without using an adhesive tape reel A having a plurality of winding portions 2 and 2a. You are using 2c.
  • the adhesive tape 1 is wound on the take-up reel 17 and the end mark 28 is exposed on one adhesive tape 1, one adhesive tape reel 2b is replaced with a new adhesive tape.
  • the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are connected to be exchanged with the tape reel 2c.
  • connection portion ⁇ 4 detects the portion of the heating and pressure head 19 by detecting the connection portion ⁇ 4 as a connection portion detection means with the thickness detection sensor ⁇ 7. I try to skip it.
  • the locking tool 76 for connecting the adhesive tapes 1 is not limited to the locking pin, and the overlapping portion of the two can be used.
  • a clip that can be sandwiched and fixed with an elastically deformable clip with a substantially U-shaped cross section, or a metal piece with a substantially U-shaped cross section between the two, and pressing the holding pieces from both sides of the overlapped portion A method may be used in which both are crushed and connected.
  • connection portion 74 is recognized by detecting the thickness of the connection portion 74 by using the thickness detection sensor 47. Not only that, but the connection part can be detected by using the transmittance detection sensor to recognize the connection part 74 or by using a CCD camera to capture the surface of the connection part on the monitor screen and comparing the density of the pixels to detect the connection part You may.
  • Figure 31A, Figure 31B, and Figures 32A to 32C show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the die and the semiconductor element of the lead frame.
  • An example of an L0C (Lead on Chip) structure is shown in which an adhesive tape for connecting a lead frame to a lead frame fixing support substrate and a semiconductor element are bonded and fixed to the lead frame.
  • An adhesive layer 80 such as a 25 ⁇ thick polyamide-imide adhesive layer is attached to both sides of a support film 78 such as a polyimide film having a surface treatment having a thickness of 5 ⁇ .
  • the semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG. 31B.
  • the adhesive tape shown in Fig. 31A is stripped using the die 8 7 (male (convex) 95, female (concave) 96) of the bonding machine shown in Figs. 32A to 32C.
  • an inner lead of 0.2 mm width and 0.2 mm width is placed on a 0.2 mm thick iron-nickel alloy lead frame.
  • the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductors at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed.
  • the frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B.
  • 81 is an adhesive film for semiconductor punched from an adhesive tape
  • 82 is a semiconductor element
  • 83 is a lead frame
  • 84 is a sealing material
  • 85 is a sealing material.
  • the bonding wire 86 is a bus bar.
  • Figures 32A, 32B, and 32C are bonding devices.
  • 87 is a punching die
  • 88 is a lead frame transport section
  • 61 is an adhesive tape.
  • Stamping and pasting parts 90 is a part of the heater
  • 91 is an adhesive tape reel (adhesive tape unwinding part)
  • 92 is an adhesive tape (adhesive film for semiconductor)
  • 93 is an adhesive tape It is a one-page unwinder.
  • reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor), 95 denotes a male type (convex portion), 96 denotes a female type (concave portion), and 97 denotes a film holding plate.
  • the adhesive tape 9 2 is unwound continuously from the adhesive tape 9 (adhesive tape unwinding section) 9 1, punches out the adhesive tape, and forms a strip with the shelling sound 9 It is stamped out and adhered to the lead portion of the lead frame, and is conveyed from the lead frame conveyance section as a lead frame with a semiconductor adhesive film. The punched adhesive tape is carried out from the adhesive tape unwinding roller 93.
  • the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape.
  • Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and in particular, is wound in a reel shape.
  • the present invention relates to an adhesive tape, a method for producing an adhesive tape, and a method for crimping an adhesive tape.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound up on the reel is about 50 m, and the adhesive tape is Once unwound from the reel and pressure-bonded to the circuit board or the like, it will not be used again.
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased.
  • FIG. 33A and FIG. are views of an adhesive tape
  • FIG. 33A is a perspective view of a reel on which an adhesive tape is wound
  • FIG. 34 is a cross-sectional view of A
  • FIG. 34 is a perspective view showing a use state of an adhesive in a PDP
  • FIG. 35 is a cross-sectional view showing a step of applying an adhesive to a base material.
  • the adhesive tape 1 according to the present embodiment is wound on a reel 3.
  • the reel 3 has side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. And are provided.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 1 Omm.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are arranged at 5 intervals.
  • the base material 9 is made of OPP (polypropylene (PP), polytetrafluoroethylene, silicone-treated PET (PET)) from the viewpoint of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • OPP polypropylene
  • PET silicone-treated PET
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, vinyl ester resin, and acrylic resin S as thermosetting resin resins.
  • the umbrella system and the silicone resin system are used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as a ceramic, a plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. This connection is crimped to the circuit board 21
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 thus obtained, and if necessary, as a cushion material, for example, is heated and pressed through a polytetrafluoroethylene material 24. Heats and presses the wiring circuit 23 onto the circuit board 21.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time.
  • the use amount of the agent 11 is remarkably increased as compared with the conventional method. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound up on the empty reel 17 in a relatively short time, and the reel 3 is wound up. Become empty.
  • the adhesive 11 mixed with the resin and the conductive particles 13 is applied to the base material (separation one night) unwound from the unwinding machine 25 by the first one 27 After drying in the drying oven 29, the web is wound up by the winder 31. As shown in Fig. 35, five coaters 27 are placed on the base material 9 for the 10 mm width, and five strips of adhesive 11 are placed on the 10 mm width. Is applied.
  • the raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound around a winding core, and the side plates 7, 7 are attached to the winding core from both sides, or It is wound on a core and packed with a dehumidifying material, and is preferably shipped at a low temperature (15 ° C to 110 ° C).
  • the adhesive tape 1 has an adhesive applied to the entire surface of one side of the base material with a width W.
  • the adhesive is separated into a plurality of strips in the width W direction by slits 35 formed in the longitudinal direction.
  • the slit 35 is preferably formed immediately after the adhesive tape 1 is pressure-bonded to the circuit board 21 after the reel 3 is mounted on the bonding device 15. .
  • a slit 35 is formed in the adhesive 11 of the adhesive tape 1 to be wound by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 3). It may be wound on a reel after forming a slit in the finishing step in the production of the adhesive tape shown in Fig. 5, or after drying in the coating step.
  • a slit may be formed immediately before winding in step 1.
  • the adhesive tape 1 according to the second embodiment is used in the bonding device 15
  • the adhesive tape is separated by slits 35 one by one. Is pressed from the base material 9 side by the heating and pressing head 19 and used sequentially as shown in Fig. 36A, 36B and 36C.
  • a plurality of adhesives 11 can be obtained only by forming slits 35 in the adhesive on the base material obtained by the same process as the conventional method. It is easy to manufacture.
  • the adhesive 11 is applied to the entire surface of the base material 9 (FIG. 37A).
  • the width W of the adhesive 11 is 5 to 100 mm as in the above-described embodiment.
  • the adhesive tape 1 is mounted on the bonding device 15 in the same manner as in the first embodiment, the adhesive tape 1 fed from the reel 3 is placed on the circuit board 21, and the adhesive tape 1 is bonded in the width W direction.
  • the adhesive tape 1 is bonded in the width W direction.
  • Fig. 37B By heating and pressurizing a part (one part) of the agent (Fig. 37B), the cohesive force of that part is reduced.
  • only the adhesive in the heated and pressurized portion is separated from the base material and pressed on the circuit board 21 (FIG. 37C).
  • a cohesive force reduction line is formed along the line around the heating and pressing head 19, and most of the heated and pressurized portion causes the adhesive to flow softly. It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide).
  • the heating temperature is selected according to the adhesive system used. I do.
  • the adhesive 11 is pressed into the substrate circuit by fluidizing one line of the width W only at the time of use.
  • the reel 3 of the adhesive tape 1 and the empty reel can be used a plurality of times by rotating forward and reverse.
  • the fourth embodiment shown in Figs. 38A to 38C shows another method of manufacturing the adhesive tape according to the first embodiment.
  • a slit 98 is formed on the applied adhesive 11 (FIG. 38A)
  • the other substrate is placed on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b.
  • Paste the material 9b Fig. 38B
  • one and the other base materials 9a and 9b are separated so as to be peeled off, and adhesive strips 11a and 1lb are arranged on every other base material 9a and 9b.
  • the adhesive is applied from one side of the base material 9a or 9b so that the adhesive strips 11a and lib are alternately arranged on the base material 9a and 9b.
  • the adhesive strips 11a, 11b may be arranged on every other base material 9a, 9b by heating and pressing every other strip 11a, 11b.
  • the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are not dispersed.
  • the number of the adhesives formed on the base material 9 may be any number, and may be at least two or more.
  • These inventions provide an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and electrically connecting both electrodes, a method for manufacturing an adhesive tape, and a method for manufacturing the same.
  • the present invention relates to a pressure bonding method for an adhesive tape.
  • Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive in a reel shape. .
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m.
  • the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board.
  • Adhesive is crimped around the four sides of the board.
  • the invention described in claims 35 to 41 is an adhesive tape capable of increasing the amount of adhesive without increasing the number of turns of the adhesive tape. And a method for producing an adhesive tape and a method for pressure-bonding the adhesive tape. [0590]
  • FIG. 39A and FIG. B, FIG. 40, FIG. 34, FIG. 5, and FIG. 41 the first embodiment of the invention described in claims 35 to 41 will be described.
  • Fig. 39A and Fig. 39B are views of the adhesive tape
  • Fig. 39A is a perspective view of a reel around which the adhesive tape is wound
  • Fig. 39B is a view of the adhesive tape of Fig. 39A.
  • FIG. 40 is a plan view seen from the side of the adhesive
  • FIG. 40 is a perspective view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • the adhesive tape 1 according to the present embodiment is wound on a reel 3.
  • the reel 3 includes a winding core 5 and side plates 7 arranged on both sides of the adhesive tape 1. It is set up.
  • the length of the adhesive tape 1 is about 50 m
  • the width W is about 150 O mm, which is almost the same size as one side of the circuit board.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are provided at regular intervals and in the width direction of the tape.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, and a vinyl ester type resin as a thermosetting resin.
  • a silicone resin system is used.
  • conductive particles 13 are dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • a material in which the above-described conductive layer is formed by coating or the like on a polymer core material such as ceramics and plastic may be used. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the circuit board 21 is rotated by about 90 degrees, the side adjacent to the circuit board 21 is positioned in the width direction of the adhesive tape 1, and the heating and pressing head 19
  • the adhesive 11 is pressed to the other side of the circuit board 21 by the above method.
  • the circuit board 21 is rotated by about 90 degrees, the adhesive 11 is pressed, and the adhesive 11 is pressed around the circuit board 21 over four circumferences.
  • the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and permanently connected.
  • the wiring circuit (or electronic component) 23 is placed on the adhesive 11, and if necessary, as a cushioning material, for example, polytetrafluoride.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the ethylene material 24.
  • connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time.
  • the use amount of the agent 11 is remarkably increased as compared with the conventional method.
  • the width W of the adhesive tape 1 is substantially equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 is increased, but the amount of adhesive is the same even with the same number of windings as before.
  • the number of reel replacements is significantly less than conventional ones.
  • An adhesive 11 mixed with resin and conductive particles 13 is applied to the base material (separate one night) unwound from the unwinding machine 25 by the second one 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the adhesive is applied to the base material 9 at regular intervals by moving to the left and right.
  • the material of the wound adhesive tape is After being cut to a predetermined width by the ridge 33 and wound on the winding core, the side plates 7, 7 are attached to the winding core from both sides, or are wound on the winding core with the side plate, Packed with dehumidifier, preferably shipped in a controlled low temperature (15 ° C to 110 ° C)
  • the adhesive tape 1 is mounted at two places in the adhesive device 15, and one adhesive tape 1 and the other adhesive tape are provided. Steps 1 are provided in directions orthogonal to each other. Then, the adhesive 11 is pressure-bonded to the pair of opposed vertical sides N of the circuit board 21 on one adhesive tape 1 (first step), and the pair of horizontal The adhesive 11 is crimped to the side M (second step), and the adhesive is crimped to the four circumferences of the circuit board 21 in two steps.
  • the circuit board 21 placed in the first step is used as it is in the second step without rotating the direction of the circuit board 21 between the first step and the second step. By moving to, automatic bonding of the adhesive becomes possible, and the working efficiency can be further improved. In this case, the circuit S 21 may be placed on a transport belt and automatically transported.
  • the adhesive is applied to the entire surface of one side of the base material with a width W, and the adhesive is formed in the width W direction of the base material.
  • the adhesive is separated into multiple strips in the width W direction by slits 35.
  • the slit 35 is preferably formed immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is mounted on the bonding device 15.
  • a slit 35 is formed on the adhesive 11 of the adhesive tape 1 to be wound out by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 40).
  • a slit may be formed immediately before winding with.
  • the face may reciprocate in the width W direction of the adhesive sheet 1.
  • the adhesive tape 1 according to the third embodiment is used in the bonding device 15, as in the first embodiment, the adhesive tapes 1 separated by the slits 35 are bonded one by one.
  • the agent is pressed from the base material 9 side with a heating and pressurizing head and used sequentially from the tip side.
  • a plurality of adhesives 11 provided in the width direction only by forming slits 35 in the adhesive on the base material obtained by the same process as in the related art It is easy to manufacture.
  • the adhesive 9 is applied to the entire surface of the base material 9 on one side (FIG. 43A).
  • the width W of the adhesive 9 and the adhesive 11 is substantially the same as the length of one side of the circuit board as in the above-described embodiment.
  • it is mounted in the same manner as in the first embodiment, and a part (one strip) of the adhesive is heated and pressed in the width W direction of the adhesive tape 1 (FIG. 43B), whereby the aggregation of the part is performed.
  • a cohesive force reduction line is formed along the line around the heating and pressing head 19, and the adhesive softens and flows in most of the heated and pressed portion, and (1 ° It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide).
  • the heating temperature is selected according to the adhesive system to be used.
  • the adhesive 11 can be softened and fluidized one by one in the width W direction only when used, and can be pressure-bonded to the substrate circuit.
  • the slits 3 5 It is not necessary to form or separate multiple strips.
  • the fifth embodiment shown in Figs. 44A to 44C shows another method of manufacturing the adhesive tape 1 according to the first embodiment, and shows the adhesive 1 applied to the base material 9a.
  • the other substrate 9b is attached on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (Fig. 44B).
  • the adhesive strips 11a and lib are arranged on every other substrate 9a and 9b.
  • one of the base materials 9a and 9b is adhered from one base material 9a or 9b side so that the adhesive strips 11a and 11b are alternately arranged on the other base material 9a and 9b.
  • the adhesive strips 11a and lib may be sequentially adhered to the base materials 9a and 9b by heating and calorizing every other strip of strips 11a and 11b.
  • the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are dispersed.
  • These inventions provide an adhesive tape cassette and an adhesive using an adhesive tape cassette for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes. To a crimping method.
  • Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses that an adhesive tape having a base material coated with an adhesive is wound into a reel.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
  • the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board.
  • Adhesive is crimped around the four sides of the board.
  • the invention described in claims 42 to 46 can reduce the amount of the adhesive without increasing the number of windings of the adhesive tape, and reduce the amount of the adhesive. It is an object of the present invention to provide an adhesive tape cassette and a method for crimping an adhesive using the adhesive tape cassette, which can easily replace a cell.
  • FIG. 45A and FIG. B, FIG. 46, FIG. 47, FIG. 4, FIG. 34, FIG. 48, the first embodiment of the invention described in claims 42 to 46 will be described. .
  • the adhesive tape is described in the case where two adhesives are arranged, but a plurality of adhesives may be formed.
  • FIG. 45A and 45B are diagrams of the adhesive tape cassette according to the first embodiment of the invention described in claims 42 to 46, and FIG. FIG. 45B is a perspective view of the tape cassette shown in FIG. 45A, and FIG. 46 is a perspective view of the tape cassette, and FIG. 46 is a view of the tape cassette shown in FIGS. 45A and 45B.
  • FIG. 47 is a cross-sectional view showing the state
  • FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus
  • FIG. 48 is a process diagram showing a method for manufacturing an adhesive tape cassette.
  • the adhesive tape cassette 100 mainly includes one reel 3, the other reel 17, and a case 99 for accommodating them.
  • the adhesive tape 1 is wound around one of the reels 3, and the other end 9 a of the adhesive tape 1 is fixed to the other reel 17.
  • An opening 11 is formed in one side of the case 99, and the adhesive tape 1 is drawn out from the opening 11.
  • Guides 13 and 13 for guiding the movement of the adhesive tape 1 are provided on both sides of the opening 11.
  • the case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are attached to a bonding device 27 (described later).
  • the provided spool 17 (see FIG. 46) is fitted and fitted to each reel 3,5.
  • each of the reels 3 and 5 is formed on its inner peripheral side with a fitting line 19 on which the spool 17 of the bonding device 27 is fitted, and on the outer peripheral side thereof is rotated by a projection 7c of a case 99. Engagement grooves 21 are formed so as to fit as much as possible.
  • the adhesive tape 1 has one side of the base material 9 coated with two adhesives 11a and 11b in a width direction. . The two strips of adhesive 11a, 1lb are spaced apart from each other.
  • the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm.
  • the width of each piece of adhesive 11a, 11 1 is about 1.2 mm.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, a vinyl ester type resin type, and a silicone as a thermosetting resin type.
  • a resin system is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, As, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like.
  • the conductive layer may be formed by coating a polymer nucleus material such as ceramics, plastic, or the like with a coating. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit sometimes increases and the reliability is improved.
  • polymers when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
  • the adhesive tape cassette 100 is attached to the bonding device 27.
  • the bonding device 27 is provided with spools 17 and 17 (see FIG. 46) for cassettes at intervals, and the spools 17 and 17 are mounted on reels 3 and 5 of the adhesive tape cassette 100, respectively.
  • Engage, 17 Therefore, the adhesive tape cassette 100 can be mounted with a one-touch switch, so that there is no need to attach the other end 9a of the adhesive tape 1 wound on a reel to an empty reel as in the related art.
  • the adhesive tape 1 is pulled out from the adhesive tape force set 100, and is passed over the guides 31 and 31 of the bonding device 27.
  • the spool 17 of the bonding device 27 is driven to feed out the adhesive tape 1 (in the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the circuit board 21. Then, the adhesive tape 1 is pressed from the base material 9 side with the heating and pressing head 19, and one strip of the adhesive 1 la on one side in the width direction is pressed against one side of the circuit board 21. Wind the strip adhesive 1 1b and 9 on the other reel 17. In this way, the adhesive 11a is pressure-bonded over the entire circumference of the circuit board 21.
  • the adhesive tape cassette 100 is once removed, turned upside down and mounted, and the above-described steps are repeated.
  • the adhesive is formed on the adhesive tape in two or more strips, it is possible to change the position in the width direction and perform the pressure bonding sequentially or at intervals.
  • the electrodes 33a of the circuit board 21 and the electrodes 37a of the wiring circuit (electronic parts) 37 are aligned and permanently connected.
  • the wiring circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressing head 19 via the fluoroethylene material 39 (see FIG. 4).
  • the electrode 33a of the circuit board 21 and the electrode 37a of the wiring circuit 23 are connected and fixed.
  • the adhesive tape cassette according to the present embodiment In the present embodiment, the connection portion of the PDP 26 that has been bonded using 100 is bonded over the entire periphery of the PDP 26, and the amount of the adhesive 11 used at one time has conventionally been reduced. It is much higher than in comparison. However, since two strips of adhesive 1 la and 1 lb are placed on the adhesive tape 1 in the width W, the amount of adhesive is doubled even if the number of windings is the same as before, so the number of cassette replacements Need less.
  • the base material (separation) 23 unwound from the unwinding machine 25 is used to apply the adhesive 11 mixed with the resin and the conductive particles 30 to the base material 2 3 After coating and drying in a drying oven 29, the web is wound up by a winder 31.
  • a large number of adhesives are applied to the base material 9.
  • the raw material of the wound adhesive tape is cut into a predetermined width (width of two adhesive strips) by a slit 33 in a finishing process, wound on a reel 3, and then wound on a reel.
  • the adhesive tape cassette 100 is manufactured by fitting the 3 and the empty reel 5 so as to be sandwiched between the half cases 99a and 99.
  • the adhesive tape cassette 100 is packed together with a dehumidifying material, and is preferably shipped at a low temperature (_5 ° C to 110 ° C).
  • the adhesive 11 is pressure-bonded at one time over the entire side of the circuit board 21.
  • a guide 101 for pulling out the adhesive tape 1 from the tape force set 100 and arranging it is provided.
  • the entirety of one side of the circuit board 21 is contacted at one time. Work efficiency is good because the adhesive can be pressed.
  • the adhesive 11 is applied to the entire surface of one side of the base material 9 with a width W, and the adhesive is divided into two by a slit 102. It is separated.
  • the slits 102 are provided immediately after the adhesive tape 1 is mounted on the circuit board 21 after the adhesive tape cassette 100 is mounted on the bonding device 27. It is preferable to form it.
  • a slit 102 is formed on the adhesive 11 of the adhesive tape 1 to be unwound by attaching a face to the vicinity of the cassette mounting portion of the adhesive device 27 (indicated by S in FIG. 47).
  • the adhesive tape may be wound on a reel 3 after forming a slit in the finishing process during the production of the adhesive tape shown in FIG. 48, or may be wound on a winding machine 3 after drying in the coating process.
  • the slit 102 may be formed immediately before winding at 1.
  • the adhesive 11 is applied to the entire surface of the base material 9 on one side (FIG. 51A).
  • the adhesive tape cassette 100 containing the adhesive tape 1 is mounted on the adhesive device 27 in the same manner as in the first embodiment, and a part of the adhesive 11 in the width W direction of the adhesive tape 1 ( By heating and pressurizing the adhesive, the cohesive force of that portion is reduced, and only the adhesive 1 la of the heated and pressurized portion is separated from the base material 9 and pressed against the circuit board 21 (Fig. 5 1). ⁇ ) ⁇
  • a cohesive force reduction line 103 (Fig. 51A) is formed along the periphery of the heating / pressing head 19, and most of the heated / pressed portion is made of an adhesive. It is preferable that the adhesive softens and flows (100 or less voids are a guideline) and the curing reaction of the adhesive does not start or is in a low state (reaction rate is 20% or less as a guideline). Select according to the drug system.
  • the adhesive 11 has a width W only when used.
  • 25 a of one line can be softened and fluidized, and can be pressure-bonded to the substrate circuit.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
  • adhesive reel hereinafter simply referred to as “adhesive reel”
  • FIGS. 52A and 52B are views showing the connection of the adhesive tape according to the present embodiment
  • FIG. 52A is a perspective view showing the connection between the adhesive reels
  • FIG. 5B is a sectional view showing a connection portion in FIG. 52A.
  • the adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the reels 3 and 3a have side plates disposed on both sides of the winding core 5 and the adhesive tape 1, respectively. 7 are provided. [0666]
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 has a support layer 9 b and a hot-melt layer (a hot-melt layer) 9 a sandwiching the support layer 9 b from both sides.
  • a hot-melt layer a hot-melt layer
  • thermoplastic resin such as polyethylene, SBS (styrene butadiene styrene block copolymer), and nylon.
  • SBS styrene butadiene styrene block copolymer
  • nylon nylon
  • OPP stretched polypropylene
  • polytetrafluoroethylene And reinforcing fibers such as plastic glass fiber such as PET (polyethylene terephthalate), aramide fiber, and carbon fiber.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • connection temperature when a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the guide pins 22.
  • the tape is attached to the take-up reel 7 and the adhesive tape 1 is fed out (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the reels 3 a and 17.
  • the adhesive 1 1 is crimped to the circuit board 21.
  • the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time.
  • the end mark 28 of the adhesive tape 1 wound on a is exposed (see FIG. 52A).
  • connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive tape 3a and a new adhesive tape.
  • 3 adhesive tape With respect to the starting end 32 of the tape 1, the adhesive 11 surface of the starting end 32 is superimposed on the hot melt layer 9 a of the base material 9 at the end 30, and such a portion is placed on the table 104. Then, the overlapping portion is heated by the heating / pressing head 19 of the bonding device 15 to melt the hot-melt layer 9a, and then the hot-melt is solidified by cooling. 0 and the start end 32 are connected. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • Adhesive 11 mixed with resin and conductive particles 13 is applied to base material (separation overnight) unwound from unwinding machine 25 by co-existing 27 After drying in the drying oven 29, the web is wound up by the winder 31.
  • the raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core. Then, side plates are attached to the winding core from both sides, and dehumidification is performed. It is packaged together with the materials and shipped at a low temperature (15 ° C to -10 ° C).
  • the hot-melt agent layer 9a is sandwiched between the support layers 9b.
  • the hot-melt agent layer 9 a is heated by the heating and pressurizing head 19 of the adhesive device 15.
  • the hot melt exudes from the hot melt layer 9a, and the hot melt solidifies by cooling, so that the adhesive tapes 1 are connected to each other.
  • the hot-melt agent layer 9a is sandwiched between the support layers 9b, it is possible to prevent the adhesive strength of the hot-melt agent layer 9a from being lowered due to adhesion of moisture and dust due to moisture.
  • the base material 9 is composed of the support layer 9b and the three layers sandwiching the support layer 9b from both sides with the hot-melt agent layer 9a, but is not limited thereto. Four or more layers may be used.
  • the heating and pressurizing head 19 of the bonding device 15 is used for the heat press bonding of the connection portion.
  • the heating and pressurizing head 19 instead of the heating and pressurizing head 19, separate heating is performed.
  • the connection between the adhesive tapes 1 may be performed by heating the connection portion using a container.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards, and for electrically connecting both electrodes.
  • liquid crystal panels PDPs (plasma display panels), E Adhesive tape is used as a method of bonding and fixing electronic components such as L (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards, and electrically connecting both electrodes.
  • L fluorescent display
  • the adhesive tape is used for the lead fixing tape of the lead frame, the LOC tape, the die bonding tape, the adhesive film such as the micro BGA / CSP, etc., to improve the productivity and reliability of the entire semiconductor device. Used to improve.
  • Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
  • both sides of the base material are subjected to a silicone treatment so that the adhesive does not adhere to the base material or is easily peeled off.
  • adheresive reel When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive material reel by a heating and pressing head, and the remaining base material is wound on a take-up reel.
  • adhesive reel a reel of the adhesive tape
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased.
  • the use of adhesives has expanded, and the amount of adhesives used has increased.
  • the number of adhesive tapes wound on the reels is increased to increase the amount of adhesive per reel and to reduce the frequency of reel replacement.
  • the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse.
  • the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape and cause blocking.
  • An object of the present invention is to provide a method of connecting an adhesive tape that can be improved.
  • FIGS. 54A to 54C are cross-sectional views showing the connection process of the connection portion in FIG. 55
  • FIG. 54A shows the state of the adhesive tape before discharge
  • FIG. 54B shows the state after discharge
  • FIG. 54C shows the state of the adhesive tape
  • FIG. 54C is a view showing the thermocompression bonding of the connection portion.
  • FIG. 55 is a perspective view showing a connection between the adhesive reels in the method of connecting the adhesive tape
  • FIG. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
  • Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both width sides of core 5 and adhesive tape 1, respectively. Are provided.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive 11. G), etc., and surface-treated with release agent 9a.
  • the release agent include an olefin release agent, a low melting point wax such as ethylene glycol montanate, carnauba wax, petroleum wax, a low molecular weight fluororesin, a silicone-based or fluorine-based surfactant, an oil, and a wax.
  • Resins, polyester-modified silicone resins and the like are used, and silicone resins are particularly common.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is guided into the guide bin 22. And attach it to the take-up reel 17 and pay out the adhesive tape 1 (Fig. 5 6 Medium arrow E). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is crimped over the entire periphery of the PDP 26.
  • the adhesive tape 1 on the reel 3a is replaced with the adhesive tape 1 on the reel 3a in order to replace the reel 3a with a new adhesive reel 3.
  • the end 30 of the material tape 1 is connected to the beginning 32 of the adhesive tape 1 (the other adhesive tape) wound on a new adhesive reel 3.
  • this adhesive tape 1 is connected by placing the end 30 of the adhesive tape 1 on the used reel 3a at the irradiation position of the electric discharger 105. . Then, the release agent 9 a is removed by discharging the surface of the base material 9.
  • the adhesive 11 surface of the starting end 32 of the other adhesive tape 1 is superimposed on the surface of the base material 9 from which the release agent 9a has been removed (Fig. 54C).
  • the superposed part of both is placed on the table and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 I do. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
  • the release agent 9a of the base material 9 of one of the adhesive tapes 1 whose winding has been completed is removed, and a new adhesive tape is applied to such a portion.
  • 1 Adhesive 1 Laminate 1 surface apply heat and pressure with heating and pressurizing 19 and bond, connect both, but remove release agent 9a from substrate 9 of new adhesive tape 1 Then, the adhesive 11 of one of the adhesive tapes 1 whose winding has been completed may be overlapped on such a portion, and the two may be connected.
  • a method for removing the release agent 9a besides plasma discharge, a method using ultraviolet irradiation or laser irradiation may be used.
  • ultraviolet irradiation for example, a mercury lamp is used as a light source. This is performed by irradiating ultraviolet rays from a mercury lamp for a certain period of time.
  • laser irradiation the release agent 9a is decomposed and scattered by the laser light irradiated by the laser oscillator, and the release agent 9a is removed.
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component to a circuit board or a circuit board and electrically connecting both electrodes.
  • the present invention relates to an adhesive tape used in a semiconductor device for fixing a semiconductor element (chip) to a support for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and particularly to a reel-shaped.
  • the present invention relates to an adhesive tape reel wound around.
  • the adhesive tape is used for a lead frame lead fixing tape, a LOC tape, a die bond tape, and the like.
  • a lead fixing tape is used to fix lead pins of a lead frame. It is used to improve the productivity and reliability of the lead frame itself or the entire semiconductor device.
  • semiconductor elements such as a glass epoxy substrate or polyimide substrate
  • connection part and the top surface or the end surface of the chip are sealed with an epoxy-based sealing material or epoxy-based liquid sealing material, and metal terminals such as solder balls are arranged on the back surface of the wiring board in an array.
  • Adhesive tapes are also used for QFN (Quad i! At Non-leaded Package) and SON (Small Outline Non-leaded Package). Then, a method is adopted in which a plurality of these packages are mounted on the board of an electronic device at high density by a solder reflow method and packaged at a time.
  • the die of the lead frame and the semiconductor element are mounted via an adhesive, and the terminal on the semiconductor element side and the lead frame terminal are connected by wire bonding, and the connection portion and the upper surface or the end surface of the chip are connected. Sealed with epoxy-based sealing material or epoxy-based liquid sealing material. An adhesive tape is also used as an adhesive for such a semiconductor device.
  • Japanese Patent Application Laid-Open No. 2000-2005 discloses a method of electrically connecting electrodes to each other by winding an adhesive tape coated with an adhesive in a reel shape. What was taken is disclosed.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
  • FIGS. 57A to 57C are views showing an adhesive tape reel according to the first embodiment
  • the adhesive tape reel A includes winding portions (hereinafter, winding portions) 2, 2a of a plurality of adhesive tapes 1, and winding portions 2, 2a.
  • 2a is provided with reels 3 and 3a on which an adhesive tape 1 is wound.
  • Each reel 3, 3a is provided with a winding core 5 and side plates 7, 7a, 7b arranged on both width sides of the adhesive tape 1. As shown in FIG.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • a cover member 8 covering the periphery of the adhesive tape 1 wound on the reel 3a is detachably provided on the reel 3a on the unused winding portion 2a.
  • a storage portion (storage space) 12 for the desiccant 10 is provided in the side plate 7a inside the winding portions 2 and 2a.
  • a desiccant 10 such as a force gel
  • the moisture in the unused winding portion 2a is removed from the inside.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate) is used, but is not limited to these.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • the conductive particles 13 may be dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated It is preferable because it has deformability by pressure or pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability.
  • a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
  • the adhesive tape reel A and the take-up reel 17 are attached to the adhesive device 15, and the base end of one adhesive tape 1 is hung on the guide bin 22. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the reels 3 and 17. Then, the adhesive 1 1 is pressed to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17. Next, as shown in FIG.
  • the wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and the polytetrafluoroethylene material 2 is used as the cushioning material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4.
  • the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • the adhesive 11 is pressed over the entire periphery of the PDP 26.
  • the amount of the adhesive 11 used at one time is significantly larger than in the past. Therefore, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time.
  • the end mark is exposed on the adhesive tape 1 of the one winding part 2, replace it with the adhesive tape 1 of the new winding part 2a.
  • the unused winding portion 2a is provided with a cover member 8, and after removing the cover member 8, the adhesive tape 1 is fed out to take up the winding reel 17. Attach to 9694
  • the winding portions 2, 2a, and 2b are separately provided, and are provided on the main body of the bonding device 15. Slidably mounted on the shaft 107. Then, when the unwinding of the one winding part 2 is completed, the cap 108 attached to the tip of the shaft 107 is removed, and the one winding part 2 is removed from the bonding device 15. Then, the other winding portion 2a is moved to the bonding position, the cover member 8 is removed, and then the adhesive tape 1 of the other winding portion 2a is wound around the take-up reel 17 and the adhesive tape 1 has been exchanged. In this case, the plurality of winding portions 2, 2a, and 2b are separately provided, so that they are easy to handle.
  • the winding portions 2, 2a, and 2b are separately provided, and the winding portion 2 , 2a, 2b are attached to the bonding device 15 by fitting the side plates 7, 7a of each other.
  • the side plate 7 a of the other winding portion 2 a is provided with a fitted portion 110 having a substantially U-shaped cross section, and the side plate 7 of the one winding portion 2 is provided.
  • the number of winding portions 2 and 2a is not particularly limited and may be any number.
  • the side plates 7, 7a are vertically slid.
  • the one and the other winding portions 2 and 2a are fitted to each other.
  • a fitting hole is formed in one side plate 7 and a fitting projection is provided in the other side plate 7a. The fitting projection may be pushed into the fitting hole in the width direction of the above to fit the two together.
  • Figures 31A and 31B show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the adhesive tape for connecting the die of the lead frame and the semiconductor element.
  • An example of an L 0 C (Lead on Chip) structure for bonding and fixing a semiconductor device to a support frame for fixing a lead frame to a lead frame is shown.
  • the semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG.
  • the adhesive tape shown in Fig. 31A is attached to the punching die 87 (male (convex) 95, female (recess) 96) of the bonding machine shown in Figs. 32A to 32C.
  • Punched into strips for example, and placed on a 0.2 mm thick iron-120-kel alloy lead frame so that the inner lead with 0.2 mm spacing and 0.2 mm width is in contact with it.
  • the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductor at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed.
  • the frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B.
  • a sealing material such as an epoxy resin molding material
  • reference numeral 81 denotes an adhesive film for a semiconductor punched from an adhesive tape
  • 54 denotes a semiconductor element
  • 83 denotes a lead frame
  • 84 denotes a sealing material
  • 85 denotes a bonding wire.
  • 86 are bus bars.
  • Fig. 3 2A, 32B and 32C are bonding devices.
  • 87 is a punching die
  • 88 is a lead frame transport section
  • 6 1 is an adhesive tape punching and sticking area
  • 90 is a part of the adhesive tape
  • 91 is an adhesive tape-prill (adhesive tape unwinding part)
  • 92 is an adhesive tape (adhesive film for semiconductor).
  • 93) is an adhesive tape unwinding roller.
  • reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor)
  • 95 denotes a male type (convex portion)
  • 96 denotes a female type (concave portion)
  • 97 denotes a film holding plate.
  • the adhesive tape 9 2 is continuously unwound from an adhesive tape reel (adhesive tape unwinding portion) 9 1, punches out an adhesive tape, and is punched into a strip shape at an attaching portion 8 9. It is adhered to the lead portion of the lead frame and is transported from the lead frame transport section as a lead frame with an adhesive film for semiconductor. The punched adhesive tape is carried out from an adhesive tape unwinding roller 93.
  • the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape.
  • Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
  • the present invention relates to an adhesive tool for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and pressing an adhesive for electrically connecting both electrodes to the circuit board.
  • Japanese Patent Application Laid-Open No. 2001-280405 discloses a reel wound on an adhesive tape having a base material coated with an adhesive.
  • This adhesive tape reel (hereinafter referred to as "adhesive reel") is mounted on an automatic bonding machine for use. It is described.
  • the automatic bonding machine includes a mounting section for an adhesive reel and a mounting section for an empty reel, a heating and pressing member provided between these reels, and a table for mounting a substrate.
  • the adhesive tape is pulled out from the adhesive reel onto the substrate, and the adhesive tape is heated and pressed from the back side of the base material by a heating and pressing member, and the adhesive is pressed onto the substrate.
  • the conventional automatic bonding machine is large, and when it is desired to partially press the adhesive on the substrate, when the area to press the adhesive is small, or when performing temporary pressing, etc. There is a problem that it is rather difficult to operate because of its large size.
  • the invention described in claim 59 is a bonding device that is small in size, can be operated with one hand, and can easily press the adhesive on a part of the substrate.
  • the purpose is to provide.
  • FIGS. 62A and 62B are views of the adhesive tool according to the first embodiment of the invention described in claim 59
  • FIG. 62A is a perspective view of the adhesive tool
  • FIG. 62B is a sectional view taken along the line A--A of FIG. 62A
  • FIG. 63 is a side view for explaining how to use the bonding tool shown in FIGS. 62A and 62B.
  • FIG. 4 is a process chart showing a method for manufacturing an adhesive tool.
  • the adhesive tool 111 includes one reel (supply reel) 3, the other reel (empty reel) 5, and a case 9 for accommodating them.
  • the adhesive tape 1 is wound around one of the reels 3, and one end 9 a of the adhesive tape 1 is fixed to the other reel 5.
  • the case 9 9 is formed in a size that can be gripped with one hand, and is viewed from the side.
  • the shape is substantially triangular with curved corners, so that it is easy to hold.
  • An opening 113 is formed at a corner of the substantially triangular case 99, and the adhesive tape 9 is exposed from the opening 113.
  • a heating member 111 is protruded from the opening 113, and the heating member 114 has a substantially triangular shape in a side view.
  • the adhesive tape 1 pulled out along the lower surface 13b is guided, and an electric heating plate 115 is provided on the lower surface side.
  • the shape of the heating member 1 14 is rod-shaped, and the heating member 1 14 is rotated when the adhesive tape 9 is pulled out by covering the heating member 1 14 with the electric heating plate 1 15.
  • the tape 9 can be pulled out smoothly. It is preferable to provide polytetrafluoroethylene-silicone rubber or both on the outside of the electric heating plate 115 because pressure is uniformly applied when the adhesive 9 is pressed.
  • the case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are housed in the case.
  • a guide 16 is further provided in the case to guide the movement of the adhesive tape 1.
  • a plate-shaped guide is formed on one of the bottom surfaces of either the case 99a or 7b, and when this adhesive is pressed against the circuit board while pressing the guide against the edge of the circuit board, it follows the circuit board. Adhesive can be pressed with high precision.
  • One gear 3 is fixed coaxially to one reel 3, and the other gear 1 17 is also fixed coaxially to the other reel 17 and one gear 11 6 and the other gear 1 17 mesh with each other, and when one reel 3 rotates and the adhesive tape 1 is pulled out, the other reel 17 pulls out the adhesive tape 1.
  • the substrate 9 is rotated by an amount and wound up.
  • the gear unit 118 is constituted by the one gear 116 and the other gear 117.
  • a case (power supply means) 1 19 for supplying electric power to the heating member 1 14 is provided on the side surface of the case 9 9. Dry electricity A pond is housed, and an adjustment circuit for the power supplied to the heating members 114 is housed.
  • the third case 1 19 is provided with a power switch 120 so that the ON / OFF operation can be performed by the finger of the hand holding the adhesive 1 1 1.
  • the adhesive tape 1 has an adhesive 11 applied to one surface of the substrate 9.
  • the adhesive tape 1 has a length of about 20 m and a width W of about 1.2 mm.
  • the base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
  • thermoplastic resin a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acryl type resin, and a silicone resin type as a thermosetting resin type. Is used.
  • the conductive particles 13 are dispersed in the adhesive 11.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the above-mentioned conductive layer may be formed by coating or the like on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved.
  • the core is made of polymers, it does not show a melting point like solder, so the softening state can be widely controlled by the connection temperature, and the electrode thickness This is more preferable because a connection member that can easily cope with variations in brightness and flatness is obtained.
  • a method of using the bonding tool 111 according to the present embodiment will be described.
  • Fig. 63 hold the adhesive tool 1 1 1 with one hand and turn ON the power switch 1 20.
  • the opening 1 13 where the adhesive tape 1 is exposed is pressed against the circuit board 27.
  • the opening 11 is provided with a heating member 1 14 on the base material 9 side of the adhesive tape 1, so that the adhesive tape 1 on the lower surface side of the heating member 1 1 1 is heat-pressed to circuit 27.
  • the adhesive 11 when the adhesive 11 is to be pressed at an arbitrary position on the circuit board 27, the adhesive 11 can be easily held by pushing it with one hand.
  • the adhesive 11 can be pressed. In this way, the adhesive 11 can be easily crimped.
  • the electronic component (wiring circuit) 37 when temporarily crimped on the circuit board 27, or when only a part of the circuit board 27 is When crimping parts (wiring circuit) 37 (This is particularly effective.
  • the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are aligned and fully connected.
  • the electronic components (wiring circuit) 37 are placed on the adhesive 11 and, if necessary, polytetrafluoroethylene 3 9 Heating force!]
  • Pressure head 19 heats and presses electronic components (wiring circuit) 37 onto circuit board 27 (see Fig. 4).
  • the electrode 27a of the circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 are connected and fixed.
  • the adhesive 1 11 is packed together with a dehumidifying material, and is preferably shipped at a controlled low temperature (15 ° C to 10 ° C).
  • the present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
  • the conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound around the reel is about 50 m, and the adhesive tape is once applied. After being unwound from the reel and pressure-bonding the adhesive to a circuit board or the like, it is not used again.
  • the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased.
  • the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, there is a problem that the frequency of replacement of the adhesive reel is increased, and the replacement of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved.
  • the invention described in claims 60 to 64 can increase the number of windings per reel and improve the production efficiency of electronic equipment.
  • the purpose is to provide adhesive tape.
  • FIG. 65A, FIG. 65B, FIG. 3, FIG. 4, FIG. 29, and FIG. 5 illustrate the first embodiment of the invention described in claims 60 to 64. Things.
  • FIG. 65A and FIG. 65B are views of the adhesive tape according to the first embodiment,
  • FIG. 65A is a perspective view showing an adhesive reel, and
  • FIG. 4 Fig. 65 is a sectional view taken along line AA in Fig. 5A.
  • the adhesive tape 1 is wound around a reel 3.
  • the reel 3 is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
  • the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 was a copper film (copper foil).
  • the thickness of substrate 9 (indicated by S in Fig. 65B) is 10 ⁇ , the tensile strength of substrate 9 at 25 ° C is 500 MPa, the thickness of substrate 9 with respect to adhesive 11 The ratio (S / T) was 0.5, and the thickness of the adhesive 11 was 20 Aim.
  • the surface roughness Rmax of the substrate 9 was 0.25 m.
  • a substrate using an aromatic polyamide film (Miktron) as the substrate 9 was also manufactured.
  • the thickness, the tensile strength, and the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 of the base material 9 were prepared in the same manner as the copper film.
  • the reel 3 of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is hung on the guide bin 22.
  • the tape was attached to the take-up reel 17 and the adhesive tape 1 was unwound (arrow E in FIG. 3).
  • the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is applied to the base material 9 side by the heating / pressing head 19 placed between both reels 3 and 17.
  • the adhesive 11 was pressure-bonded to the circuit board 21. Thereafter, the substrate 9 was wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushioning material.
  • the wiring circuit 23 was heated and pressed on the circuit board 21 by the heating and pressing head 19 through 4.
  • the electrode 21 a of the circuit board 21 was connected to the electrode 23 a of the wiring circuit 23.
  • the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment the adhesive 11 is pressure-bonded over the entire periphery of the PDP. It is clear that the amount of the adhesive 11 used at one time is significantly higher than in the past. Therefore, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 17 in a relatively short time, and the reel 3 is empty. become.
  • the base material 9 was easy to handle like the conventional adhesive tape 1 and the base material 9 was used. There was no stretching or cutting. Since the thickness of the base material 11 is thinner than that of the conventional product (50 m), the number of windings of the adhesive tape is increased, the frequency of reel replacement is reduced, and productivity is improved.
  • the adhesive tape 1 was prepared. As described above, when actually used, no troubles such as elongation of the base material 9 and cutting occurred.
  • the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 is set to 0.
  • the adhesive tape 1 was produced and actually used as described above. There were no problems such as cutting.
  • These inventions relate to a method for forming an adhesive material of an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other and electrically connecting both electrodes. Also, the present invention relates to a method for forming an adhesive tape for an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor element (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element. The present invention relates to a method for forming an adhesive tape wound on an adhesive tape reel.
  • Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
  • Japanese Patent Application Laid-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
  • This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m.
  • adheresive reel to the adhesive device, and attach the starting end of the adhesive tape. Pull it out and attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining winding is wound on a winding reel. I have.
  • the winding diameter the diameter of the tape around which the adhesive tape is wound (hereinafter referred to as the “winding diameter”) becomes large, and it is difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus can be used. It may disappear.
  • the invention described in claims 65 to 66 can improve the production efficiency of electronic devices without increasing the winding diameter of the adhesive tape. It is an object of the present invention to provide a method of forming an adhesive tape that can be used.
  • FIGS. 66A and 66B are diagrams showing an adhesive forming step of the adhesive tape according to the first embodiment, and FIG.
  • the process of winding one of the substrates on a reel for winding FIG. 66 is a cross-sectional view showing an overlapped portion of the adhesives in FIG. 66, and FIG. 67 shows a step of forming the adhesive on the adherend in the bonding apparatus.
  • FIG. 68 is a perspective view of a reel around which an adhesive tape is wound
  • Fig. 4 is a cross-sectional view showing the bonding between circuit boards
  • Fig. 29 shows the use state of the adhesive in the PDP.
  • FIG. 5 is a perspective view
  • FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
  • Adhesive tape 1 is wound around reels 3 and 1 2 1, respectively, and each reel 3 and 1 2 1 has side plates arranged on both width sides of core 5 and adhesive tape 1. 7 are provided.
  • the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
  • the base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) or the like from the viewpoint of strength and adhesive releasability. However, it is not limited to these.
  • thermoplastic resin a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin
  • Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
  • conductive particles 13 may be dispersed.
  • the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like.
  • the conductive layer may be formed by coating the conductive layer on a polymer core material such as non-conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable.
  • a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved.
  • polymers are used as cores, they do not show a melting point like solder, so the state of softening can be widely controlled by the connection temperature This is more preferable because a connection member that can easily cope with variations in electrode thickness and flatness can be obtained.
  • the bonding apparatus 15 is equipped with reels 3 and 12 of two adhesive tapes 1 and reels 17 and 18 for winding, and one of the reels.
  • the tip of the adhesive tape 1 wound on 3 is hung on the guide bin 22 and attached to one of the take-up reels 17 to feed out the adhesive tape 1 (arrow E in FIG. 66A).
  • the tip of the adhesive tape 1 wound on the other reel 12 1 is also attached to the other take-up reel 18, and the adhesive tape 1 is paid out.
  • one adhesive tape 1 is arranged on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressurizing head 19, and the adhesive is applied. 11 is formed by crimping the circuit board 21 as an adherend. Thereafter, the base material 9 is wound on a take-up reel 17.
  • a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material.
  • the wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
  • FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is press-bonded over the entire periphery of the PDP 26.
  • the bonding of the adhesive 11 of one adhesive tape 1 and the bonding of the other adhesive tape 1 is performed.
  • the adhesive 1 1 is overlaid to make the desired thickness of the adhesive 1 1, and then the adhesive 1 1 is pressed onto the circuit board 2 1, so that the thickness of each adhesive tape 1 is halved be able to. Therefore, the number of windings of the adhesive tape 1 per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape 1 is reduced, and the production efficiency of electronic devices is increased.
  • the adhesive 11 mixed with the resin and conductive particles 13 is applied to the base material (separation material) unwound from the unwinding machine 25 by the co-existing one 27 as shown in the following. It is applied to a half thickness, dried in a drying oven 29, and then wound up by a winder 31.
  • the raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core 5, and then the side plates 7, 7 are wound on the winding core 5 from both sides. Attached, packaged with dehumidifying material, and shipped at a controlled low temperature (15 ° C to 110 ° C).
  • the adhesive tape 1 may include a bonding agent described later in the adhesive 11.
  • Both adhesive tapes 1b containing no hardener were manufactured, and adhesive tape 1a containing a hardener and other adhesive tapes 1b were stacked as shown in Fig. 69A.
  • they may be integrated, and the stacked products may be pressure-bonded to the circuit board 21.
  • the adhesive 11a of one adhesive tape 1a contains a curing agent
  • the adhesive 11b of the other adhesive tape 1b does not require a curing agent. Therefore, the adhesive tape 1b of the adhesive 11b containing no stiffener does not require low-temperature management. Therefore, the number of the adhesive tapes 1a that need to be controlled at a low temperature can be reduced, and the transport and storage of the adhesive tape can be efficiently controlled.
  • the adhesive is an epoxy resin
  • imidazole, amide imide, hondium salt, polyamines, polymercapone, and the like can be given as examples of epoxy resin stiffeners.
  • the adhesive 11a of one adhesive tape la containing a curing agent contains conductive particles 13 and has a two-layer structure. Since the conductive particles are not contained on the side to be crimped, the conductive particles do not flow out from between the circuits facing each other with the flow of the resin, and the conductive particles 13 and the electrode 21 a are heated and pressurized. It can be reliably held between the electrode 23a.
  • the adhesive 11 includes the conductive particles 13; however, the adhesive 11 may not include the conductive particles 13.
  • These inventions include, for example, liquid crystal panels, PDP panels, EL panels, An anisotropic conductive material tape for bonding and fixing electronic components such as pair chip mounting to a circuit board and circuit boards, and for supplying an anisotropic conductive material for electrically connecting both electrodes. It relates to the winding form of the material.
  • an anisotropic conductive material which is a film adhesive
  • the connection between electronic components and circuit boards and between circuit boards is performed by applying heat and pressure.
  • the film-like adhesive is mixed with conductive particles for obtaining conduction between the electrodes.
  • the resin a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin, A photocurable resin is used (for example, refer to Japanese Patent Application Laid-Open No. 55-14007).
  • Typical resins include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, silicone resin, and acrylic resin as thermosetting resin.
  • thermoplastic resins include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, silicone resin, and acrylic resin as thermosetting resin.
  • Heating and pressurizing is required to connect both thermoplastic resin type and thermosetting resin type. This is because in the case of a thermoplastic resin system, the resin is allowed to flow to obtain an adhesion to an adherend, and in the case of a thermosetting resin system, the resin is further subjected to a hard reaction.
  • a mixed system of a thermoplastic resin and a thermosetting resin and a thermosetting resin system have become mainstream. Also, photocurable resin systems that can be connected at low temperatures have begun to be used industrially.
  • the anisotropic conductive material has been supplied in the form of a reel in which a film-shaped adhesive is wound on a core material having a circular cross section, and the time required to replace the reel has hindered an improvement in productivity.
  • the width of the anisotropic conductive material has been narrowing along with the narrowing of the frame of the liquid crystal panel, and in the conventional reel shape wound in the same circular core, the winding collapse has occurred.
  • the yield in the process was deteriorating.
  • An object of the present invention is to provide an anisotropic conductive material tape that contributes to an improvement in productivity by eliminating a decrease in productivity.
  • FIG. 70 is a schematic view showing a first embodiment of the invention described in claims 67 to 72.
  • the anisotropic conductive material tape of the present embodiment has two layers of a film-like adhesive 11 and a base film (base material) 9 having both surfaces peeled off. It is formed by winding and laminating an anisotropic conductive material having a structure in a number of turns in the longitudinal direction of the core material 5, and FIG. 70 shows a supply form of the anisotropic conductive material.
  • side plates 7 are provided at both ends of the core material 5.
  • the anisotropic conductive material tape is composed of a base film 9 and a film-like adhesive 11 which is an anisotropic conductive material applied on the base film 9, and in the anisotropic conductive material tape, It is used to connect high-definition electronic components, and prevents inorganic and organic foreign substances and contamination. 9 is outside the adhesive.
  • anisotropic conductive material For connection using an anisotropic conductive material, improvement in tact time is required, and rapid transferability of the anisotropic conductive material is required.
  • the anisotropic conductive material is wound many times in the longitudinal direction of the core material (winding core) 5 with the side plate 7 and laminated and wound into a thread-like shape, so that it does not collapse. It is possible to supply an anisotropic conductive material having a length. For this reason, the time interval for replacing the anisotropic conductive material tape can be lengthened, and productivity can be improved.
  • the tensile strength of the substrate film 9, and 1 2 kg / mm 2 or more, elongation at break of the substrate film 9 to 6 0-2 0 0% Is preferred.
  • the film adhesive 11 constituting the anisotropic conductive material is not transferred to the connection member such as a circuit board in the process of transferring the film adhesive. It is possible to prevent stretch, thinness, and narrow width of 1 1.
  • the thickness of the base film 9 is desirably 100 zm or less from the viewpoint of handling and environment. If the thickness of the base film 9 is thin, the above-described effects are inferior. Therefore, the thickness of the base film 9 is preferably 0.5 ⁇ or more.
  • the base film 9 used for the anisotropic conductive material tape silicon and fluorine were peeled from the surface of the strength and the releasability of the adhesive constituting the anisotropic conductive material.
  • ⁇ polypropylene
  • ⁇ ⁇ ⁇ stretched polypropylene
  • ⁇ ⁇ ⁇ polyethylene terephthalate
  • the peeling treatment of the base film 9 can be easily performed by performing a silicon or fluorine treatment. If the peeling treatment is performed only on one side of the base film 9, the peeling treatment is performed on both sides of the film 9.
  • the film-shaped adhesive 11 is made of epoxy resin, which is a highly reliable thermosetting resin, and is designed to reduce the stress of the adhesive and to improve the compatibility of the adhesive.
  • a certain silicone resin type a radical type that can be connected at a lower temperature and in a shorter time than these, is used, but the film-like adhesive 11 is not limited to these.
  • the radical adhesive 11 an acrylic adhesive is mainly used.
  • FIG. 71 is a schematic diagram illustrating a second embodiment of the invention described in claims 67 to 72.
  • the same components as those in FIG. 70 are denoted by the same reference numerals, and detailed description will be omitted.
  • the anisotropic conductive material tape of the present embodiment has two types of base films and is configured to sandwich an adhesive therebetween. Except for using the material, it has the same configuration as the anisotropic conductor tape of the first embodiment. That is, as shown in FIG. 71, the anisotropic conductive material in the present embodiment is composed of a film-like adhesive 11 and two kinds of base materials 9 a and 9 b obtained by peeling off the surface of the adhesive 11. It has a layer structure. [0861] When the adhesive constituting the anisotropic conductive material is soft, deformation of the adhesive by the next base film on the winding core side can be prevented.
  • the tensile strength of the substrate film 9 a, 9 b is a physical property value of the substrate film 9 a, 9 b and 1 2 k gZmm 2 or more, the substrate film of 9 a, 9 b It is the same as in the first embodiment that the breaking elongation is preferably set to 60 to 200%. Thereby, physical strength is obtained in the base films 9a and 9b, and it is possible to prevent the base film 9a and 9b from becoming thinner and becoming thinner in the width direction due to the elongation of the film-like adhesive. Further, the thickness of the base materials 9a and 9b is preferably set to 100 zm or less, so that handling and environmental measures can be taken.
  • a solution of 30% by weight of ethyl acetate was prepared, and 5% by volume of Ni powder having an average particle size of 2.5 ⁇ m was added thereto. Then, 50 g of a phenoxy resin (high-molecular-weight epoxy resin), 20 g of an epoxy resin and 5 g of imidazole were added as a film-forming material to the above-mentioned ethyl acetate solution to obtain a solution for forming an adhesive.
  • a base film was prepared on both sides of a transparent polyethylene terephthalate film (break strength: 25 kg / mm 2 , elongation at break: 130%) with a transparent blue color and a thickness of 5 ⁇ . Then, the above solution was applied to one surface of the base film using a roll coater and dried at 110 ° C. for 5 minutes to obtain a roll of an anisotropic conductive material film having a thickness of 5 ⁇ .
  • the anisotropic conductive material wound in a thread form that is, the anisotropic conductive material tape is attached to an automatic anisotropic conductive material tape crimping machine, and when the anisotropic conductive material is supplied, the anisotropic conductive material is removed. Good results were obtained in the transferability and elongation tests. Moreover, the number of reel installations was reduced, and the time required for installation, transferability, and repetition of the sticking work due to adhesive elongation were eliminated. Improved.
  • Example 2 In the same manner as in Example 1, a roll of anisotropic conductive material tape was produced. And The laminate of the substrate film and the adhesive, yet the other one of thickness 2 5 ⁇ M Poryechi Renterefu evening rate base film (breaking strength 2 5 kg Roh mm 2, elongation at break 1 3 0%), and two Lamination was carried out so as to sandwich the adhesive between the base films to obtain a roll of anisotropic conductive material film having a three-layer structure. In the same manner as in Example 1, the roll of this film is slit to a width of 1.5 mm, and is wound on a core material (winding core) having a side plate with a diameter of 48 mm and a width of 100 mm. By winding in a square shape, an anisotropic conductive material tape having a length of 300 m was obtained.
  • a core material winding core
  • Example 3 As in Example 1, good productivity was obtained. (Example 3)
  • Example 2 Same as Example 1, except that a polytetrafluoroethylene film (rupture strength: 4.6 kg / mm elongation at break: 350%) with a thickness of 5 ⁇ was used as the base film
  • a roll of an anisotropic conductive material film was obtained, and further, as in Example 1, the roll of this film was slit to a width of 1.5 mm, and a diameter of 48 mm with a side plate was attached.
  • An anisotropic conductive material tape having a length of 300 m was obtained by winding the core material (winding core) having a diameter of 100 mm in a thread form. In this case as well, it could be wound around 3 O O m in length.
  • a roll of an anisotropic conductive material film was obtained in the same manner as in Example 1, and the roll of this film was slit into a width of 1.5 mm as in Example 1 to obtain a conventional film.
  • An anisotropic conductive material tape having a length of 10 Om was wound on the reel in the same circular core shape.
  • the contact T / JP2003 / 009694 The end of the unwound adhesive tape (one adhesive tape) and the newly installed adhesive tape (the other adhesive tape) using the adhesive of the adhesive tape Since the adhesive reel is replaced after bonding to the start end, it is easy to mount a new adhesive tape on the bonding machine.
  • One adhesive tape and the other adhesive tape have high adhesive strength because the adhesive surfaces are overlapped and adhered.
  • the end of the unwound adhesive tape and the start of the newly attached adhesive tape are fixed with the locking pins. Connection is easy.
  • every time a new adhesive reel is replaced there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, and set guide bins or the like on a predetermined path. The replacement time for new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
  • one claw portion of the locking member is locked to the end of one adhesive tape, and then the other of the locking member is locked. Since the claws are locked to the start end of the other adhesive tape and the two are connected to each other, the connection is easy.
  • connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other, and the necessary minimum position Can be connected, so that the adhesive tape can be prevented from being wasted.
  • connection can be made only by sandwiching the overlapped portion of the end of one adhesive tape and the start of the other adhesive tape with a clip. Therefore, connection work is easy.
  • the adhesive reel is replaced by bonding the parts, and a new adhesive Easy mounting of reels.
  • the time required to replace a new adhesive reel is reduced. , Increases production efficiency.
  • connection area can be increased by forming the concave and convex portions in the connection portion, and the adhesive material tape pulling direction (longitudinal direction) in the connection portion can be obtained.
  • adhesive material tape pulling direction longitudinal direction
  • connection can be achieved.
  • the adhesive exudes to the inner periphery of the through hole, and the bonding area of the adhesive increases, so that the connection strength can be further increased.
  • the completed adhesive tape (one adhesive tape) and a new adhesive tape (the other adhesive tape) are used. Since it is only necessary to connect and change reels, it is easy to mount a new adhesive reel on the bonding machine. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, to attach the start end of the new adhesive tape to the take-up reel, or to attach the adhesive tape to the guide 3i. Reel replacement time is reduced and the production efficiency of electronic equipment is increased. 2003/009694
  • the processing agent used for the base material of the adhesive tape is a silicone resin, and by using a silicone adhesive for the adhesive tape, the difference in surface tension between the two is reduced to increase the adhesion. Because of this, it is possible to realize the bonding between the two, which was difficult in the past.
  • the same effects as those of the invention set forth in claim 14 can be obtained, and the surface of the adhesive surface of the silicone adhesive tape can be obtained.
  • the difference between the tension and the surface tension of the silicone-treated substrate in the adhesive tape to 10 mN / mdOdyne / cm) or less, a strong adhesion can be obtained, and the two can be securely bonded.
  • the same effects as those of the invention described in claim 15 can be obtained, and the adhesive strength can be further reduced to 100 g / 2.
  • the thickness By setting the thickness to 5 mm or more, it is possible to more firmly bond one and the other adhesive tapes to both adhesive surfaces.
  • the same effect as that of the invention described in claim 16 can be obtained, and one and the other adhesive tapes can be used. Since the connection is made on both sides, a stronger connection can be obtained.
  • the double-sided silicone adhesive tape of the double-sided adhesive is used, the double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape.
  • the two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
  • the end of the adhesive tape that has been unwound and the start of the adhesive tape to be newly attached are pasted. Connection is easy because it is fixed with resin adhesive. In addition, there is no need to replace the take-up tape, attach the starting end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path each time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased. [0899] According to the invention set forth in claim 20, the same operation and effect as those of the invention set forth in claim 19 are exhibited, and the thermosetting resin is used as the resin adhesive. In addition, a resin adhesive suitable for connecting the adhesive tapes can be selected from the group of the photocurable resin and the hot melt adhesive, and the connection strength between the adhesive tapes can be increased.
  • the resin adhesive according to claim 19 or claim 20 is supplied into the bonding apparatus. Since a filling machine is provided, there is no need to prepare a separate filling machine, and wasteful connection work can be prevented.
  • the same effect as that of the invention described in claim 22 can be obtained, and the other end of the adhesive tape and the other end can be provided. Since the start end of one adhesive tape is connected with the connecting tape, after the unwinding of the adhesive tape of one adhesive tape reel is completed, the adhesive tape of the other winding part is wound. Eliminating the work of attaching to take-up reels makes the production efficiency of electronic equipment even higher.
  • the connecting tape is automatically wound on the take-up reel. Then, the adhesive tape can be sequentially fed from the next winding portion.
  • the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound on the take-up reel until the connecting tape passes through the crimping portion. Can be.
  • the connecting portion between the terminal end of one adhesive tape and the start end of the other adhesive tape is formed by connecting the stopper with an adhesive. Since the tape is covered with the tape, the appearance is good, and it is possible to prevent the fastener at the connection portion from contacting the adhesive tape and damaging the adhesive tape or the adhesive device.
  • connection portion detecting means detects the connection portion
  • one of the adhesive tapes is wound until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Further, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
  • connection portion can be detected with a simple configuration.
  • the detection accuracy can be improved by using these means.
  • a plurality of adhesives can be used one by one in sequence, so that it can be used on one reel without increasing the number of tape windings.
  • the amount of adhesive required can be more than doubled.
  • the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the adhesive tape as set forth in claim 30 can be easily manufactured.
  • two adhesive tapes can be manufactured at the same time, so that the manufacturing efficiency is excellent.
  • the adhesive is heated. Since the adhesive tape is applied to the entire surface of one side of the base material, adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be crimped to the circuit board can be arbitrarily set by changing the heating area, and the degree of freedom of the width of the adhesive to be crimped is high.
  • the number of windings of the tape can be increased.
  • the amount of adhesive that can be used on one reel can be more than doubled.
  • the width of the adhesive tape is equal to or greater than the length of one side of the circuit board. The number of wound adhesive tapes can be reduced.
  • [0 9 2 1] Increase the amount of adhesive used without increasing the number of turns of adhesive tape. 3 009694 Since the width can be increased, it is possible to prevent buckling and prevent blocking, damage and cutting of the base material. Also, in electronic component manufacturing plants, the number of times that new adhesive tape needs to be changed is reduced, thereby increasing manufacturing efficiency.
  • the amount of adhesive per reel can be increased, so that the amount of use of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the same effect as the invention described in claim 35 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
  • two adhesive tapes according to claim 36 can be simultaneously manufactured using existing equipment. Excellent rate.
  • the effects described in claims 35 to 37 can be obtained, and the circuit board can be rotated. In other words, it can be moved to the position of one adhesive tape and the other adhesive tape, and the adhesive can be easily pressed on the four circumferences of the circuit board, resulting in good work efficiency.
  • the adhesive tape when the adhesive is pressure-bonded to the periphery of the circuit board, the adhesive tape is strip-shaped along the width direction. By applying heat and pressure, pressure bonding of the adhesive to the circuit board can be facilitated, and work efficiency is good. [0992] Also, since the adhesive may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be press-bonded to the circuit board can be arbitrarily set by changing the heating / pressing region, and the degree of freedom of the pressure-sensitive adhesive width is high.
  • the amount of the adhesive can be increased without increasing the number of windings, so that it is possible to prevent the collapse of the winding and to reduce the amount of the adhesive. Effects such as prevention of blocking due to oozing and prevention of adverse effects due to elongation of the base material can be obtained.
  • the adhesive sheet is formed by arranging at least two adhesives in the width direction and using one adhesive at a time.
  • One reel can be used for at least two reels, and the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of wound adhesive tapes.
  • the same effect as that of the invention described in claim 42 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
  • the same effect as that of claim 42 can be obtained, and the adhesive tape is formed by applying an adhesive to the entire surface of one side of It is easy to manufacture because only the slit is formed.
  • the adhesive tape has a base. Adhesive can be applied to the entire surface of the material, and adhesive tape can be manufactured using existing equipment as it is.
  • the width of the adhesive to be bonded to the circuit board can be set arbitrarily by changing the heating and pressing area, and the degree of freedom of the width of the bonded adhesive is high.
  • the same effect as that of claim 45 can be obtained, and further, the same effect as the invention described in claim 1 can be obtained.
  • the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding, to prevent the blocking due to the exudation of the adhesive, and to prevent the adverse effect due to the elongation of the base material. be able to.
  • the cassette is only turned upside down when the use of one reel is completed, so the next installation is easy. Since it is a cassette, it is easy to handle and has good workability for installation and replacement.
  • the end of the unwound adhesive tape is newly mounted by using the adhesive tape base material. Since the adhesive reel is replaced by bonding the adhesive tape to the start end, it is easy to mount a new adhesive reel on the bonding machine. In addition, there is no need to replace the take-up reel and attach the start end of the new adhesive reel to the take-up reel every time a new adhesive reel is replaced. Production efficiency is increased.
  • the portion of the base material which has been subjected to the surface treatment with the release agent is removed, and the base material is wound using the adhesive of the adhesive tape.
  • Adhesive tape is replaced by bonding the end of the adhesive tape that has been dispensed to the start of the adhesive tape to be newly installed, so that a new adhesive reel is mounted on the bonding machine. Can be easily done.
  • the same effects as those of the invention set forth in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, and laser irradiation can be performed. Since the release agent is removed using any one of the methods, the release agent can be removed accurately and in a short time.
  • the adhesive tape reel has a plurality of winding portions (winding portions) of the adhesive tape obtained by winding the adhesive tape around the reel. The installation of the adhesive tape was completed for one of the winding sections.
  • the side plate of the reel is provided with a storage portion for drying agent. It has the same function and effect as the invention, and reliably removes moisture inside the adhesive tape reel from the inside.
  • the cover member that covers the periphery of the adhesive tape wound on the reel is detachably provided on the reel, the adhesive material is provided.
  • the tape is not directly exposed to the outside air, and the adhesive tape prevents dust and the adverse effects of the humidity of the outside air. Therefore, even when a plurality of winding portions are provided, deterioration of the quality of the adhesive tape can be prevented by providing a cover member on an unused winding portion.
  • the cover member is detachably provided, the adhesive tape can be easily pulled out from the adhesive tape reel by removing the cover member.
  • the adhesive tape can be fed directly from the adhesive tape reel without removing the cover member of the adhesive tape reel.
  • the invention set forth in any one of claims 52 to 56 is defined by the invention set forth in claim 52 or claim 58.
  • the same effect is achieved, especially when the adhesive tape is an adhesive tape in which the adhesive for electrode connection that connects the opposing electrodes is applied to five substrates, or the adhesive tape is used to fix the lead frame.
  • Support substrate or semiconductor device mounting support substrate or lead frame It is particularly useful for an adhesive tape for connecting a die to a semiconductor element.
  • the case is gripped with one hand, the opening where the adhesive tape is exposed is pressed against the circuit board, and the heating member is pressed from the base material side. Since the adhesive is heat-pressed to press the adhesive on the circuit board, it is compact and operable with one hand, and can easily press the adhesive when pressing the adhesive on a part of the substrate.
  • the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. be able to. Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
  • the claim 60 JP2003 / 009694 and the invention according to any one of claims 63 to 63 have the same effect, and by setting the surface roughness R max of the base material to 0.5 ⁇ or less, the base material The surface becomes smooth, and the adhesive is easily separated from the base material when the adhesive is pressed against the circuit board.
  • the adhesive of one adhesive tape and the adhesive of the other are used in the step immediately before forming the adhesive on the adherend.
  • An adhesive is formed on the adherend after the desired adhesive thickness is formed by superposing the adhesive on the tape, so that the thickness of each adhesive tape can be reduced. Although the number of windings of the tape is increased, the winding diameter of the adhesive tape per reel can be reduced.
  • any one of claims 67 to 72 it has good transferability (sticking property) to a member to be connected, It has good connection reliability, thereby increasing the yield in the process and improving workability. It is possible to supply a longer anisotropic conductive material tape than before, and productivity and workability are improved. Is improved.

Abstract

A method of connecting adhesive material tapes, used for connecting one adhesive material tape wound on one reel and the other tape wound on the other reel, an adhesive agent being applied on base materials of the tapes. The end portion of the one adhesive material tape is turned over, and an adhesive agent face of the one adhesive material tape and an adhesive agent layer of the other adhesive material tape are laid over each other. Then, the laid over portion is heated and pressed so as to connect them. To exchange the adhesive material reels, the end portion of an adhesive material tape having been paid out and the start potion of an adhesive material tape to be newly installed are adhered to each other using the adhesive agents of the adhesive material tapes. Therefore, work including exchange of take-up tapes at every replacement of a new adhesive material tape and installation of the start portion of a new adhesive material tape to a take-up reel is not required. The replacement to a new adhesive material tape requires less time, and then productivity of electronic equipment is increased.

Description

明糸田書  Akitoda
接着材テープ、 その接続方法、 製造方法、 圧着方法、 接着材テープリール、 接着 装置、 接着剤テープカセット、 これを用いた接着剤の圧着方法並びに異方導電材 テープ Adhesive tape, connection method, manufacturing method, crimping method, adhesive tape reel, bonding device, adhesive tape cassette, adhesive bonding method using the same, and anisotropic conductive material tape
技術分野 Technical field
【0 0 0 1】 本発明は、 電子部品と回路基板、 又は回路基板同士を接着固定す ると共に、 両者の電極同士を電気的に接続する接着材テープ、 その接続方法、 製 造方法、 圧着方法、 接着材テープリール、 接着装置、 接着剤テープカセット及び これを用いた接着剤の圧着方法に関し、 特にリール状に卷かれた接着材テープ、 その接続方法、 製造方法、 圧着方法、 接着材テープリール、 接着装置、 接着剤テ The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, a connection method thereof, a manufacturing method, and a crimping method. TECHNICAL FIELD The present invention relates to a method, an adhesive tape reel, an adhesive device, an adhesive tape cassette and an adhesive pressure bonding method using the same, and particularly to an adhesive tape wound in a reel shape, a connection method thereof, a manufacturing method, a pressure bonding method, and an adhesive tape. Reel, bonding equipment, adhesive tape
—プカセヅト、 これを用いた接着剤の圧着方法及び異方導電材テープに関する。 背景技術 The present invention relates to pukaset, an adhesive bonding method using the same, and an anisotropic conductive material tape. Background art
【0 0 0 2】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ベアチヅプ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する手段として、 接着 材テープが用いられている。  Generally, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare-chip mounting, and a circuit board and a circuit board are adhered and fixed to each other, and both electrodes are electrically connected. Adhesive tape is used as a means for making the connection.
【0 0 0 3】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。  [0002] Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. I have.
【0 0 0 4】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度である。  A conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
【0 0 0 5】 接着材テープを接着装置に装着する場合、 接着材テープのリール (以下、 単に「接着材リールという」） を接着装置に取り付け、 接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから巻き 出された接着材テ一プの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに巻き取っている。 ' When the adhesive tape is mounted on the adhesive device, a reel of the adhesive tape (hereinafter, simply referred to as “adhesive reel”) is attached to the adhesive device, and the starting end of the adhesive tape is pulled out. Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. . '
【0 0 0 6】 そして、 接着材リールの接着材テープが終了すると、 終了したリ —ルと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付け ている。 [0 0 0 6] When the adhesive tape on the adhesive reel ends, the completed The reel and the take-up reel that has taken up the base material are removed, a new take-up reel and a new adhesive reel are mounted on the bonding device, and the starting end of the adhesive tape is attached to the take-up reel.
発明の開示 Disclosure of the invention
【0 0 0 7】 近年の P D P等におけるパネル画面の大型化にともない回路基板 の接着面積 （又は周囲一辺の寸法） が増大し、 一度に使用する接着剤の使用量が 増加してきた。 また、 接着剤の用途も拡大したため、 接着剤の使用量が増加して きた。このため、電子機器の製造工場では、接着材リールの交換頻度が多くなり、 接着材リールの交換に手間がかかるため電子機器の生産効率の向上が図れないと いう問題がある。  [0107] With the recent increase in the size of panel screens in PDPs and the like, the bonding area of the circuit board (or the dimension of one side of the periphery) has increased, and the amount of adhesive used at one time has increased. In addition, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, there is a problem that in an electronic device manufacturing plant, the frequency of replacement of the adhesive reel increases, and it takes time to replace the adhesive reel, so that it is not possible to improve the production efficiency of the electronic device.
【0 0 0 8】 かかる問題に対して、 リールに巻き取る接着材テープの巻き数を 多くすることで、 1リ一ル当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 巻き 数を多くすると巻き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に卷いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロヅキングの原因になるおそれがある。  [0108] In response to such a problem, it is possible to increase the amount of adhesive tape per reel and to reduce the frequency of reel replacement by increasing the number of windings of the adhesive tape wound on the reel. Although it is conceivable, the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 0 0 9】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0109] Furthermore, when the number of windings of the adhesive tape is increased, the diameter of the reel is also increased, which makes it difficult to mount the tape on an existing bonding apparatus, and may render the existing bonding apparatus unusable.
【0 0 1 0】 そこで、 本発明は、 接着材リールの交換が簡単にでき、 電子機器 の生産効率の向上を図ることができる接着材テープの接続方法、 並びに接着材テ ープ、 その製造方法、 圧着方法、 接着材テ一プリ一ル、 接着装置、 接着剤テープ カセット、 これを用いた接着剤の圧着方法及び異方導電材テープの提供を目的と する。  [0100] Therefore, the present invention provides a method of connecting an adhesive tape, which enables easy replacement of an adhesive reel and can improve the production efficiency of an electronic device, an adhesive tape, and its production. It is an object of the present invention to provide a method, a crimping method, an adhesive tape, a bonding device, an adhesive tape cassette, a method for crimping an adhesive using the cassette, and an anisotropic conductive material tape.
【0 0 1 1】 請求の範囲第 1項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに卷いた一方の接着材テープと他方のリールに卷 いた他方の接着材テープとを接続する接着材テープの接続方法であって、 —方の 接着材テープの終端部を裏返して、 一方の接着材テープの接着剤面と他方の接着 材テープの接着剤面とを重ね合わせ、 両者の重ね合わせ部分を加熱圧着して接続 することを特徴とする。 [0111] The invention described in claim 1 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel. A method of connecting an adhesive tape to connect the other adhesive tape to the adhesive tape, wherein the end of the adhesive tape is turned over, and the adhesive surface of one adhesive tape is bonded to the other adhesive tape. It is characterized in that the surfaces are superimposed on each other, and the superposed parts are connected by heating and pressing.
【0 0 1 2】 この請求の範囲第 1項に記載の発明では、 接着材テープの接着剤 を利用して巻き出しの終了した接着材テープの終端部と、 新たに装着する接着材 テープの始端部とを接着して接着材リールの交換を行うので、 接着装置への新た な接着材テープの装着が簡単にできる。 また、 新たな接着材テープの交換毎に卷 取りテープの交換や新規接着材テープの始端を卷取りリールに取り付ける作業、 所定の経路にガイドビン等を設定する作業が必要ないので、 新しい接着材リール の交換時間が少なくて済み、 電子機器の生産効率が高まる。  In the invention described in claim 1, the end of the unwound adhesive tape using the adhesive of the adhesive tape and the end of the newly mounted adhesive tape Since the adhesive reel is replaced by bonding to the start end, it is easy to attach a new adhesive tape to the bonding device. In addition, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on the predetermined path each time a new adhesive tape is replaced. Reel replacement time is reduced, and the production efficiency of electronic equipment is increased.
【0 0 1 3】 巻き出しの終了した接着材テープの終端部を裏返し、 接着材テ一 プの接着剤面と新たに装着する接着材テープの接着剤面同士を重ね合わせて接着 するので、 接続強度が高い。  [0 0 13] The end of the adhesive tape that has been unwound is turned over, and the adhesive surface of the adhesive tape and the adhesive surface of the adhesive tape to be newly attached are overlapped and adhered. High connection strength.
【0 0 1 4】 接続部分の加熱圧着は、 接着材リ一ルを装着する接着装置の加熱 加圧へッドを用いれば、 接着装置を合理的に利用することができる。  [0104] The heating and pressurization of the connection portion can be rationally used by using the heating and pressurizing head of the bonding device for mounting the adhesive reel.
【0 0 1 5】 請求の範囲第 2項に記載された発明は、 請求の範囲第 1項に記載 の発明において、 一方の接着材テープの終端部にはェンドマークが付されている ことを特徴とする。  The invention described in claim 2 is characterized in that, in the invention described in claim 1, the end mark of one of the adhesive tapes is provided with an end mark. And
【0 0 1 6】 この請求の範囲第 2項に記載の発明によれば、 請求の範囲第 1項 に記載の発明と同様な作用効果を奏するとともに、 巻き出しの終了した接着材テ ープの切断はェンドマ一クが露出したときに行うことができるので、 切断及び接 続作業をする部分が解りやすく且つ必要最小限の位置で接続できるので接着材テ ープの無！:を防止できる。  According to the second aspect of the present invention, the adhesive tape having the same effects as the first aspect of the present invention and the unwinding is completed. Can be cut when the endmark is exposed, so the cutting and connecting parts are easy to understand and can be connected at the minimum necessary position, so there is no adhesive tape! : Can be prevented.
【0 0 1 7】 請求の範囲第 3項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリ一ルに卷いた一方の接着材テープと他方のリールに卷 いた他方の接着材テープとを接続する接着材テープの接続方法であって、 他方の 接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テ一 プの基材面に貼り付けて止めており、一方の接着材テープの終端部を裏返した後、 リ一ドテープの接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、 重ね合わせ部分を加熱圧着することを特徴とする。 The invention described in claim 3 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other reel. Roll A method of connecting an adhesive tape to the other adhesive tape, wherein a starting end of the other adhesive tape is attached to a base material surface of an adhesive tape wound around a reel with a lead tape. After turning over the end of one adhesive tape, the adhesive surface of the lead tape is overlapped with the adhesive surface of the end of one adhesive tape, and the overlapped portion is heated and pressed. Features.
【0 0 1 8】 この請求の範囲第 3項に記載の発明によれば、 請求の範囲第 1項 記載の発明と同様に接着装置への新たな接着材テープの装着が簡単にでき、 また 新しい接着材リ一ルの交換時間が少なくて済み、 電子機器の生産効率が高まる。 According to the third aspect of the present invention, it is possible to easily attach a new adhesive tape to the bonding apparatus, similarly to the first aspect of the present invention. The time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
【0 0 1 9】 更に、 接着材テープのリードテープを利用して卷き出しの終了し た接着材テープの終端部と新たに装着する接着材テープの始端部と接着するので、 接着材テープ同士の接着が簡単にできる。 [0 0 19] Further, since the end of the unwound adhesive tape and the start of the newly attached adhesive tape are bonded using the adhesive tape lead tape, the adhesive tape is used. Adhesion between them can be made easily.
【0 0 2 0】 請求の範囲第 4項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに卷いた一方の接着材テープと他方のリールに卷 いた他方の接着材テープとを接続する接着材テープの接続方法であって、 他方の 接着材テープの始端部はリードテープによりリールに巻き付けてある接着材テ一 プの基材面に貼り付けて止めており、 リードテープの接着剤面を一方の接着材テ —プの終端部の接着剤面に重ね合わせ、 重ね合わせ部分を加熱圧着することを特 とする。  [0200] The invention described in claim 4 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel. A method of connecting an adhesive tape to the other adhesive tape, wherein a starting end of the other adhesive tape is attached to a base material surface of an adhesive tape wound around a reel with a lead tape. It is characterized in that the adhesive surface of the lead tape is overlapped with the adhesive surface at the end of one adhesive tape, and the overlapped portion is heated and pressed.
【0 0 2 1】 この請求の範囲第 4項に記載の発明によれば、 請求の範囲第 1項 記載の発明と同様に接着装置への新たな接着材テープの装着が簡単にでき、 また 新しい接着材リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。 According to the invention set forth in claim 4, it is possible to easily attach a new adhesive tape to the bonding device, similarly to the invention set forth in claim 1. The time required to replace new adhesive reels is reduced, increasing the production efficiency of electronic equipment.
【0 0 2 2】 更に、卷き出しの終了した接着材テープを裏返す必要がないので、 卷取りリールに接着材テ一プを卷き取った際に巻き崩れが生じるおそれを防止で きる。 [0200] Furthermore, since it is not necessary to turn over the adhesive tape that has been unwound, it is possible to prevent the possibility that the adhesive tape may be broken when the adhesive tape is wound on the take-up reel.
【0 0 2 3】 請求の範囲第 5項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに卷いた一方の接着材テープと他方のリ一ルに卷 T/JP2003/009694 いた他方の接着材テープとを接続する接着材テープの接続方法であって、 一方の 接着材テープの終端部と、 他方の接着材テープの始端部とを重ね合わせ、 両者の 重ね合わせ部分に係止ピンを挿入して接続することを特徴とする。 The invention described in claim 5 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel. Roll T / JP2003 / 009694 This is a method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are overlapped with each other. It is characterized in that a locking pin is inserted into the overlapped portion for connection.
【0 0 2 4】 この請求の範囲第 5項に記載の発明では、 卷出しが終了した接着 材テープの終端部と、 新たに装着する接着材テープの始端部とを係止ピンで固定 するので、 接続が簡単である。 また、 新たな接着材リールの交換毎に卷取りテー プの交換や新規接着材テープの始端を卷取りリールに取り付ける作業、 所定の経 路にガイドビン等を設定する作業が必要ないので、 新しい接着材リールの交換時 間が少なくて済み、 電子機器の生産効率が高まる。  In the invention described in claim 5, the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are fixed with the locking pins. So the connection is easy. In addition, there is no need to replace the take-up tape, attach the starting end of the new adhesive tape to the take-up reel, and set guide bins or the like in a predetermined path every time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
【0 0 2 5】 請求の範囲第 6項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに卷いた一方の接着材テープと他方のリールに卷 いた他方の接着材テープとを接続する接着材テープを、 係止部材を用いて接続す る接着材テープの接続方法であって、 係止部材は一方及び他方の端部に設けた爪 部と爪部間に設けた弾性部材とを備えており、 一方の接着材テープの終端部と他 方の接着材テープの始端部とを突き合わせ、 係止部材の一端に設けた爪部を一方 の接着材テープの終端部に係止し、 他端に設けた爪部を他方の接着材テープの始 端部に係止して、 両方の爪部を弾性部材で引き寄せていることを特徴とする。 The invention described in claim 6 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel. A method of connecting an adhesive tape for connecting the other adhesive tape to the other adhesive tape using a locking member, wherein the locking member is provided with a claw provided at one and the other end. An elastic member is provided between the claws, and the end of one adhesive tape and the start of the other adhesive tape are abutted to each other. It is characterized in that it is locked to the end of the material tape, the claw provided at the other end is locked to the start of the other adhesive tape, and both claws are pulled by an elastic member.
【0 0 2 6】 この請求の範囲第 6項に記載の発明によれば、 一方の接着材テー プの終端部に係止部材の一方の爪部を係止し、 その後に係止部材の他方の爪部を 他方の接着材テープの始端部に係止して両者を互いに接続するので、 接続が容易 である。 また、 一方の爪部と他方の爪部との間に弾性部材を備えているので、 弾 性部材が伸びて係止部材の他方の爪部を他方の接着材テープの始端部の任意の位 置に係止することができるので、 接続の自由度が高い。 According to the invention as set forth in claim 6, one claw portion of the locking member is locked to the end portion of the one adhesive tape, and then the locking member is The other claw portion is locked to the starting end of the other adhesive tape and the two are connected to each other, so that the connection is easy. In addition, since the elastic member is provided between the one claw portion and the other claw portion, the elastic member is extended, and the other claw portion of the locking member is positioned at an arbitrary position of the starting end of the other adhesive tape. The connection can be locked, so the degree of freedom of connection is high.
【0 0 2 7】 また、 一方の接着材テープの終端部と他方の接着材テープの始端 部とを突き合わせた状態で接続するので、互いのテープを重ね合せる必要がなく、 必要最小限の位置で接続できるので接着材テープの無駄を防止できる。 【0 0 2 8】 請求の範囲第 7項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに巻いた一方の接着材テープと他方のリールに卷 いた他方の接着材テープとを接続する接着材テープの接続方法であって、 一方の 接着材テープの終端部と、 他方の接着材テープの始端部とを重ね合わせ、 両者の 重ね合わせ部分を横断面略コ字状の弾性変形可能なクリップで挟んで固定するこ とを特徴とする。 [0207] Also, since the connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other. Can be connected, so that the adhesive tape can be prevented from being wasted. The invention described in claim 7 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel. A method of connecting an adhesive tape that connects the other adhesive tape that has been used, in which the end of one adhesive tape and the start end of the other adhesive tape are overlapped and traverses the overlapped portion of the two. It is characterized in that it is sandwiched and fixed by a substantially U-shaped elastically deformable clip.
【0 0 2 9】 この請求の範囲第 7項に記載の発明によれば、 一方の接着材テ一 プの終端部と他方の接着材テープの始端部の重ね合わせ部分をクリップで挟むだ けで接続できるので、 接続作業が容易である。  [0209] According to the invention as set forth in claim 7, only the overlapping portion between the end of one adhesive tape and the start of the other adhesive tape is clipped. Connection work is easy.
【0 0 3 0】 請求の範囲第 8項に記載された発明は、 一方の接着材テープと他 方の接着材テープとの重ね合わせ部分を、 一方の接着材テープと他方の接着材テ ープとの重ね合わせ部分を横断面略断面コ字状の金属製の挟持片で挾み、 重ね合 わせ部分の両面側から挟持片を押しつぶして両者を接続することを特徴とする。 【0 0 3 1】 この請求の範囲第 8項に記載の発明によれば、 重ね合わせ部分の 両面から挟持片を押しつぶして両者を接続するので、 接着材テープの重ね合わせ 部分の接続強度を高めることができる。  [0300] According to the invention described in claim 8, the overlapping portion of one adhesive tape and the other adhesive tape is formed by combining one adhesive tape with the other adhesive tape. It is characterized in that a portion to be overlapped with the lip is sandwiched by metal holding pieces having a substantially U-shaped cross section, and the holding pieces are crushed from both sides of the overlapping portion to connect the two. According to the invention as set forth in claim 8, since the sandwiching pieces are crushed from both sides of the overlapping portion to connect them, the connection strength of the overlapping portion of the adhesive tape is increased. be able to.
【0 0 3 2】 請求の範囲第 9項に記載された発明は、 電極接続用の接着剤が基 材に塗布された、 一方のリールに巻いた一方の接着材テープと他方のリールに卷 V、た他方の接着材テープとを接続する接着剤テープの接続方法であって、 一方の 接着材テープの終端部と、 他方の接着材テープの始端部とを、 いずれか一方の基 材面に他方の接着剤面を重ね合わせ、 両者の重ね合わせ長さを接着剤テープの幅 の 2倍乃至 5 0倍の範囲として、両者を加熱圧着して接続することを特徴とする。 【0 0 3 3】 この請求の範囲第 9項に記載の発明では、 接着材テープの接着剤 を利用して終了した接着材テープの終端部と、 新たに装着する接着材テープの始 端部とを接着して、 接着材リールの交換を行うので、 接着装置への新たな接着材 リールの装着が簡単にできる。 また、 新たな接着材リールの交換毎に卷取りリ一 ルの交換や新規接着材の始端を卷取りリールに取り付ける作業が必要ないので、 新しい接着材リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。The invention described in claim 9 is characterized in that the adhesive for electrode connection is applied to the base material, and one adhesive tape wound on one reel and one wound on the other reel. V. A method of connecting an adhesive tape for connecting the other adhesive tape, wherein an end of one adhesive tape and a start end of the other adhesive tape are connected to one of the base surfaces. The other adhesive surface is overlapped, and the overlap length of the two is set in a range of 2 to 50 times the width of the adhesive tape, and the two are connected by heating and pressing. In the invention according to the ninth aspect of the present invention, the end of the adhesive tape completed by using the adhesive of the adhesive tape and the start of the adhesive tape to be newly mounted are provided. The adhesive reel is replaced by bonding the new adhesive reel to the new adhesive reel. Also, each time a new adhesive reel is replaced, Since there is no need to replace the tape or attach the beginning of the new adhesive to the take-up reel, the time required to replace the new adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
【0 0 3 4】 重ね合わせ部分の長さを接着材テープの幅の 2倍乃至 5 0倍とし ているのは、 2倍よりも少ないと充分な接続強度が得られず、 5 0倍よりも大き いと接続部分に使用する接着材が多くなりすぎて、 接着材が無駄になるからであ る。 [0334] The reason why the length of the overlapped portion is set to 2 to 50 times the width of the adhesive tape is that if it is less than 2 times, sufficient connection strength cannot be obtained, and 50 times or more. If it is too large, too much adhesive will be used for the connection, and the adhesive will be wasted.
【0 0 3 5】 接続部分の加熱圧着は、 接着材リ一ルを装着する接着装置の加熱 加圧へッドを用いれば、 接着装置を合理的に利用することができる。  [0355] The heating and pressurization of the connection portion can be rationally used by using a heating and pressurizing head of the bonding device for mounting the adhesive reel.
【0 0 3 6】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 剤であってもよいし、 絶縁性接着剤のみであってもよいし、 それらの接着剤中に 絶縁性のスぺ一サ粒子を分散したものであってもよい。  The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
【0 0 3 7】 請求の範囲第 1 0項に記載された発明は、 電極接続用の接着剤が 基材に塗布された、 一方のリールに卷いた一方の接着材テープと他方のリールに 巻いた他方の接着材テープとを接続する接着剤テープの接続方法であって、 一方 の接着材テープの終端部を接着剤が対面する方向に折り曲げ、 他方の接着材テ一 プの始端部を接着剤が対面する方向に折り曲げ、 両者の折り曲げ部分を互いに係 止して重ね合わせ且つ両者の接着材面を対面させて、 重ね合わせ部分を加熱圧着 することを特徴とする。  The invention described in claim 10 is characterized in that the adhesive for electrode connection is applied to the base material, and the one adhesive tape wound on one reel and the other reel are wound on one reel. This is a method of connecting an adhesive tape to connect the other adhesive tape wound, wherein the end of one adhesive tape is bent in a direction facing the adhesive, and the starting end of the other adhesive tape is bent. The method is characterized in that the adhesive is bent in a direction facing each other, the bent portions of the two are overlapped with each other, and the surfaces of the adhesives are opposed to each other, and the overlapped portion is heat-pressed.
【0 0 3 8】 この請求の範囲第 1 0項に記載の発明によれば、 請求の範囲第 1 項に記載の発明と同様な作用効果を奏するとともに、 一方の接着材テープの終端 部と他方の接着材テープの始端部とを互いに鉤状にして係止するとともに、 両者 は接着剤面を互いに接続するので、 接続強度が高い。  According to the tenth aspect of the present invention, the same operation and effect as those of the first aspect of the present invention can be obtained, and at the same time, the one end of the adhesive tape and The starting end of the other adhesive tape is hooked to each other and locked, and the two connect the adhesive surfaces to each other, so that the connection strength is high.
【0 0 3 9】 請求の範囲第 1 1項に記載された発明は、 請求の範囲第 9項又は 請求の範囲第 1 0項に記載された発明において、 一方の接着材テープの終端部に はェンドマークが付されていることを特徴とする。  The invention described in claim 11 is the invention according to claim 9 or claim 10, wherein one end of the adhesive tape is Is characterized by having an end mark.
【0 0 4 0】 この請求の範囲第 1 1項に記載の発明によれば、 請求の範囲第 9 項又は請求の範囲第 1 0項記載の発明と同様な作用効果を奏するとともに、 一方 の接着材テープの終端部はェンドマ一ク部分で行うことができるので、 接続作業 をする部分が解りやすく且つ必要最小限の位置で接続できるので接着材テ一プの 無駄を防止できる。 また、 エンドマーク部分を自動で検知でき、 その検知信号に より装置を制御したり、 警報を発するようにすると作業効率を高めることができ る。 [0400] According to the invention as set forth in claim 11, claim 9 In addition to providing the same function and effect as the invention described in claim 10 or claim 10, the end of one adhesive tape can be made at the end mark portion, so that the connecting portion is easy to understand and Since the connection can be made at the minimum necessary position, waste of the adhesive tape can be prevented. In addition, the end mark can be automatically detected, and the device can be controlled or an alarm can be issued based on the detection signal to improve work efficiency.
【0 0 4 1】 請求の範囲第 1 2項に記載された発明は、 請求の範囲第 9項〜 1 1のいずれか一項に記載の発明において、 一方の接着材テープと他方の接着材テ The invention described in claim 12 is the invention according to any one of claims 9 to 11, wherein one of the adhesive tape and the other is Te
—プとの重ね合わせ部分を、 凹凸を形成した一方の金型と、 これに嚙み合う他方 の金型とで挟んで加熱圧着することを特徴とする。 The method is characterized in that a portion to be overlapped with the mold is sandwiched between one mold having irregularities and the other mold that fits in the mold, and then heat-pressed.
【0 0 4 2】 この請求の範囲第 1 2項に記載の発明によれば、 請求の範囲第 9 項〜 1 1のいずれか一項に記載の発明と同様な作用効果を奏するとともに、 接続 部分に凹凸を形成することより、 接続面積を広くできるとともに、 凹凸部の係合 により接着材テープの引張り方向（長手方向）の接続強度を高めることができる。 According to the invention described in claim 12, the same operation and effect as those of the invention described in any one of claims 9 to 11 can be obtained, and By forming the concavo-convex portions, the connection area can be increased, and the connection strength in the tensile direction (longitudinal direction) of the adhesive tape can be increased by the engagement of the concavo-convex portions.
【0 0 4 3】 請求の範囲第 5項に記載された発明は、 請求の範囲第 1項〜 3の いずれか一項に記載の発明において、 一方の接着材テープと他方の接着材テープ との重ね合わせ部分に貫通穴を形成した後、 重ね合わせ部分を加熱圧着すること を特徴とする。 The invention described in claim 5 is the invention according to any one of claims 1 to 3, wherein one of the adhesive tapes and the other is After forming a through hole in the overlapped portion of the above, the overlapped portion is heat-pressed.
【0 0 4 4】 この請求の範囲第 1 3項に記載の発明によれば、 請求の範囲第 9 項〜 1 1のいずれか一項に記載の発明と同様な作用効果を奏するとともに、 接続 部分に貫通孔を形成することにより、 貫通孔の内周に接着剤が染み出して、 接着 剤による接着面積が増えるので、 更に接続強度を高めることができる。  According to the invention described in claim 13, the same operation and effect as the invention described in any one of claims 9 to 11 can be obtained, and By forming the through hole in the portion, the adhesive leaks out to the inner periphery of the through hole, and the bonding area by the adhesive increases, so that the connection strength can be further increased.
【0 0 4 5】 請求の範囲第 1 4項に記載された発明は、 電極接続用の接着剤が シリコーン処理基材に塗布された、 一方のリールに巻いた一方の接着材テープと 他方のリールに巻いた他方の接着材テープとを接続する接着材テープの接続方法 であって、 一方の接着材テープの終端部と他方の接着材テープの始端部を重ね合 わせ又は突き合せて、 両接着材テープのシリコーン処理基材の表面に跨る部分を シリコーン粘着テープで貼り付けて両接着材テープを接続することを特徴とする。The invention described in claim 14 is characterized in that an adhesive for electrode connection is applied to a silicone-treated substrate, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel. A method of connecting an adhesive tape that connects the other adhesive tape wound on a reel, wherein an end of one adhesive tape and a start end of the other adhesive tape are overlapped. The two adhesive tapes are connected to each other by affixing or joining the portions of the two adhesive tapes straddling the surface of the silicone-treated base material with a silicone adhesive tape.
【0 0 4 6】 この請求の範囲第 1 4項に記載の発明では、 一方の接着材テープ を卷いた接着材リ一ルと接着材テープの基材のみを卷き取る卷取りリ一ルが接着 装置に装着してあり、 接着材リールの接着材テープが終了したときに、 終了した 接着材テープ （一方の接着材テープ） の終端部と、 新たに装着する接着材リール の接着材テ一プ （他方の接着材テープ） の始端部とをシリコーン粘着テープで接 続して、 終了した接着材リールに換えて新たな接着材リ一ルを接着装置に装着す o According to the invention as set forth in claim 14, the reel for winding one of the adhesive tapes and the winding reel for winding only the base material of the adhesive tape are provided. When the adhesive tape on the adhesive reel is finished and the adhesive tape on the adhesive reel is finished, the end of the completed adhesive tape (one adhesive tape) and the adhesive tape on the newly installed adhesive reel Connect the start end of one tape (the other adhesive tape) with the silicone adhesive tape, and replace the finished adhesive reel with a new adhesive reel and attach it to the bonding machine o
【0 0 4 7】 本発明では、 終了した接着材テープと新たな接着材テープとを接 続してリ一ルの交換を行うだけなので、 接着装置への新たな接着材リ一ルの装着 が簡単にできる。 また、 新たな接着材リールの交換毎に卷取りリールの交換や、 新規接着材テープの始端を卷取りリールに取り付けたり、 接着材テープをガイド に掛ける作業が必要ないので、 新しい接着材リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。  In the present invention, since the completed adhesive tape and the new adhesive tape are simply connected to replace the reel, the new adhesive reel is mounted on the bonding apparatus. Can be easily done. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, attach the start end of the new adhesive tape to the take-up reel, or hang the adhesive tape on the guide. The replacement time is short, and the production efficiency of electronic equipment is increased.
【0 0 4 8】 接着材テープの基材はシリコーンで表面処理してあり、 用いる粘 着テープにもシリコーン粘着剤を用いることにより、 両者の表面張力の差を小さ くして密着力を高めているので、 従来困難であった両者の接着を実現できる。 [0408] The base material of the adhesive tape is surface-treated with silicone, and by using a silicone adhesive also for the adhesive tape to be used, the difference in surface tension between the two is reduced, and the adhesive force is increased. Therefore, the bonding between the two, which has been difficult in the past, can be realized.
【0 0 4 9】 接着材テープの接着剤は、 絶縁性接着剤中に導電粒子を分散した 異方導電性接着であってもよいし、 絶縁性接着剤のみであってもよいし、 これら の接着材中に絶縁性のスぺ一サ粒子を分散したものであってもよい。 The adhesive of the adhesive tape may be anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be only an insulating adhesive. Insulating spacer particles may be dispersed in the adhesive.
【0 0 5 0】 請求の範囲第 1 5項に記載された発明は、 請求の範囲第 1 4項に 記載のシリコーン粘着テープは、 その粘着剤面の表面張力と接着材テープのシリ コ一ン処理基材の表面張力との差を 1 O mNZm(10dyne/c m)以下とすること を特徴とする。  The invention described in claim 15 is a silicone adhesive tape according to claim 14, wherein the surface tension of the adhesive surface and the silicone tape of the adhesive tape are reduced. Characterized in that the difference from the surface tension of the coated substrate is 1 OmNZm (10 dyne / cm) or less.
【0 0 5 1】 この請求の範囲第 1 5項に記載の発明によれば、 請求の範囲第 1 4項に記載の発明と同様な作用効果を奏するとともに、 シリコ一ン粘着テープに おける粘着剤面の表面張力と接着材テープにおけるシリコ一ン処理基材の表面張 力との差を 1 O mN/m( 10dyne/ c m)以下とすることにより、 強い密着力を得 ることができ、 両者を確実に接着できる。 表面張力は、 濡れ試薬や接触角で測定 することができる。 According to the invention set forth in claim 15 of the present invention, claim 1 In addition to providing the same effect as the invention described in Item 4, the difference between the surface tension of the adhesive surface of the silicone adhesive tape and the surface tension of the silicone-treated substrate in the adhesive tape is 1 OmN. By setting it to / m (10 dyne / cm) or less, a strong adhesion can be obtained and both can be securely bonded. Surface tension can be measured by wetting reagent or contact angle.
【0 0 5 2】 接着材テープのシリコーン処理基材とシリコーン粘着テ一プの粘 着剤面との表面張力の差は、 好ましくは 0〜5 mNZm(5dyne/cm)である。 表面 張力の差は小さいほどよく、 1 O mN/m( 10dyne/cm)を超えて大きくすると充分 な密着強度が得られないおそれがあるからである。  The difference in surface tension between the silicone-treated base material of the adhesive tape and the adhesive surface of the silicone adhesive tape is preferably 0 to 5 mNZm (5 dyne / cm). The reason for this is that the smaller the difference in surface tension, the better. If the difference exceeds 1 OmN / m (10 dyne / cm), sufficient adhesion strength may not be obtained.
【0 0 5 3】 請求の範囲第 1 6項に記載された発明は、 請求の範囲第 2項に記 載された発明において、 シリコーン粘着テープは、 接着力が 1 0 0 gZ2 5 mm 以上であることを特徴とする。  [0530] The invention described in claim 16 is the invention described in claim 2, wherein the silicone adhesive tape has an adhesive force of 100 gZ25 mm or more. There is a feature.
【0 0 5 4】 この請求の範囲第 1 6項に記載の発明によれば、 請求の範囲第 2 項記載の発明と同様な作用効果を奏するとともに、 一方及び他方の接着材テープ の接続において、 両者の接着剤面にもシリコーン粘着テープを張り付けて接着で きるので、 一方及び他方の接着材テープを両面から接着 （又は密着） することに より、 高い強度で接着できる。  According to the invention described in claim 16, the same operation and effect as those of the invention described in claim 2 can be obtained, and the connection of one and the other adhesive tapes can be achieved. Since a silicone pressure-sensitive adhesive tape can be adhered to both surfaces of the adhesive, the adhesive tape can be adhered with high strength by adhering (or adhering) one and the other adhesive tapes from both surfaces.
【0 0 5 5】 特に、 接着カを 1 0 0 §/ 2 5 111111以上とすることにょり、 一方 及び他方の接着材テープの両接着剤面との接着をより強固におこなうことができ [0555] In particular, by setting the adhesive force to be 100 § / 25111111 or more, it is possible to more firmly bond the one and the other adhesive tapes to both adhesive surfaces.
^ ο ^ ο
【0 0 5 6】 接着強度は、 大きければ強い接着強度を得ることができるが、 1 0 0 g/ 2 5 mmよりも小さいと所定の強度が得られないおそれがある。  [0556] If the adhesive strength is large, a strong adhesive strength can be obtained, but if it is smaller than 100 g / 25 mm, a predetermined strength may not be obtained.
【0 0 5 7】 請求の範囲第 1 7項に記載された発明は、 請求の範囲第 1 6項に 記載の発明において、 請求の範囲第 1 6項に記載のシリコーン粘着テープを、 ― 方の接着材テープの終端部と他方の接着材テープの始端部を重ね合わせ又は突き 合せて、 両接着材テープの両面に亘つて張り付けて接続することを特徴とする。 【0 0 5 8】 この請求の範囲第 1 7項に記載の発明によれば、 請求の範囲第 1 6項に記載の発明と同様な作用効果を奏するとともに、 一方と他方の接着材テ一 プをその両面で接続するので、 更に強固な接続を得ることができる。 The invention described in claim 17 is the invention described in claim 16, wherein the silicone pressure-sensitive adhesive tape described in claim 16 is used for: The end portion of the adhesive tape and the start end of the other adhesive tape are overlapped or abutted, and attached to both sides of both adhesive tapes for connection. According to the invention as set forth in claim 17, the same operation and effect as those of the invention as set forth in claim 16 can be obtained, and one and the other adhesive materials can be used. Since the loops are connected on both sides, a stronger connection can be obtained.
【0 0 5 9】 請求の範囲第 1 8項に記載された発明は、 電極接続用の接着剤が シリコーン処理基材に塗布された、 一方のリールに巻いた一方の接着材テープと 他方のリールに卷いた他方の接着材テープとを接続する接着剤テープの接続方法 であって、 一方の接着材テ一プの終端部と他方の接着材テ一プの始端部との間に シリコーン粘着剤を両面に塗布したシリコーン粘着テープを挟んで両接着材テ一 プを接続し、 両面のシリコーン粘着剤はシリコーン基材の表面張力との差が 1 0 mN/m(10dyneZ c m)以下で、 且つ接着力が 1 0 0 g/ 2 5 mm以上としてい ることを特徴とする。  The invention described in claim 18 is characterized in that an adhesive for electrode connection is applied to a silicone-treated base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel. A method of connecting an adhesive tape for connecting the other adhesive tape wound on a reel, wherein a silicone adhesive is provided between an end of one adhesive tape and a start of the other adhesive tape. The two adhesive tapes are connected by sandwiching a silicone adhesive tape coated on both sides with a silicone adhesive, and the difference between the silicone adhesive on both sides and the surface tension of the silicone substrate is 10 mN / m (10 dyneZcm) or less. In addition, the adhesive strength is 100 g / 25 mm or more.
【0 0 6 0】 この請求の範囲第 1 8項に記載の発明によれば、 両面粘着剤のシ リコーン粘着テープを用いているので、 一方と他方の接着材テープ間に両面シリ コーン粘着テープを挟んで両者を接着 （又は密着） できるから、 両者の接続が簡 単且つ容易である。  According to the invention as set forth in claim 18, since the double-sided adhesive silicone adhesive tape is used, a double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape. The two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
【0 0 6 1】 請求の範囲第 1 9項に記載された発明は、 電極接続用の接着剤が 基材に塗布された、 一方のリ一ルに巻いた一方の接着材テープと他方のリ一ルに 巻いた他方の接着材テープとを接続する接着剤テープの接続方法であって、 一方 の接着材テープの終端部と、 他方の接着材テープの始端部とを重ね合わせ又は突 き合わせ、 ペースト状の樹脂製接着剤を重ね合わせ部分又は突き合わせ部分に付 けて、 ペースト状の樹脂製接着剤を硬化させることで両者を接続することを特徴 とする。  [061] The invention described in claim 19 is characterized in that an adhesive for electrode connection is applied to a base material, and one adhesive tape wound on one reel and the other adhesive tape are wound on one reel. A method of connecting an adhesive tape that connects the other adhesive tape wound on a reel, wherein the end of one adhesive tape and the start end of the other adhesive tape are overlapped or protruded. It is characterized in that the two are connected by applying a paste-like resin adhesive to the overlapped portion or abutting portion and curing the paste-like resin adhesive.
【0 0 6 2】 この請求の範囲第 1 9項に記載の発明では、 卷出しが終了した接 着材テープの終端部と、 新たに装着する接着材テープの始端部とをペースト状の 樹脂製接着剤で固定するので、 接続が簡単である。 また、 新たな接着材リールの 交換毎に卷取りテープの交換や新規接着材テープの始端を卷取りリ一ルに取り付 ける作業、 所定の経路にガイドピン等を設定する作業が必要ないので、 新しい接 着材リ一ルの交換時間が少なくて済み、 電子機器の生産効率が高まる。 [062] In the invention according to claim 19, the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are made of a paste-like resin. Connection is easy because it is fixed with adhesive. In addition, every time a new adhesive reel is replaced, the take-up tape is replaced and the beginning of the new adhesive tape is attached to the take-up reel. Since there is no need to perform the work of setting the guide pins etc. on the predetermined path, the time required to replace new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
【0 0 6 3】 一方の接着材テープの終端部と、 他方の接着材テープの始端部と の重ね合わせ部分又は突き合わせ部分において樹脂製接着剤を付けるので、 接続 の自由度が高い。  [063] A resin adhesive is applied at a portion where the end of one adhesive tape is overlapped or abutted with the beginning of the other adhesive tape, so that the degree of freedom of connection is high.
【0 0 6 4】 請求の範囲第 2 0項に記載された発明は、 請求の範囲第 1 9項に 記載の発明において、 樹脂製接着剤は熱硬化性樹脂、 光硬化性樹脂、 ホットメル ト接着剤の群から選択される少なくとも 1つの材料からなることを特徴とする。 [0664] The invention described in claim 20 is the invention according to claim 19, wherein the resin adhesive is a thermosetting resin, a photocurable resin, or a hot melt resin. It is characterized by being made of at least one material selected from the group of adhesives.
【0 0 6 5】 この請求の範囲第 2 0項に記載の発明によれば、 請求の範囲第 1 9項に記載の発明と同様な作用効果を奏するとともに、 樹脂製接着剤として熱硬 化性樹脂、 光硬化性樹脂、 ホットメルト接着剤の群の中から、 接着材テープ同士 の接続に好適な樹脂製接着剤を選択することができ、 接着材テープ同士の接続強 度を高めることができる。 According to the invention as set forth in claim 20, the same operation and effect as those of the invention as set forth in claim 19 are obtained, and the thermosetting resin adhesive is used. A suitable resin adhesive for connecting adhesive tapes can be selected from the group of adhesive resins, photo-curing resins, and hot melt adhesives, and the connection strength between adhesive tapes can be increased. it can.
【0 0 6 6】 請求の範囲第 2 1項に記載された発明は、 接着材テープが装着さ れる接着装置には請求の範囲第 1 9項又は請求の範囲第 2 0項に記載の樹脂製接 着剤を供給する充 が設けられていることを特徴とする。  [063] The invention described in claim 21 is a bonding apparatus to which an adhesive tape is mounted, wherein the resin according to claim 19 or claim 20 is provided. It is characterized by being provided with a filler for supplying a bonding agent.
【0 0 6 7】 この請求の範囲第 2 1項に記載の発明によれば、 接着装置内に請 求の範囲第 1 9項又は請求の範囲第 2 0項に記載の樹脂製接着剤を供給する充填 機が設けられているので、 別途に充填機を用意する必要がなく、 接続作業の無駄 を防止できる。  According to the invention as set forth in claim 21, the resin adhesive according to claim 19 or claim 20 is provided in the bonding apparatus. Since a filling machine is provided, it is not necessary to prepare a separate filling machine, and waste of connection work can be prevented.
【0 0 6 8】 尚、 接着装置内には充填機の他に、 熱硬化性樹脂を硬化するため に加熱器又は光硬化性樹脂を光照射するための紫外線を備えるものであっても良 い。  [060] In addition to the filling machine, the bonding apparatus may be provided with a heater for curing the thermosetting resin or an ultraviolet ray for irradiating the photocurable resin with light. No.
【0 0 6 9】 請求の範囲第 2 2項に記載された発明は、 電極接続用の接着剤が 基材に塗布された、接着材テープをリールに巻いた接着材テ一プリ一ルであって、 接着材テープリールはテープの幅方向に接着材テープの卷き部を複数設けたこと を特徴とする。 The invention set forth in claim 22 is an adhesive tape that is formed by applying an adhesive for electrode connection to a base material and winding an adhesive tape on a reel. The adhesive tape reel has a plurality of adhesive tape windings in the width direction of the tape. It is characterized by.
【0 0 7 0】 この請求の範囲第 2 2項に記載の発明では、 接着材テープの卷き 部 （巻き部） を複数設けたので、 複数の卷き部のうち、 一方の卷き部に巻かれた 接着材テープの卷き出しが終了すると、 卷き出しの終了した卷き部の隣に配置し た他方の卷き部の接着材テープを卷取りリールに取り付ける。  In the invention according to claim 22, since a plurality of winding portions (winding portions) of the adhesive tape are provided, one of the winding portions among the plurality of winding portions is provided. When the unwinding of the adhesive tape wound on the tape is completed, the adhesive tape of the other winding portion arranged next to the unwinding wound portion is attached to the take-up reel.
【0 0 7 1】 このように、 一方の接着材テープの卷き出しが終了すると、 他方 の接着材テ一プを巻取りリールに取り付けて、 接着材テープの交換を行うので、 接着装置への新たな接着材テープリールの装着が不要である。 従って、 新たな接 着材テ一プリールの交換作業が少なくて済み、 電子機器の生産効率が高まる。 【0 0 7 2】 複数の卷き部に巻かれた接着材テープを順次使用できるので、 1 つの接着材テープリールあたりの接着材テープの卷き数を増やすことなく、 1回 の交換作業で使用可能な接着剤量を大幅に増やすことができる。 また、 接着材テ 一プの卷き数を増やすことがないから、 卷き崩れを防止できるとともに、 接着剤 がテープの幅方向に染み出して巻いた接着材テープ同士が接着するいわゆるプロ ヅキングを防止でき、 さらに基材が長くなることで生じ易い基材の伸び等の弊害 を防止できる。  [0071] As described above, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is exchanged. It is not necessary to install a new adhesive tape reel. Therefore, the replacement work of the new adhesive tape pulp is reduced, and the production efficiency of electronic equipment is improved. [0 0 7 2] Since the adhesive tape wound on a plurality of winding portions can be used sequentially, the number of windings of the adhesive tape per adhesive tape reel can be increased without changing the number of windings of the adhesive tape. The amount of adhesive that can be used can be greatly increased. In addition, since the number of windings of the adhesive tape is not increased, collapse of the tape can be prevented, and so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other, is performed. In addition, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur when the base material is elongated.
【0 0 7 3】 請求の範囲第 2 3項に記載された発明は、 請求の範囲第 2 2項記 載の発明において、 一方の接着材テープの終端部と他方の接着材テープの始端部 との間には両者を接続する連結テープを備えており、 一方の接着材テープの巻き 出しが終了すると、 続いて他方の接着材テープの繰り出しが開始されることを特 徴とする。  The invention described in claim 23 is the invention according to claim 22, wherein the end of one adhesive tape and the start of the other adhesive tape are provided. And a connecting tape for connecting the two, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
【0 0 7 4】 この請求の範囲第 2 3項に記載の発明によれば、 請求の範囲第 2 2項に記載の発明と同様な作用効果を奏するとともに、 一方の接着材テープの終 端部と他方の接着材テープの始端部とが、 連結テープで接続されているので、 一 方の卷き部の接着材テープの卷き出しが終了した後、 他方の卷き部の接着材テ一 プを卷取りリールに取り付ける作業が不要となり、 電子機器の生産効率がさらに 局まる。 According to the invention described in claim 23, the same operation and effect as those of the invention described in claim 22 can be obtained, and the end of one of the adhesive tapes can be obtained. Is connected to the start end of the other adhesive tape by the connecting tape, so that after the unwinding of the adhesive tape of one winding part is completed, the adhesive tape of the other winding part is finished. There is no need to attach the reels to the take-up reel, further increasing the production efficiency of electronic equipment. Bureau.
【0 0 7 5】 請求の範囲第 2 4項に記載された発明は、 請求の範囲第 2 3項に 記載の接着材テ一プリ一ルと、 接着材テープの卷取りリールと、 接着材テ一プリ —ルと卷取りリールとの間に設けられ且つ加熱加圧へヅドで接着材テープの接着 材を電子機器の回路基板に圧着する圧着部と、 連結テープを検知するテープ検知 手段とを備えた接着装置であつて、 テープ検知手段が連結テープを検知した場合 には、 連結テープが圧着部を通過するまで連結テープを巻取りリールに卷き取る ことを特徴とする。  The invention described in claim 24 is an adhesive tape reel according to claim 23, a winding reel for an adhesive tape, and an adhesive material. A crimping portion provided between the tape reel and the take-up reel and for crimping the adhesive of the adhesive tape onto the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the connection tape. And when the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the pressure bonding portion.
【0 0 7 6】 この請求の範囲第 2 4項に記載の発明によれば、 連結テープは自 動的に卷取りリールに巻き取られるので、 一方の卷き部の接着材テープが終了し た後に、 順次、 次の卷き部から接着材テープを繰り出すことができる。  According to the invention as set forth in claim 24, the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
【0 0 7 7】 また、 連結テープをテ一プ検知手段が検知すると、 連結テープが 圧着部を通過するまで、 連結テープを自動的に卷取りリールに卷き取るので、 卷 取りの手間を省くことができる。  When the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion. Can be omitted.
【0 0 7 8】 尚、 テープ検知手段としては例えば接着装置に一対の発光部と受 光部とを備え、 連結テープを光学的に検知するものである。 一方、 連結テープの 両端には色を付した （例えば黒） マークを設けており、 発光部から発したレーザ 光により連結テープの両端のマ一クを受光部が検知することで連結テープを判断 している。 また連結テープにマ一クを付する他、 連結テープの幅を接着材テープ の幅とは異なる幅にする方法、 連結テープに複数の孔を形成する方法であっても 良い。  [0778] Incidentally, as the tape detecting means, for example, a bonding device is provided with a pair of light emitting units and a light receiving unit, and optically detects the connecting tape. On the other hand, colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the mark at both ends of the connecting tape by the laser beam emitted from the light emitting unit, and judges the connecting tape. are doing. In addition to the marking on the connection tape, a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
【0 0 7 9】 請求の範囲第 2 5項に記載された発明は、 一方の接着材テープの 終端部と他方の接着材テープの始端部とを係止具を用いて接続した接着材テープ リ一ルであつて、 接続部分は接着材テープで係止具を覆っていることを特徴とす る。  The invention described in claim 25 is an adhesive tape in which the end of one adhesive tape and the start of the other adhesive tape are connected using a fastener. The reel is characterized in that the connecting portion is covered with the adhesive tape by the adhesive tape.
【0 0 8 0】 この請求の範囲第 2 5項に記載の発明では、 巻き出しの終了した 接着材テープの終端部と新たに装着する接着材テ一プの始端部とを係止具を用い て接続し、 接着材テープリールの交換を行うので、 接着装置への新たな接着材テ —プリ一ルの装着が簡単にできる。 また、 新たな接着材テープリールの交換毎に 卷取りテープの交換や新規接着材テープの始端を卷取りリ一ルに取り付ける作業、 所定の経路にガイドビン等を設定する作業が必要ないので、 新しい接着材テープ リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。 In the invention according to claim 25, the unwinding is completed. The end of the adhesive tape and the beginning of the new adhesive tape are connected using a fastener, and the adhesive tape reel is replaced, so a new adhesive tape to the bonding device is used. Easy installation of prills. In addition, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced. New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
【0 0 8 1】 接着材テ一プを順次使用できるので、 1つの接着材テ一プリ一ル あたりの接着材テープの卷き数を増やすことなく、 1回の交換作業で使用可能な 接着剤量を大幅に増やすことができる。 また、 接着材テープの卷き数を増やすこ とがないから、 巻き崩れを防止できるとともに、 接着剤がテープの幅方向に染み 出して卷いた接着材テープ同士が接着するいわゆるブロヅキングを防止でき、 さ らに基材が長くなることで生じ易い基材の伸び等の弊害を防止できる。  [0 0 8 1] Adhesive tapes can be used sequentially, so that the adhesive tape can be used in one exchange without increasing the number of adhesive tapes wound per adhesive tape. The dosage can be greatly increased. In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent winding collapse and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. Further, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur due to the longer base material.
【0 0 8 2】 また、.一方の接着材テープの終端部と他方の接着材テープの始端 部との接続部分は、 係止具を接着材テープで覆っているので、 外観が良いととも に、 接続部分の係止具が接着材テープに接触して、 接着材テープが損傷すること を防止できたり、 接着装置の加熱加圧ヘッド、 支持台等の構成部品を係止具で損 傷させることがない。  [0108] In addition, the connection between the end of one adhesive tape and the start of the other adhesive tape covers the locking member with the adhesive tape, so that the appearance is good. In addition, it is possible to prevent the fastener at the connection part from being in contact with the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine with the fastener. I will not let you.
【0 0 8 3】 尚、 係止具を接着材テープで覆う方法としては、 一方の接着材テ —プの終端部及び他方の接着材テープの始端部を係止具で接続した後、 接続部分 をテープの長手方向に 1 8 0度折り返すことで、 係止具を接着材テープで覆うこ とが好ましい。  [0813] Incidentally, as a method of covering the locking tool with the adhesive tape, the end of one adhesive tape and the starting end of the other adhesive tape are connected by the locking tool, and then the connection is performed. It is preferable to fold the portion by 180 degrees in the longitudinal direction of the tape so that the locking member is covered with the adhesive tape.
【0 0 8 4】 また、 接続部分を他の接着材テープで巻いて係止具を覆うように しても良い。  [0908] Further, the connection portion may be wound with another adhesive tape so as to cover the locking member.
【0 0 8 5】 請求の範囲第 2 6項に記載された発明は、 請求の範囲第 1項に記 載の接着材テープリールと、 接着材テープの卷取りリールと、 接着材テープリー ルと卷取りリールとの間に設けられ、 且つ、 加熱加圧ヘッドで接着材テープの接 着材を電子機器の回路基板に圧着する圧着部と、 テープの接続部分を検知する接 続部検知手段とを備えた接着装置であって、 接続部検知手段がテープの接続部分 を検知した場合には、 接続部分が圧着部を通過するまで一方の接着材テ一プを卷 取りリールに卷き取ることを特徴とする。 The invention described in claim 26 is the adhesive tape reel described in claim 1, an adhesive tape take-up reel, and an adhesive tape reel. And a take-up reel, and the adhesive tape is connected by a heating / pressing head. An adhesive device that includes a crimping part for crimping an adhesive to a circuit board of an electronic device and a connection part detecting means for detecting a tape connection part, wherein the connection part detection means detects a tape connection part. The method is characterized in that one adhesive tape is wound on a winding reel until the connection portion passes through the crimping portion.
【0 0 8 6】 この請求の範囲第 2 6項に記載の発明によれば、 接続部分を接続 部検知手段が検知すると、 接続部分が圧着部を通過するまで、 一方の接着材テー プを卷取りリールに卷き取るので、 接続部分が圧着部にきて、 圧着動作が行われ るという不具合を防止できる。 また、 接続部分が圧着部を通過するまで、 一方の 接着材テープを自動的に卷取りリールに巻き取るので、 卷取りの手間を省くこと ができる。  According to the invention as set forth in claim 26, when the connection portion detecting means detects the connection portion, one of the adhesive tapes is applied until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Also, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
【0 0 8 7】 請求の範囲第 2 7項に記載された発明は、 請求の範囲第 2 6項に 記載の発明において、 接続部検知手段は、 C C Dカメラ、 厚み検知センサ、 透過 率検知センサの何れかであることを特徴とする。  [0887] The invention described in claim 27 is the invention described in claim 26, wherein the connection portion detection means is a CCD camera, a thickness detection sensor, a transmittance detection sensor. Characterized in that:
【0 0 8 8】 この請求の範囲第 2 7項に記載の発明によれば、 請求の範囲第 2 6項に記載の発明と同様の作用効果を奏するとともに、 簡単な構成で接続部分の 検知ができ、 しかも、 これらの手段を用いることで検知精度を高めることができ According to the invention described in claim 27, the same operation and effect as those of the invention described in claim 26 can be obtained, and the connection portion can be detected with a simple configuration. In addition, the detection accuracy can be improved by using these means.
Ό o Ό o
【0 0 8 9】 例えば、 接続部検知手段として C C Dカメラを用いた場合には、 接続部分の表面をモニタ画面に取り込み、 画素の濃淡を比較することで、 接続部 分を検知している。 また、 厚み検知センサを用いた場合には、 接続部分の厚みが 接着材テープの厚みより大きいので、 厚みの変化を比較することで、 接続部分を 検知.している。 さらに、 透過率センサを用いた場合には、 接続部分は厚みが厚く なり、 また係止具があるので透過率が低くなり、 透過率の値を比較することで、 接続部分を検知する。  [0809] For example, when a CCD camera is used as the connection detecting means, the connection is detected by capturing the surface of the connection on a monitor screen and comparing the density of pixels. In addition, when a thickness detection sensor is used, the thickness of the connection is greater than the thickness of the adhesive tape, so the change in thickness is compared to detect the connection. Furthermore, when a transmittance sensor is used, the connection portion becomes thicker, and the transmittance decreases due to the presence of the locking member, and the connection portion is detected by comparing the transmittance values.
【0 0 9 0】 請求の範囲第 2 8項に記載された接着材テープの接続方法は、 一 方の接着材テープの終端部と他方の接着材テープの始端部とを係止具を用いて接 続し、 接続部分は接着材テープで係止具を覆うことを特徴とする。 [0109] The method of connecting an adhesive tape according to claim 28 is a method for connecting an end portion of one adhesive tape and a start end portion of the other adhesive tape using a fastener. Contact Subsequently, the connection portion is characterized by covering the locking device with an adhesive tape.
【0 0 9 1】 この請求の範囲第 2 8項に記載の発明では、 卷き出しの終了した 接着材テープの終端部と新たに装着する接着材テープの始端部とを係止具を用い て接続し、 接着材テープリールの交換を行うので、 接着装置への新たな接着材テ —プリ一ルの装着が簡単にできる。 また、 新たな接着材テープリールの交換毎に 卷取りテープの交換や新規接着材テープの始端を卷取りリ一ルに取り付ける作業、 所定の経路にガイドビン等を設定する作業が必要ないので、 新しい接着材テープ リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。  [0091] According to the invention as set forth in claim 28, the end of the unwound adhesive tape and the start of the newly-attached adhesive tape are locked by using a fastener. Connection, and the adhesive tape reel is replaced, so that a new adhesive tape can be easily attached to the bonding equipment. In addition, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path every time a new adhesive tape reel is replaced. New adhesive tape reels require less time to change, increasing production efficiency of electronic equipment.
【0 0 9 2】 接着材テープを順次使用できるので、 1つの接着材テ一プリ一ル あたりの接着材テープの卷き数を増やすことなく、 1回の交換作業で使用可能な 接着剤量を大幅に増やすことができる。 また、 接着材テープの卷き数を增やすこ とがないから、 卷き崩れを防止できるとともに、 接着剤がテープの幅方向に染み 出して巻いた接着材テープ同士が接着するいわゆるプロヅキングを防止でき、 さ らに が長くなることで生じ易い基材の伸び等の弊害を防止できる。  [0 0 9 2] Since adhesive tapes can be used sequentially, the amount of adhesive that can be used in one exchange operation without increasing the number of wound adhesive tapes per adhesive tape Can be greatly increased. Also, since the number of windings of the adhesive tape does not need to be small, it is possible to prevent the collapse of the winding and prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. In addition, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur when the length is increased.
【0 0 9 3】 また、 一方の接着材テープの終端部と他方の接着材テープの始端 部との接続部分は、 係止具を接着材テープで覆っているので、 外観が良いととも に、 接続部分の係止具が接着材テープに接触して、 接着材テープが損傷すること を防止できたり、 接着装置の加熱加圧ヘッド、 支持台等の構成部品を係止具で損 傷させることがない。  [0093] Also, the connecting portion between the end of one adhesive tape and the beginning of the other adhesive tape covers the locking member with the adhesive tape, so that it has good appearance and In this way, it is possible to prevent the adhesive at the connection part from contacting the adhesive tape and to prevent the adhesive tape from being damaged, or to damage components such as the heating and pressurizing head and the support base of the bonding machine. Nothing.
【0 0 9 4】 尚、 係止具を接着材テープで覆う方法としては、 一方の接着材テ ープの終端部及び他方の接着材テープの始端部を係止具で接続した後、 接続部分 をテープの長手方向に 1 8 0度折り返すことで、 係止具を接着材テープで覆うこ とが好ましい。  [094] Note that as a method of covering the locking tool with the adhesive tape, the end of one adhesive tape and the starting end of the other adhesive tape are connected by the locking tool, and then the connection is performed. It is preferable to fold the portion by 180 degrees in the longitudinal direction of the tape so that the locking member is covered with the adhesive tape.
【0 0 9 5】 また、 接続部分を他の接着材テープで巻いて係止具を覆うように しても良い。  [095] Further, the connecting portion may be wound with another adhesive tape so as to cover the locking member.
【0 0 9 6】 請求の範囲第 2 9項に記載された発明は、 基材に接着剤が塗布さ れて、 リール状に巻いた接着剤テープであって、 基材には接着剤がテープの長手 方向に複数条配置されていることを特徴とする。 [096] The invention described in claim 29 is a method in which an adhesive is applied to a base material. An adhesive tape wound in a reel shape, wherein a plurality of adhesives are arranged on a base material in a longitudinal direction of the tape.
【0 0 9 7】 この請求の範囲第 2 9項に記載の発明では、 接着剤テープの使用 時には、 接着剤テープを卷き取つたリールと空のリ一ルとを接着装置に装着し、 回路基板に接着剤を加熱加圧した後に基材を空のリ一ルに卷き取るように装着す る。  In the invention according to claim 29, when the adhesive tape is used, the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, After heating and pressurizing the adhesive on the circuit board, the substrate is mounted so as to be wound up on an empty reel.
【0 0 9 8】 そして、 回路基板に接着剤を加熱加圧する場合には、 基材の幅方 向に複数設けられた複数条の接着剤のうちの一条を回路基板に圧着し、 圧着後の 残りの接着剤条は基材とともに空のリールに巻き取る。 そして、 リールから接着 剤テープの繰り出しが終了したら、 リールの回転方向を反転させて接着剤テープ の供給方向を反転させる。 このように接着剤は一条毎に使用したのち残りの接着 剤と基材とを卷き取り、 残りの接着剤条を順次使用することを繰り返す。 したが つて、 複数条の接着剤を順次一条づっ使用できるので、 テープの巻き数を増やす ことなく、 1リールで使用可能な接着剤量を大幅に （2倍以上に） 増やすことが できる。  When the adhesive is heated and pressurized on the circuit board, one of a plurality of adhesives provided in the width direction of the base material is pressure-bonded to the circuit board. The remaining adhesive strip is wound onto an empty reel together with the substrate. Then, when the feeding of the adhesive tape from the reel is completed, the rotation direction of the reel is reversed to reverse the supply direction of the adhesive tape. As described above, after the adhesive is used for each strip, the remaining adhesive and the base material are wound up, and the remaining adhesive strips are sequentially used. Therefore, since a plurality of adhesives can be sequentially used one by one, the amount of adhesive usable on one reel can be greatly increased (more than twice) without increasing the number of tape windings.
【0 0 9 9】 本発明によれば、 接着剤テープの卷き数を増やすことなく、 使用 する接着剤量を大幅に増やすことができる。 しかも、 接着剤テープの卷き数を増 やすことがないから、 卷き崩れを防止できるとともに、 接着剤がテープの幅方向 に染み出して卷かれているテープ同士が接着するブロッキングを防止でき、更に、 基材が長くなることにより生じ易い基材の伸び等の弊害 （基材の損傷や切断） を 防止できる。  [0109] According to the present invention, the amount of adhesive to be used can be greatly increased without increasing the number of windings of the adhesive tape. In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent the collapse of the winding, and to prevent the adhesive from leaking out in the width direction of the tape and blocking the wound tapes from adhering to each other. Furthermore, it is possible to prevent adverse effects such as elongation of the base material (damage or breakage of the base material) that are likely to occur due to the longer base material.
【0 1 0 0】 電子部品の製造工場では、 新しい接着剤テープの交換回数が少な くて済むので、 製造効率が高まる。  [0100] In an electronic component manufacturing plant, the number of times of replacement of a new adhesive tape can be reduced, thereby increasing the manufacturing efficiency.
【0 1 0 1】 また、 接着剤テープの製造においては、 1リ一ル当りの接着剤量 を多くできるので、 リール材ゃ湿気防止材の使用量を削減でき、 製造コストを低 減でぎる。 【0 1 0 2】 尚、 1条目の接着剤の圧着が終了して接着剤テープを空のリール に巻き取った後に次の条の接着剤を使用するために、回転方向を反転させないで、 接着装置に装着している 2つのリールを交換してもよい。 [0110] Also, in the production of adhesive tape, the amount of adhesive per reel can be increased, so that the amount of reel material / moisture prevention material can be reduced, and the production cost can be reduced. . [0110] In addition, after the pressure bonding of the first adhesive is completed, the adhesive tape is wound on an empty reel, and then the adhesive of the next adhesive is used. The two reels mounted on the bonding machine may be exchanged.
【0 1 0 3】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 剤であってもよいし、 絶縁性接着剤のみであってもよいし、 それらの接着剤中に 絶縁性のスぺ一サ粒子を分散したものであってもよい。  [0103] The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
【0 1 0 4】 基材の幅は 5 mn！〜 1 0 0 0 mmが好ましいが、 一条の接着剤の 幅や接着剤の条数により任意に選択される。 接着剤の一条の幅は 0 . 5 mm〜l 0 . 0 mmが好ましい。  [0104] The width of the substrate is 5 mn! The thickness is preferably 1000 mm, but is arbitrarily selected depending on the width of one adhesive and the number of adhesives. The width of one line of the adhesive is preferably from 0.5 mm to 1.0 mm.
【0 1 0 5】 基材の幅を 5 mm〜： L 0 0 0 mmとしているのは、 基材の幅が 5 mm未満の場合には、 基材上に設ける接着剤の条数ゃ接着剤の幅に制限があると ともに、 1 0 0 0 mmより大きくなると既存の接着装置に装着できなくなるおそ れがある為である。  [0105] The width of the base material is 5 mm or more: L000 mm is set when the width of the base material is less than 5 mm, the number of the adhesives provided on the base material divided by the adhesion. This is because not only is the width of the agent limited, but if it is larger than 100 mm, it may not be possible to attach it to existing bonding equipment.
【0 1 0 6】 請求の範囲第 3 0項に記載された発明は、 請求の範囲第 2 9項に 記載された発明において、 複数条の接着剤は、 互いに隣合う接着剤条が間隔をあ けていることを特徴とする。  [0106] The invention described in claim 30 is the invention described in claim 29, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
【0 1 0 7】 この請求の範囲第 3 0項に記載の発明によれば、 請求の範囲第 2 9項に記載の発明と同様な作用効果を奏するとともに、 隣合う接着剤条同士が離 れているので、 接着剤を 1条づっ容易に圧着できる。  [0107] According to the invention described in claim 30 of the present invention, the same effect as that of the invention described in claim 29 is obtained, and the adjacent adhesive strips are separated from each other. The adhesive can be easily crimped one by one.
【0 1 0 8】 請求の範囲第 3 1項に記載された発明は、 請求の範囲第 2 9項に 記載された発明において、 接着剤は、 テープの長手方向に形成したスリットによ り複数条に分離されていることを特徴とする。  [0108] The invention described in claim 31 is the invention according to claim 29, wherein the adhesive is formed by a slit formed in the longitudinal direction of the tape. It is characterized by being separated into articles.
【0 1 0 9】 この請求の範囲第 3 1項に記載の発明によれば、 請求の範囲第 2 9項と同様な作用効果を奏するとともに、 基材の片面全面に接着剤を塗布して製 造し、 接着剤を回路基板に圧着する直前に、 即ち、 接着剤テープの使用直前に切 刃等により接着剤に切れ目を入れてスリットを形成することが好ましい。 3009694 [0109] According to the invention set forth in claim 31, the same effect as that of claim 29 can be obtained, and an adhesive is applied to one entire surface of the base material. It is preferable to form a slit by cutting the adhesive with a cutting blade or the like immediately before manufacturing and immediately pressing the adhesive on the circuit board, that is, immediately before using the adhesive tape. 3009694
【0110】 尚、 スリットは、 接着剤テープの製造時に、 切刃等で接着剤に切 れ目を入れてスリットを形成してもよい。 [0110] The slit may be formed by making a cut in the adhesive with a cutting blade or the like when the adhesive tape is manufactured.
【0111】 スリツ卜の形成は、 切刃のほか、 レーザや電熱線等により形成す るものであってもよい。  [0111] The slit may be formed by a laser, a heating wire, or the like, in addition to the cutting edge.
【0112】 本発明によれば、 基材上に配置する接着剤条の条数を多くするこ とができる。  [0112] According to the present invention, the number of the adhesive strips arranged on the base material can be increased.
【0113】 請求の範囲第 32項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に巻いた接着剤テープの製造方法であって、 基材の幅方向に間隔を おいて配置した塗布器から、 連続搬送される基材面上に接着剤を供給することに より、 基材に接着剤を複数条塗布したことを特徴とする。  [0113] The invention described in claim 32 is a method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, wherein an interval is provided in a width direction of the base material. A plurality of adhesives are applied to the substrate by supplying the adhesive onto the surface of the substrate that is continuously conveyed from the applicator that is disposed.
【0114】 この請求の範囲第 32項に記載の発明によれば、 既存設備を利用 して請求の範囲第 30項に記載の接着剤テープを製造することができる。  [0114] According to the invention described in claim 32, the adhesive tape according to claim 30 can be manufactured using existing equipment.
【0115】 塗布器は、 基材の幅方向に複数設けたロールであってもよいし、 ノズルであってもよい。  [0115] The applicator may be a plurality of rolls provided in the width direction of the base material or a nozzle.
【0116】 請求の範囲第 33項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に卷いた接着剤テープの製造方法であって、 一方の基材の片面全面 に接着剤を塗布し、 次に接着剤に長手方向のスリットを形成した後、 接着剤面上 に他方の基材を配置して一方及び他方の基材で接着剤を挟み、 次に一方の基材と 他方の基材とを互いに離して一方及び他方の基材のそれぞれに複数条の接着剤を 交互に貼着し、 一方及び他方の基材に複数条の接着剤を間隔をおいて配置したも のを製造することを特徴とする。  [0116] The invention described in claim 33 is a method of manufacturing an adhesive tape in which an adhesive is applied to a substrate and wound in a reel shape, wherein the adhesive tape is adhered to one entire surface of one substrate. After applying an adhesive, and then forming a longitudinal slit in the adhesive, the other substrate is placed on the adhesive surface, the adhesive is sandwiched between one and the other substrates, and then the one substrate And the other substrate are separated from each other, and a plurality of adhesives are alternately adhered to each of the one and the other substrates, and the plurality of adhesives are arranged at intervals on the one and the other substrates It is characterized by manufacturing things.
【0117】 この請求の範囲第 33項に記載の発明によれば、 請求の範囲第 2 項に言 3載の接着剤テープを同時に 2つ製造できるので、 製造効率に優れる。 [0117] According to the invention set forth in claim 33, two adhesive tapes described in claim 3 can be manufactured at the same time, so that the manufacturing efficiency is excellent.
【0118】 請求の範囲第 34項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に巻いた接着剤テープを用いて回路基板に接着剤を圧着する接着剤 の圧着方法であって、 基材にはその片面全面に接着剤が塗布されており、 接着剤 テープの幅方向における接着剤の一部を基材側からテープの長手方向に沿って条 状に加熱加圧することにより加熱した部分の接着剤の凝集力を低下させつつ回路 基板に圧着し、 圧着後残りの接着剤を基材とともにリール状に巻き取り、 リール 状に卷き取った接着剤テープを再度用いて回路基板に残りの接着剤を加熱加圧す ることを特徴とする。 [0118] The invention described in claim 34 is a method for crimping an adhesive, in which an adhesive is applied to a base material and the adhesive is pressure-bonded to a circuit board using an adhesive tape wound in a reel shape. The adhesive is applied to the entire surface of the base material, and the adhesive is A portion of the adhesive in the width direction of the tape is heated and pressed in a strip shape along the longitudinal direction of the tape from the base material side, thereby reducing the cohesive force of the adhesive in the heated portion and pressing the adhesive to the circuit board. Thereafter, the remaining adhesive is wound up in a reel shape together with the base material, and the adhesive is heated and pressed onto the circuit board again using the adhesive tape wound up in the reel shape.
【0 1 1 9】 この請求の範囲第 3 4項に記載の発明によれば、 接着剤の一部を 加熱することにより、 その部分の凝集力が低下し （以下 「凝集力低下ライン」 と いう）、凝集力低下ラインから加熱した部分の接着剤が回路基板に圧着さ て、基 材から離れる。 残余の接着剤は基材に残ったまま基材とともに空のリ一ルに卷き 取られる。  According to the invention set forth in claim 34, by heating a part of the adhesive, the cohesive strength of the part is reduced (hereinafter referred to as “cohesive strength reduction line”). ), The adhesive in the heated area from the cohesive strength reduction line is pressed against the circuit board and separates from the substrate. The remaining adhesive is wound onto an empty reel together with the substrate while remaining on the substrate.
【0 1 2 0】 本発明によれば、 接着剤テープの幅を従来よりも広くとるだけで あるから、 既存設備をそのまま用いて接着剤テープを製造できる。  [0120] According to the present invention, since the width of the adhesive tape is merely wider than in the past, the adhesive tape can be manufactured using existing equipment as it is.
【0 1 2 1】 更に、 回路基板に圧着する接着剤の幅は、 加熱領域を変えること により任意に設定でき、 圧着する接着剤幅の自由度が高い。  [0112] Furthermore, the width of the adhesive to be pressed onto the circuit board can be set arbitrarily by changing the heating area, and the degree of freedom of the width of the adhesive to be pressed is high.
【0 1 2 2】 また、 請求の範囲第 2 9項に記載の発明と同様に、 空リールへ接 着剤テープの繰り出しが終了したら、 リールの回転方向を反転させてテープの供 給方向を反転させ、 又はリールの回転方向はそのままにしてリールを相互に交換 する。 これにより、 基材上の接着剤から順次一条分づっ加熱して回路基板に圧着 できるので、 テープの卷き数を増やすことなく、 1リールで使用できる接着剤量 を大幅に増やすことができる。  [0123] Further, similarly to the invention described in claim 29, when the feeding of the adhesive tape to the empty reel is completed, the rotation direction of the reel is reversed to change the tape supply direction. Reverse the reels or exchange the reels while keeping the rotation direction of the reels. This allows the adhesive on the base material to be heated one by one in sequence and then pressed onto the circuit board, so that the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of tape windings.
[ 0 1 2 3 ] また、 請求の範囲第 2 9項に記載の発明と同様に、 巻き数を増加 させることなく接着剤量を増加できるので、 卷き崩れを防止できるとともに、 接 着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる 等の効果を得ることができる。  [0 1 2 3] Further, similar to the invention described in claim 29, since the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent collapse of the winding and to reduce the amount of the adhesive. Effects such as prevention of blocking due to oozing and prevention of adverse effects due to elongation of the base material can be obtained.
【0 1 2 4】 テープ幅は 5 mn！〜 1 0 0 0 mmが好ましく、 回路基板に圧着す る接着剤は 0 . 5 mn！〜 1 · 5 mmが好ましい。 テープ幅を 5 mm〜 1 0 0 0 m mとしているのは、 テープ幅が 5 mm未満の場合には、 1リール当りにおける接 着剤の圧着回数が少なくなるとともに、 1 0 0 0 mmより大きくなると既存の接 着装置に装着できなくなるおそれがある為である。 [0 1 2 4] The tape width is 5 mn! ~ 100 mm is preferable, and the adhesive to be crimped to the circuit board is 0.5 mn! ~ 1.5 mm is preferred. Tape width from 5 mm to 100 m The reason for m is that if the tape width is less than 5 mm, the number of times the adhesive is crimped per reel will be reduced, and if it is more than 100 mm, it may not be possible to attach it to existing bonding equipment. Because there is.
【◦ 1 2 5】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 剤であってもよいし、 絶縁性接着剤のみであってもよいし、 これらの接着剤中に 絶縁性のスぺ一サ粒子を分散したものであってもよい。  [◦ 125] The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of these adhesives. It may be one in which insulating spacer particles are dispersed.
【0 1 2 6】 請求の範囲第 3 5項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に巻いた接着剤テープであって、 接着剤テープの幅は回路基板の一 辺の長さと同じ以上であり、 接着剤はテープの幅方向に複数条配置されているこ とを特徴とする。  [0126] The invention described in claim 35 is an adhesive tape in which an adhesive is applied to a base material and wound on a reel, wherein the width of the adhesive tape is a circuit board. The length of one side is equal to or longer than that of one side, and a plurality of adhesives are arranged in the width direction of the tape.
【0 1 2 7】 この請求の範囲第 3 5項に記載の発明では、 接着剤テープをその 幅が回路基板の一辺に重なるように配置し、 接着剤テープの幅方向に設けた接着 剤の一条をそのまま回路基板の一辺に沿って加熱加圧する。  [0127] In the invention according to claim 35, the adhesive tape is arranged so that the width thereof overlaps one side of the circuit board, and the adhesive tape provided in the width direction of the adhesive tape is provided. One strip is directly heated and pressed along one side of the circuit board.
【0 1 2 8】 接着剤テープの幅は回路基板の一辺の長さと同じ以上であるから、 接着剤テープは接着剤の条幅だけ引き出して用いればよい。  [0128] Since the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, the adhesive tape may be drawn out by the width of the adhesive and used.
【0 1 2 9】 そして、 回路基板の一辺に接着剤を圧着後、 回路基板を回して、 他辺を接着剤テープの幅方向に位置させ接着剤条を他辺に加熱加圧する。 このよ うにして、 順次回路基板の他辺にも接着剤を圧着すれば、 回路基板の四周に容易 に接着剤を圧着できる。  [0129] Then, after bonding the adhesive to one side of the circuit board, the circuit board is turned, and the other side is positioned in the width direction of the adhesive tape, and the adhesive strip is heated and pressed to the other side. In this way, if the adhesive is sequentially pressed on the other side of the circuit board, the adhesive can be easily pressed on the four circumferences of the circuit board.
【 0 1 3 0】 したがって、 回路基板の一辺の長さ以上を有する接着剤を順次一 条づっ使用するので、 一回の使用量は接着剤条の幅寸法分だけであるから、 接着 剤テープの卷き数を増やすことなく、 1リールで使用可能な接着剤量を大幅に増 やすことができる。  [0130] Therefore, the adhesive having the length of one side or more of the circuit board is sequentially used one by one, and the amount of use at one time is only the width of the adhesive strip. The amount of adhesive that can be used on one reel can be greatly increased without increasing the number of windings.
【 0 1 3 1】 しかも、 接着剤テープの卷き数を増やすことがないから、 卷き崩 れを防止できるとともに、 接着剤がテープの幅方向に染み出して巻かれているテ ープ同士が接着するブロヅキングを防止でき、 更に、 基材が長くなることにより 生じ易い基材の伸び等の弊害 （基材の損傷や切断） を防止できる。 [0 1 3 1] Moreover, since the number of windings of the adhesive tape is not increased, it is possible to prevent the tape from being broken and to prevent the adhesive from leaking out in the width direction of the tape and winding the tapes together. Can be prevented from sticking, and the base material becomes longer It is possible to prevent adverse effects such as elongation of the base material (damage or cutting of the base material) that easily occur.
【0132】 一方、 電子部品の製造工場では、 新しい接着剤テ一プの交換回数 が少なくて済むので、 製造効率が高まる。  [0132] On the other hand, in an electronic component manufacturing plant, the number of times of replacement of a new adhesive tape can be reduced, so that the manufacturing efficiency increases.
【0133】 また、 接着剤テープの製造においては、 1リ一ル当りの接着剤量 を多くできるので、 リール材ゃ湿気防止材の使用量を削減でき、 製造コストを低 減できる。  [0133] Further, in the production of the adhesive tape, the amount of the adhesive per reel can be increased, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
【0134】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 剤であってもよいし、 絶縁性接着剤のみであってもよいし、 それらの接着剤中に 絶縁性のスぺーサ粒子を分散したものであってもよい。  [0134] The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be only an insulating adhesive, or may be an insulating adhesive. May be dispersed.
【0135】 接着剤テープの幅は、 回路基板の一辺の寸法以上を有するから、 例えば、 5mm~3000mmである。 また、 回路基板の一辺の寸法を有しない 接着剤テープであっても接着剤テープの幅方向に複数条、 隣接配置することで回 路基板の一辺の寸法を有すればよい。 この場合、 異なる寸法の回路基板へも容易 に適応できるため生産効率を向上できる。 接着剤の一条の幅は、 例えば 0. 5m m〜 10. 0 mmである。  [0135] The width of the adhesive tape is equal to or greater than the dimension of one side of the circuit board, and is, for example, 5 mm to 3000 mm. In addition, even if the adhesive tape does not have the dimension of one side of the circuit board, it may have the dimension of one side of the circuit board by arranging a plurality of adjacent strips in the width direction of the adhesive tape. In this case, production efficiency can be improved because the circuit board can be easily adapted to circuit boards having different dimensions. The width of one strip of the adhesive is, for example, 0.5 mm to 10.0 mm.
【0136】 接着剤テープの幅を 5 mn！〜 3000mmとしているのは、 回路 基板の一辺の寸法が 5 mm未満である場合が少ないからであり、 3000mmよ り大きくなるとリ一ルの幅が広くなりすぎて、 既存の接着装置への装着ができな くなるおそれがある為である。  [0136] The width of the adhesive tape is 5 mn! The reason why it is set to 3000 mm is that the dimension of one side of the circuit board is less than 5 mm in many cases, and if it is larger than 3000 mm, the width of the reel becomes too wide, and it is difficult to mount it on existing bonding equipment. This is because it may not be possible.
【0137】 請求の範囲第 36項に記載された発明は、 請求の範囲第 35項に 記載された発明において、 複数条の接着剤は、 互いに隣合う接着剤条が間隔をあ けていることを特徴とする。  [0137] In the invention described in claim 36, in the invention described in claim 35, the plurality of adhesives are such that adhesives adjacent to each other are spaced apart from each other. It is characterized.
【0138】 この請求の範囲第 36項に記載の発明によれば、 請求の範囲第 3 5項に記載の発明と同様な作用効果を奏するとともに、 隣合う接着剤条同士が離 れているので、 接着剤を一条づっ容易に基材から引き離して圧着できる。  [0138] According to the invention described in claim 36, the same operation and effect as those of the invention described in claim 35 can be obtained, and the adjacent adhesive strips are separated from each other. The adhesive can be easily separated from the substrate one by one and pressed.
[0139】 請求の範囲第 37項に記載された発明は、 請求の範囲第 35項に 記載された発明において、 接着剤は、 テープの幅方向に形成したスリットにより 複数条に分離されていることを特徴とする。 [0139] The invention described in claim 37 is as claimed in claim 35. In the described invention, the adhesive is separated into a plurality of strips by slits formed in a width direction of the tape.
【0 1 4 0】 この請求の範囲第 3 7項に記載の発明によれば、 請求の範囲第 3 5項と同様な作用効果を奏するとともに、 接着剤テープは基材の片面全面に接着 剤を塗布して乾燥したものを用い、 接着剤を回路基板に圧着する直前に、 即ち、 接着剤テープの使用直前に切刃等により接着剤に切れ目を入れてスリットを形成 することが好ましい。  [0140] According to the invention set forth in claim 37, the same operation and effect as those in claim 35 can be obtained, and the adhesive tape is applied to the entire surface of one side of the base material. It is preferable that a slit is formed by cutting the adhesive with a cutting blade or the like immediately before the adhesive is pressed onto the circuit board, that is, immediately before the adhesive tape is used, using a dried and coated adhesive.
【0 1 4 1】 尚、 スリットは、 接着剤テープの製造時に、 切刃等で接着剤に切 れ目を入れてスリットを形成してもよいし、 切刃のほか、 レーザや電熱線等によ り形成するものであってもよい。  [0 1 4 1] Incidentally, the slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a laser or a heating wire other than the cutting blade may be used. It may be formed by
【0 1 4 2】 本発明によれば、 上に配置する接着剤条の条数を多くするこ とができるとともに、 テープの幅方向に接着剤を複数条配置する接着剤テープの 製造が容易である。  [0143] According to the present invention, it is possible to increase the number of adhesive strips arranged on the upper side and to easily manufacture an adhesive tape in which a plurality of adhesive strips are arranged in the width direction of the tape. It is.
【0 1 4 3】 請求の範囲第 3 8項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に卷いた接着剤テープの製造方法であって、 一方の基材の全面に接 着剤を塗布し、 次に接着剤にテープの幅方向に沿ってスリットを形成した後、 接 着剤面上に他方の基材を配置して一方及び他方の基材で接着剤を挟み、 次に一方 の基材と他方の基材とを互いに離して一方及び他方の基材のそれそれに複数条の 接着剤を交互に貼着することにより、 一方及び他方の基材に複数条の接着剤を間 隔をおいて配置したものを製造することを特徴とする。  [0145] The invention described in claim 38 is a method for manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, The adhesive is applied to the entire surface, and then a slit is formed in the adhesive along the width direction of the tape. Then, the other substrate is placed on the adhesive surface and the adhesive is applied to one and the other substrates. Then, one substrate and the other substrate are separated from each other, and a plurality of adhesives are alternately attached to those of the one and the other substrates, so that a plurality of adhesives are attached to the one and the other substrates. It is characterized in that it is manufactured by arranging strip adhesives at intervals.
【0 1 4 4】 この請求の範囲第 3 8項に記載の発明によれば、 既存設備を利用 して請求の範囲第 2項に記載の接着剤テープを同時に 2つ製造できるので、 製造 効率に優れる。  [0144] According to the invention described in claim 38, two adhesive tapes described in claim 2 can be simultaneously manufactured using existing equipment, so that manufacturing efficiency can be improved. Excellent.
【0 1 4 5】 請求の範囲第 3 9項に記載された発明は、 請求の範囲第 1項〜 3 のいずれかに記載の接着剤テープを回路基板上に配置し、 接着剤テープを幅方向 に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着し、 接着剤テ —プを幅方向に沿って加熱加圧することにより回路基板の一辺に接着剤条を圧着 することを特徴とする接着剤テープの圧着方法である。 この圧着方法では、 接着 剤テープを回路基板上に配置し、 接着剤テープを幅方向に沿って加熱加圧するこ とにより回路基板の一辺に接着剤条を圧着し、 次いで回路基板の位置を変えて回 路基板の他辺に接着剤テープをその幅方向に沿って加熱加圧することにより回路 基板の他辺に次の接着剤条を圧着することもできる。 [0145] The invention described in claim 39 is a method of disposing the adhesive tape according to any one of claims 1 to 3 on a circuit board, and the adhesive tape having a width. The adhesive strip is pressed against one side of the circuit board by applying heat and pressure along the direction. This is a method for crimping an adhesive tape, wherein an adhesive strip is crimped to one side of a circuit board by heating and pressing the tape along the width direction. In this crimping method, an adhesive tape is placed on a circuit board, the adhesive tape is heated and pressed along the width direction to press the adhesive strip on one side of the circuit board, and then the position of the circuit board is changed. The next adhesive strip can also be pressed on the other side of the circuit board by heating and pressing the adhesive tape along the width direction on the other side of the circuit board.
【0 1 4 6】 この請求の範囲第 3 9項に記載された発明によれば、 請求の範囲 第 3 5項〜 3 7のいずれかに記載の作用効果を得ることができるとともに、 接着 剤テープを接着装置に装着後、 回路基板の一辺を接着剤テープの幅方向に配置し て回路基板の一辺に接着剤を圧着し、 次に、 回路基板を例えば約 9 0度回して回 路基板の他の辺を接着剤テープの幅方向と平行に位置させ、 回路基板の他辺に接 着剤を圧着する。 このように、 回路基板を順次 9 0度回して接着剤を圧着するこ とにより、 回路基板の四周に接着剤を簡単に圧着でき、 電子部品の製造工場では 作業効率を向上できる。  [0146] According to the invention described in claim 39, the effects described in any of claims 35 to 37 can be obtained, and the adhesive can be used. After attaching the tape to the adhesive device, place one side of the circuit board in the width direction of the adhesive tape and crimp the adhesive to one side of the circuit board.Next, rotate the circuit board by about 90 degrees, for example, and turn the circuit board The other side is positioned parallel to the width direction of the adhesive tape, and the adhesive is pressed on the other side of the circuit board. In this way, by sequentially turning the circuit board by 90 degrees and pressing the adhesive, the adhesive can be easily pressed on the four circumferences of the circuit board, thereby improving work efficiency in an electronic component manufacturing plant.
【0 1 4 7】 請求の範囲第 4 0項に記載の発明は、 請求の範囲第 3 5項〜 3 7 のいずれかに記載の接着剤テープを回路基板を移動する搬送路に少なくとも 2つ 配置し、 一方の接着剤テープはその幅方向が搬送路に直交する方向に配置し、 他 方の接着剤テープはその幅方向を搬送路に沿う方向に配置し、 一方の接着剤テ一 プにおいて、 回路基板の対向する 2辺について接着剤テープを幅方向に沿って加 熱加圧することにより回路基板の対向する 2辺に接着剤条を圧着し、 次に回路基 板を他方の接着剤テープへ移動し、 回路基板の残りの 2辺について基材側から接 着剤テープを幅方向に沿って加熱加圧することにより、 回路基板の四周に接着剤 条を圧着することを特徴とする。  [0147] The invention described in claim 40 is that at least two adhesive tapes according to any one of claims 35 to 37 are provided on a transport path for moving a circuit board. One adhesive tape is placed in the direction perpendicular to the transport path, and the other adhesive tape is placed in the width direction along the transport path. In the above, the adhesive strip is pressed on the two opposing sides of the circuit board by heating and pressing the adhesive tape along the width direction on the two opposing sides of the circuit board, and then the circuit board is bonded to the other adhesive. The adhesive tape is crimped on the four circumferences of the circuit board by moving to the tape and heating and pressing the adhesive tape along the width direction from the base material side on the remaining two sides of the circuit board.
【0 1 4 8】 この請求の範囲第 4 0項に記載の発明によれば、 請求の範囲第 3 5項〜 3 7に記載の作用効果を得ることができるとともに、 回路基板を回転させ ることなく、 一方の接着剤テープと他方の接着剤テープとの位置に移動して、 そ JP2003/009694 れそれの位置で幅方向に沿って加熱加圧することにより、 回路基板の四周に容易 に接着剤を圧着でき作業効率が良い。 According to the invention described in claim 40, the effects described in claims 35 to 37 can be obtained, and the circuit board is rotated. Without moving to the position of one adhesive tape and the other adhesive tape. JP2003 / 009694 By applying heat and pressure in the width direction at the position, adhesive can be easily pressed on the four circumferences of the circuit board, resulting in good work efficiency.
【0 1 4 9】 請求の範囲第 4 1項に記載の発明は、 基材の片面全面に接着剤が 塗布され、 リール状に卷いた接着剤テープを用いて回路基板に接着剤を圧着する 接着剤テープの圧着方法であって、 接着剤テープの幅は回路基板の一辺の長さ以 上を有しており、 接着剤テープの幅方向における接着剤の一部を幅方向に加熱加 圧することにより加熱した部分の接着剤の凝集力を低下させつつ回路基板に接着 剤を圧着することを特徴とする。  [0149] According to the invention set forth in claim 41, the adhesive is applied to the entire surface of one side of the base material, and the adhesive is pressure-bonded to the circuit board using an adhesive tape wound in a reel shape. An adhesive tape crimping method in which the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed in the width direction. In this way, the adhesive is pressed onto the circuit board while reducing the cohesive force of the adhesive in the heated portion.
【0 1 5 0】 この請求の範囲第 4 1項に記載の発明によれば、 回路基板の周囲 に接着剤を圧着する場合には、 接着装置に接着剤テープを装着し、 幅方向に沿つ て接着剤テープを加熱加圧することにより、その部分の凝集力が低下し（以下「凝 集力低下ライン」という）、凝集力低下ラインから加熱した部分の接着剤が基材か ら離れて回路基板に圧着される。 次に、 回路基板を約 9 0度回転して、 隣の辺を 接着剤テープの幅方向に位置させ、幅方向に沿って次の接着剤条を加熱加圧して、 接着剤条を隣の辺に接着剤を圧着する。 このようにして、 順次回路基板の四辺に 接着剤を圧着することができ、 作業効率が良い。  [0150] According to the invention set forth in claim 41, when the adhesive is pressure-bonded to the periphery of the circuit board, an adhesive tape is attached to the bonding device, and the adhesive tape is attached along the width direction. When the adhesive tape is heated and pressurized, the cohesive strength of that part is reduced (hereinafter referred to as the “cohesive strength reduction line”), and the adhesive of the heated part from the cohesive strength reduction line separates from the base material. It is crimped to the circuit board. Next, rotate the circuit board by about 90 degrees, position the adjacent side in the width direction of the adhesive tape, and heat and press the next adhesive strip along the width direction to place the adhesive strip next to the adhesive strip. Press the adhesive on the sides. In this way, the adhesive can be sequentially pressed on the four sides of the circuit board, and the working efficiency is good.
【0 1 5 1】 また、接着剤テープ はその全面に接着剤を塗布すればよいので、 既存設備をそのまま用いて接着剤テープを製造できる。  [0155] Also, since the adhesive tape may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
【0 1 5 2】 更に、 回路基板に圧着する接着剤の幅は、 加熱加圧領域を変える ことにより任意に設定でき、 圧着する接着剤幅の自由度が高い。  [0155] Furthermore, the width of the adhesive to be pressed onto the circuit board can be arbitrarily set by changing the heating and pressing area, and the degree of freedom of the width of the adhesive to be pressed is high.
【0 1 5 3】 また、 請求の範囲第 3 5項に記載の発明と同様に、 巻き数を増加 させることなく接着剤量を増加できるので、 卷き崩れを防止できるとともに、 接 着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる 等の効果を得ることができる。  [0153] Further, similarly to the invention described in claim 35, since the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding and to reduce the amount of the adhesive. Effects such as prevention of blocking due to oozing and prevention of adverse effects due to elongation of the base material can be obtained.
【0 1 5 4】 請求の範囲第 4 2項に記載された発明は、 一方のリールと、 他方 のリールと、 これらのリールを回転自在に保持しつつ収納するケースとを備え、 一方のリ一ルには基材に接着剤が塗布された接着剤テープが卷かれており、 他方 のリールには接着剤テープの一端が固定されており、 接着剤テープにはテープの 長手方向に沿って接着剤が少なくとも 2条配置されていることを特徴とする。 【0 1 5 5】 この請求の範囲第 4 2項に記載の発明では、 接着剤テープカセヅ トを接着装置に装着し、 接着剤テープの幅方向に少なくとも 2条で長手方向に沿 つて形成された接着剤の一条を回路基板の一辺に重なるように配置し、 基材側か ら加熱加圧して一条の接着剤を回路基板に圧着する。 このように接着剤を順次回 路基板に圧着していき、 一方のリールから接着剤テープを順次繰り出していくと ともに、 他方のリールに残りの一条の接着剤が塗布されている接着剤テ一プを卷 き取っていく。 そして、 一方のリールに巻かれた接着剤テープが終了したところ で、 カセットを裏返して圧着装置に再度装着する。 [0154] The invention described in claim 42 includes one reel, the other reel, and a case for housing these reels while holding them rotatably. One of the reels has an adhesive tape coated with an adhesive applied to a base material, the other reel has one end of the adhesive tape fixed thereto, and the adhesive tape has a longitudinal direction of the tape. Characterized in that at least two lines of adhesive are arranged along the line. [0155] In the invention according to claim 42, the adhesive tape cassette is mounted on the bonding device, and is formed along the longitudinal direction with at least two in the width direction of the adhesive tape. One piece of the adhesive is arranged so as to overlap one side of the circuit board, and the one piece of the adhesive is pressed onto the circuit board by applying heat and pressure from the substrate side. In this manner, the adhesive is sequentially pressed on the circuit board, the adhesive tape is sequentially fed out from one of the reels, and the adhesive tape on which the other adhesive is applied to the other reel. And wind up. Then, when the adhesive tape wound on one of the reels is completed, the cassette is turned over and mounted on the crimping device again.
【0 1 5 6】 これにより、 一方のリールと他方のリールとが入れ替わるので、 今度は他方のリールから接着剤テープを繰り出して残っている、 さらに、 一条の 接着剤の圧着を行う。  [0156] As a result, one of the reels and the other reel are exchanged, so that the adhesive tape is fed out from the other reel, and further, a single adhesive is pressed.
【0 1 5 7】 接着剤テープに接着剤が 2条以上に形成されている場合、 幅方向 の位置を変えて順番に、 または、 間隔をおいて圧着を行うこともできる。  [0157] When the adhesive tape is formed with two or more adhesives on the adhesive tape, the pressure bonding can be performed sequentially or at intervals by changing the position in the width direction.
【0 1 5 8】 このように、 本発明では、 接着剤シートには、 接着剤を幅方向に 少なくとも 2条並べてあり、 一条づっ使用するものであるから、 少なくとも 1リ —ルで 2リール分使用でき、 接着剤テープの卷き数を増やすことなく、 1リール で使用可能な接着剤量を 2倍以上に增やすことができる。  [0158] As described above, in the present invention, at least two lines of the adhesive are arranged in the width direction in the adhesive sheet, and the adhesive is used one by one. It can be used, and the amount of adhesive that can be used on one reel can be more than doubled without increasing the number of turns of adhesive tape.
【0 1 5 9】 しかも、 接着剤テープの卷き数を増やすことがないから、 巻き崩 れを防止できるとともに、 接着剤がテープの幅方向に染み出して、 巻かれている テープ同士が接着するブロッキングを防止でき、 更に、 基材が長くなることによ り生じ易い基材の伸び等の弊害 （基材の損傷や切断） を防止できる。  [0 1 5 9] Moreover, since the number of windings of the adhesive tape is not increased, the winding can be prevented from being broken, and the adhesive oozes out in the width direction of the tape, and the wound tapes adhere to each other. In addition, adverse effects such as elongation of the base material (damage or breakage of the base material), which are likely to occur due to the elongation of the base material, can be prevented.
【0 1 6 0】 一方、 接着剤が 2条に形成されている場合、 電子部品の製造工場 では、 1リール分 （1条の接着剤） の使用が終了したところで、 カセットを裏返 すだけなので、 次の装着が容易である。 [0160] On the other hand, if the adhesive is formed in two strips, the electronic component manufacturing factory turns over the cassette when the use of one reel (one strip of adhesive) is completed. It is easy to install the next.
【0 1 6 1】 また、 接着剤テープをカセヅトにしてあるので、 接着装置におい て接着剤テープをリールへ取り付ける手間がかからず、 接着装置にカセットを装 着するだけであるから取扱い易く、 且つ取り付けや交換の作業性が良い。  [0166] Also, since the adhesive tape is used as a cassette, there is no need to attach the adhesive tape to the reel in the bonding device, and it is easy to handle since only the cassette is mounted on the bonding device. Also, the workability of installation and replacement is good.
【0 1 6 2】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 剤であってもよいし、 絶縁性接着剤のみであってもよいし、 それらの接着剤中に 絶縁性のスぺ一サ粒子を分散したものであってもよい。  [0166] The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be any of those adhesives. It may be one in which insulating spacer particles are dispersed.
【0 1 6 3】 請求の範囲第 4 3項に記載された発明は、 請求の範囲第 4 2項に 記載された発明において、 複数条の接着剤は、 互いに隣合う接着剤条が間隔をあ けていることを特徴とする。  [0166] The invention described in claim 43 is the invention described in claim 42, wherein a plurality of adhesives are arranged such that adjacent adhesives are spaced apart from each other. It is characterized by opening.
【0 1 6 4】 この請求の範囲第 4 3項に記載の発明によれば、 請求の範囲第 4 2項に記載の発明と同様な作用効果を奏するとともに、 隣合う接着剤条同士が離 れているので、 接着剤を一条づっ容易に基材から引き離して圧着できる。  According to the invention set forth in claim 43, the same operation and effect as those of the invention set forth in claim 42 are obtained, and the adjacent adhesive strips are separated from each other. As a result, the adhesive can be easily separated from the substrate one by one and pressed.
【0 1 6 5】 請求の範囲第 4 4項に記載された発明は、 請求の範囲第 4 2項に 記載された発明において、 接着剤は、 テープの幅方向に形成したスリットにより 複数条に分離されていることを特徴とする。  [0165] The invention described in claim 44 is the invention described in claim 42, wherein the adhesive is formed into a plurality of strips by slits formed in the width direction of the tape. It is characterized by being separated.
【0 1 6 6】 この請求の範囲第 4 4項に記載の発明によれば、 請求の範囲第 4 2項と同様な作用効果を奏するとともに、 接着剤テープは基材の片面全面に接着 剤を塗布して乾燥したものを用い、 接着剤を回路基板に圧着する直前に、 即ち、 接着剤テープの使用直前に切刃等により接着剤に切れ目を入れてスリットを形成 することが好ましい。  [0166] According to the invention set forth in claim 44, the same operation and effect as those of claim 42 are exhibited, and the adhesive tape is applied to the entire surface of one side of the base material. It is preferable that a slit is formed by cutting the adhesive with a cutting blade or the like immediately before the adhesive is pressed onto the circuit board, that is, immediately before the adhesive tape is used, using a dried and coated adhesive.
【0 1 6 7】 尚、 スリットは、 接着剤テープの製造時に、 切刃等で接着剤に切 れ目を入れてスリットを形成してもよいし、 切刃のほか、 レーザや電熱線等によ り形成するものであってもよい。  [0 1 6 7] The slit may be formed by making a cut in the adhesive with a cutting blade or the like at the time of manufacturing the adhesive tape, or a slit or a laser or a heating wire may be used. May be formed.
【0 1 6 8】 請求の範囲第 4 5項に記載された発明は、 一方のリールと、 他方 のリールと、 これらのリールを回転自在に保持しつつ収納するケースとを備え、 一方のリ一ルには基材に接着剤が塗布された接着剤テープが卷かれており、 他方 のリ一ルには接着剤テープの一端が固定されている接着剤テープカセットを圧着 装置に装着し、 接着剤テープを接着剤テープカセヅトから回路 板上に引き出し て、 接着剤テープの幅方向の一部を加熱加圧することにより、 加熱した部分の接 着剤の凝集力を低下させて幅方向の一部の接着剤を回路基板に圧着することを特 徴とする。 [0166] The invention described in claim 45 includes one reel, the other reel, and a case for rotatably holding and storing these reels, One reel has an adhesive tape coated with an adhesive applied to a base material, and the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device. Attach, pull out the adhesive tape from the adhesive tape cassette onto the circuit board, and apply heat and pressure to a part of the adhesive tape in the width direction to reduce the cohesive force of the adhesive in the heated part and reduce the width in the width direction. It is characterized in that a part of the adhesive is pressed onto the circuit board.
【0 1 6 9】 この請求の範囲第 4 5項に記載の発明によれば、 接着剤テープに おいて幅方向の一部を加熱加圧することにより、 その部分の接着剤の凝集力が低 下し（以下「凝集力低下ライン」という）、 凝集力低下ラインから加熱した部分の 接着剤が基材から離れて回路基板に圧着される。  According to the invention as set forth in claim 45, by heating and pressing a part of the adhesive tape in the width direction, the cohesive force of the adhesive in the part is reduced. (Hereinafter referred to as “cohesive strength reduction line”), and the adhesive in the portion heated from the cohesive strength reduction line is separated from the base material and pressed onto the circuit board.
【0 1 7 0】 本発明では、 接着剤テープには基材の全面に接着剤を塗布すれば よいので、 既存設備をそのまま用いて接着剤テープを製造できる。  [0170] In the present invention, the adhesive tape may be applied to the entire surface of the base material, so that the existing equipment can be used as it is to manufacture the adhesive tape.
【0 1 7 1】 更に、 回路基板に圧着する接着剤の幅は、 加熱加圧領域を変える ことにより任意に設定でき、 圧着する接着剤幅の自由度が高い。  [0177] Furthermore, the width of the adhesive to be bonded to the circuit board can be arbitrarily set by changing the heating / pressing area, and the width of the adhesive to be bonded is high.
【0 1 7 2】 請求の範囲第 4 6項に記載された発明は、 一方のリールと、 他方 のリールと、 これらのリールを回転自在に保持しつつ収納するケースとを備え、 一方のリ一ルには基材に接着剤が塗布された接着剤テープが卷かれており、 他方 のリールには接着剤テープの一端が固定されている接着剤テープカセットを圧着 装置に装着し、 接着剤テープを接着剤テープカセヅトから回路基板上に引き出 して、 接着剤テープの幅方向の一部を加熱加圧することにより、 加熱した部分の 接着剤の凝集力を低下させて幅方向の一部の接着剤を回路基板に圧着し、 一方の リ一ルに巻かれた接着剤テープが終了したら接着剤テープカセットを裏返して残 り部分の接着剤を回路基板に圧着することを特徴とする接着剤テープカセットを 用レ、た接着剤の圧着方法である。  [0177] The invention described in claim 46 includes one reel, the other reel, and a case for rotatably holding and storing these reels. One of the reels has an adhesive tape coated with an adhesive applied to a base material, and the other reel has an adhesive tape cassette in which one end of the adhesive tape is fixed to a crimping device. The tape is pulled out of the adhesive tape cassette onto the circuit board, and a part of the adhesive tape in the width direction is heated and pressurized to reduce the cohesive force of the adhesive in the heated part and reduce the part of the width in the width direction. The adhesive is pressure-bonded to the circuit board, and when the adhesive tape wound around one of the reels is completed, the adhesive tape cassette is turned over and the remaining adhesive is pressure-bonded to the circuit board. Use tape cassette, glue A crimping method.
【0 1 7 3】 この請求の範囲第 4 6項に記載の発明によれば、 請求の範囲第 4 5項と同様な作用効果を奏するとともに、 一方のリールに巻かれた接着剤テープ 2003/009694 が終了したところで、 カセットを裏返して圧着装置に再度装着し、 残り部分の接 着剤を回路基板に圧着するので、 請求項 1に記載の発明と同様に、 卷き数を増加 させることなく接着剤量を増加でき、 卷き崩れを防止できるとともに、 接着剤の 染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる等の効 果を得ることができる。 更に、 電子部品の製造工場では、 1リール分 （一条分の 接着剤） の使用が終了したところで、 カセットを裏返すだけなので、 次の装着が 容易である。 カセットにしてあるから、 取扱い易く、 且つ取り付けや交換の作業 性が良い。 [0177] According to the invention set forth in Claim 46, the same operation and effect as those of Claim 45 are exhibited, and the adhesive tape wound on one of the reels is provided. At the end of 2003/009694, the cassette is turned upside down and mounted again on the crimping device, and the remaining adhesive is crimped on the circuit board, so that the number of windings is increased in the same manner as in the invention of claim 1. It is possible to obtain an effect that the amount of the adhesive can be increased without any breakage, the crushing of the adhesive can be prevented, the blocking due to the exudation of the adhesive and the adverse effect due to the extension of the base material can be prevented. Furthermore, in an electronic component manufacturing plant, when the use of one reel (one strip of adhesive) has been completed, the cassette is simply turned over, so the next installation is easy. Since it is a cassette, it is easy to handle and easy to install and replace.
【0 1 7 4】 請求の範囲第 4 7項に記載された発明は、 基材に塗布され、 リー ル状に巻いた接着剤テープであって、 基材は熱溶融剤層及び支持層を備えている ことを特徴とする。  The invention described in claim 47 is an adhesive tape applied to a base material and wound in a reel shape, wherein the base material has a hot-melt agent layer and a support layer. It is characterized by having.
【0 1 7 5】 この請求の範囲第 4 7項に記載の発明では、 接着材テープの使用 時には、 接着材テープを巻き取つたリ一ルと空のリールとを接着装置に装着し、 回路基板に接着材を加熱加圧した後に、 基材を空のリ一ルに卷き取るように装着 する。 そして、 卷き出しが終了した一方のリールに卷いた一方の接着材テープの 終端部と新たな他方のリールに卷いた他方の接着材テープの始端部とを重ね合わ せ又は突き合わせ、 かかる部分を加熱し、 熱溶融剤層を溶融させた後、 冷却によ り熱溶融剤が固化することで、 接着材テープ同士を接続する。  In the invention according to claim 47, when the adhesive tape is used, the reel on which the adhesive tape has been wound and the empty reel are mounted on an adhesive device, and a circuit is mounted. After heating and pressing the adhesive on the substrate, the substrate is mounted so as to be wound up on an empty reel. Then, the end of one adhesive tape wound on one reel where the unwinding is completed and the start end of the other adhesive tape wound on another new reel are overlapped or abutted, and such a portion is heated. Then, after the hot-melt agent layer is melted, the hot-melt agent is solidified by cooling, so that the adhesive tapes are connected to each other.
【0 1 7 6】 接着材テープの基材を利用して、 卷き出しの終了した接着材テ一 プの終端部と新たに装着する接着材テープの始端部とを接着して、 接着材リール の交換を行うので、 接着装置への新たな接着材リールの装着が簡単にできる。 ま た、 新たな接着材リールの交換毎に卷取りリールの交換や新規接着材の始端を卷 取りリールに取り付けたり、ガイドビンに卷き付けたりする作業が必要ないので、 新しい接着材リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。 [0176] Using the base material of the adhesive tape, the end of the unwound adhesive tape and the starting end of the newly-attached adhesive tape are bonded to each other. Since the reel is replaced, it is easy to mount a new adhesive reel on the bonding machine. In addition, there is no need to replace the take-up reel, attach the starting end of the new adhesive to the take-up reel, or wind it on the guide bin every time a new adhesive reel is replaced. The replacement time is short, and the production efficiency of electronic equipment is increased.
【0 1 7 7】 接続部分の加熱圧着は、 接着材リ一ルを装着する接着装置の加熱 加圧へッドを用いれば、 接着装置を合理的に利用することができる。 【0 1 7 8】 請求の範囲第 4 8項に記載された発明は、 請求の範囲第 1項に記 載の発明において、 支持層が熱溶融剤層に挾まれていることを特徴とする。[0177] For the heating and press-bonding of the connection portion, the bonding device can be used rationally by using the heating and pressing head of the bonding device for mounting the adhesive reel. [0178] The invention described in claim 48 is characterized in that, in the invention described in claim 1, the support layer is sandwiched between the hot melt layers. .
【0 1 7 9】 この請求の範囲第 4 8項に記載の発明によれば、 請求の範囲第 1 項に記載の発明と同様な作用効果を奏するとともに、 熱溶融剤層が基材の表面に あるので、 一方の接着材テープの終端部の熱溶融剤層に始端部の接着剤面を重ね 合わせ、 かかる部分を加熱圧着して両者を接続でき、 接続が簡単である。 また、 熱溶融剤層はテープの長手方向の全体に渡り形成されているので、 重ね合わせ長 さを厳密に位置決めする必要がなく、 接続の自由度が高い。 [0179] According to the invention described in claim 48, the same function and effect as the invention described in claim 1 can be obtained, and the hot-melt agent layer is formed on the surface of the base material. Therefore, the adhesive surface at the start end is superimposed on the hot-melt agent layer at the end of one adhesive tape, and such a portion can be heated and pressed to connect the two, and the connection is simple. In addition, since the hot-melt agent layer is formed over the entire length of the tape, it is not necessary to strictly determine the overlapping length, and the degree of freedom of connection is high.
【0 1 8 0】 請求の範囲第 4 9項に記載された発明は、 請求の範囲第 1項記載 の発明において、 熱溶融剤層が支持層に挟まれていることを特徴とする。  [0180] The invention described in claim 49 is characterized in that, in the invention described in claim 1, the hot-melt agent layer is interposed between the support layers.
【0 1 8 1】 この請求の範囲第 4 9項に記載の発明によれば、 請求の範囲第 4 7項に記載の発明と同様な作用効果を奏するとともに、 接着材テープ同士を接続 するには、 一方の接着材テープの終端部と他方の接着材テープの始端部とを突き 合わせた位置で、 接着装置の加熱加圧へッドで加熱する。 加熱すると熱溶融剤が 溶けて染み出し、 冷却により熱溶融剤が固化することで、 接着材テープ同士が接 続する。 この場合、 熱溶融剤層が支持層に挟まれているので、 溶融剤層が外気に さらされて、 湿気の吸湿ゃ麈等の付着による熱溶融剤層の接着強度が低下するこ とを防止できる。  According to the invention described in claim 49, the same operation and effect as those of the invention described in claim 47 can be obtained, and the adhesive tapes can be connected to each other. Is heated by a heating and pressing head of the bonding apparatus at a position where the end of one adhesive tape and the start of the other adhesive tape are abutted. When heated, the hot melt dissolves and exudes, and upon cooling, the hot melt solidifies, so that the adhesive tapes are connected. In this case, since the hot-melt layer is sandwiched between the support layers, it is possible to prevent the hot-melt layer from being exposed to the outside air and reducing the adhesive strength of the hot-melt layer by adhesion of moisture and dust. it can.
【0 1 8 2】 請求の範囲第 5 0項に記載された発明は、 一方のリールに巻いた 一方の接着材テープと他方のリールに卷いた他方の接着材テープとを接続する接 着材テープの接続方法であって、 接着材テープは離型剤で表面処理した基材と接 着剤とを備え、 いずれか一方の接着材テープの基材端部の離型剤を除去し、 その 部分に他方の接着材テープの接着剤面を重ね合わせ、 両者の重ね合わせ部分を加 熱圧着して接続することを特徴とする。  [0187] The invention described in claim 50 is a bonding material for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel. A method of connecting tapes, wherein the adhesive tape includes a base material surface-treated with a release agent and an adhesive, and the release agent at the end of the base material of one of the adhesive tapes is removed. It is characterized in that the adhesive surface of the other adhesive tape is superimposed on the part, and the two superposed parts are connected by thermocompression bonding.
【0 1 8 3】 この請求の範囲第 5 0項に記載の発明では、 いずれか一方の接着 材テープの基材面と他方の接着材テープの接着剤面を重ね合わせ、 重ね合わせ部 分を加熱圧着して、 卷き出しの終了した接着材テープの終端部と新たに装着する 接着材テープの始端部とを接続し、 接着材リールの交換を行うので、 接着装置へ の新たな接着材リ一ルの装着が簡単にできる。 In the invention described in claim 50, the base material surface of one of the adhesive tapes and the adhesive surface of the other adhesive tape are overlapped with each other, Then, the end of the unwound adhesive tape is connected to the start of the newly installed adhesive tape, and the adhesive reel is replaced. Adhesive reel can be easily installed.
【0 1 8 4】 新たな接着材リールの交換毎に卷取りリ一ルの交換や新規接着材 テープの始端を卷取りリールに取り付ける作業、 所定の経路にガイドビン等を設 定する作業が必要ないので、 新しい接着材リールの交換時間が少なくて済み、 電 子機器の生産効率が高まる。  [0 1 8 4] Every time a new adhesive reel is replaced, the winding reel must be replaced, the starting end of the new adhesive tape must be attached to the winding reel, and the guide bin must be set in a predetermined path. Since it is not necessary, the replacement time of a new adhesive reel is reduced and the production efficiency of electronic equipment is increased.
【0 1 8 5】 また、 基材の表面には接着材テ一プをリールに卷いた状態におい て、 接着剤面と基材面とが接着しないように、 基材の表面には離型剤が施されて いる。 本発明では、 一方の接着材テープの離型剤を除去し、 その部分に他方の接 着材テープの接着剤面を重ね合わせて接着するので、 接着材テープ同士の接続が 簡単である。  [0185] Further, in a state where an adhesive tape is wound around a reel on the surface of the base material, the surface of the base material is released from the mold so that the adhesive surface and the base material surface do not adhere to each other. Agent has been applied. In the present invention, since the release agent of one adhesive tape is removed and the adhesive surface of the other adhesive tape is overlapped and adhered to that part, the connection between the adhesive tapes is simple.
【0 1 8 6】 接続部分の加熱圧着は、 接着材リールを装着する接着装置の加熱 加圧へッドを用いれば、 接着装置を合理的に利用することができる。  [0186] For the heat press bonding of the connection portion, the bonding device can be used rationally by using the heating and pressurizing head of the bonding device for mounting the adhesive material reel.
【0 1 8 7】 請求の範囲第 5 1項に記載された発明は、 請求の範囲第 5 0項に 記載の発明において、 離型剤の除去は、 プラズマ放電、 紫外線照射、 レーザ照射 の何れか 1つにより行うことを特徴とする。  [0187] The invention described in claim 51 is the invention according to claim 50, wherein the release agent is removed by any of plasma discharge, ultraviolet irradiation, and laser irradiation. It is characterized by one or more.
【0 1 8 8】 この請求の範囲第 5 1項に記載の発明によれば、 請求の範囲第 5 0項に記載の発明と同様な作用効果を奏するとともに、 プラズマ放電、 紫外線照 射、 レーザ照射の何れか一つの方法を用いて離型剤を除去するので、 手を用いて 剥ぎ取る場合に比べて離型剤の除去を正確且つ短時間で行うことができる。 According to the invention described in claim 51, the same operation and effect as those of the invention described in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, laser Since the release agent is removed by using any one of the irradiation methods, the release agent can be removed more accurately and in a shorter time than when the release agent is peeled off by hand.
【0 1 8 9】 離型剤の除去方法として、 プラズマ放電を用いた場合には、 ブラ ズマ状態にしたガスを分解させ、 反応しやすい状態 (励起状態）として、 基材の表 面に放電を行うことで離型剤を除去する。 また、 紫外線照射の場合には、 例えば 水銀ランプを光源として使用し、 水銀ランプから一定時間紫外線を照射すること により行う。 さらに、 レ一ザ照射の場合には、 レーザ発振器により照射されたレ 2003/009694 一ザ光により離型剤が加熱されて溶け、 離型剤が除去される。 [0189] When plasma discharge is used as a method for removing the release agent, the gas in the plasma state is decomposed, and the gas is discharged to the surface of the base material in a state in which it is easy to react (excitation state). To remove the release agent. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and irradiation is performed from the mercury lamp for a certain period of time. Furthermore, in the case of laser irradiation, the laser irradiated by the laser oscillator 2003/009694 The release agent is heated and melted by the light, and the release agent is removed.
【0 1 9 0】 請求の範囲第 5 2項に記載された発明は、 電極接続用の接着剤が 基材に塗布された、接着材テ一プをリールに巻いた接着材テープリールであって、 接着材テープリールはテープの幅方向に接着材テープの巻き部を複数設けたこと を特徴とする。  [0190] The invention described in claim 52 is an adhesive tape reel in which an adhesive tape is wound around a reel, the adhesive for electrode connection being applied to a base material. The adhesive tape reel is characterized in that a plurality of winding portions of the adhesive tape are provided in the width direction of the tape.
【0 1 9 1】 この請求の範囲第 5 2項に記載の発明では、 接着材テープの卷き 部 （巻き部） を複数設けたので、 複数の卷き部のうち、 一方の卷き部に巻かれた 接着材テープの卷き出しが終了すると、 卷き出しの終了した卷き部の隣に配置し た他方の巻き部の接着材テ一プを卷取りリールに取り付ける。  [0191] In the invention described in claim 52, since a plurality of winding portions (winding portions) of the adhesive tape are provided, one of the winding portions among the plurality of winding portions is provided. When the unwinding of the adhesive tape wound on the tape is completed, the adhesive tape of the other winding part arranged next to the unwound winding part is attached to the take-up reel.
【0 1 9 2】 このように、 一方の接着材テープの卷き出しが終了すると、 他方 の接着材テ一プを卷取りリールに取り付けて、 接着材テープの交換を行うので、 接着装置への新たな接着材テープリールの装着が不要である。 従って、 新たな接 着材テ一プリ一ルの交換作業が少なくて済み、 電子機器の生産効率が高まる。 [0192] As described above, when the unwinding of one adhesive tape is completed, the other adhesive tape is attached to the take-up reel, and the adhesive tape is exchanged. It is not necessary to install a new adhesive tape reel. Therefore, the replacement work of a new adhesive tape table is reduced, and the production efficiency of electronic equipment is improved.
【0 1 9 3】 複数の巻き部に巻かれた接着材テープを順次使用できるので、 1 つの接着材テープリールあたりの接着材テープの巻き数を増やすことなく、 1回 の交換作業で使用可能な接着剤量を大幅に増やすことができる。 また、 接着材テ 一プの卷き数を増やすことがないから、 卷き崩れを防止できるとともに、 接着剤 がテープの幅方向に染み出して卷いた接着材テープ同士が接着するいわゆるプロ ヅキングを防止でき、 さらに基材が長くなることで生じ易い基材の伸び等の弊害 を防止できる。 [0 1 9 3] Adhesive tape wound on multiple winding sections can be used sequentially, so it can be used in one exchange work without increasing the number of adhesive tape turns per adhesive tape reel It is possible to greatly increase the amount of adhesive required. In addition, since the number of windings of the adhesive tape is not increased, it is possible to prevent collapse of the tape and to prevent so-called blocking, in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. In addition, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur when the base material is elongated.
【0 1 9 4】 請求の範囲第 5 3項に記載された発明は、 請求の範囲第 5 2項記. 載の発明において、 一方の接着材テープの終端部と他方の接着材テープの始端部 との間には両者を接続する連結テープを備えており、 一方の接着材テープの卷き 出しが終了すると、 続いて他方の接着材テープの繰り出しが開始されることを特 徴とする。  [0194] The invention described in claim 53 is the invention described in claim 52. In the invention described in claim 52, the end of one adhesive tape and the start of the other adhesive tape are provided. A connection tape for connecting the two is provided between the first and second parts, and when the unwinding of one adhesive tape is completed, the unwinding of the other adhesive tape is started.
【0 1 9 5】 この請求の範囲第 5 3項に記載の発明によれば、 請求の範囲第 5 2項に記載の発明と同様な作用効果を奏するとともに、 一方の接着材テ一プの終 端部と他方の接着材テープの始端部とが、 連結テープで接続されているので、 一 方の巻き部の接着材テープの卷き出しが終了した後、 他方の卷き部の接着材テ一 プを卷取りリールに取り付ける作業が不要となり、 電子機器の生産効率がさらに[0196] According to the invention described in claim 53, claim 5 In addition to providing the same operation and effect as the invention described in paragraph 2, the end end of one adhesive tape and the start end of the other adhesive tape are connected by a connecting tape, so that After the unwinding of the adhesive tape of the winding part is completed, the work of attaching the adhesive tape of the other winding part to the take-up reel becomes unnecessary, and the production efficiency of electronic equipment is further improved.
[¾ る。 [¾
【0 1 9 6】 請求の範囲第 5 4項に記載された発明は、 請求の範囲第 5 3項に 記載の接着材テープリールと、 接着材テープの卷取りリールと、 接着材テ一プリ 一ルと卷取りリールとの間に設けられ且つ加熱加圧へヅドで接着材テープの接着 材を電子機器の回路基板に圧着する圧着部と、 連結テープを検知するテープ検知 手段とを備えた接着装置であって、 テープ検知手段が連結テープを検知した場合 には、 連結テープが圧着部を通過するまで連結テープを卷取りリールに巻き取る ことを特徴とする。  [0196] The invention described in claim 54 is the adhesive tape reel described in claim 53, a winding reel of the adhesive tape, and an adhesive tape. A crimping portion provided between the reel and the take-up reel and for crimping the adhesive of the adhesive tape to the circuit board of the electronic device by a heating and pressing head; and a tape detecting means for detecting the coupling tape. Wherein when the tape detecting means detects the connection tape, the connection tape is wound on a take-up reel until the connection tape passes through the crimping portion.
【0 1 9 7】 この請求の範囲第 5 4項に記載の発明によれば、 連結テープは自 動的に卷取りリールに卷き取られるので、 一方の卷き部の接着材テープが終了し た後に、 順次、 次の卷き部から接着材テープを繰り出すことができる。  [0196] According to the invention set forth in claim 54, the connecting tape is automatically wound on the take-up reel, so that the adhesive tape on one of the winding portions is terminated. After that, the adhesive tape can be sequentially fed out from the next winding portion.
【0 1 9 8】 また、 連結テープをテープ検知手段が検知すると、 連結テープが 圧着部を通過するまで、 連結テープを自動的に卷取りリ一ルに巻き取るので、 卷 取りの手間を省くことができる。  [0198] When the tape detecting means detects the connecting tape, the connecting tape is automatically wound on the winding reel until the connecting tape passes through the crimping portion, so that the time and effort for winding can be reduced. be able to.
【0 1 9 9】 尚、 テープ検知手段としては例えば接着装置に一対の発光部と受 光部とを備え、 連結テープを光学的に検知するものである。 一方、 連結テープの 両端には色を付した （例えば黒） マークを設けており、 発光部から発したレーザ 光により連結テープの両端のマークを受光部が検知することで連結テープを判断 している。 また連結テープにマークを付する他、 連結テープの幅を接着材テープ の幅とは異なる幅にする方法、 連結テープに複数の孔を形成する方法であっても 良い。  [0199] Incidentally, as the tape detecting means, for example, an adhesive device is provided with a pair of light emitting portions and a light receiving portion, and the connecting tape is optically detected. On the other hand, colored (for example, black) marks are provided at both ends of the connecting tape, and the light receiving unit detects the marks at both ends of the connecting tape by the laser beam emitted from the light emitting unit to determine the connecting tape. I have. In addition to marking the connection tape, a method of making the width of the connection tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connection tape may be used.
【0 2 0 0】 請求の範囲第 5 9項に記載された発明は、 一方のリールと、 他方 のリールと、 一方のリールと他方のリールの回転を連動するギアユニットと、 こ れらを収納するケースと、 ケースの開口部に配置した加熱部材と、 加熱部材に電 力を供給する電源手段とを備える接着具であって、 一方のリールには基材に接着 剤が塗布された接着剤テープが巻かれており、 他方のリールには接着剤テープの 一端が固定されており、 加熱部材は供給された電力により発熱する電熱部材を備 え、 一方のリールに卷かれた接着剤テープをケースの開口部に引き出して、 加熱 部材で開口部にある接着剤テープを基材側から加熱加圧することにより接着剤を 回路基板に圧着し、 接着剤が剥がれた基材を他方のリ一ルで卷き取ることを特徴 とする。 [0200] The invention described in claim 59 is one of a reel and the other. , A gear unit for interlocking the rotation of one reel and the other reel, a case for accommodating them, a heating member disposed in an opening of the case, and a power supply for supplying power to the heating member An adhesive tape having a base material coated with an adhesive wound around one of the reels, one end of the adhesive tape being fixed to the other reel, and a heating member. Is equipped with an electric heating member that generates heat by the supplied electric power, pulls out the adhesive tape wound on one of the reels into the opening of the case, and heats the adhesive tape in the opening with the heating member from the base material side. The adhesive is pressed against the circuit board by pressing, and the base material from which the adhesive has been peeled off is wound up with the other reel.
【0 2 0 1】 この請求の範囲第 5 9項に記載の発明は、 回路基板に接着剤を圧 着する場合には、 片手でケースを握り、 接着剤テープが露出している開口部を回 路基板に押し当てることにより、 開口部に設けられた接着剤テープ基材側の加熱 部材が開口部にある接着剤テープを押し当てることにより、 接着剤を回路基板に 圧着するものである。 そして、 加熱部材の下に位置する接着剤テープを押し付 けつつ接着具を前進させると、 一方のリールから接着剤テープが引き出され、 リ —ルから接着剤テープが引き出されるとリールが回転するので、 一方のリールの 同軸に固定されているギアが回転し、 これに歯合する他方のリールのギアが回転 して他方のリ一ルに接着剤が剥がれた基材を卷きつける。  [0220] According to the invention as set forth in claim 59, when the adhesive is pressed on the circuit board, the case is grasped with one hand, and the opening where the adhesive tape is exposed is closed. When the heating member on the side of the adhesive tape base material provided in the opening presses the adhesive tape in the opening by pressing against the circuit board, the adhesive is pressed against the circuit board. Then, when the adhesive is advanced while pressing the adhesive tape located below the heating member, the adhesive tape is pulled out from one reel, and the reel rotates when the adhesive tape is pulled out from the reel. Therefore, the coaxially fixed gear of one of the reels rotates, and the gear of the other reel that meshes with this rotates to wind the base material from which the adhesive has been peeled off on the other reel.
【0 2 0 2】 加熱部材への電力の供給は、 ケースに設けたスィツチにより電力 を供給したり、 あるいは、 加熱部材に感圧スイッチを設けておき、 加熱部材が押 圧されるとそれを感知して加熱部材に電力が供給されるものであってもよい。 [0220] To supply power to the heating member, power is supplied by a switch provided in the case, or a pressure-sensitive switch is provided in the heating member, and when the heating member is pressed, the pressure is reduced. Electric power may be supplied to the heating member upon sensing.
【0 2 0 3】 接着剤は、 絶縁性接着剤中に導電粒子を分散した異方導電性接着 であってもよいし、 絶縁性接着剤のみであってもよいし、 それらの接着剤中に絶 縁性のスぺ一サ粒子を分散したものであってもよい。 [0223] The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, may be an insulating adhesive alone, or may be an adhesive. Insulating particles may be dispersed.
【0 2 0 4】 請求の範囲第 6 0項に記載された発明は、 基材に塗布された接着 材テープであって、 基材は金属フィルム又は芳香族ポリアミドフィルムからなる JP2003/009694 ことを特徴とする。 The invention described in claim 60 is an adhesive tape applied to a substrate, wherein the substrate is made of a metal film or an aromatic polyamide film. JP2003 / 009694.
【0 2 0 5】 この請求の範囲第 6 0項に記載の発明では、 接着材テープの基材 を金属フィルム （又は金属箔） 又は芳香族ポリアミドフィルムとすることで、 基 材の厚みを薄くした場合でも、 基材が伸びや、 切断などの不具合を防止できる。 【0 2 0 6】 よって、厚みの薄い からなる接着材テープを利用することで、 1つのリール当たりの巻き数を多くすることができ、 1リールで使用可能な接着 剤量を増やすことができる。 また、 本発明の接着材テープを用いれば、 1リール 当たりの卷き数が多いので、 電子部品の製造工場では、 新しい接着材テープの交 換回数が少なくて済み、 作業効率が高まる。 さらに、 接着材テープの製造におい ては、 製造するリール数を少なくできるので、 リール材ゃ湿気防止材の使用量を 削減でき、 製造コストを低減できる。  [0205] In the invention according to claim 60, the base material of the adhesive tape is a metal film (or a metal foil) or an aromatic polyamide film, so that the thickness of the base material is reduced. Even in this case, problems such as stretching of the base material and cutting can be prevented. [0206] Therefore, by using an adhesive tape having a small thickness, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. . Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
【0 2 0 7】 金属フィルムは、 伸展性の高い金属が好ましく、 銅、 アルミニゥ ム、 ステンレス、 鉄、 錫などが用いられる。  [0207] The metal film is preferably a metal having high extensibility, and copper, aluminum, stainless steel, iron, tin, or the like is used.
【0 2 0 8】 芳香族ポリアミドフィルムは、 具体的には、 パラ系ァラミドフィ ルム （ミクトロン；東レ株式会社製商品名） などが用いられる。  [0208] As the aromatic polyamide film, specifically, para-aramid film (Microtron; trade name, manufactured by Toray Industries, Inc.) is used.
【0 2 0 9】 接着剤は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹脂と 熱硬化性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱可塑 性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬ィ匕性樹脂 系としてはエポキシ樹脂系、 アクリル樹脂系、 シリコン樹脂系が用いられる。 【0 2 1 0】 接着剤には、 導電粒子が分散されていてもよい。 導電粒子として は、 A u , A g , P t , N i , C u， W, S b、 S n , はんだなどの金属粒子や 力一ボン、 黒鉛などがあり、 これら及,び/または非導電性のガラス、 セラミック ス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成した ものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆 粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属 や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは 加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接 触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はんだのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極 の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。[0209] As the adhesive, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Representative examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type. [0210] The adhesive may have conductive particles dispersed therein. The conductive particles include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coating particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. Heat-melted metal such as solder, or polymer nucleus material such as plastic with a conductive layer formed on It is preferable because it has deformability by pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability. In particular, when a polymer is used as a core, it is more preferable because a softening state can be widely controlled by a connection temperature because it does not have a melting point unlike solder, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained. .
【0 2 1 1】 請求の範囲第 6 1項に記載された発明は、 請求の範囲第 6 0項 に記載の発明において、 基材の厚さは Ιμπ！〜 2 5μπιであることを特徴とする。[0211] The invention described in claim 61 is the invention described in claim 60, wherein the thickness of the base material is Ιμπ! 225μπι.
【0 2 1 2】 基材の厚さを Ιμπ！〜 2 5μπιとしているのは、 基材の厚さが 1 μ m未満の場合には基材の十分な引張強さが得られず、 切れ易くなるからである。 また、 基材の厚さが 2 5μπιを超える場合には、 1リール当たりの卷き数につい て満足の得られる巻き数が得られ難いからである。 [0 2 1 2] を μπ! The reason for setting the thickness to 25 μπι is that if the thickness of the substrate is less than 1 μm, sufficient tensile strength of the substrate cannot be obtained and the substrate is easily cut. Further, when the thickness of the base material exceeds 25 μπι, it is difficult to obtain a satisfactory number of windings per reel.
【0 2 1 3】 請求の範囲第 6 2項に記載された発明は、 請求の範囲第 6 0項又 は請求の範囲第 6 1項に記載の発明において、 基材の引張強度は 2 5口で 3 0 0 MP a以上であることを特徴とする。  [0213] The invention described in claim 62 is the invention according to claim 60 or claim 61, wherein the tensile strength of the base material is 25. It is characterized by being at least 300 MPa by mouth.
【0 2 1 4】 基材の引張強度を 3 0 O MP a以上としているのは、 基材の引張 強度が 3 0 O MP aより小さいと、 基材が伸びやすく、 また接着材テープが切断 し易くなるからである。  [0 2 14] The reason why the tensile strength of the base material is 30 OMPa or more is that if the tensile strength of the base material is less than 30 OMPa, the base material is easily stretched and the adhesive tape is cut. It is because it becomes easy.
【0 2 1 5】 請求の範囲第 6 3項に記載された発明は、 請求の範囲第 6 0項な いし請求の範囲第 6 2項のいずれかに記載の発明において、 基材の接着剤に対す る厚みの比が 0 . 0 1〜1 . 0であることを特徴とする。  The invention described in claim 63 is the invention according to any one of claims 60 to 62, wherein the adhesive for the base material is The ratio of the thickness to the thickness is 0.01 to 1.0.
【0 2 1 6】 基材の接着剤に対する厚みの比を 0 . 0 1〜1 . 0としているの は、 基材の接着剤に対する厚みの比が 0 . 0 1未満の場合には、 基材が薄すぎて 接着材テープの強度が十分得られないからである。 また、 基材の接着剤に対する 厚みの比が 1 . 0を超えると、 基材の厚みが厚くなりすぎて、 1リール当たりの 巻き数を多くできないからである。  [0216] The ratio of the thickness of the base material to the adhesive is set to 0.01 to 1.0 when the ratio of the thickness of the base material to the adhesive is less than 0.01. This is because the material is too thin and the strength of the adhesive tape cannot be obtained sufficiently. Also, if the ratio of the thickness of the base material to the adhesive exceeds 1.0, the thickness of the base material becomes too thick, and the number of turns per reel cannot be increased.
【0 2 1 7】 請求の範囲第 6 4項に記載された発明は、 請求の範囲第 6 0項な いし請求の範囲第 6 3項のいずれかに記載の発明において、基材の表面粗さ RmA xが 0 . 5μπι以下であることを特徴とする。 [0217] The invention described in claim 64 is the invention according to any one of claims 60 to 63, wherein the surface roughness of the substrate is R R mA x is 0.5 μπι or less.
【0 2 1 8】 基材の表面粗さ Rmaxを 0 . 5μπι以下としているのは、 Rmaxが 0 . 5μπιを超えると、 基材の表面の凹凸により、 回路基板に接着剤を圧着する 際に接着剤が基材から分離し難くなるからである。 [0218] The reason why the surface roughness R max of the base material is 0.5 μπι or less is that when R max exceeds 0.5 μπι, the adhesive is pressed onto the circuit board due to the unevenness of the surface of the base material. This is because the adhesive is difficult to separate from the base material.
【0 2 1 9】 請求の範囲第 6 5項に記載された発明は、 基材に接着剤が塗布さ れ、 リール状に巻いた接着材テープを用いて被着体に接着剤を形成する接着材テ —プの接着材形成方法であって、 複数のリールから夫々接着材テープを引き出し て、 各接着材テープを重ね合わせて一体にし、 一方の基材を剥離するとともに、 重ね合わせて一体にした接着剤を被着体に形成することを特徴とする。  In the invention described in claim 65, an adhesive is applied to a base material, and the adhesive is formed on the adherend using an adhesive tape wound in a reel shape. An adhesive tape forming method in which an adhesive tape is pulled out from each of a plurality of reels, each adhesive tape is overlapped and integrated, and one of the base materials is peeled off and overlapped to be integrated. The adhesive is formed on the adherend.
【0 2 2 0】 この請求の範囲第 6 5項に記載の発明では、 一方のリールから繰 り出された接着材テープの接着剤面と他方のリールから繰り出された接着材テー プの接着剤面とを重ね合わせ接着材テープを一体にする。 他方の接着材テープの 基材は卷取り用のリ一ルに卷取り、 重ね合わせて一体にした接着材テープの接着 剤を、 加圧加熱ヘッドによって被着体に圧着する。被着体は、 電子部品や回路基 板であり、 リードフレームやリードフレームのダイなどである。  [0220] According to the invention as set forth in claim 65, the bonding between the adhesive surface of the adhesive tape unwound from one reel and the adhesive tape unwound from the other reel is performed. The adhesive surface is integrated with the agent surface. The base material of the other adhesive tape is wound on a winding reel, and the adhesive of the adhesive tape integrated by lamination is pressure-bonded to the adherend by a pressurized heating head. The adherend is an electronic component or a circuit board, such as a lead frame or a lead frame die.
【0 2 2 1】 このように、 被着体に接着剤を形成する直前の工程で、 一方の接 着材テープの接着剤と、 他方の接着材テープの接着剤とを重ね合わせて、 所望の 接着剤の厚さにしてから被着体に接着剤を形成するので、 接着材テープの卷き数 を多くしているのに、 1リール当たりの接着材テープの卷き径を小さくすること ができる。従って、 1リールあたりの接着材テ一プの卷き数を増やすことができ、 1回の交換作業で使用可能な接着剤量を大幅に増やすことができる。 よって、 新 たな接着材テープの交換作業が少なくて済み、 電子機器の生産効率が高まる。  [0223] As described above, in the process immediately before forming the adhesive on the adherend, the adhesive of one adhesive tape and the adhesive of the other adhesive tape are overlapped with each other to obtain a desired adhesive tape. Since the adhesive is formed on the adherend after the thickness of the adhesive is increased, the winding diameter of the adhesive tape per reel should be reduced even though the number of windings of the adhesive tape is increased. Can be. Therefore, the number of windings of the adhesive tape per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape is reduced, and the production efficiency of electronic equipment is improved.
[ 0 2 2 2 ] 請求の範囲第 6 6項に記載された発明は、 請求の範囲第 1項に記 載の発明において、 一方の接着材テープの接着剤のみに硬化剤を含有しているこ とを特徴とする。  [022 2] The invention described in claim 66 is the invention according to claim 1, wherein only one adhesive of the adhesive tape contains a curing agent. This is the feature.
Γ 0 2 2 3】 この請求の範囲第 6 6項に記載の発明によれば、 請求の範囲第 6 5項に記載の発明と同様な作用効果を奏するとともに、 一方の接着材テープの接 着剤のみに硬化剤を含有しているので、 他方の接着材テープの接着剤には硬化剤 が不要となる。 従って、 硬化剤を含まない接着剤の接着材テープは、 低温管理が 不要となる。 よって、 低温管理の必要な接着材テープの数を減らすことができ、 接着材テープの輸送、 保管の効率的管理を行うことができる。 また、 硬化剤が配 合されていない接着材テープと硬化剤が配合された接着材テープの接着剤は、 硬 化剤と反応する成分を他方の接着剤とし、 硬化剤と反応しない成分を硬ィヒ剤とと もに用いる接着剤を一方の接着剤とすることで接着剤の保存安定性を向上させる ことができる。 Γ 0 2 2 3] According to the invention described in Claim 66, Claim 6 In addition to providing the same function and effect as the invention described in Item 5, only the adhesive of one adhesive tape contains a curing agent, so the adhesive of the other adhesive tape does not require a curing agent. Become. Therefore, low-temperature control is not required for adhesive tapes made of adhesives that do not contain a curing agent. Therefore, the number of adhesive tapes requiring low-temperature management can be reduced, and the transport and storage of the adhesive tapes can be efficiently managed. In addition, the adhesive of the adhesive tape containing no curing agent and the adhesive tape containing the curing agent include the component reacting with the curing agent as the other adhesive, and the component not reacting with the curing agent as the curing agent. The storage stability of the adhesive can be improved by using one of the adhesives used together with the ligne.
【0 2 2 4】 請求の範囲第 6 7項に記載された発明は、 フィルム状の接着剤を 有する異方導電材を芯材の長手方向に多数回卷き積層したことを特徴とする異方 導電材テ一プである。  [0224] The invention described in claim 67 is characterized in that an anisotropic conductive material having a film-like adhesive is wound and laminated many times in the longitudinal direction of the core material. This is a conductive tape.
[ 0 2 2 5 ] また、 請求の範囲第 6 8項に記載された発明は、 上記異方導電材 が、 フィルム状の接着剤の片面に基材フィルムを設けた 2層構造の異方導電材で ある請求の範囲第 6 7項に記載の異方導電材テープである。  [0225] Further, according to the invention described in claim 68, the anisotropic conductive material is a two-layer anisotropic conductive material in which a base film is provided on one surface of a film-like adhesive. The anisotropic conductive material tape according to claim 67, which is a material.
[ 0 2 2 6 ] また、 請求の範囲第 6 9項に記載された発明は、 請求の範囲第 6 7項に記載の異方導電材テープにおいて、 上記異方導電材が、 フィルム状の接着 剤の両面に基材フィルムを設けた 3層構造の異方導電材である異方導電材テープ である。  [0226] Further, according to the invention described in claim 69, in the anisotropic conductive material tape according to claim 67, the anisotropic conductive material is a film-like adhesive. This is an anisotropic conductive material tape that is a three-layered anisotropic conductive material with a base material film provided on both sides of the agent.
【0 2 2 7】 また、 請求の範囲第 7 0項に記載された発明は、 請求の範囲第 6 8項または請求の範囲第 6 9項に記載の異方導電材テープにおいて、 基材フィル ムの片面または両面が剥離処理されている異方導電材テ一プである。  The invention described in claim 70 is the anisotropic conductive material tape according to claim 68 or claim 69, wherein the base film is This is an anisotropic conductive material tape in which one or both surfaces of the film are subjected to a peeling treatment.
【0 2 2 8】 また、 請求の範囲第 7 1項に記載された発明は、 請求の範囲第 6 7項ないし請求の範囲第 7 0項のいずれかに記載の異方導電材テープにおいて、 フィルム状の接着剤の幅が、 0 . 5〜 5 mmである異方導電材テープである。 The invention described in claim 71 is the anisotropic conductive material tape according to any one of claims 67 to 70, This is an anisotropic conductive material tape in which the width of the film adhesive is 0.5 to 5 mm.
【0 2 2 9】 また、 請求の範囲第 7 2項に記載された発明は、 請求の範囲第 6 8項ないし請求の範囲第 71項のいずれかに記載の異方導電材テープにおいて、 基材フィルムの強度が、 12 kg/mm2以上で、 伸びが、 60〜 200%、 厚 みが、 10 Ομπι以下である異方導電材テープである。そして、基材フィルムは、 有色透明または有色不透明に着色してあると基材フィルムと接着剤の判別が容易 であり、 また、 卷きだし部の位置が容易となり、 作業性が向上する。 [0229] Further, the invention described in claim 72 is the claim 6 In anisotropic conductive material tape according to any one of item 8 to claims 71, wherein the strength of the base film, at 12 kg / mm 2 or more, elongation, from 60 to 200%, Thickness is 10 This is an anisotropic conductive material tape having a thickness of Ομπι or less. When the base film is colored to be transparent or colored and opaque, it is easy to distinguish the base film from the adhesive, and the position of the unwinding portion is easy, so that the workability is improved.
図面の簡単な説明 BRIEF DESCRIPTION OF THE FIGURES
【0 2 3 0】 図 1は、 第 1実施の形態にかかる接着材テープの接続方法におい て、 接着材リール同士の接続を示す斜視図である。  FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tapes according to the first embodiment.
【0 2 3 1】 図 2 A及ぴ図 2 Bは、 図 1における接続部分の接続工程を示す斜 5 視図である。  FIGS. 2A and 2B are oblique perspective views showing the connection process of the connection portion in FIG.
【0 2 3 2】 図 3は、接着装置における接着剤の圧着工程を示す概略図である。 [0232] FIG. 3 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0 2 3 3】 図 4は、 回路基板同士の接着を示す断面図である。 [0233] FIG. 4 is a cross-sectional view showing adhesion between circuit boards.
【0 2 3 4】 図 5は、 接着材テープの製造方法を示す工程図である。 FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
【0 2 3 5】 図 6は、 本発明の第 2実施の形態における、 接着材テープの接続 L0 方法を示す斜視図である。 FIG. 6 is a perspective view showing an adhesive tape connection L0 method in the second embodiment of the present invention.
【0 2 3 6】 図 7は、 本発明の第 2実施の形態の変形例における、 接着材テー プの接続方法を示す斜視図である。  FIG. 7 is a perspective view showing a method of connecting an adhesive tape in a modification of the second embodiment of the present invention.
【0 2 3 7】 図 8 A〜8 Cは、 第 1実施の形態にかかる接着材テープの接続方 法を示す図であり、 図 8 Aは接着材リール同士の接続を示す斜視図であり、 図 8 L5 Bは図 8 Aにおける接続部分の接続方法を示す斜視図、 図 8 Cは図 8 Aにおける 接続部分の平面図である。  FIGS. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment, and FIG. 8A is a perspective view showing the connection between the adhesive reels. 8L5B is a perspective view showing a connection method of the connection portion in FIG. 8A, and FIG. 8C is a plan view of the connection portion in FIG. 8A.
【0 2 3 8】 図 9は、 本発明の第 2実施の形態における、 接着材テープの接壳 方法を示す断面図である。  FIG. 9 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
【0 2 3 9】 図 1 0は、 本発明の第 3実施の形態における、 接着材テープの接 20 続方法を示す断面図である。  FIG. 10 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
【0 2 4 0】 図 1 1は、 本発明の第 4実施の形態における、 接着材テープの接 続方法を示す断面図である。  FIG. 11 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
【0 2 4 1】 図 1 2 及び1 2 Bは、 第 1実施の形態にかかる接着材テープの 接続方法を示す図であり、 図 1 2 Aは接着材リール同士の接続を示す斜視図であ 25 り、 図 1 2 Bは図 1 2 Aにおける接続部分の接続方法を示す斜視図である。  FIGS. 12 and 12B are views showing a method of connecting the adhesive tape according to the first embodiment, and FIG. 12A is a perspective view showing the connection between the adhesive reels. FIG. 12B is a perspective view showing a connection method of the connection portion in FIG. 12A.
【0 2 4 2】 図 1 3は、 本発明の第 2実施の形態における、 接着材テープの接 続方法を示す断面図である。 FIGS. 13A and 13B show the adhesive tape in the second embodiment of the present invention. It is sectional drawing which shows a continuation method.
【0243】 図 14A及び図 14Bは、 本発明の第 3実施の形態における、 接 着材テープの接続方法を示す断面図であり、図 14 Aは加熱加圧前の状態を示し、 図 14 Bは加熱加圧後の状態を示す。  [0243] Figs. 14A and 14B are cross-sectional views illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention. Fig. 14A illustrates a state before heating and pressing. Indicates the state after heating and pressing.
【0244】 図 15 A及び図 15 Bは、 本発明の第 4実施の形態における、 接 着材テープの接続方法を示す図であり、 図 15 Aは断面図であり、 図 15Bは平 面図である。  [0244] Fig. 15A and Fig. 15B are views showing a method of connecting an adhesive tape in the fourth embodiment of the present invention, Fig. 15A is a cross-sectional view, and Fig. 15B is a plan view. It is.
【0245】 図 16 A及ぴ図 16 Bは、 第 1実施の形態にかかる接着材テープ の接続方法を示す図であり、 図 16 Aは接着材リール同士の接続を示す斜視図で あり、 図 16Bは図 16 Aにおける接続部分 （b) を示す斜視図である。  [0245] FIGS. 16A and 16B are diagrams showing a method of connecting the adhesive tape according to the first embodiment, and FIG. 16A is a perspective view showing the connection between the adhesive reels. 16B is a perspective view showing a connection portion (b) in FIG. 16A.
【0246】 図 17は、 本発明の第 2実施の形態における、 接着材テープの接 続方法を示す断面図である。  [0246] Fig. 17 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the second embodiment of the present invention.
【0247】 図 18は、 本発明の第 3実施の形態における、 接着材テープの接 続方法を示す断面図である。  [0247] Fig. 18 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the third embodiment of the present invention.
【0248】 図 19は、 本発明の第 4実施の形態における、 接着材テ一プの接 続方法を示す断面図である。  [0248] Fig. 19 is a cross-sectional view illustrating a method of connecting an adhesive tape according to the fourth embodiment of the present invention.
【0249】 図 20 A〜図 20 Cは、 第 1実施の形態にかかる接着材テープの 接続方法を示す図であり、 図 2 OAは接着材リール同士の接続を示す斜視図であ り、 図 20B及び図 20 Cは図 2 OAにおける接続部分の接続方法を示す断面図 である。  [0249] Figs. 20A to 20C are diagrams showing a method of connecting the adhesive tape according to the first embodiment, and Fig. 2 OA is a perspective view showing the connection between the adhesive reels. 20B and 20C are cross-sectional views showing a connection method of a connection portion in FIG. 2 OA.
【0250】 図 21は、 接着装置における接着剤の圧着工程を示す概略図であ る。  [0250] Fig. 21 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding device.
【0251】 図22八~22(は、 第 1実施の形態にかかる接着材テ一プリ一 ルを示す図であり、 図 22 Aは接着材テープリールを示す斜視図であり、 図 22 Bは図 22 Aにおける正面図であり、 図 22 Cは図 22 Aにおける連結テープの 平面図である。 【0252】 図 23は、 接着装置における接着剤の圧着工程を示す ¾ϊ略図であ る ο [0251] FIGS. 22A to 22C are diagrams showing an adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing an adhesive tape reel, and FIG. FIG. 22C is a front view of FIG. 22A, and FIG. 22C is a plan view of the connecting tape of FIG. 22A. [0252] Fig. 23 is a schematic diagram showing a pressure bonding step of the adhesive in the bonding apparatus.
【0253】 図 24は、 本発明の第 2実施の形態における、 連結テープの平面 図である。  [0253] Fig. 24 is a plan view of the connecting tape according to the second embodiment of the present invention.
【0254】 図 25は、 本発明の第 3実施の形態における、 連結テープの平面 図である。  [0254] Fig. 25 is a plan view of a connecting tape according to the third embodiment of the present invention.
【0255】 図 26は、 本発明の第 4実施の形態における、 接着材テープリ一 ルを示す斜視図である。  [0255] Fig. 26 is a perspective view showing an adhesive tape reel according to the fourth embodiment of the present invention.
【0256】 図 27 Α〜図 27 Cは、 第 1実施の形態にかかる接着材テ一プリ —ルを示す図であり、 図 27 Aは接着材テ一プリ一ルを示す斜視図であり、 図 2 7Bは図 27 Aにおける正面図であり、 図 27 Cは図 27 Aにおける接続部分の 断面図である。  [0256] Figs. 27A to 27C are diagrams illustrating an adhesive tape according to the first embodiment, and Fig. 27A is a perspective view illustrating the adhesive tape. FIG. 27B is a front view in FIG. 27A, and FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A.
[0257] 図 28は、 接着装置における接着剤の圧着工程を示す概略図であ る。  FIG. 28 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0258】 図 29は、 PDPにおける接着剤の使用状態を示す斜視図である。 【0259】 図 30は、 本発明の第 2実施の形態における、 接着材テープリ一 ルを示す斜視図である。  [0258] Fig. 29 is a perspective view showing a use state of the adhesive in the PDP. [0259] Fig. 30 is a perspective view showing an adhesive tape reel according to the second embodiment of the present invention.
【0260】 図 31Aは、 本発明の接着材テ一プリ一ルの接着材テープを LO C構造の半導体装置に用いる場合の接着材テープの断面図である。  [0260] FIG. 31A is a cross-sectional view of an adhesive tape in a case where the adhesive tape of the adhesive tape of the present invention is used for a semiconductor device having a LOC structure.
【026 1】 図 31Bは、 本発明の接着材テープリールの接着材テープを LO C構造の半導体装置に用いる場合の LOC構造の半導体装置の断面図である。 FIG. 31B is a cross-sectional view of a semiconductor device having a LOC structure when the adhesive tape of the adhesive tape reel of the present invention is used for a semiconductor device having a LOC structure.
【0262】 図 32A〜32 Cは、 本発明の接着材テ一プリ一ルを用いた接着 装置の概略図であり、 図 32 Aは正面図、 図 32 Bは側面図であり、 図 32 Cは 図 32 Bにおける接着材テープ打ち抜き、 貼り付け部 89の要部拡大図である。[0262] Figs. 32A to 32C are schematic diagrams of a bonding apparatus using the adhesive tape of the present invention. Fig. 32A is a front view, Fig. 32B is a side view, and Figs. FIG. 34 is an enlarged view of a main part of the adhesive tape punching and sticking section 89 in FIG. 32B.
【0263】 図 33 A及び図 33 Bは、 接着剤テープの図であり、 図 33 Aは 接着剤テ一プを卷いたリールの斜視図であり、 図 33Bは図 33Aにおける A— 2003/009694 FIGS. 33A and 33B are views of an adhesive tape, FIG. 33A is a perspective view of a reel on which an adhesive tape is wound, and FIG. 2003/009694
A断面図である。 It is A sectional drawing.
【0264】 図 34は、 P DPにおける接着剤の使用状態を示す斜視図である。 【0265】 図 35は、 基材に接着剤を塗布する工程を示す断面図である。 【0266】 図 36A〜36 Cは、 本発明の第 2実施の形態にかかる接着剤テ ープの断面図である。  [0264] Fig. 34 is a perspective view showing a use state of the adhesive in the PDP. [0265] Fig. 35 is a cross-sectional view showing a step of applying an adhesive to a base material. [0266] Figs. 36A to 36C are cross-sectional views of the adhesive tape according to the second embodiment of the present invention.
【0267】 図 37A~37 Cは、 本発明の第 3実施の形態にかかる接着剤テ ープ及びその圧着方法を示す工程図である。  [0267] Figs. 37A to 37C are process diagrams illustrating an adhesive tape and a method for crimping the same, according to the third embodiment of the present invention.
【0268】 図 38A〜38 Cは、 本発明の第 4実施の形態にかかる接着剤テ [0268] Figs. 38A to 38C show an adhesive tape according to a fourth embodiment of the present invention.
—プの製造方法を示す工程図である。 FIG. 3 is a process chart showing a method for producing a loop.
【0269】 図 39 A及び図 39 Bは、 接着剤テープの図であり、 図 39 Aは 接着剤テープを巻いたリールの斜視図であり、 図 39 Bは図 39 Aの接着剤テ一 プを接着剤側から見た平面図である。  [0269] Fig. 39A and Fig. 39B are views of the adhesive tape, Fig. 39A is a perspective view of a reel around which the adhesive tape is wound, and Fig. 39B is the adhesive tape of Fig. 39A. FIG. 3 is a plan view as viewed from an adhesive side.
[0270] 図 40は、 接着装置における接着剤の圧着工程を示す概略図であ る。  [0270] Fig. 40 is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
【0271】 図 41は、 本発明の第 2実施の形態であって、 接着装置における 接着剤の圧着工程を示す概略図である。  [0271] Fig. 41 is a second embodiment of the present invention, and is a schematic view illustrating a pressure bonding step of an adhesive in a bonding apparatus.
【0272】 図 42A〜42 Cは、 本発明の第 3実施の形態にかかる接着剤テ —プの断面図である。  [0272] Figs. 42A to 42C are cross-sectional views of the adhesive tape according to the third embodiment of the present invention.
【0273】 図 43A〜43 Cは、 本発明の第 4実施の形態にかかる接着剤テ —プ及びその圧着方法を示す工程図である。  [0273] Figs. 43A to 43C are process diagrams illustrating an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
【0274】 図 44 A〜44 Cは、 本発明の第 5実施の形態にかかる接着剤テ —プの製造方法を示す工程図である。  [0274] Figs. 44A to 44C are process diagrams showing a method of manufacturing an adhesive tape according to the fifth embodiment of the present invention.
【0275】 図 45 A及び 45Bは、 本発明の第 1実施の形態にかかる接着剤 テ一ブカセットの図であり、 図 45 Aは接着剤テープカセヅトの斜視図であり、 図 45Bは図 45 Aの A— A切断面図である。  [0275] Figs. 45A and 45B are views of an adhesive table cassette according to the first embodiment of the present invention, Fig. 45A is a perspective view of an adhesive tape cassette, and Fig. 45B is a view of Fig. 45A. FIG. 4 is a sectional view taken along line A-A.
【0276】 図 46は、 図 45 Aに示すテープカセットにおけるリ一ルの取り 付け状態を示す断面図である。 [0276] Fig. 46 is a view showing reel removal in the tape cassette shown in Fig. 45A. It is sectional drawing which shows an attachment state.
【0 2 7 7】 図 4 7は、 接着装置における接着剤の圧着工程を示す正面図であ る  [0277] FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0 2 7 8】 図 4 8は、接着剤テープカセヅトの製造方法を示す工程図である。 【0 2 7 9】 図 4 9は、 本発明の第 2実施の形態であって、 接着装置における 接着剤の圧着工程を示す概略図である。  [0278] Fig. 48 is a process diagram showing a method for producing an adhesive tape cassette. [0279] Fig. 49 is a second embodiment of the present invention, and is a schematic view showing a pressure bonding step of an adhesive in a bonding apparatus.
【0 2 8 0】 図 5 0は、 本発明の第 3実施の形態にかかる接着剤テープの断面 図である。  FIG. 50 is a cross-sectional view of the adhesive tape according to the third embodiment of the present invention.
【0 2 8 1】 図 5 1 A及び図 5 1 Bは、 本発明の第 4実施の形態にかかる接着 剤テープ及びその圧着方法を示す工程図である。  FIGS. 51A and 51B are process diagrams showing an adhesive tape and a method for crimping the same according to a fourth embodiment of the present invention.
【0 2 8 2】 図 5 2 A及び図 5 2 Bは、 第 1実施の形態にかかる接着材テープ を示す図であり、 図 5 2 Aは接着材リール同士の接続を示す斜視図であり、 図 5 2 Bは図 5 2 Aにおける接続部分を示す断面図である。  FIGS. 52A and 52B are views showing the adhesive tape according to the first embodiment, and FIG. 52A is a perspective view showing the connection between the adhesive reels. FIG. 52B is a cross-sectional view showing a connection portion in FIG. 52A.
【0 2 8 3】 図 5 3は、 第 2の実施形態に係る接着材テープを示す断面図であ る。  [0283] FIG. 53 is a cross-sectional view illustrating an adhesive tape according to the second embodiment.
【0 2 8 4】 図 5 4 A〜5 4 Cは、 図 5 5における接続部分の接続工程を示す 断面図であり、 図 5 4 Aは放電前の状態を示し、 図 5 4 Bは放電後の状態を示し 図 5 4 Cは接続部分の加熱圧着を示す図である。  [0284] FIGS. 54A to 54C are cross-sectional views showing a connection step of a connection portion in FIG. 55, FIG. 54A shows a state before discharging, and FIG. FIG. 54C is a view showing a thermocompression bonding of a connection portion.
【0 2 8 5】 図 5 5は、 接着材テープの接続方法において、 接着材リ一ル同士 の接続を示す斜視図である。  [0285] Fig. 55 is a perspective view showing the connection between the adhesive reels in the method of connecting the adhesive tape.
【0 2 8 6】 図 5 6は、 接着装置における接着剤の圧着工程を示す概略図であ る。  [0286] Fig. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0 2 8 7】 図 5 7 A〜図 5 7 Cは、 第 1実施の形態にかかる接着材テ一プリ —ルを示す図であり、 図 5 7 Aは接着材テープリールを示す斜視図であり、 図 5 7 Bは図 5 7 Aにおける正面図であり、 図 5 7 Cは図 5 7 Aにおけるカバ一部材 の正面図である。 【0 2 8 8】 図 5 8は、 接着材テープリールの製造方法を示す工程図である。 【0 2 8 9】 図 5 9は、 本発明の第 2実施の形態における、 接着材テ一プリ一 ルの側面図である。 FIG. 57A to FIG. 57C are views showing an adhesive tape reel according to the first embodiment, and FIG. 57A is a perspective view showing an adhesive tape reel. 57B is a front view in FIG. 57A, and FIG. 57C is a front view of the cover member in FIG. 57A. [0288] Fig. 58 is a process diagram showing a method for manufacturing an adhesive tape reel. [0289] Fig. 59 is a side view of the adhesive tape in the second embodiment of the present invention.
【0 2 9 0】 図 6 O A及び図 6 0 Bは、 本発明の第 3実施の形態における、 接 着材テープリールの正面図であり、 接着剤テープの交換を説明する図である。 FIG. 6OA and FIG. 60B are front views of the adhesive tape reel according to the third embodiment of the present invention, and are views illustrating replacement of the adhesive tape.
【0 2 9 1】 図 6 1は、 本発明の第 4実施の形態における、 卷き部の側板を示 す斜視図である。 [0292] Fig. 61 is a perspective view showing a side plate of a winding portion in the fourth embodiment of the present invention.
【0 2 9 2】 図 6 2 A及び図 6 2 Bは、 本発明の第 1実施の形態にかかる接着 具の図であり、 図 6 2 Aは接着具の斜視図であり、 図 6 2 Bは図 6 2 Aの A— A 切断面図である。  [0292] Figs. 62A and 62B are diagrams of the adhesive tool according to the first embodiment of the present invention, and Fig. 62A is a perspective view of the adhesive tool. B is a sectional view taken along line AA of FIG. 62A.
【0 2 9 3】 図 6 3は、 図 6 2 A及び図 6 2 Bに示す接着具の使用方法を説明 する側面図である。  [0293] FIG. 63 is a side view for explaining how to use the bonding tool shown in FIG. 62A and FIG. 62B.
【0 2 9 4】 図 6 4は、 接着具の製造方法を示す工程図である。  [0294] FIG. 64 is a process diagram illustrating a method for manufacturing an adhesive tool.
【0 2 9 5】 図 6 5 A及び図 6 5 Bは、 第 1実施の形態にかかる接着材テープ を示す図であり、 図 6 5 Aは接着材テープがリ一ルに卷かれた斜視図であり、 図 [0295] Fig. 65A and Fig. 65B are diagrams showing an adhesive tape according to the first embodiment. Fig. 65A is a perspective view in which the adhesive tape is wound around a reel. FIG.
6 5 Aは図 6 5 Aにおける A— A断面図である。 65A is a sectional view taken along the line AA in FIG. 65A.
【0 2 9 6】 図 6 6 A及び図 6 6 Bは、 第 1実施の形態にかかる接着材テープ の接着材形成工程を示す図であり、 図 6 6 Aは各接着材テープを重ね合わせて一 体にし、 一方の基材を卷取り用のリールに卷取る工程を示す概略図であり、 図 6 6 Bは図 6 6 Aにおける接着剤同士の重ね合わせ部分を示す断面図である。 【0 2 9 7】 図 6 7は、 接着装置における接着剤を被着体に形成する工程を示 す概略図である。  FIGS. 66A and 66B are diagrams showing an adhesive forming process of the adhesive tape according to the first embodiment, and FIG. FIG. 66B is a schematic view showing a step of winding one of the base materials onto a winding reel, and FIG. 66B is a cross-sectional view showing a portion where adhesives are overlapped in FIG. 66A. [0297] FIG. 67 is a schematic view showing a step of forming an adhesive on an adherend in the bonding apparatus.
【0 2 9 8】 図 6 8は、 接着材テ一プを卷いたリ一ルの斜視図である。  FIG. 68 is a perspective view of a reel on which an adhesive tape is wound.
【0 2 9 9】 図 6 9 Aは、 第 2実施の形態における接着材テープの接着材形成 工程を示す断面図である。  FIG. 69A is a cross-sectional view showing a step of forming an adhesive material on an adhesive tape according to the second embodiment.
【0 3 0 0】 図 6 9 Bは、 図 6 9 Aの接着材を用いた回路基板同士の接着を示 す断面図である。 [0300] FIG. 69B shows adhesion between circuit boards using the adhesive of FIG. 69A. FIG.
【0 3 0 1】 図 7 0は、 本発明の 2層構 異方導電材テ一プの供給形態の模式 図である。  FIG. 70 is a schematic diagram of a supply form of the two-layer anisotropic conductive material tape of the present invention.
【0 3 0 2】 図 7 1は、 本発明の 3層構成異方導電材テープの供給形態の模式 図である。 FIG. 71 is a schematic diagram of a supply form of the three-layer anisotropic conductive material tape of the present invention.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
【0 3 0 3】 次に、 添付図面を参照しながら、 本発明の実施の形態について説 明する。 なお、 以下の説明において、 同一又は同等の構成要素については同一符 号を付す。  [0333] Next, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, the same or equivalent components are denoted by the same reference numerals.
【0 3 0 4】 まず請求の範囲第 1〜第 4項に記載された発明の実施形態につい て図 1〜図 5を参照して説明する。  First, an embodiment of the invention described in claims 1 to 4 will be described with reference to FIGS. 1 to 5.
【0 3 0 5】 図 1は第 1実施の形態にかかる接着材テープの接続方法において、 接着材リール同士の接続を示す斜視図であり、 図 2 A及び図 2 Bは、 図 1におけ る接続部分 （A) の接続工程を示す図であり、 図 2 Aは使用済み接着材テープの ェンドテープの切断を示す斜視図、 図 2 Bは使用済みの接着材テープを裏返して 新たな接着材テープとの接続を示す斜視図、 図 3は接着装置における接着剤の圧 着工程を示す概略図、 図 4は回路基板同士の接着を示す断面図、 図 5は接着材テ —プの製造方法を示す工程図である。  FIG. 1 is a perspective view showing the connection between the adhesive reels in the method for connecting the adhesive tape according to the first embodiment, and FIGS. 2A and 2B are diagrams in FIG. Fig. 2A is a perspective view showing the cutting of an end tape of a used adhesive tape, and Fig. 2B is a view showing a used adhesive tape turned upside down to obtain a new adhesive material. FIG. 3 is a schematic view showing an adhesive bonding step in a bonding apparatus, FIG. 4 is a cross-sectional view showing bonding between circuit boards, and FIG. 5 is a method of manufacturing an adhesive tape. FIG.
【0 3 0 6】 接着材テープ 1はリール 3、 3 aにそれそれ巻かれており、 各リ —ル 3、 3 aには卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。 即ち、 各リール 3 , 3 aは、 卷き芯 5と、 接着材テープ 1の両幅側 にそれぞれ配置される側板 7とを有している。  [0306] The adhesive tape 1 is wound around the reels 3 and 3a, and the reels 3 and 3a are arranged on both sides of the winding core 5 and the adhesive tape 1. A side plate 7 is provided. That is, each of the reels 3, 3 a has a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
【0 3 0 7】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0307] The adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 3 0 8】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら〇P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などで構成されるが、 これらに制限さ れるものではない。  [0308] The base material 9 is made of 〇PP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
【 0 3 0 9】 接着剤 1 1としては、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可 塑性樹脂と熱硬化性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹 脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂 系があり、また熱硬化性樹脂系としてはエポキシ樹脂系、ビニルエステル系樹脂、 アクリル樹月旨系、 シリコーン I脂系が用いられる。 As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such resins include styrene resin as thermoplastic resin, and polyester resin. Epoxy resin, vinyl ester resin, acrylic resin, and silicone I resin.
【0310】 接着剤 1 1には、 導電粒子 13が分散されている。 導電粒子 13 としては、 Au， Ag, Pt, Ni， Cu, W， Sb、 Sn, はんだなどの金属 粒子や力一ボン、 黒鉛などがあり、 導電粒子 13は、 これら及び非導電性のガラ ス、 セラミックス、 プラスチヅク等の高分子核材等に、 前記した導電粒子 13を 構成する材料からなる導電層を被覆等により形成したものでもよい。 さらに前記 したような導電粒子 13を絶縁層で被覆してなる絶縁被覆粒子や、 導電粒子 13 と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック 等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧により変形性 を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面積が増加し信 頼性が向上するので好ましい。 特に高分子類を核とした場合、 導電粒子 13は、 はんだのように融点を示さないので、 軟化の状態を接続温度で広く制御でき、 電 極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい 【031 1】 次に、 本実施の形態にかかる接着材テープ 1の使用方法について 説明する。 図 3に示すように、 接着装置 15に接着材テープ 1のリール 3 aと、 卷取りリール 17とを装着し、 リール 3 aに卷いた接着材テープ 1の先端をガイ ドビン 22に掛けて卷取りリール 17に取り付け、接着材テープ 1を繰り出す（図 3中矢印 E)。そして、 回路基板 2 1上に接着材テープ 1を配置して、両リール 3 a、 17間に配置された加熱加圧ヘッド 19で接着材テープ 1を基材 9側から圧 接し、 接着剤 11を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に巻き取る。  [0310] The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, copper, graphite, and the like. The conductive particles 13 include these and non-conductive glass. A conductive layer made of the material constituting the above-described conductive particles 13 may be formed by coating a polymer nucleus material such as ceramic, plastic, or the like with a coating. Furthermore, insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc., it is deformable by heating or pressurizing, and the distance between the electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as the core, the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and the connection can easily cope with variations in electrode thickness and flatness. [0311] Next, a method of using the adhesive tape 1 according to the present embodiment will be described. As shown in FIG. 3, the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is hung on the guide bin 22 and wound. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the two reels 3 a, 17, and the adhesive 11 To the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
【03 12】 上記の圧着後（仮接続)、 回路基板 21の電極と配線回路（電子部 品） 23の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 21に圧着された接着剤 1 1に配線回路 (又は電子部品） 23を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 24を JP2003/009694 介して加熱加圧へヅド 1 9により ffi線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する。[0312] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluorocarbon. Ethylene 24 The ffi wire circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressurizing head 19 via JP2003 / 009694. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 3 1 3】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。したがって、リール 3 aに卷いた接着材テープ 1の使用量も多くなり、 リ一ル 3 aに卷いた接着材テープ 1は比較的短時間で卷取りリ一ル 1 7に卷き取 られて、 リール 3 aに卷かれた接着材テープ 1のエンドマーク 2 8が露出される[0311] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
(図 1参照）。 (refer graph1).
【0 3 1 4】 本発明の接着材テープの接続方法は、 （a )卷取りリール 1 7をそ のまま使用し、 使用済みの接着材テープ 1の卷きが残り少なくなった接着剤テ一 プを交換し、新たな接着剤テープと卷取りリール 1 7を接続する場合と、 （b )卷 取りリール 1 7として使用済みの接着材テープ 1の卷きが残り少なくなつた接着 剤テープを使用し、 新たな接着剤テープと巻きが残り少なくなった接着剤テープ を接続する場合がある。  The adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When the tape is replaced and a new adhesive tape is connected to the take-up reel 17, and (b) the adhesive tape 1 used as the take-up reel 17 has a small number of used adhesive tapes 1 In some cases, a new adhesive tape is connected to an adhesive tape with less winding.
【0 3 1 5】 （b ) の場合、 図 1に示すように、 リール 3 aの接着材テープ 1 に、 リール 3 aを新たな接着材リ一ル 3と交換するため、 リール 3 aの接着材テ —プ （一方の接着材テープ） 1の終端部 3 0と、 新たな接着材リール 3に卷かれ た接着材テープ （他方の接着材テープ） 1の始端部 3 2とを接続する。  [0315] In the case of (b), as shown in FIG. 1, the reel 3a is replaced with the adhesive tape 1 on the reel 3a, and the reel 3a is replaced with a new adhesive reel 3. Connect the end 30 of the adhesive tape (one adhesive tape) 1 to the beginning 3 2 of the adhesive tape (the other adhesive tape) 1 wound on a new adhesive reel 3 .
【0 3 1 6】 この接着材テープ 1の接続は、 使用済みリール 3 aの接着材テ一 プ 1のエンドマーク 2 8が露出したときに、 図 2 Aに示すように、 接着材テープ [0 3 16] The adhesive tape 1 is connected when the end mark 28 of the adhesive tape 1 of the used reel 3a is exposed, as shown in FIG. 2A.
1のエンドマーク 2 8付近を切断し（ B )、接着材テープ 1の終端部 3 0を裏返し て、 接着材テープ 1の接着剤 1 1面を上側にする （図 2 B )。 そして、 使用済みリ ール 3 aの接着材テープ 1の終端部 3 0の接着剤 1 1面に、 新たな接着材リールCut the area near the end mark 28 of 1 (B), turn over the end 30 of the adhesive tape 1 and turn the adhesive 11 side of the adhesive tape 1 upward (Fig. 2B). Then, a new adhesive reel is placed on the adhesive 1 at the end 30 of the adhesive tape 1 of the used reel 3a.
3の接着材テープ 1の始端部 3 2の接着剤 1 1面を重ね合わせる （図 2 B )。 The adhesive end of tape 3 of adhesive 1 3 Adhesive 1 of 2 2 Laminate 1 side (Fig. 2B).
【0 3 1 7】 そして、 図 4に示すように、 両者の重ね合わせ部分を、 テ一プル 1 0 4の上に置き、接着装置 1 5の加熱加圧へヅド 1 9で加熱加圧して接着する。 これにより、 使用済みのリール 3 aに巻かれた接着材テープ 1と、 新たなリール 3に卷かれた接着材テープ 1とが接続される。 次に、 使用済みのリール 3 aと新 たなリール 3を入れ替えて、 新たなリール 3を接着装置 1 5に装着する。 したが つて、 卷取りリール 1 7に接着材テープ 1を装着する作業が必要ない。 また、 接 着剤 1 1面同士を重ね合わせて接着するので、 接続強度が高い。 [0 3 1 7] Then, as shown in FIG. It is placed on 104, and heated and pressed by a heating and pressing head 19 of the bonding device 15 to bond. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3 a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17. In addition, the bonding strength is high because the bonding surfaces of the adhesives 11 are overlapped.
【0 3 1 8】 尚、 エンドマーク 2 8は、 接着材テープ 1において、 使用済みリ —ル （接着材テープ 1が完全に繰り出されているリール） 3 aから加熱加圧へヅ ド 1 9まで接着材テープ 1を伸ばしたときに、 接着材テープ 1の使用済みリール 3 aへの固定位置から加熱加圧へヅド 1 9までの長さの位置に付けることが望ま しい。 この場合、 エンドマーク 2 8の付近を切断すれば、 必要最小限の位置で接 着材テープ 1が切断されることとなり、 接着材テープ 1の無駄を防止できると共 に、 使用済みリール 3 aを取り外してエンドマーク 2 8が加熱加圧へヅド 1 9ま で届くように使用済みリ一ル 3 aを移動させるという面倒な作業を防止できる。 【0 3 1 9】 この実施の形態では、接着装置 1 5が加熱加圧へヅド 1 9を有し、 この加熱加圧へヅド 1 9を利用して使用済みリ一ル 3 aの接着材テープ 1の終端 部 3 0の接着剤 1 1と、 新たな接着材リール 3の接着材テープ 1の始端部 3 2の 接着剤 1 1との接続が行われるので、 接着剤 1 1同士を圧着するための圧着用器 具を別途用いることなく接着材テープ 1が卷かれたリ一ル 3、 3 aの交換ができ る。  [0 3 1 8] Note that the end mark 28 is used for the adhesive tape 1 from the used reel (reel from which the adhesive tape 1 is completely fed) 3a to the heating and pressurizing mode. When the adhesive tape 1 is stretched to a position where the adhesive tape 1 is fixed to the used reel 3a, it is desirable to attach the adhesive tape 1 to a position extending from the fixing position to the heating and pressing head 19. In this case, if the vicinity of the end mark 28 is cut, the adhesive tape 1 will be cut at the minimum necessary position, and the waste of the adhesive tape 1 can be prevented, and the used reel 3 a It is possible to prevent the troublesome work of removing the used reel 3a so that the end mark 28 can reach the heating / pressing head 19 by heating. In this embodiment, the bonding apparatus 15 has a heating / pressing head 19, and the heating / pressing head 19 is used to remove the used reel 3a. The adhesive 1 1 at the end 30 of the adhesive tape 1 and the adhesive 1 1 at the beginning 3 2 of the adhesive tape 1 on the new adhesive reel 3 are connected. The reels 3 and 3a on which the adhesive tape 1 is wound can be exchanged without using a separate crimping tool for crimping.
【0 3 2 0】 （a ) の卷取りリール 1 7をそのまま使用し、 使用済みの接着材 テープ 1の卷きが残り少なくなつた接着剤テープを新たな接着剤テープと交換し、 新たな接着剤テープと卷取りリール 1 7を接続する場合は、 使用済みリール 3 a の接着材テ一プ 1のエンドマーク 2 8が露出したときに接着材テープ 1のエンド マーク 2 8付近を切断し、 巻取りリール 1 7側に残った接着材テープの終端部を 裏返し、 接着剤 1 1面を上側にする。 そして、 この接着材テープ 1の終端部の接 着剤 1 1面と、 新たな接着材リール 3の接着材テープ 1の始端部 3 2の接着剤 1 1面を重ね合わせる。 そして、 両者の重ね合わせ部分を、 テーブル 1 0 4の上に 置き、接着装置 1 5の加熱加圧へッド 1 9で加熱加圧して接着する。これにより、 卷取りリール 1 7に卷かれた接着材テープ 1と、 新たなリール 3に卷かれた接着 材テープ 1とが接続される。 これにより、 卷取りリール 1 7では基材 9だけが卷 き取られるので、 接着材リールの数本分を卷き取ることができ、 卷取りリール 1 7の交換回数を少なくすることができ、 作業効率が良い。 [0 3 2 0] Using the take-up reel 17 of (a) as it is, replacing the used adhesive tape 1 with a small amount of the remaining adhesive tape 1 with a new adhesive tape, and performing new bonding When the adhesive tape is connected to the take-up reel 17, cut the area near the end mark 28 of the adhesive tape 1 when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed, Turn over the end of the adhesive tape remaining on the take-up reel 17 side, and turn the adhesive 1 side up. Then, the end of the adhesive tape 1 is contacted. The adhesive 1 1 surface and the adhesive 1 1 surface of the starting end 3 2 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Then, the overlapped portion of the two is placed on the table 104, and is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond. Thus, the adhesive tape 1 wound on the take-up reel 17 and the adhesive tape 1 wound on the new reel 3 are connected. As a result, only the base material 9 is wound on the take-up reel 17, so that several adhesive material reels can be wound, and the number of times of changing the take-up reel 17 can be reduced. Work efficiency is good.
【0 3 2 1】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 3 2 2】 卷出機 2 5から巻き出された基材 （セパレ一夕） 9にコ一夕一 2 7により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で 乾燥した後、 卷取機 3 1で原反を卷き取る。 卷き取られた接着材テープ 1の原反 は、 スリツ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 卷き芯 に側板 7 , 7が両側から装着されて、 あるいは、 側板付卷き芯に卷き取られ、 除 湿材とともに梱包され、 低温 （一 5 °C〜一 1 0 °C) に管理されて出荷される。 [0 3 2 2] The adhesive (11) in which resin and conductive particles (13) were mixed was applied to the substrate (separation) 9 unwound from the unwinding machine 25 by the co-exit 27. After drying in the drying oven 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core, and then the side plates 7 and 7 are attached to the winding core from both sides. Alternatively, it is wound around a core with a side plate, packed with a dehumidifying material, and shipped at a low temperature (15 ° C to 110 ° C).
【 0 3 .2 3】 次に、 本発明の第 2実施の形態について説明するが、 以下では上 述した実施の形態と異なる点を主に説明する。 [0323] Next, a second embodiment of the present invention will be described. Hereinafter, points different from the above-described embodiment will be mainly described.
【0 3 2 4】 図 6に示す第 2実施の形態では、 新たな接着材リール 3の接着材 テープ 1の始端部 3 2に備えてあるリードテープ 4 1を利用して、 新たな接着材 リ一ル 3の接着材テープ 1と使用済みのリ一ル 3 aに卷かれた接着材テープ 1と の接続を行っている。 リードテープ 4 1は基材 6 3とその裏面の接着剤 4 3面と からなり、 新たな接着材リ一ル 3の接着材テープ 1の始端部 3 2は、 リードテー プ 4 1によりリールに巻き付けてある接着材テープ 1の基材 9面に貼り付けて止 めている。 そして、 リードテープ 4 1を基材 9面から剥がして、 裏返した接着材 テープ 1の終端部 3 0の接着剤 1 1面に重ね合わせる。両者の重ね合わせ部分を、 テーブル 1 0 4の上に置き、 接着装置 1 5の加熱加圧へッド 1 9で加熱加圧して このように、 接着材テープ 1のリードテープ 4 1を利用して卷き出し の終了した接着材テープ 1の終端部 3 0と、 新たに装着する接着材テープ 1の始 端部 3 2とを接着するので、 接着材テープ 1同士の接続が簡単である。 また、 こ の場合、 リードテープ 4 1の基材 6 3の裏面側に設けた接着剤 4 3面は粘着性が あり、 裏返した接着材テープ 1の終端部 3 0の接着剤 1 1面に重ね合わせるだけ で接続されるのでこの方法でも良い。 In the second embodiment shown in FIG. 6, a new adhesive material is provided by using the lead tape 41 provided on the start end 32 of the adhesive tape 1 of the new adhesive material reel 3. The connection is made between the adhesive tape 1 of the reel 3 and the adhesive tape 1 wound on the used reel 3a. The lead tape 4 1 consists of the base material 6 3 and the adhesive 4 3 on the back surface, and the beginning 3 2 of the adhesive tape 1 of the new adhesive reel 3 is wound around the reel by the lead tape 4 1 The adhesive tape 1 is attached to the base material 9 surface of the adhesive tape 1 and stopped. Then, the lead tape 41 is peeled off from the surface of the base material 9 and superposed on the adhesive 11 surface of the terminal end portion 30 of the adhesive tape 1 turned over. Place the overlapped part on the table 104 and heat and press with the heating and pressing head 19 of the bonding device 15 In this way, using the lead tape 41 of the adhesive tape 1, the end 30 of the adhesive tape 1 that has been unwound and the start 32 of the adhesive tape 1 to be newly installed are connected. Since they are bonded, the connection between the adhesive tapes 1 is easy. In this case, the adhesive 43 provided on the back side of the base material 6 3 of the lead tape 41 is sticky, and the adhesive 1 1 of the terminal end 30 of the adhesive tape 1 turned over is attached to the adhesive tape 1. This method may be used because the connection is made simply by overlapping.
【0 3 2 5】 本発明は、 上述した実施の形態に限らず、 本発明の要旨を逸脱し ない範囲で種々変形可能である。  [0327] The present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist of the present invention.
【0 3 2 6】 例えば、 上述した第 2実施の形態において、 使用済みのリール 3 aに卷かれた接着材テープ 1を裏返さずに、 図 7に示すように新たに装着する接 着材テープ 1の始端部 3 2のリードテープ 4 1を *« 9面から剥がして、 裏面の 接着剤 1 1面に貼り付け、 リードテープ 4 1を使用済みの接着材テープ 1の終端 部 3 0の接着剤 1 1面に接続して接着装置 1 5の加熱加圧へッド 1 9で加熱加圧 して接着しても良い。 この際、 巻き出しの終了した接着材テープ 1を裏返す必要 がないので、 卷取りリールに接着材テープ 1を卷き取った際に巻き崩れが生じる おそれを防止できる。  For example, in the above-described second embodiment, the adhesive to be newly mounted as shown in FIG. 7 without turning over the adhesive tape 1 wound around the used reel 3a. Remove the lead tape 4 1 at the start end 3 2 of the tape 1 from the * 9 surface and paste it on the adhesive 1 on the back surface, and attach the lead tape 4 1 to the end 30 of the used adhesive tape 1 The adhesive may be connected to one surface and bonded by heating and pressing with a heating and pressing head 19 of a bonding device 15. At this time, since it is not necessary to turn over the adhesive tape 1 after the unwinding, it is possible to prevent a possibility that the adhesive tape 1 may be broken when the adhesive tape 1 is wound on the winding reel.
【0 3 2 7】 さらに、 この場合、 接着材テープ 1の女台端部 3 2のリードテープ 4 1を基材 9面から剥がして、 リードテープ 4 1を使用済みの接着材テープ 1の 基材 9面に接着しても良い。  [0 3 2 7] Further, in this case, the lead tape 41 of the female end portion 32 of the adhesive tape 1 is peeled off from the base material 9 surface, and the lead tape 41 is used as the base material of the used adhesive tape 1. It may be adhered to 9 surfaces.
【0 3 2 8】 次に、 請求の範囲第 5〜第 8項に記載された発明について説明す る。  Next, the invention described in claims 5 to 8 will be described.
【0 3 2 9】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に卷かれた接着材テープの接続方法に関するものである。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes to each other, and more particularly to an adhesive tape wound in a reel shape. The present invention relates to a method for connecting material tapes.
【0 3 3 0】 次に、 請求の範囲第 5〜第 8項に記載された発明の背景技術につ いて説明する。 【0 3 3 1】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。 Next, the background art of the invention described in claims 5 to 8 will be described. [0331] Generally, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a pair chip mounting, a circuit board, and a circuit board are adhered and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method for making the connection.
【0 3 3 2】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に巻き取ったものが開示されている。  [0333] Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. .
【0 3 3 3】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ 一ルに卷き取るテープの長さは 5 0 m程度である。  [0333] The conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
【0 3 3 4】 接着材テープを接着装置に装着する場合、 接着材テープのリール (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き 出された接着材テープの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに卷き取っている。  [0 3 3 4] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound up on a take-up reel. .
【0 3 3 5】 そして、 接着材リ一ルの接着材テープが終了すると、 終了したリ —ルと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付け ている。  [0 3 3 5] Then, when the adhesive tape of the adhesive reel is completed, the completed reel and the take-up reel that has taken up the base material are removed, and a new take-up reel and a new connection are established. The adhesive reel is mounted on the bonding device, and the beginning of the adhesive tape is attached to the take-up reel.
【0 3 3 6】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある c 【0 3 3 7】 かかる問題に対して、 リールに巻き取る接着材テープの巻き数を 多くすることで、 1リ一ル当りの接着剤量を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると巻き崩れが生じるおそれがある。 また、 巻き数を多くするとテ一 プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロッキングの原因になるおそれがある。 [0333] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in the electronic device manufacturing plant, there is a problem that the frequency of replacing the adhesive reel increases, and it takes time to replace the adhesive reel, so that it is not possible to improve the production efficiency of the electronic device. C [0 3 3 7 To address this problem, it is conceivable to increase the number of adhesive tapes wound on a reel, thereby increasing the amount of adhesive per reel and reducing the frequency of replacing the reels. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse. Also, if the number of turns is large, The pressure acting on the adhesive tape wound in a loop may increase, and the adhesive may ooze out from both sides of the tape and cause blocking.
【0 3 3 8】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ 5 れがある。 '  [0 3 3 8] Furthermore, if the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus may not be used. . '
【0 3 3 9】 そこで、 請求の範囲第 5〜第 8項に記載された発明は、 接着材リ ールの交換が簡単にでき、 電子機器の生産効率の向上を図ることができる接着材 テープの接続方法の提供を目的とする。  [0339] Therefore, the inventions described in claims 5 to 8 are directed to an adhesive material that can easily replace an adhesive material reel and can improve the production efficiency of electronic equipment. The purpose is to provide a method for connecting tapes.
【0 3 4 0】 次に、 図 8 A〜8 C、 図 3〜図 5を参照して本発明の第 1実施の L0 形態について説明する。 図 8 A〜 8 Cは第 1実施の形態にかかる接着材テープの 接続方法を示す図であり、図 8 Aは接着材リール同士の接続を示す斜視図であり、 図 8 Bは図 8 Aにおける接続部分の接続方法を示す斜視図であり、 図 8 Cは図 8 Aにおける接続部分の平面図である。  Next, a first embodiment L0 of the present invention will be described with reference to FIGS. 8A to 8C and FIGS. 3 to 5. FIG. 8A to 8C are views showing a method of connecting the adhesive tape according to the first embodiment, FIG. 8A is a perspective view showing the connection between the adhesive reels, and FIG. FIG. 8C is a perspective view showing a connection method of the connection portion in FIG. 8, and FIG. 8C is a plan view of the connection portion in FIG. 8A.
【0 3 4 1】 接着材テープ 1はリール 3、 3 aにそれそれ巻かれており、 各リ [5 —ル 3、 3 aには卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。 本実施の形態では、 接着材テープ 1は長さが約 5 0 mであり、 幅 W が約 5 mmである。  [0 3 4 1] Adhesive tape 1 is wound around reels 3 and 3a, and each reel has a core 5 and adhesive tape 1 on both width sides. A side plate 7 is provided. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 5 mm.
【0 3 4 2】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0334] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
20 【0 3 4 3】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などで構成されるが、 これらに制限さ れるものではない。 20 [0 3 4 3] The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate), but are not limited to these.
【0 3 4 4】 接着剤 1 1としては、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可 5 塑性樹脂と熱硬化性樹脂の混合系、 ホヅ トメルト系が用いられている。 かかる樹 脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂 系があり、また熱硬ィ匕性樹脂系としてはエポキシ樹脂系、ビニルエステル系樹脂、 アクリル樹脂系、 シリコーン樹脂系が用いられる。 [0334] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such resins include styrene resin as thermoplastic resin, and polyester resin. Epoxy resin, vinyl ester resin, acrylic resin, and silicone resin.
【0 3 4 5】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 Au , A g , P t , N i , C u , W, S b、 S n , はんだなどの金属 粒子やカーボン、 黒鉛などがあり、 導電粒子 1 3は、 これら及び非導電性のガラ ス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電粒子 1 3を 構成する材料からなる導電層を被覆等により形成したものでもよい。 さらに前記 したような導電粒子 1 3を絶縁層で被覆してなる絶縁被覆粒子や、 導電粒子 1 3 と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック 等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧により変形性 を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面積が増加し信 頼性が向上するので好ましい。 特に高分子類を核とした場合、 導電粒子 1 3は、 はんだのように融点を示さないので、 軟化の状態を接続温度で広く制御でき、 電 極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい [0345] In the adhesive 11, conductive particles 13 are dispersed. The conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, and graphite.The conductive particles 13 include A conductive layer made of the material constituting the conductive particles 13 described above may be formed by coating a non-conductive glass, ceramic, plastic, or other polymer nucleus material or the like. Further, insulating coated particles obtained by coating the above-described conductive particles 13 with an insulating layer, a combination of the conductive particles 13 and the insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, etc., it is deformable by heating or pressurizing, and the distance between the electrodes after connection is reduced. This is preferable because the contact area with the circuit is increased and the reliability is improved. Especially when using polymers as the core, the conductive particles 13 do not show a melting point like solder, so that the softening state can be controlled widely by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness More preferable because a connecting member can be obtained
【0 3 4 6】 次に、 本実施の形態にかかる接着材テープ 1の使用方法について 説明する。 図 3に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端をガイ ドビン 2 2に掛けて卷取りリール 1 7に取り付け、接着材テープ 1を繰り出す（図 3中矢印 E )。そして、 回路基板 2 1上に接着材テープ 1を配置して、両リール 3 a、 1 7間に配置された加熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧 接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に卷き取る。 [0334] Next, a method of using the adhesive tape 1 according to the present embodiment will be described. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is inserted into the guide bin 22. The tape is attached to the take-up reel 17 and the adhesive tape 1 is paid out (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 a and 17. The adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
【0 3 4 7】 上記の圧着後（仮接続)、 回路基板 2 1の電極と配線回路（電子部 品） 2 3の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 2 1に圧着された接着剤 1 1に配線回路 (又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へヅド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する。[0334] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. Polyethylene material 2 4 The wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressing head 19 through the heating circuit. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 3 4 8】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。したがって、リ一ル 3 aに巻いた接着材テープ 1の使用量も多くなり、 リール 3 aに卷いた接着材テープ 1は比較的短時間で卷取りリール 1 7に巻き取 られて、 リール 3 aに卷かれた接着材テープ 1のェンドマーク 2 8が露出される[0334] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. End mark 2 8 of adhesive tape 1 wound on a is exposed
(図 8 A参照)。 (See Figure 8A).
【0 3 4 9】 本発明の接着材テープの接続方法は、 （a )卷取りリール 1 7をそ のまま使用し、 使用済みの接着材テープ 1の卷きが残り少なくなった接着剤テ一 プを交換し、新たな接着剤テープと卷取りリール 1 7を接続する場合と、 （b )卷 取りリール 1 7として使用済みの接着材テープ 1の巻きが残り少なくなつた接着 剤テープを使用し、 新たな接着剤テープと卷きが残り少なくなつた接着剤テープ を接続する場合がある。  [0334] The adhesive tape connecting method of the present invention comprises the steps of: (a) using the take-up reel 17 as it is; When replacing the tape and connecting a new adhesive tape to the take-up reel 17, and (b) using the adhesive tape 1 with a small number of used adhesive tapes 1 remaining as the take-up reel 17 In some cases, a new adhesive tape and an adhesive tape with few remaining windings may be connected.
【0 3 5 0】 （b ) の場合、 図 8 Aに示すように、 リール 3 aの接着材テープ 1にェンドマ一ク 2 8が露出したところで、 リール 3 aを新たな接着材リール 3 と交換するため、 リール 3 aの接着材テープ （一方の接着材テープ） 1の終端部 3 0と、 新たな接着材リール 3に巻かれた接着材テープ （他方の接着材テープ） の始端部 3 2とを接続する （図 8 A参照）。  In the case of (b), as shown in FIG. 8A, when the end mark 28 is exposed on the adhesive tape 1 on the reel 3a, the reel 3a is replaced with the new adhesive reel 3. For replacement, the end 30 of the adhesive tape (one adhesive tape) 1 on the reel 3 a and the beginning 3 of the adhesive tape (the other adhesive tape) wound on a new adhesive reel 3 Connect to 2 (see Fig. 8A).
【0 3 5 1】 この接着材テープ 1の接続は、 図 8 B及び図 8 Cに示すように、 接着材リ一ル 3 aの接着材テープ 1の終端部 3 0と、 新たな接着材リ一ル 3の接 着材テープ 1の始端部 3 2とについて、 終端部 3 0の基材 9面に始端部 3 2の接 着剤 1 1面を重ね合わせる。 そして、 重ね合わせ部分に略コ字状の係止ピン 4 6 を挿入して接着材テープ 1の終端部 3 0と、 新たな接着材リール 3の接着材テ一 プ 1の始端部 3 2とを接続する。 【0 3 5 2】 これにより、使用済みのリール 3 aに卷かれた接着材テープ 1と、 新たなリ一ル 3に巻かれた接着材テープ 1とが接続される。 このように、 卷出し が終了した接着材テープ 1の終端部 3 0と、 新たに装着する接着材テープ 1の始 端部 3 2とを係止ピン 4 6で固定するので、 接続が簡単である。 [0355] As shown in Figs. 8B and 8C, the connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a to the new adhesive material. With respect to the starting end 32 of the adhesive tape 1 of the reel 3, the adhesive 11 of the starting end 32 is superimposed on the base 9 surface of the end 30. Then, a substantially U-shaped locking pin 46 is inserted into the overlapped portion, and the end portion 30 of the adhesive tape 1 and the start end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are formed. Connect. [0355] Thus, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. In this way, the end 30 of the adhesive tape 1 after the unwinding and the start 32 of the adhesive tape 1 to be newly mounted are fixed by the locking pins 46, so that connection is easy. is there.
【0 3 5 3】 次に、 使用済みのリール 3 aと新たなリール 3を入れ替えて、 新 たなリール 3を接着装置 1 5に装着する。 したがって、 卷取りリール 1 7に新た に接着材テープ 1を装着する作業が必要ない。  [0355] Next, the used reel 3a and the new reel 3 are exchanged, and the new reel 3 is mounted on the bonding apparatus 15. Therefore, there is no need to newly attach the adhesive tape 1 to the take-up reel 17.
【0 3 5 4】 （a ) の卷取りリール 1 7をそのまま使用し、 使用済みの接着材 テープ 1の巻きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、 新たな接着剤テープと卷取りリール 1 7を接続する場合は、 使用済みリール 3 a の接着材テープ 1のェンドマ一ク 2 8が露出したときに接着材テープ 1のェンド マーク 2 8付近を切断し、 卷取りリール 1 7側に残った接着材テープの終端部 3 0と新たな接着材リール 3の接着材テープ 1の始端部 3 2を重ね合わせる。 そし て、 両者の重ね合わせ部分に略コ字状の係止ピン 4 6を挿入して接着材テープ 1 の終端部 3 0と、 新たな接着材リ一ル 3の接着材テープ 1の始端部 3 2とを接続 する。  [0 3 5 4] (a) The take-up reel 17 is used as it is, and the used adhesive tape is replaced with a new adhesive tape by replacing the used adhesive tape 1 with a small amount of remaining tape with a new adhesive tape. When connecting the tape to the take-up reel 17, cut off the vicinity of the end mark 28 of the adhesive tape 1 when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed, and take up the tape. The end 30 of the adhesive tape remaining on the reel 17 side and the start 32 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Then, a substantially U-shaped locking pin 46 is inserted into the overlapping portion of the two to insert the end 30 of the adhesive tape 1 and the start of the adhesive tape 1 of the new adhesive reel 3. 3 Connect to 2.
【0 3 5 5】 卷取りリール 1 7では基材 9だけを卷き取っているので、 接着材 リールの数本分を巻き取ることができる。 このため、 卷取りリール 1 7の交換回 数を少なくすることができ、 作業効率が良い。  [0 3 5 5] Since only the base material 9 is wound on the take-up reel 17, several adhesive reels can be wound. For this reason, the number of times of changing the take-up reel 17 can be reduced, and work efficiency is good.
【0 3 5 6】 次に、 請求の範囲第 5〜第 8項に記載された発明の第 2〜第 4実 施の形態について説明するが、 以下に説明する実施の形態では同一の部分には同 一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した 第 1実施の形態と異なる点を主に説明する。  Next, second to fourth embodiments of the present invention described in claims 5 to 8 will be described. However, in the embodiments described below, the same portions will be described. The same reference numerals are used to denote the same parts, and a detailed description of those parts is omitted. Hereinafter, points different from the first embodiment will be mainly described.
【0 3 5 7】 図 9に示す第 2実施の形態では、 一方及び他方の端部に設けた爪 部 4 8、 4 9と両端の爪部 4 8、 4 9を結ぶ弾性部材 5 0とを備えた係止部材 4 7を用いて一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2とを接続するようにしている。 詳しくは、 一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2とを突き合わせ、 係止部材 4 7の一端に 設けた爪部 4 8を終端部 3 0に係止し、 他端に設けた爪部 4 9を始端部 3 2に係 止し、 一方の爪部 4 8と他方の爪部 4 9とを弾性部材 5 0で引き寄せるようにし ている。 尚、 爪部 4 8、 4 7は板部材の裏面に先端の尖った複数本の爪 5 1を設 けたものである。 In the second embodiment shown in FIG. 9, the elastic members 50 connecting the pawls 48, 49 provided at one end and the other end and the pawls 48, 49 at both ends are provided. The end 30 of one adhesive tape 1 and the start of the other adhesive tape 1 using a locking member 47 provided with 3 and 2 are connected. Specifically, the end 30 of one adhesive tape 1 and the starting end 32 of the other adhesive tape 1 are abutted, and the claw 48 provided at one end of the locking member 47 is connected to the end 30. The claw portion 49 provided at the other end is engaged with the start end portion 32 so that the one claw portion 48 and the other claw portion 49 are attracted by the elastic member 50. The claw portions 48 and 47 are provided with a plurality of sharpened claws 51 on the back surface of the plate member.
【 0 3 5 8】 係止部材 4 7の一端に設けた爪部 4 8を終端部 3 0に係止し、 そ の後に他端に設けた爪部 4 9を始端部 3 2に係止して両者を互いに接続するので、 接続が容易である。 また、 一方の爪部 4 8と他方の爪部 4 9との間に弾性部材 5 0を備えているので、 弾性部材 5 0が伸びて係止部材 4 7の他方の爪部 4 9を他 方の接着材テープ 1の始端部 3 2の任意の位置に係止することができるので、 接 続の自由度が高い。  [03558] The claw portion 48 provided at one end of the locking member 47 is locked to the terminal portion 30 and the claw portion 49 provided at the other end is subsequently locked to the starting end portion 32. Then, both are connected to each other, so that connection is easy. In addition, since the elastic member 50 is provided between the one claw portion 48 and the other claw portion 49, the elastic member 50 is extended, and the other claw portion 49 of the locking member 47 is connected to the other claw portion 49. Since it can be locked at any position of the starting end 32 of the adhesive tape 1, the degree of freedom of connection is high.
【 0 3 5 9】 図 1 0に示す第 3実施の形態では、 使用済みのリ一ル 3 aに卷か れた接着材テープ 1の終端部 3 0と、 新たな接着材リール 3の接着材テープ 1の 始端部 3 2とについて、 終端部 3 0の基材 9面に始端部 3 2の接着剤 1 1面を重 ね合わせ、 そして、 重ね合わせ部分を横断面略コ字状の弾性変形可能なクリップ 5 3で挟んで固定している。 重ね合わせ部分をクリヅプ 5 3で挟むだけで接続で きるので、 接続作業が容易である。  [0359] In the third embodiment shown in Fig. 10, the end portion 30 of the adhesive tape 1 wound around the used reel 3a and the new adhesive reel 3 are bonded. At the start end 3 2 of the material tape 1, the adhesive 1 1 of the start end 3 2 is superimposed on the surface 9 of the base material at the end 30, and the superposed portion has a substantially U-shaped elastic cross section. It is clamped between deformable clips 53 and fixed. Connection can be performed simply by sandwiching the overlapped portion between clips 53, so that connection work is easy.
【 0 3 6 0】 図 1 1に示す第 4実施の形態では、 第 1実施の形態において、 重 ね合わせ部分を横断面略コ字状の金属製の挟持片 5 5で被せ、 重ね合せ部分の両 面から挟持片 5 5を押しつぶして両者を接続している。 重ね合せ部分の両面から 挟持片 5 5を押しつぶして接続するので、 重ね合わせ部分で強固な接続を得るこ とができる。  In the fourth embodiment shown in FIG. 11, in the first embodiment, the overlapping portion is covered with a metal holding piece 55 having a substantially U-shaped cross section in the first embodiment. The nip pieces 55 are crushed from both sides to connect them. Since the holding pieces 55 are crushed from both sides of the overlapped portion for connection, a strong connection can be obtained at the overlapped portion.
【 0 3 6 1】 請求の範囲第 5〜第 8項に記載された発明は、 上述した実施の形 態に限らず、 請求の範囲第 5〜第 8項に記載された発明の要旨を逸脱しない範囲 で種々変形可能である。 【0 3 6 2】 例えば、 上述した第 1実施の形態において、 係止ピン 4 6は略コ 字状にすることなく、 1本の線状のピンであってもよく、 この場合には重ね合わ せ部分に複数本のピンを用いて固定することが望ましい。 The invention described in claims 5 to 8 is not limited to the above-described embodiment, and may depart from the gist of the invention described in claims 5 to 8 Various modifications can be made without departing from the scope. [0365] For example, in the above-described first embodiment, the locking pin 46 may be a single linear pin without being formed in a substantially U-shape. It is desirable to use a plurality of pins to fix the fixing portion.
【0 3 6 3】 第 2実施の形態において、 係止部材 4 7は接着材テープ 1の幅に 合わせて複数個使うようにしても良い。  [0366] In the second embodiment, a plurality of locking members 47 may be used according to the width of the adhesive tape 1.
【0 3 6 4】 第 3実施の形態及び第 4実施の形態において、 クリップ 5 3又は 挟持片 5 5を複数個使用し、 接着材テープ 1の重ね合せ部分の両側からそれそれ 固定するようにしても良い。  [0366] In the third and fourth embodiments, a plurality of clips 53 or sandwiching pieces 55 are used, and they are fixed from both sides of the overlapping portion of the adhesive tape 1 respectively. May be.
【0 3 6 5】 次に、 請求の範囲第 9〜第 1 3項に記載された発明について説明 する。  [0365] Next, the invention described in claims 9 to 13 will be described.
【0 3 6 6】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に巻かれた接着材テープの接続方法に関するものである。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape. The present invention relates to a method for connecting material tapes.
【0 3 6 7】 次に、 請求の範囲第 9〜第 1 3項に記載された発明の背景技術に ついて説明する。  [0365] Next, the background art of the invention described in claims 9 to 13 will be described.
【0 3 6 8】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。  [0368] Generally, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a pair chip mounting, and a circuit board or a circuit board are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method for making the connection.
【0 3 6 9】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。  [0365] Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape obtained by applying an adhesive to a base material in a reel shape. I have.
【0 3 7 0】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度である。  [0370] The conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
【0 3 7 1】 接着材テープを接着装置に装着する場合、 接着材テープのリール (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き 出された接着材テープの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに卷き取っている。 [0 3 7 1] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. And wound from the adhesive reel The adhesive is pressure-bonded to a circuit board or the like from the base material side of the released adhesive tape with a heating and pressing head, and the remaining base material is wound up on a take-up reel.
【0 3 7 2】 そして、 接着材リールの接着材テープが終了すると、 終了したリ 一ノレと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付け ている。  [0 3 7 2] When the adhesive tape on the adhesive reel ends, the finished reel and the winding reel on which the base material has been wound are removed, and a new winding reel and a new adhesive material are removed. The reel is mounted on the bonding machine, and the beginning of the adhesive tape is mounted on the take-up reel.
【0 3 7 3】 し力 し、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。 However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, there is a problem that the frequency of replacement of the adhesive reel is increased, and the replacement of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved.
【0 3 7 4】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜 3 mmと狭いため、 巻き 数を多くすると巻き崩れが生じるおそれがある。 また、 巻き数を多くするとテー プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロッキングの原因になるおそれがある。 [0374] In order to solve such a problem, it is possible to increase the amount of adhesive per reel and reduce the frequency of reel replacement by increasing the number of windings of the adhesive tape wound on the reel. Although it is conceivable, the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 3 7 5】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0375] Furthermore, when the number of windings of the adhesive tape is increased, the diameter of the reel also increases, which makes it difficult to mount the tape on an existing bonding device, and may render the existing bonding device unusable.
【0 3 7 6】 そこで、 請求の範囲第 9〜第 1 3項に記載された発明は、 接着材 リールの交換が簡単にでき、 電子機器の生産効率の向上を図ることができる接着 材テープの接続方法の提供を目的とする。  [0376] Therefore, the inventions described in claims 9 to 13 are directed to an adhesive tape capable of easily replacing an adhesive reel and improving the production efficiency of electronic equipment. The purpose is to provide a connection method.
【0 3 7 7】 次に、 添付図面を参照しながら請求の範囲第 9〜第 1 3項に記載 された発明の実施の形態について説明するが、 まず図 1 2 A， 1 2 B、 図 3〜図 5を参照して請求の範囲第 9〜第 1 3項に記載された発明の第 1実施の形態につ いて説明する。 図 1 2 A〜 1 2 Cは第 1実施の形態にかかる接着材テープの接続 方法を示す図であり、 図 1 2 Aは接着材リール同士の接続を示す斜視図であり、 図 1 2 Bは図 1 2 Aにおける接続部分の接続方法を示す斜視図である。 Next, embodiments of the invention described in claims 9 to 13 will be described with reference to the accompanying drawings. First, FIGS. 12A and 12B, FIG. 3 to FIG. 5, the first embodiment of the invention described in claims 9 to 13 will be described. Will be described. FIGS. 12A to 12C are views showing a method of connecting the adhesive tape according to the first embodiment, and FIG. 12A is a perspective view showing the connection between the adhesive reels. FIG. 2 is a perspective view showing a connection method of a connection portion in FIG. 12A.
【0 3 7 8】 接着材テープ 1はリール 3、 3 aにそれそれ巻かれており、 各リ ール 3、 3 aには巻き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。 本実施の形態では、 接着材テープ 1は長さが約 5 0 mであり、 幅 W が約 3 mmである。  [0 3 7 8] The adhesive tape 1 is wound around each of the reels 3 and 3a, and each reel 3 and 3a has a side plate disposed on both width sides of the winding core 5 and the adhesive tape 1. 7 are provided. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 3 mm.
【0 3 7 9】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0379] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 3 8 0】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するも のではない。  [0380] The substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and the releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
【0 3 8 1】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬ィ匕性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹脂、 ァク リル樹脂系、 シリコーン樹脂系が用いられる。  [0380] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type. A silicone resin system is used.
【0 3 8 2】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u , A g , P t , N i， C u , W, S b、 S n , はんだなどの金属 粒子や力一ボン、黒鉛などがあり、これら及び非導電性のガラス、セラミヅクス、 プラスチヅク等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接銃時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 [0380] The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer described above may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. A conductive layer formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, Sometimes the contact surface with the circuit This is preferable because the product increases and the reliability improves. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
【 0 3 8 3】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 3に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷 取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端を卷取り リール 7に取り付け、接着材テープ 1を繰り出す（図 3中矢印 E )。そして、 回路 基板 2 1上に接着材テープ 1を配置して、 両リール 3 a、 1 7間に配置された加 熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を回路基 板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に卷き取る。  [0383] Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the take-up reel 7. Attach and pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the two reels 3 a and 17. Then, the adhesive 11 1 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
【 0 3 8 4】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 品） 2 3の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 2 1に圧着された接着剤 1 1に配線回路 (又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へヅド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する。 [0384] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. The wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【 0 3 8 5】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。したがって、リール 3 aに巻いた接着材テープ 1の使用量も多くなり、 リ一ル 3 aに巻いた接着材テープ 1は比較的短時間で卷取りリ一ル 1 7に卷き取 られて、 リール 3 aに卷かれた接着材テープ 1のェンドマ一ク 2 8が露出される[0385] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP. 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed.
(図 1 2 A参照)。 (See Figure 12A).
【 0 3 8 6】 請求の範囲第 9〜第 1 3項に記載された発明の接着材テープの接 続方法は、 （a )卷取りリール 1 7をそのまま使用し、使用済みの接着材テープ 1 の巻きが残り少なくなった接着剤テープを交換し、 新たな接着剤テープと卷取り リール 1 7を接続する場合と、 （b )卷取りリール 1 7として使用済みの接着材テ ープ 1の巻きが残り少なくなった接着剤テープを使用し、 新たな接着剤テープと 卷きが残り少なくなつた接着剤テープを接続する場合がある。 [0386] The method for connecting an adhesive tape according to the invention described in claims 9 to 13 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining winding of 1 and run it with a new adhesive tape When the reel 17 is connected, (b) Use the adhesive tape with the remaining tape of the used adhesive tape 1 remaining as the take-up reel 17 and use the new adhesive tape and the remaining winding. In some cases, a connected adhesive tape is connected.
【0 3 8 7】 （b ) の場合、 図 1 2 Aに示すように、 リ一ル 3 aの接着材テー プ 1にエンドマーク 2 8が露出したところで、 リール 3 aを新たな接着材リール 3と交換するため、 リール 3 aの接着材テープ （一方の接着材テープ） 1の終端 部 3 0と、新たな撵着材リ一ル 3に巻かれた接着材テープ（他方の接着材テープ） の始端部 3 2とを接続する （図 1 2 A参照）。  In the case of (b), as shown in FIG. 12A, when the end mark 28 is exposed on the adhesive tape 1 of the reel 3a, the reel 3a is replaced with a new adhesive. In order to replace the adhesive tape with the reel 3, the end tape 30 of the adhesive tape 1 on the reel 3a (one adhesive tape) 1 and the adhesive tape wound on the new adhesive material reel 3 (the other adhesive tape) Connect the start end 32 of the tape (see Fig. 12A).
【0 3 8 8】 この接着材テープ 1の接続は、 図 1 2 Bに示すように、 接着材リ ール 3 aの接着材テープ 1の終端部 3 0と、 新たな接着材リール 3の接着材テー プ 1の始端部 3 2とについて、 終端部 3 0の基材 9面に始端部 3 2の接着剤 1 1 を重ね合わせる。 両者の重ね合わせ長さ Hを接着剤テープ 1の幅 Wの約 2 . 5と して、 テーブル 3 6に置き、 接着装置 1 5の加熱加圧へッド 1 9で加熱加圧して 接着する。 これにより、 使用済みのリール 3 aに卷かれた接着材テープ 1と、 新 たなリール 3に卷かれた接着材テープ 1とが接続される。 次に、 使用済みのリー ル 3 aと新たなリ一ル 3を入れ替えて、 新たなリ一ル 3を接着装置 1 5に装着す る。 したがって、 卷取りリール 1 7に接着材テ一プを装着する作業が必要ない。 【0 3 8 9】 この実施の形態では、 加熱加圧へヅド 1 9を利用しているので、 接着剤同士の圧着用器具を別途用いることなく、 接着材 1が卷かれたリール 3、 3 aの交換ができる。  [0388] The connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 as shown in Fig. 12B. With respect to the starting end 32 of the adhesive tape 1, the adhesive 11 of the starting end 32 is superimposed on the base material 9 surface of the end 30. The overlapping length H of the two is set to about 2.5 of the width W of the adhesive tape 1, placed on the table 36, and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 . Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. Next, the used reel 3 a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach an adhesive tape to the take-up reel 17. [0380] In this embodiment, since the heating and pressing head 19 is used, the reel 3 on which the adhesive 1 is wound without using a separate press-fitting device for the adhesives. 3A can be exchanged.
【0 3 9 0】 （a ) の卷取りリール 1 7をそのまま使用し、 使用済みの接着材 テープ 1の卷きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、 新たな接着剤テープと卷取りリール 1 7を接続する場合は、 使用済みリール 3 a の接着材テープ 1のェンドマ一ク 2 8が露出したときに接着材テープ 1のェンド マーク 2 8付近を切断し、 巻取りリール 1 7側に残った接着材テープの終端部 3 0と新たな接着材リール 3の接着材テープ 1の始端部 3 2を重ね合わせる。 そし 03 009694 て、 両者の重ね合わせ部分を接着装置 1 5の加熱加圧へッド 1 9で加熱加圧して 接着する。 巻取りリール 1 7では基材 9だけを卷き取っているので、 接着材リ一 ルの数本分を卷き取ることができるので、 卷取りリール 1 7の交換回数を少なく することができ、 作業効率が良い。 [0390] Using the take-up reel 17 of (a) as it is, replacing the used adhesive tape 1 with the remaining tape with less winding with a new adhesive tape, and performing new bonding When the adhesive tape is connected to the take-up reel 17, cut off the area around the end mark 28 of the adhesive tape 1 when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed. The end 30 of the adhesive tape remaining on the take-up reel 17 side and the start 32 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Soshi 03 009694 Then, the overlapped portion of both is heated and pressed by the heating and pressing head 19 of the bonding device 15 to bond. Since only the base material 9 is wound on the take-up reel 17, it is possible to wind up several pieces of the adhesive material reel, so that the number of times of changing the take-up reel 17 can be reduced. , Work efficiency is good.
【0 3 9 1】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  Here, a method of manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 3 9 2】 卷出機 2 5から巻きだされた基材 （セパレー夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、 卷取機 3 1で原反を卷き取る。 巻き取られた接着材テープの原反は、 スリツ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 卷き芯に側 板 7 , 7が両側から装着されて、 あるいは、 側板付卷き芯に巻き取られ、 除湿材 とともに梱包され、 好ましくは、 低温 ( - 5 °C〜一 1 0 °C) に管理されて出荷さ れる。  [0 3 9 2] An adhesive 11 containing resin and conductive particles 13 is applied to the base material (separate resin) unwound from the unwinding machine 25 by a co-exit 27 and dried. After drying in the furnace 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core, and side plates 7 and 7 are attached to the winding core from both sides. Alternatively, it is wound around a core with a side plate, packed with a dehumidifying material, and preferably shipped at a low temperature (−5 ° C. to 110 ° C.).
【0 3 9 3】 次に、 請求の範囲第 9〜第 1 3項に記載された発明の他の実施の 形態について説明するが、 以下に説明する実施の形態では上述した実施の形態と 同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  [0390] Next, another embodiment of the invention described in claims 9 to 13 will be described. However, the following embodiment is the same as the above-described embodiment. The same reference numerals are used to denote the same parts, and detailed description of those parts is omitted. Hereinafter, points different from the above-described embodiment will be mainly described.
【0 3 9 4】 図 1 3に示す第 2実施の形態では、 接着材テープ 1の重ね合わせ 部分 3 4を、 表面にあるぎざぎざ （凹凸） 4 4が互いに嵌合する一方の金型 5 6 と他方の金型 5 7とで挟持し、 重ね合わせ部分 3 4に凹凸 5 8を形成する。 この ように凹凸 5 8を形成することにより、 重ね合わせ部分 3 4における接着面積を 増やすことができ、 且つ重ね合わせ部分 3 4の凹凸 5 8の係合により引張り方向 [0396] In the second embodiment shown in FIG. 13, the overlapping portion 34 of the adhesive tape 1 is replaced with one of the molds 5 6 on which the jaggedness (unevenness) 44 on the surface is fitted. And the other mold 57 to form an unevenness 58 in the overlapped portion 34. By forming the irregularities 58 in this manner, the bonding area at the overlapping portion 34 can be increased, and the pulling direction can be increased by the engagement of the irregularities 58 of the overlapping portion 34.
(接着材テープの長手方向） の強度を高くできる。 凹凸形成の際に、 接着剤 1 1 が流動して重ね合わせ部分の端面同士が接着剤により接着され、 さらに、 重ね合 わせ部分 3 4の引張り方向の強度が高まる。 (Longitudinal direction of the adhesive tape). At the time of forming the unevenness, the adhesive 11 flows and the end surfaces of the overlapped portions are bonded to each other by the adhesive, and the strength of the overlapped portions 34 in the tensile direction is further increased.
【0 3 9 5】 図 1 4 A及び図 1 4 Bに示す第 3実施の形態では、 新しい接着材 1が卷かれたリール 3の始端部 3 2を略 V字形状に折り曲げ、 使用済みリ一ル 3 aに卷かれた接着材テープ 1の終端部 3 0も略 V字形状に折り曲げて、 両者を鉤 状にして接着剤 1 1を対面させて互いに係止し（図 1 4 A)、加熱加圧へヅド 1 9 で加熱加圧して、 両者を接続する （図 1 4 B )。 この第 3実施の形態では、 終端部 3 0と始端部 3 2とを鉤状に連結するので強固に連結できるとともに、 互いに接 着剤 1 1を重ねて接続するので、 更に強固な接続を得ることができる。 上記と同 様に重ねた部分の接着剤が流動し端面でも接着されるので、 さらに強固な接続を 得ることができる。 [0395] In the third embodiment shown in Figs. 14A and 14B, a new adhesive material is used. The leading end 3 2 of the reel 3 on which 1 is wound is bent into a substantially V shape, and the end portion 30 of the adhesive tape 1 wound on the used reel 3 a is also bent into a substantially V shape. The hooks are hooked and the adhesives 11 are opposed to each other and locked together (Fig. 14A), and heated and pressed with a heating and pressing head 19 to connect them (Fig. 14B). In the third embodiment, the terminal end portion 30 and the start end portion 32 are connected in a hook shape, so that they can be connected firmly. Further, since the adhesive 11 is overlapped and connected to each other, a stronger connection is obtained. be able to. In the same manner as described above, the adhesive in the overlapped portion flows and is also adhered to the end face, so that a stronger connection can be obtained.
【0 3 9 6】 図 1 5 A及び図 1 5 Bに示す第 4実施の形態では、 第 1実施の形 態において、 加熱加圧前又は、 加熱加圧と同時に重な合わせ部分 3 4に貫通孔 5 9をあける。 貫通孔 5 9をあけることで、 貫通孔 5 9の周囲から加熱加圧時に接 着剤 1 1が染み出し、 これらが接着するので、 接着力を高めることができ、 重ね 合わせ部 3 4では強固な接続を得ることができる。  [0396] In the fourth embodiment shown in Figs. 15A and 15B, in the first embodiment, the overlapped portions 34 before or simultaneously with the heating and pressurizing are added to the overlapped portions 34. Drill through holes 59. By drilling the through-hole 59, the adhesive 11 leaks out from the periphery of the through-hole 59 at the time of heating and pressurization, and they adhere to each other. Connection can be obtained.
【0 3 9 7】 請求の範囲第 9〜第 1 3項に記載された発明は、 上述した実施の 形態に限らず、 請求の範囲第 9〜第 1 3項に記載された発明の要旨を逸脱しない 範囲で種々変形可能である。  [0397] The invention described in claims 9 to 13 is not limited to the above-described embodiment, but includes the gist of the invention described in claims 9 to 13 Various modifications can be made without departing from the scope.
【0 3 9 8】 例えば、 上述した第 2実施の形態において、 凹凸 5 8は山型にす ることなく、 丸みを帯びた丸型であってもよい。  [0398] For example, in the above-described second embodiment, the unevenness 58 may be a rounded round shape without forming a mountain shape.
【0 3 9 9】 第 4実施の形態において、 貫通孔 5 9の数は、 特に制限はなく幾 つあってもよい。 また、 貫通孔 5 9の径も制限されない。 また、 第 2、 第 3実施 の形態において、 更に重ね合わせ部分 3 4に貫通孔 5 9を形成してもよい。 [0390] In the fourth embodiment, the number of through holes 59 is not particularly limited, and may be any number. Further, the diameter of the through hole 59 is not limited. Further, in the second and third embodiments, a through hole 59 may be formed in the overlapping portion 34.
【0 4 0 0】 次に、 請求の範囲第 1 4〜第 1 8項に記載された発明について説 明する。 [0400] Next, the invention described in claims 14 to 18 will be described.
【0 4 0 1】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に巻かれた接着材テープの接続方法に関するものである。 【0 4 0 2】 次に、 請求の範囲第 1 4〜第 1 8項に記載された発明の背景技術 について説明する。 The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. The present invention relates to a method for connecting material tapes. Next, the background art of the invention described in claims 14 to 18 will be described.
【0 4 0 3】 一般に、液晶パネル、 P D P (プラズマディスプレイパネル)、 E L (蛍光ディスプレイ） パネル、 ベアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。  [0430] In general, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a bare chip are adhered and fixed to a circuit board and a circuit board, and both electrodes are electrically connected to each other. Adhesive tape is used as a method for making the connection.
【0 4 0 4】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に巻き取ったものが開示されている。  [0404] Japanese Patent Application Laid-Open Publication No. 2001-280405 discloses a tape in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. .
【0 4 0 5】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度 ある。  [0405] This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
【0 4 0 6】 接着材テープを接着装置に装着する場合、 接着材テープのリ一ル (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 接着材リールの装着後、 接着材 リールから卷き出された接着材テ一プの基材側から加熱加圧へッドで接着剤を回 路基板等に圧着し、 残った基材を卷取りリールに卷き取っている。  [0406] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as "adhesive reel") to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. After mounting the adhesive reel, the adhesive is pressed against the circuit board, etc. from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining base material is wound. It is wound on a take-up reel.
【0 4 0 7】 そして、 接着材リールの接着材テープが終了すると、 終了したリ —ルと、 基材を巻き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープを接着装置のガイドに掛けるとと もに始端を卷取りリ一ルに取り付けている。  [0407] When the adhesive tape on the adhesive reel is completed, the reel that has been completed and the take-up reel that has taken up the base material are removed, and a new take-up reel and a new adhesive reel are removed. Is attached to the bonding device, the adhesive tape is hung on the guide of the bonding device, and the starting end is attached to the winding reel.
【0 4 0 8】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある c [0408] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. C Therefore, in the manufacturing factory of the electronic device, the frequency of replacing the adhesive reel is increased, there is a problem that time and labor to replace the adhesive reels can not be improved production efficiency of electronic equipment for such
【0 4 0 9】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す 4 ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 巻き 数を多くすると卷き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロヅキングの原因になるおそれがある。 [0409] In response to such a problem, by increasing the number of adhesive tapes wound on the reel, the amount of adhesive per reel is increased, and the frequency of reel replacement is reduced. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, there is a possibility that collapse will occur if the number of turns is increased. Also, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 4 1 0】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0410] Furthermore, when the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding device, and may render the existing bonding device unusable.
【0 4 1 1】 一方、 接着材テープと接着材テープを粘接着材テープで貼り付け ようとしても十分な接着力で接着することができなかった。 これは、 接着材テ一 プに、 接着材との剥離性を良好とするためフッ素系離型剤ゃシリコーン系離型剤 等が塗布され、 その影響によるためである。  [0411] On the other hand, even when the adhesive tape and the adhesive tape were stuck together with the adhesive tape, they could not be adhered with sufficient adhesive strength. This is because a fluorine-based release agent, a silicone-based release agent, or the like is applied to the adhesive tape in order to improve the releasability from the adhesive, and this is due to the influence.
【0 4 1 2】 そこで、 請求の範囲第 1 4〜第 1 8項に記載された発明は、 特に 接着材テープの基材がシリコーン処理された基材を用いている場合でも、 接着材 リールの交換が簡単にでき、 電子機器の生産効率の向上を図ることができる接着 材テープの接続方法の提供を目的とする。  [0412] Therefore, the invention described in claims 14 to 18 may be applied to an adhesive reel even if the adhesive tape is made of a silicone-treated substrate. It is an object of the present invention to provide a method for connecting an adhesive tape, which can easily replace the adhesive tape and improve the production efficiency of electronic equipment.
【0 4 1 3】 次に、 添付図面を参照しながら請求の範囲第 1 4〜第 1 8項に記 載された発明の実施の形態について説明するが、 まず図 1 6 A、 1 6 B、 図 3〜 図 5を参照して請求の範囲第 1 4〜第 1 8項に記載された発明の第 1実施の形態 について説明する。 図 1 6 A及び 1 6 Bは第 1実施の形態にかかる接着材テープ の接続方法を示す図であり、 図 1 6 Aは接着材リール同士の接続を示す斜視図で あり、 図 1 6 Bは図 1 6 Aにおける接続部分 （b ) の接続方法を示す斜視図であ る。  Next, embodiments of the invention described in claims 14 to 18 will be described with reference to the accompanying drawings. First, FIGS. 16A and 16B A first embodiment of the invention described in claims 14 to 18 will be described with reference to FIGS. FIGS. 16A and 16B are views showing a method of connecting the adhesive tape according to the first embodiment, and FIG. 16A is a perspective view showing the connection between the adhesive reels. FIG. 16 is a perspective view showing a connection method of a connection portion (b) in FIG. 16A.
【0 4 1 4】 接着材テープ 1はリール 3、 3 aにそれぞれ巻かれており、 各リ —ル 3、 3 aには巻き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。  [0 4 1 4] Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both sides of core 5 and adhesive tape 1, respectively. Are provided.
【0 4 1 5】 接着材テープ 1は、 シリコーン処理基材 9と、 シリコーン処理基 材 9の一側面に塗布された接着剤 1 1とから構成されている。 [0 4 15] The adhesive tape 1 is composed of a siliconized base material 9 and a siliconized base. And an adhesive 11 applied to one side of the material 9.
【0 4 1 6】 シリコーン処理基材 9は、 強度及び異方導電材を構成する接着剤 の剥] 生の面から 0 P P (延伸ポリプロピレン）、 ポリテトラフルォ口エチレン、 P E T (ポリエチレンテレフ夕レート）等の基材を用い、 この表面にシリコーン樹 脂等により表面処理されている。  [0 4 16] The silicone-treated substrate 9 has a strength and an adhesive that constitutes an anisotropic conductive material is peeled off.] From a raw surface, 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate), etc. The surface of this substrate is treated with a silicone resin or the like.
【◦4 1 7】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬化性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹脂、 ァク リル樹 S旨系、 シリコーン樹旨系が用いられる。  [◦4 17] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin type as a thermosetting resin type. A silicone tree system is used.
【0 4 1 8】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 Au , A ：， P t , N i , C u , W, S b、 S n , はんだなどの金属 粒子や力一ボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 [0418] In the adhesive 11, conductive particles 13 are dispersed. The conductive particles 13 include metal particles such as Au, A :, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer described above may be formed by coating a polymer core material such as glass, ceramics, and plastic on the core. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
【0 4 1 9】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 3に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷 取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端を卷取り リール 1 7に取り付け、接着材テープ 1を繰り出す（図 3中矢印 E：)。そして、 回 路基板 2 1上に接着材テープ 1を配置して、 両リール 3 a、 1 7間に配置された Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are attached to the bonding apparatus 15 and the tip of the adhesive tape 1 wound on the reel 3a is taken up by the take-up reel 17 , And pay out the adhesive tape 1 (arrow E in Fig. 3). Then, the adhesive tape 1 was placed on the circuit board 2 1 and placed between the two reels 3 a and 17.
69 加熱加圧へヅド 1 9で接着材テープ 1をシリコーン処理基材 9側から圧接し、 接 着剤 1 1を回路基板 2 1に圧着する。 その後、 シリコーン基材 9を卷取りリール 1 7に卷き取る。 69 The adhesive tape 1 is pressed from the side of the silicone-treated base material 9 with the heating and pressing head 19, and the adhesive 11 is pressed onto the circuit board 21. Thereafter, the silicone base material 9 is wound up on a take-up reel 17.
【 0 4 2 0】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 口 ) 2 3の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 2 1に圧着された接着剤 1 1に配線回路 (又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へヅド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する。 [0420] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening) 23 are aligned and permanently connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. The wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【 0 4 2 1】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。したがって、リール 3 aに卷いた接着材テープ 1の使用量も多くなり、 リール 3 aに卷いた接着材テープ 1は比較的短時間で卷取りリール 1 7に巻き取 られて、 リール 3 aに卷かれた接着材テープ 1のェンドマ一ク 2 8が露出される[0421] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound up on the winding reel 17 in a relatively short time, and is wound on the reel 3a. The end mark 2 8 of the wound adhesive tape 1 is exposed.
(図 1 6 A参照）。 (See Figure 16A).
【 0 4 2 2】 請求の範囲第 1 4〜第 1 8項に記載された発明の接着材テープの 接続方法は、 （a )巻取りリール 1 7をそのまま使用し、使用済みの接着材テープ 1の巻きが残り少なくなった接着剤テープを交換し、 新たな接着剤テープと卷取 りリール 1 7を接続する場合と、 （b )卷取りリール 1 7として使用済みの接着材 テープ 1の卷きが残り少なくなつた接着剤テープを使用し、 新たな接着剤テープ と卷きが残り少なくなった接着剤テープを接続する場合がある。  The connection method of the adhesive tape according to the invention described in claims 14 to 18 is as follows: (a) The take-up reel 17 is used as it is, and the used adhesive tape is used. Replace the adhesive tape with the remaining winding of 1 remaining, and connect the new adhesive tape to the take-up reel 17; and (b) the winding of the adhesive tape 1 used as the take-up reel 17 In some cases, a new adhesive tape is used to connect to an adhesive tape with less winding, using an adhesive tape with less remaining adhesive.
【 0 4 2 3】 （b ) の場合、 図 1 6 Aに示すように、 リール 3 aの接着材テ一 プ 1にエンドマーク 2 8が露出したところで、 リール 3 aを新たな接着材リール 3と交換するため、 リール 3 aの接着材テープ （一方の接着材テープ） 1の終端 部 3 0と、新たな接着材リール 3に巻かれた接着材テープ（他方の接着材テープ） P T/JP2003/009694 の始端部 3 2とを接続する。 [0423] In the case of (b), as shown in Fig. 16A, when the end mark 28 is exposed on the adhesive tape 1 of the reel 3a, the reel 3a is replaced with a new adhesive reel. Adhesive tape on reel 3 a (one adhesive tape) 1 to replace with 3 and adhesive tape wound on new adhesive reel 3 (the other adhesive tape) Connect to the beginning 32 of PT / JP2003 / 009694.
【0 4 2 4】 この接着材テープ 1の接続は、 図 1 6 Bに示すように、 接着材リ ール 3 aの接着材テープ 1の終端部 3 0と、 新たな接着材リ一ル 3の接着材テー プ 1の始端部 3 2とを突き合せ、両接着材テープ 1、 1のシリコーン処理基材 9、 9の表面に跨ってシリコーン粘着テープ 6 0を貼り付けて、 両接着材テープ 1、 1を接続する。  [0 4 2 4] As shown in FIG. 16B, the connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel. Abut the starting end 3 2 of the adhesive tape 1 of 3 and apply silicone adhesive tape 60 over the surfaces of the silicone-treated base materials 9 and 9 of both adhesive tapes 1 and 1 to attach both adhesive tapes. Connect tapes 1 and 1.
【0 4 2 5】 このシリコーン粘着テープ 6 0は、 基材 6 3と基材 6 3の片面に 塗布されたシリコーン粘着剤 6 2とから構成されている。 基材.6 3は、 その材質 は特に限定されないが、 本実施の形態では、 ポリイミド樹脂材である。 尚、 図 1 6 Bにおいて、 接着材テープの接着剤 1 1及びシリコーン粘着テープ 6 0の粘着 剤部分 4 3は、 それぞれ斜線で示している。  The silicone pressure-sensitive adhesive tape 60 includes a base material 63 and a silicone pressure-sensitive adhesive 62 applied to one surface of the base material 63. The material of the base material .63 is not particularly limited, but is a polyimide resin material in the present embodiment. In FIG. 16B, the adhesive portion 11 of the adhesive tape and the adhesive portion 43 of the silicone adhesive tape 60 are indicated by diagonal lines.
【0 4 2 6】 ここで、シリコーン粘着テープ 6 0による接着について説明する。 一方及び他方の接着材テープ 1、 1において、 シリコーン処理基材 9、 9はそれ それシリコ一ンがコーティングしたあるため、接着剤による接着が困難であるが、 本実施の形態では、 シリコーン粘着テープ 6 0の粘着剤 4 3にシリコーン樹脂を 用いることにより、両シリコーン処理基材 9、 9との表面張力の差を少なくして、 密着 （接着） させることにより一方の接着材テープ 1の終端部 3 0と他方の接着 材テープ 1の始端部 3 2とが良好に接続される。 シリコーン粘着テープ 6 0にお けるシリコ一ン粘着剤 6 2の表面とシリコ一ン処理基材 9、 9表面との表面張力 の差は 1 0 mN/m( 10dyne/cm)以下とすることが好ましく、本実施の形態では表 面張力の差はほとんどない。  [0426] Here, adhesion by the silicone pressure-sensitive adhesive tape 60 will be described. In each of the adhesive tapes 1 and 1, the silicone-treated substrates 9 and 9 are each coated with silicone, so that it is difficult to bond them with an adhesive. By using a silicone resin for the adhesive 43, the difference in surface tension between the two silicone-treated substrates 9, 9 is reduced, and the adhesive tape 1 is adhered to the end of one adhesive tape 1. 30 and the start end 32 of the other adhesive tape 1 are connected well. The difference in surface tension between the surface of the silicone adhesive 62 in the silicone adhesive tape 60 and the surface of the silicone-treated base material 9, 9 should be 10 mN / m (10 dyne / cm) or less. Preferably, in the present embodiment, there is almost no difference in surface tension.
【0 4 2 7】 一般的には、 一方の接着材テープ 1の終端部 3 0と他方の接着材 テ一プ 1の両シリコーン処理基材 9、 9の表面張力は 2 5 mN/m〜6 O mN/ m (25〜60dyne/cm) であり、例えば、 表面張力が 3 O mN/mの場合には、 シリ コーン粘着テープ 6 0におけるシリコーン粘着剤 6 2の表面張力を 2 O mN/m 以上、 4 O mN/m以下に設定する。 【0 4 2 8】 シリコーン系粘着剤は、 主としてシリコーンガムとシリコーンレ ジンからなり、 両者をわずかに縮合反応させ粘着性を発現させ、 さらに、 過酸ィ匕 物、 白金触媒によるヒドロシリル化反応により架橋させてガラス転移温度を一 1 0 0 °C以下としたものが一般的である。 これらは、 市販されており、 それを好適 に用いることができる。 In general, the surface tension of both the silicone-treated base materials 9 and 9 of one end of the adhesive tape 1 and the other adhesive tape 1 is 25 mN / m or less. 6 O mN / m (25-60 dyne / cm) .For example, when the surface tension is 3 O mN / m, the surface tension of the silicone adhesive 62 on the silicone adhesive tape 60 is 2 O mN / m. Set to not less than m and not more than 4 O mN / m. [0428] The silicone-based pressure-sensitive adhesive is mainly composed of a silicone gum and a silicone resin. The silicone-based pressure-sensitive adhesive is slightly condensed to exhibit tackiness, and is further subjected to a hydrosilylation reaction using a peroxidized product and a platinum catalyst. It is general that the glass transition temperature is reduced to 100 ° C. or lower by crosslinking. These are commercially available and can be suitably used.
【0 4 2 9】 このように、 シリコーン粘着テープ 6 0を用いて、 使用済みの接 着材リ一ル 3 aに巻かれた接着材テープ 1と、 新たな接着材リ一ル 3に卷かれた 接着材テープ 1とが接続される。 次に、 使用済みの接着材リール 3 aと新たな接 着材リール 3を入れ替えて、 新たな接着材リール 3を接着装置 1 5に装着する。 したがって、 新たな接着材リール 3の接着材テープ 1を引き出して、 卷取りリー ル 1 7に接着材テープを装着したり、 接着装置 1 5のガイド 3 6に新たな接着材 テープ 1を掛けたりする作業が必要ないので、 接着材リール 3、 3 aの交換の作 業効率が良い。 このように、 卷出しが終了した接着材テープ 1の終端部 3 0と、 新たに装着する接着材テープ 1の始端部 3 2とをシリコーン粘着テープで接続す るので、 接続が簡単である。  [0429] As described above, using the silicone adhesive tape 60, the adhesive tape 1 wound around the used adhesive material reel 3a and the new adhesive material tape 3 are wound around the adhesive tape 1a. The adhesive tape 1 is connected. Next, the used adhesive reel 3a and the new adhesive reel 3 are exchanged, and the new adhesive reel 3 is mounted on the bonding apparatus 15. Therefore, pull out the adhesive tape 1 of the new adhesive reel 3 and attach the adhesive tape to the take-up reel 17 or hang the new adhesive tape 1 on the guide 36 of the bonding device 15. Work is not required, and the work efficiency of exchanging the adhesive reels 3 and 3a is high. As described above, since the end 30 of the adhesive tape 1 after the unwinding and the start 32 of the adhesive tape 1 to be newly mounted are connected by the silicone adhesive tape, the connection is simple.
【0 4 3 0】 次に、 使用済みのリ一ル 3 aと新たなリ一ル 3を入れ替えて、 新 たなリール 3を接着装置 1 5に装着する。 したがって、 卷取りリール 1 7に新た に接着材テープ 1を装着する作業が必要ない。  [0430] Next, the used reel 3a and the new reel 3 are exchanged, and the new reel 3 is mounted on the bonding apparatus 15. Therefore, there is no need to newly attach the adhesive tape 1 to the take-up reel 17.
【0 4 3 1】 （a) の卷取りリール 1 7をそのまま使用し、 使用済みの接着材 テープ 1の巻きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、 新たな接着剤テープと卷取りリ一ル 1 7を接続する場合は、 使用済みリ一ル 3 a の接着材テ一プ 1のエンドマーク 2 8が露出したときに接着材テープ 1のエンド マーク 2 8付近を切断し、 卷取りリール 1 7側に残った接着材テープの終端部 3 0と新たな接着材リール 3の接着材テープ 1の始端部 3 2を突き合わせる。 そし て、 両者の突き合せ部分にシリコーン粘着テープを用いて接着材テープ 1の終端 部 3 0と、 新たな接着材リール 3の接着材テープ 1の始端部 3 2とを接続する。 T JP2003/009694 卷取りリール 1 7では基材 9だけを卷き取っているので、 接着材リールの数本分 を卷き取ることができるので、 卷取りリール 1 7の交換回数を少なくすることが でき、 作業効率が良い。 [0 4 3 1] Use the take-up reel 17 in (a) as it is, and replace the used adhesive tape 1 with the remaining tape 1 with the remaining tape with a new adhesive tape. When connecting the tape and take-up reel 17, remove the end mark 28 of the adhesive tape 1 when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed. Cut, the end 30 of the adhesive tape remaining on the take-up reel 17 side and the starting end 32 of the adhesive tape 1 of the new adhesive reel 3 are abutted. Then, the end portion 30 of the adhesive tape 1 and the starting end portion 32 of the adhesive tape 1 of the new adhesive reel 3 are connected to each other by using a silicone adhesive tape at the butted portion. T JP2003 / 009694 In the take-up reel 17, only the base material 9 is taken up, so that several adhesive reels can be taken up. And work efficiency is good.
【0 4 3 2】 次に、 図 5を参照して本実施の形態にかかる接着材テ一プ 1の製 造方法について説明する。  Next, a method of manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 4 3 3】 卷出機 2 5から巻きだされた基材 （セパレ一夕） にコ一夕一 2 7 により、樹脂と導電粒子が混合された接着剤を塗布し、乾燥炉 2 9で乾燥した後、 卷取機 3 1で原反を卷き取る。 巻き取られた接着材テープの原反は、 スリツ夕 3 3により所定幅に切断されて巻き芯に卷き取れられた後、 巻き芯に側板 7、 7が 両側から装着されて、 あるいは、 側板付巻き芯に卷き取られ、 除湿材とともに梱 包され、 好ましくは、 低温 （一 5 °C〜― 1 0 °C) に管理されて出荷される。  [0 4 3 3] An adhesive in which resin and conductive particles are mixed is applied to the base material (separate overnight) unwound from the unwinding machine 25 by a co-extruder 27 and a drying oven 29 After drying, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a core, and then the side plates 7, 7 are attached to the core from both sides, or It is wound on a core and packaged with a dehumidifying material, and is preferably shipped at a controlled low temperature (15 ° C to -10 ° C).
【0 4 3 4】 次に、 請求の範囲第 1 4〜第 1 8項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, another embodiment of the invention described in claims 14 to 18 will be described. However, in the embodiment described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 4 3 5】 図 1 7に示す第 2実施の形態では、 上述した第 1実施の形態に加 えて、 一方の接着材テープ 1の終端部 3 0と他方の接着材テープの始端部 3 2と の接着剤 1 1面側にもシリコーン粘着テープ 6 0を貼着したものである。 この第 In the second embodiment shown in FIG. 17, in addition to the first embodiment described above, the end portion 30 of one adhesive tape 1 and the start end 3 of the other adhesive tape 1 Adhesive 1 and 2 Silicone adhesive tape 60 is also adhered to one side. This second
2実施の形態におけるシリコーン粘着テープ 6 0のシリコーン粘着剤 6 2は、 接 着力が 1 0 0 gZ 2 5 mm以上であり、 本実施の形態では、 7.0 0 2 5 mm 〜1 4 0 0 2 5 111111でぁる。 尚、 シリコーン粘着テープ 6 0におけるシリコ ーン粘着剤 6 2の表面張力は、 上述した実施の形態と同様に、 一方及び他方の接 着材テープにおけるシリコーン基材の表面張力との差を 1 0 m N Z m (10dyne/cm)以下に設定している。この第 2実施の形態では、一方の接着材テープ(2) The silicone pressure-sensitive adhesive 62 of the silicone pressure-sensitive adhesive tape 60 in the embodiment has an adhesive force of 100 gZ25 mm or more, and in the present embodiment, 7.00 25 mm to 140 0 25 It is 111111. The surface tension of the silicone adhesive 62 in the silicone adhesive tape 60 is, as in the above-described embodiment, the difference between the surface tension of the silicone base material in one of the adhesive tapes and the surface tension of the silicone base material in the other adhesive tape. m NZ m (10 dyne / cm) or less. In the second embodiment, one adhesive tape
1の終端部 3 0と他方の接着材テープの始端部 3 2との両面において、 シリコー ン粘着テープ 6 0で接着しているので、 第 1実施の形態よりも高い強度で両接着 2003/009694 材テープ 1、 1を接着することができる。 Both sides of the end part 30 of the first adhesive tape 30 and the start end part 32 of the other adhesive tape are adhered with the silicone adhesive tape 60, so that both adhesives are applied with higher strength than in the first embodiment. 2003/009694 Material tape 1, 1 can be glued.
【0 4 3 6】 図 1 8に示す第 3実施の形態は、 一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2とを重ねて配置し、 そのシリコーン処 理基材 9側面と接着材 1 1側面とに第 2実施の形態にかかるシリコ一ン粘着テー プ 6 0を貼着したものであり、 この第 3実施の形態によれば、 第 2実施の形態と 同様な作用効果を奏することができる。  In the third embodiment shown in FIG. 18, the end portion 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape 1 are arranged so as to overlap with each other. The silicone adhesive tape 60 according to the second embodiment is adhered to the side surface of the processing base material 9 and the side surface of the adhesive material 1 1, and according to the third embodiment, The same operation and effect as those of the embodiment can be obtained.
【0 4 3 7】 図 1 9に示す第 4実施の形態は、 一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2との間に、 基材の両面にシリコーン粘. 着剤 6 2を塗布したシリコーン粘着テープ 6 1を介在して、 終端部 3 0と始端部 3 2とを接続したものである。 この第 4実施の形態によれば、 両面のシリコーン 粘着テープ 6 1を用いることにより、 更に、 一方の接着材テープ 1の終端部 3 0 と他方の接着材テープ 1の始端部 3 2との接続が簡単に且つ容易にできる。  The fourth embodiment shown in FIG. 19 is different from the first embodiment in that both ends of the base material are placed between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1. The end 30 and the start 32 are connected via a silicone adhesive tape 61 coated with a silicone adhesive 62. According to the fourth embodiment, the use of the double-sided silicone adhesive tape 61 further reduces the connection between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1. Can be done easily and easily.
【0 4 3 8】 次に、 請求の範囲第 1 9〜第 2 1項に記載された発明について説 明する。  [0438] Next, the invention described in claims 19 to 21 will be described.
【0 4 3 9】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に巻かれた接着材テープの接続方法に関する。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. It relates to a method of connecting a material tape.
【0 4 4 0】 次に、 請求の範囲第 1 9〜第 2 1項に記載された発明の背景技術 について説明する。  [0440] Next, the background art of the invention described in Claims 19 to 21 will be described.
【0 4 4 1】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ベアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。  [044 4 1] Generally, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method for making the connection.
【0 4 4 2】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。  [0444] Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
【0 4 4 3】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ 一ルに卷き取るテープの長さは 5 0 m程度である。 [0444] This type of conventional adhesive tape has a width of about 1 to 3 mm, The length of the tape wound on a roll is about 50 m.
【0 4 4 4】 接着材テープを接着装置に装着する場合、 接着材テープのリ一ル (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き 出された接着材テ一プの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに卷き取っている。  [0 4 4 4] When attaching the adhesive tape to the adhesive device, attach the adhesive tape reel (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
【0 4 4 5】 そして、 接着材リールの接着材テープが終了すると、 終了したリ ールと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付け ている。  [0 4 4 5] When the adhesive tape on the adhesive reel ends, the finished reel and the winding reel on which the base material has been wound are removed, and a new winding reel and a new adhesive material are removed. The reel is mounted on the bonding machine, and the beginning of the adhesive tape is mounted on the take-up reel.
【0 4 4 6】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。 [0446] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, there is a problem that in an electronic device manufacturing plant, the frequency of exchanging the adhesive reel increases, and it takes time and effort to exchange the adhesive reel, so that it is not possible to improve the production efficiency of the electronic device.
【0 4 4 7】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると卷き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に卷いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してプロヅキングの原因になるおそれがある。 [0444] To solve this problem, by increasing the number of adhesive tapes wound on the reel, it is possible to increase the amount of adhesive per reel and reduce the frequency of reel replacement. Although it is conceivable, the width of the adhesive tape is as narrow as 1 to 3 mm, so if the number of windings is increased, winding collapse may occur. In addition, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 4 4 8】 更に、 接着材テープの巻き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0444] Further, when the number of windings of the adhesive tape is increased, the diameter of the reel also increases, which makes it difficult to mount the tape on an existing bonding apparatus, and may render the existing bonding apparatus unusable.
【0 4 4 9】 そこで、 請求の範囲第 1 9〜第 2 1項に記載された発明は、 接着 材リ一ルの交換が簡単にでき、 電子機器の生産効率の向上を図ることができる接 着材テープの接続方法の提供を目的とする。 Therefore, the inventions described in claims 19 to 21 can easily replace the adhesive reel, and can improve the production efficiency of electronic devices. Contact An object of the present invention is to provide a method for connecting an adhesive tape.
【0 4 5 0】 次に、 添付図面を参照しながら請求の範囲第 1 9〜第 2 1項に記 載された発明の実施の形態について説明するが、まず図 2 0 A〜2 0 C、図 2 1、 図 4及び図 5を参照して請求の範囲第 1 9〜第 2 1項に記載された発明の第 1実 施の形態について説明する。 図 2 O A〜図 2 0 Cは本実施の形態にかかる接着材 テープの接続方法を示す図であり、 図 2 O Aは接着材リール同士の接続を示す斜 視図であり、 図 2 0 B及び 2 0 Cは図 2 O Aにおける接続部分の接続方法を示す 断面図である。  Next, embodiments of the invention described in claims 19 to 21 will be described with reference to the attached drawings. First, FIGS. 20A to 20C are described. The first embodiment of the invention described in claims 19 to 21 will be described with reference to FIGS. FIGS. 2OA to 20C are diagrams showing a method of connecting the adhesive tape according to the present embodiment, and FIG. 2OA is a perspective view showing the connection between the adhesive reels. 20C is a cross-sectional view showing a connection method of a connection portion in FIG. 2 OA.
【0 4 5 1】 接着材テープ 1はリール 3、 3 aにそれそれ卷かれており、 各リ —ル 3、 3 aには卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。  [0 4 5 1] Adhesive tape 1 is wound on reels 3 and 3a, respectively, and each reel 3 and 3a is disposed on both width sides of winding core 5 and adhesive tape 1. A side plate 7 is provided.
【0 4 5 2】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0452] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 4 5 3】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するも のではない。  [0445] The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
【0 4 5 4】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬化性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹脂、 ァク リル樹脂系、 シリコ一ン樹脂系が用いられる。  [0445] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acrylic resin type and a silicone type as a thermosetting resin type. One resin system is used.
【0 4 5 5】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u , A g , P t， N i 5 C u , W, S b、 S n , はんだなどの金属 粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミヅクス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 [0455] In the adhesive 11, conductive particles 13 are dispersed. As the conductive particles 1 3, A u, A g , P t, N i 5 C u, W, S b, S n, include metal particles or carbon, graphite, such as solder, these and non-conductive glass Formed by coating the above-mentioned conductive layer on a polymer nucleus material such as plastic, ceramics, plastic, etc. May be. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
【0 4 5 6】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 2 1に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端をガイ ドビン 2 2に掛けて卷取りリール 1 7'に取り付け、接着材テープ 1を繰り出す（図 2 1中矢印 E )。そして、 回路基板 2 1上に接着材テープ 1を配置して、両リール 3、 1 7間に配置された加熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧 接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に巻き取る。  Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 21, the reel 3 a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 a is connected to the guide bin 22. And attach it to the take-up reel 17 'and pay out the adhesive tape 1 (arrow E in Fig. 21). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the substrate 9 is wound on a take-up reel 17.
【0 4 5 7】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 口口口 ) 2 3の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 2 1に圧着された接着剤 1 1に配線回路 (又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へヅド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配糸泉回路 2 3の電極 2 3 aとを接続する。 【0 4 5 8】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。したがって、リ一ル 3 aに巻いた接着材テープ 1の使用量も多くなり、 リール 3 aに巻いた接着材テープ 1は比較的短時間で卷取りリール 1 7に巻き取 られて、 リール 3 aに卷かれた接着材テープ 1のェンドマ一ク 2 8が露出される (図 2 O A参照)。 [0445] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic part opening / closing opening) 23 are aligned and permanently connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. The wiring circuit 23 is heated and pressurized to the circuit board 21 by the heating and pressurizing head 19 through the polyethylene material 24. This connects the electrode 21 a of the circuit board 21 and the electrode 23 a of the spring circuit 23. [0445] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be crimped over the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Therefore, the amount of the adhesive tape 1 wound on the reel 3a increases, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. Then, the end mark 28 of the adhesive tape 1 wound on the reel 3a is exposed (see FIG. 2 OA).
【0 4 5 9】 請求の範囲第 1 9〜第 2 1項に記載された発明の接着材テープの 接続方法は、 （a )卷取りリール 1 7をそのまま使用し、使用済みの接着材テープ 1の卷きが残り少なくなつた接着剤テープを交換し、 新たな接着剤テープと卷取 りリール 1 7を接続する場合と、 （b)卷取りリール 1 7として使用済みの接着材 テープ 1の卷きが残り少なくなった接着剤テープを使用し、 新たな接着剤テープ と卷きが残り少なくなった接着剤テープを接続する場合がある。  [0445] The method for connecting an adhesive tape according to the invention described in claims 19 to 21 includes the steps of: (a) using the take-up reel 17 as it is; Replace the adhesive tape with the remaining number of windings 1 remaining, replace the new adhesive tape with the take-up reel 17 and (b) use the adhesive tape 1 used as the take-up reel 17 In some cases, an adhesive tape with less winding is used, and a new adhesive tape is connected to the adhesive tape with less winding.
【0 4 6 0】 （b ) の場合、 図 2 O Aに示すように、 リール 3 aの接着材テ一 プ 1にェンドマ一ク 2 8が露出したところで、 リ一ル 3 aを新たな接着材リール 3と交換するため、 リール 3 aの接着材テープ （一方の接着材テープ） 1の終端 音 3 0と、新たな接着材リ一ル 3に卷かれた接着材テープ（他方の接着材テープ） In the case of (b), as shown in FIG. 2A, when the end mark 28 is exposed on the adhesive tape 1 of the reel 3a, the reel 3a is newly bonded. Adhesive tape on reel 3a (one adhesive tape) 1 and the adhesive tape wound on new adhesive reel 3 (the other adhesive tape) tape)
1の始端部 3 2とを樹脂製接着剤 6 4を用いて接続する。 1 is connected to the starting end 32 using a resin adhesive 64.
【0 4 6 1】 樹 S旨製接着剤 6 4としては、 例えば、 エポキシ細旨、 シァネ一ト 樹脂、 ビスマレイミド樹脂、 フエノール樹脂、 ユリア樹脂、 メラミン樹脂、 アル キヅド樹脂、ァクリル樹脂、不飽和ポリエステル樹脂、ジァリルフタレート樹脂、 シリコーン樹 g旨、 レゾルシノールホルムアルデヒド樹脂、 キシレン樹 S旨、 フラン 樹脂、 ポリウレタン樹脂、 ケトン樹脂、 トリァリルシアヌレート樹脂等が挙げら れる。  [0 4 6 1] The glue S 4 made of Sumi includes, for example, epoxy finesse, epoxy resin, bismaleimide resin, phenol resin, urea resin, melamine resin, alkyl resin, acryl resin, and unsaturated resin. Polyester resin, diaryl phthalate resin, silicone resin g, resorcinol formaldehyde resin, xylene resin S, furan resin, polyurethane resin, ketone resin, triaryl cyanurate resin, and the like.
【0 4 6 2】 この接着材テープ 1の接続は、 図 2 0 Bに示すように、 接着材リ —ル 3 aの接着材テープ 1の終端部 3 0と、 新たな接着材リール 3の接着材テー プ 1の始端部 3 2とについて、 終端部 3 0の基材 9面に始端部 3 2の接着剤 1 1 面を重ね合わせる。 そして、 接着装置 1 5に組み込まれた充填機 6 5からペース ト状の樹脂製接着剤 6 4を重ね合わせ部分に塗布する。 そして、 図 2 0 Cに示す ように、 接着装置 1 5に組み込まれた加熱器 6 6の加熱によって樹脂製接着剤 6 4が熱硬化性樹脂である場合、 これを硬化させることで接着材テープ 1の終端部 3 009694 [0 4 6 2] As shown in FIG. 20B, the connection of the adhesive tape 1 is performed by connecting the terminal 30 of the adhesive tape 1 of the adhesive reel 3a and the new adhesive reel 3 to each other. With respect to the start end 32 of the adhesive tape 1, the adhesive 11 surface of the start end 32 is superimposed on the base 9 surface of the end 30. Then, a paste-like resin adhesive 64 is applied to the overlapped portion from a filling machine 65 incorporated in the bonding apparatus 15. Then, as shown in FIG. 20C, when the resin adhesive 64 is a thermosetting resin by the heating of the heater 66 incorporated in the bonding apparatus 15, the adhesive tape is cured by curing the resin adhesive 64. End of 1 3 009694
3 0と、 新たな接着材リ一ル 3の接着材テープ 1の始端部 3 2とを接続する。 【0 4 6 3】 これにより、使用済みのリール 3 aに巻かれた接着材テープ 1と、 新たなリール 3に巻かれた接着材テープ 1とが接続される。 このように、 卷出し が終了した接着材テープ 1の終端部 3 0と、 新たに装着する接着材テープ 1の始 端部 3 2とを樹旨製接着剤 6 4で固定するので、 接続が簡単である。 30 and the start end 32 of the adhesive tape 1 of the new adhesive reel 3 are connected. [0466] Thus, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected. In this way, since the end 30 of the adhesive tape 1 after the unwinding and the start 32 of the adhesive tape 1 to be newly mounted are fixed with the adhesive 64 made of wood, the connection is established. Easy.
【0 4 6 4】 次に、 使用済みのリ一ル 3 aと新たなリ一ル 3を入れ替えて、 新 たなリール 3を接着装置 1 5に装着する。 したがって、 巻取りリール 1 7に接着 材テープ 1を装着する作業が必要ない。  [0464] Next, the used reel 3a and the new reel 3 are replaced, and the new reel 3 is mounted on the bonding apparatus 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17.
【0 4 6 5】 （a) の卷取りリール 1 7をそのまま使用し、 使用済みの接着材 テープ 1の卷きが残り少なくなった接着剤テープを新たな接着剤テープと交換し、 新たな接着剤テープと卷取りリ一ル 1 7を接続する場合は、 使用済みリ一ル 3 a の接着材テープ 1のェンドマ一ク 2 8が露出したときに接着材テープ 1のェンド マーク 2 8付近を切断し、 卷取りリール 1 7側に残った接着材テープの終端部 3 0と新たな接着材リール 3の接着材テープ 1の始端部 3 2を重ね合わせる。 そし て、 両者の重ね合わせ部分にペースト状の樹脂製接着剤 6 4を塗布して、 用いる 樹脂製接着剤の種類により接着力を発揮できるように加熱、紫外線照射等を行い、 終端部 3 0と、 新たな接着材リ一ル 3の接着材テープ 1の始端部 3 2とを接続す る。 卷取りリール 1 7では基材 9だけを卷き取っているので、 接着材リールの数 本分を卷き取ることができるので、 卷取りリール 1 7の交換回数を少なくするこ とができ、 作業効率が良い。  [0 4 6 5] Use the take-up reel 17 of (a) as it is, and replace the used adhesive tape 1 with the remaining adhesive tape 1 with a small amount of remaining tape with a new adhesive tape and perform new bonding. When the adhesive tape is connected to the take-up reel 17, when the end mark 28 of the adhesive tape 1 of the used reel 3 a is exposed, the vicinity of the end mark 28 of the adhesive tape 1 The tape is cut, and the end 30 of the adhesive tape remaining on the take-up reel 17 side and the starting end 32 of the adhesive tape 1 of the new adhesive reel 3 are overlapped. Then, a paste-like resin adhesive 64 is applied to the overlapped portion of both, and heating, ultraviolet irradiation, etc. are performed so that the adhesive force can be exerted depending on the type of the resin adhesive used. Is connected to the start end 32 of the adhesive tape 1 of the new adhesive reel 3. Since only the base material 9 is wound on the take-up reel 17, several adhesive reels can be wound, so that the number of times of changing the take-up reel 17 can be reduced. Work efficiency is good.
【0 4 6 6】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  [0466] Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 4 6 7】 卷出機 2 5から卷き出された基材 （セパレ一夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、 卷取機 3 1で原反を卷き取る。 卷き取られた接着材テープの原反は、 スリッ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 卷き芯に側 o [0 4 6 7] Adhesive 11 containing resin and conductive particles 13 is applied to base material (separate one night) unwound from unwinding machine 25 by means of one second 27 After drying in the drying oven 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a winding core. o
板 7、 7が両側から装着されて、 あるいは、 側板付巻き芯に卷き取られ、 除湿材 とともに梱包され、 好ましくは、 低温 ( - 5 °C〜一 1 0 °C) に管理されて出荷さ れる。 Plates 7, 7 are mounted on both sides or wound on a core with side plates, packed with dehumidifying material, and preferably shipped at a low temperature (-5 ° C to 110 ° C) Is done.
【0 4 6 8】 請求の範囲第 1 9〜第 2 1項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 1 9〜第 2 1項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  [0466] The invention described in claims 19 to 21 is not limited to the above-described embodiment, but may be any of the inventions described in claims 19 to 21. Various modifications can be made without departing from the gist.
【0 4 6 9】 本実施の形態では、 樹脂製接着剤 6 4として熱硬化性樹脂を例に 用いたが、 熱硬化性樹脂の代わりに光硬ィ匕性樹脂を用い、 紫外線等の光照射によ り光硬化性樹脂を硬化させることによって、 接着材テープ 1同士の接続を行うよ うにしても良い。  In the present embodiment, a thermosetting resin is used as an example of the resin adhesive 64. However, instead of the thermosetting resin, a light-hardening resin is used, and light such as ultraviolet light is used. The adhesive tapes 1 may be connected to each other by curing the photocurable resin by irradiation.
【0 4 7 0】 この場合、 光硬化性樹脂としては、 ァクリレート基またはメ夕ク リレート基を有する樹脂に、 光重合開始剤を配合した組成物や、 芳香族ジァゾ二 ゥム塩、 ジァリルョ一ドニゥム塩、 スルホ二ゥム塩等の光硬化剤を含むエポキシ 樹脂等が用いられる。 [0470] In this case, as the photocurable resin, a composition in which a photopolymerization initiator is blended with a resin having an acrylate group or a methyl acrylate group, an aromatic diazonium salt, a diaryl methacrylate, etc. An epoxy resin containing a photocuring agent such as a donium salt or a sulfonium salt is used.
5 【0 4 7 1】 また、 樹脂製接着剤としてエチレン酢酸ビニル樹脂やポリオレフ ィン樹脂を主成分にしたホットメルト接着材を使用しても良く、 例えばシート状 のホットメルト接着材の場合は、 接着材テープ 1同士の重ね合せ部分に、 シート 状のホットメルト接着剤を卷いて、 加熱器 6 6でホヅトメルト接着剤を加熱して 溶融させた後、 冷却によりホットメルト接着剤が固化することで、 接着材テープ5 [0 4 7 1] A hot-melt adhesive containing ethylene vinyl acetate resin or polyolefin resin as a main component may be used as the resin adhesive. For example, in the case of a sheet-like hot-melt adhesive, A sheet-like hot-melt adhesive is wound around the portion where the adhesive tapes 1 overlap, and the hot-melt adhesive is heated and melted by a heater 66 and then solidified by cooling. With adhesive tape
1同士が接続する。 1 connects.
【0 4 7 2】 接着材テープ 1の接続に用いる樹脂製接着剤は、 熱硬化性樹脂、 光硬化性樹脂、 ホットメルト接着剤の群の中から複数使用しても良い。  [0472] A plurality of resin adhesives used for connecting the adhesive tape 1 may be used from the group of a thermosetting resin, a photocurable resin, and a hot melt adhesive.
【0 4 7 3】 上述の実施の形態において、 接着材リール 3 aの接着材テープ 1 の終端部 3 0の基材 9面と、 新たな接着材リ一ル 3の接着材テープ 1の始端部 35 2の接着剤 1 1面を重ね合わせ、 樹脂製接着剤である熱硬化性樹脂を塗布して接 続するようにしたが、 接着材リール 3 aの接着材テープ 1の終端部 3 0を裏返し て、 接着剤 1 1面同士を重ね合わせて両者を接着した後で、 熱硬化性樹脂で固定 するようにしても良い。 In the above-described embodiment, the base material 9 surface of the end portion 30 of the adhesive tape 1 of the adhesive reel 3a and the starting end of the adhesive tape 1 of the new adhesive reel 3 The adhesive 1 of the part 35 2 is superimposed on one side, and a thermosetting resin, which is a resin adhesive, is applied and connected. However, the terminal part 30 of the adhesive tape 1 on the adhesive reel 3a is used. Inside out Then, the adhesive 11 may be fixed with a thermosetting resin after the surfaces are superimposed and bonded together.
【0 4 7 4】 次に、 請求の範囲第 2 2〜第 2 4項に記載された発明について説 明する。  Next, the invention described in claims 22 to 24 will be described.
【0 4 7 5】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に巻かれた接着材テープリール及び接着装置に関する。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly, to an adhesive tape wound in a reel shape. The present invention relates to a material tape reel and an adhesive device.
【0 4 7 6】 次に、 請求の範囲第 2 2〜第 2 4項に記載された発明の背景技術 について説明する。  [0476] Next, the background art of the invention described in Claims 22 to 24 will be described.
【0 4 7 7】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル)、 E L (蛍光ディスプレイ） パネル、 ベアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。  [0477] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method for making the connection.
【0 4 7 8】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。  [0477] Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape in which an adhesive is applied to a base material in a reel shape. I have.
【0 4 7 9】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ 一ルに卷き取るテープの長さは 5 0 m程度である。  [0479] The conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
【0 4 8 0】 接着材テープを接着装置に装着する場合、 接着材テープをリール に巻いた接着材テープリールを接着装置に取り付け、 接着材テープの始端部を引 き出して、 卷取りリールに取り付ける。 そして、 接着材テープリールから巻き出 された接着材テ一プの基材側から加熱加圧へッドで接着剤を回路基板等に圧着し、 残った基材を卷取りリールに卷き取っている。  [0480] When the adhesive tape is mounted on the bonding device, the adhesive tape reel in which the adhesive tape is wound on a reel is attached to the bonding device, the starting end of the adhesive tape is pulled out, and the take-up reel is taken out. Attach to Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
【0 4 8 1】 そして、一方の接着材テープリールの接着材テープが終了すると、 終了したリールと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリール と新たな接着材テープリールを接着装置に装着し、 接着材テープの始端を卷取り リールに取り付けている。 【0 4 8 2】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材テープリールの交換頻度が多くなり、 接着材テ —プリールの交換に手間がかかるため電子機器の生産効率の向上が図れないとい う問題がある。 [0 4 8 1] When the adhesive tape on one adhesive tape reel is completed, the completed reel and the winding reel on which the base material has been wound are removed, and a new winding reel and a new adhesive material are removed. The tape reel is mounted on the bonding machine, and the beginning of the adhesive tape is mounted on the take-up reel. However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, the frequency of exchanging the adhesive tape reel increases, and it takes time and effort to exchange the adhesive tape, so that there is a problem that the production efficiency of the electronic device cannot be improved.
【0 4 8 3】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リ一ル当りの接着剤量を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると巻き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロッキングの原因になるおそれがある。  [0 4 8 3] To address this problem, increasing the number of adhesive tapes wound on a reel increases the amount of adhesive per reel and reduces the frequency of reel replacement. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of turns may cause collapse. Also, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may seep out from both widths of the tape and cause blocking.
【0 4 8 4】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0 4 8 4] Furthermore, when the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus may not be used.
【0 4 8 5】 そこで、 請求の範囲第 2 2〜第 2 4項に記載された発明は、 接着 材テープリールの交換が簡単にでき、 電子機器の生産効率の向上を図ることがで きる接着材テープリ一ル及び接着装置の提供を目的とする。  [0485] Therefore, the inventions described in claims 22 to 24 can easily replace the adhesive tape reel and improve the production efficiency of electronic devices. An object of the present invention is to provide an adhesive tape reel and an adhesive device.
【0 4 8 6】 次に、 添付図面を参照しながら請求の範囲第 2 2〜第 2 4項に記 載された発明の実施の形態について説明するが、まず図 2 2 A〜2 2 C、図 2 3、 図 4及び図 5を参照して請求の範囲第 2 2〜第 2 4項に記載された発明の第 1実 施の形態について説明する。 図 2 2 A〜図 2 2 Cは第 1実施の形態にかかる接着 材テープリールを示す図であり、 図 2 2 Aは接着材テープリールを示す斜視図で あり、 図 2 2 Bは図 2 2 Aにおける正面図であり、 図 2 2 Cは図 2 2 Aにおける 連結テープの平面図であり、 図 2 3は接着装置における接着剤の圧着工程を示す 概略図である。 【0 4 8 7】 図 2 2 Aに示すように、 本実施の形態にかかる接着材テ一プリ一 ル Aは、 複数の接着材テープの巻き部 （以下、 巻き部） 2、 2 aを備えており、 巻き部 2、 2 aはリール 3、 3 aに接着材テープ 1がそれぞれ卷かれている。 各 リール 3、 3 aには卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設 けられている。 図 2 3に示すように接着材テープ 1は、 基材 9と、 基材 9の一側 面に塗布された接着剤 1 1とから構成されている。 Next, embodiments of the invention described in claims 22 to 24 will be described with reference to the accompanying drawings. First, FIGS. 22A to 22C are described. A first embodiment of the invention described in claims 22 to 24 will be described with reference to FIGS. 23, 4, and 5. FIG. FIGS. 22A to 22C are views showing the adhesive tape reel according to the first embodiment, FIG. 22A is a perspective view showing the adhesive tape reel, and FIG. 22B is FIG. FIG. 2C is a front view of FIG. 2A, FIG. 22C is a plan view of the connecting tape of FIG. 22A, and FIG. 23 is a schematic view showing a pressure bonding step of an adhesive in an adhesive device. [0487] As shown in Fig. 22A, the adhesive tape A according to the present embodiment includes a plurality of adhesive tape winding portions (hereinafter, winding portions) 2, 2a. The winding portions 2 and 2a have the adhesive tape 1 wound on the reels 3 and 3a, respectively. Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in FIG. 23, the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【 0 4 8 8】 複数の卷き部 2、 2 aのうち、 一方の卷き部 2に卷かれた接着材 テープ （以下、 一方の接着材テープ） 1の終端部 3 0と他方の卷き部に巻かれた 接着材テープ （以下、 他方の接着材テープ） 1の始端部 3 2との間には、 両者を 接続する連結テープ 4 1が設けられている。 連結テープ 6 7は、 一方の接着材テ —プ 1の終端部 3 0から、 リール 3の側板 7の内側面を沿うように配置され、 側 板 7の上部に形成された切欠け部分 6 8に係止して他方の接着材テープ 1の始端 部 3 2に接続されている。  [0 4 8 8] Out of the plurality of winding portions 2 and 2 a, one end portion 30 of the adhesive tape 1 wound on one winding portion 2 (hereinafter, one adhesive tape) and the other winding portion A connection tape 41 is provided between the adhesive tape 1 (hereinafter referred to as the other adhesive tape) 1 wound around the contact portion and the start end 32 of the adhesive tape. The connecting tape 67 is arranged along the inner surface of the side plate 7 of the reel 3 from the terminal end 30 of one of the adhesive tapes 1, and a cutout portion 6 8 formed on the upper portion of the side plate 7. And is connected to the start end 32 of the other adhesive tape 1.
【 0 4 8 9】 また、 一方及び他方の接着材テープ 1と連結テープ 6 7との接続 部分には、 連結テープ 6 7を認識できるマーク 6 9、 7 0が付されており、 テ一 プ検出手段 （発光部 7 1、 受光部 7 2 ) でマーク 6 9、 7 0を検出した際は連結 テープ 6 7部分をスキップして、 連結テープ 6 7部分で圧着が行われないように している。  [0489] Marks 69 and 70 for recognizing the connecting tape 67 are attached to the connecting portions between the adhesive tape 1 and the connecting tape 67 on one side and the other, and the tape is provided. When the detection means (light-emitting part 71, light-receiving part 72) detects the marks 69, 70, skip the connecting tape 67 and prevent crimping at the connecting tape 67. I have.
【0 4 9 0】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するも のではない。  [0490] The substrate 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
【 0 4 9 1】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系、 ホヅ トメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹 S旨系があ り、 また熱硬ィ匕性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹脂、 ァク リル樹脂系、 シリコーン樹脂系が用いられる。 As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin S type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, and an acrylic resin as a thermosetting resin type. Ril resin type and silicone resin type are used.
【0 4 9 2】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u , A g , P t , N i , C u , W， S b、 S n , はんだなどの金属 粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチヅク等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟ィ匕の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易 ヽ接続部材が得られるのでより好ましい。  [0492] In the adhesive 11, conductive particles 13 are dispersed. The conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, etc., and these and non-conductive glass. The conductive layer may be formed by coating the conductive layer on a polymer core material such as ceramic, plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when a polymer is used as the core, the melting point is not exhibited like solder, so that the softened state can be widely controlled by the connection temperature, and it is easy to cope with variations in electrode thickness and flatness. It is more preferable because it can be obtained.
【0 4 9 3】 次に、 本実施の形態にかかる接着材テープリール Aの使用方法に ついて説明する。図 2 3に示すように、接着装置 1 5に接着材テ一プリ一ル Aと、 卷取りリール 1 7とを装着し、 一方の接着材テープ 1の始端部 3 2をガイドピン 2 2に掛けて卷取りリール 1 7に取り付け、 接着材テープ 1を繰り出す （図 2 3 中矢印 E )。 そして、 回路 ¾ί反 2 1上に接着材テープ 1を配置して、 両リール 3、 1 7間に配置された加熱加圧へッド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 Ίに卷 き取る。  Next, a method of using the adhesive tape reel A according to the present embodiment will be described. As shown in FIG. 23, the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide pin 22. The tape is attached to the take-up reel 17 and the adhesive tape 1 is fed out (arrow E in FIG. 23). Then, the adhesive tape 1 is arranged on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 arranged between the two reels 3 and 17. The adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 1 1.
【0 4 9 4】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 品） 2 3の電極を位置合わせして本接続する。 本接続は、 図 4に示すように、 回 路基板 2 1に圧着された接着剤 1 1に配線回路 (又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へッド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する c 【0 4 9 5】 本実施の形態による接着材テープ 1を用いた P D Pは、 そのサイ ズが大きくなつており、 P D Pの周囲全体に亘り圧着する場合があり、 接続部分 が多く、 接着剤 1 1は一度に用いる接着剤 1 1の使用量が従来に比較して格段に 多くなる。 したがって、 リール 3に卷いた接着材テープ 1の使用量も多くなり、 リール 3に巻いた接着材テープ 1は比較的短時間で卷取りリール 1 Ίに卷き取ら れる。 [0494] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. In this connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on an adhesive 11 crimped on a circuit board 21 and, if necessary, as a cushion material, for example, polytetrafluid. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the polyethylene material 24. This connects the electrode 21a of the circuit board 21 to the electrode 23a of the wiring circuit 23c. [0495] The PDP using the adhesive tape 1 according to the present embodiment has a large size, and may be pressure-bonded to the entire periphery of the PDP, and has many connection parts, and the adhesive 1 1 means that the amount of adhesive 11 used at a time will be much higher than before. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 1 in a relatively short time.
【0 4 9 6】 一方の接着材テープ 1の卷き出しが終了したところで、 連結テ一 プ 6 7が切欠け部分 6 8から外れ、 続いて他方の接着材テープ 1の繰り出しが行 われる。 本実施の形態では、 一方の接着材テ一プ 1の終端部 3 0と他方の接着材 テープ 1の始端部 3 2との間に両者を接続する連結テープ 6 7を備えているので、 一方の接着材テープ 1の卷き出しが終了すると、 続けて他方の接着材テープ 1の 繰り出しを開始することができる。 従って、 一方の接着材テープ 1の卷き出しが 終了した後、 新たな接着材テープ 1を卷取りリ一ル 1 7に取り付ける作業が不要 となり、 電子機器の生産効率が高まる。  [0496] When the unwinding of one adhesive tape 1 is completed, the connecting tape 67 is disengaged from the cutout 68, and then the other adhesive tape 1 is fed out. In the present embodiment, a connecting tape 67 is provided between the end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 so as to connect them. When the unwinding of the adhesive tape 1 is completed, the unwinding of the other adhesive tape 1 can be started. Therefore, after the unwinding of one adhesive tape 1 is completed, the work of attaching a new adhesive tape 1 to the take-up reel 17 becomes unnecessary, and the production efficiency of electronic equipment is increased.
【0 4 9 7】 また、 接着装置 1 5は、 図 2 3に示すように、 一対の発光部 7 1 と受光部 7 2とを備えており、 連結テープ 6 7を光学的に検知している。 一方の 接着材テープ 1と他方の接着材テープ 1の両者をつなく、連結テープ 6 7の両端に は黒色のマーク 6 9、 7 0を付している。 発光部 7 1はレーザ光を接着材テープ [0497] Further, as shown in Fig. 23, the bonding device 15 includes a pair of a light-emitting unit 71 and a light-receiving unit 72, and optically detects the connection tape 67. I have. Both the adhesive tape 1 and the other adhesive tape 1 are connected to each other, and black marks 69 and 70 are provided at both ends of the connecting tape 67. The light emitting section 7 1 uses a laser tape for adhesive tape.
1に向けて連続して発しており、 その反射光を受光部 7 2が受けて、 その検知信 号を制御装置 7 9に送っている。 そして、 受光部 7 2が連結テープ 6 7の両端の マーク 6 9、 7 0の反射光を受け、 その検知信号が制御装置 7 9に送られる。The light is continuously emitted toward 1, and the reflected light is received by the light receiving section 72, and the detection signal is sent to the control device 79. Then, the light receiving section 72 receives the reflected lights of the marks 69 and 70 on both ends of the connecting tape 67, and the detection signal is sent to the control device 79.
【0 4 9 8】 検知信号を受けた制御装置 7 9は、 接着装置 1 5の両リ一ル 3、[0 4 9 8] The control device 79, which has received the detection signal, sets the two reels 3 of the bonding device 15
1 7を駆動するモータへの制御信号を出力し、 モ一夕ドライバを介してモ一夕に 対する駆動パルスの出力を開始する。 そして、 モー夕ドライバから印加されるパ ルス数に応じてモ一夕が回転し、 両リール 3、 1 7を通常の速度より速い速度で 移動させながら、 連結テープ 6 7の長さに応じた距離だけ接着材テープ 1を卷き 出し方向に移動させる。 17 Outputs a control signal to the motor that drives 7, and starts outputting drive pulses to the motor via the motor driver. Then, the motor rotates according to the number of pulses applied from the motor driver, and moves both reels 3 and 17 at a speed higher than the normal speed, according to the length of the connecting tape 67. Wrap adhesive tape 1 for distance Move in the dispensing direction.
【0 4 9 9】 これにより、 他方の接着材テープ 1が加熱加圧へヅド 1 9の位置 まで、 自動的に繰り出されるので、 他方の接着材テープ 1の始端部 3 2が加熱加 圧へヅド 1 9の位置にくるまで、 連結テープ 6 7を繰り出す手間を省くことがで ぎる。  [0499] As a result, the other adhesive tape 1 is automatically fed out to the position of the heating and pressing head 19, so that the starting end 3 2 of the other adhesive tape 1 is heated and pressed. Until the position of the head 19 is reached, it is not necessary to pay out the connecting tape 67.
【0 5 0 0】 尚、 卷取りリール 1 7では基材 9だけを巻き取っているので、 接 着材テ一プリ一ルの数本分を卷き取ることができるので、 卷取りリール 1 7の交 換回数を少なくすることができ、 作業効率が良い。 '  [0500] Incidentally, since only the base material 9 is wound on the take-up reel 17, it is possible to wind up several tapes of the adhesive material. The number of replacements can be reduced, and work efficiency is good. '
【0 5 0 1】 ここで、 図 5を参照して本実施の形態にかかる接着材テ一プリ一 ル Aの製造方法について説明する。  [0550] Here, a method of manufacturing the adhesive tape A according to the present embodiment will be described with reference to FIG.
【0 5 0 2】 卷出機 2 5から卷きだされた基材 （セパレ一夕） にコ一夕一 2 7 により、樹脂と導電粒子が混合された接着剤を塗布し、乾燥炉 2 9で乾燥した後、 卷取機 3 1で原反を卷き取る。 卷き取られた接着材テープの原反は、 スリツ夕 3 3により所定幅に切断されて巻き芯に巻き取れられた後、 巻き芯に側板 7， 7が 両側から装着されて、 あるいは、 側板付巻き芯に巻き取られ、 除湿材とともに梱 包され、 好ましくは、 低温 （一 5 °C〜― 1 0 °C) に管理されて出荷される。  [0 5 0 2] An adhesive mixed with resin and conductive particles is applied to the base material (separate one night) unwound from the unwinding machine 25 by means of the first one 27 and a drying oven 29 After drying, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound on a core, and side plates 7, 7 are attached to the core from both sides. It is wound on a core and packaged with a dehumidifying material, and is preferably shipped at a controlled low temperature (15 ° C to -10 ° C).
【0 5 0 3】 次に、 請求の範囲第 2 2〜第 2 4項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, other embodiments of the invention described in claims 22 to 24 will be described. However, in the embodiment described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 5 0 4】 図 2 4に示す第 2実施の形態では、 連結テープ 6 7の幅 Tを、 前 後の接着材テープ 1の幅 Wよりも狭くすることで、 連結テープ 6 7を認識してい る。 また、 接着装置 1 5には、 接着材テープ 1を挟んだ対向位置に第 1実施の形 態と同様な発光部及び受光部を設けている。 この場合、 連結テープ 6 7の幅狭部 分を透過したレーザ光を受光部が受けることで、連結テープ 6 7を認識している。 In the second embodiment shown in FIG. 24, the connecting tape 67 is recognized by making the width T of the connecting tape 67 smaller than the width W of the front and rear adhesive tapes 1. are doing. Further, the bonding device 15 is provided with a light emitting unit and a light receiving unit similar to those of the first embodiment at opposing positions with the adhesive tape 1 interposed therebetween. In this case, the connection tape 67 is recognized by receiving the laser beam transmitted through the narrow portion of the connection tape 67 by the light receiving unit.
【0 5 0 5】 図 2 5に示す第 3実施の形態では、 連結テープ 6 7に、 多数の孔 5 3を形成して連結テープ 6 7を認識している。 この場合も、 連結テープ 6 7の 孔 5 3を透過したレーザ光を受光部が受けることで、 連結テープ 6 7を認識して いる。 In the third embodiment shown in FIG. 25, the connecting tape 67 has many holes. The connecting tape 6 7 is recognized by forming 5 3. Also in this case, the connection tape 67 is recognized by the light receiving portion receiving the laser beam transmitted through the hole 53 of the connection tape 67.
【0 5 0 6】 図 2 6に示す第 4実施の形態では、 連結テープ 6 7で接着材テ一 プ 1同士の接続を行わず、 一方の接着材テープ 1の卷き出しが終了すると、 他方 の接着材テープ 1を巻き出しリール 1 7に巻き付けて、 接着材テープ 1の交換を 行っている。 この場合においても、 接着装置への新たな接着材テープリールの装 着が不要であるので、 新たな接着材テープリールの交換作業が少なくて済み、 電 子機器の生産効率が高まる。  In the fourth embodiment shown in FIG. 26, the connection between the adhesive tapes 1 is not performed by the connecting tape 67, and when the unwinding of one adhesive tape 1 is completed, The adhesive tape 1 is exchanged by winding the other adhesive tape 1 around the unwinding reel 17. In this case as well, since it is not necessary to mount a new adhesive tape reel on the bonding apparatus, the replacement work of a new adhesive tape reel is reduced, and the production efficiency of electronic equipment is increased.
【0 5 0 7】 請求の範囲第 2 2〜第 2 4項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 2 2〜第 2 4項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  The invention described in claims 22 to 24 is not limited to the above-described embodiment, but may be any of the inventions described in claims 22 to 24. Various modifications can be made without departing from the gist.
【0 5 0 8】 例えば、 上述した第 1及び第 2実施の形態において、 卷き部 2、 2 aは特に制限はなく幾つあってもよい。  [0508] For example, in the first and second embodiments described above, the number of the winding portions 2 and 2a is not particularly limited, and may be any number.
【 0 5 0 9】 第 1乃至第 3実施の形態において、 連結テープ 6 7を光学的に検 知しているが、 その他連結テープ 6 7に磁気テープを巻いて磁気センサでこれを 検知するようにしても良い。  In the first to third embodiments, the connecting tape 67 is optically detected. However, a magnetic tape may be wound around the connecting tape 67 and detected by a magnetic sensor. You may do it.
【0 5 1 0】 次に、 請求の範囲第 2 5〜第 2 8項に記載された発明について説 明する。  Next, the invention described in claims 25 to 28 will be described.
【0 5 1 1】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関する。 ま た、 また、 リ一ドフレームの固定用支持基板やリードフレームのダイ、 半導体素 子搭載用支持基板に半導体素子 （チップ） を接着 '固定する半導体装置において 使用される接着材テープに関し、 特にリール状に巻かれた接着材テープリール、 接着装置及び接着材テ一プの接続方法に関する。  [0511] The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or between circuit boards, and for electrically connecting both electrodes. In addition, the present invention relates to an adhesive tape used in a semiconductor device for bonding and fixing a semiconductor element (chip) to a supporting substrate for fixing a lead frame, a die for a lead frame, and a supporting substrate for mounting a semiconductor element. The present invention relates to an adhesive tape reel wound in a reel shape, an adhesive device, and a method of connecting an adhesive tape.
Γ 0 5 1 2】 次に、 請求の範囲第 2 5〜第 2 8項に記載された発明の背景技術 について説明する。 Γ 0 5 1 2] Next, the background art of the invention described in claims 25 to 28 Will be described.
【0513】 一般に、 液晶パネル、 PDP (プラズマディスプレイパネル)、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。 また、 接着材テープは、 リードフレームのリード固 定テープ、 LOCテープ、 ダイボンドテープ、 マイクロ BGA · CSP等の接着 フィルム等に用いられ、 半導体装置全体の生産性、 信頼性を向上させるために使 用される。  [0513] In general, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a pair chip mounting, and a circuit board and a circuit board are bonded and fixed to each other, and both electrodes are electrically connected to each other. Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
【0514】 特開 2001— 284005号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に巻き取ったものが開示されている。  [0514] Japanese Patent Laying-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
【0515】 この種の従来の電極接続用接着材テープは、 幅が 1〜 3 mm程度 であり、 リールに巻き取るテープの長さは 50 m程度である。  [0515] This type of conventional adhesive tape for electrode connection has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m.
【0516】 接着材テープを接着装置に装着する場合、 接着材テープをリ一ル に卷いた接着材テープリールを接着装置に取り付け、 接着材テープの始端部を引 き出して、 卷取りリールに取り付ける。 そして、 接着材テープリールから卷き出 された接着材テ一プの基材側から加熱加圧へヅドで接着剤を回路基板等に圧着し、 残った基材を卷取りリールに卷き取っている。  [0516] When the adhesive tape is mounted on the bonding device, the adhesive tape reel on which the adhesive tape is wound around the reel is mounted on the bonding device, the starting end of the adhesive tape is pulled out, and the tape is wound on the take-up reel. Attach. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive tape reel with a heating and pressing head, and the remaining base material is wound on a take-up reel. taking it.
【0517】 そして、一方の接着材テ一プリ一ルの接着材テープが終了すると、 終了したリールと、 基材を卷き取った卷取りリールを外し、 新たな卷取りリール と新たな接着材テープリールを接着装置に装着し、 接着材テープの始端を卷取り リールに取り付けている。  [0517] Then, when the adhesive tape of one adhesive tape is completed, the completed reel and the take-up reel that has taken up the base material are removed, and a new take-up reel and a new adhesive material are removed. The tape reel is mounted on the bonding machine, and the beginning of the adhesive tape is mounted on the take-up reel.
【0518】 しかし、 近年の PDP等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してぎた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材テープリールの交換頻度が多くなり、 接着材テ —プリールの交換に手間がかかるため電子機器の生産効率の向上が図れないとい う問題がある。 [0518] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, the frequency of changing the adhesive tape reel is increased in electronic device manufacturing plants, and it takes time to change the adhesive tape, so it is not possible to improve the production efficiency of electronic devices. Problem.
【0 5 1 9】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 巻き 数を多くすると卷き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロヅキングの原因になるおそれがある。  [0 5 1 9] To solve this problem, it is possible to increase the amount of adhesive per reel and reduce the frequency of reel replacement by increasing the number of windings of the adhesive tape wound on the reel. It is conceivable, however, that the tape width of the adhesive tape is as narrow as 1 to 3 mm. Also, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 5 2 0】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0520] Furthermore, when the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding device, and may render the existing bonding device unusable.
【0 5 2 1】 そこで、 請求の範囲第 2 5〜第 2 8項に記載された発明は、 接着 材テープリ一ルの交換が簡単にでき、 電子機器の生産効率の向上を図ることがで きる接着材テープリ一ル、 接着装置及び接続方法の提供を目的とする。  Therefore, the inventions described in claims 25 to 28 can easily replace the adhesive tape reel and improve the production efficiency of electronic devices. It is an object of the present invention to provide an adhesive tape reel, a bonding device and a connection method.
【0 5 2 2】 次に、 添付図面を参照しながら請求の範囲第 2 5〜第 2 8項に記 載された発明の実施の形態について説明するが、まず図 2 7 A〜2 7 C、図 2 8、 図 4、 図 2 9、 図 5を参照して請求の範囲第 2 5〜第 2 8項に記載された発明の 第 1実施の形態について説明する。 図 2 7 A〜2 7 Cは第 1実施の形態にかかる 接着材テープリールを示す図であり、 図 2 7 Aは接着材テープリールを示す斜視 図であり、 図 2 7 Bは図 2 7 Aにおける正面図であり、 図 2 7 Cは図 2 7 Aにお ける接続部分の断面図であり、 図 2 8は接着装置における接着剤の圧着工程を示 す概略図であり、図 2 9は P D Pにおける接着剤の使用状態を示す斜視図である。 【0 5 2 3】 本実施の形態にかかる接着材テ一プリ一ル Aは、 複数の接着材テ —プ 1の巻き部 （以下、 巻き部） 2、 2 aを備えており、 卷き部 2、 2 aには接 着材テープ 1が巻かれたリール 3、 3 aを備えている。 各リール 3、 3 aには卷 き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設けられている。 図 2 8 に示すように、 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 Next, embodiments of the invention described in claims 25 to 28 will be described with reference to the attached drawings. First, FIGS. 27A to 27C are described. The first embodiment of the invention described in claims 25 to 28 will be described with reference to FIGS. 28, 4, 4, 29, and 5. FIG. FIGS. 27A to 27C are diagrams illustrating an adhesive tape reel according to the first embodiment, FIG. 27A is a perspective view illustrating the adhesive tape reel, and FIG. FIG. 27C is a front view, FIG. 27C is a cross-sectional view of the connection portion in FIG. 27A, and FIG. 28 is a schematic view showing a bonding step of the adhesive in the bonding apparatus. FIG. 4 is a perspective view showing a use state of an adhesive in a PDP. The adhesive tape A according to the present embodiment includes winding portions (hereinafter referred to as winding portions) 2 and 2a of a plurality of adhesive tapes 1. Parts 2 and 2a are provided with reels 3 and 3a on which adhesive tape 1 is wound. Each reel 3, 3 a is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in Fig. 28, the adhesive tape 1 is composed of the base material 9 and the adhesive applied to one side of the base material 9.
oo
4 剤 1 1とから構成されている。  It consists of four agents.
【0 5 2 4】 複数の卷き部 2、 2 aのうち、 一方の卷き部 2に巻かれた接着材 テープ （以下、 一方の接着材テープ） 1の終端部 3 0と他方の巻き部 2 aに卷か れた接着材テープ （以下、 他方の接着材テープ） 1の始端部 3 2とを、 係止具 7 6を用いて接続している。係止具 7 6は、例えば断面略コ字状の係止ピンであり、 一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2とを重 ね合せ、 この重ね合せ部分に係止ピンを挿入して両者を接続している。  [0 5 2 4] Of the plurality of winding portions 2 and 2a, the end portion 30 of the adhesive tape 1 wound on one winding portion 2 (hereinafter, one adhesive tape) and the other winding portion The starting end 32 of the adhesive tape 1 (hereinafter referred to as the other adhesive tape) wound around the portion 2 a is connected using a locking member 76. The locking member 76 is, for example, a locking pin having a substantially U-shaped cross section. The terminal 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are overlapped. A locking pin is inserted into the overlapping portion to connect the two.
【0 5 2 5】 さらに、 本実施の形態では、 接続部分 7 4は図 2 7 Cに示すよう に、 終端部 3 0と始端部 3 2とを、 係止具 7 6で接続した後、 接続部分 7 4をテ —プの長手方向に 1 8 0度折り返すことで、 係止具 7 6を接着材テープ 1で覆つ ている。  Further, in the present embodiment, as shown in FIG. 27C, the connecting portion 74 connects the terminal end portion 30 and the start end portion 32 with the locking member 76, The connecting part 74 is folded back 180 degrees in the longitudinal direction of the tape, so that the locking member 76 is covered with the adhesive tape 1.
【0 5 2 6】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延^ 3ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコン処理し た P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するもの [0526] The base material 9 is made of OPP (rolled ^ 3 polypropylene), polytetrafluoroethylene, or silicon-treated PET (PET) in view of the strength and the releasability of the adhesive constituting the anisotropic conductive material. Polyethylene terephthalate) etc., but are not limited to these
L5 ではない。 Not L5.
【0 5 2 7】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱 可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性 樹脂系としてはエポキシ樹脂系、ァクリル樹脂系、シリコン樹脂系が用いられる。 [0526] As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
【0 5 2 8】 接着剤 1 1には、 導電粒子 1 3が分散されていても良い。 導電粒 子 1 3としては、 Au， A g , P t , N i , C u , W， S b、 S n , はんだなど の金属粒子やカーボン、 黒鉛などがあり、 これら及び/または非導電性のガラス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等によ り形成したものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してな 5 る絶縁被覆粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の 熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加 9694 圧もしくは加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に 回路との接触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核と した場合、 はんだのように融点を示さないので軟化の状態を接続温度で広く制御 でき、 電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより 好ましい。 [0528] The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like. The conductive layer may be formed by coating the above-mentioned conductive layer on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated 9694 It is preferable because it has deformability under pressure or pressure, reduces the distance between electrodes after connection, increases the contact area with the circuit at the time of connection, and improves reliability. Particularly when a polymer is used as a nucleus, the melting point is not exhibited unlike solder, so that the softened state can be widely controlled by the connection temperature, and a connection member that can easily cope with variations in electrode thickness and flatness is obtained, which is more preferable. .
【0 5 2 9】 次に、 本実施の形態にかかる接着材テープリールの使用方法につ いて説明する。 図 2 8に示すように、 接着装置 1 5に接着材テ一プリ一ル Aと、 卷取りリール 1 7とを装着し、 一方の接着材テープ 1の始端部 3 2をガイドビン 2 2に挂トけて卷取りリール 1 7に取り付け、 接着材テープ 1を繰り出す （図 2 8 中矢印 E )。 そして、 回路基板 2 1上に接着材テープ 1を配置して、 両リール 3、 Next, a method for using the adhesive tape reel according to the present embodiment will be described. As shown in FIG. 28, the adhesive tape A and the take-up reel 17 are attached to the adhesive device 15, and the starting end 32 of one adhesive tape 1 is attached to the guide bin 22. Attach it to the take-up reel 17 and hang out the adhesive tape 1 (arrow E in Fig. 28). Then, the adhesive tape 1 is placed on the circuit board 2 1 and both reels 3,
1 7間に配置された加熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリ一ル 1 7に卷 き取る。 The adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between 17 and the adhesive 11 is pressed against the circuit board 21. Thereafter, the base material 9 is wound on a winding reel 17.
【0 5 3 0】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クッション材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へヅド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 l aと配線回路 2 3の 電極 2 3 aとを接続する。  Next, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 5 3 1】 図 2 9に本実施の形態による接着材テープ 1を用いた P D P 2 6 の接続部分を示すように、 接着剤 1 1は P D P 2 6の周囲全体に亘り圧着してお り、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが明 らかである。 したがって、 接着材テープ 1の使用量も多くなり、 リール 3、 3 a に卷いた接着材テープ 1は比較的短時間で卷取りリール 1 7に巻き取られる。 [0530] As shown in FIG. 29, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive 11 is pressed over the entire periphery of the PDP 26. In other words, it is clear that the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time.
【0 5 3 2】 本実施の形態では、 一方の接着材テープ 1の卷き出しが終了した ところで、 接続部分 7 4を切欠け 7 5から外し、 続いて他方の接着材テープ 1の 繰り出しを行う （図 2 7 B )o本実施の形態では、一方の接着材テープ 1の終端部 3 0と他方の接着材テープ 1の始端部 3 2とが係止具 7 6で接続されているので、 一方の接着材テープ 1の卷き出しが終了すると、 続けて他方の接着材テープ 1の 繰り出しを開始することができる。 従って、 一方の接着材テープ 1の巻き出しが 終了した後、 新たな接着材テープ 1を卷取りリール 1 7に取り付ける作業が不要 となり、 電子機器の生産効率が高まる。 また、 接続部分 7 4は、 係止具 7 6を接 着材テープ 1で覆っているので、 外観が良いとともに、 接続部分 7 4の係止具 7 6が接着材テープ 1に接触して、 接着材テープ 1が損傷することを防止できる。 【0 5 3 3】 また、 接着装置 1 5は、 図 2 8に示すように、 接続部検知センサ 4 7として厚み検知センサーを備えており、 接続部分 7 4を光学的に検知して、 接続部分 7 4が加熱加圧へッド 1 9の部分をスキップするようにしている。 一方 の接着材テープ 1と他方の接着材テープ 1との接続部分 7 4は、 図 2 7 Cに示す ように、 接着材テープ 1の厚みに比べて大きくなつており、 厚みの違いを検知す ることで、 接続部分 7 4を認識する。 厚み検知センサ 4 7は、 接着材テープ 1の 厚みを常時検知しており、 その検知信号を制御装置 7 9に送信している。 [0530] In the present embodiment, when the unwinding of one adhesive tape 1 is completed, the connection portion 74 is removed from the notch 75, and then the other adhesive tape 1 is unreeled. Perform (FIG. 27B) o In this embodiment, the end of one adhesive tape 1 Since 30 and the start end 3 2 of the other adhesive tape 1 are connected by the locking member 76, when the unwinding of one adhesive tape 1 is completed, the other adhesive tape 1 continues. Can be started. Therefore, after the unwinding of one of the adhesive tapes 1 is completed, the work of attaching a new adhesive tape 1 to the take-up reel 17 becomes unnecessary, and the production efficiency of the electronic device increases. In addition, since the connecting portion 74 covers the locking member 76 with the adhesive tape 1, the appearance is good and the locking member 76 of the connecting portion 74 contacts the adhesive tape 1, The adhesive tape 1 can be prevented from being damaged. [053 3 3] Further, as shown in FIG. 28, the bonding device 15 includes a thickness detection sensor as the connection portion detection sensor 47, and optically detects the connection portion 74 to perform connection. The part 74 is to skip the part of the heating and pressing head 19. The connecting portion 74 of one adhesive tape 1 and the other adhesive tape 1 is larger than the thickness of the adhesive tape 1 as shown in Fig. 27C, and the difference in thickness is detected. By recognizing the connection part 74, The thickness detection sensor 47 constantly detects the thickness of the adhesive tape 1 and transmits a detection signal to the control device 79.
【0 5 3 4】 検知信号を受けた制御装置 7 9は、 接着装置 1 5の両リール 3、 1 7を駆動するモ一夕への制御信号を出力し、 モー夕ドライバを介してモー夕に 対する駆動パルスの出力を開始する。 そして、 モータドライバから印加されるパ ルス数に応じてモ一夕が回転し、 両リール 3、 1 7を通常の速度より速い速度で 回転させながら、 接続部分 7 4の搬送方向の長さに応じた所定の距離だけ接着材 テープ 1を卷き出し方向に移動させる。  [0 5 3 4] Upon receiving the detection signal, the control device 79 outputs a control signal to the motor driving the reels 3 and 17 of the bonding device 15 and outputs the control signal to the motor via the motor driver. The output of the drive pulse to is started. Then, the motor rotates according to the number of pulses applied from the motor driver, and while rotating both reels 3 and 17 at a speed higher than the normal speed, the length of the connecting portion 74 in the transport direction is increased. The adhesive tape 1 is moved in the unwinding direction by a predetermined distance corresponding to the distance.
【0 5 3 5】 これにより、 他方の接着材テープ 1が加熱加圧へヅ ド 1 9の位置 まで搬送されるので、 一方及び他方の接着材テープ 1の接続部分 7 4が加熱加圧 へッド 1 9の位置にきて、圧着動作が行われるという不具合を防止できる。また、 接続部分 4 1が加熱加圧へヅド 1 9を通過するまで、 一方の接着材テープ 1を自 動的に卷取りリール 1 7に卷き取るので、 卷取りの手間を省くことができる。 [0553] As a result, the other adhesive tape 1 is transported to the position of the heating and pressing head 19, so that the connection portion 74 of the one and the other adhesive tape 1 is heated and pressed. The problem that the crimping operation is performed at the position of the pad 19 can be prevented. Further, one adhesive tape 1 is automatically wound on the take-up reel 17 until the connection portion 41 passes through the heating / pressing head 19, so that the time and effort for winding can be reduced. it can.
【0 5 3 6】 尚、 厚み検知センサ 4 7により、 接続部分 Ί 4の先端部 4 1 a及 び後端部 4 l bを認識し、 接続部分 7 4のみをスキップできるようにすれば、 接 着材テープ 1を有効に利用することができる。 [0 5 3 6] By the thickness detection sensor 47, the tip 41a of the connection part Ί4 The adhesive tape 1 can be used effectively by recognizing the rear end 4 lb and skipping only the connecting portion 7 4.
【0 5 3 7】 尚、 卷取りリール 1 7では基材 9だけを巻き取っているので、 接 着材テープリールの数本分を巻き取ることができるので、 卷取りリール 1 7の交 換回数を少なくすることができ、 作業効率が良い。  [0 5 3 7] Since only the base material 9 is wound on the take-up reel 17, it is possible to take up several adhesive tape reels. The number of times can be reduced and work efficiency is good.
【0 5 3 8】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  [0533] Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 5 3 9】 卷出機 2 5から卷きだされた基材 （セパレー夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤を塗布し、 乾燥炉 2 9で乾燥し た後、 卷取機 3 1で原反を卷き取る。 卷き取られた接着材テープの原反は、 スリ ッ夕 3 3により所定幅に切断されて巻き芯に巻き取れられた後、巻き芯に側板 7 , 7が両側から装着されて、 除湿材とともに梱包され、 好ましくは、 低温 ( - 5 °C 〜一 1 0 °C) に管理されて出荷される。  [0 5 3 9] An adhesive containing a mixture of resin and conductive particles 13 is applied to the base material (separation material) unwound from the unwinding machine 25 by the coke 27, and the drying oven 2 After drying at 9, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound around a core, and side plates 7 and 7 are attached to the core from both sides to remove the dehumidifying material. It is packaged together with the product, and is preferably shipped at a low temperature (-5 ° C to 110 ° C).
【0 5 4 0】 次に、 請求の範囲第 2 5〜第 2 8項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, another embodiment of the invention described in claims 25 to 28 will be described. However, in the embodiment described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 5 4 1】 図 3 0に示す第 2実施の形態では、 複数の巻き部 2、 2 aを備え た接着材テープリール Aを用いずに、 1つの巻き部を備えた接着材テープリール 2 cを使用している。 この場合、 接着材テープ 1が卷取りリール 1 7に卷き取ら れて、 一方の接着材テープ 1にエンドマーク 2 8が露出したところで、 一方の接 着材テープリール 2 bを新たな接着材テープリール 2 cと交換するため、 一方の 接着材テープ 1の終端部 3 0と、 他方の接着材テープ 1の始端部 3 2とを接続し ている。  In the second embodiment shown in FIG. 30, an adhesive tape reel having one winding portion is used without using an adhesive tape reel A having a plurality of winding portions 2 and 2a. You are using 2c. In this case, when the adhesive tape 1 is wound on the take-up reel 17 and the end mark 28 is exposed on one adhesive tape 1, one adhesive tape reel 2b is replaced with a new adhesive tape. The end 30 of one adhesive tape 1 and the start 32 of the other adhesive tape 1 are connected to be exchanged with the tape reel 2c.
【0 5 4 2】 この場合においても、 接続部分 7 4を接続部検知手段として厚み 検出センサ Ί 7で検知することで、 接続部分 Ί 4が加熱加圧へヅド 1 9の部分を スキップするようにしている。 [0554] In this case as well, the connection portion 部分 4 detects the portion of the heating and pressure head 19 by detecting the connection portion 部分 4 as a connection portion detection means with the thickness detection sensor Ί7. I try to skip it.
【0 5 4 3】 請求の範囲第 2 5〜第 2 8項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 2 5〜第 2 8項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  The invention described in claims 25 to 28 is not limited to the above-described embodiment, but may be any of the inventions described in claims 25 to 28. Various modifications can be made without departing from the gist.
【0 5 4 4】 例えば、 上述した第 1及び第 2実施の形態において、 接着材テ一 プ 1同士を接続する係止具 7 6は、 係止ピンに限らず、 両者の重ね合せ部分を横 断面略コ字状の弾性変形可能なクリップで挟んで固定するものや、 両者の重ね合 せ部分を横断面略コ字状の金属片で挟み、 重ね合せ部分の両面側から挟持片を押 しつぶして両者を接続する方法であっても良い。  For example, in the first and second embodiments described above, the locking tool 76 for connecting the adhesive tapes 1 is not limited to the locking pin, and the overlapping portion of the two can be used. A clip that can be sandwiched and fixed with an elastically deformable clip with a substantially U-shaped cross section, or a metal piece with a substantially U-shaped cross section between the two, and pressing the holding pieces from both sides of the overlapped portion A method may be used in which both are crushed and connected.
【0 5 4 5】 第 1及び第 2実施の形態において、厚み検知センサ 4 7を用いて、 接続部分 7 4の厚みを検知することで、 接続部分 7 4を認識するようにしたが、 これに限らず、 透過率検知センサを用いて接続部分 7 4を認識するものや、 C C Dカメラを用いて、 接続部分の表面をモニタ画面に取り込み、 画素の濃淡を比較 することで、 接続部分を検知しても良い。  In the first and second embodiments, the connection portion 74 is recognized by detecting the thickness of the connection portion 74 by using the thickness detection sensor 47. Not only that, but the connection part can be detected by using the transmittance detection sensor to recognize the connection part 74 or by using a CCD camera to capture the surface of the connection part on the monitor screen and comparing the density of the pixels to detect the connection part You may.
【0 5 4 6】 図 3 1 A、 図 3 1 B、 図 3 2 A〜3 2 Cには、 リードフレームの 固定用支持基板、 半導体素子搭載用支持基板あるいはリードフレームのダイと半 導体素子を接続する接着材テープのうち、 リードフレームの固定用支持基板と半 導体素子をリードフレームに接着 ·固定する L 0 C (Lead on Chip) 構造の 1例 を示す。  [0554] Figure 31A, Figure 31B, and Figures 32A to 32C show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the die and the semiconductor element of the lead frame. An example of an L0C (Lead on Chip) structure is shown in which an adhesive tape for connecting a lead frame to a lead frame fixing support substrate and a semiconductor element are bonded and fixed to the lead frame.
【0 5 4 7】 厚さ 5 Ομπιの表面処理を施したポリイミドフィルム等の支持フ イルム 7 8の両面に、 厚さ 2 5μπιのポリアミドイミド系接着剤層等の接着剤層 8 0が両面についた図 3 1 Αの構成の接着材テープを用い、 図 3 1 Bに示した L O C構造の半導体装置が得られる。 図 3 1 Aに示す接着材テープを図 3 2 A〜3 2 Cに示す接着装置の打ち抜き金型 8 7 (雄型（凸部） 9 5、 雌型（凹部） 9 6 ) を用いて短冊状に打ち抜き、 例えば、 厚さ 0 . 2 mmの鉄一ニッケル合金製のリ ードフレームの上に 0 . 2 mm間隔、 0 . 2 mm幅のインナーリードが当たるよ うに乗せて 4 0 0 °Cで 3 M P aの圧力で 3秒間加圧して圧着し、 半導体用接着フ イルム付きリードフレームを作製する。 次いで、 別工程で、 この半導体用接着フ イルム付きリ一ドフレームの接着剤層面に半導体素子を 3 5 0 °Cの温度で 3 M P aの圧力で 3秒間加圧して圧着し、 その後、 リードフレームと半導体素子を金線 でワイヤボンドしてエポキシ樹脂成形材料等の封止材を用いてトランスファ成形 により封止し、 図 3 1 Bに示すような半導体装置を得る。 図 3 1 A、 3 I Bにお いて、 8 1は接着材テープから打ち抜かれた半導体用接着フィルム、 8 2は半導 体素子、 8 3はリードフレーム、 8 4は封止材、 8 5はボンディングワイャ、 8 6はバスバ一である。 図 3 2 A、 3 2 B、 3 2 Cは接着装置であり、 図 3 2 A、 図 3 2 Bにおいて、 8 7は打ち抜き金型、 8 8はリードフレーム搬送部、 6 1は 接着剤テープ打ち抜き、 貼り付け部、 9 0はヒー夕一部、 9 1は接着材テープリ ール（接着材テープ巻き出し部)、 9 2は接着材テープ（半導体用接着フィルム）、 9 3は接着材テ一プ卷き出し口一ラーである。 また図 3 2 Cにおいて、 9 4は接 着材テープ （半導体用接着フィルム）、 9 5は雄型 （凸部)、 9 6は雌型 （凹部)、 9 7はフィルム押さえ板である。 接着材テープ 9 2は、 接着材テ一プリ一ル （接 着材テープ卷き出し部） 9 1から、 連続して卷き出され接着材テープ打ち抜き、 貝占り付け音 9で短冊状に打ち抜かれ、リードフレームのリード部分に接着され、 半導体用接着フィルム付きリードフレームとしてリ一ドフレーム搬送部から搬送 される。 打ち抜かれた接着材テープは接着材テープ巻き出しローラ一 9 3から搬 出される。 [0 5 4 7] An adhesive layer 80 such as a 25 μπι thick polyamide-imide adhesive layer is attached to both sides of a support film 78 such as a polyimide film having a surface treatment having a thickness of 5 μπι. The semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG. 31B. The adhesive tape shown in Fig. 31A is stripped using the die 8 7 (male (convex) 95, female (concave) 96) of the bonding machine shown in Figs. 32A to 32C. For example, an inner lead of 0.2 mm width and 0.2 mm width is placed on a 0.2 mm thick iron-nickel alloy lead frame. And press-fit it at 400 ° C at a pressure of 3 MPa for 3 seconds to produce a lead frame with an adhesive film for semiconductors. Then, in a separate step, the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductors at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed. The frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B. In Figures 31A and 3IB, 81 is an adhesive film for semiconductor punched from an adhesive tape, 82 is a semiconductor element, 83 is a lead frame, 84 is a sealing material, and 85 is a sealing material. The bonding wire 86 is a bus bar. Figures 32A, 32B, and 32C are bonding devices. In Figures 32A and 32B, 87 is a punching die, 88 is a lead frame transport section, and 61 is an adhesive tape. Stamping and pasting parts, 90 is a part of the heater, 91 is an adhesive tape reel (adhesive tape unwinding part), 92 is an adhesive tape (adhesive film for semiconductor), and 93 is an adhesive tape It is a one-page unwinder. In FIG. 32C, reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor), 95 denotes a male type (convex portion), 96 denotes a female type (concave portion), and 97 denotes a film holding plate. The adhesive tape 9 2 is unwound continuously from the adhesive tape 9 (adhesive tape unwinding section) 9 1, punches out the adhesive tape, and forms a strip with the shelling sound 9 It is stamped out and adhered to the lead portion of the lead frame, and is conveyed from the lead frame conveyance section as a lead frame with a semiconductor adhesive film. The punched adhesive tape is carried out from the adhesive tape unwinding roller 93.
【0 5 4 8】 上記と同様に 接着材テープを用いて半導体素子搭載用支持基板 に半導体素子を接続する。 また、 同様にリードフレームのダイと半導体素子を接 続 '接着する。 接着材テープは、 単に接着 '固定する場合と電極同士を接触によ り、 あるいは導電性粒子を介して電気的に接続する接着剤が目的に応じて使用さ れ、 支持フィルムを用いる場合と、 単に接着剤のみからなる場合がある。  [0545] In the same manner as above, the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape. Similarly, connect and bond the die of the lead frame and the semiconductor element. Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
[ 0 5 4 9】 次に、 請求の範囲第 2 9〜第 3 4項に記載された発明について説 明する。 [0549] Next, the invention described in claims 29 to 34 will be described. I will tell.
【0 5 5 0】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着剤テープに関し、 特に リ一ル状に巻かれた接着剤テープ、 接着剤テープの製造方法及び接着剤テープの 圧着方法に関する。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and in particular, is wound in a reel shape. The present invention relates to an adhesive tape, a method for producing an adhesive tape, and a method for crimping an adhesive tape.
【0 5 5 1】 次に、 請求の範囲第 2 9〜第 3 4項に記載された発明の背景技術 について説明する。  [0555] Next, the background art of the invention described in claims 29 to 34 will be described.
【0 5 5 2】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 剤テープが用いられている。  [0552] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, and pair chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method of making the connection.
【0 5 5 3】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着剤が塗布さ れた接着剤テープをリール状に卷き取ったものが開示されている。  [0555] Japanese Patent Application Laid-Open No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel shape. I have.
【0 5 5 4】· この種の従来の接着剤テープは、 幅が 1〜 3 mm程度であり、 リ 一ルに卷き取るテープの長さは 5 0 m程度であり、 接着剤テープは一度リールか ら巻き出されて接着剤を回路基板等に圧着した後は、再び使用されることがない。 【0 5 5 5】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 上述した電子機器の製造工場では、 接着剤テープを卷いたリールの交換頻度が多 くなり、 新たなリ一ルの交換に手間がかかるため電子機器の生産効率の向上が図 れないという問題がある。  [0555] The conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound up on the reel is about 50 m, and the adhesive tape is Once unwound from the reel and pressure-bonded to the circuit board or the like, it will not be used again. [0555] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in the above-described electronic device manufacturing plant, the frequency of replacement of the reel on which the adhesive tape is wound is increased, and replacement of a new reel takes time, so that it is not possible to improve the production efficiency of the electronic device. There is a problem.
【0 5 5 6】 かかる問題に対して、 リールに卷き取る接着剤テープの巻き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着剤テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると巻き崩れが生じるおそれがある。 また、 巻き数を多くするとテー プ状に巻いた接着剤フイルムに作用する圧力が高くなり接着剤がテープの両幅か ら染み出しブロッキングの原因になるおそれがある。 [0556] To solve this problem, it is conceivable to increase the number of adhesive tapes wound on the reel to increase the amount of adhesive per reel and reduce the frequency of reel replacement. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse. Also, increasing the number of turns The pressure acting on the adhesive film wound in a loop may increase, and the adhesive may ooze out from both sides of the tape and cause blocking.
【0 5 5 7】 更に、 接着剤テープの巻き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [05557] Further, when the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus may not be used.
【0 5 5 8】 そこで、 請求の範囲第 2 9〜第 3 4項に記載された発明は、 接着 剤テープの巻き数を多くすることなく、 接着剤量を增やすことができる接着剤テ [0558] Therefore, the invention described in claims 29 to 34 is intended to reduce the amount of the adhesive tape without increasing the number of turns of the adhesive tape.
—プ、接着剤テープの製造方法及び接着剤テープの圧着方法の提供を目的とする。 【 0 5 5 9】 次に、 添付図面を参照しながら請求の範囲第 2 9〜第 3 4項に記 載された発明の実施の形態について説明するが、まず図 3 3 A、図 3 3 B、図 3、 図 4、 揺 ^^図 5、 図 3 5を参照して請求の範囲第 2 9〜第 3 4項に記載され た発明の第 1実施の形態について説明する。 図 3 3 A及び図 3 3 Bは接着剤テ一 プの図であり、 図 3 3 Aは接着剤テープを卷いたリールの斜視図であり、 図 3 3 Bは図 3 3 Aにおける A— A断面図であり、 図 3 4は P D Pにおける接着剤の使 用状態を示す斜視図であり、 図 3 5は基材に接着剤を塗布する工程を示す断面図 である。 And a method for producing an adhesive tape and a method for pressure-bonding the adhesive tape. [0555] Next, embodiments of the invention described in claims 29 to 34 will be described with reference to the accompanying drawings. First, FIG. 33A and FIG. The first embodiment of the invention described in claims 29 to 34 will be described with reference to B, FIG. 3, FIG. 4, FIG. 5 and FIG. FIGS. 33A and 33B are views of an adhesive tape, FIG. 33A is a perspective view of a reel on which an adhesive tape is wound, and FIG. FIG. 34 is a cross-sectional view of A, FIG. 34 is a perspective view showing a use state of an adhesive in a PDP, and FIG. 35 is a cross-sectional view showing a step of applying an adhesive to a base material.
【0 5 6 0】 本実施の形態にかかる接着剤テープ 1はリ一ル 3に卷かれたもの であり、 リール 3には巻き芯 5と接着剤テープ 1の両幅側に配置した側板 7とが 設けられている。 本実施の形態では、 接着剤テープ 1は長さが約 5 0 mであり、 幅 Wが約 1 O mmである。  [0560] The adhesive tape 1 according to the present embodiment is wound on a reel 3. The reel 3 has side plates 7 arranged on both width sides of the core 5 and the adhesive tape 1. And are provided. In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 1 Omm.
【 0 5 6 1】 接着剤テープ 1は、 基材 9と、 基材 9上に塗布された接着剤 1 1 とから構成されており、 基材 9上には一条の幅が 0 . 5 mmの接着剤 1 1が間隔 をあけて 5条配置されている。  The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are arranged at 5 intervals.
【0 5 6 2】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延■(申ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するも のではない。 [0556] The base material 9 is made of OPP (polypropylene (PP), polytetrafluoroethylene, silicone-treated PET (PET)) from the viewpoint of the strength and the releasability of the adhesive constituting the anisotropic conductive material. Polyethylene terephthalate), etc. Not.
【 0 5 6 3】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬化性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹 S旨、 ァク リル樹 S旨系、 シリコーン樹脂系が用いられる。  [0563] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, vinyl ester resin, and acrylic resin S as thermosetting resin resins. The umbrella system and the silicone resin system are used.
【0 5 6 4】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u， A g , P t , N i , C u， W， S b、 S n， はんだなどの金属 粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミヅクス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 【 0 5 6 5】 次に、 本実施の形態にかかる接着剤テープの使用方法について説 明する。接着装置 1 5に接着剤テープ 1のリール 3と、空リール 1 Ίとを装着し、 リ一ル 3に巻いた接着剤テープ 1の先端を空リ一ル 1 7に取り付け、 接着剤テ一 プ 1を繰り出す（図 3中矢印 E )。そして、 回路基板 2 1上に接着剤テープ 1を配 置して、 両リール 3、 1 7間に配置された加熱加圧へヅ ド 1 9で接着剤テープ 1 を基材 9側から圧接し、 1条分の接着剤 1 1を回路基板に圧着する。 その後、 基 材 9とともに残りの接着剤 1 1を空リール 1 7に巻き取る。  [0566] In the adhesive 11, conductive particles 13 are dispersed. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, carbon, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as a ceramic, a plastic, or the like. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between the electrodes after connection decreases, This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred. [0565] Next, a method of using the adhesive tape according to the present embodiment will be described. Attach the reel 3 of the adhesive tape 1 and the empty reel 1 装置 to the adhesive device 15, attach the tip of the adhesive tape 1 wound on reel 3 to the empty reel 17, and Step 1 (arrow E in Fig. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the reels 3 and 17. , One piece of adhesive 1 1 is crimped to the circuit board. After that, the remaining adhesive 11 together with the substrate 9 is wound on an empty reel 17.
【 0 5 6 6】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 品） 2 3の電極を位置合わせして本接続する。 本接続は、 回路基板 2 1に圧着さ れた接着剤 1 1に配線回路 （又は電子部品） 2 3を配置して、 必要によりクッシ ヨン材として、 例えば、 ポリテトラフルォロエチレン材 2 4を介して加熱加圧へ ヅド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する。 これにより回路基 板 2 1の電極 2 1 aと配線回路 2 3の電極 2 3 aとを接続する。 [0566] After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and fully connected. This connection is crimped to the circuit board 21 A wiring circuit (or electronic component) 23 is placed on the adhesive 11 thus obtained, and if necessary, as a cushion material, for example, is heated and pressed through a polytetrafluoroethylene material 24. Heats and presses the wiring circuit 23 onto the circuit board 21. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 5 6 7】 図 3 4に示すように、 本実施の形態による接着剤テープ 1を用い た P D P 2 6の接続部分は、 P D Pの周囲全体に亘り接着しており、 一度に用い る接着剤 1 1の使用量が従来に比較して格段に多くなる。 したがって、 リ一ル 3 に卷いた接着剤テープ 1の使用量も多くなり、 リ一ル 3に巻いた接着剤テープ 1 は比較的短時間で空リール 1 7に巻き取られて、 リール 3が空になる。  [0566] As shown in FIG. 34, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time. The use amount of the agent 11 is remarkably increased as compared with the conventional method. Accordingly, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound up on the empty reel 17 in a relatively short time, and the reel 3 is wound up. Become empty.
【0 5 6 8】 リール 3が空になったところで、 リール 3及びリール 1 7をそれ それ反転させて、 今度は空になったリール 3で卷き取るようにして、 接着剤テ一 プ 1の移動方向を反対にする （図 3中矢印 F )。  [0 5 6 8] When the reel 3 became empty, the reel 3 and the reel 17 were turned around, and the reel 3 was wound up with the empty reel 3 this time. In the opposite direction (arrow F in Fig. 3).
【0 5 6 9】 このようにして、 接着剤 1 1の一条毎に接着剤テープ 1の卷き取 り方向 （E、 F ) を順次換えて、 回路基板 2 1に接着剤 1 1を圧着する。  [0 5 6 9] In this manner, the winding direction (E, F) of the adhesive tape 1 is sequentially changed for each strip of the adhesive 11, and the adhesive 11 is crimped on the circuit board 21. I do.
【0 5 7 0】 ここで、 図 5及び図 3 5を参照して本実施の形態にかかる接着剤 テープ 1の製造方法について説明する。  [0570] Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIGS.
【0 5 7 1】 卷出機 2 5から卷きだされた基材 （セパレ一夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、 卷取機 3 1で原反を卷き取る。 コ一夕一 2 7では、 図 3 5に示すよう に基材 9の 1 0 mm幅に対して 5個のコ一ター 2 7が配置され、 1 0 mm幅に 5 条の接着剤 1 1が塗布されるようになっている。 卷き取られた接着剤テープの原 反は、 スリッ夕 3 3により所定幅に切断されて卷き芯に巻き取れられ、 卷き芯に 側板 7， 7が両側から装着されて、 あるいは、 側板付卷き芯に巻き取られ、 除湿 材とともに梱包され、 好ましくは低温 （一 5 °C〜一 1 0 °C) に管理されて出荷さ れる。  [0 5 7 1] The adhesive 11 mixed with the resin and the conductive particles 13 is applied to the base material (separation one night) unwound from the unwinding machine 25 by the first one 27 After drying in the drying oven 29, the web is wound up by the winder 31. As shown in Fig. 35, five coaters 27 are placed on the base material 9 for the 10 mm width, and five strips of adhesive 11 are placed on the 10 mm width. Is applied. The raw material of the wound adhesive tape is cut into a predetermined width by a slit 33 and wound around a winding core, and the side plates 7, 7 are attached to the winding core from both sides, or It is wound on a core and packed with a dehumidifying material, and is preferably shipped at a low temperature (15 ° C to 110 ° C).
【0 5 7 2】 次に、 請求の範囲第 2 9〜第 3 4項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。 Next, another embodiment of the invention described in claims 29 to 34 will be described. However, in the embodiments described below, the same parts as those in the above-described embodiment are denoted by the same reference numerals, and detailed description of those parts will be omitted. The differences from the embodiment will be mainly described.
【0 5 7 3】 図 3 6 A〜図 3 6 Cに示す第 2実施の形態では、 接着剤テープ 1 には、 基材の片面全面に幅 Wで接着剤を塗布しており、 基材の長手方向に形成し たスリット 3 5により接着剤を幅 W方向に複数条に分離したものである。 この第 2実施の形態の接着剤テープ 1において、 スリット 3 5は、 接着装置 1 5にリ一 ル 3を装着後で接着剤テープ 1を回路基板 2 1に圧着する直前に形成することが 好ましい。 この場合、 接着装置 1 5のリール装着部近傍 （図 3に Sで示す） に切 羽を取り付けて卷き出される接着剤テープ 1の接着剤 1 1にスリット 3 5を形成 するものであってもよいし、 図 5に示す接着剤テープの製造時の仕上げ工程でス リツトを形成したものをリールに巻き取ったものであってもよいし、 塗工工程に おいて乾燥後卷取機 3 1で卷き取る直前にスリツトを形成しても良い。  In the second embodiment shown in FIGS. 36A to 36C, the adhesive tape 1 has an adhesive applied to the entire surface of one side of the base material with a width W. The adhesive is separated into a plurality of strips in the width W direction by slits 35 formed in the longitudinal direction. In the adhesive tape 1 according to the second embodiment, the slit 35 is preferably formed immediately after the adhesive tape 1 is pressure-bonded to the circuit board 21 after the reel 3 is mounted on the bonding device 15. . In this case, a slit 35 is formed in the adhesive 11 of the adhesive tape 1 to be wound by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 3). It may be wound on a reel after forming a slit in the finishing step in the production of the adhesive tape shown in Fig. 5, or after drying in the coating step. A slit may be formed immediately before winding in step 1.
【0 5 7 4】 第 2実施の形態にかかる接着剤テープ 1を接着装置 1 5で使用す るときには、 第 1実施の形態と同様に、 スリット 3 5で分離された一条ずつの接 着剤を基材 9側から加熱加圧ヘッド 1 9で圧着して、 図 3 6 A、 3 6 B、 3 6 C に示すように、 順次使用していく。  [0575] When the adhesive tape 1 according to the second embodiment is used in the bonding device 15, when the adhesive tape 1 is used in the bonding apparatus 15 as in the first embodiment, the adhesive tape is separated by slits 35 one by one. Is pressed from the base material 9 side by the heating and pressing head 19 and used sequentially as shown in Fig. 36A, 36B and 36C.
【0 5 7 5】 この第 2実施の形態では、 従来と同様な工程により得られた基材 上の接着剤にスリット 3 5を形成するだけで複数条の接着剤 1 1を得ることがで きるので、 製造が容易である。  In the second embodiment, a plurality of adhesives 11 can be obtained only by forming slits 35 in the adhesive on the base material obtained by the same process as the conventional method. It is easy to manufacture.
【0 5 7 6】 図 3 7 A〜図 3 7 Cに示す第 3実施の形態では、 基材 9には接着 剤 1 1が全面に塗布されており （図 3 7 A)、基材 9及び接着剤 1 1の幅 Wは上述 した実施の形態と同様に 5〜1 0 0 0 mmである。 そして、 使用時には接着装置 1 5に第 1実施の形態と同様に装着し、 リール 3から繰り出された接着剤テープ 1を回路基板 2 1上に配置し、 接着剤テープ 1の幅 W方向における接着剤の一部 (一条分） を加熱加圧することにより （図 3 7 B )、 その部分の凝集力を低下させ て、 加熱加圧した部分の接着剤のみを基材から分離して回路基板 2 1に圧着する (図 3 7 C )。 In the third embodiment shown in FIG. 37A to FIG. 37C, the adhesive 11 is applied to the entire surface of the base material 9 (FIG. 37A). The width W of the adhesive 11 is 5 to 100 mm as in the above-described embodiment. At the time of use, the adhesive tape 1 is mounted on the bonding device 15 in the same manner as in the first embodiment, the adhesive tape 1 fed from the reel 3 is placed on the circuit board 21, and the adhesive tape 1 is bonded in the width W direction. By heating and pressurizing a part (one part) of the agent (Fig. 37B), the cohesive force of that part is reduced. Then, only the adhesive in the heated and pressurized portion is separated from the base material and pressed on the circuit board 21 (FIG. 37C).
【0 5 7 7】 この場合、 加熱加圧へヅド 1 9の周囲ラインに沿って凝集力低下 ラインが形成され、加熱加圧された部分のほとんどは接着剤が軟ィ匕流動し、 （ 1 0 0 0ボイズ以下が目安)、接着剤の硬化反応が開始しないか低位の状態（反応率 2 0 %以下が目安） とすることが好ましく、 加熱温度は使用する接着剤系に応じて 選定する。  [0577] In this case, a cohesive force reduction line is formed along the line around the heating and pressing head 19, and most of the heated and pressurized portion causes the adhesive to flow softly. It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide). The heating temperature is selected according to the adhesive system used. I do.
【0 5 7 8】 この第 3実施の形態によれば、 接着剤 1 1は、 使用時にのみ幅 W のうちの一条分ずつを軟ィ匕流動化させて基板回路に圧着するので、 上述した実施 の形態と同様に、 接着剤テープ 1のリール 3及び空リールを正転及び反転させる ことにより複数回分使用することができる。  [0578] According to the third embodiment, the adhesive 11 is pressed into the substrate circuit by fluidizing one line of the width W only at the time of use. As in the embodiment, the reel 3 of the adhesive tape 1 and the empty reel can be used a plurality of times by rotating forward and reverse.
【0 5 7 9】 また、 上述した実施の形態のように接着剤 1 1にスリット 3 5を 形成したり、 複数条分離して設ける必要がなく、 幅広の基材の片面全面に接着剤 1 1を塗布しておくだけなので、 接着剤テープの製造が容易である。  [0570] Further, it is not necessary to form slits 35 in the adhesive 11 or to provide a plurality of slits as in the above-described embodiment, and the adhesive 1 Since only 1 is applied, it is easy to manufacture the adhesive tape.
【0 5 8 0】 図 3 8 A〜図 3 8 Cに示す第 4実施の形態は、 第 1実施の形態に かかる接着剤テープの他の製造方法を示すものであり、 基材 9 aに塗布した接着 剤 1 1にスリ ヅ ト 9 8を形成した後に（図 3 8 A)、接着剤 1 1を基材 9 a、 9 b で挟むように、 接着剤 1 1の上に他方の基材 9 bを貼着する （図 3 8 B )。 次に、 一方及び他方の基材 9 a、 9 bを剥がすように分離し、 それそれの基材 9 a、 9 bに一つ置きに接着剤条 1 1 a、 1 l bを配置する。 この第 4実施の形態では、 一方及び他方の.基材 9 a、 9 bに交互に接着剤条 1 1 a、 l i bが配置するよう に、 一方の基材 9 a又は 9 b側から接着剤条 1 1 a、 1 1 bを一つ置きに加熱 · 加圧することにより、 接着剤条 1 1 a、 1 1 bをひとつおきに各基材 9 a、 9 b に配置してもよい。  [0580] The fourth embodiment shown in Figs. 38A to 38C shows another method of manufacturing the adhesive tape according to the first embodiment. After a slit 98 is formed on the applied adhesive 11 (FIG. 38A), the other substrate is placed on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b. Paste the material 9b (Fig. 38B). Next, one and the other base materials 9a and 9b are separated so as to be peeled off, and adhesive strips 11a and 1lb are arranged on every other base material 9a and 9b. In the fourth embodiment, the adhesive is applied from one side of the base material 9a or 9b so that the adhesive strips 11a and lib are alternately arranged on the base material 9a and 9b. The adhesive strips 11a, 11b may be arranged on every other base material 9a, 9b by heating and pressing every other strip 11a, 11b.
【0 5 8 1】 請求の範囲第 2 9〜第 3 4項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 2 9〜第 3 4項に記載された発明の要旨を逸脱し ない範囲で種種変形可能である。 [0558] The invention described in claims 29 to 34 is not limited to the above-described embodiment, but may be any of the inventions described in claims 29 to 34. Deviating from the gist It can be variously deformed within the range that does not exist.
【0 5 8 2】 例えば、 上述した実施の形態において、 接着剤 1 1には導電粒子 1 3を分散していない絶縁性接着剤であってもよい。  For example, in the above embodiment, the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are not dispersed.
【0 5 8 3】 上述した実施の形態で、 基材 9上に形成する接着剤の条数はいく つでもよく、 少なくとも 2条以上であればよい。  [0583] In the above-described embodiment, the number of the adhesives formed on the base material 9 may be any number, and may be at least two or more.
【0 5 8 4】 次に、 請求の範囲第 3 5〜第 4 1項に記載された発明について説 明する。  [0584] Next, the invention described in claims 35 to 41 will be described.
【0 5 8 5】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続するための接着剤テープ、 接着 剤テープの製造方法及び接着剤テープの圧着方法に関する。  [0585] These inventions provide an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and electrically connecting both electrodes, a method for manufacturing an adhesive tape, and a method for manufacturing the same. The present invention relates to a pressure bonding method for an adhesive tape.
【0 5 8 6】 次に、 請求の範囲第 3 5〜第 4 1項に記載された発明の背景技術 について説明する。  [0586] Next, the background art of the invention set forth in claims 35 to 41 will be described.
【0 5 8 7】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ベアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し且つ両者の電極同士を電気的に接続する方法として、 接 着剤テープが用いられている。  [0558] In general, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, a bare chip mounting, a circuit board, and a circuit board are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method of making the connection.
【0 5 8 8】 特閧 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着剤が塗布さ れた接着剤テープをリール状に巻き取ったものが開示されている。  [0558] Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive in a reel shape. .
【0 5 8 9】 この種の従来の接着剤テープは、 幅が 1 ~ 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度である。 そして、 回路基板の四周に接 着剤を圧着する場合には、 接着剤テープを回路基板の一辺に沿って引き出して接 着剤を圧着し、 これを回路基板の四周に対して行って、 回路基板の四周に接着剤 を圧着している。  [0589] This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m. When bonding the adhesive to the circuit board on the four sides, the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board. Adhesive is crimped around the four sides of the board.
【0 5 9 0】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積 （周囲一辺の寸法） が増大し、 一度に使用する接着剤の使用 量が増加してきた。 また、 接着剤の用途も拡大したため、 接着剤の使用量が増加 してきた。 このため、 上述した電子機器の製造工場では、 接着剤テープを卷いた リ一ルの交換頻度が多くなり、 リールの交換には手間がかかるため電子機器の生 産効率の向上が図れなくなるという問題がある。 [0590] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area (dimensions on one side) of the circuit board has increased, and the amount of adhesive used at one time has increased. In addition, the use of adhesives has expanded, and the amount of adhesives used has increased I've been. For this reason, in the above-described electronic device manufacturing plant, the frequency of exchanging reels wound with adhesive tape is increased, and it takes time and effort to exchange reels, so that it is not possible to improve the production efficiency of electronic devices. There is.
【0 5 9 1】 かかる問題に対して、 リールに卷き取る接着剤テープの卷き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着剤テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると卷き崩れが生じるおそれがある。 また、 巻き数を多くするとテ一 プ状に巻いた接着剤テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してプロヅキングの原因になるおそれがある。  [0590] In order to solve this problem, by increasing the number of adhesive tapes wound on the reel, it is possible to increase the amount of adhesive per reel and to reduce the frequency of reel replacement. It is conceivable, however, that the width of the adhesive tape is as narrow as 1 to 3 mm. Also, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape, which may cause blocking.
【0 5 9 2】 そこで、 請求の範囲第 3 5〜第 4 1項に記載された発明は、 接着 剤テープの巻き数を多くすることなく、 接着剤量を増やすことができる接着剤テ ープ、接着剤テープの製造方法及び接着剤テープの圧着方法の提供を目的とする。 【0 5 9 3】 次に、 添付図面を参照しながら請求の範囲第 3 5〜第 4 1項に記 載された発明の実施の形態について説明するが、 まず図 3 9 A、 図 3 9 B、 図 4 0、 図 3 4、 図 5、 図 4 1を参照して請求の範囲第 3 5〜第 4 1項に記載された 発明の第 1実施の形態について説明する。 図 3 9 A及び図 3 9 Bは接着剤テープ の図であり、 図 3 9 Aは接着剤テープを巻いたリールの斜視図であり、 図 3 9 B は図 3 9 Aの接着剤テープを接着剤側から見た平面図であり、 図 4 0は接着装置 における接着剤の圧着工程を示す斜視図である。  [0590] Therefore, the invention described in claims 35 to 41 is an adhesive tape capable of increasing the amount of adhesive without increasing the number of turns of the adhesive tape. And a method for producing an adhesive tape and a method for pressure-bonding the adhesive tape. [0590] Next, embodiments of the invention described in claims 35 to 41 will be described with reference to the accompanying drawings. First, FIG. 39A and FIG. B, FIG. 40, FIG. 34, FIG. 5, and FIG. 41, the first embodiment of the invention described in claims 35 to 41 will be described. Fig. 39A and Fig. 39B are views of the adhesive tape, Fig. 39A is a perspective view of a reel around which the adhesive tape is wound, and Fig. 39B is a view of the adhesive tape of Fig. 39A. FIG. 40 is a plan view seen from the side of the adhesive, and FIG. 40 is a perspective view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0 5 9 4】 本実施の形態にかかる接着剤テープ 1はリ一ル 3に卷かれたもの であり、 リール 3には巻き芯 5と接着剤テープ 1の両側に配置した側板 7とが設 けられている。 本実施の形態では、 接着剤テープ 1は長さが約 5 0 mであり、 幅 Wは回路基板の一辺と略同じ寸法の約 1 5 0 O mmである。  [0590] The adhesive tape 1 according to the present embodiment is wound on a reel 3. The reel 3 includes a winding core 5 and side plates 7 arranged on both sides of the adhesive tape 1. It is set up. In the present embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 150 O mm, which is almost the same size as one side of the circuit board.
【0 5 9 5】 接着剤テープ 1は、 基材 9と、 基材 9上に塗布された接着剤 1 1 とから構成されており、 基材 9上には一条の幅が 0 . 5 mmの接着剤 1 1が等間 隔をあけて且つテープの幅方向に設けられている。 【0 5 9 6】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフタレ一ト）などを用いるが、 これらに制限するも のではない。 [0595] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied on the base material 9, and the width of one strip is 0.5 mm on the base material 9. Adhesives 11 are provided at regular intervals and in the width direction of the tape. [0559] The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
【0 5 9 7】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬ィ匕性樹 B旨系としてはエポキシ樹脂系、 アクリル系、 ビニルエステル 系樹脂系、 シリコーン樹脂系が用いられる。  [0590] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, and a vinyl ester type resin as a thermosetting resin. A silicone resin system is used.
【0 5 9 8】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 Au , A g , P t , N i , C u , W， S b、 S n， はんだなどの金属 粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、 プラスチヅク等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチヅク等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 [0590] In the adhesive 11, conductive particles 13 are dispersed. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like. A material in which the above-described conductive layer is formed by coating or the like on a polymer core material such as ceramics and plastic may be used. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
【0 5 9 9】 次に、 本実施の形態にかかる接着剤テープ 1の使用方法について 説明する。 接着装置 1 5に接着剤テープ 1のリール 3と、 空リール 1 7とを装着 し、 リール 3に卷いた接着剤テープ 1の先端を空リール 1 7に取り付け、 接着剤 テープ 1を繰り出す（図 4 0中矢印 E )。そして、 回路基板 2 1上に接着剤テープNext, a method of using the adhesive tape 1 according to the present embodiment will be described. Attach reel 3 of adhesive tape 1 and empty reel 17 to adhesive device 15, attach the end of adhesive tape 1 wound on reel 3 to empty reel 17, and pay out adhesive tape 1 (Fig. 40 middle arrow E). And adhesive tape on the circuit board 21
1を配置して、 両リール 3、 1 7間に配置された加熱加圧へヅド 1 9で接着剤テ ープ 1を基材 9側から圧接し、 一条分の接着剤 1 1を接着剤テープの幅方向にあ る回路基板の一辺に圧着し、 接着剤 1 1をその条幅分だけ空リール 1 7に卷き取 る。 1 and then press the adhesive tape 1 from the base material 9 side with the heating and pressurizing head 19 placed between both reels 3 and 17 to bond one strip of adhesive 1 1 In the width direction of the adhesive tape The adhesive 11 is wound on the empty reel 17 by the width of the strip.
【0 6 0 0】 次に、 回路基板 2 1を約 9 0度回転させて、 回路基板 2 1の隣の 辺を接着剤テープ 1の幅方向に位置させ、 加熱加圧へッド 1 9により接着剤 1 1 を回路基板 2 1の他の辺に圧着する。 このように、 回路基板 2 1を約 9 0度回転 させては接着剤 1 1を圧着させて、 回路基板 2 1の四周に亘つて接着剤 1 1を圧 着する。  [0600] Next, the circuit board 21 is rotated by about 90 degrees, the side adjacent to the circuit board 21 is positioned in the width direction of the adhesive tape 1, and the heating and pressing head 19 The adhesive 11 is pressed to the other side of the circuit board 21 by the above method. As described above, the circuit board 21 is rotated by about 90 degrees, the adhesive 11 is pressed, and the adhesive 11 is pressed around the circuit board 21 over four circumferences.
【0 6 0 1】 上記の圧着後 (仮接続)、 回路基板 2 1の電極と配線回路 （電子部 品） 2 3の電極を位置合わせして本接続する。 本接続は、 回路基板 2 1の四周に 接着剤 1 1を圧着後、 接着剤 1 1に配線回路 （又は電子部品） 2 3を配置して、 必要によりクッション材として、 例えば、 ポリテトラフルォロエチレン材 2 4を 介して加熱加圧へッド 1 9により配線回路 2 3を回路基板 2 1に加熱加圧する After the above-mentioned crimping (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic parts) 23 are aligned and permanently connected. In this connection, after bonding the adhesive 11 on the four sides of the circuit board 21, the wiring circuit (or electronic component) 23 is placed on the adhesive 11, and if necessary, as a cushioning material, for example, polytetrafluoride. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via the ethylene material 24.
(図 4参照)。これにより回路基板 2 1の電極 2 1 aと SH線回路 2 3の電極 2 3 a とを接続固定する。 (See Figure 4). Thereby, the electrode 21a of the circuit board 21 and the electrode 23a of the SH line circuit 23 are connected and fixed.
【0 6 0 2】 図 3 4に示すように、 本実施の形態による接着剤テープ 1を用い た P D P 2 6の接続部分は、 P D Pの周囲全体に亘り接着しており、 一度に用い る接着剤 1 1の使用量が従来に比較して格段に多くなる。 しかし、 接着剤テープ 1の幅 Wを回路基板 2 1の一辺の長さ Hと略等しくしているから、 接着剤テープ 1の幅 Wは広くなるものの従来と同じ巻き数でも接着剤量が従来よりも極めて多 くなるので、 リールの交換は従来のものより格段に少ない。  As shown in FIG. 34, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment is bonded over the entire periphery of the PDP, and is used at a time. The use amount of the agent 11 is remarkably increased as compared with the conventional method. However, since the width W of the adhesive tape 1 is substantially equal to the length H of one side of the circuit board 21, the width W of the adhesive tape 1 is increased, but the amount of adhesive is the same even with the same number of windings as before. The number of reel replacements is significantly less than conventional ones.
【0 6 0 3】 ここで、 図 5及び図 4 1を参照して本実施の形態にかかる接着剤 テープ 1の製造方法について説明する。  Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG. 5 and FIG.
【0 6 0 4】 卷出機 2 5から卷きだされた基材 （セパレ一夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、 卷取機 3 1で原反を卷き取る。 コ一夕一 2 7は、 左右に移動して基材 9に等間隔で条状の接着剤を塗布する。 巻き取られた接着剤テープの原反は、 ス リツ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 卷き芯に側板 7 , 7が両側から装着されて、 あるいは、 側板付卷き芯に卷き取られ、 除湿材と ともに梱包され、 好ましくは、 低温 （一 5 °C〜一 1 0 °C) に管理されて出荷され ο [0 6 0 4] An adhesive 11 mixed with resin and conductive particles 13 is applied to the base material (separate one night) unwound from the unwinding machine 25 by the second one 27 After drying in the drying oven 29, the web is wound up by the winder 31. In step 27, the adhesive is applied to the base material 9 at regular intervals by moving to the left and right. The material of the wound adhesive tape is After being cut to a predetermined width by the ridge 33 and wound on the winding core, the side plates 7, 7 are attached to the winding core from both sides, or are wound on the winding core with the side plate, Packed with dehumidifier, preferably shipped in a controlled low temperature (15 ° C to 110 ° C)
【0 6 0 5】 次に、 請求の範囲第 3 5〜第 4 1項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, other embodiments of the invention described in claims 35 to 41 will be described. However, in the embodiments described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 6 0 6】 図 4 1に示す第 2実施の形態では、 接着装置 1 5において、 接着 剤テープ 1を 2箇所に装着しており、 一方の接着剤テープ 1及び他方の接着剤テ ープ 1を互いに直交する方向に設けている。 そして、 一方の接着剤テープ 1にお いて回路基板 2 1の対向する一対の縦辺 Nに接着剤 1 1を圧着し（第 1工程)、他 方の接着剤テープ 1において対向する一対の横辺 Mに接着剤 1 1を圧着して （第 2工程)、 2つの工程で回路基板 2 1の四周に接着剤を圧着するものである。この 第 2実施の形態では、 第 1工程と第 2工程との間で回路基板 2 1の向きを回転さ せることなく、 第 1工程で載置されている回路基板 2 1をそのまま第 2工程に移 動させることにより接着剤の自動圧着が可能となり、 さらに作業効率の向上を図 ることができ 。 この場合、 回路 S反 2 1を搬送ベルトに載せて自動搬送するも のであってもよい。  [0606] In the second embodiment shown in Fig. 41, the adhesive tape 1 is mounted at two places in the adhesive device 15, and one adhesive tape 1 and the other adhesive tape are provided. Steps 1 are provided in directions orthogonal to each other. Then, the adhesive 11 is pressure-bonded to the pair of opposed vertical sides N of the circuit board 21 on one adhesive tape 1 (first step), and the pair of horizontal The adhesive 11 is crimped to the side M (second step), and the adhesive is crimped to the four circumferences of the circuit board 21 in two steps. In the second embodiment, the circuit board 21 placed in the first step is used as it is in the second step without rotating the direction of the circuit board 21 between the first step and the second step. By moving to, automatic bonding of the adhesive becomes possible, and the working efficiency can be further improved. In this case, the circuit S 21 may be placed on a transport belt and automatically transported.
【0 6 0 7】 図 4 2 A〜図 4 2 Cに示す第 3実施の形態では、 基材の片面全面 に幅 Wで接着剤を塗布しており、 基材の幅 W方向に形成したスリット 3 5により 接着剤を幅 W方向に複数条に分離したものである。 この第 3実施の形態の接着剤 テープ 1において、 スリット 3 5は、 接着装置 1 5にリール 3を装着後で接着剤 テープ 1を回路基板 2 1に圧着する直前に形成することが好ましい。 この場合、 接着装置 1 5のリール装着部近傍 （図 4 0に Sで示す） に切羽を取り付けて卷き 出される接着剤テープ 1の接着剤 1 1にスリヅト 3 5を形成するものであっても よいし、 図 5に示す接着剤テープの製造時に仕上げ工程でスリヅトを形成したも のをリ一ルに卷き取つたものであってもよいし、 塗工工程において乾燥後卷取機 3 1で卷き取る直前にスリットを形成しても良い。 尚、 各場合において切羽は接 着剤シート 1の幅 W方向に往復動するものであってもよい。 In the third embodiment shown in FIGS. 42A to 42C, the adhesive is applied to the entire surface of one side of the base material with a width W, and the adhesive is formed in the width W direction of the base material. The adhesive is separated into multiple strips in the width W direction by slits 35. In the adhesive tape 1 according to the third embodiment, the slit 35 is preferably formed immediately after the adhesive tape 1 is pressed onto the circuit board 21 after the reel 3 is mounted on the bonding device 15. In this case, a slit 35 is formed on the adhesive 11 of the adhesive tape 1 to be wound out by attaching a face to the vicinity of the reel mounting portion of the bonding device 15 (indicated by S in FIG. 40). Also It is also possible to use a reel in which a slit has been formed in the finishing step during the production of the adhesive tape shown in FIG. 5, or a winding machine after drying in the coating step. A slit may be formed immediately before winding with. In each case, the face may reciprocate in the width W direction of the adhesive sheet 1.
【0 6 0 8】 尚、 第 3実施の形態にかかる接着剤テープ 1を接着装置 1 5で使 用するときには、 第 1実施の形態と同様に、 スリット 3 5で分離された一条ずつ の接着剤を基材 9側から加熱加圧へッドで圧着して、 先端側から順次使用してい [0680] When the adhesive tape 1 according to the third embodiment is used in the bonding device 15, as in the first embodiment, the adhesive tapes 1 separated by the slits 35 are bonded one by one. The agent is pressed from the base material 9 side with a heating and pressurizing head and used sequentially from the tip side.
< o <o
【0 6 0 9】 この第 3実施の形態では、 従来と同様な工程により得られた基材 上の接着剤にスリット 3 5を形成するだけで幅方向に設けた複数条の接着剤 1 1 を得ることができるので、 製造が容易である。  In the third embodiment, a plurality of adhesives 11 provided in the width direction only by forming slits 35 in the adhesive on the base material obtained by the same process as in the related art It is easy to manufacture.
【0 6 1 0】 図 4 3 A〜図 4 3 Cに示す第 4実施の形態では、 基材 9には接着 剤 1 1が片面全面に塗布されており （図 4 3 A)、基材 9及び接着剤 1 1の幅 Wは 上述した実施の形態と同様に回路基板の一辺の長さと略同じ寸法である。そして、 使用時には第 1実施の形態と同様に装着し、 接着剤テープ 1の幅 W方向に接着剤 の一部（一条分） を加熱加圧することにより （図 4 3 B )、 その部分の凝集力を低 下させて、 加熱加圧した部分の接着剤のみを基材から分離して回路基板 2 1に圧 着する （図 4 3 C)o  In the fourth embodiment shown in FIGS. 43A to 43C, the adhesive 9 is applied to the entire surface of the base material 9 on one side (FIG. 43A). The width W of the adhesive 9 and the adhesive 11 is substantially the same as the length of one side of the circuit board as in the above-described embodiment. At the time of use, it is mounted in the same manner as in the first embodiment, and a part (one strip) of the adhesive is heated and pressed in the width W direction of the adhesive tape 1 (FIG. 43B), whereby the aggregation of the part is performed. Reduce the force to separate only the heated and pressurized part of the adhesive from the substrate and press it onto the circuit board 21 (Fig. 4 3C) o
【0 6 1 1】 この場合、 加熱加圧へヅド 1 9の周囲ラインに沿って凝集力低下 ラインが形成され、加熱加圧された部分のほとんどは接着剤が軟化流動し、 （ 1◦ 0 0ボイズ以下が目安）、接着剤の硬化反応が開始しないか低位の状態（反応率 2 0 %以下が目安） とすることが好ましく、 加熱温度は使用する接着剤系に応じて 選定する。  [0 611] In this case, a cohesive force reduction line is formed along the line around the heating and pressing head 19, and the adhesive softens and flows in most of the heated and pressed portion, and (1 ° It is preferable that the curing reaction of the adhesive does not start or is in a low state (the reaction rate is 20% or less as a guide). The heating temperature is selected according to the adhesive system to be used.
【0 6 1 2】 この第 4実施の形態によれば、 接着剤 1 1は、 使用時にのみ幅 W 方向に一条分ずつを軟化流動化させて基板回路に圧着することができる。  According to the fourth embodiment, the adhesive 11 can be softened and fluidized one by one in the width W direction only when used, and can be pressure-bonded to the substrate circuit.
【0 6 1 3】 また、 上述した実施の形態のように接着剤 1 1にスリット 3 5を 形成したり、 複数条分離して設ける必要がなく、 幅広の基材の片面全面に接着剤[061 13] Also, as in the above-described embodiment, the slits 3 5 It is not necessary to form or separate multiple strips.
1 1を塗布しておくだけなので、 接着剤テープの製造が容易である。 Since only 1 is applied, it is easy to manufacture the adhesive tape.
【0614】 図 44A〜44 Cに示す第 5実施の形態は、 第 1実施の形態にか かる接着剤テープ 1の他の製造方法を示すものであり、 基材 9 aに塗布した接着 剤 1 1にスリヅト 98を形成した後に（図 44 A)、接着剤 1 1を基材 9 a、 9 b で挟むように、 接着剤 11の上に他方の基材 9bを貼着する （図 44B)。 次に、 一方及び他方の基材 9 a、 9 bを剥がすように分離し、 それそれの基材 9 a、 9 bに一つ置きに接着剤条 1 1 a、 l i bを配置する。 この第 5実施の形態では、 一方及び他方の基材 9 a、 9 bに交互に接着剤条 1 1 a、 1 1 bが配置するよう に、 一方の基材 9 a又は 9 b側から接着剤条 11 a、 11 bを一つ置きに加熱カロ 圧することにより、 接着剤条 1 1 a、 l i bを順次各基材 9 a、 9 bに貼着して もよい。  [0614] The fifth embodiment shown in Figs. 44A to 44C shows another method of manufacturing the adhesive tape 1 according to the first embodiment, and shows the adhesive 1 applied to the base material 9a. After forming the slit 98 on 1 (Fig. 44A), the other substrate 9b is attached on the adhesive 11 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (Fig. 44B). . Next, one and the other substrates 9a and 9b are separated so as to be peeled off, and the adhesive strips 11a and lib are arranged on every other substrate 9a and 9b. In the fifth embodiment, one of the base materials 9a and 9b is adhered from one base material 9a or 9b side so that the adhesive strips 11a and 11b are alternately arranged on the other base material 9a and 9b. The adhesive strips 11a and lib may be sequentially adhered to the base materials 9a and 9b by heating and calorizing every other strip of strips 11a and 11b.
【0615】 請求の範囲第 35〜第 41項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 35〜第 41項に記載された発明の要旨を逸脱し ない範囲で種種変形可能である。  [0615] The invention described in Claims 35 to 41 is not limited to the above-described embodiment, and may be within the scope of the invention described in Claims 35 to 41. Various modifications are possible.
【0616】 例えば、 上述した実施の形態において、 接着剤 11には導電粒子 13を分散して 、ない絶縁性接着剤であってもよい。  [0616] For example, in the above-described embodiment, the adhesive 11 may be an insulating adhesive in which the conductive particles 13 are dispersed.
【0617】 次に、 請求の範囲第 42〜第 46項に記載された発明について説 明する。  [0617] Next, the invention described in claims 42 to 46 will be described.
【0618】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続するための接着剤テープカセッ ト及び接着剤テープカセットを用いた接着剤の圧着方法に関する。  [0618] These inventions provide an adhesive tape cassette and an adhesive using an adhesive tape cassette for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and for electrically connecting both electrodes. To a crimping method.
【0619】 次に、 請求の範囲第 42〜第 46項に記載された発明の背景技術 について説明する。  [0619] Next, the background art of the invention described in claims 42 to 46 will be described.
【0620】 一般に、液晶パネル、 PDP (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチヅプ実装などの電子部品と回路基板、 回 路基板同士を接着固定し且つ両者の電極同士を電気的に接続する方法として、 接 着剤テープが用いられている。 [0620] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, and pair-chip mounting and circuit boards, Adhesive tapes have been used as a method of bonding and fixing circuit boards to each other and electrically connecting both electrodes.
【0 6 2 1】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着剤が塗布さ れた接着剤テープをリール状に卷き取  [0621] Japanese Patent Application Laid-Open Publication No. 2000-2005 discloses that an adhesive tape having a base material coated with an adhesive is wound into a reel.
つたものが開示されている。 One is disclosed.
【0 6 2 2】 この種の従来の接着剤テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度である。 そして、 回路基板の四周に接 着剤を圧着する場合には、 接着剤テープを回路基板の一辺に沿って引き出して接 着剤を圧着し、 これを回路基板の四周に対して行って、 回路基板の四周に接着剤 を圧着している。  [0622] This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound on a reel is about 50 m. When bonding the adhesive to the circuit board on the four sides, the adhesive tape is pulled out along one side of the circuit board, and the adhesive is pressed on the circuit board. Adhesive is crimped around the four sides of the board.
【 0 6 2 3】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積 （周囲一辺の寸法） が増大し、 一度に使用する接着剤の使用 量が増加してきた。 また、 接着剤の用途も拡大したため、 接着剤の使用量が増加 してきた。 このため、 上述した電子機器の製造工場では、 接着剤テープを巻いた リ一ルの交換頻度が多くなり、 リ一ルの交換には手間がかかるため電子機器の生 産効率の向上が図れなくなるという問題がある。  [0623] However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area (dimensions of one side) of the circuit board has increased, and the amount of adhesive used at one time has increased. In addition, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in the above-described electronic device manufacturing plant, the frequency of exchanging the reel wound with the adhesive tape increases, and it takes time and effort to exchange the reel, so that it is impossible to improve the production efficiency of the electronic device. There is a problem.
【 0 6 2 4】 かかる問題に対して、 リールに卷き取る接着剤テープの卷き数を 多くすることで、 1リ一ル当りの接着剤量を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着剤テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると卷き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に巻いた接着剤テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してプロッキングの原因になるおそれがある。  [0 624] To solve this problem, increasing the number of adhesive tapes wound on the reel increases the amount of adhesive per reel and reduces the frequency of reel replacement. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of turns may cause collapse. In addition, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 6 2 5】 そこで、 請求の範囲第 4 2〜第 4 6項に記載された発明は、 接着 剤テープの巻き数を多くすることなく、 接着剤量を增やすことができ、 且つリ一 ルの交換が簡易にできる接着剤テープカセヅト及び接着剤テープカセヅトを用い た接着剤の圧着方法の提供を目的とする。 【0 6 2 6】 次に、 添付図面を参照しながら請求の範囲第 4 2〜第 4 6項に記 載された発明の実施の形態について説明するが、 まず図 4 5 A、 図 4 5 B、 図 4 6、 図 4 7、 図 4、 図 3 4、 図 4 8を参照して請求の範囲第 4 2〜第 4 6項に記 載された発明の第 1実施の形態について説明する。 説明の都合上接着剤テープに は接着剤が 2条配置された場合について記載するが、 複数条形成されていてもよ い。 図 4 5 A及び図 4 5 Bは請求の範囲第 4 2〜第 4 6項に記載された発明の第 1実施の形態にかかる接着剤テープカセヅ卜の図であり、 図 4 5 Aは接着剤テ一 プカセットの斜視図であり、 図 4 5 Bは図 4 5 Aの A— A切断面図であり、 図 4 6は図 4 5 A及び図 4 5 Bに示すテープカセヅトにおけるリ一ルの取り付け状態 を示す断面図であり、 図 4 7は接着装置における接着剤の圧着工程を示す正面図 であり、 図 4 8は接着剤テープカセットの製造方法を示す工程図である。 Therefore, the invention described in claims 42 to 46 can reduce the amount of the adhesive without increasing the number of windings of the adhesive tape, and reduce the amount of the adhesive. It is an object of the present invention to provide an adhesive tape cassette and a method for crimping an adhesive using the adhesive tape cassette, which can easily replace a cell. Next, embodiments of the invention described in claims 42 to 46 will be described with reference to the accompanying drawings. First, FIG. 45A and FIG. B, FIG. 46, FIG. 47, FIG. 4, FIG. 34, FIG. 48, the first embodiment of the invention described in claims 42 to 46 will be described. . For the sake of explanation, the adhesive tape is described in the case where two adhesives are arranged, but a plurality of adhesives may be formed. FIGS. 45A and 45B are diagrams of the adhesive tape cassette according to the first embodiment of the invention described in claims 42 to 46, and FIG. FIG. 45B is a perspective view of the tape cassette shown in FIG. 45A, and FIG. 46 is a perspective view of the tape cassette, and FIG. 46 is a view of the tape cassette shown in FIGS. 45A and 45B. FIG. 47 is a cross-sectional view showing the state, FIG. 47 is a front view showing a pressure bonding step of the adhesive in the bonding apparatus, and FIG. 48 is a process diagram showing a method for manufacturing an adhesive tape cassette.
【0 6 2 7】 本実施の形態にかかる接着剤テ一プカセヅ ト 1 0 0は、 一方のリ —ル 3と、 他方のリール 1 7と、 これらを収納するケース 9 9とから主に構成さ れており、 一方のリール 3には接着剤テープ 1が巻かれ、 接着剤テープ 1の他端 9 aは他方のリール 1 7に固定されている。  The adhesive tape cassette 100 according to the present embodiment mainly includes one reel 3, the other reel 17, and a case 99 for accommodating them. The adhesive tape 1 is wound around one of the reels 3, and the other end 9 a of the adhesive tape 1 is fixed to the other reel 17.
【0 6 2 8】 ケース 9 9には、 その一側に開口 1 1が形成されており、 この開 口 1 1から接着剤テープ 1が引き出されるようになつている。 また、 開口 1 1の 両側には接着剤テープ 1の移動を案内するガイド 1 3、 1 3が設けられている。 [0628] An opening 11 is formed in one side of the case 99, and the adhesive tape 1 is drawn out from the opening 11. Guides 13 and 13 for guiding the movement of the adhesive tape 1 are provided on both sides of the opening 11.
【0 6 2 9】 ケース 9 9はハーフケース 9 9 a、 9 9 bを嵌合して作られてお り、 一方及び他方のリール 3、 5には、 接着装置 2 7 (後述する） に設けられた スプール 1 7 (図 4 6参照） を嵌挿して各リール 3、 5に嵌合するようになって いる。 [0 6 2 9] The case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are attached to a bonding device 27 (described later). The provided spool 17 (see FIG. 46) is fitted and fitted to each reel 3,5.
【0 6 3 0】 ここで、 図 4 6を参照して、 各リール 3， 5及び、 各リール 3、 5とケース 9 9との係合について説明する。 各リール 3、 5には、 その内周側に 接着装置 2 7のスプール 1 7が嵌合する嵌合条 1 9が形成されており、 外周側に はケース 9 9の突部 7 cに回転可能に嵌合する係合溝 2 1が形成されている。 【0 6 3 1】 接着剤テープ 1には、 図 4 5 Bに示すように、 基材 9の片面に接 着剤 1 1 a、 1 1 bが幅方向に 2条並んで塗布されている。 各 2条の接着剤 1 1 a、 1 l bは互いに間隔をあけて設けられている。 [0630] Here, with reference to FIG. 46, the respective reels 3, 5 and the engagement between the respective reels 3, 5 and the case 99 will be described. Each of the reels 3 and 5 is formed on its inner peripheral side with a fitting line 19 on which the spool 17 of the bonding device 27 is fitted, and on the outer peripheral side thereof is rotated by a projection 7c of a case 99. Engagement grooves 21 are formed so as to fit as much as possible. [0630] As shown in FIG. 45B, the adhesive tape 1 has one side of the base material 9 coated with two adhesives 11a and 11b in a width direction. . The two strips of adhesive 11a, 1lb are spaced apart from each other.
【0 6 3 2】 本実施の形態では、 接着剤テープ 1は長さが約 5 0 mであり、 幅 Wは約 4 mmである。各一条の接着剤 1 1 a、 1 1ゎの幅は約1 . 2 mmである。 [0630] In the present embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 4 mm. The width of each piece of adhesive 11a, 11 1 is about 1.2 mm.
【0 6 3 3】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフタレ一ト）などを用いるが、 これらに制限するも のではない。 The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. 1), etc., but is not limited to these.
【0 6 3 4】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系、 ホットメルト系が用いられている。 かかる樹脂の代 表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があ り、 また熱硬化性樹 S旨系としてはエポキシ樹脂系、 アクリル系、 ビニルエステル 系樹脂系、 シリコーン樹脂系が用いられる。  As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic type, a vinyl ester type resin type, and a silicone as a thermosetting resin type. A resin system is used.
【0 6 3 5】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u , A s , P t , N i , C u , W, S b、 S n， はんだなどの金属 粒子やカーボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、 プラスチヅク等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 ブラスチック等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。 [0635] The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, As, Pt, Ni, Cu, W, Sb, Sn, and solder, carbon, graphite, and the like. The conductive layer may be formed by coating a polymer nucleus material such as ceramics, plastic, or the like with a coating. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressurizing, and the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit sometimes increases and the reliability is improved. In particular, when polymers are used as cores, they do not show a melting point like solder, so the softening state can be controlled widely by the connection temperature, and a connection member that can easily respond to variations in electrode thickness and flatness can be obtained. More preferred.
【0 6 3 6】 次に、 本実施の形態にかかる接着剤テ一プカセヅト 1 0 0の使用 方法について説明する。 図 4 7に示すように、 接着装置 2 7に接着剤テープカセ ヅト 1 0 0を装着する。接着装置 2 7には、カセヅト用のスプール 1 7、 1 7 (図 4 6参照） が間隔をあけて設けられており、 接着剤テープカセヅト 1 0 0の各リ —ル 3、 5にスプール 1 7、 1 7を係合する。 したがって、 接着剤テープカセッ ト 1 0 0の装着はワン夕ツチででき、 従来のようにリールに卷いた接着剤テープ 1の他端 9 aを空リ一ルに取り付ける作業等が必要ない。 Next, use of the adhesive tape cassette 100 according to the present embodiment is described. The method will be described. As shown in FIG. 47, the adhesive tape cassette 100 is attached to the bonding device 27. The bonding device 27 is provided with spools 17 and 17 (see FIG. 46) for cassettes at intervals, and the spools 17 and 17 are mounted on reels 3 and 5 of the adhesive tape cassette 100, respectively. Engage, 17 Therefore, the adhesive tape cassette 100 can be mounted with a one-touch switch, so that there is no need to attach the other end 9a of the adhesive tape 1 wound on a reel to an empty reel as in the related art.
【0 6 3 7】 次に、 接着剤テープ力セヅト 1 0 0から接着剤テープ 1を引き出 して、 接着装置 2 7のガイド 3 1、 3 1に掛け渡す。  [0637] Next, the adhesive tape 1 is pulled out from the adhesive tape force set 100, and is passed over the guides 31 and 31 of the bonding device 27.
【0 6 3 8】 そして、 接着装置 2 7のスプール 1 7を駆動して接着剤テープ 1 を繰り出し（図 4 7の矢印 E方向)、回路基板 2 1上に接着剤テープ 1を配置して、 加熱加圧へッド 1 9で接着剤テープ 1を基材 9側から圧接し、 幅方向の片側にあ る一条分の接着剤 1 l aを回路基板 2 1の一辺に圧着し、 残りの条の接着剤 1 1 bと 9を他方のリール 1 7に卷き取る。 このようにして、 回路基板 2 1の四 周に亘つて接着剤 1 1 aを圧着する。  [0 638] Then, the spool 17 of the bonding device 27 is driven to feed out the adhesive tape 1 (in the direction of the arrow E in Fig. 47), and the adhesive tape 1 is placed on the circuit board 21. Then, the adhesive tape 1 is pressed from the base material 9 side with the heating and pressing head 19, and one strip of the adhesive 1 la on one side in the width direction is pressed against one side of the circuit board 21. Wind the strip adhesive 1 1b and 9 on the other reel 17. In this way, the adhesive 11a is pressure-bonded over the entire circumference of the circuit board 21.
【 0 6 3 9】 そして、一方のリ一ル 3に卷かれた接着剤テープ 1が終了したらヽ 接着剤テープカセヅト 1 0 0を一度取り外した後、 裏返して装着して、 上述した 工程を繰り返す。 接着剤テープに接着剤が 2条以上に形成されている場合は、 幅 方向の位置を変えて順番に、 または、 間隔をおいて圧着を行うこともできる。 【0 6 4 0】 上記の圧着後 (仮接続)、回路基板 2 1の電極 3 3 aと配線回路（電 子部品） 3 7の電極 3 7 aを位置合わせして本接続する。 本接続は、 回路基板 2 1の四周に接着剤 1 1 aを圧着後、 接着剤 1 1 aに配線回路 （又は電子部品） 3 7を配置して、 必要によりクヅシヨン材として、 例えば、 ポリテトラフルォロェ チレン材 3 9を介して加熱加圧へヅド 1 9により配線回路 2 3を回路基板 2 1に 加熱加圧する（図 4参照)。これにより回路基板 2 1の電極 3 3 aと配線回路 2 3 の電極 3 7 aを接続固定する。  When the adhesive tape 1 wound on one of the reels 3 is completed, the adhesive tape cassette 100 is once removed, turned upside down and mounted, and the above-described steps are repeated. When the adhesive is formed on the adhesive tape in two or more strips, it is possible to change the position in the width direction and perform the pressure bonding sequentially or at intervals. After the above crimping (temporary connection), the electrodes 33a of the circuit board 21 and the electrodes 37a of the wiring circuit (electronic parts) 37 are aligned and permanently connected. For this connection, after bonding the adhesive 11a on the four circumferences of the circuit board 21 and placing the wiring circuit (or electronic component) 37 on the adhesive 11a, if necessary, as a cushion material, for example, The wiring circuit 23 is heated and pressurized on the circuit board 21 by the heating and pressing head 19 via the fluoroethylene material 39 (see FIG. 4). Thus, the electrode 33a of the circuit board 21 and the electrode 37a of the wiring circuit 23 are connected and fixed.
【0 6 4 1】 図 3 4に示すように、 本実施の形態による接着剤テープカセヅト 1 0 0を用いて接着をおこなった P D P 2 6の接続部分は、 本実施の形態では P D P 2 6の周囲全体に亘り接着しており、 一度に用いる接着剤 1 1の使用量が従 来に比較して格段に多くなる。 しかし、 接着剤テープ 1には幅 Wに 2条の接着剤 1 l a、 1 l bを配置しているので、 従来と同じ巻き数でも接着剤量が従来の 2 倍になるので、 カセットの交換回数は少なくて済む。 As shown in FIG. 34, the adhesive tape cassette according to the present embodiment In the present embodiment, the connection portion of the PDP 26 that has been bonded using 100 is bonded over the entire periphery of the PDP 26, and the amount of the adhesive 11 used at one time has conventionally been reduced. It is much higher than in comparison. However, since two strips of adhesive 1 la and 1 lb are placed on the adhesive tape 1 in the width W, the amount of adhesive is doubled even if the number of windings is the same as before, so the number of cassette replacements Need less.
【0 6 4 2】 また、 接着剤テープ 1をカセット 1としているから、 交換、 取扱 い、 装着が容易であり、 作業性が良い。  [0 6 4 2] Also, since adhesive tape 1 is used as cassette 1, it is easy to replace, handle and install, and workability is good.
【0 6 4 3】 ここで、 図 4 8を参照して本実施の形態にかかる接着剤テープ力 セット 1 0 0の製造方法について説明する。  Now, a method for manufacturing the adhesive tape force set 100 according to the present embodiment will be described with reference to FIG.
【0 6 4 4】 卷出機 2 5から巻き出された基材 （セパレ一夕） 2 3にコ一夕一 2 8により、 樹脂と導電性粒子 3 0が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾燥した後、 卷取機 3 1で原反を卷き取る。 コ一夕一 2 8は、 基材 9に多数 条の接着剤を塗布する。 卷き取られた接着剤テープの原反は、 仕上げ工程におい てスリツ夕 3 3により所定幅 （2条の接着剤条となる幅） に切断されてリール 3 に卷き取れられた後、 リール 3と空リール 5とをハーフケース 9 9 a , 9 9わで 挟むように嵌合して、 接着剤テープカセヅト 1 0 0を製造する。  [0 6 4 4] The base material (separation) 23 unwound from the unwinding machine 25 is used to apply the adhesive 11 mixed with the resin and the conductive particles 30 to the base material 2 3 After coating and drying in a drying oven 29, the web is wound up by a winder 31. In the process of applying the adhesive 28, a large number of adhesives are applied to the base material 9. The raw material of the wound adhesive tape is cut into a predetermined width (width of two adhesive strips) by a slit 33 in a finishing process, wound on a reel 3, and then wound on a reel. The adhesive tape cassette 100 is manufactured by fitting the 3 and the empty reel 5 so as to be sandwiched between the half cases 99a and 99.
【0 6 4 5】 接着剤テープカセヅト 1 0 0は、 除湿材とともに梱包され、 好ま しくは、 低温 （_ 5 °C〜一 1 0 °C) に管理されて出荷される。  [0645] The adhesive tape cassette 100 is packed together with a dehumidifying material, and is preferably shipped at a low temperature (_5 ° C to 110 ° C).
【0 6 4 6】 次に、 請求の範囲第 4 2〜第 4 6項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, other embodiments of the invention described in claims 42 to 46 will be described. However, in the embodiments described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 6 4 7】 図 4 9に示す第 2実施の形態は、 回路基板 2 1の一辺全体に亘っ て接着剤 1 1を一度に圧着するものであり、 接着装置 2 7には、 接着剤テープ力 セット 1 0 0から接着剤テープ 1を長く引き出して配置するガイド 1 0 1が設け られている。 この第 2実施の形態によれば、 一度に回路基板 2 1の一辺全体に接 着剤を圧着できるので、 作業効率が良い。 In the second embodiment shown in FIG. 49, the adhesive 11 is pressure-bonded at one time over the entire side of the circuit board 21. A guide 101 for pulling out the adhesive tape 1 from the tape force set 100 and arranging it is provided. According to the second embodiment, the entirety of one side of the circuit board 21 is contacted at one time. Work efficiency is good because the adhesive can be pressed.
【0 6 4 8】 図 5 0に示す第 3実施の形態では、 基材 9の片面全面に幅 Wで接 着剤 1 1を塗布し、 スリ ヅ ト 1 0 2により接着剤を 2条に分離したものである。 この第 3実施の形態の接着剤テープ 1において、 スリット 1 0 2は、 接着装置 2 7に接着剤テ一プカセット 1 0 0を装着後で接着剤テープ 1を回路基板 2 1に圧 着する直前に形成することが好ましい。 この場合、 接着装置 2 7のカセット装着 部近傍 （図 4 7に Sで示す） に切羽を取り付けて巻き出される接着剤テープ 1の 接着剤 1 1にスリヅ ト 1 0 2を形成するものであってもよいし、 図 4 8に示す接 着剤テープの製造時に仕上げ工程でスリヅトを形成したものをリール 3に巻き取 つたものであってもよいし、 塗工工程において乾燥後卷取機 3 1で卷き取る直前 にスリヅ ト 1 0 2を形成しても良い。  In the third embodiment shown in FIG. 50, the adhesive 11 is applied to the entire surface of one side of the base material 9 with a width W, and the adhesive is divided into two by a slit 102. It is separated. In the adhesive tape 1 according to the third embodiment, the slits 102 are provided immediately after the adhesive tape 1 is mounted on the circuit board 21 after the adhesive tape cassette 100 is mounted on the bonding device 27. It is preferable to form it. In this case, a slit 102 is formed on the adhesive 11 of the adhesive tape 1 to be unwound by attaching a face to the vicinity of the cassette mounting portion of the adhesive device 27 (indicated by S in FIG. 47). The adhesive tape may be wound on a reel 3 after forming a slit in the finishing process during the production of the adhesive tape shown in FIG. 48, or may be wound on a winding machine 3 after drying in the coating process. The slit 102 may be formed immediately before winding at 1.
【0 6 4 9】 この第 3実施の形態では、 従来と同様な工程により得られた基材 9上の接着剤 1 1にスリット 1 0 2を形成するだけで 2条の接着剤 1 1 a、 1 1 bを得ることができるので、 製造が容易である。  In the third embodiment, only by forming a slit 102 in the adhesive 11 on the substrate 9 obtained by the same process as in the past, two adhesives 11a It is easy to manufacture because 1b can be obtained.
【0 6 5 0】 図 5 1 A及ぴ図 5 1 Bに示す第 4実施の形態では、 基材 9には接 着剤 1 1が片面全面に塗布されており （図 5 1 A)、この接着剤テープ 1を収納し た接着剤テープカセット 1 0 0を第 1実施の形態と同様に接着装置 2 7に装着し、 接着剤テープ 1の幅 W方向における接着剤 1 1の一部 （一条分） を加熱加圧する ことにより、 その部分の凝集力を低下させて、 加熱加圧した部分の接着剤 1 l a のみを基材 9から分離して回路基板 2 1に圧着する （図 5 1 Β ) ο  In the fourth embodiment shown in FIGS. 51A and 51B, the adhesive 11 is applied to the entire surface of the base material 9 on one side (FIG. 51A). The adhesive tape cassette 100 containing the adhesive tape 1 is mounted on the adhesive device 27 in the same manner as in the first embodiment, and a part of the adhesive 11 in the width W direction of the adhesive tape 1 ( By heating and pressurizing the adhesive, the cohesive force of that portion is reduced, and only the adhesive 1 la of the heated and pressurized portion is separated from the base material 9 and pressed against the circuit board 21 (Fig. 5 1). Β) ο
【0 6 5 1】 この場合、 加熱加圧へヅド 1 9の周囲に沿って凝集力低下ライン 1 0 3 (図 5 1 A) が形成され、 加熱加圧された部分のほとんどは接着剤が軟化 流動し（ 1 0 0 0ボイズ以下が目安)、接着剤の硬化反応が開始しないか低位の状 態 （反応率 2 0 %以下が目安） とすることが好ましく、 加熱温度は使用する接着 剤系に応じて選定する。  [0655] In this case, a cohesive force reduction line 103 (Fig. 51A) is formed along the periphery of the heating / pressing head 19, and most of the heated / pressed portion is made of an adhesive. It is preferable that the adhesive softens and flows (100 or less voids are a guideline) and the curing reaction of the adhesive does not start or is in a low state (reaction rate is 20% or less as a guideline). Select according to the drug system.
【0 6 5 2】 この第 4実施の形態によれば、 接着剤 1 1は、 使用時にのみ幅 W 方向に一条分 2 5 aを軟化流動化させて基板回路に圧着することができる。 【 0 6 5 3】 次に、 請求の範囲第 4 7〜第 4 9項に記載された発明について説 明する。 According to the fourth embodiment, the adhesive 11 has a width W only when used. In the direction, 25 a of one line can be softened and fluidized, and can be pressure-bonded to the substrate circuit. Next, the invention described in claims 47 to 49 will be described.
【0 6 5 4】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に巻かれた接着材テープに関する。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
【0 6 5 5】 次に、 請求の範囲第 4 7〜第 4 9項に記載された発明の背景技術 について説明する。  [0655] Next, the background art of the invention described in claims 47 to 49 will be described.
【·0 6 5 6】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。  [· 0 6 5 6] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards are adhered and fixed to each other, and the electrodes of both are fixed. Adhesive tape is used as a method of electrical connection.
【0 6 5 7】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。  [0657] Japanese Patent Application Laid-Open No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
【0 6 5 8】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度である。  [0658] The conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound on the reel is about 50 m.
【0 6 5 9】 接着材テープを接着装置に装着する場合、 接着材テープのリ一ル (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き 出された接着材テ一プの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに卷き取っている。  [0 6 5 9] When attaching the adhesive tape to the adhesive device, attach a reel of adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device and pull out the start end of the adhesive tape. And attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel by a heating and pressing head, and the remaining base material is wound on a take-up reel. ing.
【0 6 6 0】 そして、 接着材リールの接着材テープが終了すると、 終了したリ —ルと、 基材を巻き取った卷取りリールを外し、 新たな卷取りリールと新たな接 着材リールを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付け ている。  [0660] When the adhesive tape on the adhesive reel ends, the reel that has finished and the winding reel that has wound the base material are removed, and a new winding reel and a new adhesive reel are removed. Is attached to the bonding machine, and the beginning of the adhesive tape is attached to the take-up reel.
【0 6 6 1】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路 ¾反の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。[0 6 6 1] However, with the recent increase in the size of panel screens in PDP, etc., Circuits The bonding area of the circuit has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, there is a problem that the frequency of replacement of the adhesive reel is increased, and the replacement of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved.
【0 6 6 2】 かかる問題に対して、 リールに卷き取る接着材テープの卷き数を 多くすることで、 1リール当りの接着剤量'を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると卷き崩れが生じるおそれがある。 また、 卷き数を多くするとテ一 プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロヅキングの原因になるおそれがある。 [0 662] In order to solve this problem, by increasing the number of adhesive tapes wound on the reel, the amount of adhesive per reel is increased, and the frequency of reel replacement is reduced. However, since the width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause the windings to collapse. Also, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape is increased, and the adhesive may ooze out from both widths of the tape to cause blocking.
【0 6 6 3】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0666] Further, when the number of windings of the adhesive tape is increased, the diameter of the reel also becomes large, which makes it difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus may not be used.
【0 6 6 4】 そこで、 請求の範囲第 4 7〜第 4 9項に記載された発明は、 接着 材リ一ルの交換が簡単にでき、 電子機器の生産効率の向上を図ることができる接 着材テープの提供を目的とする。  [0666] Therefore, the inventions described in claims 47 to 49 can easily replace the adhesive reel, and can improve the production efficiency of electronic devices. The purpose is to provide adhesive tape.
【0 6 6 5】 次に、 添付図面を参照しながら請求の範囲第 4 7〜第 4 9項に記 載された発明の実施の形態について説明する。  [0666] Next, embodiments of the invention described in claims 47 to 49 will be described with reference to the accompanying drawings.
【0 6 6 6】 図 5 2 A、 図 5 2 B、 図 3、 図 4、 図 2 9、 図 5を参照して請求 の範囲第 4 7〜第 4 9項に記載された発明の第 1実施の形態について説明する。 図 5 2 A及び図 5 2 Bは本実施の形態にかかる接着材テープの接続を示す図であ り、 図 5 2 Aは接着材リール同士の接続を示す斜視図であり、 図 5 2 Bは図 5 2 Aにおける接続部分を示す断面図である。  [0666] Referring to Fig. 52A, Fig. 52B, Fig. 3, Fig. 4, Fig. 29 and Fig. 5, the invention of the invention described in claims 47 to 49 will be described. One embodiment will be described. FIGS. 52A and 52B are views showing the connection of the adhesive tape according to the present embodiment, and FIG. 52A is a perspective view showing the connection between the adhesive reels. FIG. 5B is a sectional view showing a connection portion in FIG. 52A.
【0 6 6 7】 接着材テープ 1はリール 3、 3 aにそれぞれ卷かれており、 各リ —ル 3、 3 aには卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。 【0 6 6 8】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。 [0 6 6 7] The adhesive tape 1 is wound on the reels 3 and 3a, respectively, and the reels 3 and 3a have side plates disposed on both sides of the winding core 5 and the adhesive tape 1, respectively. 7 are provided. [0666] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【 0 6 6 9】 基材 9は、 支持層 9 bと、 これを両側から挟む熱溶融剤層 （ホヅ トメルト層） 9 aとを有し、熱溶融剤層 9 aを構成する熱溶融剤（ホットメルト） には、 熱可塑性樹脂であるポリエチレン、 S B S (スチレンブタジエンスチレン ブロック共重合体)、 ナイロンなどを用い、 支持層 9 bには、 O P P (延伸ポリプ ロピレン）、ポリテトラフルォロエチレン、 P E T (ポリエチレンテレフ夕レート） などのプラスチヅクゃガラス繊維、 ァラミド繊維、 カーボン繊維等の補強繊維を 用いている。  The base material 9 has a support layer 9 b and a hot-melt layer (a hot-melt layer) 9 a sandwiching the support layer 9 b from both sides. For the (hot melt), use is made of thermoplastic resin such as polyethylene, SBS (styrene butadiene styrene block copolymer), and nylon. For the support layer 9b, OPP (stretched polypropylene), polytetrafluoroethylene And reinforcing fibers such as plastic glass fiber such as PET (polyethylene terephthalate), aramide fiber, and carbon fiber.
【0 6 7 0】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱 可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性 樹脂系としてはエポキシ樹脂系、ァクリル樹脂系、シリコン樹脂系が用いられる。 【 0 6 7 1】 接着剤 1 1には、 導電粒子 1 3が分散されていても良い。 導電粒 子 1 3としては、 A n , A g , P t , N i , C u， W， S b、 S n， はんだなど の金属粒子やカーボン、 黒鉛などがあり、 これら及び/または非導電性のガラス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等によ り形成したものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してな る絶縁被覆粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の 熱溶融金属や、 プラスチヅク等の高分子核材に導電層を形成したものは、 加熱加 圧もしくは加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に 回路との接触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核と した場合、 はんだのように融点を示さないので軟ィ匕の状態を接続温度で広く制御 でき、 電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより 好ましい。  [0670] As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type. [0671] The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it has deformability by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
【0 6 7 2】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 3に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷 取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端をガイド ピン 2 2に掛けて卷取りリール 7に取り付け、 接着材テープ 1を繰り出す （図 3 中矢印 E )。そして、回路基板 2 1上に接着材テープ 1を配置して、両リール 3 a、 1 7間に配置された加熱加圧へッド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に卷 き取る。 Next, a method of using the adhesive tape according to the present embodiment will be described. I will tell. As shown in FIG. 3, the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15 and the tip of the adhesive tape 1 wound on the reel 3a is attached to the guide pins 22. The tape is attached to the take-up reel 7 and the adhesive tape 1 is fed out (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressing head 19 disposed between the reels 3 a and 17. The adhesive 1 1 is crimped to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
【0 6 7 3】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クッション材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へッド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の 電極 2 3 aとを接続する。  Next, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 6 7 4】 図 2 9に本実施の形態による接着材テープ 1を用いた P D P 2 6 の接続部分を示すように、 接着剤 1 1は P D P 2 6の周囲全体に亘り圧着してお り、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが明 らかである。 したがって、 リール 3 aに巻いた接着材テープ 1の使用量も多くな り、 リール 3 aに卷いた接着材テープ 1は比較的短時間で卷取りリール 1 7に卷 き取られて、 リール 3 aに卷かれた接着材テープ 1のエンドマーク 2 8が露出さ れる （図 5 2 A参照）。  As shown in FIG. 29, the connecting portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive 11 is pressed over the entire periphery of the PDP 26. In other words, it is clear that the amount of the adhesive 11 used at one time is significantly larger than in the past. Accordingly, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on a is exposed (see FIG. 52A).
【0 6 7 5】 図 5 2 Aに示すように、 リール 3 aの接着材テープ 1にエンドマ —ク 2 8が露出したところで、 リール 3 aを新たな接着材リール 3と交換するた め、 リール 3 aの接着材テープ（一方の接着材テープ） 1の終端部 3 0と、 新た な接着材リール 3に卷かれた接着材テープ （他方の接着材テープ） 1の始端部 3 2とを接続する。  [0 675] As shown in FIG. 52A, when the end mark 28 is exposed on the adhesive tape 1 on the reel 3a, the reel 3a is replaced with a new adhesive reel 3. The end 30 of the adhesive tape (one adhesive tape) 1 on the reel 3 a and the start end 3 2 of the adhesive tape (the other adhesive tape) 1 wound on a new adhesive reel 3 Connecting.
【0 6 7 6】 この接着材テープ 1の接続は、 図 5 2 Bに示すように、 接着材リ ール 3 aの接着材テープ 1の終端部 3 0と、 新たな接着材リ一ル 3の接着材テー プ 1の始端部 3 2とについて、 終端部 3 0の基材 9の熱溶融剤層 9 aに始端部 3 2の接着剤 1 1面を重ね合わせ、 かかる部分をテーブル 1 0 4に置く。 そして、 接着装置 1 5の加熱加圧へッド 1 9で重ね合わせ部分を加熱して、 熱溶融剤層 9 aを溶融させた後、 冷却により熱溶融剤が固化することで、 終端部 3 0と始端部 3 2とを接続する。 これにより、 使用済みのリール 3 aに卷かれた接着材テープ 1と、 新たなリール 3に卷かれた接着材テープ 1とが接続される。 [0676] As shown in Fig. 52B, the connection of the adhesive tape 1 is performed by connecting the end portion 30 of the adhesive tape 1 of the adhesive tape 3a and a new adhesive tape. 3 adhesive tape With respect to the starting end 32 of the tape 1, the adhesive 11 surface of the starting end 32 is superimposed on the hot melt layer 9 a of the base material 9 at the end 30, and such a portion is placed on the table 104. Then, the overlapping portion is heated by the heating / pressing head 19 of the bonding device 15 to melt the hot-melt layer 9a, and then the hot-melt is solidified by cooling. 0 and the start end 32 are connected. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
【0 6 7 7】 次に、 使用済みのリール 3 aと新たなリール 3を入れ替えて、 新 たなリール 3を接着装置 1 5に装着する。 したがって、 卷取りリール 1 7に接着 材テープ 1を装着する作業が必要ない。 尚、 卷取りリール 1 7では主として基材 9だけを卷き取っているので、 接着材リールの数本分を卷き取ることができるの で、 卷取りリール 1 7の交換回数を少なくすることができ、 作業効率が良い。 【0 6 7 8】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  Next, the used reel 3a is replaced with the new reel 3, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17. Since only the base material 9 is wound on the take-up reel 17, it is possible to wind up several reels of the adhesive material. Work efficiency is good. [0678] Here, a method for manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
[ 0 6 7 9 ] 卷出機 2 5から卷き出された基材 (セパレ一夕) にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、卷取機 3 1で原反を卷き取る。卷き取られた接着材テープ 1の原反は、 スリツ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 卷き芯に側 板が両側から装着されて、 除湿材とともに梱包され、 好ましくは低温 （一 5 °C〜 - 1 0 °C) に管理されて出荷される。  [0 6 7 9] Adhesive 11 mixed with resin and conductive particles 13 is applied to base material (separation overnight) unwound from unwinding machine 25 by co-existing 27 After drying in the drying oven 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core. Then, side plates are attached to the winding core from both sides, and dehumidification is performed. It is packaged together with the materials and shipped at a low temperature (15 ° C to -10 ° C).
【0 6 8 0】 次に、 請求の範囲第 4 7〜第 4 9項に記載された発明の他の実施 形態について説明するが、 以下に説明する実施の形態では上述した実施の形態と 同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  [0680] Next, another embodiment of the invention described in claims 47 to 49 will be described. However, the following embodiment is the same as the above-described embodiment. The same reference numerals are used to denote the same parts, and detailed description of those parts is omitted. Hereinafter, points different from the above-described embodiment will be mainly described.
【0 6 8 1】 図 5 3に示す第 2実施の形態では、 接着材テープ 1の基材 9にお いて、 熱溶融剤層 9 aが支持層 9 bに挟まれるようになつている。 この場合、 図 3に示すように、 接着材テープ 1同士を接続するには、 一方の接着材テープ 1の 終端部 3 0と他方の接着材テープ 1の始端部 3 2を突き合わせた位置で、 接着装 置 1 5の加熱加圧へッド 1 9で熱溶融剤層 9 aを加熱する。 加熱すると熱溶融剤 層 9 aから熱溶融剤が染み出し、 冷却により熱溶融剤が固化することで、 接着材 テープ 1同士が接続する。 このように、 熱溶融剤層 9 aが支持層 9 bに挟まれて いるので、 湿気による吸湿ゃ麈等の付着による熱溶融剤層 9 aの接着強度が低下 することを防止できる。 In the second embodiment shown in FIG. 53, in the base material 9 of the adhesive tape 1, the hot-melt agent layer 9a is sandwiched between the support layers 9b. In this case, as shown in Fig. 3, to connect the adhesive tapes 1 At the position where the end portion 30 and the start end portion 32 of the other adhesive tape 1 abut against each other, the hot-melt agent layer 9 a is heated by the heating and pressurizing head 19 of the adhesive device 15. When heated, the hot melt exudes from the hot melt layer 9a, and the hot melt solidifies by cooling, so that the adhesive tapes 1 are connected to each other. As described above, since the hot-melt agent layer 9a is sandwiched between the support layers 9b, it is possible to prevent the adhesive strength of the hot-melt agent layer 9a from being lowered due to adhesion of moisture and dust due to moisture.
【0 6 8 2】 請求の範囲第 4 7〜第 4 9項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 4 7〜第 4 9項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  [0680] The invention described in claims 47 to 49 is not limited to the above-described embodiment, but may be any of the inventions described in claims 47 to 49. Various modifications can be made without departing from the gist.
【0 6 8 3】 第 1実施の形態において、 基材 9は支持層 9 bと、 これを両側か ら熱溶融剤層 9 aで挟んだ 3層から構成されているが、 これに限定されず 4層以 上であっても良い。  In the first embodiment, the base material 9 is composed of the support layer 9b and the three layers sandwiching the support layer 9b from both sides with the hot-melt agent layer 9a, but is not limited thereto. Four or more layers may be used.
【0 6 8 4】 本実施の形態では、 接続部分の加熱圧着は、 接着装置 1 5の加熱 加圧へッド 1 9を用いたが、 加熱加圧へッド 1 9の代わりに別途加熱器を用い、 接続部分を加熱して、 接着材テープ 1同士の接続を行うようにしても良い。 In the present embodiment, the heating and pressurizing head 19 of the bonding device 15 is used for the heat press bonding of the connection portion. However, instead of the heating and pressurizing head 19, separate heating is performed. The connection between the adhesive tapes 1 may be performed by heating the connection portion using a container.
【0 6 8 5】 次に、 請求の範囲第 5 0〜第 5 1項に記載された発明について説 明する。 Next, the invention described in claims 50 to 51 will be described.
【0 6 8 6】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関する。 ま た、 リードフレームの固定用支持 ¾反やリードフレームのダイ、 半導体素子搭載 用支持基板に半導体素子 （チヅプ） を接着 '固定する半導体装置において使用さ れる接着材テープに関し、 特にリール状に巻かれた接着材テープの接続方法に関 する。  [0686] The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards, and for electrically connecting both electrodes. In addition, adhesive tapes used in semiconductor devices for fixing semiconductor elements (chips) to a support for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and in particular, reel-shaped. It relates to the connection method of the adhesive tape.
【0 6 8 7】 次に、 請求の範囲第 5 0〜第 5 1項に記載された発明の背景技術 について説明する。  [0687] Next, the background art of the invention described in claims 50 to 51 will be described.
【0 6 8 8】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。 [0 6 8 8] Generally, liquid crystal panels, PDPs (plasma display panels), E Adhesive tape is used as a method of bonding and fixing electronic components such as L (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards, and electrically connecting both electrodes.
【0 6 8 9】 また、 接着材テープは、 リードフレームのリード固定テープ、 L O Cテープ、 ダイボンドテープ、 マイクロ B GA · C S P等の接着フィルム等に 用いられ、 半導体装置全体の生産性、 信頼性を向上させるために使用される。 [0688] The adhesive tape is used for the lead fixing tape of the lead frame, the LOC tape, the die bonding tape, the adhesive film such as the micro BGA / CSP, etc., to improve the productivity and reliability of the entire semiconductor device. Used to improve.
【0 6 9 0】 特閧 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に卷き取ったものが開示されている。 [0006] Japanese Patent Application Publication No. 2000-2005 discloses a tape obtained by winding an adhesive tape having a base material coated with an adhesive material in a reel shape. I have.
【0 6 9 1】 この種の従来の接着材テープは、 接着剤が基材に固着しないよう に、 あるいは剥がし易くするために、 基材の両面にはシリコーン処理が施されて いる。  [069] In this type of conventional adhesive tape, both sides of the base material are subjected to a silicone treatment so that the adhesive does not adhere to the base material or is easily peeled off.
【0 6 9 2】 接着材テープを接着装置に装着する場合、 接着材テープのリール (以下、 単に「接着材リールという」） を接着装置に取り付け、接着材テープの始 端部を引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き 出された接着材テープの基材側から加熱加圧へッドで接着剤を回路基板等に圧着 し、 残った基材を卷取りリールに巻き取っている。  [0 6 9 2] When attaching the adhesive tape to the adhesive device, attach a reel of the adhesive tape (hereinafter simply referred to as “adhesive reel”) to the adhesive device, pull out the start end of the adhesive tape, Attach to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive material reel by a heating and pressing head, and the remaining base material is wound on a take-up reel.
【0 6 9 3】 そして、 接着材リ一ルの接着材テープが終了すると、 終了したリ ールと、 基材を卷き取った卷取りリールを外し、 新たな接着材リールを接着装置 に装着し、 接着材テープの始端を卷取りリールに取り付けている。  [0 6 9 3] When the adhesive tape of the adhesive reel is completed, the completed reel and the take-up reel on which the base material has been wound are removed, and a new adhesive reel is attached to the bonding apparatus. The adhesive tape is attached and the beginning of the adhesive tape is attached to the take-up reel.
【0 6 9 4】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある 【0 6 9 5】 かかる問題に対して、 リールに卷き取る接着材テープの巻き数を 多くすることで、 1リール当りの接着剤量を增やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 卷き 数を多くすると巻き崩れが生じるおそれがある。 また、 卷き数を多くするとテー プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してブロッキングの原因になるおそれがある。 However, with the recent increase in the size of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, there is a problem that in an electronic device manufacturing plant, the frequency of changing the adhesive reel is increased, and it is troublesome to replace the adhesive reel, so that it is not possible to improve the production efficiency of the electronic device. To solve this problem, the number of adhesive tapes wound on the reels is increased to increase the amount of adhesive per reel and to reduce the frequency of reel replacement. However, since the tape width of the adhesive tape is as narrow as 1 to 3 mm, a large number of windings may cause winding collapse. In addition, when the number of windings is large, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape and cause blocking.
【0 6 9 6】 更に、 接着材テープの卷き数を増やすと、 リールの径寸法も大き くなり、 既存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそ れがある。  [0696] Further, when the number of windings of the adhesive tape is increased, the diameter of the reel also increases, which makes it difficult to mount the tape on an existing bonding apparatus, and may render the existing bonding apparatus unusable.
【0 6 9 7】 そこで、 請求の範囲第 5 0〜第 5 1項に記載された発明は、 接着 材リールの交換が簡単にでき、 電子機器の生産効率の  [0696] Therefore, the invention described in claims 50 to 51 can easily replace the adhesive material reel and reduce the production efficiency of electronic equipment.
向上を図ることができる接着材テープの接続方法の提供を目的とする。 An object of the present invention is to provide a method of connecting an adhesive tape that can be improved.
【0 6 9 8】 次に、 添付図面を参照しながら請求の範囲第 5 0〜第 5 1項に記 載された発明の実施の形態について説明する。 まず図5 4 〜5 4 0、 図 5 5、 図 5 6、 図 4、 図 2 9を参照して請求の範囲第 5 0〜第 5 1項に記載された発明 の第 1実施の形態について説明する。 図 5 4 A〜5 4 Cは、 図 5 5における接続 部分の接続工程を示す断面図であり、 図 5 4 Aは放電前の接着材テープの状態を 示し、 図 5 4 Bは放電後の接着材テープの状態を示し、 図 5 4 Cは接続部分の加 熱圧着を示す図である。 図 5 5は接着材テープの接続方法において、 接着材リ一 ル同士の接続を示す斜視図であり、 図 5 6は接着装置における接着剤の圧着工程 を示す概略図である。  [0699] Next, embodiments of the invention described in claims 50 to 51 will be described with reference to the accompanying drawings. First, referring to FIGS. 54 to 540, FIGS. 55, 56, 4, and 29, the first embodiment of the invention described in claims 50 to 51 will be described. explain. FIGS. 54A to 54C are cross-sectional views showing the connection process of the connection portion in FIG. 55, FIG. 54A shows the state of the adhesive tape before discharge, and FIG. 54B shows the state after discharge. FIG. 54C shows the state of the adhesive tape, and FIG. 54C is a view showing the thermocompression bonding of the connection portion. FIG. 55 is a perspective view showing a connection between the adhesive reels in the method of connecting the adhesive tape, and FIG. 56 is a schematic view showing a pressure bonding step of the adhesive in the bonding apparatus.
【0 6 9 9】 接着材テープ 1はリール 3、 3 aにそれぞれ巻かれており、 各リ ール 3、 3 aには巻き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設け られている。  [0 6 9 9] Adhesive tape 1 is wound on reels 3 and 3a, respectively, and reels 3 and 3a have side plates 7 arranged on both width sides of core 5 and adhesive tape 1, respectively. Are provided.
【0 7 0 0】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0700] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 7 0 1】 基材 9は、強度及び接着剤 1 1の剥離性の面から 0 P P (延伸ポリ プロピレン）、 ポリテトラフルォロエチレン、 P E T (ポリエチレンテレフ夕レー ト）などを用いており、 離型剤 9 aで表面処理が施されている。 離型剤としては、 ォレフィン系離型剤、エチレングリコ一ルモンタン酸エステル、カルナゥバロウ、 石油系ワックス等の低融点ワックス、 低分子量フッ素樹脂、 シリコーン系又はフ ヅ素系の界面活性剤、 オイル、 ワックス、 レジン、 ポリエステル変性シリコーン 樹脂などが用いられ、 特にシリコーン樹脂が一般的である。 [0710] The base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive 11. G), etc., and surface-treated with release agent 9a. Examples of the release agent include an olefin release agent, a low melting point wax such as ethylene glycol montanate, carnauba wax, petroleum wax, a low molecular weight fluororesin, a silicone-based or fluorine-based surfactant, an oil, and a wax. , Resins, polyester-modified silicone resins and the like are used, and silicone resins are particularly common.
【0 7 0 2】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱 可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性 樹脂系としてはエポキシ樹脂系、 アクリル樹脂系、 シリコーン樹脂系が用いられ る。  [0720] As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acrylic resin type and a silicone resin type as a thermosetting resin type.
【0 7 0 3】 接着剤 1 1には、 導電粒子 1 3が分散されていても良い。 導電粒 子 1 3としては、 Au , A g , P t , N i， C u , W， S b、 S n , はんだなど の金属粒子や力一ボン、 黒鉛などがあり、 これら及び/または非導電性のガラス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等によ り形成したものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してな る絶縁被覆粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の 熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加 圧もしくは加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に 回路との接触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核と した場合、 はんだのように融点を示さないので軟ィ匕の状態を接続温度で広く制御 でき、 電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより 好ましい。  [0770] The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved. In particular, when a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
【0 7 0 4】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 5 6に示すように、 接着装置 1 5に接着材テープ 1のリール 3 aと、 卷取りリール 1 7とを装着し、 リール 3 aに卷いた接着材テープ 1の先端をガイ ドビン 2 2に掛けて卷取りリール 1 7に取り付け、接着材テープ 1を繰り出す（図 5 6中矢印 E )。そして、 回路基板 2 1上に接着材テープ 1を配置して、両リール 3、 1 7間に配置された加熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧 接し、 接着剤 1 1を回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に卷き取る。 [0714] Next, a method for using the adhesive tape according to the present embodiment will be described. As shown in Fig. 56, the reel 3a of the adhesive tape 1 and the take-up reel 17 are mounted on the bonding device 15 and the tip of the adhesive tape 1 wound on the reel 3a is guided into the guide bin 22. And attach it to the take-up reel 17 and pay out the adhesive tape 1 (Fig. 5 6 Medium arrow E). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 disposed between the reels 3 and 17, The adhesive 1 1 is pressed on the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17.
【0 7 0 5】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クッション材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へッド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 l aと配線回路 2 3の 電極 2 3 aとを接続する。  Next, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 7 0 6】 図 2 9は、 本実施の形態による接着材テ一プ 1を用いた P D P 2 6の接続部分を示しており、 接着剤 1 1は P D P 2 6の周囲全体に亘り圧着して おり、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが 明らかである。 したがって、 リール 3 aに卷いた接着材テープ 1の使用量も多く なり、 リール 3 aに巻いた接着材テープ 1は比較的短時間で卷取りリ一ル 1 7に 巻き取られて、 リール 3 aに卷かれた接着材テープ 1のエンドマーク 2 8が露出 される （図 5 5参照)。  [0770] FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is crimped over the entire periphery of the PDP 26. Thus, it is clear that the amount of the adhesive 11 used at one time is significantly larger than in the past. Therefore, the amount of the adhesive tape 1 wound on the reel 3a is also increased, and the adhesive tape 1 wound on the reel 3a is wound up on the winding reel 17 in a relatively short time. The end mark 28 of the adhesive tape 1 wound on a is exposed (see FIG. 55).
【0 7 0 7】 図 5 5に示すように、 リール 3 aの接着材テープ 1に、 リール 3 aを新たな接着材リール 3と交換するため、 リール 3 aの接着材テープ （一方の 接着材テープ） 1の終端部 3 0と、 新たな接着材リール 3に卷かれた接着材テー プ （他方の接着材テープ） 1の始端部 3 2とを接続する。  [0710] As shown in FIG. 55, the adhesive tape 1 on the reel 3a is replaced with the adhesive tape 1 on the reel 3a in order to replace the reel 3a with a new adhesive reel 3. The end 30 of the material tape 1 is connected to the beginning 32 of the adhesive tape 1 (the other adhesive tape) wound on a new adhesive reel 3.
【0 7 0 8】 この接着材テープ 1の接続は、 図 5 4 Bに示すように、 使用済み リール 3 aの接着材テープ 1の終端部 3 0を放電機 1 0 5の照射位置に置く。 そ して、 基材 9の表面に放電を行うことで離型剤 9 aを除去する。  [0710] As shown in FIG. 54B, this adhesive tape 1 is connected by placing the end 30 of the adhesive tape 1 on the used reel 3a at the irradiation position of the electric discharger 105. . Then, the release agent 9 a is removed by discharging the surface of the base material 9.
【0 7 0 9】 そして、 離型剤 9 aを除去した基材 9面に、 他方の接着材テープ 1の始端部 3 2の接着剤 1 1面を重ね合わせる（図 5 4 C )。両者の重ね合わせ部 分を、 テーブルに置き、 接着装置 1 5の加熱加圧へッド 1 9で加熱加圧して接着 する。 これにより、 使用済みのリール 3 aに卷かれた接着材テ一プ 1と、 新たな リール 3に卷かれた接着材テープ 1とが接続される。 [0710] Then, the adhesive 11 surface of the starting end 32 of the other adhesive tape 1 is superimposed on the surface of the base material 9 from which the release agent 9a has been removed (Fig. 54C). The superposed part of both is placed on the table and bonded by heating and pressing with the heating and pressing head 19 of the bonding device 15 I do. Thereby, the adhesive tape 1 wound on the used reel 3a and the adhesive tape 1 wound on the new reel 3 are connected.
【 0 7 1 0】 次に、 使用済みのリール 3 aと新たなリール 3を入れ替えて、 新 たなリール 3を接着装置 1 5に装着する。 したがって、 卷取りリール 1 7に接着 材テープ 1を装着する作業が必要ない。  [0710] Next, the used reel 3a and the new reel 3 are exchanged, and the new reel 3 is mounted on the bonding device 15. Therefore, there is no need to attach the adhesive tape 1 to the take-up reel 17.
【 0 7 1 1】 この実施の形態では、 加熱加圧へヅド 1 9を利用しているので、 接着材テープ 1同士の接続器具を別途用いることなく、 接着材テープ 1が卷かれ たリール 3、 3 aの交換ができる。 尚、 卷取りリール 1 7では基材 9だけを卷き 取っているので、 接着材リールの数本分を卷き取ることができるので、 卷取りリ ール 1 7の交換回数を少なくすることができ、 作業効率が良い。  [0711] In this embodiment, since the heating and pressing head 19 is used, the reel on which the adhesive tape 1 is wound without using a connecting device for the adhesive tapes 1 separately. 3, 3a can be exchanged. Since only the base material 9 is taken up on the take-up reel 17, several adhesive reels can be taken up, so the number of times the take-up reel 17 needs to be replaced is reduced. Work efficiency is good.
【 0 7 1 2】 請求の範囲第 5 0〜第 5 1項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 5 0〜第 5 1項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  [0712] The invention described in claims 50 to 51 is not limited to the above-described embodiment, but may be any of the inventions described in claims 50 to 51. Various modifications can be made without departing from the gist.
【 0 7 1 3】 例えば、 上述した実施の形態において、 卷取りの終了した一方の 接着材テープ 1の基材 9の離型剤 9 aを除去して、 かかる部分に新規接着材テ一 プ 1の接着剤 1 1面を重ね合わせ、 加熱加圧へヅ ド 1 9で加熱加圧して接着し、 両者を接続したが、 新規接着材テープ 1の基材 9の離型剤 9 aを除去して、 かか る部分に巻取りの終了した一方の接着材テープ 1の接着剤 1 1面を重ね合わせて 両者を接続しても良い。  [0713] For example, in the above-described embodiment, the release agent 9a of the base material 9 of one of the adhesive tapes 1 whose winding has been completed is removed, and a new adhesive tape is applied to such a portion. 1 Adhesive 1 Laminate 1 surface, apply heat and pressure with heating and pressurizing 19 and bond, connect both, but remove release agent 9a from substrate 9 of new adhesive tape 1 Then, the adhesive 11 of one of the adhesive tapes 1 whose winding has been completed may be overlapped on such a portion, and the two may be connected.
【 0 7 1 4】 離型剤 9 aを除去する方法として、 プラズマ放電の他に、 紫外線 照射又はレーザ照射による方法でも良く、 紫外線照射の場合には、 例えば水銀ラ ンプを光源として使用し、 水銀ランプから一定時間紫外線を照射することにより 行う。 さらに、 レーザ照射の場合には、 レーザ発振器により照射されたレーザ光 により離型剤 9 aが分解飛散して離型剤 9 aが除去される。  [0714] As a method for removing the release agent 9a, besides plasma discharge, a method using ultraviolet irradiation or laser irradiation may be used. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source. This is performed by irradiating ultraviolet rays from a mercury lamp for a certain period of time. Further, in the case of laser irradiation, the release agent 9a is decomposed and scattered by the laser light irradiated by the laser oscillator, and the release agent 9a is removed.
【 0 7 1 5】 上記では、 電子部品と回路基板、 回路基板同士を接着固定するす る場合について説明したが、 リードフレームの固定用支持基板やリードフレーム のダイ、 半導体素子搭載用支持基板に半導体素子 （チップ） を接着 ·固定する半 導体装置用の接着材テープについても同様に行うことができる。 [0715] In the above, the case where the electronic component and the circuit board and the circuit boards are bonded and fixed has been described. The same can be applied to an adhesive tape for a semiconductor device for bonding and fixing a semiconductor element (chip) to a die or a support substrate for mounting a semiconductor element.
【◦ 7 1 6】 次に、 請求の範囲第 5 2〜第 5 8項に記載された発明について説 明する。  [◦716] Next, the invention described in claims 52 to 58 will be described.
【0 7 1 7】 これらの発明は、 電子部品と回路 ¾¾、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関する。 ま た、 リードフレームの固定用支持 ¾反やリードフレームのダイ、 半導体素子搭載 用支持基板に半導体素子 （チップ） を接着'固定する半導体装置において使用さ れる接着材テ一プに関し、特にリール状に巻かれた接着材テープリールに関する。 [0717] The present invention relates to an adhesive tape for bonding and fixing an electronic component to a circuit board or a circuit board and electrically connecting both electrodes. In addition, the present invention relates to an adhesive tape used in a semiconductor device for fixing a semiconductor element (chip) to a support for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element, and particularly to a reel-shaped. The present invention relates to an adhesive tape reel wound around.
【0 7 1 8】 次に、 請求の範囲第 5 2〜第 5 8項に記載された発明の背景技術 について説明する。 Next, the background art of the invention described in claims 52 to 58 will be described.
【0 7 1 9】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テ一プが用いられている。  [0 7 1 9] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method of making the connection.
【 0 7 2 0】 また、 接着材テープは、 リ一ドフレームのリ―ド固定テープ、 L O Cテープ、 ダイボンドテープ等に用いられ、 例えば、 リード固定テープは、 リ —ドフレームのリードピンを固定してリードフレーム自体又は半導体装置全体の 生産性、 信頼性を向上させるために使用される。  [0720] The adhesive tape is used for a lead frame lead fixing tape, a LOC tape, a die bond tape, and the like. For example, a lead fixing tape is used to fix lead pins of a lead frame. It is used to improve the productivity and reliability of the lead frame itself or the entire semiconductor device.
【0 7 2 1】 電子機器の小型 ·軽量化が進むとともに、 半導体装置は、 その外 部端子が半導体装置 （パッケージ） 下部にエリアアレイ状配置されたマイクロ B G A (ボールグリッドアレイ） や C S P (チップサイズパッケージ) と呼ばれる 小型のパヅケージの開発が進められ、 これらのパッケージは、 1層または多層配 線構造を有するガラスエポキシ基板やポリイミド基板などの半導体素子搭載用支 持基板の上に接着剤を介して半導体素子 （チップ） を搭載し、 半導体素子側の端 子と基板の配線板側端子とがワイヤボンドないしはフリヅプチヅプ方式で接続さ れ、 接続部とチップ上面部ないしは端面部とがエポキシ系封止材ないしはェポキ シ系液状封止材で封止され、 配線基板裏面にはんだボールなどの金属端子がェリ ァアレイ状に配置されている構造が採用されている。 また、 Q F N (Quad i!at Non-leaded Package) や S O N (Small Outline Non-leaded Package)などにも接 着材テープが用いられている。 そして、 これらのパッケージの複数個が電子機器 の基板にはんだリフロー方式で高密度で面付け一括実装する方式が採用されてい る。 さらに、 リードフレームのダイと半導体素子 （チヅプ） を接着剤を介して搭 載し、 半導体素子側の端子とリードフレーム端子とがワイヤボンドで接続され、 接続部とチップ上面部ないしは端面部とがエポキシ系封止材ないしはエポキシ系 液状封止材で封止されている。 このような半導体装置の接着剤にも接着材テープ が用いられている。 [072 1 1] As electronic devices have become smaller and lighter, semiconductor devices have micro BGAs (ball grid arrays) or CSPs (chips) whose external terminals are arranged in an area array below the semiconductor device (package). Small packages called size packages) are being developed, and these packages are mounted on a support substrate for mounting semiconductor elements, such as a glass epoxy substrate or polyimide substrate, having a single-layer or multilayer wiring structure, with an adhesive. A semiconductor element (chip) is mounted on the board, and the terminal on the semiconductor element side and the terminal on the wiring board of the board are connected by wire bonding or flip-chip method. The connection part and the top surface or the end surface of the chip are sealed with an epoxy-based sealing material or epoxy-based liquid sealing material, and metal terminals such as solder balls are arranged on the back surface of the wiring board in an array. Is adopted. Adhesive tapes are also used for QFN (Quad i! At Non-leaded Package) and SON (Small Outline Non-leaded Package). Then, a method is adopted in which a plurality of these packages are mounted on the board of an electronic device at high density by a solder reflow method and packaged at a time. Furthermore, the die of the lead frame and the semiconductor element (chip) are mounted via an adhesive, and the terminal on the semiconductor element side and the lead frame terminal are connected by wire bonding, and the connection portion and the upper surface or the end surface of the chip are connected. Sealed with epoxy-based sealing material or epoxy-based liquid sealing material. An adhesive tape is also used as an adhesive for such a semiconductor device.
【0 7 2 2】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 電極同士を電気的に接 続する方法として に接着材が塗布された接着材テープをリール状に巻き取つ たものが開示されている。  [0722] Japanese Patent Application Laid-Open No. 2000-2005 discloses a method of electrically connecting electrodes to each other by winding an adhesive tape coated with an adhesive in a reel shape. What was taken is disclosed.
【0 7 2 3】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ 一ルに卷き取るテープの長さは 5 0 m程度である。  [0723] The conventional adhesive tape of this type has a width of about 1 to 3 mm, and the length of the tape wound up on the reel is about 50 m.
【0 7 2 4】 接着材テープを接着装置に装着する場合、 接着材テープをリール に卷いた接着材テープリールを接着装置に取り付け、 接着材テープの始端部を引 き出して、 卷取りリールに取り付ける。 そして、 接着材テ一プリ一ルから卷き出 された接着材テープの基材側から加熱加圧へッドで接着剤を回路基板等に圧着し、 残った基材を卷取りリールに卷き取っている。  [0 7 2 4] When the adhesive tape is mounted on the bonding apparatus, the adhesive tape reel on which the adhesive tape is wound around the reel is mounted on the bonding apparatus, the starting end of the adhesive tape is pulled out, and the winding reel is taken up. Attach to Then, the adhesive is pressed against a circuit board or the like with a heating and pressing head from the base material side of the adhesive tape unwound from the adhesive tape, and the remaining base material is wound on a take-up reel. I'm scratching.
【0 7 2 5】 そして、一方の接着材テープリールの接着材テープが終了すると、 終了したリールと、 基材を卷き取った卷取りリールを外し、 新たな巻取りリール と新たな接着材テープリールを接着装置に装着し、 接着材テープの始端を卷取り リールに取り付けている。  [0 7 2 5] When the adhesive tape of one adhesive tape reel is completed, the completed reel and the take-up reel having taken up the base material are removed, and a new take-up reel and a new adhesive material are removed. The tape reel is mounted on the bonding machine, and the beginning of the adhesive tape is mounted on the take-up reel.
【0 7 2 6】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路 ¾反の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材テープリールの交換頻度が多くなり、 接着材テ —プリールの交換に手間がかかるため電子機器の生産効率の向上が図れないとい う問題がある。 [0 7 2 6] However, with the recent increase in the size of panel screens in PDP, etc., Circuits The bonding area of the circuit has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, the frequency of exchanging the adhesive tape reel increases, and it takes time and effort to exchange the adhesive tape, so that there is a problem that the production efficiency of the electronic device cannot be improved.
【0 7 2 7】 かかる問題に対して、 リールに巻き取る接着材テープの卷き数を 多くすることで、 1リ一ル当りの接着剤量を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着材テープのテープ幅が 1〜3 mmと狭いため、 巻き 数を多くすると巻き崩れが生じるおそれがある。 また、 巻き数を多くするとテー プ状に巻いた接着材テープに作用する圧力が高くなり接着剤がテープの両幅から 染み出してプロッキングの原因になるおそれや、 リールの径寸法も大きくなり既 存の接着装置に装着し難く、 既存の接着装置が使用できなくなるおそれがある。 【0 7 2 8】 さらに、 接着材テープリールは接着材テープが直接外気にさらさ れると、 麈ゃ湿気による品質低下を招くおそれがある。  [0 7 2 7] To solve this problem, by increasing the number of adhesive tapes wound on the reel, the amount of adhesive per reel is increased, and the frequency of replacing the reel is reduced. However, the width of the adhesive tape is as narrow as 1 to 3 mm. In addition, when the number of windings is increased, the pressure acting on the adhesive tape wound in a tape shape increases, and the adhesive may ooze out from both widths of the tape to cause blocking, and the diameter of the reel increases. It is difficult to attach to existing bonding equipment, and the existing bonding equipment may not be used. [0722] Furthermore, if the adhesive tape is directly exposed to the outside air, the adhesive tape reel may cause quality deterioration due to dust and moisture.
【0 7 2 9】 そこで、 請求の範囲第 5 2〜第 5 8項に記載された発明は、 接着 材テープリ一ルの交換が簡単にでき、 電子機器の生産効率の向上及び接着材テ一 プの品質維持を図ることができる接着材テープリールの提供を目的とする。 【0 7 3 0】 次に、 添付図面を参照しながら電極接続用の接着材テープを例と して請求の範囲第 5 2〜第 5 8項に記載された発明の実施の形態について説明す るが、 半導体素子接続用の接着材テープでも同様である。 まず図 5 7 A〜図 5 7 C、 図 3、 図 4、 図 2 9、 図 5 8を参照して請求の範囲第 5 2〜第 5 8項に記載 された発明の第 1実施の形態について説明する。 図 5 7 A〜図 5 7 Cは第 1実施 の形態にかかる接着材テープリールを示す図であり、 図 5 7 Aは接着材テ一プリ —ルを示す斜視図であり、 図 5 7 Bは図 5 7 Aにおける正面図であり、 図 5 7 C は図 5 7 Aにおけるカバー部材の正面図であり、 図 5 8は接着材テープの製造方 法を示す工程図である。 【0 7 3 1】 本実施の形態にかかる接着材テープリール Aは、 複数の接着材テ ープ 1の巻き部 （以下、 巻き部） 2、 2 aを備えており、 卷き部 2、 2 aには接 着材テープ 1が卷かれたリール 3、 3 aを備えている。 各リール 3、 3 aには卷 き芯 5と接着材テープ 1の両幅側に配置した側板 7、 7 a、 7 bとが設けられて いる。 図 3に示すように接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布さ れた接着剤 1 1とから構成されている。 未使用の卷き部 2 aには、 リール 3 aに 巻かれた接着材テープ 1の周囲を覆うカバー部材 8がリール 3 aに着脱自在に設 けられている。 Therefore, the invention described in claims 52 to 58 can easily replace the adhesive tape reel, improve the production efficiency of electronic equipment, and improve the adhesive tape. It is an object of the present invention to provide an adhesive tape reel capable of maintaining the quality of a tape. Next, embodiments of the invention described in claims 52 to 58 will be described with reference to the accompanying drawings, taking an adhesive tape for electrode connection as an example. However, the same applies to an adhesive tape for connecting a semiconductor element. First, the first embodiment of the invention described in claims 52 to 58 with reference to FIGS. 57A to 57C, FIGS. 3, 4, 29, and 58 Will be described. FIGS. 57A to 57C are views showing an adhesive tape reel according to the first embodiment, FIG. 57A is a perspective view showing an adhesive tape reel, and FIG. FIG. 57A is a front view of FIG. 57A, FIG. 57C is a front view of the cover member of FIG. 57A, and FIG. 58 is a process diagram showing a method of manufacturing an adhesive tape. [0731] The adhesive tape reel A according to the present embodiment includes winding portions (hereinafter, winding portions) 2, 2a of a plurality of adhesive tapes 1, and winding portions 2, 2a. 2a is provided with reels 3 and 3a on which an adhesive tape 1 is wound. Each reel 3, 3a is provided with a winding core 5 and side plates 7, 7a, 7b arranged on both width sides of the adhesive tape 1. As shown in FIG. 3, the adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9. A cover member 8 covering the periphery of the adhesive tape 1 wound on the reel 3a is detachably provided on the reel 3a on the unused winding portion 2a.
【0 7 3 2】 また、 卷き部 2、 2 aの内側の側板 7 aには、 乾燥剤 1 0の収納 部 (収納空間） 1 2が設けられており、 収納部 1 2内にシリ力ゲル等の乾燥剤 1 0 を収納することで、 未使用の卷き部 2 a内の湿気を内部から除去している。  [0 732] Further, a storage portion (storage space) 12 for the desiccant 10 is provided in the side plate 7a inside the winding portions 2 and 2a. By storing a desiccant 10 such as a force gel, the moisture in the unused winding portion 2a is removed from the inside.
【0 7 3 3】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコン処理し た P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するもの ではない。  The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Evening rate) is used, but is not limited to these.
【0 7 3 4】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱 可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬ィ匕性 樹脂系として、エポキシ樹脂系、ァクリル樹脂系、シリコン樹脂系が用いられる。 [0734] As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
【0 7 3 5】 接着剤 1 1には、 導電粒子 1 3が分散されていても良い。 導電粒 子 1 3としては、 Au , A g , P t , N i， C u , W， S b、 S n , はんだなど の金属粒子や力一ボン、 黒鉛などがあり、 これら及び/または非導電性のガラス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等によ り形成したものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してな る絶縁被覆粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の 熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加 圧もしくは加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に 回路との接触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核と した場合、 はんだのように融点を示さないので軟ィ匕の状態を接続温度で広く制御 でき、 電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより 好ましい。 [0735] The conductive particles 13 may be dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer nucleus material such as conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. Heat-melted metal such as solder or polymer nucleus material such as plastic with a conductive layer formed is heated It is preferable because it has deformability by pressure or pressurization, reduces the distance between electrodes after connection, increases the contact area with a circuit at the time of connection, and improves reliability. In particular, when a polymer is used as a core, since a melting point is not exhibited unlike solder, the softened state can be controlled widely by the connection temperature, and a connection member which can easily cope with variations in electrode thickness and flatness can be obtained. More preferred.
【0 7 3 6】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 3に示すように、 接着装置 1 5に接着材テープリール Aと、 卷取りリ —ル 1 7とを装着し、 一方の接着材テープ 1の台端部をガイドビン 2 2に挂トけて 卷取りリール 1 7に取り付け、接着材テープ 1を繰り出す（図 3中矢印 E )。そし て、 回路基板 2 1上に接着材テープ 1を配置して、 両リール 3、 1 7間に配置さ れた加熱加圧へヅド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を 回路基板 2 1に圧着する。 その後、 基材 9を卷取りリール 1 7に卷き取る。 【0 7 3 7】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クヅシヨン材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へヅド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の 電極 2 3 aとを接続する。  Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 3, the adhesive tape reel A and the take-up reel 17 are attached to the adhesive device 15, and the base end of one adhesive tape 1 is hung on the guide bin 22. Attach it to the take-up reel 17 and pay out the adhesive tape 1 (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is pressed from the base material 9 side by the heating / pressing head 19 placed between the reels 3 and 17. Then, the adhesive 1 1 is pressed to the circuit board 21. Thereafter, the base material 9 is wound on a take-up reel 17. Next, as shown in FIG. 4, the wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and the polytetrafluoroethylene material 2 is used as the cushioning material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thus, the electrode 21 a of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 7 3 8】 図 2 9に本実施の形態による接着材テープ 1を用いた P D P 2 6 の接続部分を示すように、 接着剤 1 1は P D P 2 6の周囲全体に亘り圧着してお り、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが明 らかである。 したがって、 接着材テープ 1の使用量も多くなり、 リール 3、 3 a に卷いた接着材テープ 1は比較的短時間で卷取りリール 1 7に卷き取られる。 【0 7 3 9】 一方の卷き部 2の接着材テープ 1にェンドマ一クが露出したとこ ろで、 新たな卷き部 2 aの接着材テープ 1と交換する。 本実施の形態では、 未使 用の卷き部 2 aには、 カバ一部材 8が設けられており、 このカバー部材 8を取り 外した後、 接着材テープ 1を繰り出して卷取りリール 1 7に取り付ける。 9694 [0736] As shown in FIG. 29, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive 11 is pressed over the entire periphery of the PDP 26. In other words, it is clear that the amount of the adhesive 11 used at one time is significantly larger than in the past. Therefore, the amount of the adhesive tape 1 used increases, and the adhesive tape 1 wound on the reels 3 and 3a is wound on the take-up reel 17 in a relatively short time. [0 7 3 9] When the end mark is exposed on the adhesive tape 1 of the one winding part 2, replace it with the adhesive tape 1 of the new winding part 2a. In this embodiment, the unused winding portion 2a is provided with a cover member 8, and after removing the cover member 8, the adhesive tape 1 is fed out to take up the winding reel 17. Attach to 9694
【0 7 4 0】 このように、 一方の卷き部 2の巻き出しが終了すると、 他方の卷 き部 2 aの接着材テープ 1を卷取りリ一ル 1 7に取り付けて、 接着材テープ 1の 交換を行うので、 接着装置 1 5への新たな接着材テープリールの装着が不要であ る。 従って、 新たな接着材テープリールの交換作業が少なくて済み、 電子機器の 生産効率が高まる。 ' [0740] As described above, when the unwinding of one of the winding portions 2 is completed, the adhesive tape 1 of the other winding portion 2a is attached to the winding reel 17 and the adhesive tape is attached. Since replacement of 1 is performed, it is not necessary to attach a new adhesive tape reel to the bonding device 15. Therefore, the replacement work of a new adhesive tape reel is reduced, and the production efficiency of electronic equipment is improved. '
【0 7 4 1】 また、 未使用の卷き部 2 aには、 カバ一部材 8が設けられている ので、 接着材テープ 1が直接外気にさらされることがなく、 接着材テープ 1が麈 や湿気により接着力の低下などが生じ難くなる。 従って、 複数の巻き部 2、 2 a が設けられている場合でも、未使用の巻き部 2 aにカバ一部材 8を設けることで、 接着材テープ 1の品質の低下を防止できる。  [0 7 4 1] Also, since the cover member 8 is provided on the unused winding portion 2a, the adhesive tape 1 is not directly exposed to the outside air, and the adhesive tape 1 is dusty. It is difficult for the adhesive strength to be reduced due to moisture or moisture. Therefore, even when a plurality of winding portions 2 and 2a are provided, deterioration of the quality of the adhesive tape 1 can be prevented by providing the cover member 8 on the unused winding portion 2a.
【0 7 4 2】 尚、 卷取りリール 1 7では基材 9だけを卷き取っているので、 接 着材テープリールの数本分を巻き取ることができるので、 卷取りリール 1 7の ¾ 換回数を少なくすることができ、 作業効率が良い。  [0 7 4 2] Since only the base material 9 is wound on the take-up reel 17, it is possible to wind several adhesive tape reels. The number of replacements can be reduced, and work efficiency is good.
【0 7 4 3】 ここで、 図 5 8を参照して本実施の形態にかかる接着材テ一プリ ール Aの製造方法について説明する。  Here, a method of manufacturing the adhesive tape A according to the present embodiment will be described with reference to FIG.
【0 7 4 4】 卷出機 2 5から卷き出された基材 (セパレ一夕) にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤を塗布し、 乾燥炉 2 9で乾燥し た後、 卷取機 3 1で原反を巻き取る。 巻き取られた接着材テープの原反は、 スリ ッ夕 3 3により所定幅に切断されて卷き芯に巻き取れられた後、卷き芯に側板 7， 7 a , 7 bが両側から装着されて、 カバー部材 8を装着し、 除湿材とともに梱包 され、 好ましくは低温 （一 5。C〜一 1 0 °C) に管理されて出荷される。  [0 7 4 4] An adhesive mixture of resin and conductive particles 13 is applied to the base material (separate one night) unwound from the unwinding machine 25 by the first time 27 and dried. After drying in the furnace 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut to a predetermined width by a slit 33 and wound on a winding core, and then the side plates 7, 7a and 7b are attached to the winding core from both sides. Then, it is mounted with the cover member 8 and packed together with the dehumidifying material, and is preferably shipped at a low temperature (15.C to 110 ° C).
【0 7 4 5】 次に、 請求の範囲第 5 2〜第 5 8項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付することによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  Next, another embodiment of the invention described in claims 52 to 58 will be described. However, in the embodiment described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 7 4 6】 図 5 9に示す第 2実施の形態では、 巻き部 2、 2 aに取り付ける 09694 カバ一部材 8に接着材テープ 1の引出し口 1 0 6を備えている。 この場合、 カバ 一部材 8の引出し口 1 0 6から接着材テープ 1を繰り出すことができるので、 卷 き部 2、 2 aのカバ一部材 8を外すことなく、 卷き部 2、 2 aから直接、 接着材 テープ 1を繰り出すことができる。 [0741] In the second embodiment shown in Fig. 59, it is attached to the winding parts 2 and 2a. 09694 Cover member 8 has a draw-out opening 106 for adhesive tape 1. In this case, the adhesive tape 1 can be fed out from the outlet 106 of the cover member 8, so that the cover member 8 of the winding portions 2 and 2a is not removed from the winding portions 2 and 2a. The adhesive tape 1 can be fed directly.
【0 7 4 7】 図 6 O A及び図 6 0 Bに示す第 3実施の形態では、 巻き部 2、 2 a、 2 bはそれそれ別体になっており、 接着装置 1 5本体に設けられた軸 1 0 7 に摺動自在に取り付けられている。 そして、 一方の卷き部 2の卷き出しが終了す ると、 軸 1 0 7の先端に取り付けてあるキャップ 1 0 8を取り外し、 一方の卷き 部 2を接着装置 1 5から取り除く。 そして、 他方の巻き部 2 aを接着位置に移動 させ、 カバ一部材 8を外してから、 他方の巻き部 2 aの接着材テ一プ 1を卷取り リール 1 7に巻き付けて、 接着材テープ 1の交換を行っている。 この場合、 複数 の巻き部 2、 2 a、 2 bはそれそれ別体になっているので、 取り扱いがし易い。 In the third embodiment shown in FIG. 6OA and FIG. 60B, the winding portions 2, 2a, and 2b are separately provided, and are provided on the main body of the bonding device 15. Slidably mounted on the shaft 107. Then, when the unwinding of the one winding part 2 is completed, the cap 108 attached to the tip of the shaft 107 is removed, and the one winding part 2 is removed from the bonding device 15. Then, the other winding portion 2a is moved to the bonding position, the cover member 8 is removed, and then the adhesive tape 1 of the other winding portion 2a is wound around the take-up reel 17 and the adhesive tape 1 has been exchanged. In this case, the plurality of winding portions 2, 2a, and 2b are separately provided, so that they are easy to handle.
【0 7 4 8】 図 6 1に示す第 4実施の形態では、 第 3実施の形態と同様に、 卷 き部 2 , 2 a , 2 bがそれぞれ別体になっており、 卷き部 2 , 2 a , 2 bの互い の側板 7 , 7 a同士が嵌合することで、 接着装置 1 5に装着されている。 図 6 1 に示すように、 他方の卷き部 2 aの側板 7 aには横断面略コ字状の被嵌合部 1 1 0が設けられており、 一方の卷き部 2の側板 7に設けられた被嵌合部 4 9を上側 から被嵌合部 1 1 0に嵌合させることで、 両者が接続される。 巻き出しの,終了し た一方の巻き部 2を接着装置 1 5から取り外す場合には、 一方の卷き部 2を上側 に持ち上げるだけで嵌合が外れ、一方の卷き部 2を簡単に取り外すことができる。[0749] In the fourth embodiment shown in Fig. 61, similarly to the third embodiment, the winding portions 2, 2a, and 2b are separately provided, and the winding portion 2 , 2a, 2b are attached to the bonding device 15 by fitting the side plates 7, 7a of each other. As shown in FIG. 61, the side plate 7 a of the other winding portion 2 a is provided with a fitted portion 110 having a substantially U-shaped cross section, and the side plate 7 of the one winding portion 2 is provided. By fitting the fitted portion 49 provided on the base to the fitted portion 110 from above, the two are connected. To remove one of the unwound winding portions 2 from the bonding device 15, simply lift one of the winding portions 2 upward to disengage and easily remove one of the winding portions 2. be able to.
【0 7 4 9】 請求の範囲第 5 2〜第 5 8項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 5 2〜第 5 8項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。 The invention described in claims 52 to 58 is not limited to the above-described embodiment, but may be any of the inventions described in claims 52 to 58. Various modifications can be made without departing from the gist.
【0 7 5 0】 例えば、 上述した実施の形態において、 卷き部 2、 2 aは特に制 限はなく幾つあってもよい。  [0750] For example, in the above-described embodiment, the number of winding portions 2 and 2a is not particularly limited and may be any number.
【0 7 5 1】 第 4実施の形態において、 側板 7 , 7 a同士を上下にスライ ドさ せることで、 一方及び他方の卷き部 2、 2 aを嵌合するようにしたが、 一方の側 板 7に嵌合穴を形成し、 他方の側板 7 aに嵌合突起を設け、 テープの幅方向に嵌 合突起を嵌合穴に押し込んで、 両者を嵌合しても良い。 [0753] In the fourth embodiment, the side plates 7, 7a are vertically slid. In this case, the one and the other winding portions 2 and 2a are fitted to each other.However, a fitting hole is formed in one side plate 7 and a fitting projection is provided in the other side plate 7a. The fitting projection may be pushed into the fitting hole in the width direction of the above to fit the two together.
【0 7 5 2】 図 3 1 A , 3 1 Bには、 リードフレームの固定用支持基板、 半導 体素子搭載用支持基板あるいはリードフレームのダイと半導体素子を接続する接 着材テープのうち、 リードフレームの固定用支持基板と半導体素子をリードフレ —ムに接着 .固定する L 0 C (Lead on Chip) 構造の 1例を示す。  [0753] Figures 31A and 31B show the supporting substrate for fixing the lead frame, the supporting substrate for mounting the semiconductor element, or the adhesive tape for connecting the die of the lead frame and the semiconductor element. An example of an L 0 C (Lead on Chip) structure for bonding and fixing a semiconductor device to a support frame for fixing a lead frame to a lead frame is shown.
【0 7 5 3】 厚さ 5 Ομπιの表面処理を施したポリイミドフィルム等の支持フ イルム 7 8の両面に、 厚さ 2 5μπιのポリアミドィミド系接着剤層等の接着剤層 8 0が両面についた図 3 1 Αの構成の接着材テープを用い、 図 3 1 Bに示した L O C構造の半導体装置が得られる。 図 3 1 Aに示す接着材テ一プを図 3 2 A〜図 3 2 Cに示す接着装置の打ち抜き金型 8 7 (雄型 （凸部） 9 5、 雌型 （凹部） 9 6 ) を用いて短冊状に打ち抜き、 例えば、 厚さ 0 . 2 mmの鉄一二ヅケル合金製 のリードフレームの上に 0 . 2 mm間隔、 0 . 2 mm幅のインナ一リードが当た るように乗せて 4 0 0 °Cで 3 MP aの圧力で 3秒間加圧して圧着し、 半導体用接 着フィルム付きリードフレームを作製する。 次いで、 別工程で、 この半導体用接 着フィルム付きリ一ドフレームの接着剤層面に半導体素子を 3 5 0 °Cの温度で 3 MP aの圧力で 3秒間加圧して圧着し、 その後、 リードフレームと半導体素子を 金線でワイヤボンドしてエポキシ樹脂成形材料等の封止材を用いてトランスファ 成形により封止し、 図 3 1 Bに示すような半導体装置を得る。 図 3 1 A、 図 3 1 Bにおいて、 8 1は接着材テープから打ち抜かれた半導体用接着フィルム、 5 4 は半導体素子、 8 3はリードフレーム、 8 4は封止材、 8 5はボンディングワイ ャ、 8 6はバスバーである。 図 3 2 A、 3 2 B、 3 2 Cは接着装置であり、 図 3 [0 753] [075] Both sides of a support film 7 8 such as a polyimide film or the like that has been subjected to a surface treatment with a thickness of 5 µπι, and an adhesive layer 80 such as a polyamideimide adhesive layer with a thickness of 25 µπι The semiconductor device having the LOC structure shown in FIG. 31B can be obtained by using the adhesive tape having the structure shown in FIG. The adhesive tape shown in Fig. 31A is attached to the punching die 87 (male (convex) 95, female (recess) 96) of the bonding machine shown in Figs. 32A to 32C. Punched into strips, for example, and placed on a 0.2 mm thick iron-120-kel alloy lead frame so that the inner lead with 0.2 mm spacing and 0.2 mm width is in contact with it. At 400 ° C at a pressure of 3 MPa for 3 seconds to produce a lead frame with an adhesive film for semiconductors. Then, in a separate step, the semiconductor element was pressed against the adhesive layer surface of the lead frame with the adhesive film for semiconductor at a temperature of 350 ° C. at a pressure of 3 MPa for 3 seconds, and then pressed. The frame and the semiconductor element are wire-bonded with a gold wire and sealed by transfer molding using a sealing material such as an epoxy resin molding material to obtain a semiconductor device as shown in FIG. 31B. In FIGS. 31A and 31B, reference numeral 81 denotes an adhesive film for a semiconductor punched from an adhesive tape, 54 denotes a semiconductor element, 83 denotes a lead frame, 84 denotes a sealing material, and 85 denotes a bonding wire. And 86 are bus bars. Fig. 3 2A, 32B and 32C are bonding devices.
2 A、 図 3 2 Bにおいて、 8 7は打ち抜き金型、 8 8はリードフレーム搬送部、In FIG. 2A and FIG. 32B, 87 is a punching die, 88 is a lead frame transport section,
6 1は接着剤テープ打ち抜き、 貼り付け部、 9 0はヒ一夕一部、 9 1は接着材テ —プリール（接着材テープ卷き出し部)、 9 2は接着材テープ（半導体用接着フィ ルム）、 9 3は接着材テープ巻き出しローラ一である。 また図 3 2 Cにおいて、 9 4は接着材テープ（半導体用接着フィルム)、 9 5は雄型（凸部)、 9 6は雌型（凹 部)、 9 7はフィルム押さえ板である。接着材テープ 9 2は、接着材テープリール (接着材テープ卷き出し部） 9 1から、 連続して卷き出され接着材テープ打ち抜 き、 貼り付け部 8 9で短冊状に打ち抜かれ、 リードフレームのリード部分に接着 され、 半導体用接着フィルム付きリードフレームとしてリードフレーム搬送部か ら搬送される。 打ち抜かれた接着材テープは接着材テープ卷き出しローラ一 9 3 から搬出される。 6 1 is an adhesive tape punching and sticking area, 90 is a part of the adhesive tape, 91 is an adhesive tape-prill (adhesive tape unwinding part), and 92 is an adhesive tape (adhesive film for semiconductor). 93) is an adhesive tape unwinding roller. In FIG. 32C, reference numeral 94 denotes an adhesive tape (adhesive film for semiconductor), 95 denotes a male type (convex portion), 96 denotes a female type (concave portion), and 97 denotes a film holding plate. The adhesive tape 9 2 is continuously unwound from an adhesive tape reel (adhesive tape unwinding portion) 9 1, punches out an adhesive tape, and is punched into a strip shape at an attaching portion 8 9. It is adhered to the lead portion of the lead frame and is transported from the lead frame transport section as a lead frame with an adhesive film for semiconductor. The punched adhesive tape is carried out from an adhesive tape unwinding roller 93.
【0 7 5 4】 上記と同様に、 接着材テープを用いて半導体素子搭載用支持基板 に半導体素子を接続する。 また、 同様にリードフレームのダイと半導体素子を接 続 '接着する。 接着材テープは、 単に接着 '固定する場合と電極同士を接触によ り、 あるいは導電性粒子を介して電気的に接続する接着剤が目的に応じて使用さ れ、 支持フィルムを用いる場合と、 単に接着剤のみからなる場合がある。  [0753] Similarly to the above, the semiconductor element is connected to the semiconductor element mounting support substrate using an adhesive tape. Similarly, connect and bond the die of the lead frame and the semiconductor element. Adhesive tapes are used simply for bonding and fixing, or when an adhesive that electrically connects electrodes by contact or via conductive particles is used according to the purpose, and when a support film is used. In some cases, it may consist solely of an adhesive.
【0 7 5 5】 次に、 請求の範囲第 5 9項に記載された発明について説明する。 【0 7 5 6】 この発明は、 電子部品と回路基板、 又は回路基板同士を接着固定 すると共に、 両者の電極同士を電気的に接続するための接着剤を回路基板に圧着 する接着具に関する。  Next, the invention described in claim 59 will be described. [0756] The present invention relates to an adhesive tool for bonding and fixing an electronic component and a circuit board or circuit boards to each other, and pressing an adhesive for electrically connecting both electrodes to the circuit board.
【0 7 5 7】 次に、 請求の範囲第 5 9項に記載された発明の背景技術について 説明する。  [0757] Next, the background art of the invention described in claim 59 will be described.
【0 7 5 8】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチヅプ実装などの電子部品と回路基板、 回 路基板同士を接着固定し且つ両者の電極同士を電気的に接続する方法として、 接 着剤テープが用いられている。  [0757] In general, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and pair-chip mounting are adhered and fixed to a circuit board and a circuit board, and both electrodes are electrically connected. Adhesive tape is used as a method of making the connection.
【0 7 5 9】 特開 2 0 0 1— 2 8 4 0 0 5号公報には、 基材に接着剤が塗布さ れた接着剤テープをリール状に巻き取ったものが開示されており、 この接着剤テ —プのリール（以下、 「接着剤リール」 という）を自動接着機械に装着して用いる ことが記載されている。 [0757] Japanese Patent Application Laid-Open No. 2001-280405 discloses a reel wound on an adhesive tape having a base material coated with an adhesive. This adhesive tape reel (hereinafter referred to as "adhesive reel") is mounted on an automatic bonding machine for use. It is described.
【0 7 6 0】 自動接着機械は、 接着剤リールの装着部と空リールの装着部と、 これらのリール間に設けた加熱加圧部材と、 基板を載置するテーブルとを備えて おり、 接着剤リールから接着剤テープを基板上に引き出して、 加熱加圧部材によ り基材の背面側から接着剤テープを加熱加圧し、 基板上に接着剤を圧着するもの である。  [0760] The automatic bonding machine includes a mounting section for an adhesive reel and a mounting section for an empty reel, a heating and pressing member provided between these reels, and a table for mounting a substrate. The adhesive tape is pulled out from the adhesive reel onto the substrate, and the adhesive tape is heated and pressed from the back side of the base material by a heating and pressing member, and the adhesive is pressed onto the substrate.
【 0 7 6 1】 しかし、 従来の自動接着機械は大型であり、 基板に部分的に接着 剤を圧着したい場合や、 接着剤を圧着する面積が小さい場合や、 仮圧着をする場 合等は大型であるためにかえって操作し難いという問題がある。  [0761] However, the conventional automatic bonding machine is large, and when it is desired to partially press the adhesive on the substrate, when the area to press the adhesive is small, or when performing temporary pressing, etc. There is a problem that it is rather difficult to operate because of its large size.
【0 7 6 2】 一方、 このような大型の自動接着機械とは別に小型で且つ簡単に 操作可能であり、 局所的な部分や仮圧着をする場合に、 大型の装置を用いること なく接着剤を圧着できる器具が望まれている。  [0764] On the other hand, apart from such a large-scale automatic bonding machine, it is small and easily operable, and can be used for local parts and temporary crimping without using a large-scale device. There is a demand for a device that can press the crimp.
【0 7 6 3】 そこで、 請求の範囲第 5 9項に記載された発明は、 小型でしかも 片手で操作可能であり且つ基板の一部に容易に接着剤を圧着することができる接 着具の提供を目的とする。  [0764] Therefore, the invention described in claim 59 is a bonding device that is small in size, can be operated with one hand, and can easily press the adhesive on a part of the substrate. The purpose is to provide.
【0 7 6 4】 次に、 添付図面を参照しながら請求の範囲第 5 9項に記載された 発明の実施の形態について説明する。 図 6 2 A及び図 6 2 Bは請求の範囲第 5 9 項に記載された発明の第 1実施の形態にかかる接着具の図であり、 図 6 2 Aは接 着具の斜視図であり、 図 6 2 Bは図 6 2 Aの A _ A切断面図であり、 図 6 3は図 6 2 A及び図 6 2 Bに示す接着具の使用方法を説明する側面図であり、 図 6 4は 接着具の製造方法を示す工程図である。  [0764] Next, an embodiment of the invention described in claim 59 will be described with reference to the accompanying drawings. FIGS. 62A and 62B are views of the adhesive tool according to the first embodiment of the invention described in claim 59, and FIG. 62A is a perspective view of the adhesive tool. FIG. 62B is a sectional view taken along the line A--A of FIG. 62A, and FIG. 63 is a side view for explaining how to use the bonding tool shown in FIGS. 62A and 62B. FIG. 4 is a process chart showing a method for manufacturing an adhesive tool.
【0 7 6 5】 本実施の形態にかかる接着具 1 1 1は、 一方のリ一ル （供給リ一 ル） 3と、 他方のリール （空リール） 5と、 これらを収納するケース 9 9とから 主に構成されており、 一方のリール 3には接着剤テープ 1が巻かれ、 接着剤テ一 プ 1の一端 9 aは他方のリール 5に固定されている。  [0756] The adhesive tool 111 according to the present embodiment includes one reel (supply reel) 3, the other reel (empty reel) 5, and a case 9 for accommodating them. The adhesive tape 1 is wound around one of the reels 3, and one end 9 a of the adhesive tape 1 is fixed to the other reel 5.
【0 7 6 6】 ケース 9 9は、 片手で把持できる寸法に形成されており、 側面視 において、 角が湾曲した略三角形状であり、 持ちやすい形状になっている。 略三 角形状のケース 9 9の角部には、 開口部 1 1 3が形成されており、 この開口部 1 1 3から接着剤テープ 9が露出するようになっている。 [0 7 6 6] The case 9 9 is formed in a size that can be gripped with one hand, and is viewed from the side. In the above, the shape is substantially triangular with curved corners, so that it is easy to hold. An opening 113 is formed at a corner of the substantially triangular case 99, and the adhesive tape 9 is exposed from the opening 113.
【0 7 6 7】 また、 開口部 1 1 3には、 加熱部材 1 1 4が突設されており、 こ の加熱部材 1 1 4は側面視で略三角形状であり、 上面 1 3 aから下面 1 3 bに沿 つて引き出された接着剤テープ 1が案内されており、 下面側に電熱板 1 1 5が設 けられている。  [0764] Also, a heating member 111 is protruded from the opening 113, and the heating member 114 has a substantially triangular shape in a side view. The adhesive tape 1 pulled out along the lower surface 13b is guided, and an electric heating plate 115 is provided on the lower surface side.
【0 7 6 8】 加熱部材 1 1 4の形状を棒状にし、 電熱板 1 1 5で加熱部材 1 1 4を覆うことで接着材テープ 9を引き出すのに際し、 加熱部材 1 1 4が回転する ことでスムーズにテープ 9を引き出すことが出来る。 また、 電熱板 1 1 5の外側 にポリテトラフルォロェチレンゃシリコーンゴム若しくはその両方を設けること は接着剤 9を圧着する際、 均一に圧力がかかるため好ましい。  [0 7 6 8] The shape of the heating member 1 14 is rod-shaped, and the heating member 1 14 is rotated when the adhesive tape 9 is pulled out by covering the heating member 1 14 with the electric heating plate 1 15. The tape 9 can be pulled out smoothly. It is preferable to provide polytetrafluoroethylene-silicone rubber or both on the outside of the electric heating plate 115 because pressure is uniformly applied when the adhesive 9 is pressed.
【0 7 6 9】 ケース 9 9はハーフケース 9 9 a、 9 9 bを嵌合して作られてお り、 一方及び他方のリール 3、 5がケース内に収納されている。 ケース内には更 に、ガイド 1 6が設けられており、接着剤テープ 1の移動を案内している。また、 ケース 9 9 a若しくは 7 bのどちらかの底面の一方に板状のガイドを形成し、 こ のガイドを回路基板の縁に押し当てながら接着剤を回路基板に圧着すると回路基 板に沿って接着剤を精度良く圧着出来る。  [0764] The case 99 is formed by fitting half cases 99a and 99b, and one and the other reels 3 and 5 are housed in the case. A guide 16 is further provided in the case to guide the movement of the adhesive tape 1. In addition, a plate-shaped guide is formed on one of the bottom surfaces of either the case 99a or 7b, and when this adhesive is pressed against the circuit board while pressing the guide against the edge of the circuit board, it follows the circuit board. Adhesive can be pressed with high precision.
【0 7 7 0】 一方のリール 3には同軸に一方のギヤ 1 1 6が固定されており、 他方のリール 1 7にも同軸に他方のギヤ 1 1 7が固定され、 一方のギヤ 1 1 6と 他方のギヤ 1 1 7とが相互に歯合しており、 一方のリール 3が回転して接着剤テ ープ 1が引き出されると、 他方のリール 1 7がその接着剤テープ 1の引き出し量 だけ回転して基材 9を卷き取るようになつている。 尚、 一方のギヤ 1 1 6と他方 のギヤ 1 1 7とによりギアュニヅト 1 1 8が構成されている。  [0770] One gear 3 is fixed coaxially to one reel 3, and the other gear 1 17 is also fixed coaxially to the other reel 17 and one gear 11 6 and the other gear 1 17 mesh with each other, and when one reel 3 rotates and the adhesive tape 1 is pulled out, the other reel 17 pulls out the adhesive tape 1. The substrate 9 is rotated by an amount and wound up. The gear unit 118 is constituted by the one gear 116 and the other gear 117.
【0 7 7 1】 また、 ケース 9 9の側面には加熱部材 1 1 4に電力を供給する第 ケース （電源手段） 1 1 9が設けられており、 第三ケース 1 1 9内には、 乾電 池が収納されているとともに、 加熱部材 1 1 4に供給する電力の調整回路が収納 されている。 尚、 第三ケース 1 1 9には電源スィッチ 1 2 0が設けられており、 接着具 1 1 1を把持している手の指で O N 0 F F操作可能が可能になっている。[0 7 7 1] A case (power supply means) 1 19 for supplying electric power to the heating member 1 14 is provided on the side surface of the case 9 9. Dry electricity A pond is housed, and an adjustment circuit for the power supplied to the heating members 114 is housed. The third case 1 19 is provided with a power switch 120 so that the ON / OFF operation can be performed by the finger of the hand holding the adhesive 1 1 1.
【0 7 7 2】 接着剤テープ 1には、 図 6 2 Bに示すように、 基材 9の片面に接 着剤 1 1が塗布されている。 As shown in FIG. 62B, the adhesive tape 1 has an adhesive 11 applied to one surface of the substrate 9.
【0 7 7 3】 本実施の形態では、 接着剤テープ 1は長さが約 2 0 mであり、 幅 Wは約 1 . 2 mmである。  [0770] In the present embodiment, the adhesive tape 1 has a length of about 20 m and a width W of about 1.2 mm.
【0 7 7 4】 基材 9は、 強度及び異方導電材を構成する接着剤の剥離性の面か ら O P P (延伸ポリプロピレン）、 ポリテトラフルォロエチレン、 シリコーン処理 した P E T (ポリエチレンテレフ夕レート）などを用いるが、 これらに制限するも のではない。  The base material 9 is made of OPP (stretched polypropylene), polytetrafluoroethylene, or silicone-treated PET (polyethylene terephthalate) from the viewpoint of strength and releasability of the adhesive constituting the anisotropic conductive material. Rate) etc., but is not limited to these.
【0 7 7 5】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬ィ匕性樹脂の混合系、 ホヅトメルト系が用いられる。 かかる樹脂の代表的 なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性樹脂系としてはエポキシ樹脂系、 ビニルエステル系樹脂、 アクリル 系樹 β旨、 シリコーン樹脂系が用いられる。  [0775] As the adhesive 11, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a hot melt system is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, a vinyl ester type resin, an acryl type resin, and a silicone resin type as a thermosetting resin type. Is used.
【0 7 7 6】 接着剤 1 1には、 導電粒子 1 3が分散されている。 導電粒子 1 3 としては、 A u， A g , P t , N i , C u， W, S b、 S n , はんだなどの金属 粒子や力一ボン、黒鉛などがあり、これら及び非導電性のガラス、セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等により形成したもの でもよい。 さらに前記したような導電粒子を絶縁層で被覆してなる絶縁被覆粒子 や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の熱溶融金属や、 プラスチヅク等の高分子核材に導電層を形成したものは、 加熱加圧もしくは加圧 により変形性を有し、 接続後の電極間の距離が減少し、 接続時に回路との接触面 積が増加し信頼性が向上するので好ましい。 特に高分子類を核とした場合、 はん だのように融点を示さないので軟化の状態を接続温度で広く制御でき、 電極の厚 みや平坦性のばらつきに対応し易い接続部材が得られるのでより好ましい。[0770] The conductive particles 13 are dispersed in the adhesive 11. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The above-mentioned conductive layer may be formed by coating or the like on a polymer nucleus material such as glass, ceramics and plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressurizing, and the distance between electrodes after connection is reduced. This is preferable because the contact area with the circuit increases and reliability is improved. In particular, when the core is made of polymers, it does not show a melting point like solder, so the softening state can be widely controlled by the connection temperature, and the electrode thickness This is more preferable because a connection member that can easily cope with variations in brightness and flatness is obtained.
【0 7 7 7】 . 次に、 本実施の形態にかかる接着具 1 1 1の使用方法について説 明する。 図 6 3に示すように、 片手で接着具 1 1 1を握り、 電源スィッチ 1 2 0 を O Nにする。 そして、 接着剤テープ 1が露出している開口部 1 1 3を回路基板 2 7に押し当てる。 開口部 1 1には、 接着剤テープ 1の基材 9側に加熱部材 1 1 4が設けてあるから、 加熱部材 1 1 4の下面側にある接着剤テープ 1を押し付け ることにより、 接着剤 1 1を回路 ¾反2 7に加熱圧着する。 Next, a method of using the bonding tool 111 according to the present embodiment will be described. As shown in Fig. 63, hold the adhesive tool 1 1 1 with one hand and turn ON the power switch 1 20. Then, the opening 1 13 where the adhesive tape 1 is exposed is pressed against the circuit board 27. The opening 11 is provided with a heating member 1 14 on the base material 9 side of the adhesive tape 1, so that the adhesive tape 1 on the lower surface side of the heating member 1 1 1 is heat-pressed to circuit 27.
【0 7 7 8】 接着具 1 1 1を下方に押し付けながら前方 （図 6 3中矢印 E ) に 進めると、 接着剤テープ 1が順次引き出されて、 加熱部材 1 1 4が E方向に進む とともに新たな接着剤 9が加熱部材 1 1 4の下に位置して接着剤 1 1が回路基板 2 7に順次圧着される。  [0 7 7 8] When the adhesive 1 1 1 is pushed downward and advanced forward (arrow E in Fig. 6 3), the adhesive tape 1 is sequentially pulled out, and the heating member 1 14 advances in the E direction. The new adhesive 9 is positioned below the heating members 114 and the adhesive 11 is sequentially pressed against the circuit board 27.
【0 7 7 9】 このようにして、 一方のリール 3から接着剤テープ 1が引き出さ れると、 一方のリール 3が回転するので、 一方のリール 3の同軸に固定されてい る一方のギヤ 1 1 6が回転し、 これに歯合する他方のギヤ 1 1 7が回転して、 他 方のリール 1 7に接着剤 2 5が剥がされた後の基材 9を卷きつける。  [0770] Thus, when the adhesive tape 1 is pulled out from the one reel 3, one of the reels 3 rotates, so that one of the gears 1 1 fixed coaxially with the one of the reels 3 1 6 rotates, the other gear 11 meshing with this rotates, and winds the base material 9 after the adhesive 25 has been peeled off on the other reel 17.
【0 7 8 0】 本実施の形態によれば、 回路基板 2 7上の任意の位置に接着剤 1 1を圧着したい場合には、 接着具 1 1 1を片手で持って推し進めるだけで簡単に 接着剤 1 1を圧着することができる。 このように、 簡易に接着剤 1 1を圧着でき るから、 例えば、 回路基板 2 7上に電子部品 (配線回路） 3 7を仮圧着する場合等 や、 回路基板 2 7の一部にのみ電子部品（配線回路） 3 7を圧着する場合 (こは特に 有効である。  According to the present embodiment, when the adhesive 11 is to be pressed at an arbitrary position on the circuit board 27, the adhesive 11 can be easily held by pushing it with one hand. The adhesive 11 can be pressed. In this way, the adhesive 11 can be easily crimped. For example, when the electronic component (wiring circuit) 37 is temporarily crimped on the circuit board 27, or when only a part of the circuit board 27 is When crimping parts (wiring circuit) 37 (This is particularly effective.
【0 7 8 1】 上記の圧着後 (仮接続)、 回路基板 2 7の電極と電子部品 （配線回 路） 3 7の電極を位置合わせして本接続する。 本接続は、 回路基板 2 7に接着剤 1 1を圧着後、 接着剤 1 1上に電子部品 (配線回路） 3 7を配置して、 必要により クッション材としてポリテトラフルォロエチレン材 3 9を介して加熱力!]圧へヅド 1 9により電子部品 (配線回路） 3 7を回路基板 2 7に加熱加圧する（図 4参照）。 これにより回路基板 2 7の電極 2 7 aと電子部品 （配線回路） 3 7の電極 3 7 a を接続固定する。 After the above crimping (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are aligned and fully connected. In this connection, after bonding the adhesive 11 to the circuit board 27, the electronic components (wiring circuit) 37 are placed on the adhesive 11 and, if necessary, polytetrafluoroethylene 3 9 Heating force!] Pressure head 19 heats and presses electronic components (wiring circuit) 37 onto circuit board 27 (see Fig. 4). Thus, the electrode 27a of the circuit board 27 and the electrode 37a of the electronic component (wiring circuit) 37 are connected and fixed.
【0 7 8 2】 また、 接着剤テープ 1をケース 9 9内に収納して、 そのまま用い る構成としているから、 取扱いが容易であり、 作業性が良い。  [0782] Also, since the adhesive tape 1 is housed in the case 99 and used as it is, handling is easy and workability is good.
【0 7 8 3】 ここで、 図 6 4を参照して本実施の形態にかかる接着具 1 1 1の 製造方法について説明する。  [0778] Here, a method for manufacturing the bonding tool 111 according to the present embodiment will be described with reference to FIG.
【0 7 8 4】 卷出機 2 5から卷き出された基材 （セパレー夕） 2 3にコ一夕一 2 8により、 樹脂と導電粒子 1 3が混合された接着剤を塗布し、 乾燥炉 2 9で乾 燥した後、 卷取機 3 1で原反を卷き取る。 巻き取られた接着剤テープの原反は、 仕上げ工程においてスリツ夕 3 3により所定幅に切断されてリール 3に卷き取れ られた後、 一方のリール 3と他方のリール （空リール） 5とをハーフケース 9 9 a , 9 9 bで挟むように嵌合して、 且つ加熱部材 1 1 4と乾電池等を収納した第 三ケース 1 1 9を組み付けることにより、 接着具 1 1 1を製造する。  [0 7 8 4] An adhesive mixture of resin and conductive particles 13 is applied to the base material (separation material) 23 wound out from the unwinding machine 25 by means of a piece 28, After drying in the drying oven 29, the web is wound up by the winder 31. The raw material of the wound adhesive tape is cut to a predetermined width by a slit 33 in a finishing process and wound on a reel 3, and then the one reel 3 and the other reel (empty reel) 5 Is manufactured by assembling the heating member 1 14 and the third case 1 19 containing a dry battery, etc., so that the bonding tool 1 11 is sandwiched between the half cases 9 9 a and 9 9 b. .
【0 7 8 5】 接着具 1 1 1は、 除湿材とともに梱包され、 好ましくは低温 （一 5 °C〜一 1 0 °C) に管理されて出荷される。  [0785] The adhesive 1 11 is packed together with a dehumidifying material, and is preferably shipped at a controlled low temperature (15 ° C to 10 ° C).
【0 7 8 6】 次に、 請求の範囲第 6 0〜第 6 4項に記載された発明について説 明する。  Next, the invention described in claims 60 to 64 will be described.
【0 7 8 7】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープに関し、 特に リール状に卷かれた接着材テープに関する。  The present invention relates to an adhesive tape for bonding and fixing an electronic component and a circuit board, or between circuit boards, and for electrically connecting both electrodes, and more particularly to an adhesive tape wound in a reel shape. Material tape.
【0 7 8 8】 次に、 請求の範囲第 6 0〜第 6 4項に記載された発明の背景技術 について説明する。  Next, the background art of the invention described in claims 60 to 64 will be described.
【0 7 8 9】 一般に、 液晶パネル、 P D P (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチップ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。 【0 7 9 0】 特開 2 0 0 1 - 2 8 4 0 0 5号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に巻き取ったものが開示されている。 [0 7 8 9] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, pair chip mounting, and circuit boards and circuit boards are bonded and fixed, and both electrodes are electrically connected. Adhesive tape is used as a method for making the connection. [0790] Japanese Unexamined Patent Application Publication No. 2000-2005 discloses a structure in which an adhesive tape in which an adhesive is applied to a base material is wound into a reel. .
【0 7 9 1】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに卷き取るテープの長さは 5 0 m程度であり、 接着材テープは一度リールか ら卷き出されて接着剤を回路基板等に圧着した後は、再び使用されることがない。 【0 7 9 2】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある。 【0 7 9 3】 かかる問題に対して、 リールに巻き取る接着材テープの巻き数を 多くすることで、 1リール当りの接着剤量を増やし、 リ一ルの交換頻度を低減す ることが考えられるが、 接着材テープの厚さが厚いため、 1リール当りの巻き数 を増やし難い。  [0791] The conventional adhesive tape of this type has a width of about 1 to 3 mm, the length of the tape wound around the reel is about 50 m, and the adhesive tape is once applied. After being unwound from the reel and pressure-bonding the adhesive to a circuit board or the like, it is not used again. However, with the recent enlargement of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, in an electronic device manufacturing plant, there is a problem that the frequency of replacement of the adhesive reel is increased, and the replacement of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved. [0 7 9 3] To solve this problem, it is possible to increase the amount of adhesive per reel and reduce the frequency of reel replacement by increasing the number of windings of the adhesive tape wound on the reel. Although it is conceivable, it is difficult to increase the number of turns per reel because the thickness of the adhesive tape is large.
【0 7 9 4】 また、 接着材テープの厚みを薄くすることが考えられるが、 基材 としてシリコン処理した P E T (ポリエチレンテレフ夕レート） が使用されてい るため、 基材の厚みを薄くすると、 基材の伸びや、 切断などの不具合が生じ易く なるおそれがある。  [07974] In addition, it is conceivable to reduce the thickness of the adhesive tape. However, since silicon-treated PET (polyethylene terephthalate) is used as the base material, if the base material thickness is reduced, Problems such as elongation of the base material and cutting may easily occur.
【0 7 9 5】 そこで、 請求の範囲第 6 0〜第 6 4項に記載された発明は、 1リ ール当たりの卷き数を増やし、 電子機器の生産効率の向上を図ることができる接 着材テープの提供を目的とする。  [0795] Therefore, the invention described in claims 60 to 64 can increase the number of windings per reel and improve the production efficiency of electronic equipment. The purpose is to provide adhesive tape.
【0 7 9 6】 次に、 添付図面を参照しながら請求の範囲第 6 0〜第 6 4項に記 載された発明の実施の形態について説明する。図 6 5 A、図 6 5 B、図 3、図 4、 図 2 9、 図 5は、 請求の範囲第 6 0〜第 6 4項に記載された発明の第 1実施の形 態を説明するものである。 図 6 5 A及び図 6 5 Bは第 1実施の形態にかかる接着 材テープの図であり、 図 6 5 Aは接着材リールを示す斜視図であり、 図 6 5 Bは 4 図 6 5 Aにおける A— A断面図である。 [0769] Next, embodiments of the invention described in claims 60 to 64 will be described with reference to the accompanying drawings. FIG. 65A, FIG. 65B, FIG. 3, FIG. 4, FIG. 29, and FIG. 5 illustrate the first embodiment of the invention described in claims 60 to 64. Things. FIG. 65A and FIG. 65B are views of the adhesive tape according to the first embodiment, FIG. 65A is a perspective view showing an adhesive reel, and FIG. 4 Fig. 65 is a sectional view taken along line AA in Fig. 5A.
【0 7 9 7】 接着材テープ 1はリール 3に卷かれたものであり、 リール 3には 卷き芯 5と接着材テープ 1の両幅側に配置した側板 7とが設けられている。  The adhesive tape 1 is wound around a reel 3. The reel 3 is provided with a winding core 5 and side plates 7 arranged on both width sides of the adhesive tape 1.
【 0 7 9 8】 接着材テープ 1は、 基材 9と、 基材 9の一側面に塗布された接着 剤 1 1とから構成されている。  [0798] The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 7 9 9】 基材 9には、 銅フィルム （銅箔） を用いた。 基材 9の厚さ （図 6 5 B中、 Sで示す） は 1 0μπι、 基材 9の 2 5 °Cでの引張強度は 5 0 0 M P a、 基材 9の接着剤 1 1に対する厚みの比 （S/T ) は、 0 . 5とし、 接着剤 1 1の 厚さは 2 0 Aimとした。 基材 9の表面粗さ Rmaxは、 0 . 2 5 mとした。 [0797] The base material 9 was a copper film (copper foil). The thickness of substrate 9 (indicated by S in Fig. 65B) is 10μπι, the tensile strength of substrate 9 at 25 ° C is 500 MPa, the thickness of substrate 9 with respect to adhesive 11 The ratio (S / T) was 0.5, and the thickness of the adhesive 11 was 20 Aim. The surface roughness Rmax of the substrate 9 was 0.25 m.
【0 8 0 0】 尚、 基材 9に芳香族ポリアミドフィルム （ミクトロン） を用いた ものも作製した。 ¾ 9の厚さ、 引張強度、 基材 9の接着剤 1 1に対する厚みの 比 ( S/T ) を夫々銅フィルムと同じように作製した。  [0800] A substrate using an aromatic polyamide film (Miktron) as the substrate 9 was also manufactured. The thickness, the tensile strength, and the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 of the base material 9 were prepared in the same manner as the copper film.
【0 8 0 1】 次に、 上述した接着材テープの使用方法について説明する。 図 3 に示すように、 接着装置 1 5に接着材テープ 1のリール 3と、 卷取りリール 1 7 とを装着し、 リール 3に卷いた接着材テープ 1の先端をガイドビン 2 2に掛けて 卷取りリール 1 7に取り付け、接着材テープ 1を繰り出した（図 3中矢印 E )。そ して、 回路基板 2 1上に接着材テ一プ 1を配置して、 両リール 3、 1 7間に配置 された加熱加圧へッド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1 を回路基板 2 1に圧着した。 その後、 基材 9を卷取りリール 1 7に巻き取った。 Next, a method of using the above-described adhesive tape will be described. As shown in FIG. 3, the reel 3 of the adhesive tape 1 and the take-up reel 17 are mounted on the adhesive device 15, and the tip of the adhesive tape 1 wound on the reel 3 is hung on the guide bin 22. The tape was attached to the take-up reel 17 and the adhesive tape 1 was unwound (arrow E in FIG. 3). Then, the adhesive tape 1 is placed on the circuit board 2 1, and the adhesive tape 1 is applied to the base material 9 side by the heating / pressing head 19 placed between both reels 3 and 17. Then, the adhesive 11 was pressure-bonded to the circuit board 21. Thereafter, the substrate 9 was wound on a take-up reel 17.
【0 8 0 2】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クヅション材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へヅド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧した。 これにより回路基板 2 1の電極 2 1 aと配線回路 2 3の 電極 2 3 aとを接続した。 Next, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 crimped to the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushioning material. The wiring circuit 23 was heated and pressed on the circuit board 21 by the heating and pressing head 19 through 4. Thus, the electrode 21 a of the circuit board 21 was connected to the electrode 23 a of the wiring circuit 23.
【0 8 0 3】 図 2 9に本実施の形態による接着材テープ 1を用いた P D P 2 6 の接続部分を示すように、 接着剤 1 1は P D Pの周囲全体に亘り圧着しており、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが明らか である。 したがって、 リール 3に巻いた接着材テープ 1の使用量も多くなり、 リ ール 3に巻いた接着材テープ 1は比較的短時間で卷取りリール 1 7に卷き取られ、 リール 3は空になる。 As shown in FIG. 29, the connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, the adhesive 11 is pressure-bonded over the entire periphery of the PDP. It is clear that the amount of the adhesive 11 used at one time is significantly higher than in the past. Therefore, the amount of the adhesive tape 1 wound on the reel 3 increases, and the adhesive tape 1 wound on the reel 3 is wound on the winding reel 17 in a relatively short time, and the reel 3 is empty. become.
【0 8 0 4】 リール 3が空になったところで、 使用済みのリール 3と新たなリ —ルを入れ替えて、 新たなリールを接着装置 1 5に装着した。 そして、 上述した ように、 接着剤 1 1を回路基板 2 1に圧着し、 基材 9を卷取りリ一ル 1 7に卷き 取る動作を繰り返した。  [0804] When the reel 3 became empty, the used reel 3 was replaced with a new reel, and a new reel was mounted on the bonding apparatus 15. Then, as described above, the operation of pressing the adhesive 11 on the circuit board 21 and winding the base material 9 on the winding reel 17 was repeated.
【0 8 0 5】 その結果、 基材 9に銅フィルムを用いたもの及び芳香族ポリアミ ドフィルムを用いたもの、 何れにおいても従来の接着材テープ 1と同様に取り扱 い易く且つ基材 9の伸びや切断もなかった。そして、基材 1 1の厚みが従来品（ 5 0 m) と比べ薄くなつている分、 接着材テープの卷き数が多くなり、 リールの 交換頻度が少なくなり生産性が向上した。  [0805] As a result, in both the case where the copper film was used for the base material 9 and the case where the aromatic polyimide film was used, the base material 9 was easy to handle like the conventional adhesive tape 1 and the base material 9 was used. There was no stretching or cutting. Since the thickness of the base material 11 is thinner than that of the conventional product (50 m), the number of windings of the adhesive tape is increased, the frequency of reel replacement is reduced, and productivity is improved.
【0 8 0 6】 ここで、 図 5を参照して本実施の形態にかかる接着材テープ 1の 製造方法について説明する。  [0806] Here, a method of manufacturing the adhesive tape 1 according to the present embodiment will be described with reference to FIG.
【0 8 0 7】 卷出機 2 5から巻き出された基材 （セパレ一夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を塗布し、 乾燥炉 2 9で乾 燥した後、卷取機 3 1で原反を巻き取る。巻き取られた接着材テープ 1の原反は、 スリツ夕 3 3により所定幅に切断されて卷き芯に卷き取れられた後、 巻き芯 5に 側板 7， 7が両側から装着されて、 除湿材とともに梱包され、 好ましくは、 低温 ( - 5 °C- 1 0 °C) に管理されて出荷される。  [0 8 0 7] An adhesive 11 mixed with resin and conductive particles 13 is applied to the base material (separation one night) unwound from the unwinding machine 25 by the first 27. After drying in a drying oven 29, the web is wound up by a winder 31. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core, and then the side plates 7, 7 are attached to the winding core 5 from both sides. It is packaged with dehumidifying material and is preferably shipped at a controlled low temperature (-5 ° C-10 ° C).
【0 8 0 8】 尚、 基材 9の厚さが、 4〃m、 2 0 m、 2 5〃mの銅フィルム 及び芳香族ポリアミドフィルムの場合についても、 接着材テープ 1を作製し、 上 述のように実際に使用してみたところ、 基材 9の伸びや、 切断などの不具合が生 じなかった。  [0810] In the case of the copper film and the aromatic polyamide film having the thickness of the base material 9 of 4m, 20m, and 25m, the adhesive tape 1 was prepared. As described above, when actually used, no troubles such as elongation of the base material 9 and cutting occurred.
【0 8 0 9】 また、 基材 9の接着剤 1 1に対する厚みの比 （S/T ) を、 0 . 0 1、 0. 05、 1. 0とした銅フィルム及び芳香族ポリアミドフィルムの場合 についても、接着材テープ 1を作製し、上述のように実際に使用してみたところ、 基材 9の伸びや、 切断などの不具合が生じなかった。 Further, the ratio (S / T) of the thickness of the base material 9 to the adhesive 11 is set to 0. In the case of the copper film and the aromatic polyamide film having a thickness of 0.1, 0.05, and 1.0, the adhesive tape 1 was produced and actually used as described above. There were no problems such as cutting.
【0810】 次に、 請求の範囲第 65〜第 66項に記載された発明について説 明する。  [0810] Next, the invention described in claims 65 to 66 will be described.
【081 1】 これらの発明は、 電子部品と回路基板、 又は回路基板同士を接着 固定すると共に、 両者の電極同士を電気的に接続する接着材テープの接着材形成 方法に関する。また、リードフレームの固定用支持基板やリードフレームのダイ、 半導体素子搭載用支持基板に半導体素子 （チップ） を接着，固定する半導体装置 において使用される接着材テープの接着材形成方法に関し、 特にリール状に卷か れた接着材テープリ一ルの接着材形成方法に関する。  [08111] These inventions relate to a method for forming an adhesive material of an adhesive tape for bonding and fixing an electronic component and a circuit board or circuit boards to each other and electrically connecting both electrodes. Also, the present invention relates to a method for forming an adhesive tape for an adhesive tape used in a semiconductor device for attaching and fixing a semiconductor element (chip) to a support substrate for fixing a lead frame, a die of a lead frame, and a support substrate for mounting a semiconductor element. The present invention relates to a method for forming an adhesive tape wound on an adhesive tape reel.
【0812】 次に、 請求の範囲第 65〜第 66項に記載された発明の背景技術 について説明する。  [0812] Next, the background art of the invention set forth in claims 65 to 66 will be described.
【0813】 一般に、液晶パネル、 PDP (プラズマディスプレイパネル）、 E L (蛍光ディスプレイ） パネル、 ペアチヅプ実装などの電子部品と回路基板、 回 路基板同士を接着固定し、 両者の電極同士を電気的に接続する方法として、 接着 材テープが用いられている。 また、 接着材テープは、 リードフレームのリード固 定テープ、 LOCテープ、 ダイボンドテープ、 マイクロ BGA · CSP等の接着 フィルム等に用いられ、 半導体装置全体の生産性、 信頼性を向上させるために使 用される。  [0813] Generally, electronic components such as a liquid crystal panel, a PDP (plasma display panel), an EL (fluorescent display) panel, and a pair-chip mounting are adhered and fixed to a circuit board and a circuit board, and both electrodes are electrically connected. Adhesive tape has been used as a method for doing this. Adhesive tapes are also used for lead fixing tapes for lead frames, LOC tapes, die-bonding tapes, adhesive films such as micro BGA and CSP, and are used to improve the overall productivity and reliability of semiconductor devices. Is done.
【0814】 特開 2001— 284005号公報には、 基材に接着材が塗布さ れた接着材テープをリール状に巻き取ったものが開示されている。  [0814] Japanese Patent Application Laid-Open No. 2001-284005 discloses an adhesive tape in which an adhesive is applied to a base material and wound on a reel.
【0815】 この種の従来の接着材テープは、 幅が 1〜 3 mm程度であり、 リ —ルに巻き取るテープの長さは 50m程度である。  [0815] This type of conventional adhesive tape has a width of about 1 to 3 mm, and the length of the tape wound around a reel is about 50 m.
【0816】 接着材テープを接着装置に装着する場合、 接着材テープのリール [0816] When attaching the adhesive tape to the adhesive device, the reel of the adhesive tape
(以下、単に「接着材リール」） を接着装置に取り付け、接着材テープの始端部を 引き出して、 卷取りリールに取り付ける。 そして、 接着材リールから卷き出され た接着材テープの基材側から加熱加圧へッドで接着剤を回路基板等に圧着し、 残 つた翻を卷取りリ一ルに卷き取っている。 (Hereinafter simply referred to as “adhesive reel”) to the adhesive device, and attach the starting end of the adhesive tape. Pull it out and attach it to the take-up reel. Then, the adhesive is pressure-bonded to a circuit board or the like from the base material side of the adhesive tape unwound from the adhesive reel using a heating and pressing head, and the remaining winding is wound on a winding reel. I have.
【0 8 1 7】 そして、 接着材リールの接着材テープが終了すると、 終了したリ —ルと、 基材を卷き取った卷取りリールを外し、 新たな接着材リールと新たな卷 取りリールをを接着装置に装着し、 接着材テープの始端を卷取りリールに取り付 けている。  [0 8 17] When the adhesive tape on the adhesive reel ends, the reel that has been finished and the take-up reel that has taken up the base material are removed, and a new adhesive reel and a new take-up reel Is attached to the bonding machine, and the starting end of the adhesive tape is mounted on the take-up reel.
【0 8 1 8】 しかし、 近年の P D P等におけるパネル画面の大型化にともない 回路基板の接着面積が増大し、 一度に使用する接着剤の使用量が増加してきた。 また、接着剤の用途も拡大したため、接着剤の使用量が増加してきた。このため、 電子機器の製造工場では、 接着材リールの交換頻度が多くなり、 接着材リールの 交換に手間がかかるため電子機器の生産効率の向上が図れないという問題がある 【0 8 1 9】 かかる問題に対して、 リールに卷き取る接着材テープの巻き数を 多くすることで、 1リール当りの接着剤量を増やし、 リールの交換頻度を低減す ることが考えられるが、 接着材テープの巻き数を増やすと、 リールの接着材テ一 プを巻いた径の寸法（以下、 「卷き径」 という） も大きくなり、 既存の接着装置に 装着し難く、 既存の接着装置が使用できなくなるおそれがある。  [0818] However, with the recent enlargement of panel screens in PDPs and the like, the bonding area of circuit boards has increased, and the amount of adhesive used at one time has increased. Also, the use of adhesives has expanded, and the amount of adhesives used has increased. For this reason, there is a problem that in an electronic device manufacturing plant, the frequency of exchanging the adhesive reel is increased, and the exchanging of the adhesive reel is troublesome, so that the production efficiency of the electronic device cannot be improved [0 8 19] To solve this problem, it is conceivable to increase the number of adhesive tapes wound on the reel, thereby increasing the amount of adhesive per reel and reducing the frequency of reel replacement. When the number of turns of the reel is increased, the diameter of the tape around which the adhesive tape is wound (hereinafter referred to as the “winding diameter”) becomes large, and it is difficult to mount the tape on an existing bonding apparatus, and the existing bonding apparatus can be used. It may disappear.
【0 8 2 0】 そこで、 請求の範囲第 6 5〜第 6 6項に記載された発明は、 接着 材テープの卷き径を大きくすることなく、 電子機器の生産効率の向上を図ること ができる接着材テープの形成方法の提供を目的とする。  [0820] Therefore, the invention described in claims 65 to 66 can improve the production efficiency of electronic devices without increasing the winding diameter of the adhesive tape. It is an object of the present invention to provide a method of forming an adhesive tape that can be used.
【0 8 2 1】 次に、 添付図面を参照しながら請求の範囲第 6 5〜第 6 6項に記 載された発明の実施の形態について説明する。 請求の範囲第 6 5〜第 6 6項に記 載された発明の第 1実施の形態について図 6 6 A及び図 6 6 B、図 6 7、図 6 8、 図 4、 図 2 9、 図 5を参照して説明する。 図 6 6 A及び図 6 6 Bは、 第 1実施の 形態にかかる接着材テープの接着材形成工程を示す図であり、 図 6 6 Aは各接着 材テ一プを重ね合わせて一体にし、 一方の基材を卷取り用のリールに卷取る工程 を示す ¾ϊ略図であり、 図 6 6 Βは図 6 6 Αにおける接着剤同士の重ね合わせ部分 を示す断面図であり、 図 6 7は接着装置における接着剤を被着体に形成する工程 を示す概略図であり、 図 6 8は接着材テープを巻いたリールの斜視図、 図 4は回 路基板同士の接着を示す断面図であり、 図 2 9は P D Pにおける接着剤の使用状 態を示す斜視図であり、 図 5は接着材テープの製造方法を示す工程図である。[0882] Next, embodiments of the invention described in claims 65 to 66 will be described with reference to the accompanying drawings. Regarding the first embodiment of the invention described in claims 65 to 66, FIGS. 66A and 66B, FIG. 67, FIG. 68, FIG. 4, FIG. 29, FIG. This will be described with reference to FIG. FIGS. 66A and 66B are diagrams showing an adhesive forming step of the adhesive tape according to the first embodiment, and FIG. The process of winding one of the substrates on a reel for winding FIG. 66 is a cross-sectional view showing an overlapped portion of the adhesives in FIG. 66, and FIG. 67 shows a step of forming the adhesive on the adherend in the bonding apparatus. Fig. 68 is a perspective view of a reel around which an adhesive tape is wound, Fig. 4 is a cross-sectional view showing the bonding between circuit boards, and Fig. 29 shows the use state of the adhesive in the PDP. FIG. 5 is a perspective view, and FIG. 5 is a process chart showing a method for manufacturing an adhesive tape.
【0 8 2 2】 接着材テープ 1はリール 3、 1 2 1にそれそれ巻かれており、 各 リール 3、 1 2 1には巻き芯 5と接着材テープ 1の両幅側に配置した側板 7とが 設けられている。 接着材テープ 1は、 基材 9と、 9の一側面に塗布された接 着剤 1 1とから構成されている。 [0 8 2 2] Adhesive tape 1 is wound around reels 3 and 1 2 1, respectively, and each reel 3 and 1 2 1 has side plates arranged on both width sides of core 5 and adhesive tape 1. 7 are provided. The adhesive tape 1 includes a base material 9 and an adhesive 11 applied to one side surface of the base material 9.
【0 8 2 3】 基材 9は、強度及び接着剤の剥離性の面から 0 P P (延伸ポリプロ ピレン）、 ポリテトラフルォロエチレン、 シリコン処理した P E T (ポリエチレン テレフ夕レート）などを用いるが、 これらに制限するものではない。  [0832] The base material 9 is made of 0 PP (stretched polypropylene), polytetrafluoroethylene, silicon-treated PET (polyethylene terephthalate) or the like from the viewpoint of strength and adhesive releasability. However, it is not limited to these.
【0 8 2 4】 接着剤 1 1は、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹 脂と熱硬化性樹脂の混合系が用いられている。 かかる樹脂の代表的なものには熱 可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性 樹脂系としてはエポキシ樹脂系、ァクリル樹脂系、シリコン樹脂系が用いられる。 [0832] As the adhesive 11, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used. Typical examples of such a resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type, an acryl resin type, and a silicon resin type as a thermosetting resin type.
【0 8 2 5】 接着剤 1 1には、 導電粒子 1 3が分散されていても良い。 導電粒 子 1 3としては、 A u， A g , P t , N i , C u， W， S b、 S n , はんだなど の金属粒子や力一ボン、 黒鉛などがあり、 これら及び/または非導電性のガラス、 セラミックス、 プラスチック等の高分子核材等に、 前記した導電層を被覆等によ り形成したものでもよい。 さらに前記したような導電粒子を絶縁層で被覆してな る絶縁被覆粒子や、 導電粒子と絶縁粒子の併用等も適用可能である。 はんだ等の 熱溶融金属や、 プラスチック等の高分子核材に導電層を形成したものは、 加熱加 圧もしくは加圧により変形性を有し、 接続後の電極間の距離が減少し、 接続時に 回路との接触面積が増加し信頼性が向上するので好ましい。 特に高分子類を核と した場合、 はんだのように融点を示さないので軟化の状態を接続温度で広く制御 でき、 電極の厚みや平坦性のばらつきに対応し易い接続部材が得られるのでより 好ましい。 [0825] In the adhesive 11, conductive particles 13 may be dispersed. Examples of the conductive particles 13 include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, solder, graphite, and the like. The conductive layer may be formed by coating the conductive layer on a polymer core material such as non-conductive glass, ceramics, or plastic. Further, insulating coated particles obtained by coating the above-described conductive particles with an insulating layer, a combination of conductive particles and insulating particles, and the like are also applicable. When a conductive layer is formed on a hot-melt metal such as solder or a polymer nucleus material such as plastic, it is deformable by heating or pressing, the distance between electrodes after connection decreases, This is preferable because the contact area with the circuit is increased and the reliability is improved. Especially when polymers are used as cores, they do not show a melting point like solder, so the state of softening can be widely controlled by the connection temperature This is more preferable because a connection member that can easily cope with variations in electrode thickness and flatness can be obtained.
【0 8 2 6】 次に、 本実施の形態にかかる接着材テープの使用方法について説 明する。 図 6 6 Aに示すように、 接着装置 1 5には 2つの接着材テープ 1のリ一 ル 3、 1 2 1と、 卷取り用のリール 1 7、 1 8とを装着し、 一方のリール 3に卷 いた接着材テープ 1の先端をガイドビン 2 2に掛けて一方の卷取りリール 1 7に 取り付け、接着材テープ 1を繰り出す（図 6 6 A中矢印 E )。 また、他方のリール 1 2 1に卷いた接着材テープ 1の先端も他方の卷取りリール 1 8に取り付け、 接 着材テープ 1を繰り出す。  Next, a method of using the adhesive tape according to the present embodiment will be described. As shown in FIG. 66A, the bonding apparatus 15 is equipped with reels 3 and 12 of two adhesive tapes 1 and reels 17 and 18 for winding, and one of the reels. The tip of the adhesive tape 1 wound on 3 is hung on the guide bin 22 and attached to one of the take-up reels 17 to feed out the adhesive tape 1 (arrow E in FIG. 66A). The tip of the adhesive tape 1 wound on the other reel 12 1 is also attached to the other take-up reel 18, and the adhesive tape 1 is paid out.
【0 8 2 7】 リール 3、 1 2 1から繰り出された接着材テープ 1は、リール 3、 1 2 1と加熱加圧へヅド 1 9との間に配置された圧着ローラ 1 2 2によって、 そ れそれの接着材テープ 1を重ね合わせて一体にする。 そして、 他方の接着材テー プ 1の基材 9を、 卷取りリーレ 1 8に卷き取る。  [0827] The adhesive tape 1 fed from the reels 3, 1 2 1 is pressed by the pressure roller 1 2 2 disposed between the reels 3, 1 2 1 and the heating / pressing head 19. The adhesive tapes 1 are overlapped and integrated. Then, the base material 9 of the other adhesive tape 1 is wound on a winding reel 18.
【0 8 2 8】 そして、 回路基板 2 1上に一方の接着材テープ 1を配置して、 加 熱加圧へッド 1 9で接着材テープ 1を基材 9側から圧接し、 接着剤 1 1を被着体 である回路基板 2 1に圧着して形成する。 その後、 基材 9を卷取りリール 1 7に 巻き取る。  [0832] Then, one adhesive tape 1 is arranged on the circuit board 21, and the adhesive tape 1 is pressed from the base material 9 side by the heating and pressurizing head 19, and the adhesive is applied. 11 is formed by crimping the circuit board 21 as an adherend. Thereafter, the base material 9 is wound on a take-up reel 17.
【0 8 2 9】 次に、 図 4に示すように、 回路基板 2 1に圧着された接着剤 1 1 に配線回路 （又は電子部品） 2 3を配置して、 クッション材としてポリテトラフ ルォロエチレン材 2 4を介して加熱加圧へヅド 1 9により配線回路 2 3を回路基 板 2 1に加熱加圧する。 これにより回路基板 2 1の電極 2 l aと配線回路 2 3の 電極 2 3 aとを接続する。  Next, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is placed on the adhesive 11 crimped on the circuit board 21, and a polytetrafluoroethylene material 2 is used as a cushion material. The wiring circuit 23 is heated and pressed to the circuit board 21 by the heating and pressing head 19 via 4. Thereby, the electrode 2 la of the circuit board 21 is connected to the electrode 23 a of the wiring circuit 23.
【0 8 3 0】 図 2 9は、 本実施の形態による接着材テープ 1を用いた P D P 2 6の接続部分を示しており、 接着剤 1 1は P D P 2 6の周囲全体に亘り圧着して おり、 一度に用いる接着剤 1 1の使用量が従来に比較して格段に多くなることが 明らかである。 したがって、 リール 3、 1 2 1に卷いた接着材テープ 1の使用量 も多くなり、 リール 3、 1 2 1に卷いた接着材テープ 1は比較的短時間で卷取り リール 1 7、 1 8に巻き取られる。 FIG. 29 shows a connection portion of the PDP 26 using the adhesive tape 1 according to the present embodiment, and the adhesive 11 is press-bonded over the entire periphery of the PDP 26. Thus, it is clear that the amount of the adhesive 11 used at one time is much larger than in the past. Therefore, the amount of adhesive tape 1 wound on reels 3 and 1 2 1 The adhesive tape 1 wound on the reels 3, 12 1 is wound up on the winding reels 17, 18 in a relatively short time.
【0 8 3 1】 この実施の形態では、 回路基板 2 1に接着剤 1 1を圧着する直前 の工程で、 一方の接着材テープ 1の接着剤 1 1と、 他方の接着材テープ 1の接着 剤 1 1とを重ね合わせて、 所望の接着剤 1 1の厚さにしてから回路基板 2 1に接 着剤 1 1を圧着するので、 それそれの接着材テープ 1の厚さを半分にすることが できる。従って、 1リールあたりの接着材テープ 1の卷き数を増やすことができ、 1回の交換作業で使用可能な接着剤量を大幅に増やすことができる。 よって、 新 たな接着材テープ 1の交換作業が少なくて済み、 電子機器の生産効率が高まる。 【0 8 3 2】 ここで、 図 5を参照して本実施の形態にかかる接着材テープの製 造方法について説明する。  In this embodiment, in the process immediately before the bonding of the adhesive 11 to the circuit board 21, the bonding of the adhesive 11 of one adhesive tape 1 and the bonding of the other adhesive tape 1 is performed. The adhesive 1 1 is overlaid to make the desired thickness of the adhesive 1 1, and then the adhesive 1 1 is pressed onto the circuit board 2 1, so that the thickness of each adhesive tape 1 is halved be able to. Therefore, the number of windings of the adhesive tape 1 per reel can be increased, and the amount of adhesive usable in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape 1 is reduced, and the production efficiency of electronic devices is increased. [0832] Here, a method of manufacturing the adhesive tape according to the present embodiment will be described with reference to FIG.
【0 8 3 3】 卷出機 2 5から卷きだされた基材 （セパレー夕） にコ一夕一 2 7 により、 樹脂と導電粒子 1 3が混合された接着剤 1 1を '通常の略半分の厚さに塗 布し、 乾燥炉 2 9で乾燥した後、 卷取機 3 1で原反を巻き取る。 卷き取られた接 着材テープ 1の原反は、 スリツ夕 3 3により所定幅に切断されて卷き芯 5に卷き 取れられた後、 卷き芯 5に側板 7、 7が両側から装着されて、 除湿材とともに梱 包され、 好ましくは低温 （一5 °C〜一 1 0 °C) に管理されて出荷される。 尚、 接 着材テープ 1は、 接着剤 1 1に後述する硬ィ匕剤を含むものであっても良い。 【0 8 3 4】 次に、 請求の範囲第 6 5〜第 6 6項に記載された発明の他の実施 の形態について説明するが、 以下に説明する実施の形態では上述した実施の形態 と同一の部分には同一の符号を付すことによりその部分の詳細な説明を省略し、 以下では上述した実施の形態と異なる点を主に説明する。  [0 8 3 3] The adhesive 11 mixed with the resin and conductive particles 13 is applied to the base material (separation material) unwound from the unwinding machine 25 by the co-existing one 27 as shown in the following. It is applied to a half thickness, dried in a drying oven 29, and then wound up by a winder 31. The raw material of the wound adhesive tape 1 is cut into a predetermined width by a slit 33 and wound on a winding core 5, and then the side plates 7, 7 are wound on the winding core 5 from both sides. Attached, packaged with dehumidifying material, and shipped at a controlled low temperature (15 ° C to 110 ° C). Note that the adhesive tape 1 may include a bonding agent described later in the adhesive 11. Next, another embodiment of the invention described in claims 65 to 66 will be described. However, in the embodiments described below, The same portions are denoted by the same reference numerals, and detailed description of those portions will be omitted. Hereinafter, differences from the above-described embodiment will be mainly described.
【0 8 3 5】 図 6 9 Aに示す第 2実施の形態では、 接着剤 1 1 aに硬化剤及び 導電粒子 1 3を含有する接着材テープ 1 aと、 硬化剤及び導電粒子 1 3を含有し ない接着材テープ 1 bの両方の製造を行い、 図 6 9 Aに示すように硬化剤等を含 有する接着材テープ 1 aと硬化剤等を含有しない接着材テープ 1 bとを重ね合わ せて一体にし、 重ね合わせたものを回路基板 2 1に圧着するようにしても良い。 この場合、 一方の接着材テープ 1 aの接着剤 1 1 aのみに硬化剤を含有している ので、他方の接着材テープ 1 bの接着剤 1 1 bには硬化剤が不要となる。従って、 硬ィ匕剤を含まない接着剤 1 1 bの接着材テープ 1 bは、 低温管理が不要となる。 よって、 低温管理の必要な接着材テープ 1 aの数を減らすことができ、 接着材テ —プの輸送、 保管の効率的管理を行うことができる。 In the second embodiment shown in FIG. 69A, an adhesive tape 1a containing a curing agent and conductive particles 13 in an adhesive 11a, and a curing agent and conductive particles 13 Both adhesive tapes 1b containing no hardener were manufactured, and adhesive tape 1a containing a hardener and other adhesive tapes 1b were stacked as shown in Fig. 69A. Alternatively, they may be integrated, and the stacked products may be pressure-bonded to the circuit board 21. In this case, since only the adhesive 11a of one adhesive tape 1a contains a curing agent, the adhesive 11b of the other adhesive tape 1b does not require a curing agent. Therefore, the adhesive tape 1b of the adhesive 11b containing no stiffener does not require low-temperature management. Therefore, the number of the adhesive tapes 1a that need to be controlled at a low temperature can be reduced, and the transport and storage of the adhesive tape can be efficiently controlled.
【0 8 3 6】 尚、 接着剤がエポキシ樹脂系の場合、 エポキシ樹脂の硬ィ匕剤とし ては、 イミダゾ一ル系、 ァミンイミド、 ォニゥム塩、 ポリアミン類、 ポリメルカ プ夕ン等が挙げられる。  [0832] When the adhesive is an epoxy resin, imidazole, amide imide, hondium salt, polyamines, polymercapone, and the like can be given as examples of epoxy resin stiffeners.
【0 8 3 7】 また、 図 6 9 Bに示すように、 硬化剤を含んだ一方の接着材テ一 プ l aの接着剤 1 1 aに導電粒子 1 3が含まれ 2層構成になっており、 圧着され る側に導電粒子が含まれていないため樹脂の流動とともに導電粒子が相対峙する 回路間から流れ出てしまうことなくなり、 加熱加圧の際に導電粒子 1 3を電極 2 1 aと電極 2 3 aとの間で確実に保持できる。  [0832] As shown in Fig. 69B, the adhesive 11a of one adhesive tape la containing a curing agent contains conductive particles 13 and has a two-layer structure. Since the conductive particles are not contained on the side to be crimped, the conductive particles do not flow out from between the circuits facing each other with the flow of the resin, and the conductive particles 13 and the electrode 21 a are heated and pressurized. It can be reliably held between the electrode 23a.
【 0 8 3 8】 請求の範囲第 6 5〜第 6 6項に記載された発明は、 上述した実施 の形態に限らず、 請求の範囲第 6 5〜第 6 6項に記載された発明の要旨を逸脱し ない範囲で種々変形可能である。  [0838] The invention described in claims 65 to 66 is not limited to the above-described embodiment, but may be any of the inventions described in claims 65 to 66. Various modifications can be made without departing from the gist.
【0 8 3 9】 第 1実施の形態では、 接着剤 1 1に導電粒子 1 3を含むようにし たが、 導電粒子 1 3を含まない接着剤 1 1であっても良い。  [0838] In the first embodiment, the adhesive 11 includes the conductive particles 13; however, the adhesive 11 may not include the conductive particles 13.
【0 8 4 0】 上記では、 電子部品と回路基板、 回路基板同士を接着固定するす る場合について説明したが、 リードフレームの固定用支持基板やリードフレ一ム のダイ、 半導体素子搭載用支持基板に半導体素子 （チップ） を接着 '固定する半 導体装置についても同様に行うことができる。  [0840] In the above, the case where the electronic component and the circuit board and the circuit boards are bonded and fixed has been described. However, the support substrate for fixing the lead frame, the die of the lead frame, and the support substrate for mounting the semiconductor element are provided. The same can be applied to a semiconductor device in which a semiconductor element (chip) is adhered and fixed.
【 0 8 4 1】 次に、 請求の範囲第 6 7〜第 7 2項に記載された発明について説 明する。  [0884] Next, the invention described in claims 67 to 72 will be described.
【0 8 4 2】 これらの発明は、例えば液晶パネル、 P D Pパネル、 E Lパネル、 ペアチップ実装などの電子部品と回路板、 回路板同士を接着固定すると共に、 両 者の電極同士を電気的に接続する異方導電材を供給するための異方導電材テープ に関し、 特に異方導電材の卷き形態に関する。 [0884] These inventions include, for example, liquid crystal panels, PDP panels, EL panels, An anisotropic conductive material tape for bonding and fixing electronic components such as pair chip mounting to a circuit board and circuit boards, and for supplying an anisotropic conductive material for electrically connecting both electrodes. It relates to the winding form of the material.
【0 8 4 3】 次に、 請求の範囲第 6 7〜第 7 2項に記載された発明の背景技術 について説明する。  [0884] Next, the background art of the invention described in claims 67 to 72 will be described.
【0 8 4 4】 異方導電材テ一プによる電子部品と回路板、 回路板同士の接続方 法として、 相対峙する電極間にフィルム状の接着剤である異方導電材を挟み、 カロ 熱加圧することにより電子部品と回路板、 回路板同士の接続を行うことがなされ ている。 フィルム状の接着剤中には、 電極間の導通を得る為の導電粒子が混合さ れ、 樹脂としては、 熱可塑性樹脂、 熱硬化性樹脂、 または熱可塑性樹脂と熱硬化 性樹脂の混合系、 光硬化性樹脂が用いられている （例えば、 特開昭 5 5— 1 0 4 0 0 7号公報参照)。  [0884] As a method of connecting an electronic component to a circuit board or a circuit board using an anisotropic conductive material tape, an anisotropic conductive material, which is a film adhesive, is interposed between electrodes facing each other. The connection between electronic components and circuit boards and between circuit boards is performed by applying heat and pressure. The film-like adhesive is mixed with conductive particles for obtaining conduction between the electrodes. As the resin, a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin, A photocurable resin is used (for example, refer to Japanese Patent Application Laid-Open No. 55-14007).
【0 8 4 5】 また、 導電粒子を含まず、 樹脂のみからなる異方導電材を用いた 回路接続方法も知られている （例えば、 特開昭 6 0 - 2 6 2 4 3 0号公報参照）。 [0845] Also, a circuit connection method using an anisotropic conductive material made of resin alone without conductive particles is known (for example, Japanese Patent Application Laid-Open No. 60-26243). reference).
【0 8 4 6】 樹脂の代表的なものには熱可塑性樹脂系としてスチレン樹脂系、 ポリエステル樹脂系があり、 また熱硬化性樹脂系としてはエポキシ樹脂系、 シリ コーン樹脂系、 アクリル樹脂系が知られている。 熱可塑性樹脂系、 熱硬化性樹脂 系共に接続する為に、 加熱加圧が必要である。 熱可塑性樹脂系では樹脂を流動さ せ被着体との密着力を得る為に、 また熱硬化性樹脂系では更に樹脂の硬ィヒ反応を 行う為である。 近年、 接続信頼性の面から、 熱可塑性樹脂と熱硬化性樹脂の混合 系、 熱硬化性樹脂系が主流となっている。 また、 低温度で接続することのできる 光硬化樹脂系も工業的に用いられ始めている。 [0864] Typical resins include styrene resin and polyester resin as thermoplastic resins, and epoxy resin, silicone resin, and acrylic resin as thermosetting resin. Are known. Heating and pressurizing is required to connect both thermoplastic resin type and thermosetting resin type. This is because in the case of a thermoplastic resin system, the resin is allowed to flow to obtain an adhesion to an adherend, and in the case of a thermosetting resin system, the resin is further subjected to a hard reaction. In recent years, from the viewpoint of connection reliability, a mixed system of a thermoplastic resin and a thermosetting resin and a thermosetting resin system have become mainstream. Also, photocurable resin systems that can be connected at low temperatures have begun to be used industrially.
【0 8 4 7】 また近年、 被接続体の反り及び伸びを防く、ために異方導電材の接 続時の接続温度の低温化が要求されている。 また、 異方導電材の接続用途の拡大 や液晶パネル、 P D Pパネル、 E Lパネル、 ベアチヅプ実装などの需要拡大に伴 い接続時のタクトタイムの短時間化の要求が、 強くなされるようになつている。 【0 8 4 8】 また、 異方導電材の接続需要及ぴ用途の拡大に伴い、 短時間接続 のみならず、 生産性向上が要求されている。 液晶パネル、 P D Pパネル、 E Lパ ネル、 ベアチップ実装などの需要拡大により、 異方導電材の使用量は増加してい る。 一方、 液晶パネルの大画面及び P D Pパネルなど大画面フラットパネルの需 要拡大に伴い、異方導電材の L枚のパネルに使用される使用量も増加した。従来、 異方導電材は、 断面が円形の芯材にフィルム状の接着剤を巻き重ねたリール形状 で供給されており、 リ一ルの取り替え時間が生産性向上を妨げていた。 [0847] In recent years, in order to prevent warpage and elongation of a connected body, a lower connection temperature at the time of connecting an anisotropic conductive material has been required. In addition, demands for shorter tact time at the time of connection have been increasing with the expansion of connection applications for anisotropic conductive materials and the growing demand for LCD panels, PDP panels, EL panels, and bare chip mounting. I have. [0884] Also, with the expansion of connection demand and application of anisotropic conductive material, not only short-time connection but also improvement in productivity is required. Due to growing demand for LCD panels, PDP panels, EL panels, bare chip mounting, etc., the use of anisotropic conductive materials is increasing. On the other hand, as the demand for large LCD flat panels and large-screen flat panels such as PDP panels increased, the amount of anisotropic conductive materials used for L panels also increased. Conventionally, the anisotropic conductive material has been supplied in the form of a reel in which a film-shaped adhesive is wound on a core material having a circular cross section, and the time required to replace the reel has hindered an improvement in productivity.
【0 8 4 9】 一方、 液晶パネルの狭額縁化に伴い、 異方導電材の狭幅化が進ん でおり、 従来の同一円芯状に卷いたリール形状では卷崩れが発生し、 製造上のェ 程内歩留が悪化していた。  [0849] On the other hand, the width of the anisotropic conductive material has been narrowing along with the narrowing of the frame of the liquid crystal panel, and in the conventional reel shape wound in the same circular core, the winding collapse has occurred. The yield in the process was deteriorating.
【0 8 5 0】 請求の範囲第 6 7〜第 7 2項に記載された発明は、 上記欠点に鑑 みなされたもので、 リールの取り替え時間の間隔を長くし、 また卷き崩れによる 作業性の低下をなくして生産性の向上に寄与する異方導電材テ一プを提供するこ とを目的とした。  The invention described in claims 67 to 72 has been made in view of the above-described drawbacks, and has an advantage in that the interval between reel replacement times is lengthened, and the work due to collapse of the reel is performed. An object of the present invention is to provide an anisotropic conductive material tape that contributes to an improvement in productivity by eliminating a decrease in productivity.
【0 8 5 1】 次に、 請求の範囲第 6 7〜第 7 2項に記載された発明の実施形態 について説明する。  [0851] Next, embodiments of the invention described in claims 67 to 72 will be described.
[ 0 8 5 2 ] 図 7 0は、 請求の範囲第 6 7〜第 7 2項に記載された発明の第 1 実施形態を示す模式図である。  [0852] FIG. 70 is a schematic view showing a first embodiment of the invention described in claims 67 to 72.
【0 8 5 3】 図 7 0に示すように、 本実施形態の異方導電材テープは、 フィル ム状の接着剤 1 1と両面を剥離処理した基材フィルム （基材） 9の 2層構造から なる異方導電材を芯材 5の長手方向に多数回糸巻き状に卷き積層してなるもので あり、 図 7 0には、 異方導電材の供給形態が示されている。 図 7 0においては、 芯材 5の両端部にそれそれ側板 7が設けられている。なお、異方導電材テープは、 基材フィルム 9と基材フィルム 9上に塗布された異方導電材であるフィルム状接 着剤 1 1とからなり、 異方導電材テ一プにおいては、 高精細化された電子部品の 接続に用いられるため無機及び有機物の異物及び汚染を防く、ために、 基材フィル ム 9が接着剤の外側となっている。 [0853] As shown in FIG. 70, the anisotropic conductive material tape of the present embodiment has two layers of a film-like adhesive 11 and a base film (base material) 9 having both surfaces peeled off. It is formed by winding and laminating an anisotropic conductive material having a structure in a number of turns in the longitudinal direction of the core material 5, and FIG. 70 shows a supply form of the anisotropic conductive material. In FIG. 70, side plates 7 are provided at both ends of the core material 5. The anisotropic conductive material tape is composed of a base film 9 and a film-like adhesive 11 which is an anisotropic conductive material applied on the base film 9, and in the anisotropic conductive material tape, It is used to connect high-definition electronic components, and prevents inorganic and organic foreign substances and contamination. 9 is outside the adhesive.
【0 8 5 4】 異方導電材を用いた接続は、 タクトタイムの向上が求められてお り、 異方導電材の迅速な転写性が要求されている。 上記のように異方導電材を側 板 7の付いた芯材 （卷き芯） 5の長手方向に多数回卷き積層して糸卷き状に卷く ことにより、 巻崩れのない、 長尺の異方導電材の供給が可能である。 このため、 異方導電材テープの取り替え時間の間隔を長くすることができ、 生産性の向上が 可能となる。  [0854] For connection using an anisotropic conductive material, improvement in tact time is required, and rapid transferability of the anisotropic conductive material is required. As described above, the anisotropic conductive material is wound many times in the longitudinal direction of the core material (winding core) 5 with the side plate 7 and laminated and wound into a thread-like shape, so that it does not collapse. It is possible to supply an anisotropic conductive material having a length. For this reason, the time interval for replacing the anisotropic conductive material tape can be lengthened, and productivity can be improved.
【0 8 5 5】 上記異方導電材テープにおいては、 基材フィルム 9の引張り強度 は、 1 2 k g/mm2以上とし、 基材フィルム 9の破断伸びは 6 0〜 2 0 0 %に することが好ましい。 これにより、 基材フィルム 9が強度を持ち、 伸びが小さい ため、 異方導電材を構成するフィルム状接着剤 1 1を回路基板等の接続部材に転 写する前のプロセスにおいて、 フィルム状接着剤 1 1が伸びたり、 厚みが薄くな つたり、 幅が細くなつたりすることを防止できる。 また、 基材フィルム 9の厚み はハンドリング及び環境面から考えると 1 0 0 zm以下が望ましい。 基材フィル ム 9が薄いと上記効果に劣るようになるので基材フィルム 9の厚さは 0 . 5μπι 以上とするのが好ましい。 [0 8 5 5] In the anisotropic conductive material tape, the tensile strength of the substrate film 9, and 1 2 kg / mm 2 or more, elongation at break of the substrate film 9 to 6 0-2 0 0% Is preferred. As a result, since the base film 9 has strength and has small elongation, the film adhesive 11 constituting the anisotropic conductive material is not transferred to the connection member such as a circuit board in the process of transferring the film adhesive. It is possible to prevent stretch, thinness, and narrow width of 1 1. The thickness of the base film 9 is desirably 100 zm or less from the viewpoint of handling and environment. If the thickness of the base film 9 is thin, the above-described effects are inferior. Therefore, the thickness of the base film 9 is preferably 0.5 μπι or more.
【0 8 5 6】 さらに、 上記異方導電材テープに用いられる基材フィルム 9とし ては、 強度及び異方導電材を構成する接着剤の剥離性の面からシリコン及びフッ 素剥離処理した Ρ Ρ (ポリプロピレン）、 〇 Ρ Ρ (延伸ポリプロピレン）、 Ρ Ε Τ (ポ リエチレンテレフ夕レート）などを用いるが、 これらに制限するものではない。 【0 8 5 7】 基材フィルム 9の剥離処理は、 シリコンまたはフッ素処理を行う ことにより容易に行うことができ、 基材フィルム 9の片面にのみ剥離処理を行う と、 フィルム 9の表裏において離型性に差を設けることができ、 基材フィル ム 9に対する背面転写を防止することができる。 また、 基材フィルム 9の両面に 剥離処理を行う場合には、 フィルム状接着剤 1 1面に対してシリコン及びフッ素 処理を行い、 フィルム状接着剤 1 1面に剥離性を持たせるようにする。 【0 8 5 8】 フィルム状の接着剤 1 1としては、 高信頼性を有する熱硬化性樹 脂系であるエポキシ樹脂系、 接着剤の低応力化を図り、 接着剤の相溶性に効果の あるシリコーン樹脂系、これらより更に低温度'短時間で接続することが可能なラ ジカル系のものが使用されるが、 フィルム状の接着剤 1 1は、 これらに制限され るものではない。 ラジカル系の接着剤 1 1としては、 主にアクリル系接着剤が使 用される。 [0856] Further, as the base film 9 used for the anisotropic conductive material tape, silicon and fluorine were peeled from the surface of the strength and the releasability of the adhesive constituting the anisotropic conductive material. Ρ (polypropylene), 〇 Ρ 延伸 (stretched polypropylene), Ρ Ε ポ (polyethylene terephthalate), etc. are used, but are not limited to these. [0857] The peeling treatment of the base film 9 can be easily performed by performing a silicon or fluorine treatment. If the peeling treatment is performed only on one side of the base film 9, the peeling treatment is performed on both sides of the film 9. It is possible to provide a difference in moldability, and it is possible to prevent the back surface transfer to the base film 9. In the case where both surfaces of the base film 9 are subjected to a release treatment, one surface of the film adhesive 11 is subjected to a silicon and fluorine treatment so that the one surface of the film adhesive 11 has releasability. . [0858] The film-shaped adhesive 11 is made of epoxy resin, which is a highly reliable thermosetting resin, and is designed to reduce the stress of the adhesive and to improve the compatibility of the adhesive. A certain silicone resin type, a radical type that can be connected at a lower temperature and in a shorter time than these, is used, but the film-like adhesive 11 is not limited to these. As the radical adhesive 11, an acrylic adhesive is mainly used.
【0 8 5 9】 図 7 1は、 請求の範囲第 6 7〜第 7 2項に記載された発明の第 2 実施形態を示す模式図である。 なお、 図 7 1において、 図 7 0と同一の構成要素 には同一の符号を付して詳細な説明を省略する。  [0859] Fig. 71 is a schematic diagram illustrating a second embodiment of the invention described in claims 67 to 72. In FIG. 71, the same components as those in FIG. 70 are denoted by the same reference numerals, and detailed description will be omitted.
【0 8 6 0】 本実施形態の異方導電材テ一プは、 図 7 1に示すように、 基材フ イルムを 2種類有し、 これらによって接着剤を挟むように構成した異方導電材を 用いた以外は第 1実施形態の異方導電体テープと同様の構成を有する。 即ち本実 施形態における異方導電材は、 図 7 1に示したように、 フィルム状の接着剤 1 1 と接着剤 1 1面を剥離処理した 2種の基材 9 a， 9 bの 3層構造からなる。 【0 8 6 1】 異方導電材を構成する接着剤が柔らかい場合、 卷き芯側の次の基 材フィルムによる接着剤の変形を防止することができる。  As shown in FIG. 71, the anisotropic conductive material tape of the present embodiment has two types of base films and is configured to sandwich an adhesive therebetween. Except for using the material, it has the same configuration as the anisotropic conductor tape of the first embodiment. That is, as shown in FIG. 71, the anisotropic conductive material in the present embodiment is composed of a film-like adhesive 11 and two kinds of base materials 9 a and 9 b obtained by peeling off the surface of the adhesive 11. It has a layer structure. [0861] When the adhesive constituting the anisotropic conductive material is soft, deformation of the adhesive by the next base film on the winding core side can be prevented.
【0 8 6 2】 さらに、 基材フイルム 9 a , 9 bの物性値である基材フィルム 9 a , 9 bの引張り強度を 1 2 k gZmm2以上とし、 基材フィルム 9 a , 9 bの 破断伸びを 6 0〜2 0 0 %にすることが好ましいのは第 1実施形態の場合と同様 である。 これにより、 基材フィルム 9 a , 9 bに物理的強度が得られ、 フィルム 状の接着剤の伸びに伴う、 薄膜化、 幅方向に細くなることを防ぐことが可能であ る。 また、 基材 9 a， 9 bの厚みは 1 0 0 zm以下にすることが好ましく、 これ により、 ハンドリング及び環境面での対応が可能である。 [0 8 6 2] In addition, the tensile strength of the substrate film 9 a, 9 b is a physical property value of the substrate film 9 a, 9 b and 1 2 k gZmm 2 or more, the substrate film of 9 a, 9 b It is the same as in the first embodiment that the breaking elongation is preferably set to 60 to 200%. Thereby, physical strength is obtained in the base films 9a and 9b, and it is possible to prevent the base film 9a and 9b from becoming thinner and becoming thinner in the width direction due to the elongation of the film-like adhesive. Further, the thickness of the base materials 9a and 9b is preferably set to 100 zm or less, so that handling and environmental measures can be taken.
【0 8 6 3】 なお、 上記第 1及び第 2実施形態において、 異方導電材を構成す るフィルム状の接着剤 1 1が、 粘着性がなく、 プロヅキング現象を示さないもの であればフィルム状の接着剤 1 1を基材フイルム 9又は 9 a , 9 b無しで単独で 糸巻き状に巻くことができる。 [0863] In the first and second embodiments, if the film-like adhesive 11 constituting the anisotropic conductive material has no tackiness and does not show a blocking phenomenon, a film may be used. Adhesive 1 1 alone without base film 9 or 9a, 9b It can be wound in a pincushion shape.
【0 8 6 4】 次に実施例を説明するが、 請求の範囲第 6 7〜第 7 2項に記載さ れた発明はこれらの実施例に制限されるものではない。  [0864] Next, examples will be described, but the invention described in claims 67 to 72 is not limited to these examples.
(実施例 1 )  (Example 1)
( 1 )異方導電材フィルムの作製  (1) Preparation of anisotropic conductive material film
【0 8 6 5】 酢酸ェチルの 3 0重量％溶液を作製し、 これに平均粒径 2 . 5 μ mの N i粉を 5体積％添加した。 そして、 上記酢酸ェチル溶液に、 フィルム形成 材としてフエノキシ樹脂 （高分子量エポキシ樹脂） 5 0 g、 エポキシ樹脂 2 0 g 及びイミダゾール 5 gを添加し、 接着剤形成用溶液を得た。 一方、 薄く青色に着 色した透明な厚み 5 Ομπιのポリエチレンテレフ夕レートフィルム （破断強度 2 5 k g/mm2、 破断伸び 1 3 0 %) の両面にシリコン処理した基材フィルムを 用意した。 そして、 この基材フィルムの片面にロールコ一夕を用いて上記の溶液 を塗布し、 1 1 0 °Cで、 5分間乾燥し、 厚み 5 Ομπιの異方導電材フィルムの卷 物を得た。 A solution of 30% by weight of ethyl acetate was prepared, and 5% by volume of Ni powder having an average particle size of 2.5 μm was added thereto. Then, 50 g of a phenoxy resin (high-molecular-weight epoxy resin), 20 g of an epoxy resin and 5 g of imidazole were added as a film-forming material to the above-mentioned ethyl acetate solution to obtain a solution for forming an adhesive. On the other hand, a base film was prepared on both sides of a transparent polyethylene terephthalate film (break strength: 25 kg / mm 2 , elongation at break: 130%) with a transparent blue color and a thickness of 5 μμπι. Then, the above solution was applied to one surface of the base film using a roll coater and dried at 110 ° C. for 5 minutes to obtain a roll of an anisotropic conductive material film having a thickness of 5 μμπι.
( 2 ) 異方導電材テープの作製  (2) Production of anisotropic conductive material tape
【0 8 6 6】 上記の異方導電材フィルムの巻物を幅 1 . 5 mmにスリヅトしな がら、 側板のついた直径 4 8 mm、 幅 1 0 0 mmの芯材 （卷き芯） の長手方向に 多数回卷いて積層し糸巻き状に卷くことにより、 3 0 0 mの長さの異方導電材テ —プを得た。  [0866] While slitting the above-mentioned scroll of anisotropic conductive material film to a width of 1.5 mm, a core material (winding core) with a side plate with a diameter of 48 mm and a width of 100 mm was used. By winding a large number of turns in the longitudinal direction, laminating and winding into a thread form, an anisotropic conductive material tape having a length of 300 m was obtained.
【0 8 6 7】 この糸巻き状に卷いてなる異方導電材、 即ち異方導電材テープを 異方導電材テープ圧着自動機に取付け、 異方導電材を供給した場合、 異方導電材 の転写性及び伸び試験において良好な結果が得られ、 しかも、 リールの取付け回 数が減り、 取付けに要する時間や転写性、 接着剤の伸びに起因する貼付け作業の 繰り返しがなくなり、 これらの効果により生産性が向上した。  [0 8 6 7] The anisotropic conductive material wound in a thread form, that is, the anisotropic conductive material tape is attached to an automatic anisotropic conductive material tape crimping machine, and when the anisotropic conductive material is supplied, the anisotropic conductive material is removed. Good results were obtained in the transferability and elongation tests.Moreover, the number of reel installations was reduced, and the time required for installation, transferability, and repetition of the sticking work due to adhesive elongation were eliminated. Improved.
(実施例 2 )  (Example 2)
【0 8 6 8】 実施例 1と同様に異方導電材テープの巻き物を作製した。そして、 基材フィルムと接着剤の積層体に、 さらにもう 1種類の厚み 2 5〃mのポリェチ レンテレフ夕レート基材フィルム （破断強度 2 5 k gノ mm 2、 破断伸び 1 3 0 %) を、 2つの基材フィルムで接着剤を挟むようにラミネートして 3層構造の 異方導電材フィルムの巻き物を得た。 そして、 実施例 1と同様にしてこのフィル ムの巻き物を幅 1 . 5 mmにスリヅトしながら、 側板のついた直径 4 8 mm、 幅 1 0 0 mmの芯材 （卷き芯） に糸卷き状に卷くことにより、 3 0 0 mの長さの異 方導電材テープを得た。 [0867] In the same manner as in Example 1, a roll of anisotropic conductive material tape was produced. And The laminate of the substrate film and the adhesive, yet the other one of thickness 2 5〃M Poryechi Renterefu evening rate base film (breaking strength 2 5 kg Roh mm 2, elongation at break 1 3 0%), and two Lamination was carried out so as to sandwich the adhesive between the base films to obtain a roll of anisotropic conductive material film having a three-layer structure. In the same manner as in Example 1, the roll of this film is slit to a width of 1.5 mm, and is wound on a core material (winding core) having a side plate with a diameter of 48 mm and a width of 100 mm. By winding in a square shape, an anisotropic conductive material tape having a length of 300 m was obtained.
【0 8 6 9】 実施例 2においても実施例 1と同様に良好な生産性が得られた。 (実施例 3 )  [0867] In Example 2, as in Example 1, good productivity was obtained. (Example 3)
【0 8 7 0】 実施例 1と同様であるが基材フィルムとして厚み 5 Ομπιのポリ テトラフルォロエチレンフィルム （破断強度 4 . 6 k g/mm 破断伸び 3 5 0 %)を用いたこと以外は実施例 1と同様にして異方導電材フィルムの巻物を得、 さらに実施例 1と同様にこのフィルムの巻物を幅 1 . 5 mmにスリヅトしながら、 側板のついた直径 4 8 mm、 幅 1 0 0 mmの芯材 （卷き芯） に糸巻き状に卷くこ とにより、 3 0 0 mの長さの異方導電材テープを得た。 この場合も、 3 O O mの 長さに卷くことができた。  [0887] Same as Example 1, except that a polytetrafluoroethylene film (rupture strength: 4.6 kg / mm elongation at break: 350%) with a thickness of 5 μμπι was used as the base film In the same manner as in Example 1, a roll of an anisotropic conductive material film was obtained, and further, as in Example 1, the roll of this film was slit to a width of 1.5 mm, and a diameter of 48 mm with a side plate was attached. An anisotropic conductive material tape having a length of 300 m was obtained by winding the core material (winding core) having a diameter of 100 mm in a thread form. In this case as well, it could be wound around 3 O O m in length.
(比較例 1 )  (Comparative Example 1)
【0 8 7 1】 実施例 1と同様にして異方導電材フィルムの卷物を得、 さらに実 施例 1と同様にこのフィルムの卷物を幅 1 . 5 mmにスリットしながら、 従来の リールに同一円芯状に卷き、 1 0 O mの長さの異方導電材テープを得た。  [0887] A roll of an anisotropic conductive material film was obtained in the same manner as in Example 1, and the roll of this film was slit into a width of 1.5 mm as in Example 1 to obtain a conventional film. An anisotropic conductive material tape having a length of 10 Om was wound on the reel in the same circular core shape.
【0 8 7 2】 この糸巻き状に卷いてなる異方導電材テープを異方導電材テープ 圧着自動機に取付け、 異方導電材を供給した場合、 異方導電材の転写性及び伸び 試験において良好な結果が得られたが、 リールの取付け回数が実施例の 3倍とな り、 取付けに要する時間と調整に用する時間が増えた。  [0 8 7 2] When the anisotropic conductive material tape wound in a thread form is attached to an automatic anisotropic conductive material tape crimping machine and the anisotropic conductive material is supplied, the transferability and elongation test of the anisotropic conductive material are performed. Although good results were obtained, the number of reel installations was three times that of the example, and the time required for installation and the time required for adjustment increased.
産業上の利用可能性 Industrial applicability
【0 8 7 3】 以上説明したように請求の範囲第 1項に記載の発明によれば、 接 T/JP2003/009694 着材テープの接着剤を利用して卷き出しの終了した接着材テープ （一方の接着材 テープ） の終端部と新たに装着する接着材テープ （他方の接着材テープ） の始端 部と接着して、 接着材リールの交換を行うので、 接着装置への新たな接着材テー プの装着が簡単にできる。 [0887] As described above, according to the invention described in claim 1, the contact T / JP2003 / 009694 The end of the unwound adhesive tape (one adhesive tape) and the newly installed adhesive tape (the other adhesive tape) using the adhesive of the adhesive tape Since the adhesive reel is replaced after bonding to the start end, it is easy to mount a new adhesive tape on the bonding machine.
【0 8 7 4】 また、 新たな接着材テープの交換毎に卷取りテープの交換や新規 接着材テープの始端を卷取りリールに取り付ける作業、 所定の経路にガイドビン 等を設定する作業が必要ないので、 新しい接着材リールの交換時間が少なくて済 み、 電子機器の生産効率が高まる。  [0 8 7 4] In addition, every time a new adhesive tape is replaced, it is necessary to replace the winding tape, attach the starting end of the new adhesive tape to the winding reel, and set a guide bin or the like in a predetermined path. No new adhesive reel replacement time is required, increasing the production efficiency of electronic equipment.
【0 8 7 5】 一方の接着材テープと他方の接着材テープとは、 接着剤面同士を 重ね合わせて接着するので、 接続強度が高い。  [0887] One adhesive tape and the other adhesive tape have high adhesive strength because the adhesive surfaces are overlapped and adhered.
【0 8 7 6】 請求の範囲第 2項に記載の発明によれば、 請求の範囲第 1項に記 載の発明と同様な効果を奏するとともに、 卷き出しの終了した接着材テープの切 断はェンドマ一クが露出したときに行うことができるので、 切断及び接続作業を する部分が解りやすく且つ必要最小限の位置で接続できるので接着材テープの無 駄を防止できる。  [0887] According to the invention set forth in claim 2, the same effect as that of the invention described in claim 1 can be obtained, and the cutting of the adhesive tape after the unwinding is completed. Since the disconnection can be performed when the endmark is exposed, the cutting and connecting portions can be easily understood and the connection can be made at the minimum necessary position, thereby preventing waste of the adhesive tape.
【0 8 7 7】 請求の範囲第 3項に記載の発明によれば、 請求の範囲第 1項記載 の発明の効果と同様に接着装置への新たな接着材テープの装着が簡単にでき、 ま た新しい接着材リ一ルの交換時間が少なくて済み、電子機器の生産効率が高まる。 [0887] According to the invention set forth in claim 3, similar to the effect of the invention described in claim 1, it is possible to easily attach a new adhesive tape to the bonding apparatus, In addition, the time required to replace a new adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
【0 8 7 8】 更に、 接着材テープのリードテープを利用して巻き出しの終了し た接着材テープの終端部と新たに装着する接着材テープの始端部とを接着するの で、 接着材テープ同士の接着が簡単にできる。 [0 8 7 8] Furthermore, the end of the unwound adhesive tape and the start of the newly attached adhesive tape are bonded using the adhesive tape lead tape. Adhesion between tapes can be done easily.
【0 8 7 9】 請求の範囲第 4項に記載の発明によれば、 請求の範囲第 1項記載 の発明の効果と同様に接着装置への新たな接着材テープの装着が簡単にでき、 ま た新しい接着材リ一ルの交換時間が少なくて済み、電子機器の生産効率が高まる。 [0887] According to the invention set forth in claim 4, similar to the effect of the invention set forth in claim 1, it is possible to easily attach a new adhesive tape to the bonding apparatus, In addition, the time required to replace a new adhesive reel is reduced, and the production efficiency of electronic equipment is increased.
【0 8 8 0】 更に、卷き出しの終了した接着材テープを裏返す必要がないので、 卷取りリールに接着材テープを卷き取った際に巻き崩れが生じるおそれを防止で 03 009694 きる。 [0888] Further, since it is not necessary to turn over the adhesive tape that has been unwound, it is possible to prevent the risk of collapse when the adhesive tape is wound on the take-up reel. 03 009694 OK.
【0 8 8 1】 請求の範囲第 5項に記載の発明によれば、 卷出しが終了した接着 材テープの終端部と、 新たに装着する接着材テープの始端部とを係止ピンで固定 するので、 接続が簡単である。 また、 新たな接着材リールの交換毎に卷取りテ一 プの交換や新規接着材テープの始端を卷取りリールに取り付ける作業、 また所定 の経路にガイドビン等を設定する作業が必要ないので、 新しい接着材リールの交 換時間が少なくて済み、 電子機器の生産効率が高まる。  [0887] According to the invention set forth in claim 5, the end of the unwound adhesive tape and the start of the newly attached adhesive tape are fixed with the locking pins. Connection is easy. In addition, every time a new adhesive reel is replaced, there is no need to replace the take-up tape, attach the start end of the new adhesive tape to the take-up reel, and set guide bins or the like on a predetermined path. The replacement time for new adhesive reels is reduced, and the production efficiency of electronic equipment is increased.
【0 8 8 2】 請求の範囲第 6項に記載の発明によれば、 一方の接着材テープの 終端部に係止部材の一方の爪部を係止し、 その後に係止部材の他方の爪部を他方 の接着材テープの始端部に係止して両者を互いに接続するので、 接続が容易であ る。  [0887] According to the invention set forth in claim 6, one claw portion of the locking member is locked to the end of one adhesive tape, and then the other of the locking member is locked. Since the claws are locked to the start end of the other adhesive tape and the two are connected to each other, the connection is easy.
【0 8 8 3】 一方の爪部と他方の爪部との間に弾性部材を備えているので、 弾 性部材が伸びて係止部材の他方の爪部を他方の接着材テープの始端部の任意の位 置に係止することができるので、 接続の自由度が高い。  [0888] Since the elastic member is provided between the one claw portion and the other claw portion, the elastic member is extended, and the other claw portion of the locking member is moved to the start end of the other adhesive tape. Since it can be locked at any position, there is a high degree of freedom in connection.
【0 8 8 4】 また、 一方の接着材テープの終端部と他方の接着材テープの始端 部とを突き合わせた状態で接続するので、互いのテープを重ね合せる必要がなく、 必要最小限の位置で接続できるので接着材テープの無駄を防止できる。  [0888] Also, since the connection is made in a state where the end of one adhesive tape and the start of the other adhesive tape are abutted, it is not necessary to overlap the tapes with each other, and the necessary minimum position Can be connected, so that the adhesive tape can be prevented from being wasted.
【0 8 8 5】 請求の範囲第 7項に記載の発明によれば、 一方の接着材テープの 終端部と他方の接着材テープの始端部の重ね合わせ部分をクリヅプで挾むだけで 接続できるので、 接続作業が容易である。  [0887] According to the invention described in claim 7, the connection can be made only by sandwiching the overlapped portion of the end of one adhesive tape and the start of the other adhesive tape with a clip. Therefore, connection work is easy.
【0 8 8 6】 請求の範囲第 8項に記載の発明によれば、 重ね合わせ部分の両面 から挟持片を押しつぶして両者を接続するので、 接着材テープの重ね合わせ部分 の接続強度を高めることができる。  [0887] According to the invention set forth in claim 8, since the sandwiching pieces are crushed from both sides of the overlapped portion to connect them, the connection strength of the overlapped portion of the adhesive tape is increased. Can be.
【0 8 8 7】 請求の範囲第 9項に記載の発明によれば、 接着材テープの接着剤 を利用して終了した接着材テープの終端部と、 新たに装着する接着材テープの始 端部とを接着して、 接着材リールの交換を行うので、 接着装置への新たな接着材 リールの装着が簡単にできる。 また、 新たな接着材リールの交換毎に基材の巻取 りリールの交換や新規接着材の始端を卷取りリールに取り付ける必要がないので、 新しい接着材リ一ルの交換時間が少なくて済み、 製造効率が高まる。 [0887] According to the invention as set forth in claim 9, the end of the adhesive tape completed by using the adhesive of the adhesive tape and the start of the adhesive tape to be newly mounted. The adhesive reel is replaced by bonding the parts, and a new adhesive Easy mounting of reels. In addition, since there is no need to replace the take-up reel of the base material and attach the starting end of the new adhesive to the take-up reel every time a new adhesive reel is replaced, the time required to replace a new adhesive reel is reduced. , Increases production efficiency.
【0 8 8 8】 請求の範囲第 1 0項に記載の発明によれば、 請求の範囲第 9項に 記載の発明と同様な効果を奏するとともに、 一方の接着材テープの終端部と他方 の接着材テープの始端部とを互いに鉤状にして係止するとともに、 両者は接着剤 面を互いに接続するので、 接続強度が高い。  [0887] According to the invention as set forth in claim 10, the same effects as those of the invention as set forth in claim 9 can be obtained, and the end of one adhesive tape and the other end can be used. The starting end of the adhesive tape is hooked and locked to each other, and the adhesive surfaces are connected to each other, so that the connection strength is high.
【0 8 8 9】 請求の範囲第 1 1項に記載の発明によれば、 請求の範囲第 9項又 は請求の範囲第 1 0項記載の発明と同様な効果を奏するとともに、 一方の接着材 テープの終端部はェンドマ一ク部分で行うことができるので、 接続作業をする部 分が解りやすく且つ接着材テープの無駄を防止できる。  [0887] According to the invention set forth in claim 11, the same effects as those of the invention set forth in claim 9 or claim 10 can be obtained, and one side of the bonding can be provided. Since the end of the material tape can be made at the end mark portion, the connecting portion can be easily understood and the waste of the adhesive tape can be prevented.
【0 8 9 0】 請求の範囲第 1 2項に記載の発明によれば、 請求の範囲第 9項〜 [0890] According to the invention described in claim 12, the claims 9 to
1 1のいずれか一項に言 3載の発明と同様な効果を奏するとともに、 接続部分に凹 凸を形成することより、 接続面積を広くできるとともに、 接続部分における接着 材テープの引張り方向 （長手方向） の強度を高めることができる。 1 In any one of the items 1, the same effect as the invention described in the item 3 can be obtained, and the connection area can be increased by forming the concave and convex portions in the connection portion, and the adhesive material tape pulling direction (longitudinal direction) in the connection portion can be obtained. Direction).
【0 8 9 1】 請求の範囲第 1 3項に記載の発明によれば、 請求の範囲第 9項〜 第 1 1項のいずれか一項に記載の発明と同様な効果を奏するとともに、 接続部分 に貫通孔を形成することにより、 貫通孔の内周に接着剤が染み出して、 接着剤に よる接着面積が増えるので、 更に接続強度を高めることができる。  According to the invention set forth in claim 13, the same effects as those of the invention set forth in any one of claims 9 to 11 can be obtained, and the connection can be achieved. By forming the through hole in the portion, the adhesive exudes to the inner periphery of the through hole, and the bonding area of the adhesive increases, so that the connection strength can be further increased.
【0 8 9 2】 請求の範囲第 1 4項に記載の発明によれば、 終了した接着材テ一 プ （一方の接着材テープ） と新たな接着材テープ （他方の接着材テープ） とを接 続してリールの交換を行うだけなので、 接着装置への新たな接着材リールの装着 が簡単にできる。 また、 新たな接着材リールの交換毎に卷取りリールの交換や、 新規接着材テープの始端を卷取りリールに取り付けたり、 接着材テープをガイド に 3iトける作業が必要ないので、 新しい接着材リ一ルの交換時間が少なくて済み、 電子機器の生産効率が高まる。 2003/009694 According to the invention as set forth in claim 14, the completed adhesive tape (one adhesive tape) and a new adhesive tape (the other adhesive tape) are used. Since it is only necessary to connect and change reels, it is easy to mount a new adhesive reel on the bonding machine. Also, there is no need to replace the take-up reel every time a new adhesive reel is replaced, to attach the start end of the new adhesive tape to the take-up reel, or to attach the adhesive tape to the guide 3i. Reel replacement time is reduced and the production efficiency of electronic equipment is increased. 2003/009694
【0 8 9 3】 接着材テープの処理基材に用いる処理剤はシリコーン系樹脂であ り、 粘着テープにもシリコーン粘着剤を用いることにより、 両者の表面張力の差 を小さくして密着力を高めているので、'従来困難であった両者の接着を実現でき る。 [089] The processing agent used for the base material of the adhesive tape is a silicone resin, and by using a silicone adhesive for the adhesive tape, the difference in surface tension between the two is reduced to increase the adhesion. Because of this, it is possible to realize the bonding between the two, which was difficult in the past.
【0 8 9 4】 請求の範囲第 1 5項に記載の発明によれば、 請求の範囲第 1 4項 に記載の発明と同様な効果 ^奏するとともに、 シリコーン粘着テープにおける粘 着剤面の表面張力と接着材テープにおけるシリコーン処理基材の表面張力との差 を 1 0 mN/mdOdyne/cm)以下とすることにより、強い密着力を得ることができ、 両者を確実に接着できる。  [0887] According to the invention set forth in claim 15, the same effects as those of the invention set forth in claim 14 can be obtained, and the surface of the adhesive surface of the silicone adhesive tape can be obtained. By setting the difference between the tension and the surface tension of the silicone-treated substrate in the adhesive tape to 10 mN / mdOdyne / cm) or less, a strong adhesion can be obtained, and the two can be securely bonded.
【0 8 9 5】 請求の範囲第 1 6項に記載された発明によれば、 請求の範囲第 1 5項記載の発明と同様な効果を奏するとともに、 更に接着力を 1 0 0 g/ 2 5 m m以上とすることにより、 一方及び他方の接着材テープの両接着剤面との接着を より強固におこなうことができる。 According to the invention described in claim 16, the same effects as those of the invention described in claim 15 can be obtained, and the adhesive strength can be further reduced to 100 g / 2. By setting the thickness to 5 mm or more, it is possible to more firmly bond one and the other adhesive tapes to both adhesive surfaces.
【0 8 9 6】 請求の範囲第 1 7項に記載された発明によれば、 請求の範囲第 1 6項に記載の発明と同様な効果を奏するとともに、 一方と他方の接着材テープを その両面で接続するので、 更に強固な接続を得ることができる。  According to the invention described in claim 17, the same effect as that of the invention described in claim 16 can be obtained, and one and the other adhesive tapes can be used. Since the connection is made on both sides, a stronger connection can be obtained.
【0 8 9 7】 請求の範囲第 1 8項に記載された発明によれば、 両面粘着剤のシ リコーン粘着テープを用いているので、 一方と他方の接着材テープ間に両面シリ コーン粘着テープを挟んで両者を接着 （又は密着） できるから、 両者の接続が簡 単且つ容易である。  [0887] According to the invention described in claim 18, since the silicone adhesive tape of the double-sided adhesive is used, the double-sided silicone adhesive tape is provided between one adhesive tape and the other adhesive tape. The two can be bonded (or in close contact) with each other, so that the connection between them is simple and easy.
【0 8 9 8】 請求の範囲第 1 9項に記載の発明によれば、 卷出しが終了した接 着材テープの終端部と、 新たに装着する接着材テープの始端部とをペースト状の 樹脂製接着剤で固定するので、 接続が簡単である。 また、 新たな接着材リールの 交換毎に卷取りテープの交換や新規接着材テープの始端を卷取りリールに取り付 ける作業、 所定の経路にガイドビン等を設定する作業が必要ないので、 新しい接 着材リールの交換時間が少なくて済み、 電子機器の生産効率が高まる。 【0 8 9 9】 請求の範囲第 2 0項に記載の発明によれば、 請求の範囲第 1 9項 に記載の発明と同様な作用効果を奏するとともに、 樹脂製接着剤として熱硬化性 樹脂、 光硬化性樹脂、 ホットメルト接着剤の群の中から、 接着材テープ同士の接 続に好適な樹脂製接着剤を選択することができ、 接着材テープ同士の接続強度を 高めることができる。 [0887] According to the invention set forth in claim 19, the end of the adhesive tape that has been unwound and the start of the adhesive tape to be newly attached are pasted. Connection is easy because it is fixed with resin adhesive. In addition, there is no need to replace the take-up tape, attach the starting end of the new adhesive tape to the take-up reel, or set guide bins or the like on a predetermined path each time a new adhesive reel is replaced. The time required to change the adhesive reel is reduced, and the production efficiency of electronic equipment is increased. [0899] According to the invention set forth in claim 20, the same operation and effect as those of the invention set forth in claim 19 are exhibited, and the thermosetting resin is used as the resin adhesive. In addition, a resin adhesive suitable for connecting the adhesive tapes can be selected from the group of the photocurable resin and the hot melt adhesive, and the connection strength between the adhesive tapes can be increased.
【0 9 0 0】 請求の範囲第 2 1項に記載の発明によれば、 接着装置内に請求の 範囲第 1 9項又は請求の範囲第 2 0項に記載の樹脂製接着剤を供給する充填機が 設けられているので、 別途に充填機を用意する必要がなく、 接続作業の無駄を防 止できる。  According to the invention as set forth in claim 21, the resin adhesive according to claim 19 or claim 20 is supplied into the bonding apparatus. Since a filling machine is provided, there is no need to prepare a separate filling machine, and wasteful connection work can be prevented.
【0 9 0 1】 請求の範囲第 2 2項に記載の発明によれば、 一方の巻き部に巻か れた接着材テープの巻き出しが終了すると、 隣の卷き部に巻かれた接着材テープ を卷取りリールに取り付けて、 接着材テープの交換を行うので、 接着装置への新 たな接着材テ一プリ一ルの装着が不要である。 従って、 新たな接着材テープリー ルの交換作業が少なくて済み、 電子機器の生産効率が高まる。  [0910] According to the invention as set forth in claim 22, when the unwinding of the adhesive tape wound around one of the winding portions is completed, the bonding wound around the adjacent winding portion is completed. Since the adhesive tape is replaced by attaching the adhesive tape to the take-up reel, it is not necessary to attach a new adhesive tape to the adhesive device. Therefore, the replacement work of the new adhesive tape reel is reduced, and the production efficiency of electronic equipment is improved.
【0 9 0 2】 請求の範囲第 2 3項に記載の発明によれば、 請求の範囲第 2 2項 に記載の発明と同様な効果を奏するとともに、 一方の接着材テープの終端部と他 方の接着材テープの始端部とが、 連結テープで接続されているので、 一方の接着 材テープリールの接着材テープの卷き出しが終了した後、 他方の卷き部の接着材 テープを卷取りリールに取り付ける作業が不要となり、 電子機器の生産効率がさ らに高まる。  According to the invention described in claim 23, the same effect as that of the invention described in claim 22 can be obtained, and the other end of the adhesive tape and the other end can be provided. Since the start end of one adhesive tape is connected with the connecting tape, after the unwinding of the adhesive tape of one adhesive tape reel is completed, the adhesive tape of the other winding part is wound. Eliminating the work of attaching to take-up reels makes the production efficiency of electronic equipment even higher.
【0 9 0 3】. 請求の範囲第 2 4項に記載の発明によれば、 連結テープは自動的 に卷取りリールに卷き取られるので、 一方の巻き部の接着材テープが終了した後 に、 順次、 次の巻き部から接着材テープを繰り出すことができる。  [0909] According to the invention described in claim 24, the connecting tape is automatically wound on the take-up reel. Then, the adhesive tape can be sequentially fed from the next winding portion.
【0 9 0 4】 また、 連結テープをテープ検知手段が検知すると、 連結テープが 圧着部を通過するまで、 連結テープを自動的に卷取りリールに卷き取るので、 卷 取りの手間を省くことができる。 【0 9 0 5】 請求の範囲第 2 5項に記載の発明によれば、 一方の接着材テープ の終端部と他方の接着材テープの始端部との接続部分は、 係止具を接着材テープ で覆っているので、 外観が良いとともに、 接続部分の係止具が接着材テープに接 触して接着材テープを損傷したり接着装置を損傷することを防止できる。 [0904] When the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound on the take-up reel until the connecting tape passes through the crimping portion. Can be. [0995] According to the invention as set forth in claim 25, the connecting portion between the terminal end of one adhesive tape and the start end of the other adhesive tape is formed by connecting the stopper with an adhesive. Since the tape is covered with the tape, the appearance is good, and it is possible to prevent the fastener at the connection portion from contacting the adhesive tape and damaging the adhesive tape or the adhesive device.
【0 9 0 6】 請求の範囲第 2 6項に記載の発明によれば、 接続部分を接続部検 知手段が検知すると、 接続部分が圧着部を通過するまで、 一方の接着材テープを 卷取りリールに卷き取るので、 接続部分が圧着部にきて、 圧着動作が行われると いう不具合を防止できる。 また、 接続部分が圧着部を通過するまで、 一方の接着 材テープを自動的に卷取りリールに巻き取るので、 卷取りの手間を省くことがで きる。  According to the invention as set forth in claim 26, when the connection portion detecting means detects the connection portion, one of the adhesive tapes is wound until the connection portion passes through the crimping portion. Since it is wound on the take-up reel, it is possible to prevent a problem that the connection portion comes to the crimping portion and the crimping operation is performed. Further, one adhesive tape is automatically wound on the winding reel until the connection portion passes through the crimping portion, so that the time and effort for winding can be reduced.
【0 9 0 7】 請求の範囲第 2 7項に記載の発明によれば、 請求の範囲第 2 6項 に記載の発明と同様の作用効果を奏するとともに、 簡単な構成で接続部分の検知 ができ、 しかも、 これらの手段を用いることで検知精度を高めることができる。 According to the invention described in claim 27, the same operation and effect as those of the invention described in claim 26 can be obtained, and the connection portion can be detected with a simple configuration. The detection accuracy can be improved by using these means.
【0 9 0 8】 請求の範囲第 2 9項に記載の発明によれば、 複数条の接着剤を順 次一条づっ使用できるので、 テープの卷き数を増やすことなく、 1リールで使用 可能な接着剤の量を従来の 2倍以上に増やすことができる。 [0908] According to the invention described in claim 29, a plurality of adhesives can be used one by one in sequence, so that it can be used on one reel without increasing the number of tape windings. The amount of adhesive required can be more than doubled.
【0 9 0 9】 巻く数を増やすことがないから、巻き崩れを防止できるとともに、 接着剤がテープの幅方向に染み出して卷かれているテープ同士が接着するブロヅ キングを防止でき、 更に、 テープ状の基材が長くなることにより生じ易い基材の 伸び等の弊害 （基材の損傷や切断） を防止できる。  [0909] Since the number of windings is not increased, it is possible to prevent collapse of the windings and prevent the adhesive from seeping out in the width direction of the tapes and blocking the wound tapes from adhering to each other. It is possible to prevent adverse effects such as elongation of the base material (damage or cutting of the base material), which are likely to occur when the tape base material becomes longer.
【0 9 1 0】 電子部品の製造工場では、 新しい接着剤テープの交換回数が少な くて済むので、 作業効率が高まる。  [0910] In an electronic component manufacturing plant, the number of times that a new adhesive tape needs to be changed can be reduced, thereby increasing work efficiency.
【0 9 1 1】 また、 接着剤テープの製造においては、 製造するリール数を少な くできるので、 リール材ゃ湿気防止材の使用量を削減でき、 製造コストを低減で きる。  [0911] Also, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
【0 9 1 2】 請求の範囲第 3 0項に言己載の発明によれば、 請求の範囲第 2 9項 に記載の発明と同様な効果を奏するとともに、 隣合う接着剤条どうしが離れてい るので、 一条づっ容易に分離でき、 回路基板への圧着が容易にできる。 According to the invention recited in claim 30, claim 29 In addition to the effects similar to those of the invention described in (1), the adhesive strips adjacent to each other are separated from each other, so that the strips can be easily separated one by one, and the pressure bonding to the circuit board can be easily performed.
【0 9 1 3】 請求の範囲第 3 1項に記載の発明によれば、 請求の範囲第 2 9項 と同様な効果を奏するとともに、 ¾ ^の片面全面に塗布した接着剤にスリツトを 形成するだけであるから製造が容易であり、 且つ隣合う接着剤条間の隙間がほと んどないから、 基材上に配置する接着剤条の条数を多くすることができる。 [0913] According to the invention described in claim 31, the same effect as in claim 29 can be obtained, and a slit is formed in the adhesive applied to the entire surface of one side of ¾ ^. Therefore, manufacturing is easy, and there is almost no gap between adjacent adhesive strips, so that the number of adhesive strips arranged on the base material can be increased.
【0 9 1 4】 請求の範囲第 3 2項に記載の発明によれば、 請求の範囲第 3 0項 に記載の接着剤テープを容易に製造することができる。 [0914] According to the invention as set forth in claim 32, the adhesive tape as set forth in claim 30 can be easily manufactured.
【0 9 1 5】 請求の範囲第 3 3項に記載の発明によれば、 2つの接着剤テープ が同時に製造できるので、 製造効率に優れる。  [0915] According to the invention described in claim 33, two adhesive tapes can be manufactured at the same time, so that the manufacturing efficiency is excellent.
【0 9 1 6】 請求の範囲第 3 4項に記載の発明によれば、 接着剤の一部を加熱 することにより、 その部分の凝集力を低下させて回路基板に圧着するので、 接着 剤テープは基材の片面全面に接着剤を塗布したものを用いるから、 既存設備をそ のまま用いて接着剤テープを製造できる。  According to the invention as set forth in claim 34, by heating a part of the adhesive to reduce the cohesive force of the part and press-bond the adhesive to the circuit board, the adhesive is heated. Since the adhesive tape is applied to the entire surface of one side of the base material, adhesive tape can be manufactured using existing equipment as it is.
【0 9 1 7】 回路基板に圧着する接着剤の幅は、 加熱領域を変えることにより 任意に設定でき、 圧着する接着剤幅の自由度が高い。  [091 17] The width of the adhesive to be crimped to the circuit board can be arbitrarily set by changing the heating area, and the degree of freedom of the width of the adhesive to be crimped is high.
【0 9 1 8】 請求の範囲第 2 9項に記載の発明と同様に、 基材上の接着剤から 順次一条分づっ加熱して回路基板に圧着できるので、 テープの巻き数を増やすこ となく、 1リールで使用できる接着剤量を 2倍以上に増やすことができる。 【0 9 1 9】 巻き数を増加させることなく、 接着剤量を増加できるので、 請求 の範囲第 2 9項に記載の発明と同様に、 卷き崩れを防止できるとともに、 接着剤 の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる。 【0 9 2 0】 請求の範囲第 3 5項に記載の発明によれば、 接着剤テープの幅は 回路基板の一辺の長さ以上を有しているので、 接着剤量を多くしながら、 接着剤 テープの卷き数を削減することができる。  [0918] In the same manner as the invention described in claim 29, since the adhesive on the base material can be sequentially heated by one line and pressure-bonded to the circuit board, the number of windings of the tape can be increased. The amount of adhesive that can be used on one reel can be more than doubled. [091] Since the amount of the adhesive can be increased without increasing the number of windings, the collapse of the adhesive can be prevented and the exudation of the adhesive can be prevented as in the invention described in claim 29. Blocking and adverse effects due to elongation of the substrate can be prevented. [0992] According to the invention described in claim 35, the width of the adhesive tape is equal to or greater than the length of one side of the circuit board. The number of wound adhesive tapes can be reduced.
【0 9 2 1】 接着剤テープの巻き数を増やすことなく、 使用する接着剤量を大 3 009694 幅に増やすことができるから、 卷き崩れを防止できるとともに、 ブロッキングや 基材の損傷や切断を防止できる。 また、 電子部品の製造工場では、 新しい接着剤 テープの交換回数が少なくて済むので、 製造効率が高まる。 [0 9 2 1] Increase the amount of adhesive used without increasing the number of turns of adhesive tape. 3 009694 Since the width can be increased, it is possible to prevent buckling and prevent blocking, damage and cutting of the base material. Also, in electronic component manufacturing plants, the number of times that new adhesive tape needs to be changed is reduced, thereby increasing manufacturing efficiency.
【0 9 2 2】 更に、 接着剤テープの製造においては、 1リール当りの接着剤量 を多くできるので、 リール材ゃ湿気防止材の使用量を削減でき、 製造コストを低 減できる。  [0922] Furthermore, in the production of the adhesive tape, the amount of adhesive per reel can be increased, so that the amount of use of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
【0 9 2 3】 請求の範囲第 3 6項に記載の発明によれば、 請求の範囲第 3 5項 に記載の発明と同様な効果を奏するとともに、 隣合う接着剤条同士が離れている ので、 接着剤を一条づっ容易に基材から引き離して圧着できる。  According to the invention described in claim 36, the same effect as the invention described in claim 35 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
【0 9 2 4】 請求の範囲第 3 7項に記載の発明によれば、 請求の範囲第 3 5項 と同様な効果を奏するとともに、 基材上に配置する接着剤条の条数を多くするこ とができるとともに、 製造が容易である。  [0992] According to the invention set forth in claim 37, the same effect as that of claim 35 can be obtained, and the number of the adhesive strips arranged on the base material is increased. And it is easy to manufacture.
【0 9 2 5】 請求の範囲第 3 8項に記載の発明によれば、 既存設備を利用して 請求の範囲第 3 6項に記載の接着剤テープを同時に 2つ製造できるので、 製造効 率に優れる。  [0992] According to the invention set forth in claim 38, two adhesive tapes according to claim 36 can be simultaneously manufactured using existing equipment. Excellent rate.
【0 9 2 6】 請求の範囲第 3 9項に記載された発明によれば、 請求の範囲第 3 5項〜第 3 7項のいずれかに記載の効果を得ることができるとともに、 回路基板 の一辺に接着剤を簡単に圧着でき、 電子部品の製造工場における作業効率を向上 できる。  According to the invention described in claim 39, the effects described in any of claims 35 to 37 can be obtained, and the circuit board can be obtained. Adhesive can be easily crimped to one side, and the work efficiency in electronic component manufacturing plants can be improved.
【0 9 2 7】 請求の範囲第 4 0項に記載の発明によれば、 請求の範囲第 3 5項 〜第 3 7項に記載の効果を得ることができるとともに、 回路基板を回転させるこ となく、 一方の接着剤テープと他方の接着剤テープとの位置に移動して、 回路基 板の四周に容易に接着剤を圧着でき、 作業効率が良い。  According to the invention set forth in claim 40, the effects described in claims 35 to 37 can be obtained, and the circuit board can be rotated. In other words, it can be moved to the position of one adhesive tape and the other adhesive tape, and the adhesive can be easily pressed on the four circumferences of the circuit board, resulting in good work efficiency.
【0 9 2 8】 請求の範囲第 4 1項に記載の発明によれば、 回路基板の周囲に接 着剤を圧着する場合には、 幅方向に沿って条状に接着剤テ一プを加熱加圧するこ とにより、 回路基板に接着剤の圧着が容易にでき、 作業効率が良い。 【0 9 2 9】 また、接着剤テープにはその全面に接着剤を塗布すればよいので、 既存設備をそのまま用いて接着剤テープを製造できる。 [0992] According to the invention set forth in claim 41, when the adhesive is pressure-bonded to the periphery of the circuit board, the adhesive tape is strip-shaped along the width direction. By applying heat and pressure, pressure bonding of the adhesive to the circuit board can be facilitated, and work efficiency is good. [0992] Also, since the adhesive may be applied to the entire surface of the adhesive tape, the adhesive tape can be manufactured using existing equipment as it is.
【0 9 3 0】 更に、 回路基板に圧着する接着剤の幅は、 加熱加圧領域を変える ことにより任意に設定でき、 圧着する接着剤幅の自由度が高い。  [0930] Furthermore, the width of the adhesive to be press-bonded to the circuit board can be arbitrarily set by changing the heating / pressing region, and the degree of freedom of the pressure-sensitive adhesive width is high.
【0 9 3 1】 また、 請求の範囲第 3 5項に記載の発明と同様に、 巻き数を増加 させることなく接着剤量を増加できるので、 卷き崩れを防止できるとともに、 接 着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害を防止できる 等の効果を得ることができる。  [0931] Further, similar to the invention described in claim 35, the amount of the adhesive can be increased without increasing the number of windings, so that it is possible to prevent the collapse of the winding and to reduce the amount of the adhesive. Effects such as prevention of blocking due to oozing and prevention of adverse effects due to elongation of the base material can be obtained.
【0 9 3 2】 請求の範囲第 4 2項に記載の発明によれば、 接着剤シートには、 接着剤を幅方向に少なくとも 2条配置させて 1条づっ使用するものであるから、 [0932] According to the invention described in claim 42, the adhesive sheet is formed by arranging at least two adhesives in the width direction and using one adhesive at a time.
1リールで少なくとも 2リール分使用でき、 接着剤テープの卷き数を増やすこと なく、 1リールで使用可能な接着剤量を大幅に増やすことができる。 One reel can be used for at least two reels, and the amount of adhesive that can be used on one reel can be greatly increased without increasing the number of wound adhesive tapes.
【0 9 3 3】 しかも、 接着剤テープの卷き数を増やすことがないから、 巻き崩 れを防止できるとともに、 接着剤がテープの幅方向に染み出して卷かれているテ —プ同士が接着するプロヅキングを防止でき、 更に、 基材が長くなることにより 生じ易い基材の伸び等の弊害 （基材の損傷や切断） を防止できる。  [0 9 3 3] Moreover, since the number of windings of the adhesive tape is not increased, it is possible to prevent the tape from being rolled up, and the tape on which the adhesive exudes and is wound in the width direction of the tape. Adhesive blocking can be prevented, and adverse effects (damage or cutting of the base material) such as elongation of the base material, which are likely to occur when the base material is elongated, can be prevented.
【0 9 3 4】 接着剤テープをカセットにしてあるので、 接着装置において接着 剤テープをリールへ取り付ける手間がかからず、 接着装置にカセットを装着する だけであるから取扱い易く、 且つ取り付けや交換の作業性が良い。  [0 9 3 4] Since the adhesive tape is used as a cassette, there is no need to attach the adhesive tape to the reel in the bonding device, and it is easy to handle since the cassette is simply mounted on the bonding device. Workability is good.
【0 9 3 5】 請求の範囲第 4 3項に記載の発明によれば、 請求の範囲第 4 2項 に記載の発明と同様な効果を奏するとともに、 隣合う接着剤条同士が離れている ので、 接着剤を一条づっ容易に基材から引き離して圧着できる。  According to the invention described in claim 43, the same effect as that of the invention described in claim 42 can be obtained, and the adjacent adhesive strips are separated from each other. Therefore, the adhesive can be easily separated from the substrate one by one and pressed.
【0 9 3 6】 請求の範囲第 4 4項に記載の発明によれば、 請求の範囲第 4 2項 と同様な効果を奏するとともに、 接着剤テ一プは の片面全面に接着剤を塗布 してスリットを形成するだけであるから製造が容易である。  According to the invention as set forth in claim 44, the same effect as that of claim 42 can be obtained, and the adhesive tape is formed by applying an adhesive to the entire surface of one side of It is easy to manufacture because only the slit is formed.
【0 9 3 7】 請求の範囲第 4 5項に記載の発明によれば、 接着剤テープには基 材の全面に接着剤を塗布すればよいので、 既存設備をそのまま用いて接着剤テー プを製造できる。 [0993] According to the invention set forth in claim 45, the adhesive tape has a base. Adhesive can be applied to the entire surface of the material, and adhesive tape can be manufactured using existing equipment as it is.
【0 9 3 8】 回路基板に圧着する接着剤の幅は、 加熱加圧領域を変えることに より任意に設定でき、 圧着する接着剤幅の自由度が高い。  [0932] The width of the adhesive to be bonded to the circuit board can be set arbitrarily by changing the heating and pressing area, and the degree of freedom of the width of the bonded adhesive is high.
【0 9 3 9】 請求の範囲第 4 6項に記載の発明によれば、 請求の範囲第 4 5項 と同様な効果を奏するとともに、更に、請求の範囲第 1項に記載の発明と同様に、 卷き数を増加させることなく接着剤量を増加できるので、 卷き崩れを防止できる とともに、 接着剤の染み出しによるブロッキングの防止と基材の伸びによる弊害 を防止できる等の効果を得ることができる。使用時には、 1リール分の使用が終 了したところで、 カセットを裏返すだけなので、 次の装着が容易である。 カセヅ トにしてあるから、 取扱い易く、 且つ取り付けや交換の作業性が良い。  According to the invention set forth in claim 46, the same effect as that of claim 45 can be obtained, and further, the same effect as the invention described in claim 1 can be obtained. In addition, since the amount of the adhesive can be increased without increasing the number of windings, it is possible to prevent the collapse of the winding, to prevent the blocking due to the exudation of the adhesive, and to prevent the adverse effect due to the elongation of the base material. be able to. At the time of use, the cassette is only turned upside down when the use of one reel is completed, so the next installation is easy. Since it is a cassette, it is easy to handle and has good workability for installation and replacement.
【0 9 4 0】 請求の範囲第 4 7項に記載の発明によれば、 接着材テープの基材 を利用して、 卷き出しの終了した接着材テープの終端部と、 新たに装着する接着 材テープの始端部とを接着して、 接着材リールの交換を行うので、 接着装置への 新たな接着材リールの装着が簡単にできる。 また、 新たな接着材リールの交換毎 に卷取りリールの交換や新たな接着材リールの始端を卷取りリールに取り付ける 作業が必要ないので、 新しい接着材リールの交換時間が少なくて済み、 電子機器 の生産効率が高まる。  [0945] According to the invention set forth in claim 47, the end of the unwound adhesive tape is newly mounted by using the adhesive tape base material. Since the adhesive reel is replaced by bonding the adhesive tape to the start end, it is easy to mount a new adhesive reel on the bonding machine. In addition, there is no need to replace the take-up reel and attach the start end of the new adhesive reel to the take-up reel every time a new adhesive reel is replaced. Production efficiency is increased.
【0 9 4 1】 請求の範囲第 4 8項に記載の発明によれば、 請求の範囲第 4 7項 に記載の発明と同様な効果を奏するとともに、 熱溶融剤層が基材の表面にあるの で、一方の接着材テープの終端部の熱溶融剤層に始端部の接着剤面を重ね合わせ、 かかる部分を加熱圧着して両者を接続するので、 接続が簡単である。 · [0941] According to the invention set forth in claim 48, the same effect as that of the invention set forth in claim 47 can be obtained, and the hot-melt agent layer is formed on the surface of the base material. Since the adhesive surface at the start end is superimposed on the hot-melt agent layer at the end of one adhesive tape and such a portion is connected by heating and pressure bonding, the connection is simple. ·
【0 9 4 2】 また、 熱溶融剤層はテープの長手方向の全体に渡り形成されてい るので、重ね合わせ長さを厳密に位置決めする必要がなく、接続の自由度が高い。[0942] Also, since the hot-melt agent layer is formed over the entire length of the tape, there is no need to precisely position the overlapping length, and the degree of freedom of connection is high.
【0 9 4 3】 請求の範囲第 4 9項に記載の発明によれば、 請求の範囲第 4 7項 に記載の発明と同様な効果を奏するとともに、 熱溶融剤層が支持層に挟まれてい o According to the invention as set forth in claim 49, the same effect as that of the invention as set forth in claim 47 is obtained, and the hot-melt agent layer is sandwiched between the support layers. And o
PCT/JP2003/009694 るので、 熱溶融剤層が外気にさらされて、 湿気による吸湿ゃ麈等の付着による熱 溶融剤層の接着強度が低下することを防止できる。  PCT / JP2003 / 009694, therefore, it is possible to prevent the heat-fusing agent layer from being exposed to the outside air, and thereby reducing the adhesive strength of the heat-fusing agent layer due to adhesion of moisture and dust due to moisture.
【0 9 4 4】 請求の範囲第 5 0項に記載の発明によれば、 基材端部の離型剤で 表面処理した部分を除去し、 接着材テープの接着剤を利用して卷き出しの終了し た接着材テープの終端部と新たに装着する接着材テープの始端部と接着して、 接 着材リールの交換を行うので、 接着装置への新たな接着材リ一ルの装着が簡単に できる。  [094] According to the invention as set forth in claim 50, the portion of the base material which has been subjected to the surface treatment with the release agent is removed, and the base material is wound using the adhesive of the adhesive tape. Adhesive tape is replaced by bonding the end of the adhesive tape that has been dispensed to the start of the adhesive tape to be newly installed, so that a new adhesive reel is mounted on the bonding machine. Can be easily done.
【0 9 4 5】 請求の範囲第 5 1項に記載の発明によれば、 請求の範囲第 5 0項 に記載の発明と同様な効果を奏するとともに、 プラズマ放電、 紫外線照射、 レー ザ照射の何れか一つの方法を用いて離型剤を除去するので、 離型剤の除去を正確 且つ短時間で行うことができる。  [0945] According to the invention set forth in claim 51, the same effects as those of the invention set forth in claim 50 can be obtained, and plasma discharge, ultraviolet irradiation, and laser irradiation can be performed. Since the release agent is removed using any one of the methods, the release agent can be removed accurately and in a short time.
【0 9 4 6】 請求の範囲第 5 2項に記載の発明によれば、 接着材テープリール には、 接着材テープをリールに巻いた接着材テープの卷き部 （卷き部） を複数設 けたので、 複数の巻き部のうち、 一つの巻き部の接着材テープの卷き出しが終了 [0964] According to the invention as set forth in claim 52, the adhesive tape reel has a plurality of winding portions (winding portions) of the adhesive tape obtained by winding the adhesive tape around the reel. The installation of the adhesive tape was completed for one of the winding sections.
L5 すると、 卷き出しの終了した卷き部に隣接して配置した別の巻き部の接着材テー プを用いるので、 接着装置への新たな接着材テープリールの装着が不要であり、 新たな接着材テープリ一ルの交換作業が少なくて済み、 電子機器の生産効率が高 まる。 また、 複数の接着材テープを順次使用できるので、 1つの接着材テ一プリ ールあたりの接着材テープの卷き数を增やすことなく、 1回の交換作業で使用可 能な接着剤量を大幅に増やすことができる。 また、 接着材テープの卷き数を増や すことがないから、 卷き崩れを防止できるとともに、 接着剤がテープの幅方向に 染み出して卷いた接着材テープ同士が接着するいわゆるブロッキングを防止でき、 さらに基材が長くなることで生じ易い基材の伸び等の弊害を防止できる。 At L5, since the adhesive tape of another winding portion arranged adjacent to the winding portion where the unwinding is completed is used, it is not necessary to mount a new adhesive tape reel on the bonding device, and a new Less adhesive tape reel replacement work increases the production efficiency of electronic equipment. In addition, since a plurality of adhesive tapes can be used sequentially, the amount of adhesive that can be used in one exchange operation can be reduced without reducing the number of wound adhesive tapes per adhesive tape. Can be greatly increased. Also, since the number of windings of the adhesive tape is not increased, it is possible to prevent collapse of the tape and prevent so-called blocking in which the adhesive oozes out in the width direction of the tape and the wound adhesive tapes adhere to each other. Further, it is possible to prevent adverse effects such as elongation of the base material, which are likely to occur due to the longer base material.
【0 9 4 7】 請求の範囲第 5 3項に記載の発明によれば、 リールの側板には乾 5 燥剤の収納部が設けられているので、 請求の範囲第 5 2項に記載の発明と同様な 作用効果を奏するとともに、 接着材テープリ一ル内の湿気を内部から確実に除去 [0945] According to the invention set forth in claim 53, the side plate of the reel is provided with a storage portion for drying agent. It has the same function and effect as the invention, and reliably removes moisture inside the adhesive tape reel from the inside.
- -
することで、 接着材テープが湿気を吸湿することで発生する品質の低下をさらに 抑えることができる。 By doing so, it is possible to further suppress the deterioration in quality caused by the adhesive tape absorbing moisture.
【0 9 4 8】 請求の範囲第 5 4項に記載の発明によれば、 リールに卷かれた接 着材テープの周囲を覆うカバー部材がリールに着脱自在に設けられているので接 着材テープが直接外気にさらされることがなく、 接着材テープが麈ゃ外気の湿気 による悪影響を防ぐことができる。 従って、 複数の卷き部を設けた場合でも、 未 使用の卷き部にカバー部材を設けておくことで、 接着材テープの品質の低下を防 止できる。  According to the invention set forth in claim 54, since the cover member that covers the periphery of the adhesive tape wound on the reel is detachably provided on the reel, the adhesive material is provided. The tape is not directly exposed to the outside air, and the adhesive tape prevents dust and the adverse effects of the humidity of the outside air. Therefore, even when a plurality of winding portions are provided, deterioration of the quality of the adhesive tape can be prevented by providing a cover member on an unused winding portion.
【0 9 4 9】 また、 カバ一部材が着脱自在に設けられているので、 カバ一部材 を取り外して簡単に接着材テープリールから接着材テープを繰り出すことができ る。  [0949] Also, since the cover member is detachably provided, the adhesive tape can be easily pulled out from the adhesive tape reel by removing the cover member.
【0 9 5 0】 請求の範囲第 5 5項に記載の発明によれば、 請求の範囲第 5 2項 ないし請求の範囲第 5 4項のいずれかに記載の発明と同様の作用効果を奏すると ともに、 カノ 一部材の引出し口から接着材テープを繰り出すことができるので、 [0995] According to the invention set forth in claim 55, the same operation and effect as those of the invention set forth in any one of claims 52 to 54 are obtained. At the same time, the adhesive tape can be paid out from the outlet of one member,
L5 接着材テープリールのカバー部材を外すことなく、接着材テープリールから直接、 接着材テープを繰り出すことができる。 L5 The adhesive tape can be fed directly from the adhesive tape reel without removing the cover member of the adhesive tape reel.
【0 9 5 1】 請求の範囲第 5 6項に記載の発明によれば、 請求の範囲第 5 2項 ないし請求の範囲第 5 5項の何れかに記載の発明と同様の効果を奏するとともに、 巻き部は側板が互いに脱着自在に嵌合しているので、 一方の卷き部の接着材テ一 プが終了した後に、 他方の卷き部との嵌合を外すことで順次、 次の卷き部から接 着材テープを繰り出すことができる。  [0995] According to the invention set forth in claim 56, the same effects as those of the invention set forth in any of claims 52 to 55 can be obtained. Since the side portions of the winding portion are detachably fitted to each other, after the adhesive tape on one of the winding portions is completed, the fitting portion of the other winding portion is released, and the next winding portion is sequentially formed. The adhesive tape can be paid out from the winding part.
【0 9 5 2】 請求の範囲第 5 7項、 第 5 8項に記載の発明によれば、 請求の範 囲第 5 2項ないし請求の範囲第 5 6項のいずれかに記載の発明と同様の作用効果 を奏し、 特に接着材テープが、 相対向する電極を接続する電極接続用の接着剤が 5 基材に塗布された接着材テープであったり、 接着材テープが、 リードフレームの 固定用支持基板、 または、 半導体素子搭載用支持基板あるいはリードフレームの ダイと半導体素子を接続する接着材テ一プである場合特に有用である。 [0995] According to the invention set forth in claims 57 and 58, the invention set forth in any one of claims 52 to 56 is defined by the invention set forth in claim 52 or claim 58. The same effect is achieved, especially when the adhesive tape is an adhesive tape in which the adhesive for electrode connection that connects the opposing electrodes is applied to five substrates, or the adhesive tape is used to fix the lead frame. Support substrate or semiconductor device mounting support substrate or lead frame It is particularly useful for an adhesive tape for connecting a die to a semiconductor element.
【0 9 5 3】 請求の範囲第 5 9項に記載の発明によれば、片手でケースを握り、 接着剤テープが露出している開口部を回路基板に押し当て、 基材側から加熱部材 が加熱圧着して接着剤を回路基板に圧着するので、 小型で且つ片手で操作可能で あり且つ基板の一部に接着剤を圧着する場合に容易に圧着することができる。 [0953] According to the invention as set forth in Claim 59, the case is gripped with one hand, the opening where the adhesive tape is exposed is pressed against the circuit board, and the heating member is pressed from the base material side. Since the adhesive is heat-pressed to press the adhesive on the circuit board, it is compact and operable with one hand, and can easily press the adhesive when pressing the adhesive on a part of the substrate.
【0 9 5 4】 請求の範囲第 6 0項に記載の発明によれば、 接着材テープの基材 を金属フィルム又は芳香族ポリアミドフィルムとすることで、 ¾ の厚みを薄く した場合でも、 基材が伸びや、 切断などの不具合を防止できる。 [0995] According to the invention as set forth in claim 60, by setting the base material of the adhesive tape to a metal film or an aromatic polyamide film, even if the thickness of Problems such as elongation of the material and cutting can be prevented.
【0 9 5 5】 よって、厚みの薄い基材からなる接着材テープを利用することで、 1つのリール当たりの卷き数を多くすることができ、 1リールで使用可能な接着 剤量を増やすことができる。 また、 本発明の接着材テープを用いれば、 1リール 当たりの卷き数が多いので、 電子部品の製造工場では、 新しい接着材テープの交 換回数が少なくて済み、 作業効率が高まる。 さらに、 接着材テープの製造におい ては、 製造するリ一ル数を少なくできるので、 リ一ル材ゃ湿気防止材の使用量を 削減でき、 製造コストを低減できる。  [095] Therefore, by using an adhesive tape made of a thin base material, the number of windings per reel can be increased, and the amount of adhesive usable on one reel can be increased. be able to. Further, if the adhesive tape of the present invention is used, the number of windings per reel is large, so that in an electronic component manufacturing factory, the number of times of replacement of a new adhesive tape can be reduced, and work efficiency can be improved. Furthermore, in the production of the adhesive tape, the number of reels to be produced can be reduced, so that the use amount of the reel material and the moisture prevention material can be reduced, and the production cost can be reduced.
【0 9 5 6】 請求の範囲第 6 1項に記載の発明によれば、 請求の範囲第 6 0項 に記載の発明と同様の効果を奏するとともに、 薄く且つ引張強度の高い接着材テ —プが得られる。  [0995] According to the invention as set forth in claim 61, the same effects as those of the invention as set forth in claim 60 can be obtained, and the adhesive material having a small thickness and a high tensile strength can be obtained. Is obtained.
【0 9 5 7】 請求の範囲第 6 2項に記載の発明によれば、 請求の範囲第 6 0項 又は請求の範囲第 6 1項に記載の発明と同様の効果を奏するとともに、 基材の引 張強度を 3 0 O M P a以上とすることで、 基材伸び難く、 また切断し難い。 【0 9 5 8】 請求の範囲第 6 3項に記載の発明によれば、 請求の範囲第 6 0項 ないし請求の範囲第 6 2項のいずれかに記載の発明と同様の効果を奏するととも に、 の接着剤に対する厚みの比を 0 . 0 1〜1 . 0にすることで、 さらに薄 く且つ引張強度の高い接着材テープが得られる。  [0995] According to the invention described in claim 62, the same effect as that of the invention described in claim 60 or claim 61 can be obtained, and When the tensile strength of the base material is 30 OMPa or more, the base material is hardly stretched and hard to cut. [0995] According to the invention described in claim 63, it is possible to obtain the same effect as the invention described in any one of claims 60 to 62. At the same time, by setting the ratio of the thickness to 0.01 to 1.0 with respect to the adhesive, a thinner adhesive tape having a higher tensile strength can be obtained.
【0 9 5 9】 請求の範囲第 6 4項に記載の発明によれば、 請求の範囲第 6 0項 JP2003/009694 ないし請求の範囲第 6 3項のいずれかに記載の発明と同様の効果を奏するととも に、基材の表面粗さ： Rmaxを 0 . 5μπι以下とすることで、基材の表面が平滑とな り、 回路基板に接着剤を圧着する際に接着剤が基材から分離しやすい。 [0995] According to the invention described in claim 64, the claim 60 JP2003 / 009694 and the invention according to any one of claims 63 to 63 have the same effect, and by setting the surface roughness R max of the base material to 0.5 μπι or less, the base material The surface becomes smooth, and the adhesive is easily separated from the base material when the adhesive is pressed against the circuit board.
【0 9 6 0】 請求の範囲第 6 5項に記載の発明によれば、 被着体に接着剤を形 成する直前の工程で、 一方の接着材テープの接着剤と、 他方の接着材テープの接 着剤とを重ね合わせて、 所望の接着剤の厚さにしてから被着体に接着剤を形成す るので、 それぞれの接着材テープの厚さを薄くすることができ、 接着材テープの 卷き数を多くしているのに、 1リール当たりの接着材テープの卷き径を小さくす ることができる。  [0960] According to the invention as set forth in claim 65, in the step immediately before forming the adhesive on the adherend, the adhesive of one adhesive tape and the adhesive of the other are used. An adhesive is formed on the adherend after the desired adhesive thickness is formed by superposing the adhesive on the tape, so that the thickness of each adhesive tape can be reduced. Although the number of windings of the tape is increased, the winding diameter of the adhesive tape per reel can be reduced.
【0 9 6 1】 従って、 1リールあたりの接着材テープの巻き数を増やすことが でき、 1回の交換作業で使用可能な接着剤量を大幅に増やすことができる。 よつ て、 新たな接着材テープの交換作業が少なくて済み、 電子機器の生産効率が高ま る。  [0961] Therefore, the number of windings of the adhesive tape per reel can be increased, and the amount of adhesive that can be used in one exchange operation can be greatly increased. Therefore, the replacement work of the new adhesive tape is reduced, and the production efficiency of the electronic equipment is increased.
【0 9 6 2】 請求の範囲第 6 6項に記載の発明によれば、 請求の範囲第 6 5項 に記載の発明と同様な効果を奏するとともに、 低温管理の必要な接着材テープの 数を減らすことができ、 接着材テープの輸送、 保管の効率的管理を行うことがで きる。  [0969] According to the invention as set forth in claim 66, the same effect as that of the invention as set forth in claim 65 can be obtained, and the number of adhesive tapes requiring low-temperature control is reduced. And the efficient management of the transport and storage of the adhesive tape.
【0 9 6 3】 請求の範囲第 6 7項〜第 7 2項のいずれか一項に記載の発明によ れば、 被接続部材に対して良好な転写性 （貼付け性） を有し、 良好な接続信頼性 を有し、そのことにより工程内における歩留を高め、さらに作業性をも向上した、 従来より長尺の異方導電材テープの供給が可能であり、 生産性、 作業性が向上す る。  According to the invention described in any one of claims 67 to 72, it has good transferability (sticking property) to a member to be connected, It has good connection reliability, thereby increasing the yield in the process and improving workability. It is possible to supply a longer anisotropic conductive material tape than before, and productivity and workability are improved. Is improved.

Claims

請求の範囲 The scope of the claims
1 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接着 材テープと他方のリールに卷いた他方の接着材テープとを接続する接着材テープ の接続方法であって、 一方の接着材テープの終端部を裏返して、 一方の接着材テ —プの接着剤面と他方の接着材テープの接着剤面と重ね合わせ、 両者の重ね合わ せ部分を加熱圧着して接続することを特徴とする接着材テープの接続方法。 1. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the base material. Then, the end of one adhesive tape is turned over, the adhesive surface of one adhesive tape and the adhesive surface of the other adhesive tape are overlapped, and the overlapped portion of both is heated and pressed. A method for connecting an adhesive tape, comprising: connecting the adhesive tape.
2 . 一方の接着材テープの終端部にはェンドマ一クが付されていることを特徴と する請求の範囲第 1項に記載の接着材テープの接続方法。 2. The method for connecting an adhesive tape according to claim 1, wherein an end mark is attached to an end of one adhesive tape.
3 . 電極接続用の接着剤が基材に塗布された、 一方のリールに卷いた一方の接着 材テープと他方のリールに卷いた他方の接着材テープとを接続する接着材テープ の接続方法であって、 他方の接着材テープの始端部はリードテープによりリール に巻き付けてある接着材テープの基材面に貼り付けて止めており、 一方の接着材 テープの終端部を裏返した後、 リードテープの接着剤面を一方の接着材テープの 終端部の接着剤面に重ね合わせ、 重ね合わせ部分を加熱圧着することを特徴とす る接着材テープの接続方法。  3. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the base material. Then, the beginning of the other adhesive tape is attached to the base surface of the adhesive tape wound around the reel with a lead tape and stopped, and the lead tape is turned over after the end of one adhesive tape is turned over. A method of connecting an adhesive tape, wherein the adhesive surface of the adhesive tape is overlapped with the adhesive surface at the end of one adhesive tape, and the overlapped portion is heated and pressed.
4 . 電極接続用の接着剤が基材に塗布された、 一方のリ一ルに巻いた一方の接着 材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープ の接続方法であって、 他方の接着材テープの始端部はリードテープによりリール に巻き付けてある接着材テープの基材面に貼り付けて止めており、 リードテープ の接着剤面を一方の接着材テープの終端部の接着剤面に重ね合わせ、 重ね合わせ 部分を加熱圧着することを特徴とする接着材テープの接続方法。  4. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with adhesive for electrode connection applied to the base material A method in which the starting end of the other adhesive tape is fixed to the base surface of the adhesive tape wound around the reel with a lead tape, and the adhesive surface of the lead tape is fixed to the adhesive surface of the one adhesive tape. A method for connecting an adhesive tape, wherein the adhesive tape is overlapped on an adhesive surface at a terminal end, and the overlapped portion is heat-pressed.
5 . 電極接続用の接着剤が基材に塗布された、 一方のリールに卷いた一方の接着 材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テープ の接続方法であって、 一方の接着材テープの終端部と、 他方の接着材テープの始 端部とを重ね合わせ、 両者の重ね合わせ部分に係止ピンを挿入して接続すること を特徴とする接着材テ一プの接続方法。 5. Adhesive for connecting electrodes is applied to the base material, and the adhesive tape is used to connect one adhesive tape wound on one reel to the other adhesive tape wound on the other reel. The adhesive tape is characterized in that the end of one adhesive tape and the start of the other adhesive tape are overlapped, and a locking pin is inserted into the overlapped portion and connected. One connection method.
6 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接着 材テープと他方のリールに巻いた他方の接着材テープとを接続する接着材テ一プ を、 係止部材を用いて接続する接着材テープの接続方法であって、 係止部材はー 方及び他方の端部に設けた爪部と爪部間に設けた弾性部材とを備えており、 一方6. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the base material, A method for connecting an adhesive tape to be connected using a locking member, wherein the locking member includes a claw portion provided on one side and the other end, and an elastic member provided between the claw portions.
5 の接着材テープの終端部と他方の接着材テープの始端部とを突き合わせ、 係止部 材の一端に設けた爪部を一方の接着材テープの終端部に係止し、 他端に設けた爪 部を他方の接着材テープの始端部に係止して、 両方の爪部を弾性部材で引き寄せ ていることを特徴とする接着材テープの接続方法。 The end of the adhesive tape of No. 5 and the start of the other adhesive tape are abutted, and the claw provided at one end of the locking member is engaged with the end of one adhesive tape, and provided at the other end. A method for connecting an adhesive tape, wherein the claw portion is engaged with a starting end of the other adhesive tape, and both claw portions are pulled together by an elastic member.
7 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接着 L0 材テープと他方のリールに卷いた他方の接着材テープとを接続する接着材テープ の接続方法であって、 一方の接着材テープの終端部と、 他方の接着材テープの始 端部とを重ね合わせ、 両者の重ね合わせ部分を横断面略コ字状の弾性変形可能な クリヅプで挟んで固定することを特徴とする接着材テープの接続方法。 7. Adhesive tape for connecting one adhesive L0 material tape wound on one reel and the other adhesive tape wound on the other reel with adhesive for electrode connection applied to the base material Where the end of one adhesive tape and the start of the other adhesive tape are overlapped, and the overlapped portion of the two is sandwiched between elastically deformable clips having a substantially U-shaped cross section and fixed. A method for connecting an adhesive tape.
8 . 一方の接着材テープと他方の接着材テープとの重ね合わせ部分を、 一方の接 15 着材テープと他方の接着材テープとの重ね合わせ部分を横断面略断面コ字状の金 属製の挟持片で挟み、 重ね合わせ部分の両面側から挟持片を押しつぶして両者を 接続することを特徴とする接着材テープの接続方法。 8. The overlapping part of one adhesive tape and the other adhesive tape is made of metal with a cross section of approximately U-shape in the overlapping part of one adhesive tape and the other adhesive tape. A method of connecting an adhesive tape, wherein the adhesive tape is sandwiched between the holding pieces, and the two pieces are connected by crushing the holding pieces from both sides of the overlapped portion.
9 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接着 材テープと他方のリールに卷いた他方の接着材テープとを接続する接着剤テープ 9. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the base material
20 の接続方法であって、 一方の接着材テープの終端部と、 他方の接着材テープの始 端部とを、 いずれか一方の基材面に他方の接着剤面を重ね合わせ、 両者の重ね合 わせ長さを接着剤テープの幅の 2倍乃至 5 0倍の範囲として、 両者を加熱圧着し て接続することを特徴とする接着材テ一プの接続方法。 20. The connection method according to claim 20, wherein the end of one adhesive tape and the start of the other adhesive tape are overlapped with one of the base material surfaces and the other adhesive surface is overlapped. A method of connecting an adhesive tape, wherein the combined length is set in a range of 2 to 50 times the width of the adhesive tape, and the two are heated and pressed to be connected.
1 0 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接 25 着材テープと他方のリールに巻いた他方の接着材テープとを接続する接着剤テー プの接続方法であって、 一方の接着材テープの終端部を接着剤が対面する方向に 折り曲げ、 他方の接着材テープの始端部を接着剤が対面する方向に折り曲げ、 両 者の折り曲げ部分を互いに係止して重ね合わせ且つ両者の接着材面を対面させて、 重ね合わせ部分を加熱圧着することを特徴とする接着材テープの接続方法。 10. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with adhesive for electrode connection applied to the base material The connection end of one of the adhesive tapes in the direction in which the adhesive faces. Bend, bend the start end of the other adhesive tape in the direction facing the adhesive, lock the two bent parts together, and superimpose them, and heat-press the overlapped part with both adhesive surfaces facing each other. A method for connecting an adhesive tape.
1 1 . 一方の接着材テープの終端部にはエンドマークが付されていることを特徴 とする請求の範囲第 9項又は請求の範囲第 1 0項に記載の接着材テープの接続方 法。  11. The method for connecting an adhesive tape according to claim 9 or claim 10, wherein an end mark is provided at an end of one adhesive tape.
1 2 . —方の接着材テープと他方の接着材テープとの重ね合わせ部分を、 凹凸を 形成した一方の金型と、 これに嚙み合う他方の金型とで挟んで加熱圧着すること を特徴とする請求の範囲第 9項ないし請求の範囲第 1 1項のいずれかに記載の接 着材テープの接続方法。  1 2. Make sure that the overlapped portion of one adhesive tape and the other adhesive tape is sandwiched between one mold with irregularities and the other The method for connecting an adhesive tape according to any one of claims 9 to 11, characterized in that:
1 3 . —方の接着材テープと他方の接着材テープとの重ね合わせ部分に貫通穴を 形成した後、 重ね合わせ部分を加熱圧着することを特徴とする請求の範囲第 9項 〜請求の範囲第 1 1項のいずれかに記載の接着材テープの接続方法。  13. After forming a through hole in a portion where one of the adhesive tapes and the other adhesive tape overlap each other, heat-pressing the overlapped portion is performed. 11. The method for connecting an adhesive tape according to any one of items 11 to 11.
4 . 電極接続用の接着剤がシリコーン処理基材に塗布された、 一方のリールに卷 いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接続す る接着材テープの接続方法であって、 一方の接着材テープの終端部と他方の接着 材テープの始端部を重ね合わせ又は突き合せて、 両接着材テープのシリコーン処 理基材の表面に跨る部分をシリコーン粘着テープで貼り付けて両接着材テープを 接続することを特徴とする接着材テープの接続方法。  4. An adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the silicone-treated base material. A connection method, in which the end of one adhesive tape and the beginning of the other adhesive tape are overlapped or butted, and the portion of both adhesive tapes that straddles the surface of the silicone-treated base material is a silicone adhesive tape. A method of connecting an adhesive tape, characterized in that the adhesive tapes are attached to each other to connect the adhesive tapes.
1 5 . 請求の範囲第 1 4項に記載のシリコーン粘着テープは、 その粘着剤面の表 面張力と接着材テープのシリコーン処理基材の表面張力との差を 1 O mNZm ( 1 0 d y n e/ c m) 以下とすることを特徴とする接着材テープの接続方法。 15. The silicone pressure-sensitive adhesive tape according to claim 14, wherein the difference between the surface tension of the pressure-sensitive adhesive surface and the surface tension of the silicone-treated base material of the adhesive tape is 1 OmNZm (10 dyne / cm) A method for connecting an adhesive tape, characterized in that:
1 6 . シリコーン粘着テープは、 接着力が 1 0 0 gZ 2 5 mm以上であることを 特徴とする請求の範囲第 1 4項または請求の範囲第 1 5項に記載の接着材テープ の接続方法。 16. The method for connecting an adhesive tape according to claim 14 or claim 15, wherein the silicone adhesive tape has an adhesive force of 100 gZ25 mm or more. .
1 7 . 請求の範囲第 1 6項に記載のシリコーン粘着テープを、 一方の接着材テ一 プの終端部と他方の接着材テープの始端部を重ね合わせ又は突き合せて、 両接着 材テープの両面に亘つて張り付けて接続することを特徴とする接着材テープの接 続方法。 17. The silicone adhesive tape described in claim 16 is attached to one of the adhesive A method of connecting an adhesive tape, wherein the end of the adhesive tape and the beginning of the other adhesive tape are overlapped or abutted, and the two adhesive tapes are attached by bonding over both surfaces.
1 8 . 電極接続用の接着剤がシリコ一ン処理基材に塗布された、 一方のリール に卷いた一方の接着材テープと他方のリールに巻いた他方の接着材テープとを接 続する接着剤テープの接続方法であって、 一方の接着材テープの終端部と他方の 接着材テープの始端部との間にシリコーン粘着剤を両面に塗布したシリコーン粘 着テープを挟んで両接着材テープを接続し、 両面のシリコーン粘着剤はシリコー ン処理基材の表面張力との差が 1 O mN/m ( 1 O d y n e / c m) 以下で、 且 つ接着力が 1 0 0 5 mm以上であることを特徴とする接着材テープの接続 方法。  18. Adhesive for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the silicon-treated substrate A method of connecting adhesive tapes, in which a silicone adhesive tape coated with silicone adhesive on both sides is sandwiched between the end of one adhesive tape and the beginning of the other adhesive tape, and the two adhesive tapes are connected to each other. The silicone adhesive on both sides must have a difference of less than 1 OmN / m (1 Odyne / cm) from the surface tension of the silicone-treated substrate and an adhesive strength of at least 105 mm. A method for connecting an adhesive tape, comprising:
1 9 . 電極接続用の接着剤が基材に塗布された、 一方のリールに巻いた一方の接 着材テープと他方のリールに卷いた他方の接着材テープとを接続する接着剤テ一 プの接続方法であって、 一方の接着材テープの終端部と、 他方の接着材テープの 始端部とを重ね合わせ又は突き合わせ、 ぺ一スト状の樹脂製接着剤を重ね合わせ 部分又は突き合わせ部分に付けて、 ペースト状の樹脂製接着剤を硬化させること で両者を接続することを特徴とする接着材テープの接続方法。  19. Adhesive tape for connecting one adhesive tape wound on one reel and the other adhesive tape wound on the other reel, with the adhesive for electrode connection applied to the base material The end of one adhesive tape and the starting end of the other adhesive tape are overlapped or butted, and a resin adhesive in the form of a paste is attached to the overlapped portion or the butted portion. A method of connecting an adhesive tape by curing a paste-like resin adhesive.
2 0 . 樹脂製接着剤は熱硬化性樹脂、 光硬化性樹脂、 ホットメルト接着剤の群か ら選択される少なくとも 1つの材料からなることを特徴とする請求の範囲第 1 9 項に記載の接着材テープの接続方法。 20. The method according to claim 19, wherein the resin adhesive is made of at least one material selected from the group consisting of a thermosetting resin, a photocurable resin, and a hot melt adhesive. How to connect the adhesive tape.
2 1 . 接着材テープが装着される接着装置には請求の範囲第 1 9項又は請求の範 囲第 2 0項に記載の樹脂製接着剤を供給する充填機が設けられていることを特徴 とする接着材テープの接着装置。  21. The bonding apparatus to which the adhesive tape is mounted is provided with a filling machine for supplying the resinous adhesive according to claim 19 or claim 20. Adhesive tape bonding device.
2 2 . 電極接続用の接着剤が基材に塗布された、 接着材テープをリールに卷いた 接着材テープリールであって、 接着材テープリールはテープの幅方向に接着材テ 一プの卷き部を複数設けたことを特徴とする接着材テ一プリール。 2 2. An adhesive tape reel in which an adhesive tape for electrode connection is applied to a base material, and an adhesive tape is wound on a reel, and the adhesive tape reel is formed by winding an adhesive tape in the width direction of the tape. Adhesive tape characterized by having a plurality of contact portions.
2 3 . 一方の接着材テープの終端部と他方の接着材テープの始端部との間には両 者を接続する連結テープを備えており、 一方の接着材テープの卷き出しが終了す ると、 続いて他方の接着材テープの繰り出しが開始されることを特徴とする請求 の範囲第 2 2項記載の接着材テープリール。 23. A connecting tape is provided between the end of one adhesive tape and the beginning of the other adhesive tape to connect the two, and the unwinding of one adhesive tape is completed. 22. The adhesive tape reel according to claim 22, wherein the feeding of the other adhesive tape is started.
2 4 . 請求の範囲第 2 3項記載の接着材テープリールと、 接着材テープの卷取り リールと、 接着材テ一プリ一ルと卷取りリールとの間に設けられ且つ加熱加圧へ ッドで接着材テープの接着材を電子機器の回路基板に圧着する圧着部と、 連結テ 一プを検知するテ一プ検知手段とを備えた接着装置であって、 テープ検知手段が 連結テープを検知した場合には、 連結テープが圧着部を通過するまで連結テープ を巻取りリールに巻き取ることを特徴とする接着装置。 24. The adhesive tape reel according to claim 23, a take-up reel for the adhesive tape, and a heat and pressure tape provided between the adhesive tape reel and the take-up reel. And a tape detecting means for detecting a connecting tape, wherein the tape detecting means applies the connecting tape to the circuit board of the electronic device. An adhesive device that, when detected, winds up the connecting tape on a take-up reel until the connecting tape passes through the crimping section.
2 5 . 一方の接着材テープの終端部と他方の接着材テープの始端部とを係止具を 用いて接続した接着材テープリールであって、 接続部分は接着材テープで係止具 を覆っていることを特徴とする接着材テープリール。  25. An adhesive tape reel in which the end of one adhesive tape and the beginning of the other adhesive tape are connected using a fastener, and the connection is covered with the adhesive tape. An adhesive tape reel comprising:
2 6 . 請求の範囲第 2 5項に記載の接着材テープリールと、 接着材テープの卷取 りリールと、 接着材テープリールと卷取りリールとの間に設けられ、 且つ、 加熱 加圧へッドで接着材テープの接着材を回路基板に圧着する圧着部と、 テープの接 続部分を検知する接続部検知手段とを備えた接着装置であって、 接続部検知手段 がテープの接続部分を検知した場合には、 接続部分が圧着部を通過するまで一方 の接着材テ一プを卷取りリールに卷き取ることを特徴とする接着装置。  26. An adhesive tape reel according to claim 25, a winding reel of the adhesive tape, and a tape reel provided between the adhesive tape reel and the winding reel, and heating and pressurizing. An adhesive device comprising: a crimping section for crimping the adhesive of the adhesive tape to the circuit board with a pad; An adhesive device characterized by winding one adhesive tape on a take-up reel until a connection portion passes through a crimping portion when the connection is detected.
2 7 . 接続部検知手段は、 C C Dカメラ、 厚み検知センサ、 透過率検知センサの 何れかであることを特徴とする請求の範囲第 2 6項に記載の接着装置。 27. The bonding apparatus according to claim 26, wherein the connection portion detection means is any one of a CCD camera, a thickness detection sensor, and a transmittance detection sensor.
2 8 . —方の接着材テープの終端部と他方の接着材テープの始端部とを係止具を 用いて接続し、 接続部分は接着材テープで係止具を覆うことを特徴とする接着材 テープの接続方法。 28. Adhesion characterized in that the end of one adhesive tape is connected to the start end of the other adhesive tape using a lock, and the connection is covered with the adhesive tape. Material How to connect the tape.
2 9 . 基材に接着剤が塗布されて、 リール状に巻いた接着剤テープであって、 基 材には接着剤がテープの長手方向に複数条配置されていることを特徴とする接着 剤テープ。 29. An adhesive tape in which an adhesive is applied to a base material and wound into a reel shape, wherein a plurality of adhesives are arranged on the base material in the longitudinal direction of the tape. Agent tape.
3 0 . 複数条の接着剤は、 互いに隣合う接着剤条が間隔をあけていることを特徴 とする請求の範囲第 2 9項に記載の接着剤テープ。  30. The adhesive tape according to claim 29, wherein a plurality of adhesive strips have an interval between adjacent adhesive strips.
3 1 . 接着剤は、 テープの長手方向に形成したスリットにより複数条に分離され ていることを特徴とする請求の範囲第 2 9項に記載の接着剤テープ。  31. The adhesive tape according to claim 29, wherein the adhesive is separated into a plurality of strips by slits formed in a longitudinal direction of the tape.
3 2 . 基材に接着剤が塗布され、 リール状に卷いた接着剤テープの製造方法であ つて、 基材の幅方向に間隔をおいて配置した塗布器から、 連続搬送される基材面 上に接着剤を供給することにより、 基材に接着剤を複数条塗布したことを特徴と する接着剤テープの製造方法。  3 2. A method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape, wherein the surface of the base material which is continuously conveyed from an applicator arranged at intervals in the width direction of the base material. A method for producing an adhesive tape, characterized in that a plurality of adhesives are applied to a substrate by supplying an adhesive thereon.
3 3 . 基材に接着剤が塗布され、 リール状に巻いた接着剤テープの製造方法であ つて、 一方の基材の片面全面に接着剤を塗布し、 次に接着剤に長手方向のスリツ トを形成した後、 接着剤面上に他方の基材を配置して一方及び他方の基材で接着 剤を挟み、 次に一方の基材と他方の基材とを互いに離して一方及び他方の基材の それそれに複数条の接着剤を交互に貼着し、 一方及び他方の基材に複数条の接着 剤を間隔をおいて配置したものを製造することを特徴とする接着剤テープの製造 方法。 3 3. A method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound in a reel shape. The adhesive is applied to one entire surface of one of the base materials, and then a slit is formed on the adhesive in a longitudinal direction. After the substrate is formed, the other substrate is placed on the adhesive surface, the adhesive is sandwiched between the one and the other substrates, and then the one and the other substrates are separated from each other and the Adhesive tape, characterized in that a plurality of adhesives are alternately adhered to that of the base material and a plurality of adhesives are arranged at intervals on one and the other base material. Production method.
3 4 . 基材に接着剤が塗布され、 リール状に巻いた接着剤テープを用いて回路基 板に接着剤を圧着する接着剤の圧着方法であって、 基材にはその片面全面に接着 剤が塗布されており、 接着剤テープの幅方向における接着剤の一部を基材側から テープの長手方向に沿って条状に加熱加圧することにより加熱した部分の接着剤 の凝集力を低下させつつ回路基板に圧着し、 圧着後残りの接着剤を基材とともに リール状に巻き取り、 リール状に巻き取つた接着剤テープを再度用いて回路基板 に残りの接着剤を加熱加圧することを特徴とする接着剤テープの圧着方法。 3 5 . 基材に接着剤が塗布され、 リール状に巻いた接着剤テープであって、 接着 剤テープの幅は回路基板の一辺の長さと同じ以上であり、 接着剤はテープの幅方 向に複数条配置されていることを特徴とする接着剤テープ。 ' 5 3 4. Adhesive is applied to the base material, and the adhesive is bonded to the circuit board using an adhesive tape wound in a reel shape. The adhesive is applied, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed in a strip shape from the base material side along the longitudinal direction of the tape to reduce the cohesive force of the adhesive in the heated part After pressing, the remaining adhesive is wound up in a reel shape together with the base material, and the adhesive tape wound in a reel is again used to heat and press the remaining adhesive on the circuit board. Characteristic pressure bonding method of adhesive tape. 3 5. Adhesive tape applied to the base material and wound in a reel shape, the width of the adhesive tape is equal to or greater than the length of one side of the circuit board, and the adhesive is in the width direction of the tape. Adhesive tape characterized by being arranged in a plurality of lines. ' Five
WO 2004/011356 PCT/JP2003/009694  WO 2004/011356 PCT / JP2003 / 009694
3 6 . 複数条の接着剤は、 互いに隣合う接着剤条が間隔をあけていることを特徴 とする請求の範囲第 3 5項に記載の接着剤テープ。 36. The adhesive tape according to claim 35, wherein the plurality of adhesives have an interval between adjacent adhesives.
3 7 . 接着剤は、 テープの幅方向に形成したスリットにより複数条に分離されて いることを特徴とする請求の範囲第 3 5項に記載の接着剤テープ。  37. The adhesive tape according to claim 35, wherein the adhesive is separated into a plurality of strips by slits formed in a width direction of the tape.
3 8 . 基材に接着剤が塗布され、 リール状に巻いた接着剤テープの製造方法であ つて、 一方の基材の全面に接着剤を塗布し、 次に接着剤にテープの幅方向に沿つ てスリツトを形成した後、 接着剤面上に他方の基材を配置して一方及び他方の基 材で接着剤を挟み、 次に一方の基材と他方の基材とを互いに離して一方及び他方 の基材のそれぞれに複数条の接着剤を交互に貼着することにより、 一方及び他方 の基材に複数条の接着剤を間隔をおいて配置したものを製造することを特徴とす る接着剤テープの製造方法。  3 8. A method of manufacturing an adhesive tape in which an adhesive is applied to a base material and wound into a reel. The adhesive is applied to the entire surface of one of the base materials, and then the adhesive is applied in the width direction of the tape. After the slits are formed, the other base material is placed on the adhesive surface, the adhesive is sandwiched between one and the other base materials, and then the one base material and the other base material are separated from each other. The method is characterized in that a plurality of adhesives are alternately stuck to each of the one and the other substrates to produce a plurality of the adhesives arranged at intervals on the one and the other substrates. Manufacturing method of adhesive tape.
3 9 . 請求の範囲第 3 5項〜第 3 7項のいずれかに記載の接着剤テープを回路基 板上に配置し、 接着剤テープを幅方向に沿って加熱加圧することにより回路基板 の一辺に接着剤条を圧着することを特徴とする接着剤テープの圧着方法。  39. The adhesive tape according to any one of claims 35 to 37 is disposed on a circuit board, and the adhesive tape is heated and pressed along the width direction to form a circuit board. A method for crimping an adhesive tape, comprising: crimping an adhesive strip on one side.
L5 4 0 . 請求の範囲第 3 5項〜第 3 7項のいずれかに記載の接着剤テープを回路基 板を移動する搬送路に少なくとも 2つ配置し、 一方の接着剤テープはその幅方向 が搬送路に直交する方向に S置し、 他方の接着剤テープはその幅方向を搬送路に 沿う方向に配置し、 一方の接着剤テープにおいて、 回路基板の対向する 2辺につ いて接着剤テープを幅方向に沿って加熱加圧することにより回路基板の対向する 0 2辺に接着剤条を圧着し、 次に回路基板を他方の接着剤テープへ移動し、 回路基 板の残りの 2辺について基材側から接着剤テープを幅方向に沿って加熱加圧する ことにより、 回路 ¾反の四周に接着剤条を圧着することを特徴とする接着剤テ一 プの圧着方法。  L540. At least two adhesive tapes according to any one of claims 35 to 37 are arranged on a transport path for moving the circuit board, and one of the adhesive tapes is in the width direction. Is placed in the direction perpendicular to the transport path, and the other adhesive tape is placed in the width direction along the transport path.In one adhesive tape, the adhesive is applied to the two opposite sides of the circuit board. The tape is heated and pressed along the width direction, so that the adhesive strip is pressed against the opposing sides of the circuit board, and then the circuit board is moved to the other adhesive tape, and the other two sides of the circuit board are moved. A method for crimping an adhesive tape, characterized in that an adhesive tape is heated and pressed along the width direction from the base material side so that an adhesive strip is crimped around the four sides of the circuit.
4 1 . 基材の片面全面に接着剤が塗布され、 リール状に巻いた接着剤テープを用 いて回路基板に接着剤を圧着する接着剤テープの圧着方法であって、 接着剤テ一 プの幅は回路基板の一辺の長さ以上を有しており、 接着剤テープの幅方向におけ る接着剤の一部を幅方向に加熱加圧することにより加熱した部分の接着剤の凝集 力を低下させつつ回路基板に接着剤を圧着することを特徴とする接着剤テープの 圧着方法。 4 1. Adhesive is applied to the entire surface of one side of the base material, and the adhesive tape is applied to the circuit board using an adhesive tape wound in a reel shape. The width is longer than the length of one side of the circuit board. A method for crimping an adhesive tape, characterized in that a pressure is applied to a circuit board while reducing the cohesive force of the adhesive in a heated portion by heating and pressing a part of the adhesive in a width direction.
4 2 . —方のリールと、 他方のリールと、 これらのリールを回転自在に保持しつ つ収納するケースとを備え、 一方のリールには基材に接着剤が塗布された接着剤 テープが巻かれており、他方のリ一ルには接着剤テープの一端が固定されており、 接着剤テープにはテープの長手方向に沿って接着剤が少なくとも 2条配置されて いることを特徴とする接着剤テープカセット。  4 2 .-- one reel, the other reel, and a case for rotatably holding and holding these reels, and one reel has an adhesive tape formed by applying an adhesive to a base material. One end of an adhesive tape is fixed to the other reel, and the adhesive tape has at least two lines of adhesive arranged along the longitudinal direction of the tape. Adhesive tape cassette.
4 3 . 少なくとも 2条の接着剤は、 互いに隣合う接着剤条が間隔をあけているこ とを特徴とする請求の範囲第 4 2項に記載の接着剤テープカセット。  43. The adhesive tape cassette according to claim 42, wherein at least two adhesive strips are arranged such that adjacent adhesive strips are spaced apart from each other.
4 4 . 接着剤は、 テープの長手方向に形成したスリットにより少なくとも 2条に 分離されていることを特徴とする請求の範囲第 4 2項に記載の接着剤テープカセ ッ卜。  44. The adhesive tape cassette according to claim 42, wherein the adhesive is separated into at least two lines by slits formed in a longitudinal direction of the tape.
4 5 . —方のリールと、 他方のリールと、 これらのリールを回転自在に保持しつ つ収納するケースとを備え、 一方のリールには基材に接着剤が塗布された接着剤 テープが巻かれており、 他方のリ一ルには接着剤テープの一端が固定されている 接着剤テープカセットを圧着装置に装着し、 接着剤テープを接着剤テープカセ ットから回路基板上に引き出して、 接着剤テープの幅方向の一部を加熱加圧する ことにより、 加熱した部分の接着剤の凝集力を低下させて幅方向の一部の接着剤 を回路基板に圧着することを特徴とする接着剤テープカセヅトを用いた接着剤の 圧着方法。  4 5 .-- one reel, the other reel, and a case for rotatably holding and storing these reels, and one reel is provided with an adhesive tape having an adhesive applied to a base material. An adhesive tape cassette with one end of the adhesive tape fixed to the other reel is attached to the crimping device, and the adhesive tape is pulled out from the adhesive tape cassette onto the circuit board, An adhesive characterized by reducing the cohesive force of the heated portion of the adhesive by heating and pressing a part of the adhesive tape in the width direction, and pressing a part of the adhesive in the width direction onto the circuit board. Adhesive bonding method using tape cassette.
4 6 . —方のリールと、 他方のリールと、 これらのリールを回転自在に保持しつ つ収納するケースとを備え、 一方のリールには基材に接着剤が塗布された接着剤 テープが卷かれており、 他方のリ一ルには接着剤テープの一端が固定されている 接着剤テープカセットを圧着装置に装着し、 接着剤テープを接着剤テープカセ ヅトから回路基板上に引き出して、 接着剤テープの幅方向の一部を加熱加圧する ことにより、 加熱した部分の接着剤の凝集力を低下させて幅方向の一部の接着剤 を回路基板に圧着し、 一方のリールに卷かれた接着剤テープが終了したら接着剤 テープカセットを裏返して残り部分の接着剤を回路基板に圧着することを特徴と する接着剤テープカセットを用いた接着剤の圧着方法。 4 6 .-- One reel, the other reel, and a case for rotatably holding and holding these reels, and one reel is provided with an adhesive tape having a base material coated with an adhesive. An adhesive tape cassette with one end of the adhesive tape fixed to the other reel is mounted on the crimping device, and the adhesive tape is pulled out from the adhesive tape cassette onto the circuit board. Heat and press a part of the width of the adhesive tape in the width direction This reduces the cohesive force of the adhesive in the heated area and presses a part of the adhesive in the width direction onto the circuit board, and when the adhesive tape wound on one reel ends, the adhesive tape cassette is turned over. And bonding the remaining portion of the adhesive to the circuit board by using an adhesive tape cassette.
4 7 . 基材に塗布され、 リール状に卷いた接着剤テープであって、 基材は熱溶融 剤層及び支持層を備えていることを特徴とする接着材テープ。 47. An adhesive tape applied to a base material and wound into a reel, wherein the base material has a hot-melt agent layer and a support layer.
4 8 . 支持層が熱溶融剤層に挟まれていることを特徴とする請求の範囲第 4 7項 に記載の接着材テープ。  48. The adhesive tape according to claim 47, wherein the support layer is sandwiched between the hot melt layers.
9 . 熱溶融剤層が支持層に挟まれていることを特徴とする請求の範囲第 4 7項 に記載の接着材テープ。  9. The adhesive tape according to claim 47, wherein the hot-melt agent layer is sandwiched between support layers.
5 0 . —方のリールに卷いた一方の接着材テープと他方のリールに巻いた他方の 接着材テープとを接続する接着材テープの接続方法であって、 接着材テープは離 型剤で表面処理した基材と接着剤とを備え、 いずれか一方の接着材テープの基材 端部の離型剤を除去し、その部分に他方の接着材テープの接着剤面を重ね合わせ、 両者の重ね合わせ部分を加熱圧着して接続することを特徴とする接着材テープの 接続方法。  50. This is a method of connecting an adhesive tape that connects one adhesive tape wound on one reel to the other adhesive tape wound on the other reel, and the adhesive tape is surfaced with a release agent. Equipped with the treated base material and adhesive, remove the release agent from the end of the base material of one of the adhesive tapes, and superimpose the adhesive surface of the other adhesive tape on that part. A method for connecting an adhesive tape, wherein the joining portions are connected by heating and pressure bonding.
5 1 . 離型剤の除去は、 プラズマ放電、 紫外線照射、 レーザ照射の何れか 1つに より行うことを特徴とする請求の範囲第 1項に記載の接着材テープの接続方法。 5. The method for connecting an adhesive tape according to claim 1, wherein removal of the release agent is performed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation.
5 2 . 両側板を有するリールに巻いた接着材テープリールであって、 接着材テ一 プリ一ルはテープの幅方向に接着材テープの巻き部を複数設けていることを特徴 とする接着材テープリール。 5 2. An adhesive tape reel wound on a reel having both side plates, wherein the adhesive tape is provided with a plurality of adhesive tape winding portions in the width direction of the tape. Tape reel.
5 3 . リールの側板には乾燥剤の収納部が設けられていることを特徴とする請求 の範囲第 5 2項記載の接着材テ一プリ一ル。  53. The adhesive tape according to claim 52, wherein a storage portion for a desiccant is provided on a side plate of the reel.
5 4 . リールに巻かれた接着材テープの周囲を覆うカバ一部材がリールに着脱自 在に設けられていることを特徴とする請求の範囲第 5 2項または請求の範囲第 5 54. Claim 52 or Claim 5 wherein a cover member covering the periphery of the adhesive tape wound on the reel is provided on the reel independently.
3項に記載の接着剤テープリール。 The adhesive tape reel according to item 3.
5 5 . カバー部材は接着材テープの引出し口を備えることを特徴とする請求の範 囲第 5 4項に記載の接着材テ一プリ一ル。 55. The adhesive tape according to claim 54, wherein the cover member has an outlet for an adhesive tape.
5 6 . 接着材テープの卷き部は互いの側板同士が着脱自在に嵌合していることを 特徴とする請求の範囲第 5 2項又は請求の範囲第 5 3項に記載の接着材テープリ —ル。  56. The adhesive tape tape according to claim 52 or claim 53, wherein the side plates of the wound portion of the adhesive tape are detachably fitted to each other. —Le.
5 7 . 接着材テープが、 相対向する電極を接続する電極接続用の接着剤が基材に 塗布された接着材テープである請求の範囲第 5 2項又は請求の範囲第 5 3項に記 載の接着剤テープリール。  57. The adhesive tape according to claim 52 or claim 53, wherein the adhesive tape is an adhesive tape in which an adhesive for connecting electrodes for connecting opposing electrodes is applied to a base material. Adhesive tape reel.
5 8 . 接着材テープが、 リードフレームの固定用支持基板若しくは半導体素子搭 載用支持基板又はリードフレームのダイと半導体素子とを接続する接着材テープ である請求の範囲第 5 2項又は請求の範囲第 5 3項に記載の接着剤テープリール。 58. The adhesive tape for connecting the semiconductor device to the supporting substrate for fixing the lead frame or the supporting substrate for mounting the semiconductor element, or the die of the lead frame and the semiconductor element. An adhesive tape reel according to item 53.
5 9 . —方のリールと、 他方のリールと、 一方のリールと他方のリールの回転を 連動するギアユニットと、 これらを収納するケースと、 ケースの開口部に配置し た加熱部材と、 加熱部材に電力を供給する電源手段とを備える接着具であって、 一方のリ一ルには基材に接着剤が塗布された接着剤テープが巻かれており、 他方 のリールには接着剤テープの一端が固定されており、 加熱部材は供給された電力 により発熱する電熱部材を備え、 一方のリールに卷かれた接着剤テープをケース の開口部に引き出して、 加熱部材で開口部にある接着剤テープを基材側から加熱 加圧することにより接着剤を回路基板に圧着し、 接着剤が剥がれた基材を他方の リ一ルで卷き取ることを特徴とする接着具。 5 9 .—The other reel, the other reel, a gear unit that interlocks the rotation of one reel and the other reel, a case that stores them, a heating member that is arranged in the opening of the case, and heating. An adhesive having power supply means for supplying power to a member, wherein one of the reels is wound with an adhesive tape having an adhesive applied to a base material, and the other reel is an adhesive tape. The heating member is provided with an electric heating member that generates heat by the supplied electric power, and the adhesive tape wound on one of the reels is drawn out to the opening of the case, and the heating member is used to bond the adhesive tape at the opening. An adhesive tool, wherein an adhesive tape is heated and pressed from the base material side to press the adhesive onto the circuit board, and the base material from which the adhesive has been peeled off is wound up with the other reel.
6 0 . 基材に塗布された接着材テープであって、 ¾¾·は金属フィルム又は芳香族 ポリアミドフィルムからなることを特徴とする接着材テープ。  60. An adhesive tape applied to a substrate, wherein the adhesive tape is made of a metal film or an aromatic polyamide film.
6 1 . 基材の厚さは l〃m〜2 5 であることを特徴とする請求の範囲第 6 0 項に記載の接着材テープ。  61. The adhesive tape according to claim 60, wherein the thickness of the base material is l〃m to 25.
6 2 . 基材の引張強度は 2 5 °Cで 3 0 O M P a以上であることを特徴とする請求 の範囲第 6 0項又は請求の範囲第 6 1項に記載の接着材テープ。 62. The adhesive tape according to claim 60 or claim 61, wherein the base material has a tensile strength of 30 OMPa or more at 25 ° C.
6 3 . 基材の接着剤に対する厚みの比が 0 . 0 1〜1 . 0であることを特徴とす る請求の範囲第 6 0項又は請求の範囲第 6 1項に記載の接着材テープ。 63. The adhesive tape according to claim 60 or claim 61, wherein the ratio of the thickness of the base material to the adhesive is 0.01 to 1.0. .
6 4 . 基材の表面粗さ Rm axが 0 . 5〃111以下であることを特徴とする請求の範 囲第 6 0項又は請求の範囲第 6 1項に記載の接着材テープ。 6 4. Surface roughness R m ax of substrate 0. 5〃111 adhesive tape according to the sixth 1 wherein the range囲第6 0 1 or claims claims, wherein less.
6 5 . 基材に接着剤が塗布され、 リール状に卷いた接着材テープを用いて被着体 に接着剤を形成する接着材テープの接着材形成方法であって、 複数のリールから 夫々接着材テープを引き出して、 各接着材テ一プを重ね合わせて一体にし、 一方 の基材を剥離するとともに、 重ね合わせて一体にした接着剤を被着体に形成する ことを特徴とする接着材テープの接着材形成方法。  6 5. An adhesive forming method for an adhesive tape in which an adhesive is applied to a base material and an adhesive is formed on an adherend using an adhesive tape wound in a reel shape. An adhesive characterized in that the adhesive tape is pulled out, the adhesive tapes are overlapped and integrated, and one of the base materials is peeled off, and the integrated adhesive is formed on the adherend. A method for forming a tape adhesive.
6 6 . 一方の接着材テープの接着剤のみに硬化剤を含有していることを特徴とす る請求の範囲第 6 5項に記載の接着材テープの接着材形成方法。  66. The adhesive tape forming method according to claim 65, wherein only one of the adhesive tapes contains a curing agent.
6 7 . フィルム状の接着剤を有する異方導電材を芯材の長手方向に多数回卷き積 層したことを特徴とする異方導電材テープ。  67. An anisotropic conductive material tape comprising an anisotropic conductive material having a film-like adhesive wound and wound many times in the longitudinal direction of a core material.
6 8 . 前記異方導電材が、 フィルム状の接着剤の片面に基材フィルムを設けた 2 層構造の異方導電材である請求の範囲第 6 7項に記載の異方導電材テープ。 68. The anisotropic conductive material tape according to claim 67, wherein said anisotropic conductive material is a two-layered anisotropic conductive material having a base film provided on one surface of a film-like adhesive.
6 9 . 前記異方導電材が、 フィルム状の接着剤の両面に基材フィルムを設けた 3 層構造の異方導電材である請求の範囲第 6 7項に記載の異方導電材テープ。69. The anisotropic conductive material tape according to claim 67, wherein the anisotropic conductive material is a three-layered anisotropic conductive material in which a base material film is provided on both sides of a film adhesive.
7 0 . 前記基材フィルムの片面または両面が剥離処理されている請求の範囲第 6 8項または請求の範囲第 6 9項に記載の異方導電材テープ。 70. The anisotropic conductive material tape according to claim 68 or claim 69, wherein one or both surfaces of said base film are subjected to a release treatment.
7 1 . 前記フィルム状の接着剤の幅が、 0 . 5〜5 mmである請求の範囲第 6 7 項ないし請求の範囲第 6 9項のいずれかに記載の異方導電材テープ。  71. The anisotropic conductive material tape according to any one of claims 67 to 69, wherein the width of the film-like adhesive is 0.5 to 5 mm.
7 2 .基材フィルムの強度が、 1 2 k gZmm2以上で、伸びが、 6 0〜 2 0 0 %、 厚みが、 1 0 0 z m以下である請求の範囲第 6 8項又は請求の範囲第 6 9項に記 載の異方導電材テ一プ。 72.Claim 68 or claim wherein the strength of the base film is 12 kgZmm 2 or more, the elongation is 60 to 200%, and the thickness is 100 zm or less. Anisotropic conductive material tape described in Item 69.
PCT/JP2003/009694 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape WO2004011356A1 (en)

Applications Claiming Priority (34)

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JP2002221225A JP2004059776A (en) 2002-07-30 2002-07-30 Anisotropic conductive material tape
JP2002-221225 2002-07-30
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JP2003-130196 2003-05-08
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JP2003176322A JP2005330297A (en) 2003-06-20 2003-06-20 Method of forming adhesive material by adhesive material tape
JP2003-176321 2003-06-20
JP2003176321A JP2005330296A (en) 2003-06-20 2003-06-20 Connecting method of adhesive material tape

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