CN104152075B - Adhesive material band and crimping method therefor - Google Patents

Adhesive material band and crimping method therefor Download PDF

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Publication number
CN104152075B
CN104152075B CN201410378540.3A CN201410378540A CN104152075B CN 104152075 B CN104152075 B CN 104152075B CN 201410378540 A CN201410378540 A CN 201410378540A CN 104152075 B CN104152075 B CN 104152075B
Authority
CN
China
Prior art keywords
adhesive material
bonding agent
material tape
spool
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201410378540.3A
Other languages
Chinese (zh)
Other versions
CN104152075A (en
Inventor
福岛直树
立泽贵
福富隆广
小林宏治
柳川俊之
汤佐正己
有福征宏
后藤泰史
塚越功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN104152075A publication Critical patent/CN104152075A/en
Publication of CN104152075B publication Critical patent/CN104152075B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

The invention relates to an adhesive material band and a crimping method therefor. The adhesive material band is an adhesive belt on which an adhesive agent is coated and is rolled into a shaft shape. The adhesive material band is characterized in that pluralities of adhesive agent bars are arranged in the width direction of the band. According to the adhesive material band and the crimping method, an terminal end part of the adhesive material band where the adhesive agents are used up and a starting end part of a newly installed adhesive material band are bonded, and the adhesive material reel can be changed. Thus, each time a new adhesive material band is changed, operation of changing the rolling shaft and installing the starting end of the adhesive material band on the rolling shaft is not needed. Thus new adhesive material band change time can be saved, and electronic machine production efficiency can be improved.

Description

Adhesive material tape and its compression bonding method
The application is to submit on July 30th, 2003, and Application No. 03818084.7 is entitled《Adhesive material tape and its Method of attachment, manufacture method, compression bonding method, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, using their bonding agent Compression bonding method and anisotropic conductive material band》Patent application divisional application.
Technical field
The present invention relates to while one kind between electronic devices and components and circuit board or circuit board by being adhesively fixed, make the two Electrode between the adhesive material tape and attaching method thereof, manufacture method, compression bonding method, adhesive material tape spool, viscous that electrically connects Connection device, adhesive agent-tape cassette, using adhesive agent-tape cassette bonding agent compression bonding method, be particularly rolled into the adhesivess of reel Band and attaching method thereof, manufacture method, compression bonding method, adhesive material tape spool, adhering device, adhesive agent-tape cassette, use bonding The compression bonding method and anisotropic conductive material band of the bonding agent of agent tape drum.
Background technology
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is adhesively fixed between part and circuit board, circuit board, and makes the means electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the reel that is rolled into that adhesivess are coated with base material is disclosed Adhesive material tape.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape rolled out from adhesive material reel, is crimped onto bonding agent on circuit board etc. with thermal head, and The base material of residual is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has the volume of base material Axle is taken, new winding off spindle is installed on adhering device with new adhesive material reel, and the top of adhesive material tape is installed To on winding off spindle.
With the maximization of the panel of PDP etc. in recent years, the bond area (or size of surrounding a line) of circuit board Increase, the consumption of the bonding agent for once being used also is continuously increased.Further, since the purposes of bonding agent is also extended so that viscous Connecing the consumption of agent increases.Therefore, the replacing frequency of the adhesive material reel of the manufacturer of e-machine becomes many, viscous due to changing Material spool trouble is connect, therefore the problem for existing is the production efficiency that can not improve e-machine.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, reduces the replacing frequency of spool, but, because the bandwidth of adhesive material tape is too narrow to 1～3mm, if The number of turns increase be possible to occur volume disintegration phenomenon.In addition, if the number of turns increases, act on and be rolled on the adhesivess band of banding Pressure increases, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the diameter dimension of spool can also become big, it is difficult to be arranged on existing On some adhering devices, existing adhering device is possible to be used again.
The content of the invention
Therefore, it is an object of the invention to provide a kind of replacing that can simply carry out adhesive material reel, realizes electricity It is the method for attachment of the adhesive material tape that the production efficiency of handset device is improved and adhesive material tape, its manufacture method, compression bonding method, viscous Connect material spool of tape, adhering device, adhesive agent-tape cassette, using the compression bonding method and anisotropic conductive material of their bonding agent Band.
The method of attachment of the adhesive material tape of the 1st scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is overturn, gluing for a side is made The adhesive side for connecing the adhesive side of material strips and the adhesive material tape of the opposing party is Chong Die, and to the lap of the two hot pressing is carried out Connect it.
According to the invention of the 1st scheme, because the bonding agent using adhesive material tape will unreel the adhesive material tape for finishing Terminal part be bonded together with the initial portion of the new adhesive material tape installed, carry out the replacing of adhesive material reel, therefore, Simply new adhesive material tape can be installed to adhering device.In addition, when carrying out the replacing of new adhesive material tape every time, no Must carry out coiling band replacing, the top of new adhesive material tape is installed to the operation on winding off spindle, on given route The operation of pilot pin etc. is set, therefore, the replacing construction of new adhesive material reel improves the production of e-machine without oversize Efficiency.
Further, since the terminal part for unreeling the adhesive material tape for finishing is overturn, the adhesive side of adhesive material tape is made Overlap each other with the adhesive side of the new adhesive material tape installed and be bonded together, therefore bonding strength is high.
If the thermo-compression bonding of coupling part, can be reasonably using the thermal head of the adhering device for installing adhesive material reel Using adhering device.
The method of attachment of the adhesive material tape of the 2nd scheme of the present invention is on the basis of the 1st scheme, it is characterised in that Terminal label is provided with the terminal part of the adhesive material tape of a side.
According to the invention of the 2nd scheme, while can playing with the 1st scheme identical action effect, due to can be Carry out unreeling the cut-out of the adhesive material tape for finishing when exposing terminal label, therefore, easily distinguish and cut off and connected work The part of industry, and can be attached in necessary minimal position such that it is able to prevent the waste of adhesive material tape.
The method of attachment of the adhesive material tape of the 3rd scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The initial portion of the adhesive material tape of the opposing party, is directed band and pastes On the substrate surface of the adhesive material tape being fixed on spool, in the terminal part of the adhesive material tape for overturning a side it is divided Afterwards, the adhesive side and the adhesive side of the terminal part of the adhesive material tape of a side for making guiding band overlaps, to lap It is thermally compressed.
It is identical with the invention of the 1st scheme according to the invention of the 3rd scheme, simply can install new to adhering device Adhesive material tape, in addition, the replacing construction of new adhesive material reel improves the production efficiency of e-machine without oversize.
Further, since using the guiding band of adhesive material tape, will unreel the terminal part of the adhesive material tape for finishing with it is new The initial portion of the adhesive material tape of installation is bonded together, therefore, it is possible to simply carry out the bonding between adhesive material tape.
The method of attachment of the adhesive material tape of the 4th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The initial portion of the adhesive material tape of the opposing party, is directed band and pastes On the substrate surface of the adhesive material tape being fixed on spool, the adhesive side of guiding band and the adhesive material tape of a side are made The adhesive side of terminal part overlap, lap is thermally compressed.
It is identical with the invention of the 1st scheme according to the invention of the 4th scheme, simply can install new to adhering device Adhesive material tape, in addition, the replacing construction of new adhesive material reel improves the production efficiency of e-machine without oversize.
Further, since need not overturn that the adhesive material tape for finishing is unreeled, glue therefore, it is possible to prevent from being wound on winding off spindle Volume is likely to occur when connecing material strips to collapse.
The method of attachment of the adhesive material tape of the 5th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is made, it is viscous with the opposing party The initial portion for connecing material strips overlaps, and inserts locking pin in the lap of the two and is attached.
According to the invention of the 5th scheme, due to by locking pin will unreel the terminal part of the adhesive material tape for finishing with The initial portion of the new adhesive material tape installed is fixed up, therefore, connection is simple.In addition, carrying out new adhesivess every time During the replacing of spool, due to carrying out the replacing of coiling band, the top of new adhesive material tape is installed on winding off spindle Operation, the operation that pilot pin etc. is set on given route, therefore, the replacing construction of new adhesive material reel without oversize, Improve the production efficiency of e-machine.
The method of attachment of the adhesive material tape of the 6th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, by the adhesive material tape of a side of the connection on the spool of a side and on the spool of the opposing party The adhesive material tape of adhesive material tape of the opposing party coupled together using engagement device, it is characterised in that：Engagement device has setting Claw on the end of a side and the opposing party and the elastic component being arranged between claw, by the end of the adhesive material tape of a side End part is relative to each other with the initial portion of the adhesive material tape of the opposing party, and the claw being arranged on one end of engagement device is locking On the terminal part of the adhesive material tape of a side, the claw for arranging on an opposite end is engaging in into the adhesive material tape of the opposing party Initial portion on, the claw of two sides is furthered by elastic component.
Adhesive material tape according to the invention of the 6th scheme, due to the claw of a side of engagement device to be engaging in a side On terminal part, the claw of the opposing party of engagement device is engaging on the initial portion of the adhesive material tape of the opposing party afterwards, will The two is interconnected, therefore, connection is easy.Further, since having elasticity between the claw of a side and the claw of the opposing party The claw of the opposing party of engagement device can be engaging in the beginning of the adhesive material tape of the opposing party after component, therefore elastic component elongation On the optional position of end part, therefore the degree of freedom for connecting is high.
Further, since terminal part and the opposing party of the adhesive material tape of a side adhesive material tape initial portion that It is attached in the state of this is relative, therefore, there is no need to that belt overlaps each other, due in necessary minimal position Put and be attached such that it is able to prevent the waste of adhesive material tape.
The method of attachment of the adhesive material tape of the 7th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is made, it is viscous with the opposing party The initial portion for connecing material strips overlaps, with the clip of the elastically deformable of cross section substantially U-shaped, by the overlap of the two Clamp and fixed part.
According to the invention of the 7th scheme, due to only with clip by the terminal part of the adhesive material tape of a side and the opposing party The lap of initial portion of adhesive material tape clamp and just can be attached, therefore, connection operation is easy.
The method of attachment of the adhesive material tape of the 8th scheme of the present invention, it is characterised in that：With cross section substantially U-shaped Metal holding piece, the adhesive material tape of a side is clamped with the lap of the adhesive material tape of the opposing party, from overlapping portion Press holding piece so as to the two be coupled together in two surface sides being divided to.
According to the invention of the 8th scheme, the two is coupled together due to pressing holding piece from the two sides of lap, because This, it is possible to increase the bonding strength of the lap of adhesive material tape.
The method of attachment of the adhesive material tape of the 9th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is made, it is viscous with the opposing party The substrate surface of either one and the adhesive side of the opposing party for connecing the initial portion of material strips overlaps, and makes the overlap length of the two exist In the range of 2 times to 50 times of the width of bonding agent band, carrying out thermo-compression bonding to the two connects it.
According to the invention of the 9th scheme, due to the bonding agent using adhesive material tape, by end-of-use adhesive material tape Terminal part is bonded together with the initial portion of the new adhesive material tape installed, and carries out the replacing of adhesive material reel, accordingly, it is capable to It is enough simply new adhesive material reel to be installed to adhering device.In addition, when carrying out the replacing of new adhesive material reel every time, Due to the replacing that need not carry out winding off spindle, the operation being installed to the top of new adhesivess on winding off spindle, therefore, new is viscous The replacing construction of material spool is connect without oversize, the production efficiency of e-machine is improve.
The length for why making lap is 2 times to 50 times of the width of bonding agent band, is because if less than 2 times, Enough bonding strengths cannot be just obtained, if it exceeds 50 times, the adhesivess that coupling part is used are just excessive, produce bonding The waste of material.
If the thermo-compression bonding of coupling part uses the thermal head of the adhering device for installing adhesive material reel, it becomes possible to rationally Using adhering device.
Bonding agent both can be the bonding of the anisotropic conductive that conducting particles is dispersed with the bonding agent of insulating properties Agent, it is also possible to simply insulating properties bonding agent, can be dispersed with the spacer particle of insulating properties in these bonding agents.
The method of attachment of the adhesive material tape of the 10th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：By the terminal part of the adhesive material tape of a side towards bonding agent phase The direction bending for facing, by the initial portion of the adhesive material tape of the opposing party towards the facing direction bending of bonding agent, makes two The mutual locking overlap of the dogleg section of person, and make the adhesive side of the two facing, lap is thermally compressed.
According to the invention of the 10th scheme, while the invention identical action effect with the 1st scheme can be played, due to Terminal part and the initial portion of the adhesive material tape of the opposing party of adhesive material tape of a side are made mutually with hook-shaped locking, and is made The adhesive side of the two is interconnected, therefore bonding strength is high.
The method of attachment of the adhesive material tape of the 11st scheme of the present invention is that on the basis of the 9th or the 10th scheme, it is special Levy and be, in the terminal part of the adhesive material tape of a side terminal label is provided with.
According to the invention of the 11st scheme, while the invention identical action effect with the 9th or the 10th scheme can be played, Because the terminal part of the adhesive material tape of a side can be carried out in terminal label part, therefore, easily distinguish and be attached work The part of industry, and can be attached in necessary Min. position, the waste of adhesive material tape can be prevented.In addition, can Automatic detection terminal label part, is controlled according to the detection signal to device, or sends alarm such that it is able to improve operation Efficiency.
The method of attachment of the adhesive material tape of the 12nd scheme of the present invention is the basis of any one in the 9th～11 scheme On, it is characterised in that the mould for forming an irregular side, and the mould of the opposing party being engaged with it are used, the viscous of a side is clamped Connect material strips to be thermally compressed with the lap of the adhesive material tape of the opposing party.
According to the invention of the 12nd scheme, can play and the 9th～11 scheme any one invention identical action effect Meanwhile, by forming concavo-convex in coupling part such that it is able to extend connection area, while can carry because of the engaging of jog The bonding strength of the draw direction (length direction) of high adhesive material tape.
The method of attachment of the adhesive material tape of the 13rd scheme of the present invention is the basis of any one in the 9th～11 scheme On, it is characterised in that after adhesive material tape and the lap of the adhesive material tape of the opposing party of a side define through hole, Lap is thermally compressed.
According to the invention of the 13rd scheme, can play and the 9th～11 scheme any one invention identical action effect Meanwhile, by forming through hole in coupling part, so that bonding agent oozes out in the inner circumferential of through hole, increased the bonding plane of bonding agent Product, therefore, it is possible to further improve bonding strength.
The method of attachment of the adhesive material tape of the 14th scheme of the present invention is applied on the silicone-treated base material of adhesive material tape Electrode connecting adhesive is furnished with, the adhesive material tape of the side on the spool of a side, with the volume wound on the opposing party The adhesive material tape of the opposing party on axle is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is made, it is and another The initial portion of the adhesive material tape of one side overlaps or toward each other, is pasted across two adhesive material tapes with silicone adhesive tape Silicone-treated base material surface part, so as to two adhesive material tapes be coupled together.
According to the invention of the 14th scheme, the adhesive material reel of the adhesive material tape of a side will be wound with, and be only wound The winding off spindle of the base material of adhesive material tape is arranged in adhering device, when the adhesive material tape of adhesive material reel has been used up When, by silicone adhesive tape, by the terminal part of end-of-use adhesive material tape (adhesive material tape of a side) and new installation The initial portion of the adhesive material tape (adhesive material tape of the opposing party) of adhesive material reel is coupled together, and is replaced end-of-use and is glued Material spool is connect, new adhesive material reel is installed in adhering device.
In the present invention, due to only coupling together end-of-use adhesive material tape with new adhesive material tape, spool is carried out Replacing, therefore, it is possible to simply to adhering device install new adhesive material reel.In addition, carrying out new bonding material every time During the replacing of material spool, due to carrying out the replacing of winding off spindle, the top of new adhesive material tape is installed on winding off spindle Or adhesive material tape is hung over operation on guiding piece, therefore, the replacing construction of new adhesive material reel is improved without oversize The production efficiency of e-machine.
By being surface-treated to the base material of adhesive material tape with silicone, silicone is also used on the splicing tape for being used Sticker, the difference of the surface tension due to reducing the two improves closing force, therefore, it is possible to highly difficult both before realizing Bonding.
The bonding agent of adhesive material tape both can be the anisotropy that conducting particles is dispersed with the bonding agent of insulating properties The bonding agent of electric conductivity, it is also possible to simply insulating properties bonding agent, it is also possible to which the spacer particle of insulating properties is dispersed in into these bondings In agent.
The method of attachment of the adhesive material tape of the 15th scheme of the present invention is that on the basis of the 14th scheme, its feature exists Exist in, the surface tension in the sticker face of silicone adhesive tape, and the difference of the surface tension of the silicone-treated base material of adhesive material tape 10mN/m (10dyne/cm) is below.
According to the invention of the 15th scheme, while can playing the invention identical action effect with the 14th scheme, By the difference for making the surface tension of the surface tension of the adhesive side of silicone adhesive tape and the silicone-treated base material of adhesive material tape For 10mN/m (10dyne/cm) below, strong closing force can be obtained such that it is able to be reliably bonded together the two.Surface Tension force can be measured with moistening reagent, contact angle.
The difference of the surface tension of the silicone-treated base material of adhesive material tape and the adhesive side of silicone adhesive tape is preferably 0～ 5mN/m(5dyne/cm).This is because the difference of surface tension is the smaller the better, if its value is arrived more than 10mN/m (10dyne/cm) greatly When, it is likely that enough dhering strengths can not be obtained.
The method of attachment of the adhesive material tape of the 16th scheme of the present invention is its feature on the basis of the 14th or 15 schemes It is that the bonding force of silicone adhesive tape is in more than 100g/25mm.
According to the invention of the 16th scheme, can play same with the invention identical action effect of the 14th or 15 schemes When, glued due in the connection of a side and the adhesive material tape of the opposing party, can all paste silicone in the adhesive side of the two Band carries out bonding, therefore, by the way that the adhesive material tape of a side and the opposing party is got up from two sides bonding (or closely sealed), can be with High intensity carries out bonding.
Particularly, by making bonding force for more than 100g/25mm, can more firmly carry out viscous with a side and the opposing party Connect the bonding between two adhesive sides of material strips.
If bonding force is big, strong adhesive strength can be obtained, when less than 100g/25mm, it is likely that can not be advised Fixed intensity.
The method of attachment of adhesive material tape of the 17th scheme of the present invention is characterised by, makes the adhesive material tape of a side Terminal part, overlaps or toward each other with the initial portion of the adhesive material tape of the opposing party, along two adhesive material tapes Paste the silicone adhesive tape described in the 16th scheme and be attached in two sides.
According to the invention of the 17th scheme, while the invention identical action effect with the 16th can be played, due to right One side is attached with the adhesive material tape of the opposing party on its two sides, therefore, it is possible to obtain stronger connection.
The method of attachment of the adhesive material tape of the 18th scheme of the present invention is applied on the silicone-treated base material of adhesive material tape Electrode connecting adhesive is furnished with, the adhesive material tape of the side on the spool of a side, with the volume wound on the opposing party The adhesive material tape of the opposing party on axle is coupled together, it is characterised in that：It is and another in the terminal part of the adhesive material tape of a side Between the initial portion of the adhesive material tape of one side, clipping two sided coatings has the silicone adhesive tape of silicone sticker, viscous by two Connect material strips to couple together；The difference of the silicone sticker on two sides and the surface tension of silicone-treated base material is in 10mN/m (10dyne/ ) below, and bonding force is in more than 100g/25mm cm.
According to the invention of the 18th scheme, due to the silicone adhesive tape using two-sided sticker such that it is able to by two-sided silicon Ketone adhesive tape is clipped between a side and the adhesive material tape of the opposing party and the two is connected into (or closely sealed), therefore the company of the two Connect simply and readily.
The method of attachment of the adhesive material tape of the 19th scheme of the present invention is to be coated with electrode on the base material of adhesive material tape Connecting adhesive, the adhesive material tape of the side on the spool of a side is and another on the spool of the opposing party The adhesive material tape of one side is coupled together, it is characterised in that：The terminal part of the adhesive material tape of a side is made, it is viscous with the opposing party The initial portion for connecing material strips overlaps or toward each other, the resin-made bonding agent of pasty state is attached to into lap or each other phase To part on, hardened by making the resin-made bonding agent of pasty state, and the two is coupled together.
According to the invention of the 19th scheme, due to by the resin-made bonding agent of pasty state, the adhesivess for finishing will be unreeled The terminal part of band is fixed up with the initial portion of the new adhesive material tape installed, therefore connects simple.In addition, carrying out every time During the replacing of new adhesive material reel, it is not necessary to carry out the replacing of winding off spindle and the top of new adhesive material tape is installed to into volume Take the operation on axle, and the operations such as pilot pin are set on given route, therefore, the replacing construction of new adhesive material reel is not Can be too many, improve the production efficiency of e-machine.
It is overlap with the initial portion of the adhesive material tape of the opposing party due to the terminal part of the adhesive material tape in a side Adhere to resin-made bonding agent on part or part relative to each other, therefore the degree of freedom for connecting is high.
The method of attachment of the adhesive material tape of the 20th scheme of the present invention is that on the basis of the 19th scheme, its feature exists In resin-made bonding agent is by least one material selected from thermosetting resin, light-cured resin, heatmeltable bonding agent group Constitute.
According to the invention of the 20th scheme, while the invention identical action effect with the 19th scheme can be played, make For resin-made bonding agent, can select to be suitable to adhesivess from thermosetting resin, light-cured resin, heatmeltable bonding agent group The resin-made bonding agent of the connection between band such that it is able to improve the bonding strength between adhesive material tape.
The adhering device of the adhesive material tape of the 21st scheme of the present invention, it is characterised in that be provided with supply the such as the 19th or 20 The plugger of the resin-made bonding agent described in scheme.
According to the invention of the 21st scheme, glue due to being provided with the resin-made described in the 19th or 20 schemes of supply in adhering device The plugger of agent is connect, therefore need not in addition prepare plugger such that it is able to prevent the waste of connection operation.
In addition, in adhering device in addition to plugger, can also have the heater for hardening thermosetting resin, Or for carrying out the ultraviolet of light irradiation to light-cured resin.
The adhesive material tape spool of the 22nd scheme of the present invention, is wound with base material to be coated with electrode connection and use on spool and glues Connect the adhesive material tape of agent, it is characterised in that：Adhesive material tape spool is provided with multiple adhesivess on the width of belt The winding part of band.
According to the invention of the 22nd scheme, the winding part (winder) due to being provided with multiple adhesive material tapes, therefore, when In multiple winders, unreel wound on the adhesive material tape of a winder when finishing, the winding for finishing just will be unreeled with this The adhesive material tape of other winders that portion is adjacent to is installed on winding off spindle.
So, when an adhesive material tape is unreeled to be finished, another adhesive material tape is installed on winding off spindle, is carried out The replacing of adhesive material tape, therefore new adhesive material tape spool need not be installed in adhering device.So, new bonding The replacement operation of material spool of tape will not be too many, improves the production efficiency of e-machine.
Due to sequentially using the adhesive material tape wound in multiple winders, therefore can not increase each adhesives The number of turns of the adhesive material tape in spool of tape, it becomes possible to which the bonding dosage that can be used is dramatically increased by 1 replacement operation. Further, since do not increase the number of turns of adhesive material tape, while therefore, it is possible to prevent volume from collapsing, additionally it is possible to prevent bonding agent from belt Width ooze out, the adhesive material tape for winding up is bonded together into mutually this so-called adhesion, and then be prevented from The drawbacks such as the stretching of the base material easily produced because base material is elongated.
The adhesive material tape spool of the 23rd scheme of the present invention is on the basis of the 22nd scheme, it is characterised in that one Between the initial portion of the adhesive material tape of the terminal part and the opposing party of the adhesive material tape of side, connection connecting the two is provided with Band, when the adhesive material tape of a side is unreeled to be finished, then starts the adhesive material tape for extracting the opposing party out.
According to the invention of the 23rd scheme, while the invention identical action effect with the 22nd scheme can be played, by In by connect band the terminal part of the adhesive material tape of one side is connected with the initial portion of the adhesive material tape of the opposing party Come, therefore, the adhesive material tape of the winder of a side is unreeled after finishing, it is not necessary to by the adhesive material tape of the winder of the opposing party It is installed on winding off spindle, can further improves the production efficiency of e-machine.
The adhering device of the 24th scheme of the present invention, including the adhesive material tape spool of the 23rd scheme, adhesive material tape Winding off spindle, is arranged between adhesive material tape spool and winding off spindle and is crimped the adhesivess of adhesive material tape with thermal head Pressure contact portion on the circuit board of e-machine, and the band detection means of detection connect band, it is characterised in that：In band detection means In the case of detecting connect band, connect band is wound up on winding off spindle, until connect band has passed through pressure contact portion.
According to the invention of the 24th scheme, because connect band is by auto reeling to winding off spindle, therefore when the winding of a side After the adhesive material tape in portion has been used up, sequentially adhesive material tape can be extracted out from next winder.
In addition, when band detection means detects connect band, due to connect band is wound up on winding off spindle automatically, Zhi Daolian Tape splicing passes through pressure contact portion, therefore, it is possible to save the trouble of winding.
In addition, as band detection means, such as there is a pair of illuminating parts and light accepting part in adhering device, connection is brought into Row optical detection.On the other hand, the labelling of colored (such as black) is set at the two ends of connect band, using what is sent from illuminating part Laser, the labelling at the two ends of connect band is detected by light accepting part, so as to judge connect band.In addition, except in connect band Put on outside labelling, can also adopt makes the width of the connect band method different from the width of adhesive material tape, and in connect band The upper method for forming multiple holes.
The adhesive material tape spool of the 25th scheme of the present invention, using fastener by the terminal part of the adhesive material tape of a side Divide and coupled together with the initial portion of the adhesive material tape of the opposing party, it is characterised in that：Coupling part is with adhesive material tape cladding Fastener.
According to the invention of the 25th scheme, due to using fastener will unreel the terminal part of the adhesive material tape for finishing with The initial portion of the new adhesive material tape installed is coupled together, and the replacing of adhesive material tape spool is carried out, therefore, it is possible to simply New adhesive material tape spool is installed to adhering device.In addition, when carrying out the replacing of new adhesive material tape spool every time, due to The replacing that winding off spindle need not be carried out and the operation being installed at the top of new adhesive material tape on winding off spindle, and on given road The operations such as pilot pin are set on line, therefore, the replacing construction of new adhesive material tape spool will not be too many, improves e-machine Production efficiency.
Due to can sequentially use adhesive material tape, therefore, it is possible to not increase the bonding material on each adhesive material tape spool The number of turns of material strip, by 1 replacement operation the bonding dosage that can be used can be just significantly increased.Further, since not increasing bonding material The number of turns of material strip, while therefore, it is possible to prevent volume from collapsing, is prevented from bonding agent and oozes out from the width of belt, will wind The adhesive material tape for coming is bonded together mutually this so-called adhesion, additionally it is possible to prevent the base material easily produced because base material is elongated The drawback such as stretching.
Further, since the company of the initial portion of the adhesive material tape of the terminal part of the adhesive material tape of a side and the opposing party The glued material strips cladding of fastener of socket part point, thus outward appearance it is good while, be prevented from the fastener of coupling part with Adhesive material tape contacts, and also will not so as to damage the constituent parts such as adhesive material tape, thermal head, the support table of adhering device Damaged by fastener.
In addition, the method as fastener is coated with adhesive material tape, preferably by the bonding with fastener one side of connection After the initial portion of the terminal part of material strips and the adhesive material tape of the opposing party, by coupling part belt length direction Turned back with 180 degree, so as to coat fastener with adhesive material tape.
Alternatively, it is also possible to coat fastener with other adhesive material tape winding coupling parts.
The adhering device of the 26th scheme of the present invention, including the adhesive material tape spool described in the 25th scheme, adhesivess The winding off spindle of band, is arranged between adhesive material tape spool and winding off spindle and with thermal head by the adhesivess of adhesive material tape The pressure contact portion being crimped onto on the circuit board of e-machine, and the connecting portion detection means of the coupling part of detection band, its feature exists In：In the case where connecting portion detection means detects the coupling part of belt, the adhesive material tape of a side is wound up into and is batched On axle, until coupling part has passed through pressure contact portion.
According to the invention of the 26th scheme, when connecting portion detection means detects coupling part, due to gluing a side Connect material strips to be wound up on winding off spindle, until coupling part is by pressure contact portion, therefore, it is possible to prevent coupling part from reaching pressure contact portion And carry out this unsuitable situation of crimping action.Further, since the adhesive material tape of a side is wound up on winding off spindle automatically, Until coupling part is by pressure contact portion, therefore, it is possible to save the trouble of winding.
27th scheme of the present invention is on the basis of the 26th scheme, it is characterised in that connecting portion detection means is CCD photographs Any one in camera, thickness detecting sensor, light transmittance detection sensor.
According to the invention of the 27th scheme, while the invention identical action effect with the 26th scheme can be played, energy Enough detections that part is attached with simple structure, and, accuracy of detection can be improved by using these devices.
For example, using CCD camera as connecting portion detection means in the case of, the intake of the surface of coupling part is arrived In monitor picture, by comparing the deep or light of pixel, coupling part is detected.In addition, in the feelings using thickness detecting sensor Under condition, because the thickness of coupling part is bigger than the thickness of adhesive material tape, therefore by comparing the change of thickness, connection is detected Part.In addition, in the case of using transmittance sensor, due to the thickness of coupling part it is thickening, and with fastener, therefore Its light transmittance is reduced, and by the value for comparing light transmittance, detects coupling part.
The method of attachment of the adhesive material tape of the 28th scheme of the present invention, it is characterised in that：Using fastener by a side's The terminal part of adhesive material tape is coupled together with the initial portion of the adhesive material tape of the opposing party, and coupling part is with adhesivess Band cladding fastener.
According to the invention of the 28th scheme, the terminal part and new peace of the adhesive material tape for finishing will be unreeled using fastener The initial portion of the adhesive material tape of dress is coupled together, and carries out the replacing of adhesive material tape spool, therefore, it is possible to simply to viscous Connection device installs new adhesive material tape spool.In addition, when carrying out the replacing of new adhesivess tape spool every time, due to entering The replacing of row winding off spindle and the operation being installed at the top of new adhesive material tape on winding off spindle, and set on given route The operations such as pilot pin are put, therefore, the replacing construction of new adhesive material tape spool will not be too many, improves the production effect of e-machine Rate.
Due to can sequentially use adhesive material tape, therefore, it is possible to not increase the adhesivess on each adhesivess tape spool The number of turns of band, by 1 replacement operation the bonding dosage that can be used can be just dramatically increased.Due to not increasing adhesive material tape The number of turns, while therefore, it is possible to prevent volume from collapsing, be prevented from bonding agent and ooze out from the width of belt, by what is wound up Adhesive material tape is bonded together mutually this so-called adhesion, additionally it is possible to prevent the drawing of base material easily produced because base material is elongated The drawback such as stretch.
Further, since the company of the initial portion of the adhesive material tape of the terminal part of the adhesive material tape of a side and the opposing party The fastener of socket part point is coated with adhesive material tape, thus outward appearance it is good while, be prevented from the fastener of coupling part with Adhesive material tape contacts and also will not so as to damage the constituent parts such as adhesive material tape, thermal head, the support table of adhering device Damaged by fastener.
In addition, the method as fastener is coated with adhesive material tape, preferably by the bonding with fastener one side of connection After the initial portion of the terminal part of material strips and the adhesive material tape of the opposing party, by coupling part belt length direction Turned back with 180 degree, so as to coat fastener with adhesive material tape.
Alternatively, it is also possible to coat fastener with other adhesive material tape winding coupling parts.
The bonding agent band of the 29th scheme of the present invention, is coated with bonding agent on base material, and is wound into a roll shaft-like, and its feature exists In：On base material, a plurality of bonding agent is configured on the length direction of belt.
According to the invention of the 29th scheme, during using adhesive material tape, by the spool for being wound with bonding agent band and the volume of sky Axle is arranged in adhering device, by bonding agent hot pressing on circuit boards after, base material is wound up on the spool of sky being pacified Dress.
Afterwards, in the case of being hot bonding agent on circuit boards, will be provided with a plurality of a plurality of on the width of base material One in bonding agent is crimped onto on circuit board, and strip of glue remaining after crimping is wound up into into the volume of sky together with base material On axle.Afterwards, after bonding agent band to be unreeled from spool finish, the direction of rotation for making spool inverts, and makes bonding agent band The direction of the supply is inverted.So, following operation is repeated：Whenever being finished after a bonding agent, remaining bonding agent and base material are rolled up Around sequentially using remaining strip of glue.Therefore, because a plurality of bonding agent sequentially can be one by one used, therefore, it is possible to not Increase the number of turns of belt and the bonding dosage that can be used in 1 spool is significantly increased (more than 2 times).
In accordance with the invention it is possible to not increase the number of turns of bonding agent band and be significantly increased the bonding dosage for being used.Also, The number of turns due to not increasing bonding agent band, while therefore, it is possible to prevent volume from collapsing, is prevented from bonding agent from the width side of belt To oozing out, the adhesive material tape for winding up is bonded together into mutually this adhesion, additionally it is possible to prevent because base material is elongated and easy The drawbacks such as the stretching of the base material of generation (damage of base material and break).
In the manufacturer of electronic devices and components, because the replacing number of times of new bonding agent band will not be too many, therefore operation Efficiency is improved.
In addition, in the manufacture of bonding agent band, the bonding dosage due to each spool can be increased, therefore, it is possible to cut down volume The usage amount of shaft material and damp-proof material, reduces manufacturing expense.
In addition, in order to complete in the crimping of the 1st article of bonding agent and by felting agent coil on empty spool after use Next bonding agent, it is also possible to invert direction of rotation, and change 2 spools in adhering device.
Bonding agent both can be insulating properties bonding agent in be dispersed with conducting particles anisotropic conductive bonding agent, Can also be insulating properties bonding agent, the spacer particle of insulating properties can be dispersed with these bonding agents.
The width of base material is preferably 5mm～1000mm, can arbitrarily be selected according to the bar number of the width of a bonding agent, bonding agent Select.The width of of bonding agent is preferably 0.5mm～10.0mm.
The width for why making base material is 5mm～1000mm, is because in the case where the width of base material is less than 5mm, base The bar number of set bonding agent, the width of bonding agent can be restricted on material, meanwhile, if greater than 1000mm, it is possible to Cannot be arranged on again on existing adhering device.
The bonding agent band of the 30th scheme of the present invention is on the basis of the 29th scheme, it is characterised in that：A plurality of bonding agent Strip of glue adjacent each other between have interval in vain.
According to the invention of the 30th scheme, while the invention identical action effect with the 29th scheme can be played, by In making have distance between adjacent strip of glue, therefore, it is possible to easily bonding agent crimped one by one.
The bonding agent band of the 31st scheme of the present invention is on the basis of the 29th scheme, it is characterised in that：Bonding agent is by shape It is separated into into the slit on the length direction of belt a plurality of.
It is excellent while the invention identical action effect with the 29th scheme can be played according to the invention of the 31st scheme It is selected in coating adhesive in the whole surface of the one side of base material to be manufactured, shortly just bonding agent is crimped onto on circuit board it Before, i.e. before will be using bonding agent band, cut bonding agent to form slit with cutting knife etc..
In addition, slit the incision such as cutting knife bonding agent can also be formed when bonding agent band is manufactured.
The formation of slit, in addition to using cutting knife, it is also possible to formed using laser, heating wire etc..
In accordance with the invention it is possible to the bar number for making the strip of glue being configured on base material increases.
The manufacture method of the bonding agent band of the 32nd scheme of the present invention is that bonding agent is coated with manufacture base material, and is wound The bonding agent band of scroll-like relation, it is characterised in that：By the coater by the configuration spaced apart on the width of base material, give Bonding agent is supplied on the substrate surface of continuous transmission, so as to be coated with a plurality of bonding agent on base material.
According to the invention of the 32nd scheme, existing equipment can be utilized to manufacture the bonding agent band of the 30th scheme.
Coater, can both be provided in multiple rollers, or nozzle of the width of base material.
The manufacture method of the bonding agent band of the 33rd scheme of the present invention is to be coated with bonding agent on manufacture base material, and is rolled up Around the bonding agent band of scroll-like relation, it is characterised in that：The coating adhesive in the whole surface of the one side of the base material of a side, connects down After the slit of formation length direction, the base material of the opposing party to be configured in adhesive side, by the base material of a side on bonding agent Clamp bonding agent with the base material of the opposing party, next make the base material of a side disconnected from each other with the base material of the opposing party and make a side and All alternately a plurality of bonding agent is pasted on the respective base material of the opposing party, so as to produce the air switch on the base material of a side and the opposing party Interval is configured with the bonding agent band of a plurality of bonding agent.
According to the invention of the 33rd scheme, the bonding agent band due to can simultaneously manufacture 2 the 29th schemes, therefore manufacture effect Rate is good.
The compression bonding method of bonding agent band of the 34th scheme of the present invention is, using bonding agent being coated with base material and is rolled up Around scroll-like relation bonding agent band and by bonding agent crimp on circuit boards, it is characterised in that：In the whole surface of base material one side On be coated with bonding agent, by a part for the bonding agent on the width to bonding agent band, from substrate side along belt Length direction carries out strip hot pressing, makes the cohesiveness of the bonding agent of heating part and is crimped onto on circuit board while reduction, will press Remaining bonding agent is wound into a roll shaft-like together with base material after connecing, and reuses the bonding agent band for being wound into a roll shaft-like, will be surplus Under bonding agent hot pressing on circuit boards.
According to the invention of the 34th scheme, heated by the part to bonding agent, under making the cohesiveness of the part Drop (hereinafter referred to as " cohesiveness droop line "), makes the bonding agent of heating part be crimped onto on circuit board from the cohesiveness droop line, Leave base material.Remaining bonding agent is winding on the spool of sky with remaining in the state on base material together with base material.
According to the present invention, due to wide before the width ratio for only making bonding agent band, therefore, it is possible to use existing equipment as former state Manufacture bonding agent band.
In addition, the width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing heating region, crimp Bonding agent width degree of freedom it is high.
In addition, as the invention of the 29th scheme, when bonding agent band is extracted out to empty spool to be finished, making the rotation of spool Direction inverts, so that the direction of the supply reversion of belt, or the direction of rotation of holding spool, spool is exchanged.So, due to Bonding agent that can sequentially on a rule heated substrate is simultaneously crimped onto on circuit board, therefore, it is possible to not increase the number of turns of belt, by 1 The bonding dosage that can be used in individual spool is dramatically increased.
In addition, as the invention of the 29th scheme, due to the number of turns can not be increased bonding dosage is increased, therefore, it is possible to While preventing volume from collapsing, can obtain be prevented from bonding agent ooze out caused adhesion and the disadvantage for preventing the stretching of base material from causing End and other effects.
Bandwidth is preferably 5mm～1000mm, and the bonding agent for crimping on circuit boards is preferably 0.5mm～1.5mm.Why With a width of 5mm～1000mm, it is because in the case where bandwidth is less than 5mm, the bonding agent crimping number of times on each spool is few, together When, if greater than 1000mm, it is possible to cannot be arranged on again on existing adhering device.
Bonding agent both can be the bonding of the anisotropic conductive that conducting particles is dispersed with the bonding agent of insulating properties Agent, it is also possible to simply insulating properties bonding agent, it is also possible to the spacer particle of insulating properties is dispersed with these bonding agents.
The bonding agent band of the 35th scheme of the present invention, is coated with bonding agent on base material, and is wound into a roll shaft-like, and its feature exists In：The width of bonding agent band is more than or equal to the length on one side of circuit board, and the width in belt is configured with a plurality of viscous Connect agent.
In the invention of the 35th scheme, the width of bonding agent band is set to overlap with one side of circuit board, it is viscous to being arranged on One of the bonding agent on the width of agent band is connect, along one side hot pressing of circuit board.
Because the width of bonding agent band is more than or equal to the length on one side of circuit board, therefore, bonding agent band only pulls out viscous Connecing the bar width of agent carries out use.
Afterwards, after one side crimping bonding agent of circuit board, rotation circuit plate makes another side be located at the width of bonding agent band Degree direction, strip of glue is hot-pressed onto on another side.So, if sequentially also crimping bonding agent, energy on other sides of circuit board It is enough easily to crimp bonding agent in the surrounding of circuit board.
Therefore, because sequentially a rule using the edge lengths more than or equal to circuit board bonding agent, therefore, making once Consumption is only the width size of strip of glue such that it is able to do not increase the number of turns of bonding agent band, and 1 volume is dramatically increased The bonding dosage that can be used in axle.
Also, the number of turns due to not increasing adhesive material tape, while therefore, it is possible to prevent volume from collapsing, is prevented from bonding agent Ooze out from the width of belt, the belt for winding up is bonded together to form adhesion mutually, additionally it is possible to prevent because base material becomes The long and drawback such as stretching of base material for easily producing (damage of base material and break).
In addition, in the manufacturer of electronic devices and components, because the replacing number of times of new bonding agent band will not be too many, therefore Working performance is improved.
In addition, in the manufacture of bonding agent band, the bonding dosage due to each spool can be increased, therefore, it is possible to cut down spool The usage amount of material and damp-proof material, reduces manufacturing expense.
Bonding agent both can be the bonding of the anisotropic conductive that conducting particles is dispersed with the bonding agent of insulating properties Agent, it is also possible to simply insulating properties bonding agent, it is also possible to the spacer particle of insulating properties is dispersed with these bonding agents.
Due to being greater than the edge lengths equal to circuit board, thus the width of bonding agent band is such as 5mm～3000mm.Separately Outward, even not having the bonding agent band of the size on one side of circuit board, it is also possible to by the width of bonding agent band It is adjacent to that configuration is a plurality of and the size on one side that there is circuit board.In this case, due to easily size can be corresponded to not Same circuit board, therefore, it is possible to improve production efficiency.The width of of bonding agent, for example, 0.5mm～10.0mm.
The width for why making bonding agent band is 5mm～3000mm, and the size for being because one side of circuit board is seldom less than 5mm, meanwhile, if greater than 3000mm, then the width of spool is excessive, it is possible to cannot be arranged on again on existing adhering device.
The bonding agent band of the 36th scheme of the present invention is on the basis of the 35th scheme, it is characterised in that：A plurality of bonding agent Strip of glue adjacent to each other between have interval in vain.
According to the invention of the 36th scheme, while the invention identical action effect with the 35th scheme can be played, due to There is distance between adjacent strip of glue, bonding agent is separated from base material therefore, it is possible to an easily rule and is crimped.
The bonding agent band of the 37th scheme of the present invention is on the basis of the 35th scheme, it is characterised in that：Bonding agent is by edge The slit that the width of belt is formed is separated into a plurality of.
According to the invention of the 37th scheme, while the invention identical action effect with the 35th scheme can be played, preferably Using the coating adhesive in the whole surface of the one side of base material and dried bonding agent band, shortly just bonding agent is crimped onto Before on circuit board, i.e. will cut bonding agent to form slit using cutting knife etc. using before bonding agent band.
In addition, slit cutting knife etc. can also cut bonding agent and be formed when bonding agent band is manufactured, except using cutting knife it Outward, it is also possible to formed using laser and heating wire etc..
In accordance with the invention it is possible to increase the bar number of the strip of glue being configured on base material, and can be easily manufactured in band The bonding agent band of a plurality of bonding agent is configured with the width of son..
The manufacture method of the bonding agent band of the 38th scheme of the present invention, on manufacture base material bonding agent is coated with, and is wound into The bonding agent band of reel, it is characterised in that：The coating adhesive in the whole surface of the base material of a side, next in bonding agent On formed in the width direction after slit, the base material of the opposing party is configured in adhesive side, pressed from both sides by the base material of a side and the opposing party Firmly bonding agent, it is disconnected from each other with the base material of the opposing party followed by the base material for making a side and make a side and the opposing party respective All alternately a plurality of bonding agent is pasted on base material, be configured with interval in the base material overhead of a side and the opposing party so as to produce The bonding agent band of a plurality of bonding agent.
According to the invention of the 38th scheme, existing equipment can be utilized, while the bonding agent band of 2 the 35th schemes is manufactured, because This manufacture efficiency is excellent.
The compression bonding method of the bonding agent band of the 39th scheme of the present invention, it is characterised in that：Will be arbitrary in the 35th to 37 scheme The bonding agent band of item is configured on circuit boards, by carrying out hot pressing to bonding agent band along width, so as in circuit board Strip of glue is crimped on one side.
In the compression bonding method, by bonding agent band configure on circuit boards, by along width to bonding agent band hot pressing Connect, on one side of circuit board strip of glue is crimped, next, the position by changing circuit board, will be viscous along width Agent is connect with hot pressing on the another side of circuit board, so as to next strip of glue can be crimped on the another side of circuit board.
According to the invention of the 39th scheme, can play and any one of the 35th～the 37th scheme invention identical action effect While, after bonding agent band is arranged in adhering device, one side of circuit board is configured into the width in bonding agent band On, bonding agent is crimped to one side of circuit board, next, circuit board for example to be rotated about 90 degree, make the another side of circuit board Positioned at the position parallel with the width of bonding agent band, on the another side of circuit board bonding agent is crimped.So, by sequentially It is rotated by 90 ° circuit board and crimps bonding agent, simply bonding agent can be crimped in the surrounding of circuit board, in electronic devices and components Manufacturer in can improve working performance.
The compression bonding method of the bonding agent band of the 40th scheme of the present invention, it is characterised in that：In the transmission road of walking circuit plate On at least provided with any one of 2 the 35th to the 37th schemes bonding agent band, the bonding agent band of a side width configuration On the direction vertical with transmission road, the width of the bonding agent band of the opposing party is configured in along on the direction of transmission road；One In the bonding agent band of side, for the 2 relative sides of circuit board, by being hot bonding agent band along width, so as to by bonding Agent bar is crimped on the 2 relative sides of circuit board；Next circuit board is shifted to the bonding agent band of the opposing party, for circuit board Remaining 2 side, by being hot bonding agent band along width from substrate side, so as to strip of glue is crimped on into the four of circuit board Week.
According to the invention of the 40th scheme, can play and be acted on the invention identical of any one of the 35th～the 37th scheme While effect, it is not necessary to rotation circuit plate, by the position of the bonding agent band of a mobile side and the bonding agent band of the opposing party, Along width hot pressing on respective position, it becomes possible to which easily the surrounding in circuit board crimps bonding agent, and working performance is good It is good.
The compression bonding method of the bonding agent band of the 41st scheme of the present invention, is coated with the whole surface using the one side of base material Bonding agent and the bonding agent band of shaft-like is wound into a roll, and bonding agent is crimped onto on circuit board, it is characterised in that：Bonding agent band Width is more than or equal to the length on one side of circuit board, by a part for the bonding agent on the width to bonding agent band in width Degree direction carries out hot pressing, so that the cohesiveness of the bonding agent of heating part is reduced, and bonding agent is crimped onto on circuit board.
According to the invention of the 41st scheme, in the case of crimping bonding agent around circuit board, in adhering device Bonding agent band is installed, by the way that, to bonding agent band hot pressing, the cohesiveness for making the part declines and (hereinafter referred to as " coagulates along width Poly- power droop line "), make the bonding agent of heating part leave base material from the cohesiveness droop line and be crimped on circuit board.Connect down Come, circuit board is for example rotated about 90 degree, make adjacent side be located at the width with bonding agent band, along under width hot pressing One strip of glue, strip of glue is crimped onto on adjacent side.In such manner, it is possible to sequentially crimp bonding agent in the surrounding of circuit board, make Industry efficiency is good.
Further, since can be in the whole surface coating adhesive of bonding agent band, therefore, it is possible to be set using existing as former state Prepare and make bonding agent band.
In addition, the width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing hot pressing region, carry out The degree of freedom of the bonding agent width of crimping is high.
In addition, as the invention of the 35th scheme, due to the number of turns can not be increased bonding dosage is increased, therefore, it is possible to While preventing volume from collapsing, being obtained in that prevents oozing out caused adhesion and preventing the disadvantage caused by the stretching of base material for bonding agent End and other effects.
The adhesive agent-tape cassette of the 42nd scheme of the present invention, it is characterised in that：Spool with a side, the spool of the opposing party, And the box body of the two spools is rotatably kept and accommodates, it is wound with the spool of a side on base material and is coated with bonding The bonding agent band of agent, one end of fixed bonding agent band on the spool of the opposing party, along the length direction of belt on bonding agent band At least it is configured with 2 bonding agents.
According to the invention of the 42nd scheme, adhesive agent-tape cassette is arranged on adhering device, makes the width of bonding agent band One of at least 2 bonding agents alongst for being formed overlaps with one side of circuit board, from substrate side hot pressing, One bonding agent is crimped onto on circuit board.So, sequentially bonding agent is crimped onto on circuit board, from the spool of a side sequentially While extracting bonding agent band out, winding is coated with the bonding agent band of a remaining bonding agent on the spool of the opposing party.Afterwards, When the bonding agent band on the spool wound on a side has been used up, upset tape drum is again arranged on it on adhering device.
So, due to the spool and the changing reel of the opposing party of a side, therefore, specifically extract bonding out from the spool of the opposing party Agent band, carries out the crimping of a remaining bonding agent.
In the case of the bonding agent of more than 2 is formed with bonding agent band, it is also possible to which the position for changing width is suitable It is secondary or have compartment of terrain in vain and crimped.
So, in the present invention, on bonding agent band, bonding agent is at least set side by side with 2 and 1 rule ground in width Use, therefore, at least one spool can use the amount of 2 spools, therefore, it is possible to not increase the number of turns of bonding agent band, and by 1 The bonding dosage that can be used in spool increases to more than 2 times.
Also, the number of turns due to not increasing adhesive material tape, while therefore, it is possible to prevent volume from collapsing, is prevented from bonding agent Ooze out from the width of belt, the band for winding up is bonded together into mutually this adhesion, additionally it is possible to prevent because base material is elongated And the drawback such as stretching for the base material for easily producing (damage of base material and break).
On the other hand, in the case where 2 bonding agents are formed with, in the manufacturer of electronic devices and components, when 1 spool When amount (1 bonding agent) has been used up, it is only necessary to overturn tape drum, can easily carry out next installation.
Further, since bonding agent band is made into tape drum, therefore laborious bonding agent band need not be installed in adhering device To on spool, but only tape drum is installed in adhering device, therefore processing ease, and the workability of installation and replacing is good It is good.
Bonding agent both can be the bonding of the anisotropic conductive that conducting particles is dispersed with the bonding agent of insulating properties Agent, it is also possible to simply insulating properties bonding agent, it is also possible to the spacer particle of insulating properties is dispersed with these bonding agents.
The adhesive agent-tape cassette of the 43rd scheme of the present invention is on the basis of the 42nd scheme, it is characterised in that：A plurality of bonding Strip of glue adjacent to each other has interval in vain in agent.
According to the invention of the 43rd scheme, while the invention identical action effect with the 42nd scheme can be played, by There is distance between adjacent strip of glue, bonding agent is separated from base material therefore, it is possible to an easily rule and is crimped.
The adhesive agent-tape cassette of the 44th scheme of the present invention is on the basis of the 42nd scheme, it is characterised in that：Bonding agent quilt The slit being formed on the length direction of belt is separated into a plurality of.
It is excellent while the invention identical action effect with the 42nd scheme can be played according to the invention of the 44th scheme Choosing uses coating adhesive and dried bonding agent band in the whole surface of the one side of base material, shortly just bonding agent crimping Before on circuit board, i.e. will cut bonding agent to form slit using cutting knife etc. using before bonding agent band.
In addition, slit can also cut bonding agent when bonding agent band is manufactured using cutting knife etc. formed, except utilizing cutting knife Outside, it is also possible to formed by laser and heating wire etc..
The compression bonding method of the bonding agent of the use adhesive agent-tape cassette of the 45th scheme of the present invention, it is characterised in that：To have The spool of one side, the spool of the opposing party and the box body of the two spools is rotatably kept and accommodates, and the volume of a side It is wound with axle on base material and is coated with the bonding agent band of bonding agent, one end of fixed bonding agent band is viscous on the spool of the opposing party Agent tape drum is connect in compression bonding apparatus, bonding agent band is pulled out on circuit board from adhesive agent-tape cassette, by bonding agent A part for the width of band carries out hot pressing, so that the cohesiveness of the bonding agent of heating part is reduced, and by width side To the bonding agent of a part be crimped onto on circuit board.
According to the invention of the 45th scheme, to a part of hot pressing of width, the part is made by bonding agent band The cohesiveness of bonding agent decline (hereinafter referred to as " cohesiveness droop line "), make the viscous of heating part from the cohesiveness droop line Connect agent and leave base material and be crimped on circuit board.
In the present invention, due to can be in the whole surface coating adhesive of the base material of bonding agent band, therefore, it is possible to make as former state With existing device fabrication bonding agent band.
In addition, the width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing hot pressing region, carry out The degree of freedom of the bonding agent width of crimping is high.
The compression bonding method of the bonding agent of the use adhesive agent-tape cassette of the 46th scheme of the present invention, it is characterised in that：To have The spool of one side, the spool of the opposing party and the box body of the two spools is rotatably kept and accommodates, and the volume of a side It is wound with axle on base material and is coated with the bonding agent band of bonding agent, one end of fixed bonding agent band is viscous on the spool of the opposing party Agent tape drum is connect in compression bonding apparatus, bonding agent band is drawn out on circuit board from adhesive agent-tape cassette, by bonding agent A part for the width of band carries out hot pressing, so that the cohesiveness of the bonding agent of heating part is reduced, and by width side To the bonding agent of a part be crimped onto on circuit board, after the bonding agent band wound on the spool of a side has been used up, turn over Turn adhesive agent-tape cassette, the bonding agent of remainder is crimped onto on circuit board.
According to the invention of the 46th scheme, while the invention identical action effect with the 45th scheme can be played, when When bonding agent band on the spool of a side has been used up, it is arranged on again in compression bonding apparatus due to tape drum can be overturn, will be surplus The bonding agent of remaining part point is crimped onto on circuit board, therefore, as the invention with the 42nd scheme, not increasing the number of turns can just increase bonding Dosage, while being prevented from volume and collapse, being obtained in that prevents bonding agent from oozing out caused adhesion and prevents the stretching institute of base material The drawbacks of causing and other effects.Further, in the manufacturer of electronic devices and components, when 1 spool amount (1 amount bonding agent) has been used up Afterwards, due to only need to overturn tape drum then can, therefore easily installed next time.Due to adopting tape drum, therefore processing ease, and And the workability of installation and replacing is good.
The adhesive material tape of the 47th scheme of the present invention, is coated onto on base material and is rolled into the bonding material band of reel, its It is characterised by：Base material melts oxidant layer and support layer with heat.
According to the invention of the 47th scheme, during using adhesive material tape, the spool and sky of adhesive material tape will be wound with Spool is arranged in adhering device, is hot bonding on circuit boards after material, and base material is winding on the spool of sky is pacified Dress.Afterwards, the terminal part of the adhesive material tape of the side wound on the spool for unreel the side for finishing is made, it is another with new The initial portion of the adhesive material tape of the opposing party wound on the spool of side is overlapped or toward each other, heats this part, is made Heat is melted after oxidant layer fusing, makes heat melt agent solidification by cooling, so as to adhesive material tape be interconnected.
It is due to the base material using adhesive material tape, the terminal part for unreeling the adhesive material tape for finishing is viscous with new installation The initial portion for connecing material strips is bonded together, and carries out the replacing of adhesive material reel, therefore, it is possible to simply to adhering device peace Fill new adhesive material reel.In addition, when carrying out the replacing of new adhesivess tape spool every time, due to winding off spindle need not be carried out Change and the top of new adhesivess is installed on winding off spindle, and the operation on pilot pin, therefore, new bonding The replacing construction of material spool will not be too many, improves the production efficiency of e-machine.
If the thermo-compression bonding of coupling part, can be reasonable using the thermal head of the adhering device for being provided with adhesive material reel Using adhering device.
The adhesive material tape of the 48th scheme of the present invention is on the basis of the 47th scheme, it is characterised in that：Support layer quilt Heat melts oxidant layer clamping.
According to the invention of the 48th scheme, while the invention identical action effect with the 47th scheme can be played, by There is heat to melt oxidant layer in the surface of base material, thus the heat of the terminal part of the adhesive material tape of a side can be melted oxidant layer and initial portion Adhesive side overlap, this part is thermally compressed and is coupled together the two, therefore connected simple.Further, since Heat is melted oxidant layer and is formed on the whole length direction of belt, therefore strict positioning need not be carried out to overlap length, connection from It is high by degree.
The adhesive material tape of the 49th scheme of the present invention is on the basis of the 47th scheme, it is characterised in that：Heat melts oxidant layer It is supported layer clamping.
According to the invention of the 49th scheme, while the invention identical action effect with the 47th scheme can be played, it is Adhesive material tape is connected with each other, the top of terminal part and the adhesive material tape of the opposing party of the adhesive material tape of a side is made It is partially in and as to be mutually facing, is heated with the thermal head of adhering device.During heating, heat is melted oxidant layer fusing and is oozed out, and is led to Supercooling makes heat melt agent solidification, so as to adhesive material tape be interconnected.At this moment, oxidant layer is melted due to heat and is supported layer folder Hold, therefore, it is possible to prevent heat melt oxidant layer be exposed in an atmosphere, because absorption, the dust etc. of dampness attachment caused by heat melt The adhesive strength of oxidant layer declines.
The method of attachment of the adhesive material tape of the 50th scheme of the present invention is, by the side's on the spool of a side Adhesive material tape, couples together with the adhesive material tape of the opposing party on the spool of the opposing party, it is characterised in that：Bonding Material strips have the base material and bonding agent for implementing surface treatment with parting compound, remove the base material of the adhesive material tape of either one The parting compound of end, makes the part overlap with the adhesive side of the adhesive material tape of the opposing party, and the lap of the two is entered Row thermo-compression bonding connects it.
According to the invention of the 50th scheme, due to making the substrate surface of the adhesive material tape of either one and the bonding material of the opposing party The adhesive side of material strip is overlapped, and lap is thermally compressed, will unreel the terminal part of the adhesive material tape for finishing with it is new The initial portion of the adhesive material tape of installation is coupled together, and carries out the replacing of adhesive material reel, therefore, it is possible to simply to viscous Connection device installs new adhesive material reel.
When carrying out the replacing of new adhesive material reel every time, due to the replacing of winding off spindle need not be carried out and by new bonding The top of material strips is installed to the operation on winding off spindle, and the operations such as pilot pin are arranged on given route, therefore, new is viscous The replacing construction for connecing material spool will not be too many, improves the production efficiency of e-machine.
In addition, for the surface of base material, in the state of adhesive material-tape reel scroll-like relation, in order that adhesive side and base Face not bonding, on the surface of base material parting compound has been applied.In the present invention, the parting compound of the adhesive material tape due to removing a side, The part is set to carry out with the adhesive side of the adhesive material tape of the opposing party overlap bonding, therefore the connection letter between adhesive material tape It is single.
If thermal head of the thermo-compression bonding of coupling part using the adhering device for installing adhesive material reel, can be rationally sharp Use adhering device.
The method of attachment of the adhesive material tape of the 51st scheme of the present invention is that on the basis of the 50th scheme, its feature exists In：Any one method removed during parting compound is irradiated by plasma discharge, ultraviolet, laser irradiates is carried out.
According to the invention of the 51st scheme, while the invention identical action effect with the 50th scheme can be played, by Any one method in using plasma discharge, ultraviolet irradiation, laser irradiation removes parting compound, thus peels off with manual Situation is compared, and the removal of parting compound can be carried out reliably and with the short time.
As the minimizing technology of parting compound, in the case of using plasma discharge, by the gas for making plasmoid Decompose, the state (excitation state) in being susceptible to react is removed parting compound by being discharged on the surface of base material.Separately Outward, in the case of ultraviolet irradiation, for example finsen lamp will use as light source, by the purple from hydrargyrum light irradiation certain hour Outside line is carrying out.In addition, in the case where laser irradiates, parting compound is added hot melt by the laser launched using laser oscillator Change, to remove parting compound.
The adhesive material tape spool of the 52nd scheme of the present invention, is the bonding that electrode connecting adhesive is coated with base material Adhesive material tape spool of the material strips on spool, it is characterised in that：Width of the adhesive material tape spool in belt It is provided with the winding part of multiple adhesive material tapes.
According to the invention of the 52nd scheme, the winding part (winder) due to being provided with multiple adhesive material tapes, therefore, when In multiple winders, as soon as the adhesive material tape that the winder of side is wound is unreeled when finishing, by with unreel the winder that finishes The adhesive material tape of other winders being adjacent to is installed on winding off spindle.
So, when the adhesive material tape of a side is unreeled to be finished, the opposing party's adhesive material tape is installed on winding off spindle, is entered The replacing of row adhesive material tape, therefore new adhesive material tape spool need not be installed in adhering device.So, new is viscous The replacement operation for connecing material spool of tape will not be too many, improves the production efficiency of e-machine.
Due to can sequentially using the adhesive material tape wound in multiple winders, therefore, it is possible to not increase each bonding The number of turns of the adhesive material tape in material spool of tape, and the replacement operation for passing through 1 time can be dramatically increased the bonding that can be used Dosage.Further, since do not increase the number of turns of adhesive material tape, while therefore, it is possible to prevent volume from collapsing, be prevented from bonding agent from The width of belt oozes out, and the adhesive material tape for winding up is bonded together mutually into this so-called adhesion, additionally it is possible to anti- The drawbacks such as the stretching of the base material for only easily producing because base material is elongated.
The adhesive material tape spool of the invention of the 53rd scheme of the present invention is that on the basis of the 52nd scheme, its feature exists In：The receiving portion of desiccant is provided with the side plate of spool.
The adhesive material tape spool of the 54th scheme of the present invention is that on the basis of the 52nd scheme or 53 schemes, its feature exists In：Be provided with spool can freely assemble and disassemble for the cap that will coat around the adhesive material tape wound on spool Part.
The adhesive material tape spool of the invention of the 55th scheme of the present invention is that on the basis of the 54th scheme, its feature exists In：Cover has the pull-out mouth of adhesive material tape.
The adhesive material tape spool of the 56th scheme of the present invention is that on the basis of the 52nd scheme or 53 schemes, its feature exists In：The side plate of the winder of adhesive material tape can detachably be fitted together to each other.
The adhesive material tape spool of the 57th scheme of the present invention is that on the basis of the 52nd scheme or 53 schemes, its feature exists In：Adhesive material tape is the adhesive material tape of the electrode connecting adhesive that the relative electrode of connection is coated with base material.
The adhesive material tape spool of the 58th scheme of the present invention is that on the basis of the 52nd scheme or 53 schemes, its feature exists In：Adhesive material tape is that the fixed of connecting lead wire frame supports substrate or lead frame with support substrate or semiconductor element mounting The adhesive material tape of tube core and semiconductor element.
The present invention the 59th scheme adhering apparatus, the spool with a side, the spool of the opposing party, the spool for making a side with it is another The spool of one side rotation linkage gear unit, accommodate they box body, be configured in box body peristome heater block with And the supply unit powered to heater block, it is characterised in that：It is wound with the spool of one side on base material and is coated with bonding agent Bonding agent band, is fixed with one end of bonding agent band on the spool of the opposing party, heater block has to be sent out by the electric energy for being supplied The electroheat member of heat, the bonding agent band on the spool of a side is pulled out from the peristome of box body, by heater block from Substrate side is pointed to the bonding agent band of peristome and carries out hot pressing, so as to bonding agent is crimped onto on circuit board, and by bonding agent quilt The base material of stripping is wound up on the spool of the opposing party.
According to the invention of the 59th scheme, in the case of to circuit board crimping bonding agent, by be hold by one hand box body, The peristome for exposing bonding agent band is pressed on circuit boards, and makes to be arranged on the heating part of the bonding agent with substrate side of peristome Part pressing is located at the bonding agent band of peristome, so as to bonding agent is crimped onto on circuit board.So, when one side, pressing is located at heating Bonding agent band under part, while during propulsion adhering apparatus, due to pulling out bonding agent band on the spool from a side, and from spool Spool just rotates when pulling out bonding agent band, therefore also rotates with the co-axially fixed gear of the spool of a side, and what is be engaged with it is another The gear rotation of square spool, the base material that bonding agent has been stripped is wound up on the spool of the opposing party.
Power supply to heater block, it is possible to use the switch being arranged on box body is powered, or, it is also possible in heater block Upper setting pressure-sensitive switch, when sensing that heater block is pressed, then powers to heater block.
Bonding agent both can be the bonding of the anisotropic conductive that conducting particles is dispersed with the bonding agent of insulating properties Agent, it is also possible to simply insulating properties bonding agent, can be dispersed with the spacer particle of insulating properties in these bonding agents.
The invention of the 60th scheme of the present invention, the adhesive material tape being coated onto on base material, base material is by metallic film or virtue Fragrant polyamide film is constituted.
It is metallic film (or metal forming) or fragrant adoption by making the base material of adhesive material tape in the invention of the 60th scheme Amide film, even if in the case of the thinner thickness of base material, it is also possible to prevent the failures such as the stretching and fracture of base material.
In addition, the adhesive material tape constituted by using the base material of thinner thickness, can make the number of turns on each spool Increase such that it is able to increase the bonding dosage that can be used on 1 spool.If in addition, using the present invention adhesive material tape, due to The number of turns on each spool is more, therefore, in the manufacturer of electronic devices and components, the replacing number of times of new adhesive material tape will not Too much, improve working performance.In addition, in the manufacture of adhesive material tape, the spool number due to manufacture can be reduced, therefore, it is possible to Spool material, the usage amount of damp-proof material are cut down, manufacturing expense is reduced.
Metallic film is preferably the high metal of ductility, can be using copper, aluminum, rustless steel, ferrum, stannum etc..
Aromatic polyamide film, specifically, can adopt para-position aromatic polyamide film (ミ Network ト ロ Application, eastern beautiful strain formula meeting Society's trade name).
Bonding agent can adopt the mixture of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Class.In the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, as heat Thermosetting resin class, there is epoxy resin, crylic acid resin, silicones class.
Conducting particles can be dispersed with bonding agent, as conducting particles, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, scolding tin Deng metallic and carbon, graphite etc., can on the macromolecule core such as these and/or dielectric glass, ceramics, plastics, Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles structure as above with insulating barrier Into insulating wrapped particle, and conducting particles and insulating particle and with etc..In the high score such as the heatmeltable such as scolding tin metal and plastics Formed on sub- core after conductive layer, due to by hot pressing or pressurization there is the distance between morphotropism, the electrode after connection to subtract It is little, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, therefore, it is possible to the control in very wide connection temperature range shape is softened due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting material, be preferred.
The adhesive material tape of the 61st scheme of the present invention is on the basis of the 60th scheme, it is characterised in that：The thickness of base material Spend for 1 μm～25 μm.
The thickness for why making base material is 1 μm～25 μm, is because in the case where the thickness of base material is less than 1 μm, base material Enough tensile strengths cannot be obtained, is easily broken off.In addition, the thickness in base material has exceeded in the case of 25 μm, it is difficult to every The gratifying number of turns is obtained in individual spool.
The adhesive material tape of the 62nd scheme of the present invention is on the basis of the 60th or the 61st scheme, it is characterised in that：Base The tensile strength of material is more than 300MPa at 25 DEG C.
The tensile strength for why making base material is more than 300MPa, is because in base material tensile strength than 300MPa hour, Base material is easily stretched, and in addition adhesive material tape is easily broken off.
The adhesive material tape of the 63rd scheme of the present invention is that on the basis of the either a program of the 60th to the 62nd scheme, it is special Levy and be：Base material is 0.01～1.0 with the thickness ratio of bonding agent.
Why make base material be 0.01～1.0 with the thickness ratio of bonding agent, be because the thickness ratio in base material and bonding agent In the case of 0.01, base material is excessively thin, and adhesive material tape cannot obtain enough intensity.In addition, in base material and bonding agent Thickness ratio has exceeded in the case of 1.0, and base material is blocked up, it is impossible to increase the number of turns of each spool.
The adhesive material tape of the 64th scheme of the present invention is its feature on the basis of the either a program of the 60th to the 63rd scheme It is：Surface roughness R of base materialmaxFor less than 0.5 μm.
Why surface roughness R of base material is mademaxFor less than 0.5 μm, it is because if RmaxExceed 0.5 μm, due to Substrate surface it is concavo-convex, to circuit board crimp bonding agent when, bonding agent be difficult from base material separate.
The present invention the 65th scheme adhesive material tape bonding agent forming method, using be coated with base material bonding agent and The adhesive material tape of reel is rolled into, bonding agent is formed in bonded object, it is characterised in that：Pull out respectively from multiple spools Adhesive material tape, overlaps each adhesive material tape and is integrated, and while peeling off the base material of a side, makes the bonding that overlap is integrated Agent is formed in bonded object.
In the invention of the 65th scheme, by the adhesive side of the adhesive material tape extracted out from the spool of a side, with from The adhesive side of the adhesive material tape extracted out on the spool of the opposing party is overlapped, and adhesive material tape is made of one.By the opposing party The base material of adhesive material tape be wound up on the spool for batching, using thermal head, the adhesive material tape that is integrated will be overlapped Bonding agent is crimped onto in bonded object.Bonded object is tube core of electronic devices and components, circuit board, lead frame and lead frame etc..
So, in bonded object formed bonding agent before operation in, make a side adhesive material tape bonding agent with The bonding agent of the adhesive material tape of the opposing party is overlapped, and after forming desired thickness, bonding agent is formed in bonded object, because This, although the number of turns of adhesive material tape is increased, but the winding diameter of the adhesive material tape on each spool can be reduced.Institute With, by increasing capacitance it is possible to increase the number of turns of the adhesive material tape of each spool, it is dramatically increased and can uses so as to passes through 1 replacement operation Bonding dosage.Therefore, the replacement operation of new adhesive material tape will not be too many, improves the production efficiency of e-machine.
The bonding agent forming method of the adhesive material tape of the 66th scheme of the present invention is that on the basis of the 65th scheme, it is special Levy and be：Only contain firming agent in the bonding agent of the adhesive material tape of a side.
According to the invention of the 66th scheme, while the invention identical action effect with the 65th scheme can be played, by Contain firming agent in the only bonding agent of the adhesive material tape of a side, therefore, in the bonding agent of the adhesive material tape of the opposing party Firming agent is not needed.So, the adhesive material tape for not containing the bonding agent of firming agent does not need low temperature management.So as to reduce Need the number of the adhesive material tape of low temperature management such that it is able to which the conveying, keeping to adhesive material tape is efficiently managed. In addition, for adhesive material tape not added with firming agent and the bonding agent of the adhesive material tape added with firming agent, by will with it is solid Agent reaction composition as the opposing party bonding agent, by with firming agent be used together not with firming agent reaction composition it is bonding Agent as a side bonding agent, so as to improve the storage stability of bonding agent.
The anisotropic conductive material band of the 67th scheme of the present invention, it is characterised in that：By the bonding agent with film like Anisotropic conductive material, on the length direction of core wind multireel lamination form.
The anisotropic conductive material band of the 68th scheme of the present invention is on the basis of the 67th scheme, it is characterised in that： Above-mentioned anisotropic conductive material is that the anisotropy of 2 layers of construction that base material film is provided with the one side of the bonding agent of film like is led Electric material.
The anisotropic conductive material band of the 69th scheme of the present invention is on the basis of the 67th scheme, it is characterised in that： Above-mentioned anisotropic conductive material be film like bonding agent it is two-sided on be provided with the anisotropy of 3 layers of base material film construction and lead Electric material.
The present invention the 70th scheme anisotropic conductive material band be on the basis of the 68th scheme or the 69th scheme, its It is characterised by：Lift-off processing is implemented to the single or double of above-mentioned base material film.
The anisotropic conductive material band of the 71st scheme of the present invention is to any one of the 70th scheme in the 67th scheme On the basis of, it is characterised in that：The width of the bonding agent of above-mentioned film like is 0.5～5mm.
In addition, the anisotropic conductive material band of the 72nd scheme of the present invention be the 68th scheme to the 71st scheme either one On the basis of case, it is characterised in that：Base material film strength is 12kg/mm2More than, elongation percentage is 60～200%, and thickness is 100 μ Below m.Afterwards, if base material film is coloured to into colored transparent or coloured opaque, base material film just relatively holds with the differentiation of bonding agent Easily, in addition, the position of winder also easily differentiates, improve workability.
Description of the drawings
Fig. 1 is in the method for attachment of the adhesive material tape of the 1st embodiment, to represent the connection between adhesive material reel Axonometric chart.
Fig. 2A and Fig. 2 B are the axonometric chart of the connection operation of the coupling part for representing Fig. 1.
Fig. 3 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Fig. 4 is the sectional view of the bonding between indication circuit plate.
Fig. 5 is the process chart of the manufacture method for representing adhesive material tape.
Fig. 6 is the axonometric chart of the method for attachment of the adhesive material tape of the 2nd embodiment for representing the present invention.
Fig. 7 is the axonometric chart of the method for attachment of the adhesive material tape of the variation of the 2nd embodiment for representing the present invention.
Fig. 8 A～Fig. 8 C are the schematic diagram of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Fig. 8 A are expression The axonometric chart of the connection between adhesive material reel, Fig. 8 B are the axonometric chart of the method for attachment of the coupling part for representing Fig. 8 A, are schemed 8C is the top view of the coupling part of Fig. 8 A.
Fig. 9 is the sectional view of the method for attachment of the adhesive material tape of the 2nd embodiment for representing the present invention.
Figure 10 is the sectional view of the method for attachment of the adhesive material tape of the 3rd embodiment for representing the present invention.
Figure 11 is the sectional view of the method for attachment of the adhesive material tape of the 4th embodiment for representing the present invention.
Figure 12 A and Figure 12 B are the schematic diagram of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Figure 12 A are table Show the axonometric chart of the connection between adhesive material reel, Figure 12 B are the solid of the method for attachment of the coupling part for representing Figure 12 A Figure.
Figure 13 is the sectional view of the method for attachment of the adhesive material tape of the 2nd embodiment for representing the present invention.
Figure 14 A and Figure 14 B are the sectional view of the method for attachment of the adhesive material tape of the 3rd embodiment for representing the present invention, Figure 14 A represent the state before hot pressing, and Figure 14 B represent the state after hot pressing.
Figure 15 A and Figure 15 B are the schematic diagram of the method for attachment of the adhesive material tape of the 4th embodiment for representing the present invention, Figure 15 A are sectional view, and Figure 15 B are top view.
Figure 16 A and Figure 16 B are the schematic diagram of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Figure 16 A are table Show the axonometric chart of the connection between adhesive material reel, Figure 16 B are the axonometric chart of the coupling part (b) for representing Figure 16 A.
Figure 17 is the sectional view of the method for attachment of the adhesive material tape of the 2nd embodiment for representing the present invention.
Figure 18 is the sectional view of the method for attachment of the adhesive material tape of the 3rd embodiment for representing the present invention.
Figure 19 is the sectional view of the method for attachment of the adhesive material tape of the 4th embodiment for representing the present invention.
Figure 20 A～Figure 20 C are the schematic diagram of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Figure 20 A are table Show the axonometric chart of the connection between adhesive material reel, Figure 20 B and Figure 20 C are the method for attachment of the coupling part for representing Figure 20 A Sectional view.
Figure 21 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Figure 22 A～22C is the schematic diagram of the adhesive material tape spool for representing the 1st embodiment, and Figure 22 A are expression bonding material The axonometric chart of material strip spool, Figure 22 B are the front view of Figure 22 A, and Figure 22 C are the top view of the connect band of Figure 22 A.
Figure 23 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Figure 24 is the top view of the connect band of the 2nd embodiment of the present invention.
Figure 25 is the top view of the connect band of the 3rd embodiment of the present invention.
Figure 26 is the axonometric chart of the adhesive material tape spool of the 4th embodiment for representing the present invention.
Figure 27 A～27C is the schematic diagram of the adhesive material tape spool for representing the 1st embodiment, and Figure 27 A are expression bonding material The axonometric chart of material strip spool, Figure 27 B are the front view of Figure 27 A, and Figure 27 C are the sectional view of the coupling part of Figure 27 A.
Figure 28 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Figure 29 is the axonometric chart of the use state of the bonding agent for representing PDP.
Figure 30 is the axonometric chart of the adhesive material tape spool of the 2nd embodiment for representing the present invention.
Figure 31 A are that the adhesive material tape of the adhesive material tape spool of the present invention is used in the semiconductor device of LOC constructions In the case of, the sectional view of adhesive material tape.
Figure 31 B are that the adhesive material tape of the adhesive material tape spool of the present invention is used in the semiconductor device of LOC constructions In the case of, the sectional view of the semiconductor device of LOC constructions.
Figure 32 A～Figure 32 C be represent using the present invention adhesive material tape spool adhering device schematic diagram, Figure 32 A For front view, Figure 32 B are side view, and Figure 32 C are the enlarged view of the punching press paste section 89 of the adhesive material tape of Figure 32 B.
Figure 33 A and Figure 33 B for bonding agent band figure, Figure 33 A be volume have adhesive material tape spool axonometric chart, Figure 33 B For the line A-A sectional view of Figure 33 A.
Figure 34 is the axonometric chart of the use state of the bonding agent for representing PDP.
Figure 35 is the sectional view for representing the operation of coating adhesive on base material.
Figure 36 A～Figure 36 C are the sectional view of the bonding agent band of the 2nd embodiment of the present invention.
Figure 37 A～Figure 37 C are the bonding agent band and its process chart of compression bonding method of the 3rd embodiment for representing the present invention.
Figure 38 A～Figure 38 C are the process chart of the manufacture method of the bonding agent band of the 4th embodiment for representing the present invention.
Figure 39 A and Figure 39 B is the figure of bonding agent band, and Figure 39 A are the axonometric chart of the spool that volume has bonding agent band, and Figure 39 B are Top view to the bonding agent band of Figure 39 A from terms of bonding agent side.
Figure 40 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Figure 41 is the schematic diagram of the crimping process of the bonding agent of the adhering device of the 2nd embodiment for representing the present invention
Figure 42 A～Figure 42 C are the sectional view of the bonding agent band of the 3rd embodiment of the present invention.
Figure 43 A～Figure 43 C are the bonding agent band and its process chart of compression bonding method of the 4th embodiment for representing the present invention.
Figure 44 A～Figure 44 C are the process chart of the manufacture method of the bonding agent band of the 5th embodiment for representing the present invention.
Figure 45 A and Figure 45 B are the figure of the adhesive agent-tape cassette of the 1st embodiment of the present invention, and Figure 45 A are adhesive agent-tape cassette Axonometric chart, Figure 45 B are the line A-A sectional view of Figure 45 A.
Figure 46 is the sectional view of the installment state of the spool for representing the tape drum shown in Figure 45 A.
Figure 47 is the front view of the crimping process of the bonding agent for representing adhering device.
Figure 48 is the process chart of the manufacture method for representing adhesive agent-tape cassette.
Figure 49 is the schematic diagram of the crimping process of the bonding agent of the adhering device of the 2nd embodiment for representing the present invention
Figure 50 is the sectional view of the bonding agent band of the 3rd embodiment of the present invention.
Figure 51 A and Figure 51 B are the bonding agent band and its process chart of compression bonding method of the 4th embodiment for representing the present invention.
Figure 52 A and Figure 52 B are the figure of the adhesive material tape for representing the 1st embodiment, and Figure 52 A are expression adhesive material reel Between connection axonometric chart, Figure 52 B be represent Figure 52 A coupling part sectional view.
Figure 53 is the sectional view of the adhesive material tape for representing the 2nd embodiment.
Figure 54 A～Figure 54 C are the sectional view of the connection operation of the coupling part for representing Figure 55, and Figure 54 A are represented before electric discharge State, Figure 54 B represent the state after electric discharge, and Figure 54 C are the figure of the thermo-compression bonding for representing coupling part.
Figure 55 is the axonometric chart of the connection between the adhesive material reel in the method for attachment for represent adhesive material tape.
Figure 56 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
Figure 57 A～Figure 57 C are the figure of the adhesive material tape spool for representing the 1st embodiment, and Figure 57 A are expression adhesivess The axonometric chart of spool of tape, Figure 57 B are the front view of Figure 57 A, and Figure 57 C are the front view of the cover of Figure 57 A.
Figure 58 is the process chart of the manufacture method for representing adhesive material tape spool.
Figure 59 is the side view of the adhesive material tape spool of the 2nd embodiment of the present invention.
Figure 60 A and Figure 60 B are the front view of the adhesive material tape spool of the 3rd embodiment of the present invention, are to illustrate bonding The figure of the replacing of agent band.
Figure 61 is the axonometric chart of the side plate of the winder of the 4th embodiment for representing the present invention.
Figure 62 A and Figure 62 B are the figure of the adhering apparatus of the 1st embodiment of the present invention, and Figure 62 A are the axonometric chart of adhering apparatus, Figure 62 B are the line A-A sectional view of Figure 62 A.
The side view of the using method of adhering apparatus of the Figure 63 shown in explanatory diagram 62A and Figure 62 B.
Figure 64 is the process chart of the manufacture method for representing adhering apparatus.
Figure 65 A and Figure 65 B are the figure of the adhesive material tape for representing the 1st embodiment, and Figure 65 A are expression adhesive material-tape reel The axonometric chart being wound on spool, Figure 65 B are the line A-A sectional view of Figure 65 A.
Figure 66 A and Figure 66 B be represent the 1st embodiment adhesive material tape adhesivess formation process figure, Figure 66 A Each adhesive material tape is set to overlap and be made of one to represent, the operation base material of a side being wound up on the spool of winding Schematic diagram, Figure 66 B are the sectional view of the part overlapped each other between the bonding agent for representing Figure 66 A.
Figure 67 is the schematic diagram for representing the operation being formed in the bonding agent of adhering device in bonded object.
Figure 68 is the axonometric chart of the spool that volume has adhesive material tape.
Figure 69 A are the sectional view of the adhesivess formation process of the adhesive material tape for representing the 2nd embodiment.
Figure 69 B are the sectional view of the bonding between the circuit board for representing the adhesivess for using Figure 69 A.
Figure 70 is the schematic diagram of the supply mode of the anisotropic conductive material band of 2 layers of construction for representing the present invention.
Figure 71 is the schematic diagram of the supply mode of the anisotropic conductive material band of 3 layers of construction for representing the present invention.
Specific embodiment
Below, embodiments of the present invention are described in detail referring to the drawings.In addition, in the following description, to identical Or equal element puts on identical symbol.
First, with reference to Fig. 1～Fig. 5, the embodiment of the 1st scheme～the 4th scheme of the present invention is illustrated.
Fig. 1 is the connection between the adhesive material reel in the method for attachment of the adhesive material tape for representing the 1st embodiment Axonometric chart, Fig. 2A and Fig. 2 B be represent Fig. 1 coupling part (A) connection process chart, Fig. 2A for represent end-of-use is glued The axonometric chart of the magnetic tape trailer cut-out of material strips is connect, Fig. 2 B are to represent the upset of end-of-use adhesive material tape and new adhesive material tape The axonometric chart being attached, Fig. 3 is the schematic diagram of the crimping process of the bonding agent for representing adhering device, and Fig. 4 is indication circuit plate Between bonding sectional view, Fig. 5 be represent adhesive material tape manufacture method process chart.
Adhesive material tape 1 on spool 3,3a, core 5 is provided with each spool 3,3a and bonding material is configured in respectively The side plate 7 of the width both sides of material strip 1.That is, each spool 3,3a has core 5 and is arranged respectively at the width of adhesive material tape 1 The side plate 7 of degree both sides.
Adhesive material tape 1 is made up of the bonding agent 11 of base material 9 and the one side for being coated on base material 9.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is extended by OPP Polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc. constitute, it is not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc..Conducting particles 13, can be in the high score such as these and dielectric glass, ceramics, plastics On sub- core etc., the conductive layer being formed with modes such as claddings made by the material for being constituted above-mentioned conducting particles 13.In addition, may be used also The insulating wrapped particle that conducting particles 13 as above is obtained, and conducting particles 13 and insulation grain are coated with insulating barrier to be suitable for Son and with etc..After conductive layer is formed on the macromolecule core such as the heatmeltable such as scolding tin metal and plastics, due to by hot pressing Or there is the distance between morphotropism, the electrode after connection to reduce for pressurization, increase with the contact area of circuit during connection, improve Reliability, therefore preferably.In the case of particularly with high score subclass as core, conducting particles 13 as scolding tin due to showing not Go out fusing point, therefore, it is possible to control soft state in very wide connection temperature range such that it is able to obtain easily with the thickness of electrode The corresponding connecting material that fluctuates of degree and flatness, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape 1 of present embodiment.As shown in figure 3, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed, the front end for rolling up the adhesive material tape 1 on spool 3a is hung on 15 On pilot pin 22 and on winding off spindle 17, adhesive material tape 1 (the arrow E in Fig. 3) is extracted out.Afterwards, adhesive material tape 1 is matched somebody with somebody Put on circuit board 21, by the thermal head 19 being arranged between two spool 3a, 17, from the side pressure of base material 9 adhesive material tape is connect 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact：As shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of present embodiment adhesive material tape 1, its size is larger, the whole surrounding of PDP is pressed sometimes Connect, coupling part is a lot, for bonding agent 11, the usage amount of nonrecoverable bonding agent 11 with it is very many than before.Cause This, the usage amount for rolling up the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is when shorter It is interior to be just rolled on winding off spindle 17, expose the terminal label 28 (with reference to Fig. 1) of adhesive material tape 1 of the volume on spool 3a.
The method of attachment of the adhesive material tape of the present invention, with (a) and (b) two kinds of situations.A () situation is to continue with using volume Axle 17 is taken, the bonding agent band for remaining a small amount of volume of the adhesive material tape 1 being finished is changed, new bonding agent band is connected to and is batched On axle 17；B () situation is that the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 that will be finished is used as winding off spindle 17, New bonding agent band is connected with the remaining a small amount of bonding agent band of volume number.
In the case of (b), as shown in figure 1, on the adhesive material tape 1 of spool 3a, it is new in order to spool 3a is replaced by Adhesive material reel 3, it is bonding with new by the terminal part 30 of the adhesive material tape (adhesive material tape of a side) 1 of spool 3a The initial portion 32 of the adhesive material tape (adhesive material tape of the opposing party) 1 wound on material spool 3 is connected.
The connection of the adhesive material tape 1 is as described below carrying out, when the terminal of the adhesive material tape 1 of end-of-use spool 3a When labelling 28 exposes, as shown in Figure 2 A, by the cut-out (B) nearby of the terminal label 28 of adhesive material tape 1, adhesive material tape is overturn 1 terminal part 30, the face of bonding agent 11 for making adhesive material tape 1 is located at upside (Fig. 2 B).Next, by end-of-use spool 3a Adhesive material tape 1 terminal part 30 the face of bonding agent 11, the top with the adhesive material tape 1 of new adhesive material reel 3 The face of bonding agent 11 of part 32 overlaps (Fig. 2 B).
Next, as shown in figure 4, the lap of the two is placed on platform 104, using the thermal head of adhering device 15 19 carry out hot pressing so as to bonding.So, institute on the adhesive material tape 1 for being wound on end-of-use spool 3a, with new spool 3 The adhesive material tape 1 of winding is just connected.Next, end-of-use spool 3a and new spool 3 are changed, by new volume Axle 3 is installed on adhering device 15.So, it is not necessary to adhesive material tape 1 is installed to into the operation on winding off spindle 17.In addition, by In making the face of bonding agent 11 overlapped and bonding, therefore bonding strength is high.
In addition, in adhesive material tape 1, by adhesive material tape 1, from end-of-use spool, (adhesive material tape 1 is taken out completely The spool for going out) 3a when moving thermal head 19 to, preferably makes terminal label 28 be located at from adhesive material tape 1 on end-of-use spool 3a The position being fixed is in the extension position between thermal head 19.In this case, if cut off near terminal label 28, Then adhesive material tape 1 is cut off in necessary Min. position, while being prevented from the waste of adhesive material tape 1, Can be avoided to remove end-of-use spool 3a and terminal label 28 is delivered to into thermal head 19 and mobile end-of-use spool This troublesome operations of 3a.
In present embodiment, because adhering device 15 has thermal head 19, using the thermal head 19, end-of-use volume is carried out The bonding agent 11 of the terminal part 30 of the adhesive material tape 1 of axle 3a, the beginning with the adhesive material tape 1 of new adhesive material reel 3 Connection between the bonding agent 11 of end part 32, therefore, there is no need in addition using for bonding agent 11 is crimped together mutually Apparatus for pressure welding, it becomes possible to carry out rolling up the replacing of the spool 3,3a of adhesive material tape 1.
Being continuing with winding off spindle 17, by the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished with it is new Bonding agent band is changed, and new bonding agent band is connected in the situation (a) on winding off spindle 17, when the bonding of end-of-use spool 3a When the terminal label 28 of material strips 1 is exposed, the terminal label 28 of adhesive material tape 1 is nearby cut off, upset is remained in batches The terminal part of the adhesive material tape of the side of axle 17, makes the face of bonding agent 11 be located at upside.Next, making the end of the adhesive material tape 1 The face of bonding agent 11 of end part, the face phase of bonding agent 11 with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3 Overlap.Afterwards, the lap of the two is placed on platform 104, using the thermal head 19 of adhering device 15 hot pressing is carried out so as to Bonding.So, the adhesive material tape 1 for being wound on the adhesive material tape 1 on winding off spindle 17, with new spool 3 just by Couple together.So, due to only wrapped around base material 9 on winding off spindle 17, therefore, it is possible to wind the amount of multiple adhesive material reels, So as to reduce the replacing number of times of winding off spindle 17, working performance is high.
Next, illustrating to the manufacture method of the adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) 9 rolled out from the machine that rolls out 25, using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for mixing, after being dried in drying oven 29, with up- coiler 31 master is wound.The bonding material for being wound The master of material strip 1 cuts into given width by longitudinal cutter 33, after being wound up in core, side plate 7,7 is pacified from both sides It is attached in core, or it is together wired up in the core with side plate with desiccant, in (- 5 DEG C of low temperature ～-10 DEG C) under carry out keeping and outbound.
Next the 2nd embodiment of the present invention is illustrated, mainly illustrate below it is different from the embodiment described above it Point.
In the 2nd embodiment shown in Fig. 6, using the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3 Middle be provided with guiding band 41, carry out the adhesive material tape 1 of new adhesive material reel 3 with using being wound on complete spool 3a Connection between adhesive material tape 1.Guiding is made up of base material 45 with 41 with the face of bonding agent 43 on the inside of it, new adhesivess volume The initial portion 32 of the adhesive material tape 1 of axle 3, using guiding the adhesive material tape on spool is pasted and is fixed on 41 On 1 face of base material 9.Afterwards, guiding band 41 is peeled off from the face of base material 9 so as to the terminal part with the adhesive material tape 1 for having overturn 30 face of bonding agent 11 overlaps.The lap of the two is placed on platform 104, the thermal head 19 using adhering device 15 is warm Pressure so as to bonding.So, due to the guiding band 41 using adhesive material tape 1, the terminal of the adhesive material tape 1 for finishing will be unreeled Part 30, couples together with the initial portion 32 of the new adhesive material tape 1 installed, therefore, the connection letter between adhesive material tape 1 It is single.In addition, in this case, due to guiding the mask toughness of bonding agent 43 set by the inner side with 41 base material 45, as long as Make it to overlap with the face of bonding agent 11 of the terminal part 30 of the adhesive material tape 1 for having inverted just can be attached, this side Method is also feasible.
The present invention is not limited to above-mentioned embodiment, can without departing from the spirit and scope of the invention carry out various changes Shape.
For example, in above-mentioned 2nd embodiment, the adhesive material tape 1 wound on end-of-use spool 3a can not be overturn, But as shown in fig. 7, the guiding band 41 of the initial portion 32 of the new adhesive material tape 1 installed is peeled off from the face of base material 9, stickup On the face of bonding agent 11 of inner side, bonding agent 11 face of the guiding with 41 Yu the terminal part 30 of end-of-use adhesive material tape 1 is made It is connected, recycling the thermal head 19 of adhering device 15 carries out hot pressing so as to carry out bonding.At this moment, unreeled due to need not overturn The adhesive material tape 1 for finishing such that it is able to prevent the danger that volume collapses when by adhesive material tape 1 on winding off spindle.
In addition, in this case, it is also possible to by the guiding band 41 of the initial portion 32 of adhesive material tape 1 from the face of base material 9 Peel off, and it is mutually bonding with the face of base material 9 of end-of-use adhesive material tape 1 with 41 by guiding.
Next, the invention to the 5th scheme～the 8th scheme is illustrated.
While these inventions are related between bonding and fixed electronic devices and components and circuit board or circuit board, the two is made The adhesive material tape for electrically connecting, more particularly to the method for attachment for being wound into a roll the adhesive material tape of shaft-like are realized between electrode.
Next, illustrating to the background technology of the invention of the 5th scheme～the 8th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has batching for base material Axle, new winding off spindle is installed on adhering device with new adhesive material reel, and the top of adhesive material tape is installed to On winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to changing adhesive material reel fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 5th scheme～the 8th scheme is to provide one kind can simply carry out adhesivess volume The replacing of axle, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine is improved.
Next, reference picture 8A～Fig. 8 C, Fig. 3～Fig. 5, illustrates to the 1st embodiment of the present invention.Fig. 8 A～figure 8C is the figure of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Fig. 8 A are to represent the company between adhesive material reel The axonometric chart for connecing, Fig. 8 B are the axonometric chart of the method for attachment of the coupling part for representing Fig. 8 A, and Fig. 8 C are the coupling part of Fig. 8 A Top view.
Adhesive material tape 1 is provided with core 5 and is configured in bonding material respectively by volume on spool 3,3a in each spool 3,3a The side plate 7 of the width both sides of material strip 1.In present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 5mm.
Adhesive material tape 1 is made up of base material 9 and the bonding agent 11 being coated on the one side of base material 9.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is extended by OPP Polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc. constitute, but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc..Conducting particles 13, can be in the high score such as these and dielectric glass, ceramics, plastics On sub- core etc., the conductive layer being formed with modes such as claddings made by the material for being constituted above-mentioned conducting particles 13.In addition, may be used also The insulating wrapped particle that conducting particles 13 as above is obtained, and conducting particles 13 and insulation grain are coated with insulating barrier to be suitable for Son and with etc..After conductive layer is formed on the macromolecule core such as the heatmeltable such as scolding tin metal and plastics, due to by hot pressing Or there is the distance between morphotropism, the electrode after connection to reduce for pressurization, increase with the contact area of circuit during connection, improve Reliability, therefore preferably.In the case of particularly with high score subclass as core, conducting particles 13 is due to no clear as scolding tin Clear fusing point, therefore, it is possible to control soft state in very wide connection temperature range such that it is able to obtain easily with electrode The corresponding connecting material that fluctuates of thickness and flatness, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape 1 of present embodiment.As shown in figure 3, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed, the front end for rolling up the adhesive material tape 1 on spool 3a is hung on 15 On pilot pin 22 and on winding off spindle 17, adhesive material tape 1 (the arrow E in Fig. 3) is extracted out.Afterwards, adhesive material tape 1 is matched somebody with somebody Put on circuit board 21, by the thermal head 19 being arranged between two spool 3a, 17, from the side pressure of base material 9 adhesive material tape is connect 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact, as shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of present embodiment adhesive material tape 1, its size is larger, the whole surrounding of PDP is pressed sometimes Connect, coupling part is more, for bonding agent 11, the usage amount of first use bonding agent 11 with it is very many than before.Therefore, roll up The usage amount of the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is within a short period of time It is rolled on winding off spindle 17, exposes the terminal label 28 (reference picture 8A) of adhesive material tape 1 of the volume on spool 3a.
The method of attachment of the adhesive material tape of the present invention, with (a) and (b) two kinds of situations.A () situation is to continue with using volume Axle 17 is taken, the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished is changed, new bonding agent band is connected to and is batched On axle 17；B () situation is that the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 that will be finished is used as winding off spindle 17, New bonding agent band is connected with the remaining a small amount of bonding agent band of volume number.
In the case of (b), as shown in Figure 8 A, terminal label 28 is exposed on the adhesive material tape 1 of spool 3a, in order to incite somebody to action Spool 3a is replaced by new adhesive material reel 3, by the terminal part of the adhesive material tape (adhesive material tape of a side) 1 of spool 3a Divide the initial portion 32 of the adhesive material tape (adhesive material tape of the opposing party) 1 wound on 30, with new adhesive material reel 3 It is connected (reference picture 8A).
The connection of the adhesive material tape 1, the adhesive material tape 1 as shown in Fig. 8 B and Fig. 8 C, for adhesive material reel 3a Terminal part 30, the initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 makes the base material 9 of terminal part 30 Face is Chong Die with the face of bonding agent 11 of initial portion 32.Afterwards, the substantially locking pin 46 in U-shaped is inserted on lap, will The terminal part 30 of adhesive material tape 1, couples together with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3.
Therefore, the adhesive material tape 1 for being wound on end-of-use spool 3a, with the bonding material wound on new spool 3 Material strip 1 is connected.So, due to the terminal part 30 and new peace of the adhesive material tape 1 for finishing will be unreeled with locking pin 46 The initial portion 32 of the adhesive material tape 1 of dress is fixed up so that connection is simple.
Next, changing end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Cause This, it is not necessary to the operation being installed to new adhesive material tape 1 on winding off spindle 17.
Being continuing with winding off spindle 17, by the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished with it is new Bonding agent band is changed, and new bonding agent band is connected in the situation (a) on winding off spindle 17, when the bonding of end-of-use spool 3a When the terminal label 28 of material strips 1 is exposed, the terminal label 28 of adhesive material tape 1 is nearby cut off, make to remain in winding off spindle The terminal part 30 of the adhesive material tape of 17 sides, the weight of initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 It is folded.Afterwards, the substantially locking pin 46 in U-shaped is inserted on the lap of the two, by the terminal part of adhesive material tape 1 30, couple together with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3.
Due to being only wound with base material 9 on winding off spindle 17, therefore, it is possible to wind the amount of multiple adhesive material reels.Therefore, The replacing number of times of winding off spindle 17 can be reduced, working performance is high.
Next, the 2nd～the 4th embodiment of the invention of the 5th scheme～the 8th scheme is illustrated, it is described below Embodiment in by putting on same-sign to same section, omit the detailed description of the part, below main pair with it is above-mentioned 1st embodiment difference illustrates.
In the 2nd embodiment shown in Fig. 9, using claw 48,49 and with the end for being arranged on a side and the opposing party Connection two ends claw 48,49 elastic component 50 engagement device 47, by the terminal part 30 of the adhesive material tape 1 of a side with it is another The initial portion 32 of the adhesive material tape 1 of one side is coupled together.Specifically, the terminal part of the adhesive material tape 1 of a side is made 30 is relative to each other with the initial portion 32 of the adhesive material tape 1 of the opposing party, and the claw 48 being arranged on the one end of engagement device 47 is blocked Be scheduled on terminal part 30, claw 49 on an opposite end will be set and be engaging on initial portion 32, the claw 48 of a side with it is another The claw 49 of one side is furthered with elastic component 50.In addition, claw 48,49 is provided with the pawl of multiple front end points on the inside of board member 51。
Due to the claw being arranged on one end of engagement device 47 48 is engaging on terminal part 30, afterwards, will be arranged on Claw 49 on the other end is engaging on initial portion 32, and the two is interconnected, hence in so that connection is easy.Further, since Elastic component 50 is provided between the claw 48 of one side and the claw 49 of the opposing party, therefore is extended by elastic component 50 and just can make card The claw 49 for determining the opposing party of part 47 is engaging on the optional position of the initial portion 32 of the adhesive material tape 1 of the opposing party, so The degree of freedom of connection is high.
In the 3rd embodiment shown in Figure 10, for the terminal of the adhesive material tape 1 wound on end-of-use spool 3a Part 30, the initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 makes the face of base material 9 of terminal part 30 and begins The face of bonding agent 11 of end part 32 overlaps, and afterwards, is clamped simultaneously with the clip 53 of the cross section substantially elastically deformable in U-shaped Fixed lap.Just can be attached due to only being clamped lap by clip 53, therefore connection operation is easy.
In the 4th embodiment shown in Figure 11, by cross section, holding piece 55 will substantially made by the metal in U-shaped Lap in 1st embodiment is encased, and is pressed holding piece 55 from the two sides of lap and is coupled together the two.Due to logical Cross and press holding piece 55 from the two sides of lap and be attached, therefore, it is possible to firmly be connected in lap.
The invention of the 5th scheme～the 8th scheme is not limited to above-mentioned embodiment, without departing from the 5th scheme～the 8th scheme Various modifications can be carried out in the range of the purport of invention.
For example, in above-mentioned 1st embodiment, locking pin 46 can not be U-shaped substantially but the pin of 1 wire, this In the case of kind, preferably use a plurality of needles and fix lap.
In 2nd embodiment, engagement device 47 can correspond to the width of adhesive material tape 1 and use multiple.
In 3rd embodiment and the 4th embodiment, clip 53 or holding piece 55 can use multiple so as to respectively from viscous The both sides for connecing the lap of material strips 1 are fixed.
Next, the invention to the 9th scheme～the 13rd scheme is illustrated.
These invention be related to will it is bonding between electronic devices and components and circuit board or circuit board and fixation while, make the two Electrode between electrically connect adhesive material tape, be particularly rolled into the method for attachment of the adhesive material tape of reel.
Next, illustrating to the background technology of the invention of the 9th scheme～the 13rd scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has batching for base material Axle, new winding off spindle is installed on adhering device with new adhesive material reel, and the top of adhesive material tape is installed to On winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to changing adhesive material reel fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 9th scheme～the 13rd scheme is, there is provided one kind can simply carry out adhesivess The replacing of spool, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine is improved.
Next, illustrating to the embodiment of the invention of the 9th scheme～the 13rd scheme referring to the drawings.First, reference Figure 12 A, Figure 12 B, Fig. 3～Fig. 5 are illustrated to the 1st embodiment of the invention of the 9th scheme～the 13rd scheme.Figure 12 A, figure 12B is the figure of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Figure 12 A are to represent between adhesive material reel The axonometric chart of connection, Figure 12 B are the axonometric chart of the method for attachment of the coupling part for representing Figure 12 A.
Adhesive material tape 1 is provided with core 5 and is configured in bonding material respectively by volume on spool 3,3a in each spool 3,3a The side plate 7 of the width both sides of material strip 1.In present embodiment, the length of adhesive material tape 1 is about 50m, and width W is about 3mm.
Adhesive material tape 1 is made up of base material 9 and the bonding agent 11 being coated on the one side of base material 9.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc..Can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting material, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape 1 of present embodiment.As shown in figure 3, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed on 15, the front end of adhesive material tape 1 of the volume on spool 3a is installed On winding off spindle 17, adhesive material tape 1 (the arrow E in Fig. 3) is extracted out.Afterwards, adhesive material tape 1 is configured in circuit board 21 On, by the thermal head 19 being arranged between two spool 3a, 17, adhesive material tape 1 is connect from the side pressure of base material 9, by bonding agent 11 It is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact, as shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of present embodiment adhesive material tape 1, its size is larger, the whole surrounding of PDP is pressed sometimes Connect, coupling part is more, for bonding agent 11, the usage amount of first use bonding agent 11 with it is very many than before.Therefore, roll up The usage amount of the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is within a short period of time It is rolled on winding off spindle 17, exposes the terminal label 28 (reference picture 12A) of adhesive material tape 1 of the volume on spool 3a.
The method of attachment of the 9th scheme to the adhesive material tape of the 13rd scheme of the present invention, with (a) and (b) two kinds of situations. A () situation is to continue with using winding off spindle 17, change the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished, will be new Bonding agent band be connected on winding off spindle 17；B () situation is the remaining a small amount of bonding agent of volume number of the adhesive material tape 1 that will be finished Band is used as winding off spindle 17, and new bonding agent band is connected with the remaining a small amount of bonding agent band of volume number.
In the case of (b), as illustrated in fig. 12, terminal label 28 is exposed on the adhesive material tape 1 of spool 3a, in order to Spool 3a is replaced by into new adhesive material reel 3, by the terminal of the adhesive material tape (adhesive material tape of a side) 1 of spool 3a The initial portion of the adhesive material tape (adhesive material tape of the opposing party) wound on part 30, with new adhesive material reel 3 32 are connected (reference picture 12A).
The connection of the adhesive material tape 1, as shown in Figure 12 B, the terminal of the adhesive material tape 1 for adhesive material reel 3a Part 30, the initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 makes the face of base material 9 of terminal part 30 and begins The face of bonding agent 11 of end part 32 overlaps.Make the overlap length H of the two be about 2.5 times with 1 width W of bonding agent, be positioned over On platform 36, using the hot pressing of thermal head 19 of adhering device 15 bonding is carried out.So, what is wound on end-of-use spool 3a is viscous Material strips 1 are connect, is just connected with the adhesive material tape 1 that wound on new spool 3.Next, changing end-of-use Spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Therefore, there is no need to be installed to adhesive material tape Operation on winding off spindle 17.
In the present embodiment, due to using thermal head 19, thus need not be used using the crimping between bonding agent in addition Utensil, it is possible to change the spool 3,3a of winding adhesive material tape 1.
Being continuing with winding off spindle 17, by the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished with it is new Bonding agent band is changed, and new bonding agent band is connected in the situation (a) on winding off spindle 17, when the bonding of end-of-use spool 3a When the terminal label 28 of material strips 1 is exposed, the terminal label 28 of adhesive material tape 1 is nearby cut off, make to remain in winding off spindle The terminal part 30 of the adhesive material tape of 17 sides, the weight of initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 It is folded.Afterwards, its bonding is made using the lap of both the hot pressing of thermal head 19 of adhering device 15.Due on winding off spindle 17 only Winding base material 9, therefore, it is possible to wind the amount of multiple adhesive material reels such that it is able to reduce the replacing number of times of winding off spindle 17, makees Industry efficiency high.
Next, illustrating to the manufacture method of this adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesivess for being wound The master of band cuts into given width by longitudinal cutter 33, after being wound up in core, side plate 7,7 is installed to from both sides In core, or it is together wired up in the core with side plate with desiccant, preferably in (- 5 DEG C of low temperature ～-10 DEG C) under carry out keeping and outbound.
Next, the other embodiment of the invention of the 9th scheme～the 13rd scheme is illustrated, described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, the detailed description of the part is omitted, Below main pair illustrates with the difference of above-mentioned embodiment.
In the 2nd embodiment shown in Figure 13, the mould of the side that the hackle mark (concavo-convex) 44 being had by surface is mutually twisted Tool 56 and the mould 57 of the opposing party, clamp the lap 34 of adhesive material tape 1, and concavo-convex 58 are formed on lap 34.It is logical Cross and so formed concavo-convex 58, by increasing capacitance it is possible to increase the bond area of lap 34, and the combination of pass through lap 34 concavo-convex 58 The intensity of draw direction (length direction of adhesive material tape) can be increased.When forming concavo-convex, bonding agent 11 flows, by bonding Agent will be bonded together between the end face of lap, and then increase the intensity of the draw direction of lap 34.
In the 3rd embodiment shown in Figure 14 A and Figure 14 B, volume is had the initial portion of the spool 3 of new adhesivess 1 32 are bent into substantially V-shaped, and the terminal part 30 of the adhesive material tape 1 wound on end-of-use spool 3a is also bent into substantially V-shaped, makes the two hook-shaped and faces each other bonding agent 11 so as to block (Figure 14 A), using the hot pressing of thermal head 19, by two Person couples together (Figure 14 B).In 3rd embodiment, due to terminal part 30 being coupled together with initial portion 32 in hook-shaped, Therefore while being attached securely, it is attached because bonding agent 11 overlaps each other such that it is able to obtain stronger Connection.It is same as described above, the bonding agent flowing of lap so that end face is also glued, more firm therefore, it is possible to obtain Solid connection.
In the 4th embodiment shown in Figure 15 A and Figure 15 B, before the hot pressing in the 1st embodiment is carried out or hot pressing While, open through hole 59 in lap 34.By opening through hole 59, can be from through hole 59 due to carrying out bonding agent 11 during hot pressing Around ooze out and be bonded together them, therefore, it is possible to improve bonding force such that it is able to firmly connected in lap 34 Connect.
The invention of the 9th scheme～the 13rd scheme is not limited to above-mentioned embodiment, without departing from the 9th scheme～the 13rd scheme Invention purport in the range of can carry out various modifications.
For example, in above-mentioned 2nd embodiment, concavo-convex 58 can not be triangle, but the round with circular arc.
In 4th embodiment, the number of through hole 59 is had no particular limits, it is several can.In addition to through hole 59 Diameter is not also limited.In addition, in the 2nd, 3 embodiments, it is also possible to form through hole 59 on lap 34.
Next, the invention to the 14th scheme～the 18th scheme is illustrated.
These invention be related to will it is bonding between electronic devices and components and circuit board or circuit board and fixation while, make the two Electrode between electrically connect adhesive material tape, particularly a kind of method of attachment of the adhesive material tape for being rolled into reel.
Next, illustrating to the background technology of the invention of the 14th scheme～the 18th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Viscous Connect after material spool installs, the substrate side of the adhesive material tape unreeled from adhesive material reel, using thermal head by bonding agent It is crimped onto on circuit board etc., and the base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has batching for base material Axle, new winding off spindle is installed on adhering device with new adhesive material reel, and adhesive material tape is hung over into adhering device Guiding piece on while its top is installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to changing adhesive material reel fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
On the other hand, even if being pasted with adhesion adhesive material tape between adhesive material tape and adhesive material tape, can not be with Enough bonding force bondings.This is because, in order that there is good fissility between adhesive material tape and adhesivess and gluing Connect and be coated with material strips caused by the parting compound of fluorine class, the impact of the parting compound of silicone.
Therefore, the purpose of the invention of the 14th scheme～the 18th scheme is to provide a kind of method of attachment of adhesive material tape, Particularly in the case where the base material of adhesive material tape is used by the base material of silicone-treated, it is also possible to simply carry out adhesivess The replacing of spool, realizes the raising of the production efficiency of e-machine.
Next, illustrating to the embodiment of the invention of the 14th scheme～the 18th scheme referring to the drawings.First, reference Figure 16 A, 16B, Fig. 3～Fig. 5 is illustrated to the 1st embodiment of the invention of the 14th scheme～the 18th scheme.Figure 16 A and figure 16B is the figure of the method for attachment of the adhesive material tape for representing the 1st embodiment, and Figure 16 A are to represent between adhesive material reel The axonometric chart of connection, Figure 16 B are the axonometric chart of the method for attachment of the coupling part (b) for representing Figure 16 A.
Respectively by volume on spool 3,3a, each spool 3,3a is provided with core 5 and is configured in bonding material adhesive material tape 1 The side plate 7 of the width both sides of material strip 1.
Adhesive material tape 1 is by silicone-treated base material 9 and the structure of bonding agent 11 being coated on the one side of silicone-treated base material 9 Into.
Silicone-treated base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, makes With base materials such as OPP (extended polypropylene), politef, PET (polyethylene terephthalate), on its surface using silicon tree Fat etc. is surface-treated.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting material, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in figure 3, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed on 15, the front end of adhesive material tape 1 of the volume on spool 3a is installed On winding off spindle 17, adhesive material tape 1 (the arrow E in Fig. 3) is extracted out.Afterwards, adhesive material tape 1 is configured in circuit board 21 On, by the thermal head 19 being arranged between two spool 3a, 17, adhesive material tape 1 is connect from the side pressure of silicone-treated base material 9, will Bonding agent 11 is crimped onto on circuit board 21.Afterwards, silicone-treated base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact, as shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of present embodiment adhesive material tape 1, its size is larger, the whole surrounding of PDP is pressed sometimes Connect, coupling part is more, for bonding agent 11, the usage amount of first use bonding agent 11 with it is very many than before.Therefore, roll up The usage amount of the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is within a short period of time It is rolled on winding off spindle 17, exposes the terminal label 28 (reference picture 16A) of adhesive material tape 1 of the volume on spool 3a.
The method of attachment of the adhesive material tape of the invention of the 14th scheme～the 18th scheme, with (a) and (b) two kinds of situations. A () situation is to continue with using winding off spindle 17, change the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished, will be new Bonding agent band be connected on winding off spindle 17；B () situation is the remaining a small amount of bonding agent of volume number of the adhesive material tape 1 that will be finished Band is used as winding off spindle 17, and new bonding agent band is connected with the bonding agent band of the remaining a small amount of volume of volume number.
In the case of (b), as shown in Figure 16 A, terminal label 28 is exposed on the adhesive material tape 1 of spool 3a, in order to Spool 3a is replaced by into new adhesive material reel 3, by the terminal of the adhesive material tape (adhesive material tape of a side) 1 of spool 3a The initial portion of the adhesive material tape (adhesive material tape of the opposing party) wound on part 30, with new adhesive material reel 3 32 are connected.
The connection of the adhesive material tape 1, as shown in fig 16b, makes the terminal part of the adhesive material tape 1 of adhesive material reel 3a Divide 30, it is relative to each other with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3, across two adhesive material tapes 1st, silicone adhesive tape 60 on the surface mount of 1 silicone-treated base material 9,9, two adhesive material tapes 1,1 are coupled together.
The silicone adhesive tape 60, is made up of base material 63 with the silicone sticker 62 being coated with the one side of base material 63.To base There is no particular limitation for the material of material 63, is polyimide resin material in present embodiment.In addition, in Figure 16 B, bonding material The bonding agent 11 of material strip is represented respectively with the bonding agent part 43 of silicone adhesive tape 60 with oblique line.
Here, to being illustrated by the bonding of silicone adhesive tape 60.The silicon of the adhesive material tape 1,1 of one side and the opposing party Ketone to be processed and be respectively coated with silicone on base material 9,9, highly difficult hence with bonding agent bonding；But in the present embodiment, pass through Silicones are adopted in the sticker 43 of silicone adhesive tape 60 so as to the surface tension between two silicone-treated base materials 9,9 Difference it is less, by make its closely sealed (bonding) and by the bonding material of the terminal part 30 of the adhesive material tape 1 of a side and the opposing party The initial portion 32 of material strip 1 is coupled together well.The surface of the silicone sticker 62 in silicone adhesive tape 60 and silicone-treated Between base material 9,9 surfaces surface tension difference preferably in 10mN/m (10dyne/cm) below, in present embodiment, surface tension Difference does not almost have.
In general, two silicone of the adhesive material tape 1 of the terminal part 30 of the adhesive material tape 1 of a side and the opposing party The surface tension for processing base material 9,9 is 25mN/m～60mN/m (25～60dyne/cm), and for example, surface tension is 30mN/m's In the case of, the surface tension of the silicone sticker 62 of silicone adhesive tape 60 is set as into more than 20mN/m, below 40mN/m.
Silicone sticker is mainly made up of silicone rubber with silicones, is made the two that condensation reaction to occur slightly and is shown adhesion Property, in addition, the general hydrosilylation reactions by using peroxide, platinum catalyst produce crosslinking, make glass transfer temperature Spend for less than -100 DEG C.These silicone stickers are commercially available, and can be advantageously applied to this.
So, using silicone adhesive tape 60, the adhesive material tape 1 that will be wound on end-of-use adhesive material reel 3a, Couple together with the adhesive material tape 1 wound on new adhesive material reel 3.Next, changing end-of-use adhesivess Spool 3a and new adhesive material reel 3, new adhesive material reel 3 is installed on adhering device 15.Therefore, because being not required to The adhesive material tape 1 of new adhesive material reel 3 is extracted out, adhesive material tape is installed on winding off spindle 17, or will be new Adhesive material tape 1 hang over the first-class operation of guiding piece 36 of adhering device 15, so, the replacement operation of adhesive material reel 3,3a Efficiency is fine.So, the beginning due to unreeling the terminal part 30 of the adhesive material tape 1 for finishing, with the new adhesive material tape 1 installed End part 32 is connected using silicone adhesive tape, therefore connects simple.
Next, changing end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Cause This, it is not necessary to adhesive material tape 1 is installed to into the operation on winding off spindle 17.
Being continuing with winding off spindle 17, by the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished with it is new Bonding agent band is changed, and new bonding agent band is connected in the situation (a) on winding off spindle 17, when the bonding of end-of-use spool 3a When the terminal label 28 of material strips 1 is exposed, the terminal label 28 of adhesive material tape 1 is nearby cut off, make to remain in winding off spindle The terminal part 30 of the adhesive material tape of 17 sides, with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3 each other Relatively.Afterwards, in the part relative to each other of the two using silicone adhesive tape by the terminal part 30 of adhesive material tape 1, it is and new The initial portion 32 of the adhesive material tape 1 of adhesive material reel 3 connects.Due to only winding base material 9, therefore energy on winding off spindle 17 Enough wind the amount of multiple adhesive material reels such that it is able to reduce the replacing number of times of winding off spindle 17, working performance is high.
Next, illustrating to the manufacture method of this adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed with conducting particles using the coating resin of coater 27 Bonding agent, after being dried in drying oven 29, with up- coiler 31 wind master.The adhesive material tape for being wound Master cuts into given width by longitudinal cutter 33, after being wound up in core, side plate 7,7 is installed to into core from both sides On, or it is together wired up, preferably in low temperature (- 5 DEG C～-10 in the core with side plate with desiccant DEG C) under carry out keeping and outbound.
Next, the other embodiment of the invention of the 14th scheme～the 18th scheme is illustrated, described below Embodiment in by pair putting on identical symbol with above-mentioned embodiment identical part, omit the part specifically It is bright, below main pair illustrate with the difference of above-mentioned embodiment.
It is on the basis of above-mentioned 1st embodiment, in the bonding material of a side in the 2nd embodiment shown in Figure 17 The terminal part 30 of material strip 1 has also been pasted silicone and has been glued with the surface side of bonding agent 11 of the initial portion 32 of the adhesive material tape of the opposing party Band 60.The silicone sticker 62 of the silicone adhesive tape 60 of the 2nd embodiment, its bonding force be more than 100g/25mm, this reality It is 700g/25mm～1400g/25mm in applying mode.In addition, the surface tension of the silicone sticker 62 of silicone adhesive tape 60, with Above-mentioned embodiment is the same, and the difference between the surface tension of a side and the silicone-based materials of the adhesive material tape of the opposing party is set as 10mN/m (10dyne/cm) is below.In this 2nd embodiment, due to the adhesive material tape 1 in a side terminal part 30 with it is another On the two sides of the initial portion 32 of the adhesive material tape of one side, bonding is carried out by silicone adhesive tape 60, therefore, it is possible to than the 1st The higher intensity of embodiment is bonded together two adhesive material tapes 1,1.
It is in the 3rd embodiment shown in Figure 18, the terminal part 30 of the adhesive material tape 1 of a side is bonding with the opposing party The initial portion 32 of material strips 1 overlaps, and in its side of silicone-treated base material 9 and the side of adhesivess 11, pastes the 2nd and implements The silicone adhesive tape 60 of mode, by using the 3rd embodiment, playing and the 2nd embodiment identical action effect.
It is bonding with the opposing party in the terminal part 30 of the adhesive material tape 1 of a side in the 4th embodiment shown in Figure 19 Between the initial portion 32 of material strips 1, the silicone adhesive tape 61 of silicone sticker 62 is all coated with by the two sides of base material, will be eventually End part 30 couples together with initial portion 32.By using the 4th embodiment, by using two-sided silicone adhesive tape 61, can allow a side adhesive material tape 1 terminal part 30 and the opposing party adhesive material tape 1 initial portion 32 between Connection is simpler and easy.
Next, the invention to the 19th scheme～the 21st scheme is illustrated.
These invention be related to will it is bonding between electronic devices and components and circuit board or circuit board and fixation while, make the two Electrode between electrically connect adhesive material tape, particularly a kind of method of attachment of the adhesive material tape for being rolled into reel.
Next, illustrating to the background technology of the invention of the 19th scheme～the 21st scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has batching for base material Axle, new winding off spindle is installed on adhering device with new adhesive material reel, and the top of adhesive material tape is installed to On winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to changing adhesive material reel fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 19th scheme～the 21st scheme is to provide one kind can simply carry out adhesivess The replacing of spool, realizes the method for attachment of the adhesive material tape that the production efficiency of e-machine is improved.
Next, illustrating to the embodiment of the invention of the 19th scheme～the 21st scheme referring to the drawings.First, reference Figure 20 A～Figure 20 C, Figure 21, Fig. 4 and Fig. 5, illustrates to the 1st embodiment of the invention of the 19th scheme～the 21st scheme.Figure 20A～Figure 20 C are the figure of the method for attachment of the adhesive material tape for representing present embodiment, and Figure 20 A are expression adhesive material reel Between connection axonometric chart, Figure 20 B and Figure 20 C be represent Figure 20 A coupling part method of attachment sectional view.
Adhesive material tape 1 is provided with core 5 and is configured in bonding material respectively by volume on spool 3,3a in each spool 3,3a The side plate 7 of the width both sides of material strip 1.
Adhesive material tape 1 is made up of base material 9 and the bonding agent 11 being coated on the one side of base material 9.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting material, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in figure 21, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed, the front end for rolling up the adhesive material tape 1 on spool 3a is hung on 15 On pilot pin 22 and on winding off spindle 17, adhesive material tape 1 (the arrow E in Figure 21) is extracted out.Afterwards, by adhesive material tape 1 It is configured on circuit board 21, by the thermal head 19 being arranged between two spool 3a, 17, from the side pressure of base material 9 adhesivess is connect Band 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact, as shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of present embodiment adhesive material tape 1, its size is larger, the whole surrounding of PDP is pressed sometimes Connect, coupling part is more, for bonding agent 11, the usage amount of first use bonding agent 11 with it is very many than before.Therefore, roll up The usage amount of the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is within a short period of time It is rolled on winding off spindle 17, exposes the terminal label 28 (reference picture 20A) of adhesive material tape 1 of the volume on spool 3a.
The method of attachment of the adhesive material tape of the invention of the 19th scheme～the 21st scheme, with (a) and (b) two kinds of situations. A () situation is to continue with using winding off spindle 17, change the remaining a small amount of adhesive material tape of volume number of the adhesive material tape 1 being finished, will New bonding agent band is connected on winding off spindle 17；B () situation is the remaining a small amount of bonding of volume number of the adhesive material tape 1 that will be finished Agent band is used as winding off spindle 17, and new bonding agent band is connected with the remaining a small amount of bonding agent band of volume number.
In the case of (b), as shown in FIG. 20 A, when exposing terminal label 28 on the adhesive material tape 1 of spool 3a, it is Spool 3a is replaced by into new adhesive material reel 3, using resin-made bonding agent 64 by the adhesive material tape (side of spool 3a Adhesive material tape) 1 terminal part 30, (the opposing party's is viscous with the adhesive material tape that wound on new adhesive material reel 3 Connecing material strips) 1 initial portion 32 is connected.
As resin-made bonding agent 64, can enumerate for example, epoxy resin, cyanate ester resin, bimaleimide resin, phenol Urea formaldehyde, urea resin, melmac, alkyd resin, allyl resin, unsaturated polyester resin, diallyl phthalate Propyl diester resin, silicones, resorcinol formaldehyde resin, xylene resin, furane resins, polyurethane resin, ketone Resin, triallyl cyanurate resin etc..
The connection of the adhesive material tape 1, as shown in fig. 20b, the terminal of the adhesive material tape 1 for adhesive material reel 3a Part 30, the initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 makes the face of base material 9 of terminal part 30 and begins The face of bonding agent 11 of end part 32 overlaps.Afterwards, the resin-made of pasty state is glued from the tucker 65 being assembled on adhering device 15 Connect agent 64 to be coated on lap.Afterwards, as shown in Figure 20 C, by being assembled in adhering device 15 in heater 66 plus Heat, in the case where resin-made bonding agent 64 is thermosetting resin, by make its hardening and by the terminal part of adhesive material tape 1 30 couple together with the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3.
Therefore, the adhesive material tape 1 for being wound on end-of-use spool 3a, with the bonding material wound on new spool 3 Material strip 1 is connected.So, due to resin-made bonding agent 64 terminal part 30 of the adhesive material tape 1 for finishing will be unreeled It is fixed up with the initial portion 32 of the new adhesive material tape 1 installed, connection is simple.
Next, changing end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Cause This, it is not necessary to adhesive material tape 1 is installed to into the operation on winding off spindle 17.
Being continuing with winding off spindle 17, by the remaining a small amount of bonding agent band of volume number of the adhesive material tape 1 being finished with it is new Bonding agent band is changed, and new bonding agent band is connected in the situation (a) on winding off spindle 17, when the bonding of end-of-use spool 3a When the terminal label 28 of material strips 1 is exposed, the terminal label 28 of adhesive material tape 1 is nearby cut off, make to remain in winding off spindle The terminal part 30 of the adhesive material tape of 17 sides, the weight of initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3 It is folded.Afterwards, the resin-made bonding agent 64 of pasty state is coated on the lap of the two, according to the resin-made bonding agent for being used Species heated, ultraviolet irradiation etc. so as to bonding force can be played, by terminal part 30 and new adhesive material reel The initial portion 32 of 3 adhesive material tape 1 is coupled together.It is multiple therefore, it is possible to wind due to only winding base material 9 on winding off spindle 17 The amount of adhesive material reel such that it is able to reduce the replacing number of times of winding off spindle 17, working performance is high.
Next, illustrating to the manufacture method of the adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesivess for being wound Given width is cut into by longitudinal cutter 33 with 1 master, after being wound up in core, side plate 7,7 is installed from both sides To in core, or it is together wired up in the core with side plate with desiccant, preferably in (- 5 DEG C of low temperature ～-10 DEG C) under carry out keeping and outbound.
The invention of the 19th scheme～the 21st scheme is not limited to above-mentioned embodiment, without departing from the 19th scheme～the 21st side Various modifications can be carried out in the range of the purport of the invention of case.
In present embodiment, as resin-made bonding agent 64 by taking thermosetting resin as an example, but it is also possible to use photo-curable Resin replaces thermosetting resin, and by light irradiations such as ultraviolet light-cured resin is hardened, and carries out between adhesive material tape 1 Connection.
In this case, as light-cured resin, it is possible to use with acrylate-based or methacrylic acid ester group Resin in be combined with compositionss of Photoepolymerizationinitiater initiater, solid containing light such as aromatic diazonium salt, diallyl iodine salt, sulfonium salts Epoxy resin of agent etc..
In addition, as resin-made bonding agent, it is possible to use main component is cyclopropyl acetoacetic ester resin and vistanex Heatmeltable adhesivess, such as in the case of using laminar heatmeltable adhesivess, in the mutual weight of adhesive material tape 1 Folded part, laminar heatmeltable bonding agent on volume, carrying out heating to heatmeltable bonding agent with heater 66 makes after its fusing, Solidify heatmeltable bonding agent by cooling, so as to adhesive material tape 1 be interconnected.
For the resin-made bonding agent of the connection of adhesive material tape 1, it is possible to use from thermosetting resin, photo-curable tree What is selected in fat, heatmeltable bonding agent group is various.
In above-mentioned embodiment, the base material 9 of the terminal part 30 of the adhesive material tape 1 by making adhesive material reel 3a Face, overlaps with the face of bonding agent 11 of the initial portion 32 of the adhesive material tape 1 of new adhesive material reel 3, is coated with as resin The thermosetting resin of bonding agent processed is attached, but it is also possible to overturn the terminal part of the adhesive material tape 1 of adhesive material reel 3a Divide 30, make the face of bonding agent 11 overlap each other and incite somebody to action after the two bonding, then be fixed by thermosetting resin.
Next, the invention to the 22nd scheme～the 24th scheme is illustrated.
These invention be related to will it is bonding between electronic devices and components and circuit board or circuit board and fixation while, make the two Electrode between electrically connect adhesive material tape, be particularly rolled into the adhesive material tape spool and adhering device of reel.
Next, illustrating to the background technology of the invention of the 22nd scheme～the 24th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, volume on spool there is into the bonding material of adhesive material tape Material strip spool is arranged on adhering device, pulls out the initial portion of adhesive material tape, is installed on winding off spindle.Afterwards, from bonding The substrate side of the adhesive material tape that material spool of tape is unreeled, is crimped onto bonding agent on circuit board etc. using thermal head, and will The base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of the adhesive material tape spool of a side is finished, removing the spool that is finished and volume has base The winding off spindle of material, new winding off spindle is installed on adhering device with new adhesive material tape spool, and by adhesive material tape Top is installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material tape spool increases, due to changing adhesive material tape spool Trouble, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 22nd scheme～the 24th scheme is to provide one kind can simply carry out adhesivess The replacing of spool of tape, realizes the adhesive material tape spool and adhering device of the production efficiency raising of e-machine.
Next, illustrating to the embodiment of the invention of the 22nd scheme～the 24th scheme referring to the drawings.First, reference Figure 22 A～Figure 22 C, Figure 23, Fig. 4 and Fig. 5, illustrates to the 1st embodiment of the invention of the 22nd scheme～the 24th scheme.Figure 22A～Figure 22 C are the figure of the adhesive material tape spool for representing the 1st embodiment, and Figure 22 A are to represent standing for adhesive material tape spool Body figure, Figure 22 B are the front view of Figure 22 A, and Figure 22 C are the top view of the connect band of Figure 22 A, and Figure 23 is to represent gluing for adhering device Connect the schematic diagram of the crimping process of agent.
As shown in fig. 22, the adhesive material tape spool A of present embodiment, the winding part with multiple adhesive material tapes (hereinafter referred to as winder) 2,2a, in winder 2,2a, is wound with respectively adhesive material tape 1 on spool 3,3a.Each spool 3, 3a is provided with core 5 and is configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 23, adhesive material tape 1 is by base Material 9 is constituted with the bonding agent 11 being coated on the one side of base material 9.
In multiple winders 2,2a, the adhesive material tape that wound in the winder 2 of a side (the hereinafter referred to as bonding of a side Material strips) 1 terminal part 30, (hereinafter referred to as the opposing party's is viscous with the adhesive material tape that wound in the winder of the opposing party Connect material strips) between 1 initial portion 32, it is provided with connect band connecting the two 67.Connect band 67, from the adhesive material tape of a side 1 terminal part 30 is configured along the medial surface of the side plate 7 of spool 3, and be stuck in notch part 68 that the top of side plate 7 formed and It is connected with the initial portion 32 of the adhesive material tape 1 of the opposing party.
In addition, in the part that is connected with connect band 67 of the adhesive material tape 1 of a side and the opposing party, being provided with the company of being capable of identify that The labelling 69,70 of tape splicing 67, when labelling 69,70 are detected with belt detection means (illuminating part 71, light accepting part 72), the company of skipping The part of tape splicing 67, is not crimped in the part of connect band 67.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting material, thus it is preferred that.
Next, illustrating to the using method of the adhesive material tape spool A of present embodiment.As shown in figure 23, glue Adhesive material tape spool A and winding off spindle 17 are installed on connection device 15, the initial portion 32 of the adhesive material tape 1 of a side is hung over On pilot pin 22 and on winding off spindle 17, adhesive material tape 1 (the arrow E in Figure 23) is extracted out.Afterwards, by adhesive material tape 1 It is configured on circuit board 21, by the thermal head 19 being arranged between two spools 3,17, from the side pressure of base material 9 adhesive material tape is connect 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact, as shown in figure 4, by wired circuit (or electronic devices and components) 23 It is configured on the bonding agent 11 being crimped on circuit board 21, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, utilizes Thermal head 19 is hot-pressed onto wired circuit 23 on circuit board 21.So, by the electrode 21a of circuit board 21 and the electricity of wired circuit 23 Pole 23a is coupled together.
Using the PDP of the adhesive material tape 1 of present embodiment, its size is larger, the whole surrounding of PDP is carried out sometimes Crimping, coupling part is more, for bonding agent 11, the usage amount of first use bonding agent 11 with it is very many than before.Therefore, The usage amount of adhesive material tape 1 of the volume on spool 3 also becomes many, and adhesive material tape 1 of the volume on spool 3 is within a short period of time It is rolled on winding off spindle 17.
The adhesive material tape 1 of one side is unreeled after finishing, and connect band 67 is taken out from notch part 68, followed by another The extraction of the adhesive material tape 1 of side.In present embodiment, due to the adhesive material tape 1 in a side terminal part 30 with it is another There is connection both connect band 67 between the initial portion 32 of the adhesive material tape 1 of side, once thus a side adhesivess Band 1 is unreeled and finished, and can then start the adhesive material tape 1 for extracting the opposing party out.Therefore, when the adhesive material tape 1 of a side is unreeled After finishing, it is not necessary to the operation being installed to new adhesive material tape 1 on winding off spindle 17, the production effect of e-machine is improve Rate.
In addition, adhering device 15 has as shown in figure 23 a pair of illuminating parts 71 and light accepting part 72, light is carried out to connect band 67 Learn detection.It is provided with the two ends of the connect band 67 of both adhesive material tapes 1 of the opposing party in the adhesive material tape 1 for connecting a side The labelling 69,70 of black.Illuminating part 71 is continuous to launch laser to adhesive material tape 1, its reflected light is received by light accepting part 72, by this Detection signal is sent to control device 79.So, light accepting part 72 receives the reflected light of the labelling 69,70 at the two ends of connect band 67, The detection signal is sent to into control device 79.
The control device 79 of detection signal is have received, to the motor output of two spools 3,17 for driving adhering device 15 Control signal, begins through motor driver to motor output driving pulse.Afterwards, motor is corresponded to and applied from motor driver Plus umber of pulse rotation, two spools 3,17 are made to move beyond the speed of usual speed, while making adhesive material tape 1 to unreeling Distance of the direction movement corresponding to the length of connect band 67.
So, because the adhesive material tape 1 of the opposing party is retracted to the position of thermal head 19 automatically, therefore, until another The initial portion 32 of the adhesive material tape 1 of side is reached before the position of thermal head 19, can save the trouble for extracting connect band 67 out.
Further, since base material 9 is only wound on winding off spindle 17, therefore, it is possible to wind the amount of multiple adhesive material reels, so as to The replacing number of times of winding off spindle 17 can be reduced, working performance is high.
Next, illustrating to the manufacture method of the adhesive material tape spool A of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed with conducting particles using the coating resin of coater 27 Bonding agent, after being dried in drying oven 29, with up- coiler 31 wind master.The adhesive material tape for being wound Master cuts into given width by longitudinal cutter 33, after being wound up in core, side plate 7,7 is installed to into core from both sides On, or it is together wired up, preferably in low temperature (- 5 DEG C～-10 in the core with side plate with desiccant DEG C) under carry out keeping and outbound.
Next, the other embodiment of the invention of the 22nd scheme～the 24th scheme is illustrated, described below Embodiment in by pair putting on identical symbol with above-mentioned embodiment identical part, omit the part specifically It is bright, below mainly point different from the embodiment described above is illustrated.
In the 2nd embodiment shown in Figure 24, by the adhesive material tape 1 being made the width T of connect band 67 than before and after Width W it is little recognizing connect band 67.In addition, in adhering device 15, on the facing position for clipping adhesive material tape 1 It is provided with and the 1st embodiment identical illuminating part and light accepting part.In this case, the width from connect band 67 is received by light accepting part The laser that degree narrower part is passed through, is identified to connect band 67.
In the 3rd embodiment shown in Figure 25, by forming multiple holes 53 in connect band 67 connect band 67 is recognized.This In the case of kind, the laser passed through from the hole 53 of connect band 67 is received also by light accepting part, connect band 67 is identified.
In the 4th embodiment shown in Figure 26, the connection between adhesive material tape 1 is carried out not by connect band 67, and It is after the adhesive material tape 1 of a side is unreeled and finished, the adhesive material tape 1 of the opposing party to be wound up on winding off spindle 17, carries out The replacing of adhesive material tape 1.In this case it is same, due to new adhesive material tape spool being installed to into bonding dress Put, therefore, it can the replacement operation of the new adhesive material tape spool of reduction, improve the production efficiency of e-machine.
The invention of the 22nd scheme～the 24th scheme is not limited to above-mentioned embodiment, without departing from the 22nd scheme～the 24th side Various modifications can be carried out in the range of the purport of the invention of case.
For example, in above-mentioned 1st and the 2nd embodiment, winder 2,2a is not particularly limited, is several all may be used With.
In 1st to the 3rd embodiment, optical detection is carried out to connect band 67, but it is also possible to which rolling up in the connect band 67 has Tape, is detected with Magnetic Sensor to it.
Next, the invention to the 25th scheme～the 28th scheme is illustrated.
These inventions are related to one kind and will crimp between electronic devices and components and circuit board or circuit board while be fixed up, Make the adhesive material tape electrically connected between the electrode of the two.In addition, further relating in the fixed with support substrate, lead frame of lead frame Tube core, semiconductor element mounting support substrate on bonding and fixation semiconductor element (chip) semiconductor device in made Adhesive material tape, particularly a kind of adhesive material tape spool, adhering device and adhesive material tape for being rolled into reel Method of attachment.
Next, illustrating to the background technology of the invention of the 25th scheme～the 28th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.In addition, adhesive material tape is used for the bonding of lead fixing band, LOC bands, chip junction belt, micro- BGACSP of lead frame etc. Film etc., productivity, the reliability overall for improving semiconductor device.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesivess by adhesivess are coated with base material are disclosed Tape wrapping scroll-like relation.
Electrode connecting adhesive material strips before this, its width is 1～3mm or so, belt of the volume on spool Length is 50m or so.
In the case where adhesive material tape is installed on adhering device, volume on spool there is into the bonding material of adhesive material tape Material strip spool is arranged on adhering device, pulls out the initial portion of adhesive material tape, is installed on winding off spindle.Afterwards, from bonding The substrate side of the adhesive material tape that material spool of tape is unreeled, is crimped onto bonding agent on circuit board etc. using thermal head, and will The base material of residual is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of the adhesive material tape spool of a side is finished, the spool and volume being finished is removed There is the winding off spindle of base material, new winding off spindle is installed on adhering device with new adhesive material tape spool, and by adhesivess The top of band is installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material tape spool increases, due to changing adhesive material tape spool Trouble, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 25th scheme～the 28th scheme is to provide one kind can simply carry out adhesivess The replacing of spool of tape, realizes adhesive material tape spool, adhering device and the method for attachment of the raising of the production efficiency of e-machine.
Next, illustrating to the embodiment of the invention of the 25th scheme～the 28th scheme referring to the drawings.First, reference Figure 27 A～Figure 27 C, Figure 28, Fig. 4, Figure 29 and Fig. 5 says to the 1st embodiment of the invention of the 25th scheme～the 28th scheme It is bright.Figure 27 A～27C is the figure of the adhesive material tape spool for representing the 1st embodiment, and Figure 27 A are expression adhesive material tape spool Axonometric chart, Figure 27 B for Figure 27 A front view, Figure 27 C for Figure 27 A coupling part sectional view.Figure 28 is filled to represent bonding The schematic diagram of the crimping process of the bonding agent put, Figure 29 is the axonometric chart of the use state of the bonding agent for representing PDP.
The adhesive material tape spool A of present embodiment, the winding part with multiple adhesive material tapes 1 (is hereinafter referred to as rolled up Around portion) 2,2a, have in winder 2,2a and be wound with the spool 3,3a of adhesive material tape 1.Each spool 3,3a is provided with core 5 And it is configured in the side plate 7 of the width both sides of adhesive material tape 1.As shown in figure 28, adhesive material tape 1 by base material 9 be coated on base Bonding agent 11 on the one side of material 9 is constituted.
In multiple winders 2,2a, the adhesive material tape that wound in the winder 2 of a side (the hereinafter referred to as bonding of a side Material strips) 1 terminal part 30, with adhesive material tape (hereinafter referred to as the opposing party for being wound in winder 2a of the opposing party Adhesive material tape) 1 initial portion 32 between, coupled together using fastener 76.Fastener 76 is, for example, section substantially U The locking pin of font, makes the initial portion 32 of the terminal part 30 of the adhesive material tape 1 of a side and the adhesive material tape 1 of the opposing party Overlap, insert locking pin in the lap and couple together both.
In addition, in present embodiment, coupling part 74 as seen in fig. 27 c, by fastener 76 by terminal part 30 with begin After end part 32 couples together, by the way that coupling part 74 is turned back 180 degree in the length direction of belt, so as to adhesivess Band 1 covers fastener 76.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, crylic acid resin, silicones class can be adopted.
Conducting particles 13 can be dispersed with bonding agent 11, as conducting particles 13, have Au, Ag, Pt, Ni, Cu, W, Sb, The metallics such as Sn, scolding tin and carbon, graphite etc., can be in the macromolecule such as these and/or dielectric glass, ceramics, plastics On core etc., above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for as above with insulating barrier cladding The insulating wrapped particle that conducting particles is obtained, and conducting particles and insulating particle and with etc..In the heatmeltable such as scolding tin metal and On the macromolecule core such as plastics formed conductive layer after, due to by hot pressing or pressurization have morphotropism, the electrode after connection it Between distance reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with macromolecule In the case that class is core, due to no clearly fusing point as scolding tin, therefore, it is possible in very wide connection temperature range Control soft state such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus It is preferred that.
Next, illustrating to the using method of the adhesive material tape spool of present embodiment.As shown in figure 28, bonding Adhesive material tape spool A and winding off spindle 17 are installed on device 15, the initial portion 32 of the adhesive material tape 1 of a side are hung over and is led On pin 22 and on winding off spindle 17, adhesive material tape 1 (the arrow E in Figure 28) is extracted out.Afterwards, adhesive material tape 1 is matched somebody with somebody Put on circuit board 21, by the thermal head 19 being arranged between two spools 3,17, from the side pressure of base material 9 adhesive material tape 1 connect, Bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, wired circuit 23 is hot-pressed onto circuit by Jing as the polytetrafluoroethylmaterial material 24 of padded coaming using thermal head 19 On plate 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
Knowable to the coupling part of the PDP26 of the adhesive material tape 1 of use present embodiment as shown in figure 29, bonding agent 11 PDP it is whole around crimped, the usage amount of first use bonding agent 11 and very many than before.Therefore, bonding material The usage amount of material strip 1 also becomes many, and the adhesive material tape 1 rolled up on spool 3,3a is just rolled onto within a short period of time on winding off spindle 17 .
In present embodiment, after the adhesive material tape 1 of a side is unreeled and finished, coupling part 74 is taken from notch part 75 Go out, next the adhesive material tape 1 of the opposing party is extracted out (Figure 27 B).In present embodiment, due to the adhesivess of a side It is connected with fastener 76 with the initial portion 32 of the adhesive material tape 1 of the opposing party with 1 terminal part 30, therefore, once a side Adhesive material tape 1 unreel and finish, can then start the adhesive material tape 1 for extracting the opposing party out.Therefore, when the bonding material of a side Material strip 1 is unreeled after finishing, it is not necessary to the operation being installed to new adhesive material tape 1 on winding off spindle 17, improves electronic machine The production efficiency of device.In addition, in coupling part 74, because the glued material strips 1 of fastener 76 are covered, therefore outward appearance is good, together When, the fastener 76 for being prevented from coupling part 74 contacts with adhesive material tape 1, damages adhesive material tape 1.
In addition, adhering device 15 is as shown in figure 28, with the thickness detecting sensor as connecting portion detection sensor 47, Optical detection is carried out to coupling part 74, makes coupling part 74 skip the part of thermal head 19.The adhesive material tape 1 of one side with it is another The coupling part 74 of the adhesive material tape 1 of one side, it is as seen in fig. 27 c, larger compared with the thickness of adhesive material tape 1, by inspection The difference of Thickness Measurement by Microwave, so as to recognize coupling part 74.Thickness detecting sensor 47, is carried out when normal to the thickness of adhesive material tape 1 Detection, by the detection signal control device 79 is sent to.
The control device 79 of detection signal is have received, to the motor output of two spools 3,17 for driving adhering device 15 Control signal, begins through motor driver to motor output driving pulse.Afterwards, motor is corresponded to and applied by motor driver Plus umber of pulse rotation, two spools 3,17 are made to rotate beyond the speed of usual speed, while making adhesive material tape 1 to unreeling The given distance corresponding with the length of the direction of transfer of coupling part 74 is moved in direction,.
So, because the adhesive material tape 1 of the opposing party is sent to the position of thermal head 19, therefore, it is possible to prevent a side And the coupling part 74 of the adhesive material tape 1 of the opposing party reaches the position of thermal head 19 and implements the failure of crimping action etc. In addition, until coupling part 74 passes through before thermal head 19, due to automatically the adhesive material tape 1 of a side being wound up into into winding off spindle On 17 such that it is able to save winding trouble.
In addition, using thickness detecting sensor 47, the leading section 74a and rearward end 74b of coupling part 74 is can recognize that, if only Coupling part 74 is allowed to skip such that it is able to effectively utilize adhesive material tape 1.
Further, since base material 9 is only wound on winding off spindle 17, therefore, it is possible to wind the amount of multiple adhesive material reels, so as to The replacing number of times of winding off spindle 17 can be reduced, working performance is high.
Next, illustrating to the manufacture method of the adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesive material tape for being wound Master given width is cut into by longitudinal cutter 33, after being wound up in core, side plate 7,7 is installed to into volume from both sides On core, together wire up with desiccant, keeping and outbound are preferably carried out under low temperature (- 5 DEG C～-10 DEG C).
Next, the other embodiment of the invention of the 25th scheme～the 28th scheme is illustrated, it is described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, the detailed description of the part is omitted, Mainly point different from the embodiment described above illustrated below.
In the 2nd embodiment shown in Figure 30, the adhesive material tape spool A with multiple winders 2,2a is not used, and Using the adhesive material tape spool 2c with 1 winder.In this case, when adhesive material tape 1 is wound up on winding off spindle 17, When exposing terminal label 28 on the adhesive material tape 1 of one side, in order to the adhesive material tape spool 2b of a side is bonding with new Material spool of tape 2c is changed, by the terminal part 30 of the adhesive material tape 1 of a side and the beginning of the adhesive material tape 1 of the opposing party End part 32 couples together.
In this case, it is also possible to which coupling part is detected by the thickness detecting sensor 77 as connecting portion detection means 74, coupling part 74 is skipped from the part of thermal head 19.
The invention of the 25th scheme～the 28th scheme is not limited to above-mentioned embodiment, without departing from the 25th scheme～the 28th side Various modifications can be carried out in the range of the purport of the invention of case.
For example, in above-mentioned 1st and the 2nd embodiment, the fastener 76 that adhesive material tape 1 is interconnected will be connect, and Locking pin is not limited to, can also be to be pressed from both sides the lap of the two with the clip of the elastically deformable of cross section substantially U-shaped Firmly and the method that is fixed up, or the lap of the two is clamped with the sheet metal of cross section substantially U-shaped, from weight Holding piece is pressed in the two sides of folded part, the method that the two is coupled together.
In 1st and the 2nd embodiment, the thickness of coupling part 74 is detected by using thickness detecting sensor 47, to even Socket part point 74 is identified, but is not limited to this, can also recognize coupling part 74 using transmitance detection sensor, or makes With CCD camera, the surface of coupling part is absorbed in monitor picture, by comparing the deep or light detecting connection of pixel Part.
In Figure 31 A, Figure 31 B, Figure 32 A～Figure 32 C, illustrate the fixed with support substrate, semiconductor element of lead frame Installation is supported in the adhesive material tape that the tube core and semiconductor element of substrate or lead frame are attached, by the fixation of lead frame With supporting substrate and semiconductor element bonding and be fixed to an example of the LOC on lead frame (Lead on Chip) constructions.
Using the two sides that film 78 is supported in thick 50 μm polyimide film being surface-treated etc., 25 μm of addition thickness The adhesive material tape of the composition of this Figure 31 A of the bond layers such as polyamideimides bond layer 80, obtains shown in Figure 31 B The semiconductor device of LOC constructions.Using the adhering device shown in Figure 32 A～Figure 32 C stamping mold 87 (punch (convex portion) 95, Die (recess) 96), by the adhesive material tape punching press rectangularity shown in Figure 31 A, for example, in the Fe-Ni alloy of thick 0.2mm Made by lead frame, carry at intervals of 0.2mm, the lead of a width of 0.2mm, pressurize 3 seconds under 400 DEG C and 3MPa of pressure Crimped, made the lead frame with adhesive film for semiconductor.Next, by other operations, using with quasiconductor at this In the bonding agent aspect of the lead frame of adhesive film, semiconductor element pressurization is entered for 3 seconds at 350 DEG C of temperature and the pressure of 3MPa Row crimping, afterwards, is got up lead frame with semiconductor element wire bonding with metal wire, is sealed using epoxy resin molding material etc. Package material, is packaged by transfer moudling, obtains semiconductor device as shown in figure 31b.In Figure 31 A, Figure 31 B, 81 are The adhesive film for semiconductor being stamped to form by adhesive material tape, 82 is semiconductor element, and 83 is lead frame, and 84 is encapsulating material, 85 is closing line, and 86 is bus.Figure 32 A, Figure 32 B, Figure 32 C be adhering device, in Figure 32 A, Figure 32 B, 87 be stamping mold, 88 It is bonding agent band punching press paste section, 90 is heater block, 91 is adhesive material tape spool (bonding material for lead frame transport unit, 89 Material strip unreels portion), 92 be adhesive material tape (adhesive film for semiconductor), 93 be adhesive material tape let off roll.In addition, in Figure 32 C, 94 is adhesive material tape (adhesive film for semiconductor), 95 is punch (convex portion), 96 is die (recess), 97 is pressuring diaphragm.Bonding Material strips 92, are continuously unreeled from adhesive material tape spool (adhesive material tape unreels portion) 91, are pasted by adhesive material tape punching press The punching press rectangularity of portion 89, it is mutually bonding with the leading part of lead frame, as the lead frame with adhesive film for semiconductor from lead Frame transport unit is transferred out to be come.The adhesive material tape being stamped to form sends out from adhesive material tape let off roll 93.
It is same as described above, semiconductor element is connected on semiconductor element mounting substrate using adhesive material tape.Separately Outward, equally the tube core of lead frame is connected with semiconductor element and is bonded together.Adhesivess carry situations below：It is only intended to Bonding and fixed situation；The bonding that will be electrically connected by contact or Jing electroconductive particles between electrode is used according to purpose Agent, and using the situation of support film；Situation about being only made up of bonding agent.
Next, the invention to the 29th scheme～the 34th scheme is illustrated.
These invention be related to will it is bonding between electronic devices and components and circuit board or circuit board and fixation while, make the two Electrode between electrically connect bonding agent band, particularly a kind of bonding agent band for being rolled into reel, the manufacture method of bonding agent band And the compression bonding method of bonding agent band.
Next, illustrating to the background technology of the invention of the 29th scheme～the 34th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using bonding agent Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the felting agent coil by bonding agent is coated with base material is disclosed Around scroll-like relation.
Bonding agent band before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left The right side, first unreels bonding agent band from spool and after bonding agent is crimped onto on circuit board, does not just use.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency for winding the spool of bonding agent band increases, due to the spool fiber crops for more renewing It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that by the number of turns for increasing bonding agent band of the volume on spool, so as to increase each The bonding dosage of spool, to reduce the scheme of the replacing frequency of spool, but, due to bonding agent band narrow bandwidths to 1～ 3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the adhesive film for being rolled into banding is acted on On pressure will become big, bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of bonding agent band, then the radial dimension of spool also can increase, it is difficult to be arranged on existing On adhering device, it is possible to which existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 29th scheme～the 34th scheme is to provide a kind of number of turns for not increasing bonding agent band just The compression bonding method of the bonding agent band, the manufacture method of bonding agent band and bonding agent band of bonding dosage can be increased.
Next, illustrating to the embodiment of the invention of the 29th scheme～the 34th scheme referring to the drawings.First, reference Figure 33 A, Figure 33 B, Fig. 3, Fig. 4, Figure 34, Fig. 5 and Figure 35 are carried out to the 1st embodiment of the invention of the 29th scheme～the 34th scheme Explanation.Figure 33 A and Figure 33 B is the figure of bonding agent band, and Figure 33 A are the axonometric chart of the spool that volume has bonding agent band, and Figure 33 B are figure The line A-A sectional view of 33A.Figure 34 is the axonometric chart of the use state of the bonding agent for representing PDP.Figure 35 is expression on base material The sectional view of the operation of coating adhesive.
The bonding agent band 1 of present embodiment on spool 3, core 5 is provided with spool 3 and bonding agent band is configured in by volume The side plate 7 of 1 width both sides.In present embodiment, bonding agent is about 50m with 1 length, and width W is about 10mm.
Bonding agent is made up of base material 9 with 1 with the bonding agent 11 being coated on the one side of base material 9, is spaced on base material 9 There is the bonding agent 11 that 5 every width are 0.5mm.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, vinyl esters resinoid, crylic acid resin, silicon tree can be adopted Lipid.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus it is preferred that.
Next, illustrating to the using method of the bonding agent band of present embodiment.It is provided with adhering device 15 viscous Winding off spindle 17 of the agent with 1 spool 3 and sky is connect, bonding agent of the volume in spool 3 is arranged on into empty winding off spindle 17 with 1 front end On, bonding agent is extracted out with 1 (the arrow E in Fig. 3).Afterwards, by the configuration of bonding agent band 1 on circuit board 21, by being arranged on two Thermal head 19 between individual spool 3,17, from the side pressure of base material 9 bonding agent band 1 is connect, and the bonding agent 11 of 1 amount is crimped onto into circuit board On.Afterwards, base material 9 is rolled onto on the winding off spindle 17 of sky together with remaining bonding agent 11.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect exactly to be configured in wired circuit (or electronic devices and components) 23 in fact and be crimped on circuit board 21 Bonding agent 11 on, if necessary buffered material, such as polytetrafluoroethylmaterial material 24, warm by wired circuit 23 using thermal head 19 It is pressed onto on circuit board 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
As shown in figure 34, using the coupling part of the bonding agent with 1 PDP26 of present embodiment, PDP it is whole around Crimped, the amount of nonrecoverable bonding agent 11 with it is very many than before.Therefore, bonding agent of the volume on spool 3 makes with 1 Consumption also becomes many, and the bonding agent rolled up on spool 3 is just rolled within a short period of time on the winding off spindle 17 of sky with 1, and spool 3 becomes Empty.
When spool 3 becomes space-time, spool 3 and winding off spindle 17 is inverted respectively, specifically rolled up by emptying spool 3 Around bonding agent is reversed (the arrow F in Fig. 3) with 1 moving direction.
So, bonding agent is sequentially converted with 1 coiling direction (E, F), bonding agent 11 is pressed to each of bonding agent 11 It is connected on circuit board 21.
Next, illustrating with 1 manufacture method to the bonding agent of present embodiment with reference to Fig. 5 and Figure 35.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The such as Figure 35 institutes of coater 27 Show, the width to the 10mm of base material 9, be configured with 5 coaters 27,5 bonding agents 11 are coated with the width of 10mm.Wound The master of bonding agent band given width is cut into by longitudinal cutter 33, after being wound up in core, by side plate 7,7 from two Side is installed in core, or it is together wired up, preferably in low temperature in the core with side plate with desiccant Keeping and outbound are carried out under (- 5 DEG C～-10 DEG C).
Next, the other embodiment of the invention of the 29th scheme～the 34th scheme is illustrated, it is described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, so as to omit the part specifically It is bright, below mainly point different from the embodiment described above is illustrated.
The 2nd embodiment shown in Figure 36 A～Figure 36 C bonding agent band 1 on, base material one side whole surface with Width W coating adhesives, are separated into bonding agent in width W directions by the slit 35 being formed on the length direction of base material many Bar.2nd embodiment bonding agent band 1 in, preferably by spool 3 be arranged on adhering device 15 on after, by bonding agent band 1 Slit 35 is formed before will being crimped onto on circuit board 21.In this case, both can be in the spool installation portion of adhering device 15 Installation cutting knife nearby (is represented) in Fig. 3 with S, slit 35 is formed on bonding agent 11 of the bonding agent for being unreeled with 1, it is also possible to During the manufacture of bonding agent band as shown in Figure 5, slit is formed in operation is completed, be wound up into afterwards on spool, can be with Slit is formed before will being wound with up- coiler 31 after the drying in coating operation.
It is identical with the 1st embodiment in the bonding agent band 1 of the 2nd embodiment used in adhering device 15, from base material 9 Side thermal head 19 pairs is crimped by slit 35 is detached per 1 bonding agent, as shown in Figure 36 A, 36B, 36C, is sequentially carried out Use.
In 2nd embodiment, due to only by the bonding agent on the base material obtained by operation the same as before Forming slit 35 can just obtain a plurality of bonding agent 11, therefore easy to manufacture.
In the 3rd embodiment shown in Figure 37 A～Figure 37 C, (the figure of bonding agent 11 is coated with the whole surface of base material 9 37A), the width W of base material 9 and bonding agent 11 is identical with above-mentioned embodiment, is 5～1000mm.And, when in use also with 1 embodiment is equally arranged on adhering device 15, by the configuration of the bonding agent extracted out from spool 3 band 1 on circuit board 21, Hot pressing (Figure 37 B) is carried out by the part () to the bonding agent on width W directions of the bonding agent with 1, the part is made Cohesiveness is reduced, and is hot pressed the bonding agent of part and is separated from base material and be crimped on circuit board 21 (Figure 37 C) so as to only allow.
In this case, cohesiveness droop line is formed preferably along the circumferential wire of thermal head 19, is being hot pressed bonding agent Partial major part softens and flows, (target is that 100 pools are following), and the sclerous reaction in bonding agent not yet starts or low Position state (it is less than 20% that target is response rate), heating-up temperature is selected according to the bonding agent class for being used.
According to the 3rd embodiment, due to bonding agent 11 only allow when in use in width W soften flowing one by one so as to Crimp on circuit boards, therefore, it is identical with above-mentioned embodiment, rotated forward by making winding off spindle of the bonding agent with 1 spool 3 and sky And reversion, can be using multiple.
Further, since slit 35 need not be formed on bonding agent 11 as above-mentioned embodiment, or it is separately positioned It is a plurality of, and the coating adhesive 11 in the whole surface of the one side of wider base material is only needed to, therefore the manufacture of adhesive material tape Easily.
The 4th embodiment shown in Figure 38 A～Figure 38 C illustrates other manufactures of the bonding agent band of the 1st embodiment Method, defines (Figure 38 A) after slit 98 on the bonding agent 11 being coated with base material 9a, pastes above bonding agent 11 Other base materials 9b, so that base material 9a, 9b clamp bonding agent 11 (Figure 38 B).Next, by the base material 9a of a side and the opposing party, 9b strip ofves separate it, and make to be arranged with strip of glue 11a, 11b of spaced on each base material 9a, 9b.4th is real In applying mode, in order that be alternately arranged with strip of glue 11a, 11b on base material 9a, 9b of a side and the opposing party, can by from Spaced one of the base material 9a or 9b sides of one side are heated to strip of glue 11a, 11b and are pressurizeed, by strip of glue 11a, 11b phase Mutually one, interval is configured on each base material 9a, 9b.
The invention of the 29th scheme～the 34th scheme is not limited to above-mentioned embodiment, without departing from the 29th scheme～the 34th side Various modifications can be carried out in the range of the purport of the invention of case.
For example, can be the insulating properties bonding that conducting particles 13 is not dispersed with bonding agent 11 in above-mentioned embodiment Agent.
In above-mentioned embodiment, the bar number of the bonding agent being formed on base material 9 be several can, as long as more than 2 .
Next, the invention to the 35th scheme～the 41st scheme is illustrated.
These inventions be related to it is a kind of will bonding between electronic devices and components and circuit board or circuit board and fixation while, make The compression bonding method of the bonding agent band, the manufacture method of bonding agent band and bonding agent band that electrically connect between the electrode of the two.
Next, illustrating to the background technology of the invention of the 35th scheme～the 41st scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using bonding agent Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the felting agent coil by bonding agent is coated with base material is disclosed Around scroll-like relation.
Bonding agent band before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.And, when bonding agent to be crimped onto the surrounding of circuit board, bonding agent band is pulled out along one side of circuit board and crimped viscous Agent is connect, the operation is carried out to the surrounding of circuit board, in the surrounding of circuit board bonding agent is crimped.
But, with the maximization of the panel of PDP etc. in recent years, the bond area (size on surrounding one side) of circuit board Increase, the usage amount of the bonding agent for once being used is continuously increased.Further, since the purposes of bonding agent also expands so that bonding The usage amount of agent increases.Therefore, in the manufacturer of e-machine, the replacing frequency for winding the spool of bonding agent band increases, by Bother in spool is changed, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that by the number of turns for increasing bonding agent band of the volume on spool, so as to increase each The bonding dosage of spool, to reduce the scheme of the replacing frequency of spool, but, due to bonding agent band narrow bandwidths to 1～ 3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding agent band for being rolled into banding is acted on On pressure will become big, bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
Therefore, the purpose of the invention of the 35th scheme～the 41st scheme is, there is provided a kind of number of turns for not increasing bonding agent band The compression bonding method of the bonding agent band, the manufacture method of bonding agent band and bonding agent band of bonding dosage can just be increased.
Next, the embodiment of the invention of the 35th scheme～the 41st scheme is illustrated referring to the drawings, first, reference Figure 39 A, Figure 39 B, Figure 40, Figure 34, Fig. 5 and Figure 41 say to the 1st embodiment of the invention of the 35th scheme～the 41st scheme It is bright.Figure 39 A and Figure 39 B is the figure of bonding agent band, and Figure 39 A are the axonometric chart of the spool that volume has bonding agent band, and Figure 39 B are from bonding The top view of the bonding agent band of Figure 39 A is seen in agent side.Figure 40 is the schematic diagram of the crimping process of the bonding agent for representing adhering device.
By volume on spool 3, spool 3 is provided with core 5 and is configured in bonding agent band 1 the bonding agent band 1 of present embodiment Both sides side plate 7.In present embodiment, bonding agent is about 50m with 1 length, and width W is big with the size on one side of circuit board Cause identical, about 1500mm.
Bonding agent is made up of base material 9 with 1 with the bonding agent 11 being coated on base material 9, at equal intervals and in belt on base material 9 Width is provided with the bonding agent 11 that every width is 0.5mm.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, acrylic compounds, vinyl esters resinoid, silicones class can be adopted.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus it is preferred that.
Next, illustrating with 1 using method to the bonding agent of present embodiment.It is provided with adhering device 15 viscous Winding off spindle 17 of the agent with 1 spool 3 and sky is connect, bonding agent of the volume in spool 3 is arranged on into empty winding off spindle 17 with 1 front end On, bonding agent is extracted out with 1 (the arrow E in Figure 40).Afterwards, by the configuration of bonding agent band 1 on circuit board 21, by being arranged on two Thermal head 19 between individual spool 3,17, from the side pressure of base material 9 bonding agent band 1 is connect, and the bonding agent 11 of 1 amount is crimped onto positioned at viscous In a line of the circuit board for connecing agent bandwidth direction, by bonding agent 11 only with the width extent wound on empty winding off spindle 17 On.
Next, making circuit board 21 rotate about 90 degree, the adjacent side for making circuit board 21 is located at bonding agent with 1 width side To bonding agent 11 is crimped onto in the another a line of circuit board 21 using thermal head 19.So, rotated greatly by making circuit board 21 About 90 degree and bonding agent 11 is crimped, bonding agent 11 is sequentially crimped onto the surrounding of circuit board 21.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of wired circuit (electronic devices and components) 23 are made Pole position coincides carries out real connecing.Connect as described below carrying out in fact：Bonding agent 11 is crimped on after the surrounding of circuit board 21, by cloth Line circuit (or electronic devices and components) 23 is configured on bonding agent 11, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, Wired circuit 23 is hot-pressed onto on circuit board 21 (with reference to Fig. 4) using thermal head 19.So, by the electrode 21a of circuit board 21 with The electrode 23a of wired circuit 23 is coupled together.
As shown in figure 34, using the coupling part of the bonding agent with 1 PDP26 of present embodiment, PDP it is whole around Crimped, the usage amount of first use bonding agent 11 with it is very many than before.But, due to bonding agent with 1 width W with Length H on one side of circuit board 21 is roughly equal, therefore, bonding agent becomes big with 1 width W, but, even if the number of turns and former phase Together, bonding dosage with also become very many than before, therefore, the replacing of spool with become considerably less than before.
Next, illustrating with 1 manufacture method to the bonding agent of present embodiment with reference to Fig. 5 and Figure 41.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.Coater 27 or so is moved It is dynamic, being coated with the bonding agent of strip at equal intervals on base material 9.The master of the adhesive material tape for being wound is cut by longitudinal cutter 33 Given width is cut into, after being wound up in core, side plate 7,7 is installed in core from both sides, or by it wound on band Have in the core of side plate, together wire up with desiccant, preferably taken care of and gone out under low temperature (- 5 DEG C～-10 DEG C) Storehouse.
Next, the other embodiment of the invention of the 35th scheme～the 41st scheme is illustrated, it is described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, the detailed description of the part is omitted, Mainly point different from the embodiment described above illustrated below.
In the adhering device 15 of the 2nd embodiment shown in Figure 41, bonding agent band 1 is installed at two positions, a side's The bonding agent band 1 of adhesive material tape 1 and the opposing party is arranged in mutually perpendicular direction.And, on the bonding agent band 1 of a side Bonding agent 11 is crimped onto on a pair facing longitudinal edge N of circuit board 21 (the 1st operation), on the bonding agent band 1 of the opposing party Bonding agent 11 is crimped onto on a pair facing horizontal edge M of circuit board 21 (the 2nd operation), by the two operations in circuit board 21 surrounding crimping bonding agent.In 2nd embodiment, the court of rotation circuit plate 21 is not needed between the 1st operation and the 2nd operation To by the way that the former state of circuit board 21 placed in the 1st operation is moved in the 2nd operation, it becomes possible to carry out bonding agent automatically Crimping, can further improve working performance.In this case, circuit board 21 can be mounted on conveyer belt and be passed automatically Send.
It is viscous with width W coatings in the whole surface of the one side of base material in the 3rd embodiment shown in Figure 42 A～Figure 42 C Agent is connect, is separated into bonding agent on width W directions by the slit 35 being formed on the width W directions of base material a plurality of.3rd In the bonding agent band 1 of embodiment, preferably after spool 3 is arranged on adhering device 15, shortly just bonding agent band 1 is crimped Slit 35 is formed before on circuit board 21.In this case, both can near the spool installation portion of adhering device 15 (Figure 40 In represented with S) install cutting knife, on bonding agent 11 of the bonding agent for being unreeled with 1 formation slit 35, it is also possible in such as Fig. 5 institutes During the manufacture of the bonding agent band for showing, slit is formed in operation is completed, be wound up into afterwards on axle, can be with coating operation Slit is formed before will being wound with up- coiler 31 after middle drying.In addition, cutting knife can be made in the case of each in bonding agent Move back and forth on width W directions with 1.
In addition, in the bonding agent band 1 of the 3rd embodiment used in adhering device 15, it is identical with the 1st embodiment, from The side of base material 9 thermal head is sequentially used being crimped by detached 1 rule bonding agent of slit 35 from front.
In 3rd embodiment, only by being formed on the bonding agent on the base material obtained by operation the same as before Slit 35, it becomes possible to obtain arranging a plurality of bonding agent 11 in the direction of the width, thus it is easy to manufacture.
In the 4th embodiment shown in Figure 43 A～Figure 43 C, in the whole surface of the one side of base material 9 bonding agent is coated with 11 (Figure 43 A), the width W of base material 9 and bonding agent 11 identically with above-mentioned embodiment with the length dimension on one side of circuit board It is roughly the same.And, also install in a same manner as in the first embodiment when in use, by width W direction of the bonding agent with 1 Hot pressing (Figure 43 B) is carried out to a part () for bonding agent, making the cohesiveness of the part reduces, and so as to only allow part is hot pressed Bonding agent separate from base material and be crimped onto on circuit board 21 (Figure 43 C).
In this case, cohesiveness droop line is formed preferably along the circumferential wire of thermal head 19, is being hot pressed bonding agent Partial major part softens and flows, (target is that 100 pools are following), and the sclerous reaction in bonding agent not yet starts or low level State (it is less than 20% that target is response rate), heating-up temperature is selected according to the bonding agent class for being used.
According to the 4th embodiment, bonding agent 11 only can allow when in use an amount to soften flowing on width W directions So as to crimp on circuit boards.
Further, since slit 35 need not be formed on bonding agent 11 as above-mentioned embodiment, or it is separately positioned It is a plurality of, and the coating adhesive 11 in the whole surface of the one side of wider base material is only needed to, therefore the manufacture of bonding agent band is held Easily.
What the 5th embodiment shown in Figure 44 A～Figure 44 C was represented is the bonding agent of the 1st embodiment with 1 other manufactures Method, defines (Figure 44 A) after slit 98 on the bonding agent 11 being coated with base material 9a, and on bonding agent 11 it is pasted He is base material 9b, so as to clamp bonding agent 11 (Figure 44 B) with base material 9a, 9b.Next, by a side and base material 9a, 9b of the opposing party Strip off separates it, spaced a ground placement of adhesives bar 11a, 11b on each base material 9a, 9b.5th embodiment In, in order that strip of glue 11a, 11b is alternately arranged on base material 9a, 9b of a side and the opposing party, can be by the base from a side The spaced ground in material 9a or 9b sides to the hot pressing of strip of glue 11a, 11b, so as to strip of glue 11a, 11b be sequentially pasted onto On each base material 9a, 9b.
The invention of the 35th scheme～the 41st scheme is not limited to above-mentioned embodiment, without departing from the 35th scheme～the 41st side Various modifications can be carried out in the range of the purport of the invention of case.
For example, can be the insulating properties bonding that conducting particles 13 is not dispersed with bonding agent 11 in above-mentioned embodiment Agent.
Next, the invention to the 42nd scheme～the 46th scheme is illustrated.
These invention be related to it is a kind of for will it is bonding between electronic devices and components and circuit board or circuit board and fixation it is same When, make the adhesive agent-tape cassette and the bonding agent compression bonding method using adhesive agent-tape cassette of electrical connection between the electrode of the two.
Next, illustrating to the background technology of the invention of the 42nd scheme～the 46th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using bonding agent Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the felting agent coil by bonding agent is coated with base material is disclosed Around scroll-like relation.
Bonding agent band before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.And, when the surrounding crimping bonding agent in circuit board, bonding agent band is pulled out along a line of circuit board and crimped viscous Agent is connect, the operation is carried out to the surrounding of circuit board, in the surrounding of circuit board bonding agent is crimped.
But, with the maximization of the panel of PDP etc. in recent years, the bond area (size on surrounding one side) of circuit board Increase, the usage amount of the bonding agent for once being used is continuously increased.Further, since the purposes of bonding agent also expands so that bonding The usage amount of agent increases.Therefore, in the manufacturer of e-machine, the replacing frequency for winding the spool of bonding agent band increases, by Bother in spool is changed, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that by the number of turns for increasing bonding agent band of the volume on spool, so as to increase each The bonding dosage of spool, to reduce the scheme of the replacing frequency of spool, but, due to bonding agent band narrow bandwidths to 1～ 3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding agent band for being rolled into banding is acted on On pressure will become big, bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
Therefore, the purpose of the invention of the 42nd scheme～the 46th scheme is, there is provided a kind of number of turns for not increasing bonding agent band, And bonding dosage can be increased, and can simply carry out the replacing of spool connect agent tape drum and the bonding using adhesive agent-tape cassette The compression bonding method of agent.
Next, illustrating to the embodiment of the invention of the 42nd scheme～the 46th scheme referring to the drawings.First, reference Figure 45 A, Figure 45 B, Figure 46, Figure 47, Fig. 4, Figure 34 and Figure 48 enter to the 1st embodiment of the invention of the 42nd scheme～the 46th scheme Row explanation.For convenience of description, and the occasion to being configured with 2 bonding agents on bonding agent band is illustrated, but bonding agent also may be used It is a plurality of to be formed with.Figure 45 A and Figure 45 B are the adhesive agent-tape cassette of the 1st embodiment of the invention of the 42nd scheme～the 46th scheme Figure, Figure 45 A for adhesive agent-tape cassette axonometric chart, Figure 45 B for Figure 45 A line A-A sectional view, Figure 46 is to represent Figure 45 A and figure The sectional view of the installment state of the spool of the tape drum shown in 45B, Figure 47 is the crimping process of the bonding agent for representing adhering device Front view, Figure 48 is the process chart of the manufacture method for representing adhesive agent-tape cassette.
The adhesive agent-tape cassette 100 of present embodiment, mainly by the spool 3 of a side and the winding off spindle 17 of the opposing party and accommodates it Box body 99 constitute, be wound with the spool 3 of a side bonding agent band 1, bonding agent is fixed on the opposing party's with 1 other end 1a On winding off spindle 17.
In box body 99, its side is formed with opening 123, and from the opening 123 bonding agent band 1 is pulled out.In addition, opening 123 Both sides are provided with guiding piece 124,124 of the guiding bonding agent with 1 movement.
Box body 99 is made by the way that half box 99a, 99b is fitted together to, and is interspersed with the spool 3,17 of a side and the opposing party Be arranged on adhering device 128 (aftermentioned) around axle 126 (with reference to Figure 46), it is mutually chimeric with each spool 3,17.
Next, with reference to Figure 46, saying to the cooperation between each spool 3,17 and each spool 3,17 and box body 99 It is bright.On each spool 3,17, its inner circumferential side is formed with the setting strip 125 being engaged around axle 126 with adhering device 128, outside it The week side of boss is formed with the embeded slot 127 rotatably mutually chimeric with the convex portion 99c of box body 99.
On bonding agent band 1, as shown in Figure 45 B, two bonding agents are coated with the one side of base material 9 side by side in the direction of the width 11a、11b.Arrange spacedly between two bonding agents 11a, the 11b.
The bonding agent of present embodiment is about 50m, width W and about 4mm with 1 length.Each bar bonding agent 11a, 11b's Width is about 1.2mm.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but be not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, thermosol species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin Class, in addition, as type thermosetting resin, epoxy resin, acrylic compounds, vinyl esters resinoid, silicones class can be adopted.
Conducting particles 13 is dispersed with bonding agent 11, as conducting particles 13, there is Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus it is preferred that.
Next, illustrating to the using method of the adhesive agent-tape cassette 100 of present embodiment.As shown in figure 47, bonding Adhesive agent-tape cassette 100 is installed in device 128.In adhering device 128, have in vain and be positioned apart from tape drum with around axle 126,126 (with reference to Figure 46), each spool 3,17 of adhesive agent-tape cassette 100 be engaged around axle 126,126.Therefore, adhesive agent-tape cassette 100 Installation can be completed by simple operationss (one touch), it is not necessary to as before will volume on spool bonding agent band 1 Other end 1a be installed to sky the first-class operation of winding off spindle.
Next, pulling out bonding agent band 1 from adhesive agent-tape cassette 100, the guiding piece 124,124 of adhering device 128 is hung over On.
Next, drive adhering device 128 around axle 126, extract 1 (the arrow E directions in Figure 47) of bonding agent band out, will glue Connect agent band 1 to be configured on circuit board 21, bonding agent band 1 is connect from the side pressure of base material 9 using thermal head 19, by width The bonding agent 11a of 1 amount of side is crimped onto on one side of circuit board 21, and remaining bar bonding agent 11b and base material 9 are wound up into separately On the winding off spindle 17 of one side.So, bonding agent 11a will be met sequentially it will be crimped on the surrounding of circuit board 21.
Afterwards, after the bonding agent band 1 wound on the spool 3 of a side has been used up, adhesive agent-tape cassette 100 is first removed Afterwards, it is loaded in turn, the above-mentioned operation of repetition.In the case of the bonding agent of more than 2 is formed on bonding agent band, change wide The position in degree direction, just can sequentially or interval is crimped.
After above-mentioned crimping (interim connection), the electrode 21a and wired circuit (electronic devices and components) 23 of circuit board 21 are made Electrode 23a positions coincide and carry out real connecing.Connect as described below carrying out in fact：Bonding agent 11a is crimped on into the four of circuit board 21 Zhou Hou, wired circuit (or electronic devices and components) 23 is configured on bonding agent 11a, if necessary buffered material, such as polytetrafluoro Vinyl material 24, is hot-pressed onto wired circuit 23 on circuit board 21 (with reference to Fig. 4) using thermal head 19.So, by circuit board 21 The electrode 21a and electrode 23a of wired circuit 23 couple together.
As shown in figure 34, the coupling part of the PDP26 of bonding, this reality are carried out using present embodiment adhesive agent-tape cassette 100 Apply in mode PDP26 it is whole around crimped, the usage amount of first use bonding agent 11 and very many than before.But Be, due to bonding agent band 1 in 2 bonding agents 11a, 11b are configured with width W, therefore, even if the number of turns with as before, by Twice before bonding dosage is also changed into, so as to the replacing number of times of tape drum will not be too many.
Further, since by bonding agent with 1 form for making tape drum 1, therefore change, operation, install and be all easier to, workability It is good.
Next, illustrating to the manufacture method of the adhesive agent-tape cassette 100 of present embodiment with reference to Figure 48.
On the base material (spacer) 9 rolled out from the machine that rolls out 25, using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for mixing, after being dried in drying oven 29, with up- coiler 31 master is wound.Coater 27 is in base material A plurality of bonding agent is coated with 9.The master of the adhesive material tape for being wound in operation is completed by longitudinal cutter 33 cut into Fixed width (for the width of 2 strip of glue), after being wound up in core, is fitted together to and will roll up by making half box 99a, 99b Axle 3 is clamped with the winding off spindle 17 of sky, is manufactured into adhesive agent-tape cassette 100.
Adhesive agent-tape cassette 100, wires up together with desiccant, is preferably protected under low temperature (- 5 DEG C～-10 DEG C) Pipe and outbound.
Next, the other embodiment of the invention of the 42nd scheme～the 46th scheme is illustrated, it is described below In embodiment, identical symbol is put on above-mentioned embodiment identical part by pair, omits the detailed description of the part, Mainly point different from the embodiment described above illustrated below.
In embodiment 2 shown in Figure 49, once bonding agent 11, adhering device are crimped to the whole a line of circuit board 21 In 128, it is provided with and is configured to from adhesive agent-tape cassette 100 pull out longer one section of bonding agent with 1 guiding piece 101.It is real according to the 2nd Mode is applied, due to once crimping bonding agent to the whole a line of circuit board 21, therefore working performance is good.
In the 3rd embodiment shown in Figure 50, with width W coating adhesives 11 in the whole surface of the one side of base material 9, Bonding agent is separated into into 2 by slit 102.In the bonding agent band 1 of the 3rd embodiment, preferably by adhesivess tape drum 100 be installed on adhering device 128 after, by bonding agent band 1 will be crimped onto on circuit board 21 before formed slit 102.This In the case of kind, installation cutting knife both (can be represented) in Figure 47 with S near the tape drum installation portion of adhering device 128, unreeled Bonding agent 11 of the bonding agent with 1 on formed slit 102, it is also possible in the manufacture of bonding agent band as shown in figure 48, complete Slit is formed in operation, is wound up into afterwards on spool 3, can with coating operation in be dried after, be by up- coiler 31 Slit 102 will be formed before being wound.
In 3rd embodiment, due to only by the bonding agent 11 on the base material 9 obtained by operation the same as before Upper formation slit 102, it becomes possible to obtain 2 bonding agents 11a, 11b, thus it is easy to manufacture.
In the 4th embodiment shown in Figure 51 A and Figure 51 B, bonding agent 11 is coated with the whole surface of the one side of base material 9 (Figure 51 A), will accommodate the bonding agent and is installed to as the 1st embodiment on adhering device 128 with 1 box 100, by viscous Connecing a part (amount) for bonding agent 11 of the agent with 1 width W directions carries out hot pressing, and making the cohesiveness of the part reduces, from And only allow the bonding agent 11a of heated pressure section to separate from base material 9 and be crimped on circuit board 21 (Figure 51 B).
In this case, preferably along cohesiveness droop line 103 (Figure 51 A) is formed around thermal head 19, bonding agent is made Soften and flow the most of of part is hot pressed, (target is that 1000 pools are following), and the sclerous reaction in bonding agent is not yet Start or low-end trim (it is less than 20% that target is response rate), heating-up temperature is selected according to the bonding agent class for being used.
According to the 4th embodiment, bonding agent 11 only can when in use make one on width W directions to measure 11a softenings Flow so as to crimp on circuit boards.
Next, the invention to the 47th scheme～the 49th scheme is illustrated.
These inventions be related to it is a kind of will bonding between electronic devices and components and circuit board or circuit board and fixation while, make The adhesive material tape electrically connected between the electrode of the two, particularly a kind of adhesive material tape for being rolled into reel.
Next, illustrating to the background technology of the invention of the 47th scheme～the 49th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesive material tape by bonding agent is coated with base material is disclosed It is wound into a roll shaft-like.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, when the adhesive material tape of the adhesive material reel of a side is finished, removing the spool that is finished and volume has base material Winding off spindle, new winding off spindle is installed on adhering device with new adhesive material reel, and by the top of adhesive material tape It is installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to changing adhesive material reel fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, to reduce the scheme of the replacing frequency of spool, but, because the narrow bandwidths of adhesive material tape are to 1 ～3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the bonding material for being rolled into banding is acted on Pressure on material strip will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool also can increase, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device no longer can be used.
Therefore, the purpose of the invention of the 47th scheme～the 49th scheme is to provide one kind can simply carry out adhesivess The replacing of spool, realizes the adhesive material tape of the raising of the production efficiency of e-machine.
Next, illustrating to the embodiment of the invention of the 47th scheme～the 49th scheme referring to the drawings.
The 1st enforcement of reference picture 52A, Figure 52 B, Fig. 3, Fig. 4, Figure 29 and Fig. 5 to the invention of the 47th scheme～the 49th scheme Mode is illustrated.Figure 52 A and Figure 52 B are the figure of the connection of the adhesive material tape for representing present embodiment, and Figure 52 A glue to represent The axonometric chart of the connection between material spool is connect, Figure 52 B are the sectional view of the coupling part for representing Figure 52 A.
Adhesive material tape 1 is rolled up respectively on spool 3,3a, and each spool 3,3a is provided with core 5 and is configured in adhesivess Side plate 7 with 1 width both sides.
Adhesive material tape 1 is made up of base material 9 with the bonding agent 11 being coated on the one side of base material 9.
Base material 9, the heat for clamping support layer 9b with support layer 9b and from both sides melts oxidant layer (hot melting layer) 9a, constitutes heat and melts agent The heat of layer 9a melts agent (heat is melted), uses polyethylene, SBS (styrene butadiene styrene block copolymerizations as thermoplastic resin Thing) and nylon etc., support layer 9b adopts OPP (extended polypropylene), politef, PET (polyethylene terephthalate) Deng reinforcing fibres such as plastics, glass fibre, aramid fibre, carbon fibers.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, crylic acid resin, silicones class can be adopted.
Conducting particles 13 can be dispersed with bonding agent 11, as conducting particles 13, have Au, Ag, Pt, Ni, Cu, W, Sb, The metallics such as Sn, scolding tin and carbon, graphite etc., can be in the macromolecule such as these and/or dielectric glass, ceramics, plastics On core etc., above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for as above with insulating barrier cladding The insulating wrapped particle that conducting particles is obtained, and conducting particles and insulating particle and with etc..In the heatmeltable such as scolding tin metal and On the macromolecule core such as plastics formed conductive layer after, due to by hot pressing or pressurization have morphotropism, the electrode after connection it Between distance reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with macromolecule In the case that class is core, due to no clearly fusing point as scolding tin, therefore, it is possible in very wide connection temperature range Control soft state such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus It is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in figure 3, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed on 15, the front end of adhesive material tape 1 of the volume on spool 3a is hung over It is arranged on after on pilot pin 22 on winding off spindle 17, extracts adhesive material tape 1 (the arrow E in Fig. 3) out.Afterwards, by adhesive material tape 1 It is configured on circuit board 21, using the thermal head 19 being arranged between two spool 3a, 17, from the side pressure of base material 9 adhesivess is connect Band 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, wired circuit 23 is hot-pressed onto circuit by Jing as the polytetrafluoroethylmaterial material 24 of padded coaming using thermal head 19 On plate 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
The coupling part of the PDP26 of the adhesive material tape 1 of the use present embodiment represented from Figure 29, bonding agent 11 PDP it is whole around on crimped, once using the usage amount of bonding agent 11 and very many than before.Therefore, The usage amount of adhesive material tape 1 of the volume on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is within a short period of time Just it is rolled onto on winding off spindle 17, exposes the terminal label 28 (reference picture 52A) of adhesive material tape 1 of the volume on spool 3a.
As shown in Figure 52 A, when exposing terminal label 28 on the adhesive material tape 1 of spool 3a, in order to by spool 3a more New adhesive material reel 3 is changed to, it is and new by the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a Adhesive material reel 3 on the initial portion 32 of adhesive material tape (the opposing party's adhesive material tape) 1 that wound be connected.
The connection of the adhesive material tape 1, as shown in Figure 52 B, the terminal of the adhesive material tape 1 for adhesive material reel 3a Part 30, the initial portion 32 with the adhesive material tape 1 of new adhesive material reel 3, the heat for making the base material 9 of terminal part 30 is melted Oxidant layer 9a is Chong Die with the face of bonding agent 11 of initial portion 32, and lap is placed on platform 104.Afterwards, using adhering device 15 thermal head 19 to lap heat, make heat melt oxidant layer 9a melt after, then by cooling make heat melt agent solidification, so as to will Terminal part 30 is coupled together with initial portion 32.So, the adhesive material tape 1 for being wound on end-of-use spool 3a is and new Spool 3 on the adhesive material tape 1 that wound just couple together.
Next, changing end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Institute With, it is not necessary to adhesive material tape 1 is installed to into the operation on winding off spindle 17.Further, since the main only winding base material of winding off spindle 17 9, therefore, it is possible to wind the amount of multiple adhesive material reels, so as to reduce the replacing number of times of winding off spindle 17, working performance is good.
Next, illustrating to the manufacture method of the adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesivess for being wound The master of band cuts into given width by longitudinal cutter 33, after being wound up in core, side plate is installed to into volume from both sides On core, together wire up with desiccant, keeping and outbound are preferably carried out under low temperature (- 5 DEG C～-10 DEG C).
Next, the other embodiment of the invention of the 47th scheme～the 49th scheme is illustrated, it is described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, the detailed description of the part is omitted, Mainly point different from the embodiment described above illustrated below.
In the 2nd embodiment shown in Figure 53, in the base material 9 of adhesive material tape 1, heat is melted oxidant layer 9a and is supported a layer 9b institutes Clamping.In this case, as shown in figure 3, in order to adhesive material tape 1 is interconnected, by the terminal of the adhesive material tape 1 of a side Part 30, it is relative to each other with the initial portion 32 of the adhesive material tape 1 of the opposing party, using the heat of adhering device 15 on the position 19 pairs of heat of pressure head are melted oxidant layer 9a and are heated.Heating intermittent fever melts agent and is melted in oxidant layer 9a by heat and oozes out, and makes heat melt agent by cooling and consolidates Change, so as to adhesive material tape 1 be interconnected.So, melt oxidant layer 9a due to heat to be supported clamped by layer 9b, therefore, it is possible to The attachment for preventing absorption, the dust of dampness etc. causes the adhesive strength that heat melts oxidant layer 9a to reduce.
The invention of the 47th scheme～the 49th scheme is not limited to above-mentioned embodiment, without departing from the 47th scheme～the 49th side Various modifications can be carried out in the range of the purport of the invention of case.
In 1st embodiment, base material 9 is by support layer 9b and melts oxidant layer 9b by heat and clamps this 3 layers of support layer 9b from both sides Constitute, but be not limited to this, or more than 4 layers.
In present embodiment, bonding portion is thermally compressed using the thermal head 19 of adhering device 15, but it is also possible to make Replace thermal head 19 with other heater, coupling part is heated, carry out the connection between adhesive material tape 1.
Next, the invention to the 50th scheme～the 51st scheme is illustrated.
These inventions be related to it is a kind of will bonding between electronic devices and components and circuit board or circuit board and fixation while, make The adhesive material tape electrically connected between the electrode of the two.In addition, further relating to by semiconductor element (chip) bonding and be fixed on In the fixed semiconductor device with support substrate, the tube core of lead frame, semiconductor element mounting support substrate of lead frame The adhesive material tape for being used, particularly a kind of method of attachment of the adhesive material tape for being rolled into reel.
Next, illustrating to the background technology of the invention of the 50th scheme～the 51st scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In addition, adhesive material tape is used for lead fixing band, LOC bands, chip junction belt, micro- BGACSP's of lead frame etc. Adhesive film etc., productivity, the reliability overall for improving semiconductor device.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesive material tape by bonding agent is coated with base material is disclosed It is wound into a roll shaft-like.
Adhesive material tape before this, in order that it is bonding insecure between bonding agent and base material, or in order to easy Peel off, and implement silicone-treated on the two sides of base material.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") initial portion that adhesive material tape is pulled out on adhering device is arranged on, it is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has the volume of base material Axle is taken, new adhesive material reel is installed on adhering device, and the top of adhesive material tape is installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to more changing-over material volume axle trouble, Therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that by the number of turns for increasing bonding agent band of the volume on spool, so as to increase each The bonding dosage of spool, to reduce the scheme of the replacing frequency of spool, but, due to bonding agent band narrow bandwidths to 1～ 3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the adhesivess for being rolled into banding are acted on The pressure for taking will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion.
In addition, if increasing the number of turns of adhesive material tape, then the radial dimension of spool can also become big, it is difficult to be arranged on existing Adhering device on, it is possible to existing adhering device cannot be reused.
Therefore, the purpose of the invention of the 50th scheme～the 51st scheme is, there is provided one kind can simply carry out bonding material The replacing of material spool, realizes the method for attachment of the adhesive material tape of the raising of the production efficiency of e-machine.
Next, illustrating to the embodiment of the invention of the 50th scheme～the 51st scheme referring to the drawings.First, reference Figure 54 A～Figure 54 C, Figure 55, Figure 56, Fig. 4, Figure 29 says to the 1st embodiment of the invention of the 50th scheme～the 51st scheme It is bright.Figure 54 A～54C is the sectional view of the connection operation of the coupling part for representing Figure 55, and Figure 54 A represent the adhesivess before electric discharge The state of band, Figure 54 B represent the state of the adhesive material tape after electric discharge, and Figure 54 C are the figure of the thermo-compression bonding for representing coupling part.Figure The axonometric chart of the connection in 55 methods of attachment for expression adhesive material tape, between adhesive material reel.Figure 56 is expression bonding The schematic diagram of the crimping process of the bonding agent of device.
Respectively by volume on spool 3,3a, each spool 3,3a is provided with core 5 and is configured in bonding material adhesive material tape 1 The side plate 7 of the width both sides of material strip 1.
Adhesive material tape 1 is made up of base material 9 with the bonding agent 11 being coated on the one side of base material 9.
Base material 9, from intensity and the fissility aspect of bonding agent 11, using OPP (extended polypropylene), polytetrafluoroethyl-ne Alkene, PET (polyethylene terephthalate) etc., are implemented to be surface-treated with parting compound 9a.Parting compound can be using olefines point The table of the low melt waxes such as type agent, montanic acid glycol ester, Brazil wax, paraffin, the fluororesin of low-molecular-weight, silicone or fluorine class Face activating agent, oil, wax, resin, polyester modification silicones etc., particularly typically adopt silicones.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, crylic acid resin, silicones class can be adopted.
Conducting particles 13 can be dispersed with bonding agent 11.As conducting particles 13, have Au, Ag, Pt, Ni, Cu, W, Sb, The metallics such as Sn, scolding tin and carbon, graphite etc., can be in the macromolecule such as these and/or dielectric glass, ceramics, plastics On core etc., above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for as above with insulating barrier cladding The insulating wrapped particle that conducting particles is obtained, and conducting particles and insulating particle and with etc..In the heatmeltable such as scolding tin metal and On the macromolecule core such as plastics formed conductive layer after, due to by hot pressing or pressurization have morphotropism, the electrode after connection it Between distance reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with macromolecule In the case that class is core, due to no clearly fusing point as scolding tin, therefore, it is possible in very wide connection temperature range Control soft state such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus It is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in figure 56, adhering device The spool 3a and winding off spindle 17 of adhesive material tape 1 are installed on 15, the front end of adhesive material tape 1 of the volume on spool 3a is hung over It is arranged on after on pilot pin 22 on winding off spindle 17, extracts adhesive material tape 1 (the arrow E in Figure 56) out.Afterwards, by adhesive material tape 1 is configured on circuit board 21, using the thermal head 19 being arranged between two spools 3,17, from the side pressure of base material 9 adhesivess is connect Band 1, bonding agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, wired circuit 23 is hot-pressed onto circuit by Jing as the polytetrafluoroethylmaterial material 24 of padded coaming using thermal head 19 On plate 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
Figure 29 represents the coupling part of the PDP26 of the adhesive material tape 1 for having used present embodiment, it follows that bonding Agent 11 PDP it is whole around on crimped, once using the usage amount of bonding agent 11 and very many than before.Cause This, the usage amount for rolling up the adhesive material tape 1 on spool 3a also becomes many, and adhesive material tape 1 of the volume on spool 3a is when shorter It is interior to be just rolled onto on winding off spindle 17, expose the terminal label 28 (with reference to Figure 55) of adhesive material tape 1 of the volume on spool 3a.
As shown in figure 55, when exposing terminal label 28 on the adhesive material tape 1 of spool 3a, in order to spool 3a is changed It is and new by the terminal part 30 of the adhesive material tape (side's adhesive material tape) 1 of spool 3a for new adhesive material reel 3 The initial portion 32 of the adhesive material tape (the opposing party's adhesive material tape) 1 wound on adhesive material reel 3 is connected.
The connection of the adhesive material tape 1, as shown in Figure 54 B, by the terminal part of the adhesive material tape 1 of end-of-use spool 3a 30 are divided to be placed at the irradiation position of Electrical Discharge Machine 105.Afterwards, parting compound 9a is removed by carrying out electric discharge on the surface of base material 9.
Afterwards, the face of base material 9 for eliminating parting compound 9a is made, it is viscous with the initial portion 32 of the adhesive material tape 1 of the opposing party Connect the face of agent 11 and overlap (Figure 54 C).The lap of the two is placed on platform, using the thermal head 19 of adhering device 15 heat is carried out Pressure makes its bonding.So, the adhesive material tape 1 for being wound on end-of-use spool 3a, it is bonding with what is wound on new spool 3 Material strips 1 are just coupled together.
Next, changing end-of-use spool 3a and new spool 3, new spool 3 is installed on adhering device 15.Institute With, it is not necessary to adhesive material tape 1 is installed to into the operation on winding off spindle 17.
In present embodiment, due to using thermal head 19, therefore need not in addition using the connection between adhesive material tape 1 Apparatus, it becomes possible to which replacing is wound with the spool 3,3a of adhesive material tape 1.Further, since 17 winding base materials 9 of winding off spindle, therefore The amount of multiple adhesive material reels can be wound such that it is able to reduce the replacing number of times of winding off spindle 17, working performance is good.
The invention of the 50th scheme～the 51st scheme is not limited to above-mentioned embodiment, without departing from the 50th scheme～the 51st side Various modifications can be carried out in the range of the purport of the invention of case.
For example, in above-mentioned embodiment, the parting compound 9a of the base material 9 of the adhesive material tape 1 of the side that winding is finished goes Remove, make the part Chong Die with the face of bonding agent 11 of new adhesive material tape 1, carrying out hot pressing using thermal head 19 makes its bonding, will The two is coupled together, but it is also possible to is removed the parting compound 9a of the base material 9 of new adhesive material tape 1, is made the part and wound The face of bonding agent 11 of the adhesive material tape 1 of a complete side overlaps and couples together.
Method as parting compound 9a is removed, can also be to be irradiated using ultraviolet or swashed in addition to plasma discharge The method of light irradiation, in the case where being irradiated using ultraviolet, using such as finsen lamp as light source, by by hydrargyrum light irradiation The ultraviolet of certain hour is carrying out.In addition, in the case where laser irradiates, the laser irradiated using laser oscillator will divide Type agent 9a decomposition is dispersed out, so as to remove parting compound 9a.
In above-mentioned, the situation about being adhesively fixed between electronic devices and components and circuit board, circuit board is illustrated, but For by semiconductor element (chip) bonding and being fixed on the fixed with supporting substrate, the tube core of lead frame, quasiconductor of lead frame Element install with support substrate on semiconductor device with adhesive material tape also can similarly carry out.
Next, the invention to the 52nd scheme～the 58th scheme is illustrated.
These inventions be related to it is a kind of by bonding between electronic devices and components and circuit board or circuit board and fixation simultaneously, make two The adhesive material tape electrically connected between the electrode of person.In addition, being related in the fixed with the pipe for supporting substrate, lead frame of lead frame Core, semiconductor element mounting are used and supported on substrate, used in the semiconductor device of bonding and fixed semiconductor element (chip) Adhesive material tape, particularly a kind of adhesive material tape spool for being rolled into reel.
Next, illustrating to the background technology of the invention of the 52nd scheme～the 58th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In addition, adhesive material tape is used for lead fixing band, LOC bands, chip junction belt of lead frame etc., for example lead is fixed Band, lead frame itself or semiconductor device overall productivity, reliability are improved for the wire lead leg of lead frame to be fixed up Property.
With small-sized, the light-weighted progress of e-machine, in semiconductor device, its outside terminal is matched somebody with somebody in area array shape Put and be referred to as micro ball grid array (BGA-ball grid array), CSP (wafer-level package) in semiconductor device (encapsulation) bottom The exploitation of compact package constantly develop, in these encapsulation, in the glass epoxy substrate with 1 layer or multi-layer circuit structure, poly- The semiconductor element mountings such as acid imide substrate, will be partly with supporting on substrate, by bonding agent semiconductor element (chip) to be provided with The terminal of conductor element side is coupled together with the terminal of the wiring plate side of substrate with wire bonding mode or flip-chip, is used Epoxiess encapsulating material or epoxiess liquid encapsulating material are encapsulated connecting portion with the upper surface part or end face portion of chip, adopt With the structure configured the metal terminals such as solder ball in area array shape in the inner side of circuit board.In addition, Quad Flat is without drawing Line envelope turns (QFN-Quad Flat Non-leaded Package) and little gabarit non-leaded package (SON-Small Outline Non-leaded Package) etc. in also use adhesive material tape.And, it is multiple using in e-machine in these encapsulation On substrate by solder reflow mode in the way of high density docks integral installation.In addition, installing lead frame by bonding agent Tube core and semiconductor element (chip), the terminal of semiconductor element side has been connected with the terminal of lead frame by wire bonding Come, and sealed the upper surface part and end face portion of connecting portion and chip by epoxiess encapsulating material or epoxiess liquid encapsulating material Load.The bonding agent of such semiconductor device also uses adhesive material tape.
In Japanese Unexamined Patent Publication 2001-284005 publications, as by the method electrically connected between electrode, disclose on base material It is coated with the adhesive material tape for being rolled into reel of bonding agent.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
Bonding in the case where adhesive material tape is installed on adhering device, by adhesive material tape on spool Material spool of tape is arranged on adhering device, pulls out the initial portion of adhesive material tape, is installed on winding off spindle.Afterwards, from viscous The substrate side of the adhesive material tape that material spool of tape is unreeled is connect, bonding agent is crimped onto on circuit board etc. using thermal head, and The base material of residual is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of the adhesive material tape spool of a side is finished, removing the spool that is finished and volume has The winding off spindle of base material, new winding off spindle and new adhesive material tape spool are installed on adhering device, and by adhesive material tape Top be installed on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area increase of circuit board, once used The usage amount of bonding agent is continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases.Cause This, in the manufacturer of e-machine, the replacing frequency of adhesive material tape spool increases, due to changing adhesive material tape spool fiber crops It is tired, therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that by the number of turns for increasing bonding agent band of the volume on spool, so as to increase each The bonding dosage of spool, to reduce the scheme of the replacing frequency of spool, but, due to bonding agent band narrow bandwidths to 1～ 3mm, if the number of turns increases to be possible to occur that volume collapses.In addition, if the number of turns increases, the adhesivess for being rolled into banding are acted on The pressure for taking will become big, and bonding agent is possible to ooze out from the both sides of belt, the reason for become adhesion, the radial ruler of spool Very little also to become big, it is difficult to be arranged on existing adhering device, existing adhering device is possible to reuse.
In addition, if adhesive material tape is directly exposed in air in adhesive material tape spool, it is possible to can be because ash Dirt, dampness cause quality decline.
Therefore, the purpose of the invention of the 52nd scheme～the 58th scheme is, there is provided one kind can simply carry out bonding material The replacing of material strip spool, the raising for being capable of achieving the production efficiency of e-machine and the adhesivess for maintaining adhesive material tape quality Spool of tape.
Next, referring to the drawings, by taking the adhesive material tape of electrode connection as an example, the 52nd scheme～the 58th scheme is sent out Bright embodiment is illustrated, but the adhesive material tape of semiconductor element connection is also identical with this.First, reference picture 57A ～Figure 57 C, Fig. 3, Fig. 4, Figure 29 and Figure 58 are illustrated to the 1st embodiment of the invention of the 52nd scheme～the 52nd scheme.Figure 57A～Figure 57 C are the figure of the adhesive material tape spool for representing the 1st embodiment, and Figure 57 A are to represent standing for adhesive material tape spool Body figure, Figure 57 B are the front view of Figure 57 A, and Figure 57 C are the front view of the cover of Figure 57 A, and Figure 58 is to represent adhesive material tape The process chart of manufacture method.
The adhesive material tape spool A of present embodiment, the winding part with multiple adhesive material tapes 1 (is hereinafter referred to as rolled up Around portion) 2,2a, winder 2,2a is provided with the spool 3,3a for being wound with adhesive material tape 1.Each spool 3,3a is provided with core 5 And it is configured in the side plate 7,7a, 7b of the width both sides of adhesive material tape 1.As shown in figure 3, adhesive material tape 1 is by base material 9 and coating Bonding agent 11 on the one side of base material 9 is constituted.In untapped winder 2a, can detachably be provided with spool 3a Cover the cover 8 around the adhesive material tape 1 on spool 3a.
In addition, on the side plate 7a of the inner side of winder 2,2a, being provided with the receiving portion (receiving space) 12 of desiccant 10.Pass through The desiccant 10 such as silica gel are accommodated in receiving portion 12, from the internal dampness removed in untapped winder 2a.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, crylic acid resin, silicones class can be adopted.
Conducting particles 13 can be dispersed with bonding agent 11.As conducting particles 13, have Au, Ag, Pt, Ni, Cu, W, Sb, The metallics such as Sn, scolding tin and carbon, graphite etc., can be in the macromolecule such as these and/or dielectric glass, ceramics, plastics On core etc., above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for as above with insulating barrier cladding The insulating wrapped particle that conducting particles is obtained, and conducting particles and insulating particle and with etc..In the heatmeltable such as scolding tin metal and On the macromolecule core such as plastics formed conductive layer after, due to by hot pressing or pressurization have morphotropism, the electrode after connection it Between distance reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with macromolecule In the case that class is core, due to no clearly fusing point as scolding tin, therefore, it is possible in very wide connection temperature range Control soft state such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus It is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in figure 3, adhering device Adhesivess tape spool A and winding off spindle 17 are installed on 15, the initial portion of the adhesive material tape 1 of a side is hung on pilot pin 22 it It is arranged on afterwards on winding off spindle 17, extracts adhesive material tape 1 (the arrow E in Fig. 3) out.Afterwards, adhesive material tape 1 is configured in circuit On plate 21, using the thermal head 19 being arranged between two spool 3a, 17, adhesive material tape 1 is connect from the side pressure of base material 9, by bonding Agent 11 is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, wired circuit 23 is hot-pressed onto circuit by Jing as the polytetrafluoroethylmaterial material 24 of padded coaming using thermal head 19 On plate 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
The coupling part of the PDP26 of the adhesive material tape 1 of the use present embodiment represented in such as Figure 29, it is known that Bonding agent 11 PDP26 it is whole around crimped, the usage amount of first use bonding agent 11 and very many than before.Cause This, the usage amount of adhesive material tape 1 also becomes many, and the adhesive material tape 1 rolled up on spool 3,3a is just rolled within a short period of time On winding off spindle 17.
When terminal label is exposed on the adhesive material tape 1 of the winder 2 of a side, the viscous of new winder 2a is replaced by Connect material strips 1.In present embodiment, cover 8 is provided with untapped winder 2a, after the cover 8 is removed, is taken out Go out adhesive material tape 1 to be installed on winding off spindle 17.
So, when the winder 2 of a side is unreeled to be finished, due to the adhesive material tape 1 of winder 2a of the opposing party being pacified Being attached to carries out the replacing of adhesive material tape 1 on winding off spindle 17, therefore, there is no need to be installed to new adhesive material tape spool viscous On connection device 15.So, the replacement operation of new adhesive material tape spool will not be too many, improves the production efficiency of e-machine.
Further, since cover 8 is provided with untapped winder 2a, therefore, adhesive material tape 1 will not directly expose In an atmosphere, adhesive material tape 1 is difficult generation causes bonding force decline etc. because of dust, dampness.Therefore, even if multiple being provided with In the case of winder 2,2a, by arranging cover 8 in untapped winder 2a, it is also possible to prevent adhesive material tape 1 Quality decline.
Further, since base material 9 is only wound on winding off spindle 17, therefore, it is possible to wind the amount of multiple adhesive material tape spools, from And the replacing number of times of winding off spindle 17 can be reduced, working performance is good.
Next, illustrating to the manufacture method of the adhesive material tape spool A of present embodiment with reference to Figure 58.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesive material tape for being wound Master given width is cut into by longitudinal cutter 33, after being wound up in core, by side plate 7,7a, 7b from both sides install To in core, cover 8 is installed, together wires up with desiccant, preferably taken care of under low temperature (- 5 DEG C～-10 DEG C) And outbound.
Next, the other embodiment of the invention of the 52nd scheme～the 58th scheme is illustrated, it is described below In embodiment, identical symbol is put on above-mentioned embodiment identical part by pair, omits the detailed description of the part, Mainly point different from the embodiment described above illustrated below.
In the 2nd embodiment shown in Figure 59, on the cover 8 installed in winder 2,2a, adhesive material tape 1 is provided with Pull-out mouth 106.In this case, due to adhesive material tape 1 can be extracted out from the pull-out mouth 106 of cover 8, therefore need not The cover 8 of winder 2,2a is removed, directly adhesive material tape 1 can be extracted out from winder 2,2a.
In the 3rd embodiment shown in Figure 60 A and Figure 60 B, winder 2,2a, 2b is individually arranged, and can be slided It is arranged on freely and is located on the axle 107 of the main body of adhering device 15.And, when the winder 2 of a side is unreeled to be finished, remove peace The cover 108 of the front end of axle 107 is mounted in, the winder 2 of a side is taken out from adhering device 15.Afterwards, by the winder of the opposing party 2a is moved at bonding location, after removing cover 8, the adhesive material tape 1 of winder 2a of the opposing party is rolled onto into winding off spindle On 17, the replacing of adhesive material tape 1 is carried out.In this case, because multiple winders 2,2a, 2b are individually arranged, because This processing ease.
In the 4th embodiment shown in Figure 61, as the 3rd embodiment, winder 2,2a, 2b is individually set Put, by making winder 2, the side plate 7,7a between 2a, 2b be fitted together to mutually, on adhering device 15.Such as Figure 61 institutes Show, the fitting portion 109 of cross section substantially U-shaped is provided with the side plate 7a of winder 2a of the opposing party, by by a side Winder 2 side plate 7 on set fitting portion 110 be fitted in fitting portion 109 from upside, the two is coupled together. In the case where the winder 2 for unreeling the side for finishing is removed from adhering device 15, only by by the winder 2 of a side to Upside mention just can release it is chimeric such that it is able to simply remove the winder 2 of a side.
The invention of the 52nd scheme～the 58th scheme is not limited to above-mentioned embodiment, without departing from the 52nd scheme～the 58th side Various modifications can be carried out in the range of the purport of the invention of case.
For example, in above-mentioned embodiment, winder 2,2a is had no particular limits, be it is several can.
In 4th embodiment, slided up and down mutually by making side plate 7,7a, and by the winder 2,2a of a side and the opposing party It is fitted together to, but it is also possible to form embeded slot on the side plate 7 of a side, mosaic process is set on the side plate 7a of the opposing party, leads to Cross in the width of belt presses mosaic process into embeded slot, so as to the two be fitted together to.
In Figure 31 A, Figure 31 B, illustrate the fixed of connecting lead wire frame and support base with support substrate, semiconductor element mounting In plate, or the adhesive material tape of the tube core of lead frame and semiconductor element, by the fixed with support substrate and quasiconductor of lead frame Element bonding is simultaneously fixed to the example that the LOC on lead frame (Lead on Chip) is constructed.
Using the two sides that film 78 is supported in polyimide film for implementing surface treatment that thickness is 50 μm etc., addition thick 25 μm the structure of this Figure 31 A of bond layer 80 such as polyamideimides bond layer adhesive material tape, obtain Figure 31 B The semiconductor device of shown LOC constructions.Using (the punch (convex portion) of stamping mold 87 of the adhering device shown in Figure 32 A～32C 95th, die (recess) 96), the adhesive material tape punching press rectangularity shown in Figure 31 A for example, is closed in the ferrum-nickel of thick 0.2mm On lead frame made by gold, carry at intervals of 0.2mm, the lead of a width of 0.2mm, pressurize 3 under 400 DEG C and 3MPa of pressure Second is crimped, and makes the lead frame with adhesive film for semiconductor.Next, by other operations, at this quasiconductor is carried In bonding agent aspect with the lead frame of adhesive film, semiconductor element pressurization is entered for 3 seconds with the pressure of 350 DEG C of temperature and 3MPa Row crimping, afterwards, is got up lead frame with semiconductor element wire bonding with metal wire, is sealed using epoxy resin molding material etc. Package material, is packaged by transfer modling forming process, obtains semiconductor device as shown in figure 31b.In Figure 31 A, 31B, 81 It is the adhesive film for semiconductor being punched down from adhesivess band, 82 is semiconductor element, and 83 is lead frame, and 84 is package material Material, 85 is closing line, and 86 is bus.Figure 32 A, 32B, 32C are adhering device, and in Figure 32 A, 32B, 87 is stamping mold, 88 are Lead frame transport unit, 89 be bonding agent band punching press paste section, 90 be heater block, 91 be adhesive material tape spool (adhesivess Band unreels portion), 92 be adhesive material tape (adhesive film for semiconductor), 93 be adhesive material tape let off roll.In addition, in Figure 32 C, 94 For adhesive material tape (adhesive film for semiconductor), 95 be punch (convex portion), 96 be die (recess), 97 be pressuring diaphragm.Bonding material Material strip 92, continuously unreels from adhesive material tape spool (adhesive material tape unreels portion) 91, in adhesive material tape punching press paste section 89 Punching press rectangularity, it is mutually bonding with the leading part of lead frame, pass from lead frame as the lead frame with adhesive film for semiconductor Portion is sent to send out.The adhesive material tape for having carried out punching press sends out from adhesive material tape let off roll 93.
It is same as described above, semiconductor element is connected to into semiconductor element mounting using adhesive material tape and supports substrate On.In addition, equally the tube core of lead frame being connected with semiconductor element and being bonded together.Adhesive material tape has situations below： Only carry out bonding and fixed situation；According to purpose using by between electrode by contact or Jing electroconductive particles electrical connection Bonding agent, and using the situation of support film；Situation about being only made up of bonding agent.
Next, the invention to the 59th scheme is illustrated.
While the invention is related to one kind and will be used for bonding between electronic devices and components and circuit board or circuit board and fixed, The adhering apparatus for making the bonding agent electrically connected between the electrode of the two be crimped onto on circuit board.
Next, illustrating to the background technology of the invention of the 59th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using bonding agent Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, disclose and bonding agent is coated with base material and the viscous of reel is rolled into Agent band is connect, describing that the spool (hereinafter referred to as " felting agent coil axle ") of the bonding agent band is arranged in automatic sticking machine is carried out Use.
Automatic sticking machine, the installation portion with felting agent coil axle and the installation portion of the spool of sky, are arranged on these spools Between hot press parts, and place substrate platform, bonding agent band is pulled out on substrate from felting agent coil axle, using heat Splenium part, to bonding agent band hot pressing, bonding agent is crimped onto on substrate from the rear side of base material.
However, former automatic sticking machine is all large-scale, when the part that bonding agent is carried out on substrate crimps, or pressure Connect bonding agent area it is less when, or when carrying out interim crimping etc., due to being main equipment, exist on the contrary operating difficultiess this Problem.
On the other hand, it is desirable to have a kind of different from such large-scale automatic sticking machine, it is small-sized and can simply enter Row operation, in the case of local or interim crimping, it is not necessary to the utensil of bonding agent can be just crimped using large-scale plant.
Therefore, the purpose of the invention of the 59th scheme is, there is provided a kind of small-sized and can be with one-handed performance, and can easily Bonding agent is crimped onto the adhering apparatus in a part for substrate on ground.
Next, illustrating to the embodiment of the invention of the 59th scheme referring to the drawings.Figure 62 A and Figure 62 B is expression The figure of the adhering apparatus of the 1st embodiment of the invention of the 59th scheme, Figure 62 A are the axonometric chart of adhering apparatus, and Figure 62 B are Figure 62 A's Line A-A sectional view, the side view of the using method of adhering apparatus of the Figure 63 shown in explanatory diagram 62A and Figure 62 B, Figure 64 is expression The process chart of the manufacture method of adhering apparatus.
The adhering apparatus 111 of present embodiment, it is mainly (empty by the spool (supply spool) 3 of a side and the winding off spindle of the opposing party Spool) 17, and accommodate their box body 99 and constitute, bonding agent band 1 is wound with the spool 3 of a side, bonding agent is with 1 one end 1a is fixed on the winding off spindle 17 of the opposing party.
Box body 99 has size that can be to be hold by one hand, is the general triangular of angular distortion in side view, makes easily The shape of gripping.Peristome 113 is formed with the corner of the box body 99 of general triangular, from the peristome 113 bonding agent is exposed Band 1.
In addition, being provided with prominent heater block 114 in peristome 113, the side-looking of heater block 114 is general triangular, To guiding along the bonding agent band 1 pulled out to lower surface 114b from upper surface 114a, in lower face side electric hot plate is provided with 115。
Being shaped as heater block 114 is bar-shaped, by coating heater block 114 by electric hot plate 115, when pull-out bonding agent band When 1, smoothly bonding agent band 1 can be pulled out by the rotation of heater block 114.In addition, the outside of electric hot plate 115 is preferably provided with Politef, silicone rubber or both, when bonding agent band 1 is crimped, to apply uniform pressure.
Box body 99 is formed by half box 99a, 99b is chimeric, and the spool 3,17 of a side and the opposing party is contained in box body.Box body Guiding piece 16 is inside additionally provided with, bonding agent is guided with 1 movement.In addition, the bottom surface of any one in half box 99a or 99b A side on be formed with the guiding piece of tabular, bonding agent is crimped onto while the guiding piece to be pressed to the edge of circuit board When on circuit board, just bonding agent can be accurately crimped along circuit board.
A gear 116 is coaxially fixed with the spool 3 of one side, is also coaxially fixed with the winding off spindle 17 of the opposing party Another gear 117, the gear 116 of a side is engaged with the gear 117 of the opposing party, and the spool 3 of a side rotates and pulls out viscous When connecing agent band 1, the winding off spindle 17 of the opposing party also only rotates the bonding agent and base material 9 is measured and wound with 1 pull-out.In addition, a side Gear 116 constitutes gear assembly 118 with the gear 117 of the opposing party.
In addition, the side of box body 99 is provided with the box portion of the 3rd box portion (supply unit) the 119, the 3rd to the power supply of heater block 114 While accommodating aneroid battery in 119, the adjustment circuit of the power supply of oriented heater block 114 is also accommodated.In addition, in the 3rd box portion 119 On and off switch 120 is provided with, ON/OFF can be carried out by the finger of the handss of gripping adhering apparatus 111 and be operated.
Bonding agent band 1 has bonding agent 11 as shown in Figure 62 B in the single spreading of base material 9.
The bonding agent of present embodiment is about 20m with 1 length, and width is about 1.2mm.
Base material 9, from intensity and the fissility aspect of the bonding agent for constituting anisotropic conductive material, (is prolonged using OPP Stretched polypropylene), politef, silicone-treated PET (polyethylene terephthalate) etc., but not limited to this.
Bonding agent 11, using thermoplastic resin, thermosetting resin or thermoplastic resin and the mixture of thermosetting resin Class, heat melt species.In the representative of the resin, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, vinyl esters resinoid, acrylic resin, silicones class can be adopted.
Conducting particles 13 is dispersed with bonding agent 11.As conducting particles 13, there are Au, Ag, Pt, Ni, Cu, W, Sb, Sn, weldering The metallics such as stannum and carbon, graphite etc., can on macromolecule core such as these and dielectric glass, ceramics, plastics etc., Above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for coat conducting particles as above with insulating barrier The insulating wrapped particle for obtaining, and conducting particles and insulating particle and with etc..It is contour in the heatmeltable such as scolding tin metal and plastics Formed on molecule core after conductive layer, due to there is the distance between morphotropism, the electrode after connection by hot pressing or pressurization Reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with high score subclass as core In the case of, without clearly fusing point, soften therefore, it is possible to the control in very wide connection temperature range due to as scolding tin State such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus it is preferred that.
Next, illustrating to the using method of the adhering apparatus 111 of present embodiment.As shown in Figure 63, one hand is held Adhering apparatus 111, turn on the power switch 120.Afterwards, bonding agent will be exposed to be pressed against on circuit board 21 with 1 peristome 113.Open In oral area 113, heater block 114 is provided with 1 side of base material 9 in bonding agent, side below heater block 114 is located at by pressing Bonding agent band 1, bonding agent 11 is hot-pressed onto on circuit board 21.
Press down on adhering apparatus 111 while forwards (the arrow E in Figure 63) propulsion, sequentially pull out bonding agent band 1, While advancing heater block 114 towards E directions, new bonding agent band 1 is located under heater block 114, and bonding agent 11 is suitable It is secondary to be crimped onto on circuit board 21.
So, when bonding agent band 1 is pulled out from the spool 3 of a side, because the spool 3 of a side is rotated, therefore with a side's The gear 116 of the co-axially fixed side of spool 3 also can rotate, and the opposing party's gear 117 being engaged with it rotates, so as to by bonding agent Base material 9 after 11 strippings is wound up on the winding off spindle 17 of the opposing party.
According to present embodiment, in the case of crimping bonding agent 11 on the optional position of circuit board 21, as long as with list Handss grip adhering apparatus 111 and make its propulsion just can simply crimp bonding agent 11.So, due to can simply crimp bonding Agent 11, such as on circuit board 21 in the case of interim crimping electronic devices and components (wired circuit) 23, or only in circuit board 21 A part on crimp it is especially effective in the case of electronic devices and components (wired circuit) 23.
After above-mentioned crimping (interim connection), the electrode of circuit board 21 and the electricity of electronic devices and components (wired circuit) 23 are made Pole position coincides carries out real connecing.In connecing in fact, after bonding agent 11 is crimped onto on circuit board 21, by electronic devices and components (wiring Circuit) 23 it is configured on bonding agent 11, buffered material, such as polytetrafluoroethylmaterial material 24 if necessary will using thermal head 19 Electronic devices and components (wired circuit) 23 are hot-pressed onto on circuit board 21 (with reference to Fig. 4).So, by the electrode 21a of circuit board 21 and electricity The electrode 23a of sub- components and parts (wired circuit) 23 is coupled together.
Further, since make that bonding agent to be contained in the structure used in box body 99 and with this state with 1, therefore operate Easily, good work.
Next, with reference to Figure 64, illustrating to the manufacture method of the adhering apparatus 111 of present embodiment.
On the base material (spacer) 9 rolled out from the machine that rolls out 25, using the coating resin of coater 27 and conducting particles 13 The bonding agent for mixing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesivess for being wound The master of band cuts into given width in operation is completed by longitudinal cutter 33, after being wound up on spool 3, by making half Box 99a, 99b are fitted together to and clamp the spool 3 of a side with the winding off spindle (empty spool) 17 of the opposing party, and accommodate on assembling 3rd box portion 119 of heater block 114 and aneroid battery etc., so as to producing adhering apparatus 111.
Adhering apparatus 111 are together wired up with desiccant, are preferably taken care of and are gone out under low temperature (- 5 DEG C～-10 DEG C) Storehouse.
Next, the invention to the 60th scheme～the 64th scheme is illustrated.
These inventions be related to it is a kind of will bonding between electronic devices and components and circuit board or circuit board and fixation while, make The adhesive material tape electrically connected between the electrode of the two, is particularly rolled into the adhesive material tape of reel.
Next, illustrating to the background technology of the invention of the 60th scheme～the 64th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.
In Japanese Unexamined Patent Publication 2001-284005 publications, the adhesive material tape by bonding agent is coated with base material is disclosed It is wound into a roll shaft-like.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left The right side, adhesive material tape once unreel from spool and by bonding agent be crimped onto circuit board etc. it is upper after, cannot reuse .
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to more changing-over material volume axle trouble, Therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, reduce spool replacing frequency scheme, but, due to the thickness of adhesive material tape it is thicker, each The number of turns on spool is difficult to increase.
Furthermore it is possible to the method for considering the thickness of reduction adhesive material tape, but due to (poly- right using silicone-treated PET PET) as base material, therefore, once the lower thickness of base material, there is and be susceptible to the stretching of base material, break The danger of drawback such as split.
Therefore, the purpose of the invention of the 60th scheme～the 64th scheme is, there is provided a kind of to increase on each spool The number of turns, realizes the adhesive material tape that the production efficiency of e-machine is improved.
Next, illustrating to the embodiment of the invention of the 60th scheme～the 64th scheme referring to the drawings.Figure 65 A, figure 65B, Fig. 3, Fig. 4, Figure 29 and Fig. 5 are used for the 1st embodiment of the invention to the 60th scheme～the 64th scheme and illustrate.Figure 65A and Figure 65 B are the figure of the adhesive material tape of the 1st embodiment, and Figure 65 A are the axonometric chart for representing adhesive material reel, Figure 65 B For the line A-A sectional view of Figure 65 A.
By volume on spool 3, spool 3 is provided with core 5 and is configured in the width two of adhesive material tape 1 adhesive material tape 1 The side plate 7 of side.
Adhesive material tape 1 is made up of base material 9 with the bonding agent 11 being coated on the one side of base material 9.
Base material 9 uses copper film (Copper Foil)., as 10 μm, base material 9 is at 25 DEG C for the thickness (being represented with S in Figure 65 B) of base material 9 Tensile strength is 500MPa, and base material 9 is 0.5 with thickness ratio (S/T) of bonding agent 11, and the thickness of bonding agent 11 is 20 μm.Base material 9 Surface roughness RmaxFor 0.25 μm.
Furthermore it is also possible to make base material 9 using aromatic polyamide film (ミ Network ト ロ Application).Make thickness, the stretching of base material 9 Intensity, base material 9 are all identical with copper film respectively with thickness ratio (S/T) of bonding agent 11.
Next, illustrating to the using method of above-mentioned adhesive material tape.As shown in figure 3, pacifying on adhering device 15 Spool 3 equipped with adhesive material tape 1 and winding off spindle 17, the front end for rolling up the adhesive material tape 1 on spool 3 is hung on pilot pin 22 simultaneously On winding off spindle 17, adhesive material tape 1 (the arrow E in Fig. 3) is extracted out.Afterwards, adhesive material tape 1 is configured in circuit board On 21, using the thermal head 19 being arranged between two spools 3,17, adhesive material tape 1 is connect from the side pressure of base material 9, by bonding agent 11 It is crimped onto on circuit board 21.Afterwards, base material 9 is rolled onto on winding off spindle 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, if necessary buffered material, for example polytetrafluoroethylmaterial material 24, be hot-pressed onto wired circuit 23 using thermal head 19 On circuit board 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
The coupling part of the PDP26 of the adhesive material tape 1 of the use present embodiment represented such as Figure 29, it is known that viscous Connect agent 11 PDP it is whole around crimped, the usage amount of first use bonding agent 11 and very many than before.Therefore, Volume usage amount of adhesive material tape 1 on spool 3 also becomes many, rolls up the adhesive material tape 1 on spool 3 and just rolls up within a short period of time To on winding off spindle 17, spool 3 is emptying.
When spool 3 is emptying, end-of-use spool 3 is replaced by into new spool, new spool is installed to into bonding dress Put on 15.Afterwards, as described above, repeating that bonding agent 11 is crimped onto on circuit board 21, base material 9 is wound up on winding off spindle 17 Action.
As a result, base material 9 using in copper film and aromatic polyamide film which kind of all with former adhesivess Band 1 is same easily to be operated, and base material 9 will not also be stretched or ruptured.And, the thickness of base material 9 is than former product (50 μm) thin, phase The number of turns for answering ground adhesive material tape increases, thus the replacing frequency of spool is reduced, and improves productivity ratio.
Next, illustrating to the manufacture method of the adhesive material tape 1 of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, mixed using the coating resin of coater 27 and conducting particles 13 The bonding agent 11 for closing, after being dried in drying oven 29, with up- coiler 31 master is wound.The adhesivess for being wound The master of band cuts into given width by longitudinal cutter 33, after being wound up in core, side plate 7,7 is installed to from both sides In core 5, together wire up with desiccant, keeping and outbound are preferably carried out under low temperature (- 5 DEG C～-10 DEG C).
Even if in addition, the thickness in base material 9 be 4 μm, 20 μm, in the case of 25 μm of copper film and aromatic polyamide film, Manufacture adhesive material tape 1, is actually tried out as mentioned above, and the failures such as stretching, the fracture of base material 9 do not occur yet.
Even if in addition, in base material 9 and copper film and the aromatic series that thickness ratio (S/T) of bonding agent 11 is 0.01,0.05,1.0 In the case of polyamide membrane, manufacture adhesive material tape 1, actually tried out as mentioned above, do not occur yet base material 9 stretching, The failures such as fracture.
Next, the invention to the 65th scheme～the 66th scheme is illustrated.
These inventions be related to it is a kind of will bonding between electronic devices and components and circuit board or circuit board and fixation while, make The adhesivess forming method of the adhesive material tape electrically connected between the electrode of the two.In addition, further relating to the fixation in lead frame Supported on substrate with supporting substrate, the tube core of lead frame, semiconductor element mounting to use, bonding simultaneously fixes semiconductor element (chip) Semiconductor device used in adhesive material tape adhesivess forming method, particularly a kind of bonding for being rolled into reel The adhesivess forming method of material spool of tape.
Next, illustrating to the background technology of the invention of the 65th scheme～the 66th scheme.
As by liquid crystal display screen, PDP (plasma panel), EL (fluorescence display) screen, bare chip install etc. electronics unit device It is bonding and fixed between part and circuit board, circuit board, the method for making to be electrically connected between the electrode of the two, typically using adhesivess Band.In addition, adhesive material tape is used for the bonding of lead fixing band, LOC bands, chip junction belt, micro- BGACSP of lead frame etc. Film etc., productivity, the reliability all for improving semiconductor device.
In Japanese Unexamined Patent Publication 2001-284005 publications, to disclose and be rolled into reel by be coated with adhesivess on base material Adhesive material tape.
Adhesive material tape before this, its width is 1～3mm or so, and the length for rolling up the belt on spool is that 50m is left It is right.
In the case where adhesive material tape is installed on adhering device, by the spool of adhesive material tape (hereinafter referred to as " adhesive material reel ") it is arranged on adhering device, the initial portion of pull-out adhesive material tape is installed on winding off spindle.Afterwards, The substrate side of the adhesive material tape unreeled from adhesive material reel, is crimped onto bonding agent on circuit board etc. using thermal head, And the base material of residual is rolled onto on winding off spindle.
Afterwards, after the adhesive material tape of adhesive material reel is finished, removing the spool that is finished and volume has the volume of base material Axle is taken, new winding off spindle is installed on adhering device with new adhesive material reel, and the top of adhesive material tape is installed To on winding off spindle.
But, with the maximization of the panel of PDP etc. in recent years, the bond area of circuit board also increases, is once used The usage amount of bonding agent be continuously increased.Further, since the purposes of bonding agent also expands so that the usage amount of bonding agent increases. Therefore, in the manufacturer of e-machine, the replacing frequency of adhesive material reel increases, due to more changing-over material volume axle trouble, Therefore there are problems that the production efficiency that cannot realize e-machine improves this.
For this problem, it may be considered that every so as to increase by the number of turns for increasing adhesive material tape of the volume on spool The bonding dosage of individual spool, reduces the scheme of the replacing frequency of spool, but, if the number of turns of adhesive material tape increases, roll up The radial dimension (hereinafter referred to as " coil diameter ") of the adhesive material tape on spool also increases, it is difficult to be arranged on existing adhering device On, there is a problem of that existing adhering device is possible to reuse.
Therefore, the purpose of the invention of the 65th scheme～the 66th scheme is, there is provided one kind can not increase adhesive material tape Coil diameter, realize e-machine production efficiency improve adhesive material tape forming method.
Next, illustrating to the embodiment of the invention of the 65th scheme～the 66th scheme referring to the drawings.First, reference Figure 66 A and Figure 66 B, Figure 67, Figure 68, Fig. 4, Figure 29 and Fig. 5 enters to the 1st embodiment of the invention of the 65th scheme～the 66th scheme Row explanation.Figure 66 A and Figure 66 B are the schematic diagram of the bonding agent formation process of the adhesive material tape for representing the 1st embodiment, are schemed 66A is integrated to represent to overlap each adhesive material tape, and the operation that the base material of a side is wound up on winding spool is shown It is intended to, Figure 66 B are the sectional view of the part overlapped each other between the bonding agent for representing Figure 66 A.Figure 67 is to represent adhering device Bonding agent be formed in the schematic diagram of the operation in bonded object.Figure 68 is the axonometric chart of the spool that volume has adhesive material tape.Fig. 4 For the sectional view of the bonding between indication circuit plate.Figure 29 is the axonometric chart of the use state of the bonding agent for representing PDP.Fig. 5 is Represent the process chart of the manufacture method of adhesive material tape.
Adhesive material tape 1 on spool 3,121, is provided with core 5 and is configured in bonding in each spool 3,121 respectively The side plate 7 of the width both sides of material strips 1.Adhesive material tape 1 is by base material 9 and the bonding agent 11 being coated on the one side of base material 9 Constitute.
Base material 9, from intensity and the fissility aspect of bonding agent 11, using OPP (extended polypropylene), polytetrafluoroethyl-ne PET (polyethylene terephthalate) of alkene, silicone-treated etc., but not limited to this.
Bonding agent 11, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species.For the representative of these resins, as type thermoplastic resin, there are polystyrene resins class, alkyd resin class, in addition, As type thermosetting resin, epoxy resin, crylic acid resin, silicones class can be adopted.
Conducting particles 13 can be dispersed with bonding agent 11.As conducting particles 13, have Au, Ag, Pt, Ni, Cu, W, Sb, The metallics such as Sn, scolding tin and carbon, graphite etc., can be in the macromolecule such as these and/or dielectric glass, ceramics, plastics On core etc., above-mentioned conductive layer is formed with modes such as claddings.Furthermore it is also possible to be suitable for as above with insulating barrier cladding The insulating wrapped particle that conducting particles is obtained, and conducting particles and insulating particle and with etc..In the heatmeltable such as scolding tin metal and On the macromolecule core such as plastics formed conductive layer after, due to by hot pressing or pressurization have morphotropism, the electrode after connection it Between distance reduce, increase with the contact area of circuit during connection, improve reliability, therefore preferably.Particularly with macromolecule In the case that class is core, due to no clearly fusing point as scolding tin, therefore, it is possible in very wide connection temperature range Control soft state such that it is able to obtain easily corresponding with the fluctuation of the thickness of electrode and flatness connecting elements, thus It is preferred that.
Next, illustrating to the using method of the adhesive material tape of present embodiment.As shown in Figure 66 A, bonding dress The spool 3,121 that 2 adhesive material tapes 1 are provided with 15, and winding winding off spindle 17,18 are put, will be rolled up on the spool 3 of a side Around the front end of adhesive material tape 1 hang on pilot pin 22 and be arranged on the winding off spindle 17 of a side, extract (the figure of adhesive material tape 1 out Arrow E in 66A).In addition, the front end of the adhesive material tape 1 wound on the spool 121 of the opposing party is also mounted at into the opposing party Winding off spindle 18 on, extract out adhesive material tape 1.
The adhesive material tape 1 extracted out from spool 3,121, using being configured between spool 3,121 and thermal head 19 Crimping roller 122, each adhesive material tape 1 is overlapped integral.Afterwards, the base material 9 of the adhesive material tape 1 of the opposing party is wound up into On winding off spindle 18.
Afterwards, the adhesive material tape 1 of a side is configured on circuit board 21, connects viscous from the side pressure of base material 9 using thermal head 19 Material strips 1 are connect, bonding agent 11 is crimped on the circuit board 21 as bonded object formation.Afterwards, base material 9 is rolled onto into winding off spindle On 17.
Next, being crimped on gluing on circuit board 21 as shown in figure 4, wired circuit (or electronic devices and components) 23 is configured in Connect in agent 11, wired circuit 23 is hot-pressed onto circuit by Jing as the polytetrafluoroethylmaterial material 24 of padded coaming using thermal head 19 On plate 21.So, the electrode 21a of circuit board 21 is coupled together with the electrode 23a of wired circuit 23.
Figure 29 illustrates the coupling part of the PDP26 using the adhesive material tape 1 of present embodiment, it follows that bonding Agent 11 PDP26 it is whole around crimped, the usage amount of first use bonding agent 11 and very many than before.Therefore, The usage amount of adhesive material tape 1 of the volume on spool 3,121 also becomes many, rolls up the adhesive material tape 1 on spool 3,121 shorter Just it is rolled on winding off spindle 17,18 in time.
In present embodiment, bonding agent 11 will be crimped onto in the operation before circuit board 21, due to by a side's The bonding agent 11 of adhesive material tape 1 is overlap with the bonding agent 11 of the adhesive material tape 1 of the opposing party, forms required bonding agent 11 Thickness after, bonding agent 11 is crimped onto on circuit board 21, therefore, it is possible to make each adhesive material tape 1 thickness be half. Thus it is possible to increase the number of turns of the adhesive material tape 1 on each spool, can be dramatically increased by a replacement operation can The bonding dosage for using.Therefore, the replacement operation of new adhesive material tape 1 will not be too many, improves the production efficiency of e-machine.
Next, illustrating to the manufacture method of the adhesive material tape of present embodiment with reference to Fig. 5.
On the base material (spacer) rolled out from the machine that rolls out 25, using coater 27 common only about half of thickness is coated with , the bonding agent 11 that resin and conducting particles 13 are mixed, after being dried in drying oven 29, wound with up- coiler 31 Master.The master of the adhesive material tape 1 for being wound cuts into given width by longitudinal cutter 33, is wound up in core 5, it Side plate 7,7 is installed to 5 in core from both sides afterwards, is together wired up with desiccant, preferably at low temperature (- 5 DEG C～-10 DEG C) Under carry out keeping and outbound.In addition, firming agent described later can be contained in the bonding agent 11 of adhesive material tape 1.
Next, the other embodiment of the invention of the 65th scheme～the 66th scheme is illustrated, it is described below Identical symbol is put on above-mentioned embodiment identical part by pair in embodiment, the detailed description of the part is omitted, Mainly point different from the embodiment described above illustrated below.
In the 2nd embodiment described in Figure 69 A, can carry out in bonding agent 11a containing firming agent and conducting particles 13 The manufacture of both adhesive material tape 1b of firming agent and conducting particles 13 is not contained in adhesive material tape 1a, with bonding agent 11a, As shown in Figure 69 A, the adhesive material tape 1a containing firming agent etc. is set to overlap into the adhesive material tape 1b for not containing firming agent etc. Integrally, the adhesive material tape after coincidence is crimped onto on circuit board 21.In this case, due to the adhesivess for there was only a side Containing in bonding agent 11a with 1a need not solidify in firming agent, therefore the bonding agent 11a of the adhesive material tape 1b of the opposing party Agent.Therefore, the adhesive material tape 1b for not containing the bonding agent 11b of firming agent does not need low temperature keeping.So as to reduce needs The number of the adhesive material tape 1a of low temperature keeping is carried out, transport, the management of keeping of adhesive material tape is effectively carried out.
In addition, in the case where bonding agent is epoxy resin, as the firming agent of epoxy resin, imidazoles can be included Class, aminimide, salt, polyamine class, polymercaptan etc..
In addition, as shown in Figure 69 B, containing conduction in the bonding agent 11a of the adhesive material tape 1a of the side containing firming agent Particle 13, makes 2 layers of construction, and due to being crimped side conducting particles is not contained, thus conducting particles 13 will not be with the stream of resin Flow out between the circuit of dynamic slave phase face-off, in hot pressing can reliably by conducting particles 13 be maintained at electrode 21a and electrode 23a it Between.
The invention of the 65th scheme～the 66th scheme is not limited to above-mentioned embodiment, without departing from the 65th scheme～the 66th side Various modifications can be carried out in the range of the purport of the invention of case.
Containing conducting particles 13 but it is also possible to be not containing the viscous of conducting particles 13 in the bonding agent 11 of the 1st embodiment Connect agent 11.
In above-mentioned, the situation about being adhesively fixed between electronic devices and components and circuit board and circuit board is illustrated, but It is in the fixed with support substrate, the tube core of lead frame, semiconductor element mounting support substrate of lead frame, bonding is simultaneously The semiconductor device of fixed semiconductor element (chip) also can be carried out similarly.
Next, the invention to the 67th scheme～the 72nd scheme is illustrated.
These inventions are related to a kind of for providing the electronics unit of such as liquid crystal display screen, PDP screens, EL screens, bare chip installation etc. While bonding and fixed between device and circuit board, circuit board, the anisotropic conductive electrically connected between the electrode of the two is made The anisotropic conductive material band of material, the particularly winding method of anisotropic conductive material.
Next, illustrating to the background technology of the invention of the 67th scheme～the 72nd scheme.
The method of attachment being taken as between the electronic devices and components of anisotropic conductive material band and circuit board, circuit board, The anisotropic conductive material of the bonding agent as film like is typically clamped between relative electrode, electronics is carried out by hot pressing Connection between components and parts and circuit board, circuit board.In the bonding agent of film like, be mixed with for obtain between electrode turn on lead Charged particle, as resin, can adopt the mixing of thermoplastic resin, thermosetting resin or thermoplastic resin and thermosetting resin Species, light-cured resin (see, for example Japanese Unexamined Patent Application 55-104007 publication).
In addition, known also use does not contain conducting particles, the electricity of the anisotropic conductive material being only made up of resin Road method of attachment (see, for example Japanese Unexamined Patent Application 60-262430 publication).
It is known to have in representative resin, as type thermoplastic resin, there are polystyrene resins class, polyester tree Lipid, in addition, as type thermosetting resin, there is epoxy resin, silicones class, crylic acid resin.In order to connect, thermoplasticity Resinae and type thermosetting resin must all carry out hot pressing.It is in order that resin flowing is obtained and quilt for type thermoplastic resin The closing force of sticky object, and be to further carry out hardening of resin reaction for type thermosetting resin.In recent years, from even The reliability for connecing is set out, and thermoplastic resin has become main flow with the mixing species and type thermosetting resin of thermosetting resin.In addition, The light-cured resin class that can be attached at low temperature also begins to use in the industry.
In addition, in recent years, in order to prevent being connected the warpage of thing and stretching, it is desirable to which anisotropic conductive material is in connection Connection temperature low temperature.In addition, expansion and liquid crystal display screen, PDP screens along with the connection purposes of anisotropic conductive material, The expansion of the needs such as EL screens, bare chip installation, the requirement to the shortening for producing interval time during connection is more and more stronger.
In addition, the connection needs and the expansion of purposes along with anisotropic conductive material, not only require that the short time connects, Also require to improve productivity ratio.With the expansion of the needs such as liquid crystal display screen, PDP screens, EL screens, bare chip installation, anisotropic conductive material The usage amount of material is also being continuously increased.In addition, the needs of the big picture flat screen such as big picture and PDP screens with liquid crystal display screen Expand, usage amount of the anisotropic conductive material used in 1 screen also increases.In the past, anisotropic conductive material with The reel of the bonding agent for overlapping coiled film shape on the core that section is circular is supplied, and the replacing construction of spool is hindered Productive raising.
On the other hand, along with the narrow side of liquid crystal display screen, the narrowing of anisotropic conductive material is constantly in progress, wound on Volume can occur with the reel in circular core as before to collapse, the qualification rate in manufacturing process is reduced.
The invention of the 67th scheme～the 72nd scheme, in view of the presence of disadvantages mentioned above, its object is to provide one kind can extend The replacing construction interval of spool, will not cause workability to reduce because volume occurring and collapsing, and be favorably improved the anisotropy of productivity ratio Conductive material bands.
Below, the embodiment of the invention of the 67th scheme～the 72nd scheme is illustrated.
Figure 70 is the schematic diagram of the 1st embodiment of the invention for representing the 67th scheme～the 72nd scheme.
As shown in Figure 70, the anisotropic conductive material band of present embodiment is by by the bonding agent 11 of film like and two sides 2 layers of the base material film (base material) 9 for having carried out lift-off processing construct the length direction of the anisotropic conductive material in core 5 of composition Upper repeatedly winding lamination is formed into spool-like, and what Figure 70 was represented is the supply form of anisotropic conductive material.In Figure 70, core 5 both ends are respectively equipped with side plate 7.In addition, anisotropic conductive material band, by base material film 9 and the work being coated on base material film 9 Film like bonding agent 11 for anisotropic conductive material is constituted, and prevents inorganic to be used for the connection of precise electronic components and parts And foreign body and the pollution of Organic substance, therefore in anisotropic conductive material band, make base material film 9 be located at the outside of bonding agent.
Using the connection of anisotropic conductive material, it is desirable to improve and produce interval time, it is desirable to anisotropic conductive material Rapid replicability.As described above, by by anisotropic conductive material with side plate 7 core (core) 5 length side Lamination is repeatedly wound upwards into around shaft-like such that it is able to which the longer anisotropic conductive material for collapsing is not rolled up in offer.Therefore, The replacing construction interval of anisotropic conductive material band can be extended, productivity ratio is improved.
In above-mentioned anisotropic conductive material band, the tensile strength for preferably making base material film 9 is 12kg/mm2More than, make base The fracture elongation of material film 9 is 60～200%.So, because base material film 9 keeps intensity, stretch it is less, therefore, it is possible to by structure Film like bonding agent 11 into anisotropic conductive material is copied in the process before the connecting elements such as circuit board, prevents film like Bonding agent 11 be stretched, lower thickness, width attenuates.In addition, considering from operation and environment this respect, the thickness of base material film 9 Preferably less than 100 μm.If base material film 9 is thin, above-mentioned effect will be deteriorated, therefore, the thickness of base material film 9 is preferably 0.5 μ More than m.
In addition, as the base material film 9 used in above-mentioned anisotropic conductive material band, from intensity and composition anisotropy The fissility aspect of the bonding agent of conductive material is set out, and the PP (polypropylene) of silicon and fluorine lift-off processing, OPP can be adopted (to extend poly- Propylene), PET (polyethylene terephthalate) etc., but be not limited to this.
The lift-off processing of base material film 9 is processed and can easily carried out by carrying out silicon or fluorine, and only the one side of base material film 9 entered During row lift-off processing, can fissility be set inside and outside base material film 9 poor such that it is able to prevent the back side to base material film 9 Replicate.In addition, when the two sides to base material film 9 carries out lift-off processing, silicon is carried out to the face of bonding agent 11 of film like and fluorine is processed, And make the face of bonding agent 11 of film like that there is fissility.
The bonding agent 11 of film like, can be employed as the epoxy resin of the type thermosetting resin with high reliability, energy The silicones class of the low stress for enough realizing bonding agent and the intermiscibility for contributing to bonding agent, and compared with above-mentioned two resinoid The material of the free radical that can be attached with lower temperature and shorter time, but the bonding agent 11 of film like is not limited to this. As the bonding agent 11 of radical type, mainly using acrylic-based adhesives.
Figure 71 is the schematic diagram of the 2nd embodiment of the invention for representing the 67th scheme～the 72nd scheme.In addition, right in Figure 71 Identical symbol is put on Figure 70 identical elements, description is omitted.
The anisotropic conductive material band of present embodiment, as shown in Figure 71, except using have 2 kinds of base material films, with this 2 Kind of base material film clamps bonding agent outside constituted anisotropic conductive material, other all with the anisotropy of the 1st embodiment Conductive material bands have identical structure.That is, the anisotropic conductive material of present embodiment, as shown in Figure 71, by thin film The bonding agent 11 of shape with 2 kinds of base materials 9a, 9b of lift-off processing this 3-tier architecture implemented to the face of bonding agent 11 constitute.
In the case where the bonding agent softness of anisotropic conductive material is constituted, the next base material of core side is prevented from The bonding agent deformation that film causes.
In addition, used as the physical characteristic value of base material film 9a, 9b, the tensile strength for preferably making base material film 9a, 9b is 12kg/ mm2More than, the fracture elongation for making base material film 9 is 60～200%, and this point is identical with the 1st embodiment.So, due to base The physical strength that material film 9a, 9b have such that it is able to prevent along with film like bonding agent stretching and make its filming, Width attenuates.In addition, the thickness of base material film 9a, 9b is preferably less than 100 μm, so can be with operation and environment this respect Correspondence.
In addition, in above-mentioned 1st and the 2nd embodiment, constituting the bonding agent 11 of the film like of anisotropic conductive material, such as Fruit does not show adhesion phenomenon, then avoid the need for base material film 9 or 9a, 9b without cohesiveness, can individually by the viscous of film like Connect agent 11 and be wound into spool-like.
Embodiment is illustrated below, but the invention of the 67th scheme～the 72nd scheme is not restricted by the embodiments.
Embodiment 1
(1) making of anisotropic conductive material film
30 weight % solution of ethyl acetate are made, the mean particle diameter for being added to 5 volumes % is 2.5 μm of Ni Powder.Afterwards, in above-mentioned ethyl acetate solution, the 50g phenoxy resin (high molecular weight epoxies as thin film formation material are added Resin), 20g epoxy resin and 5g imidazoles, obtain bonding agent and form solution.On the other hand, prepare in light blue transparent, thickness For 50 μm of pet films, (fracture strength is 25kg/mm2, fracture elongation is two sides 130%) The base material film of silicon process is carried out.Afterwards, above-mentioned solution is coated with the one side of the base material film using paint roller, in 110 DEG C of dryings 5 Minute, obtain the coiled strip of the anisotropic conductive material film that thickness is 50 μm.
(2) making of anisotropic conductive material band
By the way that the coiled strip of above-mentioned anisotropic conductive material film is longitudinally cutting into wide 1.5mm, straight with side plate Footpath 48mm, the length direction of the core (core) of width 100mm repeatedly wind lamination, are wound into spool-like, obtain length for 300m Anisotropic conductive material band.
This is wound into into the anisotropic conductive material of spool-like, namely anisotropic conductive material band be installed to it is each to different Property conductive material bands automatic crimping machine on, supply anisotropic conductive material in the case of, then anisotropic conductive material is obtained Good result in the replicability of material and tension test, and the installation number of times of spool can be reduced, eliminate required for installing Time and come from the repetition of sticking operation caused by the stretching of replicability, bonding agent, by these effects, improve production Property.
Embodiment 2
The coiled strip of anisotropic conductive material band is made similarly to Example 1.Afterwards, it is folded with bonding agent in base material film Layer body on, then the polyethylene terephthalate base material film of a kind of thick 25 μm of lamination (fracture strength is 25kg/mm2, fracture prolongs Rate is stretched for 130%) so that 2 base material films clamp bonding agent, so as to obtain the volume of the anisotropic conductive material film of 3 layers of construction Material.Afterwards, in the same manner as in Example 1, by the way that the coiled strip of above-mentioned anisotropic conductive material film is longitudinally cutting into wide 1.5mm, Simultaneously the length direction in the diameter 48mm with side plate, the core (core) of width 100mm is wound into spool-like, and obtaining length is The anisotropic conductive material band of 300m.
Embodiment 2 also in the same manner as in Example 1, can obtain good productivity.
Embodiment 3
It is same as Example 1, but (fracture strength is 4.6kg/mm to use thick 50 μm polytetrafluoroethylene film2, fracture Elongation percentage is that in addition, other are all same as Example 1 350%) as base material film, obtains anisotropic conductive material film Coiled strip, it is and then in the same manner as in Example 1, the coiled strip of the film is longitudinally cutting into wide 1.5mm, while by straight with side plate Footpath 48mm, the core (core) of width 100mm are wound into spool-like, obtain the anisotropic conductive material band that length is 300m.This In the case of kind, it is also possible to be wound up into the length of 300m.
Comparative example 1
In the same manner as in Example 1, the coiled strip of anisotropic conductive material film is obtained, and then in the same manner as in Example 1, by the film Coiled strip is longitudinally cutting into wide 1.5mm, while being wound into same round core shape on former spool, obtains length for each of 100m Anisotropy conductive material bands.
The anisotropic conductive material band for being wound into spool-like is installed to into anisotropic conductive material band automatic crimping On machine, in the case of supply anisotropic conductive material, though replicability and the tension test of anisotropic conductive material can be obtained In good result, but spool installs number of times for 3 times of embodiment, increased time required for installing and for adjusting Time.
According to the invention of the 1st scheme as above, using the bonding agent of adhesive material tape, the bonding material for finishing will be unreeled The beginning of the terminal part of material strip (adhesive material tape of a side) and the new adhesive material tape (adhesive material tape of the opposing party) installed End part is bonded together, and carries out the replacing of adhesive material reel, therefore, it is possible to simply to the bonding material that adhering device installation is new Material strip.
In addition, when carrying out the replacing of new adhesive material tape every time, due to need not carry out winding off spindle replacing and will be new The top of adhesive material tape is installed to the operation on winding off spindle, and the operations such as pilot pin are arranged on given route, therefore, newly The replacing construction of adhesive material reel will not be too many, improve the production efficiency of e-machine.
It is bonded together because the adhesive side for making the adhesive material tape of a side and the adhesive material tape of the opposing party overlaps each other, Therefore bonding strength is high.
According to the invention of the 2nd scheme, while the invention identical action effect with the 1st scheme can be played, due to putting The cut-out of the adhesive material tape that volume is finished can be carried out when terminal label is exposed, and therefore, it can easily distinguish is carried out Cut-out and the part of connection operation, and due to being attached in necessary minimal position such that it is able to prevent The waste of adhesive material tape.
It is identical with the The effect of invention of the 1st scheme according to the invention of the 3rd scheme, simply can install to adhering device New adhesive material tape, in addition, the replacing construction of new adhesive material reel will not be too many, improves the production effect of e-machine Rate.
Further, since using the guiding band of adhesive material tape, will unreel the terminal part of the adhesive material tape for finishing with it is new The initial portion of the adhesive material tape of installation is bonded together, therefore, it is possible to simply carry out the bonding between adhesive material tape.
It is identical with the The effect of invention of the 1st scheme according to the invention of the 4th scheme, simply can install to adhering device New adhesive material tape, in addition, the replacing construction of new adhesive material reel will not be too many, improves the production effect of e-machine Rate.
Further, since need not overturn that the adhesive material tape for finishing is unreeled, glue therefore, it is possible to prevent from being wound on winding off spindle There is volume when connecing material strips to collapse.
According to the invention of the 5th scheme, due to by locking pin will unreel the terminal part of the adhesive material tape for finishing with it is new The initial portion of the adhesive material tape of installation is fixed up, therefore, connection is simple.In addition, carrying out new adhesivess volume every time During the replacing of axle, it is not necessary to carry out the replacing of winding off spindle, the operation being installed at the top of new adhesive material tape on winding off spindle, and The operations such as pilot pin are set on given route, therefore, the replacing construction of new adhesive material reel will not be too many, improves electricity The production efficiency of handset device.
According to the invention of the 6th scheme, the end of the adhesive material tape due to the claw of a side of engagement device to be engaging in a side On the part of end, the claw of the opposing party of engagement device is engaging on the initial portion of the adhesive material tape of the opposing party afterwards, by two Person is interconnected, therefore, connection is simple.
Due to having elastic component between the claw of a side and the claw of the opposing party, therefore, it is possible to tensile elasticity component, will The claw of the opposing party of engagement device is engaging on the optional position of the initial portion of the adhesive material tape of the opposing party, therefore connect Degree of freedom is high.
Further, since terminal part and the opposing party of the adhesive material tape of a side adhesive material tape initial portion that It is attached in the state of this is relative, therefore, there is no need to that belt overlaps each other, due to can be with necessary Min. Position be attached such that it is able to prevent the waste of adhesive material tape.
According to the invention of the 7th scheme, due to only passing through clip by the terminal part of the adhesive material tape of a side and the opposing party The lap of initial portion of adhesive material tape clamp and just can be attached, therefore, connection is simple.
According to the invention of the 8th scheme, the two is coupled together due to pressing holding piece from the two sides of lap, therefore, The bonding strength of the lap of adhesive material tape can be improved.
According to the invention of the 9th scheme, using the bonding agent of adhesive material tape, by the terminal part of end-of-use adhesive material tape Divide and be bonded together with the initial portion of the new adhesive material tape installed, the replacing of adhesive material reel is carried out, therefore, it is possible to simple Ground to adhering device installs new adhesive material reel.In addition, when carrying out the replacing of new adhesive material reel every time, it is not necessary to The replacing of the winding off spindle of base material and the top of new adhesivess is installed on winding off spindle, therefore, new adhesive material reel Replacing construction will not be too many, improve manufacture efficiency.
According to the invention of the 10th scheme, while the invention identical action effect with the 9th scheme can be played, a side is made Terminal part and the initial portion of the adhesive material tape of the opposing party of adhesive material tape make hook-shaped locking mutually, and make the two Adhesive side be interconnected, therefore bonding strength is high.
According to the invention of the 11st scheme, can play and the invention identical action effect of the 9th scheme or the 10th scheme Simultaneously as the terminal part of the adhesive material tape of a side can be carried out in terminal label part, therefore, it is attached the portion of operation Partial volume is easily distinguished, and is prevented from the waste of adhesive material tape.
According to the invention of the 12nd scheme, can play and make with the invention identical of any one of the 9th scheme～the 11st scheme While using effect, by forming concavo-convex in coupling part, connection area can be extended, and the bonding of coupling part can be improved The intensity of the draw direction (length direction) of material strips.
According to the invention of the 13rd scheme, can play and make with the invention identical of any one of the 9th scheme～the 11st scheme While using effect, by forming through hole in coupling part, because inner circumferential of the bonding agent in through hole is oozed out, the bonding of bonding agent is made Area increases, therefore, it is possible to further improve bonding strength.
According to the invention of the 14th scheme, due to only by end-of-use adhesive material tape (adhesive material tape of a side) with it is new Adhesive material tape (adhesive material tape of the opposing party) is coupled together, and carries out the replacing of spool, therefore, it is possible to simply to bonding dress Put and new adhesive material reel is installed.In addition, when carrying out the replacing of new adhesive material reel every time, it is not necessary to which winding off spindle is more Change, the top of new adhesive material tape is installed on winding off spindle or hangs over adhesive material tape the operation on guiding piece, because This, the replacing construction of new adhesive material reel will not be too many, improves the production efficiency of e-machine.
It is silicones class by using the inorganic agent of the process base material in adhesive material tape, silicone is also used in adhesive tape Sticker, can reduce the capillary difference of the two, improve closing force, therefore, it is possible to before realizing highly difficult both it is viscous Connect.
According to the invention of the 15th scheme, while the invention identical action effect with the 14th scheme can be played, pass through The difference for making the surface tension of the surface tension in the sticker face of silicone adhesive tape and the silicone-treated base material of adhesive material tape is 10mN/m (10dyne/cm) below, can obtain strong closing force such that it is able to be reliably bonded together the two.
According to the invention of the 16th scheme, while the invention identical action effect with the 15th scheme can be played, pass through Further make bonding force be more than 100g/25mm, can more firmly carry out two of a side and the adhesive material tape of the opposing party Bonding between adhesive side.
According to the invention of the 17th scheme, while the invention identical action effect with the 16th scheme can be played, due to One side is carried out with its two sides that is connected to of the adhesive material tape of the opposing party, therefore, it is possible to obtain stronger connection.
According to the invention of the 18th scheme, due to the silicone adhesive tape using two-sided sticker such that it is able to a side with it is another Two-sided silicone adhesive tape is clipped between the adhesive material tape of one side by the two bonding (or closely sealed), therefore the connection letter of the two It is single and easy.
According to the invention of the 19th scheme, due to the resin-made bonding agent with pasty state, the adhesive material tape that finishes will be unreeled Terminal part is fixed up with the initial portion of the new adhesive material tape installed, therefore connects simple.In addition, carrying out every time new During the replacing of adhesive material reel, it is not necessary to the replacing of winding off spindle and the top of new adhesive material tape is installed on winding off spindle Operation, and the operations such as pilot pin are set on given route, therefore, the replacing construction of new adhesive material reel will not be too It is many, improve the production efficiency of e-machine.
According to the invention of the 20th scheme, while the invention identical action effect with the 19th scheme can be played, as Resin-made bonding agent, can select to be suitable to adhesive material tape from thermosetting resin, light-cured resin, heatmeltable bonding agent Between connection resin-made bonding agent such that it is able to improve the bonding strength between adhesive material tape.
According to the invention of the 21st scheme, because the resin-made that the 19th scheme of supply or the 20th scheme are provided with adhering device is glued The plugger of agent is connect, therefore need not in addition prepare plugger such that it is able to prevent the waste of connection operation.
According to the invention of the 22nd scheme, finish when the adhesive material tape wound in the winder of a side is unreeled, will be adjacent Winder on the adhesive material tape that wound be installed on winding off spindle, carry out the replacing of adhesive material tape, therefore need not be by New adhesive material tape spool is installed on adhering device.So, the replacement operation of new adhesive material tape spool will not be too many, Improve the production efficiency of e-machine.
According to the invention of the 23rd scheme, while the invention identical action effect with the 22nd scheme can be played, due to By connect band, the terminal part of the adhesive material tape of a side is connected with the initial portion of the adhesive material tape of the opposing party Come, therefore, the adhesive material tape of the adhesive material tape spool of a side is unreeled after finishing, it is not necessary to by the viscous of the winder of the opposing party The operation that material strips are installed on winding off spindle is connect, the production efficiency of e-machine can be further improved.
According to the invention of the 24th scheme, because connect band automatically can be wound up on winding off spindle, therefore when the winding of a side After the adhesive material tape in portion has been used up, sequentially adhesive material tape can be extracted out from next winder.
In addition, when with band detection means detect connect band when, due to until connect band pass through pressure contact portion before can be automatically Connect band is wound up on winding off spindle, therefore, it is possible to save the trouble of winding.
According to the beginning of the invention of the 25th scheme, the terminal part of the adhesive material tape of a side and the adhesive material tape of the opposing party The coupling part of end part, because the glued material strips of fastener are coated, therefore outward appearance is good, meanwhile, it is capable to prevent connection Partial fastener contacts with adhesive material tape and damages adhesive material tape or damage adhering device.
According to the invention of the 26th scheme, when connecting portion detection means detects coupling part, due to leading to until coupling part Crossing before pressure contact portion automatically can be wound up into the adhesive material tape of a side on winding off spindle, therefore, it is possible to prevent coupling part from arriving Up to pressure contact portion and carry out this failure of crimping action.Further, since until coupling part passes through before pressure contact portion automatically by one The adhesive material tape of side is wound up on winding off spindle, therefore, it is possible to save the trouble of winding.
According to the invention of the 27th scheme, while the invention identical action effect with the 26th scheme can be played, can With the detection that simple structure is attached part, and, accuracy of detection can be improved by using these devices.
According to the invention of the 29th scheme, due to sequentially can one by one use a plurality of bonding agent, therefore, it is possible to not increase The number of turns of belt, by the bonding dosage that can be used in 1 spool former more than 2 times are increased to.
Due to not increasing the number of turns, while therefore, it is possible to prevent volume from collapsing, width of the bonding agent from belt is prevented from Ooze out so that the mutual bonding of the belt for winding up causes adhesion, and then, it is prevented from holding because the base material of banding is elongated The drawbacks such as the stretching of the base material being also easy to produce (damage of base material and break).
In the manufacturer of electronic devices and components, because the replacing number of times of new bonding agent band will not be too many, therefore operation is imitated Rate is high.
In addition, in the manufacture of bonding agent band, due to manufactured spool number can be reduced, therefore, it is possible to cut down spool material and The usage amount of damp-proof material, reduces manufacturing expense.
According to the invention of the 30th scheme, while the invention identical action effect with the 29th scheme can be played, due to Separate between adjacent strip of glue, separated therefore, it is possible to an easily rule such that it is able to be easily crimped onto circuit On plate.
According to the invention of the 31st scheme, while the invention identical action effect with the 29th scheme can be played, due to Only slit is formed in the bonding agent being coated on the whole one side of base material, thus it is easy to manufacture, also, due to adjacent bonding It is almost very close to each other between agent bar such that it is able to which that increase is configured in the bar number of the strip of glue on base material.
According to the invention of the 32nd scheme, the bonding agent band of the 30th scheme can be easily manufactured.
According to the invention of the 33rd scheme, due to can simultaneously manufacture 2 bonding agent bands, therefore manufacture efficiency is excellent.
According to the invention of the 34th scheme, heated by the part to bonding agent, the cohesiveness for making the part declines And be crimped onto on circuit board, therefore, using the bonding agent band of the coating adhesive in the whole surface of the one side of base material, so energy It is enough directly to use existing device fabrication bonding agent band.
The width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing heating region, be pressed The degree of freedom of the bonding agent width for connecing is high.
As invention with the 29th scheme, due to can sequentially on a rule heated substrate bonding agent and be crimped onto circuit On plate, therefore, it is possible to not increase the number of turns of belt, the bonding dosage that can be used in 1 spool is increased to into more than 2 times.
Increase bonding dosage due to the number of turns can not be increased, therefore as the invention of the 29th scheme, be prevented from volume While collapsing, be prevented from bonding agent oozes out caused adhesion, the drawbacks of prevent the stretching of base material from causing.
According to the invention of the 35th scheme, more than the length of the width for one side of circuit board of bonding agent band, accordingly, it is capable to Enough while bonding dosage is increased, the number of turns of bonding agent band is reduced.
Used bonding dosage is dramatically increased due to the number of turns of bonding agent band can not be increased, therefore, it is possible to anti- While only volume collapses, it is prevented from adhesion and the damage of base material and breaks.In addition, in the manufacturer of electronic devices and components, due to The replacing number of times of new bonding agent band will not be too many, therefore manufacture efficiency is high.
In addition, in the manufacture of bonding agent band, the bonding dosage due to each spool can be increased, therefore, it is possible to cut down spool The usage amount of material and damp-proof material, reduces manufacturing expense.
According to the invention of the 36th scheme, while the invention identical action effect with the 35th scheme can be played, due to Separate between adjacent strip of glue, bonding agent is separated from base material therefore, it is possible to an easily rule and is crimped.
According to the invention of the 37th scheme, while the invention identical action effect with the 35th scheme can be played, can Increase is configured in the bar number of the strip of glue on base material, and manufacture is easier to.
According to the invention of the 38th scheme, existing equipment can be utilized, while the bonding agent band of 2 the 36th schemes is manufactured, because This manufacture efficiency is excellent.
According to the invention of the 39th scheme, can play and the effect of any one of the 35th scheme～the 37th scheme invention identical While effect, simply bonding agent can be crimped on one side of circuit board, during the manufacturer of electronic devices and components can be improved Working performance.
According to the invention of the 40th scheme, can play and the effect of any one of the 35th scheme～the 37th scheme invention identical While effect, it is not necessary to which rotation circuit plate can just move the position of the bonding agent band of a side and the bonding agent band of the opposing party, because And easily bonding agent can be crimped in the surrounding of circuit board, functioning efficiency is good.
According to the invention of the 41st scheme, in the case of crimping bonding agent around circuit board, by along width Hot pressing is carried out to bonding agent band in strip, it is thus possible to easily crimp bonding agent on circuit boards, working performance is good.
Further, since can in the whole surface of bonding agent band coating adhesive, therefore, it is possible to directly be set using existing Prepare and make bonding agent band.
Further, the width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing heating pressurised zone Fixed, the degree of freedom of the bonding agent width for being crimped is high.
In addition, as the invention of the 35th scheme, due to increasing bonding dosage with can not increasing the number of turns, therefore, can obtain While volume must being prevented from and collapse, oozing out caused adhesion and preventing caused by the stretching of base material for bonding agent is prevented from Drawback and other effects.
According to the invention of the 42nd scheme, due to being at least configured with 2 bonding agents in the width direction on bonding agent piece And 1 the rule use, therefore, the amount of 2 spools can be at least used using 1 spool, therefore, it is possible to not increase bonding agent band The number of turns, and the bonding dosage that can be used in 1 spool is dramatically increased.
Also, the number of turns due to not increasing bonding agent band, while therefore, it is possible to prevent volume from collapsing, be prevented from bonding agent from The width of band oozes out and is bonded together the belt for winding up mutually and causes adhesion, in addition it is possible to prevent because of base material The drawbacks such as the elongated and stretching of base material that easily produces (damage of base material and break).
Because bonding agent band is installed in tape drum, therefore bonding agent band need not be installed on spool in adhering device, Due to only tape drum is installed in adhering device, therefore easily operation, and install and the workability changed is good.
According to the invention of the 43rd scheme, while the invention identical action effect with the 42nd scheme can be played, due to Separate between adjacent strip of glue, bonding agent is separated from base material therefore, it is possible to an easily rule and is crimped.
According to the invention of the 44th scheme, while the invention identical action effect with the 42nd scheme can be played, due to Bonding agent band only coating adhesive and forms slit in the whole surface of the one side of base material, therefore easy to manufacture.
According to the invention of the 45th scheme, due to can in the whole surface coating adhesive of the base material of bonding agent band, therefore Existing device fabrication bonding agent band can directly be used.
The width of the bonding agent being crimped onto on circuit board, can arbitrarily be set by changing heating pressurised zone, be entered The degree of freedom of the bonding agent width of row crimping is high.
According to the invention of the 46th scheme, the invention identical action effect with the 45th scheme can be played, also, with the 1st As the invention of scheme, due to the number of turns can not be increased bonding dosage is increased, while therefore, it is possible to prevent volume from collapsing, can Obtain preventing the drawbacks of oozing out caused by caused adhesion and the stretching of base material and other effects of bonding agent.When using, when using After the amount of complete 1 spool, it is only necessary to overturn tape drum, therefore ensuing installation is easy.Due to adopting tape drum, therefore operate Easily, and install and change workability it is good.
According to the invention of the 47th scheme, due to the base material using adhesive material tape, the adhesive material tape that finishes will be unreeled Terminal part is bonded together with the initial portion of the new adhesive material tape installed, and carries out the replacing of adhesive material reel, therefore energy It is enough simply new adhesive material reel to be installed to adhering device.In addition, when carrying out the replacing of new adhesive material reel every time, The replacing for not needing winding off spindle and the operation being installed at the top of new adhesive material reel on winding off spindle, therefore, new is viscous The replacing construction for connecing material spool will not be too many, improves the production efficiency of e-machine.
According to the invention of the 48th scheme, while the invention identical action effect with the 47th scheme can be played, due to The surface of base material has heat to melt oxidant layer, and it is viscous with initial portion that the heat of the terminal part of the adhesive material tape by making a side melts oxidant layer The agent face of connecing overlaps, and carries out hot pressing to this part and couples together the two, therefore connects simple.
Further, since heat melts oxidant layer be formed on the whole length direction of belt, therefore overlap length need not be carried out sternly Close positioning, the degree of freedom of connection is high.
According to the invention of the 49th scheme, while the invention identical action effect with the 47th scheme can be played, due to Heat is melted oxidant layer and is supported layer clamping, is exposed in an atmosphere therefore, it is possible to prevent heat from melting oxidant layer, attached because of moisture absorption, dust etc. The adhesive strength decline that caused heat melts oxidant layer.
According to the invention of the 50th scheme, the part being surface-treated with parting compound of base material end is removed, using viscous The bonding agent of material strips is connect by the terminal part for unreeling the adhesive material tape for finishing and the top portion of the new adhesive material tape installed Divide and be bonded together, carry out the replacing of adhesive material reel, roll up therefore, it is possible to simply install new adhesivess to adhering device Axle.
According to the invention of the 51st scheme, while the invention identical action effect with the 50th scheme can be played, due to Parting compound is removed using any one method in plasma discharge, ultraviolet irradiation, laser irradiation, therefore, it is possible to accurately and in short-term Between carry out the removal of parting compound.
According to the invention of the 52nd scheme, due to adhesive material tape spool in, be provided with multiple spools and be wound with adhesivess The winding part (winder) of the adhesive material tape of band, therefore, when in multiple winders, the adhesive material tape of 1 winder is put After volume is finished, with regard to the adhesive material tape for using with unreel other winders that the winder for finishing is adjacent to, therefore, there is no need to New adhesive material tape spool is installed in adhering device, the replacement operation of new adhesive material tape spool will not be too many, carries The high production efficiency of e-machine.Further, since multiple adhesive material tapes can be sequentially used, therefore, it is possible to not increase by 1 The number of turns of the adhesive material tape on adhesive material tape spool, and the replacement operation for passing through 1 time is dramatically increased can use viscous Connect dosage.Further, since not increasing the number of turns of adhesive material tape, while therefore, it is possible to prevent volume from collapsing, bonding agent is prevented from From the so-called adhesion that the width of belt oozes out and is mutually bonded together the adhesive material tape for winding up, in addition, can Prevent the drawbacks such as the stretching of base material that easily produces because base material is elongated.
According to the invention of the 53rd scheme, the receiving portion due to being provided with desiccant on the side plate of spool, therefore, it is possible to play While with the invention identical action effect of the 52nd scheme, by from it is internal reliably remove it is wet in adhesive material tape spool Gas, can further suppress because of the quality decline produced by adhesive material tape moisture absorption.
According to the invention of the 54th scheme, due to be provided with can freely assemble and disassemble on spool for will be wound on spool The cover coated around adhesive material tape, therefore adhesive material tape will not be directly exposed in air such that it is able to The harmful effect for preventing adhesive material tape from bringing because of dampness in dust, air.Therefore, even if in the situation for being provided with multiple winders Under, by arranging cover in untapped winder, it is also possible to prevent the quality decline of adhesive material tape.
Further, since cover is configured to freely to assemble and disassemble, therefore, cover is removed just can simply from bonding Material spool of tape extracts adhesive material tape out.
According to the invention of the 55th scheme, can play and be acted on the 52nd scheme to any one of the 54th scheme invention identical While effect, due to adhesive material tape can be extracted out from the opening of cover, therefore adhesive material-tape reel need not be removed The cover of axle, it becomes possible to directly extract adhesive material tape out from adhesive material tape spool.
According to the invention of the 56th scheme, can play and be acted on the 52nd scheme to any one of the 55th scheme invention identical While effect, because the side plate of winder mutually can detachably be fitted together to, therefore, when the adhesivess of the winder of a side After band has been used up, by releasing the Qian He with the winder of the opposing party, sequentially bonding material can be extracted out from next winder Material strip.
According to the 57th scheme, the invention of the 58th scheme, can play and the invention of any one of the 52nd scheme to the 56th scheme Identical action effect, is that the electrode that couples together at facing electrode is coated with base material in adhesive material tape particularly The adhesive material tape of connecting adhesive, or be by the fixed with support substrate or semiconductor element of lead frame in adhesive material tape Part installation especially has in the case of supporting the adhesive material tape that substrate, the tube core of lead frame and semiconductor element are coupled together With.
According to the invention of the 59th scheme, due to be hold by one hand box body, the peristome for exposing bonding agent band being pressed against into electricity On the plate of road, heater block carries out hot pressing and bonding agent is crimped onto on circuit board from substrate side, therefore, it is possible to miniaturization and can With one-handed performance, and can easily be crimped when bonding agent is crimped onto in a part for substrate.
It is metallic film or aromatic polyamide film by making the base material of adhesive material tape according to the invention of the 60th scheme, Even if in the case of the thinner thickness of base material, it is also possible to prevent the failures such as the stretching and fracture of base material.
In addition, the adhesive material tape constituted by using the base material of thinner thickness, increases can the number of turns on 1 spool Plus such that it is able to increase the bonding dosage that can be used on 1 spool.In addition, by using the present invention adhesive material tape, due to The number of turns on each spool is more, therefore in the manufacturer of electronic devices and components, the replacing number of times of new adhesive material tape will not Too much, improve working performance.In addition, in the manufacture of adhesive material tape, the number due to manufactured spool can be reduced, because This can cut down the usage amount of spool material and damp-proof material, reduce manufacturing expense.
According to the invention of the 61st scheme, while the invention identical action effect with the 60th scheme can be played, can Obtain the high adhesive material tape of thin and tensile strength.
According to the invention of the 62nd scheme, can play and the invention identical action effect of the 60th scheme or the 61st scheme Meanwhile, it is more than 300MPa by the tensile strength for making base material, base material is difficult to be stretched or is broken.
According to the invention of the 63rd scheme, can play and be acted on the 60th scheme to any one of the 62nd scheme invention identical It is 0.01～1.0 by the thickness ratio for making base material and bonding agent while effect, can obtains that thinner and tensile strength is higher Adhesive material tape.
According to the invention of the 64th scheme, can play and be acted on the 60th scheme to any one of the 63rd scheme invention identical While effect, by surface roughness R for making base materialmaxFor less than 0.5 μm so that the surface of base material smooths, on circuit boards Bonding agent is easily separated from base material during crimping bonding agent.
According to the invention of the 65th scheme, during the operation before bonding agent is formed in bonded object, due to making gluing for a side The bonding agent for connecing the bonding agent of material strips and the adhesive material tape of the opposing party is Chong Die, after forming desired bonding agent thickness, Bonding agent is formed in bonded object again, therefore, it is possible to make the thinner thickness of each adhesive material tape, even if increased bonding The number of turns of material strips, it is also possible to reduce the winding diameter of the adhesive material tape on each spool.
Thus it is possible to increase the number of turns of the adhesive material tape of each spool, so as to 1 replacement operation is dramatically increased in The bonding dosage that can be used.Therefore, the replacement operation of new adhesive material tape will not be too many, improves the production effect of e-machine Rate.
According to the invention of the 66th scheme, while the invention identical action effect with the 65th scheme can be played, can Reduction needs the number of the adhesive material tape of low temperature keeping such that it is able to carry out transport, the efficient pipe of keeping of adhesive material tape Reason.
Invented according to any one of the 67th scheme～the 72nd scheme, using the teaching of the invention it is possible to provide there is good duplication to being connected component Property (stickup), and with good connection reliability such that it is able to the qualification rate of in-process is improved, operation is further improved Property, the anisotropic conductive material band longer with size than before, so as to improve productivity, workability.

Claims (17)

1. a kind of bonding agent band, is the bonding agent band that bonding agent is coated with base material and shaft-like is wound into a roll, it is characterised in that： Configure a plurality of bonding agent on the width of belt, the width of bonding agent band is 5mm～3000mm, the width of the bonding agent band More than or equal to the length on one side of circuit board, the width of of bonding agent is 0.5mm～10.0mm.
2. bonding agent band as claimed in claim 1, it is characterised in that：Between the strip of glue adjacent to each other of a plurality of bonding agent Have interval in vain.
3. bonding agent band as claimed in claim 1, it is characterised in that：The slit that bonding agent is formed by the width along belt It is separated into a plurality of.
4. the bonding agent band as any one of claims 1 to 3, it is characterised in that：The width of bonding agent band is and circuit The roughly the same size in one side of plate.
5. bonding agent band as claimed in claim 1 or 2, it is characterised in that：Bonding agent is set with having equally spaced mode in vain.
6. the bonding agent band as any one of claims 1 to 3, it is characterised in that：Base material is extended polypropylene, polytetrafluoro The polyethylene terephthalate of ethylene or silicone-treated.
7. the bonding agent band as any one of claims 1 to 3, it is characterised in that：Bonding agent is thermoplastic resin, thermosetting Property resin, thermoplastic resin and thermosetting resin mixing species or hot melt species.
8. bonding agent band as claimed in claim 7, it is characterised in that：Thermosetting resin is epoxy resin, acrylic resin Class, vinyl ester resin class or silicones class.
9. the bonding agent band as any one of claims 1 to 3, it is characterised in that：Conducting particles is dispersed with bonding agent.
10. bonding agent band as claimed in claim 9, it is characterised in that：Conducting particles be metallic, carbon, graphite, or, It is the particle that conductive layer is formed with these or dielectric glass, ceramics or macromolecule core.
The 11. bonding agent bands as any one of claims 1 to 3, it is characterised in that：Bonding agent is not to be dispersed with conductive particle The insulating properties bonding agent of son.
A kind of 12. compression bonding methods of bonding agent band, it is characterised in that：By the bonding agent any one of claim 1～11 Band is configured on circuit boards, by carrying out hot pressing along width to bonding agent band, so as to crimp on one side of circuit board Strip of glue.
The compression bonding method of 13. bonding agent bands as claimed in claim 12, it is characterised in that：By bonding agent be crimped on circuit board it Before, form slit on the width of bonding agent.
The compression bonding method of 14. bonding agent bands as claimed in claim 13, it is characterised in that：Bonding agent band will be crimped onto The slit was formed before on circuit board.
The compression bonding method of the 15. bonding agent bands as described in claim 13 or 14, it is characterised in that：To detached 1 by slit Bar bonding agent is used from substrate side with thermal head crimping.
The compression bonding method of 16. bonding agent bands as claimed in claim 12, it is characterised in that：The bonding agent of the part being hot pressed is soft Change and flow, be below 100 pools.
The compression bonding method of 17. bonding agent bands as claimed in claim 12, it is characterised in that：The response rate of the bonding agent being hot pressed For less than 20%.
CN201410378540.3A 2002-07-30 2003-07-30 Adhesive material band and crimping method therefor Expired - Lifetime CN104152075B (en)

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Application Number Priority Date Filing Date Title
JP2002-221225 2002-07-30
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JP2002370623A JP4032961B2 (en) 2002-12-20 2002-12-20 Adhesive tape connection method
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JP2002370622A JP2004196540A (en) 2002-12-20 2002-12-20 Method of connecting adhesive tape
JP2002-370624 2002-12-20
JP2002370624A JP4477823B2 (en) 2002-12-20 2002-12-20 Adhesive tape connection method and adhesive tape connector
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JP2003002092A JP2004211017A (en) 2003-01-08 2003-01-08 Adhesive tape, method of producing the same and compression adhesion method for the same
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JP2003-002094 2003-01-08
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JP2003-002095 2003-01-08
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JP2003118287A JP4654566B2 (en) 2003-04-23 2003-04-23 Adhesive tape connection method and adhesive tape connector
JP2003-118287 2003-04-23
JP2003-118286 2003-04-23
JP2003130196A JP2004331833A (en) 2003-05-08 2003-05-08 Tape reel for adhesive materials
JP2003-130196 2003-05-08
JP2003-130197 2003-05-08
JP2003130197A JP4238626B2 (en) 2003-05-08 2003-05-08 Adhesive tape reel, adhesive device, connection method, and adhesive tape connector
JP2003176322A JP2005330297A (en) 2003-06-20 2003-06-20 Method of forming adhesive material by adhesive material tape
JP2003-176321 2003-06-20
JP2003176321A JP2005330296A (en) 2003-06-20 2003-06-20 Connecting method of adhesive material tape
JP2003-176322 2003-06-20

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TWI321868B (en) 2010-03-11

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